WO2022089299A1 - 骨声纹传感器模组和电子设备 - Google Patents

骨声纹传感器模组和电子设备 Download PDF

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Publication number
WO2022089299A1
WO2022089299A1 PCT/CN2021/125309 CN2021125309W WO2022089299A1 WO 2022089299 A1 WO2022089299 A1 WO 2022089299A1 CN 2021125309 W CN2021125309 W CN 2021125309W WO 2022089299 A1 WO2022089299 A1 WO 2022089299A1
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WO
WIPO (PCT)
Prior art keywords
vibration
casing
sensor module
vibration pickup
bone voiceprint
Prior art date
Application number
PCT/CN2021/125309
Other languages
English (en)
French (fr)
Inventor
方华斌
端木鲁玉
Original Assignee
歌尔微电子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔微电子股份有限公司 filed Critical 歌尔微电子股份有限公司
Priority to EP21885026.1A priority Critical patent/EP4240025A1/en
Publication of WO2022089299A1 publication Critical patent/WO2022089299A1/zh
Priority to US18/307,411 priority patent/US20230269506A1/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/46—Special adaptations for use as contact microphones, e.g. on musical instrument, on stethoscope
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/283—Enclosures comprising vibrating or resonating arrangements using a passive diaphragm

Definitions

  • the present application relates to the technical field of bone conduction, and in particular, to a bone voiceprint sensor module and an electronic device.
  • the bone voiceprint sensor uses the slight vibration of the head and neck bones caused by people's speech to collect sound signals and convert them into electrical signals. Because it is different from traditional microphones that collect sound through air conduction, it can transmit sound with high definition in a very noisy environment. In many occasions, such as fire scenes, firefighters with anti-virus equipment cannot speak directly into the microphone with their mouths, so bone voiceprint sensors can be used at this time. With the development of electronic products, the application of bone voiceprint sensors is becoming more and more extensive.
  • the bone voiceprint sensor includes a vibration pickup unit and a sensor unit.
  • the vibration pickup unit is used to pick up the external bone vibration signal and transmit it to the sensor unit; the sensor unit is used to convert the vibration signal into an electrical signal.
  • the sensor unit includes a package housing and a sensor chip arranged in the package housing, the vibration pickup unit includes a vibration pickup housing with an open end and a vibration pickup film installed in the vibration pickup housing, and the vibration pickup housing has a The open end is mounted on the outer surface of the package housing. In this way, since the vibration pickup unit is arranged outside the package housing, the vibration pickup housing is easily affected by abnormal external force and the performance of the vibration pickup film is affected.
  • the main purpose of this application is to propose a bone voiceprint sensor module, which aims to solve the technical problem in the related art that the vibration pickup housing of the vibration pickup unit is easily affected by abnormal external forces.
  • a bone voiceprint sensor module comprising:
  • the first housing includes a first top plate opposite to the base plate;
  • a vibration pickup unit the vibration pickup unit is arranged in the packaging cavity, the vibration pickup unit includes a second casing with an open end, and an elastic vibration pickup member arranged in the second casing, the first The open end of the second shell is mounted on the base plate or the first top plate, and the second shell is provided with a vibration transmission through hole; and
  • the sensor unit includes a sensor chip mounted on the outer surface of the second casing, and the back cavity of the sensor chip is disposed corresponding to the vibration transmission through hole.
  • the second casing includes a second top plate opposite to the base plate or the first top plate, the vibration transmission through hole is opened in the second top plate, and the sensor chip is mounted on the second top plate. the outer surface of the second top plate.
  • the sensor unit further includes an ASIC chip electrically connected to the sensor chip, the ASIC chip is mounted on the outer surface of the second top plate, or the ASIC chip is mounted on the substrate.
  • the ASIC chip is electrically connected to the substrate through connecting wires.
  • the vibration pickup unit further includes a vibration adjustment member disposed on the elastic vibration pickup member.
  • the elastic vibration pickup member is a diaphragm.
  • the elastic vibration pickup member includes a mounting ring provided on the shell wall of the second housing, a vibration pickup sheet located in the mounting ring and spaced from the mounting ring, and connecting the mounting ring.
  • a connecting arm between the mounting ring and the vibration pickup sheet, and an elastic sealing film arranged in the gap between the mounting ring and the vibration pickup sheet, and the vibration adjusting member is provided on the vibration pickup sheet.
  • the substrate is a main control board of an electronic device.
  • the first casing is a metal casing; and/or,
  • the first casing is provided with a vent hole.
  • the present application also provides an electronic device, including the above-mentioned bone voiceprint sensor module.
  • the vibration pickup unit can be protected to prevent abnormal external forces from directly acting on the second casing , so as not to affect the performance of the elastic vibration pickup.
  • the requirements for the first casing can be reduced, and the first casing and the substrate do not need to form a three-layer PCB structure, thereby reducing the cost.
  • the protection effect of the vibration pickup unit can be further improved, the first casing can be kept away from the vibration-sensitive position, and the elastic vibration pickup can be improved. reliability.
  • FIG. 1 is a schematic structural diagram of an embodiment of a bone voiceprint sensor module according to the present application
  • FIG. 2 is a schematic structural diagram of another embodiment of the bone voiceprint sensor module of the present application.
  • FIG. 3 is a schematic structural diagram of another embodiment of a bone voiceprint sensor module according to the present application.
  • FIG. 4 is a schematic structural diagram of still another embodiment of the bone voiceprint sensor module of the present application.
  • the present application provides a bone voiceprint sensor module and an electronic device.
  • the bone voiceprint sensor module is used for electronic equipment, and the electronic equipment can be, but is not limited to, headsets, earphones, smart watches, smart bracelets, vehicle noise reduction equipment, and vibration sensing devices that are well known to those skilled in the art electronic equipment.
  • the bone voiceprint sensor module 100 includes:
  • a vibration pickup unit the vibration pickup unit is arranged in the packaging cavity 21 , and the vibration pickup unit includes a second housing 30 with one end open, and an elastic vibration pickup member 40 arranged in the second housing 30 ,
  • the open end of the second casing 30 is mounted on the base plate 10 or the first top plate 22, and the second casing 30 is provided with a vibration transmission through hole 31;
  • a sensor unit the sensor unit includes a sensor chip 50 mounted on the outer surface of the second housing 30 , and the back cavity 51 of the sensor chip 50 is disposed corresponding to the vibration transmission through hole 31 .
  • the substrate 10 is a circuit board, such as a PCB board.
  • the first housing 20 further includes a first enclosure plate 23 , and the first top plate 22 is provided at one end of the first enclosure plate 23 . The other end is open.
  • the elastic vibration pickup member 40 is installed on the peripheral wall of the second casing 30 to divide the space in the second casing 30 into a first cavity 32 and a second cavity 33 , the first cavity 32 and the second cavity 33 are respectively located on two sides of the elastic vibration pickup member 40 , and the vibration transmission through hole 31 communicates with the first cavity 32 and the back cavity 51 of the sensor chip 50 .
  • the elastic vibration pick-up member 40 is used to pick up the bone vibration of the outside world (such as the wearer, or other vibration sources, which will be described in the following by taking the wearer as an example) to generate vibration, thereby instigating the first cavity 32 to transmit vibration.
  • the gas in the through hole 31 and the back cavity 51 of the sensor chip 50 vibrates to transmit the vibration to the sensor chip 50 (ie, vibrate the sensing film 52 of the sensor chip 50 ), which generates an electrical signal.
  • the vibration pickup unit can be protected to prevent abnormal external forces from directly acting on the first shell 20. on the two housings 30 to avoid affecting the performance of the elastic vibration pick-up member 40 .
  • the requirements for the first casing 20 can be reduced, and the first casing 20 and the substrate 10 are not required to form a three-layer PCB structure (ie, the first casing 20
  • the top plate 22 , the first enclosure plate 23 and the base plate 10 are all PCB boards), thereby reducing the cost.
  • the open end of the second housing 30 is mounted on the substrate 10 .
  • the protection effect of the vibration pickup unit can be further improved, the first housing 20 can be kept away from the vibration-sensitive position, and the reliability of the elastic vibration pickup member 40 can be improved.
  • the second casing 30 is deformed by an external force during assembly, so as to avoid affecting the elastic vibration pickup member 40 .
  • the open end of the second casing 30 is mounted on the first top plate 22 .
  • vent hole 24 structure needs to be introduced.
  • the first housing 20 is provided with a vent hole 24 , and the vent hole 24 is used to vent pressure when the bone voiceprint sensor module 100 is assembled.
  • the vent hole 24 is opened on the first top plate 22 .
  • vent hole 24 is used to realize the communication between the internal space of the bone voiceprint sensor module 100 and the external environment, so that when assembling the bone voiceprint sensor module 100, it can be avoided that the internal space of the first shell 20 is caused by the internal space.
  • the air pressure difference caused the sensor chip 50 to fail.
  • the vent hole 24 needs to be blocked to prevent it from affecting the performance of the bone voiceprint sensor module 100 .
  • the vent hole 24 may be blocked by sealing glue, adhering a sealing tape, or adding a sealing plug.
  • the vent hole 24 can be kept away from the vibration-sensitive position, thereby improving the vibration resistance of the elastic vibration pick-up member 40 . reliability. Moreover, when the air vent hole 24 is sealed with the sealing glue, the sealing glue can be prevented from dripping onto the elastic vibration pickup member 40 to avoid affecting the operation of the elastic vibration pickup member 40 .
  • vent hole 24 may be configured as a single larger large through hole, or may be configured as a plurality of micro holes.
  • the effective vent area of the vent hole 24 can be greater than or equal to 5000 square micrometers.
  • the bone voiceprint sensor module 100 of the present application simplifies the product structure, can avoid the three-layer board structure, reduces the product cost, and improves the packaging reliability. Moreover, the first housing 20 and the air vent hole 24 can also be kept away from the vibration-sensitive position, so that the reliability of the elastic vibration pickup member 40 can be improved.
  • the first casing 20 is a metal casing, so that the first casing 20 can have a strong shielding effect.
  • the second casing 30 includes a second top plate 34 opposite to the base plate 10 or the first top plate 22 , the vibration transmission through holes 31 are opened in the second top plate 34 , the The sensor chip 50 is mounted on the outer surface of the second top plate 34 .
  • the second housing 30 further includes a second enclosure plate 35 , the second top plate 34 is disposed at one end of the second enclosure plate 35 , and the other end of the second enclosure plate 35 forms an opening.
  • the sensor chip 50 is mounted on the outer surface of the second top plate 34 through the packaging glue.
  • the second top plate 34 when the open end of the second casing 30 is installed on the base plate 10, the second top plate 34 is disposed opposite to the base plate 10; when the open end of the second casing 30 is installed on the first When the top plate 22 is installed, the second top plate 34 is disposed opposite to the first top plate 22 .
  • the vibration of the elastic vibration pickup member 40 can be easily transmitted to the sensing film 52 of the sensor chip 50 , thereby improving the performance of the bone voiceprint sensor module 100 .
  • the sensor chip 50 can also be disposed at other positions, such as the outer surface of the second enclosure plate 35 .
  • the sensor unit further includes an ASIC (Application Specific Integrated Circuit) chip, the ASIC chip 60 is electrically connected to the sensor chip 50 to process electrical signals generated by the sensor chip 50 .
  • ASIC Application Specific Integrated Circuit
  • the ASIC chip 60 may be installed in the package cavity 21 or outside the package cavity 21 (eg, directly installed on the main control board of an electronic device).
  • the ASIC chip The ASIC chip 60 is installed in the package cavity 21.
  • the ASIC chip 60 is mounted on the outer surface of the second top plate 34 .
  • the open end of the second casing 30 is mounted on the first top plate 22
  • the sensor chip 50 is mounted on the outer surface of the second top plate 34
  • the ASIC chip 60 is mounted on the substrate 10 .
  • the ASIC chip 60 is electrically connected to the substrate 10 through connecting wires 70 .
  • the sensor chip 50 can be electrically connected to the substrate 10 .
  • the vibration pickup unit further includes a vibration adjustment member 80 disposed on the elastic vibration pickup member 40 .
  • the vibration adjustment member 80 is used to adjust the vibration of the elastic vibration pickup member 40, so that the vibration of the elastic vibration pickup member 40 is better matched with the wearer's bone vibration signal, thereby improving the bone voiceprint sensor module. 100 sensitivity. Moreover, the vibration adjusting member 80 vibrates together with the elastic vibration pickup member 40 , which can increase the quality of the elastic vibration pickup member 40 when vibrating, thereby effectively avoiding the interference of external factors (such as sound waves).
  • the vibration adjusting member 80 may be bonded to the elastic vibration pickup member 40 through glue.
  • the vibration adjusting member 80 may be disposed on any side of the elastic vibration pickup member 40; that is, the vibration adjusting member 80 may be disposed in the first cavity 32 or in the first cavity 32. inside the second cavity 33 .
  • the vibration adjusting member 80 is a mass.
  • the elastic vibration pickup member 40 is a vibrating membrane
  • the vibration adjusting member 80 is disposed on the vibrating membrane.
  • the diaphragm can be a diaphragm with elastic deformation ability, including but not limited to a plastic diaphragm, a paper diaphragm, a metal diaphragm, a biological diaphragm, and the like.
  • the diaphragm can be a single-layer structure or a multi-layer composite diaphragm.
  • the diaphragm can be made of a single material or a composite of different materials. No specific description is given here.
  • the elastic vibration pick-up member 40 may also be configured in other structural forms.
  • the elastic vibration pick-up member 40 includes a The mounting ring of the shell wall of the two housings 30, the vibration pickup plate located in the mounting ring and spaced from the mounting ring, the connecting arm connecting the mounting ring and the vibration pickup plate, and the vibration pickup plate arranged between the mounting ring and the vibration pickup plate The elastic sealing film in the gap, the vibration adjusting member 80 is provided on the vibration pickup plate.
  • the sensor chip 50 may be a microphone chip or a pressure sensor chip 50 , that is, the sensor unit may use a MEMS microphone or a MEMS pressure sensor, so that the design difficulty of the bone voiceprint sensor module 100 can be reduced.
  • the side of the substrate 10 away from the first housing 20 is provided with an electrical connection portion 11 , and the electrical connection portion 11 is used for electrical connection with the main control board of the electronic device to The electrical connection between the main control board and the bone voiceprint sensing module is realized.
  • the substrate 10 is mounted on the surface of the main control board, and when the substrate 10 is mounted on the surface of the main control board, the electrical connection portion 11 is electrically connected to the electrical control board , so that the sensor chip 50 is electrically connected to the external circuit (ie, the circuit of the electronic device).
  • the substrate 10 can also be directly set as the main control board of the electronic device.
  • the substrate 10 is the main control board of the electronic device. In this way, not only can the cost be reduced, but also the overall height of the bone voiceprint sensor module 100 can be reduced, thereby facilitating the miniaturized design of electronic devices (especially for small electronic devices such as earphones). .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)

Abstract

本申请公开一种骨声纹传感器模组和电子设备，所述骨声纹传感器模组包括：基板；第一壳体，所述第一壳体的一端呈敞口设置，所述第一壳体的敞口端安装于所述基板，所述第一壳体与所述基板围合形成封装腔，所述第一壳体包括与所述基板相对设置的第一顶板；拾振单元，所述拾振单元设于所述封装腔内，所述拾振单元包括一端敞口的第二壳体、及设于所述第二壳体内的弹性拾振件，所述第二壳体的敞口端安装于所述基板或所述第一顶板，所述第二壳体上设有传振通孔；以及传感器单元，所述传感器单元包括安装于所述第二壳体外表面的传感器芯片，所述传感器芯片的背腔对应所述传振通孔设置。

Description

骨声纹传感器模组和电子设备
本申请要求于2020年10月27日申请的、申请号为202022432156.0的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及骨传导技术领域，特别涉及一种骨声纹传感器模组和电子设备。
 背景技术
骨声纹传感器是利用人讲话时引起的头颈部骨骼的轻微振动，来把声音信号收集起来转为电信号的。由于它不同于传统麦克风的通过空气传导采集声音，所以可以在很嘈杂的环境里也可以把声音高清晰的传出来。在许多场合如火灾现场，带着防毒而具的消防人员不能用嘴直接对着麦克风讲话，因此此时可以利用骨声纹传感器。随着电子产品的发展，骨声纹传感器的应用越来越广泛。
相关技术中，骨声纹传感器包括拾振单元和传感器单元，拾振单元用于拾取外界的骨振动信号，并传递给传感器单元；传感器单元用于将振动信号转化为电信号。其中，传感器单元包括封装壳体、及设于封装壳体内的传感器芯片，拾振单元包括一端敞口的拾振壳体和安装于拾振壳体内的拾振膜，所述拾振壳体的敞口端安装于封装壳体的外表面。这样，由于拾振单元设于封装壳体外，使得拾振壳体容易受非正常外力作用而影响拾振膜的性能，如拾振壳体容易受外力变形，从而会影响拾振膜的性能。
 技术问题
本申请的主要目的是提出一种骨声纹传感器模组，旨在解决相关技术中，拾振单元的拾振壳体容易受非正常外力作用的技术问题。
 技术解决方案
为实现上述目的，本申请提出一种骨声纹传感器模组，包括：
基板；
第一壳体，所述第一壳体的一端呈敞口设置，所述第一壳体的敞口端安装于所述基板，所述第一壳体与所述基板围合形成封装腔，所述第一壳体包括与所述基板相对设置的第一顶板；
拾振单元，所述拾振单元设于所述封装腔内，所述拾振单元包括一端敞口的第二壳体、及设于所述第二壳体内的弹性拾振件，所述第二壳体的敞口端安装于所述基板或所述第一顶板，所述第二壳体上设有传振通孔；以及
传感器单元，所述传感器单元包括安装于所述第二壳体外表面的传感器芯片，所述传感器芯片的背腔对应所述传振通孔设置。
在一实施例中，所述第二壳体包括与所述基板或所述第一顶板相对的第二顶板，所述传振通孔开设于所述第二顶板，所述传感器芯片安装于所述第二顶板的外表面。
在一实施例中，所述传感器单元还包括与所述传感器芯片电连接的ASIC芯片，所述ASIC芯片安装于所述第二顶板的外表面，或者，所述ASIC芯片安装于所述基板。
在一实施例中，所述ASIC芯片通过连接线与所述基板电连接。
在一实施例中，所述拾振单元还包括设于所述弹性拾振件的振动调节件。
在一实施例中，所述弹性拾振件为振膜。
在一实施例中，所述弹性拾振件包括设于所述第二壳体的壳壁的安装环、位于所述安装环内且与所述安装环间隔设置的拾振片、连接所述安装环与所述拾振片的连接臂、及设于所述安装环与所述拾振片之间的间隙内的弹性密封膜，所述振动调节件设于所述拾振片。
在一实施例中，所述基板为电子设备的主控板。
在一实施例中，所述第一壳体为金属壳体；和/或，
所述第一壳体上设有泄气孔。
本申请还提出一种电子设备，包括如上所述的骨声纹传感器模组。
 有益效果
本申请中，通过使第一壳体与基板围合形成封装腔，并使拾振单元设于封装腔内，可对拾振单元进行保护，以避免非正常外力直接作用到第二壳体上，以避免影响弹性拾振件的性能。而且，通过使传感器芯片安装于第二壳体的外表面，可降低对第一壳体的要求，而不用使第一壳体与基板构成三层PCB板结构，从而可降低成本。
特别对于“所述第二壳体的敞口端安装于基板”的方案，可进一步地提高对拾振单元的保护效果，可使得第一壳体远离振动敏感位置，从而可提高弹性拾振件的可靠性。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请骨声纹传感器模组一实施例的结构示意图；
图2为本申请骨声纹传感器模组另一实施例的结构示意图；
图3为本申请骨声纹传感器模组又一实施例的结构示意图；
图4为本申请骨声纹传感器模组再一实施例的结构示意图。
附图标号说明：
标号 名称 标号 名称
100 骨声纹传感器模组 33 第二腔体
10 基板 34 第二顶板
11 电连接部 35 第二围板
20 第一壳体 40 弹性拾振件
21 封装腔 50 传感器芯片
22 第一顶板 51 背腔
23 第一围板 52 感应膜
24 泄气孔 60 ASIC芯片
30 第二壳体 70 连接线
31 传振通孔 80 振动调节件
32 第一腔体    
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，若本申请实施例中有涉及方向性指示（诸如上、下、左、右、前、后……），则该方向性指示仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，若本申请实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，全文中出现的“和/或”的含义为，包括三个并列的方案，以“A和/或B”为例，包括A方案，或B方案，或A和B同时满足的方案。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
本申请提出一种骨声纹传感器模组和电子设备。其中，骨声纹传感器模组用于电子设备，该电子设备可以是但不限于头戴设备、耳机、智能手表、智能手环、车载降噪设备及振动感测装置等本领域技术人员所熟知的电子设备。
在本申请的实施例中，如图1-4所示，所述骨声纹传感器模组100包括：
基板10；
第一壳体20，所述第一壳体20的一端呈敞口设置，所述第一壳体20的敞口端安装于基板10，所述第一壳体20与基板10围合形成封装腔21，所述第一壳体20包括与基板10相对设置的第一顶板22；
拾振单元，所述拾振单元设于封装腔21内，所述拾振单元包括一端敞口的第二壳体30、及设于所述第二壳体30内的弹性拾振件40，所述第二壳体30的敞口端安装于基板10或第一顶板22，所述第二壳体30上设有传振通孔31；以及
传感器单元，所述传感器单元包括安装于第二壳体30外表面的传感器芯片50，所述传感器芯片50的背腔51对应传振通孔31设置。
具体的，所述基板10为电路板，如PCB板等。
具体的，如图1-4所示，所述第一壳体20还包括第一围板23，所述第一顶板22设于第一围板23的一端，所述第一围板23的另一端形成敞口。
具体的，如图1-4所示，所述弹性拾振件40安装于第二壳体30的周壁，以将第二壳体30内的空间分隔成第一腔体32和第二腔体33，所述第一腔体32与第二腔体33分别位于弹性拾振件40的两侧，所述传振通孔31连通第一腔体32与传感器芯片50的背腔51。
工作时，所述弹性拾振件40用于拾取外界（如佩戴者，或其他振动源，下文以佩戴者为例进行说明）的骨振动而产生振动，从而策动第一腔体32、传振通孔31及传感器芯片50的背腔51内的气体振动，以将振动传递给传感器芯片50（即、使传感器芯片50的感应膜52振动），所述传感器芯片50从而产生电信号。
本申请中，通过使第一壳体20与基板10围合形成封装腔21，并使拾振单元设于封装腔21内，可对拾振单元进行保护，以避免非正常外力直接作用到第二壳体30上，以避免影响弹性拾振件40的性能。
而且，通过使传感器芯片50安装于第二壳体30的外表面，可降低对第一壳体20的要求，而不用使第一壳体20与基板10构成三层PCB板结构（即第一顶板22、第一围板23及基板10三者均为PCB板），从而可降低成本。
在本申请的一实施例中，如图1所示，所述第二壳体30的敞口端安装于基板10。如此，可进一步地提高对拾振单元的保护效果，可使得第一壳体20远离振动敏感位置，从而可提高弹性拾振件40的可靠性。如可避免装配时第二壳体30受到外力作用而变形，以避免影响弹性拾振件40。
在本申请的另一实施例中，如图2所示，所述第二壳体30的敞口端安装于第一顶板22。
为了进一步地描述本申请的效果，需引入泄气孔24结构。
具体的，如图1-4所示，所述第一壳体20上设有泄气孔24，所述泄气孔24用于在装配骨声纹传感器模组100时泄压。在一实施例中，所述泄气孔24开设于第一顶板22。
具体来说，所述泄气孔24用于实现骨声纹传感器模组100的内部空间与外部环境连通，这样，在装配骨声纹传感器模组100时，可避免由于第一壳体20内外空间的气压差而导致传感器芯片50失效。
但是，在骨声纹传感器模组100应用时，即将其应用到电子设备上时，泄气孔24需要被封堵，以免其影响骨声纹传感器模组100的性能。在一实施例中，可以通过密封胶水、或粘接密封胶带、或添加密封塞等形式将泄气孔24封堵。
需要说明的是，如图1和4所示，若所述第二壳体30的敞口端安装于基板10，则可使泄气孔24远离振动敏感位置，从而可提高弹性拾振件40的可靠性。而且，在通过密封胶水密封泄气孔24时，可避免密封胶水滴落到弹性拾振件40上，以避免影响弹性拾振件40工作。
具体的，所述泄气孔24既可以设置成单个较大的大通孔，也可以设置为包括多个微孔。且在一实施例中，可使泄气孔24的有效泄气面积大于或等于5000平方微米。
总的来说，本申请骨声纹传感器模组100，简化了产品结构，可避免三层板结构，降低了产品成本，且提升了封装可靠性。而且，还可将第一壳体20及泄气孔24远离振动敏感位置，从而可提升弹性拾振件40可靠性。
进一步地，所述第一壳体20为金属壳体，如此，可使得第一壳体20具有较强的屏蔽作用。
进一步地，如图1所示，所述第二壳体30包括与所述基板10或第一顶板22相对的第二顶板34，所述传振通孔31开设于第二顶板34，所述传感器芯片50安装于第二顶板34的外表面。具体的，所述第二壳体30还包括第二围板35，所述第二顶板34设于第二围板35的一端，所述第二围板35的另一端形成敞口。具体的，所述传感器芯片50通过封装胶安装于第二顶板34的外表面。
具体的，可以理解，当所述第二壳体30的敞口端安装于基板10时，所述第二顶板34与基板10相对设置；当第二壳体30的敞口端安装于第一顶板22时，所述第二顶板34与第一顶板22相对设置。
如此，可便于将弹性拾振件40的振动传递给传感器芯片50的感应膜52，从而可提高骨声纹传感器模组100的性能。
当然，于其他实施例中，也可使所述传感器芯片50设于其他位置，如第二围板35的外表面。
进一步地，如图1所示，所述传感器单元还包括与所述传感器芯片50电连接的ASIC（Application Specific Integrated Circuit）芯片，所述ASIC芯片60与传感器芯片50电连接，以对传感器芯片50产生的电信号进行处理。
具体的，所述ASIC芯片60既可以安装在封装腔21内，也可以安装于封装腔21外（如直接安装在电子设备的主控板上），在本申请的示例中，所述ASIC芯片60安装在封装腔21内，如在本申请的一实施例和另一实施例中，如图1和2所示，所述ASIC芯片60安装于第二壳体30的外表面，且在一实施例中，所述ASIC芯片60安装于第二顶板34的外表面。又如，在本申请的又一实施例中，如图3所示，第二壳体30的敞口端安装于第一顶板22，所述传感器芯片50安装于第二顶板34的外表面，所述ASIC芯片60安装于所述基板10。
进一步地，如图1-4所示，所述ASIC芯片60通过连接线70与基板10电连接。如此，可使得传感器芯片50与基板10电连接。
进一步地，如图1-4所示，所述拾振单元还包括设置在弹性拾振件40上的振动调节件80。
其中，所述振动调节件80用于对弹性拾振件40的振动进行调节，使弹性拾振件40的振动与佩戴者的骨振动信号匹配性更好，从而可提高骨声纹传感器模组100的灵敏度。而且，振动调节件80随弹性拾振件40一同振动，可增加弹性拾振件40振动时的质量，从而可以有效避免外界因素（如声波）的干扰。
在一实施例中，所述振动调节件80可以通过胶体粘接在弹性拾振件40上。
在一实施例中，所述振动调节件80可以设于弹性拾振件40的任意一面；即是说，所述振动调节件80既可以设于第一腔体32内，也可以设于第二腔体33内。
在一实施例中，所述振动调节件80为质量块。
进一步地，所述弹性拾振件40为振膜，所述振动调节件80设于所述振膜。其中，振膜可以采用具有弹性形变能力的膜片，包括但不限于塑料膜片、纸质膜片、金属膜片、生物膜片等。而且，振膜可以采用单层结构，也可以采用多层复合的膜片。而且，振膜可以采用单一材质，也可以采用不同材质复合而成。在此不再具体说明。
当然，于其他实施例中，所述弹性拾振件40也可设置为其他结构形式，如在弹性拾振件40的第二实施例中，所述弹性拾振件40包括设于所述第二壳体30的壳壁的安装环、位于所述安装环内且与安装环间隔设置的拾振片、连接安装环与拾振片的连接臂、及设于安装环与拾振片之间的间隙内的弹性密封膜，所述振动调节件80设于拾振片。
在一实施例中，所述传感器芯片50可以为麦克风芯片或压力传感器芯片50，也即传感器单元可以采用MEMS麦克风或MEMS压力传感器，如此，可以降低骨声纹传感器模组100的设计难度。
进一步地，如图1-3所示，所述基板10的背离第一壳体20的侧面设有电连接部11，所述电连接部11用于与电子设备的主控板电连接，以实现主控板与骨声纹传感模组的电连接。具体来说，在装配骨声纹传感模组时，基板10贴装到主控板的表面，且当基板10贴装到主控板的表面时，电连接部11与电控板电连接，以使传感器芯片50与外部电路（即电子设备的电路）电连接。
当然，于其他实施例中，也可将基板10直接设置为电子设备的主控板，如在本申请的再一实施例中，如图4所示，所述基板10为电子设备的主控板，如此，不仅可降低成本，还可有利于降低骨声纹传感器模组100的整体高度，从而有利于实现电子设备的小型化设计（特别是对耳机等这类小巧的电子设备来说）。
以上所述仅为本申请的可选实施例，并非因此限制本申请的专利范围，凡是在本申请的发明构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (10)

  1. 一种骨声纹传感器模组，其中，所述骨声纹传感器模组包括：
    基板；
    第一壳体，所述第一壳体的一端呈敞口设置，所述第一壳体的敞口端安装于所述基板，所述第一壳体与所述基板围合形成封装腔，所述第一壳体包括与所述基板相对设置的第一顶板；
    拾振单元，所述拾振单元设于所述封装腔内，所述拾振单元包括一端敞口的第二壳体、及设于所述第二壳体内的弹性拾振件，所述第二壳体的敞口端安装于所述基板或所述第一顶板，所述第二壳体上设有传振通孔；以及
    传感器单元，所述传感器单元包括安装于所述第二壳体外表面的传感器芯片，所述传感器芯片的背腔对应所述传振通孔设置。
  2. 如权利要求1所述的骨声纹传感器模组，其中，所述第二壳体包括与所述基板或所述第一顶板相对的第二顶板，所述传振通孔开设于所述第二顶板，所述传感器芯片安装于所述第二顶板的外表面。
  3. 如权利要求2所述的骨声纹传感器模组，其中，所述传感器单元还包括与所述传感器芯片电连接的ASIC芯片，所述ASIC芯片安装于所述第二顶板的外表面，或者，所述ASIC芯片安装于所述基板。
  4. 如权利要求3所述的骨声纹传感器模组，其中，所述ASIC芯片通过连接线与所述基板电连接。
  5. 如权利要求1至4中任意一项所述的骨声纹传感器模组，其中，所述拾振单元还包括设于所述弹性拾振件的振动调节件。
  6. 如权利要求5所述的骨声纹传感器模组，其中，所述弹性拾振件为振膜。
  7. 如权利要求5所述的骨声纹传感器模组，其中，所述弹性拾振件包括设于所述第二壳体的壳壁的安装环、位于所述安装环内且与所述安装环间隔设置的拾振片、连接所述安装环与所述拾振片的连接臂、及设于所述安装环与所述拾振片之间的间隙内的弹性密封膜，所述振动调节件设于所述拾振片。
  8. 如权利要求1至5中任意一项所述的骨声纹传感器模组，其中，所述基板为电子设备的主控板。
  9. 如权利要求1至5中任意一项所述的骨声纹传感器模组，其中，所述第一壳体为金属壳体；和/或，
    所述第一壳体上设有泄气孔。
  10. 一种电子设备，其中，所述电子设备包括如权利要求1至9任一项所述的骨声纹传感器模组。
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