WO2021238558A1 - 压电马达及电子装置 - Google Patents
压电马达及电子装置 Download PDFInfo
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- WO2021238558A1 WO2021238558A1 PCT/CN2021/090459 CN2021090459W WO2021238558A1 WO 2021238558 A1 WO2021238558 A1 WO 2021238558A1 CN 2021090459 W CN2021090459 W CN 2021090459W WO 2021238558 A1 WO2021238558 A1 WO 2021238558A1
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- WIPO (PCT)
- Prior art keywords
- reinforcing plate
- circuit board
- piezoelectric
- piezoelectric motor
- groove
- Prior art date
Links
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 69
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000011032 tourmaline Substances 0.000 claims description 2
- 229940070527 tourmaline Drugs 0.000 claims description 2
- 229910052613 tourmaline Inorganic materials 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 238000003754 machining Methods 0.000 abstract description 2
- 229910001294 Reinforcing steel Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 241000220010 Rhode Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000003238 somatosensory effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/18—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing electrical output from mechanical input, e.g. generators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
Definitions
- This application relates to the field of electronic technology, and in particular to a piezoelectric motor and an electronic device.
- a piezoelectric motor is a motor that uses the piezoelectric inverse effect of a piezoelectric body to convert electromechanical energy.
- a piezoelectric motor includes a piezoelectric sheet, a circuit board, and a reinforcing steel plate stacked in sequence, and the piezoelectric sheet can be vibrated by applying an alternating current to the circuit board.
- the inventor found the following problems in the prior art: the piezoelectric sheet is prone to warpage after high-temperature sintering; the thickness of the reinforcing steel plate is small, and there will be a certain internal stress after machining. This will make the reinforcing steel plate prone to uneven stress distribution after assembly, which will cause the reinforcing steel plate to warp away from the piezoelectric sheet; in addition, when the reinforcing steel plate is bonded to the piezoelectric ceramic through an adhesive, After assembly, the orientation and shrinkage of the adhesive will further warp the reinforcing steel plate, which greatly reduces the performance and reliability of the piezoelectric motor, and seriously affects the subsequent bonding and assembly.
- An embodiment of the present application provides a piezoelectric motor, including:
- the circuit board is arranged on one side of the piezoelectric sheet and is electrically connected to the piezoelectric sheet;
- the reinforcing plate is arranged on the side of the circuit board away from the piezoelectric sheet, and the side of the reinforcing plate away from the circuit board is provided with a plurality of grooves, and the plurality of grooves are used to offset the State the internal stress of the reinforcing plate.
- a plurality of grooves are formed on the side of the reinforcing plate away from the circuit board, and the combined structure formed by the plurality of grooves will produce the side of the reinforcing plate away from the circuit board after the grooves are opened. Residual stress, which can offset the internal stress generated by the mechanical processing of the reinforcing plate before assembly, so that the reinforcing plate can be kept flat after assembly.
- An embodiment of the present application also provides an electronic device, including:
- the supporting plate is located on the side of the reinforcing plate away from the circuit board.
- the supporting plate is provided with a supporting portion at a position corresponding to the groove, and the supporting portion is adapted to the groove.
- a plurality of grooves are formed on the side of the reinforcing plate away from the circuit board, and the combined structure formed by the plurality of grooves will generate residual stress on the side of the reinforcing plate away from the circuit board after the grooves are opened.
- the residual stress can offset the internal stress generated by the mechanical processing of the reinforcing plate before assembly, so that the reinforcing plate can be kept flat after assembly.
- Fig. 1 is a schematic structural diagram of a piezoelectric motor provided by an embodiment of the present invention.
- Fig. 2 is a schematic diagram of an assembly structure of a piezoelectric motor and a support plate provided by an embodiment of the present invention.
- the second bonding department 30 The second bonding department 30
- an embodiment of the present application provides a piezoelectric motor 10, which includes a piezoelectric sheet 12, a circuit board 14, and a reinforcing plate 16.
- the piezoelectric sheet 12 has a substantially sheet shape.
- the piezoelectric sheet 12 is made of piezoelectric material. In the energized state, the piezoelectric sheet 12 can be deformed, and in the power-off state, the piezoelectric sheet 12 will deform and recover.
- the piezoelectric sheet 12 is any one of quartz, ceramics, tourmaline, Rhodes's salt, and zinc oxide. In this way, piezoelectric sheets of different materials can be selected to meet different actual needs.
- the piezoelectric sheet 12 in this embodiment is ceramic.
- the circuit board 14 is arranged on one side of the piezoelectric sheet 12 and is electrically connected to the piezoelectric sheet 12 for supporting the piezoelectric sheet 12.
- the circuit board 14 may be a PCB (Printed Circuit Board, printed circuit board), a flexible and rigid combined board, or an FPC (Flexible Printed Circuit, flexible circuit board), where the flexible and rigid combined board includes a laminated PCB And FPC.
- the piezoelectric motor 10 further includes a first adhesive portion 18, the first adhesive portion 18 is provided between the piezoelectric sheet 12 and the circuit board 14, and two opposite sides of the first adhesive portion 18 are respectively adhered The piezoelectric sheet 12 and the circuit board 14 are combined.
- the first adhesive part 18 is a conductive adhesive, for example, an epoxy resin adhesive or a die attach film (Die Attach Film, DAF for short); in this way, the first adhesive part 18 can be The piezoelectric sheet 12 and the circuit board 14 are connected together to ensure electrical conduction between the two.
- the reinforcing plate 16 is fixed on the side of the circuit board 14 away from the piezoelectric sheet 12 and is laminated with the circuit board 14.
- a plurality of grooves 162 are opened on the side of the reinforcing plate 16 away from the circuit board 14, and the plurality of grooves 162 are used to offset the internal stress of the reinforcing plate 16.
- each groove 162 extends along the first direction and penetrates two opposite sides of the reinforcing plate 16 in the first direction, and a plurality of grooves 162 are evenly spaced along the second direction, the first direction and the second direction All are parallel to the side of the reinforcing plate 16 away from the circuit board 14. In this way, after the groove 162 is opened, the residual stress at the groove 162 will be evenly distributed on the side of the reinforcing plate 16 away from the circuit board 14, and the internal stress of the reinforcing plate 16 before assembly can be offset, which can effectively improve The degree of warpage of the reinforcing plate 16.
- first direction, the second direction and the third direction below are perpendicular to each other.
- the first direction is defined as the X-axis direction in this embodiment (not shown), and the second direction is defined as The Y-axis direction in this embodiment and the third direction are defined as the Z-axis direction in this embodiment.
- first direction and the second direction may not be perpendicular, and the angle between the first direction and the second direction can be set according to actual needs.
- the angle between the first direction and the second direction is 50°.
- each groove 162 extends in the first direction, or penetrates one side of the reinforcing plate 16, or two opposite sides of the reinforcing plate 16 do not penetrate, as long as the groove is provided.
- the residual stress generated after the groove 162 can offset the internal stress generated by the mechanical processing of the reinforcing plate 16 before assembly.
- the plurality of grooves 162 may also be arranged at uneven intervals, as long as the residual stress generated after the grooves 162 are opened can offset the internal stress generated by the mechanical processing of the reinforcing plate 16 before assembly. .
- the cross section of the groove 162 in the second direction is any one of a semicircle, a rectangle, a trapezoid, an angle, and a pentagon. In this way, grooves with different cross-sectional shapes can be provided to meet different actual needs.
- the cross section of the groove 162 in the second direction is rectangular.
- the material of the reinforcing plate 16 is any one of copper, steel, aluminum, iron, magnesium aluminum alloy, aluminum alloy, and silver. In this way, reinforcing plates 16 of different materials can be selected to meet different actual needs. In this embodiment, the material of the reinforcing plate 16 is steel.
- the piezoelectric motor 10 satisfies the following relationship:
- L is the length of the reinforcing plate 16 in the second direction
- L1 is the total length of the plurality of grooves 162 in the second direction.
- the strength of the reinforcing plate 16 can be ensured, and the residual stress after the groove 162 is opened can be evenly distributed on the side of the reinforcing plate 16 away from the circuit board 14, and can offset the internal of the reinforcing plate 16 before assembly. stress.
- the residual stress after opening the groove 162 can offset the internal stress of the reinforcing plate 16 before assembly, but the opening groove 162 has an excessively long total length in the second direction. It will affect the strength of the reinforcing plate 16.
- the piezoelectric motor 10 satisfies the following relationship:
- H is the thickness of the reinforcing plate 16 in the third direction
- H1 is the depth of the groove 162 in the third direction
- the third direction is arranged perpendicular to the first direction and the second direction, respectively.
- the strength of the reinforcing plate 16 can be ensured, and the residual stress after the groove 162 is opened can be evenly distributed on the side of the reinforcing plate 16 away from the circuit board 14, and can offset the internal of the reinforcing plate 16 before assembly. stress.
- H1/H ⁇ 2/3 the residual stress after opening the groove 162 can offset the internal stress of the reinforcing plate 16 before assembly, but the opening of the groove 162 is affected by the excessive depth in the third direction. Strength of the reinforcing plate 16.
- a plurality of grooves 162 are formed on the side of the reinforcing plate 16 away from the circuit board 14. After the grooves 162 are opened, the side of the reinforcing plate 16 away from the circuit board 14 will generate residual stress.
- the residual stress can offset the internal stress generated by the mechanical processing of the reinforcing plate 16 before assembly, so that the reinforcing plate 16 can be kept flat after assembly, which facilitates subsequent lamination and assembly.
- the piezoelectric motor 10 of the embodiment of the present invention can be applied to the electronic device (not shown) of the embodiment of the present invention.
- the electronic device includes a piezoelectric motor 10 and a supporting plate 20, and the supporting plate 20 is provided on the reinforcing plate.
- a side of 16 away from the circuit board 14 is provided with a supporting portion 22 at a position corresponding to the groove 162 of the supporting board 20, and the supporting portion 22 is adapted to the groove 162.
- the electronic device further includes a second adhesive part 30.
- the second adhesive part 30 is an optical adhesive, for example, an epoxy resin adhesive or a die attach film (Die Attach Film, DAF for short).
- the second adhesive portion 30 is disposed between the supporting portion 22 and the groove wall of the groove 162 to fix the supporting portion 22 in the corresponding groove 162.
- the second adhesive portion 30 can bond the supporting portion 22 with the groove wall of the groove 162, and the reinforcing plate 16
- the concave (groove 162) and convex (supporting portion 22) structure between the support plate 20 and the support plate 20 can increase the contact area of the second bonding portion 30 and the compactness of the bonding, effectively increase the bonding strength, and effectively prevent piezoelectric
- the motor 10 is disengaged from the supporting part 22.
- the electronic devices of the embodiments of the present invention include, but are not limited to, driving recorders, smart phones, tablet computers, notebook computers, e-book readers, portable multimedia players (PMP), portable phones, video phones, digital still cameras, Electronic devices with piezoelectric motors such as mobile medical devices and wearable devices.
- driving recorders smart phones
- tablet computers notebook computers
- e-book readers portable multimedia players
- PMP portable phones
- video phones digital still cameras
- Electronic devices with piezoelectric motors such as mobile medical devices and wearable devices.
- a plurality of grooves 162 are formed on the side of the reinforcing plate 16 away from the circuit board 14. After the grooves 162 are opened, the side of the reinforcing plate 16 away from the circuit board 14 will generate residual stress.
- the internal stress generated by the mechanical processing of the reinforcing plate 16 before assembly is offset, so that the reinforcing plate 16 can be kept flat after assembly.
- a matching concave-convex structure is provided between the reinforcing plate 16 and the supporting plate 20, which can effectively improve the "drift" caused by the glue pressing between the supporting plate 20 and the piezoelectric motor 10, which causes the positional deviation during the bonding process.
- the problem of displacement improves the accuracy and efficiency of the bonding; and the laminated structure of the reinforcing plate 16 and the supporting plate 20 embedded in each other can further reduce the overall thickness of the reinforcing plate 16 and the supporting plate 20, saving overall space and reducing pressing
- the sinking displacement optimizes the somatosensory effect; secondly, the mutually embedded concave-convex structure has good bonding strength and compactness due to the good bonding strength and compactness of the second adhesive portion 30, which can further optimize the vibration transmission effect and enhance the vibration experience.
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
提供一种压电马达（10）及电子装置。压电马达（10）包括：压电片（12）；电路板（14），设于压电片（12）的一侧，且与压电片（12）电连接；及补强板（16），设于电路板（14）背离压电片（12）的一侧，补强板（16）背离电路板（14）的一侧开设有多个凹槽（162），多个凹槽（162）用于抵消补强板（16）的内部应力，具体为：多个凹槽（162）形成的组合结构在开设凹槽（162）后补强板（16）背离电路板（14）的一侧会产生残余应力，该残余应力可抵消补强板（16）在组装前由于机械加工而产生的内部应力，从而使补强板（16）在组装后能够保持平整。
Description
本申请涉及电子技术领域，特别涉及一种压电马达及电子装置。
压电马达是利用压电体的压电逆效应进行机电能量转换的电动机。目前，压电马达包括依次层叠设置的压电片、电路板及补强钢板，对电路板通交流电可使得压电片振动。
在实现本申请的过程中，发明人发现现有技术中存在以下问题：压电片在高温烧结后容易发生翘曲；补强钢板的厚度较小，在机械加工后会存在一定内部应力，这会使得补强钢板在组装后容易出现应力分布不均的问题，从而致使补强钢板朝远离压电片的方向翘曲；另外，当补强钢板与压电陶瓷通过粘合剂贴合后，在组装后由于粘合剂的取向及收缩也会使得补强钢板进一步翘曲，极大的降低了压电马达的性能和可靠性，并严重影响了后续的贴合和组装。
发明内容
鉴于以上内容，有必要提出一种压电马达及电子装置，以解决上述问题。
本申请的实施例提供了一种压电马达，包括：
压电片；
电路板，设于所述压电片的一侧，且与所述压电片电连接；及
补强板，设于所述电路板背离所述压电片的一侧，所述补强板背离所述电路板的一侧开设有多个凹槽，所述多个凹槽用于抵消所述补强板的内部应力。
上述实施例的压电马达中补强板背离电路板的一侧开设有多个凹槽，所述多个凹槽形成的组合结构在开设凹槽后补强板背离电路板的一侧会产生残余应力，该残余应力可抵消补强板在组装前由于机械加工而产生的内部应力，从而使补强板在组装后能够保持平整。
本申请的实施例还提供一种电子装置，包括：
上述的压电马达；及
支撑板，位于所述补强板背离所述电路板的一侧，所述支撑板的对应所述凹槽的位置设有支撑部，所述支撑部与所述凹槽适配。
上述的电子装置中补强板背离电路板的一侧开设有多个凹槽，所述多个凹槽形成的组合结构在开设凹槽后补强板背离电路板的一侧会产生残余应力，该残余应力可抵消补强板在组装前由于机械加工而产生的内部应力，从而使补强板在组装后能够保持平整。
图1是本发明实施例提供的压电马达的结构示意图。
图2是本发明实施例提供的压电马达与支撑板的装配结构示意图。
主要元件符号说明
压电马达 10
压电片 12
电路板 14
补强板 16
凹槽 162
第一粘合部 18
支撑板 20
支撑部 22
第二粘合部 30
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅 用以解释本发明，并不用于限定本发明。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中设置的元件。当一个元件被认为是“设置在”另一个元件，它可以是直接设置在另一个元件上或者可能同时存在居中设置的元件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
请参照图1，本申请实施例提供了一种压电马达10，包括压电片12、电路板14及补强板16。
压电片12大致为片状。压电片12由压电材料制成，在通电状态下，压电片12能够发生变形，在断电状态下，压电片12则会变形恢复。
在一些实施例中，压电片12为石英、陶瓷、电气石、罗德盐、氧化锌中的任意一种。如此，可选择不同材质的压电片，以满足不同的实际需要。例如，本实施例中的压电片12为陶瓷。
电路板14设于压电片12的一侧，且与压电片12电连接，用于承载压电片12。电路板14可以为PCB(Printed Circuit Board，印制电路板)，也可以为软硬结合板，也可以为FPC(Flexible Printed Circuit，柔性电路板)，其中，软硬结合板包括层叠设置的PCB及FPC。
在一些实施例中，压电马达10还包括第一粘合部18，第一粘合部18设于压电片12及电路板14之间，第一粘合部18的两相对侧面分别粘合压电片12及电路板14。第一粘合部18为一种导电型粘合剂，例如，环氧树脂型粘合剂或晶粒连接薄膜黏合剂(Die Attach Film，简称DAF)；如此，第一粘合部18可将压电片12及电路板14连接在一起，还能保证两者之间导电。
补强板16固定于电路板14背离压电片12的一侧，且与电路板14层叠设置。补强板16背离电路板14的一侧开设有多个凹槽162，多个凹槽162用于抵消补强板16的内部应力。
具体地，每个凹槽162沿第一方向延伸并贯穿补强板16在第一方向的相对的两个侧面，多个凹槽162沿第二方向均匀间隔设置，第一方向和第二方向均平行于补强板16背离电路板14的侧面。如此，在开设凹槽162后，凹槽162处的残余应力会均匀分布在补强板16背离电路板14的一侧，并可抵消补强板16在组装前的内部应力，能够有效地改善补强板16的翘曲度。
需要说明的是，第一方向、第二方向及下文中的第三方向两两之间相互垂直，第一方向定义为本实施例中的X轴方向(图未示)，第二方向定义为本实施例中的Y轴方向，第三方向定义为本实施例中的Z轴方向。
可以理解，在其他的实施例中，第一方向与第二方向也可不垂直，第一方向与第二方向的夹角可根据实际需要设置，例如，第一方向与第二方向的夹角为50°。
可以理解，在其他的实施例中，每个凹槽162沿第一方向延伸，或者贯穿补强板16的其中一个侧面，或者补强板16的两个相对的侧面均不贯穿，只要开设凹槽162后产生的残余应力能够抵消补强板16在组装前由于机械加工而产生的内部应力即可。
可以理解，在其他的实施例中，多个凹槽162也可不均匀间隔设置，只要开设凹槽162后产生的残余应力能够抵消补强板16在组装前由于机械加工而产生的内部应力即可。
在一些实施例中，凹槽162在第二方向的截面为半圆形、矩形、梯形、角形、五边形中的任意一种。如此，可设置不同截面形状的凹槽，以满足不同的实际需要。在本实施例中，凹槽162在第二方向的截面为矩形。
在一些实施例中，补强板16的材质为铜、钢、铝、铁、镁铝合金、铝合金及银中的任意一种。如此，可选择不同材质的补强板16，以满足不同的实际需要。在本实施例中，补强板16的材质为钢。
在一些实施例中，压电马达10满足以下关系式：
0<L1/L<2/3；
其中，L为补强板16在第二方向的长度，L1为多个凹槽162在第二方向的总长度。
如此，可保证补强板16的强度，还能使开设凹槽162后的残余应力会均匀分布在补强板16背离电路板14的一侧，并可抵消补强板16在组装前的内部应力。然，当L1/L≥2/3时，开设凹槽162后的残余应力虽可抵消补强板16在组装前的内部应力，但开设的凹槽162由于在第二方向的总长度过长会影响补强板16的强度。
在一些实施例中，压电马达10满足以下关系式：
0<H1/H<2/3；
其中，H为补强板16在第三方向的厚度，H1为凹槽162在第三方向的深度，第三方向分别与第一方向及第二方向垂直设置。
如此，可保证补强板16的强度，还能使开设凹槽162后的残余应力会均匀分布在补强板16背离电路板14的一侧，并可抵消补强板16在组装前的内部应力。然，当H1/H≥2/3时，开设凹槽162后的残余应力虽可抵消补强板16在组装前的内部应力，但开设的凹槽162由于在第三方向的深度过大会影响补强板16的强度。
上述实施例的压电马达10中补强板16背离电路板14的一侧开设有多个凹槽162，在开设凹槽162后补强板16背离电路板14的一侧会产生残余应力，该残余应力可抵消补强板16在组装前由于机械加工而产生的内部应力，从而使补强板16在组装后能够保持平整，利于后续贴合组装。
请参见图2，本发明实施例的压电马达10可应用于本发明实施例的电子装置(图未示)，电子装置包括压电马达10及支撑板20，支撑板20设于补强板16背离电路板14的一侧，支撑板20的对应凹槽162的位置设有支撑部22，支撑部22与凹槽162适配。
在一些实施例中，电子装置还包括第二粘合部30。第二粘合部30为一种光学粘合剂，例如，环氧树脂型粘合剂或晶粒连接薄膜黏合剂(Die Attach Film，简称DAF)。第二粘合部30设于支撑部22和凹槽162的槽壁之间，用以将支撑部22固定于相对应的凹槽162内。如此，在支撑板20的支撑部22与补强板16的凹槽162对位安装后，第二粘合部30可将支撑部22与凹槽162的槽壁进行粘接，补强板16和支撑板20之间的凹(凹槽162)凸(支撑部22)结构可增加第二粘合部30的接触面积和粘接的致密性，有效增加了粘接强度，可有效防止压电马达10从支撑部22处脱离。
本发明实施例的电子装置包括但不限于为行车记录仪、智能手机、平板电脑、笔记本电脑、电子书籍阅读器、便携多媒体播放器(PMP)、便携电话机、视频电话机、数码静物相机、移动医疗装置、可穿戴式设备等具有压电马达的电子装置。
上述的电子装置中补强板16背离电路板14的一侧开设有多个凹槽162，在开设凹槽162后补强板16背离电路板14的一侧会产生残余应力，该残余应力可抵消补强板16在组装前由于机械加工而产生的内部应力，从而使补强板16在组装后能够保持平整。另外，补强板16和支撑板20之间设置相匹配的凹凸结构，可有效改善因支撑板20和压电马达10平面结构间通过胶水压合而“漂移”，导致贴合过程中位置偏移的问题，提高贴合的精度和效率；并且补强板16和支撑板20相互嵌入式的叠层结构可进一步降低补强板16和支撑板20的整体厚度，节约整体空间并减小按压下沉位移，优化了体感效果；其次，相互嵌入的凹凸结构因第二粘合部30具有良好的粘结强度和致密性，可进一步优化振动传递效果，增强振感体验。
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化涵括在本发明内。
最后应说明的是，以上实施例仅用以说明本发明的技术方案而非限制，尽管参照较佳实施例对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或等同替换，而不脱离本发明技术方案的精神和范围。
Claims (10)
- 一种压电马达，其特征在于，包括：压电片；电路板，设于所述压电片的一侧，且与所述压电片电连接；及补强板，设于所述电路板背离所述压电片的一侧，所述补强板背离所述电路板的一侧开设有多个凹槽，所述多个凹槽用于抵消所述补强板的内部应力。
- 如权利要求1所述的压电马达，其特征在于，每个所述凹槽沿第一方向延伸并贯穿所述补强板在所述第一方向的相对的两个侧面；多个所述凹槽沿第二方向均匀间隔设置，所述第一方向和所述第二方向均平行于所述补强板背离所述电路板的侧面。
- 如权利要求2所述的压电马达，其特征在于，所述压电马达满足以下关系式：0<L1/L<2/3；其中，L为所述补强板在所述第二方向的长度，L1为所述多个凹槽在所述第二方向的总长度。
- 如权利要求2所述的压电马达，其特征在于，所述压电马达满足以下关系式：0<H1/H<2/3；其中，H为所述补强板在第三方向的厚度，H1为所述凹槽在所述第三方向的深度，所述第三方向分别与所述第一方向及所述第二方向垂直设置。
- 如权利要求2所述的压电马达，其特征在于，所述凹槽在所述第二方向的截面为半圆形、矩形、梯形、角形、五边形中的任意一种。
- 如权利要求1所述的压电马达，其特征在于，所述压电马达还包括：第一粘合部，设于所述压电片及所述电路板之间，所述第一粘合部的两相对侧面分别粘合所述压电片及所述电路板。
- 如权利要求1所述的压电马达，其特征在于，所述补强板的材质为铜、 钢、铝、铁、镁铝合金、铝合金及银中的任意一种。
- 如权利要求1所述的压电马达，其特征在于，所述压电片为石英、陶瓷、电气石、罗德盐、氧化锌中的任意一种。
- 一种电子装置，其特征在于，包括：权利要求1-8任意一项所述的压电马达；及支撑板，位于所述补强板背离所述电路板的一侧，所述支撑板的对应所述凹槽的位置设有支撑部，所述支撑部与所述凹槽适配。
- 如权利要求9所述的电子装置，其特征在于，所述电子装置还包括：第二粘合部，设于所述支撑部和所述凹槽的槽壁之间，用以将所述支撑部固定于相对应的所述凹槽内。
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