WO2023000999A1 - 振动传感器和电子设备 - Google Patents

振动传感器和电子设备 Download PDF

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Publication number
WO2023000999A1
WO2023000999A1 PCT/CN2022/104655 CN2022104655W WO2023000999A1 WO 2023000999 A1 WO2023000999 A1 WO 2023000999A1 CN 2022104655 W CN2022104655 W CN 2022104655W WO 2023000999 A1 WO2023000999 A1 WO 2023000999A1
Authority
WO
WIPO (PCT)
Prior art keywords
vibration
circuit board
assembly
pickup
support
Prior art date
Application number
PCT/CN2022/104655
Other languages
English (en)
French (fr)
Inventor
端木鲁玉
田峻瑜
方华斌
Original Assignee
歌尔微电子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔微电子股份有限公司 filed Critical 歌尔微电子股份有限公司
Publication of WO2023000999A1 publication Critical patent/WO2023000999A1/zh
Priority to US18/417,006 priority Critical patent/US20240151576A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/46—Special adaptations for use as contact microphones, e.g. on musical instrument, on stethoscope
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones

Definitions

  • the present application relates to the technical field of sensors, in particular to a vibration sensor and electronic equipment using the vibration sensor.
  • the bone voiceprint sensor is a kind of sensor that uses the vibration of the diaphragm to instigate air flow, excites the MEMS diaphragm, and uses this to detect the flow signal, so the bone voiceprint sensor can be used for head and neck bones caused by human speech.
  • the slight vibration is used to collect the sound signal and convert it into an electrical signal, which is different from the traditional microphone to collect sound through air conduction, so the sound can be transmitted with high clarity even in a very noisy environment.
  • the bone voiceprint sensor usually includes a vibration pickup unit and a microphone unit.
  • the vibration pickup unit is used to pick up external bone vibration and transmits it to the microphone unit.
  • the microphone unit is used to convert the vibration signal into an electrical signal.
  • the microphone unit is usually surrounded by multiple circuit boards to form an internal space, and a chip module is arranged in the internal space, so that there are multiple bonding positions between multiple circuit boards, resulting in low reliability of product performance. Holes are opened on the circuit board to connect the chip module to the installation space of the vibration pickup unit.
  • the structure is complex, the manufacturing process is lengthy, and the cost is too high, resulting in a low product yield.
  • the main purpose of this application is to provide a vibration sensor, which aims to simplify the structure of the vibration sensor, reduce the processing difficulty and cost, and improve the structural reliability of the vibration sensor.
  • the vibration sensor includes:
  • the housing is covered on one side of the circuit board assembly to enclose and form an installation space;
  • a vibration pickup component the vibration pickup component is arranged in the installation space, and the vibration pickup component is used to pick up external bone vibrations to generate response vibrations;
  • the support shell is connected to the side of the vibration pickup assembly away from the circuit board assembly;
  • the chip component is connected to the side of the supporting shell away from the circuit board component, and is electrically connected to the circuit board component;
  • a conduction cavity is enclosed and formed among the vibration pickup component, the supporting shell and the chip component.
  • the chip assembly includes:
  • a MEMS element the MEMS element is connected to a side of the support shell away from the vibration pickup assembly, and the MEMS element and the support shell are surrounded by the vibration pickup assembly to form the conductive cavity;
  • the ASIC chip is connected to the supporting shell, and is electrically connected to the MEMS element and the circuit board assembly respectively.
  • the supporting shell and the vibration pickup component are enclosed to form a first chamber
  • the MEMS element is enclosed with the supporting shell to form a second chamber
  • the supporting shell is provided with The vibration transmission hole, the first chamber and the second chamber communicate through the vibration transmission hole to form the conduction cavity.
  • the vibration-transmitting through-holes are micro-holes
  • the vibration sensor further includes an airflow buffer structure, and the airflow buffer structure covers the vibration transmission through hole;
  • vibration-transmitting through holes there are multiple vibration-transmitting through holes, and the multiple vibration-transmitting through holes are spaced apart in the support shell;
  • the volume of the first chamber is V1, 0.1mm3 ⁇ V1 ⁇ 20mm3.
  • a pressure relief chamber is formed between the chip component and the housing, the housing is provided with a pressure relief hole communicating with the pressure relief chamber, and the MEMS element is provided with a pressure relief hole communicating with the first pressure relief chamber.
  • the second chamber and the first airflow channel of the pressure relief chamber are provided between the chip component and the housing, the housing is provided with a pressure relief hole communicating with the pressure relief chamber, and the MEMS element is provided with a pressure relief hole communicating with the first pressure relief chamber.
  • the pressure relief hole and the MEMS element are arranged in dislocation.
  • the vibration pickup component is connected to the circuit board component to enclose and form a vibration cavity.
  • the vibration pickup component includes:
  • the support is fixedly connected to the circuit board assembly
  • An elastic vibration pickup the elastic vibration pickup is connected to the support, one side of the elastic vibration pickup is surrounded by the circuit board assembly to form the vibration cavity, and the other side of the elastic vibration pickup is forming the conduction chamber enclosed by the chip assembly and the support case;
  • a vibration adjustment part is connected with the elastic vibration pickup part.
  • the elastic vibration pickup is connected to a side of the support away from the circuit board assembly, and the outer periphery of the elastic vibration pickup covers the support, and the support The shell is connected to the side of the elastic vibration pickup member away from the support member;
  • an avoidance groove is formed on the side of the circuit board assembly facing the vibration chamber;
  • the elastic vibration pickup member and the vibration adjustment member are provided with a second airflow channel, and the second airflow channel communicates with the conduction cavity and the vibration cavity.
  • the circuit board assembly includes multilayer circuit boards stacked.
  • the present application also proposes an electronic device, the electronic device includes a vibration sensor, and the vibration sensor includes:
  • the housing is covered on one side of the circuit board assembly to enclose and form an installation space;
  • a vibration pickup component the vibration pickup component is arranged in the installation space, and the vibration pickup component is used to pick up external bone vibrations to generate response vibrations;
  • the support shell is connected to the side of the vibration pickup assembly away from the circuit board assembly;
  • the chip component is connected to the side of the supporting shell away from the circuit board component, and is electrically connected to the circuit board component;
  • a conduction cavity is enclosed and formed among the vibration pickup component, the supporting shell and the chip component.
  • the vibration sensor of the technical solution of the present application is covered on one side of the circuit board assembly by the shell to directly enclose and form the installation space.
  • the vibration pickup component is away from the side of the circuit board component, and then the vibration pickup component is connected to the side of the support shell away from the vibration pickup component, so that the internal structure is compact and the installation is more convenient, and the vibration pickup component, the support shell and the chip component A conduction cavity is formed around it, so that the response vibration generated by the vibration pickup component picking up external bone vibration is transmitted to the chip component through the conduction cavity.
  • the vibration sensor of the present application does not need to form a space for installing chip components in the circuit board assembly, thereby reducing the number of exposed bonding positions of the circuit board assembly, simplifying the installation process, and ensuring the stability of the overall structure of the circuit board assembly.
  • the risk of reliability is reduced, and there is no need to open holes on the circuit board, thereby simplifying the structure of the vibration sensor, and reducing processing difficulty and cost.
  • FIG. 1 is a schematic structural diagram of an embodiment of a vibration sensor of the present application.
  • connection and “fixation” should be interpreted in a broad sense, for example, “fixation” can be a fixed connection, a detachable connection, or an integral body; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be an internal communication between two elements or an interaction relationship between two elements, unless otherwise clearly defined.
  • fixing can be a fixed connection, a detachable connection, or an integral body; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be an internal communication between two elements or an interaction relationship between two elements, unless otherwise clearly defined.
  • the present application proposes a vibration sensor 100 .
  • the vibration sensor 100 includes a circuit board assembly 10, a housing 20, a vibration pickup assembly 30, a supporting shell 50 and a chip assembly 40, and the housing 20 covers the circuit board assembly 10
  • One side is enclosed to form an installation space 90;
  • the vibration pickup assembly 30 is arranged in the installation space 90, and the vibration pickup assembly 30 is used to pick up external bone vibration to generate response vibration;
  • the support shell 50 is connected to On the side of the vibration pickup assembly 30 away from the circuit board assembly 10;
  • the chip assembly 40 is connected to the side of the supporting shell 50 away from the circuit board assembly 10, and electrically Sexual connection; wherein, a conductive cavity 60 is formed between the vibration pickup assembly 30 , the support shell 50 and the chip assembly 40 .
  • the vibration pickup assembly 30 When working, the vibration pickup assembly 30 is used to pick up bone vibrations from the outside world (such as the wearer, or other vibration sources, the wearer is used as an example below) to generate response vibrations, that is to say, the bone vibrations from the outside world are transmitted to the vibration pickup body.
  • component 30, the elastic vibration pickup part 32 of the vibration pickup component 30 vibrates to generate a response vibration, and transmits the vibration to the chip component 40 through the conduction cavity 60, so that the chip component 40 generates an electrical signal according to the received response vibration, and The electricity is transmitted to the circuit board assembly 10 .
  • the vibration sensor 100 of the technical solution of the present application is covered on one side of the circuit board assembly 10 by the housing 20 to directly enclose the installation space 90, and at the same time, the vibration pickup assembly 30, the support shell 50 and the chip assembly 40 are all arranged in the installation space 90 and make the support shell 50 fixed on the side of the vibration pickup assembly 30 away from the circuit board assembly 10, and then the vibration pickup assembly 10 is connected to the side of the support shell 50 away from the vibration pickup assembly 30, so that the internal structure is compact and the installation is relatively Conveniently, a conduction cavity 60 is enclosed between the vibration pickup component 30 , the supporting shell 50 and the chip component 40 , so that the response vibration of the vibration pickup component 30 is transmitted to the chip component 40 through the conduction cavity 60 .
  • the vibration sensor 100 of the present application does not need to form a space for installing the chip assembly 40 in the circuit board assembly 10, thereby reducing the number of exposed bonding positions of the circuit board assembly 10, simplifying the installation process, and ensuring the integrity of the circuit board assembly 10.
  • the stability of the structure reduces the risk of reliability, and at the same time, there is no need to open holes on the circuit board, thereby simplifying the structure of the vibration sensor 100 and reducing the processing difficulty and cost.
  • the chip assembly 40 includes a MEMS element 411 and an ASIC chip 42, the MEMS element 411 is connected to the side of the support shell 50 away from the vibration pickup assembly 30, and the MEMS element 411 and the support shell 50 and the vibration pickup assembly 30 enclose the conductive cavity 60; the ASIC chip 42 is connected to the support shell 50, and is connected to the MEMS element 411 and the circuit board assembly respectively 10 electrical connections.
  • the support shell 50 can be fixed on the side of the vibration pickup assembly 30 away from the circuit board assembly 10, and at the same time, by installing the MEMS element 411 and the ASIC chip 42 on the same side of the support shell 50 away from the vibration pickup assembly 30, the MEMS element 411 and ASIC chip 42 provide installation positions, which not only ensure the stability after installation, but also facilitate synchronous installation in the early stage and maintenance and disassembly in the later stage.
  • the MEMS element 411 and the supporting shell 50 and the vibration pickup assembly 30 surround and form a conductive cavity 60, so that the response vibration of the vibration pickup assembly 30 can be transmitted to the MEMS element 411 to receive the response vibration, and electrically transmitted to the ASIC chip 42 for further processing. Process the output electrical signal.
  • the MEMS element 411 can be a capacitive structure, a piezoresistive structure or a piezoelectric structure.
  • the support shell 50 and the vibration pickup assembly 30 enclose to form a first cavity 61
  • the MEMS element 411 and the support shell 50 enclose to form a second cavity 62
  • the supporting shell 50 is provided with a vibration transmission hole 51
  • the first chamber 61 and the second chamber 62 communicate through the vibration transmission hole 51 to form the conduction cavity 60 .
  • the support shell 50 and the vibration pickup assembly 30 enclose the first cavity 61 to form a vibration space for the elastic vibration pickup member 32 of the vibration pickup assembly 30 , and through the support shell 50 provided with a vibration transmission The through hole 51, so that the vibration pickup assembly 30 forms a response vibration in the first chamber 61 after vibrating, and transmits it to the second chamber 62 formed by the MEMS element 411 and the support shell 50 through the vibration transmission through hole 51, so So that the MEMS element 411 can receive the response vibration and electrically transfer it to the ASIC chip 42 for processing and outputting an electrical signal.
  • the vibration transmission through hole 51 is set as a microhole; wherein, the diameter of the microhole can be selected as 1um ⁇ 100um, so by setting the vibration transmission through hole 51 as a microhole, it can be Damping the airflow flowing between the first chamber 61 and the second chamber 62, thereby suppressing the peak sensitivity of the vibration sensor 100, thereby improving the frequency response characteristics of the vibration sensor 100, and expanding the operating frequency of the vibration sensor 100 Wide width improves product performance.
  • the vibration sensor 100 further includes an airflow buffer structure (not shown), and the airflow buffer structure covers the vibration transmission through hole 51; 51, so that an airflow buffer structure can be provided at the vibration transmission hole 51, and the airflow buffer structure can be a breathable film or an adapter sheet with micro holes, etc., so that the frequency response characteristics of the vibration sensor 100 can be further improved. Expand the operating bandwidth of the vibration sensor 100 to improve product performance.
  • multiple vibration-transmitting through-holes 51 there are multiple vibration-transmitting through-holes 51 , and the multiple vibration-transmitting through-holes 51 are opened in the support shell 50 at intervals.
  • multiple vibration transmission through holes 51 can also be provided, so as to prevent the normal flow of air flow between the first chamber 61 and the second chamber 62 when a single vibration transmission through hole 51 is blocked and fails.
  • the volume of the first chamber 61 is V1, 0.1mm3 ⁇ V1 ⁇ 20mm3.
  • the vibration space required by the vibration-pickup member 32 can be elasticized, and at the same time, the overall volume of the vibration sensor 100 can be avoided from being too large.
  • a pressure relief chamber 80 is formed between the chip assembly 40 and the housing 20 , and the housing 20 is provided with a pressure relief hole 21 communicating with the pressure relief chamber 80 , the MEMS element 411 defines a first gas flow channel 411 communicating with the second chamber 62 and the pressure relief chamber 80 .
  • the chip assembly 40 and the housing A pressure relief cavity 80 is formed between the 20, and a pressure relief hole 21 communicating with the pressure relief cavity 80 is opened in the housing 20, and the MEMS element 411 is provided with a first airflow channel 411 communicating with the second chamber 62 and the pressure relief cavity 80, In this way, the airflow in the inner space of the second chamber 62 after the vibration of the vibration pickup assembly 30 can flow through the first airflow channel 411 to the pressure relief chamber 80, and flow to the outside through the pressure relief hole 21, so as to ensure the airflow in the installation space 90. normal use of each component.
  • the MEMS element 411 is a capacitive structure, and can be selected from single diaphragm/single back pole, double diaphragm/single back pole, single diaphragm/double back pole, etc., and a vent hole for venting is placed on the diaphragm to
  • the first airflow channel 411 is formed, and the shape of the hole can be a circular hole with a diameter of 1um ⁇ 30um, or a fan-shaped gap with a width of 0.2um ⁇ 20um; and when the MEMS element 411 is a piezoresistive or piezoelectric structure, a fan blade structure can be selected , the number can be between 1 and 50; the fan blade gap is preferably 0.1um to 30um.
  • a gas connection channel can also be provided between the vibration chamber 70 and the pressure relief chamber 80 enclosed by the vibration pickup assembly 30 and the circuit board assembly 10.
  • the circuit board assembly 10 , the vibration pickup assembly 30 or both of them can be connected.
  • another conduit can be provided for communication, which can be selected by those skilled in the art.
  • the pressure relief hole 21 and the MEMS element 411 are arranged in dislocation. Wherein, in order to avoid that external light and other factors can directly pass through the pressure relief hole 21 and affect the normal operation of the MEMS element 411, the pressure relief hole 21 is opened at the position of the housing 20 and the MEMS element 411 is misplaced to ensure that the MEMS element 411 Stability during work, improve reliability.
  • the vibration pickup assembly 30 is connected to the circuit board assembly 10 to enclose a vibration chamber 70 .
  • the elastic vibration pickup member 32 of the vibration pickup assembly 30 works in a two-way vibration
  • the vibration cavity 70 is formed by synchronously enclosing it, so that the elastic vibration pickup assembly
  • the vibration space provided by 32 ensures the sensitivity of the vibration pickup assembly 30.
  • the volume of the vibration cavity 70 can be 0.1 mm3 to 20 mm3, so that the vibration space required by the vibration pickup 32 can be elastically accommodated, and at the same time, the overall volume of the vibration sensor 100 can be avoided from being too large.
  • the chip assembly 40 is connected to the side of the vibration pickup assembly 30 away from the circuit board to enclose the conductive cavity 60, so that the vibration pickup assembly 30 and the chip assembly 40 can be assembled with the circuit board assembly 10 during installation, and then Covering the shell 20 on the circuit board assembly 10 simplifies the installation process, improves installation efficiency, and can cover and protect internal components.
  • the vibration pickup assembly 30 includes a support member 31, an elastic vibration pickup member 32 and a vibration adjustment member 33, the support member 31 is fixedly connected to the circuit board assembly 10;
  • the vibration part 32 is connected to the support part 31, one side of the elastic vibration pickup part 32 is enclosed with the circuit board assembly 10 to form the vibration cavity 70, and the other side of the elastic vibration pickup part 32 is connected to the circuit board assembly 10.
  • the chip assembly 40 and the supporting shell 50 enclose the conduction cavity 60 ; the vibration adjustment member 33 is connected to the elastic vibration pickup member 32 .
  • the support 31 is fixedly connected to the circuit board assembly 10, so as to ensure the stability of the installation of the vibration pickup assembly 30, and the elastic vibration pickup 32 is connected to the support 31, and the upper and lower sides of the elastic vibration pickup 32 are respectively
  • the conducting cavity 60 and the vibrating cavity 70 are formed, so that the elastic vibration pickup member 32 vibrates to generate response vibration, which will affect the pressure of the conducting cavity 60 and the vibrating cavity 70 .
  • the elastic pickup 32 can be made of organic polymer film or glue, metal sheet or other elastic materials, and the vibration area is selected from 0.2mm2 to 200mm2, so that the vibration amplitude of the elastic pickup 32 can be guaranteed, and the vibration adjustment
  • the member 33 can be a block structure such as a circle, a square or a rectangle, and the mass can be selected between 0.2mg and 20mg.
  • the vibration regulator 33 can be placed on the upper part, the lower part of the elastic vibration pickup member 32 or embedded in it, so that the vibration regulator 33 can increase the amplitude of the response vibration generated when the elastic vibration picking member 32 receives bone vibration.
  • the elastic vibration pickup 32 is connected to the side of the support 31 away from the circuit board assembly 10, and the outer periphery of the elastic vibration pickup 32 covers the support 31, the support shell 50 is connected to the side of the elastic vibration pickup 32 away from the support 31; wherein, by connecting the support 31, the elastic vibration pickup 32 and the support shell 50 along the side away from the circuit board assembly 10 The directions are stacked and installed sequentially, so as to facilitate the overall processing of the vibration sensor 100, thereby improving the installation efficiency.
  • the circuit board assembly 10 forms an avoidance groove 11 on the side facing the vibration chamber 70; wherein, in order to further increase the vibration space of the vibration chamber 70, it is possible to One side of the vibrating cavity 70 forms an avoidance groove 11, and the depth can be between 10mm and 1000mm, so that the vibration amplitude of the elastic vibration picking member 32 will not be affected when vibrating in the vibrating cavity 70, and the sensitivity of the vibration of the vibration picking assembly 30 can be improved. sex.
  • the elastic vibration pickup member 32 and the vibration adjustment member 33 are provided with a second airflow passage 34, and the second airflow passage 34 communicates with the conduction chamber 60 and the vibration chamber 70 .
  • a second air flow channel 34 is provided in the elastic vibration pickup part 32 and the vibration adjustment part 33 to communicate with the conduction cavity 60 and the vibration cavity 70, so as to ensure the stability of the air flow in the conduction cavity 60 and the vibration cavity 70, and the first
  • the shape of the second airflow channel 34 is not limited, and the opening area can be between 1um2 and 1000um2. It can be specifically set on the elastic vibration pickup part 32, the vibration adjustment part 33 or the connection position of the two. Of course, another conduit can also be provided for communication. Selection is made by those skilled in the art.
  • the second airflow channel 34 can damp the airflow flowing between the conduction cavity 60 and the vibration cavity 70, thereby suppressing the peak sensitivity of the vibration sensor 100, thereby improving the frequency response characteristics of the vibration sensor 100, and expanding the vibration sensor 100. Wide working bandwidth, improve product performance.
  • the circuit board assembly 10 includes multi-layer circuit boards stacked. Among them, in order to ensure the overall structural strength of the circuit board assembly 10, to ensure the stability of the supporting shell 20, multi-layer circuit boards can be stacked to ensure the overall stability of the circuit board assembly 10, and the number of circuit boards can be further reduced. The number of exposed bonding positions of the component 10 reduces reliability risks, and the specific number of the circuit boards can be set by those skilled in the art according to specific conditions.
  • the present application also proposes an electronic device, which may be, but not limited to, electronic devices known to those skilled in the art such as head-mounted devices, earphones, smart watches, smart bracelets, vehicle-mounted noise reduction devices, and vibration sensing devices.
  • the electronic device includes a vibration sensor 100.
  • the vibration sensor 100 For the specific structure of the vibration sensor 100, refer to the above-mentioned embodiments. Since this electronic device adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the benefits brought by the technical solutions of the above-mentioned embodiments. effects, which will not be repeated here.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

一种振动传感器（100），包括电路板组件（10）、外壳（20）、拾振组件（30）、支撑壳（50）以及芯片组件（40），外壳（20）罩盖于电路板组件（10）的一侧以围合形成安装空间；拾振组件（30）设于安装空间内，拾振组件（30）用于拾取外界的骨振动而产生响应振动；支撑壳（50）连接于拾振组件（30）背离电路板组件（10）的一侧；芯片组件（40）连接于支撑壳（50）背离电路板组件（10）的一侧，并与电路板组件（10）电性连接；其中，拾振组件（30）、支撑壳（50）以及芯片组件（40）之间围合形成有传导腔（60），以使响应振动通过传导腔（60）传递给芯片组件（40）。还提供一种包括振动传感器（100）的电子设备。

Description

振动传感器和电子设备
本申请要求于2021年7月20日申请的、申请号为202110810452.6的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及传感器技术领域，特别涉及一种振动传感器和应用该振动传感器的电子设备。
 背景技术
骨声纹传感器是一种利用振膜振动时策动空气流动，激励MEMS振膜，并以此来检测流动信号的一种传感器，从而骨声纹传感器可以用于人讲话时引起的头颈部骨骼的轻微振动，来把声音信号收集起来转为电信号，如此以不同于传统麦克风的通过空气传导采集声音，所以可以在很嘈杂的环境里也可以把声音高清晰的传出来。
在相关技术中，骨声纹传感器通常包括拾振单元和麦克风单元，拾振单元用于拾取外界的骨振动，并传递给麦克风单元，麦克风单元用于将振动信号转化为电信号。而麦克风单元通常是由多个电路板围合形成内部空间，并在其内部空间设置芯片模块，从而多个电路板之间存在多个粘接位置，导致产品性能可靠性较低，同时还需要在电路板上开孔以使芯片模块连通拾振单元的安装空间，结构复杂，制程冗长，成本过高，造成产品良率较低。
 技术问题
本申请的主要目的是提供一种振动传感器，旨在简化振动传感器结构，降低了加工难度和成本，同时提高振动传感器的结构可靠性。
 技术解决方案
为实现上述目的，本申请提出的振动传感器，所述振动传感器包括：
电路板组件；
外壳，所述外壳罩盖于所述电路板组件的一侧以围合形成安装空间；
拾振组件，所述拾振组件设于所述安装空间内，所述拾振组件用于拾取外界的骨振动而产生响应振动；
支撑壳，所述支撑壳连接于所述拾振组件背离所述电路板组件的一侧；以及
芯片组件，所述芯片组件连接于所述支撑壳背离所述电路板组件的一侧，并与所述电路板组件电性连接；
其中，所述拾振组件、所述支撑壳以及所述芯片组件之间围合形成有传导腔。
在本申请的一实施例中，所述芯片组件包括：
MEMS元件，所述MEMS元件连接于所述支撑壳背离所述拾振组件的一侧，所述MEMS元件和所述支撑壳与所述拾振组件围合形成所述传导腔；和
ASIC芯片，所述ASIC芯片连接于所述支撑壳，并分别与所述MEMS元件和所述电路板组件电性连接。
在本申请的一实施例中，所述支撑壳与所述拾振组件围合形成第一腔室，所述MEMS元件与所述支撑壳围合形成第二腔室，所述支撑壳开设有传振通孔，所述第一腔室和所述第二腔室通过所述传振通孔连通以形成所述传导腔。
在本申请的一实施例中，所述传振通孔为微孔设置；
和/或，所述振动传感器还包括气流缓冲结构，所述气流缓冲结构罩盖所述传振通孔；
和/或，所述传振通孔为多个，多个所述传振通孔间隔开设于所述支撑壳；
和/或，所述第一腔室的容积为V1，0.1mm3≤V1≤20mm3。
在本申请的一实施例中，所述芯片组件和所述外壳之间形成泄压腔，所述外壳开设有连通所述泄压腔的泄压孔，所述MEMS元件开设有连通所述第二腔室和所述泄压腔的第一气流通道。
在本申请的一实施例中，所述泄压孔与所述MEMS元件错位设置。
在本申请的一实施例中，所述拾振组件与所述电路板组件连接以围合形成振动腔。
在本申请的一实施例中，所述拾振组件包括：
支撑件，所述支撑件固定连接于所述电路板组件；
弹性拾振件，所述弹性拾振件连接于所述支撑件，所述弹性拾振件的一侧与所述电路板组件围合形成所述振动腔，所述弹性拾振件另一侧与所述芯片组件以及所述支撑壳围合形成所述传导腔；以及
振动调节件，所述振动调节件与所述弹性拾振件连接。
在本申请的一实施例中，所述弹性拾振件连接于所述支撑件背离所述电路板组件的一侧，且所述弹性拾振件的外周沿覆盖所述支撑件，所述支撑壳连接于所述弹性拾振件背离所述支撑件的一侧；
和/或，所述电路板组件朝向所述振动腔的一侧形成避让槽；
和/或，所述弹性拾振件和所述振动调节件开设有第二气流通道，所述第二气流通道连通所述传导腔和所述振动腔。
在本申请的一实施例中，所述电路板组件包括堆叠设置的多层电路板。
本申请还提出一种电子设备，所述电子设备包括振动传感器，所述振动传感器包括：
电路板组件；
外壳，所述外壳罩盖于所述电路板组件的一侧以围合形成安装空间；
拾振组件，所述拾振组件设于所述安装空间内，所述拾振组件用于拾取外界的骨振动而产生响应振动；
支撑壳，所述支撑壳连接于所述拾振组件背离所述电路板组件的一侧；以及
芯片组件，所述芯片组件连接于所述支撑壳背离所述电路板组件的一侧，并与所述电路板组件电性连接；
其中，所述拾振组件、所述支撑壳以及所述芯片组件之间围合形成有传导腔。
 有益效果
本申请技术方案的振动传感器通过外壳罩盖于电路板组件的一侧以直接围合形成安装空间，同时将拾振组件、支撑壳以及芯片组件均设于安装空间内，并使支撑壳固定于拾振组件背离电路板组件的一侧，再将拾振组件连接于支撑壳背离拾振组件的一侧，以使内部结构紧凑，安装较为方便，且拾振组件、支撑壳以及芯片组件之间围合形成有传导腔，以使拾振组件拾取外界的骨振动而产生的响应振动通过传导腔传递给芯片组件。如此本申请的振动传感器无需在电路板组件内形成用于安装芯片组件的空间，从而可以减少了电路板组件对外裸露的粘接位置数量，简化安装工序，保证电路板组件整体结构的稳定性，降低了可靠性风险，同时也无需在电路板上开孔，进而简化了振动传感器结构，并降低了加工难度和成本。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请振动传感器一实施例的结构示意图。
附图标号说明：
标号 名称 标号 名称
100 振动传感器 41 MEMS元件
10 电路板组件 411 第一气流通道
11 避让槽 42 ASIC芯片
20 外壳 50 支撑壳
21 泄压孔 51 传振通孔
30 拾振组件 60 传导腔
31 支撑件 61 第一腔室
32 弹性拾振件 62 第二腔室
33 振动调节件 70 振动腔
34 第二气流通道 80 泄压腔
40 芯片组件 90 安装空间
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，本申请实施例中所有方向性指示（诸如上、下、左、右、前、后……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
在本申请中，除非另有明确的规定和限定，术语“连接”、“固定”等应做广义理解，例如，“固定”可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
另外，在本申请中如涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，全文中出现的“和/或”的含义为，包括三个并列的方案，以“A和/或B为例”，包括A方案，或B方案，或A和B同时满足的方案。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
本申请提出一种振动传感器100。
参照图1，在本申请实施例中，该振动传感器100包括电路板组件10、外壳20、拾振组件30、支撑壳50以及芯片组件40，所述外壳20罩盖于所述电路板组件10的一侧以围合形成安装空间90；所述拾振组件30设于所述安装空间90内，所述拾振组件30用于拾取外界的骨振动而产生响应振动；所述支撑壳50连接于所述拾振组件30背离所述电路板组件10的一侧；所述芯片组件40连接于所述支撑壳50背离所述电路板组件10的一侧，并与所述电路板组件10电性连接；其中，所述拾振组件30、所述支撑壳50以及所述芯片组件40之间围合形成有传导腔60。
工作时，拾振组件30用于拾外界(如佩戴者，或其他振动源，下文以佩戴者为例进行说明)的骨振动而产生响应振动，即是说，外界的骨振动传递给拾振组件30，拾振组件30的弹性拾振件32振动而产生响应振动，并将该振动通过传导腔60传递给芯片组件40，以使芯片组件40根据接收到的响应振动而产生电信号，并电性传递至电路板组件10。
本申请技术方案的振动传感器100通过外壳20罩盖于电路板组件10的一侧以直接围合形成安装空间90，同时将拾振组件30、支撑壳50以及芯片组件40均设于安装空间90内，并使支撑壳50固定于拾振组件30背离电路板组件10的一侧，再将拾振组件10连接于支撑壳50背离拾振组件30的一侧，以使内部结构紧凑，安装较为方便，且拾振组件30、支撑壳50以及芯片组件40之间围合形成有传导腔60，以使拾振组件30的响应振动通过传导腔60传递给芯片组件40。如此本申请的振动传感器100无需在电路板组件10内形成用于安装芯片组件40的空间，从而可以减少了电路板组件10对外裸露的粘接位置数量，简化安装工序，保证电路板组件10整体结构的稳定性，降低了可靠性风险，同时也无需在电路板上开孔，进而简化了振动传感器100结构，并降低了加工难度和成本。
在本申请的一实施例中，所述芯片组件40包括MEMS元件411和ASIC芯片42，所述MEMS元件411连接于所述支撑壳50背离所述拾振组件30的一侧，所述MEMS元件411和所述支撑壳50与所述拾振组件30围合形成所述传导腔60；所述ASIC芯片42连接于所述支撑壳50，并分别与所述MEMS元件411和所述电路板组件10电性连接。其中，该支撑壳50可以固定于拾振组件30背离电路板组件10的一侧，同时通过将MEMS元件411和ASIC芯片42安装于支撑壳50背离拾振组件30的同一侧，如此为MEMS元件411和ASIC芯片42提供安装位置，不仅保证安装后的稳定性，同时便于前期同步安装和后期维修拆卸。而该MEMS元件411和支撑壳50与拾振组件30围合形成传导腔60，如此以便于拾振组件30响应振动可以传导至MEMS元件411接收到响应振动，并电性传递至ASIC芯片42进行处理输出电信号。该MEMS元件411可以为电容结构、压阻结构或压电结构。
在本申请的一实施例中，所述支撑壳50与所述拾振组件30围合形成第一腔室61，所述MEMS元件411与所述支撑壳50围合形成第二腔室62，所述支撑壳50开设有传振通孔51，所述第一腔室61和所述第二腔室62通过所述传振通孔51连通以形成所述传导腔60。可以理解的是，该支撑壳50和拾振组件30围合形成第一腔室61，从而形成供拾振组件30的弹性拾振件32的振动空间，并且通过在支撑壳50开设有传振通孔51，如此拾振组件30振动后在第一腔室61内形成响应振动，并通过传振通孔51传递至由MEMS元件411与支撑壳50围合形成第二腔室62内，如此以使MEMS元件411可以接收到响应振动并电性传递至ASIC芯片42进行处理输出电信号。
在本申请的一实施例中，所述传振通孔51为微孔设置；其中，该微孔直径可以选为1um~100um，如此通过将传振通孔51设为微孔，如此以可以对第一腔室61和第二腔室62内之间流通的气流起到阻尼作用，从而可压制振动传感器100的峰值灵敏度，从而改善振动传感器100的频率响应特性，扩大振动传感器100的工作频宽宽度，提升产品性能。
在本申请的一实施例中，所述振动传感器100还包括气流缓冲结构（未图示），所述气流缓冲结构罩盖所述传振通孔51；其中，为了进一步提高对传振通孔51的阻尼作用，从而可以在传振通孔51处设置气流缓冲结构，该气流缓冲结构可以为透气膜或者带微孔的转接片等，如此也可以进一步改善振动传感器100的频率响应特性，扩大振动传感器100的工作频宽宽度，提升产品性能。
在本申请的一实施例中，所述传振通孔51为多个，多个所述传振通孔51间隔开设于所述支撑壳50。其中，传振通孔51也可以设置多个，如此防止当单一传振通孔51阻塞失效时，还可以保证第一腔室61和第二腔室62之间的气流的正常流动性。
在本申请的一实施例中，所述第一腔室61的容积为V1，0.1mm3≤V1≤20mm3。其中，通过将该第一容积V1设置为为0.1mm3至20mm3，如此即可以弹性拾振件32所需的振动空间，同时还可以避免振动传感器100的整体体积过大。
在本申请的一实施例中，结合参照图1，所述芯片组件40和所述外壳20之间形成泄压腔80，所述外壳20开设有连通所述泄压腔80的泄压孔21，所述MEMS元件411开设有连通所述第二腔室62和所述泄压腔80的第一气流通道411。其中，拾振组件30振动时，外壳20和电路板组件10形成安装空间90内的各个腔室的压强发生变化，为了保证安装空间90内的各部器件使用的稳定性，从而芯片组件40和外壳20之间形成泄压腔80，并在外壳20开设有连通泄压腔80的泄压孔21，而MEMS元件411开设有连通第二腔室62和泄压腔80的第一气流通道411，如此以使拾振组件30振动后第二腔室62的内部空间的气流可以通过第一气流通道411流通至泄压腔80，并由泄压孔21流通至外界，以保证安装空间90内的各个部件的正常使用。需要说明的是，该MEMS元件411为电容结构，可以选单振膜/单背极、双振膜/单背极、单振膜/双背极等，而振膜上放置泄气用的泄气孔以形成第一气流通道411，孔形状可以是圆形孔，孔径1um~30um，或是扇形缝隙，缝隙宽度0.2um~20um；而MEMS元件411为压阻或压电结构时，可以选扇叶结构，数量可以为1个至50个之间；扇叶间隙优选0.1um至30um。此外，该拾振组件30与电路板组件10围合形成的振动腔70和泄压腔80之间也可以设置气体连接通道，通道形状不限，开口面积可以为1um²至1000um²之间，具体设置在电路板组件10、拾振组件30或者二者连接位置均可，当然也可以另外设置导管进行连通，具体可由本领域技术人员进行选择。
在本申请的一实施例中，所述泄压孔21与所述MEMS元件411错位设置。其中，为了避免外界光线等因素可以直接穿过泄压孔21而影响到MEMS元件411的正常工作，从而将泄压孔21开设于外壳20的位置与MEMS元件411错位设置，以保证MEMS元件411工作时的稳定性，提高可靠性。
在本申请的一实施例中，参照图1，所述拾振组件30与所述电路板组件10连接以围合形成振动腔70。
需要说明的是，由于拾振组件30的弹性拾振件32工作时为双向振动，从而在该拾振组件30与电路板组件10连接时以同步围合形成振动腔70，以为弹性拾振件32提供的振动空间，进而保证拾振组件30的灵敏性。该振动腔70的容积可以为0.1mm3至20mm3，如此即可以弹性拾振件32所需的振动空间，同时还可以避免振动传感器100的整体体积过大。而该芯片组件40连接于拾振组件30背离电路板的一侧以围合形成传导腔60，如此以使得安装时可以先将拾振组件30和芯片组件40与电路板组件10进行装配，再将外壳20盖合于电路板组件10，如此以简化安装过程，提高安装的效率，同时可以覆盖保护内部元件。
在本申请的一实施例中，所述拾振组件30包括支撑件31、弹性拾振件32以及振动调节件33，所述支撑件31固定连接于所述电路板组件10；所述弹性拾振件32连接于所述支撑件31，所述弹性拾振件32的一侧与所述电路板组件10围合形成所述振动腔70，所述弹性拾振件32另一侧与所述芯片组件40以及所述支撑壳50围合形成所述传导腔60；所述振动调节件33与所述弹性拾振件32连接。其中，该支撑件31固定连接于电路板组件10，从而以保证拾振组件30安装的稳定性，而该弹性拾振件32连接于支撑件31，并且弹性拾振件32的上下两侧分别形成传导腔60和振动腔70，从而该弹性拾振件32振动产生响应振动时会影响传导腔60和振动腔70的压强。该弹性拾振件32可以为有机高分子膜或胶、金属片或其他有弹性的材料制成，振动面积选0.2mm2~200mm2，如此可以保证弹性拾振件32的振动幅度，而该振动调节件33可以为圆形、方形和矩形等块状结构，质量可选0.2mg至20mg之间，该振动调节件33可以在弹性拾振件32的上部、下部或嵌入其中，以此振动调节件33可增大弹性拾振件32接收到骨振动时产生的响应振动的幅度。
在本申请的一实施例中，所述弹性拾振件32连接于所述支撑件31背离所述电路板组件10的一侧，且所述弹性拾振件32的外周沿覆盖所述支撑件31，所述支撑壳50连接于所述弹性拾振件32背离所述支撑件31的一侧；其中，通过将支撑件31、弹性拾振件32以及支撑壳50沿背离电路板组件10的方向依次堆叠安装设置，如此以便于振动传感器100整体的加工，进而可提高安装效率。
在本申请的一实施例中，所述电路板组件10朝向所述振动腔70的一侧形成避让槽11；其中，为了进一步增大振动腔70的振动空间，从而可以在电路板组件10向振动腔70的一侧形成避让槽11，深度可以10mm至1000mm之间，如此以保证弹性拾振件32在振动腔70内振动时的振动幅度不会被影响，提高拾振组件30振动的灵敏性。
在本申请的一实施例中，所述弹性拾振件32和所述振动调节件33开设有第二气流通道34，所述第二气流通道34连通所述传导腔60和所述振动腔70。其中，在弹性拾振件32和振动调节件33开设有第二气流通道34以连通传导腔60和振动腔70，如此以保证传导腔60和振动腔70内气流流通的稳定性，而该第二气流通道34形状不限，开口面积可以为1um²至1000um²之间，具体设置在弹性拾振件32、振动调节件33或者二者连接位置均可，当然也可以另外设置导管进行连通，具体可由本领域技术人员进行选择。而该第二气流通道34可以对传导腔60和振动腔70之间流通的气流起到阻尼作用，从而可压制振动传感器100的峰值灵敏度，从而改善振动传感器100的频率响应特性，扩大振动传感器100的工作频宽宽度，提升产品性能。
在本申请的一实施例中，所述电路板组件10包括堆叠设置的多层电路板。其中，为了保证电路板组件10整体的结构强度，以保证支撑外壳20的稳定性，从而可以将多层电路板堆叠设置，以保证电路板组件10整体的稳定性，并且可以进一步减少了电路板组件10对外裸露的粘接位置数量，降低了可靠性风险，而该电路板的具体数量可由本领域技术人员根据具体情况进行设置。
本申请还提出一种电子设备，该电子设备可以是但不限于头戴设备、耳机、智能手表、智能手环、车载降噪设备及振动感测装置等本领域技术人员所熟知的电子设备。该电子设备包括振动传感器100，该振动传感器100的具体结构参照上述实施例，由于本电子设备采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。
以上所述仅为本申请的优选实施例，并非因此限制本申请的专利范围，凡是在本申请的申请构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (11)

  1. 一种振动传感器，其中，所述振动传感器包括：
    电路板组件；
    外壳，所述外壳罩盖于所述电路板组件的一侧以围合形成安装空间；
    拾振组件，所述拾振组件设于所述安装空间内，所述拾振组件用于拾取外界的骨振动而产生响应振动；
    支撑壳，所述支撑壳连接于所述拾振组件背离所述电路板组件的一侧；以及
    芯片组件，所述芯片组件连接于所述支撑壳背离所述电路板组件的一侧，并与所述电路板组件电性连接；
    其中，所述拾振组件、所述支撑壳以及所述芯片组件之间围合形成有传导腔。
  2. 如权利要求1所述的振动传感器，其中，所述芯片组件包括：
    MEMS元件，所述MEMS元件连接于所述支撑壳背离所述拾振组件的一侧，所述MEMS元件和所述支撑壳与所述拾振组件围合形成所述传导腔；和
    ASIC芯片，所述ASIC芯片连接于所述支撑壳，并分别与所述MEMS元件和所述电路板组件电性连接。
  3. 如权利要求2所述的振动传感器，其中，所述支撑壳与所述拾振组件围合形成第一腔室，所述MEMS元件与所述支撑壳围合形成第二腔室，所述支撑壳开设有传振通孔，所述第一腔室和所述第二腔室通过所述传振通孔连通以形成所述传导腔。
  4. 如权利要求3所述的振动传感器，其中，所述传振通孔为微孔设置；
    和/或，所述振动传感器还包括气流缓冲结构，所述气流缓冲结构罩盖所述传振通孔；
    和/或，所述传振通孔为多个，多个所述传振通孔间隔开设于所述支撑壳；
    和/或，所述第一腔室的容积为V1，0.1mm3≤V1≤20mm3。
  5. 如权利要求3所述的振动传感器，其中，所述芯片组件和所述外壳之间形成泄压腔，所述外壳开设有连通所述泄压腔的泄压孔，所述MEMS元件开设有连通所述第二腔室和所述泄压腔的第一气流通道。
  6. 如权利要求5所述的振动传感器，其中，所述泄压孔与所述MEMS元件错位设置。
  7. 如权利要求1至6任意一项中所述的振动传感器，其中，所述拾振组件与所述电路板组件连接以围合形成振动腔。
  8. 如权利要求7所述的振动传感器，其中，所述拾振组件包括：
    支撑件，所述支撑件固定连接于所述电路板组件；
    弹性拾振件，所述弹性拾振件连接于所述支撑件，所述弹性拾振件的一侧与所述电路板组件围合形成所述振动腔，所述弹性拾振件另一侧与所述芯片组件以及所述支撑壳围合形成所述传导腔；以及
    振动调节件，所述振动调节件与所述弹性拾振件连接。
  9. 如权利要求8所述的振动传感器，其中，所述弹性拾振件连接于所述支撑件背离所述电路板组件的一侧，且所述弹性拾振件的外周沿覆盖所述支撑件，所述支撑壳连接于所述弹性拾振件背离所述支撑件的一侧；
    和/或，所述电路板组件朝向所述振动腔的一侧形成避让槽；
    和/或，所述弹性拾振件和所述振动调节件开设有第二气流通道，所述第二气流通道连通所述传导腔和所述振动腔。
  10. 如权利要求1至6任意一项中所述的振动传感器，其中，所述电路板组件包括堆叠设置的多层电路板。
  11. 一种电子设备，其中，包括如权利要求1至10任一项所述的振动传感器。
PCT/CN2022/104655 2021-07-20 2022-07-08 振动传感器和电子设备 WO2023000999A1 (zh)

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