WO2021189565A1 - 一种显示面板、显示模组及电子装置 - Google Patents

一种显示面板、显示模组及电子装置 Download PDF

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Publication number
WO2021189565A1
WO2021189565A1 PCT/CN2020/084662 CN2020084662W WO2021189565A1 WO 2021189565 A1 WO2021189565 A1 WO 2021189565A1 CN 2020084662 W CN2020084662 W CN 2020084662W WO 2021189565 A1 WO2021189565 A1 WO 2021189565A1
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Prior art keywords
layer
metal layer
metal
cathode
display panel
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PCT/CN2020/084662
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English (en)
French (fr)
Inventor
黄式强
明星
曹起
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/956,590 priority Critical patent/US11404524B2/en
Publication of WO2021189565A1 publication Critical patent/WO2021189565A1/zh
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/123Connection of the pixel electrodes to the thin film transistors [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/17Passive-matrix OLED displays
    • H10K59/179Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8052Cathodes

Definitions

  • the present invention relates to the field of display technology, in particular to a display panel, a display module and an electronic device.
  • the organic light emitting diode display panel can be divided into two types of structures: bottom emission and top emission according to different light emitting directions.
  • the light of the bottom emission structure is transmitted from the anode. Because the wiring density on the side of the array substrate is relatively high and the light transmittance is low, the bottom emission structure is often used for products with large size and low pixel density.
  • the top-emission structure the light emitted by the organic light-emitting diode is transmitted through the cathode.
  • the object of the present invention is to provide a display panel, a display module, and an electronic device, which can improve the uniformity of brightness.
  • the present invention provides a display panel, including:
  • the semiconductor layer is provided on the substrate;
  • the third metal layer is provided on the first metal layer, and the third metal layer includes signal lines;
  • a pixel definition layer disposed on the conductive layer, the pixel definition layer including a first opening area and a second opening area;
  • a light-emitting layer located in the first opening area
  • a cathode is arranged in the second opening area, on the light-emitting layer and the pixel defining layer, and the cathode is connected to the connecting portion.
  • the present invention also provides a display module, which includes the above-mentioned display panel.
  • the present invention also provides an electronic device, which includes the above-mentioned display module.
  • the display panel, display module, and electronic device of the present invention include a third metal layer, which is arranged on the first metal layer, the third metal layer includes signal lines, and a conductive layer, which is arranged on the third metal layer
  • the conductive layer includes an anode and a connecting portion; the connecting portion is connected to the signal line; a pixel definition layer is provided on the conductive layer, and the pixel definition layer includes a first opening area and a second opening area
  • the light-emitting layer is located in the first opening area; the cathode is located in the second opening area and on the light-emitting layer and the pixel defining layer, the cathode is connected to the connecting portion, because the cathode is It is connected to the signal line, so the impedance of the cathode is reduced, so that the cathode voltage distribution in the plane is uniform, thereby improving the uniformity of the brightness.
  • FIG. 1 is a schematic diagram of the structure of an existing pixel driving circuit
  • FIG. 2 is a schematic diagram of a working sequence of the pixel driving circuit shown in FIG. 1 in the prior art
  • FIG. 3 is a schematic cross-sectional view of a conventional display panel
  • FIG. 4 is a schematic cross-sectional view of a display panel according to an embodiment of the invention.
  • FIG. 5 is a schematic structural diagram of the fifth step of the manufacturing method of the display panel according to an embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of the eighth step of the manufacturing method of the display panel according to an embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a pixel driving circuit according to an embodiment of the invention.
  • the existing 7T1C pixel driving circuit includes a driving transistor T1 and a second transistor T2 to a seventh transistor T7.
  • the gate of the second transistor T2 is connected to the second scan signal Scan[n], the source is connected to the data voltage Vdata, and the drain is connected to the source of the driving transistor T1;
  • the gate of the driving transistor T1 is connected to the source of the third transistor T3, and the drain is connected to the drain of the third transistor T3;
  • the gate of the fifth transistor T5 is connected to the light-emitting signal EM, the source is connected to the data voltage VDD, and the drain is connected to the source of the driving transistor T1;
  • the gate of the third transistor T3 is connected to the second scan signal Scan[n], and the drain is connected to the drain of the driving transistor T1;
  • the gate of the fourth transistor T4 is connected to the first scan signal Scan[n-1], the source is connected to the source of the third transistor T3, and the drain and the source of the seventh transistor T7 are both connected to the low-level signal VI ;
  • the gate of the sixth transistor T6 is connected to the light emitting signal EM, the source is connected to the drain of the driving transistor T1, the drain is connected to the drain of the seventh transistor T7 and the organic light emitting diode, and the gate of the seventh transistor T7 is connected to The third scan signal XScan[n].
  • the specific work process includes the following stages:
  • the working process of the pixel drive circuit is divided into three stages: the initialization stage (t1), the threshold voltage compensation stage (t2), and the light-emitting stage (t3), as follows:
  • the initialization stage (t1) Scan[n-1] outputs a low level, so that the transistor T4 is turned on, Scan[n], XScan[N] and EM output a high level, so that T2, T3, T5, T6, T7 are turned off, and the VI signal (low potential) resets the gate of the driving transistor T1 through T4;
  • T1 no longer meets the opening condition, and the threshold voltage compensation phase ends.
  • the potential of the gate of the first transistor T1 is: Vdata+Vth
  • the VI signal resets the anode of the light-emitting device through T7.
  • the existing display panel includes a first flexible substrate 11, a first barrier layer 12, a second flexible substrate 13, a second barrier layer 14, a buffer layer 14', a semiconductor layer 15 (Poly), a An insulating layer 16, gate 171, second insulating layer 18, metal part 191, third insulating layer 20, source 211 and drain 212, flat layer 22, anode 231 (ANO), pixel definition layer 24 (PDL) , The first functional layer 25, the light-emitting layer 26, the second functional layer 27, the cathode 28 (Cathode) and so on.
  • FIG. 4 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention.
  • the display panel of this embodiment includes a substrate 10, a semiconductor layer 15, a first metal layer 17, a second metal layer 19, a conductive layer 23, a pixel definition layer 24, a light emitting layer 26, and a cathode 28. It may include at least one of the buffer layer 14 ′, the first insulating layer 16, the second insulating layer 18, the third insulating layer 20, and the flat layer 22.
  • the base 10 may be a flexible base or a glass substrate.
  • the base 10 may include a first flexible substrate 11, a first barrier layer 12, a second flexible substrate 13, and a second barrier layer 14.
  • the materials of the first flexible substrate 11 and the second flexible substrate 13 can both be polyimide.
  • the buffer layer 14 ′ is provided on the substrate 10.
  • Material of the buffer layer 14 ' may include at least one of the 2 SiNx, and SiO.
  • the semiconductor layer 15 is provided on the buffer layer 14'.
  • the material of the semiconductor layer 15 may be polysilicon.
  • the first insulating layer 16 is provided on the semiconductor layer 15, and the material of the first insulating layer 16 includes at least one of SiNx and SiO 2.
  • the first metal layer 17 is disposed on the first insulating layer 16; the first metal layer 17 includes a gate 171.
  • the second metal layer 19 is disposed on the second insulating layer 18; the second metal layer 19 includes a metal part 191, and the metal part 191 corresponds to the position of the gate 171.
  • the metal portion 191 and the gate 171 form a capacitor.
  • a first via hole (not shown in the figure) is provided on the third insulating layer 20, and the first via hole penetrates the first insulating layer.
  • Layer 16, the second insulating layer 18, and the third insulating layer 20 are provided on the third insulating layer 20, and the first via hole penetrates the first insulating layer.
  • the third metal layer 21 is disposed on the third insulating layer 20, and the third metal layer 21 includes a signal line 213.
  • the signal line 213 is connected to a first power supply voltage, and the first power supply voltage is less than a preset value.
  • the first power supply voltage may be a DC low-level voltage.
  • the third metal layer 21 is also provided in the first via hole to form the signal line 213.
  • the third metal layer 21 includes a source electrode 211 and a drain electrode 212, that is, the signal line 213, the source electrode 211 and the drain electrode 212 are located in the same metal layer.
  • the first via hole corresponds to the position of the signal line 213.
  • the flat layer 22 is provided on the third metal layer 21, the flat layer 22 is provided with a second connection hole (not shown in the figure), and the connection portion 232 is connected to the signal through the second connection hole. Line 213 is connected.
  • the second connecting hole corresponds to the position of the connecting portion 232.
  • the conductive layer 23 is provided on the flat layer 22; the conductive layer 23 includes an anode 231 and a connecting portion 232; the connecting portion 232 is connected to the signal line 213; the conductive layer 23 is made of a transparent conductive material, For example, indium tin oxide.
  • the pixel definition layer 24 is provided on the conductive layer 23, and the pixel definition layer 24 includes a first opening area 101 and a second opening area 102.
  • the light-emitting layer 26 is located in the first opening area 101;
  • the cathode 28 is disposed in the second opening area 102 and on the light-emitting layer 26 and the pixel defining layer 24, and the cathode 28 is connected to the connecting portion 232.
  • the material of the cathode 28 may be magnesium-silver alloy (Mg/Ag). In one embodiment, the thickness of the cathode 28 is about 100 ⁇ , and the impedance of the cathode 28 layer is less than 20 ⁇ .
  • the display panel may further include a first functional layer 25 and a second functional layer 27.
  • the first functional layer 25 is provided between the pixel defining layer 24 and the light-emitting layer 26, and the first functional layer 25 may include a hole injection layer and a hole transport layer.
  • the second functional layer 27 is provided between the light-emitting layer 26 and the cathode 28.
  • the second functional layer 27 is provided with a first connection hole 271, and the first connection hole 271 penetrates the The second functional layer 27 and the first functional layer 25, and the cathode 28 is connected to the connecting portion 232 through the first connecting hole 271.
  • the second functional layer 27 may include an electron transport layer and an electron injection layer.
  • the display panel may also include film layers such as an encapsulation layer and/or a cover plate.
  • the first metal layer 17 may further include a second conductive portion (not shown in the figure), and the signal line 213 is connected to the second conductive portion.
  • the second metal layer 19 includes a first conductive portion, and the signal line 213 is connected to the first conductive portion (not shown in the figure). At this time, the signal line 213 is used to connect the connecting portion 232 with the first conductive portion or the second conductive portion.
  • FIG. 7 The structure diagram of the pixel driving circuit corresponding to the above display panel is shown in FIG. 7. Compared with FIG. 1, the signal line 213 is added in FIG. 7, and the signal line 213 is connected to the cathode. The voltage is the same, and the signal line 213 and the cathode are both connected to the power supply low voltage VSS.
  • the cathode 28 Since the cathode 28 is connected to the signal line 213, the supply of the in-plane cathode 28 can be increased, and the impedance of the cathode 28 can be reduced, so that the cathode voltage at the far end of the input is the same as the cathode voltage at the near end of the input, and the cathode voltage at the far end of the input is not dropped. , So that the cathode voltage distribution in the plane is uniform, thereby improving the uniformity of brightness.
  • FIG. 4 only shows the structure of the display panel of one of the embodiments, but it does not limit the present invention.
  • the manufacturing method of the above-mentioned display panel includes:
  • the semiconductor layer 15, the first insulating layer 16, the gate electrode 171, the second insulating layer 18, the metal part 191, and the third insulating layer 20 are sequentially fabricated on the substrate 10; Second via
  • the first via hole penetrates the third insulating layer 20, the second insulating layer 18, and the first insulating layer 16; the source electrode 211 and the drain electrode 212 are connected to the semiconductor layer 15 through the second via hole.
  • the patterning process may include steps such as exposure, development, and etching.
  • the anode 231 is connected to the drain 212 through the third via hole (not shown in the figure), and the connection portion 232 is connected to the signal line through the second connection hole (not shown in the figure). 213 connections.
  • One of them is to use a metal mask 30 with an opening 31, and use oxygen (O 2 ) to perform ashing (Ash) treatment on the second functional layer 27 and the first functional layer 25 at the position of the opening 31 to remove the function Layers, forming connection holes.
  • Another method is to use a quartz mask.
  • the quartz mask is provided with a light-shielding layer outside the opening. First, ultraviolet radiation is used to change the characteristics of the functional layer in the opening area, and then oxygen (O 2 ) After ashing (Ash) treatment, the functional layer irradiated by ultraviolet rays is removed to form a connection hole.
  • the present invention also provides a display module, which includes any of the above-mentioned display panels.
  • the display module may also include a touch layer.
  • the present invention also provides an electronic device, which includes any one of the above-mentioned display modules.
  • the electronic device can be a mobile phone, a tablet computer, a computer, and other equipment.
  • the display panel, display module, and electronic device of the present invention include a third metal layer, which is arranged on the first metal layer, the third metal layer includes signal lines, and a conductive layer, which is arranged on the third metal layer
  • the conductive layer includes an anode and a connecting portion; the connecting portion is connected to the signal line; a pixel definition layer is provided on the conductive layer, and the pixel definition layer includes a first opening area and a second opening area
  • the light-emitting layer is located in the first opening area; the cathode is located in the second opening area and on the light-emitting layer and the pixel defining layer, the cathode is connected to the connecting portion, because the cathode is It is connected to the signal line, so the impedance of the cathode is reduced, so that the cathode voltage distribution in the plane is uniform, thereby improving the uniformity of the brightness.

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Abstract

一种显示面板、显示模组及电子装置,显示面板包括:第三金属层(21)包括信号线(213);导电层(23)包括连接部(232);连接部(232)与信号线(213)连接;像素定义层(24),设于导电层(23)上,像素定义层(24)包括第一开口区域(101)和第二开口区域(102);阴极(28),设于第二开口区域(102)内和像素定义层(24)上,阴极(28)与连接部(232)连接。

Description

一种显示面板、显示模组及电子装置 技术领域
本发明涉及显示技术领域,特别是涉及一种显示面板、显示模组及电子装置。
背景技术
目前,有机发光二极管显示面板按出光方向的不同,可分为底发射和顶发射两种结构。底发射结构的光从阳极透射出去,因阵列基板侧的布线密集度较高,透光率较低,因此底发射结构常用于大尺寸低像素密度的产品。顶发射结构中,有机发光二极管发出的光从阴极透射出去。
技术问题
然而,随着有机发光二极管显示面板尺寸的增大,以及阴极材料本身的阻抗较大,会导致输入远端的阴极电压下降较明显,从而使得面内的阴极电压的均一性降低,进而造成亮度不均。
因此,有必要提供一种显示面板、显示模组及电子装置,以解决现有技术所存在的问题。
技术解决方案
本发明的目的在于提供一种显示面板、显示模组及电子装置,能够提高亮度的均一性。
为解决上述技术问题,本发明提供一种显示面板,包括:
基底;
半导体层,设于所述基底上;
第一金属层,设于所述半导体层上;所述第一金属层包括栅极;
第三金属层,设于所述第一金属层上,所述第三金属层包括信号线;
导电层,设于所述第三金属层上;所述导电层包括阳极和连接部;所述连接部与所述信号线连接;
像素定义层,设于所述导电层上,所述像素定义层包括第一开口区域和第二开口区域;
发光层,位于所述第一开口区域内;
阴极,设于所述第二开口区域内、所述发光层以及所述像素定义层上,所述阴极与所述连接部连接。
本发明还提供一种显示模组,其包括上述显示面板。
本发明还提供一种电子装置,其包括上述显示模组。
有益效果
本发明的显示面板、显示模组及电子装置,包括第三金属层,设于所述第一金属层上,所述第三金属层包括信号线;导电层,设于所述第三金属层上;所述导电层包括阳极和连接部;所述连接部与所述信号线连接;像素定义层,设于所述导电层上,所述像素定义层包括第一开口区域和第二开口区域;发光层,位于所述第一开口区域内;阴极,设于所述第二开口区域内以及所述发光层和所述像素定义层上,所述阴极与所述连接部连接,由于将阴极与信号线相连,因此减小阴极的阻抗,使得面内阴极电压分布均匀,从而提高亮度的均一性。
附图说明
图1为现有像素驱动电路的结构示意图;
图2为现有图1所示的像素驱动电路的一种工作时序示意图;
图3为现有显示面板的剖面示意图;
图4为本发明一实施例的显示面板的剖面示意图;
图5为本发明一实施例的显示面板的制作方法的第五步的结构示意图;
图6为本发明一实施例的显示面板的制作方法的第八步的结构示意图;
图7为本发明一实施例的像素驱动电路的结构示意图。
本发明的实施方式
以下各实施例的说明是参考附加的图式,用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语,例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本发明,而非用以限制本发明。在图中,结构相似的单元是以相同标号表示。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别不同对象,而不是用于描述特定顺序。此外,术语“包括”和“具有”以及它们任何变形,意图在于覆盖不排他的包含。
如图1和图2所示,现有的7T1C的像素驱动电路包括驱动晶体管T1和第二晶体管T2至第七晶体管T7。
第二晶体管T2的栅极接入第二扫描信号Scan[n],源极接入数据电压Vdata,漏极与驱动晶体管T1的源极连接;
驱动晶体管T1的栅极与第三晶体管T3的源极连接,漏极与第三晶体管T3的漏极连接;
第五晶体管T5的栅极接入发光信号EM,源极接入数据电压VDD,漏极与驱动晶体管T1的源极连接;
第三晶体管T3的栅极接入第二扫描信号Scan[n],漏极与驱动晶体管T1的漏极连接;
第四晶体管T4的栅极接入第一扫描信号Scan[n-1],源极与第三晶体管T3的源极连接,漏极与第七晶体管T7的源极均与低电平信号VI连接;
第六晶体管T6的栅极接入发光信号EM,源极与驱动晶体管T1的漏极连接,漏极与第七晶体管T7的漏极连接以及有机发光二极管连接,第七晶体管T7的栅极接入第三扫描信号XScan[n]。
具体工作过程中包括以下阶段:
该像素驱动电路工作过程分为三个阶段:初始化阶段(t1)、阈值电压补偿阶段(t2)、发光阶段(t3),具体如下:
以T1至T7为P型晶体管为例,初始化阶段(t1):Scan[n-1]输出低电平,使得晶体管T4打开,Scan[n]、XScan[N]及EM输出高电平,使得T2、T3、T5、T6、T7关闭,VI信号(低电位)通过T4对驱动晶体管T1的栅极进行复位;
阈值电压补偿阶段(t2):Scan[n-1]及EM输出高电平,使得晶体管T4、T5、T6关闭,Scan[n]和XScan[n]输出低电平,使得T2、T3、T7打开,上一阶段T1的栅极为低电位,T1处于打开状态,数据电压Vdata通过T2、T1、T3对T1的栅极进行充电,当T1栅极与源极电位差为其阈值电压时(即VA-Vdata=Vth),T1不再满足打开条件,阈值电压补偿阶段结束,此时第一晶体管T1栅极的电位为:Vdata+Vth,同时VI信号通过T7对发光器件的阳极进行复位。
发光阶段(t3):Scan[n-1]、Scan[n]和XScan[N]输出高电平,使得晶体管T2、T3、T4、T7关闭,EM输出低电平,使得T5、T6打开,VDD通过T5、T1、T6给发光器件的阳极供电,驱动晶体管T1输出电流以驱动发光器件发光。
如图3所示,现有显示面板包括第一柔性衬底11、第一阻挡层12、第二柔性衬底13、第二阻挡层14、缓冲层14’、半导体层15(Poly)、第一绝缘层16、栅极171、第二绝缘层18、金属部191、第三绝缘层20、源极211和漏极212、平坦层22、阳极231(ANO)、像素定义层24(PDL)、第一功能层25、发光层26、第二功能层27、阴极28(Cathode)等。
请参照图4至图7,图4为本发明一实施例的显示面板的剖面示意图。
如图4所示,本实施例的显示面板包括基底10、半导体层15、第一金属层17、第二金属层19、导电层23、像素定义层24、发光层26以及阴极28,此外还可包括缓冲层14’、第一绝缘层16、第二绝缘层18、第三绝缘层20以及平坦层22中的至少一种。
其中基底10可为柔性基底或者玻璃基板,在一实施方式中,基底10可包括第一柔性衬底11、第一阻挡层12、第二柔性衬底13以及第二阻挡层14。其中第一柔性衬底11和第二柔性衬底13的材料均可为聚酰亚胺。
缓冲层14’设于所述基底10上。缓冲层14’的材料可以包括SiNx和SiO 2中的至少一种。
半导体层15设于所述缓冲层14’上。所述半导体层15的材料可为多晶硅。
第一绝缘层16设于所述半导体层15上,所述第一绝缘层16的材料包括SiNx和SiO 2中的至少一种。
第一金属层17设于所述第一绝缘层16上;所述第一金属层17包括栅极171。
第二绝缘层18设于所述第一金属层17上,所述第二绝缘层18的材料包括SiNx和SiO 2中的至少一种。
第二金属层19设于所述第二绝缘层18上;所述第二金属层19包括金属部191,所述金属部191与所述栅极171的位置对应。所述金属部191与所述栅极171形成电容。
第三绝缘层20设于所述第二金属层19上,所述第三绝缘层20的材料包括SiNx和SiO 2中的至少一种。其中,在一实施方式中,为了更加提高亮度的均一性,所述第三绝缘层20上设置有第一过孔(图中未标出),所述第一过孔贯穿所述第一绝缘层16、所述第二绝缘层18以及所述第三绝缘层20。
第三金属层21设于所述第三绝缘层20上,所述第三金属层21包括信号线213。所述信号线213接入有第一电源电压,所述第一电源电压小于预设值。第一电源电压可为直流低电平电压。在一实施方式中,所述第三金属层21还设于所述第一过孔内,以形成所述信号线213。在一实施方式中,为了简化制程工艺,降低生产成本,所述第三金属层21包括源极211和漏极212,也即信号线213、源极211和漏极212位于同一金属层。其中第一过孔与所述信号线213的位置对应。
平坦层22设于所述第三金属层21上,所述平坦层22上设置有第二连接孔(图中未标出),所述连接部232通过所述第二连接孔与所述信号线213连接。第二连接孔与所述连接部232的位置对应。
导电层23设于所述平坦层22上;所述导电层23包括阳极231和连接部232;所述连接部232与所述信号线213连接;所述导电层23的材料为透明导电材料,比如为氧化铟锡。
结合图5,像素定义层24设于所述导电层23上,所述像素定义层24包括第一开口区域101和第二开口区域102。
发光层26位于所述第一开口区域101内;
阴极28设于所述第二开口区域102内以及所述发光层26和所述像素定义层24上,所述阴极28与所述连接部232连接。其中所述阴极28的材料可为是镁银合金(Mg/Ag),在一实施方式中,所述阴极28的厚度约为100Å,所述阴极28层的阻抗小于20Ω。
此外,显示面板还可包括第一功能层25和第二功能层27。
第一功能层25设于所述像素定义层24和所述发光层26之间,所述第一功能层25可包括空穴注入层和空穴传输层。
第二功能层27设于所述发光层26和所述阴极28之间,结合图6,所述第二功能层27上设置有第一连接孔271,所述第一连接孔271贯穿所述第二功能层27和所述第一功能层25,所述阴极28通过所述第一连接孔271与所述连接部232连接。第二功能层27可包括电子传输层和电子注入层。
此外,该显示面板还可包括封装层和/或者盖板等膜层。
在另一实施例中,所述第一金属层17还可包括第二导电部(图中未标出),所述信号线213与所述第二导电部连接。在又一实施例中,所述第二金属层19包括第一导电部,所述信号线213与所述第一导电部(图中未标出)连接。此时信号线213用于将连接部232与第一导电部或第二导电部进行连接。
上述显示面板对应的像素驱动电路的结构示意图如图7所示,图7相较于图1增加了信号线213,且信号线213与阴极连接,信号线213接入的电压与阴极接入的电压相同,其中信号线213和阴极均接入电源低电压VSS。
由于将阴极28与信号线213相连,可增加面内阴极28的供给,减小阴极28的阻抗,使输入远端的阴极电压与输入近端的阴极电压相同,避免输入远端的阴极电压下降,使得面内阴极电压分布均匀,从而提高亮度的均一性。
可以理解的是,图4仅给出其中一种实施方式的显示面板的结构,但是并不能对本发明构成限定。在一实施方式中,结合图5和图6,上述显示面板的制作方法包括:
S101、在基底10上依次制作半导体层15、第一绝缘层16、栅极171、第二绝缘层18、金属部191、第三绝缘层20;在第三绝缘层20制作第一过孔和第二过孔;
其中所述第一过孔贯穿所述第三绝缘层20、所述第二绝缘层18以及第一绝缘层16;源极211和漏极212通过第二过孔与半导体层15连接。
S102、在所述第一过孔、所述第二过孔内以及第三绝缘层20上制作第三金属层21,对第三金属层21进行图案化处理形成源极211和漏极212以及信号线213。
图案化工艺可以包括曝光、显影、蚀刻等步骤。
S103、在所述第三金属层21上制作平坦层22,在所述平坦层22上制作第二连接孔和第三过孔;
S104、在所述第二连接孔和所述第三过孔内制作导电层23,对所述导电层23进行图案化处理,形成阳极231和连接部232;
所述阳极231通过所述第三过孔(图中未标出)与所述漏极212连接,所述连接部232通过所述第二连接孔(图中未标出)与所述信号线213连接。
S105、在所述导电层23上制作像素定义层24,对所述像素定义层24进行图案化处理,形成第一开口区域101和第二开口区域102;
S106、在所述第一开口区域101和所述第二开口区域102内以及所述像素定义层24上制作第一功能层25;
S107、在位于所述第一开口区域101内的第一功能层25上制作发光层26;
S108、在所述发光层26上制作第二功能层27,对所述第二功能层27进行图案化处理,形成第一连接孔271;
其中一种是采用具有开孔31的金属掩膜板30,利用氧气(O 2)对开孔31位置处的第二功能层27以及第一功能层25进行灰化(Ash)处理,去除功能层,形成连接孔。另外一种方法是采用石英掩膜板,石英掩膜板中在开孔以外的位置设置有遮光层,首先利用紫外线照射,使开孔区域内的功能层特性发生改变,再利用氧气(O 2)进行灰化(Ash)处理,被紫外线照过的功能层被去除,形成连接孔。
S109、在所述第一连接孔271内以及所述第二功能层27上制作阴极28。
本发明还提供一种显示模组,其包括上述任意一种显示面板。该显示模组还可包括触控层。
本发明还提供一种电子装置,其包括上述任意一种显示模组。该电子装置可以为手机、平板电脑、电脑等设备。
本发明的显示面板、显示模组及电子装置,包括第三金属层,设于所述第一金属层上,所述第三金属层包括信号线;导电层,设于所述第三金属层上;所述导电层包括阳极和连接部;所述连接部与所述信号线连接;像素定义层,设于所述导电层上,所述像素定义层包括第一开口区域和第二开口区域;发光层,位于所述第一开口区域内;阴极,设于所述第二开口区域内以及所述发光层和所述像素定义层上,所述阴极与所述连接部连接,由于将阴极与信号线相连,因此减小阴极的阻抗,使得面内阴极电压分布均匀,从而提高亮度的均一性。
综上所述,虽然本发明已以优选实施例揭露如上,但上述优选实施例并非用以限制本发明,本领域的普通技术人员,在不脱离本发明的精神和范围内,均可作各种更动与润饰,因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种显示面板,其包括:
    基底;
    半导体层,设于所述基底上;
    第一金属层,设于所述半导体层上;所述第一金属层包括栅极;
    第三金属层,设于所述第一金属层上,所述第三金属层包括信号线;
    导电层,设于所述第三金属层上;所述导电层包括阳极和连接部;所述连接部与所述信号线连接;
    像素定义层,设于所述导电层上,所述像素定义层包括第一开口区域和第二开口区域;
    发光层,位于所述第一开口区域内;以及
    阴极,设于所述第二开口区域内、所述发光层以及所述像素定义层上,所述阴极与所述连接部连接。
  2. 根据权利要求1所述的显示面板,其还包括:
    第一功能层,设于所述像素定义层和所述发光层之间;以及
    第二功能层,设于所述发光层和所述阴极之间,所述第二功能层上设置有第一连接孔,所述第一连接孔贯穿所述第二功能层和所述第一功能层,所述阴极通过所述第一连接孔与所述连接部连接。
  3. 根据权利要求1所述的显示面板,其还包括:
    平坦层,位于所述第三金属层和所述导电层之间,所述平坦层上设置有第二连接孔,所述连接部通过所述第二连接孔与所述信号线连接。
  4. 根据权利要求1所述的显示面板,其中
    所述第一金属层和所述第二金属层之间设置有第二金属层,所述第二金属层包括金属部,所述金属部与所述栅极的位置对应。
  5. 根据权利要求4所述的显示面板,其中
    所述第二金属层包括第一导电部,所述信号线与所述第一导电部连接。
  6. 根据权利要求1所述的显示面板,其中
    所述第一金属层还包括第二导电部,所述信号线与所述第二导电部连接。
  7. 根据权利要求1所述的显示面板,其中所述信号线接入有第一电源电压,所述第一电源电压小于预设值。
  8. 根据权利要求1所述的显示面板,其中
    所述半导体层和所述第一金属层之间设置有第一绝缘层;
    所述第一金属层和所述第二金属层之间设置有第二绝缘层;
    所述第二金属层和所述第三金属层之间设置有第三绝缘层;
    所述第三绝缘层上设置有第一过孔,所述第一过孔贯穿所述第一绝缘层、所述第二绝缘层以及所述第三绝缘层;
    其中所述第三金属层还设于所述第一过孔内,以形成所述信号线。
  9. 根据权利要求1所述的显示面板,其中
    所述第三金属层还包括源极和漏极。
  10. 一种显示模组,其包括显示面板,其包括:基底;
    半导体层,设于所述基底上;
    第一金属层,设于所述半导体层上;所述第一金属层包括栅极;
    第三金属层,设于所述第一金属层上,所述第三金属层包括信号线;
    导电层,设于所述第三金属层上;所述导电层包括阳极和连接部;所述连接部与所述信号线连接;
    像素定义层,设于所述导电层上,所述像素定义层包括第一开口区域和第二开口区域;
    发光层,位于所述第一开口区域内;以及
    阴极,设于所述第二开口区域内、所述发光层以及所述像素定义层上,所述阴极与所述连接部连接。
  11. 根据权利要求10所述的显示模组,其中所述显示面板还包括:
    第一功能层,设于所述像素定义层和所述发光层之间;
    第二功能层,设于所述发光层和所述阴极之间,所述第二功能层上设置有第一连接孔,所述第一连接孔贯穿所述第二功能层和所述第一功能层,所述阴极通过所述第一连接孔与所述连接部连接。
  12. 根据权利要求10所述的显示模组,其中
    所述显示面板还包括:
    平坦层,位于所述第三金属层和所述导电层之间,所述平坦层上设置有第二连接孔,所述连接部通过所述第二连接孔与所述信号线连接。
  13. 根据权利要求10所述的显示模组,其中
    所述第一金属层和所述第二金属层之间设置有第二金属层,所述第二金属层包括金属部,所述金属部与所述栅极的位置对应。
  14. 根据权利要求13所述的显示模组,其中
    所述第二金属层包括第一导电部,所述信号线与所述第一导电部连接。
  15. 根据权利要求10所述的显示模组,其中
    所述第一金属层还包括第二导电部,所述信号线与所述第二导电部连接。
  16. 根据权利要求10所述的显示模组,其中所述信号线接入有第一电源电压,所述第一电源电压小于预设值。
  17. 根据权利要求10所述的显示模组,其中
    所述半导体层和所述第一金属层之间设置有第一绝缘层;
    所述第一金属层和所述第二金属层之间设置有第二绝缘层;
    所述第二金属层和所述第三金属层之间设置有第三绝缘层;
    所述第三绝缘层上设置有第一过孔,所述第一过孔贯穿所述第一绝缘层、所述第二绝缘层以及所述第三绝缘层;
    其中所述第三金属层还设于所述第一过孔内,以形成所述信号线。
  18. 根据权利要求10所述的显示模组,其中
    所述第三金属层还包括源极和漏极。
  19. 一种电子装置,其包括显示模组,其包括显示面板,其包括:基底;
    半导体层,设于所述基底上;
    第一金属层,设于所述半导体层上;所述第一金属层包括栅极;
    第三金属层,设于所述第一金属层上,所述第三金属层包括信号线;
    导电层,设于所述第三金属层上;所述导电层包括阳极和连接部;所述连接部与所述信号线连接;
    像素定义层,设于所述导电层上,所述像素定义层包括第一开口区域和第二开口区域;
    发光层,位于所述第一开口区域内;以及
    阴极,设于所述第二开口区域内、所述发光层以及所述像素定义层上,所述阴极与所述连接部连接。
  20. 根据权利要求19所述的电子装置,其中所述显示面板还包括:
    第一功能层,设于所述像素定义层和所述发光层之间;以及
    第二功能层,设于所述发光层和所述阴极之间,所述第二功能层上设置有第一连接孔,所述第一连接孔贯穿所述第二功能层和所述第一功能层,所述阴极通过所述第一连接孔与所述连接部连接。
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