WO2021255967A1 - Élément thermoconducteur - Google Patents

Élément thermoconducteur Download PDF

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Publication number
WO2021255967A1
WO2021255967A1 PCT/JP2020/047798 JP2020047798W WO2021255967A1 WO 2021255967 A1 WO2021255967 A1 WO 2021255967A1 JP 2020047798 W JP2020047798 W JP 2020047798W WO 2021255967 A1 WO2021255967 A1 WO 2021255967A1
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WO
WIPO (PCT)
Prior art keywords
housing portion
metal layer
plate
conductive member
housing
Prior art date
Application number
PCT/JP2020/047798
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English (en)
Japanese (ja)
Inventor
雅昭 花野
淳一 石田
Original Assignee
日本電産株式会社
超▲しゅう▼科技股▲ふん▼有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電産株式会社, 超▲しゅう▼科技股▲ふん▼有限公司 filed Critical 日本電産株式会社
Publication of WO2021255967A1 publication Critical patent/WO2021255967A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat conductive member.
  • a vapor chamber formed in a thin flat plate shape is known as a heat conductive member for cooling a heating element.
  • the vapor chamber has an upper metal sheet and a lower metal sheet.
  • the upper metal sheet is provided on the lower metal sheet.
  • a heating element is attached to the lower surface of the lower metal sheet.
  • a closed space in which the hydraulic fluid is sealed is formed between the upper metal sheet and the lower metal sheet.
  • the working liquid that receives heat from the heating element and evaporates is cooled by the outside via the upper metal sheet.
  • the upper metal sheet and the lower metal sheet can be formed by using a metal material such as stainless steel. (For example, refer to Japanese Patent Application Laid-Open No. 2019-158323)
  • An object of the present invention is to improve the bonding strength between the first housing portion and the second housing portion of the heat conductive member.
  • the exemplary heat conductive member of the present invention comprises a housing in which a working medium is enclosed in an internal space.
  • a wick structure is arranged in the internal space.
  • the housing has a plate-shaped first housing portion, a plate-shaped second housing portion, and a joint portion.
  • the internal space is arranged between the first housing portion and the second housing portion.
  • the first housing portion has a first plate made of metal and a first metal layer.
  • the first metal layer is arranged on the surface of the first plate on the side of the second housing portion.
  • the melting point of the first metal layer is lower than the melting point of the first plate.
  • the second housing portion has a second plate made of metal.
  • the joint portion is arranged along the outer edge portion of the internal space when viewed from one of the first housing portion and the second housing portion in the vertical direction toward the other.
  • the joint portion joins the first surface of the first metal layer on the second housing portion side and the second surface of the second housing portion on the first housing portion side.
  • the bonding strength between the first housing portion and the second housing portion of the heat conductive member can be improved.
  • FIG. 7A is a cross-sectional view showing a first configuration example of the joint portion according to the first modification.
  • FIG. 7B is a cross-sectional view showing a second configuration example of the joint portion according to the first modification.
  • FIG. 8A is a cross-sectional view showing a configuration example of the heat conductive member according to the second modification.
  • FIG. 8B is a cross-sectional view showing another configuration example of the heat conductive member according to the second modification.
  • the facing direction of the first housing portion 1 and the second housing portion 2 described later is referred to as "vertical direction”.
  • the direction from the first housing portion 1 to the second housing portion 2 is referred to as “downward”
  • the direction from the second housing portion 2 to the first housing portion 1 is referred to as "upward”.
  • the lower end is referred to as the "lower end”
  • the upper end is referred to as the "upper end”.
  • the surface facing downward is referred to as “lower surface”
  • the surface facing upward is referred to as "upper surface”.
  • these are names used only for explanation, and there is no intention of limiting the actual positional relationship, direction, and name. It was
  • FIG. 1 is a perspective view of the heat conductive member 100.
  • FIG. 2 is a cross-sectional view showing a configuration example of the heat conductive member 100 according to the embodiment. Note that FIG. 2 shows a cross-sectional structure of the heat conductive member 100 along the line AA of FIG.
  • the heat conductive member 100 is a so-called vapor chamber, and is a member for cooling a heat generating source (not shown).
  • the heat generation source is, for example, an arithmetic processing unit such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit).
  • the heat conductive member 100 includes a housing 101 in which a working medium (not shown) is enclosed in an internal space 1010.
  • a wick structure (not shown) is arranged in the internal space 1010.
  • the wick structure has a capillary structure.
  • a liquefied working medium can penetrate inside the wick structure.
  • the wick structure is a porous metal sintered body such as a sintered body of a metal powder such as copper.
  • the wick structure is not limited to these examples.
  • the working medium is pure water in this embodiment, but may be a medium other than water.
  • the working medium may be any of alcohol compounds such as methanol and ethanol, CFC substitutes such as hydrofluorocarbons, hydrocarbon compounds such as propane and isobutane, fluorinated hydrocarbon compounds such as difluoromethane, and ethylene glycol. good.
  • the working medium can be adopted depending on the usage environment of the heat conductive member 100. It was
  • the working medium is vaporized by the heat transferred from the heat generation source in the vicinity of the portion of the housing 101 in contact with the heat generation source, and evaporates into the internal space 1010.
  • the closed internal space 1010 is depressurized, and its internal pressure is lower than the atmospheric pressure. This makes the working medium even easier to vaporize.
  • the working medium is cooled and liquefied at a portion of the housing 101 away from the heat source.
  • the liquefied working medium permeates the inside of the wick structure and is refluxed to the vicinity of the portion in contact with the heat generation source.
  • the housing 101 has a plate-shaped first housing portion 1, a plate-shaped second housing portion 2, and a joint portion 3.
  • An internal space 1010 is arranged between the first housing portion 1 and the second housing portion 2.
  • the first housing portion 1 is arranged so as to be overlapped above the second housing portion 2.
  • the first housing portion 1 has a recess 10.
  • the recess 10 is arranged at the lower end of the first housing portion 1 and is recessed upward.
  • a sealed internal space 1010 is formed inside the housing 101.
  • the recess 10 becomes the internal space 1010.
  • the second housing portion 2 may have a recess that is arranged at the upper end portion of the second housing portion 2 and is recessed downward.
  • the recess may overlap the recess 10 when viewed from above and below.
  • the internal space 1010 may be composed of a recess 10 of the first housing portion 1 and a recess of the second housing portion 2.
  • the first housing portion 1 may not have the recess 10
  • the recess of the second housing portion 2 may be the internal space 1010.
  • the first housing portion 1 has a first plate 11 made of metal and a first metal layer 12.
  • the first metal layer 12 is arranged on the surface (that is, the lower surface) of the first plate 11 on the second housing portion 2 side.
  • the melting point of the first metal layer 12 is lower than the melting point of the first plate 11.
  • the second housing portion 2 has a second plate 21 made of metal.
  • the second housing portion 2 further has a second metal layer 22.
  • the second metal layer 22 is arranged on the surface (that is, the upper surface) of the second plate 21 on the first housing portion 1 side.
  • the melting point of the second metal layer 22 is lower than the melting point of the second plate 21. By doing so, it becomes easier to join the first housing portion 1 and the second housing portion 2. It was
  • one of the “first plate 11" and the “second plate 21" described in the present specification corresponds to the “first plate” of the present invention, and the other corresponds to the “second plate” of the present invention. do.
  • one of the “first metal layer 12" and the “second metal layer 22" described in the present specification corresponds to the "first metal layer” of the present invention, and the other corresponds to the “second metal layer” of the present invention.
  • the "first housing portion 1" described in the present specification corresponds to the "first housing portion” of the present invention
  • the “second housing portion 2" described in the present invention corresponds to the "second housing portion 2" of the present invention.
  • the "first plate 11" and “first metal layer 12" described in the present specification correspond to the “first plate” and “first metal layer” of the present invention, respectively.
  • the “second plate 21" and “second metal layer 22” described in the present specification correspond to the “second plate” and “second metal layer” of the present invention, respectively.
  • the “first housing portion 1” described in the present specification corresponds to the “second housing portion” of the present invention
  • the “second housing portion 2" described in the present invention corresponds to the “second housing portion 2" of the present invention.
  • the "first plate 11" and the “first metal layer 12" described in the present specification are referred to as the “second plate” and the “second metal layer” of the present invention, respectively.
  • the “second plate 21" and the “second metal layer 22" described in the present specification correspond to the “first plate” and the “first metal layer” of the present invention, respectively. It was
  • the first housing portion 1 is joined to the second housing portion 2 outside the internal space 1010 when viewed from one of the first housing portion 1 and the second housing portion 2 in the vertical direction toward the other. Will be done.
  • the thickness T1 of the first housing portion 1 in the portion joined to the second housing portion 2 of the first housing portion 1 is from the vertical direction of the first housing portion 1. Seen, it is thinner than the thickness T2 of the first housing portion 1 in the portion overlapping the internal space 1010.
  • the thickness T3 of the second housing portion 2 in the portion of the second housing portion 2 joined to the first housing portion 1 is inside the second housing portion 2 when viewed from the vertical direction. It is thinner than the thickness T4 of the second housing portion 2 in the portion overlapping with the space 1010. It was
  • one housing portion in the portion of one housing portion joined to the other housing portion overlaps with the internal space 1010 in the one housing portion when viewed from the vertical direction. It is thinner than the thickness of one of the housings in.
  • one housing portion is one of the first housing portion 1 and the second housing portion 2.
  • the other housing portion is the other of the first housing portion and the second housing portion.
  • the thermal resistance of the joint portion of one housing portion becomes larger than the thermal resistance of the portion overlapping the internal space 1010 of the one housing portion.
  • the thermal resistance of the portion overlapping the internal space 1010 of one housing portion becomes smaller.
  • T1 ⁇ T2 the thermal resistance of the portion overlapping the internal space 1010 of the first housing portion 1 is smaller than the thermal resistance of the joint portion of the first housing portion 1.
  • T3 ⁇ T4 the thermal resistance of the portion overlapping the internal space 1010 of the second housing portion 2 is smaller than the thermal resistance of the joint portion of the second housing portion 2. Therefore, heat is easily transferred via the portion of the housing 101 that overlaps with the internal space 1010. Therefore, heat can be transferred through a heat transfer path having a shorter path length, so that the heat transfer performance of the heat transfer member 100 is improved.
  • the magnitude relationship between the thickness of the portion overlapping the internal space 1010 of the housing 101 and the thickness of the joint portion of the housing 101 is not limited to this example.
  • the thickness of the joint portion is thinner than the thickness of the portion overlapping the internal space 1010, while the first housing portion 1 and the second housing portion 2 In the other of 2, the thickness of the joint portion does not have to be thinner than the thickness of the portion overlapping the internal space 1010.
  • T1 ⁇ T2 T3 ⁇ T4 may be satisfied.
  • T3 ⁇ T4 T1 ⁇ T2 may be satisfied. It was
  • the thickness ta of the first metal layer 12 at the joint portion with the second housing portion 2 of the first metal layer 12 is the internal space 1010 when viewed from the vertical direction of the first metal layer 12. It is thinner than the thickness tb of the first metal layer 12 in the overlapping portion. Since ta ⁇ tb, the thermal resistance of the joint portion of the first metal layer 12 is larger than the thermal resistance of the portion overlapping the internal space 1010 of the first metal layer 12. That is, the thermal resistance of the portion overlapping the internal space 1010 of the first housing portion 1 becomes smaller. Therefore, heat is more easily transferred between the outside of the housing 101 and the internal space 1010 inside the housing 101 via this portion. Therefore, heat can be transferred through a heat transfer path having a shorter path length, so that the heat transfer performance of the heat transfer member 100 is improved. It was
  • the thickness ct of the second metal layer 22 at the joint portion of the second metal layer 22 with the first housing portion 1 overlaps with the internal space 1010 of the second metal layer 22 when viewed from the vertical direction. It is thinner than the thickness td of the second metal layer 22 in the portion. Since tc ⁇ td, the thermal resistance of the joint portion of the second metal layer 22 is larger than the thermal resistance of the portion overlapping the internal space 1010 of the second metal layer 22. That is, the thermal resistance of the portion overlapping the internal space 1010 of the second housing portion 2 becomes smaller. Therefore, heat is more easily transferred between the outside of the housing 101 and the internal space 1010 inside the housing 101 via this portion. Therefore, heat can be transferred through a heat transfer path having a shorter path length, so that the heat transfer performance of the heat transfer member 100 is improved. It was
  • the first plate 11 and the second plate 21 spread in a direction perpendicular to the vertical direction.
  • a material having high mechanical strength is adopted.
  • the materials of the first plate 11 and the second plate 21 are stainless steel, respectively.
  • the mechanical strength of the housing 101 can be improved. Therefore, the durability of the heat conductive member 100 can be improved.
  • the material of the first metal layer 12 has a higher thermal conductivity than the material of the first plate 11.
  • the material of the first metal layer 12 is either copper or a copper alloy.
  • the thermal conductivity of the first housing portion 1 can be improved. Therefore, the heat conduction performance of the heat conduction member 100 can be improved.
  • the material of the second metal layer 22 has a higher thermal conductivity than the material of the second plate 21.
  • the material of the second metal layer 22 is either copper or a copper alloy, like the first metal layer 12. By using copper or a copper alloy having high thermal conductivity for the second metal layer 22, the thermal conductivity of the second housing portion 2 can be improved.
  • first metal layer 12 and the second metal layer 22 are made of the same material, it becomes easy to join the two, and the joining strength thereof can be improved.
  • a metal material other than copper and a copper alloy may be adopted for the first metal layer 12 and the second metal layer 22.
  • the first metal layer 12 covers the entire surface of the first plate 11 on the second housing portion 2 side.
  • the thermal conductivity of the first housing portion 1 can be enhanced. Therefore, the heat conduction performance of the heat conduction member 100 can be improved.
  • the second metal layer 22 covers the entire surface of the second plate 21 on the first housing portion 1 side.
  • the thermal conductivity of the second housing portion 2 can be enhanced. Therefore, the heat conduction performance of the heat conduction member 100 can be improved.
  • At least one metal layer of the first metal layer 12 and the second metal layer 22 is the first housing portion 1 and the second housing portion 2 of the above-mentioned surface. May cover only the parts that are in contact with each other. It was
  • the first metal layer 12 is a metal-plated layer arranged on the surface of the first plate 11 on the second housing portion 2 side.
  • the second metal layer 22 is a metal-plated layer arranged on the surface of the second plate 21 on the first housing portion 1 side.
  • the metal plate having the metal plating layer formed on the surface can be used for the first housing portion 1 and the second housing portion 2, the number of manufacturing steps of the heat conductive member 100 can be reduced. Therefore, the productivity of the heat conductive member 100 can be improved. It was
  • first housing portion 1 may be a clad material, and for example, the first metal layer 12 may be rolled and joined to the surface of the first plate 11 on the second housing portion 2 side.
  • second housing portion 2 may be a clad material, and the second metal layer 22 may be rolled and joined to the surface of the second plate 21 on the first housing portion 1 side.
  • the clad material that has been rolled and joined can be used for the first housing portion 1 and / or the second housing portion 2
  • the number of manufacturing steps of the heat conductive member 100 can be reduced. Therefore, the productivity of the heat conductive member 100 can be improved. It was
  • FIG. 3 is a cross-sectional view showing a first configuration example of the joint portion 3 according to the embodiment. Note that FIG. 3 is an enlarged view of the cross-sectional structure in the vicinity of the joint portion 3 in the embodiment.
  • the joint portion 3 is a portion of the housing 101 in which the first housing portion 1 and the second housing portion 2 are joined to each other.
  • the joint portion 3 is arranged along the outer edge portion of the internal space 1010 when viewed from one of the first housing portion 1 and the second housing portion 2 in the vertical direction toward the other (see FIG. 1).
  • the joint portion 3 is arranged in an annular shape when viewed from the vertical direction. For example, since the joint portion 3 can be arranged without interruption along the outer edge portion of the internal space 1010, the airtightness of the internal space 1010 can be ensured. It was
  • the joint portion 3 joins the first surface 120 and the second surface 20.
  • the first surface 120 is a surface of the first metal layer 12 on the second housing portion 2 side.
  • the second surface 20 is a surface of the second housing portion 2 on the first housing portion 1 side.
  • the joining portion 3 joins the lower surface of the first metal layer 12 to the upper surface of the second metal layer 22.
  • the first plate 11 can be connected to the second plate 21 via a metal layer such as the first metal layer 12 and the second metal layer 22.
  • the melting point of the first metal layer 12 is lower than the melting point of the first plate 11, and the melting point of the second metal layer 22 is lower than the melting point of the second plate 21.
  • the first housing portion 1 it becomes easier to join the first housing portion 1 to the second housing portion 2 as compared with the case where the first plate 11 and the second plate 21 are directly joined. Therefore, even if the materials of the first plate 11 and the second plate 21 are a combination in which it is difficult to directly join the two, the indirect fixing between the two via the above-mentioned metal layer ensures a close connection between the two. It can be done easily. For example, even if the material of the first plate 11 and the material of the second plate 21 are both stainless steel, the two can be firmly connected to each other. Therefore, the joint strength between the first housing portion 1 and the second housing portion 2 can be improved.
  • the joining portion 3 joins the entire region of the lower surface of the first housing portion 1 in contact with the second housing portion 2 to the second housing portion 2.
  • the joining portion 3 joins the entire region of the first surface 120 of the first metal layer 12 in contact with the second surface 20 of the second housing portion 2 to the second surface 20.
  • the joining portion 3 joins the entire region of the lower surface of the first metal layer 12 in contact with the upper surface of the second metal layer 22 to the second metal layer 22.
  • the second surface 20 is the surface of the second metal layer 22 on the first housing portion 1 side. That is, the joining portion 3 joins the first surface 120 of the first metal layer 12 on the second housing portion 2 side to the upper surface (that is, the second surface 20) of the second metal layer 22. Since both the first housing portion 1 and the second housing portion 2 have a metal layer for joining, the joining strength between the first housing portion 1 and the second housing portion 2 can be further improved. It was
  • FIG. 4A is a cross-sectional view showing a second configuration example of the joint portion 3 according to the embodiment.
  • FIG. 4B is a cross-sectional view showing a third configuration example of the joint portion 3 according to the embodiment.
  • 4A and 4B are enlarged views of the cross-sectional structure in the vicinity of the joint portion 3. It was
  • FIG. 5A is a cross-sectional view showing a configuration example of the joint portion 3.
  • FIG. 5B is a cross-sectional view showing another configuration example of the joint portion 3.
  • the first housing portion 1 and the second housing portion 2 are joined by being heated in the vertical direction while being overlapped in the vertical direction.
  • heat pressurization process the process of simultaneously performing heating and pressurization.
  • the metal structure of the contact portion where the first housing portion 1 and the second housing portion 2 are in contact with each other is gradually reconstructed.
  • the metal atoms of the first metal layer 12 are diffused into the metal structure of the second metal layer 22, and the metal atoms of the second metal layer 22 are diffused into the metal structure of the first metal layer 12.
  • the joint portion 3 is formed at the contact portion between the first housing portion 1 and the second housing portion 2.
  • the boundary between the first housing portion 1 and the second housing portion 2 in the contact portion is partially eliminated by appropriately adjusting the conditions of the heat and pressure treatment.
  • crystal grain Cr straddling the boundary is generated at a part of the boundary between the first housing portion 1 and the second housing portion 2.
  • the joint portion 3 having the first region A1 and the second region A2 is formed at the contact portion between the first housing portion 1 and the second housing portion 2.
  • crystal grain Cr is generated by the reconstruction of the metal structure at the contact portion.
  • the crystal grain Cr exists across the boundary at a part of the boundary between the first metal layer 12 and the second metal layer 22 of the second housing portion 2.
  • the number of crystal grains Cr arranged in each first region A1 is singular in FIG. 5A, the number is not limited to this example and may be plural. It was
  • the joint portion 3 further has an interface 31 in which the first surface 120 of the first metal layer 12 and the second surface 20 of the second housing portion 2 are in direct contact with each other.
  • the first metal layer 12 is joined to the second housing portion 2.
  • the first metal layer 12 is joined to the second metal layer 22 at the interface 31. Since both are joined, it is possible to sufficiently suppress the permeation of a liquid such as a working medium in a liquid state and a gas such as a vaporized working medium at the interface 31. Therefore, the airtightness of the internal space 1010 can be further improved. It was
  • the joint portion 3 having only the first region A1 is formed in the contact portion of the first housing portion 1 and the second housing portion 2 by the heat and pressure treatment.
  • the crystal grain Cr generated by the reconstruction of the metal structure at the contact portion straddles the boundary over the entire boundary between the first housing portion 1 and the second housing portion 2.
  • the crystal grain Cr is present across the boundary over the entire boundary between the first metal layer 12 and the second metal layer 22.
  • the joint portion 3 has crystal grain Cr existing over at least a part of the boundary between the first metal layer 12 and the second housing portion 2. Since the joint portion 3 has the above-mentioned crystal grain Cr, the first housing portion 1 and the second housing portion 2 can be joined to each other without using other materials. It was
  • both can be joined to each other under more preferable conditions as compared with the case where the above-mentioned boundary is completely eliminated.
  • the first housing portion 1 and the second housing portion 2 can be joined to each other in a lower temperature condition and a shorter processing time as compared with the case where the above-mentioned boundary is completely eliminated.
  • the processing time can be further shortened by making the temperature conditions the same as compared with the case where the above-mentioned boundary is completely eliminated. By doing so, the time required for joining the first housing portion 1 and the second housing portion 2 to each other can be further shortened.
  • the treatment time can be made the same and the temperature condition can be further lowered as compared with the case where the above-mentioned boundary is completely eliminated. By doing so, it is possible to reduce the energy consumption required when joining the first housing portion 1 and the second housing portion 2 to each other. It was
  • the entire boundary between the first housing portion 1 and the second housing portion 2 can be firmly joined. Therefore, it is possible to reliably prevent the liquid such as the working medium in a liquid state and the gas such as the vaporized working medium from permeating at the joint portion 3. Therefore, the airtightness of the internal space 1010 can be significantly improved. It was
  • the joint portion 3 is arranged along the outer edge portion of the internal space 1010 when viewed from the vertical direction.
  • the single or plurality of crystal grain Crs are arranged in an annular shape along the outer edge portion of the internal space 1010 when viewed from the vertical direction.
  • the first region A1 and the second region A2 in FIG. 5A are arranged in a ring shape as described above when viewed from the vertical direction.
  • the first region A1 in FIG. 5B is arranged in a ring shape as described above when viewed from the vertical direction.
  • the internal space 1010 can be surrounded by the crystal grains Cr arranged in an annular shape without interruption, it is more reliable that the liquid such as the working medium in a liquid state and the gas such as the vaporized working medium permeate at the joint portion 3. Can be prevented. Therefore, the airtightness of the internal space 1010 can be further significantly improved.
  • the arrangement of the crystal grain Cr is not limited to this example.
  • the crystal grain Cr may extend in an annular shape along the outer edge of the internal space 1010 with a partial break. It was
  • the housing 101 further includes a pillar portion 4 and a third metal layer 5 (see FIG. 2).
  • the pillar portion 4 projects from the first plate 11 toward the second housing portion 2 and is arranged in the internal space 1010. More specifically, the pillar portion 4 projects downward from the bottom surface of the recess 10.
  • the tip portion of the pillar portion 4 indirectly contacts the upper surface of the second housing portion 2 via the third metal layer 5.
  • the tip portion may be in direct contact with the upper surface of the second housing portion 2, or may be indirectly or directly in contact with the wick structure.
  • the pillar portion 4 supports both of the first housing portion 1 and the second housing portion 2. Therefore, even if a downward force acts on the upper surface of the first housing portion 1 or an upward force acts on the lower surface of the second housing portion 2, the housing 101 is less likely to be deformed. It is possible to prevent the internal space 1010 from becoming narrow due to the deformation of the housing 101.
  • the example of the present embodiment is not limited to this, and at least a part of the pillar portion 4 may protrude from the upper surface of the second housing portion 2, for example, may protrude from the upper surface of the second plate 21. It was
  • the third metal layer 5 is arranged on the surface of the pillar portion 4 (see FIG. 2). That is, the surface of the pillar portion 4 is covered with the third metal layer 5.
  • the third metal layer 5 and the first metal layer 12 are different parts of a single member.
  • the present invention is not limited to this example, and the third metal layer 5 may be a separate body from the first metal layer 12.
  • the thermal conductivity of the third metal layer 5 is higher than the thermal conductivity of the column portion 4.
  • the thermal conductivity of the column portion 4 with respect to the working medium in the internal space 1010 can be improved. Therefore, the heat conduction performance of the heat conduction member 100 can be improved.
  • the present invention is not limited to these examples, and the surface of the pillar portion 4 may not be covered with the third metal layer 5. For example, as shown in FIG. 6, at least the side surface of the pillar portion 4 may be exposed to the internal space 1010. It was
  • FIGS. 7A and 7B are enlarged views of the cross-sectional structure in the vicinity of the joint portion 3 in the first modification.
  • FIG. 7A is a cross-sectional view showing a first configuration example of the joint portion 3 according to the first modification.
  • FIG. 7B is a cross-sectional view showing a second configuration example of the joint portion 3 according to the first modification.
  • both the first metal layer 12 and the second metal layer 22 are arranged in the housing 101.
  • the present invention is not limited to these examples, and for example, as in FIGS. 4A and 4B, either the first metal layer 12 or the second metal layer 22 may not be arranged in the housing 101. It was
  • the joint portion 3 further has an intermediate connector 32.
  • the intermediate connector 32 is made of metal and is a copper or copper alloy plate in this embodiment.
  • the material of the intermediate connector 32 is not limited to this example, and may be another metal material. It was
  • the intermediate connecting body 32 is arranged between the first housing portion 1 and the second housing portion 2, and indirectly connects the lower surface of the first housing portion 1 and the second surface 20 of the second housing portion 2. Connect to.
  • the intermediate connection body 32 is arranged between the first metal layer 12 and the second housing portion 2.
  • the first surface 120 of the first metal layer 12 is connected to the second surface 20 of the second housing portion 2 via the intermediate connecting body 32.
  • the intermediate connector 32 is arranged between the first metal layer 12 and the second metal layer 22.
  • the first surface 120 of the first metal layer 12 is connected to the upper surface of the second metal layer 22 via the intermediate connecting body 32.
  • the first housing portion 1, the intermediate connecting body 32, and the second housing portion 2 are joined by heat and pressure treatment in a state where they are stacked in order from the upper side to the lower side. Will be done.
  • the metal structure of the contact portion between the first metal layer 12 and the intermediate connecting body 32 and the metal structure of the contact portion of the second metal layer 22 and the intermediate connecting body 32 are gradually formed by heat and pressure treatment. Reconstructed. It was
  • the first housing portion 1, the intermediate connection body 32, and The second housing portion 2 may be connected by a single crystal grain Cra in the vertical direction. That is, the joint portion 3 has crystal grains Cra.
  • the crystal grain Cra exists across the boundary between the first housing portion 1 and the intermediate connecting body 32, the intermediate connecting body 32, and the boundary between the intermediate connecting body 32 and the second housing portion 2. More specifically, the crystal grain Cra exists across the boundary at a part of the boundary between the first metal layer 12 of the first housing portion 1 and the intermediate connector 32.
  • crystal grain Cra exists so as to straddle the intermediate connecting body 32 in the vertical direction. Further, the crystal grain Cra exists across the boundary at a part of the boundary between the intermediate connection body 32 and the second metal layer 22 of the second housing portion 2. In each first region A1, the number of crystal grains Cra may be singular or plural. It was
  • the joint portion 3 may have at least two of the first crystal grain Cr1, the second crystal grain Cr2, and the crystal grain Cra. It was
  • the joint portion 3 further has a first interface 311 and a second interface 312.
  • the first interface 311 the first surface 120 of the first metal layer 12 of the first housing portion 1 and the surface of the intermediate connecting body 32 on the first housing portion 1 side are in direct contact with each other.
  • the second surface 20 of the second housing portion 2 and the surface of the intermediate connecting body 32 on the second housing portion 2 side are in direct contact with each other, and in FIGS.
  • the joint portion 3 (see FIG. 5B) having only the first region A1 is replaced with the first housing portion 1 and the second housing portion 2 by the heat and pressure treatment. It may be formed in the contact portion of.
  • at least one of the above-mentioned crystal grains Cr1, Cr2, and Cra generated by the reconstruction of the metal structure at the contact portion is the first housing portion 1 and the second housing portion 2. It may exist across the boundary in the entire area of the boundary. It was
  • the first crystal grain Cr1 is the intermediate connector 32 with the first metal layer 12 of the first housing portion 1. It may exist across the boundary in the entire area of the boundary. And / or, the second crystal grain Cr2 may be present across the boundary over the entire boundary between the second metal layer 22 of the second housing portion 2 and the intermediate connector 32. At least one of the first crystal grain Cr1 and the second crystal grain Cr2 may be singular or plural. It was
  • the joint portion 3 further has a first crystal grain Cr1 and a second crystal grain Cr2.
  • the first crystal grain Cr1 exists across the boundary at least a part of the boundary between the first metal layer 12 and the intermediate connector 32.
  • the second crystal grain Cr2 exists across the boundary at least a part of the boundary between the second metal layer 22 and the intermediate connector 32.
  • the first housing portion 1 and the first housing portion 1 and the second housing portion 32 are completely eliminated.
  • the entire boundary of the housing portion 2 can be firmly joined. Therefore, it is possible to reliably prevent the liquid such as the working medium in a liquid state and the gas such as the vaporized working medium from permeating at the joint portion 3. Therefore, the airtightness of the internal space 1010 can be significantly improved. It was
  • the crystal grain Cra straddles the boundary over the entire boundary between the first metal layer 12 of the first housing portion 1 and the intermediate connector 32. May exist. And / or, the crystal grain Cra may be present across the boundary over the entire boundary between the second metal layer 22 of the second housing portion 2 and the intermediate connector 32. At this time, the number of crystal grains Cra may be singular or plural. It was
  • the joint portion 3 has crystal grains Cra.
  • the crystal grain Cra exists across the boundary at least a part of the boundary between the first metal layer 12 of the first housing portion 1 and the intermediate connection body 32, and also exists across the intermediate connection body 32, and further. It exists across the boundary at least a part of the boundary between the intermediate connection body 32 and the second housing portion 2.
  • the first housing portion 1 and the second housing portion 2 can be more firmly connected via the intermediate connecting body 32. Further, by eliminating a part of the boundary between the first housing portion 1 and the intermediate connecting body 32 and / or a part of the boundary between the second housing portion 2 and the intermediate connecting body 32, the above-mentioned boundary is eliminated. Compared with the case of completely eliminating them, both can be joined to each other under more preferable conditions as in the case of FIG. 7A. Alternatively, by completely eliminating the boundary between the first housing portion 1 and the intermediate connecting body 32 and / or the boundary between the second housing portion 2 and the intermediate connecting body 32, as in the case of FIG. 7A, It is possible to reliably prevent the liquid such as the working medium in a liquid state and the gas such as the vaporized working medium from permeating at the joint portion 3. It was
  • the joint portion 3 is arranged along the outer edge portion of the internal space 1010 when viewed from the vertical direction.
  • the single or plurality of crystal grains Cr1, Cr2, and Cra are arranged in an annular shape along the outer edge portion of the internal space 1010 when viewed from the vertical direction. It was
  • At least one of the first crystal grain Cr1 and the second crystal grain Cr2 in FIG. 7A is arranged in an annular shape along the outer edge portion of the internal space 1010 when viewed from the vertical direction.
  • a liquid such as a working medium in a liquid state, a vaporized working medium, and the like can be used. It is possible to sufficiently prevent the gas of the above from permeating at the joint portion 3. Therefore, the airtightness of the internal space 1010 can be enhanced.
  • the arrangement of the first crystal grain Cr1 and the second crystal grain Cr2 is not limited to this example.
  • at least one of the first crystal grain Cr1 and the second crystal grain Cr2 may extend in an annular shape along the outer edge of the internal space 1010 with a partial break. It was
  • the crystal grains Cra of FIG. 7B are arranged in an annular shape along the outer edge portion of the internal space 1010 when viewed from the vertical direction.
  • the internal space 1010 can be surrounded by the crystal grains Cra arranged in a ring shape without interruption, a liquid such as a working medium in a liquid state and a gas such as a vaporized working medium permeate through the joint portion 3. Can be reliably prevented. Therefore, the airtightness of the internal space 1010 can be enhanced.
  • the arrangement of the crystal grain Cra is not limited to this example.
  • the crystal grain Cra may extend in an annular shape along the outer edge of the internal space 1010 with a partial break. It was
  • the region A1 in which the first crystal grain Cr1 and the crystal grain Cra are present may be arranged in an annular shape along the outer edge portion of the internal space 1010 when viewed from the vertical direction.
  • the region A1 in which the second crystal grain Cr2 and the crystal grain Cra are present may be arranged in an annular shape along the outer edge portion of the internal space 1010 when viewed from the vertical direction.
  • FIG. 8A is a cross-sectional view showing a configuration example of the heat conductive member 100 according to the second modification.
  • FIG. 8B is a cross-sectional view showing another configuration example of the heat conductive member 100 according to the second modification. It was
  • one of the first metal layer 12 and the second metal layer 22 is arranged on the housing 101. It was
  • the first metal layer 12 is arranged in the housing 101, but the second metal layer 22 is not arranged.
  • the third metal layer 5 may or may not be arranged on the surface of the pillar portion 4 as shown in FIG. 8A.
  • the material of the first metal layer 12 is different from the material of the first plate 11 and is the same as the material of the second plate 21.
  • the material of the first plate 11 is stainless steel, and the material of the first metal layer 12 and the material of the second plate 21 are both copper or a copper alloy.
  • these materials are not limited to the above-mentioned examples.
  • a material having higher mechanical strength than the first metal layer 12 can be used for the first plate 11.
  • first metal layer 12 and the second plate 21 a material having a higher thermal conductivity than that of the first plate 11 can be adopted. By doing so, since the same materials are joined at the joint portion 3, the joint strength between the first metal layer 12 and the second plate 21 of the first housing portion 1 can be improved. Therefore, the airtightness of the internal space 1010 can be further improved. It was
  • the second metal layer 22 is arranged in the housing 101, but the first metal layer 12 and the third metal layer 5 are not arranged. Further, the material of the second metal layer 22 is different from the material of the second plate 21 and is the same as the material of the first plate 11. For example, in FIG. 8B, the material of the first plate 11 and the material of the second metal layer 22 are both copper or a copper alloy, and the material of the second plate 21 is stainless steel. In addition, these materials are not limited to the above-mentioned examples. For example, a material having higher mechanical strength than the second metal layer 22 can be used for the second plate 21.
  • first plate 11 and the second metal layer 22 a material having a higher thermal conductivity than that of the second plate 21 can be adopted. By doing so, since the same materials are bonded to each other at the joint portion 3, the joint strength between the first plate 11 and the second metal layer 22 of the second housing portion 2 can be improved. Therefore, the airtightness of the internal space 1010 can be further improved. It was
  • the present invention is useful, for example, for a member that dissipates heat from a heat generation source.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Un boîtier d'un élément thermoconducteur selon la présente invention comporte une première partie de boîtier en forme de plaque, une seconde partie de boîtier en forme de plaque et une partie de jonction. Un espace intérieur, dans lequel est disposée une structure de mèche, est disposé entre la première partie de boîtier et la seconde partie de boîtier et est entouré par un milieu de travail. La première partie de boîtier comprend une première plaque métallique et une première couche métallique. La première couche métallique est disposée sur la surface côté seconde partie de boîtier de la première plaque. Le point de fusion de la première couche métallique est inférieur au point de fusion de la première plaque. La seconde partie de boîtier a une seconde plaque métallique. La partie de jonction est disposée le long d'une section de bord externe de l'espace intérieur lorsqu'elle est vue depuis la direction haut-bas faisant face à l'une ou l'autre de la première partie de boîtier et de la seconde partie de boîtier et relie une première surface de la première couche métallique sur le côté seconde partie de boîtier de celle-ci à une seconde surface de la seconde partie de boîtier sur le côté première partie de boîtier de celle-ci.
PCT/JP2020/047798 2020-06-15 2020-12-22 Élément thermoconducteur WO2021255967A1 (fr)

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JP2020-103317 2020-06-15
JP2020103317A JP2023106647A (ja) 2020-06-15 2020-06-15 熱伝導部材

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WO2021255967A1 true WO2021255967A1 (fr) 2021-12-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7233584B1 (ja) 2022-02-28 2023-03-06 古河電気工業株式会社 ベーパーチャンバ

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WO2014184890A1 (fr) * 2013-05-15 2014-11-20 日新製鋼株式会社 Procédé permettant de produire un produit soudé par diffusion en acier inoxydable
WO2016031604A1 (fr) * 2014-08-29 2016-03-03 古河電気工業株式会社 Caloduc plat
JP2016188734A (ja) * 2015-03-30 2016-11-04 株式会社フジクラ ベーパーチャンバー
JP2017003160A (ja) * 2015-06-08 2017-01-05 株式会社フジクラ 薄板ヒートパイプ型熱拡散板
JP2018189349A (ja) * 2017-04-28 2018-11-29 株式会社村田製作所 ベーパーチャンバー
JP2019039662A (ja) * 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014184890A1 (fr) * 2013-05-15 2014-11-20 日新製鋼株式会社 Procédé permettant de produire un produit soudé par diffusion en acier inoxydable
WO2016031604A1 (fr) * 2014-08-29 2016-03-03 古河電気工業株式会社 Caloduc plat
JP2016188734A (ja) * 2015-03-30 2016-11-04 株式会社フジクラ ベーパーチャンバー
JP2017003160A (ja) * 2015-06-08 2017-01-05 株式会社フジクラ 薄板ヒートパイプ型熱拡散板
JP2018189349A (ja) * 2017-04-28 2018-11-29 株式会社村田製作所 ベーパーチャンバー
JP2019039662A (ja) * 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7233584B1 (ja) 2022-02-28 2023-03-06 古河電気工業株式会社 ベーパーチャンバ
WO2023163200A1 (fr) * 2022-02-28 2023-08-31 古河電気工業株式会社 Chambre à vapeur
JP2023125766A (ja) * 2022-02-28 2023-09-07 古河電気工業株式会社 ベーパーチャンバ

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