WO2021220631A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2021220631A1
WO2021220631A1 PCT/JP2021/009549 JP2021009549W WO2021220631A1 WO 2021220631 A1 WO2021220631 A1 WO 2021220631A1 JP 2021009549 W JP2021009549 W JP 2021009549W WO 2021220631 A1 WO2021220631 A1 WO 2021220631A1
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WO
WIPO (PCT)
Prior art keywords
hole
substrate
conductor portion
electronic device
lightning rod
Prior art date
Application number
PCT/JP2021/009549
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English (en)
Japanese (ja)
Inventor
貴之 岩田
Original Assignee
ソニーグループ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニーグループ株式会社 filed Critical ソニーグループ株式会社
Publication of WO2021220631A1 publication Critical patent/WO2021220631A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • This technology relates to a technical field of an electronic device including a substrate having a through hole and a substrate bonding body to which the substrate is bonded.
  • Microphones include, for example, MEMS (Micro Electrical Mechanical Systems) microphones, which have the advantages of being able to be reflow-mounted at the same time as other semiconductors and electronic components, and are attracting attention as small, high-performance devices. ing.
  • MEMS Micro Electrical Mechanical Systems
  • the MEMS microphone has a microphone body (wafer bonding body) in which an input hole for inputting sound is formed and a substrate bonded to the microphone body, and sound is input from the input hole through a through hole formed in the substrate. Will be done.
  • an electronic device in which input is performed from the input hole through the through hole formed in such a substrate for example, there is a barometric pressure sensor that measures atmospheric pressure, and in the barometric pressure sensor, through the through hole. Atmospheric pressure is input from the input hole.
  • a conductive member is provided at a position extending inside and outside the case to facilitate static electricity to reach the ground formed inside the case via the conductive member, resulting in a malfunction due to static electricity jumping in. It is configured to prevent the occurrence of static electricity and failures.
  • this technology electronic device is to prevent the occurrence of malfunctions and failures by taking measures against static electricity after simplifying the structure.
  • the electronic device has a base layer in which a circuit pattern is formed on both sides and a cover layer laminated on both sides of the base layer, and a through hole penetrated in the thickness direction is formed.
  • the substrate is provided with a substrate having an input hole communicating with the through hole and a substrate bonding body to which the substrate is bonded, and the substrate is formed on both sides in the thickness direction as a first surface and a second surface, respectively.
  • the second surface is bonded to the substrate bonding body, and a lightning rod conductor portion exposed on the first surface side is formed at least on the opening edge of the through hole of the substrate.
  • the lightning rod conductor portion is formed on one surface of the base layer, and a through hole is formed by providing a conductive portion in the through hole, and the lightning rod is formed. It is desirable that the conductor portion and the conductive portion are connected.
  • a connecting conductor portion connected to the terminal portion of the substrate bonding body is formed on the other surface of the base layer by soldering, and the connecting conductor portion and the connection conductor portion are formed. It is desirable that a gap is formed between the conductive portions.
  • the connecting conductor portion is set to the ground potential, and the lightning rod conductor portion is connected to the connecting conductor portion via a via hole formed in the base layer. Is desirable.
  • the lightning rod conductor portion is set to the ground potential and is connected to the connecting conductor portion connected to the terminal portion of the wafer bonding body, so that it is not necessary to form a dedicated grounding circuit for connecting the lightning rod conductor portion.
  • a flexible printed wiring board is used as the substrate, and a reinforcing plate having a communication hole communicating with the through hole is attached to the first surface. It is desirable that the diameter of the communication hole is larger than the diameter of the through hole.
  • the lightning rod conductor portion is exposed through the communication hole in the state where the reinforcing plate is attached to the first surface.
  • the cover layer is formed as a resist layer, and the cover layer formed on the first surface side has an exposure opening for exposing the lightning rod conductor portion. It is desirable to be formed.
  • 2 to 8 show an embodiment of the electronic device of the present technology, and this figure is a conceptual diagram of an audio device having the electronic device. It is sectional drawing of an electronic device. It is a conceptual diagram which shows the circuit pattern on the wafer bonding side formed in the base layer. It is sectional drawing which shows the structure which shows the structure which the reinforcing plate is formed separately from the wiring board, and the reinforcing plate is attached to a wiring board. It is sectional drawing which shows the structure of the electronic device which the through hole is not formed. It is sectional drawing which shows the electronic device which concerns on 1st modification. It is sectional drawing which shows the electronic device which concerns on the 2nd modification. It is sectional drawing which shows the electronic device which concerns on 3rd modification.
  • the mode for implementing the electronic device of the present technology will be described below according to the attached drawings.
  • an example in which the electronic device of the present technology is applied to a microphone provided in an audio device such as headphones or earphones will be described.
  • the application range of the electronic device of the present technology is not limited to the microphone, and may be applied to other electronic devices such as a barometric pressure sensor.
  • the electronic devices shown below have a configuration in which the microphone body (wafer bonding body) and the substrate are bonded.
  • the thickness direction of the substrate which is the bonding direction between the microphone body and the substrate. Is used as the vertical direction to indicate the vertical, front, rear, left, and right directions.
  • the electronic device 1 is provided as, for example, a MEMS (Micro Electrical Mechanical Systems) microphone, and is arranged inside, for example, a case (outer housing) 50 in an audio device 100 such as headphones or earphones (see FIG. 1).
  • the case 50 has, for example, a housing 51 opened upward and a cover 52 that closes the opening of the housing 51.
  • An acoustic hole 52a is formed in the cover 52.
  • the electronic device 1 has a substrate bonding body 2 and a substrate 3, and the substrate 3 is bonded to the substrate bonding body 2 in the thickness direction (see FIGS. 1 and 2).
  • the substrate bonding body 2 functions as a microphone body having an acoustic input circuit or the like (not shown) inside, and is arranged, for example, on the inner surface (upper surface) of the bottom surface portion 51a of the housing 51. Input holes 2a penetrated vertically are formed at the upper end of the substrate bonding body 2.
  • the substrate 3 is positioned in a state of being in contact with or close to the inner surface (lower surface) of the cover 52, for example, and the thickness direction is in the vertical direction.
  • the upper surface of the substrate 3 may be adhered to the inner surface of the cover 52 by an adhesive sheet or the like (not shown).
  • a highly flexible flexible printed wiring board is used as the substrate 3.
  • the board 3 has a wiring board 4 on which a circuit pattern is formed and a reinforcing plate 5 for reinforcing the wiring board 4, and the reinforcing plate 5 is attached to the upper surface of the wiring board 4.
  • Both sides of the substrate 3 in the thickness direction are formed as a first surface 3a and a second surface 3b, respectively, the first surface 3a is the upper surface of the reinforcing plate 5, and the second surface 3b is the lower surface of the wiring plate 4.
  • the wiring board 4 has a base layer 6 having circuit patterns formed on both sides, a first cover layer 7 laminated on the upper side of the base layer 6, and a second cover layer laminated on the lower side of the base layer 6. Has 8 and.
  • the wiring board 4 is formed with through holes 9 penetrating vertically. The through hole 9 is located directly above the input hole 2a formed in the substrate bonding body 2.
  • a lightning rod conductor portion 10 is formed on the upper surface of the base layer 6 by copper foil or the like.
  • the lightning rod conductor portion 10 is formed around the through hole 9, for example, in a wide area on the upper surface of the base layer 6.
  • a connecting conductor portion 11 is formed on the lower surface of the base layer 6 by copper foil or the like (see FIGS. 2 and 3).
  • the connecting conductor portion 11 is set to the ground potential to serve as a grounding conductive portion of the wafer bonding body 2, and is connected to a terminal portion (not shown) of the wafer bonding body 2.
  • the connecting conductor portion 11 is formed in an annular shape around the through hole 9 at a position separated from the through hole 9 by a certain distance, and is formed in a region narrower than the lightning rod conductor portion 10.
  • the connecting conductor portion 11 is connected to the terminal portion of the substrate bonding body 2 by the solders 12, 12, and 12. Note that FIG. 3 shows the positions of the solders 12, 12, and 12 by a two-dot chain line.
  • Electrode terminals 13, 14, 15 and 15 are formed on the lower surface of the base layer 6 (see FIG. 3).
  • the electrode terminal 13 is a terminal for ground
  • the electrode terminal 14 is a terminal for supplying power
  • the electrode terminals 15 and 15 are terminals for transmitting and receiving signals
  • the electrode terminals 13, 14, 15 and 15 are substrates, respectively.
  • the joint body 2 is separately connected to a terminal portion (not shown) by solders 16, 16, .... In FIG. 3, the positions of the solders 16, 16, ... Are shown by a two-dot chain line.
  • a through hole 18 is formed in the substrate 3 by providing a conductive portion 17 with a copper foil or the like on the wall surface forming the through hole 9, and the upper end portion of the conductive portion 17 is connected to the inner peripheral portion of the lightning rod conductor portion 10.
  • the conductive portion 17 has the same function as the lightning rod conductor portion 10, and functions as a conductor portion for the lightning rod for charging static electricity.
  • An annular gap 19 is formed between the lower end of the conductive portion 17 and the inner peripheral portion of the connecting conductor portion 11 formed on the lower surface of the base layer 6. Therefore, the conductive portion 17 and the connecting conductor portion 11 are not connected to each other.
  • the connecting conductor portion 11 connected to the terminal portion of the substrate bonding 2 by the solder 12 is formed on the base layer, and the gap 19 is formed between the connecting conductor portion 11 and the conductive portion 17. Even if the solder 12 is melted, a portion where the conductor is not exposed is formed between the connecting conductor portion 11 and the conductive portion 17 due to the gap 19, and the solder 12 is difficult to flow toward the through hole 9. It is possible to prevent the solder 12 from flowing into the through hole 9. Therefore, since the solder 12 does not flow into the through hole 9, the melting of the solder 12 does not affect the acoustic input state input to the substrate bonding body 2 through the through hole 9, and the solder 12 does not affect the acoustic substrate bonding body 2. It is possible to secure a good input state of.
  • Via holes 20 and 20 are formed in the base layer 6 at positions corresponding to the outer peripheral portion of the connecting conductor portion 11, for example, at positions separated by 180 degrees in the circumferential direction. Therefore, the lightning rod conductor portion 10 and the outer peripheral portion of the connecting conductor portion 11 are connected by the via holes 20 and 20.
  • the via hole 20 is formed of copper foil or the like.
  • the first cover layer 7 is formed with an exposure opening 7a on the upper side of the lightning rod conductor portion 10.
  • the diameter of the exposure opening 7a is made larger than the diameter of the through hole 9, and the through hole 9 is located inside the exposure opening 7a.
  • the reinforcing plate 5 is formed with communication holes 5a penetrating vertically.
  • the diameter of the communication hole 5a is made larger than the diameter of the exposure opening 7a, and the exposure opening 7a and the through hole 9 are located inside the communication hole 5a.
  • the diameter of the communication hole 5a may be the same as the diameter of the exposure opening 7a.
  • the reinforcing plate 5 is in a state where the opening edge of the communication hole 5a and the opening edge of the exposure opening 7a are matched. Is attached to the wiring board 4.
  • the wafer bonding body 2 and the substrate 3 are joined, if the wafer bonding body 3 is in a state of being easily deformed or deformed, it becomes difficult to join the wafer bonding body 2 and the substrate 3 in an appropriate positional relationship.
  • the configuration in which the reinforcing plate 5 is provided suppresses bending and deformation of the substrate 3, and it is possible to join the substrates 3 after ensuring high positional accuracy between the substrate bonding body 2 and the substrate 3.
  • the diameter of the exposure opening 7a is made larger than the diameter of the through hole 9, the through hole 9 is located inside the exposure opening 7a, and the diameter of the communication hole 5a is larger than the diameter of the exposure opening 7a.
  • the inner peripheral portion of the lightning protection needle conductor portion 10 is exposed to the first surface 3a side.
  • the inner peripheral portion of the lightning rod conductor portion 10 is formed as an exposed portion 10a exposed on the first surface 3a side.
  • the input sound when sound is input from the outside through the sound hole 52a, the input sound is bonded to the substrate from the input hole 2a via the communication hole 5a and the through hole 9 of the reinforcing plate 5. It is input inside the body 2.
  • the acoustic device 100 is formed with the acoustic hole 52a, static electricity may jump from the acoustic hole 52a toward the through hole 9.
  • the lightning rod conductor portion 10 is formed on the substrate 3 and the inner peripheral portion of the lightning rod conductor portion 10 is formed as the exposed portion 10a, the static electricity that has jumped in is charged to the lightning rod conductor portion 10.
  • the through hole 18 is formed by providing the conductive portion 17 on the wall surface forming the through hole 9 in the substrate 3, the lightning rod conductor portion 10 is not charged with the static electricity that has jumped into the substrate 3. The static electricity that was not charged in the portion 10 is charged in the through hole 18.
  • the lightning rod conductor portion 10 is formed on one surface of the base layer 6, and the through hole 18 is formed by providing the conductive portion 17 in the through hole 9, and the lightning rod conductor portion 10 is formed. And the conductive portion 17 are connected.
  • connecting conductor portion 11 is set to the ground potential, and the lightning rod conductor portion 10 is connected to the connecting conductor portion 11 via the via hole 20 formed in the base layer 6.
  • the lightning rod conductor portion 10 is set to the ground potential and is connected to the connection conductor portion 11 connected to the terminal portion of the substrate joint 2, it is necessary to form a dedicated grounding circuit for connecting the lightning rod conductor portion 10. Therefore, it is possible to prevent static electricity from jumping into the input hole 2a while simplifying the structure of the electronic device 1.
  • a flexible printed wiring board is used as the substrate 3, and a reinforcing plate 5 having a communication hole 5a communicating with the through hole 9 is attached to the first surface 3a, and the diameter of the communication hole 5a is the diameter of the through hole 9. It has been made larger.
  • the strength of the substrate 3 is increased to increase the strength between the substrate bonding 2 and the substrate 3. It is possible to prevent static electricity from jumping into the input hole 2a while improving the position accuracy.
  • the substrate 3 in which the through hole 9 is formed in advance and the reinforcing plate 5 in which the communication hole 5a is formed in advance are separately formed, and the reinforcing plate 5 is the first cover layer 7 of the substrate 3. It is desirable that the device be attached to the device by adhesion or the like (see FIG. 4).
  • the electronic device 1 By configuring the electronic device 1 by such a method, it becomes possible to form the through holes 9 and the communication holes 5a having different diameters with high dimensional accuracy, and the through holes 9 and the communication holes 5a having different diameters can be formed, respectively.
  • the electronic device 1 provided with the substrate 3 and the reinforcing plate 5 can be configured by a simple method.
  • the communication hole 5a is formed in the reinforcing plate 5 by a jig for making a hole or the like to generate an electron.
  • the device 1 may be configured.
  • the lightning rod conductor portion 10 is formed and the through hole 18 is formed. It is also possible to have a configuration that is not formed (see FIG. 5). In this case, if the inner peripheral surface 10b of the lightning rod conductor portion 10 approaches the opening edge 9a of the through hole 9, the inner peripheral portion of the lightning rod conductor portion 10 may be scraped. It is desirable that a constant interval P is formed between them.
  • the electronic device 1A according to the first modification is an example in which the substrate is applied to a rigid substrate having high rigidity (see FIG. 6).
  • the electronic device 1A shown below is different from the above-mentioned electronic device 1 mainly in that it does not have the reinforcing plate 5, only the parts different from the electronic device 1 will be described in detail. However, the other parts are given the same reference numerals as those given to the same parts in the electronic device 1, and the description thereof will be omitted.
  • the electronic device 1A has a wafer bonding body 2 and a wafer bonding body 3A, and the wafer bonding body 3A is bonded to the wafer bonding body 2 in the thickness direction.
  • the substrate 3A has a wiring board 4 on which a circuit pattern is formed, but since it is a rigid substrate, it is not necessary to reinforce the wiring board 4, and the reinforcing plate 5 is not provided. Therefore, in the electronic device 1A, the first surface 3a is formed on the upper surface of the wiring board 4.
  • the configuration of the wiring board 4 of the electronic device 1A is the same as that of the wiring board 4 of the electronic device 1, but both the first cover layer 7 and the second cover layer 8 are formed as resist layers. Therefore, in the electronic device 1A, the exposed portion 10a of the lightning rod conductor portion 10 is formed according to the size of the exposure opening 7a in the first cover layer 7 which is the resist layer.
  • the size of the exposed portion 10a can be determined in the first cover layer 7 which is a resist layer formed on the first surface 3a side according to the size of the exposure opening 7a. Therefore, the size of the exposed portion 10a can be determined without considering the reinforcing plate 5, and good measures against static electricity can be taken while simplifying the structure of the substrate 3A and facilitating manufacturing.
  • the first cover layer 7 and the second cover layer 8 can be formed as the resist layer, but the flexible printed wiring board is used as the substrate. If so, a reinforcing plate 5 is required.
  • the electronic device 1B according to the second modification is an example in which the adhesive sheet is formed as a lightning rod conductor portion when the substrate is adhered to the cover 52 by the adhesive sheet (see FIG. 7).
  • the electronic device 1B shown below is different from the electronic device 1 in that the adhesive sheet is mainly formed as a lightning rod conductor portion and the through hole 18 is not formed as compared with the electronic device 1 described above. Only the parts that are different from each other will be described in detail, and the other parts will be given the same reference numerals as those given to the same parts in the electronic device 1 and the description thereof will be omitted.
  • a flexible printed wiring board is used as the substrate 3B, and the substrate 3B is adhered to the inner surface of the cover 52 by an adhesive sheet 21.
  • the adhesive sheet 21 is a conductive double-sided adhesive sheet, the lower surface of which is attached to the upper surface of the reinforcing plate 5, and the upper surface of which is attached to the inner surface of the cover 52.
  • the adhesive sheet 21 is formed with a passage hole 21a that communicates with the communication hole 5a of the reinforcing plate 5.
  • a conductive portion 22 that is not intended to be charged with static electricity is formed in place of the lightning rod conductor portion 10.
  • the conductive portion 22 is formed of a copper foil or the like like the lightning rod conductor portion 10.
  • the through hole 18 is not formed in the substrate 3B, and the entire conductive portion 22 is covered with the first cover layer 7.
  • the adhesive sheet 21 is connected to the conductive portion 22 by a conductive member 23 formed of a conductive material such as metal, and is connected to the connecting conductor portion 11 via the conductive portion 22 and the via hole 20.
  • the conductive member 23 is in a state where the adhesive sheet 21 and the conductive portion 22 are connected by inserting the reinforcing plate 5.
  • the conductive member 23 is a member capable of conducting conduction in the thickness direction of the substrate 3A, and for example, a member having conductivity called OBC (On Board Contact) is used.
  • the adhesive sheet 21 is charged with static electricity that tends to jump from the acoustic hole 52a of the cover 52 toward the through hole 9.
  • the through hole 18 is formed as in the electronic device 1, and the adhesive sheet 21 and the through hole 18 can be charged with static electricity that is about to jump into the through hole 9.
  • the configuration in which the adhesive sheet 21 is formed as the lightning rod conductor portion as in the electronic device 1B can be applied to the structure in which the rigid substrate is used such as the electronic device 1A.
  • the structure in which the adhesive sheet 21 is formed as the lightning rod conductor portion is applied to the structure in which the rigid substrate is used, it is not necessary to provide the reinforcing plate 5.
  • the electronic device 1C according to the third modification is an example in which a lightning rod conductor portion is formed on the cover 52 when the substrate is adhered to the cover 52 by an adhesive sheet (see FIG. 8).
  • the electronic device 1C shown below is different from the electronic device 1 in that the lightning rod conductor portion is mainly formed on the cover 52 and the through hole 18 is not formed as compared with the electronic device 1 described above. Only the parts that are different from each other will be described in detail, and the other parts will be given the same reference numerals as those given to the same parts in the electronic device 1 and the description thereof will be omitted.
  • a flexible printed wiring board is used as the substrate 3C, and the substrate 3C is adhered to the inner surface of the cover 52 by an adhesive sheet 21C.
  • the adhesive sheet 21C may be either conductive or non-conductive.
  • the adhesive sheet 21C is formed with a passage hole 21b that communicates with the communication hole 5a of the reinforcing plate 5.
  • a conductive portion 22 is formed on the upper surface of the base layer 6 instead of the lightning rod conductor portion 10.
  • the through hole 18 is not formed in the substrate 3C, and the entire conductive portion 22 is covered with the first cover layer 7.
  • the cover 52 is formed with a lightning rod conductor portion 10 exposed upward.
  • the lightning rod conductor portion 10 is formed in an annular shape around the acoustic hole 52a.
  • the lightning rod conductor portion 10 is connected to the conductive portion 22 by the conductive member 23, and is connected to the connecting conductor portion 11 via the conductive portion 22 and the via hole 20.
  • the lightning rod conductor portion 10 is formed on the cover 52 by, for example, a three-dimensional wiring forming technique called MID (Molded Interconnect Device) technique, which forms a wiring portion on a resin component.
  • MID Molded Interconnect Device
  • the lightning rod conductor portion 10 formed in the cover 52 is charged with static electricity that tries to jump from the acoustic hole 52a of the cover 52 toward the through hole 9.
  • the adhesive sheet 21C has conductivity, the static electricity that tends to jump into the through hole 9 is also charged to the adhesive sheet 21C.
  • the through hole 18 is formed as in the electronic device 1, and the lightning rod conductor portion 10 and the through hole 18 can be charged with static electricity that is about to jump into the through hole 9. ..
  • the configuration in which the lightning rod conductor portion 10 is formed on the cover 52 as in the electronic device 1C can be applied to a structure in which a rigid substrate is used such as the electronic device 1A.
  • a rigid substrate such as the electronic device 1A.
  • both sides of the substrates 3, 3A, 3B, and 3C in the thickness direction are the first surface 3a and the second surface, respectively.
  • the lightning protection needle conductor portion 10 formed as the surface 3b, the second surface 3b is bonded to the substrate bonding body 2, and is exposed on the first surface 3a side at the opening edge of at least the through hole 9 of the substrates 3, 3A, 3B, 3C. (Adhesive sheet 21) is formed.
  • the static electricity that is about to jump from the through hole 9 is charged to the lightning rod conductor portion 10 (adhesive sheet 21) formed in a state where it is exposed on the first surface 3a side, so that the static electricity that is about to jump into the input hole 2a is suppressed. It is not necessary to provide a dedicated member for this purpose, and it is possible to prevent the substrate joint 2 from malfunctioning or failing by taking measures against static electricity after simplifying the structure.
  • the antenna is the lightning rod conductor portion 10 or the adhesive sheet 21. It is desirable that it is formed at a position sufficiently separated from the antenna.
  • the electronic devices 1 and 1A tend to have the lightning rod conductor portion 10 at a position separated from the antenna, so that the structure does not deteriorate the receiving function of the antenna. It is possible to prevent the occurrence of malfunction and failure of the substrate bonding body 2 after simplifying the above.
  • the acoustic device 100 The whole may be an electronic device.
  • the present technology can be configured as follows.
  • a substrate bonding body having an input hole communicating with the through hole and the substrate to be bonded is provided. Both sides of the substrate in the thickness direction are formed as a first surface and a second surface, respectively, and the second surface is bonded to the substrate bonding body.
  • the lightning rod conductor portion is formed on one surface of the base layer, and the lightning rod conductor portion is formed on one surface of the base layer.
  • a through hole is formed by providing a conductive portion in the through hole, and a through hole is formed.
  • a connecting conductor portion connected to the terminal portion of the substrate bonding body is formed on the other surface of the base layer by soldering.
  • the connecting conductor portion is set to the ground potential, and the connection conductor portion is set to the ground potential.
  • a flexible printed wiring board is used as the substrate.
  • a reinforcing plate having a communication hole that communicates with the through hole is attached to the first surface.
  • the cover layer is formed as a resist layer, The electronic device according to any one of (1) to (4) above, wherein an exposure opening for exposing the lightning rod conductor portion is formed in the cover layer formed on the first surface side.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

La présente invention concerne un dispositif électronique comprenant : un substrat ayant une couche de base avec des motifs de circuit formés sur ses deux surfaces, et des couches de recouvrement stratifiées sur les deux côtés de la couche de base, le substrat ayant un trou traversant formé pénétrant à travers celui-ci dans une direction d'épaisseur ; et un ensemble joint de substrat ayant un trou d'entrée communiquant avec le trou traversant et auquel le substrat est joint. Le substrat présente une première surface et une seconde surface formée respectivement des deux côtés dans la direction de l'épaisseur. La seconde surface est jointe à l'ensemble joint de substrat. Une partie de conducteur de paratonnerre est formée au moins au niveau d'un bord d'ouverture du trou traversant du substrat, la partie de conducteur de paratonnerre étant exposée sur le premier côté de surface.
PCT/JP2021/009549 2020-04-30 2021-03-10 Dispositif électronique WO2021220631A1 (fr)

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Application Number Priority Date Filing Date Title
JP2020-080217 2020-04-30
JP2020080217 2020-04-30

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WO2021220631A1 true WO2021220631A1 (fr) 2021-11-04

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011120170A (ja) * 2009-12-07 2011-06-16 Hosiden Corp マイクロホン
CN103546854A (zh) * 2013-10-21 2014-01-29 深圳市欧珀通信软件有限公司 一种板下型麦克风的静电防护方法及结构
JP2014140002A (ja) * 2012-12-21 2014-07-31 Canon Inc プリント配線板、プリント回路板及びプリント回路板の製造方法
CN105828227A (zh) * 2015-08-28 2016-08-03 维沃移动通信有限公司 一种麦克风静电防护装置
CN106604533A (zh) * 2017-02-03 2017-04-26 环旭电子股份有限公司 静电防护结构

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011120170A (ja) * 2009-12-07 2011-06-16 Hosiden Corp マイクロホン
JP2014140002A (ja) * 2012-12-21 2014-07-31 Canon Inc プリント配線板、プリント回路板及びプリント回路板の製造方法
CN103546854A (zh) * 2013-10-21 2014-01-29 深圳市欧珀通信软件有限公司 一种板下型麦克风的静电防护方法及结构
CN105828227A (zh) * 2015-08-28 2016-08-03 维沃移动通信有限公司 一种麦克风静电防护装置
CN106604533A (zh) * 2017-02-03 2017-04-26 环旭电子股份有限公司 静电防护结构

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