WO2021246271A1 - Acoustic defect detection device and method for detecting defect - Google Patents

Acoustic defect detection device and method for detecting defect Download PDF

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Publication number
WO2021246271A1
WO2021246271A1 PCT/JP2021/020120 JP2021020120W WO2021246271A1 WO 2021246271 A1 WO2021246271 A1 WO 2021246271A1 JP 2021020120 W JP2021020120 W JP 2021020120W WO 2021246271 A1 WO2021246271 A1 WO 2021246271A1
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WIPO (PCT)
Prior art keywords
ultrasonic
acoustic
defect detection
vibration
detection device
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PCT/JP2021/020120
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French (fr)
Japanese (ja)
Inventor
広志 宗像
マイケル カークビー
哲弥 歌野
晶太 中野
卓也 足立
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ヤマハロボティクスホールディングス株式会社
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Priority to JP2022528775A priority Critical patent/JP7308577B2/en
Publication of WO2021246271A1 publication Critical patent/WO2021246271A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy

Definitions

  • the present invention relates to a structure of an acoustic defect detection device that detects defects of an inspection object using ultrasonic waves and a defect detection method that detects defects using ultrasonic waves.
  • Patent Document 1 has a problem that the device becomes complicated because the ultrasonic vibrator is connected to the inspection object and the entire inspection object is ultrasonically vibrated. ..
  • an object of the present invention is to detect defects in an inspection object with a simple configuration.
  • the acoustic defect detection device of the present invention is an acoustic defect detection device that detects defects of an inspection object, and is an acoustic head that ultrasonically vibrates the inspection object and an ultrasonic excitation head that is attached to the acoustic head.
  • the acoustic head is oriented with an infrared thermography that outputs the temperature distribution of the surface of the inspection object inside as a temperature distribution image and a detection unit that detects defects based on the temperature distribution image input from the infrared thermography.
  • It has a plurality of ultrasonic generators having a property and a casing in which a plurality of ultrasonic generators are mounted so that a plurality of ultrasonic waves generated from the plurality of ultrasonic generators are concentrated on an object to be inspected. It is characterized in that a plurality of ultrasonic waves generated from the ultrasonic generator of the above are concentrated on the inspection target and the inspection target is ultrasonically vibrated.
  • ultrasonic waves are concentrated on the inspection target and the inspection target is indirectly ultrasonically vibrated to detect defects such as cracks. It is possible to detect defects such as cracks with a simple structure as compared with the case where ultrasonic vibration is directly incident on the object to be inspected. Further, since the inspection object is indirectly ultrasonically vibrated, it is possible to detect the defect of the inspection object in a non-contact manner.
  • the detection unit may detect a high temperature portion having a temperature higher than the surroundings in the temperature distribution image input from the infrared thermography as a defect region.
  • the infrared thermography outputs the temperature distribution of the surface of the inspection object before ultrasonic vibration as a temperature distribution image before vibration, and during ultrasonic vibration or ultrasonic vibration.
  • the temperature distribution on the surface of the object to be inspected later is output as a post-vibration temperature distribution image, and the detection unit is based on the pre-vibration temperature distribution image and the post-vibration temperature distribution image input from the infrared thermography.
  • the temperature difference between the temperature before the vibration and the temperature after the vibration may be calculated for each region, and the region where the temperature difference is equal to or larger than a predetermined threshold may be detected as a defective region.
  • the temperature difference between the temperature before vibration and the temperature after vibration is calculated for each surface region, and the region where the temperature difference is equal to or greater than a predetermined threshold value is detected as the defective region. Even when the shaking time is short and the temperature rise of the defective portion is not so large as compared with the other portions, defects such as cracks can be reliably detected. As a result, the defect detection time can be shortened.
  • the holding surface includes a stage for holding an inspection object, the acoustic head is arranged on the holding surface side of the stage away from the stage, and the casing of the acoustic head is annular.
  • the multiple ultrasonic generators are multiple ultrasonic speakers, each axis attached to the casing so that it concentrates on the object to be inspected held on the holding surface of the stage. May be good.
  • the ultrasonic waves generated by the ultrasonic speaker can be effectively concentrated on the inspection target object, and the inspection target object can be effectively ultrasonically vibrated.
  • the acoustic defect detection device of the present invention includes a moving mechanism that moves the acoustic head relative to the stage, and the moving mechanism is an inspection in which a plurality of ultrasonic waves generated from a plurality of ultrasonic generators are concentrated on an inspection object.
  • the acoustic head may be moved relative to scan the area along the surface of the object to be inspected.
  • the acoustic defect detection device of the present invention may include a drive circuit for driving a plurality of ultrasonic generators, and the drive circuit may be capable of adjusting each phase of the ultrasonic waves generated from each ultrasonic generator. Further, the drive circuit may include a plurality of drive units for driving one ultrasonic generator, and the drive unit may be capable of adjusting the phase of the ultrasonic wave generated from the ultrasonic generator.
  • the size of the inspection target and the size of defects such as cracks to be detected can be adjusted to the surface of the ultrasonic inspection target.
  • the degree of concentration can be adjusted.
  • the defect detection method of the present invention is a defect detection method for detecting defects in an inspection object, which includes an acoustic head having a plurality of directional ultrasonic generators and ultrasonically vibrating the inspection object.
  • the preparatory step of preparing an acoustic defect detection device equipped with infrared thermography attached to the acoustic head, and multiple ultrasonic waves generated by multiple ultrasonic generators of the acoustic head are concentrated and inspected on the inspection object.
  • the defect detection method of the present invention is a defect detection method for detecting defects in an inspection object, and is an acoustic head having a plurality of directional ultrasonic generators and ultrasonically vibrating the inspection object. And the preparatory step of preparing an acoustic defect detection device equipped with infrared thermography attached to the acoustic head, and multiple ultrasonic waves generated by multiple ultrasonic generators of the acoustic head are concentrated on the inspection object.
  • the temperature distribution of the surface of the inspection target before ultrasonic vibration is acquired as a pre-vibration temperature distribution image by the ultrasonic vibration step of ultrasonically vibrating the inspection target and the infrared thermography, and the ultrasonic vibration is applied.
  • Pre- and post-vibration image acquisition process to acquire the temperature distribution of the surface of the inspection object during shaking or after ultrasonic vibration as a post-vibration temperature distribution image, and the acquired pre-vibration temperature distribution image and post-vibration temperature distribution image.
  • the defective region detection step of calculating the temperature difference between the temperature before the vibration and the temperature after the vibration for each surface region and detecting the region where the temperature difference is equal to or higher than a predetermined threshold as the defective region. , It is characterized by having.
  • the present invention can detect defects such as cracks in the inspection target with a simple configuration.
  • the acoustic defect detection device 100 of the embodiment includes a stage 10, an acoustic head 20, a moving mechanism 30, a control unit 50, and a detection unit 55.
  • the direction perpendicular to the paper surface of FIG. 1 will be described as the X direction
  • the direction orthogonal to the X direction on the horizontal plane will be described as the Y direction
  • the vertical direction will be described as the Z direction. Note that FIG.
  • each ultrasonic speaker 21 is not distinguished, it is referred to as an ultrasonic speaker 21 and each is referred to as an ultrasonic speaker 21.
  • each ultrasonic speaker 21 is referred to as an ultrasonic speaker 21 and each is referred to as an ultrasonic speaker 21.
  • ultrasonic speakers 211 to 216 When distinguishing the ultrasonic speakers 21, they are referred to as ultrasonic speakers 211 to 216.
  • the stage 10 is attached to a base (not shown).
  • the stage 10 attracts and holds the electronic component 13 which is an inspection target on the upper holding surface 10a.
  • the electronic component 13 may be, for example, a semiconductor chip 11 mounted on the substrate 12.
  • the semiconductor chip 11 contains a defective crack 90.
  • the stage 10 can convey the electronic component 13 in the X direction.
  • the acoustic head 20 is arranged above the holding surface 10a of the stage 10 so as to be separated from the stage 10.
  • the acoustic head 20 is composed of a casing 22 and a plurality of ultrasonic speakers 21 attached to the casing 22.
  • the casing 22 of the acoustic head 20 is connected to a moving mechanism 30 that moves the acoustic head 20 relative to the electronic component 13 that is attracted and held on the holding surface 10a of the stage 10.
  • the moving mechanism 30 includes a guide rail 31 movably attached to a base (not shown) so as to be movable in the X direction, and a slider 33 that moves in the Y direction along the guide rail 31.
  • the guide rail 31 is configured to be movable in the X direction by the X direction moving mechanism 32.
  • the slider 33 is provided with a Y-direction moving mechanism 34 inside, and is configured to be movable in the Y-direction by being guided by a guide rail 31.
  • the casing 22 of the acoustic head 20 is connected to the slider 33 by an arm 36 extending in the Z direction.
  • the slider 33 is internally provided with a Z-direction moving mechanism 35 that drives the arm 36 in the Z direction, and is configured to be able to move the acoustic head 20 in the Z direction. Therefore, the moving mechanism 30 is configured to be relatively movable in the XYZ direction with respect to the electronic component 13 in which the acoustic head 20 is attracted and held on the stage 10.
  • the casing 22 of the acoustic head 20 has a spherical dome shape, and the lower stage side is open.
  • the spherical center 26 constituting the casing 22 is located on the surface 15 of the electronic component 13 held on the holding surface 10a of the stage 10.
  • the ultrasonic speaker 21 is a directivity ultrasonic generator, and generates the ultrasonic wave 24 so that the ultrasonic wave 24 propagates in the range of the directivity angle ⁇ about the axis 21a in the direction of the axis 21a.
  • the plurality of ultrasonic speakers 21 are attached to the casing 22 so that the axes 21a intersect with each other at the spherical center 26 of the casing 22.
  • each ultrasonic wave 24 generated from the plurality of ultrasonic speakers 21 is concentrated on the surface 15 of the electronic component 13 held on the holding surface 10a where the sphere center 26 is located.
  • the area where the ultrasonic waves 24 on the surface 15 of the electronic component 13 are concentrated is the inspection area 40 for detecting the crack 90.
  • a drive unit 23 for driving the ultrasonic speaker 21 is connected to each ultrasonic speaker 21.
  • Each drive unit 23 can adjust the phase of the ultrasonic wave 24 generated by the connected ultrasonic speaker 21.
  • the plurality of drive units 23 form a drive circuit for driving the ultrasonic speaker group composed of the plurality of ultrasonic speakers 21.
  • the X-direction moving mechanism 32, the Y-direction moving mechanism 34, the Z-direction moving mechanism 35, and the drive unit 23 for driving each ultrasonic speaker 21 of the moving mechanism 30 are connected to the control unit 50 and are connected to the control unit 50. Driven by command.
  • the control unit 50 is a computer including a CPU 51, which is a processor that processes information internally, and a storage unit 52 that stores a control program and control data.
  • An infrared thermography 27 is attached to the center of the acoustic head 20.
  • the infrared thermography 27 measures infrared radiation from the surface 15 of the electronic component 13 and outputs the temperature distribution of the surface 15 as a temperature distribution image.
  • the infrared thermography 27 is attached to the casing 22 so that the optical axis 28 is perpendicular to the stage 10 and passes through the center 26 of the sphere. Therefore, the infrared thermography 27 is attached to the casing 22 so as to image the inspection region 40 of the surface 15 of the electronic component 13 from directly above.
  • the infrared thermography 27 is connected to the detection unit 55.
  • the detection unit 55 detects the crack 90 based on the temperature distribution image input from the infrared thermography 27.
  • the detection unit 55 is a computer including a CPU 56 which is a processor that processes information internally, a storage unit 57 that stores a control program and control data, and a display 58 that displays a temperature distribution image input from the infrared thermography 27. be. Further, the detection unit 55 is connected to the control unit 50 to exchange data.
  • the first control unit 50 operates the Z-direction moving mechanism 35 to adjust the Z-direction position of the acoustic head 20 so that the height of the sphere center 26 coincides with the surface 15 of the electronic component 13.
  • the control unit 50 drives each ultrasonic speaker 21 by each drive unit 23 to generate an ultrasonic wave 24 having a predetermined frequency from each ultrasonic speaker 21.
  • Each ultrasonic speaker 21 has directivity and propagates in the direction of each axis 21a within a range of a directivity angle ⁇ centered on the axis 21a. Since each ultrasonic speaker 21 is attached to the casing 22 so that each axis 21a intersects with the spherical center 26 of the casing 22, the ultrasonic wave 24 generated from each ultrasonic speaker 21 is the spherical center 26 of the casing 22. It intersects in the vicinity of and is concentrated and overlapped.
  • the control unit 50 adjusts each phase of each ultrasonic speaker 21 so that the amplitude of the ultrasonic vibration becomes large in the vicinity of the center of the sphere 26 by superimposing the ultrasonic waves 24.
  • the phase of the ultrasonic wave 24 generated by the ultrasonic speakers 211 and 216 located symmetrically with respect to the center 26 of the sphere is shifted by 180 degrees.
  • the phases of the ultrasonic speakers 212 and 215 and the phases of the ultrasonic speakers 213 and 214 which are positioned symmetrically with respect to the center 26 of the sphere, may be shifted by 180 degrees, respectively.
  • the phase of each ultrasonic wave 24 generated by each ultrasonic speaker 211 to 216 may be adjusted to be dispersed. As a result, the amplitude of the ultrasonic vibration in the inspection region 40, which is the range where the ultrasonic waves 24 in the vicinity of the center of the sphere 26 are concentrated, can be increased.
  • the control unit 50 continues ultrasonic vibration of the inspection region 40 for a predetermined time ⁇ t1.
  • the detection unit 55 When the inspection region 40 is ultrasonically vibrated for a predetermined time ⁇ t1, the detection unit 55 causes an infrared thermography 27 attached to the acoustic head 20 to image the infrared radiation of the inspection region 40 to measure the temperature distribution of the inspection region 40. Output as a distribution image. As shown in FIG. 3, the detection unit 55 detects a high temperature portion having a temperature higher than the surroundings in the temperature distribution image input from the infrared thermography 27 as a crack region 91 in which the crack 90 exists inside. The crack region 91 is a defective region in which a defective crack 90 exists.
  • a region having a temperature higher than the ambient temperature is extracted from the temperature distribution image as a high temperature portion, and the high temperature portion and the ambient temperature are the highest.
  • the temperature difference ⁇ T1 (see FIG. 2) with the low temperature portion having a low temperature becomes equal to or higher than a predetermined threshold value, the high temperature portion may be detected as the crack region 91.
  • the inspector looks at the image displayed on the display 58 and detects the high temperature portion as the crack region 91 based on the color of the image. You may do it.
  • the crack region 91 may be detected by the temperature difference between the temperature before ultrasonic vibration and the temperature during or after ultrasonic vibration.
  • the detection unit 55 acquires the temperature distribution of the inspection region 40 of the electronic component 13 before ultrasonic vibration as a pre-vibration temperature distribution image by infrared thermography 27. Then, as shown in FIG. 2, after the control unit 50 drives the ultrasonic speaker 21 to ultrasonically vibrate the inspection region 40 for a predetermined time ⁇ t2, the temperature distribution of the inspection region 40 of the electronic component 13 is vibrated. Obtained as a temperature distribution image. Then, the detection unit 55 detects the temperature before vibration and the temperature after vibration in a predetermined region 45 (see FIG.
  • this detection method can detect the same temperature difference with a shorter ultrasonic vibration time than the method for detecting the high temperature portion of the temperature distribution image described above, so that the crack region 91 can be detected. Detection time can be shortened.
  • the temperature distribution image after the vibration is acquired after the ultrasonic vibration, but the temperature distribution image after the vibration may be acquired during the ultrasonic vibration.
  • the control unit 50 moves the acoustic head 20 in the XY direction by the moving mechanism 30. In this way, the inspection region 40 is scanned along the surface 15 of the electronic component 13 by the moving mechanism 30 to detect the crack region 91 of the entire electronic component 13.
  • the crack region 91 of the electronic component 13 may be detected without scanning.
  • the ultrasonic wave 24 is concentrated on the surface 15 of the electronic component 13 by using the acoustic head 20 to which a plurality of ultrasonic speakers 21 are attached to form the electronic component 13. Indirectly ultrasonically vibrate. Therefore, it is possible to detect the crack region 91 in which the crack 90 exists inside with a simple structure as compared with the case where the ultrasonic vibration is directly incident on the electronic component 13. Further, since the electronic component 13 is indirectly ultrasonically vibrated, the crack region 91 of the electronic component 13 can be detected without contact.
  • each drive unit 23 of the acoustic defect detection device 100 can adjust the phase of the ultrasonic wave 24 generated by the connected ultrasonic speaker 21, and is formed by adjusting each phase.
  • the shape, size, and position of the inspection area 40 can be freely adjusted according to the size of the inspection object.
  • the casing 22 has a spherical dome shape, and each ultrasonic speaker 21 is attached so that each axis 21a intersects at the center 26 of the sphere.
  • the inspection region 40 having a large amplitude of ultrasonic vibration can be stably formed. Therefore, the position of the inspection region 40 does not fluctuate, and the surface 15 of the electronic component 13 can be reliably ultrasonically vibrated.
  • the height of the center 26 of the sphere is set to match the surface 15 of the electronic component 13, but the present invention is not limited to this, and the electronic component 13 is not limited to this and is within the thickness range of the electronic component 13. It may be below the surface 15 of. As a result, the entire electronic component 13 can be ultrasonically vibrated. Further, the center 26 of the sphere may be slightly above the surface 15.
  • each ultrasonic speaker 21 is arranged so that the range of each direction angle ⁇ centered on each axis 21a of each ultrasonic speaker 21 intersects even if each axis 21a does not intersect at the center of the sphere 26. You just have to.
  • the drive unit 23 for driving the ultrasonic speaker 21 has been described as being connected to each ultrasonic speaker 21, the present invention is not limited to this, and some ultrasonic speakers 21 are combined with one drive unit 23. It may be configured to be driven.
  • the moving mechanism 30 has been described as being composed of a guide rail 31 moving in the X direction, a slider 33 moving in the Y direction, and a Z direction moving mechanism 35 attached to the slider 33, but the present invention is limited to this.
  • the acoustic head 20 may be attached to the tip of a robot arm that can freely move in the XYZ direction.
  • the robot arm constitutes the moving mechanism 30.
  • the stage 10 may be configured to move in the XYZ direction, or the electronic component 13 mounted on the stage 10 may be configured to move in the XY direction.
  • the acoustic defect detection device 200 of another embodiment will be described with reference to FIG.
  • the same parts as those of the acoustic defect detection device 100 described above with reference to FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted.
  • a plurality of ultrasonic speakers 21 are attached to an annular casing 62.
  • the casing 62 is a sphere-shaped annular member having an open surface 64 having a small diameter on the upper side and an open surface 65 having a large diameter on the lower side, and a plurality of ultrasonic speakers 21 are attached to the ball band surface 63.
  • the ball center 66 of the ball band surface 63 is located on the surface 15 of the electronic component 13 held on the holding surface 10a of the stage 10.
  • the plurality of ultrasonic speakers 21 are attached to the casing 62 so that the axes 21a intersect at the spherical center 66 of the casing 62. Similar to the acoustic defect detection device 100 described above with reference to FIG.
  • the ultrasonic waves 24 generated from each ultrasonic speaker 21 intersect at the center of the sphere 66 and are concentrated and superposed.
  • an inspection region 40 having a large amplitude of ultrasonic vibration is formed in the vicinity of the center 66 of the sphere.
  • a stay 67 is attached to the open surface 64 on the upper side of the casing 62, and an arm 36 is connected to the stay 67. Similar to the acoustic head 20 of the acoustic defect detection device 100 described above with reference to FIG. 1, the acoustic head 60 is attracted and held on the stage 10 by the moving mechanism 30 in the XYZ direction with respect to the electronic component 13. It is relatively mobile.
  • Infrared thermography 27 is attached to the stay 67.
  • the infrared thermography 27 is attached to the stay 67 so that the optical axis 28 is perpendicular to the stage 10 and passes through the center of the sphere 66.
  • the operation of the acoustic defect detection device 200 is the same as the operation of the acoustic defect detection device 100 described above with reference to FIG.
  • the casing 62 of the acoustic defect detection device 200 is composed of a spherical segment-shaped annular member, the thickness in the Z direction can be reduced, and the casing 62 can be incorporated into a small bonding device or the like.
  • the casing 62 of the acoustic head 60 has been described as a sphere-shaped annular member having an open surface 64 having a small diameter on the upper side and an open surface 65 having a large diameter on the lower side.
  • a lid may be attached to the.
  • the ultrasonic wave 24 generated from the ultrasonic speaker 21 is less likely to be affected by the outside air, so that the position and size of the inspection region 40 can be further stabilized.
  • the ultrasonic speaker 21 may be attached to the lid.
  • the amplitude of the ultrasonic vibration in the inspection region 40 can be made larger, and the surface 15 of the electronic component 13 can be effectively ultrasonically vibrated to efficiently detect the crack region 91, which is a defective region.
  • the acoustic defect detection devices 100 and 200 have been described as detecting the crack 90 inside the electronic component 13 as the crack region 91, but it exists not only on the crack 90 inside but also on the surface 15. It is also possible to detect cracks 90.
  • the electrons connecting the semiconductor chip 11 and the substrate 12 with a wire 16 by using the acoustic defect detection device 100 described above with reference to FIG. 1 A case of detecting a non-attachment region 94 between the semiconductor chip 11 and the wire 16 of the component 13 or a non-attachment region 94 between the substrate 12 and the wire 16 will be described.
  • the non-attached region 94 is a defective region in which the non-attached portions 92 and 93, which will be described later, are defective.
  • the electronic component 13 includes a semiconductor chip 11, a substrate 12, and a metal wire 16 connecting between the pad 11a (see FIG. 6) of the semiconductor chip 11 and the island 12a (see FIG. 7) of the substrate 12. It is composed of.
  • the wire 16 presses a free air ball formed at the tip onto the pad 11a and is bonded onto the pad 11a as a hemispherical crimping ball 17.
  • Such bonding is called ball bonding.
  • a non-bonded portion 92 that is not crimped may be formed between the crimping ball 17 and the pad 11a.
  • the other end of the wire 16 is crimped by pressing the side surface of the wire 16 onto the island 12a.
  • a non-bonded portion 93 that has not been crimped may be formed between the crimped portion 18 and the island 12a.
  • non-delivery detection a method is used in which a current is passed between the wire 16 and the semiconductor chip 11 to detect non-delivery.
  • a current is passed between the wire 16 and the semiconductor chip 11 to detect non-delivery.
  • FIGS. 6 and 7 when a part of the non-delivery is detected, the non-delivery is detected. It was difficult to detect non-delivery by the method of passing an electric current.
  • the pad 11a shown by shading whose temperature is higher than the surroundings is detected as the non-attachment region 94 in which the non-attachment portion 92 exists.
  • the island 12a having a temperature higher than that of the surroundings is detected as the non-attachment region 94 in which the non-attachment portion 93 exists.
  • the specific method for detecting the non-arrival region 94 is the same as the method for detecting the crack region 91 of the electronic component 13 described above.
  • the detection unit 55 detects the acquired pre-vibration temperature.
  • a predetermined region 45 in the inspection region 40 of the distribution image and the temperature distribution image after vibration may be set to a range including one pad 11a.
  • the acoustic defect detecting device 100 detects the non-attached portions 92 and 93 of the wire 16 of the electronic component 13 has been described above.
  • the acoustic defect detecting device 100 is not limited to the electronic component 13, but the turbine blade, the shaft, and the like. It can also be applied to the detection of cracks 90 in metal parts.
  • the operation of the acoustic defect detection devices 100 and 200 described above can be described as follows as a defect detection method.
  • the temperature distribution of the surface 15 of the electronic component 13 before ultrasonic vibration is acquired as a pre-vibration temperature distribution image by infrared thermography 27.
  • the temperature difference between the temperature before vibration and the temperature after vibration is calculated for each region 45 of the surface 15 based on the temperature distribution image after vibration, and the region where the temperature difference is equal to or more than a predetermined threshold is defective.
  • 10 stage 10a holding surface, 11 semiconductor chip, 11a pad, 12 substrate, 12a island, 13 electronic component, 15 surface, 16 wire, 17 crimping ball, 18 crimping part, 20 acoustic head, 21,211-216 ultrasonic waves Speaker, 21a axis, 22 casing, 23 drive unit, 24 ultrasonic wave, 26 sphere center, 27 infrared thermography, 28 optical axis, 30 movement mechanism, 31 guide rail, 32 X direction movement mechanism, 33 slider, 34 Y direction movement mechanism , 35 Z direction movement mechanism, 36 arm, 40 inspection area, 45 area, 50 control unit, 51, 56 CPU, 52, 57 storage unit, 55 detection unit, 58 display, 60 acoustic head, 62 casing, 63 ball band surface , 64, 65 open surface, 66 ball center, 67 stay, 90 crack, 91 crack area, 92, 93 non-attached part, 94 non-attached area, 100, 200 acoustic defect detection device.

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Abstract

The present invention comprises an acoustic head (20) that ultrasonically excites an electronic component (13), an infrared thermograph (27) that outputs the temperature distribution of a surface (15) of the electronic component (13) during ultrasonic excitation as a temperature distribution image, and a detection unit (55) that detects cracks (90) on the basis of the temperature distribution image inputted from the infrared thermograph (27). The acoustic head (20) has a plurality of ultrasonic speakers (21) having directionality, and a casing (22) to which the plurality of ultrasonic speakers (21) are attached such that a plurality of ultrasonic waves (24) generated by the plurality of ultrasonic speakers (21) are concentrated in the electronic component (13). The plurality of ultrasonic waves (24) generated from the plurality of ultrasonic speakers (21) are concentrated in the electronic component (13) to ultrasonically excite the electronic component (13).

Description

音響式不良検出装置及び不良検出方法Acoustic defect detection device and defect detection method
　本発明は、超音波を用いて検査対象物の不良の検出を行う音響式不良検出装置の構造及び超音波を用いて不良の検出を行う不良検出方法に関する。 The present invention relates to a structure of an acoustic defect detection device that detects defects of an inspection object using ultrasonic waves and a defect detection method that detects defects using ultrasonic waves.
　クラック等の不良を内在する検査対象物に超音波振動を入射するとクラック等の不良の存在する部分の温度が他の部分よりも高くなることが知られている。この原理に基づいて、超音波振動子から発生させた超音波振動を検査対象物に入射させ、赤外線サーモグラフィで検査対象物の表面の温度分布画像を取得し、温度の高い部分を不良として検出する非破壊検査装置が用いられている（例えば、特許文献１参照）。 It is known that when ultrasonic vibration is incident on an inspection object that has defects such as cracks, the temperature of the part where the defects such as cracks are present becomes higher than that of other parts. Based on this principle, the ultrasonic vibration generated from the ultrasonic vibrator is incident on the inspection object, the temperature distribution image of the surface of the inspection object is acquired by infrared thermography, and the high temperature part is detected as a defect. A non-destructive inspection device is used (see, for example, Patent Document 1).
特開２０１６－１９１５５２号公報Japanese Unexamined Patent Publication No. 2016-191552
　しかし、特許文献１に記載された従来技術の装置は、超音波振動子を検査対象物に接続し、検査対象物全体を超音波加振するため装置が複雑になってしまうという問題があった。 However, the device of the prior art described in Patent Document 1 has a problem that the device becomes complicated because the ultrasonic vibrator is connected to the inspection object and the entire inspection object is ultrasonically vibrated. ..
　そこで、本発明は、簡便な構成で検査対象物の不良の検出を行うことを目的とする。 Therefore, an object of the present invention is to detect defects in an inspection object with a simple configuration.
　本発明の音響式不良検出装置は、検査対象物の不良を検出する音響式不良検出装置であって、検査対象物を超音波加振する音響ヘッドと、音響ヘッドに取付けられて超音波加振中の検査対象物の表面の温度分布を温度分布画像として出力する赤外線サーモグラフィと、赤外線サーモグラフィから入力された温度分布画像に基づいて不良の検出を行う検出部と、を備え、音響ヘッドは、指向性を有する複数の超音波発生器と、複数の超音波発生器から発生した複数の超音波が検査対象物に集中するように複数の超音波発生器が取付けられるケーシングと、を有し、複数の超音波発生器から発生した複数の超音波を検査対象物に集中させて検査対象物を超音波加振すること、を特徴とする。 The acoustic defect detection device of the present invention is an acoustic defect detection device that detects defects of an inspection object, and is an acoustic head that ultrasonically vibrates the inspection object and an ultrasonic excitation head that is attached to the acoustic head. The acoustic head is oriented with an infrared thermography that outputs the temperature distribution of the surface of the inspection object inside as a temperature distribution image and a detection unit that detects defects based on the temperature distribution image input from the infrared thermography. It has a plurality of ultrasonic generators having a property and a casing in which a plurality of ultrasonic generators are mounted so that a plurality of ultrasonic waves generated from the plurality of ultrasonic generators are concentrated on an object to be inspected. It is characterized in that a plurality of ultrasonic waves generated from the ultrasonic generator of the above are concentrated on the inspection target and the inspection target is ultrasonically vibrated.
　このように、複数の超音波発生器を取付けた音響ヘッドを用いて検査対象物に超音波を集中させて検査対象物を間接的に超音波加振してクラック等の不良の検出を行うので、検査対象物に直接的に超音波振動を入射させる場合に比べて簡便な構造でクラック等の不良の検出を行うことができる。また、検査対象物を間接的に超音波加振するので、非接触で検査対象物の不良の検出を行うことができる。 In this way, using an acoustic head equipped with multiple ultrasonic generators, ultrasonic waves are concentrated on the inspection target and the inspection target is indirectly ultrasonically vibrated to detect defects such as cracks. It is possible to detect defects such as cracks with a simple structure as compared with the case where ultrasonic vibration is directly incident on the object to be inspected. Further, since the inspection object is indirectly ultrasonically vibrated, it is possible to detect the defect of the inspection object in a non-contact manner.
　本発明の音響式不良検出装置において、検出部は、赤外線サーモグラフィから入力された温度分布画像の中で周囲よりも温度が高い高温部を不良領域として検出してもよい。 In the acoustic defect detection device of the present invention, the detection unit may detect a high temperature portion having a temperature higher than the surroundings in the temperature distribution image input from the infrared thermography as a defect region.
　これにより、簡便な構成でクラック等の不良の検出を行うことができる。 This makes it possible to detect defects such as cracks with a simple configuration.
　本発明の音響式不良検出装置において、赤外線サーモグラフィは、超音波加振前の検査対象物の表面の温度分布を加振前温度分布画像として出力すると共に、超音波加振中又は超音波加振後の検査対象物の表面の温度分布を加振後温度分布画像として出力し、検出部は、赤外線サーモグラフィから入力された加振前温度分布画像と加振後温度分布画像とに基づいて、表面の領域毎に加振前の温度と加振後の温度との温度差を算出し、温度差が所定の閾値以上となる領域を不良領域として検出してもよい。 In the acoustic defect detection device of the present invention, the infrared thermography outputs the temperature distribution of the surface of the inspection object before ultrasonic vibration as a temperature distribution image before vibration, and during ultrasonic vibration or ultrasonic vibration. The temperature distribution on the surface of the object to be inspected later is output as a post-vibration temperature distribution image, and the detection unit is based on the pre-vibration temperature distribution image and the post-vibration temperature distribution image input from the infrared thermography. The temperature difference between the temperature before the vibration and the temperature after the vibration may be calculated for each region, and the region where the temperature difference is equal to or larger than a predetermined threshold may be detected as a defective region.
　このように、表面の領域毎に加振前の温度と加振後の温度との温度差を算出し、温度差が所定の閾値以上となる領域を不良存在領域として検出するので、超音波加振時間が短く、不良部分の温度上昇が他の部分に比べてあまり大きくない場合でも、確実にクラック等の不良を検出することができる。これにより、不良検出時間を短縮することができる。 In this way, the temperature difference between the temperature before vibration and the temperature after vibration is calculated for each surface region, and the region where the temperature difference is equal to or greater than a predetermined threshold value is detected as the defective region. Even when the shaking time is short and the temperature rise of the defective portion is not so large as compared with the other portions, defects such as cracks can be reliably detected. As a result, the defect detection time can be shortened.
　本発明の音響式不良検出装置において、保持面に検査対象物を保持するステージを含み、音響ヘッドは、ステージの保持面の側にステージと離間して配置され、音響ヘッドのケーシングは、円環状又はステージの側が開放されたドーム状で、複数の超音波発生器は複数の超音波スピーカーであり、各軸がステージの保持面に保持された検査対象物に集中するようにケーシングに取付けられてもよい。 In the acoustic defect detection device of the present invention, the holding surface includes a stage for holding an inspection object, the acoustic head is arranged on the holding surface side of the stage away from the stage, and the casing of the acoustic head is annular. Or, in a dome shape with the side of the stage open, the multiple ultrasonic generators are multiple ultrasonic speakers, each axis attached to the casing so that it concentrates on the object to be inspected held on the holding surface of the stage. May be good.
　この構成により、効果的に超音波スピーカーが発生した超音波を検査対象物に集中させて検査対象物を効果的に超音波加振することができる。 With this configuration, the ultrasonic waves generated by the ultrasonic speaker can be effectively concentrated on the inspection target object, and the inspection target object can be effectively ultrasonically vibrated.
　本発明の音響式不良検出装置において、音響ヘッドをステージに対して相対移動させる移動機構を含み、移動機構は、複数の超音波発生器から発生した複数の超音波が検査対象物に集中する検査領域を検査対象物の表面に沿ってスキャンする様に音響ヘッドを相対移動させてもよい。 The acoustic defect detection device of the present invention includes a moving mechanism that moves the acoustic head relative to the stage, and the moving mechanism is an inspection in which a plurality of ultrasonic waves generated from a plurality of ultrasonic generators are concentrated on an inspection object. The acoustic head may be moved relative to scan the area along the surface of the object to be inspected.
　これにより、検査対象物が大きい場合で表面全体を一度に超音波加振できない場合でも、音響ヘッドをスキャンさせることにより、検査対象物全体のクラック等の不良の検出を行うことができる。 This makes it possible to detect defects such as cracks in the entire inspection object by scanning the acoustic head even when the entire surface cannot be ultrasonically oscillated at once when the inspection object is large.
　本発明の音響式不良検出装置において、複数の超音波発生器を駆動する駆動回路を備え、駆動回路は、各超音波発生器から発生する超音波の各位相をそれぞれ調整可能としてもよい。また、駆動回路は、１つの超音波発生器を駆動する駆動ユニットを複数含み、駆動ユニットは、超音波発生器から発生する超音波の位相を調整可能してもよい。 The acoustic defect detection device of the present invention may include a drive circuit for driving a plurality of ultrasonic generators, and the drive circuit may be capable of adjusting each phase of the ultrasonic waves generated from each ultrasonic generator. Further, the drive circuit may include a plurality of drive units for driving one ultrasonic generator, and the drive unit may be capable of adjusting the phase of the ultrasonic wave generated from the ultrasonic generator.
　このように、複数の超音波発生器の超音波の各位相を調整することによって、検査対象物の大きさや検出しようとしているクラック等の不良の大きさ等により超音波の検査対象物の表面への集中の度合いを調整することができる。 In this way, by adjusting each phase of the ultrasonic waves of the plurality of ultrasonic generators, the size of the inspection target and the size of defects such as cracks to be detected can be adjusted to the surface of the ultrasonic inspection target. The degree of concentration can be adjusted.
　本発明の不良検出方法は、検査対象物の不良を検出する不良検出方法であって、指向性を有する複数の超音波発生器を有し、検査対象物を超音波加振する音響ヘッドと、音響ヘッドに取付けられた赤外線サーモグラフィと、を備える音響式不良検出装置を準備する準備工程と、音響ヘッドの複数の超音波発生器で発生させた複数の超音波を検査対象物に集中させて検査対象物を超音波加振する超音波加振工程と、赤外線サーモグラフィで超音波加振中の検査対象物の表面の温度分布を温度分布画像として取得する画像取得工程と、取得した温度分布画像の中で周囲よりも温度が高い高温部を不良領域として検出する検出工程と、を備えることを特徴とする。 The defect detection method of the present invention is a defect detection method for detecting defects in an inspection object, which includes an acoustic head having a plurality of directional ultrasonic generators and ultrasonically vibrating the inspection object. The preparatory step of preparing an acoustic defect detection device equipped with infrared thermography attached to the acoustic head, and multiple ultrasonic waves generated by multiple ultrasonic generators of the acoustic head are concentrated and inspected on the inspection object. An ultrasonic vibration step of ultrasonically vibrating an object, an image acquisition step of acquiring the temperature distribution of the surface of the inspection object being ultrasonically vibrated by infrared thermography as a temperature distribution image, and an acquired temperature distribution image. It is characterized by comprising a detection step of detecting a high temperature portion having a higher temperature than the surroundings as a defective region.
　また、本発明の不良検出方法は、検査対象物の不良を検出する不良検出方法であって、指向性を有する複数の超音波発生器を有し、検査対象物を超音波加振する音響ヘッドと、音響ヘッドに取付けられた赤外線サーモグラフィと、を備える音響式不良検出装置を準備する準備工程と、音響ヘッドの複数の超音波発生器で発生させた複数の超音波を検査対象物に集中させて検査対象物を超音波加振する超音波加振工程と、赤外線サーモグラフィで、超音波加振前の検査対象物の表面の温度分布を加振前温度分布画像として取得すると共に、超音波加振中又は超音波加振後の検査対象物の表面の温度分布を加振後温度分布画像として取得する加振前後画像取得工程と、取得した加振前温度分布画像と加振後温度分布画像とに基づいて、表面の領域毎に加振前の温度と加振後の温度との温度差を算出し、温度差が所定の閾値以上となる領域を不良領域として検出する不良領域検出工程と、を備えることを特徴とする。 Further, the defect detection method of the present invention is a defect detection method for detecting defects in an inspection object, and is an acoustic head having a plurality of directional ultrasonic generators and ultrasonically vibrating the inspection object. And the preparatory step of preparing an acoustic defect detection device equipped with infrared thermography attached to the acoustic head, and multiple ultrasonic waves generated by multiple ultrasonic generators of the acoustic head are concentrated on the inspection object. The temperature distribution of the surface of the inspection target before ultrasonic vibration is acquired as a pre-vibration temperature distribution image by the ultrasonic vibration step of ultrasonically vibrating the inspection target and the infrared thermography, and the ultrasonic vibration is applied. Pre- and post-vibration image acquisition process to acquire the temperature distribution of the surface of the inspection object during shaking or after ultrasonic vibration as a post-vibration temperature distribution image, and the acquired pre-vibration temperature distribution image and post-vibration temperature distribution image. Based on the above, the defective region detection step of calculating the temperature difference between the temperature before the vibration and the temperature after the vibration for each surface region and detecting the region where the temperature difference is equal to or higher than a predetermined threshold as the defective region. , It is characterized by having.
　これにより、簡便な方法でクラック等の不良の検出を行うことができる。 This makes it possible to detect defects such as cracks by a simple method.
　本発明は、簡便な構成で検査対象物のクラック等の不良の検出を行うことができる。 The present invention can detect defects such as cracks in the inspection target with a simple configuration.
実施形態の音響式不良検出装置の構成を示す立面図である。It is an elevation view which shows the structure of the acoustic type defect detection apparatus of embodiment. 実施形態の音響式不良検出装置で電子部品を超音波加振した場合の時間に対する電子部品の表面温度の変化を示すグラフである。It is a graph which shows the change of the surface temperature of an electronic component with respect to time when the electronic component is ultrasonically vibrated by the acoustic type defect detection apparatus of embodiment. 実施形態の音響式不良検出装置でクラック領域を検出した際のディスプレイの表示を示す図である。It is a figure which shows the display of the display when the crack region is detected by the acoustic type defect detection apparatus of embodiment. 他の実施形態の音響式不良検出装置の構成を示す立面図である。It is an elevation view which shows the structure of the acoustic type defect detection apparatus of another embodiment. 半導体チップとサブストレートとをワイヤで接続した電子部品を超音波加振した状態を示す立面図である。It is an elevation view which shows the state which the electronic component which connected the semiconductor chip and a substrate by a wire are ultrasonically vibrated. パッドと圧着ボールとの間の不着部を示す立面図である。It is an elevation view which shows the non-adhesive part between a pad and a crimp ball. アイランドとワイヤとの間の不着部を示す立面図である。It is an elevation view which shows the non-attachment part between an island and a wire. 実施形態の音響式不良検出装置でパッドと圧着ボールの不着領域を検出した際のディスプレイの表示を示す図である。It is a figure which shows the display of the display when the non-adhesion area of a pad and a crimp ball is detected by the acoustic type defect detection apparatus of embodiment.
　以下、図面を参照しながら実施形態の音響式不良検出装置１００について説明する。図１に示す様に、音響式不良検出装置１００は、ステージ１０と、音響ヘッド２０と、移動機構３０と、制御部５０と、検出部５５とを備えている。図１の紙面に対して垂直方向をＸ方向、水平面でＸ方向と直交する方向をＹ方向、上下方向をＺ方向として説明する。なお、図１には、音響ヘッド２０のケーシング２２に取付けられている６つの超音波スピーカー２１を図示しているが、各超音波スピーカー２１を区別しない場合は、超音波スピーカー２１といい、各超音波スピーカー２１を区別する場合には、超音波スピーカー２１１～２１６という。 Hereinafter, the acoustic defect detection device 100 of the embodiment will be described with reference to the drawings. As shown in FIG. 1, the acoustic defect detection device 100 includes a stage 10, an acoustic head 20, a moving mechanism 30, a control unit 50, and a detection unit 55. The direction perpendicular to the paper surface of FIG. 1 will be described as the X direction, the direction orthogonal to the X direction on the horizontal plane will be described as the Y direction, and the vertical direction will be described as the Z direction. Note that FIG. 1 shows six ultrasonic speakers 21 attached to the casing 22 of the acoustic head 20, but when each ultrasonic speaker 21 is not distinguished, it is referred to as an ultrasonic speaker 21 and each is referred to as an ultrasonic speaker 21. When distinguishing the ultrasonic speakers 21, they are referred to as ultrasonic speakers 211 to 216.
　ステージ１０は、図示しないベースに取付けられている。ステージ１０は、上側の保持面１０ａに検査対象物である電子部品１３を吸着保持する。電子部品１３は、例えば、サブストレート１２の上に取付けられた半導体チップ１１であってもよい。半導体チップ１１は、不良であるクラック９０が内在している。ステージ１０は、電子部品１３をＸ方向に搬送可能である。 The stage 10 is attached to a base (not shown). The stage 10 attracts and holds the electronic component 13 which is an inspection target on the upper holding surface 10a. The electronic component 13 may be, for example, a semiconductor chip 11 mounted on the substrate 12. The semiconductor chip 11 contains a defective crack 90. The stage 10 can convey the electronic component 13 in the X direction.
　ステージ１０の保持面１０ａの側の上方には、ステージ１０と離間して音響ヘッド２０が配置されている。音響ヘッド２０は、ケーシング２２と、ケーシング２２に取付けられた複数の超音波スピーカー２１とで構成されている。音響ヘッド２０のケーシング２２は、音響ヘッド２０をステージ１０の保持面１０ａの上に吸着保持された電子部品１３に対して相対的に移動させる移動機構３０に接続されている。 The acoustic head 20 is arranged above the holding surface 10a of the stage 10 so as to be separated from the stage 10. The acoustic head 20 is composed of a casing 22 and a plurality of ultrasonic speakers 21 attached to the casing 22. The casing 22 of the acoustic head 20 is connected to a moving mechanism 30 that moves the acoustic head 20 relative to the electronic component 13 that is attracted and held on the holding surface 10a of the stage 10.
　移動機構３０は、図示しないベースにＸ方向に移動可能に取付けられたガイドレール３１と、ガイドレール３１に沿ってＹ方向に移動するスライダ３３とで構成されている。ガイドレール３１は、Ｘ方向移動機構３２によってＸ方向に移動可能に構成されている。スライダ３３は、内部にＹ方向移動機構３４を備えておりガイドレール３１にガイドされてＹ方向に移動可能に構成されている。音響ヘッド２０のケーシング２２はＺ方向に延びるアーム３６でスライダ３３に接続されている。スライダ３３は、内部にアーム３６をＺ方向に駆動するＺ方向移動機構３５を備えており、音響ヘッド２０をＺ方向に移動可能に構成されている。従って、移動機構３０は、音響ヘッド２０をステージ１０の上に吸着保持された電子部品１３に対してＸＹＺ方向に相対的に移動可能に構成されている。 The moving mechanism 30 includes a guide rail 31 movably attached to a base (not shown) so as to be movable in the X direction, and a slider 33 that moves in the Y direction along the guide rail 31. The guide rail 31 is configured to be movable in the X direction by the X direction moving mechanism 32. The slider 33 is provided with a Y-direction moving mechanism 34 inside, and is configured to be movable in the Y-direction by being guided by a guide rail 31. The casing 22 of the acoustic head 20 is connected to the slider 33 by an arm 36 extending in the Z direction. The slider 33 is internally provided with a Z-direction moving mechanism 35 that drives the arm 36 in the Z direction, and is configured to be able to move the acoustic head 20 in the Z direction. Therefore, the moving mechanism 30 is configured to be relatively movable in the XYZ direction with respect to the electronic component 13 in which the acoustic head 20 is attracted and held on the stage 10.
　音響ヘッド２０のケーシング２２は、球形のドーム状で下方のステージ側が開放されている。ケーシング２２を構成する球面の球中心２６は、ステージ１０の保持面１０ａの上に保持される電子部品１３の表面１５の上に位置している。超音波スピーカー２１は、指向性を有する超音波発生器であり、軸２１ａの方向で軸２１ａを中心とした指向角度θの範囲に超音波２４が伝播するように超音波２４を発生させる。複数の超音波スピーカー２１は、各軸２１ａがケーシング２２の球面の球中心２６で交差するようにケーシング２２に取付けられている。このため、複数の超音波スピーカー２１から発生された各超音波２４は、球中心２６の位置する保持面１０ａの上に保持された電子部品１３の表面１５に集中する。電子部品１３の表面１５の超音波２４が集中する範囲がクラック９０の検出を行う検査領域４０である。 The casing 22 of the acoustic head 20 has a spherical dome shape, and the lower stage side is open. The spherical center 26 constituting the casing 22 is located on the surface 15 of the electronic component 13 held on the holding surface 10a of the stage 10. The ultrasonic speaker 21 is a directivity ultrasonic generator, and generates the ultrasonic wave 24 so that the ultrasonic wave 24 propagates in the range of the directivity angle θ about the axis 21a in the direction of the axis 21a. The plurality of ultrasonic speakers 21 are attached to the casing 22 so that the axes 21a intersect with each other at the spherical center 26 of the casing 22. Therefore, each ultrasonic wave 24 generated from the plurality of ultrasonic speakers 21 is concentrated on the surface 15 of the electronic component 13 held on the holding surface 10a where the sphere center 26 is located. The area where the ultrasonic waves 24 on the surface 15 of the electronic component 13 are concentrated is the inspection area 40 for detecting the crack 90.
　各超音波スピーカー２１には、それぞれ超音波スピーカー２１を駆動する駆動ユニット２３が接続されている。各駆動ユニット２３は、接続されている超音波スピーカー２１が発生する超音波２４の位相を調整可能となっている。また、複数の駆動ユニット２３は、複数の超音波スピーカー２１で構成される超音波スピーカー群を駆動する駆動回路を構成する。 A drive unit 23 for driving the ultrasonic speaker 21 is connected to each ultrasonic speaker 21. Each drive unit 23 can adjust the phase of the ultrasonic wave 24 generated by the connected ultrasonic speaker 21. Further, the plurality of drive units 23 form a drive circuit for driving the ultrasonic speaker group composed of the plurality of ultrasonic speakers 21.
　移動機構３０のＸ方向移動機構３２と、Ｙ方向移動機構３４と、Ｚ方向移動機構３５と、各超音波スピーカー２１を駆動する駆動ユニット２３とは、制御部５０に接続されて制御部５０の指令によって駆動する。制御部５０は、内部に情報処理を行うプロセッサであるＣＰＵ５１と制御プログラムや制御用データを格納する記憶部５２とを備えるコンピュータである。 The X-direction moving mechanism 32, the Y-direction moving mechanism 34, the Z-direction moving mechanism 35, and the drive unit 23 for driving each ultrasonic speaker 21 of the moving mechanism 30 are connected to the control unit 50 and are connected to the control unit 50. Driven by command. The control unit 50 is a computer including a CPU 51, which is a processor that processes information internally, and a storage unit 52 that stores a control program and control data.
　音響ヘッド２０の中心には、赤外線サーモグラフィ２７が取付けられている。赤外線サーモグラフィ２７は、電子部品１３の表面１５からの赤外線放射を測定して表面１５の温度分布を温度分布画像として出力する。赤外線サーモグラフィ２７は、光軸２８がステージ１０に対して垂直で球中心２６を通るようにケーシング２２に取付けられている。従って、赤外線サーモグラフィ２７は、電子部品１３の表面１５の検査領域４０を真上から撮像するようにケーシング２２に取付けられている。 An infrared thermography 27 is attached to the center of the acoustic head 20. The infrared thermography 27 measures infrared radiation from the surface 15 of the electronic component 13 and outputs the temperature distribution of the surface 15 as a temperature distribution image. The infrared thermography 27 is attached to the casing 22 so that the optical axis 28 is perpendicular to the stage 10 and passes through the center 26 of the sphere. Therefore, the infrared thermography 27 is attached to the casing 22 so as to image the inspection region 40 of the surface 15 of the electronic component 13 from directly above.
　赤外線サーモグラフィ２７は検出部５５に接続されている。検出部５５は、赤外線サーモグラフィ２７から入力された温度分布画像に基づいてクラック９０の検出を行う。検出部５５は、内部に情報処理を行うプロセッサであるＣＰＵ５６と制御プログラムや制御用データを格納する記憶部５７と、赤外線サーモグラフィ２７から入力された温度分布画像を表示するディスプレイ５８とを備えるコンピュータである。また、検出部５５は、制御部５０と接続されてデータの授受を行う。 The infrared thermography 27 is connected to the detection unit 55. The detection unit 55 detects the crack 90 based on the temperature distribution image input from the infrared thermography 27. The detection unit 55 is a computer including a CPU 56 which is a processor that processes information internally, a storage unit 57 that stores a control program and control data, and a display 58 that displays a temperature distribution image input from the infrared thermography 27. be. Further, the detection unit 55 is connected to the control unit 50 to exchange data.
　以上のように構成された音響式不良検出装置１００の動作について説明する。最初の制御部５０は、Ｚ方向移動機構３５を動作させて球中心２６の高さが電子部品１３の表面１５に一致するように音響ヘッド２０のＺ方向位置を調整する。 The operation of the acoustic defect detection device 100 configured as described above will be described. The first control unit 50 operates the Z-direction moving mechanism 35 to adjust the Z-direction position of the acoustic head 20 so that the height of the sphere center 26 coincides with the surface 15 of the electronic component 13.
　次に、制御部５０は、各駆動ユニット２３によって各超音波スピーカー２１を駆動して各超音波スピーカー２１から所定の周波数の超音波２４を発生させる。各超音波スピーカー２１は、指向性が有り、各軸２１ａの方向で軸２１ａを中心とした指向角度θの範囲に伝播していく。各超音波スピーカー２１は、各軸２１ａがケーシング２２の球中心２６で交差するようにケーシング２２に取付けられているので、各超音波スピーカー２１から発生した超音波２４は、ケーシング２２の球中心２６の近傍で交差、集中して重ね合わされる。 Next, the control unit 50 drives each ultrasonic speaker 21 by each drive unit 23 to generate an ultrasonic wave 24 having a predetermined frequency from each ultrasonic speaker 21. Each ultrasonic speaker 21 has directivity and propagates in the direction of each axis 21a within a range of a directivity angle θ centered on the axis 21a. Since each ultrasonic speaker 21 is attached to the casing 22 so that each axis 21a intersects with the spherical center 26 of the casing 22, the ultrasonic wave 24 generated from each ultrasonic speaker 21 is the spherical center 26 of the casing 22. It intersects in the vicinity of and is concentrated and overlapped.
　制御部５０は、この超音波２４の重ね合わせにより、球中心２６の近傍に超音波振動の振幅が大きくなるように、各超音波スピーカー２１の各位相を調整する。一例を示すと、球中心２６に対して対称の位置にある超音波スピーカー２１１，２１６の発生する超音波２４の位相を１８０度ずらす様にする。同様に、球中心２６に対して対称の位置にある超音波スピーカー２１２，２１５の位相、超音波スピーカー２１３，２１４の位相をそれぞれ１８０度ずらすようにしてもよい。また、他の例としては、各超音波スピーカー２１１～２１６が発生する各超音波２４の位相を分散するように調整してもよい。これにより、球中心２６の近傍の超音波２４が集中する範囲である検査領域４０の超音波振動の振幅を大きくすることができる。 The control unit 50 adjusts each phase of each ultrasonic speaker 21 so that the amplitude of the ultrasonic vibration becomes large in the vicinity of the center of the sphere 26 by superimposing the ultrasonic waves 24. As an example, the phase of the ultrasonic wave 24 generated by the ultrasonic speakers 211 and 216 located symmetrically with respect to the center 26 of the sphere is shifted by 180 degrees. Similarly, the phases of the ultrasonic speakers 212 and 215 and the phases of the ultrasonic speakers 213 and 214, which are positioned symmetrically with respect to the center 26 of the sphere, may be shifted by 180 degrees, respectively. Further, as another example, the phase of each ultrasonic wave 24 generated by each ultrasonic speaker 211 to 216 may be adjusted to be dispersed. As a result, the amplitude of the ultrasonic vibration in the inspection region 40, which is the range where the ultrasonic waves 24 in the vicinity of the center of the sphere 26 are concentrated, can be increased.
　超音波スピーカー２１の発生する超音波振動が検査領域４０に集中すると、検査領域４０の温度は、図２に示す様に上昇してくる。この際、電子部品１３の内部に不良であるクラック９０が存在する部分の表面１５の温度は、図２の実線ａに示す様に、図２の破線ｂに示す内部にクラック９０の無い部分よりも高くなってくる。制御部５０は、所定時間Δｔ１の間、検査領域４０の超音波加振を続ける。 When the ultrasonic vibration generated by the ultrasonic speaker 21 is concentrated in the inspection area 40, the temperature of the inspection area 40 rises as shown in FIG. At this time, the temperature of the surface 15 of the portion where the defective crack 90 exists inside the electronic component 13 is higher than the portion without the crack 90 inside as shown by the broken line b in FIG. 2, as shown by the solid line a in FIG. Is getting higher. The control unit 50 continues ultrasonic vibration of the inspection region 40 for a predetermined time Δt1.
　検出部５５は、所定時間Δｔ１だけ検査領域４０が超音波加振されたら、音響ヘッド２０に取付けられた赤外線サーモグラフィ２７に、検査領域４０の赤外線放射を撮像させて検査領域４０の温度分布を温度分布画像として出力させる。検出部５５は、図３に示す様に、赤外線サーモグラフィ２７から入力された温度分布画像の中で周囲よりも温度が高い高温部を内部にクラック９０が存在するクラック領域９１として検出する。クラック領域９１は、内部に不良であるクラック９０が存在する不良領域である。 When the inspection region 40 is ultrasonically vibrated for a predetermined time Δt1, the detection unit 55 causes an infrared thermography 27 attached to the acoustic head 20 to image the infrared radiation of the inspection region 40 to measure the temperature distribution of the inspection region 40. Output as a distribution image. As shown in FIG. 3, the detection unit 55 detects a high temperature portion having a temperature higher than the surroundings in the temperature distribution image input from the infrared thermography 27 as a crack region 91 in which the crack 90 exists inside. The crack region 91 is a defective region in which a defective crack 90 exists.
　クラック領域９１の検出は、いろいろな方法を用いてよいが、例えば、温度分布画像の中から周囲の温度よりも温度が高くなっている領域を高温部として抽出し、高温部と周囲の最も温度が低い低温部との温度差ΔＴ１（図２参照）が所定の閾値以上となった場合に高温部をクラック領域９１として検出するようにしてもよい。 Various methods may be used to detect the crack region 91. For example, a region having a temperature higher than the ambient temperature is extracted from the temperature distribution image as a high temperature portion, and the high temperature portion and the ambient temperature are the highest. When the temperature difference ΔT1 (see FIG. 2) with the low temperature portion having a low temperature becomes equal to or higher than a predetermined threshold value, the high temperature portion may be detected as the crack region 91.
　また、赤外線サーモグラフィ２７の温度分布画像は、温度によって色分けされているので、検査員がディスプレイ５８に表示された画像を見て画像の色に基づいて温度の高い部分をクラック領域９１として検出するようにしてもよい。 Further, since the temperature distribution image of the infrared thermography 27 is color-coded according to the temperature, the inspector looks at the image displayed on the display 58 and detects the high temperature portion as the crack region 91 based on the color of the image. You may do it.
　また、他の方法として、超音波加振前の温度と超音波加振中又は超音波加振後の温度との温度差によってクラック領域９１を検出するようにしてもよい。検出部５５は、超音波加振前に、赤外線サーモグラフィ２７で、超音波加振前の電子部品１３の検査領域４０の温度分布を加振前温度分布画像として取得する。そして、図２に示す様に、制御部５０が超音波スピーカー２１を駆動して所定の時間Δｔ２だけ検査領域４０を超音波加振した後に電子部品１３の検査領域４０の温度分布を加振後温度分布画像として取得する。そして、検出部５５は、取得した加振前温度分布画像と加振後温度分布画像の検査領域４０の中の所定の領域４５（図３参照）の加振前の温度と加振後の温度との温度差ΔＴ２（図２参照）を算出する。そして、温度差ΔＴ２が所定の閾値以上となる領域をクラック領域９１として検出してもよい。 Alternatively, as another method, the crack region 91 may be detected by the temperature difference between the temperature before ultrasonic vibration and the temperature during or after ultrasonic vibration. Before ultrasonic vibration, the detection unit 55 acquires the temperature distribution of the inspection region 40 of the electronic component 13 before ultrasonic vibration as a pre-vibration temperature distribution image by infrared thermography 27. Then, as shown in FIG. 2, after the control unit 50 drives the ultrasonic speaker 21 to ultrasonically vibrate the inspection region 40 for a predetermined time Δt2, the temperature distribution of the inspection region 40 of the electronic component 13 is vibrated. Obtained as a temperature distribution image. Then, the detection unit 55 detects the temperature before vibration and the temperature after vibration in a predetermined region 45 (see FIG. 3) in the inspection region 40 of the acquired pre-vibration temperature distribution image and post-vibration temperature distribution image. The temperature difference ΔT2 with and from (see FIG. 2) is calculated. Then, a region where the temperature difference ΔT2 is equal to or greater than a predetermined threshold value may be detected as the crack region 91.
　この検出方法は、図２に示す様に、先に説明した温度分布画像の高温部を検出する方法よりも短い超音波加振時間で同様の温度差を検出することができるので、クラック領域９１の検出時間を短くすることができる。 As shown in FIG. 2, this detection method can detect the same temperature difference with a shorter ultrasonic vibration time than the method for detecting the high temperature portion of the temperature distribution image described above, so that the crack region 91 can be detected. Detection time can be shortened.
　なお、上記の説明では、超音波加振後に加振後温度分布画像を取得することとして説明したが、超音波加振中に加振後温度分布画像を取得するようにしてもよい。 In the above description, the temperature distribution image after the vibration is acquired after the ultrasonic vibration, but the temperature distribution image after the vibration may be acquired during the ultrasonic vibration.
　制御部５０は、一つの検査領域４０におけるクラック検出動作が終了したら、移動機構３０によって音響ヘッド２０をＸＹ方向に移動させる。このように、移動機構３０によって検査領域４０を電子部品１３の表面１５に沿ってスキャンさせて電子部品１３全体のクラック領域９１の検出を行う。 When the crack detection operation in one inspection area 40 is completed, the control unit 50 moves the acoustic head 20 in the XY direction by the moving mechanism 30. In this way, the inspection region 40 is scanned along the surface 15 of the electronic component 13 by the moving mechanism 30 to detect the crack region 91 of the entire electronic component 13.
　なお、検査対象物である電子部品１３が検査領域４０よりも小さい場合には、スキャンせずに電子部品１３のクラック領域９１の検出を行うようにしてもよい。 If the electronic component 13 to be inspected is smaller than the inspection area 40, the crack region 91 of the electronic component 13 may be detected without scanning.
　以上説明したように、実施形態の音響式不良検出装置１００は、複数の超音波スピーカー２１を取付けた音響ヘッド２０を用いて電子部品１３の表面１５に超音波２４を集中させて電子部品１３を間接的に超音波加振する。このため、電子部品１３に直接的に超音波振動を入射させる場合に比べて簡便な構造で内部にクラック９０が存在するクラック領域９１の検出を行うことができる。また、電子部品１３を間接的に超音波加振するので、非接触で電子部品１３のクラック領域９１の検出を行うことができる。 As described above, in the acoustic defect detection device 100 of the embodiment, the ultrasonic wave 24 is concentrated on the surface 15 of the electronic component 13 by using the acoustic head 20 to which a plurality of ultrasonic speakers 21 are attached to form the electronic component 13. Indirectly ultrasonically vibrate. Therefore, it is possible to detect the crack region 91 in which the crack 90 exists inside with a simple structure as compared with the case where the ultrasonic vibration is directly incident on the electronic component 13. Further, since the electronic component 13 is indirectly ultrasonically vibrated, the crack region 91 of the electronic component 13 can be detected without contact.
　また、音響式不良検出装置１００の各駆動ユニット２３は、接続されている超音波スピーカー２１が発生する超音波２４の位相を調整可能となっており、各位相を調整することによって、形成される検査領域４０の形状、大きさ、位置を検査対象物の大きさに合わせて自由に調整できる。 Further, each drive unit 23 of the acoustic defect detection device 100 can adjust the phase of the ultrasonic wave 24 generated by the connected ultrasonic speaker 21, and is formed by adjusting each phase. The shape, size, and position of the inspection area 40 can be freely adjusted according to the size of the inspection object.
　また、音響式不良検出装置１００では、ケーシング２２は球形のドーム状で、各超音波スピーカー２１は、各軸２１ａが球中心２６で交差するように取り付けられている。このように、各超音波２４を一点で重ね合わせることにより、超音波振動の振幅が大きい検査領域４０を安定して形成できる。このため、検査領域４０の位置がふらつかず、確実に電子部品１３の表面１５を超音波加振することができる。 Further, in the acoustic defect detection device 100, the casing 22 has a spherical dome shape, and each ultrasonic speaker 21 is attached so that each axis 21a intersects at the center 26 of the sphere. By superimposing the ultrasonic waves 24 at one point in this way, the inspection region 40 having a large amplitude of ultrasonic vibration can be stably formed. Therefore, the position of the inspection region 40 does not fluctuate, and the surface 15 of the electronic component 13 can be reliably ultrasonically vibrated.
　なお、以上の説明では、球中心２６の高さを、電子部品１３の表面１５に一致させることとして説明したが、これに限らず、電子部品１３の厚さの範囲であれば、電子部品１３の表面１５よりも下側でもよい。これにより、電子部品１３全体を超音波加振することができる。また、球中心２６が表面１５より僅かに上側であってもよい。 In the above description, the height of the center 26 of the sphere is set to match the surface 15 of the electronic component 13, but the present invention is not limited to this, and the electronic component 13 is not limited to this and is within the thickness range of the electronic component 13. It may be below the surface 15 of. As a result, the entire electronic component 13 can be ultrasonically vibrated. Further, the center 26 of the sphere may be slightly above the surface 15.
　また、ケーシング２２の形状はこのような球形に限らない。例えば、ケーシング２２は楕円球形のドーム形状であってもよい。また、各超音波スピーカー２１は、各軸２１ａが球中心２６で交差してなくても、各超音波スピーカー２１の各軸２１ａを中心とした各指向角度θの範囲が交差するように配置されていればよい。 Further, the shape of the casing 22 is not limited to such a spherical shape. For example, the casing 22 may have an elliptical spherical dome shape. Further, each ultrasonic speaker 21 is arranged so that the range of each direction angle θ centered on each axis 21a of each ultrasonic speaker 21 intersects even if each axis 21a does not intersect at the center of the sphere 26. You just have to.
　また、超音波スピーカー２１を駆動する駆動ユニット２３は、各超音波スピーカー２１にそれぞれ接続されていることとして説明したが、これに限らず、いくつかの超音波スピーカー２１を一つの駆動ユニット２３で駆動するように構成してもよい。 Further, although the drive unit 23 for driving the ultrasonic speaker 21 has been described as being connected to each ultrasonic speaker 21, the present invention is not limited to this, and some ultrasonic speakers 21 are combined with one drive unit 23. It may be configured to be driven.
　また、移動機構３０は、Ｘ方向に移動するガイドレール３１とＹ方向に移動するスライダ３３と、スライダ３３に取付けられたＺ方向移動機構３５とで構成されることとして説明したが、これに限らない。例えば、ＸＹＺ方向に自在に移動可能なロボットアームの先端に音響ヘッド２０を取付けてもよい。この場合、ロボットアームが移動機構３０を構成する。また、ステージ１０をＸＹＺ方向に移動させるように構成してもよいし、ステージ１０上に載置されている電子部品１３をＸＹ方向に移動させるように構成してもよい。 Further, the moving mechanism 30 has been described as being composed of a guide rail 31 moving in the X direction, a slider 33 moving in the Y direction, and a Z direction moving mechanism 35 attached to the slider 33, but the present invention is limited to this. No. For example, the acoustic head 20 may be attached to the tip of a robot arm that can freely move in the XYZ direction. In this case, the robot arm constitutes the moving mechanism 30. Further, the stage 10 may be configured to move in the XYZ direction, or the electronic component 13 mounted on the stage 10 may be configured to move in the XY direction.
　次に図４を参照しながら他の実施形態の音響式不良検出装置２００について説明する。先に図１を参照して説明した音響式不良検出装置１００と同様の部分には、同様の符号を付して説明は省略する。図４に示すように、音響式不良検出装置２００の音響ヘッド６０は、円環状のケーシング６２に複数の超音波スピーカー２１が取付けられている。 Next, the acoustic defect detection device 200 of another embodiment will be described with reference to FIG. The same parts as those of the acoustic defect detection device 100 described above with reference to FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted. As shown in FIG. 4, in the acoustic head 60 of the acoustic defect detection device 200, a plurality of ultrasonic speakers 21 are attached to an annular casing 62.
　図４に示すように、ケーシング６２は、上側が小径の開放面６４で下側が大径の開放面６５の球台型の環状部材であり、球帯面６３に複数の超音波スピーカー２１が取付けられている。球帯面６３の球中心６６は、ステージ１０の保持面１０ａの上に保持される電子部品１３の表面１５の上に位置している。複数の超音波スピーカー２１は、各軸２１ａがケーシング６２の球面の球中心６６で交差するようにケーシング６２に取付けられている。先に図１を参照して説明した音響式不良検出装置１００と同様、各超音波スピーカー２１から発生した超音波２４は、球中心６６で交差し、集中して重ね合わされる。この超音波２４の重ね合わせにより、球中心６６の近傍には超音波振動の振幅が大きい検査領域４０が形成される。 As shown in FIG. 4, the casing 62 is a sphere-shaped annular member having an open surface 64 having a small diameter on the upper side and an open surface 65 having a large diameter on the lower side, and a plurality of ultrasonic speakers 21 are attached to the ball band surface 63. ing. The ball center 66 of the ball band surface 63 is located on the surface 15 of the electronic component 13 held on the holding surface 10a of the stage 10. The plurality of ultrasonic speakers 21 are attached to the casing 62 so that the axes 21a intersect at the spherical center 66 of the casing 62. Similar to the acoustic defect detection device 100 described above with reference to FIG. 1, the ultrasonic waves 24 generated from each ultrasonic speaker 21 intersect at the center of the sphere 66 and are concentrated and superposed. By superimposing the ultrasonic waves 24, an inspection region 40 having a large amplitude of ultrasonic vibration is formed in the vicinity of the center 66 of the sphere.
　ケーシング６２の上側の開放面６４には、ステー６７が取付けられており、ステー６７には、アーム３６が接続されている。音響ヘッド６０は、先に図１を参照して説明した音響式不良検出装置１００の音響ヘッド２０と同様、移動機構３０によりステージ１０の上に吸着保持された電子部品１３に対してＸＹＺ方向に相対的に移動可能となっている。 A stay 67 is attached to the open surface 64 on the upper side of the casing 62, and an arm 36 is connected to the stay 67. Similar to the acoustic head 20 of the acoustic defect detection device 100 described above with reference to FIG. 1, the acoustic head 60 is attracted and held on the stage 10 by the moving mechanism 30 in the XYZ direction with respect to the electronic component 13. It is relatively mobile.
　また、ステー６７には、赤外線サーモグラフィ２７が取付けられている。赤外線サーモグラフィ２７は、光軸２８がステージ１０に対して垂直で球中心６６を通るようにステー６７に取付けられている。 Infrared thermography 27 is attached to the stay 67. The infrared thermography 27 is attached to the stay 67 so that the optical axis 28 is perpendicular to the stage 10 and passes through the center of the sphere 66.
　音響式不良検出装置２００の動作は、先に図１を参照して説明した音響式不良検出装置１００の動作と同様である。 The operation of the acoustic defect detection device 200 is the same as the operation of the acoustic defect detection device 100 described above with reference to FIG.
　音響式不良検出装置２００は、ケーシング６２が球台型の環状部材で構成されているので、Ｚ方向の厚さを薄くすることができ、小型のボンディング装置等に組み込むことが可能となる。 Since the casing 62 of the acoustic defect detection device 200 is composed of a spherical segment-shaped annular member, the thickness in the Z direction can be reduced, and the casing 62 can be incorporated into a small bonding device or the like.
　以上の説明では、音響ヘッド６０のケーシング６２は、上側が小径の開放面６４で下側が大径の開放面６５の球台型の環状部材として説明したが、これに限らず、上側の開放面６４に蓋を取付けるようにしてもよい。この場合、超音波スピーカー２１から発生する超音波２４が外気の影響を受けにくくなるので、検査領域４０の位置、大きさをより安定させることができる。また、蓋に超音波スピーカー２１を取付けてもよい。これにより、検査領域４０の超音波振動の振幅をより大きくして電子部品１３の表面１５を効果的に超音波加振して効率的に不良領域であるクラック領域９１を検出することができる。 In the above description, the casing 62 of the acoustic head 60 has been described as a sphere-shaped annular member having an open surface 64 having a small diameter on the upper side and an open surface 65 having a large diameter on the lower side. A lid may be attached to the. In this case, the ultrasonic wave 24 generated from the ultrasonic speaker 21 is less likely to be affected by the outside air, so that the position and size of the inspection region 40 can be further stabilized. Further, the ultrasonic speaker 21 may be attached to the lid. As a result, the amplitude of the ultrasonic vibration in the inspection region 40 can be made larger, and the surface 15 of the electronic component 13 can be effectively ultrasonically vibrated to efficiently detect the crack region 91, which is a defective region.
　なお、以上の説明では、音響式不良検出装置１００，２００は、電子部品１３の内部のクラック９０をクラック領域９１として検出することとして説明したが、内部のクラック９０のみでなく、表面１５に存在するクラック９０の検出も行うことができる。 In the above description, the acoustic defect detection devices 100 and 200 have been described as detecting the crack 90 inside the electronic component 13 as the crack region 91, but it exists not only on the crack 90 inside but also on the surface 15. It is also possible to detect cracks 90.
　次に図５から図８を参照しながら、先に図１を参照して説明した音響式不良検出装置１００を用いて半導体チップ１１とサブストレート１２との間をワイヤ１６で接続している電子部品１３の半導体チップ１１とワイヤ１６との不着領域９４、或いは、サブストレート１２とワイヤ１６との不着領域９４を検出する場合について説明する。不着領域９４は、後で説明する不良である不着部９２，９３が存在する不良領域である。 Next, with reference to FIGS. 5 to 8, the electrons connecting the semiconductor chip 11 and the substrate 12 with a wire 16 by using the acoustic defect detection device 100 described above with reference to FIG. 1 A case of detecting a non-attachment region 94 between the semiconductor chip 11 and the wire 16 of the component 13 or a non-attachment region 94 between the substrate 12 and the wire 16 will be described. The non-attached region 94 is a defective region in which the non-attached portions 92 and 93, which will be described later, are defective.
　電子部品１３は、半導体チップ１１と、サブストレート１２と、半導体チップ１１のパッド１１ａ（図６参照）とサブストレート１２のアイランド１２ａ（図７参照）との間を接続する金属製のワイヤ１６とで構成されている。 The electronic component 13 includes a semiconductor chip 11, a substrate 12, and a metal wire 16 connecting between the pad 11a (see FIG. 6) of the semiconductor chip 11 and the island 12a (see FIG. 7) of the substrate 12. It is composed of.
　図６に示す様に、ワイヤ１６は先端に形成したフリーエアボールをパッド１１ａの上に押圧して半球状の圧着ボール１７としてパッド１１ａの上にボンディングされている。このようなボンディングをボールボンディングという。ボールボンディング場合、圧着ボール１７とパッド１１ａとの間に圧着していない不着部９２ができる場合がある。また、図７に示す様に、ワイヤ１６の他端は、ワイヤ１６の側面をアイランド１２ａの上に押し付けて圧着される。この場合も、圧着部１８とアイランド１２ａとの間に圧着していない不着部９３ができる場合がある。これらの不着部９２，９３は、ワイヤ１６の接続部の不良であり、電子部品１３が動作しなかったり、動作不良となったりする場合がある。このため、不良である不着部９２，９３を検出する技術が求められている。 As shown in FIG. 6, the wire 16 presses a free air ball formed at the tip onto the pad 11a and is bonded onto the pad 11a as a hemispherical crimping ball 17. Such bonding is called ball bonding. In the case of ball bonding, a non-bonded portion 92 that is not crimped may be formed between the crimping ball 17 and the pad 11a. Further, as shown in FIG. 7, the other end of the wire 16 is crimped by pressing the side surface of the wire 16 onto the island 12a. In this case as well, a non-bonded portion 93 that has not been crimped may be formed between the crimped portion 18 and the island 12a. These non-attached portions 92 and 93 are defective in the connection portion of the wire 16, and the electronic component 13 may not operate or may malfunction. Therefore, there is a demand for a technique for detecting defective non-attached portions 92 and 93.
　不着検出としてはワイヤ１６と半導体チップ１１との間に電流を流して不着検出を行う方法が用いられているが、図６、図７に示す様に一部分が不着となっている場合には、電流を流す方法では不着検出が難しかった。 As non-delivery detection, a method is used in which a current is passed between the wire 16 and the semiconductor chip 11 to detect non-delivery. However, as shown in FIGS. 6 and 7, when a part of the non-delivery is detected, the non-delivery is detected. It was difficult to detect non-delivery by the method of passing an electric current.
　図６、図７に示す様な不着部９２，９３が存在する場合、図５に示す様に音響ヘッド２０によって電子部品１３を超音波加振すると、不着部９２，９３を含むパッド１１ａ、或いはアイランド１２ａは、不着部９２，９３が存在しないパッド１１ａ、アイランド１２ａよりも温度が大きく上昇する。 When the non-attached portions 92 and 93 as shown in FIGS. 6 and 7 are present, when the electronic component 13 is ultrasonically vibrated by the acoustic head 20 as shown in FIG. 5, the pad 11a including the non-attached portions 92 and 93 or the pad 11a or The temperature of the island 12a rises significantly more than that of the pad 11a and the island 12a in which the non-attached portions 92 and 93 do not exist.
　このため、図８に示す様に、赤外線サーモグラフィ２７から入力された温度分布画像の中で周囲よりも温度が高い網掛けで示すパッド１１ａを不着部９２が存在する不着領域９４として検出する。同様に、周囲よりも温度が高いアイランド１２ａを不着部９３が存在する不着領域９４として検出する。不着領域９４の検出の具体的な方法は、先に説明した電子部品１３のクラック領域９１の検出方法と同様である。 Therefore, as shown in FIG. 8, in the temperature distribution image input from the infrared thermography 27, the pad 11a shown by shading whose temperature is higher than the surroundings is detected as the non-attachment region 94 in which the non-attachment portion 92 exists. Similarly, the island 12a having a temperature higher than that of the surroundings is detected as the non-attachment region 94 in which the non-attachment portion 93 exists. The specific method for detecting the non-arrival region 94 is the same as the method for detecting the crack region 91 of the electronic component 13 described above.
　なお、超音波加振前の温度と超音波加振中又は超音波加振後の温度との温度差によって不着領域９４の検出を行う場合には、検出部５５は、取得した加振前温度分布画像と加振後温度分布画像の検査領域４０の中の所定の領域４５を図８に示す様に、一つのパッド１１ａを含む範囲に設定してもよい。 When the non-adhesive region 94 is detected by the temperature difference between the temperature before ultrasonic vibration and the temperature during or after ultrasonic vibration, the detection unit 55 detects the acquired pre-vibration temperature. As shown in FIG. 8, a predetermined region 45 in the inspection region 40 of the distribution image and the temperature distribution image after vibration may be set to a range including one pad 11a.
　以上、音響式不良検出装置１００で電子部品１３のワイヤ１６の不着部９２，９３を検出する場合について説明したが、音響式不良検出装置１００は電子部品１３に限らず、タービン翼やシャフト等の金属部品のクラック９０の検出にも適用することができる。 The case where the acoustic defect detecting device 100 detects the non-attached portions 92 and 93 of the wire 16 of the electronic component 13 has been described above. However, the acoustic defect detecting device 100 is not limited to the electronic component 13, but the turbine blade, the shaft, and the like. It can also be applied to the detection of cracks 90 in metal parts.
　尚、以上説明した、音響式不良検出装置１００，２００の動作は、不良検出方法として以下のように記載することができる。 The operation of the acoustic defect detection devices 100 and 200 described above can be described as follows as a defect detection method.
　超音波スピーカー２１を有し、電子部品１３を超音波加振する音響ヘッド２０と、音響ヘッド２０に取付けられた赤外線サーモグラフィ２７と、を備える音響式不良検出装置１００，２００を準備する準備工程と、音響ヘッド２０の複数の超音波スピーカー２１で発生させた複数の超音波２４を電子部品１３に集中させて電子部品１３を超音波加振する超音波加振工程と、赤外線サーモグラフィ２７で超音波加振中の電子部品１３の表面１５の温度分布を温度分布画像として取得する画像取得工程と、取得した温度分布画像の中で周囲よりも温度が高い高温部を不良領域として検出する検出工程と、を備える不良検出方法。 A preparatory step for preparing acoustic defect detection devices 100 and 200 having an ultrasonic speaker 21 and an acoustic head 20 that ultrasonically vibrates an electronic component 13 and an infrared thermography 27 attached to the acoustic head 20. , The ultrasonic vibration step of concentrating the plurality of ultrasonic waves 24 generated by the plurality of ultrasonic speakers 21 of the acoustic head 20 on the electronic component 13 and ultrasonically vibrating the electronic component 13, and the ultrasonic wave by the infrared thermography 27. An image acquisition step of acquiring the temperature distribution of the surface 15 of the surface 15 of the electronic component 13 being vibrated as a temperature distribution image, and a detection step of detecting a high temperature portion having a higher temperature than the surroundings in the acquired temperature distribution image as a defective region. , A defect detection method.
　また、他の不良検出方法は、上記の画像取得工程と検出工程に代えて、赤外線サーモグラフィ２７で、超音波加振前の電子部品１３の表面１５の温度分布を加振前温度分布画像として取得すると共に、超音波加振中又は超音波加振後の電子部品１３の表面１５の温度分布を加振後温度分布画像として取得する加振前後画像取得工程と、取得した加振前温度分布画像と加振後温度分布画像とに基づいて、表面１５の領域４５毎に加振前の温度と加振後の温度との温度差を算出し、温度差が所定の閾値以上となる領域を不良領域として検出する不良領域検出工程を含む。 Further, as another defect detection method, instead of the above image acquisition step and detection step, the temperature distribution of the surface 15 of the electronic component 13 before ultrasonic vibration is acquired as a pre-vibration temperature distribution image by infrared thermography 27. In addition, the pre-vibration image acquisition step of acquiring the temperature distribution of the surface 15 of the electronic component 13 during or after ultrasonic vibration as a post-vibration temperature distribution image, and the acquired pre-vibration temperature distribution image. The temperature difference between the temperature before vibration and the temperature after vibration is calculated for each region 45 of the surface 15 based on the temperature distribution image after vibration, and the region where the temperature difference is equal to or more than a predetermined threshold is defective. Includes a defective area detection step to detect as an area.
　１０　ステージ、１０ａ　保持面、１１　半導体チップ、１１ａ　パッド、１２　サブストレート、１２ａ　アイランド、１３　電子部品、１５　表面、１６　ワイヤ、１７　圧着ボール、１８　圧着部、２０　音響ヘッド、２１，２１１～２１６　超音波スピーカー、２１ａ　軸、２２　ケーシング、２３　駆動ユニット、２４　超音波、２６　球中心、２７　赤外線サーモグラフィ、２８　光軸、３０　移動機構、３１　ガイドレール、３２　Ｘ方向移動機構、３３　スライダ、３４　Ｙ方向移動機構、３５　Ｚ方向移動機構、３６　アーム、４０　検査領域、４５　領域、５０　制御部、５１，５６　ＣＰＵ、５２，５７　記憶部、５５　検出部、５８　ディスプレイ、６０　音響ヘッド、６２　ケーシング、６３　球帯面、６４，６５　開放面、６６　球中心、６７　ステー、９０　クラック、９１　クラック領域、９２，９３　不着部、９４　不着領域、１００，２００　音響式不良検出装置。 10 stage, 10a holding surface, 11 semiconductor chip, 11a pad, 12 substrate, 12a island, 13 electronic component, 15 surface, 16 wire, 17 crimping ball, 18 crimping part, 20 acoustic head, 21,211-216 ultrasonic waves Speaker, 21a axis, 22 casing, 23 drive unit, 24 ultrasonic wave, 26 sphere center, 27 infrared thermography, 28 optical axis, 30 movement mechanism, 31 guide rail, 32 X direction movement mechanism, 33 slider, 34 Y direction movement mechanism , 35 Z direction movement mechanism, 36 arm, 40 inspection area, 45 area, 50 control unit, 51, 56 CPU, 52, 57 storage unit, 55 detection unit, 58 display, 60 acoustic head, 62 casing, 63 ball band surface , 64, 65 open surface, 66 ball center, 67 stay, 90 crack, 91 crack area, 92, 93 non-attached part, 94 non-attached area, 100, 200 acoustic defect detection device.

Claims (12)

  1. 　検査対象物の不良を検出する音響式不良検出装置であって、
    　前記検査対象物を超音波加振する音響ヘッドと、
    　前記音響ヘッドに取付けられて超音波加振中の前記検査対象物の表面の温度分布を温度分布画像として出力する赤外線サーモグラフィと、
    　前記赤外線サーモグラフィから入力された前記温度分布画像に基づいて不良の検出を行う検出部と、を備え、
    　前記音響ヘッドは、指向性を有する複数の超音波発生器と、複数の前記超音波発生器から発生した複数の超音波が前記検査対象物に集中するように複数の前記超音波発生器が取付けられるケーシングと、を有し、複数の前記超音波発生器から発生した複数の超音波を前記検査対象物に集中させて前記検査対象物を超音波加振すること、
    　を特徴とする音響式不良検出装置。     It is an acoustic defect detection device that detects defects in the inspection object.
    An acoustic head that ultrasonically vibrates the inspection object,
    Infrared thermography attached to the acoustic head and outputting the temperature distribution on the surface of the inspection object during ultrasonic vibration as a temperature distribution image, and
    A detection unit that detects defects based on the temperature distribution image input from the infrared thermography is provided.
    The acoustic head is equipped with a plurality of directional ultrasonic generators and the plurality of ultrasonic generators so that the plurality of ultrasonic waves generated from the plurality of ultrasonic generators are concentrated on the inspection object. A plurality of ultrasonic waves generated from the plurality of the ultrasonic generators are concentrated on the inspection object, and the inspection object is ultrasonically vibrated.
    An acoustic defect detection device characterized by.
  2. 　請求項１に記載の音響式不良検出装置であって、
    　前記検出部は、前記赤外線サーモグラフィから入力された前記温度分布画像の中で周囲よりも温度が高い高温部を不良領域として検出すること、
    　を特徴とする音響式不良検出装置。     The acoustic defect detection device according to claim 1.
    The detection unit detects a high temperature portion having a higher temperature than the surroundings in the temperature distribution image input from the infrared thermography as a defective region.
    An acoustic defect detection device characterized by.
  3. 　請求項１に記載の音響式不良検出装置であって、
    　前記赤外線サーモグラフィは、
    　超音波加振前の前記検査対象物の前記表面の温度分布を加振前温度分布画像として出力すると共に、超音波加振中又は超音波加振後の前記検査対象物の前記表面の温度分布を加振後温度分布画像として出力し、
    　前記検出部は、前記赤外線サーモグラフィから入力された前記加振前温度分布画像と前記加振後温度分布画像とに基づいて、前記表面の領域毎に加振前の温度と加振後の温度との温度差を算出し、前記温度差が所定の閾値以上となる領域を不良領域として検出すること、
    　を特徴とする音響式不良検出装置。     The acoustic defect detection device according to claim 1.
    The infrared thermography is
    The temperature distribution of the surface of the inspection object before ultrasonic vibration is output as a temperature distribution image before vibration, and the temperature distribution of the surface of the inspection object during ultrasonic vibration or after ultrasonic vibration is performed. Is output as a temperature distribution image after vibration,
    The detection unit determines the temperature before vibration and the temperature after vibration for each region of the surface based on the temperature distribution image before vibration and the temperature distribution image after vibration input from the infrared thermography. The temperature difference is calculated, and the region where the temperature difference is equal to or greater than a predetermined threshold is detected as a defective region.
    An acoustic defect detection device characterized by.
  4. 　請求項１から３のいずれか１項に記載の音響式不良検出装置であって、
    　保持面に前記検査対象物を保持するステージを含み、
    　前記音響ヘッドは、前記ステージの前記保持面の側に前記ステージと離間して配置され、
    　前記音響ヘッドの前記ケーシングは、円環状又は前記ステージの側が開放されたドーム状で、
    　複数の前記超音波発生器は複数の超音波スピーカーであり、各軸が前記ステージの前記保持面に保持された前記検査対象物に集中するように前記ケーシングに取付けられていること、
    　を特徴とする音響式不良検出装置。     The acoustic defect detection device according to any one of claims 1 to 3.
    The holding surface includes a stage for holding the inspection object.
    The acoustic head is arranged on the side of the holding surface of the stage so as to be separated from the stage.
    The casing of the acoustic head is annular or dome-shaped with the side of the stage open.
    The plurality of the ultrasonic generators are a plurality of ultrasonic speakers, and each axis is attached to the casing so as to concentrate on the inspection object held on the holding surface of the stage.
    An acoustic defect detection device characterized by.
  5. 　請求項４に記載の音響式不良検出装置であって、
    　前記音響ヘッドを前記ステージに対して相対移動させる移動機構を含み、
    　前記移動機構は、複数の前記超音波発生器から発生した複数の超音波が前記検査対象物に集中する検査領域を前記検査対象物の表面に沿ってスキャンする様に前記音響ヘッドを相対移動させること、
    　を特徴とする音響式不良検出装置。     The acoustic defect detection device according to claim 4.
    A moving mechanism for moving the acoustic head relative to the stage is included.
    The moving mechanism relatively moves the acoustic head so that a plurality of ultrasonic waves generated from the plurality of ultrasonic generators scan an inspection area where the inspection object is concentrated along the surface of the inspection object. matter,
    An acoustic defect detection device characterized by.
  6. 　請求項１から３のいずれか１項に記載の音響式不良検出装置であって、
    　複数の前記超音波発生器を駆動する駆動回路を備え、
    　前記駆動回路は、各超音波発生器から発生する前記超音波の各位相をそれぞれ調整可能であること、
    　を特徴とする音響式不良検出装置。     The acoustic defect detection device according to any one of claims 1 to 3.
    A drive circuit for driving the plurality of the ultrasonic generators is provided.
    The drive circuit is capable of adjusting each phase of the ultrasonic wave generated from each ultrasonic wave generator.
    An acoustic defect detection device characterized by.
  7. 　請求項４に記載の音響式不良検出装置であって、
    　複数の前記超音波発生器を駆動する駆動回路を備え、
    　前記駆動回路は、各超音波発生器から発生する前記超音波の各位相をそれぞれ調整可能であること、
    　を特徴とする音響式不良検出装置。     The acoustic defect detection device according to claim 4.
    A drive circuit for driving the plurality of the ultrasonic generators is provided.
    The drive circuit is capable of adjusting each phase of the ultrasonic wave generated from each ultrasonic wave generator.
    An acoustic defect detection device characterized by.
  8. 　請求項５に記載の音響式不良検出装置であって、
    　複数の前記超音波発生器を駆動する駆動回路を備え、
    　前記駆動回路は、各超音波発生器から発生する前記超音波の各位相をそれぞれ調整可能であること、
    　を特徴とする音響式不良検出装置。     The acoustic defect detection device according to claim 5.
    A drive circuit for driving the plurality of the ultrasonic generators is provided.
    The drive circuit is capable of adjusting each phase of the ultrasonic wave generated from each ultrasonic wave generator.
    An acoustic defect detection device characterized by.
  9. 　請求項６に記載の音響式不良検出装置であって、
    　前記駆動回路は、１つの前記超音波発生器を駆動する駆動ユニットを複数含み、
    　前記駆動ユニットは、前記超音波発生器から発生する前記超音波の位相を調整可能であること、
    　を特徴とする音響式不良検出装置。     The acoustic defect detection device according to claim 6.
    The drive circuit includes a plurality of drive units for driving one ultrasonic generator.
    The drive unit is capable of adjusting the phase of the ultrasonic wave generated from the ultrasonic wave generator.
    An acoustic defect detection device characterized by.
  10. 　請求項７または８に記載の音響式不良検出装置であって、
    　前記駆動回路は、１つの前記超音波発生器を駆動する駆動ユニットを複数含み、
    　前記駆動ユニットは、前記超音波発生器から発生する前記超音波の位相を調整可能であること、
    　を特徴とする音響式不良検出装置。     The acoustic defect detection device according to claim 7 or 8.
    The drive circuit includes a plurality of drive units for driving one ultrasonic generator.
    The drive unit is capable of adjusting the phase of the ultrasonic wave generated from the ultrasonic wave generator.
    An acoustic defect detection device characterized by.
  11. 　検査対象物の不良を検出する不良検出方法であって、
    　指向性を有する複数の超音波発生器を有し、前記検査対象物を超音波加振する音響ヘッドと、
    　前記音響ヘッドに取付けられた赤外線サーモグラフィと、を備える音響式不良検出装置を準備する準備工程と、
    　前記音響ヘッドの複数の前記超音波発生器で発生させた複数の超音波を前記検査対象物に集中させて前記検査対象物を超音波加振する超音波加振工程と、
    　前記赤外線サーモグラフィで超音波加振中の前記検査対象物の表面の温度分布を温度分布画像として取得する画像取得工程と、
    　取得した前記温度分布画像の中で周囲よりも温度が高い高温部を不良領域として検出する検出工程と、
    　を備えることを特徴とする不良検出方法。     It is a defect detection method that detects defects in the inspection object.
    An acoustic head having a plurality of directional ultrasonic generators and ultrasonically vibrating the inspection object,
    A preparatory step for preparing an acoustic defect detection device including infrared thermography attached to the acoustic head, and
    An ultrasonic vibration step of concentrating a plurality of ultrasonic waves generated by the plurality of ultrasonic generators of the acoustic head on the inspection object and ultrasonically vibrating the inspection object.
    An image acquisition step of acquiring the temperature distribution of the surface of the inspection object during ultrasonic vibration by the infrared thermography as a temperature distribution image, and
    A detection step of detecting a high temperature portion having a higher temperature than the surroundings as a defective region in the acquired temperature distribution image, and
    A defect detection method characterized by comprising.
  12. 　検査対象物の不良を検出する不良検出方法であって、
    　指向性を有する複数の超音波発生器を有し、前記検査対象物を超音波加振する音響ヘッドと、
    　前記音響ヘッドに取付けられた赤外線サーモグラフィと、を備える音響式不良検出装置を準備する準備工程と、
    　前記音響ヘッドの複数の前記超音波発生器で発生させた複数の超音波を前記検査対象物に集中させて前記検査対象物を超音波加振する超音波加振工程と、
    　前記赤外線サーモグラフィで、超音波加振前の前記検査対象物の表面の温度分布を加振前温度分布画像として取得すると共に、超音波加振中又は超音波加振後の前記検査対象物の前記表面の温度分布を加振後温度分布画像として取得する加振前後画像取得工程と、
    　取得した前記加振前温度分布画像と前記加振後温度分布画像とに基づいて、前記表面の領域毎に加振前の温度と加振後の温度との温度差を算出し、前記温度差が所定の閾値以上となる領域を不良領域として検出する不良領域検出工程と、
    　を備えることを特徴とする不良検出方法。     It is a defect detection method that detects defects in the inspection object.
    An acoustic head having a plurality of directional ultrasonic generators and ultrasonically vibrating the inspection object,
    A preparatory step for preparing an acoustic defect detection device including infrared thermography attached to the acoustic head, and
    An ultrasonic vibration step of concentrating a plurality of ultrasonic waves generated by the plurality of ultrasonic generators of the acoustic head on the inspection object and ultrasonically vibrating the inspection object.
    In the infrared thermography, the temperature distribution on the surface of the inspection target before ultrasonic vibration is acquired as a temperature distribution image before vibration, and the inspection target during or after ultrasonic vibration is described. The image acquisition process before and after the vibration to acquire the surface temperature distribution as the temperature distribution image after the vibration, and
    Based on the acquired temperature distribution image before vibration and the temperature distribution image after vibration, the temperature difference between the temperature before vibration and the temperature after vibration is calculated for each region of the surface, and the temperature difference is obtained. A defective area detection step of detecting an area where is equal to or higher than a predetermined threshold value as a defective area,
    A defect detection method characterized by comprising.
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