WO2021187519A1 - 電子部品包装用カバーテープおよび包装体 - Google Patents

電子部品包装用カバーテープおよび包装体 Download PDF

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Publication number
WO2021187519A1
WO2021187519A1 PCT/JP2021/010788 JP2021010788W WO2021187519A1 WO 2021187519 A1 WO2021187519 A1 WO 2021187519A1 JP 2021010788 W JP2021010788 W JP 2021010788W WO 2021187519 A1 WO2021187519 A1 WO 2021187519A1
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WIPO (PCT)
Prior art keywords
cover tape
layer
heat seal
tape
antistatic
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PCT/JP2021/010788
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English (en)
French (fr)
Japanese (ja)
Inventor
保則 長塚
峻平 柳澤
真邦 井上
Original Assignee
大日本印刷株式会社
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Application filed by 大日本印刷株式会社 filed Critical 大日本印刷株式会社
Priority to CN202180021226.8A priority Critical patent/CN115298109B/zh
Priority to JP2022508406A priority patent/JP7201125B2/ja
Publication of WO2021187519A1 publication Critical patent/WO2021187519A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/34—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents and having several recesses to accommodate a series of articles or quantities of material

Definitions

  • This disclosure relates to a cover tape for packaging electronic components and a packaging body using the same.
  • the inventors of the present disclosure when the package is stored or transported, even if there is no problem when the package is stored or transported in a sufficiently controlled normal temperature and humidity environment. It was found that when exposed to a high temperature and high humidity environment, there is a problem that electronic components adhere to the cover tape when the cover tape is peeled from the carrier tape.
  • the present disclosure may be referred to as a phenomenon in which electronic components adhere to a cover tape when the package is exposed to a high temperature and high humidity environment during storage or transportation (hereinafter, referred to as "adhesion phenomenon due to high temperature and high humidity"). It is an object of the present invention to provide a cover tape for packaging electronic parts which can suppress (there is).
  • a cover tape for packaging electronic components having an arranged antistatic layer which is stored for 24 hours in an environment of 60 ° C. and 95% RH in the state of a package using a carrier tape.
  • the surface resistivity measured from the antistatic layer side of the above is 1 ⁇ 10 10 ⁇ / ⁇ or less, and the package is stored in a package using a carrier tape in an environment of 60 ° C. and 95% RH for 24 hours.
  • the surface tack force measured from the heat seal layer side of the cover tape after the moist heat load is measured from the heat seal layer side of the cover tape before the moist heat load.
  • the carrier tape having a plurality of storage portions for storing electronic components, the electronic components stored in the storage portions, and the electronic component packaging arranged so as to cover the storage portions. It is a packaging body provided with a cover tape for use.
  • the cover tape for packaging electronic components of the present disclosure According to the cover tape for packaging electronic components of the present disclosure, the adhesion phenomenon due to high temperature and high humidity can be suppressed. Therefore, by using the cover tape for packaging electronic components and the packaging body of the present disclosure, it is possible to improve the mounting of electronic components.
  • the mode of arranging another member on one member when it is simply described as “above” or “below”, it is in contact with a certain member unless otherwise specified. Including the case where another member is arranged directly above or directly below, and the case where another member is arranged above or below a certain member via another member. Further, in the present specification, when expressing the mode of arranging another member on the surface of a certain member, when simply expressing "on the surface side" or “on the surface”, unless otherwise specified, the certain member is used. It includes both the case where another member is arranged directly above or directly below the member so as to be in contact with each other, and the case where another member is arranged above or below one member via another member. Further, in the present specification, unless otherwise specified, the numerical value is an average value after excluding specific values.
  • cover tape for packaging electronic components may be simply referred to as a "cover tape”.
  • the cover tape of the present disclosure is opposite to the surface of the base material layer, the heat seal layer arranged on one surface side of the base material layer, and the surface of the base material layer on the heat seal layer side. It has an antistatic layer arranged on the surface side.
  • the cover tape is stored in a package using a carrier tape in an environment of 60 ° C. and 95% RH for 24 hours.
  • the surface resistivity of the cover tape measured from the antistatic layer side of the cover tape after a moist heat load is 1. ⁇ 10 10 ⁇ / ⁇ or less.
  • the cover tape is stored in a package using a carrier tape in an environment of 60 ° C. and 95% RH for 24 hours.
  • the surface tack force measured from the heat seal layer side of the cover tape after a moist heat load is 5 gf or less. Is.
  • FIG. 1 is a schematic cross-sectional view showing an example of the cover tape of the present disclosure.
  • the cover tape 1 of the present disclosure is arranged on one surface side of the base material layer 2 and the base material layer 2, and the heat seal layer 3 and the heat seal layer 3 side of the base material layer 2 are arranged. It has an antistatic layer 4 arranged on the surface side opposite to the surface of the surface.
  • an intermediate layer 5 may be arranged between the base material layer 2 and the heat seal layer 3, if necessary.
  • an adhesive layer may be arranged between the base material layer 2 and the intermediate layer 5.
  • a second antistatic layer different from the antistatic layer 4 or an antistatic layer is arranged on the surface side of the heat seal layer 3 opposite to the surface on the base material layer 2 side. good.
  • the cover tape 1 of the present disclosure has a surface resistivity of 1 ⁇ 10 10 ⁇ / ⁇ or less measured from the antistatic layer 4 side after a predetermined moist heat load, and is measured from the heat seal layer 3 side after a predetermined moist heat load.
  • the surface tack force applied is 5 gf or less.
  • Surface resistivity is the electrical resistivity per unit area of the surface, and is also called sheet resistivity or surface resistivity.
  • the surface resistivity is measured by the method described in [Measurement of surface resistivity] of the embodiment described later.
  • the surface resistivity measured from the antistatic layer side after the moist heat load is the surface of the antistatic layer side of the cover tape where the cover tape is not heat-sealed after the cover tape is peeled off from the package after the moist heat load, which will be described later. It is a value measured in.
  • Surface tack force is the adhesive force per unit area of the surface.
  • the surface tack force is measured by the method described in [Measurement of surface tack force] of the embodiment described later.
  • the surface tack force measured from the heat-sealed layer side after the moist heat load is the surface of the cover tape on the heat-sealed layer side where the cover tape is not heat-sealed after the cover tape is peeled off from the package after the moist heat load, which will be described later. It is a value measured in.
  • the moist heat load is a load given by storing the cover tape in the state of a package obtained by heat-sealing the cover tape on a paper carrier tape in an environment of 60 ° C. and 95% RH for 24 hours.
  • the conditions for the moist heat load will be described in [Method for producing a package] and [Method for moist heat load] in Examples described later.
  • Electronic components are packed as packaging at the electronic component manufacturing factory.
  • the package should be stored and transported in a well-controlled normal temperature and humidity environment so as not to be in a high temperature and high humidity environment.
  • Carrier tapes are roughly classified into plastic carrier tapes made of plastic and paper carrier tapes made of paper. Paper carrier tapes generally absorb moisture more easily than plastic carrier tapes, and are affected by high temperature and high humidity environments. Easy to receive. Therefore, dealing with the adhesion phenomenon due to high temperature and high humidity is an important issue.
  • the inventors of the present disclosure faced a problem that it is difficult to further reduce the adhesion phenomenon due to high temperature and high humidity to some extent by imparting antistatic performance to the cover tape. Therefore, as a result of diligent studies, the inventors of the present disclosure have found that it is important to set the surface tack force measured from the heat seal layer side after a predetermined moist heat load to 5 gf or less. Even if only the surface tacking force is reduced in a state where the antistatic performance is insufficient, the contribution of static electricity is large, so that the adhesion phenomenon due to high temperature and high humidity cannot be reduced.
  • the inventors of the present disclosure have arranged an antistatic layer on the surface opposite to the surface of the base material layer on the heat seal layer side, and the cover tape after a predetermined moist heat load. It was found that it is important that the surface resistivity measured from the antistatic layer side of the above is 1 ⁇ 10 10 ⁇ / ⁇ or less. Even when the antistatic layer is provided on the surface opposite to the surface of the base material layer on the heat seal layer side, the surface resistivity is usually measured from the surface of the cover tape on the heat seal layer side.
  • the inventors of the present disclosure have measured the surface of the cover tape from the surface on the antistatic layer side in order to reduce the adhesion phenomenon due to high temperature and high humidity while ensuring the desired heat sealing performance. It was found that the resistivity should be focused on.
  • the antistatic layer 4 is arranged on the surface opposite to the surface of the base material layer 2 on the heat seal layer 3 side, and the surface measured from the antistatic layer 4 side after a predetermined moist heat load.
  • the resistivity is 1 ⁇ 10 10 ⁇ / ⁇ or less.
  • it is said that good antistatic performance can be obtained when the surface resistivity is 1 ⁇ 10 10 ⁇ / ⁇ or less. If the antistatic performance on the antistatic layer 4 side is set to that level, even if the antistatic performance on the heat seal layer 3 side does not reach that level, the adhesion phenomenon due to high temperature and high humidity can be suppressed, and the adhesion phenomenon can be suppressed.
  • Surface resistivity measured from the antistatic layer 4 side after a predetermined wet heat load may be a 1 ⁇ 10 9 ⁇ / ⁇ under.
  • an antistatic agent that is not easily decomposed or deteriorated by heat or humidity is added to the antistatic layer. It can be adjusted by doing.
  • examples of such an antistatic agent include conductive polymers, polymer-type surfactants, and conductive inorganic particles.
  • the antistatic layer may be formed only with an antistatic agent. Further, an antistatic agent may be added to a layer other than the main antistatic layer, for example, a base material layer, a heat seal layer, an intermediate layer or an adhesive layer described later, to assist the antistatic layer.
  • the heat seal layer 3 is arranged on the surface opposite to the surface of the base material layer 2 on the antistatic layer 4 side, and the cover tape 1 is measured from the heat seal layer 3 side after a predetermined moist heat load.
  • the surface tack force is 5 gf or less.
  • a low-viscosity material or a hard material for the heat seal layer, cure the heat seal layer, and heat seal. It can be adjusted by a method such as a constant roughening of the surface of the layer or a thinning of the heat seal layer.
  • a material having better heat-sealing property but high viscosity and hardness and a material having relatively low heat-sealing property but having viscosity and hardness are high. It can be used in combination with low materials. Examples of such a material combination include a combination of a material having a relatively low melting point and glass transition temperature and a material having a relatively high melting point and glass transition temperature, a combination of a low molecular weight or medium molecular weight material and a polymer material, and a resin. Examples thereof include a combination of a material and an inorganic material.
  • polyethylene including a copolymer of ethylene and ⁇ -olefin
  • polyethylene including a copolymer of ethylene and ⁇ -olefin
  • an olefin-based resin other than polyethylene olefin-based resin and olefin-based
  • examples thereof include a combination with a thermoplastic resin other than the resin.
  • the surface tacking force of the heat-sealing layer can be adjusted by giving priority to ensuring the heat-sealing performance and using a layer other than the heat-sealing layer, for example, an intermediate layer, an adhesive layer, a base material layer, etc., which will be described later.
  • the surface tacking force can be reduced by using a hard material for the layer other than the heat seal layer or reducing the thickness of the layer other than the heat seal layer.
  • the surface tack force measured from the heat seal layer side of the cover tape after the moist heat load may be lower than the surface tack force before the moist heat load.
  • the layer or material constituting the cover tape is softened or deteriorated by a moist heat load, so that a high-temperature and high-humidity adhesion phenomenon is likely to occur.
  • the tacking force is reduced by the moist heat load, so that the adhesion phenomenon of high temperature and high humidity can be suppressed.
  • the surface tack force after the moist heat load may be 80% of the surface tack force before the moist heat load.
  • a material whose viscosity is lowered or hardened by the moist heat load can be used.
  • a material whose viscosity is lowered or hardened by the moist heat load can be used.
  • an ethylene-vinyl acetate copolymer may become hard due to high crystallinity and orientation due to a moist heat load.
  • the composition containing the heat-crosslinking agent may undergo a heat-crosslinking reaction and become hard due to a moist heat load.
  • the cover tape for packaging electronic components of the present disclosure completed by the inventors of the present disclosure and the like in this manner is exposed to a high temperature and high humidity environment when the package is stored and / or transported. Even so, the phenomenon of electronic components adhering to the cover tape (hereinafter, may be referred to as "adhesion phenomenon due to high temperature and high humidity”) can be suppressed.
  • the carrier tape used in combination with the cover tape of the present disclosure may be a plastic carrier tape or a paper carrier tape, but as described above, there are major problems inherent in the carrier tape. It is preferably a paper carrier tape.
  • the moist heat load is applied with the paper carrier tape because the carrier tape, which is more susceptible to the influence of humidity, is used to make the conditions more severe.
  • the temperature may reach 60 ° C and the humidity may reach 95% RH (Relative Humidity), but it is considered rare that the temperature reaches 60 ° C and 95% RH.
  • RH Relative Humidity
  • the heat seal layer is a layer arranged on one surface side of the base material layer.
  • the heat seal layer is heat-sealed against the carrier tape, so that the cover tape and the carrier tape are adhered to each other.
  • the heat seal layer may contain a thermoplastic resin.
  • thermoplastic resin One kind of thermoplastic resin may be used, or a plurality of kinds of thermoplastic resins may be used.
  • Thermoplastic resins include ethylene-vinyl acetate copolymers, olefin resins such as polyethylene (including copolymers of ethylene and ⁇ -olefin) and polypropylene (polymers of polypropylene and ⁇ -olefin), and acrylic resins. Examples thereof include resins, polyester resins, polyurethane resins, vinyl chloride-vinyl acetate copolymers, and the like.
  • the heat seal layer may contain additives such as a tackifier, an antistatic agent, and an antiblocking agent.
  • the heat seal layer As one of the specific examples of the heat seal layer, a case where a combination of an ethylene-vinyl acetate copolymer and polyethylene is used will be described. If necessary, it may contain an ethylene-vinyl acetate copolymer or a resin other than polyethylene.
  • the ethylene-vinyl acetate-based copolymer is a copolymer containing at least an ethylene monomer unit and a vinyl acetate monomer unit.
  • the content of ethylene in the ethylene-vinyl acetate copolymer is not particularly limited, but can be 60% by mass or more and 97% by mass or less, and 80% by mass or more and 95% by mass or less.
  • the content of vinyl acetate in the ethylene-vinyl acetate-based copolymer is not particularly limited, but can be 3% by mass or more and 40% by mass or less, and 5% by mass or more and 20% by mass or less.
  • the ethylene-vinyl acetate copolymer may contain a third monomer unit in addition to the ethylene monomer unit and the vinyl acetate monomer unit.
  • the third monomer unit may contain a functional group having an antistatic property.
  • the content of the ethylene-vinyl acetate copolymer in the heat seal layer is not particularly limited, but can be 50% by mass or more and 90% by mass or less, and 60% by mass or more and 80% by mass or less. Increasing the content of the ethylene-vinyl acetate copolymer improves the heat-sealing performance, but tends to increase the surface tacking force.
  • polyethylene examples include polyethylene such as low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, and high-density polyethylene. From the viewpoint of ease of mixing with ethylene-vinyl acetate copolymer, low density polyethylene (LDPE, density 0.910 to less than 0.930) and linear low density polyethylene (LLDPE, density 0.910 to 0. 925) can be used.
  • LDPE low density polyethylene
  • LLDPE linear low density polyethylene
  • LLDPE linear low density polyethylene
  • the content of the polyethylene resin in the heat seal layer is not particularly limited, but can be 10% by mass or more and less than 50% by mass, and 20% by mass or more and 40% by mass or less. Increasing the polyethylene content reduces the heat sealing performance, but tends to reduce the surface tacking force.
  • the thickness of the heat seal layer can be, for example, 1 ⁇ m or more and 60 ⁇ m or less. In the case of paper carrier tape, the thickness of the heat seal layer may be, for example, 10 ⁇ m or more and 60 ⁇ m or less.
  • Examples of the method for forming the heat seal layer include a coating method, an inflation method, and a T-die extrusion method.
  • the antistatic layer is arranged on the surface opposite to the surface of the base material layer on the heat seal layer side, and is a layer for preventing the cover tape from being charged.
  • the antistatic layer may contain an antistatic agent.
  • the antistatic agent include conductive polymers, polymer-type surfactants, low-molecular-weight surfactants, and conductive inorganic particles.
  • the conductive polymer include polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyphenylene vinylene, polyvinylcarbazole and the like.
  • the polymer-type surfactant include a polymer-type quaternary ammonium salt and the like.
  • the antistatic layer may contain, for example, a binder such as a resin or an additive such as an anti-blocking agent.
  • a crosslinked resin can be used as the binder of the antistatic layer.
  • the thickness of the antistatic layer can be, for example, 0.02 ⁇ m or more and 3 ⁇ m or less. Examples of the method for forming the antistatic layer include a coating method.
  • the base material layer is a layer that supports the heat seal layer and the antistatic layer.
  • the base material layer include polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymer, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer, nylon 6, nylon 66, and the like.
  • polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymer, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer, nylon 6, nylon 66, and the like.
  • polyamides such as nylon 610
  • polyolefins such as polyethylene, polypropylene and polymethylpentene.
  • the base material layer may contain additives such as a filler, a plasticizer, a colorant,
  • the base material layer may be a single layer or a laminated body of a plurality of layers of the same type or different types. Further, the base material layer may be a stretched film or an unstretched film.
  • the base material layer may be subjected to easy-adhesion treatment such as corona discharge treatment, plasma treatment, ozone treatment, frame treatment, preheat treatment, dust removal treatment, thin film deposition treatment, alkali treatment, and sandblast treatment.
  • the thickness of the base material layer can be, for example, 2.5 ⁇ m or more and 300 ⁇ m or less, 6 ⁇ m or more and 100 ⁇ m or less, and 12 ⁇ m or more and 50 ⁇ m or less.
  • An intermediate layer may be provided between the base material layer and the heat seal layer.
  • the intermediate layer can improve the adhesion between the base material layer and the heat seal layer. Further, the intermediate layer improves the cushioning property, and heat is applied to the heat-sealing layer more uniformly when the cover tape is heat-sealed to the carrier tape.
  • the material of the intermediate layer include polyolefins such as polyethylene and polypropylene, polyurethane, polyester and the like.
  • the thickness of the intermediate layer can be, for example, 5 ⁇ m or more and 50 ⁇ m or less.
  • An adhesive layer may be provided between the base material layer and the intermediate layer.
  • the adhesive layer By forming the adhesive layer on the base material layer, the adhesion between the base material layer and the intermediate layer is improved even when the base material layer has poor adhesive strength.
  • the material of the adhesive layer include acrylic, isocyanate-based, urethane-based, and ester-based adhesives.
  • the thickness of the adhesive layer can be, for example, 0.1 ⁇ m or more and 1 ⁇ m or less.
  • the surface resistivity measured from the antistatic layer side of the cover tape before the moist heat load can be 1 ⁇ 10 10 ⁇ / ⁇ or less, and can be less than 1 ⁇ 10 9 ⁇ / ⁇ . Further, the surface tack force measured from the heat seal layer side of the cover tape before the moist heat load can be 30 gf or less and 20 gf or less.
  • the heat seal strength of the cover tape before moist heat load can be 5 gf or more and 50 fg or less, and 15 gf or more and 40 gf or less. Further, the heat seal strength of the cover tape after a moist heat load can be 5 gf or more and 50 fg or less, and 15 gf or more and 40 gf or less. It is possible to suppress the risk of problems such as peeling when packaging electronic components and the risk of the cover tape being unintentionally peeled during storage or transportation. The heat seal strength is measured by the method described in [Measurement of heat seal strength] of Examples described later.
  • the packaging body of the present disclosure includes a carrier tape having a plurality of storage portions for storing electronic parts, electronic parts stored in the storage parts, and the above-mentioned cover tape arranged so as to cover the storage parts. And. According to the package of the present disclosure, the adhesion phenomenon due to high temperature and high humidity can be suppressed.
  • FIGS. 3A and 3B are schematic plan views and cross-sectional views showing an example of a package using the cover tape for packaging electronic components of the present disclosure
  • FIG. 3 (b) is A of FIG. 3 (a). It is a cross-sectional view taken along the line A.
  • the package 10 stores the carrier tape 11 having a plurality of storage portions 12 for storing the electronic components 13, the electronic components 13 stored in the storage portions 12, and the electronic components 13.
  • a cover tape 1 arranged so as to cover the portion 12 is provided.
  • the cover tape 1 is heat-sealed on the carrier tape 11, and heat-sealing portions 3h are provided on both ends of the heat-sealing layer 3 of the cover tape 1 in a line shape with a predetermined width. Further, in the package 10, the carrier tape 11 can have feed holes 14 arranged at a pitch a in one direction.
  • the heat seal layer of the cover tape and the carrier tape are adhered at the heat seal portion.
  • the heat-sealing portion can be arranged, for example, in a part of the portion where the heat-sealing layer of the cover tape comes into contact with the carrier tape. That is, the heat-sealing layer may have a heat-sealing portion and a non-heat-sealing portion. Thereby, the peelability of the cover tape with respect to the carrier tape can be improved.
  • the carrier tape is a member having a plurality of storage portions for storing electronic components.
  • the carrier tape may be any one having a plurality of storage portions, and for example, any of an embossed carrier tape, a punch carrier tape, and a press carrier tape can be used.
  • the material of the carrier tape include plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, and ABS resin, and paper.
  • the term "paper” refers to a paper containing cellulose as a main component, and may further contain a resin component and a small molecule component such as glue or filler.
  • the electronic components are not particularly limited, and for example, ICs, resistors, capacitors, inductors, transistors, diodes, LEDs (light emitting diodes), liquid crystals, piezoelectric element registers, filters, crystal oscillators, crystal oscillators, connectors, switches, etc. Volumes, relays, etc. can be mentioned.
  • Example 1 As a base material layer, a 25 ⁇ m-thick biaxially stretched polyethylene terephthalate film (FE2002 manufactured by Futamura Chemical Co., Ltd., hereinafter referred to as PET film) having corona treatment on both sides was prepared.
  • An antistatic layer was formed by applying (0.0%) (Wet application amount 3.5 g / m 2).
  • An amount of 1.0 g / m 2 was applied to form an adhesive layer.
  • polyethylene CE4009 manufactured by Sumitomo Chemical Co., Ltd.
  • polyethylene Sumicasen L705 manufactured by Sumitomo Chemical Co., Ltd.
  • an ethylene-vinyl acetate copolymer having antistatic performance Melt (registered trademark) M (MX53C) Tosoh) are melt-extruded.
  • Example 1 A material obtained by mixing 40/60 (mass ratio) with (manufactured by the company) was laminated to a thickness of 20 ⁇ m each to form an intermediate layer and a heat seal layer, respectively. As a result, the cover tape of Example 1 was produced.
  • Example 2 As the heat seal layer material in Example 1, polyethylene (manufactured by Sumikasen L705 Sumitomo Chemical Co., Ltd.) and an ethylene-vinyl acetate composite having antistatic performance (Melsen (registered trademark) M (MX53C) manufactured by Tosoh Co., Ltd.) were used on 20/80.
  • the cover tape of Example 2 was produced in the same manner as in Example 1 except that the mixed material was changed to (mass ratio).
  • Example 3 The heat-sealing layer material in Example 1 is polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) and an ethylene-vinyl acetate composite having antistatic performance (Melsen (registered trademark) M (MX53C) manufactured by Tosoh Co., Ltd.) 60/40.
  • the cover tape of Example 3 was produced in the same manner as in Example 1 except that the mixed material was changed to (mass ratio).
  • Example 4 The heat-sealed layer material in Example 1 was an ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) 63.2% by mass, low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) 26.4. Weight%, modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) 8% by mass, antistatic masterbatch (Rikemaster ELB-347, manufactured by RIKEN Vitamin Co., Ltd.
  • Example 4 (containing 25% antistatic agent) 2.4% by mass)
  • the cover tape of Example 4 was prepared in the same manner as in Example 1 except that the intermediate layer material in Example 1 was changed to polyethylene resin (Novatec LC600A, manufactured by Nippon Polyethylene Co., Ltd.). bottom.
  • Example 5 The heat-sealed layer material in Example 1 was an ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) 44.8% by mass, low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) 44.8. Mass%, modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) 8 mass%, antistatic masterbatch (Rikemaster ELB-347, manufactured by Riken Vitamin Co., Ltd.
  • Example 5 (containing 25% antistatic agent) 2.4 mass
  • the cover tape of Example 5 was applied in the same manner as in Example 1 except that the mixed material was changed to% and the intermediate layer material in Example 1 was changed to polyethylene resin (Novatec LC600A, manufactured by Nippon Polyethylene Co., Ltd.). Made.
  • Example 6 The heat-sealed layer material in Example 1 was an ethylene-vinyl acetate copolymer (Evaflex EV2350, manufactured by Mitsui Dow Polychemical Co., Ltd.) 78.8% by mass, and low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) 8.8. Mass%, modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) 10 mass%, antistatic masterbatch (Rikemaster ELB-347, manufactured by RIKEN Vitamin Co., Ltd. (containing 25% antistatic agent)) 2.4 mass
  • the cover tape of Example 6 was prepared in the same manner as in Example 1 except that the mixed material was changed to%.
  • Example 1 The same method as in Example 1 except that the heat seal layer material in Example 1 was changed to an ethylene-vinyl acetate copolymer having antistatic performance (Melsen (registered trademark) M (MX53C) manufactured by Tosoh Corporation). , The cover tape of Comparative Example 1 was prepared.
  • Comparative Example 2 The cover tape of Comparative Example 2 was produced in the same manner as in Example 4 except that the antistatic layer was not provided in the cover tape of Example 4.
  • Taping machine NST-35 (manufactured by Nitto Kogyo Co., Ltd.) Paper carrier tape: Hokuetsu Corporation 0.31mmt 8mm width (virgin paper) Paper carrier tape feed hole pitch: 2 mm Cover tape width: 5.25 mm width Taping temperature: 180 ° C Taping speed: 3500 tact taping trowel size: 0.6 mm x 2 wires Taping trowel length (seal length at 1 tact) 8 ⁇ 1 mm Electronic components: 0402 size capacitors
  • the surface resistivity was measured using a surface resistivity meter (Mitsubishi Chemical Analytech Hiresta UP MCP-HT450) under the following test conditions.
  • Probe UA probe Applicable voltage: 10 Less than 10 ⁇ / ⁇ 10 V 10 10 to 10 12 ⁇ / ⁇ 500 V 10 13 ⁇ / ⁇ or more 1000 V Measurement points: Central part of the sample Measured value: Measure 5 points so that the measurement points do not overlap, and use the average value.
  • One measurement time Use the display after 10 seconds.
  • the surface tacking force was measured using a tacking tester (TAC-2, manufactured by RHESCA) under the following measurement conditions and measurement procedure.
  • the number of abnormal behaviors of electronic components when the cover tape was peeled off from the package obtained by the above manufacturing method was measured. Specifically, the cover tape was peeled off from the roll-shaped package at a speed of 100 mm / sec using a cover tape peeling device (W08f Intelligent Feeder, manufactured by FUJI). The peeling was performed in an environment of 25 ⁇ 3 ° C. and 30 ⁇ 5% RH, and was completed in 10 seconds. The behavior of electronic components during peeling was observed with a high-speed camera.
  • W08f Intelligent Feeder manufactured by FUJI
  • the number of abnormal behaviors was calculated by visually observing the number of abnormal behaviors while playing back the images taken by the high-speed camera in slow motion.
  • the cover tapes of Examples 1 to 6 had fewer abnormal behaviors after a moist heat load than the cover tapes of Comparative Examples 1 and 2.
  • the cover tape of Comparative Example 1 since the surface tack force measured from the heat seal layer side after the moist heat load exceeds 5 gf, the number of abnormal behaviors after the moist heat load is the cover tape of Examples 1 to 6. Was more than.
  • the surface tack force measured from the heat seal layer side after the moist heat load is 5 gf or less, but the surface resistivity measured from the antistatic layer side after the moist heat load is 1 ⁇ . Since it exceeds 10 10 ⁇ / ⁇ , the number of abnormal behaviors after moist heat loading was larger than that of the cover tapes of Examples 1 to 6.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
PCT/JP2021/010788 2020-03-17 2021-03-17 電子部品包装用カバーテープおよび包装体 WO2021187519A1 (ja)

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