WO2021184210A1 - 一种显示面板、显示装置及显示面板的制作方法 - Google Patents

一种显示面板、显示装置及显示面板的制作方法 Download PDF

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Publication number
WO2021184210A1
WO2021184210A1 PCT/CN2020/079760 CN2020079760W WO2021184210A1 WO 2021184210 A1 WO2021184210 A1 WO 2021184210A1 CN 2020079760 W CN2020079760 W CN 2020079760W WO 2021184210 A1 WO2021184210 A1 WO 2021184210A1
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WIPO (PCT)
Prior art keywords
polarizer
display module
cover plate
heat sink
display
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PCT/CN2020/079760
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English (en)
French (fr)
Inventor
王佳祥
罗永辉
冯彬峰
张子杰
冉海龙
李飞
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202080000280.XA priority Critical patent/CN113906336B/zh
Priority to PCT/CN2020/079760 priority patent/WO2021184210A1/zh
Priority to US17/626,762 priority patent/US20230006182A1/en
Priority to PCT/CN2021/080256 priority patent/WO2021185149A1/zh
Priority to CN202180000445.8A priority patent/CN113841084A/zh
Publication of WO2021184210A1 publication Critical patent/WO2021184210A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling

Definitions

  • the present invention relates to the field of display technology, in particular to a display panel, a display device and a manufacturing method of the display panel.
  • the present invention provides a display panel, a display device, and a manufacturing method of the display panel, so as to improve the problem that the display panel in the prior art still has a wide frame.
  • An embodiment of the present invention provides a method for manufacturing a display panel, which includes:
  • a cover plate is attached to the side of the polarizer facing away from the display module
  • the outer edge of the display module on which the polarizer and the cover plate are attached except for the binding side is cut into an integral shape.
  • the manufacturing method further includes:
  • a heat sink is attached to the side of the display module facing away from the polarizer.
  • the attaching a heat sink to the side of the display module facing away from the polarizer includes:
  • the heat sink with a size smaller than the size of the display module is attached to the side of the display module facing away from the polarizer.
  • the attaching a heat sink to the side of the display module facing away from the polarizer includes:
  • the heat sink is bonded to the side of the display module facing away from the polarizer through a first optical glue.
  • the manufacturing method further includes:
  • a protective film is attached to the side of the cover plate facing away from the polarizer.
  • the cutting the display module to which the polarizer and the cover plate are attached to an integral shape includes:
  • the display module bonded with the polarizer and the cover plate is cut in an integrated shape through a laser cutting process.
  • the attaching the cover plate to the side of the polarizer facing away from the display module includes:
  • the cover plate is attached to the side of the polarizer facing away from the display module through the second optical glue.
  • An embodiment of the present invention also provides a display panel, which includes:
  • a polarizer the polarizer is located on the light-emitting surface of the display module, and the outer edge of the polarizer is flush with the outer edge of the display module;
  • the cover plate is located on the side of the polarizer facing away from the display module, the cover plate is on the outer edge except the binding side and the display module is on the side other than the binding side The outer edges are flush.
  • the heat sink is located on the side of the display module facing away from the polarizer.
  • the display module includes a back film, and the front projection of the heat sink on the back film is covered by an area occupied by the back film.
  • a first optical glue is further provided between the heat sink and the display module, and the heat sink is bonded to the optical module through the first optical glue.
  • the orthographic projection of the heat sink on the back film covers the orthographic projection of the first optical glue on the back film.
  • the outer edges are flush except for the binding side.
  • the display module includes: a back film, and a panel film layer on the side of the back film facing the polarizer;
  • the back film includes a polyphenylsulfone terephthalamide fiber film layer and a polyimide film layer that are stacked.
  • An embodiment of the present invention also provides a display device, which includes the display panel provided in the embodiment of the present invention.
  • FIG. 1 is a schematic diagram of the structure of a display panel in the prior art
  • FIG. 2 is a flowchart of a manufacturing method of a display panel provided by an embodiment of the present invention
  • FIG. 3 is a flowchart of a manufacturing method of a display panel including a heat sink according to an embodiment of the present invention
  • FIG. 4 is a flowchart of a manufacturing method of a display panel including a protective film according to an embodiment of the present invention
  • FIG. 5 is a schematic structural diagram of a display panel provided by an embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a display panel provided with a protective film according to an embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a display device provided by an embodiment of the present invention.
  • FIG. 8 is a schematic cross-sectional structure diagram along the direction of arrow AB in FIG. 7.
  • the display panel may include a display module 01 (specifically, it may include a back film 011 and a display film layer on the back film 011), which is located in the display module 01 Polarizer 02 (POL) on the light-emitting surface, cover 03 (Cover Film) on the side of polarizer 02 facing away from display module 01, and heat sink 05 (SUS) on the side of display module 01 away from polarizer 02, where ,
  • the cover 03 is bonded to the polarizer through the second optical adhesive 042 (OCA2), and the heat sink 05 is bonded to the display module 01 through the first optical adhesive 041 (OCA1).
  • the display module 01 may specifically include a back film 011 and The panel film layer 012 on the back film 011. After the display module 01 is attached to the polarizer 02, shape cut is performed, and then attached to the cover plate 03. Due to the lamination tolerance during the lamination, the tolerance of the laser cutting and the processing tolerance of the cover plate during cutting, Therefore, the outer dimensions of the cover plate 03 need to be unilaterally expanded relative to the display module 01.
  • the specific tolerance and calculation are as follows:
  • A represents the fitting tolerance of the cover, specifically ⁇ 0.1mm
  • B represents the tolerance of laser cutting during shape cutting, specifically ⁇ 0.075mm
  • C represents the processing tolerance of the cover, specifically ⁇ 0.1mm
  • an embodiment of the present invention provides a manufacturing method of a display panel, which includes:
  • the display module may specifically be a display module in an organic light-emitting device (Organic Light-Emitting Diode, OLED), which may specifically include a back film and a panel film layer fabricated on the back film, and the panel film layer may specifically include The substrate film layer, and the display film layer and the touch film layer sequentially located on the substrate film layer.
  • OLED Organic Light-Emitting Diode
  • step S102 the cover plate is attached to the side of the polarizer that is away from the display module.
  • Step S103 cutting the outer edge of the display module to which the polarizer and the cover plate are attached except for the binding side in an integrated shape. That is, as shown in FIG. 7, the display panel 100 has an upper edge, a lower edge, a left edge, and a right edge.
  • the cutting is mainly aimed at the shape of the non-binding side, that is, the upper edge, the left edge, and the right edge are cut, as shown by the dotted line in FIG. 7.
  • the manufacturing method of the display panel includes: attaching a polarizer on the light-emitting surface of the display module; attaching a cover plate on the side of the polarizer facing away from the display module; attaching a polarizer and a cover plate to the polarizer.
  • the display module is cut in an integrated shape, that is, the polarizer and the cover plate are bonded on one side of the display module, and then the display module with the polarizer and the cover plate is cut in an integrated shape.
  • the display module with the polarizer is usually cut after the polarizer is attached, and then when the cover is attached, there is a problem that the cover is more expensive than the display module due to the estimated process error.
  • the reserved externally enlarged size will result in the final display panel having a larger frame.
  • the manufacturing method of the display panel provided by the embodiment of the present invention is cut after the cover is attached, which can avoid the need for pre-processing of the cover. Leave the expanded size to cause the problem of wider frame of the display panel.
  • the manufacturing method further includes: step S104, in the display module
  • the side facing away from the polarizer is attached to the heat sink.
  • the size of the attached heat sink can be made smaller than the size of the display module, that is, attach the heat sink on the side of the display module facing away from the polarizer, including: attaching the heat sink on the side of the display module away from the polarizer A heat sink with a size smaller than the size of the display module.
  • a heat sink is attached to the side of the display module facing away from the polarizer to dissipate the heat generated by the display module during display.
  • the size of the heat sink is smaller than the size of the display module, which can prevent the display panel from having a larger frame due to the excessively large heat sink. It is understandable that the size of the heat sink is smaller than the size of the display module.
  • the size of the respective bonding surfaces is compared, that is, for example, the heat sink is attached to the back film in the display module.
  • the area occupied by the back film covers the front projection of the heat sink on the back film.
  • the material of the heat sink may be metal, specifically, stainless steel SUS.
  • attaching the heat sink to the side of the display module away from the polarizer includes: attaching the heat sink to the side of the display module away from the polarizer through the first optical glue.
  • the manufacturing method is also Including: step S105, attaching a protective film on the side of the cover plate away from the polarizer.
  • a protective film 6 is attached to the side of the cover plate 3 facing away from the polarizer 2, wherein the size of the protective film 6 can be smaller than that of the cover plate, that is, the orthographic projection of the protective film 6 on the cover plate 3 is The area occupied by the cover plate 3 is covered to avoid the influence on the frame size.
  • the heat sink before attaching the heat sink, it also includes: attaching a protective film to the side of the cover plate facing away from the polarizer, thereby avoiding the need to turn over after attaching the cover plate.
  • attaching a protective film to the side of the cover plate facing away from the polarizer, thereby avoiding the need to turn over after attaching the cover plate.
  • the step S103 that is, the integrated shape cutting of the display module with the polarizer and the cover plate, includes: the display module with the polarizer and the cover plate is integrated by a laser cutting process Shape cutting.
  • the step S102 that is, attaching the cover plate on the side of the polarizer facing away from the display module includes: attaching the cover plate on the side of the polarizer facing away from the display module through the second optical glue.
  • an embodiment of the present invention also provides a display panel, which includes:
  • the polarizer 2 is located on the light-emitting surface of the display module 1 (for example, the upper surface of the display module 1 in FIG. 5 is the light-emitting surface), and the outer edge of the polarizer 2 is flush with the outer edge of the display module 1;
  • the cover plate 3 is located on the side of the polarizer 2 facing away from the display module 1.
  • the outer edge of the cover plate 3 except the binding side is flush with the outer edge of the display module 1 except the binding side .
  • the display panel in the embodiment of the present invention is manufactured by using the manufacturing method of the display panel provided in the embodiment of the present invention, that is, in conjunction with FIG. Laser shape cutting is performed at the position indicated by the dotted line in 7 to obtain the display panel provided by the embodiment of the present invention.
  • the display device may further include a chip on film 200 (COF) connected to the display panel 100, and a flexible printed circuit board 300 (Flexible Printed Circuit, FPC) connected to the chip on film 200.
  • An IC 201 may also be provided on the crystal film 200.
  • the cross-sectional schematic diagram of the display panel shown in FIG. 7 along the arrow AB in the figure after bending may be as shown in FIG.
  • One side of the sheet 9 is also provided with a backing film 111, the backing film 111 is bonded to the thick copper sheet 9 through the second double-sided tape 72, and the flexible printed circuit board 300 is bonded to the thick copper sheet 9 through the third double-sided tape 73.
  • a micro-coating layer 8 may be attached to the bent portion of the display film layer 12, and the micro-coating layer 8 may be MCL glue to protect the display film layer 12 at the bending area.
  • the display module 1 may include: a back film 11, and a panel film layer 12 on the side of the back film 11 facing the polarizer 2; the back film 11 includes stacked polyphenylsulfone pairs Phthalamide fiber membrane layer (PSA) and polyimide membrane layer (PI).
  • the back film (BF) can be a 13um PSA+25um PI structure design.
  • the panel film layer 12 may include a substrate film layer, and a display film layer and a touch film layer sequentially located on one side of the substrate film layer.
  • the display panel further includes a heat sink 5, which is located on the side of the display module 1 facing away from the polarizer 2.
  • the size of the heat sink 5 is smaller than the size of the display module 1, that is, the front projection of the heat sink 5 on the back film is covered by the area occupied by the back film 11.
  • the material of the heat sink can specifically be stainless steel SUS. When the material of the heat sink is stainless steel SUS, it also has a support and rebound effect in addition to heat dissipation.
  • first optical glue 41 between the heat sink 5 and the display module 1, and the heat sink 5 is bonded to the display module 1 through the first optical glue 41.
  • the size of the first optical glue 41 is smaller than the size of the heat sink 5, that is, the orthographic projection of the heat sink 5 on the back film 11 covers the orthographic projection of the first optical glue 41 on the back film 11.
  • FIG. 5 there is a second optical glue 42 between the cover plate 3 and the polarizer 2, and the cover plate 3 is bonded to the polarizer 2 through the second optical glue 42.
  • the second optical glue 42 The outer edge except the binding side is flush with the outer edge of the display module 1 except the binding side.
  • the thickness of the cover plate 3 can be 83um; the thickness of the second optical glue 42 can be 50um; the thickness of the polarizer 2 can be 55um; the total thickness of the panel film on the back film can be 45um; the thickness of the back film 11
  • the thickness can be 38um; the thickness of the first optical glue 41 can be 50um; the thickness of the heat sink 5 can be 40um.
  • the overall process of the display panel can be UV glue coating (B-Dispenser) at the back film slotting (Pad cut) ⁇ COF Bonding (COF Bonding) ⁇ Flexible printed circuit board bonding ( FOF Bonding ⁇ Flexible printed circuit board and flip chip sealant coating (Dispenser) ⁇ Polarizer bonding (POL Lami) ⁇ Cover board bonding (Cover Lami) ⁇ Shape cutting (Shape Cut) ⁇ Protective film bonding ( Protective film Lami ⁇ Stainless steel sheet bonding (SUS Lami) ⁇ Slider Lami ⁇ Flexible circuit board and flip chip film are bent and bonded to the back of the module (PAD Bending).
  • an embodiment of the present invention also provides a display device, which includes the display panel as provided in the embodiment of the present invention.
  • the manufacturing method of the display panel provided by the embodiments of the present invention includes: attaching a polarizer to the light-emitting surface of the display module; attaching a cover plate to the side of the polarizer that faces away from the display module;
  • the display module with the polarizer and the cover plate is cut into an integrated shape, that is, the polarizer and the cover plate are firstly bonded on one side of the display module, and then the display module with the polarizer and the cover plate is bonded
  • the display module with the polarizer is cut after the polarizer is attached, and the cover plate is then attached. There will be errors due to estimation process.
  • the cover plate has a reserved outer expansion size than the display module, which results in the final formed display panel having a larger frame.
  • the manufacturing method of the display panel provided by the embodiment of the present invention is performed after the cover plate is attached. The cutting can avoid the problem that the cover plate needs to reserve an expanded size and cause the frame of the display panel to be wider.

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  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
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  • Engineering & Computer Science (AREA)
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Abstract

一种显示面板、显示装置及显示面板的制作方法，以改善现有技术的显示面板仍存在边框较宽的问题。该显示面板的制作方法包括：在显示模组（1）的出光面贴合偏光片（2）（S101）；在偏光片（2）的背离显示模组（1）的一面贴合盖板（3）（S102）；对贴合有偏光片（2）、盖板（3）的显示模组（1）除绑定一侧以外的外边缘进行一体形状切割（S103）。

Description

一种显示面板、显示装置及显示面板的制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种显示面板、显示装置及显示面板的制作方法。
背景技术
随着通信技术的日趋发展，手机、智能穿戴装置等可移动的显示装置应用广泛，目前手机的发展趋势是全面屏手机，这样的设计屏幕的占比尽可能的大，这就需要更窄的边框。但现有技术的显示面板仍存在边框较宽的问题。
发明内容
本发明提供一种显示面板、显示装置及显示面板的制作方法，以改善现有技术的显示面板仍存在边框较宽的问题。
本发明实施例提供一种显示面板的制作方法，其中，包括：
在显示模组的出光面贴合偏光片；
在所述偏光片的背离所述显示模组的一面贴合盖板；
对贴合有所述偏光片、所述盖板的所述显示模组除绑定一侧以外的外边缘进行一体形状切割。
在一种可能的实施方式中，在对贴合有所述偏光片、所述盖板的所述显示模组进行一体形状切割之后，所述制作方法还包括：
在所述显示模组的背离所述偏光片的一面贴合散热片。
在一种可能的实施方式中，所述在所述显示模组的背离所述偏光片的一面贴合散热片，包括：
在所述显示模组的背离所述偏光片的一面贴合尺寸小于所述显示模组尺寸的所述散热片。
在一种可能的实施方式中，所述在所述显示模组的背离所述偏光片的一 面贴合散热片，包括：
在所述显示模组的背离所述偏光片的一面通过第一光学胶贴合所述散热片。
在一种可能的实施方式中，在对贴合有所述偏光片、所述盖板的所述显示模组进行一体形状切割之后，在所述显示模组的背离所述偏光片的一面贴合散热片之前，所述制作方法还包括：
在所述盖板的背离所述偏光片的一面贴合保护膜。
在一种可能的实施方式中，所述对贴合有所述偏光片、所述盖板的所述显示模组进行一体形状切割，包括：
通过激光切割工艺对贴合有所述偏光片、所述盖板的所述显示模组进行一体形状切割。
在一种可能的实施方式中，所述在所述偏光片的背离所述显示模组的一面贴合盖板，包括：
在所述偏光片的背离所述显示模组的一面通过第二光学胶所述贴合所述盖板。
本发明实施例还提供一种显示面板，其中，包括：
显示模组；
偏光片，所述偏光片位于所述显示模组的出光面，所述偏光片的外边缘与所述显示模组的外边缘齐平；
盖板，所述盖板位于所述偏光片的背离所述显示模组的一面，所述盖板在除绑定一侧以外的外边缘与所述显示模组在除绑定一侧以外的外边缘齐平。
在一种可能的实施方式中，还包括：
散热片，所述散热片位于所述显示模组的背离所述偏光片的一面。
在一种可能的实施方式中，所述显示模组包括背膜，所述散热片在所述背膜的正投影被所述背膜所占区域覆盖。
在一种可能的实施方式中，所述散热片与所述显示模组之间还具有第一光学胶，所述散热片通过所述第一光学胶与所述光学模组贴合。
在一种可能的实施方式中，所述散热片在所述背膜的正投影覆盖所述第一光学胶在所述背膜的正投影。
在一种可能的实施方式中，所述盖板与所述偏光片之间还具有第二光学胶，所述第二光学胶在除绑定一侧以外的外边缘与所述显示模组在除绑定一侧以外的外边缘齐平。
在一种可能的实施方式中，所述显示模组包括：背膜，以及位于所述背膜的面向所述偏光片一面的面板膜层；
所述背膜包括叠置的聚苯砜对苯二甲酰胺纤维膜层和聚酰亚胺膜层。
本发明实施例还提供一种显示装置，其中，包括如本发明实施例提供的所述显示面板。
附图说明
图1为现有技术的一种显示面板的结构示意图；
图2为本发明实施例提供的一种显示面板的制作方法的流程图；
图3为本发明实施例提供的一种包含有散热片的显示面板的制作方法的流程图；
图4为本发明实施例提供的一种包含有保护膜的显示面板的制作方法的流程图；
图5为本发明实施例提供的一种显示面板的结构示意图；
图6为本发明实施例提供的一种设置有保护膜的显示面板的结构示意图；
图7为本发明实施例提供的一种显示装置的结构示意图；
图8为图7中沿箭头AB方向的剖面结构示意图。
具体实施方式
为了使得本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基 于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
为了保持本公开实施例的以下说明清楚且简明，本公开省略了已知功能和已知部件的详细说明。
如图1所示，为传统的非一体切显示面板的堆叠示意图，显示面板可以包括显示模组01(具体可以包括背膜011以及位于背膜011之上的显示膜层)，位于显示模组01出光面的偏光片02(POL)，位于偏光片02背离显示模组01一面的盖板03(Cover Film)，位于显示模组01的远离偏光片02一面的散热片05(SUS)，其中，盖板03通过第二光学胶042(OCA2)与偏光片贴合，散热片05通过第一光学胶041(OCA1)与显示模组01贴合，显示模组01具体可以包括背膜011以及位于背膜011上的面板膜层012。显示模组01与偏光片02贴合后进行形状切割(shape cut)，之后与盖板03进行贴合，因贴合时有贴合公差，以及切割时激光切割的公差和盖板加工公差，因此，盖板03外形尺寸需相对于显示模组01进行单边外扩。具体的公差连演算如下：
Figure PCTCN2020079760-appb-000001
其中，A表示盖板贴合公差，具体为±0.1mm，B表示形状切割时激光切割的公差，具体为±0.075mm，C表示盖板加工公差，具体为±0.1mm，因此，盖板03需相对于显示模组进行的单边外扩D＝0.2mm(上述公式计算的为 理论值，为了良率及降低工艺难度，通常会再留一定的余量，0.16向上取整0.2)，才能保证显示模组01边缘贴合时不超出盖板03边缘，因此，该种制作方式会导致最终形成的显示面留有较大的边框。
基于此，参见图2，本发明实施例提供一种显示面板的制作方法，其中，包括：
步骤S101、在显示模组的出光面贴合偏光片。具体的，显示模组具体可以为有机发光器件(Organic Light-Emitting Diode，OLED)中的显示模组，具体可以包括背膜以及制作于背膜之上的面板膜层，面板膜层具体可以包括衬底膜层，以及依次位于衬底膜层之上的显示膜层以及触控膜层。
步骤S102、在偏光片的背离显示模组的一面贴合盖板。
步骤S103、对贴合有偏光片、盖板的显示模组除绑定一侧以外的外边缘进行一体形状切割。即，结合图7所示，显示面板100具有上边缘、下边缘、左边缘和右边缘，其中，下边缘用于与覆晶薄膜200绑定，即，下边缘作为绑定侧，显示面板100在切割时主要针对非绑定一侧的形状切割，即，对上边缘、左边缘、右边缘进行切割，如图7中虚线所示。
本发明实施例提供的显示面板的制作方法，包括：在显示模组的出光面贴合偏光片；在偏光片的背离显示模组的一面贴合盖板；对贴合有偏光片、盖板的显示模组进行一体形状切割，即，先在显示模组的一面完成偏光片、盖板的贴合，然后对贴合有偏光片、盖板的显示模组进行一体形状切割，相比于现有技术通常是在贴合完偏光片之后就对贴合有偏光片的显示模组进行切割，之后再进行贴合盖板时，会存在因估算工艺误差而需盖板较显示模组具有预留的外扩尺寸，进而导致最终形成的显示面板具有较大的边框，本发明实施例提供的显示面板的制作方法，由于在贴合完盖板后再进行切割，可以避免盖板需要预留外扩尺寸而导致显示面板的边框较宽的问题。
在具体实施时，参见图3所示，在步骤S103之后，即，在对贴合有偏光片、盖板的显示模组进行一体形状切割之后，制作方法还包括：步骤S104、在显示模组的背离偏光片的一面贴合散热片。具体的，可以使贴合的散热片 的尺寸小于显示模组的尺寸，即，在显示模组的背离偏光片的一面贴合散热片，包括：在显示模组的背离偏光片的一面贴合尺寸小于显示模组尺寸的散热片。本发明实施例中，通过在显示模组的背离偏光片的一面贴合散热片，以对显示模组在显示时产生的热量进行散热。而散热片的尺寸小于显示模组的尺寸，可以避免由于散热片过大而造成显示面板具有较大的边框。可以理解的是，散热片的尺寸小于显示模组的尺寸，为二者贴合时，各自贴合面的尺寸大小比较，即，例如，散热片与显示模组中的背膜进行贴合，背膜所占区域覆盖散热片在背膜的正投影。具体的，散热片的材质可以为金属，具体可以为不锈钢SUS。
在具体实施时，在显示模组的背离偏光片的一面贴合散热片，包括：在显示模组的背离偏光片的一面通过第一光学胶贴合散热片。
在具体实施时，结合图4所示，在对贴合有偏光片、盖板的显示模组进行一体形状切割之后，在显示模组的背离偏光片的一面贴合散热片之前，制作方法还包括：步骤S105、在盖板的背离偏光片的一面贴合保护膜。结合图6所示，盖板3的背离偏光片2的一面贴合有保护膜6，其中，保护膜6的尺寸可以小于盖板的尺寸，即，保护膜6在盖板3的正投影被盖板3所占区域覆盖，以避免对边框尺寸的影响。本发明实施例中，在贴合散热片之前还包括：在盖板的背离偏光片的一面贴合保护膜，进而可以避免在贴合完盖板后，需要翻过来，在显示模组的另一面贴合散热片时，可能会对盖板的表面造成磨损。
在具体实施时，关于步骤S103、即，对贴合有偏光片、盖板的显示模组进行一体形状切割，包括：通过激光切割工艺对贴合有偏光片、盖板的显示模组进行一体形状切割。
在具体实施时，关于步骤S102、即，在偏光片的背离显示模组的一面贴合盖板，包括：在偏光片的背离显示模组的一面通过第二光学胶贴合盖板。
基于同一发明构思，参见图5所示，本发明实施例还提供一种显示面板，其中，包括：
显示模组1；
偏光片2，偏光片2位于显示模组1的出光面(如，图5中显示模组1的上表面为出光面)，偏光片2的外边缘与显示模组1的外边缘齐平；
盖板3，盖板3位于偏光片2的背离显示模组1的一面，盖板3在除绑定一侧以外的外边缘与显示模组1在除绑定一侧以外的外边缘齐平。
可以理解的是，本发明实施例中的显示面板为采用本发明实施例提供的显示面板的制作方法制作形成，即，结合图7所示，可以对贴合完盖板的显示面板100沿图7中虚线所示位置进行激光形状切割，以获得本发明实施例提供的显示面板。结合图7所示，显示装置还可以包括与显示面板100连接的覆晶薄膜200(Chip on Film，COF)，与覆晶薄膜200连接的柔性印刷电路板300(Flexible Printed Circuit，FPC)，覆晶薄膜200上还可以设置有IC 201。
具体的，图7所示的显示面板在弯折后沿图中箭头AB的剖面示意图可以如图8所示，即，显示装置具体还可以包括：位于散热片5背离第一光学胶41一侧的厚铜片9，以及位于厚铜片9与散热片5之间的第一双面胶71，其中，显示膜层12弯折到背面，显示膜层12弯折到背面的部分朝向黄铜片9的一侧还设置有背面背膜111，背面背膜111通过第二双面胶72与厚铜片9贴合，柔性印刷电路板300通过第三双面胶73与厚铜片9贴合。具体的，显示膜层12在弯折的部分还可以贴合有微涂覆层8，微涂覆层8可以选用MCL胶，用于保护弯折区处的显示膜层12。
在具体实施时，结合图5所示，显示模组1可以包括：背膜11，以及位于背膜11的面向偏光片2一面的面板膜层12；背膜11包括叠置的聚苯砜对苯二甲酰胺纤维膜层(PSA)和聚酰亚胺膜层(PI)。具体的，为满足折叠要求，背膜(BF)可以为13um PSA+25um PI的结构设计。具体的，面板膜层12可以包括衬底膜层、以及依次位于衬底膜层一面的显示膜层以及触控膜层。
在具体实施时，结合图5所示，显示面板还包括：散热片5，散热片5位于显示模组1的背离偏光片2的一面。具体的，散热片5的尺寸小于显示模组1的尺寸，即散热片5在背膜的正投影被背膜11所占区域覆盖。本发明实 施例中，因散热片5不需要进行一体切割，考虑到贴合公差±0.1等因素，散热片5的外形尺寸可以采用单边内缩E＝0.15um。散热片的材质具体可以为不锈钢片SUS，散热片的材质为不锈钢片SUS时，除散热外还有支撑和回弹作用。
具体的，结合图5所示，散热片5与显示模组1之间还具有第一光学胶41，散热片5通过第一光学胶41与显示模组1贴合。第一光学胶41的尺寸小于散热片5的尺寸，即，散热片5在背膜的11正投影覆盖第一光学胶41在背膜11的正投影。
在具体实施时，结合图5所示，盖板3与偏光片2之间还具有第二光学胶42，盖板3通过第二光学胶42与偏光片2进行贴合，第二光学胶42在除绑定一侧以外的外边缘与显示模组1在除绑定一侧以外的外边缘齐平。
具体的，盖板3的厚度具体可以83um；第二光学胶42的厚度可以为50um；偏光片2的厚度可以为55um；背膜上的面板膜层的总厚度可以为45um；背膜11的厚度可以为38um；第一光学胶41的厚度可以为50um；散热片5的厚度可以为40um。
具体的，显示面板的总体流程可以为背膜开槽处UV胶涂覆(B-Dispenser)→焊接区切割(Pad cut)→覆晶薄膜绑定(COF Bonding)→柔性印刷电路板绑定(FOF Bonding)→柔性印刷电路板及覆晶薄膜密封胶涂覆(Dispenser)→偏光片贴合(POL Lami)→盖板贴合(Cover Lami)→形状切割(Shape Cut)→保护膜贴合(Protective film Lami)→不锈钢片贴合(SUS Lami)→滑块贴合(Slider Lami)→柔性电路板及覆晶薄膜弯曲后贴合到模组后侧(PAD Bending)。
基于同一发明构思，本发明实施例还提供一种显示装置，其中，包括如本发明实施例提供的显示面板。
本发明实施例有益效果如下：本发明实施例提供的显示面板的制作方法，包括：在显示模组的出光面贴合偏光片；在偏光片的背离显示模组的一面贴合盖板；对贴合有偏光片、盖板的显示模组进行一体形状切割，即，先在显 示模组的一面完成偏光片、盖板的贴合，然后对贴合有偏光片、盖板的显示模组进行一体形状切割，相比于现有技术通常是在贴合完偏光片之后就对贴合有偏光片的显示模组进行切割，之后再进行贴合盖板时，会存在因估算工艺误差而需盖板较显示模组具有预留的外扩尺寸，进而导致最终形成的显示面板具有较大的边框，本发明实施例提供的显示面板的制作方法，由于在贴合完盖板后再进行切割，可以避免盖板需要预留外扩尺寸而导致显示面板的边框较宽的问题。
尽管已描述了本发明的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本发明范围的所有变更和修改。
显然，本领域的技术人员可以对本发明实施例进行各种改动和变型而不脱离本发明实施例的精神和范围。这样，倘若本发明实施例的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (15)

  1. 一种显示面板的制作方法，其中，包括：
    在显示模组的出光面贴合偏光片；
    在所述偏光片的背离所述显示模组的一面贴合盖板；
    对贴合有所述偏光片、所述盖板的所述显示模组除绑定一侧以外的外边缘进行一体形状切割。
  2. 如权利要求1所述的制作方法，其中，在对贴合有所述偏光片、所述盖板的所述显示模组进行一体形状切割之后，所述制作方法还包括：
    在所述显示模组的背离所述偏光片的一面贴合散热片。
  3. 如权利要求2所述的制作方法，其中，所述在所述显示模组的背离所述偏光片的一面贴合散热片，包括：
    在所述显示模组的背离所述偏光片的一面贴合尺寸小于所述显示模组尺寸的所述散热片。
  4. 如权利要求2所述的制作方法，其中，所述在所述显示模组的背离所述偏光片的一面贴合散热片，包括：
    在所述显示模组的背离所述偏光片的一面通过第一光学胶贴合所述散热片。
  5. 如权利要求2所述的制作方法，其中，在对贴合有所述偏光片、所述盖板的所述显示模组进行一体形状切割之后，在所述显示模组的背离所述偏光片的一面贴合散热片之前，所述制作方法还包括：
    在所述盖板的背离所述偏光片的一面贴合保护膜。
  6. 如权利要求1所述的制作方法，其中，所述对贴合有所述偏光片、所述盖板的所述显示模组进行一体形状切割，包括：
    通过激光切割工艺对贴合有所述偏光片、所述盖板的所述显示模组进行一体形状切割。
  7. 如权利要求1所述的制作方法，其中，所述在所述偏光片的背离所述 显示模组的一面贴合盖板，包括：
    在所述偏光片的背离所述显示模组的一面通过第二光学胶所述贴合所述盖板。
  8. 一种显示面板，其中，包括：
    显示模组；
    偏光片，所述偏光片位于所述显示模组的出光面，所述偏光片的外边缘与所述显示模组的外边缘齐平；
    盖板，所述盖板位于所述偏光片的背离所述显示模组的一面，所述盖板在除绑定一侧以外的外边缘与所述显示模组在除绑定一侧以外的外边缘齐平。
  9. 如权利要求8所述的显示面板，其中，还包括：
    散热片，所述散热片位于所述显示模组的背离所述偏光片的一面。
  10. 如权利要求9所述的显示面板，其中，所述显示模组包括背膜，所述散热片在所述背膜的正投影被所述背膜所占区域覆盖。
  11. 如权利要求10所述的显示面板，其中，所述散热片与所述显示模组之间还具有第一光学胶，所述散热片通过所述第一光学胶与所述光学模组贴合。
  12. 如权利要求11所述的显示面板，其中，所述散热片在所述背膜的正投影覆盖所述第一光学胶在所述背膜的正投影。
  13. 如权利要求9所述的显示面板，其中，所述盖板与所述偏光片之间还具有第二光学胶，所述第二光学胶在除绑定一侧以外的外边缘与所述显示模组在除绑定一侧以外的外边缘齐平。
  14. 如权利要求8所述的显示面板，其中，所述显示模组包括：背膜，以及位于所述背膜的面向所述偏光片一面的面板膜层；
    所述背膜包括叠置的聚苯砜对苯二甲酰胺纤维膜层和聚酰亚胺膜层。
  15. 一种显示装置，其中，包括如权利要求8-14任一项所述的显示面板。
PCT/CN2020/079760 2020-03-17 2020-03-17 一种显示面板、显示装置及显示面板的制作方法 WO2021184210A1 (zh)

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