WO2021196338A1 - 一种半导体制冷片及脱毛仪 - Google Patents

一种半导体制冷片及脱毛仪 Download PDF

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Publication number
WO2021196338A1
WO2021196338A1 PCT/CN2020/088872 CN2020088872W WO2021196338A1 WO 2021196338 A1 WO2021196338 A1 WO 2021196338A1 CN 2020088872 W CN2020088872 W CN 2020088872W WO 2021196338 A1 WO2021196338 A1 WO 2021196338A1
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WO
WIPO (PCT)
Prior art keywords
air
fan
lamp tube
hair removal
cavity
Prior art date
Application number
PCT/CN2020/088872
Other languages
English (en)
French (fr)
Inventor
赵凤球
Original Assignee
深圳市予一电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市予一电子科技有限公司 filed Critical 深圳市予一电子科技有限公司
Priority to CN202080002020.6A priority Critical patent/CN112055799B/zh
Publication of WO2021196338A1 publication Critical patent/WO2021196338A1/zh

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00—Radiation therapy
    • A61N5/06—Radiation therapy using light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

Definitions

  • the invention relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration sheet and a hair removal device.
  • Semiconductor refrigeration fins or thermoelectric refrigeration fins or heat pumps are equipped with insulating ceramic sheets, and the integral circuit of the NP semiconductor electric couple connected by a conductor is used as the refrigeration layer.
  • the cold and hot faces of the refrigeration layer are respectively connected with
  • the contact surface between the ceramic sheets is coated with a layer of thermally conductive silicone grease to maintain good contact.
  • Semiconductor refrigeration sheets have been widely used in the coolers of beauty instruments, especially the coolers of pulsed light hair removal instruments.
  • sapphire In the freezing point hair removal devices currently on the market, sapphire is used on the head in contact with the skin, and a semiconductor refrigeration sheet is arranged on the side of the sapphire to cool the sapphire to form an ice compress effect.
  • the contact surface between the ceramic sheet and the sapphire is also coated with a layer of thermal conductive silicone grease.
  • the cold surface of the semiconductor refrigeration sheet needs to pass through the ceramic sheet and the thermal conductive silicone grease layer to cool the sapphire. The cooling efficiency is greatly reduced, and the cooling effect is greatly reduced. Bad.
  • the main purpose of the present invention is to provide a semiconductor refrigeration sheet to solve the problems of low refrigeration efficiency and poor refrigeration effect of the existing semiconductor refrigeration sheet.
  • Another object of the present invention is to provide a hair removal device to solve the problem of low cooling efficiency of the existing hair removal device.
  • the present invention provides a semiconductor refrigeration sheet comprising a semiconductor galvanic layer formed by connecting a semiconductor galvanic couple with a metal conductor; the cold surface of the semiconductor refrigeration sheet is made of transparent crystals, thereby forming a transparent crystal cold surface; The inner surface of the cold crystal surface is fixedly connected with the metal conductor.
  • the hot surface of the semiconductor refrigeration sheet is composed of a ceramic substrate; the inner surface of the ceramic substrate is fixedly connected to the metal conductor of the semiconductor galvanic layer; the ceramic substrate and the transparent crystal connect the metal conductor to the semiconductor galvanic couple to form a semiconductor galvanic coupler clip
  • the semiconductor refrigeration sheet is jointly formed inside; the semiconductor galvanic double layer is connected with positive and negative electrodes.
  • the semiconductor galvanic layer has a ring shape, and electronic components are arranged in the ring area, and the inner hollow area is for light to penetrate;
  • the ceramic substrate is ring shape, the ring area is used as a heat dissipation surface, and the inner hollow area is for light to penetrate;
  • the ring shape fits with the ring shape of the semiconductor galvanic layer, and the inner hollow area is correspondingly connected.
  • the transparent crystal cold surface covers the entire surface of the semiconductor galvanic layer to form an entire surface cooling; the thickness of the transparent crystal layer is not less than 1 mm.
  • the middle area of the cold surface of the transparent crystal is a light-transmitting area, and the ring-shaped area at the periphery of the light-transmitting area fits the semiconductor galvanic layer;
  • the light-transmitting area of the cold surface of the transparent crystal It is covered on the inner hollow area of the semiconductor galvanic layer and can be penetrated by light;
  • the entire cooling area of the cold surface of the transparent crystal includes the light-transmitting area and the ring-shaped area around the light-transmitting area;
  • the ring of the cold surface of the transparent crystal After shading treatment, the surface of the area forms an annular shading area for shielding the internal electronic components;
  • the edge of the transparent crystal cold surface forms an assembly position, and the assembly position is used for fixed assembly with the outer casing.
  • one or both sides of the annular area of the cold surface of the transparent crystal are subjected to surface shading treatment to form an annular shading area; the assembly position is a hypotenuse or a stepped surface.
  • the present invention also provides a hair removal instrument, which includes a shell and a hair removal working head, a lamp tube assembly, a heat dissipation assembly and a control circuit board installed in the shell; the control circuit board is electrically connected with the lamp tube assembly; the hair removal working head is installed There are the semiconductor refrigeration sheet as described above; the transparent crystal cold surface of the semiconductor refrigeration sheet is also used as a hair removal working surface in contact with the skin; the control circuit board controls the lamp tube assembly to generate pulsed light to penetrate the semiconductor refrigeration sheet to perform hair removal deal with.
  • the heat dissipation assembly includes a heat pipe, a radiator connected to the heat pipe, and a fan; the housing is provided with a first air inlet and an air outlet; the heat pipe is connected to the hot surface of the cooling fin, thereby connecting the cooling fin The generated heat is conducted to the heat dissipation component for heat dissipation; the fan is installed in a cavity, one side of the cavity extends through the air path to form an air outlet channel, and the end of the air outlet channel is connected to the air outlet; the first air inlet, The space on the surface of the radiator, the cavity where the fan is installed, the air outlet channel, and the air outlet communicate with each other to form an air-cooled heat dissipation channel of the radiator; by starting the fan work, the radiator can be air-cooled and dissipated by sucking in cold air .
  • one side of the cavity obliquely extends toward the air outlet to form an inclined air outlet channel;
  • the housing is provided with an opening, and the radiator is installed inside the housing and located behind the opening;
  • the opening The outer cover is provided with a baffle; a gap is reserved between the baffle and the edge of the opening of the shell; the gap forms a lateral air inlet to the surface of the radiator; one or more groups of air holes are opened on the baffle;
  • the first air inlet includes a lateral air inlet formed by the gap and the one or more groups of air holes; the gap between the baffle and the edge of the opening of the housing also forms the air outlet on one side;
  • the air outlet is connected with the end of the air outlet channel of the cavity to discharge hot air laterally;
  • the hair removal device works by starting the fan, and the first air inlet sucks in cold air to the space on the surface of the radiator, taking away the surface of the radiator The heat of the radiator forms hot air, which is sucked into the cavity where the fan is
  • the radiator is a finned radiator; the radiator and the fan are installed up and down; the air duct on the surface of the radiator communicates with the air inlet of the fan for sucking the hot air on the surface of the radiator into the fan installed In the cavity;
  • the heat dissipation assembly further includes a heat conducting element; the heat conducting element and the refrigeration sheet are in conformity with the shape and are in close contact with each other; the heat pipe is wound to form a ring shape, and the heat conducting element and the ring shape of the heat pipe are sleeved to form an annular sticker In contact with each other, the heat generated by the cooling fins is transferred from the heat-conducting element to the heat pipe for heat dissipation, thereby realizing the cooling of the cooling fins.
  • the heat dissipation component is also used for heat dissipation of the lamp tube assembly; a second air inlet is provided on the housing corresponding to the lamp tube assembly, and the second air inlet communicates with the space air path on the surface of the lamp tube assembly; The second air inlet, the space on the surface of the lamp tube assembly, the cavity where the fan is installed, the air outlet channel, and the air outlet communicate with each other to form an air-cooled heat dissipation channel for the lamp tube assembly; The second air inlet sucks in cold air to the surface of the lamp tube assembly, and takes away the heat from the surface of the lamp tube assembly to form hot air. The fan discharges the hot air from the air outlet channel and the air outlet to realize air cooling and heat dissipation of the lamp tube assembly.
  • the outer cover of the lamp tube assembly is provided with an air guide cover, and the interval between the air guide cover and the lamp tube assembly forms an air-cooled cavity for heat dissipation of the light tube assembly;
  • the air-cooled cavity corresponds to the The space on the surface of the lamp tube assembly;
  • the air path between the air-cooled cavity and the cavity where the fan is installed passes through, and is also in communication with the air path between the second air inlet;
  • the lamp tube assembly is installed on the lamp tube bracket;
  • the lamp tube holder is installed in the housing and located behind the hair removal head; at least one ventilation pipe is arranged in the lamp holder, and the ventilation pipe penetrates up and down from the second air inlet to the space on the surface of the lamp assembly, thereby The space on the surface of the lamp tube assembly is connected to the second air inlet.
  • the lamp tube assembly includes a lamp tube and a reflector cup covered by the lamp tube; the air-cooled cavity is a space defined between the air guide cover and the reflector cup of the lamp tube; the reflector cup is thermally conductive Made of material; the shape and size of the wind deflector are adapted to the reflector cup and installed close to the outer surface of the reflector; the shape of the wind deflector covered on one side of the reflector cup is horn-shaped, and the other side is provided with Hollow connecting end; the hollow connecting end is connected to the air-cooled cavity, and is also connected to the air circuit of the cavity where the fan is installed; the width of the hollow connecting end is designed to maximize the principle to facilitate the rapid flow of gas; the lamp holders are respectively provided with wind shields
  • the windshield is arranged obliquely toward the surface of the reflector, and is used to guide the cold air sucked in by the second air inlet to the surface of the reflector; the windshield is also used to block light to avoid light leakage ;
  • the air guide hood is connected to the sealing element; one side of the sealing element is provided with an air guide connecting pipe; one end of the air guide connecting pipe communicates with the hollow connecting end of the air guide hood so as to communicate with the airway of the air-cooled cavity;
  • the other end of the air guide pipe is connected to the cavity where the fan is installed in an air path;
  • the other side of the seal is provided with an annular sealing ring, which is installed on the outer edge of the air inlet of the fan to prevent side
  • the outer side of the annular sealing ring of the seal is further provided with another annular sealing ring, and the other annular sealing ring is installed on the edge of the end of the air outlet channel to prevent lateral air leakage.
  • the cavity where the fan is installed and a pressure plate are buckled together to fix the fan in the cavity;
  • the pressure plate is provided with an opening, which is aligned with the opening of the fan housing to form the air inlet of the fan;
  • the hair removal working head is equipped with at least two sensors for detecting whether the working surface of the transparent crystal is completely or almost completely covered by the skin to activate or turn off the lamp operation; wherein, two sensors are installed on the edge of the working surface of the transparent crystal
  • the hair removal device also includes a capacitor, the semiconductor refrigeration chip is electrically connected to the control circuit board and the capacitor, or is connected to an independent power supply or an independent control circuit board; the lamp assembly and the capacitor Electrical connection; the fan is electrically connected to the control circuit board.
  • the cooling surface of the semiconductor refrigeration sheet of the present invention uses a transparent crystal to directly replace the ceramic sheet, and the transparent crystal is directly fixedly connected with the metal conductor connected to the NP semiconductor galvanic couple to form a new type of semiconductor refrigeration sheet as a whole.
  • the transparent crystal can directly contact the skin It is used as the working surface of the head of the epilator.
  • the pulsed light can be directly irradiated to the skin through the transparent crystal. After the light is cooled by the transparent crystal, the pain or discomfort caused by the light is greatly reduced or eliminated.
  • the cooling surface of the semiconductor refrigeration fin is larger than 1mm
  • the transparent crystal can increase the strength of the semiconductor refrigeration chip, reduce the risk of assembly damage, and increase the service life.
  • Fig. 1 is a perspective view of a semiconductor refrigeration chip according to an embodiment of the present invention.
  • Fig. 2 is an exploded view of a semiconductor refrigeration chip according to an embodiment of the present invention.
  • Fig. 3 is a front view of a semiconductor refrigeration chip according to an embodiment of the present invention.
  • Fig. 4 is a side view of the semiconductor refrigeration chip according to the embodiment of the present invention.
  • Fig. 5 is a perspective view of the cold surface of the semiconductor refrigeration fin according to the embodiment of the present invention.
  • Fig. 6 is a schematic diagram of a refrigeration structure according to an embodiment of the present invention.
  • Fig. 7 is an exploded view of the heat dissipation component of the hair removal device according to the embodiment of the present invention.
  • Fig. 8 is a perspective view of a hair removal device according to an embodiment of the present invention.
  • Fig. 9 is a three-dimensional view of another view of the hair removal device according to the embodiment of the present invention.
  • Fig. 10 is a cross-sectional view of the internal structure of the hair removal device according to the embodiment of the present invention.
  • Fig. 11 is a perspective view of the hair removal device according to the embodiment of the present invention with part of the housing removed.
  • FIG. 12 is a schematic diagram of the structure of the lamp tube assembly and the air-cooled heat dissipation channel of the hair removal device according to the embodiment of the present invention.
  • Fig. 13 is a cross-sectional view of the hair removal device according to an embodiment of the present invention and a schematic diagram of the air-cooled heat dissipation channel of the radiator.
  • FIG. 14 is an exploded view corresponding to the viewing angle shown in FIG. 9 of the hair removal device according to the embodiment of the present invention.
  • the embodiment of the present invention relates to a semiconductor refrigeration sheet 1, including a cold surface 10, a semiconductor galvanic couple layer 11 formed by connecting a semiconductor galvanic couple with a metal conductor, and a hot surface 12.
  • the semiconductor galvanic layer 11 is located between the cold side 10 and the hot side 12.
  • the cold surface 10 of the semiconductor refrigeration sheet is composed of transparent crystals, thereby forming a transparent crystal cold surface; the inner surface of the transparent crystal cold surface 10 is fixedly connected with the metal conductor of the semiconductor galvanic layer 11.
  • the hot surface 12 of the semiconductor refrigeration sheet is composed of a ceramic substrate, and the inner surface of the ceramic substrate is fixedly connected with the metal conductor of the semiconductor galvanic layer 11.
  • the ceramic substrate hot surface 12 and the transparent crystal cold surface 10 sandwich the semiconductor galvanic layer 11 inside to form the semiconductor refrigeration sheet 1.
  • Positive and negative electrodes 113 are connected to the ends of the semiconductor galvanic layer 11.
  • the fixed connection between the semiconductor galvanic layer 11 and the cold surface 10 of the transparent crystal and the hot surface 12 of the ceramic substrate can be achieved in a manner applicable in the prior art.
  • the transparent crystal cold surface 10 and the inner surface of the ceramic substrate hot surface 12 are first metalized, and then welded to the metal conductor of the semiconductor galvanic layer 11 to form a welding fixation.
  • the semiconductor galvanic layer 11 and the cold surface 10 of the transparent crystal and the hot surface 12 of the ceramic substrate are bonded by a thermally conductive adhesive to form a bonding fixation.
  • the transparent crystal may be a light-transmitting material with high light transmittance, high thermal conductivity, and high heat resistance, such as natural spar or gemstone.
  • the semiconductor refrigeration sheet 1 of the present invention can be used as a refrigeration structure in various beauty equipment or other equipment in contact with the skin, especially for IPL intense pulsed light hair removal equipment, and can be used as the head cooling surface of the hair removal equipment.
  • the advantage of using the transparent crystal for cooling is that the semiconductor cooling surface can directly contact the skin, which maximizes the efficiency and experience of cooling. It reduces the problems of cooling rate loss and slower speed caused by the contact connection of traditional semiconductor refrigeration and aluminum plate or sapphire crystal.
  • the light-transmitting crystal is used as the semiconductor cooling surface, and the strong pulsed light of IPL can be irradiated to the skin through the middle frame area for hair removal treatment.
  • the cooling surface of the semiconductor refrigeration sheet 1 uses a transparent crystal to directly replace the prior art ceramic substrate, and the transparent crystal is directly fixed to the metal conductor connected to the NP semiconductor galvanic couple to directly cool the entire body, and can directly contact the skin.
  • the pulsed light can be directly irradiated to the skin through the transparent crystal. After the light is cooled by the transparent crystal, the pain or discomfort caused by the light is greatly reduced or eliminated.
  • a transparent crystal larger than 1 mm is used for the cooling surface of the semiconductor refrigeration sheet, which can increase the strength of the semiconductor refrigeration sheet, reduce the risk of assembly damage, and increase the service life.
  • the semiconductor refrigeration sheet 1 can be designed in different shapes and sizes as a whole.
  • the semiconductor galvanic layer 11 has a ring shape, the ring-shaped area 111 is used for arranging electronic components, and the inner hollow area 112 is for light to penetrate.
  • the inside of the semiconductor galvanic layer 11 is a whole circuit of a metal conductor connected to an NP semiconductor galvanic couple.
  • NP semiconductor galvanic couple Using the Peltier effect of semiconductor materials, when the direct current passes through the galvanic couple formed by two different semiconductor materials of N and P in series, there will be between the two ends. Generate heat transfer, heat will be transferred from one end to the other end, thereby generating a temperature difference to form a hot and cold end.
  • the cold end adopts a transparent crystal to form the transparent crystal cold surface 10 of the semiconductor refrigeration sheet, and the hot end still adopts a ceramic substrate to form the hot surface 12 of the semiconductor refrigeration sheet.
  • the shape and size of the hot surface 12 of the ceramic substrate are adapted to the semiconductor galvanic layer 11, and it is also ring-shaped.
  • the ring-shaped area 121 serves as a heat dissipation surface, and the inner hollow area 122 allows light to penetrate.
  • the ring shape of the hot surface 12 of the ceramic substrate and the ring shape of the semiconductor galvanic layer 11 fit together to fit together to facilitate rapid heat dissipation.
  • the hot surface 12 of the ceramic substrate and the inner hollow area of the semiconductor galvanic layer 11 are aligned and communicated with each other.
  • the transparent crystal cold surface 10 covers the entire surface of the semiconductor galvanic layer 11, thereby forming an entire surface of cooling.
  • the transparent crystal cold surface 10 is a whole piece of crystal with a continuous surface.
  • the thickness of the transparent crystal layer is not less than 1 mm, so as to increase the strength of the semiconductor refrigeration sheet 1, reduce the risk of assembly damage, and increase the service life.
  • the transparent crystal material of this embodiment has high light transmittance and high thermal conductivity, so that the pulsed light can penetrate the transparent crystal for hair removal operation. The high thermal conductivity is beneficial to improve the cooling efficiency and effect.
  • the middle area of the transparent crystal cold surface 10 is a light-transmitting area 102, and the ring-shaped area 101 on the periphery of the light-transmitting area 102 fits the semiconductor galvanic layer 11 in a suitable fit.
  • the light-transmitting area 102 of the cold surface of the transparent crystal is covered on the inner hollow area 112 of the semiconductor galvanic layer 11, thereby covering the hollow area and allowing light to penetrate.
  • the entire refrigerating area of the transparent crystal cold surface 10 includes a light-transmitting area 102 and an annular area 101 at the periphery of the light-transmitting area. The entire surface of the crystal surface is cooled to increase the cooling area, and the experience is better.
  • the surface of the annular area 101 of the cold transparent crystal surface 10 is subjected to shading treatment to form an annular shading area (the shaded part in FIG. 3), which is used to shield the internal electronic components.
  • the light-shielding treatment can be to coat a light-shielding film on one or both sides of the transparent crystal, and then remove the light-shielding film at the corresponding position of the middle light-transmitting area; or directly print the light-shielding layer on the annular area of the transparent crystal, and Avoid light-transmitting areas.
  • the shading area is formed by surface treatment of the transparent crystal cold surface 10, which can be treated on both sides of the crystal or on either side of the crystal, and can be treated by means of coating, spraying, printing, etc.
  • the four peripheral edges of the transparent crystal cold surface 10 can be further processed to form an assembly position 103 (refer to FIG. 4) for fixed assembly with the external shell.
  • the assembly position 103 may be a beveled edge or a stepped surface to form a tight fit with the outer casing.
  • the present invention relates to a hair removal device 1000, which includes a housing 6 and a hair removal working head installed in the housing, a heat dissipation assembly 2, a lamp assembly 3, a capacitor 4, a control circuit board 5, and the like.
  • the control circuit board 5 is electrically connected with the lamp tube assembly 3 and the capacitor 4 to control the lamp tube to generate working pulse light for hair removal treatment.
  • the hair removal working head of the hair removal device 1000 is equipped with the semiconductor refrigeration sheet 1 of the above-mentioned embodiment directly as a hair removal working surface that can directly contact the skin.
  • the control circuit board 5 controls the capacitor 4 to start the lamp assembly 3 to generate pulsed light, and the pulsed light penetrates the hair removal working surface for hair removal treatment.
  • the heat dissipation assembly 2 is connected with the cooling fin 1 for cooling the semiconductor cooling fin 1.
  • the housing 6 is provided with a first air inlet 60 and an air outlet 66.
  • the heat dissipation assembly 2 includes a heat pipe 21, a radiator 23 connected to the heat pipe, and a fan 25.
  • the heat pipe 21 is connected to the cooling fin 1 so as to transfer the heat generated by the cooling fin 1 to the heat dissipation assembly 2 for heat dissipation.
  • the fan 25 is installed in the cavity 28, one side of the cavity 28 extends to form an air outlet channel 280, and the end of the air outlet channel 280 is connected to the air outlet 66.
  • the first air inlet 60 sucks in cold air to the surface of the radiator 23 to take away heat, and the fan 25 discharges the hot air to the outside of the air outlet channel 280 and the air outlet 66 to realize air-cooled heat dissipation of the radiator.
  • the fan 25 is electrically connected to the control circuit board 5, and the control circuit board 5 controls its operation.
  • the cold surface of the semiconductor refrigeration sheet 1 is directly used as the working surface in the hair removal working head of the hair removal device.
  • the semiconductor refrigeration sheet 1 uses transparent crystals directly as the cold surface 10 and at the same time as the depilatory working surface of the skin contact surface.
  • the heat pipe 21 is connected to the hot surface 12 of the peltier fin 1 so as to conduct the heat of the peltier fin 1 from the hot surface 12 to the heat sink 2 for heat dissipation.
  • the housing 6 includes an upper housing 61 and a lower housing 62 (the upper and lower positions are relative to each other, and this is only for the convenience of description), and also includes a depilatory head housing 63.
  • the upper shell 61 and/or the lower shell 62 are provided with a plurality of second air inlets 65 at positions corresponding to the lamp assembly 3.
  • the upper and lower shells are provided with second air inlets 65 (for example, a row of second air inlets are provided for each Tuyere 65).
  • the second air inlet 65 is in communication with the space air path on the surface of the lamp tube assembly 3, and is used to inhale cold air (cold air) from the outside to the inside to cool and dissipate the lamp tube assembly 3 by air.
  • the lower shell 62 is provided with an opening 69, and the radiator 23 is located behind the opening; the outer side of the opening 69 is covered with a baffle 64, and the baffle 64 is buckled on the opening 69 of the lower shell.
  • the baffle is provided with air holes 68, and the air holes 68 may be one or more groups of densely arranged through holes.
  • the air hole 68 is used to connect the external environment with the internal air path of the housing, specifically, to the space air path on the surface of the radiator, and is used to draw ambient cold air into the surface of the radiator 23 for air cooling and heat dissipation.
  • the gap between the edge of the baffle 64 and the edge of the lower shell opening 69 is used as an air outlet 66 and a lateral air inlet 67.
  • the air outlet 66 is connected to the end of the air outlet channel 280 of the cavity 28, and the lateral air inlet 67 is used for Form side air intake to the surface of the radiator.
  • the baffle 64 and the four peripheral edges of the opening 69 of the lower shell 62 form a gap.
  • the gap between one side edge forms the air outlet 66, and the gap between the other edges forms
  • the lateral air inlet 67 and the lateral air inlet 67 communicate with the surface of the radiator 23 inside the lower shell 62 in an air path, and are used for laterally injecting air into the surface of the radiator 23 to increase the amount and speed of the inlet cold air.
  • the air holes 68 on the casing take in the air in a positive direction, and combine with the lateral air inlet 67 to take in the air laterally, thereby forming a multi-directional air inlet to cool the surface of the radiator and improve the heat dissipation efficiency.
  • the first air inlet 60 is used to introduce cold air to the surface of the radiator, and preferably includes a lateral air inlet 67 formed by the gap between the baffle 64 and the edge of the lower shell opening, and also includes one or more groups on the baffle The wind hole 68. In other embodiments, the first air inlet 60 is not limited to the lateral air inlet 67 and the air hole 68.
  • the upper shell 61 is equipped with keys or a key board.
  • the control circuit board 5 is mounted on the inner side of the upper shell 61.
  • the lamp tube assembly 3 includes a lamp tube 31 and a reflector cup 32 provided outside the lamp tube.
  • the control circuit board 5 controls the capacitor 4 to supply power to the lamp tube.
  • the lamp tube assembly sends out pulsed light and transmits it to the working head of the hair removal device to act on the skin surface, thereby performing ablation and hair removal.
  • the heat generated by the operation of the lamp assembly 3 is dissipated by the heat dissipation assembly 2.
  • the reflector cup 32 is made of a thermally conductive material, and the heat generated by the lamp tube 31 is conducted to the reflector cup 32 for heat dissipation.
  • the lamp assembly 3 is installed on the lamp holder 7, and the lamp holder 7 is installed in the housing 6 behind the head of the depilation work.
  • the head of the depilation work and the lamp holder 7 are connected by a mirror cover 71.
  • the lamp The pulse light generated by the component 3 is transmitted to the hair removal working head through the mirror mask 71 for hair removal treatment.
  • the two ends of the lamp assembly 3 are installed on the lamp holder 7.
  • the two sides of the lamp holder 7 are respectively provided with wind shields 72 to shield the two ends of the lamp assembly; the wind shield 72 is inclined toward the surface of the reflector 32 of the lamp tube Therefore, the cold air sucked in by the second air inlet 65 is directed to the surface of the reflector to facilitate heat dissipation.
  • the windshield 72 is also used to block light to avoid light leakage at the two mounting ends of the lamp tube assembly.
  • the windshield 72 may be plate-shaped, and the plate surface is inclined to the surface of the reflector cup 32.
  • the windshield 72 may also be a sealing sleeve, which is sleeved outside the two ends of the lamp tube assembly.
  • At least one ventilation pipe 70 is provided in the lamp holder 7, and each ventilation pipe 70 penetrates up and down from the second air inlet 65 to the surface of the reflector of the lamp.
  • the space between the surface of the lamp assembly and the surface of the lamp assembly is the following air-cooled cavity 33 gas circuit is connected.
  • the end of the ventilation pipe 70 is communicated with the second air inlet 65 provided on the housing, and the cold air sucked by the second air inlet 65 is directed to the surface of the lamp tube assembly for heat dissipation.
  • at least one ventilation pipe 70 is provided in each of the upper and lower parts of the lamp holder 7.
  • the corresponding positions of the upper and lower housings 61 and 62 are provided with a second air inlet 65 which is connected to the ventilation pipe 70.
  • the lamp tube assembly 3 and the mirror cover 71 are installed on the lamp tube bracket 7, and gaskets 73 can be respectively sleeved on the outer periphery of the lamp tube assembly 3 and the mirror cover 71 for fixing and preventing light leakage.
  • the outer cover of the lamp tube assembly 3 is provided with an air guiding cover 30, and the space between the air guiding cover 30 and the surface of the lamp tube assembly 3 forms an air-cooled cavity 33 for heat dissipation of the lamp tube assembly.
  • the air-cooled cavity 33 corresponds to the space on the surface of the above-mentioned lamp tube assembly.
  • the air-cooled cavity 33 is in air communication with the ventilation pipe 70 provided in the lamp holder 7, and further is in air communication with the second air inlet 65 provided on the housing 6.
  • the air path between the air-cooled cavity 33 and the cavity 28 where the fan is installed passes through.
  • the air-cooled cavity 33 surrounds the lamp tube assembly 3.
  • the inner side of the air guide cover 30 is arranged outside the reflector cup 32 of the lamp tube, and the air-cooled cavity 33 is the space defined between the air guide cover 30 and the surface of the reflector cup 32 of the lamp tube.
  • the reflector 32 of the lamp tube dissipates heat.
  • the shape and size of the wind deflector 30 are adapted to the reflector cup 32 of the lamp tube and installed close to the outer wall of the reflector cup to define the air-cooled cavity 33. This configuration method reduces the height of the gap and maximizes the opposite surface
  • the surface area is favorable for forming a relatively strong negative pressure in the air-cooled cavity 33 when the fan is started, thereby increasing the strength of the second air inlet 65 to suck in cold air.
  • the shape of the wind deflector 30 covering the reflector cup 32 on one side is a trumpet shape, and a hollow connecting end 34 is provided on the other side.
  • the horn-shaped edge is clamped and installed on the lamp tube bracket 7.
  • the hollow connecting end 34 is in communication with the air-cooled cavity 33 and is also in air communication with the cavity 28; the width of the hollow connecting end 34 is designed in accordance with the principle of maximization to facilitate rapid gas circulation.
  • Cold heat dissipation channel By starting the fan 25 to work, it is realized that the cold air is sucked from the second air inlet 65 to the surface of the lamp tube assembly, and the heat on the surface of the lamp tube assembly is taken away to form hot air. The hot air is sucked into the cavity 28 and discharged to the air outlet channel 280 by the fan. The air outlet 66 is discharged, so that the air-cooled heat dissipation of the lamp tube assembly 3 is realized.
  • the outer side of the wind deflector 30 is connected with a sealing element 8.
  • One side of the sealing element 8 is provided with an air connecting pipe 81; one end of the connecting pipe 81 is connected to the hollow connecting end 34 of the air guiding hood 30 so as to communicate with the air-cooled cavity 33; the other end of the connecting pipe 81 is connected to the cavity 28, and the air path is connected .
  • An annular sealing ring 82 is formed on the other side of the sealing element 8, and the annular sealing ring 82 is installed on the edge of the air inlet hole at one end of the fan 25 to prevent lateral air leakage.
  • the outer side of the annular sealing ring 82 of the sealing element 8 further forms another annular sealing ring 83.
  • the other annular sealing ring 83 is installed on the edge of the end of the air outlet channel 280 of the cavity 28 to prevent lateral air leakage.
  • the cavity 28 is an annular cavity, and is buckled with the pressure plate 29 to fix the fan 25 in the cavity.
  • One side of the cavity 28 obliquely extends toward the air outlet 66 to form an inclined air outlet channel 280, which can prevent air from being poured back.
  • the air outlet channel 280 communicates with the air path inside the cavity 28.
  • the central opening 290 (not labeled) of the pressing plate 29 is aligned with the opening 250 of the fan housing to form an air inlet of the fan.
  • the annular sealing ring 83 of the seal is installed on the opening of the pressure plate to prevent lateral air leakage.
  • the depilation working head of the depilatory device 1000 of the present invention is equipped with a semiconductor refrigeration sheet 1 to be used as a depilatory working surface in contact with the skin.
  • the semiconductor refrigeration sheet 1 uses transparent crystals directly as the cold surface 10 and at the same time serves as the depilatory working surface of the skin contact surface.
  • the heat pipe 21 of the heat dissipating assembly 2 is connected to the hot surface 12 of the semiconductor refrigeration fin 1, and conducts the heat of the heat dissipation fin 1 from the hot surface 12 to the heat dissipation assembly 2 for heat dissipation.
  • the semiconductor refrigeration sheet 1 is fixedly assembled by the depilatory head shell 63.
  • the working head shell 63 is clamped and assembled with the front ends of the upper and lower shells 61 and 62, and is clamped and assembled with the lamp holder 7.
  • the working head can be further secured by fasteners such as screws, positioning posts or buckle structures.
  • the part housing 63 is assembled with the upper and lower housings 61 and 62 and the lamp holder 7.
  • the semiconductor refrigeration sheet 1 is electrically connected to the control circuit board 5 and the capacitor 4.
  • the control circuit board 5 controls the operation of the lamp assembly 3 to generate pulsed light to penetrate the semiconductor refrigeration sheet 1 for hair removal operation.
  • the control circuit board 5 can also be used to control the semiconductor refrigeration fin 1 to perform cooling work. It can be understood that the semiconductor refrigeration sheet 1 can also be provided with an independent power supply or an independent control circuit board to independently control the operation of the semiconductor refrigeration sheet 1.
  • One end of the heat pipe 21 is provided with a heat-conducting member 22, which is attached to the hot surface 12 of the semiconductor refrigeration fin 1, and is used to transfer the heat of the hot surface 12 of the semiconductor refrigeration fin to the heat pipe 21 through the heat-conducting member 22, which is composed of the heat pipe 21 and the radiator.
  • the heat sink 23 is a fin heat sink.
  • the heat conducting member 22 is generally a metal piece, preferably copper, and the shape of the heat conducting member 22 is adapted to the shape of the hot surface 12 of the peltier plate 1, and is in close contact with the hot surface 12 of the peltier plate 1, so as to Conducive to rapid heat transfer.
  • the heat pipe 21 is preferably a copper pipe.
  • the end of the heat pipe 21 connected with the semiconductor refrigeration fin 1 is wound to form a ring 24, and the ring 24 is adapted to the shape and size of the hot surface of the semiconductor refrigeration fin 1.
  • the contour of the ring 24 of the heat pipe 21 is consistent with the contour of the heat conducting member 22, and the heat conducting member 22 and the ring 24 of the heat pipe 21 are sleeved and attached to each other in a ring shape.
  • the heat conducting member 22 and the ring 24 of the heat pipe can be welded to form an annular fit, so that heat can be quickly transferred to the heat pipe 21.
  • the heat conducting member 22 is a metal ring sleeved in the ring 24 of the heat pipe, and the ring contact surfaces are further welded.
  • the ring 24 of the heat pipe 21 absorbs heat, and the refrigerant inside absorbs heat and evaporates and flows to one end of the radiator 23. After the heat is dissipated by the radiator, it is condensed and cooled and then circulates back to the ring 24 to continue to absorb heat.
  • the fan 25 of the heat dissipation assembly cooperates with the fin radiator 23 to strengthen the discharge of hot air from the surface of the fin radiator 23.
  • the radiator 23 and the fan 25 are installed up and down, and the air path communicates.
  • the fin radiator 23 is installed inside the housing and located behind the baffle 64 of the lower shell.
  • the air holes 68 opened on the baffle 64 and the lateral air inlet 67 formed on the periphery communicate with the heat dissipation air ducts of the fins on the surface of the radiator 23 .
  • the air passage on the surface of the fin communicates with the cavity 28 so that the hot air on the surface of the fin is sucked into the air inlet of the fan, discharged by the fan to the air outlet channel 280 and then discharged from the air outlet 66.
  • the fin radiator 23 is installed at one end of the air inlet of the fan 25, and the pressing plate 29 and the sealing member 8 are sandwiched between the fin radiator 23 and the fan 25.
  • the fan 25 and the cavity 28 are used for both the heat dissipation of the lamp tube assembly 3 and the heat dissipation process of the radiator 23 of the semiconductor cooling fin, and are used for drawing in cold air (cold air) and exhausting hot air (hot air).
  • cold air cold air
  • hot air hot air
  • the fan 25 when the fan 25 is started, negative pressure is generated in the cavity 28, and ambient cold air is sucked in from the second air inlet 65 and the first air inlet 60 respectively, and the cold air sucked in the second air inlet 65 enters the air-cooled cavity on the surface of the lamp assembly 33 The heat taken away from the surface of the lamp assembly becomes hot air and then drawn into the cavity 28.
  • the cold air sucked in by the first air inlet 60 absorbs heat on the surface of the radiator and becomes hot air and then drawn into the cavity 28.
  • the fan 25 The hot air is discharged to the air outlet channel 280 and then discharged from the air outlet 66 to the external environment.
  • heat dissipation of the lamp assembly 3 and heat dissipation of the radiator 23 are realized.
  • This configuration of air inlets, air outlets and fans can effectively prevent the formation of water mist or water droplets from eroding the control circuit board 5 due to the air entering the front of the lower shell.
  • the hair removal working head of the hair removal device 100 is equipped with at least two sensors 9 for detecting whether the working surface of the transparent crystal is completely or almost completely covered by the skin to activate or turn off the lamp operation.
  • two inductors 9 are installed on the diagonal of the edge of the transparent crystal working surface 10 or close to the diagonal.
  • the inductor 9 is connected to the control circuit board 5.
  • the hair removal device using the semiconductor refrigeration sheet 1 of the present invention can obtain an excellent ice compress effect, and the temperature of the cold surface of the refrigeration sheet can reach below the freezing point.
  • Using the light-transmitting crystal as a semiconductor refrigeration surface can directly contact the skin, which maximizes the efficiency and experience of refrigeration. Reduce the cooling rate loss and improve the cooling speed. Due to the improvement of cooling and heat dissipation efficiency, the pulse light intensity of the hair removal device can be increased, and the efficiency and effect of hair removal can be improved.
  • the heat dissipation component of the hair removal device 1000 of this embodiment can quickly dissipate heat.
  • the use of a fan also enhances the heat dissipation of the lamp tube assembly and the intensity of the cold air sucked in during the heat dissipation process of the radiator.
  • the tuyere 66 is preferably inclined to discharge wind. The heat dissipation structure and the configuration of the air-cooled heat dissipation channel of the present invention prevent the formation of water mist or water droplets from damaging the control circuit board.
  • the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense, and they can be fixed or detachable connections, or Integral; it can be air connection, or mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relation.
  • installed can be fixed or detachable connections, or Integral; it can be air connection, or mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relation.

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Abstract

本发明涉及一种半导体制冷片及脱毛仪。其中，半导体制冷片包括由金属导体连接半导体电偶形成的半导体电偶层，所述半导体制冷片的冷面由透明晶体构成形成透明晶体冷面；透明晶体冷面内侧表面与金属导体固定连接。本发明脱毛仪采用半导体制冷片的透明晶体冷面用作直接与皮肤接触的脱毛工作面，减除了制冷率的损耗，提高了制冷速度和效率，增加了制冷面积，体验感更好，大大降低或消除了光照的疼痛或不适感。

Description

一种半导体制冷片及脱毛仪 技术领域
本发明涉及半导体制冷技术领域，尤其是一种半导体制冷片及脱毛仪。
 背景技术
半导体制冷片或称热电制冷片或热泵。现有技术的半导体制冷片的两端面（热面和冷面）均设置有绝缘陶瓷片，内部是由导体连接NP半导体电偶的整体电路作为制冷层，制冷层的冷面和热面分别与陶瓷片之间的接触面涂有一层导热硅脂,以保持良好的接触。半导体制冷片已广泛应用于美容仪的制冷器，特别是用于脉冲光脱毛仪的制冷器。目前市面上的冰点脱毛仪中的，与皮肤接触的头部采用蓝宝石，蓝宝石周围侧面设置半导体制冷片给蓝宝石制冷形成冰敷效果。陶瓷片与蓝宝石的接触面之间也涂有一层导热硅脂，这种制冷结构中，半导体制冷片的冷面需经陶瓷片、导热硅脂层才给蓝宝石制冷，制冷效率大大降低，制冷效果不佳。
 技术问题
本发明的主要目的是：提供一种半导体制冷片，解决现有半导体制冷片制冷效率低，制冷效果不佳的问题。
本发明另一目的是提供一种脱毛仪，以解决现有脱毛仪制冷效率较低的问题。
 技术解决方案
为实现上述目的，本发明提供一种半导体制冷片，包括由金属导体连接半导体电偶形成的半导体电偶层；所述半导体制冷片的冷面由透明晶体构成，从而形成透明晶体冷面；透明晶体冷面内侧表面与所述金属导体固定连接。
进一步地，所述半导体制冷片的热面由陶瓷基板构成；陶瓷基板内侧表面与半导体电偶层的金属导体固定连接；陶瓷基板和透明晶体将金属导体连接半导体电偶形成的半导体电偶层夹在内部共同构成所述半导体制冷片；所述半导体电偶层连接有正负电极。
进一步地，所述半导体电偶层为环形，环形区域布置电子元件，内部空心区域供光线穿透；所述陶瓷基板为环形，环形区域作为散热面，内部空心区域供光线穿透；陶瓷基板的环形与半导体电偶层的环形相适配地贴合、内部空心区域对应连通。
作为一些实施例，所述透明晶体冷面覆盖半导体电偶层的整面从而形成整面制冷；所述透明晶体层厚度不少于1mm。
作为一些实施例，所述透明晶体冷面的中间区域为透光区域，透光区域外围的环形区域与所述半导体电偶层相适配地贴合；所述透明晶体冷面的透光区域封盖于半导体电偶层的内部空心区域上，且可供光线穿透；透明晶体冷面整面制冷的区域包括透光区域以及透光区域外围的环形区域；所述透明晶体冷面的环形区域表面经遮光处理后形成环形遮光区域，用于遮挡内部的电子部件；所述透明晶体冷面的边沿形成装配位，所述装配位用于与外部壳体之间固定装配。
作为一些实施例，所述透明晶体冷面的环形区域的单面或双面经表面遮光处理形成环形遮光区域；所述装配位为斜边或台阶面。
本发明还提供一种脱毛仪，包括壳体以及壳体内安装的脱毛工作头部、灯管组件、散热组件和控制电路板；控制电路板与灯管组件电连接；所述脱毛工作头部安装有如上所述的半导体制冷片；半导体制冷片的透明晶体冷面同时用作与皮肤接触的脱毛工作面；由所述控制电路板控制灯管组件产生脉冲光穿透所述半导体制冷片执行脱毛处理。
进一步地，所述散热组件包括热管、与热管连接的散热器，以及风扇；所述壳体上设置有第一进风口以及出风口;热管与所述制冷片的热面连接，从而将制冷片产生的热量传导至散热组件进行散热；风扇安装于一腔体内，腔体一侧气路贯通地延伸形成出风通道，出风通道末端与所述出风口接通；所述第一进风口、散热器表面的空间、安装风扇的所述腔体、出风通道及所述出风口之间气路连通形成散热器的风冷散热通道；通过启动风扇工作实现吸入冷风对散热器进行风冷散热。
在一些实施例中，腔体一侧朝向所述出风口倾斜延伸形成倾斜的出风通道；所述壳体上设有开孔，散热器安装于壳体内部且位于开孔的后方；开孔外侧盖设有挡板；挡板与壳体的开孔的边沿之间预留有间隙；所述间隙对散热器表面形成侧向进风口；挡板上开设有一组或多组风孔；所述第一进风口包括所述间隙形成的侧向进风口以及所述一组或多组风孔；挡板与壳体的开孔的边沿之间的间隙在一侧还形成所述出风口；出风口与腔体的出风通道末端连接用于侧向地向外排出热风；所述脱毛仪通过启动风扇工作，所述第一进风口吸入冷风至散热器表面的空间，带走散热器表面的热量形成热风，热风吸入安装风扇的所述腔体内，由风扇将热风排向出风通道，由所述出风口排出，从而实现散热器的风冷散热。
进一步地，所述散热器为鳍片散热器；散热器与风扇上下位置地安装；散热器表面的风道与风扇的进风孔连通，用于将散热器表面的热风吸入安装风扇的所述腔体内；所述散热组件还包括导热件；导热件与制冷片的形状相适配且相互贴合接触；热管绕制形成一个环状，导热件与热管的环状相互套设且形成环形贴合接触，制冷片产生的热量由导热件传导至热管进行散热，从而实现制冷片的制冷。
在一些实施例中，散热组件还用于灯管组件散热；所述壳体上对应灯管组件的位置设有第二进风口，第二进风口与灯管组件表面的空间气路相通；所述第二进风口、灯管组件表面的空间、安装风扇的所述腔体、出风通道以及出风口之间气路连通形成灯管组件的风冷散热通道；通过启动风扇工作实现自所述第二进风口吸入冷风至灯管组件表面，带走灯管组件表面的热量形成热风，由风扇将热风自出风通道和出风口排出，从而实现灯管组件的风冷散热。
在一些实施例中，所述灯管组件外部罩设有导风罩，导风罩与灯管组件之间的间隔形成用于灯管组件散热的风冷腔；所述风冷腔对应所述灯管组件表面的空间；所述风冷腔与安装风扇的所述腔体之间气路贯通，还与所述第二进风口之间气路连通；灯管组件安装于灯管支架上；灯管支架安装于壳体内且位于脱毛工作头部的后方；所述灯管支架内设置至少一条通风管路，通风管路上下贯通地自第二进风口通向灯管组件表面的空间，从而连通灯管组件表面的空间及所述第二进风口。
在一些实施例中，所述灯管组件包括灯管以及灯管外罩设的反光杯；所述风冷腔为导风罩与灯管的反光杯之间限定的空间；所述反光杯为导热材料制成；所述导风罩的形状及尺寸与反光杯相适配且贴近反光杯外表面地安装；导风罩一侧罩设于反光杯外的形状为喇叭形，另一侧设置有空心连接端；空心连接端与风冷腔连通，还与安装风扇的所述腔体气路连通；空心连接端的宽度以最大化原则设计以利于气体快速流通；灯管支架上分别设置有挡风件以遮挡灯管组件的两端；挡风件朝向反光杯表面倾斜地设置，用于将所述第二进风口吸入的冷风导向反光杯表面；所述挡风件还用于遮挡光线避免漏光；灯管支架的上下两部分内各分别设有至少一条通风管路，相应地，壳体上下两侧对应灯管组件的位置分别至少开设一个所述第二进风口，第二进风口通过通风管路与风冷腔之间气路连通。
在一些实施例中，所述导风罩与密封件连接；密封件一侧设置有导气连接管；导气连接管一端与导风罩的空心连接端连通从而与风冷腔气路连通；导气连接管另一端气路连通地连接于安装风扇的所述腔体；密封件另一侧设置有一个环状密封圈，环状密封圈安装于风扇的进风孔外部边沿，以防止侧向漏风；密封件的环形密封圈外侧进一步设置另一环形密封圈，所述另一环状密封圈安装于出风通道末端的边沿，防止侧向漏风。
在一些实施例中，安装风扇的所述腔体与一压板扣合共同将风扇固定于所述腔体内；压板上设有开孔，与风扇壳体的开孔对齐形成风扇的进风孔；所述脱毛工作头部安装有至少两个感应器，用于检测透明晶体工作面是否全部或者几乎全部被皮肤覆盖以激发或关闭灯管工作；其中，两个感应器安装于透明晶体工作面边沿的对角线或靠近对角线位置；所述脱毛仪还包括电容，半导体制冷片与控制电路板及电容之间电连接或者与独立的电源或独立的控制电路板连接；灯管组件与电容电连接；所述风扇与控制电路板电连接。
 有益效果
本发明的有益效果是：
本发明的半导体制冷片的制冷面使用透明晶体直接取代陶瓷片，透明晶体直接与连接NP半导体电偶的金属导体固定连接，整体形成一种新型的半导体制冷片，同时透明晶体可直接与皮肤接触用作脱毛仪头部的脱毛工作面。使用晶体直接作为半导体制冷片的制冷面和脱毛工作面，可获得以下效果：
1）消除了传统制冷的中间层，减除了制冷率的损耗，提高了制冷速度和效率；
2）与皮肤或接触面接触时为晶体表面整面制冷，提高了制冷面积，体验感更好；
3）使用晶体作为制冷面，脉冲光可直接透过透明晶体照射至皮肤，光经过透明晶体冷却后，大大降低或消除了光照的疼痛或不适感。
进一步地，半导体制冷片的制冷面使用大于 1mm 的透明晶体，可提高半导体制冷片的强度，降低装配的损伤风险，增加了使用寿命。
下面结合附图对本发明作进一步的详细描述。
 附图说明
图1是本发明实施例半导体制冷片的立体图。
图2是本发明实施例半导体制冷片的爆炸图。
图3是本发明实施例半导体制冷片的主视图。
图4是本发明实施例半导体制冷片的侧视图。
图5是本发明实施例半导体制冷片的冷面的立体图。
图6是本发明实施例制冷结构示意图。
图7是本发明实施例脱毛仪的散热组件爆炸图。
图8是本发明实施例脱毛仪的立体图。
图9是本发明实施例脱毛仪的另一视角的立体图。
图10是本发明实施例脱毛仪的内部结构的剖视图。
图11是本发明实施例脱毛仪移去部分壳体后的立体图。
图12是本发明实施例脱毛仪灯管组件装置结构及风冷散热通道示意图。
图13是本发明实施例脱毛仪的剖视图及散热器的风冷散热通道示意图。
图14是本发明实施例脱毛仪的以图9所示视角对应的爆炸图。
 本发明的实施方式
需要说明的是，在不冲突的情况下，本申请中的各实施例及实施例中的特征可以相互结合，下面结合附图和具体实施例对本发明作进一步详细说明。
请参照图1-5所示，本发明的实施例涉及一种半导体制冷片1，包括冷面10、由金属导体连接半导体电偶形成的半导体电偶层11以及热面12。半导体电偶层11位于冷面10和热面12之间。其中，半导体制冷片的冷面10由透明晶体构成，从而形成透明晶体冷面；透明晶体冷面10内侧表面与半导体电偶层11的金属导体固定连接。半导体制冷片的热面12由陶瓷基板构成，陶瓷基板内侧表面与半导体电偶层11的金属导体固定连接。陶瓷基板热面12和透明晶体冷面10将半导体电偶层11夹设在内部从而形成半导体制冷片1。半导体电偶层11的端部连接有正负电极113。
半导体电偶层11与透明晶体冷面10及陶瓷基板热面12之间的固定连接，可以通过现有技术中适用的方式实现。例如，先将透明晶体冷面10及陶瓷基板热面12的内侧表面进行金属化，之后再与半导体电偶层11的金属导体之间焊接从而形成焊接固定。又或者，半导体电偶层11与透明晶体冷面10及陶瓷基板热面12之间由导热胶粘结，从而形成粘结固定。
透明晶体可以是具有高透光性、高导热系数、高耐热性的透光材质，例如天然晶石或宝石。
本发明的半导体制冷片1可用于各种美容仪器类或者其他与皮肤接触的仪器中作为制冷结构，特别是用于IPL强脉冲光类脱毛仪，作为脱毛仪的头部制冷面可获得极佳的冰敷效果。使用该透光晶体制冷的好处在于，半导体制冷面可直接与皮肤接触，最大程度的提高了制冷的效率与体验。减少了传统工艺半导体制冷与铝板或蓝宝石晶体接触式连接所带来的制冷率损耗与速度较慢的问题。使用透光晶体作为半导体制冷面，同时IPL强脉冲光可通过中间方框区域照射至皮肤进行脱毛处理。
半导体制冷片1的制冷面使用透明晶体直接取代现有技术的陶瓷基板，透明晶体直接与连接NP半导体电偶的金属导体固定而直接整体制冷，且可直接与皮肤接触。
使用晶体直接作为半导体制冷片的制冷面，具有以下优点：
1）消除了传统制冷的中间层，减除了制冷率的损耗，提高了制冷速度和效率；
2）与皮肤或接触面接触时为晶体表面整面制冷，提高了制冷面积，体验感更好；
3）使用晶体作为制冷面，脉冲光可直接透过透明晶体照射至皮肤，光经过透明晶体冷却后，大大降低或消除了光照的疼痛或不适感。
较佳地，半导体制冷片的制冷面使用大于1mm的透明晶体，可提高半导体制冷片的强度，降低装配的损伤风险，增加了使用寿命。
用于不同类型的美容仪器时，半导体制冷片1整体可设计成不同形状和尺寸。
本实施例中，半导体电偶层11为环形，其环形区域111用于布置电子元件，内部空心区域112供光线穿透。半导体电偶层11内部是由金属导体连接NP半导体电偶的整体电路，利用半导体材料的Peltier效应，当直流电通过N、P两种不同半导体材料串联成的电偶时，两端之间就会产生热量转移，热量就会从一端转移到另一端，从而产生温差形成冷热端。冷端采用透明晶体形成半导体制冷片的透明晶体冷面10，热端仍采用陶瓷基板形成半导体制冷片的热面12。
陶瓷基板热面12的形状及尺寸与半导体电偶层11相适配，也为环形，环形区域121作为散热面，内部空心区域122供光线穿透。陶瓷基板热面12的环形与半导体电偶层11的环形相适配地贴合在一起，便于快速散热。陶瓷基板热面12和半导体电偶层11的内部空心区域边沿对齐连通。
同时参照图5，透明晶体冷面10覆盖半导体电偶层11的整面，从而形成整面制冷。透明晶体冷面10为一整片晶体，表面连续。较佳地，透明晶体层厚度不少于1mm，以提高半导体制冷片1的强度，降低装配的损伤风险，增加了使用寿命。本实施例的透明晶体材料具有高透光性以及高导热系数，以便于脉冲光穿透透明晶体进行脱毛操作，高导热系数有利于提高制冷效率及效果。
透明晶体冷面10的中间区域为透光区域102，透光区域102外围的环形区域101与所述半导体电偶层11相适配地贴合。相应地，透明晶体冷面的透光区域102封盖于半导体电偶层11的内部空心区域112上，从而将空心区域盖合，且可供光线穿透。透明晶体冷面10的整面制冷区域包括透光区域102以及透光区域外围的环形区域101。晶体表面整面制冷提高了制冷面积，体验感更好。
参照图3，透明晶体冷面10的环形区域101的表面经遮光处理后形成环形遮光区域（图3中的阴影部分），用于遮挡内部的电子部件。具体地，遮光处理可以是在透明晶体的单面或双面镀一层遮光膜，然后把中间透光区域对应位置的遮光膜去掉；或者是直接在透明晶体的环形区域上印刷遮层，且透光区域避空。遮光区域是对透明晶体冷面10进行表面处理形成，可在晶体双面或任一单面处理，可采用镀膜，喷涂，印刷等方式处理。
透明晶体冷面10的四周边沿还可进一步加工形成装配位103（参照图4），用于与外部壳体之间固定装配。例如，装配位103可以是斜边或台阶面，与外部壳体之间形成卡紧配合。
参照图8-14，本发明涉及一种脱毛仪1000，包括壳体6以及壳体内安装的脱毛工作头部、散热组件2、灯管组件3、电容4以及控制电路板5等。控制电路板5与灯管组件3、电容4电连接以控制灯管产生用于脱毛处理的工作脉冲光。脱毛仪1000的脱毛工作头部安装有上述实施例的半导体制冷片1直接作为可与皮肤直接接触的脱毛工作面。控制电路板5控制电容4启动灯管组件3工作产生脉冲光，脉冲光穿透所述脱毛工作面进行脱毛处理。散热组件2与制冷片1连接用于给半导体制冷片1制冷。壳体6上设置有第一进风口60以及出风口66。
结合参照图6-7，散热组件2包括热管21、与热管连接的散热器23，以及风扇25。热管21与制冷片1连接，从而将制冷片1产生的热量传导至散热组件2进行散热。风扇25安装于腔体28内，腔体28的一侧延伸形成出风通道280，出风通道280的末端与出风口66接通。
第一进风口60、散热器表面的空间、安装风扇的腔体28、出风通道280及所述出风口66之间气路连通形成散热器的风冷散热通道(图10中的箭头)；通过启动风扇工作，第一进风口60吸入冷风至散热器23的表面带走热量，由风扇25将热风排出至出风通道280和出风口66外部从而实现散热器的风冷散热。风扇25与控制电路板5电连接，由控制电路板5控制其工作。
本发明的实施例中，脱毛仪的脱毛工作头部内直接采用半导体制冷片1的冷面作为工作面。半导体制冷片1采用透明晶体直接作为冷面10且同时用作与皮肤接触面的脱毛工作面。热管21与所述半导体制冷片1的热面12连接，从而将半导体制冷片1的热量自热面12传导至散热组件2进行散热。
壳体6包括相上壳61和下壳62（上下方位相对而言，此处仅为描述方便），还包括脱毛工作头部壳体63。上壳61和/或下壳62上对应灯管组件3的位置开设有若干个第二进风口65，较佳地，上下壳体均设置第二进风口65（例如各设置一排第二进风口65）。第二进风口65与灯管组件3表面的空间气路连通，用于从外部向内吸入冷风（冷空气）对灯管组件3进行风冷散热。
下壳62设置有开孔69，散热器23位于开孔后方位置；开孔69外侧盖设有挡板64，挡板64扣合于下壳的开孔69上。挡板上开设风孔68，风孔68可以是一组或多组密集排列的通孔。风孔68用于将外部环境与壳体内部气路连通，具体是与散热器表面的空间气路连通，用于将环境冷风吸入散热器23表面进行风冷散热。
挡板64的边沿与下壳开孔69的边沿之间的间隙用作出风口66和侧向进风口67，出风口66与腔体28出风通道280的末端连接，侧向进风口67用于对散热器表面形成侧向进风。结合图8、10和图13所示，挡板64与下壳62的开孔69四周边沿之间形成间隙中，其中一侧边沿之间的间隙形成出风口66，其他边沿之间的间隙形成侧向进风口67，侧向进风口67与下壳62内侧的散热器23表面气路相通，用于对散热器23表面侧向进风，提高进冷风进入量和进风速度。壳体上的风孔68正向进风，结合侧向进风口67侧向进风，从而形成多方向进风对散热器表面进行风冷散热，提高散热效率。第一进风口60用于向散热器表面导入冷风，较佳地包括挡板64与下壳开孔边沿之间的间隙形成的侧向进风口67，还包括挡板上的一组或多组风孔68。其他实施例中，第一进风口60不限于侧向进风口67及风孔68。
上壳61装配有按键或按键板。上壳61的内侧安装所述控制电路板5。
灯管组件3包括灯管31以及灯管外罩设的反光杯32。灯管31通电时产生脉冲光，控制电路板5控制电容4给灯管供电，灯管组件发出脉冲光传输至脱毛仪的工作头部作用于皮肤表面，从而进行烧蚀脱毛。灯管组件3工作产生的热量由散热组件2进行散热。反光杯32为导热材料制成，灯管31产生的热量传导到反光杯32进行散热。
灯管组件3安装于灯管支架7上，灯管支架7安装于壳体6内且位于脱毛工作头部的后方，脱毛工作头部与灯管支架7之间由镜面罩71连接，灯管组件3产生的脉冲光通过镜面罩71内传输至脱毛工作头部进行脱毛处理。灯管组件3两端安装于灯管支架7上，灯管支架7两侧分别设置有挡风件72以遮挡灯管组件的两端；挡风件72朝向灯管的反光杯32的表面倾斜地设置，从而将第二进风口65吸入的冷风导向反光杯表面以利于散热。挡风件72除了用于导向冷风外，还用于遮挡光线，避免灯管组件两安装端发生漏光。挡风件72可以是板状，板面倾斜向反光杯32的表面。挡风件72也可以是密封套，套设在灯管组件的两端外部。
灯管支架7内设置至少一条通风管路70，每条通风管路70上下贯通地由第二进风口65通向灯管的反光杯表面，与灯管组件表面的空间即下述风冷腔33气路连通。通风管路70的末端与壳体上设置的第二进风口65连通，将第二进风口65吸入的冷风导向灯管组件表面进行散热。较佳地，灯管支架7的上下两部分内各分设置至少一条通风管路70，相应地，上下壳体61、62对应位置均设置有第二进风口65，与通风管路70连接。
灯管组件3和镜面罩71安装于灯管支架7，在灯管组件3和镜面罩71外部周边还可分别套装有垫片73，用于安装固定且防止漏光。
本实施例中，灯管组件3外部罩设有导风罩30，导风罩30与灯管组件3表面之间的间隔空间形成用于灯管组件散热的风冷腔33。风冷腔33对应上述灯管组件表面的空间。风冷腔33与灯管支架7内设置的通风管路70气路相通，进而与壳体6上设置的第二进风口65气路相通。风冷腔33与安装风扇的腔体28之间气路贯通。风冷腔33包围于所述灯管组件3外。具体地，导风罩30内侧罩设于灯管的反光杯32外，风冷腔33为导风罩30与灯管的反光杯32表面之间限定的空间，吸入风冷腔内的冷风给灯管的反光杯32散热。导风罩30的形状及尺寸与灯管的反光杯32相适配且贴近反光杯外壁地安装从而限定所述风冷腔33，这种配置方式以减小间隙的高度、最大化相对面的表面积，以利于风扇启动时能在风冷腔33内形成较强负压，从而提高第二进风口65吸入冷风的强度。较佳地，导风罩30一侧罩设于反光杯32外的形状为喇叭形，另一侧设置有空心连接端34。喇叭形边沿卡紧安装于灯管支架7上。空心连接端34与风冷腔33连通，还与腔体28气路连通；空心连接端34的宽度以最大化原则设计以利于气体快速流通。
壳体6上的第二进风口65、灯管组件表面的空间即风冷腔33、安装风扇的腔体28、出风通道280以及出风口66之间气路连通形成灯管组件3的风冷散热通道。通过启动风扇25工作，实现自第二进风口65吸入冷风至灯管组件表面，带走灯管组件表面的热量形成热风，热风吸入腔体28内由风扇将排向出风通道280，最后由出风口66排出，从而实现灯管组件3的风冷散热。
导风罩30外侧连接密封件8。密封件8一侧设置有导气连接管81；连接管81一端与导风罩30的空心连接端34连接从而与风冷腔33连通；连接管81另一端连接于腔体28，气路连通。密封件8的另一侧形成一个环状密封圈82，环状密封圈82安装于风扇25一端的进风孔边沿，以防止侧向漏风。密封件8的环形密封圈82外侧进一步形成另一环形密封圈83。该另一环状密封圈83安装于腔体28的出风通道280末端边沿，防止侧向漏风。
腔体28为环形腔体，与压板29扣合将风扇25固定在腔体内。腔体28一侧朝向出风口66倾斜延伸形成倾斜的出风通道280，可防止空气倒灌。出风通道280与腔体28内部气路相通。压板29中心开孔290（未标号）与风扇壳体的开孔250对齐，形成风扇的进风孔。密封件的环状密封圈83安装于压板的开孔上，防止侧向漏风。
本发明的脱毛仪1000的脱毛工作头部安装半导体制冷片1，用作脱毛工作面与皮肤接触。其中，半导体制冷片1采用透明晶体直接作为冷面10且同时用作与皮肤接触面的脱毛工作面。散热组件2的热管21与所述半导体制冷片1的热面12连接，将半导体制冷片1的热量自热面12传导至散热组件2进行散热。半导体制冷片1由脱毛工作头部壳体63固定装配。工作头部壳体63与上下壳体61、62的前端卡紧装配，且与灯管支架7之间卡紧地装配，可进一步由紧固件如螺丝、定位柱或卡扣结构将工作头部壳体63与上下壳体61、62以及灯管支架7之间进行装配。
半导体制冷片1与控制电路板5及电容4之间电连接。控制电路板5控制灯管组件3工作产生脉冲光穿透半导体制冷片1进行脱毛操作。控制电路板5还可用于控制半导体制冷片1进行制冷工作。可以理解，半导体制冷片1也可设置独立的电源或独立的控制电路板，单独控制半导体制冷片1工作。
热管21一端设有导热件22，导热件22与半导体制冷片1的热面12贴合，用于将半导体制冷片热面12的热量经导热件22传导至热管21，由热管21及散热器23进行散热。散热器23为鳍片散热器。
导热件22一般为金属件，较佳为铜，导热件22的形状与半导体制冷片1的热面12的形状相适配，且与半导体制冷片1的热面12之间贴合接触，以利于快速传热。热管21内部有循环流动的制冷剂，热管固定在鳍片散热器23的表面或者内部。热管21较佳为铜管。热管21与半导体制冷片1连接的一端绕制形成一个环状24，环状24与半导体制冷片1的热面形状及尺寸相适配。热管21的环状24与导热件22的轮廓一致，导热件22与热管21的环状24相互套设且环形贴合。导热件22与热管的环状24可以通过焊接形成环形贴合，以便于热量能快速的传到热管21。本实施例中导热件22为金属环套设于热管的环状24内，环形接触面之间进一步焊接。热管21的环状24吸收热量，内部的制冷剂吸热蒸发后向散热器23一端流动，由散热器散热后冷凝降温后循环回流至环状24内继续吸热。
散热组件的风扇25与鳍片散热器23配合，加强鳍片散热器23表面的热空气排出。散热器23与风扇25上下安装，气路相通。鳍片散热器23安装于壳体内部且位于下壳的挡板64后方，挡板64上开设的风孔68以及周边形成的侧向进风口67与散热器23表面鳍片的散热风道连通。鳍片表面的风道与腔体28连通，从而将鳍片表面的热风吸入风扇的进风孔内，由风扇排出至出风通道280后由出风口66排出。鳍片散热器23安装于风扇25的进风孔一端，压板29和密封件8夹设于鳍片散热器23和风扇25之间。
本实施例中，风扇25及腔体28同时用于灯管组件3的散热以及半导体制冷片的散热器23的散热过程，用于抽入冷风（冷空气）及排出热风（热空气）。具体地，启动风扇25，腔体28内产生负压，分别从第二进风口65以及第一进风口60内吸入环境冷风，第二进风口65内吸入的冷风进入灯具组件表面的风冷腔33带走灯具组件表面的热量变成热风后抽入至腔体28内，第一进风口60吸入的冷风在散热器表面吸收热量变成热风后抽入至腔体28内，最后由风扇25排出热风至出风通道280后从出风口66排出到外部环境中，同时实现对灯具组件3的散热以及对散热器23的散热，散热器23散热冷却热管，进而实现半导体制冷片1的制冷。这种进风口、出风口以及风扇的配置，可有效避免因下壳正面进风形成水雾或水滴侵蚀控制电路板5。
作为一些实施例中，脱毛仪100的脱毛工作头部安装有至少两个感应器9，用于检测透明晶体工作面是否全部或者几乎全部被皮肤覆盖以激发或关闭灯管工作。其中，两个感应器9安装于透明晶体工作面10边沿的对角线或靠近对角线位置。感应器9与控制电路板5连接。
应用本发明的半导体制冷片1的脱毛仪，可获得极佳的冰敷效果，制冷片的冷面温度可达冰点以下。使用该透光晶体作为半导体制冷面可直接与皮肤接触，最大程度的提高了制冷的效率与体验。减少了制冷率损耗，提高了制冷速度。因制冷及散热效率的改善，可提高脱毛仪的脉冲光强，提高脱毛效率及效果。本实施例的脱毛仪1000的散热组件能快速散热，风扇的使用同时加强灯管组件散热以及散热器散热过程中吸入冷风的强度，热风由风扇25统一排至一侧的出风通道280及出风口66，较佳地为倾斜出风。本发明的散热结构及风冷散热通道的配置避免形成水雾或水珠对控制电路板造成损坏。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，可以是固定连接，也可以是可拆卸连接，或成一体；可以是气路相通地连接，或者是机械连接，也可能是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，均应属于本申请的范围；本发明的保护范围由所附权利要求及其等同范围限定。

Claims (15)

  1. 一种半导体制冷片，包括由金属导体连接半导体电偶形成的半导体电偶层；其特征在于：所述半导体制冷片的冷面由透明晶体构成，从而形成透明晶体冷面；透明晶体冷面内侧表面与所述金属导体固定连接。
  2. 如权利要求1所述的半导体制冷片，其特征在于：所述半导体制冷片的热面由陶瓷基板构成；陶瓷基板内侧表面与半导体电偶层的金属导体固定连接；陶瓷基板和透明晶体将金属导体连接半导体电偶形成的半导体电偶层夹在内部共同构成所述半导体制冷片；所述半导体电偶层连接有正负电极。
  3. 如权利要求2所述的半导体制冷片，其特征在于：所述半导体电偶层为环形，环形区域布置电子元件，内部空心区域供光线穿透；所述陶瓷基板为环形，环形区域作为散热面，内部空心区域供光线穿透；陶瓷基板的环形与半导体电偶层的环形相适配地贴合、内部空心区域对应连通。
  4. 如权利要求1~3任一项所述的半导体制冷片，其特征在于：
    所述透明晶体冷面覆盖半导体电偶层的整面从而形成整面制冷；所述透明晶体层厚度不少于1mm。
  5. 如权利要求4所述的半导体制冷片，其特征在于：
    所述透明晶体冷面的中间区域为透光区域，透光区域外围的环形区域与所述半导体电偶层相适配地贴合；所述透明晶体冷面的透光区域封盖于半导体电偶层的内部空心区域上，且可供光线穿透；透明晶体冷面整面制冷的区域包括透光区域以及透光区域外围的环形区域；
    所述透明晶体冷面的环形区域表面经遮光处理后形成环形遮光区域，用于遮挡内部的电子部件；
    所述透明晶体冷面的边沿形成装配位，所述装配位用于与外部壳体之间固定装配。
  6. 如权利要求5所述的半导体制冷片，其特征在于：所述透明晶体冷面的环形区域的单面或双面经表面遮光处理形成环形遮光区域；所述装配位为斜边或台阶面。
  7. 一种脱毛仪，包括壳体以及壳体内安装的脱毛工作头部、灯管组件、散热组件和控制电路板；控制电路板与灯管组件电连接；其特征在于：所述脱毛工作头部安装有如权利要求1~6任一项所述的半导体制冷片；半导体制冷片的透明晶体冷面同时用作与皮肤接触的脱毛工作面；由所述控制电路板控制灯管组件产生脉冲光穿透所述半导体制冷片执行脱毛处理。
  8. 如权利要求7所述的脱毛仪，其特征在于：
    所述散热组件包括热管、与热管连接的散热器，以及风扇；
    所述壳体上设置有第一进风口以及出风口;
    热管与所述制冷片的热面连接，从而将制冷片产生的热量传导至散热组件进行散热；
    风扇安装于一腔体内，腔体一侧气路贯通地延伸形成出风通道，出风通道末端与所述出风口接通；
    所述第一进风口、散热器表面的空间、安装风扇的所述腔体、出风通道及所述出风口之间气路连通形成散热器的风冷散热通道；通过启动风扇工作实现吸入冷风对散热器进行风冷散热。
  9. 如权利要求8所述的脱毛仪，其特征在于：
    腔体一侧朝向所述出风口倾斜延伸形成倾斜的出风通道；
    所述壳体上设有开孔，散热器安装于壳体内部且位于开孔的后方；
    开孔外侧盖设有挡板；挡板与壳体的开孔的边沿之间预留有间隙；所述间隙对散热器表面形成侧向进风口；挡板上开设有一组或多组风孔；所述第一进风口包括所述间隙形成的侧向进风口以及所述一组或多组风孔；
    挡板与壳体的开孔的边沿之间的间隙在一侧还形成所述出风口；出风口与腔体的出风通道末端连接用于侧向地向外排出热风；
    所述脱毛仪通过启动风扇工作，所述第一进风口吸入冷风至散热器表面的空间，带走散热器表面的热量形成热风，热风吸入安装风扇的所述腔体内，由风扇将热风排向出风通道，由所述出风口排出，从而实现散热器的风冷散热。
  10. 如权利要求8所述的脱毛仪，其特征在于：
    所述散热器为鳍片散热器；散热器与风扇上下位置地安装；散热器表面的风道与风扇的进风孔连通，用于将散热器表面的热风吸入安装风扇的所述腔体内；
    所述散热组件还包括导热件；导热件与制冷片的形状相适配且相互贴合接触；
    热管绕制形成一个环状，导热件与热管的环状相互套设且形成环形贴合接触，制冷片产生的热量由导热件传导至热管进行散热，从而实现制冷片的制冷。
  11. 如权利要求8所述的脱毛仪，其特征在于：
    散热组件还用于灯管组件散热；所述壳体上对应灯管组件的位置设有第二进风口，第二进风口与灯管组件表面的空间气路相通；所述第二进风口、灯管组件表面的空间、安装风扇的所述腔体、出风通道以及出风口之间气路连通形成灯管组件的风冷散热通道；
    通过启动风扇工作实现自所述第二进风口吸入冷风至灯管组件表面，带走灯管组件表面的热量形成热风，由风扇将热风自出风通道和出风口排出，从而实现灯管组件的风冷散热。
  12. 如权利要求11所述的脱毛仪，其特征在于：
    所述灯管组件外部罩设有导风罩，导风罩与灯管组件之间的间隔形成用于灯管组件散热的风冷腔；所述风冷腔对应所述灯管组件表面的空间；
    所述风冷腔与安装风扇的所述腔体之间气路贯通，还与所述第二进风口之间气路连通；
    灯管组件安装于灯管支架上；灯管支架安装于壳体内且位于脱毛工作头部的后方；
    所述灯管支架内设置至少一条通风管路，通风管路上下贯通地自第二进风口通向灯管组件表面的空间，从而连通灯管组件表面的空间及所述第二进风口。
  13. 如权利要求12所述的脱毛仪，其特征在于：
    所述灯管组件包括灯管以及灯管外罩设的反光杯；所述风冷腔为导风罩与灯管的反光杯之间限定的空间；所述反光杯为导热材料制成；
    所述导风罩的形状及尺寸与反光杯相适配且贴近反光杯外表面地安装；
    导风罩一侧罩设于反光杯外的形状为喇叭形，另一侧设置有空心连接端；空心连接端与风冷腔连通，还与安装风扇的所述腔体气路连通；空心连接端的宽度以最大化原则设计以利于气体快速流通；
    灯管支架上分别设置有挡风件以遮挡灯管组件的两端；挡风件朝向反光杯表面倾斜地设置，用于将所述第二进风口吸入的冷风导向反光杯表面；所述挡风件还用于遮挡光线避免漏光；
    灯管支架的上下两部分内各分别设有至少一条通风管路，相应地，壳体上下两侧对应灯管组件的位置分别至少开设一个所述第二进风口，第二进风口通过通风管路与风冷腔之间气路连通。
  14. 如权利要求13所述的脱毛仪，其特征在于：
    所述导风罩与密封件连接；
    密封件一侧设置有导气连接管；导气连接管一端与导风罩的空心连接端连通从而与风冷腔气路连通；导气连接管另一端气路连通地连接于安装风扇的所述腔体；
    密封件另一侧设置有一个环状密封圈，环状密封圈安装于风扇的进风孔外部边沿，以防止侧向漏风；
    密封件的环形密封圈外侧进一步设置另一环形密封圈，所述另一环状密封圈安装于出风通道末端的边沿，防止侧向漏风。
  15. 如权利要求8所述的脱毛仪，其特征在于：
    安装风扇的所述腔体与一压板扣合共同将风扇固定于所述腔体内；压板上设有开孔，与风扇壳体的开孔对齐形成风扇的进风孔；
    所述脱毛工作头部安装有至少两个感应器，用于检测透明晶体工作面是否全部或者几乎全部被皮肤覆盖以激发或关闭灯管工作；其中，两个感应器安装于透明晶体工作面边沿的对角线或靠近对角线位置；
    所述脱毛仪还包括电容，半导体制冷片与控制电路板及电容之间电连接或者与独立的电源或独立的控制电路板连接；灯管组件与电容电连接；所述风扇与控制电路板电连接。
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CN117017475A (zh) * 2023-06-09 2023-11-10 深圳市美时美刻智能电器有限公司 强脉冲光治疗仪
CN116492046A (zh) * 2023-06-27 2023-07-28 北京萨诺光电科技发展有限公司 脱毛仪智能控制系统、控制方法和脱毛仪
CN116492046B (zh) * 2023-06-27 2023-09-05 北京萨诺光电科技发展有限公司 脱毛仪智能控制系统、控制方法和脱毛仪

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