WO2021246271A1 - 音響式不良検出装置及び不良検出方法 - Google Patents

音響式不良検出装置及び不良検出方法 Download PDF

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Publication number
WO2021246271A1
WO2021246271A1 PCT/JP2021/020120 JP2021020120W WO2021246271A1 WO 2021246271 A1 WO2021246271 A1 WO 2021246271A1 JP 2021020120 W JP2021020120 W JP 2021020120W WO 2021246271 A1 WO2021246271 A1 WO 2021246271A1
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Prior art keywords
ultrasonic
acoustic
defect detection
vibration
detection device
Prior art date
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PCT/JP2021/020120
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English (en)
French (fr)
Japanese (ja)
Inventor
広志 宗像
マイケル カークビー
哲弥 歌野
晶太 中野
卓也 足立
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Yamaha Robotics Co Ltd
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Yamaha Robotics Co Ltd
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Priority to JP2022528775A priority Critical patent/JP7308577B2/ja
Publication of WO2021246271A1 publication Critical patent/WO2021246271A1/ja
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy

Definitions

  • the present invention relates to a structure of an acoustic defect detection device that detects defects of an inspection object using ultrasonic waves and a defect detection method that detects defects using ultrasonic waves.
  • Patent Document 1 has a problem that the device becomes complicated because the ultrasonic vibrator is connected to the inspection object and the entire inspection object is ultrasonically vibrated. ..
  • an object of the present invention is to detect defects in an inspection object with a simple configuration.
  • the acoustic defect detection device of the present invention is an acoustic defect detection device that detects defects of an inspection object, and is an acoustic head that ultrasonically vibrates the inspection object and an ultrasonic excitation head that is attached to the acoustic head.
  • the acoustic head is oriented with an infrared thermography that outputs the temperature distribution of the surface of the inspection object inside as a temperature distribution image and a detection unit that detects defects based on the temperature distribution image input from the infrared thermography.
  • It has a plurality of ultrasonic generators having a property and a casing in which a plurality of ultrasonic generators are mounted so that a plurality of ultrasonic waves generated from the plurality of ultrasonic generators are concentrated on an object to be inspected. It is characterized in that a plurality of ultrasonic waves generated from the ultrasonic generator of the above are concentrated on the inspection target and the inspection target is ultrasonically vibrated.
  • ultrasonic waves are concentrated on the inspection target and the inspection target is indirectly ultrasonically vibrated to detect defects such as cracks. It is possible to detect defects such as cracks with a simple structure as compared with the case where ultrasonic vibration is directly incident on the object to be inspected. Further, since the inspection object is indirectly ultrasonically vibrated, it is possible to detect the defect of the inspection object in a non-contact manner.
  • the detection unit may detect a high temperature portion having a temperature higher than the surroundings in the temperature distribution image input from the infrared thermography as a defect region.
  • the infrared thermography outputs the temperature distribution of the surface of the inspection object before ultrasonic vibration as a temperature distribution image before vibration, and during ultrasonic vibration or ultrasonic vibration.
  • the temperature distribution on the surface of the object to be inspected later is output as a post-vibration temperature distribution image, and the detection unit is based on the pre-vibration temperature distribution image and the post-vibration temperature distribution image input from the infrared thermography.
  • the temperature difference between the temperature before the vibration and the temperature after the vibration may be calculated for each region, and the region where the temperature difference is equal to or larger than a predetermined threshold may be detected as a defective region.
  • the temperature difference between the temperature before vibration and the temperature after vibration is calculated for each surface region, and the region where the temperature difference is equal to or greater than a predetermined threshold value is detected as the defective region. Even when the shaking time is short and the temperature rise of the defective portion is not so large as compared with the other portions, defects such as cracks can be reliably detected. As a result, the defect detection time can be shortened.
  • the holding surface includes a stage for holding an inspection object, the acoustic head is arranged on the holding surface side of the stage away from the stage, and the casing of the acoustic head is annular.
  • the multiple ultrasonic generators are multiple ultrasonic speakers, each axis attached to the casing so that it concentrates on the object to be inspected held on the holding surface of the stage. May be good.
  • the ultrasonic waves generated by the ultrasonic speaker can be effectively concentrated on the inspection target object, and the inspection target object can be effectively ultrasonically vibrated.
  • the acoustic defect detection device of the present invention includes a moving mechanism that moves the acoustic head relative to the stage, and the moving mechanism is an inspection in which a plurality of ultrasonic waves generated from a plurality of ultrasonic generators are concentrated on an inspection object.
  • the acoustic head may be moved relative to scan the area along the surface of the object to be inspected.
  • the acoustic defect detection device of the present invention may include a drive circuit for driving a plurality of ultrasonic generators, and the drive circuit may be capable of adjusting each phase of the ultrasonic waves generated from each ultrasonic generator. Further, the drive circuit may include a plurality of drive units for driving one ultrasonic generator, and the drive unit may be capable of adjusting the phase of the ultrasonic wave generated from the ultrasonic generator.
  • the size of the inspection target and the size of defects such as cracks to be detected can be adjusted to the surface of the ultrasonic inspection target.
  • the degree of concentration can be adjusted.
  • the defect detection method of the present invention is a defect detection method for detecting defects in an inspection object, which includes an acoustic head having a plurality of directional ultrasonic generators and ultrasonically vibrating the inspection object.
  • the preparatory step of preparing an acoustic defect detection device equipped with infrared thermography attached to the acoustic head, and multiple ultrasonic waves generated by multiple ultrasonic generators of the acoustic head are concentrated and inspected on the inspection object.
  • the defect detection method of the present invention is a defect detection method for detecting defects in an inspection object, and is an acoustic head having a plurality of directional ultrasonic generators and ultrasonically vibrating the inspection object. And the preparatory step of preparing an acoustic defect detection device equipped with infrared thermography attached to the acoustic head, and multiple ultrasonic waves generated by multiple ultrasonic generators of the acoustic head are concentrated on the inspection object.
  • the temperature distribution of the surface of the inspection target before ultrasonic vibration is acquired as a pre-vibration temperature distribution image by the ultrasonic vibration step of ultrasonically vibrating the inspection target and the infrared thermography, and the ultrasonic vibration is applied.
  • Pre- and post-vibration image acquisition process to acquire the temperature distribution of the surface of the inspection object during shaking or after ultrasonic vibration as a post-vibration temperature distribution image, and the acquired pre-vibration temperature distribution image and post-vibration temperature distribution image.
  • the defective region detection step of calculating the temperature difference between the temperature before the vibration and the temperature after the vibration for each surface region and detecting the region where the temperature difference is equal to or higher than a predetermined threshold as the defective region. , It is characterized by having.
  • the present invention can detect defects such as cracks in the inspection target with a simple configuration.
  • the acoustic defect detection device 100 of the embodiment includes a stage 10, an acoustic head 20, a moving mechanism 30, a control unit 50, and a detection unit 55.
  • the direction perpendicular to the paper surface of FIG. 1 will be described as the X direction
  • the direction orthogonal to the X direction on the horizontal plane will be described as the Y direction
  • the vertical direction will be described as the Z direction. Note that FIG.
  • each ultrasonic speaker 21 is not distinguished, it is referred to as an ultrasonic speaker 21 and each is referred to as an ultrasonic speaker 21.
  • each ultrasonic speaker 21 is referred to as an ultrasonic speaker 21 and each is referred to as an ultrasonic speaker 21.
  • ultrasonic speakers 211 to 216 When distinguishing the ultrasonic speakers 21, they are referred to as ultrasonic speakers 211 to 216.
  • the stage 10 is attached to a base (not shown).
  • the stage 10 attracts and holds the electronic component 13 which is an inspection target on the upper holding surface 10a.
  • the electronic component 13 may be, for example, a semiconductor chip 11 mounted on the substrate 12.
  • the semiconductor chip 11 contains a defective crack 90.
  • the stage 10 can convey the electronic component 13 in the X direction.
  • the acoustic head 20 is arranged above the holding surface 10a of the stage 10 so as to be separated from the stage 10.
  • the acoustic head 20 is composed of a casing 22 and a plurality of ultrasonic speakers 21 attached to the casing 22.
  • the casing 22 of the acoustic head 20 is connected to a moving mechanism 30 that moves the acoustic head 20 relative to the electronic component 13 that is attracted and held on the holding surface 10a of the stage 10.
  • the moving mechanism 30 includes a guide rail 31 movably attached to a base (not shown) so as to be movable in the X direction, and a slider 33 that moves in the Y direction along the guide rail 31.
  • the guide rail 31 is configured to be movable in the X direction by the X direction moving mechanism 32.
  • the slider 33 is provided with a Y-direction moving mechanism 34 inside, and is configured to be movable in the Y-direction by being guided by a guide rail 31.
  • the casing 22 of the acoustic head 20 is connected to the slider 33 by an arm 36 extending in the Z direction.
  • the slider 33 is internally provided with a Z-direction moving mechanism 35 that drives the arm 36 in the Z direction, and is configured to be able to move the acoustic head 20 in the Z direction. Therefore, the moving mechanism 30 is configured to be relatively movable in the XYZ direction with respect to the electronic component 13 in which the acoustic head 20 is attracted and held on the stage 10.
  • the casing 22 of the acoustic head 20 has a spherical dome shape, and the lower stage side is open.
  • the spherical center 26 constituting the casing 22 is located on the surface 15 of the electronic component 13 held on the holding surface 10a of the stage 10.
  • the ultrasonic speaker 21 is a directivity ultrasonic generator, and generates the ultrasonic wave 24 so that the ultrasonic wave 24 propagates in the range of the directivity angle ⁇ about the axis 21a in the direction of the axis 21a.
  • the plurality of ultrasonic speakers 21 are attached to the casing 22 so that the axes 21a intersect with each other at the spherical center 26 of the casing 22.
  • each ultrasonic wave 24 generated from the plurality of ultrasonic speakers 21 is concentrated on the surface 15 of the electronic component 13 held on the holding surface 10a where the sphere center 26 is located.
  • the area where the ultrasonic waves 24 on the surface 15 of the electronic component 13 are concentrated is the inspection area 40 for detecting the crack 90.
  • a drive unit 23 for driving the ultrasonic speaker 21 is connected to each ultrasonic speaker 21.
  • Each drive unit 23 can adjust the phase of the ultrasonic wave 24 generated by the connected ultrasonic speaker 21.
  • the plurality of drive units 23 form a drive circuit for driving the ultrasonic speaker group composed of the plurality of ultrasonic speakers 21.
  • the X-direction moving mechanism 32, the Y-direction moving mechanism 34, the Z-direction moving mechanism 35, and the drive unit 23 for driving each ultrasonic speaker 21 of the moving mechanism 30 are connected to the control unit 50 and are connected to the control unit 50. Driven by command.
  • the control unit 50 is a computer including a CPU 51, which is a processor that processes information internally, and a storage unit 52 that stores a control program and control data.
  • An infrared thermography 27 is attached to the center of the acoustic head 20.
  • the infrared thermography 27 measures infrared radiation from the surface 15 of the electronic component 13 and outputs the temperature distribution of the surface 15 as a temperature distribution image.
  • the infrared thermography 27 is attached to the casing 22 so that the optical axis 28 is perpendicular to the stage 10 and passes through the center 26 of the sphere. Therefore, the infrared thermography 27 is attached to the casing 22 so as to image the inspection region 40 of the surface 15 of the electronic component 13 from directly above.
  • the infrared thermography 27 is connected to the detection unit 55.
  • the detection unit 55 detects the crack 90 based on the temperature distribution image input from the infrared thermography 27.
  • the detection unit 55 is a computer including a CPU 56 which is a processor that processes information internally, a storage unit 57 that stores a control program and control data, and a display 58 that displays a temperature distribution image input from the infrared thermography 27. be. Further, the detection unit 55 is connected to the control unit 50 to exchange data.
  • the first control unit 50 operates the Z-direction moving mechanism 35 to adjust the Z-direction position of the acoustic head 20 so that the height of the sphere center 26 coincides with the surface 15 of the electronic component 13.
  • the control unit 50 drives each ultrasonic speaker 21 by each drive unit 23 to generate an ultrasonic wave 24 having a predetermined frequency from each ultrasonic speaker 21.
  • Each ultrasonic speaker 21 has directivity and propagates in the direction of each axis 21a within a range of a directivity angle ⁇ centered on the axis 21a. Since each ultrasonic speaker 21 is attached to the casing 22 so that each axis 21a intersects with the spherical center 26 of the casing 22, the ultrasonic wave 24 generated from each ultrasonic speaker 21 is the spherical center 26 of the casing 22. It intersects in the vicinity of and is concentrated and overlapped.
  • the control unit 50 adjusts each phase of each ultrasonic speaker 21 so that the amplitude of the ultrasonic vibration becomes large in the vicinity of the center of the sphere 26 by superimposing the ultrasonic waves 24.
  • the phase of the ultrasonic wave 24 generated by the ultrasonic speakers 211 and 216 located symmetrically with respect to the center 26 of the sphere is shifted by 180 degrees.
  • the phases of the ultrasonic speakers 212 and 215 and the phases of the ultrasonic speakers 213 and 214 which are positioned symmetrically with respect to the center 26 of the sphere, may be shifted by 180 degrees, respectively.
  • the phase of each ultrasonic wave 24 generated by each ultrasonic speaker 211 to 216 may be adjusted to be dispersed. As a result, the amplitude of the ultrasonic vibration in the inspection region 40, which is the range where the ultrasonic waves 24 in the vicinity of the center of the sphere 26 are concentrated, can be increased.
  • the control unit 50 continues ultrasonic vibration of the inspection region 40 for a predetermined time ⁇ t1.
  • the detection unit 55 When the inspection region 40 is ultrasonically vibrated for a predetermined time ⁇ t1, the detection unit 55 causes an infrared thermography 27 attached to the acoustic head 20 to image the infrared radiation of the inspection region 40 to measure the temperature distribution of the inspection region 40. Output as a distribution image. As shown in FIG. 3, the detection unit 55 detects a high temperature portion having a temperature higher than the surroundings in the temperature distribution image input from the infrared thermography 27 as a crack region 91 in which the crack 90 exists inside. The crack region 91 is a defective region in which a defective crack 90 exists.
  • a region having a temperature higher than the ambient temperature is extracted from the temperature distribution image as a high temperature portion, and the high temperature portion and the ambient temperature are the highest.
  • the temperature difference ⁇ T1 (see FIG. 2) with the low temperature portion having a low temperature becomes equal to or higher than a predetermined threshold value, the high temperature portion may be detected as the crack region 91.
  • the inspector looks at the image displayed on the display 58 and detects the high temperature portion as the crack region 91 based on the color of the image. You may do it.
  • the crack region 91 may be detected by the temperature difference between the temperature before ultrasonic vibration and the temperature during or after ultrasonic vibration.
  • the detection unit 55 acquires the temperature distribution of the inspection region 40 of the electronic component 13 before ultrasonic vibration as a pre-vibration temperature distribution image by infrared thermography 27. Then, as shown in FIG. 2, after the control unit 50 drives the ultrasonic speaker 21 to ultrasonically vibrate the inspection region 40 for a predetermined time ⁇ t2, the temperature distribution of the inspection region 40 of the electronic component 13 is vibrated. Obtained as a temperature distribution image. Then, the detection unit 55 detects the temperature before vibration and the temperature after vibration in a predetermined region 45 (see FIG.
  • this detection method can detect the same temperature difference with a shorter ultrasonic vibration time than the method for detecting the high temperature portion of the temperature distribution image described above, so that the crack region 91 can be detected. Detection time can be shortened.
  • the temperature distribution image after the vibration is acquired after the ultrasonic vibration, but the temperature distribution image after the vibration may be acquired during the ultrasonic vibration.
  • the control unit 50 moves the acoustic head 20 in the XY direction by the moving mechanism 30. In this way, the inspection region 40 is scanned along the surface 15 of the electronic component 13 by the moving mechanism 30 to detect the crack region 91 of the entire electronic component 13.
  • the crack region 91 of the electronic component 13 may be detected without scanning.
  • the ultrasonic wave 24 is concentrated on the surface 15 of the electronic component 13 by using the acoustic head 20 to which a plurality of ultrasonic speakers 21 are attached to form the electronic component 13. Indirectly ultrasonically vibrate. Therefore, it is possible to detect the crack region 91 in which the crack 90 exists inside with a simple structure as compared with the case where the ultrasonic vibration is directly incident on the electronic component 13. Further, since the electronic component 13 is indirectly ultrasonically vibrated, the crack region 91 of the electronic component 13 can be detected without contact.
  • each drive unit 23 of the acoustic defect detection device 100 can adjust the phase of the ultrasonic wave 24 generated by the connected ultrasonic speaker 21, and is formed by adjusting each phase.
  • the shape, size, and position of the inspection area 40 can be freely adjusted according to the size of the inspection object.
  • the casing 22 has a spherical dome shape, and each ultrasonic speaker 21 is attached so that each axis 21a intersects at the center 26 of the sphere.
  • the inspection region 40 having a large amplitude of ultrasonic vibration can be stably formed. Therefore, the position of the inspection region 40 does not fluctuate, and the surface 15 of the electronic component 13 can be reliably ultrasonically vibrated.
  • the height of the center 26 of the sphere is set to match the surface 15 of the electronic component 13, but the present invention is not limited to this, and the electronic component 13 is not limited to this and is within the thickness range of the electronic component 13. It may be below the surface 15 of. As a result, the entire electronic component 13 can be ultrasonically vibrated. Further, the center 26 of the sphere may be slightly above the surface 15.
  • each ultrasonic speaker 21 is arranged so that the range of each direction angle ⁇ centered on each axis 21a of each ultrasonic speaker 21 intersects even if each axis 21a does not intersect at the center of the sphere 26. You just have to.
  • the drive unit 23 for driving the ultrasonic speaker 21 has been described as being connected to each ultrasonic speaker 21, the present invention is not limited to this, and some ultrasonic speakers 21 are combined with one drive unit 23. It may be configured to be driven.
  • the moving mechanism 30 has been described as being composed of a guide rail 31 moving in the X direction, a slider 33 moving in the Y direction, and a Z direction moving mechanism 35 attached to the slider 33, but the present invention is limited to this.
  • the acoustic head 20 may be attached to the tip of a robot arm that can freely move in the XYZ direction.
  • the robot arm constitutes the moving mechanism 30.
  • the stage 10 may be configured to move in the XYZ direction, or the electronic component 13 mounted on the stage 10 may be configured to move in the XY direction.
  • the acoustic defect detection device 200 of another embodiment will be described with reference to FIG.
  • the same parts as those of the acoustic defect detection device 100 described above with reference to FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted.
  • a plurality of ultrasonic speakers 21 are attached to an annular casing 62.
  • the casing 62 is a sphere-shaped annular member having an open surface 64 having a small diameter on the upper side and an open surface 65 having a large diameter on the lower side, and a plurality of ultrasonic speakers 21 are attached to the ball band surface 63.
  • the ball center 66 of the ball band surface 63 is located on the surface 15 of the electronic component 13 held on the holding surface 10a of the stage 10.
  • the plurality of ultrasonic speakers 21 are attached to the casing 62 so that the axes 21a intersect at the spherical center 66 of the casing 62. Similar to the acoustic defect detection device 100 described above with reference to FIG.
  • the ultrasonic waves 24 generated from each ultrasonic speaker 21 intersect at the center of the sphere 66 and are concentrated and superposed.
  • an inspection region 40 having a large amplitude of ultrasonic vibration is formed in the vicinity of the center 66 of the sphere.
  • a stay 67 is attached to the open surface 64 on the upper side of the casing 62, and an arm 36 is connected to the stay 67. Similar to the acoustic head 20 of the acoustic defect detection device 100 described above with reference to FIG. 1, the acoustic head 60 is attracted and held on the stage 10 by the moving mechanism 30 in the XYZ direction with respect to the electronic component 13. It is relatively mobile.
  • Infrared thermography 27 is attached to the stay 67.
  • the infrared thermography 27 is attached to the stay 67 so that the optical axis 28 is perpendicular to the stage 10 and passes through the center of the sphere 66.
  • the operation of the acoustic defect detection device 200 is the same as the operation of the acoustic defect detection device 100 described above with reference to FIG.
  • the casing 62 of the acoustic defect detection device 200 is composed of a spherical segment-shaped annular member, the thickness in the Z direction can be reduced, and the casing 62 can be incorporated into a small bonding device or the like.
  • the casing 62 of the acoustic head 60 has been described as a sphere-shaped annular member having an open surface 64 having a small diameter on the upper side and an open surface 65 having a large diameter on the lower side.
  • a lid may be attached to the.
  • the ultrasonic wave 24 generated from the ultrasonic speaker 21 is less likely to be affected by the outside air, so that the position and size of the inspection region 40 can be further stabilized.
  • the ultrasonic speaker 21 may be attached to the lid.
  • the amplitude of the ultrasonic vibration in the inspection region 40 can be made larger, and the surface 15 of the electronic component 13 can be effectively ultrasonically vibrated to efficiently detect the crack region 91, which is a defective region.
  • the acoustic defect detection devices 100 and 200 have been described as detecting the crack 90 inside the electronic component 13 as the crack region 91, but it exists not only on the crack 90 inside but also on the surface 15. It is also possible to detect cracks 90.
  • the electrons connecting the semiconductor chip 11 and the substrate 12 with a wire 16 by using the acoustic defect detection device 100 described above with reference to FIG. 1 A case of detecting a non-attachment region 94 between the semiconductor chip 11 and the wire 16 of the component 13 or a non-attachment region 94 between the substrate 12 and the wire 16 will be described.
  • the non-attached region 94 is a defective region in which the non-attached portions 92 and 93, which will be described later, are defective.
  • the electronic component 13 includes a semiconductor chip 11, a substrate 12, and a metal wire 16 connecting between the pad 11a (see FIG. 6) of the semiconductor chip 11 and the island 12a (see FIG. 7) of the substrate 12. It is composed of.
  • the wire 16 presses a free air ball formed at the tip onto the pad 11a and is bonded onto the pad 11a as a hemispherical crimping ball 17.
  • Such bonding is called ball bonding.
  • a non-bonded portion 92 that is not crimped may be formed between the crimping ball 17 and the pad 11a.
  • the other end of the wire 16 is crimped by pressing the side surface of the wire 16 onto the island 12a.
  • a non-bonded portion 93 that has not been crimped may be formed between the crimped portion 18 and the island 12a.
  • non-delivery detection a method is used in which a current is passed between the wire 16 and the semiconductor chip 11 to detect non-delivery.
  • a current is passed between the wire 16 and the semiconductor chip 11 to detect non-delivery.
  • FIGS. 6 and 7 when a part of the non-delivery is detected, the non-delivery is detected. It was difficult to detect non-delivery by the method of passing an electric current.
  • the pad 11a shown by shading whose temperature is higher than the surroundings is detected as the non-attachment region 94 in which the non-attachment portion 92 exists.
  • the island 12a having a temperature higher than that of the surroundings is detected as the non-attachment region 94 in which the non-attachment portion 93 exists.
  • the specific method for detecting the non-arrival region 94 is the same as the method for detecting the crack region 91 of the electronic component 13 described above.
  • the detection unit 55 detects the acquired pre-vibration temperature.
  • a predetermined region 45 in the inspection region 40 of the distribution image and the temperature distribution image after vibration may be set to a range including one pad 11a.
  • the acoustic defect detecting device 100 detects the non-attached portions 92 and 93 of the wire 16 of the electronic component 13 has been described above.
  • the acoustic defect detecting device 100 is not limited to the electronic component 13, but the turbine blade, the shaft, and the like. It can also be applied to the detection of cracks 90 in metal parts.
  • the operation of the acoustic defect detection devices 100 and 200 described above can be described as follows as a defect detection method.
  • the temperature distribution of the surface 15 of the electronic component 13 before ultrasonic vibration is acquired as a pre-vibration temperature distribution image by infrared thermography 27.
  • the temperature difference between the temperature before vibration and the temperature after vibration is calculated for each region 45 of the surface 15 based on the temperature distribution image after vibration, and the region where the temperature difference is equal to or more than a predetermined threshold is defective.
  • 10 stage 10a holding surface, 11 semiconductor chip, 11a pad, 12 substrate, 12a island, 13 electronic component, 15 surface, 16 wire, 17 crimping ball, 18 crimping part, 20 acoustic head, 21,211-216 ultrasonic waves Speaker, 21a axis, 22 casing, 23 drive unit, 24 ultrasonic wave, 26 sphere center, 27 infrared thermography, 28 optical axis, 30 movement mechanism, 31 guide rail, 32 X direction movement mechanism, 33 slider, 34 Y direction movement mechanism , 35 Z direction movement mechanism, 36 arm, 40 inspection area, 45 area, 50 control unit, 51, 56 CPU, 52, 57 storage unit, 55 detection unit, 58 display, 60 acoustic head, 62 casing, 63 ball band surface , 64, 65 open surface, 66 ball center, 67 stay, 90 crack, 91 crack area, 92, 93 non-attached part, 94 non-attached area, 100, 200 acoustic defect detection device.

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  • Life Sciences & Earth Sciences (AREA)
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  • Acoustics & Sound (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
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  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
PCT/JP2021/020120 2020-06-01 2021-05-27 音響式不良検出装置及び不良検出方法 Ceased WO2021246271A1 (ja)

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