WO2021218412A1 - 掩膜板组件 - Google Patents

掩膜板组件 Download PDF

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Publication number
WO2021218412A1
WO2021218412A1 PCT/CN2021/079862 CN2021079862W WO2021218412A1 WO 2021218412 A1 WO2021218412 A1 WO 2021218412A1 CN 2021079862 W CN2021079862 W CN 2021079862W WO 2021218412 A1 WO2021218412 A1 WO 2021218412A1
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WIPO (PCT)
Prior art keywords
mask
emitting layer
sub
strip
holes
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PCT/CN2021/079862
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English (en)
French (fr)
Inventor
何潘婷
肖磊芳
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/789,173 priority Critical patent/US20230036857A1/en
Publication of WO2021218412A1 publication Critical patent/WO2021218412A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present disclosure relates to the technical field of display product manufacturing, and in particular to a mask assembly.
  • OLED Organic Light-Emitting Diode
  • OLED Organic Light-Emitting Diode
  • the AA area is mostly blocked by F-mask (high-precision metal mask). Because different EL (luminescent layer) films are vapor-deposited in different chambers, each cavity There are many contents to be tested in the room, such as vapor deposition PPA (position accuracy), film thickness, optical performance, electrical performance, etc.
  • vapor deposition PPA position accuracy
  • film thickness film thickness
  • optical performance optical performance
  • electrical performance etc.
  • REML red light-emitting layer
  • GEML green light-emitting layer
  • BEML blue light-emitting layer
  • RHTL red auxiliary light-emitting layer
  • GHTL green auxiliary light-emitting layer
  • the FMM corresponding to the chamber will not be able to open the net, and the EL device will not be vapor-deposited according to the schedule, which will be damaged.
  • the repair or re-production of the F-mask of the F-mask will take longer, which will cause the project schedule to be delayed, and more seriously, it will cause the first sample schedule to be delayed.
  • the present disclosure provides a mask assembly to solve the problem of high cost of vapor-deposited EL devices and delay of the entire vapor deposition process due to damage of part of the mask.
  • a mask assembly including a first mask, and a plurality of first mask strips with different effective evaporation patterns
  • the first mask The board includes a first frame and a first support bar arranged between a set of opposite side frames of the first frame, and a first area of the first support bar is provided with a plurality of first through holes.
  • a first hollow portion, a plurality of the first through holes are used to cooperate with a plurality of the first mask strips to form different first functional structures by evaporation;
  • the first hollow portion includes three first through holes, and the three first through holes include a first sub-through hole, a second sub-through hole, and a third sub-through hole, wherein the first sub-through hole
  • the hole is used for vapor deposition to form a first functional structure for testing the first characteristic of the first color light-emitting layer on the test display substrate
  • the second sub-via is used for vapor deposition to form the first functional structure of the second color light-emitting layer on the test display substrate.
  • a first functional structure with a characteristic, and the third sub-via is used for vapor deposition to form a first functional structure for testing the first characteristic of the third color light-emitting layer of the display substrate.
  • the orthographic projection of the effective vapor deposition pattern of each first mask strip on the first mask plate is located on the corresponding first mask strip. ⁇ In the hole.
  • the second mask further includes a second mask, and a variety of second mask strips with different effective evaporation patterns.
  • the second mask includes a second frame, and a second mask provided on the second frame. Relative to the second support bar between a set of side frames, the second area of the second support bar is provided with a second hollow portion including a plurality of second through holes, and the plurality of second through holes are used to communicate with each other.
  • a variety of the second mask strips cooperate to form different second functional structures by vapor deposition.
  • the second hollow portion includes two second through holes, and the two second through holes include a fourth sub-through hole and a fifth sub-through hole, wherein the fourth sub-through hole is used for
  • the second functional structure of the first characteristic of the first color auxiliary light-emitting layer on the test display substrate is formed by vapor deposition, and the fifth sub-via is used for vapor deposition to form the second color auxiliary light-emitting layer on the test display substrate
  • the second functional structure of the first characteristic is formed by vapor deposition
  • the fifth sub-via is used for vapor deposition to form the second color auxiliary light-emitting layer on the test display substrate
  • the second functional structure of the first characteristic is formed by vapor deposition, and the fifth sub-via is used for vapor deposition to form the second color auxiliary light-emitting layer on the test display substrate.
  • it further includes two kinds of the second mask strips, and the orthographic projection of the effective evaporation pattern of each second mask strip on the second mask plate is located on the corresponding second pass ⁇ In the hole.
  • the second mask strip includes a first sub-mask strip and a second sub-mask strip, and the first sub-mask strip is used to form a first characteristic for testing the first characteristic of the first color auxiliary light-emitting layer.
  • the second sub-mask strip is used to form a second functional structure for testing the first characteristic of the second color auxiliary light-emitting layer
  • the first mask strip includes a third sub-mask strip and a fourth sub-mask strip
  • the third sub-mask strip is used to form a first functional structure for testing the first characteristic of the first color light-emitting layer
  • the fourth sub-mask strip is used to form a first functional structure for testing the second color light-emitting layer A characteristic first functional structure;
  • the first sub-mask strip is multiplexed as the third sub-mask strip
  • the second sub-mask strip is multiplexed as the fourth sub-mask strip.
  • it further includes a third mask strip with different effective vapor deposition patterns, and a third area on the first support strip on the first mask plate is provided with a first mask with a plurality of third through holes.
  • a third mask strip with different effective vapor deposition patterns and a third area on the first support strip on the first mask plate is provided with a first mask with a plurality of third through holes.
  • Three hollow parts, a plurality of the third through holes and a plurality of the third mask strips cooperate to form different third functional structures by evaporation.
  • the third hollow portion includes at least three third through holes, which are respectively used to cooperate with the first mask to form a pair of the first color light-emitting layer, the second color light-emitting layer, and the second color light-emitting layer by evaporation.
  • the second characteristic of the three-color light-emitting layer is tested in the third functional structure.
  • it further includes a fourth mask strip with different effective evaporation patterns, and a fourth area on the second support strip on the second mask plate is provided with a fourth area with a plurality of fourth through holes.
  • a fourth mask strip with different effective evaporation patterns and a fourth area on the second support strip on the second mask plate is provided with a fourth area with a plurality of fourth through holes.
  • Four hollow parts, a plurality of the fourth through holes and a plurality of the fourth mask strips cooperate to form different fourth functional structures by evaporation.
  • the fourth hollow portion includes at least two of the fourth through holes, which are respectively used to cooperate with the second mask to form an auxiliary light-emitting layer of the first color and the second light-emitting layer by evaporation.
  • a fourth functional structure in which the second characteristic of the color auxiliary light-emitting layer and the third color auxiliary light-emitting layer are tested.
  • the beneficial effect of the present disclosure is that by providing a first hollow portion with a plurality of through holes in the first area of the first support bar, it is possible to cooperate with a variety of first mask bars with different effective vapor deposition patterns to perform vaporization.
  • the plated mask can be used universally, which can save cost, and even if part of the mask is damaged, it will not cause the delay of the entire evaporation process.
  • FIG. 1 shows a schematic diagram of a corresponding functional structure of vapor deposition on a display substrate to be vaporized in an embodiment of the present disclosure
  • FIG. 2 shows a schematic diagram of the position of a first functional structure in an embodiment of the present disclosure
  • FIG. 3 shows a schematic diagram of a first functional structure for testing the first characteristic of the first color light-emitting layer by vapor deposition in an embodiment of the present disclosure
  • FIG. 4 shows a schematic diagram of a part of the structure of the first mask plate corresponding to the display substrate to be evaporated in an embodiment of the present disclosure
  • FIG. 5 shows a schematic diagram of a part of the structure of the second mask plate corresponding to the display substrate to be evaporated in an embodiment of the present disclosure
  • FIG. 6 shows a schematic diagram of the cooperation of the first mask plate and the first mask strip in an embodiment of the present disclosure
  • FIG. 7 shows a schematic diagram of a first mask strip in an embodiment of the present disclosure
  • FIG. 8 shows a schematic diagram of the cooperation of the second mask plate and the second mask strip in an embodiment of the present disclosure
  • FIG. 9 shows a schematic diagram of a second mask strip in an embodiment of the present disclosure.
  • FIG. 10 shows a schematic diagram of the structure of a third hollow part in an embodiment of the present disclosure.
  • FIG. 11 shows a schematic diagram of the structure of a fourth hollow part in an embodiment of the present disclosure.
  • FIG. 12 shows a first schematic diagram of a partial structure of the first mask in an embodiment of the present disclosure
  • FIG. 13 is a second schematic diagram of a partial structure of the first mask in the embodiment of the present disclosure.
  • FIG. 14 shows a partial structural diagram 1 of a second mask in an embodiment of the present disclosure
  • FIG. 15 shows a second schematic diagram of a partial structure of the second mask in an embodiment of the present disclosure.
  • the existing mask design requires 5 mold openings, which is not only costly, but also takes a long time to make the mask; if an accident occurs in the production of the mask, it may cause the entire project to be delayed.
  • this embodiment provides a mask assembly including a first mask 01 and a plurality of first mask strips 4 with different effective evaporation patterns
  • the first mask 01 includes A first frame 011, and a first support bar 2 disposed between a set of opposite side frames of the first frame 011, and a first area of the first support bar 2 is provided with a plurality of first communication channels.
  • the first hollow portion 21 of the hole 210, the plurality of first through holes 210 are used to cooperate with a variety of the first mask strips 4 to form different first functional structures by vapor deposition, refer to FIG. 1.
  • first hollow portion 21 With a plurality of through holes in the first area of the first support bar 2, it is made to cooperate with a variety of first mask bars 4 with different effective vapor deposition patterns for vapor deposition.
  • the mask can be used universally, which can save cost, and even if part of the mask is damaged, it will not cause the delay of the entire evaporation process.
  • one type of mask strip corresponds to one type of mask, and vapor deposition forms a functional structure.
  • Masks used to form different functional structures cannot be used universally.
  • the number of vapor deposited functional structures is equal to the number of masks. It is the same.
  • the corresponding masks need to be manufactured separately, which is costly and takes a long time. If part of the mask is damaged, it may cause delays in the entire process flow.
  • a mask can be matched with a variety of mask strips, that is to say, masks forming a variety of functional structures can be universal, reducing the number of mold openings when making masks.
  • Cost, shorten the time for making the mask, and the first mask 01 in this embodiment is universal, and can be borrowed from each other when making a variety of the first functional structures, which greatly avoids A problem with the mask plate corresponding to an evaporation chamber causes the delay of the entire project, which greatly reduces the risk of project delay.
  • the first hollow portion 21 includes three of the first through holes 210 (the first sub-through hole 211, the second sub-through hole 212, and the third sub-through hole 213).
  • An effective vapor deposition pattern 41 on the first mask strip 4 corresponds to the first sub-through hole 211, and the first sub-function structure 101 is formed by vapor deposition, and the second sub-through hole 212 and the third sub-through hole 213 The position of is blocked by the mask strip and cannot be evaporated.
  • an effective evaporation pattern on the first mask strip 4 corresponds to the second sub-via 212, which is formed by evaporation
  • the second sub-function structure 102, and the first sub-through hole 211 and the third sub-through hole 213 are blocked by the mask strip and cannot be vapor-deposited.
  • An effective vapor deposition pattern on the first mask strip 4 is the same as the third sub-pass Corresponding to the hole 213, the third sub-function structure 103 is formed by vapor deposition.
  • the positions of the first sub-through hole 211 and the second sub-through hole 212 are blocked by the mask strip.
  • the mask plates for forming the first sub-functional structure 101, the second sub-functional structure 102 and the third sub-functional structure 103 can be used in common, that is to say, only one mold opening can be used for vapor deposition formation.
  • the three kinds of masks with the first functional structure reduce the production cost and the production time, and when the mask that forms one of the first functional structures by evaporation is damaged, the other two kinds of first functional structures can be borrowed to form the mask.
  • the mask plate of the functional structure is vapor-deposited to avoid the delay of the entire process flow.
  • the number of the types of the first mask strip 4 is the same as the number of the types of the first functional structure to be formed, and the number of the first through holes 210 in the first hollow portion 21 The number is the same as the number of the types of the first mask strips 4, and the number of the first hollow portions 21 included in each first mask plate 01 can be set according to actual needs.
  • first support bar 2 is shown in the first mask 01 shown in FIG. 12, and the number of the first support bars 2 can be set according to actual needs.
  • the setting direction of 2 can also be set according to actual needs.
  • the first mask 01 may only include the first support strips 2 extending along one direction, and the first mask 01 may also include multiple extension directions at the same time.
  • the first support bar 2 shown in FIG. 12 is only an exemplary structure of the first mask 01, and is not limited thereto.
  • the first mask shown in FIG. 12 is only a schematic diagram, showing the result of the composition of the first mask, and the length-to-width ratio of the first support bar and the first frame are based on actual Need to be set, not limited.
  • the first support bar 2 is a plate-like structure located inside the first frame 011, and at least one first hollow portion 21 is provided on the first support bar 2;
  • the location of each of the first hollow portions 21 corresponds to one side of a display panel, but it is not limited to this.
  • the number and position of the first through holes 210 included in the first hollow portion 21 can be set according to actual needs, as long as it is ensured that when the mask is universal, it is matched with the corresponding mask strip to form the required The functional structure is sufficient.
  • the plurality of first through holes 210 in one of the first hollow portions 21 may be independent small holes, or may be connected and integral large holes, and the evaporation area is determined by The effective vapor deposition pattern on the first mask strip is determined.
  • the first hollow portion 21 includes three first through holes 210, and the three first through holes 210 include a first sub-through hole 211 and a second sub-through hole 212.
  • the third sub-via 213, wherein the first sub-via 211 is used for vapor deposition to form a first functional structure for testing the first characteristic of the first color light-emitting layer on the display substrate, and the second sub-via 212 The first functional structure for forming the first characteristic of the second color light-emitting layer on the test display substrate by vapor deposition, and the third sub-via 213 is used for vapor deposition to form the first function structure of the third color light-emitting layer on the test display substrate.
  • the first functional structure of the feature is used for vapor deposition to form the first function structure of the third color light-emitting layer on the test display substrate.
  • the first color light-emitting layer is a red light-emitting layer
  • the second color light-emitting layer is a green light-emitting layer
  • the third color light-emitting layer is a blue light-emitting layer, but not Limited by this.
  • the first characteristic is evaporation position accuracy (PPA), but it is not limited to this.
  • the three first through holes 210 include a red through hole (ie, the first sub-via 211) corresponding to the vapor deposition position of the red light-emitting layer on the display substrate, and the vapor deposition position of the green light-emitting layer on the display substrate.
  • the corresponding green through hole (that is, the second sub-via 212), and the blue through hole (that is, the third sub-via 213) corresponding to the vapor deposition position of the blue light-emitting layer on the display substrate refer to 4 and Fig. 12.
  • the corresponding first functional structure is located on one side of the display panel, refer to FIGS. 1 to 3, and the first mask strip 4 includes a first functional structure for forming the first characteristic of the red light-emitting layer.
  • the red mask strip is used to form the green mask strip of the first functional structure for testing the first characteristic of the green light-emitting layer, and the blue mask used to form the first functional structure for testing the first characteristic of the blue light-emitting layer
  • the red mask strip is matched with the first mask plate 01 for evaporation in the first evaporation chamber, the effective evaporation pattern on the red mask strip corresponds to the red through hole to expose the to-be-evaporated At this time, the green through holes and blue through holes are blocked by the red mask strip and cannot be evaporated.
  • the schematic diagram of the structure after evaporation is shown in Fig.
  • the green mask strip is the same as that described
  • the effective vapor deposition pattern on the green mask strip corresponds to the green through hole to expose the position to be vaporized, and at this time, the red The through holes and the blue through holes are blocked by the red mask strip and cannot be evaporated;
  • the blue mask strip is matched with the first mask plate 01 for evaporation in the third evaporation chamber, the blue mask The effective vapor deposition pattern on the film strip corresponds to the blue through hole to expose the position to be vaporized.
  • the green through hole and the red through hole are blocked by the red mask strip, and vapor deposition cannot be performed.
  • the same type of mask can be matched with different types of mask strips to form different functional structures by evaporation.
  • the first mask strip 4 shown in FIGS. 6 and 7 is a red mask strip used to form a first functional structure for testing the first characteristic of the red light-emitting layer, and the effective vapor deposition pattern thereon includes a first hollow portion
  • the first sub-via 211 on the 21 corresponds to the first effective vapor deposition pattern 41.
  • dashed through hole in FIG. 6 indicates the vapor deposition position that is blocked, that is, the position represented by the dashed through hole is blocked by the first mask strip 4, and vapor deposition cannot be performed.
  • the number of types of the first mask strips 4 is the same as the number of the first through holes 210 included in the first hollow portion 21, and the first hollow portion 21 includes three of the first through holes 210, the mask assembly also includes three types of the first mask strips 4, and the effective evaporation pattern of each of the first mask strips 4 is in the The orthographic projection on the first mask 01 is located in the corresponding first through hole 210.
  • the first mask strip 4 and the first mask plate 01 are sequentially stacked on the substrate to be evaporated, and the effective evaporation pattern of each first mask strip 4 is in the
  • the orthographic projection on the first mask 01 is located in the corresponding first through hole 210, so that the corresponding first through hole 210 exposes the effective evaporation pattern of the first mask strip 4, which is convenient for Evaporate the corresponding graphics.
  • the mask assembly further includes a second mask 02, and a variety of second mask strips 5 with different effective evaporation patterns
  • the second mask 02 includes a second frame 021, and a second support bar 3 arranged between a set of opposite side frames of the second frame 021, and a second area of the second support bar 3 is provided with a plurality of second through holes 310
  • the second hollow portion 31, a plurality of the second through holes 310 are used to cooperate with a plurality of the second mask strips 5 to form different second functional structures by evaporation, refer to FIGS. 5, 8, and 9 And Figure 14.
  • the arrangement of the first mask 01 makes the first hollow part 21 including a plurality of the first through holes 210 arranged on the first area of the first support bar 2, and the vapor deposition is different from the first hollow part 21.
  • the second mask 02 is set so as to be consistent with
  • the multiple second through holes 310 that cooperate to form different second functional structures can use the same mask, that is to say, form multiple second functional structures.
  • the mask is universal.
  • the second mask 02 shown in FIG. 14 only shows one second support bar 3, and the number of the second support bars 3 can be set according to actual needs.
  • the setting direction of 3 can also be set according to actual needs.
  • the second mask 02 can only include the second support strips 3 extending along one direction, and the second mask 02 can also include multiple extending directions at the same time.
  • the second supporting strip 3 shown in FIG. 14 is only an exemplary structure of the second mask 02, and is not limited thereto.
  • the second mask plate shown in FIG. 14 is only a schematic diagram, showing the composition result of the second mask plate, and the length-to-width ratio of the second support bar and the length-to-width ratio of the second frame are based on actual Need to be set, not limited.
  • the number of the types of the second mask strips 5 is the same as the number of the types of the second functional structures to be formed, and the number of the second through holes 310 in the second hollow portion 31 The number is the same as the number of the types of the second mask strips 5, and the number of the second hollow portions 31 included in each second mask plate 02 can be set according to actual needs.
  • the production time of the mask can be further shortened. It further effectively avoids the problem of delays in the entire process flow caused by damage to part of the mask.
  • the difference between the first mask 01 and the second mask 02 is that a first hollow part 21 and a second hollow part 21 are respectively provided on different areas of the support bar at the same position.
  • the orthographic projection on the diaphragm 02 coincides with the second support strip 3 on the second mask 02, and the first hollow portion 21 on the first support strip 2 is on the second mask
  • the orthographic projection on 02 is located in the area outside the second area of the second support bar 3.
  • the first mask 01 and the second mask 02 are integrated, that is, The first mask 01 is multiplexed as the second mask 02.
  • a mask has both the first hollow part 21 and the second hollow part 31.
  • the first mask 01 When the type of the strip 4 and the type of the second mask strip 5 overlap, the first mask 01 cannot be reused as the second mask 02, for example, a first functional structure During the evaporation, the first mask 01 is used to cooperate with the corresponding first mask strip 4, and when the evaporation of a second functional structure is performed, the second mask 02 is used Cooperating with a corresponding one of the second mask strips 5, the first mask strip 4 and the second mask strip 5 are the same type of mask strip, that is, the vapor deposition of the first functional structure is performed At this time, the effective vapor deposition pattern on the first mask strip 4 will leak out the second through hole 310 corresponding to the second functional structure. In this way, when the first functional structure is formed by vapor deposition, it may also be vaporized. The plating material is vapor-deposited on the leaked second through hole 310.
  • the second hollow portion 31 includes two second through holes 310, and the two second through holes 310 include a fourth sub-through hole 312 and a fifth sub-through hole 313, wherein the The fourth sub-via 312 is used for vapor deposition to form a second functional structure (fourth sub-function structure 104) for testing the first characteristic of the first color auxiliary light-emitting layer on the display substrate, and the fifth sub-via 313 A second functional structure (fifth sub-functional structure 105) used for vapor deposition to test the first characteristic of the second color auxiliary light-emitting layer on the display substrate.
  • the number of the second through holes 310 is set according to actual needs.
  • the first color auxiliary light-emitting layer is a red auxiliary light-emitting layer
  • the second color auxiliary light-emitting layer is a green auxiliary light-emitting layer. Layer, but not limited to this.
  • the plurality of second through holes 310 in the second hollow portion may be small through holes that are independent of each other, or may be connected to each other as a whole and form a large hole. In this case, the corresponding second hole
  • the effective vapor deposition pattern on the film strip determines the specific position and vapor deposition area of the second functional structure formed by vapor deposition.
  • the plurality of second through holes 310 in the second hollow portion 31 include red auxiliary through holes corresponding to the vapor deposition position of the red auxiliary light-emitting layer, and green auxiliary holes corresponding to the vapor deposition position of the green auxiliary light-emitting layer.
  • the second mask strip 5 includes a red auxiliary mask strip for testing the first characteristic of the red auxiliary light-emitting layer, and a green color mask for forming the first characteristic of the green auxiliary light-emitting layer.
  • Auxiliary mask strip When the red auxiliary mask strip is matched with the second mask 02 for evaporation in the fourth evaporation chamber, the effective evaporation pattern on the red auxiliary mask strip corresponds to the red auxiliary through hole.
  • the green auxiliary through hole is blocked by the red auxiliary mask strip and cannot be evaporated.
  • the green auxiliary mask strip is matched with the second mask plate 02
  • the effective vapor deposition pattern on the green auxiliary mask strip corresponds to the green auxiliary through hole to expose the position to be vaporized, and at this time, the red auxiliary through hole is assisted by the green The mask bar is blocked and cannot be evaporated.
  • the second mask strip 5 shown in FIGS. 8 and 9 is a red auxiliary mask strip used to form a second functional structure for testing the first characteristic of the red auxiliary light-emitting layer, and the effective evaporation pattern thereon includes a second The fourth sub-through hole 312 on the hollow portion 31 corresponds to the second effective vapor deposition pattern 51.
  • dashed through hole in FIG. 8 indicates the vapor deposition position that is blocked, that is, the position represented by the dashed through hole is blocked by the second mask strip 5, and vapor deposition cannot be performed.
  • the second mask 02 includes at least one second hollow portion 31, and the first hollow portion 21 and the second hollow portion 31 are vapor-deposited on the display substrate plate The position is located on the same side of the display panel area on the display substrate (the display substrate includes multiple display panels), but it is not limited to this.
  • two kinds of the second mask strips 5 are further included, and the orthographic projection of the effective evaporation pattern of each second mask strip 5 on the second mask plate 02 is located at the corresponding position.
  • the second through hole 310 is described.
  • the second mask strip 5 and the second mask 02 are sequentially stacked on the substrate to be evaporated, and the effective evaporation pattern of each second mask strip 5 is in the
  • the orthographic projection on the second mask 02 is located in the corresponding second through hole 310, so that the second through hole 310 exposes the effective evaporation pattern on the second mask strip 5, which is convenient for evaporation. Plate the corresponding graphics.
  • the second mask strip includes a first sub-mask strip and a second sub-mask strip
  • the first sub-mask strip is used to form a test for the first characteristic of the auxiliary light-emitting layer of the first color.
  • the second functional structure, the second sub-mask strip is used to form a second functional structure for testing the first characteristic of the second color auxiliary light-emitting layer
  • the first mask strip includes a third sub-mask strip and a fourth sub-mask strip.
  • a sub-mask strip, the third sub-mask strip is used to form a first functional structure for testing the first characteristic of the first color light-emitting layer, and the fourth sub-mask strip is used to form a test second-color light-emitting layer The first functional structure of the first characteristic;
  • the first sub-mask strip is multiplexed into the third sub-mask strip, that is, the same mask strip simultaneously has an effective vaporization structure for forming a second functional structure for testing the first characteristic of the first color auxiliary light-emitting layer.
  • the plating pattern, and the effective vapor deposition pattern used to form the first functional structure for testing the first characteristic of the first color light-emitting layer the second sub-mask strip is multiplexed into the fourth sub-mask strip, that is, the same
  • the mask strip has both an effective evaporation pattern for forming a second functional structure for testing the first characteristic of the second color auxiliary light-emitting layer, and a first functional structure for forming the first functional structure for testing the first characteristic of the second color light-emitting layer Effective evaporation pattern.
  • the first mask 01 cannot be reused as the second mask 02 That is, the first hollow part 21 and the second hollow part 31 cannot be simultaneously arranged on the same mask plate, because the mask strip of the second functional structure for testing the first characteristic of the red auxiliary light-emitting layer is formed
  • the type is the same as the type of the mask strip forming the first functional structure for testing the first characteristic of the red light-emitting layer (for example, the effective evaporation pattern on one mask strip includes both the first effective evaporation pattern 41 and the second effective evaporation pattern 41).
  • the first hollow portion 21 and the second hollow portion 31 are respectively located on different mask plates to avoid two vapor deposition in the same vapor deposition step. A functional structure that cannot be vapor-deposited at the same time.
  • the mask assembly further includes a third mask strip with different effective evaporation patterns, and the third area on the first support strip 2 on the first mask 01 is provided with
  • the third hollow portion 22 has a plurality of third through holes 201, and the plurality of third through holes 201 cooperate with a variety of the third mask strips to form different third functional structures by evaporation, refer to FIG. 10.
  • FIG. 10 only shows a schematic diagram of one third hollow portion 22 on the first support bar 2.
  • vapor deposition PPA vapor deposition position accuracy
  • film thickness evaporation position accuracy
  • optical performance evaporation performance
  • electrical performance evaporation position accuracy
  • holes on the mask plate evaporation position accuracy
  • different film layers e.g., different film layers
  • the positions of the openings on the film plate are also different.
  • the openings for the vapor deposition PPA (evaporation position accuracy) test correspond to one side of each display panel on the display substrate, and the film thickness, optical properties, electrical properties, etc.
  • the tested opening corresponds to the edge of the display substrate, and the third mask strip is matched with the first mask 01, and the material is vapor-deposited at the corresponding third through hole 201 to perform corresponding characteristics Test.
  • the third hollow portion 22 includes at least three third through holes 201, which are respectively used to cooperate with the first mask 01 to form a light-emitting layer of the first color by evaporation. , A third functional structure for testing the second characteristics of the second color light-emitting layer and the third color light-emitting layer.
  • the third mask strip forming the third functional structure for testing the film thickness is matched with the first mask 01, and the corresponding third through hole
  • the material is evaporated at the position of 201 to test the film thickness of the red light-emitting layer. At this time, it can only be used on the first film thickness corresponding to the effective evaporation pattern of the third mask strip forming the third functional structure for testing the film thickness.
  • the three through holes 201 can be used to vaporize the material, but the other third through holes 201 cannot, so as to avoid interference.
  • the number of types of the third mask strips is related to the type of test to be performed and the number of objects to be tested.
  • the number of third through holes 201 in one third hollow portion 22 Related to the number of objects to be tested, the number of the third hollow portions 22 included in each first mask can be set according to actual needs, for example, for the red light-emitting layer, the green light-emitting layer, and the blue light-emitting layer.
  • the film thickness and electrical properties of the layer are tested separately, and the types of the third mask strips include six, which correspond to the test of a characteristic of a light-emitting layer. For example, one of the mask strips is used for evaporation.
  • a third functional structure for testing the film thickness of the red light-emitting layer is formed by plating, and the third through hole 201 also includes six, respectively corresponding to the six types of third mask stripes.
  • the plurality of third through holes 201 in the third hollow portion 22 may be a plurality of small through holes that are independent of each other, or may be connected to each other to form a large through hole (that is, a hollow portion consists of One through hole is formed).
  • the specific position and the vapor deposition area of the third functional structure are determined by the effective vapor deposition pattern on the third mask strip.
  • the mask assembly further includes a fourth mask strip with different effective evaporation patterns, and the fourth area on the second support strip 3 on the second mask 02 is provided with
  • the fourth hollow portion 32 has a plurality of fourth through holes 301, and the plurality of fourth through holes 301 cooperate with a variety of the fourth mask strips to form different fourth functional structures by evaporation, refer to FIG. 11.
  • FIG. 11 only shows a schematic diagram of a fourth hollow portion 32 on the second support bar 3.
  • the fourth hollow portion 32 includes at least two fourth through-holes 301, which are respectively used to cooperate with the second mask 02, and are formed by evaporation to assist light emission of the first color.
  • the fourth functional structure in which the second characteristics of the second color auxiliary light-emitting layer, the second color auxiliary light-emitting layer, and the third color auxiliary light-emitting layer are tested.
  • a fourth mask strip forming a functional structure for testing the film thickness is matched with the second mask 02, in the corresponding fourth through hole 301 Evaporate the material at the position to test the film thickness of the red auxiliary luminescent layer. At this time, it can only be used in the fourth pass corresponding to the effective evaporation pattern of the fourth mask strip that forms the functional structure for testing the film thickness.
  • the hole 301 can be used to vaporize the material, but the other fourth through holes 301 cannot, so as to avoid interference.
  • the number of types of the fourth mask strips is related to the types of tests to be performed and the number of test objects.
  • the number of fourth through holes 301 in one fourth hollow portion 32 is related to the number of The number of the types of the fourth mask bars is the same, and the number of the fourth hollow portions 32 included in each second mask plate can be set according to actual needs, for example, for the red auxiliary light-emitting layer, the green
  • the film thickness and electrical properties of the auxiliary light-emitting layer are tested separately, and the fourth mask strip includes four types, which correspond to the test of one characteristic of the auxiliary light-emitting layer, for example, one of the mask strips
  • the fourth functional structure is used for vapor deposition to test the film thickness of the red auxiliary light-emitting layer, and the third through hole also includes four, which respectively correspond to the four third mask strips one-to-one.
  • the plurality of fourth through holes 301 in the fourth hollow portion 32 may be a plurality of small through holes that are independent of each other, or may be connected to each other to form a large through hole (that is, a hollow portion is formed by One through hole is formed).
  • the specific position and the vapor deposition area of the fourth functional structure are determined by the effective vapor deposition pattern on the fourth mask strip.
  • the red light-emitting layer (REML), the green light-emitting layer (GEM L), the blue light-emitting layer (BEML), and the red auxiliary light-emitting layer (RHTL) are respectively performed in five vapor deposition chambers.
  • the first mask 01 is used for vapor deposition to form the red light-emitting layer (REML), the green light-emitting layer (GEM L) ), the functional structure for testing the characteristics of the blue light-emitting layer (BEML), each chamber has a lot of content that needs to be tested, such as vapor deposition PPA (evaporation position accuracy), film thickness, optical performance, electrical performance, etc., Therefore, the mask is designed with many holes, and the opening positions on the mask are different for different film layers.
  • Figures 1 to 3 show the test of the PPA (evaporation position accuracy) of the corresponding film layer.
  • a structure 100 including the first functional structure and the second functional structure
  • a second structure 200 for testing film thickness that is, the third functional structure
  • a third structure 300 for testing electrical performance and optical performance testing
  • the display substrate 1 includes a plurality of display panels 11, and one side of each display panel 11 is provided with the first structure 100, and the display substrate 1
  • the second structure 200, the third structure 300, and the fourth structure 400 are provided on the edge of.
  • the plurality of first through holes 210 in the first hollow portion 21 on the first mask 01 including red through holes corresponding to the first functional structure for testing the first characteristic of the red light-emitting layer, and the test
  • the green through hole corresponding to the first functional structure of the first characteristic of the green light-emitting layer, and the blue through hole corresponding to the first functional structure of the first characteristic of the blue light-emitting layer (it should be noted that The first through hole 210 is not painted in red, green, or blue, but is named corresponding to the correspondingly formed structure for distinguishing), and the second mask 02 is used to vaporize to form a test red
  • the second functional structure of the first characteristic of the auxiliary light-emitting layer (RHTL) and the green auxiliary light-emitting layer (GHTL), the second through hole 310 in the second hollow portion 31 on the second mask 02 Including a second functional structure red auxiliary via hole for forming the first characteristic of the red auxiliary light-emitting layer, and a green auxiliary via hole for
  • the first characteristic is an evaporation position accuracy test, but it is not limited to this.
  • the corresponding effective vapor deposition pattern of the first mask strip 4 corresponds to the red through hole, and at this time, the green through hole and The blue through hole is blocked by the first mask strip 4.
  • the effective value of the corresponding first mask strip 4 corresponds to the green through hole, and at this time, the red through hole and the blue through hole are blocked by the first mask strip 4, and the first characteristic of the first characteristic of the blue light-emitting layer is tested by vapor deposition.
  • the corresponding effective vapor deposition pattern of the first mask strip 4 corresponds to the blue through hole, and at this time, the green through hole and the red through hole are used by the first mask strip 4 Occlude.
  • the principle of the second functional structure for testing the first characteristic of the red auxiliary light-emitting layer by vapor deposition through the second mask 02 is the same as the principle of the second functional structure for testing the first characteristic of the green auxiliary light-emitting layer.
  • the third mask strip to cooperate with the first mask 01 to adjust various characteristics other than the first characteristics of the red light-emitting layer, the green light-emitting layer, and the blue light-emitting layer.
  • the positions of the test holes forming the functional structure for testing different characteristics are different.
  • the functional structure forming the vapor deposition position accuracy test corresponds to one side of the display panel of the display substrate, and the corresponding through hole is located in the middle of the mask.
  • Area, and the functional structure forming the test film thickness, electrical properties, etc. corresponds to the edge of the display substrate, and the corresponding through holes are located at the edge of the mask.
  • the first mask 01 and different third mask strips can be used.
  • the different effective vapor deposition patterns on the third mask strip are used to form functional structures for testing different characteristics.
  • the first mask plate 01 and the corresponding third mask strip are co-evaporated.
  • the second mask 02 can be used to cooperate with different fourth mask strips, for example, to form a functional structure corresponding to the deposition position accuracy test
  • the corresponding through hole is located in the middle area of the mask, and the functional structure forming the test film thickness, electrical properties, etc. corresponds to the edge of the display substrate, and the corresponding through hole is located on the mask.
  • the different effective vapor deposition patterns on the fourth mask strip are used to form functional structures for different characteristic tests. For example, when vapor deposition of a functional structure used to test the film thickness of the red auxiliary light-emitting layer, use The second mask 02 and the corresponding third mask strip are co-evaporated.
  • the masks for the functional structure of the red light-emitting layer, the green light-emitting layer, the blue light-emitting layer, the red auxiliary light-emitting layer, and the green auxiliary light-emitting layer are divided into two types.
  • the first mask 01 is vapor-deposited to form a functional structure for testing various characteristics of the red light-emitting layer, the green light-emitting layer, and the blue light-emitting layer.
  • the second mask 02 is vapor-deposited to form the test red auxiliary light-emitting layer and the green auxiliary light-emitting layer.
  • the multi-characteristic functional structure of the light-emitting layer so that when making the mask, only need to open the mold twice, which saves costs, greatly shortens the time for making the mask, and in actual operation, there are still ten masks.
  • Diaphragm because there are five vapor deposition chambers), but the first mask 01 of the functional structure for testing the characteristics of the red, green, and blue light-emitting layers by vapor deposition can be used in general, and the vapor deposition test red is assisted
  • the second mask 02 of the functional structure with the characteristics of the light-emitting layer and the green auxiliary light-emitting layer can be used universally. Even if the mask used for vapor deposition of a functional structure is damaged, you can also borrow other universal masks for vaporization. Plating to avoid delays in the entire process flow.
  • the corresponding light-emitting layer is the same as the functional structure. It is formed by simultaneous evaporation, that is, the first support bar 2 of the first mask 01 has a plurality of the first through holes 210 for forming different first functional structures 210 by evaporation, and the first A support bar 2 has a plurality of through holes in the first functional area for vapor deposition to form the functional layer to be tested.
  • the effective vapor deposition pattern on the corresponding first mask bar includes matching with the first through holes 210
  • the vapor deposition pattern of the first functional structure 210 is formed, and it has the vapor deposition pattern that cooperates with the through hole of the first functional area to form the functional layer to be tested.
  • the first functional structure for testing the first characteristic of the first color light-emitting layer on the display substrate is formed by evaporation
  • the light-emitting layer is formed by simultaneous vapor deposition, that is, the first support strip 2 of the first mask 01 has a first sub-through hole, and the first sub-through hole is used for vapor deposition to form the first color on the test display substrate
  • the light-emitting layer has a first characteristic and a first functional structure
  • the first support strip 2 of the first mask 01 has a first functional area through hole for vapor deposition to form the first color light-emitting layer. Referring to FIG. 13, the vapor deposition position of the through hole 001 in the first functional area is shown in FIG. 13.
  • the second mask 02 when used for vapor deposition to form a second functional structure for testing the first characteristic of the first color auxiliary light-emitting layer, the second functional structure and the first color auxiliary light-emitting layer
  • the layer is formed by simultaneous vapor deposition, that is, the second support strip 3 of the second mask 02 has a fourth sub-through hole, and the fourth sub-through hole is used for vapor deposition to form the first color auxiliary light-emitting layer for testing the first color.
  • a characteristic second functional structure, and the second support strip 3 of the second mask 02 also has a second functional area through hole for vapor deposition to form the first color auxiliary light-emitting layer. Referring to FIG. 15, the vapor deposition position of the through hole 001 in the first functional area is shown in FIG. 15.
  • the second mask plate shown in FIG. 15 is only a schematic diagram, showing the composition result of the second mask plate 02, in which the aspect ratio of the second support bar 3, and the second The length and width ratio of the frame 021 is set according to actual needs and is not limited, and FIG. 15 only shows that the second support bar 3 has the second through hole 310 and the second functional area through hole 002, The size and location of the second through hole 310 and the second functional area through hole 002 are not limited.

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Abstract

本公开涉及一种掩膜板组件，包括第一掩膜板，以及具有不同的有效蒸镀图案的多种第一掩膜条，所述第一掩膜板包括第一框架、以及设置于所述第一框架相对的一组侧边框之间的第一支撑条，所述第一支撑条的第一区域上设置有包括多个第一通孔的第一镂空部，多个所述第一通孔用于与多种所述第一掩膜条进行配合以蒸镀形成不同的第一功能结构。

Description

掩膜板组件
相关申请的交叉引用
本申请主张在2020年04月26日在中国提交的中国专利申请号No.202020656789.7的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示产品制作技术领域，尤其涉及一种掩膜板组件。
背景技术
OLED(Organic Light-Emitting Diode)屏幕具有亮度高、画质好、节能等优点，已经成为面板行业的发展趋势，更是面板行业的高端产品，在其价格高的同时，客户对OLED屏幕的要求也越来越高。目前OLED行业均为采用mask(掩膜板)的方法蒸镀发光材料。
目前的EV mask中AA区的遮挡多采用F-mask(高精度金属掩膜板)的方式进行遮挡，由于不同的EL(发光层)膜层在不同的腔室中进行蒸镀，每个腔室中有许多需要测试的内容，如蒸镀PPA(位置精度)、膜厚、光学性能、电学性能等，故F-mask上设计有许多孔，不同的膜层对应的F-mask上的开孔位置也不同，故REML(红色发光层)、GEML(绿色发光层)、BEML(蓝色发光层)、RHTL(红色辅助发光层)、GHTL(绿色辅助发光层)分别对应5种不同的F-mask sheet(掩膜板组件)，在mask的制作中需要进行5次开模，不仅成本较高，同时mask制作时间较长；且在mask的制作过程中，可能会出现一张或者几张mask制作错误、损坏等情况，如果损坏的几张F-mask均为一个腔室对应的F-mask，则会导致该腔室对应的FMM无法张网，EL器件无法按日程进行蒸镀，损坏的F-mask的修复或者重新制作均需要更长的时间，会导致项目日程delay，更严重的会导致首样日程delay。
实用新型内容
为了解决上述技术问题，本公开提供一种掩膜板组件，解决蒸镀EL器件 成本高，以及部分掩膜板损坏则整个蒸镀流程延迟的问题。
为了达到上述目的，本公开采用的技术方案是：一种掩膜板组件，包括第一掩膜板，以及具有不同的有效蒸镀图案的多种第一掩膜条，所述第一掩膜板包括第一框架、以及设置于所述第一框架的相对的一组侧边框之间的第一支撑条，所述第一支撑条的第一区域上设置有包括多个第一通孔的第一镂空部，多个所述第一通孔用于与多种所述第一掩膜条进行配合以蒸镀形成不同的第一功能结构；
所述第一镂空部包括三个所述第一通孔，三个所述第一通孔包括第一子通孔、第二子通孔、第三子通孔，其中所述第一子通孔用于蒸镀形成测试显示基板上的第一颜色发光层的第一特性的第一功能结构，所述第二子通孔用于蒸镀形成测试显示基板上的第二颜色发光层的第一特性的第一功能结构，所述第三子通孔用于蒸镀形成测试显示基板的第三颜色发光层的第一特性的第一功能结构。
可选的，还包括三种所述第一掩膜条，每个所述第一掩膜条的有效蒸镀图案在所述第一掩膜板上的正投影位于对应的所述第一通孔内。
可选的，还包括第二掩膜板，以及具有不同的有效蒸镀图案的多种第二掩膜条，所述第二掩膜板包括第二框架，以及设置于所述第二框架的相对一组侧边框之间的第二支撑条，所述第二支撑条的第二区域上设置有包括多个第二通孔的第二镂空部，多个所述第二通孔用于与多种所述第二掩膜条进行配合以蒸镀形成不同的第二功能结构。
可选的，所述第二镂空部包括两个所述第二通孔，两个所述第二通孔包括第四子通孔和第五子通孔，其中所述第四子通孔用于蒸镀形成测试显示基板上的第一颜色辅助发光层的所述第一特性的第二功能结构，所述第五子通孔用于蒸镀形成测试显示基板上的第二颜色辅助发光层的所述第一特性的第二功能结构。
可选的，还包括两种所述第二掩膜条，每个所述第二掩膜条的有效蒸镀图案在所述第二掩膜板上的正投影位于对应的所述第二通孔内。
可选的，所述第二掩膜条包括第一子掩膜条和第二子掩膜条，所述第一子掩膜条用于形成测试第一颜色辅助发光层的第一特性的第二功能结构，所述第 二子掩膜条用于形成测试第二颜色辅助发光层的第一特性的第二功能结构，所述第一掩膜条包括第三子掩膜条和第四子掩膜条，所述第三子掩膜条用于形成测试第一颜色发光层的第一特性的第一功能结构，所述第四子掩膜条用于形成测试第二颜色发光层的第一特性的第一功能结构；
所述第一子掩膜条复用为所述第三子掩膜条，所述第二子掩膜条复用为所述第四子掩膜条。
可选的，还包括具有不同有效蒸镀图案的第三掩膜条，所述第一掩膜板上的所述第一支撑条上的第三区域设置有具有多个第三通孔的第三镂空部，多个所述第三通孔与多种所述第三掩膜条配合以蒸镀形成不同的第三功能结构。
所述第三镂空部至少包括三个所述第三通孔，分别用于与所述第一掩膜板相配合、以蒸镀形成分别对第一颜色发光层、第二颜色发光层、第三颜色发光层的第二特性进行测试的第三功能结构。
可选的，还包括具有不同有效蒸镀图案的第四掩膜条，所述第二掩膜板上的所述第二支撑条上的第四区域设置有具有多个第四通孔的第四镂空部，多个所述第四通孔与多种所述第四掩膜条配合以蒸镀形成不同的第四功能结构。
可选的，所述第四镂空部至少包括两个所述第四通孔，分别用于与所述第二掩膜板相配合、以蒸镀形成分别对第一颜色辅助发光层、第二颜色辅助发光层、第三颜色辅助发光层的所述第二特性进行测试的第四功能结构。
本公开的有益效果是：通过在第一支撑条的第一区域设置具有多个通孔的第一镂空部，使得与具有不同的有效蒸镀图案的多种第一掩膜条、配合进行蒸镀的掩膜板可以通用，这样可以节省成本，且即使部分掩膜板损坏也不会导致整个蒸镀流程延迟。
附图说明
图1表示本公开实施例中在待蒸镀显示基板上蒸镀相应的功能结构的示意图；
图2表示本公开实施例中第一功能结构的位置示意图；
图3表示本公开实施例中蒸镀用于测试第一颜色发光层的第一特性的第一功能结构的示意图；
图4表示本公开实施例中第一掩膜板与待蒸镀显示基板对应的部分结构示意图；
图5表示本公开实施例中第二掩膜板与待蒸镀显示基板对应的部分结构示意图；
图6表示本公开实施例中第一掩膜板与第一掩膜条相配合的示意图；
图7表示本公开实施例中第一掩膜条的示意图；
图8表示本公开实施例中第二掩膜板与第二掩膜条相配合的示意图；
图9表示本公开实施例中第二掩膜条的示意图；
图10表示本公开实施例中第三镂空部结构示意图；
图11表示本公开实施例中第四镂空部结构示意图；
图12表示本公开实施例中第一掩膜板的部分结构示意图一；
图13本公开实施例中第一掩膜板的部分结构示意图二；
图14表示本公开实施例中第二掩膜板的部分结构示意图一；
图15表示本公开实施例中第二掩膜板的部分结构示意图二。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
在本公开的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
现有的掩膜板设计需要进行5次开模，不仅成本较高，且掩膜板的制作时间较长；如果掩膜板制作中出现事故，则可能导致整个项目延迟。
针对上述问题，本实施例提供一种掩膜板组件，包括第一掩膜板01，以及具有不同的有效蒸镀图案的多种第一掩膜条4，所述第一掩膜板01包括第一框架011、以及设置于所述第一框架011的相对的一组侧边框之间的第一支撑条2，所述第一支撑条2的第一区域上设置有包括多个第一通孔210的第一镂空部21，多个所述第一通孔210用于与多种所述第一掩膜条4进行配合以蒸镀形成不同的第一功能结构，参考图1。
通过在所述第一支撑条2的第一区域设置具有多个通孔的第一镂空部21，使得与具有不同的有效蒸镀图案的多种第一掩膜条4、配合进行蒸镀的掩膜板可以通用，这样可以节省成本，且即使部分掩膜板损坏也不会导致整个蒸镀流程延迟。
传统技术中，一种掩膜条对应一种掩膜板，蒸镀形成一种功能结构，用于形成不同功能结构的掩膜板不能通用，蒸镀的功能结构的数量与掩膜板的数量是相同的，对应的掩膜板都需要单独开模制作，成本高，时间长，如果部分掩膜板损坏，则可能造成整个工艺流程的延迟。而本实施例中，一个掩膜板可以与多种掩膜条进行配合，也就是说，形成多种功能结构的掩膜板是可以通用的，减少制作掩膜板时的开模数量，降低成本，缩短了掩膜板的制作时长，且本实施例中的第一掩膜板01是可以通用的，在制作多种所述第一功能结构时相互之间可以借用，大大的避免了由于一个蒸镀腔室对应的掩膜板出现问题而导致整个项目延迟的情况，大大减小了项目延迟的风险。
参考图3、图4和图12，例如，需要在三个蒸镀腔室内，分别蒸镀形成三种第一功能结构(第一子功能结构101、第二子功能结构102和第三子功能结构103)，所述第一镂空部21包括三个所述第一通孔210(第一子通孔211、第二子通孔212和第三子通孔213)，在进行蒸镀时，一种第一掩膜条4上的有效蒸镀图案41与第一子通孔211相对应，以蒸镀形成第一子功能结构101，而第二子通孔212和第三子通孔213的位置被掩膜条遮挡不能进行蒸镀，参考图4、图6和图7，一种第一掩膜条4上的有效蒸镀图案与第二子通孔212相对应，以蒸镀形成第二子功能结构102，而第一子通孔211和第三子通孔213被掩膜条遮挡不能进行蒸镀，一种第一掩膜条4上的有效蒸镀图案与第三子通孔213相对应，以蒸镀形成第三子功能结构103，而由于所述第一镂空部21 的设置，第一子通孔211和第二子通孔212的位置被掩膜条遮挡，不能进行蒸镀，蒸镀形成第一子功能结构101、第二子功能结构102和第三子功能结构103的掩膜板可以通用，也就是说，只有一次开模即可制作用于蒸镀形成三种所述第一功能结构的掩膜板，降低了制作成本，缩短了制作时间，并且在蒸镀形成其中一种第一功能结构的掩膜板损坏时，可以借用形成另外两种第一功能结构的掩膜板进行蒸镀，避免造成整个工艺流程的延迟。
需要说明的是，所述第一掩膜条4的种类的数量与所要形成的所述第一功能结构的种类的数量相同，一个所述第一镂空部21中所述第一通孔210的数量与所述第一掩膜条4的种类的数量相同，每个所述第一掩膜板01上所包括的所述第一镂空部21的数量可以根据实际需要设定。
需要说明的是，图12中表示的第一掩膜板01中仅表示出了一个第一支撑条2，所述第一支撑条2的数量可根据实际需要设定，所述第一支撑条2的设置方向也可根据实际需要设定，第一掩膜板01可以仅包括沿着一个方向延伸设置的第一支撑条2，第一掩膜板01也可以同时包括沿多个延伸方向设置的第一支撑条2，图12中所表示的仅是第一掩膜板01的一个示例性的结构，并不以此为限。
应当理解的是，图12中表示的第一掩膜板仅为示意图，表示第一掩膜板的组成结果，其中的第一支撑条的长宽比例、以及第一框架的长宽比例以实际需要设定，并不受限。
本实施例的一实施方式中，所述第一支撑条2为位于所述第一框架011内部的板状结构，所述第一支撑条2上设置有至少一个所述第一镂空部21，每个所述第一镂空部21的设置位置对应于一个显示面板的一侧，但并不以此为限。
所述第一镂空部21包括的所述第一通孔210的数量和位置可以根据实际需要设定，只要保证在掩膜板通用的情况下，与相应的掩膜条进行配合以形成需要的功能结构即可。
需要说明的是，一个所述第一镂空部21中的多个所述第一通孔210可以是独立的多个小孔，也可以是连通的、呈一个整体的大孔，蒸镀面积由所述第一掩膜条上的有效蒸镀图案来决定。
本实施例的一些实施方式中，所述第一镂空部21包括三个所述第一通孔210，三个所述第一通孔210包括第一子通孔211、第二子通孔212和第三子通孔213，其中所述第一子通孔211用于蒸镀形成测试显示基板上的第一颜色发光层的第一特性的第一功能结构，所述第二子通孔212用于蒸镀形成测试显示基板上的第二颜色发光层的第一特性的第一功能结构，所述第三子通孔213用于蒸镀形成测试显示基板的第三颜色发光层的第一特性的第一功能结构。
本实施例的一具体实施方式中，所述第一颜色发光层为红色发光层，所述第二颜色发光层为绿色发光层，所述第三颜色发光层为蓝色发光层，但并不以此为限。
在一些实施方式中，所述第一特性为蒸镀位置精度(PPA)，但并不以此为限。
三个所述第一通孔210包括与显示基板上的红色发光层的蒸镀位置相对应的红色通孔(即第一子通孔211)，与显示基板上的绿色发光层的蒸镀位置相对应的绿色通孔(即第二子通孔212)，与显示基板上的蓝色发光层的蒸镀位置相对应的蓝色通孔(即第三子通孔213)，参照4和图12，相对应的所述第一功能结构位于显示面板的一侧，参照图1-图3，而第一掩膜条4则包括用于形成测试红色发光层的第一特性的第一功能结构的红色掩膜条，用于形成测试绿色发光层的第一特性的第一功能结构的绿色掩膜条，用于形成测试蓝色发光层的第一特性的第一功能结构的蓝色掩膜条，红色掩膜条与所述第一掩膜板01相配合在第一蒸镀腔室内进行蒸镀时，红色掩膜条上的有效蒸镀图案与红色通孔相对应、以露出待蒸镀的位置，而此时，绿色通孔和蓝色通孔被红色掩膜条遮挡，不能进行蒸镀，蒸镀后的结构示意图如图3所示；同理，绿色掩膜条与所述第一掩膜板01相配合在第二蒸镀腔室内进行蒸镀时，绿色掩膜条上的有效蒸镀图案与绿色通孔相对应、以露出待蒸镀的位置，而此时，红色通孔和蓝色通孔被红色掩膜条遮挡，不能进行蒸镀；蓝色掩膜条与所述第一掩膜板01相配合在第三蒸镀腔室内进行蒸镀时，蓝色掩膜条上的有效蒸镀图案与蓝色通孔相对应、以露出待蒸镀的位置，而此时，绿色通孔和红色通孔被红色掩膜条遮挡，不能进行蒸镀。通过相同类型的掩膜板可以与不同种类的掩膜条进行配合以蒸镀形成不同的功能结构。
图6和图7中表示的第一掩膜条4为用于形成测试红色发光层的第一特性的第一功能结构的红色掩膜条，其上的有效蒸镀图案包括与第一镂空部21上的第一子通孔211对应的第一有效蒸镀图案41。
需要说明的是，图6中的虚线通孔表示被遮挡的蒸镀位置，即虚线通孔表示的位置是被所述第一掩膜条4遮挡的，不能进行蒸镀。
本实施例的一些实施方式中，所述第一掩膜条4的种类的数量与所述第一镂空部21所述包含的所述第一通孔210的数量相同，所述第一镂空部21包括三个所述第一通孔210，则所述掩膜板组件还包括三种所述第一掩膜条4，每个所述第一掩膜条4的有效蒸镀图案在所述第一掩膜板01上的正投影位于对应的所述第一通孔210内。
在蒸镀时，所述第一掩膜条4和所述第一掩膜板01依次叠置于待蒸镀基板上，每个所述第一掩膜条4的有效蒸镀图案在所述第一掩膜板01上的正投影位于对应的所述第一通孔210内，以使得对应的所述第一通孔210将所述第一掩膜条4的有效蒸镀图案露出，便于蒸镀相应的图形。
本实施例中，所述掩膜板组件还包括第二掩膜板02，以及具有不同的有效蒸镀图案的多种第二掩膜条5，所述第二掩膜板02包括第二框架021，以及设置于所述第二框架021的相对的一组侧边框之间的第二支撑条3，所述第二支撑条3的第二区域上设置有包括多个第二通孔310的第二镂空部31，多个所述第二通孔310用于与多种所述第二掩膜条5进行配合以蒸镀形成不同的第二功能结构，参考图5、图8、图9和图14。
所述第一掩膜板01的设置，使得所述第一支撑条2的第一区域上设置包括多个所述第一通孔210的第一镂空部21，而在需要蒸镀不同于第一功能结构的其他功能结构时，即蒸镀区域的位置位于所述第一区域之外的区域时，还需要通过其他的掩膜板进行，所述第二掩膜板02的设置，使得与多个所述第二通孔310相配合以形成不同的所述第二功能结构的多种第二掩膜条5可以使用同一种掩膜板，也就是说，形成多种第二功能结构的掩膜板是通用的。
需要说明的是，图14中表示的第二掩膜板02中仅表示出了一个第二支撑条3，所述第二支撑条3的数量可根据实际需要设定，所述第二支撑条3的设置方向也可根据实际需要设定，第二掩膜板02可以仅包括沿着一个方向延伸 设置的第二支撑条3，第二掩膜板02也可以同时包括沿多个延伸方向设置的第二支撑条3，图14中所表示的仅是第二掩膜板02的一个示例性的结构，并不以此为限。
应当理解的是，图14中表示的第二掩膜板仅为示意图，表示第二掩膜板的组成结果，其中的第二支撑条的长宽比例、以及第二框架的长宽比例以实际需要设定，并不受限。
需要说明的是，所述第二掩膜条5的种类的数量与所要形成的所述第二功能结构的种类的数量相同，一个所述第二镂空部31中所述第二通孔310的数量与所述第二掩膜条5的种类的数量相同，每个所述第二掩膜板02上所包括的所述第二镂空部31的数量可以根据实际需要设定。
在使用所述第一掩膜板01进行蒸镀的工艺流程和使用所述第二掩膜板02进行蒸镀的工艺流程处于同一条生产线时，可以进一步的缩短掩膜板的制作时间，根进一步的有效的避免由于部分掩膜板损坏而导致整个工艺流程延迟的问题。
在一些实施方式中，所述第一掩膜板01和所述第二掩膜板02的区别在于，同一位置的支撑条的不同的区域上分别设置有第一镂空部21和所述第二镂空部31，即当所述第一掩膜板01和所述第二掩膜板02叠置在一起时，所述第一掩膜板01上的第一支撑条2在所述第二掩膜板02上的正投影、与所述第二掩膜板02上的第二支撑条3重合，所述第一支撑条2上的所述第一镂空部21在所述第二掩膜板02上的正投影、位于所述第二支撑条3的所述第二区域之外的区域。
需要说明的是，所述第一掩膜条4的种类与所述第二掩膜条5的种类没有重叠时，所述第一掩膜板01和所述第二掩膜板02集成，即所述第一掩膜板01复用为所述第二掩膜板02，一种掩膜板上同时具有所述第一镂空部21和所述第二镂空部31，所述第一掩膜条4的种类和所述第二掩膜条5的种类存在重叠时，所述第一掩膜板01不能复用为所述第二掩膜板02，例如，进行一种第一功能结构的蒸镀时，采用所述第一掩膜板01与对应的一种所述第一掩膜条4相配合，进行一种第二功能结构的蒸镀时，采用所述第二掩膜板02和对应的一种所述第二掩膜条5相配合，第一掩膜条4和所述第二掩膜条5为同一 种掩膜条，即在进行所述第一功能结构的蒸镀时，所述第一掩膜条4上的有效蒸镀图案会将对应形成所述第二功能结构的第二通孔310漏出，这样在蒸镀形成所述第一功能结构时，也有会蒸镀材料蒸镀于漏出的所述第二通孔310处。
本实施例中，所述第二镂空部31包括两个所述第二通孔310，两个所述第二通孔310包括第四子通孔312和第五子通孔313，其中所述第四子通孔312用于蒸镀形成测试显示基板上的第一颜色辅助发光层的所述第一特性的第二功能结构(第四子功能结构104)，所述第五子通孔313用于蒸镀形成测试显示基板上的第二颜色辅助发光层的所述第一特性的第二功能结构(第五子功能结构105)。
所述第二通孔310的数量根据实际需要设定，本实施例的一实施方式中，所述第一颜色辅助发光层为红色辅助发光层，所述第二颜色辅助发光层为绿色辅助发光层，但并不以此为限。
所述第二镂空部中的多个所述第二通孔310可以是相互独立的小通孔，也可以是相互连通为一个整体、呈一个大孔，此时由对应的所述第二掩膜条上的有效蒸镀图案来决定蒸镀形成的第二功能结构的具体位置和蒸镀面积。
所述第二镂空部31中的多个所述第二通孔310包括与红色辅助发光层的蒸镀位置对应的红色辅助通孔，以及与绿色辅助发光层的蒸镀位置相对应的绿色辅助通孔，所述第二掩膜条5包括用于形成测试红色辅助发光层的所述第一特性的红色辅助掩膜条，以及用于形成测试绿色辅助发光层的所述第一特性的绿色辅助掩膜条，红色辅助掩膜条与所述第二掩膜板02相配合在第四蒸镀腔室内进行蒸镀时，红色辅助掩膜条上的有效蒸镀图案与红色辅助通孔相对应、以露出待蒸镀的位置，而此时，绿色辅助通孔被红色辅助掩膜条遮挡，不能进行蒸镀，同理，绿色辅助掩膜条与所述第二掩膜板02相配合在第五蒸镀腔室内进行蒸镀时，绿色辅助掩膜条上的有效蒸镀图案与绿色辅助通孔相对应、以露出待蒸镀的位置，而此时，红色辅助通孔被绿色辅助掩膜条遮挡，不能进行蒸镀。
图8和图9中表示的第二掩膜条5为用于形成测试红色辅助发光层的第一特性的第二功能结构的红色辅助掩膜条，其上的有效蒸镀图案包括与第二镂空部31上的第四子通孔312对应的第二有效蒸镀图案51。
需要说明的是，图8中的虚线通孔表示被遮挡的蒸镀位置，即虚线通孔表示的位置是被所述第二掩膜条5遮挡的，不能进行蒸镀。
本实施例的一实施方式中，所述第二掩膜板02包括至少一个所述第二镂空部31，所述第一镂空部21与所述第二镂空部31蒸镀于显示基板板上的位置，位于显示基板上的显示面板区域的同一侧(显示基板上包括多个显示面板)，但并不以此为限。
本实施例中，还包括两种所述第二掩膜条5，每个所述第二掩膜条5的有效蒸镀图案在所述第二掩膜板02上的正投影位于对应的所述第二通孔310内。
在蒸镀时，所述第二掩膜条5和所述第二掩膜板02依次叠置于待蒸镀基板上，每个所述第二掩膜条5的有效蒸镀图案在所述第二掩膜板02上的正投影位于对应的所述第二通孔310内，以使得所述第二通孔310将所述第二掩膜条5上的有效蒸镀图案露出，便于蒸镀相应的图形。
本实施例中，所述第二掩膜条包括第一子掩膜条和第二子掩膜条，所述第一子掩膜条用于形成测试第一颜色辅助发光层的第一特性的第二功能结构，所述第二子掩膜条用于形成测试第二颜色辅助发光层的第一特性的第二功能结构，所述第一掩膜条包括第三子掩膜条和第四子掩膜条，所述第三子掩膜条用于形成测试第一颜色发光层的第一特性的第一功能结构，所述第四子掩膜条用于形成测试第二颜色发光层的第一特性的第一功能结构；
所述第一子掩膜条复用为所述第三子掩膜条，即同一掩膜条上同时具有用于形成测试第一颜色辅助发光层的第一特性的第二功能结构的有效蒸镀图案，和用于形成测试第一颜色发光层的第一特性的第一功能结构的有效蒸镀图案，所述第二子掩膜条复用为所述第四子掩膜条，即同一掩膜条上同时具有用于形成测试第二颜色辅助发光层的第一特性的第二功能结构的有效蒸镀图案，和用于形成测试第二颜色发光层的第一特性的第一功能结构的有效蒸镀图案。
例如，在所述第一颜色辅助发光层为红色辅助发光层、所述第一颜色发光层为红色发光层时，所述第一掩膜板01不能复用为所述第二掩膜板02，即所述第一镂空部21和所述第二镂空部31不能同时设置于同一掩膜板上，由于形成测试所述红色辅助发光层的第一特性的第二功能结构的掩膜条的种类与形成测试所述红色发光层的第一特性的第一功能结构的掩膜条的种类相同(例如， 一个掩膜条上的有效蒸镀图案同时包括第一有效蒸镀图案41和第二有效蒸镀图案51，参考图7和图9)，所述第一镂空部21和所述第二镂空部31分别位于不同的掩膜板上，避免在同一蒸镀步骤中，蒸镀了两种不能同时蒸镀的功能结构。
本实施例中，所述掩膜板组件还包括具有不同有效蒸镀图案的第三掩膜条，所述第一掩膜板01上的所述第一支撑条2上的第三区域设置有具有多个第三通孔201的第三镂空部22，多个所述第三通孔201与多种所述第三掩膜条配合以蒸镀形成不同的第三功能结构，参考图10。
需要说明的是，图10中仅表示出了第一支撑条2上的一个第三镂空部22的示意图。
每个腔室中有许多需要测试的内容，如蒸镀PPA(蒸镀位置精度)、膜厚、光学性能、电学性能等，故掩膜板上设计有许多孔，不同的膜层对应的掩膜板上的开孔位置也不同，例如，进行蒸镀PPA(蒸镀位置精度)测试的的开孔对应于显示基板上每个显示面板的一侧，而膜厚、光学性能、电学性能等测试的开孔对应于显示基板的边缘，通过所述第三掩膜条与所述第一掩膜板01配合，在对应的所述第三通孔201处蒸镀材料，以进行相应的特性的测试。
本实施例中，所述第三镂空部22至少包括三个所述第三通孔201，分别用于与所述第一掩膜板01相配合、以蒸镀形成分别对第一颜色发光层、第二颜色发光层、第三颜色发光层的第二特性进行测试的第三功能结构。
例如，对红色发光层的膜厚的测试，形成用于测试膜厚的第三功能结构的第三掩膜条与所述第一掩膜板01相配合，在对应的所述第三通孔201的位置蒸镀材料，以对红色发光层的膜厚进行测试，而此时只能在与形成用于测试膜厚的第三功能结构的第三掩膜条的有效蒸镀图案对应的第三通孔201才能蒸镀材料，而其他的第三通孔201则不可以，避免产生干扰。
需要说明的是，所述第三掩膜条的种类的数量与所要进行的测试的种类、以及测试的对象的数量有关，一个所述第三镂空部22中所述第三通孔201的数量与测试的对象数量有关，每个所述第一掩膜板上所包括的所述第三镂空部22的数量可以根据实际需要设定，例如，对红色发光层、绿色发光层和蓝色发光层的膜厚、电学性能分别进行测试，则所述第三掩膜条的种类包括六种， 以分别对应于一种发光层的一种特性的测试，例如其中一种掩膜条用于蒸镀形成对红色发光层的膜厚进行测试的第三功能结构，而所述第三通孔201也包括六个，分别与六种所述第三掩膜条一一对应。
需要说明的是，所述第三镂空部22中的多个所述第三通孔201可是相互独立的多个小通孔，也可以是相互连通组成一个大的通孔(即一个镂空部由一个通孔形成)，此时，由所述第三掩膜条上的有效蒸镀图案来决定第三功能结构的具体位置和蒸镀面积。
本实施例中，所述掩膜板组件还包括具有不同有效蒸镀图案的第四掩膜条，所述第二掩膜板02上的所述第二支撑条3上的第四区域设置有具有多个第四通孔301的第四镂空部32，多个所述第四通孔301与多种所述第四掩膜条配合以蒸镀形成不同的第四功能结构，参考图11。
需要说明的是，图11中仅表示出了第二支撑条3上的一个第四镂空部32的示意图。
每个腔室中有许多需要测试的内容，如蒸镀PPA(蒸镀位置精度)、膜厚、光学性能、电学性能等，故掩膜板上设计有许多孔，不同的膜层对应的掩膜板上的开孔位置也不同，通过所述第四掩膜条与所述第二掩膜板02配合，在对应的所述第四通孔301处蒸镀材料，以对相应的第二功能结构进行相应的特性的测试。
本实施例中，所述第四镂空部32至少包括两个所述第四通孔301，分别用于与所述第二掩膜板02相配合、以蒸镀形成分别对第一颜色辅助发光层、第二颜色辅助发光层、第三颜色辅助发光层的所述第二特性进行测试的第四功能结构。
例如，对红色辅助发光层的膜厚的测试，形成用于测试膜厚的功能结构的第四掩膜条与所述第二掩膜板02相配合，在对应的所述第四通孔301的位置蒸镀材料，以对红色辅助发光层的膜厚进行测试，而此时只能在与形成用于测试膜厚的功能结构的第四掩膜条的有效蒸镀图案对应的第四通孔301才能蒸镀材料，而其他的第四通孔301则不可以，避免产生干扰。
需要说明的是，所述第四掩膜条的种类的数量与所要进行的测试的种类以及测试对象的数量有关，一个所述第四镂空部32中所述第四通孔301的数量 与所述第四掩膜条的种类的数量相同，每个所述第二掩膜板上所包括的所述第四镂空部32的数量可以根据实际需要设定，例如，对红色辅助发光层、绿色辅助发光层的膜厚、电学性能分别进行测试，则所述第四掩膜条的种类包括四种，以分别对应于一种辅助发光层的一种特性的测试，例如其中一种掩膜条用于蒸镀形成对红色辅助发光层的膜厚进行测试的第四功能结构，而所述第三通孔也包括四个，分别与四种所述第三掩膜条一一对应。
需要说明的是，所述第四镂空部32中的多个所述第四通孔301可是相互独立的多个小通孔，也可以是相互连通组成一个大的通孔(即一个镂空部由一个通孔形成)，此时，由所述第四掩膜条上的有效蒸镀图案来决定第四功能结构的具体位置和蒸镀面积。
在本实施例的一具体实施方式中，在五个蒸镀腔室内分别进行针对红色发光层(REML)、绿色发光层(GEM L)、蓝色发光层(BEML)、红色辅助发光层(RHTL)、绿色辅助发光层(GHTL)的多种特性进行测试的功能结构的蒸镀，采用所述第一掩膜板01用于蒸镀形成进行红色发光层(REML)、绿色发光层(GEM L)、蓝色发光层(BEML)的特性的测试的功能结构，每个腔室中有许多需要测试的内容，如蒸镀PPA(蒸镀位置精度)、膜厚、光学性能、电学性能等，故掩膜板上设计有许多孔，不同的膜层对应的掩膜板上的开孔位置也不同，图1-图3表示出了测试相应的膜层的PPA(蒸镀位置精度)的第一结构100(包括所述第一功能结构和所述第二功能结构)、测试膜厚的第二结构200(即所述第三功能结构)、测试电学性能的第三结构300和测试光学性能的第四结构400(即所述第四功能结构本实施例中)，显示基板1上包括多个显示面板11，每个显示面板11的一侧设置有所述第一结构100，显示基板1的边缘设置有所述第二结构200、第三结构300和第四结构400。
所述第一掩膜板01上的所述第一镂空部21中的多个第一通孔210、包括与测试红色发光层的第一特性的第一功能结构对应的红色通孔，与测试所述绿色发光层的第一特性的第一功能结构对应的绿色通孔、与测试所述蓝色发光层的第一特性的第一功能结构对应的蓝色通孔(需要说明的是，所述第一通孔210没有进行红色、绿色、或蓝色的颜色涂色，只是为了进行区分而与对应形成的结构进行对应命名)，并采用所述第二掩膜板02蒸镀形成测试红色辅助发 光层(RHTL)、绿色辅助发光层(GHTL)的第一特性的第二功能结构，所述第二掩膜板02上的所述第二镂空部31中的所述第二通孔310、包括用于形成测试红色辅助发光层的第一特性的第二功能结构红色辅助通孔、以及用于形成测试绿色辅助发光层的第一特性的第二功能结构的绿色辅助通孔(需要说明的是，所述第二通孔310并没有进行红色或绿色的颜色涂色，只是为了进行区域而进行的不同的命名)。
所述第一特性为蒸镀位置精度测试，但并不以此为限。
进行蒸镀测试红色发光层的第一特性的第一功能结构时，将对应的所述第一掩膜条4的有效蒸镀图案与所述红色通孔相对应，而此时绿色通孔和蓝色通孔是被所述第一掩膜条4遮挡，同样的，进行蒸镀测试绿色发光层的第一特性的第一功能结构时，将对应的所述第一掩膜条4的有效蒸镀图案与所述绿色通孔相对应，而此时红色通孔和蓝色通孔是被所述第一掩膜条4遮挡，进行蒸镀测试蓝色发光层的第一特性的第一功能结构时，将对应的所述第一掩膜条4的有效蒸镀图案与所述蓝色通孔相对应，而此时绿色通孔和红色通孔是被所述第一掩膜条4遮挡。通过所述第二掩膜板02进行蒸镀测试所述红色辅助发光层的第一特性的第二功能结构和测试所述绿色辅助发光层的第一特性的第二功能结构的原理相同。
本实施方式中，还包括采用第三掩膜条与所述第一掩膜板01进行配合以对红色发光层、绿色发光层、和蓝色发光层的第一特性之外的其他各种特性进行测试，由于形成测试不同特性的功能结构的测试孔的位置不同，例如，形成蒸镀位置精度测试的功能结构对应于显示基板的显示面板的一侧，相应的通孔位于掩膜板的中部区域，而形成测试膜厚、电学性能等的功能结构对应于显示基板的边缘，相应的通孔位于掩膜板的边缘，可以采用所述第一掩膜板01与不同的第三掩膜条进行配合，第三掩膜条上具有的不同的有效蒸镀图案用于形成用于不同特性测试的功能结构，例如，用于对红色发光层进行膜厚测试的功能结构的蒸镀时，采用所述第一掩膜板01与相应的所述第三掩膜条进行配合蒸镀。
本实施方式中，还包括采用第四掩膜条与所述第二掩膜板02进行配合以对红色发光层、绿色发光层、和蓝色发光层的第一特性之外的各种特性进行测 试，由于形成测试不同特性的功能结构的测试孔的位置不同，可以采用所述第二掩膜板02与不同的第四掩膜条进行配合，例如，形成蒸镀位置精度测试的功能结构对应于显示基板的显示面板的一侧，相应的通孔位于掩膜板的中部区域，而形成测试膜厚、电学性能等的功能结构对应于显示基板的边缘，相应的通孔位于掩膜板的边缘，第四掩膜条上具有的不同的有效蒸镀图案用于形成用于不同特性测试的功能结构，例如，用于对红色辅助发光层进行膜厚测试的功能结构的蒸镀时，采用所述第二掩膜板02与相应的所述第三掩膜条进行配合蒸镀。
需要说明的是，在传统技术中，采用五张掩膜板在五个蒸镀腔室中分别完成对红色发光层、绿色发光层、蓝色发光层、红色辅助发光层、绿色辅助发光层的多种性能的测试，制作相应的掩膜板时，需要开模五次，成本高，制作时间长，在实际操作中，会预备两套掩膜板进行使用，即预备十张掩膜板，如果用于蒸镀同一结构的掩膜板均损坏，则整个蒸镀流程均会被延迟。本实施例中，将用于蒸镀测试红色发光层、绿色发光层、蓝色发光层、红色辅助发光层、绿色辅助发光层的特性的功能结构的掩膜板划分为两类，采用所述第一掩膜板01蒸镀形成测试红色发光层、绿色发光层、蓝色发光层的多种特性的功能结构，采用所述第二掩膜板02蒸镀形成测试红色辅助发光层、绿色辅助发光层的多种特性的功能结构，这样在制作掩膜板时，只需开模两次，节省成本，大大缩短了制作掩膜板的时间，且在实际操作中，仍然会预备十张掩膜板(因为有五个蒸镀腔室)，但是由于蒸镀测试红色发光层、绿色发光层、蓝色发光层的特性的功能结构的第一掩膜板01可以通用，蒸镀测试红色辅助发光层、绿色辅助发光层的特性的功能结构的第二掩膜板02可以通用，即使进行蒸镀一个功能结构使用的掩膜板损坏了，还可以借用其他的可以通用的掩膜板进行蒸镀，避免导致整个工艺流程的延迟。
需要说明的是，实际应用中，在蒸镀形成对测试显示基板上的功能层(即待测试功能层，例如发光层)的各种特性的功能结构时，对应的发光层是与该功能结构同步蒸镀形成的，即所述第一掩膜板01的第一支撑条2上具有用于蒸镀形成不同的第一功能结构210的多个所述第一通孔210，且所述第一支撑条2上具有用于蒸镀形成待测试功能层的多个第一功能区通孔，当然，对应的 第一掩膜条上的有效蒸镀图案包括与所述第一通孔210配合形成所述第一功能结构210的蒸镀图案，同时具有与所述第一功能区通孔配合形成待测试功能层的蒸镀图案。
例如，通过所述第一掩膜板01，在蒸镀形成测试显示基板上的第一颜色发光层的第一特性的第一功能结构时，该所述第一功能结构与所述第一颜色发光层是同步蒸镀形成的，即所述第一掩膜板01的第一支撑条2上具有第一子通孔，第一子通孔用于蒸镀形成测试显示基板上的第一颜色发光层的第一特性的、第一功能结构，且所述第一掩膜板01的第一支撑条2上同时具有用于蒸镀形成第一颜色发光层的第一功能区通孔。参考图13，图13中表示了第一功能区通孔001的蒸镀位置。
例如，通过所述第二掩膜板02，用于蒸镀形成测试第一颜色辅助发光层的第一特性的第二功能结构时，该所述第二功能结构与所述第一颜色辅助发光层是同步蒸镀形成的，即所述第二掩膜板02的第二支撑条3上具有第四子通孔，第四子通孔用于蒸镀形成测试第一颜色辅助发光层的第一特性的第二功能结构，且所述第二掩膜板02的第二支撑条3上同时具有用于蒸镀形成第一颜色辅助发光层的第二功能区通孔。参考图15，图15中表示了第一功能区通孔001的蒸镀位置。
需要说明的是，应当理解的是，图15中表示的第二掩膜板仅为示意图，表示第二掩膜板02的组成结果，其中的第二支撑条3的长宽比例、以及第二框架021的长宽比例以实际需要设定，并不受限，且图15中仅仅示意出了第二支撑条3上具有所述第二通孔310和所述第二功能区通孔002，所述第二通孔310和所述第二功能区通孔002的大小尺寸、设置位置等并不受限制。
以上所述为本公开较佳实施例，需要说明的是，对于本领域普通技术人员来说，在不脱离本公开所述原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本公开保护范围。

Claims (10)

  1. 一种掩膜板组件，其中，包括第一掩膜板，以及具有不同的有效蒸镀图案的多种第一掩膜条，所述第一掩膜板包括第一框架、以及设置于所述第一框架的相对的一组侧边框之间的第一支撑条，所述第一支撑条的第一区域上设置有包括多个第一通孔的第一镂空部，多个所述第一通孔用于与多种所述第一掩膜条进行配合以蒸镀形成不同的第一功能结构；
    所述第一镂空部包括三个所述第一通孔，三个所述第一通孔包括第一子通孔、第二子通孔、第三子通孔，其中所述第一子通孔用于蒸镀形成测试显示基板上的第一颜色发光层的第一特性的第一功能结构，所述第二子通孔用于蒸镀形成测试显示基板上的第二颜色发光层的第一特性的第一功能结构，所述第三子通孔用于蒸镀形成测试显示基板的第三颜色发光层的第一特性的第一功能结构。
  2. 根据权利要求1所述的掩膜板组件，其中，还包括三种所述第一掩膜条，每个所述第一掩膜条的有效蒸镀图案在所述第一掩膜板上的正投影位于对应的所述第一通孔内。
  3. 根据权利要求1所述的掩膜板组件，其中，还包括第二掩膜板，以及具有不同的有效蒸镀图案的多种第二掩膜条，所述第二掩膜板包括第二框架，以及设置于所述第二框架的相对的一组侧边框之间的第二支撑条，所述第二支撑条的第二区域上设置有包括多个第二通孔的第二镂空部，多个所述第二通孔用于与多种所述第二掩膜条进行配合以蒸镀形成不同的第二功能结构。
  4. 根据权利要求3所述的掩膜板组件，其中，所述第二镂空部包括两个所述第二通孔，两个所述第二通孔包括第四子通孔和第五子通孔，其中所述第四子通孔用于蒸镀形成测试显示基板上的第一颜色辅助发光层的所述第一特性的第二功能结构，所述第五子通孔用于蒸镀形成测试显示基板上的第二颜色辅助发光层的所述第一特性的第二功能结构。
  5. 根据权利要求4所述的掩膜板组件，其中，还包括两种所述第二掩膜条，每个所述第二掩膜条的有效蒸镀图案在所述第二掩膜板上的正投影位于对应的所述第二通孔内。
  6. 根据权利要求5所述的掩膜板组件，其中，所述第二掩膜条包括第一子掩膜条和第二子掩膜条，所述第一子掩膜条用于形成测试第一颜色辅助发光层的第一特性的第二功能结构，所述第二子掩膜条用于形成测试第二颜色辅助发光层的第一特性的第二功能结构，所述第一掩膜条包括第三子掩膜条和第四子掩膜条，所述第三子掩膜条用于形成测试第一颜色发光层的第一特性的第一功能结构，所述第四子掩膜条用于形成测试第二颜色发光层的第一特性的第一功能结构；
    所述第一子掩膜条复用为所述第三子掩膜条，所述第二子掩膜条复用为所述第四子掩膜条。
  7. 根据权利要求1所述的掩膜板组件，其中，还包括具有不同有效蒸镀图案的第三掩膜条，所述第一掩膜板上的所述第一支撑条上的第三区域设置有具有多个第三通孔的第三镂空部，多个所述第三通孔与多种所述第三掩膜条配合以蒸镀形成不同的第三功能结构。
  8. 根据权利要求7所述的掩膜板组件，其中，所述第三镂空部至少包括三个所述第三通孔，分别用于与所述第一掩膜板相配合、以蒸镀形成分别对第一颜色发光层、第二颜色发光层、第三颜色发光层的第二特性进行测试的第三功能结构。
  9. 根据权利要求3所述的掩膜板组件，其中，还包括具有不同有效蒸镀图案的第四掩膜条，所述第二掩膜板上的所述第二支撑条上的第四区域设置有具有多个第四通孔的第四镂空部，多个所述第四通孔与多种所述第四掩膜条配合以蒸镀形成不同的第四功能结构。
  10. 根据权利要求9所述的掩膜板组件，其中，所述第四镂空部至少包括两个所述第四通孔，分别用于与所述第二掩膜板相配合、以蒸镀形成分别对第一颜色辅助发光层、第二颜色辅助发光层、第三颜色辅助发光层的第二特性进行测试的第四功能结构。
PCT/CN2021/079862 2020-04-26 2021-03-10 掩膜板组件 WO2021218412A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000039514A (ja) * 1998-07-23 2000-02-08 Nippon Telegr & Teleph Corp <Ntt> 光学薄膜の製造方法
CN108893710A (zh) * 2018-07-26 2018-11-27 京东方科技集团股份有限公司 掩模板、蒸镀掩模板组件及其制造方法、蒸镀设备
CN108977762A (zh) * 2017-06-05 2018-12-11 京东方科技集团股份有限公司 掩膜板、套装掩膜板和蒸镀系统
CN110029322A (zh) * 2019-05-27 2019-07-19 京东方科技集团股份有限公司 基板蒸镀对位系统以及监控像素位置测量的方法和装置
CN110066975A (zh) * 2019-05-14 2019-07-30 京东方科技集团股份有限公司 掩膜版、蒸镀装置、蒸镀方法以及掩膜版中蒸镀开口的设计方法
CN212025440U (zh) * 2020-04-26 2020-11-27 京东方科技集团股份有限公司 掩膜板组件

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000039514A (ja) * 1998-07-23 2000-02-08 Nippon Telegr & Teleph Corp <Ntt> 光学薄膜の製造方法
CN108977762A (zh) * 2017-06-05 2018-12-11 京东方科技集团股份有限公司 掩膜板、套装掩膜板和蒸镀系统
CN108893710A (zh) * 2018-07-26 2018-11-27 京东方科技集团股份有限公司 掩模板、蒸镀掩模板组件及其制造方法、蒸镀设备
CN110066975A (zh) * 2019-05-14 2019-07-30 京东方科技集团股份有限公司 掩膜版、蒸镀装置、蒸镀方法以及掩膜版中蒸镀开口的设计方法
CN110029322A (zh) * 2019-05-27 2019-07-19 京东方科技集团股份有限公司 基板蒸镀对位系统以及监控像素位置测量的方法和装置
CN212025440U (zh) * 2020-04-26 2020-11-27 京东方科技集团股份有限公司 掩膜板组件

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