Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
  • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
  • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
  • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
  • C08K3/013—Fillers, pigments or reinforcing additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/32—Phosphorus-containing compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
  • C08K5/0041—Optical brightening agents, organic pigments
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/0091—Complexes with metal-heteroatom-bonds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/49—Phosphorus-containing compounds
  • C08K5/51—Phosphorus bound to oxygen
  • C08K5/52—Phosphorus bound to oxygen only
  • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/49—Phosphorus-containing compounds
  • C08K5/51—Phosphorus bound to oxygen
  • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
  • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K7/00—Use of ingredients characterised by shape
  • C08K7/02—Fibres or whiskers
  • C08K7/04—Fibres or whiskers inorganic
  • C08K7/14—Glass
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
  • B29K2077/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
  • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
  • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
  • B29K2105/12—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of short lengths, e.g. chopped filaments, staple fibres or bristles
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
  • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
  • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
  • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids

Definitions

• the present invention relates to a colored polyamide resin composition and a molded product thereof, and more particularly to a colored halogen-free polyamide resin composition and a molded product thereof that provide a molded product having excellent flame retardancy.
• Polyamide has excellent mechanical properties and heat resistance, so it is widely used in the fields of automobile parts and electrical / electronic parts.
• surface mounting processes with high component mounting efficiency are widespread, and heat-resistant polyamide, which has high heat resistance and excellent strength, is widely used as a suitable material for forming these components.
• lead-free solder has been adopted as the solder used in the surface mount process from the viewpoint of reducing the environmental load.
• the lead-free solder has a relatively high melting temperature, the temperature in the reflow process of the surface mount process is increased. It is necessary to set it as high as about 260 ° C. Therefore, as the heat-resistant polyamide for forming the parts for the surface mounting process, those having a relatively high melting point among the heat-resistant polyamides are adopted.
• halogen-free flame retardants there are several known halogen-free flame retardants in polyamide.
• the flame retardant blended in the heat-resistant polyamide having a high melting point has high flame retardancy, and is high during melt-kneading when producing a polyamide resin composition and during molding processing when producing a molded product.
• High heat resistance that can withstand temperatures is required, and this tendency is particularly remarkable in electrical and electronic parts that undergo the reflow process of the surface mounting process.
• Phosphinate is known as a halogen-free flame retardant having high flame retardancy and heat resistance.
• resin compositions containing specific semi-aromatic polyamides, polyphenylene ethers, and phosphinates are known (eg, Patent Documents 1 and 2).
• JP-A-2007-182550 Japanese Unexamined Patent Publication No. 2007-182551 Japanese Unexamined Patent Publication No. 2015-128091 Japanese Unexamined Patent Publication No. 2010-120983 Japanese Unexamined Patent Publication No. 2014-521765 Japanese Unexamined Patent Publication No. 2016-186080
• the above-mentioned polyamide resin composition containing phosphinate may be colored and used for automobile parts and electric / electronic parts.
• a molded product using a polyamide resin composition containing phosphinate which is colored and has excellent visibility, has a problem that flame retardancy may be lowered.
• the thickness of the test piece is 0.15 to 3.0 mm
• the test piece using the polyamide resin composition containing phosphinate without using a colorant conforms to the UL94V-0 standard, but phosphinic acid.
• the test piece using the polyamide resin composition containing a salt and a colorant may not conform to the UL94V-0 standard.
• Patent Document 3 discloses a flame-retardant thermoplastic resin composition containing a polyphenylene ether, a phosphinic acid metal salt, and a colorant.
• Patent Document 3 does not mention any effect of the colorant on flame retardancy.
• Patent Document 4 discloses a polyamide resin composition containing a metal salt of phosphinic acid, a specific rubber, melamine polyphosphate as a flame retardant, and a white pigment. This polyamide resin composition contains melamine polyphosphate, which is inferior in heat resistance, and is difficult to apply to a resin composition used in a reflow process. Further, Patent Document 4 does not mention any effect of the colorant on flame retardancy.
• Patent Documents 5 and 6 disclose a flame-retardant polyamide composition having an excellent appearance and containing a specific polyamide, a metal salt of phosphinic acid, and a flame retardant containing a colorant. However, also in Patent Documents 5 and 6, there is no mention of the effect of the colorant on the flame retardancy.
• halogen-free polyamide resin composition having excellent flame retardancy and excellent visibility in addition to being able to withstand a reflow process and a molded product thereof.
• the present invention is as follows.
• the phosphinate (C) is 25 to 40 parts by mass
• the phosphite (D) is 2 to 15 parts by mass
• the colorant (E) is contained
• the sulfur element content is less than 220% by mass.
• R 1 , R 2 , R 4 and R 5 independently represent linear or branched alkyl groups having 1 to 16 carbon atoms.
• R 1 and R 2 and R 4 and R 5 may be combined with each other to form a ring.
• R 3 is a linear or branched alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 10 carbon atoms, an alkyl arylene group having 7 to 20 carbon atoms, and a cycloalkylene group having 3 to 10 carbon atoms. Shows a group, an aralkylene group having 7 to 10 carbon atoms, or an arylalkylene group having 7 to 20 carbon atoms.
• M represents calcium, magnesium, aluminum, or zinc.
• m is an integer of 1 to 4.
• n is an integer of 1 to 4.
• x is an integer of 1 to 4.
• ⁇ E [(L * col -L * nat ) 2 + (a * col -a * nat ) 2 + (b * col -b * nat ) 2 ] 1/2 (1)
• ⁇ E is the color difference defined by the CIE1976 (L * a * b * ) color system
• L * col , a * col , and b * col are the CIE1976 (L * a * b *) color difference of the polyamide resin composition.
• L * a * b * L * , a * , and b * defined by the color system, except that L * nat , a * nat , and b * nat do not contain the colorant (E).
• [2] A molded product of the polyamide resin composition according to the above [1].
• a halogen-free polyamide resin composition having excellent flame retardancy and excellent visibility in addition to being able to withstand a reflow process and a molded product thereof.
• the polyamide resin composition of the present embodiment contains 100 parts by mass of the specific polyamide (A) and 45 to 120 parts by mass of the inorganic filler (B), at least one phosphinic acid represented by a specific formula.
• the salt (C) contains 25 to 40 parts by mass
• the phosphite (D) contains 2 to 15 parts by mass
• the colorant (E) and the sulfur element content is less than 220% by mass, according to the following formula. It is characterized in that ⁇ E represented by (1) is larger than 1.
• ⁇ E [(L * col -L * nat ) 2 + (a * col -a * nat ) 2 + (b * col -b * nat ) 2 ] 1/2 (1)
• ⁇ E is the color difference defined by the CIE1976 (L * a * b * ) color system
• L * col , a * col , and b * col are the CIE1976 (L * a * b *) color difference of the polyamide resin composition.
• the polyamide resin composition is a halogen-free polyamide resin composition that can withstand a reflow process, has excellent flame retardancy, and has excellent visibility.
• the reason why the molded product of the polyamide resin composition containing phosphinate, which is colored and has excellent visibility, has excellent flame retardancy is not necessarily clear, but is considered as follows.
• the main flame retardant mechanism of phosphinate is the formation of a carbonized layer by polyphosphate generated by the decomposition of phosphinate during combustion, and this carbonized layer suppresses heat conduction, and the thermal decomposition of the resin and it Inhibits the accompanying combustion.
• the present invention it is considered that not only the phosphinate but also the phosphite contained in the polyamide resin composition of the present embodiment contributes to the improvement of flame retardancy.
• phosphite is decomposed and foamed during combustion to form a heat insulating layer, and this heat insulating layer suppresses heat conduction and inhibits thermal decomposition of the resin and combustion accompanying it.
• sulfur element is widely used in order to change the electronic state and adjust the coloration in the case of an organic colorant, and as a sulfide in the case of an inorganic colorant.
• sulfur elements may be mixed as impurities in the production of colorants.
• the catalyst and other additives used in the process of synthesizing the polyamide resin may contain sulfur elements. Considering the above, the presence of sulfur elements in the polyamide resin composition containing phosphinate and phosphite generates sulfur radicals during combustion, which inactivate polyphosphoric acid and phosphorous acid. it is conceivable that.
• Polyamide (A) has a melting point of 280 ° C. or higher.
• the melting point of the polyamide (A) is preferably 285 ° C. or higher, more preferably 295 ° C. or higher. If the melting point of the polyamide (A) is equal to or higher than the above temperature, sufficient heat resistance can be obtained even if the molded product of the polyamide resin composition containing the polyamide (A) is used for an application exposed to a heating step such as a reflow step. Can be maintained.
• the polyamide (A) contains a diamine unit, and it is preferable that 50 to 100 mol% of the diamine unit is an aliphatic diamine unit having 4 to 18 carbon atoms. Further, the polyamide (A) contains a dicarboxylic acid unit and a diamine unit, the main component of the dicarboxylic acid unit is a unit derived from terephthalic acid, and the main component of the diamine unit is an aliphatic diamine having 4 to 12 carbon atoms. It is preferable that it is at least one selected from. Many of the above-mentioned polyamides have a sufficiently high melting point, and by using this, a polyamide resin composition capable of providing a molded product capable of withstanding a reflow process can be obtained.
• the “main component” means that other components can be contained within a range that does not impair the effects of the present invention.
• the “main component of the dicarboxylic acid unit” means that it constitutes preferably 50 to 100 mol%, more preferably 60 to 100 mol%, still more preferably 90 to 100 mol% in the total dicarboxylic acid unit.
• the “main component of the diamine unit” means that it constitutes preferably 50 to 100 mol%, more preferably 60 to 100 mol%, still more preferably 90 to 100 mol% in the total diamine unit.
• dicarboxylic acid unit other than the unit derived from terephthalic acid examples include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecandicarboxylic acid, and dodecanedicarboxylic acid.
• Aliphatic dicarboxylic acids such as dimethylmalonic acid, 2,2-diethylsuccinic acid, 2,2-dimethylglutaric acid, 2-methyladipic acid, trimethyladipic acid; 1,3-cyclopentanedicarboxylic acid, 1,3-cyclohexane Alicyclic dicarboxylic acids such as dicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, cycloheptanedicarboxylic acid, cyclooctanedicarboxylic acid, cyclodecanedicarboxylic acid; isophthalic acid, 1,4-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid For acid, 2,7-naphthalenedicarboxylic acid, diphenylic acid, 4,4'-biphenyldicarboxylic acid, diphenylmethane-4,4'-dicarboxylic acid, diphenylsulfon-4,
• the building block from which it is derived can be mentioned. These units may be one type or two or more types. Further, in the above-mentioned polyamide, a structural unit derived from a trivalent or higher valent carboxylic acid such as trimellitic acid, trimesic acid, and pyromellitic acid can be melt-molded within a range that does not impair the effects of the present invention. It can also be included.
• a trivalent or higher valent carboxylic acid such as trimellitic acid, trimesic acid, and pyromellitic acid
• Examples of the aliphatic diamine unit having 4 to 18 carbon atoms include 1,4-butanediamine, 1,5-pentanediamine, 1,6-hexanediamine, 1,7-heptanediamine, 1,8-octanediamine, and 1 , 9-Nonan diamine, 1,10-decane diamine, 1,11-undecane diamine, 1,12-dodecane diamine, 1,13-tridecane diamine, 1,14-tetradecane diamine, 1,15-pentadecane diamine, 1, Linear aliphatic diamines such as 16-hexadecanediamine, 1,17-heptadecanediamine, 1,18-octadecanediamine; 1-butyl-1,2-ethanediamine, 1,1-dimethyl-1,4-butane Diamine, 1-ethyl-1,4-butanediamine, 1,2-dimethyl-1,4-butanediamine, 1,3-dimethyl-1,4-butanediamine,
• 1,8-octanediamine, 2-methyl-1,8-octanediamine, 1,9-nonandamine, 1 , 10-Decandiamine, 1,11-Undecanediamine, and 1,12-Dodecanediamine preferably a structural unit derived from at least two species, 1,9-nonanediamine, 2-methyl-1,8. More preferably, it is a structural unit derived from at least two kinds selected from -octanediamine and 1,10-decanediamine.
• the diamine unit contains a unit derived from an aliphatic diamine having 9 carbon atoms, and the main diamine unit is It is more preferable that the component is at least two kinds selected from aliphatic diamines having 9 carbon atoms, and the diamine unit contains 60 to 100 mol% of 1,9-nonanediamine unit and 2-methyl-1,8-octanediamine unit. It is more preferable to do so.
• the diamine unit contains 60 to 100 mol% in total of the structural unit derived from 1,9-nonanediamine and the structural unit derived from 2-methyl-1,8-octanediamine, it is derived from 1,9-nonandiamine.
• the melting point of the polyamide (A) does not become too low, and it is particularly suitable for setting the temperature at which the reflow process can be tolerated.
• the diamine unit in the polyamide (A) can contain a diamine unit other than the aliphatic diamine unit having 4 to 18 carbon atoms as long as the effect of the present invention is not impaired.
• diamine units include aliphatic diamines such as ethylenediamine, 1,2-propanediamine, and 1,3-propanediamine; cyclohexanediamine, methylcyclohexanediamine, isophoronediamine, norbornandimethylamine, tricyclodecanedimethyldiamine, and the like.
• Alicyclic diamines p-phenylenediamine, m-phenylenediamine, p-xylylene diamine, m-xylylene diamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 4,4'- Examples thereof include structural units derived from aromatic diamines such as diaminodiphenyl ether. These units may be one type or two or more types.
• Polyamide (A) may contain an aminocarboxylic acid unit.
• the aminocarboxylic acid unit include lactams such as caprolactam and lauryllactam; and units derived from aminocarboxylic acids such as 11-aminoundecanoic acid and 12-aminododecanoic acid.
• the content of the aminocarboxylic acid unit in the polyamide is preferably 40 mol% or less, more preferably 20 mol% or less, based on 100 mol% of the total of the dicarboxylic acid unit and the diamine unit of the polyamide. ..
• the polyamide (A) may contain units derived from the end sealant.
• the unit derived from the terminal encapsulant is preferably 1.0 to 10 mol%, more preferably 2.0 to 7.5 mol%, and 2.5 to 6.5 with respect to the diamine unit. It is more preferably mol%.
• it can be carried out by charging the terminal encapsulant to the diamine so as to be within the above-mentioned desired range at the time of charging the polymerization raw material.
• the amount of end-capping agent charged at the time of charging the polymerization raw material is finely adjusted so that a desired amount of units derived from the end-sealing agent is introduced into the obtained resin. It is desirable to do.
• a method for determining the content of the unit derived from the terminal encapsulant in the polyamide (A) for example, as shown in Japanese Patent Application Laid-Open No. 07-228690, the solution viscosity is measured, and the number average molecular weight thereof is measured.
• a monofunctional compound having reactivity with a terminal amino group or a terminal carboxyl group can be used. Specific examples thereof include monocarboxylic acids, acid anhydrides, monoisocyanates, monoacid halides, monoesters, monoalcohols, and monoamines. From the viewpoint of reactivity and stability of the sealing terminal, a monocarboxylic acid is preferable as the terminal sealing agent for the terminal amino group, and a monoamine is preferable as the terminal sealing agent for the terminal carboxyl group. Further, from the viewpoint of ease of handling and the like, a monocarboxylic acid is more preferable as the terminal encapsulant.
• the monocarboxylic acid used as the terminal encapsulant is not particularly limited as long as it has reactivity with an amino group.
• acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, capric acid, and laurin for example, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, capric acid, and laurin.
• Alicyclic monocarboxylic acids such as acids, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, isobutyric acid; alicyclic monocarboxylic acids such as cyclopentanecarboxylic acid and cyclohexanecarboxylic acid; benzoic acid, toluic acid, Aromatic monocarboxylic acids such as ⁇ -naphthalenecarboxylic acid, ⁇ -naphthalenecarboxylic acid, methylnaphthalenecarboxylic acid, phenylacetic acid; any mixture thereof and the like can be mentioned.
• acetic acid propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, etc.
• at least one selected from the group consisting of benzoic acid is preferred.
• the monoamine used as the terminal encapsulant is not particularly limited as long as it has reactivity with a carboxyl group.
• methylamine, ethylamine, propylamine, butylamine, hexylamine, octylamine, decylamine and stearyl are not particularly limited.
• Adipose monoamines such as amines, dimethylamines, diethylamines, dipropylamines and dibutylamines; alicyclic monoamines such as cyclohexylamines and dicyclohexylamines; aromatic monoamines such as aniline, toluidine, diphenylamines and naphthylamines; any mixture thereof and the like.
• Polyamide (A) can be produced by using any method known as a method for producing polyamide. For example, it can be produced by a solution polymerization method or an interfacial polymerization method using acid chloride and diamine as raw materials, a melt polymerization method using dicarboxylic acid and diamine as raw materials, a solid phase polymerization method, a melt extrusion polymerization method and the like.
• the polyamide (A) is first polymerized by heating at a temperature of 200 to 250 ° C., for example, after first adding a diamine, a dicarboxylic acid, and if necessary, a catalyst and an end-capping agent all at once to produce a nylon salt. It can be produced by solid-phase polymerization or polymerization using a melt extruder. When the final stage of polymerization is carried out by solid phase polymerization, it is preferably carried out under reduced pressure or under an inert gas flow, and when the polymerization temperature is in the range of 200 to 280 ° C., the polymerization rate is high and the productivity is excellent. Coloring and gelation can be effectively suppressed.
• the polymerization temperature is preferably 370 ° C. or lower, and when the polymerization is carried out under such conditions, a polyamide having almost no decomposition and little deterioration can be obtained.
• Examples of the catalyst that can be used in producing the polyamide (A) include phosphoric acid, phosphorous acid, hypophosphoric acid, salts or esters thereof, and the like.
• the above salts or esters include phosphoric acid, phosphite or hypophosphoric acid and metals such as potassium, sodium, magnesium, vanadium, calcium, zinc, cobalt, manganese, tin, tungsten, germanium, titanium and antimony.
• Salt ammonium salt of phosphoric acid, phosphite or hypophosphoric acid; ethyl ester of phosphoric acid, phosphite or hypophosphoric acid, isopropyl ester, butyl ester, hexyl ester, isodecyl ester, octadecyl ester, decyl ester , Stearyl ester, phenyl ester and the like.
• Polyamide (A) can contain any of crystalline polyamide, amorphous polyamide, and a mixture thereof as long as the effect of the present invention is not impaired.
• Examples of the crystalline polyamide include polycaproamide (polyamide 6), polyhexamethylene adipamide (polyamide 66), polytetramethylene adipamide (polyamide 46), polyhexamethylene sebacamide (polyamide 610), and poly.
• Hexamethylene dodecamide (polyamide 612), polyundecamethylene adipamide (polyamide 116), polybis (4-aminocyclohexyl) metidedecamide (polyamide PACM12), polybis (3-methyl-4-aminocyclohexyl) methandodecamide (Polyamide dimethyl PACM12), polyundecamethylene terephthalamide (polyamide 11T), polyundecamethylene hexahydroterephthalamide (polyamide 11T (H)), polyundecamide (polyamide 11), polydodecamide (polyamide 12), polytrimethylhexamethylene terephthal.
• polyamide TMDT polymethaxylylene adipamide
• polyamide MXD6 polyhexamethylene terephthalamide
• polyamide 6I polyhexamethylene isophthalamide
• copolymer of polyamide 6I and polyamide 6T polyamide 6I
• polyamide 6I copolymer of polyamide 6T and polyundecaneamide
• polyamide 11 polyamide 6T / 11
• copolymers and mixtures thereof The crystalline polyamide also includes those in which the benzene ring of terephthalic acid and / or isophthalic acid is substituted with an alkyl group or a halogen atom.
• the crystalline polyamide one of the above may be used alone, or a plurality of types may be used in combination.
• amorphous polyamide examples include a polycondensate of terephthalic acid / isophthalic acid / 1,6-hexanediamine, and terephthalic acid / isophthalic acid / 1,6-hexanediamine / bis (3-methyl-4-aminocyclohexyl).
• the amorphous polyamide also includes those in which the benzene ring of terephthalic acid and / or isophthalic acid is replaced with an alkyl group or a halogen atom.
• Amorphous polyamide may be used alone or in combination of two or more.
• inorganic filler (B) examples include carbon nanotubes, fullerene, talc, wallastonite, zeolite, sericite, mica, kaolin, clay, pyrophyllite, silica, bentonite, alumina silicate, silicon oxide, magnesium oxide, and alumina.
• carbon nanotubes fullerene, talc, wallastonite, zeolite, sericite, mica, kaolin, clay, pyrophyllite, silica, bentonite, alumina silicate, silicon oxide, magnesium oxide, and alumina.
• the inorganic filler (B) is selected from at least a glass fiber having a circular cross section or a glass fiber having a non-circular cross section from the viewpoint of the molding processability of the polyamide resin composition and the mechanical strength of the molded body of the polyamide resin composition. It is preferably one type (hereinafter, these may be simply abbreviated as glass fiber).
• the cross-sectional shape of the glass fiber having a circular cross section is, for example, a perfect circle or a substantially circular shape.
• the cross-sectional shape of the glass fiber having a non-circular cross section is, for example, a cocoon shape in which the central portion in the longitudinal direction of the cross section is constricted, an oval shape having a portion substantially parallel to a position symmetrical with respect to the center of gravity of the cross section, or an elliptical shape. Is.
• the inorganic filler (B) is a glass fiber having a circular cross section and a glass fiber having a non-circular cross section from the viewpoint of the molding processability of the polyamide resin composition and the mechanical strength of the molded body of the polyamide resin composition. Is preferable.
• the inorganic filler (B) is a glass fiber having a circular cross section and a glass fiber having a non-circular cross section
• the outer peripheral length of the cross section of the glass fiber having a non-circular cross section is the same as that of the glass fiber having a non-circular cross section.
• the cross-sectional area is preferably 1.05 to 1.8 times the outer peripheral length of the glass fiber having a circular cross section.
• the inorganic filler (B) is a glass fiber having a circular cross section and a glass fiber having a non-circular cross section
• the ratio of the contents thereof is not particularly limited, but the glass fiber having a circular cross section / non-circular.
• the mass ratio of the glass fiber having a cross section is preferably 20/80 to 80/20, more preferably 30/70 to 60/40, and even more preferably 30/70 to 50/50.
• the average fiber length of the glass fiber is preferably 1.0 to 10 mm, more preferably 1.0 to 7.0 mm, still more preferably 2.0 to 4.0 mm.
• the average fiber diameter of the glass fiber is preferably 6 to 20 ⁇ m, more preferably 7 to 16 ⁇ m, still more preferably 8 to 14 ⁇ m, from the viewpoint of flame retardancy, mechanical strength, and appearance of the molded product of the polyamide resin composition.
• the average fiber length and average fiber diameter of glass fibers can be determined by measuring the fiber length and fiber diameter of each of 400 glass fibers arbitrarily selected by image analysis using an electron microscope and using the weight average value of each. can.
• the polyamide resin composition contains 45 to 120 parts by mass of the inorganic filler (B) with respect to 100 parts by mass of the polyamide (A).
• the content of the inorganic filler (B) is 45 parts by mass or more, the molded product of the polyamide resin composition has sufficient strength, and strength that can withstand practical use such as a connector can be obtained. Further, when the content is 120 parts by mass or less, the fluidity of the polyamide resin composition becomes good, the molding processability is excellent, and the compound productivity is also excellent.
• the content of the inorganic filler (B) is preferably 48 parts by mass or more, more preferably 50 parts by mass or more.
• the content of the inorganic filler (B) is preferably 100 parts by mass or less, more preferably 80 parts by mass or less.
• the polyamide resin composition is a halogen-free polyamide that provides a molded product having excellent flame retardancy by containing 25 to 40 parts by mass of phosphinate (C) with respect to 100 parts by mass of polyamide (A). It can be a resin composition.
• the phosphinate (C) is at least one represented by the following formula (I) or the following formula (II). That is, the phosphinate (C) is a phosphinate represented by the following formula (I), a diphosphinate represented by the following formula (II), or a mixture thereof.
• R 1 , R 2 , R 4 and R 5 each independently represent a linear or branched alkyl group having 1 to 16 carbon atoms.
• an alkyl group having 1 to 8 carbon atoms is preferable, and a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a tert-butyl group, an n-pentyl group, and an n-octyl group. It is more preferable that it is an ethyl group, and it is further preferable that it is an ethyl group.
• R 1 and R 2 and R 4 and R 5 may be combined with each other to form a ring.
• R 3 is a linear or branched alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 10 carbon atoms, an alkyl arylene group having 7 to 20 carbon atoms, and a cycloalkylene group having 3 to 10 carbon atoms. It represents a group, an aralkylene group having 7 to 10 carbon atoms, or an arylalkylene group having 7 to 20 carbon atoms.
• Examples of the linear or branched alkylene group having 1 to 10 carbon atoms include a methylene group, an ethylene group, an n-propylene group, an isopropylene group, an isopropylidene group, n-butylene, tert-butylene group and n-. Examples thereof include a pentylene group and an n-octylene group. Examples of the arylene group having 6 to 10 carbon atoms include a phenylene group and a naphthylene group.
• alkylarylene group having 7 to 10 carbon atoms examples include a methylphenylene group, an ethylphenylene group, a tert-butylphenylene group, a methylnaphthylene group, an ethylnaphthylene group and a tert-butylnaphthylene group.
• Examples of the cycloalkylene group having 3 to 10 carbon atoms include a cyclohexylene group and a cyclohexadimethylene group.
• Examples of the aralkylene group having 7 to 10 carbon atoms include a phenylene methylene group, a phenylene ethylene group, and a xylylene group.
• Examples of the arylalkylene group having 7 to 20 carbon atoms include a phenylmethylene group, a phenylethylene group, a phenylpropylene group, and a phenylbutylene group.
• M represents calcium, aluminum, magnesium, or zinc, and aluminum and zinc are preferable, and aluminum is more preferable.
• m is an integer of 1 to 4.
• n is an integer of 1 to 4.
• Examples of the phosphinic acid constituting the phosphinate (C) include dimethylphosphinic acid, ethylmethylphosphinic acid, diethylphosphinic acid, methyl-n-propylphosphinic acid, isobutylmethylphosphinic acid, octylmethylphosphinic acid, and methylphenylphosphine. Acids and diphenylphosphinic acids are mentioned, with diethylphosphinic acid being preferred.
• phosphinate represented by the above formula (I) include calcium dimethylphosphinate, magnesium dimethylphosphinate, aluminum dimethylphosphinate, zinc dimethylphosphinate, calcium ethylmethylphosphinate, magnesium ethylmethylphosphinate, and ethyl.
• diphosphinic acid constituting the diphosphinate examples include methanedi (methylphosphinic acid) and benzene-1,4-di (methylphosphinic acid).
• specific examples of the diphosphinate represented by the above formula (II) include calcium methanedi (methylphosphinic acid), magnesium methanedi (methylphosphinic acid), aluminum methanedi (methylphosphinic acid), zinc methanedi (methylphosphinic acid), and benzene.
• phosphinate (C) one type may be used alone, or a plurality of types may be used in combination.
• phosphinate (C) aluminum diethylphosphinate, zinc diethylphosphinate, aluminum methanedi (methylphosphinic acid), and zinc methanedi (methylphosphinic acid) are preferable from the viewpoint of even more excellent flame retardancy. Of these, aluminum diethylphosphinate is more preferable.
• the number average particle size of the phosphinate (C) is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less, further preferably 40 ⁇ m or less, from the viewpoint of flame retardancy, mechanical strength, and appearance of the molded product of the polyamide resin composition. preferable.
• the lower limit of the number average particle size is preferably 1 ⁇ m or more, more preferably 5 ⁇ m or more, and even more preferably 10 ⁇ m or more.
• the polyamide resin composition contains 25 to 40 parts by mass of phosphinate (C) with respect to 100 parts by mass of polyamide (A).
• the content of the phosphinate (C) is 25 parts by mass or more, the molded product of the polyamide resin composition has excellent flame retardancy.
• the content is 40 parts by mass or less, the polyamide resin composition is excellent in molding processability, and the molded product of the polyamide resin composition is excellent in mechanical strength.
• the content of the phosphinate (C) is preferably 26 parts by mass or more, more preferably 27 parts by mass or more.
• the content of the phosphinate (C) is preferably 38 parts by mass or less, more preferably 35 parts by mass or less.
• the polyamide resin composition can exhibit excellent flame retardancy by containing 2 to 15 parts by mass of phosphite (D) with respect to 100 parts by mass of polyamide (A), and further, polyamide.
• the melt kneading and molding process of the resin composition are improved.
• the phosphite (D) is not particularly limited, and is, for example, sodium phosphite, potassium phosphite, calcium phosphite, zinc phosphite, ammonium phosphite, aluminum phosphite, and hydrogen phosphite. Examples include aluminum. Aluminum phosphite and aluminum hydrogen phosphite are preferable from the viewpoint of exhibiting even more excellent flame retardancy.
• One type of phosphite (D) may be used alone, or a plurality of types may be used in combination.
• the polyamide resin composition contains 2 to 15 parts by mass of phosphite (D) with respect to 100 parts by mass of polyamide (A).
• the content of the phosphite (D) is 2 parts by mass or more, the molded product of the polyamide resin composition has excellent flame retardancy.
• the content is 15 parts by mass or less, the polyamide resin composition is excellent in molding processability, and the molded product of the polyamide resin composition is excellent in mechanical strength.
• the content of the phosphite (D) is preferably 2.5 parts by mass or more, more preferably 3 parts by mass or more.
• the content of the phosphite (D) is preferably 13 parts by mass or less, more preferably 10 parts by mass or less.
• the total amount of the phosphinate (C) and the phosphite (D) is preferably 16 to 25% by mass with respect to 100% by mass of the polyamide resin composition.
• the total content of the phosphinate (C) and the phosphite (D) is 16% by mass or more
• the molded product of the polyamide resin composition has excellent flame retardancy.
• the total content is 25% by mass or less, the polyamide resin composition is excellent in molding processability, and the molded product of the polyamide resin composition is excellent in mechanical strength.
• the total content is preferably 16.5% by mass or more, more preferably 17% by mass or more.
• the total content is preferably 23% by mass or less, more preferably 22.5% by mass or less.
• the mass ratio (C) / (D) of the phosphinate (C) to the phosphite (D) is preferably 70/30 to 94/6.
• the mass ratio is in the above range, the molded product of the polyamide resin composition has excellent flame retardancy.
• the mass ratio is preferably 75/25 to 93/7, more preferably 80/20 to 92/8.
• the colorant (E) By adding the colorant (E) to the polyamide resin composition, various colors can be expressed, and visibility and decorativeness can be imparted.
• the colorant (E) is not particularly limited, and examples thereof include organic colorants such as organic dyes and organic pigments, and inorganic colorants such as inorganic pigments.
• the colorant (E) does not contain carbon black.
• the colorant (E) contains an organic colorant.
• the colorant (E) may be an organic colorant.
• the colorant (E) contains an inorganic colorant.
• the colorant (E) may be an inorganic colorant.
• organic dyes examples include anthraquinone dyes, perinone dyes, anthrapyridone dyes, methine dyes, azine dyes, azo dyes, azomethine dyes, phthalocyanine dyes, quinoneimine dyes, quinoline dyes, and nitro dyes. , Indigo dyes, oxazine dyes and the like.
• anthraquinone dyes, perinone dyes, anthrapyridone dyes, and phthalocyanine dyes are preferable from the viewpoint of heat resistance, color development, and compatibility withstand the reflow process, and anthraquinone dyes, perinone dyes, etc.
• anthraquinone dyes are more preferred.
• Specific examples of the anthraquinone dye include, for example, Solvent Red 169, Solvent Red 172, Solvent Orange 63, Solvent Blue 101, Solvent Blue 102, Solvent Yellow 98 and the like.
• Specific examples of the perinone dye include Solvent Red 179 and the like.
• Specific examples of the anthrapyridone dye include Solvent Red 52 and the like.
• Specific examples of the azine dye include a niglosin compound such as Solvent Black 5.
• Specific examples of the phthalocyanine dye include Solvent Blue 38 and the like.
• Solvent Red 52, Solvent Red 169, Solvent Red 172, Solvent Red 179, and Solvent Blue 101 are preferable, and Solvent Red 52 and Solvent Red 179 are preferable from the viewpoint of flame retardancy of the molded product of the polyamide resin composition. Is more preferable.
• organic pigments examples include azo pigments such as azo lake pigments, insoluble monoazo pigments, insoluble disazo pigments and chelate azo pigments, phthalocyanine pigments, perylene pigments, perinone pigments, anthraquinone pigments, quinacridone pigments, dioxazine pigments and thioindigo.
• azo pigments such as azo lake pigments, insoluble monoazo pigments, insoluble disazo pigments and chelate azo pigments, phthalocyanine pigments, perylene pigments, perinone pigments, anthraquinone pigments, quinacridone pigments, dioxazine pigments and thioindigo.
• examples thereof include based pigments, isoindolinone based pigments, quinophthalone based pigments, diketopyrrolopyrrole based pigments, benzimidazolone based pigments, slene pigments and the like.
• azo pigments and phthalocyanine pigments are preferable, and phthalocyanine pigments are more preferable, from the viewpoints of heat resistance, color development, and compatibility that can withstand the reflow process.
• Specific examples of the phthalocyanine pigment include Pigment Blue 15, and Pigment Blue 15 is preferable from the viewpoint of flame retardancy of the molded product of the polyamide resin composition.
• the content of the organic colorant in the colorant (E) is preferably 0.01 to 100% by mass, more preferably 1 to 100% by mass, from the viewpoint of obtaining a polyamide resin composition having excellent visibility.
• the inorganic pigment examples include metal oxides such as titanium oxide (TIO, Ti 2 O 3 , TiO 2 ), zinc oxide (Pb 3 O 4 ), iron oxide (Fe 2 O 3 ), antimony oxide, and zircon oxide, and ultra. Marine (Pigment Blue 29), Zinc Sulfide, Zinc Phosphate, Barium Sulfate, Manganese Phosphate, Cobalt Aluminate, Cobalt Stinate, Cobalt Zincate, Antimon Oxide, Antimon Sulpide, Serium Sulfide, Lantern Sulfide, Chromium Oxide, Chromic Acid Contains multiple oxides such as zinc, nickel, bismuth, vanadium, molybdenum, cadmium, titanium, zinc, manganese, cobalt, iron, chromium, antimony, magnesium, and aluminum.
• Examples include composite metal oxides.
• Specific examples of the composite metal oxide include Pigment Yellow 53, Pigment Green 50, Pigment Brown 24, Pigment Blue 28, Pigment Blue 36, and the like.
• metal oxides and composite metal oxides are preferable, and from the viewpoint of flame retardancy of the molded product of the polyamide resin composition, titanium oxide (TIO, Ti 2 O 3 , TiO 2 ) and iron oxide (Fe 2 O) are preferable. 3 ), Pigment Yellow 53, Pigment Green 50, Pigment Brown 24 are more preferable.
• the content of the inorganic colorant in the colorant (E) is preferably 20 to 100% by mass, more preferably 30 to 100% by mass, still more preferably 50 to 50, from the viewpoint of obtaining a polyamide resin composition having excellent visibility. It is 100% by mass.
• the colorant (E) one type may be used alone or a plurality of types may be used in combination, but from the viewpoint of providing a polyamide resin composition having abundant color variations, the colorant (E) may be used. It is preferable to contain an organic colorant and an inorganic colorant.
• the weight ratio of the organic colorant to the inorganic colorant is preferably 1/1 to 1/30, preferably 1/1 to 1/. 15 is more preferable.
• the colorant (E) may be in any form of powder, liquid, or masterbatch.
• wax may be added or pre-kneaded to improve dispersibility.
• the content of the colorant (E) is as long as it is an organic colorant with respect to 100% by mass of the polyamide resin composition. It is preferably 0.001 to 5.0% by mass, more preferably 0.01 to 3.0% by mass, and if it is an inorganic colorant, it is preferably 0.01 to 5.0% by mass, more preferably 0. It is 0.05 to 5.0% by mass.
• the polyamide resin composition can contain other components such as a resin other than the polyamide (A), an antioxidant, and a mold release agent as long as the effects of the present invention are not impaired.
• Resins other than the polyamide (A) include, for example, polycarbonate; modified polyphenylene ether; polyphenylene oxide; polyacetal; polyphenylene sulfide (PPS); polysulfone; polyethersulfone; polysulfone; polyallylate; cyclic polyolefin; polyetherimide; syndiotactic.
• the antioxidant include hindered phenol compounds, phosphorus compounds, lactone compounds, hydroxyl compounds and the like.
• the release agent include silicone-based, fluorine-based, long-chain alkyl-based, fatty acid amide-based, and the like.
• the polyamide resin composition further comprises, if necessary, a heat stabilizer, a light stabilizer, a styrene-maleic anhydride copolymer (SMA), a lubricant, a nucleating agent, a crystallization retarder, an antioxidant, an antistatic agent.
• Other components such as an agent, a radical inhibitor, a matting agent, an ultraviolet absorber, an anti-drip agent, and a slidability-imparting agent may be further contained.
• the content of other components in the polyamide resin composition may be as long as it does not impair the effects of the present invention, but from the viewpoint of flame retardancy of the molded product of the polyamide resin composition, it is preferably 10% by mass or less. It is preferably 5% by mass or less.
• the sulfur element content in the polyamide resin composition of the present invention is less than 220 mass ppm.
• the sulfur element content in the polyamide resin composition is preferably less than 210 mass ppm, more preferably less than 200 mass ppm, from the viewpoint of flame retardancy of the molded product of the polyamide resin composition. Further, from the viewpoint of ease of production, it is preferably 20 mass ppm or more, more preferably 50 mass ppm or more, and further preferably 70 mass ppm or more.
• the total content of the polyamide (A), the inorganic filler (B), the phosphinate (C), the phosphite (D), and the colorant (E) is based on 100% by mass of the polyamide resin composition. It is preferably 90 to 99.9% by mass, more preferably 95 to 99.9% by mass, and even more preferably 95 to 99.7% by mass. When the total content is in the above range, it is suitable as a polyamide resin composition that gives a molded product having more excellent flame retardancy.
• the tensile breaking strength is 80 MPa or more, preferably 90 MPa or more, more preferably 90 MPa or more in a tensile test based on ISO 527. It is 100 MPa or more.
• the polyamide resin composition of the present invention has a ⁇ E larger than 1 represented by the following formula (1), and if ⁇ E is larger than 1, the visibility is excellent. Further, in the polyamide resin composition of the present invention, the inorganic filler (B) and the colorant (E) can be selected so as to satisfy this requirement.
• ⁇ E [(L * col -L * nat ) 2 + (a * col -a * nat ) 2 + (b * col -b * nat ) 2 ] 1/2 (1)
• ⁇ E is a color difference defined by the CIE1976 (L * a * b *) color system.
• L * col , a * col , and b * col are L * , a * , and b * defined by the CIE1976 (L * a * b * ) color system of the polyamide resin composition of the present invention.
• L * of L * col defined by CIE1976 (L * a * b *) color system of the polyamide resin composition of the present invention
• a * is a * col
• in b * is b * col be.
• CIE1976 (L * a * ) of the colorant-free polyamide resin composition having the same composition as the polyamide resin composition except that L * nat , a * nat , and b * nat do not contain the colorant (E).
• ⁇ E represented by the formula (1) is preferably greater than 3, more preferably greater than 10, and even more preferably greater than 30 from the viewpoint of enhancing visibility.
• the method for producing the polyamide resin composition is not particularly limited, and a known method can be used.
• the obtained polyamide resin composition contains 45 to 120 parts by mass of the inorganic filler (B) with respect to 100 parts by mass of the polyamide (A) having a melting point of 280 ° C. or higher, according to the formula (I) or the formula (II).
• the colorant (E) and other components to be blended as needed are dry-blended and kneaded to produce a polyamide resin composition.
• the method of melt-kneading is not particularly limited, and a method capable of uniformly mixing the above components can be preferably adopted.
• a single-screw extruder, a twin-screw extruder, a kneader, a Banbury mixer and the like are preferable, and a twin-screw extruder is more preferable from the viewpoint of good dispersibility of flame retardants and colorants and industrial productivity.
• pelletized products can be subjected to various molding methods to obtain a molded product.
• the molding method of the molded body may be appropriately selected depending on the intended use, but methods such as injection molding, extrusion molding, hollow molding, compression molding, press molding, and calendar molding can be adopted.
• the polyamide resin composition of the present embodiment is suitable as an injection molded product used for applications having a surface mounting process because it can withstand a reflow process and provides a molded product having excellent flame retardancy. Is.
• the polyamide resin composition of the present embodiment has heat resistance that can withstand the reflow process and provides a molded body having excellent flame retardancy, an FPC connector, a BtoB connector, a card connector, an SMT connector, a coaxial connector, and the like.
• External connection terminals such as memory card connectors; SMT relays; SMT bobbins; sockets such as memory sockets and CPU sockets; switches such as command switches and SMT switches; sensors such as rotation sensors and acceleration sensors; It is useful as an automobile part such as a body, an insulator, an in-vehicle connector, an engine mount, an intercooler, and a bearing retainer. It is useful.
• the molded product obtained from the polyamide resin composition of the present embodiment exhibits excellent flame retardancy, it can be suitably used for applications of SMT connectors or SMT relays.
• Examples of the electronic device provided with the molded product obtained from the polyamide resin composition of the present embodiment include, but are not limited to, portable electronic devices such as smartphones and personal computers, automobiles, and the like.
• the melting point and glass transition temperature of the polyamide (A) used in Examples and Comparative Examples were measured according to the methods shown below.
• the melting point of the polyamide (PA9T described later) used as the polyamide (A) is 10 ° C. from 30 ° C. to 360 ° C. in a nitrogen atmosphere using a differential scanning calorimeter (DSC7020) manufactured by Hitachi High-Tech Science Co., Ltd. It was determined by setting the peak temperature of the melting peak that appears when the temperature was raised at a rate of / min as the melting point (° C.). When there are a plurality of melting peaks, the peak temperature of the melting peak on the highest temperature side is defined as the melting point. Then, the sample was held at a temperature 30 ° C.
• the glass transition temperature was defined as the midpoint at which the DSC curve changed stepwise when the temperature was raised to a temperature 30 ° C. higher than the melting point at a rate of 10 ° C./min again.
• Agent-1, antioxidant-2, mold release agent, and lubricant are supplied from the most upstream hopper, and the amounts of the inorganic filler (B), phosphinate (C), and sub The phosphate (D) and the colorant (E) were supplied from the side feeder and melt-kneaded.
• the melt-kneaded polyamide resin composition was extruded into a strand shape, cooled and then cut to obtain pellets of the polyamide resin composition.
• the blending amounts of the polyamide (A), the inorganic filler (B), the phosphinate (C), the phosphite (D), and the colorant (E) in Table 1 all mean "parts by mass”. .. Using the obtained pellets, the molded product was evaluated [flame retardancy, mechanical strength, sulfur content, color value] by the following method. The results are shown in Table 2.
• T is 50 seconds or less and M is 10 seconds or less and does not burn to the clamp, and the flaming melt falls and does not ignite the dry cotton set 12 inches below, "V-0"
• T If the conditions are 250 seconds or less, M is 30 seconds or less, and the other conditions are the same as V-0, it is "V-1", T is 250 seconds or less, M is 30 seconds or less, and it does not burn to the clamp, and it melts with flame. If an object falls and ignites cotton 12 inches below, it will be "V-2".
• the sulfur element content (mass ppm) of the polyamide resin composition obtained in each Example and Comparative Example was measured with the following equipment and conditions.
• the pellets of the polyamide resin composition obtained in each Example and Comparative Example were spread over an aluminum cup and measured as a sample.
• Measuring device Scanning fluorescence X-ray analyzer ZSX Primus ⁇ manufactured by Rigaku Co., Ltd.
• X-ray tube Rh rhodium 3.0kW ⁇ Analysis diameter: ⁇ 30 mm ⁇ Atmosphere: Vacuum ⁇ Sample spin: Yes ⁇ Measurement mode: FP method ⁇ Filter: OUT ⁇ Thin film for analysis window: 0.7 ⁇ m PET ⁇ Slit: Standard ⁇ Spectral crystal: Ge ⁇ Detector: Proportional counter (proportional counter)
• Measuring device RAL gGmbH colorimeter RAL COLORCATCH NANO Light source: CIE standard light source D65 Sensor: CCD camera (224 x 224 pixels) Measurement geometry: 45 ° / 0 ° Software: RAL iCOLOURS (version 3.7.2) Equipment used: Software used on iPhone 8 (iOS 13.3) From the obtained L * a * b * , ⁇ E represented by the following formula (1) was calculated.
• L * col , a * ncol , and b * col are L defined by the CIE1976 (L * a * b * ) color system of the polyamide resin composition obtained in each example.
• * , A * , and b * , and L * nat , a * nat , and b * nat do not contain a colorant, which is the same composition as the polyamide resin composition except that the colorant (E) is not contained.
• E-7 "Pigment Brown24” (brown inorganic colorant, CAS No. 68186-90-3)
• E-8 "Solvent Yellow 98” (yellow organic colorant, CAS No. 27870-92-4)
• E-9 "Solvent Orange 63” (orange organic colorant, CAS No. 16924-75-0)
• E-10 "Pigment Blue29” (blue inorganic colorant, CAS number 57455-37-5)
• E-11 "Zinc sulfide” (white inorganic colorant, CAS No. 1314-98-3)
• (C) + (D) is the total (% by mass) of the contents of the phosphinate (C) and the phosphite (D) with respect to 100% by mass of the polyamide resin composition. Is. Further, in Table 1, “(C) / (D)” is the mass ratio of phosphinate (C) to phosphite (D).
• the molded product of the colored polyamide resin composition of this embodiment is excellent in flame retardancy. Further, since the polyamide resin composition of the present embodiment uses the polyamide (A) having a melting point of 280 ° C. or higher, it can be said that it has heat resistance that can withstand the reflow process.
• the colored polyamide resin composition of the present embodiment has heat resistance that can withstand the reflow process and provides a molded body having excellent flame retardancy, the FPC connector, BtoB connector, card connector, SMT connector, and the like.
• External connection terminals such as coaxial connectors and memory card connectors; SMT relays; SMT bobbins; sockets such as memory sockets and CPU sockets; switches such as command switches and SMT switches; sensors such as rotation sensors and acceleration sensors; , ECU housing, insulator, in-vehicle connector, engine mount, intercooler, bearing retainer and other automobile parts.

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• 2021
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