JP2012112686A - Inspection method for semiconductor device and semiconductor inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To conduct inspection of a semiconductor device with electric connection ensured.SOLUTION: An inspection method for a semiconductor device comprises a step of setting a semiconductor device on a socket of a test head of a tester with a handler (setting step, S20); a step of vibrating the semiconductor device in a horizontal direction at a frequency of 1000 Hz or less (vibrating step, S60); and a step of electrically connecting the semiconductor device to a test board of the tester by pushing the semiconductor device against a probe of the tester (testing step, S80).

Description

  The present invention relates to a semiconductor device inspection method and a semiconductor inspection device.

  In recent years, with the miniaturization and high density of semiconductor devices, the number of external terminals has increased. For this reason, in the inspection process of a semiconductor device, it has become difficult to make electrical contact between the external terminal and a fine probe of the inspection apparatus. When a probe contact failure occurs, even if the semiconductor device is a non-defective product, it may be mistaken for an open defective product.

  Patent Document 1 (Japanese Patent Application Laid-Open No. 2005-129444) discloses a semiconductor device having an ultrasonic vibration device in which the tip of a probe is cylindrical and has an angle of 90 degrees or less and ultrasonic vibration of 60 kHz or more is applied to the probe. Inspection socket is listed. According to Patent Document 1, it is said that the electrical contact between the solder ball and the probe can be suppressed by causing the probe to vibrate ultrasonically and destroying the oxide film formed on the surface of the solder ball.

JP 2005-129444 A

  Possible causes of probe contact failure include not only the case where the oxide film of the solder ball described above is generated, but also a case where foreign matter is generated on the probe or a case where the probe is in contact at an angle. In the method of ultrasonically vibrating the probe as in Patent Document 1, the frequency of vibration is too high when foreign matter is generated on the probe or when the probe is in contact with the probe at an angle. The contact state cannot be corrected.

According to the present invention,
A setting step of placing the semiconductor device on the socket of the tester by the handler;
A vibration step of vibrating the semiconductor device in a horizontal direction at a frequency of 1000 Hz or less;
After the vibration step, a test step of electrically connecting the semiconductor device to a test board in the tester by pressing the semiconductor device against a probe of the tester;
A method for inspecting a semiconductor device is provided.

According to the present invention,
A socket for mounting a semiconductor device;
An elevating mechanism that moves the semiconductor device up and down while holding the semiconductor device, and a handler that includes a vibrating unit that vibrates the semiconductor device in a horizontal direction at a frequency of 1000 Hz or less in a state where the semiconductor device is placed in the socket;
A semiconductor inspection apparatus is provided.

  According to the present invention, the foreign matter sandwiched between the probe and the solder ball is removed by vibrating the semiconductor device in the horizontal direction at a frequency of 1000 Hz or less. To correct the position. As described above, electrical connection can be reliably performed and the semiconductor device can be inspected.

  According to the present invention, electrical connection can be reliably performed and a semiconductor device can be inspected.

It is sectional drawing which shows the structure of the semiconductor inspection apparatus in 1st embodiment. It is sectional drawing to which the A section shown in FIG. 1 was expanded. It is a flowchart for demonstrating the inspection method of the semiconductor device in 1st embodiment. It is a figure for demonstrating the effect of 1st embodiment. It is a flowchart for demonstrating the inspection method of the semiconductor device in 2nd embodiment. It is a flowchart for demonstrating the inspection method of the semiconductor device in 3rd embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

(First embodiment)
FIG. 1 is a cross-sectional view showing the configuration of the semiconductor inspection apparatus according to the first embodiment. This semiconductor inspection apparatus includes a tester 100 and a handler 300, for example. The tester 100 includes a tester main body 120 and a test head 200.

  As shown in FIG. 1, the tester 100 inspects an electrical test for a modularized semiconductor device (described later, 10) in the manufacturing process of the semiconductor device. By this inspection, the semiconductor device (10) is selected as a non-defective product.

  The tester main body 120 is connected to the test head 200 and the handler 300 by wiring 140, and transmits and receives inspection signals and control signals.

  The handler 300 automatically transports the semiconductor device (10) to the test head 200 by operating according to the control signal transmitted from the tester main body 120. The handler 300 is provided with a pusher portion (described later, 320) for mounting the semiconductor device (10) on a socket (described later, 260) of the test head 200. Details of the pusher section (320) will be described later.

  The test head 200 inputs the inspection signal transmitted from the tester main body 120 to the semiconductor device 10. Then, the test head 200 receives the inspection result signal from the semiconductor device 10 and transmits it to the tester main body 120.

  Further, the handler 300 sorts and transports the semiconductor device (10) into a non-defective product or a defective product according to the control signal transmitted from the tester main body 120 based on the above-described inspection result.

  FIG. 2 is an enlarged cross-sectional view of a portion A shown in FIG. The semiconductor inspection apparatus in the present embodiment has the following configuration. The test head 200 of the semiconductor inspection apparatus is provided with a socket 260 on which the semiconductor device 10 is placed. The handler 300 of the semiconductor inspection apparatus is provided with an elevating mechanism 326 that moves the semiconductor device 10 up and down while holding the semiconductor device 10 on the pusher base 322. In addition, the handler 300 includes a vibration unit 324 that vibrates the semiconductor device 10 in the horizontal direction at a frequency of 1000 Hz or less in a state where the semiconductor device 10 is placed on the socket 260. Details will be described below.

  As shown in FIG. 2, the semiconductor device 10 is, for example, a BGA (Ball Grid Array) type semiconductor package.

  As shown in FIG. 2, the test head 200 of the semiconductor inspection apparatus includes a test board 220, a probe 240, and a socket 260. The test board 220 is electrically connected to the probe 240, and includes a wiring (not shown) for transmitting and receiving an inspection signal to and from the tester main body 120.

  The probe 240 is generally called a pogo pin. The probe 240 is provided with a spring (not shown) and a contact pin (not shown). Note that the shape of the tip of the contact pin is formed so as to easily come into contact with the shape of the external terminal of the semiconductor device 10. For example, the tip of the contact pin is formed to have a V-shaped cross section so that it can easily come into contact with the solder ball 12 of the semiconductor device 10.

  Further, the test head 200 of the semiconductor inspection apparatus is provided with a socket 260 on which the semiconductor device 10 is placed. The inner frame of the socket 260 has a size obtained by adding a certain margin to the outer dimensions of the semiconductor device 10. The margin here has a margin greater than the amplitude in the conveyance accuracy of the handler 300 and the vibration process (described later).

  On the other hand, the handler 300 of the semiconductor inspection apparatus is provided with a pusher unit 320. The pusher unit 320 includes a pusher base 322, a vibration unit 324, and an elevating mechanism 326. Here, the pusher base 322 is provided with a suction mechanism (not shown) for holding the semiconductor device 10.

  The pusher unit 320 moves the semiconductor device 10 up and down by the lifting mechanism 326 while adsorbing and holding the semiconductor device 10 to the pusher base 322. The lifting mechanism 326 is, for example, a cylinder that can be moved by compressed air.

  The pusher unit 320 vibrates the semiconductor device 10 by the vibrating unit 324 while holding the semiconductor device 10 on the pusher base 322. At this time, in a state where the semiconductor device 10 is placed on the socket 260, the semiconductor device 10 is vibrated at a frequency of 1000 Hz or less in the horizontal direction. Details of the step (vibration step) of vibrating the semiconductor device 10 will be described later.

  Here, the vibration unit 324 is, for example, a vibration motor. A pusher base 322 is fixed to a vibration part (not shown) of the vibration motor.

  At this time, the amplitude by the vibration motor is determined by the distance between the rotating shaft and the position where the pusher base 322 is attached. In order to vibrate the semiconductor device 10 in the horizontal direction, the pusher base 322 is attached so that the vibration direction of the pusher base 322 and the suction surface on which the semiconductor device 10 is held are parallel.

  Next, an inspection method for the semiconductor device 10 according to the first embodiment will be described with reference to FIG. FIG. 3 is a flowchart for explaining the inspection method of the semiconductor device 10 according to the first embodiment. The inspection method for the semiconductor device 10 according to the first embodiment includes the following steps. First, the semiconductor device 10 is placed on the socket 260 of the test head 200 in the tester 100 by the handler 300 (setting step, S20). Next, the semiconductor device 10 is vibrated in the horizontal direction at a frequency of 1000 Hz or less (vibration process, S60). Next, the semiconductor device 10 is pressed against the probe 240 of the tester 100 to be electrically connected to the test board 220 in the tester 100 (test process, S80). Details will be described below.

  The semiconductor device 10 is prepared in a state of being placed in a tray (not shown) in the handler 300.

  First, the handler 300 operates a suction mechanism (not shown) according to a control signal transmitted from the tester main body 120 to suck the semiconductor device 10 in the tray (not shown) on the pusher base 322. Next, the handler 300 moves the pusher unit 320 to take out the semiconductor device 10 from the tray (not shown) and convey it to the position just above the socket 260 (S10).

  Next, the handler 300 places the semiconductor device 10 on the socket 260 of the test head 200 by lowering the pusher unit 320 holding the semiconductor device 10 (S20). Hereinafter, this process is referred to as a setting process (S20).

  Next, with the semiconductor device 10 placed on the socket 260, the pusher unit 320 is vibrated at a frequency of 1000 Hz or less in the horizontal direction (S60). At this time, the vibration part 324 provided in the pusher part 320 vibrates only the pusher base part 322 holding the semiconductor device 10. Hereinafter, this process is referred to as a vibration process (S60).

  Here, the foreign matter (described later, 50) sandwiched between the probe 240 and the solder ball 12 is removed by the vibration in the horizontal direction, and the probe 240 in contact with the slant is in an appropriate position with respect to the solder ball 12. To be corrected.

  At this time, in the vibration step (S60), the vibration time is determined in consideration of the specification of the vibration unit 324, the vibration frequency, or the like. This vibration time is, for example, 0.5 seconds or less. In order to shorten the inspection time or to reduce the influence of vibration on the semiconductor device 10, the vibration time may be set to 0.2 seconds or less, for example.

  Furthermore, in this vibration step (S60), the amplitude for vibrating the semiconductor device 10 is, for example, ½ or less of the outer dimensional tolerance of the semiconductor device 10. In this way, by setting the amplitude within the above range, foreign matter (50), which will be described later, and optimization of the position of the probe 240 are performed without causing the semiconductor device 10 to fail. Specifically, the amplitude for vibrating the semiconductor device 10 is, for example, 0.05 mm or less.

  Next, after the vibration step (S60), the semiconductor device 10 is pressed against the probe 240 of the tester 100 to be electrically connected to the test board 220 in the tester 100. At this time, for example, 35 g weight is loaded per probe 240. Thereby, the semiconductor device 10 is inspected (S80). Hereinafter, this process is referred to as a test process (S80).

  Inspection is performed through the above steps, and the semiconductor device 10 is selected as a non-defective product.

  The effect of 1st embodiment is demonstrated using FIG. FIG. 4 shows the state of the semiconductor device 10 and the probe 240 after the setting step (S20).

  As shown in FIG. 4A, after the setting step (S20), when the foreign object 50 is sandwiched between the probe 240 and the solder ball 12, or when the probe 240 comes into contact with the solder ball 12 at an appropriate position. It may not happen. In such a case, in the subsequent test process (S80), even a non-defective semiconductor device 10 may be mistaken for an open defect.

  On the other hand, as shown in FIG. 4B, in the present embodiment, the semiconductor device 10 is vibrated at a frequency of 1000 Hz or less in the horizontal direction, so that the foreign matter 50 on the probe 240 is removed from between the probe 240 and the solder ball 12. The probe 240 that has been removed and contacted obliquely is corrected to an appropriate position with respect to the solder ball 12. As described above, electrical connection can be reliably performed and the semiconductor device 10 can be inspected.

(Second embodiment)
FIG. 5 is a flowchart for explaining an inspection method for the semiconductor device 10 according to the second embodiment. The second embodiment is the same as the first embodiment except for the following points.

  In the second embodiment, the setting process (S20) and the test process (S80) are performed on all of the plurality of semiconductor devices 10, but the predetermined number of semiconductor devices 10 extracted as samples in the vibration process (S60). Only for. Details will be described below.

  A plurality of semiconductor devices 10 for which a packaging process (not shown) has been completed are prepared in a state of being placed in a tray (not shown) in the handler 300 in advance. One of the semiconductor devices 10 is subjected to the setting step (S20) as in the first embodiment.

  Next, it is determined whether or not the vibration step (S60) was performed in the previous inspection (S32). When the vibration process (S60) is performed in the previous inspection (YES in S32), the test process (S80) is performed without performing the vibration process (S60).

  On the other hand, when the vibration process (S60) is not performed in the previous inspection (NO in S32), the pusher unit 320 is mounted with the semiconductor device 10 mounted on the socket 260 in the same manner as in the first embodiment. Is vibrated in a horizontal direction at a frequency of 1000 Hz or less (S60).

  Next, after the vibration step (S60), the semiconductor device 10 is pressed against the probe 240 of the tester 100, and the semiconductor device 10 is inspected (S80).

  Thus, for example, of the plurality of semiconductor devices 10 to be inspected, half of the semiconductor devices 10 are extracted as samples, and the extracted semiconductor device 10 is subjected to the setting process (S20) and the vibration process (S60). ) And a test step (S80). In the example described above, half of the semiconductor devices 10 are extracted from the plurality of semiconductor devices 10, but the predetermined number to be extracted may be an arbitrary number or another extraction ratio.

  According to the second embodiment, the vibration step (S60) is performed only on the semiconductor devices 10 from which a predetermined number of semiconductor devices 10 are extracted as samples among the plurality of semiconductor devices 10. Since probe contact failures rarely occur continuously, the use of the method of this embodiment can appropriately reduce the inspection time.

(Third embodiment)
FIG. 6 is a flowchart for explaining an inspection method for the semiconductor device 10 according to the third embodiment. The third embodiment is the same as the first embodiment except for the following points.

  In the third embodiment, after performing an inspection for performing a set process (S20) and a test process (S80) on a predetermined number of semiconductor devices 10, the number of semiconductor devices 10 that have an open defect in the inspection. If there are many, the vibration time of the vibration process is increased (to be described later, S64), and if the number of semiconductor devices 10 having open defects is small, the vibration time of the vibration process is decreased (to be described later, S66). Details will be described below.

  Here, for example, after 100 semiconductor devices 10 are inspected, the vibration process is adjusted as follows based on the result of the inspection.

  A plurality of semiconductor devices 10 that have completed the packaging process (not shown) are prepared on a tray (not shown) in the handler 300 in advance. One of the semiconductor devices 10 is subjected to the setting step (S20) as in the first embodiment.

  Next, it is determined whether or not the number of inspections has exceeded 100 in the previous inspections (S34). When the number of inspections does not exceed 100 (NO in S34), the test process (S80) is performed without performing the vibration process (for example, S64, S66).

  When the number of inspections exceeds 100, the vibration process is adjusted as follows. First, if there are no open defects in 100 inspections (YES in S42), it means that not only the open defective product exists in the semiconductor device 10, but also the contact failure of the probe 240 does not occur. Therefore, the test process is performed (S80) without performing the vibration process (for example, S64, S66) thereafter.

  If the number of open failures is not 0 in 100 inspections, for example, 5 or more (YES in S44), there is a possibility that misidentification has occurred due to a contact failure of the probe 240. For this reason, as a vibration process, the pusher part 320 is vibrated for 0.5 second in the horizontal direction (S64). Next, the semiconductor device 10 is pressed against the probe 240 of the tester 100, and the semiconductor device 10 is inspected (S80).

  If the number of open failures is not 0 in 100 inspections, for example, less than 5 (NO in S44), even if a contact failure of the probe 240 has occurred, it is a minor contact failure with a low probability of occurrence. Can be expected. For this reason, as a vibration process shorter than the case of S64, the pusher part 320 is vibrated in the horizontal direction for 0.2 seconds (S66). Next, the semiconductor device 10 is pressed against the probe 240 of the tester 100, and the semiconductor device 10 is inspected (S80).

  According to the third embodiment, after a predetermined number of semiconductor devices 10 are inspected among the plurality of semiconductor devices 10, a vibration process (for example, S64, S66) is determined based on the result of the inspection. Adjust. In the inspection, when the number of semiconductor devices 10 that have become open defects is large, the vibration time of the vibration process (S64) is increased, and when the number of semiconductor devices 10 that have become open defects is small, the vibration process. The vibration time of (S66) is decreased. Thereby, it is possible to appropriately shorten the inspection time while eliminating the cause of the contact failure of the probe 240.

  In the above embodiment, the semiconductor device 10 is a BGA type semiconductor package. However, the semiconductor device 10 may be a QFP (Quad Flat Package) type semiconductor package. In addition to the above-described vibration motor, the vibration unit 324 may be a coil and a magnet (not shown) that can be moved by electromagnetic induction, or a piezoelectric element (not shown) that can be moved by a piezoelectric effect.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

DESCRIPTION OF SYMBOLS 10 Semiconductor device 12 Solder ball 50 Foreign material 100 Tester 120 Tester main body 140 Wiring 200 Test head 220 Test board 240 Probe 260 Socket 300 Handler 320 Pusher part 322 Pusher base 324 Vibration part 326 Lifting mechanism

Claims (8)

A setting step of placing the semiconductor device on the socket of the tester by the handler;
A vibration step of vibrating the semiconductor device in a horizontal direction at a frequency of 1000 Hz or less;
After the vibration step, a test step of electrically connecting the semiconductor device to a test board in the tester by pressing the semiconductor device against a probe of the tester;
Semiconductor device inspection method comprising: In the inspection method of the semiconductor device according to claim 1,
The said vibration process is a test | inspection method of the semiconductor device performed by the vibration part provided in the pusher part of the said handler. In the inspection method of the semiconductor device according to claim 1 or 2,
The method for inspecting a semiconductor device, wherein a vibration time of the vibration step is 0.5 seconds or less. In the inspection method of the semiconductor device according to any one of claims 1 to 3,
A method for inspecting a semiconductor device, wherein an amplitude of the vibration step is ½ or less of an outer dimension tolerance of the semiconductor device. In the inspection method of the semiconductor device according to any one of claims 1 to 4,
A method for inspecting a semiconductor device, wherein an amplitude of the vibration step is 0.05 mm or less. In the inspection method of the semiconductor device according to any one of claims 1 to 5,
Performing the set step and the test step for all of the plurality of semiconductor devices;
A method for inspecting a semiconductor device, wherein a predetermined number of the semiconductor devices are extracted as samples, and the set step, the vibration step, and the test step are performed on the extracted semiconductor devices. In the inspection method of the semiconductor device according to any one of claims 1 to 6,
After performing an inspection for performing the set step and the test step on a predetermined number of the semiconductor devices,
In the inspection, when the number of the semiconductor devices that are open defects is large, the vibration time of the vibration process is increased, and when the number of the semiconductor devices that are open defects is small, the vibration process is performed. Semiconductor device inspection method for reducing vibration time of semiconductor device. A socket for mounting a semiconductor device;
An elevating mechanism that moves the semiconductor device up and down while holding the semiconductor device, and a handler that includes a vibrating unit that vibrates the semiconductor device in a horizontal direction at a frequency of 1000 Hz or less in a state where the semiconductor device is placed in the socket;
A semiconductor inspection apparatus.

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