WO2021220456A1 - Système de traitement - Google Patents

Système de traitement Download PDF

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Publication number
WO2021220456A1
WO2021220456A1 PCT/JP2020/018256 JP2020018256W WO2021220456A1 WO 2021220456 A1 WO2021220456 A1 WO 2021220456A1 JP 2020018256 W JP2020018256 W JP 2020018256W WO 2021220456 A1 WO2021220456 A1 WO 2021220456A1
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WO
WIPO (PCT)
Prior art keywords
processing
work
measuring
processing system
stage
Prior art date
Application number
PCT/JP2020/018256
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English (en)
Japanese (ja)
Inventor
陽介 立崎
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to PCT/JP2020/018256 priority Critical patent/WO2021220456A1/fr
Priority to TW110115215A priority patent/TW202142339A/zh
Publication of WO2021220456A1 publication Critical patent/WO2021220456A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece

Definitions

  • the present invention relates to, for example, the technical field of a processing system that processes an object with processing light.
  • Patent Document 1 describes a processing device that processes an object by irradiating the object with a laser beam, which is a specific example of processing light. In the technical field related to the processing of such an object, it is desired to improve the performance related to the processing of the object.
  • an object mounting device for mounting an object, a processing device for processing the object mounted on the object mounting device with processing light, and a processing device mounted on the object mounting device.
  • a measuring device for measuring the object, a changing device for moving at least one of the object and the processing device mounted on the object mounting device, and the processing light can irradiate the first side of the object.
  • a processing system including a control device for controlling the changing device and controlling the changing device so that the processing light can irradiate the second side opposite to the first side is provided.
  • an object mounting device for mounting an object, a processing device for processing the object mounted on the object mounting device with processing light, and a processing device mounted on the object mounting device.
  • the measuring device for measuring the object, the changing device for moving at least one of the object and the processing device mounted on the object mounting device, and the first side of the object can be processed by the processing device.
  • a processing system including a control device for controlling the changing device and controlling the changing device so that the processing device can process the second side opposite to the first side is provided.
  • an object mounting device for mounting an object, a processing device for processing the object mounted on the object mounting device with processing light, and a processing device mounted on the object mounting device.
  • a measuring device for measuring the object and a changing device for moving at least one of the object mounted on the object mounting device and the processing device are provided, and the measuring device is attached to the object mounting device.
  • the index is measured to obtain the first measurement result, and after moving at least one of the object mounted on the object mounting device and the processing device, the index is measured to obtain the second measurement result.
  • a processing system is provided.
  • an object mounting device for mounting an object, a processing device for irradiating the object with processing light to remove a part of the object, and the object from which the part has been removed are provided.
  • a machining system including a control device for controlling the machining device so as to perform machining is provided.
  • FIG. 1 is a perspective view showing the appearance of the processing system of the present embodiment.
  • FIG. 2 is a cross-sectional view showing the structure of the processing system of the present embodiment.
  • FIG. 3 is a block diagram showing a system configuration of the processing system of the present embodiment.
  • Each of FIGS. 4 (a) to 4 (c) is a cross-sectional view showing a state of removal processing performed on the work.
  • FIG. 5 is a cross-sectional view showing the structure of the processing head.
  • FIG. 6 is a perspective view showing the structure of the processing science system.
  • 7 (a) is a plan view showing an index
  • each of FIGS. 7 (b) and 7 (c) is a cross-sectional view showing the index.
  • FIG. 1 is a perspective view showing the appearance of the processing system of the present embodiment.
  • FIG. 2 is a cross-sectional view showing the structure of the processing system of the present embodiment.
  • FIG. 3 is a block diagram showing a system configuration of the processing system of
  • FIG. 8 is a flowchart showing the flow of the position information calculation operation.
  • FIG. 9 is a block diagram showing a system configuration of another example of the processing system of the present embodiment.
  • FIG. 10 is a flowchart showing the flow of the machining operation.
  • FIG. 11 is a cross-sectional view showing a processing system for measuring the first surface of the work.
  • FIG. 12 is a cross-sectional view showing a processing system for measuring the second surface of the work.
  • FIG. 13 is a cross-sectional view showing a processing system for processing the first surface of the work.
  • FIG. 14 is a cross-sectional view showing a deformed work.
  • FIG. 13 is a cross-sectional view showing a processing system for processing the second surface of the work.
  • FIG. 16 is a cross-sectional view showing a deformed work.
  • FIG. 17 is a cross-sectional view showing a processing system for measuring the second surface of the work.
  • FIG. 18 is a cross-sectional view showing a processing system for processing the second surface of the work.
  • FIG. 19 is a cross-sectional view showing a work whose second surface has been machined.
  • FIG. 20 is a cross-sectional view showing a processing system for measuring the first surface of the work.
  • FIG. 21 is a cross-sectional view showing a processing system for processing the first surface of the work.
  • FIG. 22 is a cross-sectional view showing a work whose first surface has been machined.
  • FIG. 23 is a block diagram showing a system configuration of the processing system of the first modification.
  • FIG. 23 is a block diagram showing a system configuration of the processing system of the first modification.
  • FIG. 24 is a cross-sectional view showing the structure of the processing system of the first modification.
  • FIG. 25 is a cross-sectional view showing the structure of the processing system of the first modification.
  • FIG. 26 is a cross-sectional view showing the structure of the processing system of the first modification.
  • FIG. 27 is a cross-sectional view showing the structure of the processing system of the first modification.
  • FIG. 28 is a block diagram showing a system configuration of the processing system of the second modification.
  • FIG. 29 is a cross-sectional view showing the structure of the processing system of the second modification.
  • each of the X-axis direction and the Y-axis direction is a horizontal direction (that is, a predetermined direction in the horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction orthogonal to the horizontal plane). Yes, it is assumed that it is substantially in the vertical direction or the gravity direction).
  • the rotation directions (in other words, the inclination direction) around the X-axis, the Y-axis, and the Z-axis are referred to as the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction, respectively.
  • the Z-axis direction may be the direction of gravity.
  • the XY plane may be horizontal.
  • FIG. 1 is a perspective view showing the appearance of the processing system SYS.
  • FIG. 2 is a cross-sectional view showing the structure of the processing system SYS.
  • FIG. 3 is a block diagram showing a system configuration of the processing system SYS.
  • the processing system SYS includes a processing device 1, a measuring device 2, a stage device 3, a housing 4, and a control device 5.
  • the processing device 1 can process the work W under the control of the control device 5.
  • the work W is an object processed by the processing apparatus 1.
  • the work W may be, for example, a metal, an alloy (for example, duralmine, etc.), a semiconductor (for example, silicon), a resin, or CFRP. It may be a composite material such as (Carbon Fiber Reinforced Plastic), glass, ceramics, or an object composed of any other material.
  • the processing device 1 irradiates the work W with processing light EL in order to process the work W.
  • the processing light EL may be any kind of light as long as the work W can be processed by being irradiated with the work W. In the present embodiment, the description will be made using an example in which the processing light EL is a laser light, but the processing light EL may be a type of light different from the laser light.
  • the wavelength of the processing light EL may be any wavelength as long as the work W can be processed by irradiating the work W.
  • the processed light EL may be visible light or invisible light (for example, at least one of infrared light and ultraviolet light).
  • the processing apparatus 1 irradiates the work W with processing light EL to perform removal processing for removing a part of the work W.
  • the processing apparatus 1 may perform processing different from the removal processing (for example, additional processing or marking processing).
  • the removal process includes flat surface processing, cylindrical processing, drilling processing, smoothing processing, cutting processing, and engraving processing (in other words, engraving) that forms (in other words, engraves) any character or any pattern. ) May be included.
  • FIGS. 4 (a) to 4 (c) are cross-sectional views showing a state of removal processing performed on the work W.
  • the processing apparatus 1 irradiates the processing light EL to the target irradiation region EA set on the surface of the work W as the region to which the processing light EL from the processing apparatus 1 is irradiated. ..
  • the energy of the processing light EL is applied to the energy transfer portion including at least one of the portion of the work W that overlaps the target irradiation region EA and the portion that is close to the target irradiation region EA. Be transmitted.
  • the heat generated by the energy of the processing light EL is transferred, the material constituting the energy transfer portion of the work W is melted by the heat generated by the energy of the processing light EL.
  • the molten material becomes droplets and scatters.
  • the molten material evaporates due to the heat generated by the energy of the processing light EL.
  • the energy transfer portion of the work W is removed. That is, as shown in FIG.
  • a recess (in other words, a groove) is formed on the surface of the work W.
  • the processing apparatus 1 processes the work W by utilizing the so-called thermal processing principle.
  • the processing apparatus 1 uses the galvano mirror 1122 described later to move the target irradiation region EA on the surface of the work W so that the processing light EL scans the surface of the work W.
  • the surface of the work W is at least partially removed along the scanning locus of the processed light EL (that is, the moving locus of the target irradiation region EA).
  • the processing apparatus 1 appropriately removes the portion of the work W to be removed by causing the processing light EL to scan the surface of the work W along a desired scanning locus corresponding to the region to be removed. be able to.
  • the processing apparatus 1 may process the work W by utilizing the principle of non-thermal processing (for example, ablation processing). That is, the processing apparatus 1 may perform non-thermal processing (for example, ablation processing) on the work W.
  • non-thermal processing for example, ablation processing
  • the processing apparatus 1 may perform non-thermal processing (for example, ablation processing) on the work W.
  • pulsed light with a light emission time of picoseconds or less or, in some cases, nanoseconds or femtoseconds or less
  • the material constituting the energy transfer portion of the work W evaporates instantly and Scatter.
  • the material constituting the energy transfer portion of the work W goes through a molten state. It may sublimate without. Therefore, a recess (in other words, a groove) can be formed on the surface of the work W while suppressing the influence of heat caused by the energy of the processing light EL on the work W as much as possible.
  • the processing apparatus 1 includes a processing head 11, a head drive system 12, and a position measuring instrument 13. Further, the processing head 11 includes a processing light source 111 and a processing optical system 112, as shown in FIG. 3 and FIG. 5, which is a cross-sectional view showing the structure of the processing head 11. However, the processing light source 111 may be arranged outside the processing head 11. That is, while the processing head 11 includes the processing optical system 112, the processing head 11 does not have to include the processing light source 111.
  • the processing light source 111 can generate processing light EL.
  • the processing light source 111 may be, for example, a laser diode. Further, the processing light source 111 may be a light source capable of pulse oscillation. In this case, the processing light source 111 can generate pulsed light (for example, pulsed light having a light emission time of picoseconds or less) as the processing light EL.
  • the processing light source 111 emits the generated processing light EL toward the processing optical system 112.
  • the processing optical system 112 is an optical system in which the processing light EL emitted from the processing light source 111 is incident.
  • the processing optical system 112 is an optical system for emitting (that is, guiding) the processing light EL from the processing light source 111 toward the work W.
  • the processing optical system 112 includes a focus lens 1121, a galvanometer mirror 1122, and an f ⁇ lens 1123 in order to emit the processing light EL toward the work W.
  • the focus lens 1121 controls the degree of convergence or the degree of divergence of the processed light EL emitted from the processed optical system 112. As a result, the focus position (for example, the so-called best focus position) of the processed light EL is controlled.
  • the processing optical system 112 may include, in addition to or in place of the focus lens 1121, an optical element capable of controlling an arbitrary state of the processing light EL. Any state of the processing light EL is in addition to at least one of the focus position of the processing light EL, the beam diameter of the processing light EL, the convergence degree, the divergence degree, the parallelism of the processing light EL, and the intensity distribution of the processing light EL.
  • it may include at least one of the pulse length of the processing light EL, the number of pulses of the processing light EL, the intensity of the processing light EL, the traveling direction of the processing light EL, and the polarization state of the processing light EL.
  • the galvano mirror 1122 is arranged in the optical path of the processed light EL from the focus lens 1121.
  • the processed light EL is such that the processed light EL emitted from the f ⁇ lens 1123 scans the work W (that is, the target irradiation region EA irradiated with the processed light EL moves on the surface of the work W).
  • the galvano mirror 1122 functions as an optical element capable of changing the irradiation position of the processed light EL on the work W (that is, the position of the target irradiation region EA). Therefore, the galvano mirror 1122 may be referred to as a beam irradiation position changing member.
  • the galvano mirror 1122 includes, for example, a Z scanning mirror 1122Z and a Y scanning mirror 1122Y, as shown in FIG. 6, which is a perspective view showing a part of the structure of the processing optical system 112.
  • the Z scanning mirror 1122Z reflects the processed light EL toward the Y scanning mirror 1122Y.
  • the Z scanning mirror 1122Z can swing or rotate along the ⁇ Y direction (that is, the direction of rotation about the Y axis). Due to the swing or rotation of the Z scanning mirror 1122Z, the processing light EL scans the surface of the work W along the Z axis direction. Due to the swing or rotation of the Z scanning mirror 1122Z, the target irradiation region EA moves along the Z-axis direction on the surface of the work W.
  • the position of the target irradiation region EA in the Z-axis direction is changed by swinging or rotating the Z scanning mirror 1122Z.
  • the Y scanning mirror 1122Y reflects the processed light EL toward the f ⁇ lens 1123.
  • the Y scanning mirror 1122Y can swing or rotate along the ⁇ Z direction (that is, the direction of rotation about the Z axis).
  • the processing light EL scans the surface of the work W along the Y-axis direction.
  • Due to the swing or rotation of the Y scanning mirror 1122Y the target irradiation region EA moves on the surface of the work W along the Y-axis direction.
  • the position of the target irradiation region EA in the Y-axis direction is changed by swinging or rotating the Y scanning mirror 1122Y.
  • the f ⁇ lens 1123 is an optical element for irradiating the work W with the processed light EL from the galvano mirror 1122. Therefore, the f ⁇ lens 1123 may be referred to as an irradiation optical system.
  • the f ⁇ lens 1123 is an optical element for condensing the processed light EL from the galvano mirror 1122 on the work W.
  • the work W is arranged on the side of the machining head 11 (in the example shown in FIGS. 1 and 2, the ⁇ X side). Therefore, the processing light EL is emitted sideways from the f ⁇ lens 1123 (that is, the processing head 11).
  • the processing optical system 112 does not have to include the galvano mirror 1122.
  • an optical system having a projection characteristic other than f ⁇ may be used.
  • the head drive system 12 moves (that is, moves) the machining head 11 under the control of the control device 5.
  • the head drive system 12 may move the machining head 11 with respect to at least one of the surface plate 31 and the stage 32 (furthermore, the work W mounted on the stage 32) included in the stage device 3 described later. .. Further, the head drive system 12 may move the processing head 11 with respect to the measuring device 2.
  • the head drive system 12 moves the machining head 11 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction.
  • Moving the machining head 11 along at least one of the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction changes the posture around at least one of the X-axis, Y-axis, and Z-axis of the machining head 11.
  • the head drive system 12 moves the machining head 11 along the X-axis direction and the Z-axis direction, respectively.
  • the head drive system 12 may include a head drive system 12X that moves the machining head 11 along the X-axis direction and a head drive system 12Z that moves the machining head 11 along the Z-axis direction.
  • the head drive system 12Z includes, for example, a guide member 121Z arranged on a surface plate 31 described later via a vibration isolator and extending along the Z-axis direction, a slider member 122Z movable along the guide member 121Z, and the like. It includes a motor (not shown) for moving the slider member 122Z.
  • the head drive system 12X is, for example, a guide member 121X connected to the slider member 122Z and extending along the X-axis direction, a slider member 122X movable along the guide member 121X, and a slider member 122X (not shown) for moving the slider member 122X. It is equipped with a motor.
  • a processing head 11 is connected to the slider member 122X. When the slider member 122Z moves, the machining head 11 connected to the slider member 122Z via the head drive system 12X moves along the Z-axis direction. When the slider member 122X moves, the machining head 11 connected to the slider member 122X moves along the X-axis direction.
  • the machining shot region PSA is a region (in other words, a range) in which machining is performed by the machining apparatus 1 in a state where the positional relationship between the machining head 11 and the work W is fixed (that is, without changing).
  • the machining shot region PSA coincides with or is narrower than the scanning range of the machining light EL deflected by the galvanometer mirror 1122 in a state where the positional relationship between the machining apparatus 1 and the machining object is fixed. Set to be an area.
  • the head drive system 12 can change the positional relationship between the work W, the target irradiation region EA, and the machining shot region PSA by moving the machining head 11. Further, when the head drive system 12 moves the processing head 11, the positional relationship between the stage 32 and the work W and the processing head 11 (particularly, the f ⁇ lens 1123) changes. Therefore, the head drive system 12 may be referred to as a changing device. The head drive system 12 may also be referred to as a mobile device.
  • the position measuring instrument 13 can measure the position of the processing head 11 moved by the head drive system 12.
  • the position measuring instrument 13 may include, for example, at least one of an encoder and a laser interferometer.
  • the measuring device 2 can measure the work W under the control of the control device 5.
  • the measuring device 2 may be a device capable of measuring the state of the work W.
  • the state of the work W may include the position of the work W.
  • the position of the work W may include the position of the surface of the work W.
  • the position of the surface of the work W may include a position in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction of each surface portion obtained by subdividing the surface of the work W.
  • the state of the work W may include the shape of the work W (for example, a three-dimensional shape).
  • the shape of the work W may include the shape of the surface of the work W.
  • the shape of the surface of the work W includes, in addition to or in place of the position of the surface of the work W described above, the orientation of each surface portion of the surface of the work W subdivided (for example, the orientation of the normal of each surface portion). You may be.
  • the measurement information regarding the measurement result of the measuring device 2 is output from the measuring device 2 to the control device 5.
  • the measuring device 2 includes a measuring head 21, a head drive system 22, and a position measuring instrument 23.
  • the measuring head 21 measures the work W using a predetermined measuring method.
  • a predetermined measuring method light cutting method, white interferometry, pattern projection method, time of flight method, moire topography method (specifically, lattice irradiation method or lattice projection method), holographic interferometry, autocollimation.
  • moire topography method specifically, lattice irradiation method or lattice projection method
  • holographic interferometry specifically, holographic interferometry
  • autocollimation At least one of a method, a stereo method, a non-point aberration method, a critical angle method, a knife edge method, an interferometry method, and an autocollimation method can be mentioned.
  • the measurement head 21 is a measurement light source that emits measurement light (for example, slit light or white light) ML, and reflection of light from the work W irradiated with the measurement light ML (for example, reflection of the measurement light ML). It may be provided with a receiver that receives at least one of light and scattered light).
  • the measuring device 2 measures the work W by receiving light from the work W (for example, at least one of the reflected light and the scattered light of the measuring light ML). That is, the measuring device 2 measures the work W based on the light reception result of the light from the work W (for example, at least one of the reflected light and the scattered light of the measurement light ML).
  • the work W is arranged on the side of the measuring head 21 (in the example shown in FIGS. 1 and 2, the ⁇ X side). Therefore, the measurement light ML is emitted from the measurement head 21 toward the side.
  • the measuring device 2 may measure the work W by using a contact type measuring method in which the work W is measured by contacting the work W.
  • the measuring device 2 may measure the work W by bringing the probe or the cantilever into contact with the work W.
  • the head drive system 22 moves (that is, moves) the measurement head 21 under the control of the control device 5.
  • the head drive system 22 may move the measurement head 21 with respect to at least one of the surface plate 31 and the stage 32 (furthermore, the work W mounted on the stage 32) included in the stage device 3 described later. .. Further, the head drive system 22 may move the measurement head 21 with respect to the measurement device 2.
  • the head drive system 22 moves the measurement head 21 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction. Moving the measurement head 21 along at least one of the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction changes the posture of the measurement head 21 around at least one of the X-axis, Y-axis, and Z-axis. It may be considered equivalent.
  • 1 to 2 show an example in which the head drive system 22 moves the measurement head 21 along the X-axis direction and the Z-axis direction, respectively.
  • the head drive system 22 may include a head drive system 22X that moves the measurement head 21 along the X-axis direction and a head drive system 22Z that moves the measurement head 21 along the Z-axis direction.
  • the head drive system 22Z includes, for example, a guide member 221Z arranged on a surface plate 31 described later via a vibration isolator and extending along the Z-axis direction, and a slider member 222Z movable along the guide member 221Z. It includes a motor (not shown) for moving the slider member 222Z.
  • the head drive system 22X is, for example, a guide member 221X connected to the slider member 222Z and extending along the X-axis direction, a slider member 222X movable along the guide member 221X, and a slider member 222X (not shown) for moving the slider member 222X. It is equipped with a motor.
  • a measuring head 21 is connected to the slider member 222X. When the slider member 222Z moves, the measurement head 21 connected to the slider member 222Z via the head drive system 22X moves along the Z-axis direction. When the slider member 222X moves, the measurement head 21 connected to the slider member 222X moves along the X-axis direction.
  • the measurement shot area MSA is an area (in other words, a range) in which measurement is performed by the measurement head 21 in a state where the positional relationship between the measurement head 21 and the work W is fixed (that is, without changing). Therefore, the head drive system 22 can change the positional relationship between the work W and the measurement shot area MSA by moving the measurement head 21. Further, when the head drive system 22 moves the measurement head 21, the positional relationship between the stage 32 and the work W and the measurement head 21 changes. Therefore, the head drive system 22 may be referred to as a changing device.
  • the position measuring instrument 23 can measure the position of the measuring head 21 moved by the head drive system 22.
  • the position measuring instrument 23 may include, for example, at least one of an encoder and a laser interferometer.
  • the stage device 3 includes a surface plate 31, a stage 32, a stage drive system 33, and a position measuring instrument 34.
  • the surface plate 31 is arranged on the bottom surface of the housing 4 (or on a supporting surface such as a floor on which the housing 4 is placed).
  • a stage 32 is arranged on the surface plate 31.
  • head drive systems 12 and 22 that substantially support the processing device 1 and the measuring device 2, respectively, may be arranged on the surface plate 31. That is, the processing device 1 and the measuring device 2 (further, the stage 32) may be supported by the same surface plate 31.
  • the stage 32 does not have to hold the mounted work W. That is, the stage 32 does not have to apply a holding force for holding the work W to the mounted work W.
  • the stage 32 may hold the mounted work W. That is, the stage 32 may apply a holding force for holding the work W to the mounted work W.
  • the stage 32 may hold the work W by adsorbing the work W at least one of vacuum suction, electrostatic suction, and electromagnetic suction.
  • the stage 32 is arranged on the side of the processing head 11 and the measuring head 21 (in the example shown in FIGS. 1 to 2, the ⁇ X side). Therefore, the processing head 11 is mounted on the stage 32 by injecting the processing light EL sideways from the processing head 11 (toward the ⁇ X side in the examples shown in FIGS. 1 to 2).
  • the work W is irradiated with the processing light EL.
  • the measuring head 21 emits the measuring light ML from the measuring head 21 toward the side (in the example shown in FIGS. 1 to 2 toward the ⁇ X side), so that the work W mounted on the stage 32 is mounted on the stage 32. Is irradiated with the measurement light ML.
  • the work W may be supported by a jig 321 which is a member for assisting the placement of the work W on the stage 32.
  • the jig 321 is arranged on the mounting surface 322 of the stage 32 on which the work W is mounted.
  • the work W includes a jig 321 # 1 that supports the first surface WS1 of the work W (in the example shown in FIGS. 1 to 2, the surface facing the + X side), and the first surface WS1.
  • the work W does not have to be supported by the jig 321.
  • An index member 6 that can be measured by the measuring device 2 may be attached (or may be formed) to the jig 321.
  • the index member 6 may be attached (or formed) to a member different from the jig 321.
  • the index member 6 may be attached (or formed) to the main body of the stage 32.
  • the index member 6 may be attached (or formed) to the stage drive system 33 (for example, at least one of the tables 333Y and 331 Tz described later).
  • the index member 6 may be attached (or formed) to the member attached to the stage 32.
  • FIGS. 7 (a) to 7 (c) 7 (a) is a plan view showing the index member 6, and each of FIGS. 7 (b) and 7 (c) is a cross-sectional view showing the index member 6.
  • the index member 6 may be attached to the jig 321 so as to be embedded in the jig 321. However, the index member 6 may be attached to the jig 321 so as to be arranged on the surface of the jig 321. The index member 6 may be integrated with the jig 321 (that is, a part of the jig 321 may be used as the index member 6).
  • An opening 61 is formed in the index member 6.
  • the opening 61 functions as a marker that can be measured by the measuring device 2. That is, the measuring device 2 measures the index member 6 by measuring the opening 61.
  • the measurement result of the opening 61 by the measuring device 2 (that is, the measurement result of the index member 6) may be output to the control device 5.
  • an arbitrary marker different from the opening 61 may be formed on the index member 6.
  • the opening 61 may be a through hole penetrating from the front surface to the back surface of the index member 6 (or jig 321).
  • the opening 61 may be a recess (that is, a non-through hole) formed on the surface of the index member 6 (or the jig 321).
  • the shape of the opening 61 in the plane along the YZ plane is a slit shape, but any other shape (for example, at least one of a circular shape (pinhole shape), an L shape, and a cross shape). You may.
  • the size of the opening 61 in the plane along the XY plane is, for example, a few micrometers to a few tens of micrometers (eg, 5 micrometers to 10 micrometers). , Other sizes may be used.
  • a plurality of index members 6 may be attached along the direction intersecting the rotation axis of the stage 32 (in the example shown in FIGS. 1 to 2, the rotation axis 32 ⁇ Z).
  • the work W is supported by two jigs 321 # 1 and 321 # 2 arranged along the X-axis direction intersecting the Z-axis direction. Therefore, when the index member 6 is formed on each of the jigs 321 # 1 and 321 # 2, a plurality of jigs 321 # 1 and 321 # 2 are formed along the X-axis direction intersecting the rotation axis 32 ⁇ Z (that is, the Z-axis) of the stage 32. It can be said that the index member 6 is attached.
  • the relative positional relationship between the plurality of index members 6 may be information known to the control device 5.
  • the opening 61 may be an opening through which the processing light EL can pass.
  • the opening 61 may be an opening through which the processing light EL can be incident.
  • the index member 6 (or the jig 321) may be equipped with a detector 62 capable of detecting the processing light EL through the opening 61.
  • the detector 62 is attached to the bottom surface of the index member 6 that defines the space formed by the opening 61.
  • the detector 62 is a photodetector capable of detecting (for example, receiving light) the processed light EL.
  • the detection result of the detector 62 is output to the control device 5.
  • the index member 6 may be a member provided with an attenuation film for attenuating the processing light EL on a part of the surface of the optical member through which the processing light EL can be transmitted. In this case, the portion where the damping film is not provided is the opening.
  • the attenuation film may shield the processed light EL from light.
  • the index member 6 does not have to be equipped with a photodetector capable of detecting the processing light. Further, when the index member is used as the measurement reference in the optical axis direction, the index member 6 may not have a pattern (opening or the like) formed.
  • the stage drive system 33 moves (that is, moves) the stage 32 on the surface plate 31 under the control of the control device 5.
  • the stage drive system 33 may move the stage 32 with respect to at least one of the processing head 11 and the measurement head 21.
  • the stage drive system 33 moves the stage 32 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction.
  • Moving the stage 32 along at least one of the ⁇ X, ⁇ Y, and ⁇ Z directions is the X-axis, Y-axis, and Z-axis of the stage 32 (furthermore, the work W mounted on the stage 32). It may be regarded as equivalent to changing the posture around at least one of the above, or rotating the work W placed on the stage 32 around at least one of the X-axis, Y-axis, and Z-axis. ..
  • FIGS. 1 to 2 show an example in which the stage drive system 33 moves the stage 32 along the Y-axis direction and the ⁇ Z direction, respectively. That is, FIGS. 1 to 2 show an example in which the stage drive system 33 moves the stage 32 along the Y-axis direction and rotates the stage 32 around the Z-axis.
  • the stage drive system 33 may include a stage drive system 33Y that moves the stage 32 along the Y-axis direction and a stage drive system 33Tz that moves the stage 32 along the ⁇ Z direction.
  • the stage drive system 33Y includes, for example, a guide member 331Y arranged on the surface plate 31 via a vibration isolator and extending along the Y-axis direction, a slider member 332Y movable along the guide member 331Y, and a slider member. It includes a table 333Y connected to the 332Y and a motor (not shown) for moving the slider member 332Y.
  • the stage drive system 33Tz includes, for example, a table 331Tz arranged on the table 333Y and a motor 332Tz that rotates the table 331Tz around a rotation axis 32 ⁇ Z along the Z axis.
  • a stage 32 is connected to the table 331 Tz. However, the table 331 Tz may be used as the stage 32.
  • the stage 32 connected to the slider member 332Y via the stage drive system 33Tz moves along the Y-axis direction.
  • the stage 32 connected to the table 331Tz rotates around the rotation axis 32 ⁇ Z.
  • the stage device 3 (particularly, the stage drive system 33 that moves the stage 32) may be referred to as a change device.
  • the stage 32 may be moved so that at least a part of the work W is located in the machining shot region PSA during at least a part of the machining period in which the machining apparatus 1 processes the work W.
  • the machining apparatus 1 is a machine W of the work W located in the machining shot area PSA.
  • At least a part of the processing light EL can be irradiated. As a result, at least a part of the work W is processed by the processing light EL from the processing apparatus 1 in a state of being placed on the stage 32.
  • the stage 32 may be moved so that at least a part of the work W is located in the measurement shot area MSA during at least a part of the measurement period in which the measuring device 2 measures the work W.
  • the measuring device 2 is the work W located in the machining shot area PSA.
  • At least a part of the measurement light ML can be irradiated. As a result, at least a part of the work W is measured by the measuring device 2 while being placed on the stage 32.
  • the stage 32 may move between the machining shot area PSA and the measurement shot area MSA with the work W placed on the stage 32.
  • the stage 32 may be moved so that the work W moves between the machining shot area PSA and the measurement shot area MSA while the work W is placed on the stage 32. That is, in the work W, in addition to the processing period in which the processing device 1 processes the work W and the measurement period in which the measuring device 2 measures the work W, the work W moves between the processing shot area PSA and the measurement shot area MSA. It may also remain mounted on the stage 32 during the moving period.
  • the housing 4 houses the processing device 1, the measuring device 2, and the stage device 3 in the internal storage space SP separated from the space outside the housing 4. That is, in the present embodiment, the processing device 1, the measuring device 2, and the stage device 3 are arranged in the same housing 4.
  • the processing device 1, the measuring device 2, and the stage device 3 are arranged in the same accommodation space SP.
  • the housing 4 accommodates the work W in the accommodation space SP inside the work W. That is, the processing device 1, the measuring device 2, and the work W are arranged in the same accommodation space SP.
  • at least a part of the processing device 1, the measuring device 2, and the stage device 3 may not be arranged in the accommodation space SP.
  • the control device 5 controls the operation of the processing system SYS. Specifically, the control device 5 performs the operation of the processing system SYS (for example, at least one operation of the processing device 1, the measuring device 2, and the stage device 3) so that the processing device 1 appropriately processes the work W. Control.
  • the control device 5 may include, for example, an arithmetic unit and a storage device.
  • the arithmetic unit may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit).
  • the control device 5 functions as a device that controls the operation of the processing system SYS by executing a computer program by the arithmetic unit.
  • This computer program is a computer program for causing the control device 5 (for example, an arithmetic unit) to perform (that is, execute) an operation described later to be performed by the control device 5. That is, this computer program is a computer program for causing the control device 5 to function so that the processing system SYS performs the operation described later.
  • the computer program executed by the arithmetic unit may be recorded in a storage device (that is, a recording medium) included in the control device 5, or any storage built in the control device 5 or externally attached to the control device 5. It may be recorded on a medium (for example, a hard disk or a semiconductor memory). Alternatively, the arithmetic unit may download the computer program to be executed from an external device of the control device 5 via the network interface.
  • a storage device that is, a recording medium included in the control device 5, or any storage built in the control device 5 or externally attached to the control device 5. It may be recorded on a medium (for example, a hard disk or a semiconductor memory).
  • the arithmetic unit may download the computer program to be executed from an external device of the control device 5 via the network interface.
  • the control device 5 may not be provided inside the processing system SYS, and may be provided as a server or the like outside the processing system SYS, for example.
  • the control device 5 and the processing system SYS may be connected by a wired and / or wireless network (or a data bus and / or a communication line).
  • the control device 5 and the processing system SYS may be configured so that various types of information can be transmitted and received via the network.
  • the control device 5 may be able to transmit information such as commands and control parameters to the processing system SYS via the network.
  • the processing system SYS may include a receiving device that receives information such as commands and control parameters from the control device 5 via the network.
  • the first control device that performs a part of the processing performed by the control device 5 is provided inside the processing system SYS
  • the second control device that performs the other part of the processing performed by the control device 5 is performed.
  • the control device may be provided outside the processing system SYS.
  • the recording medium for recording the computer program executed by the arithmetic unit, at least one of an optical disk, a magnetic medium, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing the program is used. You may.
  • the recording medium may include a device capable of recording a computer program.
  • each process or function included in the computer program may be realized by a logical processing block realized in the control device 5 by the control device 5 (that is, the computer) executing the computer program. It may be realized by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 5, or a logical processing block and a partial hardware module that realizes a part of the hardware are mixed. It may be realized in the form of.
  • FPGA predetermined gate array
  • the machining system SYS performs a machining operation for machining the work W. Further, the machining system SYS uses the index member 6 described above before the machining operation is started (or after the machining operation is started or after the machining operation is finished), and the machining head 11 and the measurement head 21 are combined with each other.
  • a position information calculation operation for calculating information regarding a relative position (typically, a baseline amount described later) may be performed. Therefore, in the following, the position information calculation operation and the processing operation will be described in order.
  • FIG. 8 is a flowchart showing the flow of the position information calculation operation.
  • the stage 32 and / or the machining head 11 moves so that the index member 6 (that is, the opening 61) is located in the machining shot region PSA (step S11). That is, the stage 32 and / or the processing head 11 moves so that the opening 61 is located at a position where the processing light EL from the processing head 11 can be received.
  • the machining head 11 irradiates the machining reference point in the machining shot area PSA with the machining light EL (step S12).
  • the processing head 11 irradiates the processing light EL to the processing reference point by irradiating the processing light EL without deflecting the processing light EL with the galvano mirror 1122 (that is, without driving the galvano mirror 1122). You may.
  • the processing head 11 may irradiate the processing reference point with the processing light EL by deflecting the processing light EL (that is, driving the galvano mirror 1122) and irradiating the processing light EL.
  • the machining reference point may be, for example, the center of the machining shot region PSA.
  • the processing reference point may be, for example, an intersection of the optical axis of the processing optical system 112 and the processing shot region PSA. In that state, the stage 32 and / or the processing head 11 moves until the detector 62 can detect the processing light EL (step S12).
  • the control device 5 provides stage position information regarding the position of the stage 32 at the time when the detector 62 can detect the processing light EL. , Obtained from the position measuring instrument 34 (step S13). Further, the control device 5 determines the machining position with respect to the position of the machining head 11 at the time when the detector 62 can detect the machining light EL when the machining head 11 moves at least one of steps S11 and S12. Information is acquired from the position measuring instrument 13 (step S13).
  • the stage 32 and / or the measurement head 21 moves so that the index member 6 (that is, the opening 61) irradiated with the processing light EL in step S12 is located in the measurement shot area MSA (step S14). ..
  • the measuring head 21 measures the opening 61 (step S15). In particular, the measuring head 21 measures the position of the opening 61. In that state, the stage 32 and / or the measurement head 21 moves until the opening 61 is located at the measurement reference point in the measurement shot area MSA (step S15).
  • the measurement reference point may be, for example, the center of the measurement shot area MSA.
  • the measurement reference point may be, for example, an intersection of the optical axis of the measurement head 21 and the measurement shot area MSA.
  • the control device 5 provides the stage position information regarding the position of the stage 32 at the time when the opening 61 is located at the measurement reference point, and the position measuring instrument 34. Obtained from (step S16). Further, when the measurement head 21 moves at least one of steps S14 and S15, the control device 5 measures the measurement position information regarding the position of the measurement head 21 when the opening 61 is located at the measurement reference point. Obtained from the vessel 23 (step S16).
  • the stage position information acquired in step S13 corresponds to information regarding the position of the stage 32 when the opening 61 is located at the machining reference point. Since the jig 321 on which the opening 61 is formed is arranged on the stage 32, the information regarding the position of the stage 32 when the opening 61 is located at the machining reference point is the opening located at the machining reference point. It can be said that the position of 61 (that is, the position of the processing reference point) is indirectly indicated. Further, the stage position information acquired in step S16 corresponds to information regarding the position of the stage 32 when the opening 61 is located at the measurement reference point.
  • the information regarding the position of the stage 32 when the opening 61 is located at the measurement reference point indirectly indicates the position of the opening 61 located at the measurement reference point (that is, the position of the measurement reference point). It can be said that it shows. Therefore, the difference between the position of the stage 32 indicated by the stage position information acquired in step S13 and the position of the stage 32 indicated by the stage position information acquired in step S16 is the position of the machining reference point and the position of the measurement reference point. Corresponds to the difference of. Therefore, the control device 5 sets the distance between the machining reference point and the measurement reference point (specifically, the distance along the XY plane) based on the stage position information acquired in steps S13 and S16. The corresponding baseline amount may be calculated (step S17).
  • the machining position information acquired in step S13 corresponds to the information regarding the position of the machining head 11 in the state where the opening 61 is located at the machining reference point. Furthermore, since the position of the machining shot region PSA (furthermore, the machining reference point) is a position determined with reference to the machining head 11, the machining position information acquired in step S13 is the machining head that serves as the reference for the machining reference point. It can be said that the relative position between 11 and the opening 61 is indirectly indicated.
  • the measurement position information acquired in step S16 corresponds to information regarding the position of the measurement head 21 when the opening 61 is located at the measurement reference point.
  • the measurement position information acquired in step S16 is the measurement head that serves as the reference for the measurement reference point. It can be said that the relative position between the 21 and the opening 61 is indirectly indicated. Therefore, the difference between the position of the machining head 11 indicated by the machining position information acquired in step S13 and the position of the measurement head 21 indicated by the measurement position information acquired in step S16 is also the position of the machining reference point and the measurement reference. It corresponds to the difference from the position of the point.
  • control device 5 sets the distance between the machining reference point and the measurement reference point (specifically, on the XY plane) based on the machining position information and the measurement position information acquired in steps S13 and S16, respectively.
  • the baseline amount corresponding to the distance along the line) may be calculated (step S17).
  • the calculated baseline amount may be used by the control device 5 during the period in which the processing system SYS actually processes the work W (that is, during the period in which the processing operation described later is performed). Specifically, the control device 5 may control the stage drive system 33 so that the stage 32 moves based on the calculated baseline amount. The control device 5 may control the head drive system 12 so that the machining head 11 moves based on the calculated baseline amount. The control device 5 may control the head drive system 22 so that the measurement head 21 moves based on the calculated baseline amount.
  • the machining system SYS can perform the machining operation based on the relative position between the machining head 11 and the measurement head 21 (for example, the relative position between the machining reference point and the measurement reference point). can. Therefore, the machining system SYS can be connected to the machining head 11 even when the relative position between the machining head 11 and the measurement head 21 (for example, the relative position between the machining reference point and the measurement reference point) fluctuates with the passage of time. The machining operation can be performed without being affected by the fluctuation of the relative position with the measuring head 21. As a result, the machining system SYS can machine the work W with relatively high accuracy as compared with the case where the position information calculation operation is not performed.
  • a plurality of index members 6 are attached to the stage 32.
  • the processing system SYS may perform the position information calculation operation using any one of the plurality of index members 6.
  • the processing system SYS may perform the position information calculation operation using at least two of the plurality of index members 6.
  • the processing system SYS performs the position information calculation operation using the first index member 6, and then the first index member 6 is used.
  • the position information calculation operation may be performed using a different second index member 6. That is, in the processing system SYS, at least of the processing head 11, the measuring head 21 and the stage 32 so that the first index member 6 is measured by the measuring head 21 and the first index member 6 is irradiated with the processing light EL.
  • One of the processing head 11, the measuring head 21 and the stage 32 is moved so that the second index member 6 is measured by the measuring head 21 and the second index member 6 is irradiated with the processing light EL.
  • the position information calculation operation may be performed by moving at least one of them.
  • the plurality of index members 6 are in the direction of intersecting the rotation axis of the stage 32 (in this embodiment, the rotation axis 32 ⁇ Z). It may be mounted along. In this case, if the stage 32 rotates around the rotation axis 32 ⁇ Z, the measuring device 2 can measure at least one of the plurality of index members 6. That is, even if the stage 32 rotates around the rotation axis 32 ⁇ Z, it is unlikely that any of the plurality of index members 6 cannot be located in the measurement shot area MSA of the measuring device 2.
  • the processing system SYS can appropriately perform the above-mentioned position information calculation operation.
  • An index member 6 is attached to each of the above. Therefore, when the first index member 6 (for example, the index member 6 attached to the jig 321 # 1) can be measured by the measuring head 21, the second index member 6 (for example, the jig 321) can be measured.
  • the index member 6) attached to # 2 is not measurable by the measuring head 21.
  • the second index member 6 is located outside the measurement shot area MSA of the measurement head 21 that measures the first index member 6. In this way, when a plurality of index members 6 are attached to the stage 32, the second index member 6 is located outside the measurement shot area MSA of the measurement head 21 that measures the first index member 6. , A plurality of index members 6 may be attached.
  • the plurality of index members 6 are positioned at the stage 32 during the machining operation (or before the machining operation is started or after the machining operation is completed). It may be used for the purpose of measuring.
  • the plurality of index members 6 may be used for the purpose of measuring the position of the stage 32 around the rotation axis of the stage 32 (in this embodiment, the rotation axis 32 ⁇ Z).
  • a plurality of (specifically, at least two) index members 6 whose relative positional relationships are known are attached to the stage 32 along a direction intersecting the rotation axis of the stage 32. Is preferable.
  • the control device 5 can appropriately calculate the position of the stage 32 around the rotation axis 32 ⁇ Z based on the measurement results of the plurality of index members 6 by the measuring device 2.
  • the measuring device 2 may not be able to measure the number (for example, two) of the index members 6 required to specify the position of the stage 32 at one time. In this case, the measuring device 2 measures the first index member 6, and then at least the measuring head 21 and the stage 32 so that the second index member 6 is located in the measurement shot area MSA of the measuring device 2. One may move and then the measuring device 2 may measure the second index member 6. As a result, even when a plurality of index members 6 are attached so that the second index member 6 is located outside the measurement shot area MSA of the measurement head 21 that measures the first index member 6.
  • the control device 5 can appropriately calculate the position of the stage 32 around the rotation axis 32 ⁇ Z based on the measurement results of the plurality of index members 6 by the measuring device 2.
  • the single index member 6 may be used for the purpose of measuring the position of the stage 32.
  • any one of the plurality of index members 6 may be used for the purpose of measuring the position of the stage 32.
  • the measuring device 2 measures the index member 6, then the stage 32 moves, and then the measuring device 2 measures the index member 6 located at a position different from the initial position as the stage 32 moves. May be good.
  • the control device 5 rotates based on the measurement results of the single index member 6 at different positions by the measuring device 2.
  • the position of the stage 32 around the axis 32 ⁇ Z can be appropriately calculated.
  • the machining system SYS may include a plurality of measuring devices 2 having different measurement shot area MSAs, as shown in FIG. 9, which shows a system configuration of another example of the machining system SYS.
  • the first measuring device 2 measures the index member 6, then the stage 32 moves, and then the second measuring device 2 is positioned at a position different from the initial position as the stage 32 moves.
  • the index member 6 may be measured.
  • the control device 5 can appropriately calculate the position of the stage 32 around the rotation axis 32 ⁇ Z based on the measurement results of the same index member 6 by the plurality of measuring devices 2 at different positions.
  • FIG. 10 is a flowchart showing a flow of machining operations performed by the machining system SYS.
  • a machining operation for machining the first surface WS1 and the second surface WS2 of the work W shown in FIGS. 1 to 2 will be described. That is, by removing the portion (part) on the first surface WS1 side of the work W and the portion (part) on the second surface WS2 side of the work W that is different from the portion on the first surface WS1 side of the work W.
  • the processing operation for thinning the work W will be described.
  • the work W has a plate-like shape, but may have other shapes.
  • the machining system SYS may perform a machining operation different from the machining operation for machining the first surface WS1 and the second surface WS2 of the work W.
  • step S21 the work W to be machined by the machining system SYS is placed on the stage 32 (step S21).
  • the measuring device 2 measures the work W mounted on the stage 32 (step S22). Specifically, the measuring device 2 measures a portion of the work W to be machined by the machining system SYS (that is, the first surface WS1 and the second surface WS2).
  • the control device 5 measures the work W so that the measuring device 2 can measure the first surface WS1 of the work W. Move the head 21 and / or the stage 32. That is, the control device 5 moves the measurement head 21 and / or the stage 32 so that the measurement head 21 can irradiate the first surface WS1 with the measurement light ML.
  • FIG. 11 is a cross-sectional view showing the processing system SYS that measures the work W
  • the control device 5 measures the work W so that the measuring device 2 can measure the first surface WS1 of the work W.
  • Move the head 21 and / or the stage 32 That is, the control device 5 moves the measurement head 21 and / or the stage 32 so that the measurement head 21 can irradiate the first surface WS1 with the measurement light
  • the control device 5 moves the measurement head 21 and / or the stage 32 so that the first surface WS1 faces the measurement head 21 side (that is, faces the + X side). After that, the measuring device 2 measures the first surface WS1. After the measurement of the first surface WS1 is completed, as shown in FIG. 12, which is a cross-sectional view showing the processing system SYS that measures the work W, the control device 5 uses the measuring device 2 to measure the second surface WS2 of the work W. The measuring head 21 and / or the stage 32 is moved so that the measurement can be performed. That is, the control device 5 moves the measurement head 21 and / or the stage 32 so that the measurement head 21 can irradiate the second surface WS2 with the measurement light ML. In the example shown in FIG.
  • the control device 5 moves the measurement head 21 and / or the stage 32 so that the second surface WS2 faces the measurement head 21 side (that is, faces the + X side). Since the second surface WS2 is the surface opposite to the first surface WS1 and the second surface WS2 and the first surface WS1 are aligned along the direction intersecting the rotation axis 32 ⁇ Z of the stage 32, the control device 5 May rotate the stage 32 around the rotation axis 32 ⁇ Z in order to change the state of the work W from the state shown in FIG. 11 to the state shown in FIG. After that, the measuring device 2 measures the second surface WS2. Alternatively, the measuring device 2 may measure the first surface WS1 after measuring the second surface WS2.
  • the processing apparatus 1 processes either one of the first surface WS1 and the second surface WS2 of the work W, and then processes one of the first surface WS1 and the second surface WS2 of the work W.
  • the processing apparatus 1 processes the first surface WS1 (step S23) and then processes the second surface WS2 (step S24).
  • the processing apparatus 1 may process the second surface WS2 and then the first surface WS1.
  • FIG. 13 which is a cross-sectional view showing a processing system SYSTEM for processing the first surface WS1 in order to process the first surface WS1, in the control device 5, the processing device 1 processes the first surface WS1.
  • the machining head 11 and / or the stage 32 is moved so that the processing head 11 and / or the stage 32 can be moved. That is, the control device 5 moves the measuring head 21 and / or the stage 32 so that the machining head 11 can irradiate the first surface WS1 with the machining light EL.
  • the control device 5 moves the machining head 11 and / or the stage 32 so that the first surface WS1 faces the machining head 11 side (that is, faces the + X side).
  • the processing apparatus 1 processes the first surface WS1. That is, the processing apparatus 1 removes the portion of the work W on the first surface WS1 side.
  • the processing apparatus 1 processes the first surface WS1 so as to remove the portion of the work W on the first surface WS1 side by a predetermined thickness (in the example shown in FIG. 13, the thickness in the X-axis direction). explain.
  • the work W When the first surface WS1 is processed, the work W may be deformed as shown in FIG. 14, which is a cross-sectional view showing the work W on which the first surface WS1 is processed. That is, when the portion of the work W on the first surface WS1 side is removed by a predetermined thickness, the first surface WS1 (furthermore, the first surface WS1) of the work W should be flat even though the first surface WS1 of the work W should be flat.
  • the two-sided WS2) may not be flat (for example, curved).
  • One of the reasons for this is that when the first surface WS1 is processed, the stress accumulated in the work W is released.
  • the degree of such deformation of the work W increases as it approaches the center of the work W (specifically, the center of the plate-shaped work W in a plan view, and in the example shown in FIG. 14, the center in the YZ plane). There is a possibility of becoming. That is, the amount of deformation of the work W may increase as it approaches the center of the work W.
  • the jig 321 for supporting the work W is not shown in FIGS. 14 and 14 and thereafter.
  • the processing system SYS 1 mainly aims to release the stress. Is provisionally processed, and then the deformed work W is measured by releasing the stress, and then, based on the measurement result of the deformed work W, the deformed work W has the desired shape. W is processed again (that is, it is finished). Therefore, in step S23 of FIG. 10, if the processing apparatus 1 removes the portion of the work W on the first surface WS1 side by an amount corresponding to the thickness capable of releasing the stress accumulated in the work W. It is enough.
  • the processing apparatus 1 provisionally processes the first surface WS1 mainly for the purpose of releasing the stress, and then provisionally processes the second surface WS2 mainly for the purpose of releasing the stress.
  • FIG. 15 which is a cross-sectional view showing a processing system SYSTEM for processing the second surface WS2 of the work W in order to process the second surface WS2, in the control device 5, the processing device 1 is the second surface of the work W.
  • the machining head 11 and / or the stage 32 is moved so that the surface WS2 can be machined.
  • control device 5 moves the processing head 11 and / or the stage 32 so that the processing head 11 can irradiate the second surface WS2 with the processing light EL.
  • the control device 5 moves the machining head 11 and / or the stage 32 so that the second surface WS2 faces the machining head 11 side (that is, faces the + X side).
  • the control device 5 may rotate the stage 32 around the rotation axis 32 ⁇ Z, as described above.
  • the processing apparatus 1 processes the second surface WS2. That is, the processing apparatus 1 removes the portion of the work W on the second surface WS2 side.
  • the processing apparatus 1 processes the second surface WS2 so as to remove the portion of the work W on the second surface WS2 side by a predetermined thickness.
  • the processing in step S24 is the processing of the second surface WS2 whose main purpose is to release stress
  • the processing apparatus 1 applies the portion of the work W on the second surface WS2 side to the work W. It is sufficient to remove only the amount corresponding to the thickness that can release the stress accumulated in.
  • the processing system SYS When the residual stress is deeply inserted from the surface of the work W, the processing system SYS temporarily processes the surface of the work W and then measures it with the measuring device 2, and deforms the work W per unit processing amount. You may estimate the amount. Then, the processing system SYS may further process the work W based on the estimated amount of deformation.
  • FIG. 16 is a cross-sectional view showing the work W on which the second surface WS2 is processed
  • the work W is the same as when the first surface WS1 is processed. May be further deformed. The reason is as described above.
  • the processing system SYS measures the processed first surface WS1 (that is, the first surface WS1 newly exposed by removing the portion of the work W on the first surface WS1 side), and the first surface WS1. Based on the measurement result of, the processed first surface WS1 is further processed. That is, the machining system SYS measures the portion of the machined work W on the first surface WS1 side (that is, the deformed portion), and obtains the measurement result of the portion of the machined work W on the first surface WS1 side. Based on this, the portion of the processed work W on the first surface WS1 side is further removed.
  • the processing system SYS measures the processed second surface WS2 (that is, the second surface WS2 newly exposed by removing the portion of the work W on the second surface WS2 side), and measures the second surface WS2. Based on the result, the processed second surface WS2 is further processed. That is, the machining system SYS measures the portion of the machined work W on the second surface WS2 side (that is, the deformed portion), and obtains the measurement result of the portion of the machined work W on the second surface WS2 side. Based on this, the portion of the processed work W on the second surface WS2 side is further removed. In the following, as shown in FIG.
  • the second surface WS2 is measured (step S25), then the second surface WS2 is processed (step S26), and then the first surface WS1 is measured (step S27).
  • step S28 an example in which the first surface WS1 is processed (step S28) will be described.
  • the second surface WS2 may be measured and processed.
  • FIG. 17 which is a cross-sectional view showing a processing system SYSTEM for measuring the work W in order to measure the second surface WS2, in the control device 5, the measuring device 2 is the second surface of the processed work W.
  • the measurement head 21 and / or the stage 32 is moved so that the WS2 can be measured.
  • the measuring device 2 measures the second surface WS2.
  • the control device 5 provisionally processes the second surface WS2 based on the measurement result of the second surface WS2 in step S22 of FIG. 10 and the measurement result of the second surface WS2 in step S25 of FIG.
  • the amount of deformation of the second surface WS2 due to the above can be obtained. That is, based on the measurement results of the second surface WS2 in steps S22 and S25, the amount of deformation of the portion of the work W on the second surface WS2 side can be obtained.
  • the processing system SYS processes the second surface WS2. Specifically, the control device 5 calculates the amount of processing of the second surface WS2 of the deformed work W based on the amount of deformation of the second surface WS2 and the design information regarding the work W after processing. That is, the control device 5 calculates the amount of deformation of the portion of the work W on the second surface WS2 side and the amount of processing of the portion of the deformed work W on the second surface WS2 side based on the design information regarding the work W after machining. do. For example, when the design information includes information on the dimensions of the work W after machining, the control device 5 may use the deformed work W dimensions (particularly, the dimensions of the second surface WS2 and the second surface WS2 of the work W).
  • the control device 5 determines the deformed shape of the work W (particularly, the shape of the second surface WS2 and the second surface WS2 of the work W). Calculate the amount of processing required to make at least one of the shapes of the side parts) into the ideal shape indicated by the design information.
  • FIG. 18 which is a cross-sectional view showing the processing system SYS for processing the work W, the processing apparatus 1 processes the second surface WS2 by the processing amount calculated by the control device 5.
  • the processing device 1 removes the portion of the work W on the second surface WS2 side by the processing amount calculated by the control device 5.
  • FIG. 19 which is a cross-sectional view showing the work W on which the second surface WS2 has been finished
  • at least one of the dimensions of the second surface WS2 and the dimension of the portion of the work W on the second surface WS2 side The ideal dimensions indicated by the design information.
  • at least one of the shape of the second surface WS2 and the shape of the portion of the work W on the second surface WS2 side becomes an ideal shape indicated by the design information.
  • the processing system SYS may perform an operation of calculating the position of the stage 32 using the index member 6 described above.
  • the measuring device 2 may measure the index member 6.
  • the control device 5 may calculate the position of the stage 32 based on the measurement result of the index member 6.
  • the control device 5 can grasp how the work W is placed on the stage 32. That is, the control device 5 is relative to the stage 32 and the work W (particularly, the portion of the work W on the second surface WS2 side) based on the measurement result of the index member 6 and the measurement result of the second surface WS2.
  • the positional relationship can be calculated.
  • control device 5 is suitable for the portion of the work W on the second surface WS2 side based on the relative positional relationship between the stage 32 and the work W (particularly, the portion of the work W on the second surface WS2 side).
  • the processing device 1 and / or the stage device 3 may be controlled so as to be machined.
  • the measuring device 2 measures the first surface WS1. Therefore, as shown in FIG. 20, which is a cross-sectional view showing a processing system SYSTEM for measuring the work W, in the control device 5, the measuring device 2 has the work W on which the first surface WS1 has been processed in step S26 of FIG. The measurement head 21 and / or the stage 32 is moved so that the second surface WS2 of the above can be measured. After that, the measuring device 2 measures the first surface WS1. As a result, the control device 5 obtains the amount of deformation of the first surface WS1 based on the measurement result of the first surface WS1 in step S22 of FIG. 10 and the measurement result of the first surface WS1 in step S27 of FIG. be able to. That is, based on the measurement results of the first surface WS1 in steps S22 and S27, the amount of deformation of the portion of the work W on the first surface WS1 side can be obtained.
  • FIG. 20 is a cross-sectional view showing a processing system SYSTEM for measuring the
  • the processing system SYS processes the first surface WS1. Specifically, the control device 5 calculates the amount of processing of the first surface WS1 of the deformed work W based on the amount of deformation of the first surface WS1 and the design information regarding the work W after processing. That is, the control device 5 calculates the amount of deformation of the portion of the work W on the first surface WS1 side and the amount of processing of the portion of the deformed work W on the first surface WS1 side based on the design information regarding the work W after machining. do. For example, when the design information includes information on the dimensions of the work W after machining, the control device 5 determines the dimensions of the deformed work W (particularly, the dimensions of the first surface WS1 and the first surface WS1 of the work W).
  • the control device 5 determines the deformed shape of the work W (particularly, the shape of the first surface WS1 and the first surface WS1 of the work W). Calculate the amount of processing required to make at least one of the shapes of the side parts) into the ideal shape indicated by the design information.
  • FIG. 21 which is a cross-sectional view showing the processing system SYS for processing the work W, the processing apparatus 1 processes the first surface WS1 by the processing amount calculated by the control device 5.
  • the processing device 1 removes the portion of the work W on the first surface WS1 side by the processing amount calculated by the control device 5.
  • FIG. 22 which is a cross-sectional view showing the work W on which the first surface WS1 has been finished
  • at least one of the dimensions of the first surface WS1 and the dimension of the portion of the work W on the first surface WS1 side The ideal dimensions indicated by the design information.
  • at least one of the shape of the first surface WS1 and the shape of the portion of the work W on the first surface WS1 side becomes an ideal shape indicated by the design information.
  • the processing system SYS may perform an operation of calculating the position of the stage 32 using the index member 6 described above.
  • the measuring device 2 may measure the index member 6 after the machining head 11 and / or the stage 32 has moved to measure and finish the second surface WS2.
  • the control device 5 may calculate the position of the stage 32 based on the measurement result of the index member 6.
  • the control device 5 can grasp how the work W is placed on the stage 32. That is, the control device 5 is relative to the stage 32 and the work W (particularly, the portion of the work W on the first surface WS1 side) based on the measurement result of the index member 6 and the measurement result of the first surface WS1.
  • control device 5 is suitable for the portion of the work W on the first surface WS1 side based on the relative positional relationship between the stage 32 and the work W (particularly, the portion of the work W on the first surface WS1 side).
  • the processing device 1 and / or the stage device 3 may be controlled so as to be machined.
  • the index member 6 measured by the measuring device 2 at the timing when the first surface WS1 is measured in step S27 of FIG. 10 is an index measured by the measuring device 2 at the timing when the second surface WS2 is measured in step S25 of FIG. It may be different from the member 6.
  • the measuring device 2 is the first index member 6 (for example, the index member 6 attached to the jig 321 # 2 supporting the second surface WS2) at the timing when the second surface WS2 is measured in step S25. May be measured. After that, after the stage 32 and / the processing head 11 move so as to process the second surface WS2 based on the measurement result of the first index member 6, the measuring device 2 measures the first surface WS1 in step S27.
  • the second index member 6 (for example, the index member 6 attached to the jig 321 # 1 supporting the first surface WS1) may be measured at the same timing.
  • the second index member 6 is located outside the measurement shot area MSA of the measuring device 2 that measures the first index member 6, and the measuring device 2 measures the second index member 6.
  • the first index member 6 is located outside the measurement shot area MSA.
  • the processing system SYS includes a plurality of measuring devices 2 having different measurement shot area MSAs as shown in FIG. 9, the index member 6 is measured at the timing when the first surface WS1 is measured in step S27 of FIG.
  • the measuring device 2 that measures the index member 6 may be different from the measuring device 2 that measures the index member 6 at the timing when the second surface WS2 is measured in step S25 of FIG.
  • the processing system SYS described above can process both sides of the work W while the work W is placed (or held). Since the processing system SYS can process both sides of the work W without remounting (reholding) the work W, the work W can be processed with high accuracy. Further, the machining system SYS tentatively machined the work W mainly for the purpose of releasing the stress based on the fact that the stress accumulated in the work W is released when the work W is machined, and then the work W is tentatively machined. The deformed work W is finished by releasing the stress. After the stress accumulated in the work W is released, the work W is not deformed so much or hardly even if the work W is further processed.
  • the machining system SYS can machine the work W with high accuracy so as to reduce or cancel the influence of the deformation of the work W.
  • the processing system SYS can process the work W with high accuracy so that the shape of the work W becomes an ideal shape.
  • the machining system SYS can machine the work W with high accuracy so that the dimensions of the work W become ideal dimensions.
  • FIG. 23 is a block diagram showing a system configuration of the processing system SYSA of the first modification.
  • FIG. 24 is a cross-sectional view showing the structure of the processing system SYSA of the first modification.
  • FIG. 25 is a cross-sectional view showing the structure of the processing system SYS of the first modification.
  • the machining apparatus 1 includes a head drive system 12a instead of the head drive system 12 as compared with the above-mentioned machining system SYS. It differs in that.
  • the processing system SYSa is different from the processing system SYS described above in that the measuring device 2 includes a head drive system 22a instead of the head drive system 22.
  • the processing system SYSa is different from the processing system SYS described above in that the stage device 3 includes a stage drive system 33a instead of the stage drive system 33.
  • the machining system SYSa differs from the above-mentioned machining system SYS in that the stage device 3 (particularly, the stage 32) is arranged below the machining head 11 and the measurement head 21 (that is, on the ⁇ Z side).
  • the processing head 11 and the measuring head 21 have an arch-shaped shape (or any other shape) that overhangs above the stage device 3 (particularly, the stage 32), and the surface plate 31 via a vibration isolator 31. It may be supported by the support member 8b arranged above. Therefore, in the processing system SYS, as compared with the above-mentioned processing system SYS, the processing head 11 irradiates the processing light EL downward and the measuring head 21 irradiates the measuring light ML downward. different.
  • Other features of the machining system SYS may be the same as the other features of the machining system SYS.
  • the head drive system 12a is different from the head drive system 12 in that the processing head 11 is moved along the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. Other features of the head drive system 12a may be the same as other features of the head drive system 12.
  • the head drive system 12a includes a head drive system 12Xa, a head drive system 12Ya, and a head drive system 12Za in order to move the machining head 11 along each of the X-axis direction, the Y-axis direction, and the Z-axis direction. You may be.
  • the head drive system 12Xa moves the processing head 11 along the X-axis direction.
  • the head drive system 12Ya moves the processing head 11 along the Y-axis direction.
  • the head drive system 12Za moves the processing head 11 along the Z-axis direction.
  • the head drive system 12Y includes, for example, a guide member 121Y arranged on a surface plate 31 described later via a vibration isolator and extending along the Y-axis direction, a slider member 122Ya movable along the guide member 121Ya, and the like. It includes a support column member 123Ya that is connected to the slider member 122Ya and extends to a position higher than the stage device 3 along the Z-axis direction, and a motor (not shown) that moves the slider member 122Ya.
  • the head drive system 12Xa is, for example, unable to move the guide member 121Xa connected to the upper end of the support column member 123Ya and extending along the X-axis direction, the slider member 122Xa movable along the guide member 121Xa, and the slider member 122Xa. It is equipped with the motor shown in the figure.
  • the head drive system 12Z is not shown, for example, to move the guide member 121Za connected to the slider member 122Xa and extending along the Z-axis direction, the slider member 122Za movable along the guide member 121Za, and the slider member 122Za. It is equipped with a motor.
  • a processing head 11 is connected to the slider member 122Za.
  • the processing head 11 connected to the slider member 122Ya via the head drive systems 12Xa and 12Za moves along the Y-axis direction.
  • the machining head 11 connected to the slider member 122Xa via the head drive system 12Za moves along the X-axis direction.
  • the machining head 11 connected to the slider member 122Za moves along the Z-axis direction.
  • the head drive system 22a is different from the head drive system 22 in that the measurement head 21 is moved along the Z-axis direction. Other features of the head drive system 22a may be the same as other features of the head drive system 22.
  • the head drive system 22a includes, for example, a head drive system 22Z that moves the measurement head 21 along the Z-axis direction.
  • the head drive system 22Z is not shown, for example, a guide member 221Za connected to the slider member 122Xa and extending along the Z-axis direction, a slider member 222Z movable along the guide member 221Za, and a slider member 222Za. It is equipped with a motor.
  • a measuring head 21 is connected to the slider member 222Za.
  • the measurement head 21 connected to the slider member 222Za moves along the Z-axis direction.
  • the guide member 221Za is connected to the slider member 122Xa
  • the measurement head 21 connected to the slider member 122Ya via the head drive system 12Xa and 22Za moves along the Y-axis direction. do.
  • the measurement head 21 connected to the slider member 122Xa via the head drive system 22Za moves along the X-axis direction. Therefore, the measurement head 21 can be moved along the X-axis direction, the Y-axis direction, and the Z-axis direction by the head drive systems 12a and 22a, respectively.
  • the stage drive system 33a is different from the stage drive system 33 in that the stage 32 is moved along each of the ⁇ Z direction and the ⁇ X direction. That is, the stage drive system 33a differs from the stage drive system 33 in that the stage 32 is rotated around each of the Z axis and the X axis. Other features of the stage drive system 33a may be the same as other features of the stage drive system 33.
  • the stage drive system 33a may include a stage drive system 33Tza and a stage drive system 33Txa.
  • the stage drive system 33Tza includes, for example, a table 331Tza and a motor 332Tza that rotates the table 331Tza around a rotation axis 32 ⁇ Za along the Z axis.
  • the stage drive system 33Txa includes, for example, a support column member 331Txa extending from the table 331Tza along the Z-axis direction, a table 332Txa attached to the support column member 331Txa so as to be rotatable around a rotation axis 32 ⁇ Xa along the X-axis, and a table. It includes a motor (not shown) that rotates 332Txa around a rotation shaft 32 ⁇ Xa.
  • a stage 32 is connected to the table 332Txa.
  • the table 332Txa has a shape in which the portion on which the stage 32 is placed is located below the portion connected to the support column member 331Txa, but other It may have a shape.
  • the table 332Txa may be used as the stage 32.
  • the stage 32 connected to the table 331Tza via the stage drive system 33Txa rotates around the rotation shaft 32 ⁇ Za.
  • the stage 32 connected to the table 332Txa rotates around the rotation axis 32 ⁇ Xa.
  • the stage drive system 33Txa since the processing head 11 and the measurement head 21 are arranged above the stage 32 (that is, on the + Z side), the stage drive system 33Txa typically rotates the stage 32 around the rotation axis 32 ⁇ Xa. By doing so, the state of the work W can be switched between a state in which the processing light EL can irradiate the first surface WS1 of the work W and a state in which the processing light EL can irradiate the second surface WS2 of the work W. Similarly, when the stage drive system 33Txa rotates the stage 32 around the rotation axis 32 ⁇ Xa, the state of the work W can be measured by the measurement light ML on the first surface WS1 of the work W and the measurement light ML on the work W.
  • FIG. 26 shows a state in which the stage 32 is rotated around the rotation axis 32 ⁇ Xa so that the processing light EL or the measurement light ML can irradiate the first surface WS1 of the work W.
  • FIG. 27 shows a state in which the stage 32 is rotated around the rotation axis 32 ⁇ Xa so that the processing light EL or the measurement light ML can irradiate the second surface WS2 of the work W.
  • the stage 32 can rotate around a plurality of rotation axes (specifically, two rotation axes 32 ⁇ Za and 32 ⁇ Xa) having different directions. In this case, it may be considered that the direction of the rotation axis of the stage 32 is substantially changed.
  • a plurality of the index members 6 described above may be attached along a direction intersecting each rotation axis of the stage 32. Specifically, at least two index members 6 are attached along the direction intersecting either one of the rotating shafts 32 ⁇ Za and 32 ⁇ Xa, and at least two index members 6 are attached in the direction along the other of the rotating shafts 32 ⁇ Za and 32 ⁇ Xa.
  • Another index member 6 different from 6 may be attached.
  • the position of the stage 32 around each of the plurality of rotation axes (specifically, the two rotation axes 32 ⁇ Za and 32 ⁇ Xa) is appropriate. Can be calculated.
  • FIGS. 28 to 29 the machining system SYS of the second modified example (hereinafter, the machining system SYS of the second modified example is referred to as “machining system SYSb”. ) Will be explained.
  • FIG. 28 is a block diagram showing a system configuration of the processing system SYSb of the second modification.
  • FIG. 29 is a cross-sectional view showing the structure of the processing system SYSb of the second modification.
  • the machining device 1 does not have to include the head drive system 12 and the position measuring instrument 13 as compared with the above-mentioned machining system SYS. It differs in that.
  • the processing system SYSa is different from the processing system SYS described above in that the measuring device 2 does not have to include the head drive system 22 and the position measuring instrument 23 described above.
  • the processing system SYSa is different from the processing system SYS described above in that the stage device 3 includes a stage drive system 33b instead of the stage drive system 33.
  • the machining system SYSb is different from the above-mentioned machining system SYS in that the stage device 3 (particularly, the stage 32) is arranged below the machining head 11 and the measurement head 21 (that is, on the ⁇ Z side). Therefore, in the processing system SYSb, as compared with the above-mentioned processing system SYS, the processing head 11 irradiates the processing light EL downward and the measuring head 21 irradiates the measuring light ML downward. different.
  • Other features of the machining system SYSb may be the same as the other features of the machining system SYS.
  • the stage drive system 33a is different from the stage drive system 33 in that the stage 32 is moved at least along the X-axis direction and the Y-axis direction. Further, the stage drive system 33a is different from the stage drive system 33 in that the robot arm 33Rb is provided. Other features of the stage drive system 33b may be the same as other features of the stage drive system 33.
  • the stage drive system 33b In order to move the stage 32 along the X-axis direction and the Y-axis direction, the stage drive system 33b has the stage drive system 33Xb that moves the stage 32 along the X-axis direction and the stage 32 in the Y-axis direction. It may be provided with a stage drive system 33Yb to be moved along the line.
  • the stage drive system 33Yb includes, for example, a guide member 331Yb arranged on the surface plate 31 via a vibration isolator and extending along the Y-axis direction, a slider member 332Yb movable along the guide member 331Yb, and a slider member. It includes a table 333Yb connected to 332Yb and a motor (not shown) for moving the slider member 332Yb.
  • the stage drive system 33Xb includes, for example, a guide member 331Xb connected to the table 333Yb and extending along the X-axis direction, a slider member 332Xb movable along the guide member 331Xb, and a table 333Xb connected to the slider member 332Xb.
  • a motor (not shown) for moving the slider member 332Xb is provided.
  • a stage 32 is connected to the table 333Xb.
  • the table 333Xb may be used as the stage 32.
  • the robot arm 33Rb may be, for example, an articulated robot arm.
  • the end effector of the robot arm 33Rb is preferably an end effector capable of grasping the work W.
  • the robot arm 33Rb may move the work W while holding the work W.
  • the robot arm 33Rb may move the work W along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction while grasping the work W.
  • the robot arm 33Rb determines the state of the work W by the first surface WS1.
  • a state in which at least one of the processing light EL and the measurement light ML can irradiate the first surface WS1 and a state in which the second surface WS2 is facing upward that is, the processing light EL and the processing light EL and
  • the work W may be moved so as to switch between (a state in which at least one of the measurement light MLs can irradiate the second surface WS2). That is, the robot arm 33Rb may move the work W so as to turn over the work W placed on the stage 32 (that is, reverse the vertical relationship between the first surface WS1 and the second surface WS2).
  • the work W may be placed on the stage 32 via the jig 323b so that the robot arm 33Rb can easily grasp the work W.
  • the jig 323b may function as a spacer for securing a gap between the work W and the stage 32. As a result, the robot arm 33Rb can grasp the work W relatively easily as compared with the case where a gap is not secured between the work W and the stage 32.
  • the processing apparatus 1 irradiates the work W with processing light EL to perform removal processing for removing a part of the work W.
  • the processing apparatus 1 may irradiate the work W with the processing light EL to perform processing different from the removal processing.
  • the processing apparatus 1 may irradiate the work W with the processing light EL to perform additional processing on the work W.
  • the processing apparatus 1 may perform marking processing to form a desired pattern on the surface of the work W by changing at least a part of the characteristics of the surface of the work W by irradiation with the processing light EL.
  • the stage device 3 includes a stage drive system 33. However, the stage device 3 does not have to include the stage drive system 33. That is, the stage 32 does not have to move. If the stage 32 does not move, the stage device 3 may not include the position measuring instrument 34.
  • the processing apparatus 1 includes a head drive system 12. However, the processing device 1 does not have to include the head drive system 12. That is, the processing head 11 does not have to move. In this case, the processing device 1 does not have to include the position measuring instrument 13.
  • the measuring device 2 includes a head drive system 22. However, the measuring device 2 does not have to include the head drive system 22. That is, the measurement head 21 does not have to move. In this case, the measuring device 2 does not have to include the position measuring device 23.
  • the processing apparatus 1 processes the work W by irradiating the work W with the processing light EL.
  • the processing apparatus 1 may process the work W by irradiating the work W with an arbitrary energy beam different from light (this energy beam may be referred to as a “processing beam”).
  • the processing device 1 may include a beam irradiating device capable of irradiating an arbitrary energy beam in addition to or in place of the processing light source 111.
  • An example of an arbitrary energy beam is a charged particle beam such as an electron beam and an ion beam.
  • Another example of an arbitrary energy beam is an electromagnetic wave.
  • the present invention is not limited to the above-described embodiment, and can be appropriately modified within the scope of claims and within a range not contrary to the gist or idea of the invention that can be read from the entire specification, and a processing system accompanied by such modification is also possible. It is also included in the technical scope of the present invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Un système de traitement est doté : d'un dispositif de placement d'objet sur lequel un objet peut être placé ; d'un dispositif de traitement destiné à traiter l'objet placé sur le dispositif de placement d'objet à l'aide d'une lumière de traitement ; d'un dispositif de mesure destiné à mesurer l'objet placé sur le dispositif de placement d'objet ; d'un dispositif de changement destiné à déplacer l'objet placé sur le dispositif de placement d'objet et/ou le dispositif de traitement ; et d'un dispositif de commande destiné à commander le dispositif de changement de sorte qu'un premier côté de l'objet puisse être exposé à la lumière de traitement, et à commander le dispositif de changement de sorte qu'un second côté opposé au premier côté puisse être exposé à la lumière de traitement.
PCT/JP2020/018256 2020-04-30 2020-04-30 Système de traitement WO2021220456A1 (fr)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07266066A (ja) * 1994-03-29 1995-10-17 O M C Kk ワークのレーザ加工方法とその装置
JP2006239765A (ja) * 2005-03-07 2006-09-14 Honda Motor Co Ltd 内装材のレーザ加工方法
JP2007216379A (ja) * 2006-02-13 2007-08-30 Stama Maschinenfabrik Gmbh 複数の工作物、とくに複数の金属製工作物の切削加工のための工作機械及び方法
JP2013043196A (ja) * 2011-08-24 2013-03-04 Mitsubishi Materials Corp レーザ加工装置およびレーザ加工方法
JP2018008307A (ja) * 2016-07-15 2018-01-18 株式会社リコー 光加工装置及び光加工物の生産方法
JP2018094616A (ja) * 2016-12-16 2018-06-21 澁谷工業株式会社 レーザ加工装置とレーザ加工方法
JP2019136705A (ja) * 2018-02-06 2019-08-22 東レエンジニアリング株式会社 レーザマーキング装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07266066A (ja) * 1994-03-29 1995-10-17 O M C Kk ワークのレーザ加工方法とその装置
JP2006239765A (ja) * 2005-03-07 2006-09-14 Honda Motor Co Ltd 内装材のレーザ加工方法
JP2007216379A (ja) * 2006-02-13 2007-08-30 Stama Maschinenfabrik Gmbh 複数の工作物、とくに複数の金属製工作物の切削加工のための工作機械及び方法
JP2013043196A (ja) * 2011-08-24 2013-03-04 Mitsubishi Materials Corp レーザ加工装置およびレーザ加工方法
JP2018008307A (ja) * 2016-07-15 2018-01-18 株式会社リコー 光加工装置及び光加工物の生産方法
JP2018094616A (ja) * 2016-12-16 2018-06-21 澁谷工業株式会社 レーザ加工装置とレーザ加工方法
JP2019136705A (ja) * 2018-02-06 2019-08-22 東レエンジニアリング株式会社 レーザマーキング装置

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