WO2021244248A1 - 显示面板及其制备方法、显示基板及其制备方法和显示装置 - Google Patents
显示面板及其制备方法、显示基板及其制备方法和显示装置 Download PDFInfo
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
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- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Definitions
- the present disclosure relates to the field of display technology, and in particular to a display panel and a preparation method thereof, a display substrate and a preparation method thereof, and a display device.
- OLED Organic Light-Emitting Diode
- OLED display devices have the advantages of self-luminescence, high luminous efficiency, short response time, high definition and contrast, and flexible display, so they are used in more and more occasions.
- a display panel in one aspect, includes a substrate, a first electrode, a pixel defining layer, and a first light-emitting function layer.
- the first electrode is arranged on one side of the substrate.
- the pixel defining layer is disposed on one side of the substrate, and includes a first hollowed-out portion, and the first hollowed-out portion includes a first opening and a second opening that are oppositely disposed; compared with the second opening, The first opening is closer to the substrate, wherein the first opening exposes at least part of the first electrode.
- the first light-emitting function layer is disposed on the pixel defining layer and the side of the first electrode away from the substrate, and includes a second hollow portion, and the second hollow portion is formed on the pixel defining layer
- the orthographic projection does not overlap with the first opening.
- the maximum size of the second hollow portion is smaller than the maximum size of the first hollow portion.
- the display panel further includes: a second electrode disposed on a side of the first light-emitting function layer away from the substrate, and the second electrode covers the second hollow portion.
- the display panel further includes a thin film transistor disposed between the substrate and the first electrode, and the source or drain of the thin film transistor is electrically connected to the first electrode .
- the thin film transistor further includes: an active layer, a first gate insulating layer, a gate layer, a second gate insulating layer, and an interlayer insulating layer stacked in a direction away from the substrate;
- the source and drain of the transistor are arranged on the side of the interlayer insulating layer away from the substrate, and pass through the via holes that penetrate the interlayer insulating layer, the second gate insulating layer, and the first gate insulating layer.
- the active layer contacts.
- the display panel further includes: a first metal layer disposed between the thin film transistor and the substrate, and the first metal layer and a compensation voltage terminal Electrically connected, the compensation voltage terminal is configured to provide a compensation voltage signal for compensating the threshold voltage of the thin film transistor.
- the display panel further includes an encapsulation layer including a first inorganic encapsulation sublayer, an organic encapsulation sublayer, and a second inorganic encapsulation sublayer stacked in a direction away from the substrate.
- a display substrate including: a substrate, a first electrode, a pixel defining layer, a sacrificial pattern, a spacer, and a second light-emitting function layer.
- the first electrode is arranged on one side of the substrate.
- the pixel defining layer is disposed on one side of the substrate, and includes a first hollowed-out portion, and the first hollowed-out portion includes a first opening and a second opening that are oppositely disposed; compared with the second opening, the The first opening is closer to the substrate, wherein the first opening exposes at least part of the first electrode.
- the sacrificial pattern is disposed on a side of the pixel defining layer away from the substrate, and the orthographic projection of the sacrificial pattern on the pixel defining layer does not overlap with the first opening.
- the spacer is disposed on a side of the sacrificial pattern away from the substrate, and the orthographic projection of the spacer on the pixel defining layer does not overlap with the first opening.
- the second light-emitting function layer is disposed on a side of the pixel defining layer and the first electrode away from the substrate.
- the spacer includes a first surface and a second surface disposed opposite to each other in a direction away from the substrate, and the first surface is closer to the substrate relative to the second surface; Wherein, the orthographic projection of the first surface on the pixel defining layer falls within the orthographic projection of the second surface on the pixel defining layer, and the first surface is on the pixel defining layer. There is a gap between the boundary of the orthographic projection and the boundary of the orthographic projection of the second surface on the pixel defining layer.
- the maximum size of the second surface is smaller than the maximum size of the first hollow portion.
- the thickness of the sacrificial pattern is greater than the thickness of the second light-emitting function layer.
- the display substrate further includes a thin film transistor disposed between the substrate and the first electrode, and the source or drain of the thin film transistor is electrically connected to the first electrode .
- a display device including the display panel as described above.
- a method for preparing a display substrate including:
- a first electrode is formed on the substrate.
- a pixel defining layer is formed on the substrate on which the first electrode is formed; the pixel defining layer includes: a first hollowed-out portion, and the first hollowed-out portion includes a first opening and a second opening that are arranged opposite to each other. The second opening, the first opening is closer to the substrate, and the first opening exposes at least part of the first electrode.
- a stacked sacrificial pattern and spacer are formed on the pixel defining layer, and the sacrificial pattern is closer to the substrate than the spacer.
- the substrate on which the spacer is formed is disposed opposite to the mask plate, the spacer is in contact with the mask plate, and the spacer is provided to the substrate through the mask plate
- a light-emitting functional material is vapor-deposited on one side of the object to form a second light-emitting functional layer.
- forming laminated sacrificial patterns and spacers on the pixel defining layer includes: forming a first thin film on a substrate on which the pixel defining layer is formed, and patterning the first thin film, To form a sacrificial pattern on the side of the pixel defining layer away from the substrate.
- a second thin film is formed on the substrate on which the sacrificial pattern is formed, and the second thin film is patterned to form spacers on the side of the sacrificial pattern away from the substrate.
- forming a laminated sacrificial pattern and spacers on the pixel defining layer includes: forming a first thin film on the substrate on which the pixel defining layer is formed.
- a second film is formed on the first film.
- first film and the second film are patterned to form laminated sacrificial patterns and spacers.
- a method for manufacturing a display panel including:
- the sacrificial pattern in the display substrate is removed, so that the spacer on the side of the sacrificial pattern away from the substrate in the display substrate is separated from the display substrate to form a first light-emitting function layer through a second light-emitting function layer .
- the manufacturing method of the display panel further includes:
- a second electrode is formed on the substrate on which the first light-emitting function layer is formed.
- a first inorganic encapsulation sublayer is formed on the second electrode.
- An organic encapsulation sublayer is formed on the first inorganic encapsulation sublayer.
- a second inorganic encapsulation sublayer is formed on the organic encapsulation sublayer, and the first inorganic encapsulation sublayer, the organic encapsulation sublayer, and the second inorganic encapsulation sublayer constitute an encapsulation layer.
- FIGS. 1A to 1G are structural diagrams of a display panel provided according to some embodiments of the present disclosure.
- Fig. 2 is a structural diagram of a first light-emitting functional layer provided according to some embodiments of the present disclosure
- 3A to 3C are manufacturing process diagrams of a display panel provided according to some embodiments of the present disclosure.
- FIGS. 4A and 4B are structural diagrams of another display panel provided according to some embodiments of the present disclosure.
- FIG. 5 is a structural diagram of a pixel driving circuit provided according to some embodiments of the present disclosure.
- FIG. 6 is a timing diagram of a pixel driving circuit according to some embodiments of the present disclosure.
- FIG. 7A is a structural diagram of another display panel provided according to some embodiments of the present disclosure.
- Fig. 7B is a cross-sectional view in the direction of A-A' in Fig. 7A;
- FIG. 7C is a structural diagram of a first metal layer provided according to some embodiments of the present disclosure.
- FIG. 7D is a structural diagram of an active layer provided according to some embodiments of the present disclosure.
- FIG. 7E is a structural diagram of a gate metal layer provided according to some embodiments of the present disclosure.
- FIG. 7F is a structural diagram of a second metal layer provided according to some embodiments of the present disclosure.
- FIG. 7G is a structural diagram of a third metal layer provided according to some embodiments of the present disclosure.
- FIG. 7H is a structural diagram of another display panel provided according to some embodiments of the present disclosure.
- FIGS. 8A to 8I are structural diagrams of a display substrate provided according to some embodiments of the present disclosure.
- FIG. 9A is a structural diagram of another display substrate provided according to some embodiments of the present disclosure.
- Fig. 9B is a cross-sectional view in the direction of B-B' in Fig. 9A;
- 9C is a structural diagram of a first electrode, a first hollow portion, a sacrificial pattern, and a spacer provided according to some embodiments of the present disclosure
- FIG. 9D is a structural diagram of another display substrate provided according to some embodiments of the present disclosure.
- FIG. 10A is a flowchart of a method for manufacturing a display substrate according to some embodiments of the present disclosure
- FIGS. 10B to 10G are diagrams of a manufacturing process of a display substrate provided according to some embodiments of the present disclosure.
- Fig. 10H is a cross-sectional view in the direction of C-C′ in Fig. 10G;
- FIG. 11A is a flowchart of a method for manufacturing a display panel according to some embodiments of the present disclosure
- FIG. 11B is a manufacturing process diagram of a display panel provided according to some embodiments of the present disclosure.
- first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
- plural means two or more.
- the expressions “coupled” and “connected” and their extensions may be used.
- the term “connected” may be used when describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.
- the term “coupled” may be used when describing some embodiments to indicate that two or more components have direct physical or electrical contact.
- the term “coupled” or “communicatively coupled” may also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other.
- the embodiments disclosed herein are not necessarily limited to the content of this document.
- At least one of A, B, and C has the same meaning as “at least one of A, B, or C", and both include the following combinations of A, B, and C: only A, only B, only C, A and B The combination of A and C, the combination of B and C, and the combination of A, B and C.
- a and/or B includes the following three combinations: A only, B only, and the combination of A and B.
- the term “if” is optionally interpreted to mean “when” or “when” or “in response to determination” or “in response to detection.”
- the phrase “if it is determined" or “if [the stated condition or event] is detected” is optionally interpreted to mean “when determining" or “in response to determining" Or “when [stated condition or event] is detected” or “in response to detecting [stated condition or event]”.
- the exemplary embodiments are described herein with reference to cross-sectional views and/or plan views as idealized exemplary drawings.
- the thickness of layers and regions are exaggerated for clarity. Therefore, variations in the shape with respect to the drawings due to, for example, manufacturing technology and/or tolerances can be envisaged. Therefore, the exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing.
- the etched area shown as a rectangle will generally have curved features. Therefore, the areas shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shape of the area of the device, and are not intended to limit the scope of the exemplary embodiments.
- An embodiment of the present disclosure provides a display device, which is, for example, an electroluminescence display device.
- the electroluminescent display device includes, for example, a display panel, and the display panel may be an OLED display panel or a Quantum Dot Light Emitting Diodes (QLED for short) display panel.
- the display panel may be an OLED display panel or a Quantum Dot Light Emitting Diodes (QLED for short) display panel.
- QLED Quantum Dot Light Emitting Diodes
- the display panel 1 includes, for example:
- the substrate 11 is, for example, a flexible substrate, and the material of the flexible substrate is, for example, polyimide (PI).
- PI polyimide
- At least one first electrode 12 is provided on one side of the substrate 11.
- the first electrode 12 is, for example, a transparent electrode or an anode, and its material includes, for example, indium tin oxide (ITO). In some embodiments, there are multiple first electrodes 12.
- the pixel defining layer 13 is disposed on one side of the substrate 11 and includes at least one first hollow portion 130.
- the first hollow portion 130 includes a first opening 1301 and a second opening 1302 disposed oppositely. Compared to the second opening 1302, the first opening 1301 is closer to the substrate 11, wherein the first opening 1301 exposes at least part of the first electrode 12.
- the size of the first opening 1301 and the size of the second opening 1302 are exactly the same, and the size here includes, for example, length and width.
- the size of the first opening 1301 and the size of the second opening 1302 are different, for example, at least one of the length and the width are different.
- the number of the first hollow parts 130 is greater than or equal to the number of the first electrodes 12, and the extra first hollow parts 130 are used, for example, to realize the cross-layer electrical connection between the various film layers in the display panel 1.
- the first hollow portion 130 exposes a portion of the surface of the first electrode 12 on the side away from the substrate 11.
- the first hollow portion 130 exposes the entire surface of the first electrode 12 on the side away from the substrate 11.
- the first light-emitting function layer 14 is disposed on the side of the pixel defining layer 13 and the first electrode 12 away from the substrate 11, and includes a second hollow portion 140.
- the orthographic projection of the second hollow portion 140 on the pixel defining layer 13 and the first The opening 1301 does not overlap.
- the first light-emitting functional layer 14 includes at least a light-emitting layer, and the material of the light-emitting layer may include, for example, an organic electroluminescent material.
- the first light-emitting functional layer 14 may also include an electron transport layer (election transporting layer, ETL) 142, an electron injection layer (election injection layer, EIL) 143, and a hole transport layer (hole).
- ETL electron transport layer
- EIL electron injection layer
- hole hole transport layer
- HTL transporting layer
- HIL hole injection layer
- the first light-emitting functional layer 14 is not limited to only including the light-emitting layer 141 and the combination of ETL142, EIL143, HTL144, and HIL145, and may also include other functional layers.
- the orthographic projection of the second hollow portion 140 on the pixel defining layer 13 does not overlap with the first opening 1301 and includes:
- the thickness direction of the substrate is a direction perpendicular to one side of the substrate and the other side of the substrate, and the second hollow portion 140 is There is a gap between the orthographic projection on the pixel defining layer 13 and the first opening 1301, and the first light-emitting function layer 14 covers the gap.
- the second hollow portion 140 is immediately between the orthographic projection on the pixel defining layer 13 and the first opening 1301, that is, there is no gap between the second hollow portion 140 and the first opening 1301. There is a gap; at the same time, the orthographic projection of the second hollow portion 140 on the pixel defining layer 13 and the second opening 1302 are also close to each other.
- the second hollow portion 140 has a gap between the orthographic projection on the pixel defining layer 13 and the first opening 1301, while the second hollow portion 140 is on the pixel defining layer 13. There is a partial overlap between the projection and the second opening 1302.
- the first light-emitting functional layer 14 When making the first light-emitting functional layer 14, it is necessary to use a fine metal mask (Fine metal mask, FFM) to evaporate the material used to form the first light-emitting functional layer 14, but in order to avoid scratches on the fine metal mask
- FFM fine metal mask
- the film layers that have been fabricated before the first light-emitting function layer 14 are fabricated, such as the pixel defining layer 13 and the first electrode 12, etc., so that spacers 17 are provided on the pixel defining layer 13 to support the FMM, so that the FMM and the fabricated There is a certain distance between good film layers, and there is no direct contact, so as to protect the film layers that have been made.
- a stacked sacrificial pattern 18 and spacers 17 are arranged on the pixel defining layer 13, and the sacrificial pattern 18 is located between the spacers 17 and the pixel defining layer 13.
- the sacrificial pattern 18 will be removed later (for example, it can be removed by dissolving), so that the spacer 17 can be separated from the display panel 1.
- a second light-emitting functional layer 24 is formed on the side of the first electrode 12, the pixel defining layer 13 and the spacer 17 away from the substrate 11.
- the second light-emitting functional layer 24 covers the first electrode 12 and the pixel defining layer 13. In the embodiment, the second light-emitting functional layer 24 also covers the spacer 17.
- the second light-emitting function layer 24 will be formed A hollow part is formed, and the hollow part can be understood as the second hollow part 140.
- the process can be understood as forming the first light-emitting function layer 14 with the second hollow part 140 through the second light-emitting function layer 24.
- the second light-emitting functional layer 24 covers the pixel defining layer 13, spacers 17, and the first electrode 12; referring to FIG. 3C, the second light-emitting functional layer 24 covers the pixel defining layer 13 and the first electrode 12; 1A to 1G, the first light-emitting functional layer 14 covers the pixel defining layer 13 and the first electrode 12, that is to say, the structure of the second light-emitting functional layer 24 may be different from that of the first light-emitting functional layer 14.
- the first light-emitting functional layer 14 and the second light-emitting functional layer 24 are used to distinguish, and those skilled in the art can understand that the first light-emitting functional layer 14 passes through the second light-emitting function.
- the layer 24 is prepared, or, it can also be understood that the first light-emitting functional layer 14 is at least part of the second light-emitting functional layer 24.
- the spacer 17 Since the spacer 17 is present in the manufacturing process of the display panel 1, it can not only support the FMM, so that the second light-emitting functional layer 24 can be prepared smoothly, and after the second light-emitting functional layer 24 is prepared, the first The sacrificial pattern 18 is removed, so that the spacer 17 is separated from the display panel 1, and foreign particles generated by the spacer 17 in the process of removing the FMM can be removed, so as to provide a better support surface for the subsequent preparation of the encapsulation layer .
- the sacrificial pattern 18 can be removed by, for example, wet etching, dry etching, etc.; the wet etching, for example, uses a stripping solution to dissolve the sacrificial pattern 18, and the dry etching, for example, uses a gas to react with the sacrificial pattern 18, thereby Etch away the sacrificial pattern 18.
- the spacer 17 loses support, so that it can be detached from the display panel 1 (also referred to as falling).
- the FMM since the material of the spacer 17 is an organic material, when the FMM is used, the FMM may scratch the spacer 17 during the installation or disassembly process of the FMM, thereby generating foreign particles.
- the density of the spacer 17 and the foreign particles produced therefrom will affect the quality of the film layer prepared after the first light-emitting functional layer 14.
- the film layer prepared after the first light-emitting functional layer 14 includes, for example, packaging.
- the encapsulation layer includes at least an organic encapsulation sublayer.
- the organic encapsulation sublayer can be formed by inkjet printing (IJP), for example. Since the material of the organic encapsulation sublayer has certain fluidity, the spacer 17 The density will affect its fluidity.
- the fluidity of the material in the organic encapsulation sub-layer is reduced, thereby forming a part of the organic encapsulation sub-layer with a larger thickness, while in other areas In the area where the spacer 17 has a lower density, the fluidity of the material of the organic encapsulation sublayer increases, thereby forming a part of the organic encapsulation layer with a smaller thickness. Therefore, the film thickness of the organic encapsulation sublayer is different. Thickness uniformity is poor, and foreign particles may cause defects in the organic encapsulation sublayer, which affects the encapsulation effect of the organic encapsulation sublayer.
- the display panel 1 due to the difference in the height of the spacer 17 of the display panel 1, for example, along the length of the display panel 1, if the height of the spacer 17 on the left and right sides is different, the edge brightness of the display panel 1 will be different from that of other areas. Therefore, the display panel 1 produces a color shift phenomenon, which affects the display effect. Therefore, in the related art, the presence of the spacer 17 will affect the quality of the film prepared after the first light-emitting function layer 14 and also affect the display effect of the display panel 1.
- sacrificial patterns 18 and spacers 17 are formed on the pixel defining layer 13 to support the FMM, and after the second light-emitting function layer 24 is prepared, The spacer 17 is removed or removed by removing the sacrificial pattern 18, so that the first light-emitting function layer 14 with the second hollow portion 140 is prepared from the second light-emitting function layer 24. Therefore, on the one hand, when the organic encapsulation sublayer in the present disclosure is prepared, since there is no barrier by the spacer 17, the film thickness of the prepared organic encapsulation sublayer is close to each other, and the thickness uniformity is good, which can improve the display The encapsulation effect of the panel 1.
- the foreign particles generated by the spacer 17 being scratched by the FMM will also be removed, so that the prepared organic encapsulation sub-layer will not be defective due to foreign particles, and the quality of the film It is also better, which can further improve the packaging effect of the display panel 1.
- the display panel 1 since there is no spacer 17, the display panel 1 will not produce color shift due to the height difference of the spacer 17, so that the display panel 1 The display effect is also better; on the other hand, due to the absence of spacers 17, the thickness of the display panel 1 can be reduced, so that the display panel 1 with a smaller thickness can be prepared, which is more in line with the development of the display panel 1 towards lightness and thinness. Trend, and improve the market competitiveness of the display panel 1.
- the second hollow portion 140 has a gap between the orthographic projection on the pixel defining layer 13 and the second opening 1302.
- the formed first light-emitting functional layer 14 will cover the gap, thereby ensuring that the first light-emitting functional layer 14 is completely covered
- the first opening 1301 further ensures that the contact area between the first light-emitting function layer 14 and the first electrode 12 is relatively large.
- the first light-emitting function layer 14 does not completely cover the first opening 1301, the first light-emitting function layer 14 does not completely cover the part of the first electrode 12 exposed by the first opening 1301, that is, the part of the first electrode 12 exposed by the first opening 1301 Only part of the area of one electrode 12 is covered with the first light-emitting functional layer 14, and the remaining part of the area is not covered by the first light-emitting functional layer 14, so that the contact area between the first light-emitting functional layer 14 and the first electrode 12 is small Finally, the light-emitting area of the organic light-emitting diode is small, and the present disclosure can ensure that the contact area between the first light-emitting functional layer 14 and the first electrode 12 is large, and thus the light-emitting area of the organic light-emitting diode is large.
- the length of the first opening 1301 is less than or equal to the length of the second opening 1302.
- the length directions of the first opening 1301 and the second opening 1302 are, for example, the length direction of the display panel 1.
- the length direction of the display panel 1 is from left to right or from right to left, referring to FIGS. 1A to 1G, for example.
- the length of the first opening 1301 is equal to the length of the second opening 1302, and it is convenient to form the first opening 1301 and the second opening 1302 at this time.
- the length of the first opening 1301 is less than the length of the second opening 1302, so that the side wall of the first hollow portion 130 is inclined, which is convenient for the first light-emitting function layer 14 prepared subsequently to be attached to the first hollow On the sidewall of the portion 130, it is further ensured that the first light-emitting function layer 14 completely covers at least part of the first electrode 12 exposed by the first opening 1301.
- the maximum size of the first hollow portion 130 is the maximum distance between any two points on the boundary of the orthographic projection of the first hollow portion 130 on the substrate 11, and the maximum size of the second hollow portion 140 is the first hollow portion. The maximum distance between any two points on the boundary of the orthographic projection of the two hollow portions 140 on the substrate 11.
- the maximum size of the first hollow portion 130 is, for example, the maximum length
- the maximum size of the second hollow portion 140 is, for example, the maximum length. The following analyzes the factors affecting the length of the first hollow portion 130 and the second hollow portion 140:
- the length of the second hollow portion 140 is related to the length of the sacrificial pattern 18 and the spacer 17.
- the length of the second hollow portion 140 is equal to the length of the sacrificial pattern 18.
- the length of the second hollow portion 140 is equal to the length of the side surface of the spacer 17 away from the substrate 11. Therefore, adjusting the length of the second hollow portion 140 can be achieved by changing the length of the sacrificial pattern 18 and/or the side surface of the spacer 17 away from the substrate 11.
- the maximum size (for example, its length) of the second hollow portion 140 and the maximum size (for example, its length) of the first hollow portion 130 have the following relationship:
- the length of the second hollow part 140 is smaller than the length of the first hollow part 130.
- the length of the second hollow portion 140 is equal to the length of the first hollow portion 130.
- the length of the second hollow portion 140 is greater than the length of the first hollow portion 130.
- the overall size of the second hollow portion 140 is smaller, which facilitates the formation of the second hollow portion 140 on the first light-emitting function layer 14, and As a result, there is a gap between the second hollow portion 140 and the second opening 1302.
- the display panel 1 further includes: a second electrode 15 disposed on a side of the first light-emitting function layer 14 away from the substrate 11, and the second electrode 15 covers the second hollow portion 140.
- the second electrode 15 covers the second hollow part 140, that is, the material used to form the second electrode 15 is filled in the second hollow part 140.
- the material of the second electrode 15 is, for example, silver, and the second electrode 15 is, for example, a semi-transparent electrode, so that the light generated by the organic light emitting diode passes through the second electrode 15 and exits.
- the first electrode 12 is, for example, an anode
- the second electrode 15 is, for example, a cathode.
- the organic light-emitting diode includes a first electrode 12, a second electrode 15, and a part of the first light-emitting function layer 14 between the first electrode 12 and the second electrode 15.
- the organic light-emitting diode may also It is called a light-emitting device D, and the light-emitting device D is used to provide a light source for the display panel 1.
- the display panel 1 further includes an encapsulation layer 111, and the encapsulation layer 111 includes a first inorganic encapsulation sublayer 1111, an organic encapsulation sublayer 1113, and a second inorganic encapsulation layer stacked along the thickness direction of the substrate 11.
- the material of the first inorganic encapsulation sublayer 1111 and the second inorganic encapsulation sublayer 1112 is, for example, at least one of silicon nitride and silicon oxide.
- magnetron sputtering may be used for forming the first inorganic encapsulation sublayer 1111 and the second inorganic encapsulation sublayer 1112 .
- the organic encapsulation sub-layer 1113 is formed by inkjet printing.
- the spacer 17 is no longer present on the display panel 1, so when the organic encapsulation sub-layer is formed
- the fluidity of the material used to make the organic encapsulation sublayer 1113 is better, so that the film quality and thickness of the organic encapsulation sublayer 1113 are better.
- an embodiment of the present disclosure provides a pixel driving circuit 3, the pixel driving circuit 3 includes: a reset sub-circuit 31, a data writing sub-circuit 32, a driving sub-circuit 33, and a light-emitting control sub-circuit 34.
- the reset sub-circuit 31 is electrically connected to the reset signal terminal Reset, the initialization signal terminal Vint, the node N and the first pole of the light emitting device D. In other embodiments, the reset sub-circuit 31 may also be electrically connected to the gate drive signal terminal Gate.
- the reset sub-circuit 31 is configured to transmit the initialization signal provided by the initialization signal terminal Vint to the node N under the control of the reset signal terminal Reset, and reset the node N; it is also configured to reset or the gate drive signal terminal at the reset signal terminal. Under the control of the gate, the initialization signal provided by the initialization signal terminal Vint is transmitted to the first pole of the light-emitting device D, and the first pole of the light-emitting device D is reset.
- the data writing sub-circuit 32 is electrically connected to the data signal terminal Data, the gate driving signal terminal Gate, and the driving sub-circuit 33.
- the data writing sub-circuit 32 is configured to write the data signal provided by the data signal terminal Data into the driving sub-circuit 33 under the control of the gate driving signal terminal Gate.
- the driving sub-circuit 33 is electrically connected to the gate driving signal terminal Gate, the node N, and the first power supply voltage signal terminal VDD.
- the driving sub-circuit 33 is configured to, under the control of the gate driving signal, write the data signal and the threshold voltage of the driving transistor to the first node to charge the capacitor C; and to control the first power supply voltage signal terminal VDD and the node N Next, a drive signal is output to the light emitting device D, and the drive signal is, for example, a drive current signal.
- the light emitting control sub-circuit 34 is electrically connected to the first power supply voltage signal terminal VDD, the light emitting control signal terminal EM, the driving sub-circuit 33 and the first pole of the light emitting device D.
- the light emission control sub-circuit 34 is configured to electrically connect the first electrode of the driving transistor to the first power supply voltage signal terminal VDD, and the second electrode of the driving transistor to the light emitting device D under the control of the light emitting control signal terminal EM.
- the aforementioned pixel driving circuit 3 may be, for example, a 7T1C type pixel driving circuit.
- the 7T1C type pixel driving circuit includes, for example, a first transistor T1, a second transistor T2, a third transistor T3, a fourth transistor T4, a fifth transistor T5, a sixth transistor T6, a seventh transistor T7, and a capacitor C; wherein the third transistor T3 is the driving transistor.
- Some or all of the first transistor T1 to the seventh transistor T7 may be, for example, P-type thin film transistors.
- the first electrode of the thin film transistor is, for example, the source electrode
- the second electrode is, for example, the drain electrode
- the gate of the first transistor T1 is electrically connected to the reset signal terminal Reset, the first electrode is electrically connected to the initialization signal terminal Vint, and the second electrode is electrically connected to the node N.
- the gate of the second transistor T2 is electrically connected to the gate drive signal terminal Gate, the first electrode is electrically connected to the second electrode of the third transistor T3, and the second electrode is electrically connected to the node N.
- the second transistor T2 is a compensation transistor, which enables the sum of the threshold voltage and the data signal of the third transistor T3 to be written to the node N.
- the gate of the third transistor T3 is electrically connected to the node N, and the first electrode is electrically connected to the second electrode of the fourth transistor T4.
- the gate of the fourth transistor T4 is electrically connected to the gate driving signal terminal Gate, and the first electrode is electrically connected to the data signal terminal Data.
- the gate of the fifth transistor T5 is electrically connected to the light emission control signal terminal EM, the first electrode is electrically connected to the first power supply voltage signal terminal VDD, and the second electrode is electrically connected to the first electrode of the third transistor T3.
- the gate of the sixth transistor T6 is electrically connected to the light emission control signal terminal EM, the first electrode is electrically connected to the second electrode of the third transistor T3, and the second electrode is electrically connected to the first electrode of the light emitting device D.
- the gate of the seventh transistor T7 is electrically connected to the gate driving signal terminal Gate, the first electrode is electrically connected to the initialization signal terminal Vint, and the second electrode is electrically connected to the first electrode of the light emitting device D.
- the gate of the seventh transistor T7 may also be electrically connected to the reset signal terminal Reset, so as to control the working state of the seventh transistor T7 through the reset signal.
- One end of the capacitor C is electrically connected to the node N, and the other end is electrically connected to the first power supply voltage signal terminal VDD.
- one end of the capacitor C is its first plate C 1 , and the other end is its second plate C 2 .
- the second pole of the light emitting device D is electrically connected to the second power supply voltage signal terminal VSS.
- the first power supply voltage signal terminal VDD is electrically connected to the first electrode 12 in the display panel 1
- the second power supply voltage signal terminal VSS is electrically connected to the second electrode 15 in the display panel 1, for example.
- the working phases of the pixel driving circuit 3 include, for example, a reset phase D1, a data writing phase D2, and a light emitting phase D3.
- the first transistor T1 is turned on, and the initial signal provided by the initialization signal terminal Vint is transmitted to the node N, and the node N is reset.
- the gate of the seventh transistor T7 When the gate of the seventh transistor T7 is electrically connected to the reset signal terminal Reset: under the control of the reset signal terminal Reset, the seventh transistor T7 is turned on, and the initial signal provided by the initialization signal terminal Vint is transmitted to the first light emitting device D. The first pole of the light-emitting device D is reset.
- the fourth transistor T4 and the second transistor T2 are turned on, and the data signal provided by the data signal terminal Data and the threshold voltage of the third transistor T3 are written into the node N.
- the seventh transistor T7 When the gate of the seventh transistor T7 is electrically connected to the gate drive signal terminal Gate: under the control of the gate drive signal terminal Gate, the seventh transistor T7 is turned on to transmit the initialization signal provided by the initialization signal terminal Vint To the first pole of the light emitting device D, the first pole of the light emitting device D is reset.
- the fifth transistor T5 and the sixth transistor T6 are turned on; wherein, the fifth transistor T5 makes the first electrode of the third transistor T3 and the first power supply voltage signal terminal VDD electrically connected.
- the sixth transistor T6 electrically connects the second pole of the third transistor T3 with the first pole of the light emitting device D, so that the third transistor T3 can drive the light emitting device D to emit light.
- the gate of the seventh transistor T7 is electrically connected to the gate drive signal terminal Gate or the reset signal terminal Reset, when the seventh transistor T7 is turned on, it can be used for the light emitting device.
- the first pole of D is reset.
- the gate drive signal is valid only in the data writing stage D2, so that the reset process of the light emitting device D is in the data writing stage In D2
- the reset signal is an effective signal in the reset phase D1, so that the reset process of the light-emitting device D is in the reset phase D1, but the two This embodiment does not affect the function of the reset sub-circuit 31. Therefore, the seventh transistor T7 is included in the reset sub-circuit 31 in the embodiment of the present disclosure.
- each thin film transistor (the first transistor T1 to the seventh transistor T7) in the pixel driving circuit 3 in the display panel 1 can be referred to FIG. 7A; wherein, the gate of the seventh transistor T7 is electrically connected to the reset signal terminal Reset. connect.
- the first electrode of the third transistor T3 in the pixel driving circuit 3 is electrically connected to the first electrode 12, and the first hollow portion 130 exposes at least a part of the first electrode 12.
- the gate layer of the third transistor T3 serves as the first electrode plate C 1 of the capacitor C, and the second electrode plate C 2 of the capacitor C and the first electrode plate C 1 are arranged opposite to each other along the thickness direction of the substrate 11.
- the second plate C 2 of the capacitor C has the same layer and the same material as the initialization signal line Vint.
- the first transistor T1 and the second transistor T2 may also be double-gate thin film transistors, and the two gate layers of the double-gate thin film transistor are of the same layer and the same material.
- the display panel 1 includes a first metal layer 191, a buffer layer 192, an active layer 193, a first gate insulating layer 194, and a gate metal layer that are sequentially away from the substrate 11 195, the second gate insulating layer 196, the second metal layer 197, the interlayer insulating layer 198, the third metal layer 199, and the planarization layer 16.
- the buffer layer 192, the first gate insulating layer 194, the second gate insulating layer 196, and the interlayer insulating layer 198 are all insulating layers, which play an insulating role.
- the material of these insulating layers is, for example, silicon oxide and silicon nitride. At least one.
- the active layer 193, the first gate insulating layer 194, the gate layer, the second gate insulating layer 196, the interlayer insulating layer 198, the source electrode and the drain electrode constitute a thin film transistor.
- the thin film transistor may further include a buffer layer 192.
- the planarization layer 16 has a planarization effect, and its material is, for example, an organic material, such as at least one of photoresist and resin.
- the first metal layer 191 may serve as a light shielding layer and a second gate layer of the thin film transistor T7 of the first transistors T1 to T7.
- the material of the first metal layer 191 is, for example, a metal or alloy such as silver and aluminum.
- the first metal layer 191 is used as a light shielding layer, the leakage current of the first transistors T1 to T7 thin film transistor T7 can be reduced; when the first metal layer 191 is used as the second gate layer, it needs to be electrically connected to a compensation voltage terminal
- the compensation voltage terminal can provide a compensation voltage signal, and the compensation voltage signal is used to compensate the threshold voltage of the thin film transistor.
- each of the first transistor T1 to the seventh transistor T7 includes at least two gate layers arranged opposite to each other along the thickness direction of the substrate 11; For any thin film transistor of the first transistor T1 and the second transistor T2 of the two gate layers, there are three gate layers.
- the threshold voltage Vth of the thin film transistor deviates from the preset value due to the influence of the process of making each film layer in the thin film transistor, the deviation of the threshold voltage Vth can be compensated by the compensation voltage signal provided by the compensation voltage terminal.
- the threshold voltage Vth of the thin film transistor is less than 0, and the compensation voltage signal provided by the compensation voltage terminal is greater than 0.
- the compensation voltage signal provided by the compensation voltage terminal increases, the thin film transistor's The threshold voltage Vth decreases. Therefore, when the threshold voltage Vth is too large due to process reasons, compensation can be performed by increasing the compensation voltage signal provided by the compensation voltage terminal, so that the too large threshold voltage Vth is reduced to a preset value.
- the threshold voltage Vth of the thin film transistor is preset to -3.0V.
- the threshold voltage can be increased by increasing the compensation voltage signal provided by the compensation voltage terminal.
- Vth is reduced from -2.5V to -3.0V, so as to realize the function of compensating the threshold voltage of the thin film transistor.
- the gate metal layer 195 is used to form the gate layer of the thin film transistor, the gate line Gate, the reset signal line Vint, and the light emission control signal line EM; wherein, the gate layer of the driving transistor can also be used as the first plate C 1 of the capacitor C .
- the material of the gate metal layer 195 is, for example, metals or alloys such as silver, aluminum, and molybdenum.
- the gate line Gate is electrically connected to the gate drive signal terminal Gate, and is used to provide the gate drive signal for the gate drive signal terminal Gate;
- the reset signal line Reset is electrically connected to the reset signal terminal Reset, and is used to provide the reset signal terminal Reset.
- the light-emission control signal line EM is electrically connected to the light-emission control signal terminal EM, and is used to provide the light-emission control signal to the light-emission control signal terminal EM.
- the second metal layer 197 is used to form the initialization signal line Vint and the second plate C 2 of the capacitor C.
- the material of the second metal layer 197 is, for example, metals or alloys such as silver, aluminum, and molybdenum.
- the third metal layer 199 is used to form the source and drain of the thin film transistor, the data signal line Data, the first power supply voltage signal line VDD, the compensation voltage signal line, and the connection electrode.
- the data signal line Data is electrically connected to the data signal terminal Data, and is used to provide data signals for the data signal terminal Data
- the first power supply voltage signal line VDD is electrically connected to the first power supply voltage signal terminal VDD, and is used to provide the first power supply voltage
- the signal terminal VDD provides the first power supply voltage signal
- the compensation voltage signal line is electrically connected to the compensation voltage signal terminal, and is used to provide the compensation voltage signal to the compensation voltage signal terminal
- the connection electrode is used to make the film layer (such as the first metal The layer 191 and the third metal layer 199) are electrically connected.
- the material of the second metal layer 197 is, for example, metals or alloys such as silver, aluminum, and molybdenum.
- FIG. 7C which is a structural diagram of the first metal layer 191
- a through hole 1910 is provided on the first metal layer 191.
- the through hole 1910 is used, for example, to electrically connect the first metal layer 191 to the compensation voltage signal line. , That is, the first metal layer 191 is electrically connected to a compensation voltage terminal.
- the magnitude of the voltage provided by the compensation voltage signal line is equal to the first power supply voltage signal provided by the first power supply voltage signal line VDD.
- the first power supply voltage signal line VDD is also a compensation voltage signal line, that is, the first power supply voltage signal line VDD is multiplexed as a compensation voltage signal line.
- the voltage provided by the compensation voltage signal line is different from the first power supply voltage signal provided by the first power supply voltage signal line VDD, and the compensation voltage signal line and the first power supply voltage signal line VDD are two in the same layer. Signal wires of the same material.
- the compensation voltage signal provided by the compensation voltage signal line is a fixed value, for example, equal to the magnitude of the power supply voltage signal; in different display panels 1, due to the influence of the process, the film in the different display panels 1
- the threshold voltage of the transistor may deviate from the preset value in different degrees, so the magnitude of the compensation voltage signal provided by the compensation voltage terminal in different display panels 1 may be different.
- the thin film transistors in the pixel driving circuit are, for example, P-type transistors
- the first power supply voltage signal terminal VDD provides, for example, a high-level fixed voltage, so that the thin film transistors work more stably, and the thin film transistors
- the interaction between the middle active layer and the first metal layer 191 adjusts the threshold voltage of the thin film transistor.
- the material of the active layer 193 is, for example, polysilicon (P-si).
- FIG. 7E it is a structural diagram of the gate metal layer 195, in which the gate layer of the driving transistor (the third transistor T3) also serves as the first plate C 1 of the capacitor C.
- FIG. 7F it is a structural diagram of the second metal layer 197, in which a through hole 1910 is provided on the second plate C 2 of the capacitor C, and the through hole 1910 is used to make the capacitor C and the third metal layer 199 realizes electrical connection.
- FIG. 7G it is a structural diagram of the third metal layer 199, in which the first power supply voltage signal line VDD and the through hole 1910 provided on the connecting electrode 1990 are used to implement various thin film transistors and signal lines (for example, including data signal lines).
- Line Data the first power supply voltage signal line VDD, the light emission control signal line EM, the gate line Gate, the initialization signal line Vint, etc.
- the overlapping portions of the data signal line Data and the first power supply voltage signal line VDD with the thin film transistor serve as the source and drain of the thin film transistor.
- the display panel 1 further includes a barrier layer 110 disposed on the substrate 11, and the barrier layer 110 is used to isolate the substrate 11 from the thin film transistor to avoid the influence of substances in the substrate 11.
- the active layer 193 in a thin film transistor is used to isolate the substrate 11 from the thin film transistor to avoid the influence of substances in the substrate 11.
- the overall structure of the display panel 1 is, for example, refer to FIG. 7H.
- an embodiment of the present disclosure further provides a display substrate 1 ′, including a substrate 11.
- the first electrode 12 is arranged on one side of the substrate 11.
- the pixel defining layer 13 is disposed on one side of the substrate 11 and includes a first hollow portion 130.
- the first hollow portion 130 includes a first opening 1301 and a second opening 1302 disposed oppositely; compared to the second opening 1302, the first hollow The opening 1301 is closer to the substrate 11, wherein the first opening 1301 exposes at least part of the first electrode 12.
- the substrate 11 For the explanation of the substrate 11, the first electrode 12 and the pixel defining layer 13, reference can be made to the explanation of the substrate 11, the first electrode 12 and the pixel defining layer 13 in the display panel 1, and therefore will not be repeated.
- the sacrificial pattern 18 is disposed on a side of the pixel defining layer 13 away from the substrate 11, and the orthographic projection of the sacrificial pattern 18 on the pixel defining layer 13 does not overlap with the first opening 1301.
- the material of the sacrificial pattern 18 is, for example, an organic material, or, for example, an organic material containing a fluorine element.
- the material of the sacrificial pattern 18 is, for example, a metal material, such as metals or alloys such as silver (Ag), aluminum (Al), molybdenum (Mo), and titanium (Ti).
- a metal material such as metals or alloys such as silver (Ag), aluminum (Al), molybdenum (Mo), and titanium (Ti).
- the selected material of the sacrificial pattern 18 corresponds to the peeling liquid phase, for example, and different materials correspond to different peeling liquids.
- the selected peeling liquid can dissolve the sacrificial pattern 18, but cannot react with other film layers in the display substrate 1'.
- the sacrificial pattern 18 of the metal material can be an acidic or alkaline stripping liquid
- the sacrificial pattern 18 of the negative photoresist material can be, for example, hydrofluoroethers as the stripping liquid.
- the orthographic projection of the sacrificial pattern 18 on the pixel defining layer 13 does not overlap with the first opening 1301, including: referring to FIGS. 8E and 8I, the orthographic projection of the sacrificial pattern 18 on the pixel defining layer 13 coincides with one side of the first opening 1301 , And referring to FIGS. 8A to 8D and 8F to 8H, there is a gap between the orthographic projection of the sacrificial pattern 18 on the pixel defining layer 13 and the first opening 1301.
- the orthographic projection of the sacrificial pattern 18 on the pixel defining layer 13 does not overlap with the first opening 1301, and is used to prevent the material (such as luminescent material) used to form the second light-emitting functional layer 24 from being blocked by the sacrificial pattern 18 from being completely covered At least part of the first electrode 12 is located in the first opening 1301.
- the spacer 17 is disposed on a side of the sacrificial pattern 18 away from the substrate 11, and the orthographic projection of the spacer 17 on the pixel defining layer 13 does not overlap with the first opening 1301.
- the second light-emitting function layer 24 is disposed on the side of the pixel defining layer 13 and the first electrode 12 away from the substrate 11.
- the material of the spacer 17 is, for example, an organic material, or a photosensitive organic material, such as photoresist. In some embodiments, the material of the spacer 17 is a negative photoresist.
- the spacer 17 includes a first surface and a second surface disposed opposite to each other along the thickness direction of the substrate 11. Compared with the second surface, the first surface is closer to the substrate 11;
- the orthographic projection on the defining layer 13 falls within the orthographic projection of the second surface on the pixel defining layer 13, and the boundary between the orthographic projection of the first surface on the pixel defining layer 13 and the orthographic projection of the second surface on the pixel defining layer 13 There are gaps between the projected boundaries.
- the center point of the orthographic projection of the first surface on the pixel defining layer 13 and the center point of the orthographic projection of the second surface on the pixel defining layer 13 coincide.
- the orthographic projection of the first surface on the pixel defining layer 13 falls within the orthographic projection of the second surface on the pixel defining layer 13, indicating that the area of the first surface is smaller than the area of the second surface.
- the first surface is, for example, a lower surface (a side surface close to the substrate 11 in the thickness direction of the substrate 11), and the second surface is, for example, an upper surface (a side surface away from the substrate 11 in the thickness direction of the substrate 11).
- the longitudinal cross-sectional shape of the spacer 17 is, for example, an inverted trapezoid, and the length of the bottom side of the inverted trapezoid is smaller than the length of the top side.
- the three-dimensional structure of the spacer 17 is, for example, a pyramid, the upper surface and the lower surface (opposite to the upper surface) of the pyramid, for example, are rectangular, and the upper surface The area of the rectangle is larger than the area of the bottom rectangle; or the three-dimensional structure of the spacer 17 can also be a circular truncated cone.
- the upper and lower surfaces of the circular truncated cone can be round or oval, and the upper surface area is larger than The area of the lower surface.
- the spacer 17 having an inverted trapezoidal longitudinal section can be formed through a patterning process (for example, including exposure, development, and etching).
- the longitudinal cross-sectional shape of the spacer 17 may also be a "T" shape.
- the T-shaped spacer 17 can be formed according to the principle that the same peeling liquid has different etching rates for different metals.
- the height of the spacer 17 is, for example, 0.5 ⁇ m to 3 ⁇ m.
- the second light-emitting function layer 24 that is subsequently vapor-deposited on the pixel defining layer 13 and the first electrode 12 can be sacrificed on the side wall of the spacer 17
- the sidewalls of the pattern 18 are broken, that is, the second light-emitting function layer 24 cannot completely cover the sidewalls of the spacer 17 and the sidewalls of the sacrificial pattern 18. For example, referring to FIG.
- the second light-emitting functional layer 24 covers part of the sidewalls of the sacrificial pattern 18, the remaining part of the sidewalls of the sacrificial pattern 18 is exposed, and the second light-emitting functional layer 24 also covers the upper surface of the spacer 17. , The side wall of the spacer 17 is exposed.
- the second light-emitting function layer 24 covers a part of the upper surface of the spacer 17, and the side walls of the sacrificial pattern 18 and the side walls of the spacer 17 are exposed.
- Exposure of the sidewalls of the sacrificial pattern 18 can facilitate the stripping liquid to enter the sacrificial pattern 18 to quickly dissolve the sacrificial pattern 18, and the sidewalls of the spacers 17 are exposed to facilitate subsequent removal of the spacers 17.
- the peeling liquid can also penetrate the second The light-emitting function layer 24 enters the sacrificial pattern 18, thereby dissolving the sacrificial pattern; and when the sacrificial pattern 18 is dissolved, because the thickness of the second light-emitting function layer 24 is small, the stress in the film layer is not enough to block the spacer 17 and separate The cushion 17 can still fall off from the display substrate 1'.
- the orthographic projection of the spacer 17 on the pixel defining layer 13 does not overlap with the first opening 1301, including: referring to FIGS. 8D and 8E, the orthographic projection of the spacer 17 on the pixel defining layer 13 is close to an area of the first opening 1301. The side coincides with the edge of the first opening 1301, and referring to FIGS. 8A to 8C and FIGS. 8F to 8I, there is a gap between the orthographic projection of the spacer 17 on the pixel defining layer 13 and the first opening 1301.
- the orthographic projection of the spacer 17 on the pixel defining layer 13 does not overlap with the first opening 1301, which can ensure that when the second light-emitting functional layer 24 is subsequently evaporated, the second light-emitting functional layer 24 can completely cover the first opening 1301 At least part of the first electrode 12 in the middle, so as to ensure that the contact area between the second light-emitting function layer 24 and the first electrode 12 is relatively large.
- the spacer 17 is located on the sacrificial pattern 18, wherein the first surface (lower surface) of the spacer 17 is in contact with the upper surface of the sacrificial pattern 18, and the length of the first surface of the spacer 17 is less than or equal to the length of the sacrificial pattern 18
- the width of the first surface of the spacer 17 is less than or equal to the width of the sacrificial pattern 18, so as to ensure that the spacer 17 can be separated from the display substrate 1'after the sacrificial pattern 18 is removed.
- the second light-emitting function layer 24 covers the pixel defining layer 13, the first electrode 12, and the spacer 17, wherein the second light-emitting function
- the layer 24 completely covers the side surface (the second surface) of the spacer 17 away from the substrate 11.
- the second light-emitting function layer 24 covers the pixel defining layer 13, the first electrode 12 and the spacer 17, wherein the second light-emitting function layer 24 covers the spacer 17 away from the substrate 11 The part of one side surface (second surface).
- the second light-emitting function layer 24 covers the pixel defining layer 13 and the first electrode 12, and the second light-emitting function layer 24 does not cover the side surface (the second surface) of the spacer 17 away from the substrate 11.
- the second light-emitting function layer 24 described above covers the second surface of the spacer 17, that is, whether there is a material for forming the second light-emitting function layer 24 on the second surface of the spacer 17, and the second light-emitting function layer 24 is vapor-deposited
- the FMM used at this time is related to the shadow generated by the evaporation opening corresponding to each sub-pixel.
- the material for forming the second light-emitting function layer 24 will be present on the second surface of the spacer 17, and when the vapor deposition opening is generated When the Shadow of ⁇ does not extend to the second surface of the spacer 17, the second surface of the spacer 17 will not have any material for forming the second light-emitting functional layer 24.
- the second light-emitting functional layer 24 For the introduction of the material and internal layer structure of the second light-emitting functional layer 24 (ie, the layers included in the second light-emitting functional layer 24, such as the light-emitting layer), reference may be made to the introduction of the first light-emitting functional layer 14. After the sacrificial pattern 18 and the spacer 17 are removed, the second light-emitting function layer 24 becomes the first light-emitting function layer 14. After the sacrificial pattern 18 and the spacer 17 are removed, the structure of the second light-emitting function layer 24 may or may not be changed. For example, referring to FIG. 8A, the second light-emitting function layer 24 covers the second surface of the spacer 17.
- the second light-emitting function layer 24 does not cover the second surface of the spacer 17. After the sacrificial pattern 18 and the spacer 17 are removed, the structure of the second light-emitting function layer 24 does not change.
- the second light-emitting functional layer 24 is changed after the sacrificial pattern 18 and the spacer 17 are removed, the light-emitting function between the sacrificial pattern 18 and the spacer 17 will not be removed.
- the layer is referred to as the second light-emitting functional layer 24, and the light-emitting functional layer after removing the sacrificial pattern 18 and the spacers 17 is referred to as the first light-emitting functional layer 14.
- the display substrate 1'of the present disclosure is provided with sacrificial patterns 18 and spacers 17, wherein the spacers 17 are used to support the FMM used when the second light-emitting function layer 24 is evaporated, and the second light-emitting function layer is formed.
- the sacrificial pattern 18 is removed, so that the spacer 17 is separated from the display substrate 1'.
- the structure of the display substrate 1'after removing the sacrificial pattern 18 and the spacers 17 is the same as the structure of the display panel 1 described above, so for the advantages of the display substrate 1'after removing the sacrificial pattern 18 and the spacers 17, please refer to The foregoing description in the display panel 1 will not be repeated here.
- the maximum size of the second surface in the spacer 17 is smaller than the maximum size of the first hollow portion 130.
- the maximum size of the first hollow portion 130 may be the maximum size of the first opening 1301 or the maximum size of the second opening 1302. For example, if the maximum size of the second opening 1302 is greater than the maximum size of the first opening 1301, the maximum size of the second surface in the spacer 17 is smaller than the maximum size of the first hollow part 130, that is, the second in the spacer 17 The maximum size of the surface is smaller than the maximum size of the second opening 1302.
- the maximum size of the second surface of the spacer 17 is the maximum distance between any two points on the boundary of the second surface of the spacer 17, and the maximum size of the second opening 1302 is between any two points on the boundary of the second opening 1302 The maximum distance.
- the second surface of the spacer 17 and the second opening 1302 are both rectangular, the maximum size of the second surface of the spacer 17 is the length of the diagonal, and the maximum size of the second opening 1302 is The length of the diagonal.
- the second surface of the spacer 17 is, for example, a rectangle, and the second opening 1302 is, for example, a hexagon.
- the size of the spacer 17 is also at the sub-pixel level. Therefore, the size of the spacer 17 can be made smaller, which facilitates the subsequent removal of the spacer 17 by removing the sacrificial pattern 18.
- the second light-emitting functional layer 24 can cover the gap, thereby ensuring that the second light-emitting functional layer 24 can completely cover the first opening 1302. At least part of the first electrode 12 exposed by the opening 1301. The larger the contact area between the second light-emitting function layer 24 and the first electrode 12, the larger the light-emitting area of the light-emitting diode.
- the length of the first opening 1301 is smaller than the length of the second opening 1302.
- the length of the first opening 1301 is smaller than the length of the second opening 1302, which can make the sidewall of the first hollow portion 130 bevel, thereby causing the pixel defining layer 13 to form an obtuse angle ⁇ .
- the thickness of the sacrificial pattern 18 is greater than the thickness of the second light-emitting function layer 24.
- the thickness of the sacrificial pattern 18 is, for example, 0.1 ⁇ m to 2 ⁇ m.
- the thickness of the sacrificial pattern 18 is greater than the thickness of the second light-emitting functional layer 24, the sidewalls of the sacrificial pattern 18 (along its thickness direction) are not covered by the second light-emitting functional layer 24, thereby facilitating the increase of the sacrificial pattern 18
- the area in contact with the stripping liquid in turn reduces the time required to remove the sacrificial pattern 18.
- the display substrate 1'further includes a thin film transistor, which is disposed between the substrate 11 and the first electrode 12, and the source or drain of the thin film transistor is connected to the first electrode 12. Electric connection.
- the structure of the thin film transistor included in the display substrate 1 ′ is the same as the structure of the thin film transistor included in the display panel 1, and therefore, the explanation of the thin film transistor in the display panel 1 can be referred to above.
- the top view of the sacrificial pattern 18 and the spacer 17 is, for example, a rectangle, and the top view of the first hollow portion 130 is, for example, a hexagon.
- the display substrate 1 ′ further includes a substrate 10 disposed on the side of the substrate 11 away from the thin film transistor.
- the substrate 10 is, for example, a glass substrate.
- the substrate 11 is formed on the substrate 10.
- the overall structure of the display substrate 1' is, for example, refer to FIG. 9D.
- the display substrate 1' has the same beneficial effects as the display panel 1, so it will not be repeated.
- an embodiment of the present disclosure also provides a method for preparing a display substrate 1', including:
- a first electrode 12 is formed on the substrate 11.
- the material of the first electrode 12 is, for example, ITO.
- ITO indium gallium oxide
- a pixel defining layer 13 is formed on the substrate 11 on which the first electrode 12 is formed; the pixel defining layer 13 includes a first hollow portion 130, and the first hollow portion 130 includes a first opening 1301 and The second opening 1302 is closer to the substrate 11 than the second opening 1302, wherein the first opening 1301 exposes at least part of the first electrode 12.
- An organic thin film is formed on the first electrode 12, and the first hollow portion 130 is formed through a patterning process, thereby forming the pixel defining layer 13.
- the material of the organic film is, for example, polyimide.
- a stacked sacrificial pattern 18 and spacers 17 are formed on the pixel defining layer 13, and the sacrificial pattern 18 is closer to the substrate 11 than the spacers 17.
- both the sacrificial patterns 18 and the spacers 17 are multiple, and the sizes of the sacrificial patterns 18 and the spacers 17 are both small.
- the maximum sizes of the sacrificial patterns 18 and the spacers 17 are both smaller than the first The maximum size of a hollow portion 130. In this structure, since the size of the spacer 17 is small, it is easier to detach from the display substrate 1'.
- both the sacrificial patterns 18 and the spacers 17 are multiple, and the sizes of the sacrificial patterns 18 and the spacers 17 are both larger.
- the maximum sizes of the sacrificial patterns 18 and the spacers 17 are both larger than The maximum size of the first hollow portion 130. In this structure, it is convenient to make the sacrificial pattern 18 and the spacer 17 through the process of drawing.
- both the sacrificial pattern 18 and the spacer 17 are one, and the sizes of the sacrificial pattern 18 and the spacer 17 are both larger.
- the maximum sizes of the sacrificial pattern 18 and the spacer 17 are both larger than the first The maximum size of a hollow portion 130.
- the spacer 17 has better support stability for the FMM.
- the substrate 11 on which the spacers 17 are formed and the mask plate 2 are placed opposite to each other.
- the light-emitting functional material is vapor-deposited on the side where the spacer 17 is provided to form the second light-emitting functional layer 24.
- the spacer 17 plays a role of supporting the mask plate 2.
- the mask plate 2 is, for example, an FMM.
- a plurality of evaporation openings 20 corresponding to the first hollow portion 130 are provided on the mask plate 2 to emit light.
- the functional material is vapor-deposited on the first electrode 12 and the pixel defining layer 13 through the vapor deposition opening 20 to form the second light-emitting functional layer 24.
- the light-emitting functional material includes all the materials used to form each film layer in the second light-emitting functional layer 24, for example, the organic electroluminescent material that forms the light-emitting layer and the material that forms the electron transport layer.
- the material of the electron transport layer is, for example, Including materials such as cesium, lithium and silicon monoxide.
- the structure of the second hollow portion 140 formed after the sacrificial pattern 18 and the spacer 17 are removed will be affected.
- the length of the sacrificial pattern 18 is smaller than the width of the display substrate 1'.
- the structure of the second hollow portion 140 is similar to the structure of the sacrificial pattern 18 The same or substantially the same, therefore, the first light-emitting function layer 14 formed by the second light-emitting function layer 24 is connected as a whole, and the second hollow portions 140 are arranged on the first light-emitting function layer 14 at intervals.
- the first light-emitting function layer 14 formed by the second light-emitting function layer 24 is divided into multiple parts. There are two unconnected light-emitting functional patterns, but the gap between adjacent light-emitting functional patterns can still be understood as the second hollow portion 140 in the disclosure.
- the preparation method of the above-mentioned display substrate 1' has the same beneficial effects as the above-mentioned display substrate 1', so it will not be repeated.
- the stacked sacrificial patterns 18 and spacers 17 are formed on the pixel defining layer 13, including:
- the first thin film is formed at a low temperature of 90° C., where the low temperature is beneficial to protect the characteristics of the organic material, thereby forming the quality of the first thin film better.
- the patterning of the sacrificial patterns 18 and spacers 17 during the preparation process of the above-mentioned display substrate 1' is relatively low.
- the stacked sacrificial patterns 18 and spacers 17 are formed on the pixel defining layer 13, including:
- the process of patterning the sacrificial patterns 18 and spacers 17 in the preparation process of the display substrate 1' is relatively simple.
- an embodiment of the present disclosure also provides a method for manufacturing the display panel 1, including:
- the process of forming the first electrode 12 please refer to the process of forming the first electrode 12 in the above-mentioned display substrate 1'.
- a pixel defining layer 13 is formed on the substrate 11 on which the first electrode 12 is formed; the pixel defining layer 13 includes: a first hollow portion 130, and the first hollow portion 130 includes a first opening 1301 and a second opening 1302 disposed oppositely Compared with the second opening 1302, the first opening 1301 is closer to the substrate 11, wherein the first opening 1301 exposes at least part of the first electrode 12.
- a light-emitting functional material is vapor-deposited on one side to form the second light-emitting functional layer 24.
- the process of forming the second light-emitting function layer 24 please refer to the process of forming the second light-emitting function layer 24 in the above-mentioned display substrate 1'.
- the sacrificial pattern 18 is removed, so that the spacer 17 on the side of the sacrificial pattern 18 away from the substrate 11 is separated from the display panel 1 to form the first light-emitting functional layer 14 through the second light-emitting functional layer 24.
- the sacrificial pattern 18 is dissolved by the peeling liquid, so that the spacer 17 falls by itself, so as to achieve the purpose of removing the spacer 17.
- the manufacturing process of the above-mentioned display panel 1 has the same beneficial effects as the above-mentioned display substrate 1', so it will not be repeated here.
- the manufacturing method of the display panel 1 further includes:
- the manufacturing method of the display panel 1 further includes:
- forming the encapsulation layer 111 includes, for example:
- the introduction of the first inorganic encapsulation sublayer 1111, the organic encapsulation layer 111, and the second inorganic encapsulation sublayer 1112 can refer to the above description of the first inorganic encapsulation sublayer 1111, the organic encapsulation layer 111, and the second inorganic encapsulation layer in the display panel 1.
- the introduction of the sub-layer 1112 will not be repeated here.
- the manufacturing method of the display panel 1 before forming the first electrode 12, the manufacturing method of the display panel 1 further includes:
- a substrate 11 is formed on the substrate 10, and the material of the substrate 11 is, for example, polyimide.
- the manufacturing method of the display panel 1 further includes: forming a thin film transistor on the substrate.
- At least an active layer film, a first gate insulating layer 194, a gate metal film, a second gate insulating layer 196, and a third metal film are formed on one side of the substrate 11, and the active layer is formed by a patterning process 193.
- the same reference signs can be understood as signal terminals, and can also be understood as signal lines and signals.
- Data can be understood as both data signal terminals and data signal lines and data signals.
- “same layer” refers to a layer structure formed by using the same film forming process to form a film layer for forming a specific pattern, and then using the same mask plate to form a patterning process.
- the same patterning process may include multiple exposure, development or etching processes, and the specific patterns in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights. Or have different thicknesses.
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Abstract
Description
Claims (19)
- 一种显示面板,包括:衬底;第一电极,设置于所述衬底的一侧;像素界定层,设置于所述衬底的一侧,包括第一镂空部,所述第一镂空部包括相对设置的第一开口和第二开口;相比于所述第二开口,所述第一开口更靠近所述衬底,其中所述第一开口露出所述第一电极的至少部分;第一发光功能层,设置于所述像素界定层和所述第一电极远离所述衬底的一侧,包括第二镂空部,所述第二镂空部在所述像素界定层上的正投影与所述第一开口不重叠。
- 根据权利要求1所述的显示面板,其中,所述第二镂空部在所述像素界定层上的正投影与所述第二开口之间具有间隙。
- 根据权利要求1或2所述的显示面板,其中,所述第二镂空部的最大尺寸小于所述第一镂空部的最大尺寸。
- 根据权利要求1~3任一项所述的显示面板,还包括:第二电极,设置于所述第一发光功能层远离所述衬底的一侧,且所述第二电极覆盖所述第二镂空部。
- 根据权利要求1~4任一项所述的显示面板,还包括:薄膜晶体管,设置于所述衬底与所述第一电极之间,且所述薄膜晶体管的源极或漏极与所述第一电极电连接。
- 根据权利要求5所述的显示面板,所述薄膜晶体管还包括:沿远离衬底一侧方向层叠的有源层、第一栅绝缘层、栅极层、第二栅绝缘层、层间绝缘层;所述薄膜晶体管的源极和漏极设置于所述层间绝缘层远离所述衬底的一侧,且通过贯穿所述层间绝缘层、第二栅绝缘层和第一栅绝缘层的过孔与所述有源层接触。
- 根据权利要求5所述的显示面板,还包括:第一金属层,所述第一金属层设置于所述薄膜晶体管与所述衬底之间,且所述第一金属层与一补偿电压端电连接,所述补偿电压端被配置为提供用于补偿所述薄膜晶体管的阈值电压的补偿电压信号。
- 根据权利要求1~7任一项所述的显示面板,还包括:封装层,所述封装层包括沿远离衬底一侧方向层叠的第一无机封装子层、有机封装子层和第二无机封装子层。
- 一种显示基板,包括:衬底;第一电极,设置于所述衬底的一侧;像素界定层,设置于所述衬底的一侧,包括第一镂空部,所述第一镂空部包括相对设置的第一开口和第二开口;相比于所述第二开口,所述第一开口更靠近所述衬底,其中所述第一开口露出所述第一电极的至少部分;牺牲图案,设置于像素界定层远离所述衬底的一侧,且所述牺牲图案在所述像素界定层上的正投影与所述第一开口不重叠;隔垫物,设置于所述牺牲图案远离所述衬底的一侧,所述隔垫物在所述像素界定层上的正投影与所述第一开口不重叠;第二发光功能层,设置于所述像素界定层和所述第一电极远离所述衬底的一侧。
- 根据权利要求9所述的显示基板,其中,所述隔垫物包括沿远离衬底一侧方向相对设置的第一表面和第二表面,相对于所述第二表面,所述第一表面更靠近所述衬底;其中,所述第一表面在所述像素界定层上的正投影落在所述第二表面在所述像素界定层上的正投影以内,且所述第一表面在所述像素界定层上的正投影的边界与所述第二表面在所述像素界定层上的正投影的边界之间存在间隙。
- 根据权利要求10所述的显示基板,其中,所述第二表面的最大尺寸小于所述第一镂空部的最大尺寸。
- 根据权利要求9~11任一项所述的显示基板,其中,所述隔垫物在所述像素界定层上的正投影与所述第二开口之间具有间隙。
- 根据权利要求9~12任一项所述的显示基板,其中,所述牺牲图案的厚度大于所述第二发光功能层的厚度。
- 根据权利要求9~13任一项所述的显示基板,还包括:薄膜晶体管,设置于所述衬底与所述第一电极之间,且所述薄膜晶体管的源极或漏极与所述第一电极电连接。
- 一种显示装置,包括如权利要求1~8任一项所述的显示面板。
- 一种显示基板的制备方法,包括:在衬底上形成第一电极;在形成有第一电极的衬底上形成像素界定层;所述像素界定层包括:第一镂空部,所述第一镂空部包括相对设置的第一开口和第二开口,相比于所述第二开口,所述第一开口更靠近所述衬底,其中所述第一开口露出所述第一电极的至少部分;在所述像素界定层上形成层叠的牺牲图案和隔垫物,相对于所述隔垫物,所述牺牲图案更靠近所述衬底;将形成有所述隔垫物的衬底与掩膜板相对设置,所述隔垫物与所述掩膜板抵接,透过所述掩膜板向所述衬底设置有所述隔垫物的一侧蒸镀发光功能材料,以形成第二发光功能层。
- 根据权利要求16所述的显示基板的制备方法,其中,在所述像素界定层上形成层叠的牺牲图案和隔垫物,包括:在形成有所述像素界定层的衬底上形成第一薄膜,并将第一薄膜图案化,以形成位于所述像素界定层远离衬底一侧的牺牲图案;在形成有牺牲图案的衬底上形成第二薄膜,并将第二薄膜图案化,以形成位于所述牺牲图案远离所述衬底一侧的隔垫物;或者,在形成有所述像素界定层的衬底上形成第一薄膜;在第一薄膜上形成第二薄膜;同时将第一薄膜和第二薄膜图案化,以形成层叠的牺牲图案和隔垫物。
- 一种显示面板的制备方法,包括:如权利要求16或17所述的显示基板的制备方法;去除所述显示基板中的牺牲图案,以使得所述显示基板中位于所述牺牲图案远离衬底一侧的隔垫物脱离所述显示基板,以通过第二发光功能层形成第一发光功能层。
- 根据权利要求18所述的显示面板的制备方法,还包括:在形成有第一发光功能层的衬底上形成第二电极;在所述第二电极上形成第一无机封装子层;在所述第一无机封装子层上形成有机封装子层;在所述有机封装子层上形成第二无机封装子层,所述第一无机封装子层、所述有机封装子层和所述第二无机封装子层构成封装层。
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CN114730796A (zh) | 2020-09-29 | 2022-07-08 | 京东方科技集团股份有限公司 | 显示面板及显示装置 |
CN115380386A (zh) * | 2021-03-19 | 2022-11-22 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
CN115413369A (zh) * | 2021-03-26 | 2022-11-29 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
CN117133190A (zh) * | 2023-01-18 | 2023-11-28 | 荣耀终端有限公司 | 折叠屏和可折叠电子设备 |
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