WO2021237800A1 - Mems 麦克风 - Google Patents

Mems 麦克风 Download PDF

Info

Publication number
WO2021237800A1
WO2021237800A1 PCT/CN2020/094859 CN2020094859W WO2021237800A1 WO 2021237800 A1 WO2021237800 A1 WO 2021237800A1 CN 2020094859 W CN2020094859 W CN 2020094859W WO 2021237800 A1 WO2021237800 A1 WO 2021237800A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
flexible substrate
mems
mems chip
asic chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/094859
Other languages
English (en)
French (fr)
Inventor
柏杨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
AAC Technologies Holdings Nanjing Co Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Technologies Holdings Nanjing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Technologies Holdings Nanjing Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Publication of WO2021237800A1 publication Critical patent/WO2021237800A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • This application relates to the field of miniature microphones, and in particular to a MEMS microphone.
  • MEMS microphones are generally packaged by MEMS chips, ASIC chips, packaging substrates and housings.
  • the MEMS chip and the ASIC chip are attached to one side of the packaging substrate, and the side of the packaging substrate wrapped by the casing is connected to the MEMS chip and the ASIC chip by wire bonding or TSV (Through Silicon Via) vias.
  • TSV Through Silicon Via
  • the other side of the package substrate is electrically connected to a flexible circuit board (FPC) through an external pad.
  • FPC flexible circuit board
  • the packaging substrate has a multilayer structure including a metal layer and an insulating layer, which occupies a large height space and is not conducive to the realization of the thinner and lighter MEMS microphone.
  • the external pad of the package substrate is fixed on one side of the package substrate, and the position is not flexible enough, which brings certain restrictions on the connection and matching of the microphone and other hardware in the later stage.
  • the MEMS chip and the hard packaging substrate are usually glued together, it is a rigid connection.
  • the external kinetic energy will be concentrated on the movable parts of the MEMS chip, such as the diaphragm. Break the diaphragm or backplane, and even cause the MEMS chip to fail.
  • the purpose of this application is to provide a MEMS microphone.
  • the present application provides a MEMS microphone, which includes a packaging housing, a flexible substrate that encloses a housing space with the packaging housing, and a flexible substrate that is received in the housing space and mounted on the flexible substrate.
  • a MEMS chip and an ASIC chip, the MEMS chip and the ASIC chip are electrically connected to a flexible substrate, and the flexible substrate is provided with a buffer portion in the containing space at least surrounding the MEMS chip.
  • the hardness of the buffer portion is less than the hardness of the flexible substrate.
  • the thickness of the buffer portion is smaller than the thickness of the flexible substrate.
  • the buffer portion has a corrugated structure.
  • the buffer part surrounds the MEMS chip and the ASIC chip.
  • the MEMS chip and the ASIC chip are electrically connected through a first lead, and the ASIC chip and the flexible substrate are electrically connected through a second lead.
  • the MEMS chip is provided with a first electrical through hole and a first contact point at the bottom end of the first electrical through hole
  • the ASIC chip is provided with a second electrical through hole and a second electrical through hole.
  • the flexible substrate is provided with internal pins to electrically connect the first contact point of the MEMS chip and the second contact point of the ASIC chip.
  • the flexible packaging substrate is provided with external pins, and the MEMS chip and the ASIC chip are electrically connected to the external pins of the flexible substrate.
  • a glue protection area is provided on the peripheral side of the MEMS chip or the ASIC chip, and the glue protection area is used to seal the connection between the MEMS chip or the ASIC chip and the flexible substrate.
  • the flexible substrate is a flexible circuit board.
  • the beneficial effect of the present application is that the encapsulation shell is directly fixed on the flexible substrate to form an accommodation space.
  • the MEMS chip and the ASIC chip are respectively fixed on the flexible substrate and achieve The electrical connection of the MEMS chip, the ASIC chip and the flexible substrate is provided, and the flexible substrate is provided with a buffer portion located in the containing space at least surrounding the MEMS chip.
  • the flexible connection formed by the buffer portion will release part of the external kinetic energy and expand the volume of the accommodation space to slow down the rate of air pressure rise in the accommodation space, thereby reducing the impact on the structure of the diaphragm and backplane provided in the MEMS chip, and improving The reliability of MEMS chips in extreme environments such as large air currents, drops, and vibrations.
  • FIG. 1 is a schematic structural diagram of a first embodiment of a MEMS microphone of this application
  • FIG. 2 is a schematic structural diagram of a second embodiment of a MEMS microphone of this application.
  • FIG. 3 is a schematic diagram of the structure of the flexible substrate provided with a buffer part in the MEMS microphone of this application;
  • Fig. 4 is a schematic diagram of the state when the buffer part in Fig. 3 is opened.
  • an element when an element is referred to as being “fixed on” or “disposed on” another element, the element may be directly on the other element or a centering element may also exist at the same time.
  • an element When an element is referred to as being “connected” to another element, it can be directly connected to the other element or there may be a central element at the same time.
  • the present application provides a MEMS microphone 100, which includes a packaging housing 10, a flexible substrate 20 and the packaging housing 10 enclosing a receiving space 50, received in the receiving space 50
  • the MEMS chip 30 and the ASIC chip 40 are mounted on the flexible substrate 20.
  • the MEMS chip 30 and the ASIC chip 40 are electrically connected to the flexible substrate 20, and the flexible substrate 20 is arranged to at least surround the MEMS chip 30.
  • the MEMS chip 30 is used to receive sound waves entering the containing space 50 and convert them into electrical signals.
  • the generated electrical signals are transmitted to the ASIC chip 40 and output to the external circuit by the ASIC chip 40. Convert sound into electrical signal.
  • the packaging housing 10 is made of a metal material and has a function of shielding electromagnetic interference, and the packaging housing 10 is fixed on the flexible substrate 20 by bonding or welding.
  • the packaging casing 10 or the flexible substrate 20 is provided with a sound inlet 21, and the sound inlet 21 is used for transmitting sound waves into the containing space 50.
  • the sound inlet 21 is provided on the flexible substrate 20 and located below the MEMS chip 30.
  • the MEMS chip 30 and the ASIC chip 40 are electrically connected through a first lead 31, and the ASIC chip 40 and the flexible substrate 20 are electrically connected through a second lead 41.
  • the flexible substrate 20 is provided with inner pins 22 that are connected to the ASIC chip 40 through a second lead 41.
  • the MEMS chip 30 is provided with a first electrical through hole 32 and a first contact point 33 located at the bottom of the first electrical through hole 32, and the ASIC chip 40 A second electrical through hole 42 and a second contact point 43 at the bottom end of the second electrical through hole 42 are provided.
  • the flexible substrate 20 is provided with internal pins 22 to contact the first contact points 33 and 33 of the MEMS chip 30.
  • the second contact point 43 of the ASIC chip 40 is electrically connected, and the first contact point 33 and the second contact point 43 are protrusions that extend beyond the surface of the MEMS chip 30.
  • Step S1 using TSV (Through Silicon Via) process to form electrical vias on the MEMS chip and the ASIC chip, and leave contact points at the corresponding positions of the electrical vias at the bottom of the chip;
  • Step S2 bonding the inner pins on the flexible substrate with the contact points at the bottom of the electrical through holes on the MEMS chip or the ASIC chip through solder;
  • Step S3 applying and curing glue to provide a glue protection area on the peripheral side of the MEMS chip or the ASIC chip, and the glue protection area is used to seal the connection between the MEMS chip or the ASIC chip and the flexible substrate;
  • step S4 solder paste is applied to the junction of the flexible substrate and the package shell, the package shell is pasted on the corresponding position of the flexible substrate, and then the package shell is fixed by reflow soldering.
  • the flexible substrate 20 is a flexible circuit board.
  • the flexible substrate 20 is further provided with outer pins 23, and the MEMS chip 30 and the ASIC chip 40 are connected to the flexible substrate through the inner pins 22.
  • the outer pins 23 of the substrate 20 are electrically connected.
  • the length, position, and direction of the outer pins 23 provided on the flexible substrate 20 can be arbitrarily set according to actual requirements, so as to flexibly realize the connection between the MEMS microphone and external hardware.
  • the accommodating space is formed by directly fixing the packaging case on the flexible substrate.
  • the MEMS chip and the ASIC chip are respectively fixed on the flexible substrate, and the electrical connection between the MEMS chip, the ASIC chip and the flexible substrate is realized.
  • the above-mentioned packaging structure saves the space of the rigid packaging substrate, reduces the height of the product, and saves packaging process steps and costs.
  • the buffer portion 24 is disposed around the MEMS chip 30; please refer to FIG. 2, in another embodiment, the buffer portion 24 surrounds the MEMS chip 30 and the ASIC chip 40 settings.
  • the buffer portion 24 is a corrugated structure and is located in the receiving space 50.
  • the hardness of the buffer portion 24 is less than the hardness of the flexible substrate 20; in another embodiment, the thickness of the buffer portion 24 is less than the thickness of the flexible substrate 20; of course, it can also be practical. A combination of the above two situations. In a normal use environment, the buffer portion 24 will not open. As shown in FIG. 3, the flexible substrate 20 will not be significantly deformed.
  • the buffer 24 will be opened instantly.
  • the flexible connection will release part of the external kinetic energy.
  • the volume of the containing space 50 can be enlarged to slow down the containment. The rising speed of the air pressure in the space 50 reduces the impact on the structure such as the diaphragm and the back plate provided in the MEMS chip 30, and improves the reliability of the MEMS chip 30 in extreme environments such as large air currents, drops, and vibrations.
  • This application directly fixes the package shell on the flexible substrate to form an accommodation space.
  • the MEMS chip and the ASIC chip are respectively fixed on the flexible substrate, and realize the MEMS chip and ASIC
  • the chip is electrically connected to a flexible substrate, and the flexible substrate is provided with a buffer portion located in the containing space at least surrounding the MEMS chip.
  • the flexible connection formed by the buffer portion will release part of the external kinetic energy and expand the volume of the accommodation space to slow down the rate of air pressure rise in the accommodation space, thereby reducing the impact on the diaphragm and backplane provided in the MEMS chip, and improving The reliability of MEMS chips in extreme environments such as large air currents, drops, and vibrations.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)

Abstract

本申请公开了一种MEMS麦克风，通过将封装壳体直接固定在柔性基板上以形成收容空间，在封装壳体与柔性基板形成的收容空间中，MEMS芯片和ASIC芯片分别固定在柔性基板上，并实现了MEMS芯片、ASIC芯片与柔性基板的电性连接，所述柔性基板设置至少环绕所述MEMS芯片的位于所述收容空间内的缓冲部。所述缓冲部形成的柔性连接会释放部分外部动能，并扩大收容空间的体积，以减缓收容空间气压上升的速度，从而减少对MEMS芯片中设置的振膜和背板等结构的冲击，提高了MEMS芯片在大气流、跌落、振动等极端环境下的可靠性。

Description

MEMS麦克风 技术领域
本申请涉及微型麦克风领域，尤其涉及一种MEMS麦克风。
 背景技术
现有的MEMS麦克风普遍由MEMS芯片、ASIC芯片、封装基板和外壳封装而成。其中，MEMS芯片与ASIC芯片贴在封装基板的一侧，封装基板被外壳包裹着的一侧与MEMS芯片和ASIC芯片通过引线键合或者TSV（Through Silicon Via）通孔的方式连接。在手机、平板等MEMS麦克风的实际使用终端中，封装基板的另一侧通过外部焊盘与柔性线路板（FPC）实现电连接。封装基板内部有包括金属层和绝缘层在内的多层结构，占用了较大的高度空间，不利于实现MEMS麦克风的轻薄化。
通常情况下，封装基板的外部焊盘固定位于封装基板的一侧，位置不够灵活，给后期麦克风与其他硬件的连接与匹配带来一定的限制。
此外，由于MEMS芯片与硬质封装基板之间通常使用胶水黏合，属于刚性连接，在大气流、跌落、振动等极端环境下外部动能会集中在MEMS芯片的可动部件如振膜处释放，容易使振膜或者背板断裂，甚至造成MEMS芯片失效。
因此，有必要提供一种新的技术方案以解决上述缺陷。
 技术问题
本申请的目的在于提供了一种MEMS麦克风。
 技术解决方案
为达到上述目的，本申请提供了一种MEMS麦克风，其包括封装壳体、与所述封装壳体围成收容空间的柔性基板、收容于所述收容空间内并安装于所述柔性基板上的MEMS芯片和ASIC芯片，所述MEMS芯片和所述ASIC芯片与柔性基板电性连接，所述柔性基板设置至少环绕所述MEMS芯片的位于所述收容空间内的缓冲部。
优选的，所述缓冲部的硬度小于所述柔性基板的硬度。
优选的，所述缓冲部的厚度小于所述柔性基板的厚度。
优选的，所述缓冲部为褶皱结构。
优选的，所述缓冲部环绕所述MEMS芯片及所述ASIC芯片。
优选的，所述MEMS芯片与所述ASIC芯片通过第一引线电性连接，所述ASIC芯片与所述柔性基板通过第二引线电性连接。
优选的，所述MEMS芯片设有第一电性通孔和位于第一电性通孔底端的第一接触点，所述ASIC芯片设有第二电性通孔和和位于第二电性通孔底端的第二接触点，所述柔性基板设有内引脚以与MEMS芯片的第一接触点和ASIC芯片的第二接触点电性连接。
优选的，所述柔性封装基板设有外引脚，所述MEMS芯片和所述ASIC芯片与所述柔性基板的外引脚电性相连。
优选的，所述MEMS芯片或所述ASIC芯片的周侧设有胶水保护区，所述胶水保护区用于密封MEMS芯片或ASIC芯片与柔性基板的连接处。
优选的，所述柔性基板为柔性电路板。
 有益效果
本申请的有益效果在于：通过将封装壳体直接固定在柔性基板上以形成收容空间，在封装壳体与柔性基板形成的收容空间中，MEMS芯片和ASIC芯片分别固定在柔性基板上，并实现了MEMS芯片、ASIC芯片与柔性基板的电性连接，所述柔性基板设置至少环绕所述MEMS芯片的位于所述收容空间内的缓冲部。所述缓冲部形成的柔性连接会释放部分外部动能，并扩大收容空间的体积，以减缓收容空间气压上升的速度，从而减少对MEMS芯片中设置的振膜和背板等结构的冲击，提高了MEMS芯片在大气流、跌落、振动等极端环境下的可靠性。
 附图说明
图1为本申请MEMS麦克风的第一实施例的结构示意图；
图2为本申请MEMS麦克风的第二实施例的结构示意图；
图3为本申请MEMS麦克风中柔性基板设置缓冲部的结构示意图；
图4为图3中缓冲部打开时候的状态示意图。
 本发明的实施方式
下面结合附图和实施方式对本申请作进一步说明。
需要说明的是，本申请实施例中所有方向性指示（诸如上、下、左、右、前、后、内、外、顶部、底部……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
还需要说明的是，当元件被称为“固定于”或“设置于”另一个元件上时，该元件可以直接在另一个元件上或者可能同时存在居中元件。当一个元件被称为“连接”另一个元件，它可以是直接连接另一个元件或者可能同时存在居中元件。
请参考图1至图2，本申请提供了一种MEMS麦克风100，其包括封装壳体10、与所述封装壳体10围成收容空间50的柔性基板20、收容于所述收容空间50内并安装于所述柔性基板20上的MEMS芯片30和ASIC芯片40，所述MEMS芯片30和所述ASIC芯片40与柔性基板20电性连接，所述柔性基板20设置至少环绕所述MEMS芯片30的位于所述收容空间50内的缓冲部24。其中，所述MEMS芯片30用于接收进入收容空间50的声波，并将之转换成电信号，生成的电信号传输至所述ASIC芯片40，并由所述ASIC芯片40输出至外部电路，从而将声音转换成电信号。
具体的，所述封装壳体10由金属材料制成，具有屏蔽电磁干扰功能，所述封装壳体10通过粘接或焊接的方式固定在柔性基板20上。所述封装壳体10或所述柔性基板20上设有入声孔21，入声孔21用于供声波传入收容空间50内。本实施例中，所述入声孔21设于柔性基板20上，并位于MEMS芯片30的下方。
请再参考图1，一较佳实施例中，所述MEMS芯片30与所述ASIC芯片40通过第一引线31电性连接，所述ASIC芯片40与所述柔性基板20通过第二引线41电性连接，所述柔性基板20设有内引脚22通过第二引线41与所述ASIC芯片40连接。
请再参考图2，另一较佳实施例中，所述MEMS芯片30设有第一电性通孔32和位于第一电性通孔32底端的第一接触点33，所述ASIC芯片40设有第二电性通孔42和和位于第二电性通孔42底端的第二接触点43，所述柔性基板20设有内引脚22以与MEMS芯片30的第一接触点33和ASIC芯片40的第二接触点43电性连接，所述第一接触点33和第二接触点43为超出MEMS芯片30表面的凸起。
下面将详细描述图2所涉及的工艺步骤：
步骤S1，利用TSV（Through Silicon Via）工艺使MEMS芯片以及ASIC芯片形成电性通孔，并在芯片底部的电性通孔对应位置处留出接触点；
步骤S2，将柔性基板上的内引脚与MEMS芯片或ASIC芯片上电性通孔底部的接触点通过焊料进行金属间的键合；
步骤S3，滴涂并固化胶水，以在所述MEMS芯片或所述ASIC芯片的周侧设有胶水保护区，所述胶水保护区用于密封MEMS芯片或ASIC芯片与柔性基板的连接处；
步骤S4，柔性基板与封装外壳连接处点上锡膏，将封装外壳贴在柔性基板对应的位置，然后过回流焊以固定封装外壳。
优选的，所述柔性基板20为柔性电路板。
进一步的，在图1和图2的两个实施例基础上，所述柔性基板20还设有外引脚23，所述MEMS芯片30和所述ASIC芯片40通过内引脚22与所述柔性基板20的外引脚23电性相连。在本申请中，设置在柔性基板20的外引脚23的长度、位置、方向可根据实际需求任意设置，以灵活地实现于MEMS麦克风与外部硬件的连接。
在图1和图2的实施例中，通过将封装壳体直接固定在柔性基板上以形成收容空间。在封装壳体与柔性基板形成的收容空间中，MEMS芯片和ASIC芯片分别固定在柔性基板上，并实现了MEMS芯片、ASIC芯片与柔性基板的电性连接。上述封装结构节省了硬质封装基板的空间，降低了产品的高度，节省了封装工艺步骤和成本。
请参考图1，一实施例中，所述缓冲部24环绕所述MEMS芯片30设置；请参考图2，另一实施例中，所述缓冲部24环绕所述MEMS芯片30及所述ASIC芯片40设置。，所述缓冲部24是一种褶皱结构，位于所述收容空间50内。在一实施例中，所述缓冲部24的硬度小于所述柔性基板20的硬度；在另一实施例中，所述缓冲部24的厚度小于所述柔性基板20的厚度；当然，实际也可以上述两种情况的结合。在正常使用环境中，所述缓冲部24是不会打开，如图3所示，柔性基板20不会发生明显形变。在大气流、跌落、振动等极端环境下，所述缓冲部24是会被瞬间打开，如图4所示，柔性连接会释放部分外部动能，此外，还可以扩大收容空间50的体积，减缓收容空间50气压上升的速度，从而减少对MEMS芯片30中设置的振膜和背板等结构的冲击，提高了MEMS芯片30在大气流、跌落、振动等极端环境下可靠性水平。
本申请通过将封装壳体直接固定在柔性基板上以形成收容空间，在封装壳体与柔性基板形成的收容空间中，MEMS芯片和ASIC芯片分别固定在柔性基板上，并实现了MEMS芯片、ASIC芯片与柔性基板的电性连接，所述柔性基板设置至少环绕所述MEMS芯片的位于所述收容空间内的缓冲部。所述缓冲部形成的柔性连接会释放部分外部动能，并扩大收容空间的体积，以减缓收容空间气压上升的速度，从而减少对MEMS芯片中设置的振膜和背板等结构的冲击，提高了MEMS芯片在大气流、跌落、振动等极端环境下的可靠性。
以上所述的仅是本申请的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本申请创造构思的前提下，还可以做出改进，但这些均属于本申请的保护范围。

Claims (10)

1、一种MEMS麦克风，其包括封装壳体、与所述封装壳体围成收容空间的柔性基板、收容于所述收容空间内并安装于所述柔性基板上的MEMS芯片和ASIC芯片，所述MEMS芯片和所述ASIC芯片与柔性基板电性连接，其特征在于，所述柔性基板设置至少环绕所述MEMS芯片的位于所述收容空间内的缓冲部。
2、根据权利要求1所述的MEMS麦克风，其特征在于，所述缓冲部的硬度小于所述柔性基板的硬度。
3、根据权利要求1或2所述的MEMS麦克风，其特征在于，所述缓冲部的厚度小于所述柔性基板的厚度。
4、根据权利要求1所述的MEMS麦克风，其特征在于，所述缓冲部为褶皱结构。
5、根据权利要求4所述的MEMS麦克风，其特征在于，所述缓冲部环绕所述MEMS芯片及所述ASIC芯片。
6、根据权利要求5所述的MEMS麦克风，其特征在于，所述MEMS芯片与所述ASIC芯片通过第一引线电性连接，所述ASIC芯片与所述柔性基板通过第二引线电性连接。
7、根据权利要求5所述的MEMS麦克风，其特征在于，所述MEMS芯片设有第一电性通孔和位于第一电性通孔底端的第一接触点，所述ASIC芯片设有第二电性通孔和和位于第二电性通孔底端的第二接触点，所述柔性基板设有内引脚以与MEMS芯片的第一接触点和ASIC芯片的第二接触点电性连接。
8、根据权利要求6或7所述的MEMS麦克风，其特征在于，所述柔性封装基板设有外引脚，所述MEMS芯片和所述ASIC芯片与所述柔性基板的外引脚电性相连。
9、根据权利要求1所述的MEMS麦克风，其特征在于，所述MEMS芯片或所述ASIC芯片的周侧设有胶水保护区，所述胶水保护区用于密封MEMS芯片或ASIC芯片与柔性基板的连接处。
10、根据权利要求1所述的MEMS麦克风，其特征在于，所述柔性基板为柔性电路板。
PCT/CN2020/094859 2020-05-29 2020-06-08 Mems 麦克风 Ceased WO2021237800A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202020961621.7U CN212588513U (zh) 2020-05-29 2020-05-29 Mems麦克风
CN202020961621.7 2020-05-29

Publications (1)

Publication Number Publication Date
WO2021237800A1 true WO2021237800A1 (zh) 2021-12-02

Family

ID=74642711

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/094859 Ceased WO2021237800A1 (zh) 2020-05-29 2020-06-08 Mems 麦克风

Country Status (2)

Country Link
CN (1) CN212588513U (zh)
WO (1) WO2021237800A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115057407A (zh) * 2022-04-29 2022-09-16 潍坊歌尔微电子有限公司 Mems产品及电子设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115499769B (zh) * 2022-10-13 2025-12-02 华景传感科技（无锡）有限公司 一种骨声纹振动传感器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103475983A (zh) * 2013-09-13 2013-12-25 山东共达电声股份有限公司 Mems麦克风及电子设备
EP2768240A1 (en) * 2013-02-15 2014-08-20 Funai Electric Co., Ltd. Sound input device
CN105203233A (zh) * 2015-10-16 2015-12-30 瑞声声学科技(深圳)有限公司 Mems压力传感器
CN108751119A (zh) * 2018-08-23 2018-11-06 安徽北方芯动联科微系统技术有限公司 一种具有应力缓冲结构的mems芯片及其制造方法
CN208940244U (zh) * 2018-11-02 2019-06-04 歌尔科技有限公司 Mems麦克风的封装结构及电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2768240A1 (en) * 2013-02-15 2014-08-20 Funai Electric Co., Ltd. Sound input device
CN103475983A (zh) * 2013-09-13 2013-12-25 山东共达电声股份有限公司 Mems麦克风及电子设备
CN105203233A (zh) * 2015-10-16 2015-12-30 瑞声声学科技(深圳)有限公司 Mems压力传感器
CN108751119A (zh) * 2018-08-23 2018-11-06 安徽北方芯动联科微系统技术有限公司 一种具有应力缓冲结构的mems芯片及其制造方法
CN208940244U (zh) * 2018-11-02 2019-06-04 歌尔科技有限公司 Mems麦克风的封装结构及电子设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115057407A (zh) * 2022-04-29 2022-09-16 潍坊歌尔微电子有限公司 Mems产品及电子设备

Also Published As

Publication number Publication date
CN212588513U (zh) 2021-02-23

Similar Documents

Publication Publication Date Title
CN109413554B (zh) 一种指向性mems麦克风
US20080219482A1 (en) Condenser microphone
CN101296530B (zh) 硅电容传声器
CN104956694A (zh) 麦克风组件
TWI732228B (zh) 麥克風封裝結構
JP2010141720A (ja) マイクロホンユニット及びそれを備えた音声入力装置
TWI533715B (zh) Packaging Method of Stacked Micro - Electromechanical Microphone
WO2022089299A1 (zh) 骨声纹传感器模组和电子设备
CN102158775B (zh) 微机电系统麦克风封装结构及其形成方法
CN115134727B (zh) 组合传感器、麦克风及电子设备
WO2023232033A1 (zh) 一种骨声纹传感器和电子设备
CN102118674B (zh) 一种mems麦克风及其封装方法
CN109495831B (zh) 一种mems麦克风的封装结构及其制造方法
WO2021237800A1 (zh) Mems 麦克风
WO2022062002A1 (zh) 一种骨传导麦克风
CN213847006U (zh) 传感器封装结构和电子设备
CN101437187A (zh) 用以减缩微型传感器封装体积的堆叠式封装结构
CN205622875U (zh) 一种mems麦克风
CN107113485A (zh) 在mems换能器封装件的制造中使用的基于引线框架的芯片载体
CN205616568U (zh) 一种集成传感器的封装结构
WO2021184403A1 (zh) Mems麦克风
JP2008271424A (ja) 音響センサ
CN110482477A (zh) 硅麦克风封装结构及其封装方法
CN112897451B (zh) 传感器封装结构及其制作方法和电子设备
CN215871838U (zh) 一种mems结构的封装件

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20937635

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20937635

Country of ref document: EP

Kind code of ref document: A1