WO2021200712A1 - ポリエステル、接着剤およびフィルム - Google Patents

ポリエステル、接着剤およびフィルム Download PDF

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Publication number
WO2021200712A1
WO2021200712A1 PCT/JP2021/013038 JP2021013038W WO2021200712A1 WO 2021200712 A1 WO2021200712 A1 WO 2021200712A1 JP 2021013038 W JP2021013038 W JP 2021013038W WO 2021200712 A1 WO2021200712 A1 WO 2021200712A1
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Prior art keywords
polyester
mol
component
acid component
adhesive
Prior art date
Application number
PCT/JP2021/013038
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
坂本　晃一
航 三浦
哲生 川楠
Original Assignee
東洋紡株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東洋紡株式会社 filed Critical 東洋紡株式会社
Priority to CN202180019416.6A priority Critical patent/CN115210288B/zh
Priority to JP2021536729A priority patent/JP7047977B2/ja
Priority to KR1020227033567A priority patent/KR20220161319A/ko
Publication of WO2021200712A1 publication Critical patent/WO2021200712A1/ja
Priority to JP2021205734A priority patent/JP7136312B2/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16—Dicarboxylic acids and dihydroxy compounds
    • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/181—Acids containing aromatic rings
    • C08G63/185—Acids containing aromatic rings containing two or more aromatic rings
    • C08G63/187—Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings
    • C08G63/189—Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings containing a naphthalene ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/52—Polycarboxylic acids or polyhydroxy compounds in which at least one of the two components contains aliphatic unsaturation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds

Definitions

  • the present invention relates to polyesters, adhesives and films. More specifically, the present invention relates to polyesters having excellent dielectric properties, and adhesives and films containing them.
  • Polyester is widely used as a raw material for resin compositions used in coating agents, inks, adhesives, etc., and is generally composed of a polyvalent carboxylic acid and a polyhydric alcohol. It is widely used in various applications such as coating agents and adhesives because it has flexibility by selecting and combining polyvalent carboxylic acid and polyhydric alcohol and can freely control the high and low molecular weight.
  • polyester has excellent adhesiveness to metals including copper, and has been used as an adhesive for flexible printed wiring boards (FPC) by blending a curing agent such as epoxy resin.
  • FPC flexible printed wiring boards
  • FPC Since FPC has excellent flexibility, it can be used for multi-functionality and miniaturization of personal computers (PCs) and smartphones, and is therefore often used for incorporating electronic circuit boards into narrow and complicated interiors. There is. In recent years, electronic devices have become smaller, lighter, higher in density, and have higher output, and due to these trends, the demand for the performance of wiring boards (electronic circuit boards) has become more and more sophisticated. In particular, as the speed of transmission signals in FPCs increases, the frequency of signals is increasing. Along with this, there is an increasing demand for FPCs having low dielectric properties (low dielectric constant, low dielectric loss tangent) in the high frequency region.
  • the base material used for FPC not only the conventional polyimide (PI) and polyethylene terephthalate (PET), but also the base film such as liquid crystal polymer (LCP) and syndiotactic polystyrene (SPS) having low dielectric properties.
  • PI polyimide
  • PET polyethylene terephthalate
  • SPS syndiotactic polystyrene
  • the polyester resin described in Patent Document 1 has a high relative permittivity and dielectric loss tangent, does not have the above-mentioned low dielectric properties, and is unsuitable for FPC in a high frequency region. Further, it cannot be said that the adhesive described in Patent Document 2 is excellent in heat resistance of the adhesive used for the reinforcing plate and the layers.
  • an object of the present invention is to provide a polyester having excellent solvent solubility, heat resistance, tackiness, low relative permittivity and dielectric loss tangent, and excellent dielectric properties, and an adhesive containing the same.
  • the present invention has the following configuration.
  • polyvalent carboxylic acid component and a polyhydric alcohol component as structural units, and when the polyvalent carboxylic acid component is 100 mol%, it contains 50 mol% or more of the naphthalene dicarboxylic acid component and 100 mol of the polyhydric alcohol component. %, A polyester containing 20 mol% or more of a dimerdiol component.
  • the polyester preferably has a glass transition temperature of ⁇ 30 ° C. or higher.
  • a film containing the polyester is a film containing the polyester.
  • the polyester of the present invention has excellent solvent solubility, heat resistance, tackiness, and dielectric properties. Therefore, it is suitable as an adhesive and a film for FPC in a high frequency region.
  • the polyester of the present invention has a chemical structure that can be obtained by a polycondensate of a polyvalent carboxylic acid component and a polyhydric alcohol component, and the polyvalent carboxylic acid component and the polyhydric alcohol component are one or more, respectively. It consists of selected ingredients of.
  • the polyester of the present invention contains 50 mol% or more of the naphthalene dicarboxylic acid component out of 100 mol% of the total polyvalent carboxylic acid component. It is preferably 70 mol% or more, more preferably 80 mol% or more, particularly preferably 90 mol% or more, and may be 100 mol% or more.
  • the dielectric property of polyester is improved by using a large amount of naphthalene carboxylic acid component.
  • naphthalenedicarboxylic acid component examples include 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 1,8-naphthalenedicarboxylic acid and the like. , Any of them can be used, and two or more kinds may be used. Of these, 2,6-naphthalenedicarboxylic acid is preferable because it is excellent in reactivity and availability during polymerization.
  • the polyester of the present invention can contain a polyvalent carboxylic acid component other than the naphthalene dicarboxylic acid component.
  • the polyvalent carboxylic acid component other than the naphthalenedicarboxylic acid component is not particularly limited, but the polyvalent carboxylic acid component is preferably an aromatic polyvalent carboxylic acid component or an alicyclic polyvalent carboxylic acid component, and is aromatic. It is more preferably a group dicarboxylic acid component or an alicyclic dicarboxylic acid component.
  • the aromatic dicarboxylic acid component is not particularly limited, but terephthalic acid, isophthalic acid, orthophthalic acid, 4,4'-dicarboxybiphenyl, 5-sodium sulfoisophthalic acid, or an ester thereof can be used.
  • the alicyclic dicarboxylic acid component is not particularly limited, but is 1,4-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid, tetrahydrophthalic acid anhydride, methyltetrahydrophthalic acid anhydride.
  • a substance, a hydrogenated naphthalenedicarboxylic acid, or the like can be used.
  • the polyester of the present invention contains 20 mol% or more of dimerdiol out of 100 mol% of the total polyhydric alcohol component. It is preferably 30 mol% or more, and more preferably 40 mol% or more. The use of a large amount of dimerdiol improves the dielectric properties and solvent solubility of polyester.
  • the dimer diol can be obtained by reducing the carboxyl groups of dimer acids having 20 to 48 carbon atoms obtained by dimerizing unsaturated fatty acids of C10 to 24 and saturated dimer acids obtained by hydrogenating them. .. Moreover, you may use vegetable oil as a raw material of dimerdiol. Further, the dimer diol may contain a trimmer which is a trimer of an unsaturated fatty acid of C10 to 24 or a saturated trimmer obtained by hydrogenating the trimmer.
  • the polyester of the present invention can contain a polyhydric alcohol component other than dimerdiol.
  • the polyhydric alcohol other than dimerdiol is not particularly limited, but is ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-.
  • the polyester of the present invention can also be copolymerized with a trivalent or higher polyvalent carboxylic acid component and / or a trivalent or higher polyhydric alcohol component.
  • the trivalent or higher valent carboxylic acid component include aromatic carboxylic acids such as trimellitic acid, pyromellitic acid, benzophenone tetracarboxylic acid, trimesic acid, trimellitic anhydride (TMA), and pyromellitic anhydride (PMDA). , 1, 2, 3, 4-Butantetracarboxylic acid and other aliphatic carboxylic acids, and one or more of these can be used.
  • trihydric or higher polyhydric alcohol component examples include glycerin, trimethylolpropane, trimethylolethane, pentaerythritol, ⁇ -methylglucose, mannitol, and sorbitol, and one or more of these may be used. It is possible. However, if the amount of copolymerization of the trivalent or higher-valent polycarboxylic acid component and / or the trivalent or higher-valent polyhydric alcohol component is large, the dielectric properties of the polyester may deteriorate, which is not preferable.
  • the dielectric loss tangent of the polyester of the present invention at 10 GHz is preferably 0.008 or less, more preferably 0.005 or less.
  • the relative permittivity of the polyester of the present invention at 10 GHz is preferably 3.0 or less, more preferably 2.6 or less.
  • the glass transition temperature of the polyester of the present invention is preferably ⁇ 30 ° C. or higher, more preferably ⁇ 20 ° C. or higher. By setting the glass transition temperature in the range of ⁇ 30 ° C. or higher, good dielectric properties are exhibited. Further, the tackiness (adhesiveness) of the resin surface tends to be suppressed, and the handleability of the resin is improved.
  • the glass transition temperature is preferably 100 ° C. or lower. By setting the glass transition temperature to 100 ° C. or lower, laminating can be performed even at a low temperature of about 80 ° C. Further, the lower the glass transition temperature, the better the adhesive strength tends to be.
  • a polyhydric carboxylic acid and a polyhydric alcohol are heated in the presence of a known catalyst, subjected to a dehydration esterification step, and then depolyhydric alcohol / heavy.
  • Method of performing condensation reaction 2) Method of heating alcohol ester of polyvalent carboxylic acid and polyhydric alcohol in the presence of a known catalyst, transesterification reaction, and then performing depolyhydric alcohol / polycondensation reaction 3) Solution
  • a method of performing polymerization and the like There is a method of performing polymerization and the like.
  • a part or all of the acid component may be replaced with an acid anhydride.
  • polyester of the present invention In producing the polyester of the present invention, conventionally known polymerization catalysts such as titanium compounds such as tetra-n-butyl titanate, tetraisopropyl titanate and titaniumoxyacetylcetonate, antimony trioxide, antimony such as tributoxyantimony and the like.
  • titanium compounds such as tetra-n-butyl titanate, tetraisopropyl titanate and titaniumoxyacetylcetonate
  • antimony trioxide antimony such as tributoxyantimony and the like.
  • Compounds, germanium compounds such as germanium oxide and tetra-n-butoxygermanium, and acetates such as magnesium, iron, zinc, manganese, cobalt, and aluminum can be used.
  • These catalysts may be used alone or in combination of two or more.
  • the number average molecular weight of the polyester of the present invention is preferably 5000 or more, and more preferably 10,000 or more. Further, it is preferably 100,000 or less, more preferably 50,000 or less, and further preferably 30,000 or less. When it is within the above range, it is preferable because it is easy to handle when dissolved in a solvent, the adhesive strength is good, and the dielectric property is excellent.
  • the acid value of the polyester of the present invention is preferably from 200 eq / 10 6 g, more preferably at most 100 eq / 10 6 g, more preferably at most 50eq / 10 6 g, 40eq / 10 particularly preferably 6 g or less, and most preferably not more than 30eq / 10 6 g.
  • a method for increasing the acid value of the polyester of the present invention for example, (1) after completion of the polycondensation reaction, a trivalent or higher polyvalent carboxylic acid and / or a trivalent or higher anhydrous polycarboxylic acid is added and reacted.
  • a trivalent or higher polyvalent carboxylic acid and / or a trivalent or higher anhydrous polycarboxylic acid is added and reacted.
  • methods (acid addition) and (2) methods such as (2) allowing heat, oxygen, water, etc. to act during the polycondensation reaction to intentionally alter the resin, and these can be performed arbitrarily.
  • the polyvalent carboxylic acid anhydride used for acid addition in the acid addition method is not particularly limited, but for example, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, 3,3', 4, Examples thereof include 4'-benzophenone tetracarboxylic acid dianhydride, 3,3,4,4-biphenyltetracarboxylic acid dianhydride, ethylene glycol bisamhydrotrimethylate, and one or more of these. It can be used. It is preferably trimellitic anhydride.
  • the polyester of the present invention can be used as an adhesive.
  • the polyester of the present invention since the polyester of the present invention has excellent dielectric properties, it is suitable as an adhesive for FPC in a high frequency region.
  • the polyester of the present invention can further contain a curing agent to form an adhesive composition.
  • a curing agent an epoxy resin, polyisocyanate, polycarbodiimide or the like can be used. By cross-linking with these curing agents, the cohesive force of the resin can be increased and the heat resistance can be improved.
  • Polyisocyanate is preferable because it has little effect on heat resistance and dielectric properties.
  • the content of the curing agent is preferably 0.1 part by mass or more, more preferably 0.5 part by mass or more, still more preferably 1 part by mass or more, and particularly, with respect to 100 parts by mass of polyester. It is preferably 2 parts by mass or more.
  • the value to the lower limit or more By setting the value to the lower limit or more, a sufficient curing effect can be obtained, and excellent adhesiveness and solder heat resistance can be exhibited. Further, it is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, further preferably 15 parts by mass or less, and particularly preferably 10 parts by mass or less.
  • the pot life property and the low dielectric property are improved. That is, within the above range, an adhesive composition having excellent low dielectric properties in addition to adhesiveness, solder heat resistance and pot life property can be obtained.
  • the polyester of the present invention can be used as a film.
  • the polyester of the present invention may be processed into a film as it is, or a film in which various fillers such as glass fiber and silica are dispersed may be processed into a film. You can also.
  • the thickness and shape of the film of the present invention are not particularly limited, and include a form often referred to as a sheet. Since the film of the present invention has excellent dielectric properties, it is suitable as a rigid substrate for high-speed transmission and a CCL base film for FPC.
  • a simple part means a mass part.
  • Example 1 Example of production of polyester (a1) 326 parts of dimethyl 2,6-naphthalenedicarboxylic acid, 1520 parts of dimerdiol (Croda, Pripol 2033) in a reaction vessel equipped with a stirrer, condenser, and thermometer, and tetrabutyl orthotitanate as a catalyst is total acid. 0.03 mol% was charged with respect to the components, the temperature was raised from 160 ° C. to 220 ° C. over 4 hours, and the esterification reaction was carried out through a dehydration step. Next, in the polycondensation reaction step, the pressure inside the system was reduced to 5 mmHg over 20 minutes, and the temperature was further raised to 250 ° C.
  • the glass transition temperature was -17 ° C.
  • the obtained polyester (a1) was evaluated for solvent solubility, tackiness, heat resistance, relative permittivity and dielectric loss tangent. The evaluation results are shown in Table 1.
  • Polyesters (a2) to (a14) were synthesized by changing the type of raw material and the blending ratio according to the production example of polyester (a1). The physical characteristics and evaluation results are shown in Table 1.
  • PTMG1000 is polytetramethylene ether glycol (average molecular weight 1000).
  • Polyester dissolved in toluene so as to have a solid content concentration of 30% by mass was applied to a Teflon (registered trademark) sheet having a thickness of 100 ⁇ m so as to have a thickness after drying of 25 ⁇ m, and dried at 130 ° C. for 3 minutes. Then, the Teflon (registered trademark) sheet was peeled off to obtain a resin sheet for testing. After that, the obtained test resin sheet was cut into strips of 8 cm ⁇ 3 mm to obtain a test sample.
  • the relative permittivity ( ⁇ c ) and the dielectric loss tangent (tan ⁇ ) were measured by a cavity resonator perturbation method using a network analyzer (manufactured by Anritsu) under the conditions of a temperature of 23 ° C. and a frequency of 10 GHz.
  • a polyester varnish dissolved in tacky toluene so as to have a solid content concentration of 30% by mass is applied to a polyester film (Toyobo E5101, thickness 50 ⁇ m, corona-treated surface) so that the thickness after drying is 25 ⁇ m, and 130 It was dried at ° C. for 3 minutes.
  • the dried adhesive sheet is cut to a width of 25 mm and a length of 200 mm, and the adhesive layer surface is attached to a rolled copper foil base material (manufactured by JX Metal Co., Ltd., BHY series), and 2 kg from the top.
  • the adhesive sheet was crimped by reciprocating twice at a speed of 20 mm / sec with the rubber roller of.
  • Solvent solubility The solubility of polyester dissolved in toluene with stirring at 80 ° C. for 6 hours so that the solid content concentration was 60% by mass or 50% by mass was evaluated according to the following criteria. ⁇ Evaluation criteria for solvent solubility> ⁇ : Completely dissolved without undissolved residue at a solid content concentration of 60% by mass ⁇ : Completely dissolved without undissolved residue at a solid content concentration of 50 mass% ⁇ : There is undissolved resin at a solid content concentration of 50 mass%
  • the polyester of the present invention is excellent in solvent solubility, heat resistance, and tackiness, has a low relative permittivity and dielectric loss tangent, and is useful as an adhesive and film for FPC in a high frequency region.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combined Devices Of Dampers And Springs (AREA)
  • Vehicle Body Suspensions (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
PCT/JP2021/013038 2020-03-30 2021-03-26 ポリエステル、接着剤およびフィルム WO2021200712A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202180019416.6A CN115210288B (zh) 2020-03-30 2021-03-26 聚酯、粘接剂及膜
JP2021536729A JP7047977B2 (ja) 2020-03-30 2021-03-26 ポリエステル、接着剤およびフィルム
KR1020227033567A KR20220161319A (ko) 2020-03-30 2021-03-26 폴리에스테르, 접착제 및 필름
JP2021205734A JP7136312B2 (ja) 2020-03-30 2021-12-20 ポリエステル、接着剤およびフィルム

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Application Number Priority Date Filing Date Title
JP2020-060683 2020-03-30
JP2020060683 2020-03-30

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WO2021200712A1 true WO2021200712A1 (ja) 2021-10-07

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JP (2) JP7047977B2 (enrdf_load_stackoverflow)
KR (1) KR20220161319A (enrdf_load_stackoverflow)
CN (1) CN115210288B (enrdf_load_stackoverflow)
TW (1) TWI864264B (enrdf_load_stackoverflow)
WO (1) WO2021200712A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022053533A (ja) * 2020-09-24 2022-04-05 三菱ケミカル株式会社 粘着剤組成物、粘着剤及び粘着剤層

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06128363A (ja) * 1992-10-16 1994-05-10 Toyobo Co Ltd 熱可塑性ポリエステルエラストマー
JP2011046771A (ja) * 2009-08-25 2011-03-10 Teijin Fibers Ltd ポリエステル樹脂組成物およびその製造方法ならびに成形体
JP2011048926A (ja) * 2009-08-25 2011-03-10 Teijin Fibers Ltd 電線被覆材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104813A (ja) 1992-09-18 1994-04-15 Canon Inc 無線電話機
US10471682B2 (en) 2014-09-24 2019-11-12 Toagosei Co., Ltd. Adhesive composition and laminate with adhesive layer using same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06128363A (ja) * 1992-10-16 1994-05-10 Toyobo Co Ltd 熱可塑性ポリエステルエラストマー
JP2011046771A (ja) * 2009-08-25 2011-03-10 Teijin Fibers Ltd ポリエステル樹脂組成物およびその製造方法ならびに成形体
JP2011048926A (ja) * 2009-08-25 2011-03-10 Teijin Fibers Ltd 電線被覆材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022053533A (ja) * 2020-09-24 2022-04-05 三菱ケミカル株式会社 粘着剤組成物、粘着剤及び粘着剤層
JP7173252B2 (ja) 2020-09-24 2022-11-16 三菱ケミカル株式会社 粘着剤組成物、粘着剤及び粘着剤層

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JP7136312B2 (ja) 2022-09-13
TWI864264B (zh) 2024-12-01
CN115210288A (zh) 2022-10-18
JPWO2021200712A1 (enrdf_load_stackoverflow) 2021-10-07
CN115210288B (zh) 2024-10-22
KR20220161319A (ko) 2022-12-06
TW202146519A (zh) 2021-12-16
JP7047977B2 (ja) 2022-04-05
JP2022033184A (ja) 2022-02-28

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