WO2021245766A1 - Procédé d'électrodéposition intermittente - Google Patents

Procédé d'électrodéposition intermittente Download PDF

Info

Publication number
WO2021245766A1
WO2021245766A1 PCT/JP2020/021687 JP2020021687W WO2021245766A1 WO 2021245766 A1 WO2021245766 A1 WO 2021245766A1 JP 2020021687 W JP2020021687 W JP 2020021687W WO 2021245766 A1 WO2021245766 A1 WO 2021245766A1
Authority
WO
WIPO (PCT)
Prior art keywords
plated
electroplating method
plating
intermittent
intermittent electroplating
Prior art date
Application number
PCT/JP2020/021687
Other languages
English (en)
Japanese (ja)
Other versions
WO2021245766A9 (fr
Inventor
第造 今井
駿 杉岡
敏光 長尾
順一 片山
Original Assignee
奥野製薬工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奥野製薬工業株式会社 filed Critical 奥野製薬工業株式会社
Priority to PCT/JP2020/021687 priority Critical patent/WO2021245766A1/fr
Priority to KR1020227044788A priority patent/KR20230018406A/ko
Priority to CN202180039881.6A priority patent/CN115667592A/zh
Priority to PCT/JP2021/018329 priority patent/WO2021246133A1/fr
Publication of WO2021245766A1 publication Critical patent/WO2021245766A1/fr
Publication of WO2021245766A9 publication Critical patent/WO2021245766A9/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating

Definitions

  • the present invention relates to an intermittent electroplating method or the like.
  • the intermittent electroplating method may be adopted from the viewpoint of improving the efficiency of the electroplating process, especially from the viewpoint of efficiently electroplating a long object to be plated.
  • This intermittent plating method is performed using a plurality of plating tanks on a reel-to-reel line, for example, as shown in FIG.
  • the present inventor is advancing research, and when intermittent electroplating is performed on an object to be plated having micropores such as via holes, the degree of metal precipitation (filling property) in the micropores is remarkably low. I found.
  • the deterioration of the filling property in the intermittent electroplating is a phenomenon peculiar to the intermittent plating method, that is, the object to be plated discharged from the plating tank and the object to be plated supplied to the plating tank. It has been found that this is caused by the problem of low current density due to the plating solution slightly adhering to the object (in the case of the embodiment shown in FIG. 1, the plating solution slightly leaking from the side surface of the plating tank). Then, the present inventor has found that the above-mentioned problems can be solved by using a plating solution containing polyvalent metal ions while further researching. The present inventor has completed the present invention as a result of further research based on these findings.
  • the present invention includes the following aspects.
  • Item 1 Intermittent electroplating method for objects to be plated with micropores, including the use of a plating solution containing polyvalent metal ions.
  • Item 2. The intermittent electroplating method according to Item 1, wherein the polyvalent metal ion has a valence of 3 or more.
  • Item 3 At least one of the polyvalent metal ions selected from the group consisting of Fe 3+ , V 5+ , Mn 7+ , Mo 6+ , W 6+ , Ce 4+ , Cr 3+ , Cr 6+ , Ti 4+ , Sn 4+ , and Co 3+.
  • Item 1 The intermittent electroplating method according to Item 1 or 2.
  • Item 4. The intermittent electroplating method according to any one of Items 1 to 3, wherein the multivalent metal ion is at least one selected from the group consisting of Fe 3+ and V 5+.
  • the long object to be plated is continuously supplied to the plating tank on the line, and the discharge of the object to be plated from the plating tank and the supply of the object to be plated to the plating tank are repeated a plurality of times.
  • the intermittent electroplating method according to any one of 4.
  • Item 6 The intermittent electroplating method according to Item 5, wherein the object to be plated passes through a plurality of plating tanks.
  • Item 7. The intermittent electroplating method according to Item 5 or 6, wherein the discharge and the supply are performed on the side surface of the plating tank.
  • Item 8 The intermittent electroplating method according to any one of Items 5 to 7, which is performed on a reel-to-reel line.
  • Item 9. The intermittent electroplating method according to any one of Items 1 to 8, wherein the micropores are microvias.
  • Item 10 The intermittent electroplating method according to any one of Items 1 to 9, wherein the metal deposited on the object to be plated contains at least one selected from the group consisting of Cu, Ni, and Sn.
  • Item 11 The intermittent electroplating method according to any one of Items 1 to 10, wherein the plating solution further contains an additive for beer filling.
  • Item 12 A plating solution containing polyvalent metal ions for use in the intermittent electroplating method according to any one of Items 1 to 11.
  • the present invention it is possible to provide a technique for improving the filling property of micropores in intermittent electroplating, specifically, an intermittent electroplating method, a method for filling micropores, a plating solution, and the like.
  • a schematic diagram showing an embodiment of the intermittent electroplating method and a current pattern in the electroplating method are shown. It is sectional drawing of the substrate used in Test Example 1-2. It is a graph which shows an example of the electroplating cycle of Test Example 1-3. It is sectional drawing of the via part of the object to be plated after the completion of electroplating which shows the object (the amount of dents) to be measured in the filling property evaluation. It is sectional drawing of the via part of the object to be plated after the completion of electroplating of Example 2 and Comparative Example 3.
  • an intermittent electroplating method for an object to be plated having micropores which comprises using a plating solution containing a polyvalent metal ion (in the present invention, "intermittently of the present invention”. It may be referred to as “electroplating method”).
  • the present invention relates to a plating solution containing polyvalent metal ions for use in the intermittent electroplating method of the present invention in one aspect thereof.
  • the present invention relates to a micropore filling (via filling) method by intermittent electroplating on an object to be plated having micropores, which comprises using a plating solution containing polyvalent metal ions.
  • the multivalent metal ion is not particularly limited as long as it is a metal ion having a valence of 2 or more.
  • the valence of the multivalent metal ion is preferably 3 or more. By using a multivalent metal ion having a valence of 3 or more, the filling property of the micropores can be significantly improved.
  • the upper limit of the valence of the multivalent metal ion is not particularly limited, and is, for example, 7, 6, 5, and 4.
  • the multivalent metal ion examples include Fe 3+ , V 5+ , Mn 7+ , Mo 6+ , W 6+ , Ce 4+ , Cr 3+ , Cr 6+ , Ti 4+ , Sn 4+ , Co 3+ and the like.
  • Fe 3+ , V 5+ , Mn 7+ , Mo 6+ , W 6+ , Ce 4+ , Cr 3+ and the like are preferable.
  • Fe 3+ and V 5+ are particularly preferable, and Fe 3+ is particularly preferable, from the viewpoint of the filling property of the micropores.
  • the multivalent metal ion may be one kind alone or a combination of two or more kinds.
  • a plating solution containing polyvalent metal ions can be obtained by adding a metal compound when preparing the plating solution.
  • the metal compound used include iron sulfate (III) hydrate / anhydride, iron nitrate (III) nine hydrate, and iron bromide (III) in the case of obtaining a plating solution containing Fe 3+.
  • Examples thereof include sodium metavanadate, potassium metavanadate, ammonium metavanadate, etc .; in the case of obtaining a plating solution containing Mn 7+, for example, potassium permanganate, sodium permanganate, etc. may be mentioned; Mo 6+ containing plating solution may be used.
  • Examples thereof include sodium molybdenate, potassium molybdenate, lithium molybdenate, hexaammonium hexaammonium tetrahydrate tetrahydrate and the like in the case of obtaining; for example, tungsten (IV) acid in the case of obtaining a plating solution containing W 6+.
  • Examples thereof include sodium dihydrate, sodium metatungstate, potassium tungstate, etc .; in the case of obtaining a plating solution containing Ce4 +, for example, cerium (IV) nitrate, ammonium sulphate (IV) hydrate / anhydride, etc.
  • Tetraammonium sulphate cerium (IV) dihydrate and the like Tetraammonium sulphate cerium (IV) dihydrate and the like; in the case of obtaining a plating solution containing Cr 3+, for example, chromium sulfate hydrate / anhydride, chromium acetate, potassium chromium sulfate and the like can be mentioned; When obtaining a plating solution containing Cr 6+, for example, sodium dichromate, potassium dichromate and the like can be mentioned; when obtaining a plating solution containing Ti 4+, for example, titanyl sulfate and the like can be mentioned; Sn 4+ containing.
  • a plating solution containing Co 3+ for example, sodium nitrate trihydrate and the like can be mentioned; and in the case of obtaining a plating solution containing Co 3+, for example, hexaammine cobalt (III) chloride and the like can be mentioned.
  • iron sulfate (III) hydrate / anhydride, iron nitrate (III) nine hydrate, iron bromide (III) anhydrous, and quen are particularly preferable from the viewpoint of the filling property of micropores.
  • examples thereof include iron ammonium acid, iron (III) citrate hydrate, iron (III) oxide, iron (III) sulfate hydrate, sodium metavanadate, potassium metavanadate, ammonium metavanadate, and the like, and more preferably sulfuric acid.
  • the polyvalent metal ion contained in the plating solution may have a valence changed in the plating solution after the addition of the metal compound (the above metal compound or other metal compound).
  • the metal compound may be one kind alone or a combination of two or more kinds.
  • the concentration of the multivalent metal ion in the plating solution is not particularly limited, but is, for example, 0.01 to 20 g / L.
  • the concentration is preferably 0.05 to 10 g / L, more preferably 0.1 to 5 g / L, still more preferably 0.2 to 3 g / L, still more preferably 0, from the viewpoint of the filling property of the micropores. .5 to 3 g / L.
  • the concentration is particularly preferably 0.7 to 2.5 g / L (more preferably 0.9 to 2.2 g / L) from the viewpoint of being able to greatly improve the filling property of the micropores.
  • the metal deposited on the object to be plated is not particularly limited.
  • the metal include Cu, Ni, Sn and the like. Of these, Cu is particularly preferred.
  • the metal to be deposited on the object to be plated may be one kind alone or a combination of two or more kinds.
  • the plating solution contains other components such as ions of the metal to be deposited and components to be blended as needed.
  • Other components include known electroplating solutions (eg Cu plating solutions (eg copper sulfate baths, bubbling copper baths, copper cyanide baths, copper pyrophosphate baths, etc.), Ni plating solutions (eg compound salt baths, ordinary baths, etc.).
  • Rotating bath High sulfate bath, Watt bath, Total chloride bath, Sulfate-chloride bath, Total sulfate bath, High quality bath, Strike nickel bath, Nickel sulfamate bath, Copperified nickel bath, etc.
  • Sn plating solution for example, an alkaline bath, a sulfate bath, a sulfonic acid bath, a pyrophosphate bath, a buffalo bath, etc.
  • the Cu plating solution will be described below.
  • an acidic copper plating solution containing copper ions and at least one acid component selected from organic acids and inorganic acids as essential components can be used as other components.
  • any copper compound soluble in the plating solution can be used without particular limitation.
  • a copper compound include copper sulfate, copper oxide, copper chloride, copper carbonate, copper pyrophosphate, copper alkanesulfonate, copper alkanolsulfonate, and organic copper acid.
  • the copper compound may be used alone or in combination of two or more.
  • the concentration of the copper compound in the acidic copper plating solution is not particularly limited, but can be, for example, in the range of about 20 to 280 g / L. The concentration is preferably 100 to 250 g / L, more preferably 150 to 230 g / L.
  • the acid component in the acidic copper plating solution at least one selected from the group consisting of organic acids and inorganic acids can be used.
  • organic acid include alkane sulfonic acid such as methane sulfonic acid, alkanol sulfonic acid and the like
  • inorganic acid include sulfuric acid and the like.
  • the concentration of the acid component in the acidic copper plating solution is not particularly limited, but may be, for example, about 10 to 400 g / L.
  • the concentration is preferably 40 to 200 g / L, more preferably 70 to 150 g / L.
  • the acidic copper plating solution preferably contains chloride ions.
  • the concentration may be usually about 10 to 200 mg / L.
  • the concentration is preferably 25 to 100 mg / L, more preferably 40 to 70 mg / L.
  • the chloride ion concentration in the plating solution may be adjusted by using hydrochloric acid, sodium chloride or the like, if necessary.
  • the acidic copper plating solution may contain various additives.
  • the additives the beer filling additive is preferable.
  • the object to be plated is an object to be plated having micropores and is not particularly limited as long as it can be electroplated.
  • Examples of the object to be plated include a substrate having a via hole.
  • the micropores are preferably microvias.
  • the size of the micropores is, for example, 300 to 5 ⁇ m in diameter (preferably 150 to 30 ⁇ m) and 150 to 5 ⁇ m in depth (preferably 100 to 20 ⁇ m). According to the intermittent electroplating method of the present invention, good filling property can be exhibited even for micro vias.
  • the object to be plated is pretreated.
  • the pretreatment method is not particularly limited and may follow a conventional method.
  • a material to be plated that has been subjected to a conductive treatment for example, electroless plating treatment, carbon treatment, sputtering treatment, Sn-Pd colloidal catalyst treatment, conductive polymer treatment, etc.
  • a conductive treatment for example, electroless plating treatment, carbon treatment, sputtering treatment, Sn-Pd colloidal catalyst treatment, conductive polymer treatment, etc.
  • degreasing treatment for example, degreasing treatment, stains adhering in the previous step.
  • the product obtained through the removal treatment of the above, the removal of the oxide film by pickling, etc. can be used as the object to be plated.
  • the object to be plated may already have a plating film formed by electroplating.
  • the intermittent electroplating method of the present invention is a method in which the current addition cycle is repeated intermittently, and the plating solution slightly adhered to the object to be plated discharged from the plating tank and the object to be plated supplied to the plating tank.
  • the method is not particularly limited as long as the method causes the problem of generation of low current density due to the plating solution slightly leaking from the side surface of the plating tank).
  • a long object to be plated is continuously supplied to the plating tank on the line, and the object to be plated is discharged from the plating tank and the object to be plated to the plating tank. Is a method in which the supply of is repeated multiple times.
  • the mode of discharging the object to be plated from the plating tank and supplying the object to be plated to the plating tank is not particularly limited. It is preferable that the discharge and the supply are performed on the side surface of the plating tank. In this case, when the object to be plated is discharged from the side wall of the plating tank and when the object to be plated is supplied through the side wall of the plating tank, the plating solution inside the plating tank passes through the object to be plated. As a result, it leaks to the outside of the plating tank, which causes a problem (generation of low current density) in the present invention.
  • the number of times the supply and discharge of the object to be plated to the plating tank is repeated is, for example, 2 to 30 times, preferably 5 to 25 times, and more preferably 10 to 20 times.
  • the intermittent electroplating method of the present invention is preferably a method in which the object to be plated passes through a plurality of plating tanks.
  • the number of plating tanks to pass through is, for example, 2 to 30, preferably 5 to 25, and more preferably 10 to 20.
  • the intermittent electroplating method of the present invention is preferably a method performed on a reel-to-reel line.
  • the stirring method of the plating solution is not particularly limited, and air stirring, jet stirring, mechanical stirring, etc. can be performed, and a plurality of stirring methods may be combined.
  • a soluble anode or an insoluble anode can be used as the anode.
  • the soluble anode for example, phosphorus-containing copper having a phosphorus content of about 0.02 to 0.06% can be used.
  • the insoluble anode titanium coated with iridium oxide, titanium plated with platinum, or the like can be used.
  • the shape of the anode is not particularly limited, and various shapes such as rod-shaped, spherical, plate-shaped, and mesh-shaped anodes can be used.
  • an object to be plated can be used as the cathode.
  • the temperature of the plating solution is usually about 10 to 50 ° C.
  • the temperature is preferably 20 to 35 ° C.
  • the current density (current density in the plating tank) in the intermittent electroplating method of the present invention is, for example, 2 to 15 A / dm 2 , preferably 2 to 10 A / dm 2 .
  • the time per current addition (time in which one point in the object to be plated is immersed in the plating solution in the plating tank) is, for example, 5 to 120 seconds, preferably 10 to 10. 60 seconds, more preferably 20-40 seconds.
  • the number of current addition cycles is, for example, 2 to 30, preferably 5 to 25, and more preferably 10 to 20.
  • Test example 1 Intermittent electroplating test 1 ⁇ Test Example 1-1. Preparation of electroplating solution> An electroplating solution having the composition shown in Table 1 below was prepared.
  • a copper foil resin substrate having a thickness of 64 ⁇ m (layer structure: copper foil 7 ⁇ m / resin (polyimide) layer 50 ⁇ m / copper foil 7 ⁇ m) has a large number of via holes with a diameter of 100 ⁇ m and a depth of 57 ⁇ m.
  • a substrate (Fig. 2) made conductive by a ting system is used as an object to be plated, and this is used in a degreasing solution (trade name: DP-320 Clean, manufactured by Okuno Pharmaceutical Co., Ltd., 100 ml / L aqueous solution) at 45 ° C. 5 After soaking for 1 minute, it was washed with water for 1 minute and then immersed in 100 g / L dilute sulfuric acid for 1 minute for pretreatment.
  • Example 1-4 Filling property evaluation> After the completion of electroplating, the cross section of the via portion of the object to be plated was observed, and the amount of dent in the via portion shown in FIG. 4 was measured. Based on the measured values, the filling property was evaluated according to the following evaluation criteria ( ⁇ : dent amount 48 ⁇ m or less, ⁇ : dent amount: 48 to 53 ⁇ m, ⁇ : dent amount 53 ⁇ m or more).
  • Test example 2 Intermittent electroplating test 2 An electroplating solution was prepared in the same manner as in Test Example 1-1 except that ferric sulfate n-hydrate was added to the electroplating solution to adjust the Fe 3+ concentration to the concentration shown in Table 5. Other than that, pretreatment, electroplating, and filling property evaluation were performed in the same manner as in Test Example 1.
  • FIG. 5 shows a cross-sectional observation view of the via portion of the object to be plated after the completion of electroplating in Example 2 and Comparative Example 3.
  • Test example 3 Intermittent electroplating test 3 An electroplating solution was prepared in the same manner as in Test Example 1-1 except that various metal compounds were added to the electroplating solution to adjust the polyvalent metal ion concentration to the concentration shown in Table 6. Other than that, pretreatment, electroplating, and filling property evaluation were performed in the same manner as in Test Example 1. The low current density in this test is 0.2 A / dm 2 , and the energization time is 5 seconds.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

La présente invention concerne une technologie pour améliorer les propriétés de remplissage de micropores lors d'une électrodéposition intermittente.　Ce procédé d'électrodéposition intermittente est destiné à réaliser l'électrodéposition intermittente d'un objet plaqué ayant des micropores et comprend l'utilisation d'un liquide de placage contenant des ions métalliques polyvalents.
PCT/JP2020/021687 2020-06-02 2020-06-02 Procédé d'électrodéposition intermittente WO2021245766A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2020/021687 WO2021245766A1 (fr) 2020-06-02 2020-06-02 Procédé d'électrodéposition intermittente
KR1020227044788A KR20230018406A (ko) 2020-06-02 2021-05-14 단속적 전기 도금 방법
CN202180039881.6A CN115667592A (zh) 2020-06-02 2021-05-14 间歇电镀方法
PCT/JP2021/018329 WO2021246133A1 (fr) 2020-06-02 2021-05-14 Procédé de dépôt électrochimique intermittent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/021687 WO2021245766A1 (fr) 2020-06-02 2020-06-02 Procédé d'électrodéposition intermittente

Publications (2)

Publication Number Publication Date
WO2021245766A1 true WO2021245766A1 (fr) 2021-12-09
WO2021245766A9 WO2021245766A9 (fr) 2022-01-27

Family

ID=78830213

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2020/021687 WO2021245766A1 (fr) 2020-06-02 2020-06-02 Procédé d'électrodéposition intermittente
PCT/JP2021/018329 WO2021246133A1 (fr) 2020-06-02 2021-05-14 Procédé de dépôt électrochimique intermittent

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/018329 WO2021246133A1 (fr) 2020-06-02 2021-05-14 Procédé de dépôt électrochimique intermittent

Country Status (3)

Country Link
KR (1) KR20230018406A (fr)
CN (1) CN115667592A (fr)
WO (2) WO2021245766A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004059952A (ja) * 2002-07-25 2004-02-26 Toppan Printing Co Ltd フレキシブル多層配線基板の電解めっき方法
JP2005089799A (ja) * 2003-09-16 2005-04-07 Toppan Printing Co Ltd めっき装置
JP2006519931A (ja) * 2003-03-10 2006-08-31 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 高アスペクト比のホールを有する加工品の電気めっき方法
JP2008231550A (ja) * 2007-03-23 2008-10-02 Toppan Printing Co Ltd 電解めっき装置及び配線基板の製造方法
JP2009531542A (ja) * 2006-03-30 2009-09-03 アトテック・ドイチュラント・ゲーエムベーハー 孔及びキャビティの金属による電解充填法
JP2011058093A (ja) * 2009-09-04 2011-03-24 Ibiden Co Ltd プリント配線板の製造方法
JP2018111863A (ja) * 2017-01-12 2018-07-19 上村工業株式会社 フィリングめっきシステム及びフィリングめっき方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6906237B2 (ja) * 2018-12-12 2021-07-21 奥野製薬工業株式会社 断続的電気めっき方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004059952A (ja) * 2002-07-25 2004-02-26 Toppan Printing Co Ltd フレキシブル多層配線基板の電解めっき方法
JP2006519931A (ja) * 2003-03-10 2006-08-31 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 高アスペクト比のホールを有する加工品の電気めっき方法
JP2005089799A (ja) * 2003-09-16 2005-04-07 Toppan Printing Co Ltd めっき装置
JP2009531542A (ja) * 2006-03-30 2009-09-03 アトテック・ドイチュラント・ゲーエムベーハー 孔及びキャビティの金属による電解充填法
JP2008231550A (ja) * 2007-03-23 2008-10-02 Toppan Printing Co Ltd 電解めっき装置及び配線基板の製造方法
JP2011058093A (ja) * 2009-09-04 2011-03-24 Ibiden Co Ltd プリント配線板の製造方法
JP2018111863A (ja) * 2017-01-12 2018-07-19 上村工業株式会社 フィリングめっきシステム及びフィリングめっき方法

Also Published As

Publication number Publication date
KR20230018406A (ko) 2023-02-07
CN115667592A (zh) 2023-01-31
WO2021246133A1 (fr) 2021-12-09
WO2021245766A9 (fr) 2022-01-27

Similar Documents

Publication Publication Date Title
US6129830A (en) Process for the electrolytic deposition of copper layers
KR101532559B1 (ko) 청동 전기도금
CN110306214A (zh) 一种用于高纵横比孔径印制线路板通孔电镀的反向脉冲镀铜工艺
JP4843164B2 (ja) 銅−樹脂複合材料の形成方法
JPH0544075A (ja) 無電解銅めつき代替銅ストライクめつき方法
JP2009299195A (ja) 金属層の電解析出のための方法
JPS6113688A (ja) 印刷回路用銅箔およびその製造方法
JP6389916B2 (ja) レーザー孔明け加工用の銅張積層板の製造方法
JP2006316328A (ja) ２層フレキシブル銅張積層板の製造方法
CN114574911B (zh) 一种高厚径比线路板通孔电镀工艺
CN113881983A (zh) 通孔脉冲电镀液及通孔脉冲电镀涂覆方法
JP6906237B2 (ja) 断続的電気めっき方法
WO2021245766A1 (fr) Procédé d'électrodéposition intermittente
JP6653799B2 (ja) 電解銅めっき用陽極、及びそれを用いた電解銅めっき装置
JP2006028635A (ja) 微細回路基板用表面処理銅箔の製造方法及びその銅箔
JP4646376B2 (ja) ダイレクトプレーティング用アクセレレータ浴液およびダイレクトプレーティング方法
TW202146712A (zh) 間歇電鍍方法
JP2006052431A (ja) 錫−亜鉛合金電気めっき方法
JPH07202367A (ja) 印刷回路用銅箔の表面処理方法
JPH0319307B2 (fr)
JP2019065342A (ja) めっき液、めっき膜の製造方法
CN112899737A (zh) 一种盲孔填充电镀铜溶液及其应用
US1590170A (en) Process of plating with chromium
WO2023190805A1 (fr) Solution de placage de cuivre pour électrolyse par impulsions pr et procédé de placage de cuivre au moyen d'une électrolyse par impulsions pr
JP4740711B2 (ja) Ｐｄ／Ｓｎコロイド触媒吸着促進剤

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20938749

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20938749

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP