WO2021181923A1 - グリッパ装置、搬送車、及び搬送方法 - Google Patents
グリッパ装置、搬送車、及び搬送方法 Download PDFInfo
- Publication number
- WO2021181923A1 WO2021181923A1 PCT/JP2021/002788 JP2021002788W WO2021181923A1 WO 2021181923 A1 WO2021181923 A1 WO 2021181923A1 JP 2021002788 W JP2021002788 W JP 2021002788W WO 2021181923 A1 WO2021181923 A1 WO 2021181923A1
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- WIPO (PCT)
- Prior art keywords
- pair
- portions
- engaging
- held
- gripper device
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 15
- 230000003028 elevating effect Effects 0.000 claims description 48
- 230000002265 prevention Effects 0.000 claims description 30
- 230000007246 mechanism Effects 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 3
- 230000001174 ascending effect Effects 0.000 abstract description 3
- 230000032258 transport Effects 0.000 description 21
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B61—RAILWAYS
- B61B—RAILWAY SYSTEMS; EQUIPMENT THEREFOR NOT OTHERWISE PROVIDED FOR
- B61B3/00—Elevated railway systems with suspended vehicles
- B61B3/02—Elevated railway systems with suspended vehicles with self-propelled vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C21/00—Cable cranes, i.e. comprising hoisting devices running on aerial cable-ways
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0297—Wafer cassette
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2811/00—Indexing codes relating to common features for more than one conveyor kind or type
- B65G2811/09—Driving means for the conveyors
Definitions
- the present disclosure relates to a gripper device for holding an article, a transport vehicle equipped with the gripper device, and a transport method for holding and transporting the article.
- Patent Document 1 there is known an overhead transport vehicle system for transporting an article such as FOUP (Front Opening Unified Pod) in a suspended state.
- FOUP Front Opening Unified Pod
- the flanges provided on the upper surface of the FOUP are gripped by the lift from both sides of the flange.
- one flange is provided on the upper surface of the article, and this flange is gripped by an elevating table.
- a large gripper device is required to grip the flange from both sides.
- the present disclosure describes a gripper device, a transport vehicle, and a transport method capable of holding an article in a compact configuration.
- One aspect of the present disclosure is a gripper device for holding an article provided on the upper surface of the article and provided with a pair of held portions that are separated in a direction along the upper surface, and is an elevating portion that can be raised and lowered above the article. From the standby position where the distance between the pair of engaging parts that are attached and each engages with the pair of held parts and the distance between the pair of engaged parts is shorter than the distance between the pair of held parts, the pair of engaged parts A drive unit for moving the pair of engaging portions along the above direction so that the pair of engaging portions are separated from each other is provided at an engaging position capable of engaging with the pair of held portions.
- the pair of engaging parts attached to the elevating part is moved from the standby position to the engaging position by the driving part.
- a pair of held portions separated in a predetermined direction are provided on the upper surface of the article.
- the pair of engaging portions are arranged (inside) between the pair of held portions as the gripper device attempts to hold the article, and move from the inside to the outside of the article along the predetermined direction described above. Be made to. Due to the arrangement of the engaging portion and the movement and engagement in one direction, the gripper device is made compact as a whole. According to this gripper device, the article can be held in a compact configuration.
- the gripper device may be provided with a pair of fall prevention portions that are fixed to the elevating portion and are arranged so as to be separated in the direction at intervals longer than the interval.
- a first gap through which each of the pair of held portions can pass in the vertical direction is formed between the pair of fall prevention portions and the pair of engaging portions located at the standby positions, respectively, and the pair of fall prevention portions
- a second gap may be formed between the pair of engaging portions and the pair of engaging portions located at the engaging positions so that each of the pair of held portions cannot pass in the vertical direction.
- the held portion cannot pass through. For example, even if one held portion (or one engaging portion) is damaged due to some unexpected situation, the other held portion is prevented from falling with the other engaging portion. It is sandwiched between the parts and held. In this way, since the engaging structure of either one is maintained, the article can be held and the article can be prevented from falling.
- the article may be provided with at least a pair of struts erected on the upper surface and a pair of held portions fixed to the struts.
- Each of the pair of engaging portions may have a notch that accepts the stanchion when the pair of engaging portions are located in the engaging position.
- the drive unit may have one link mechanism for moving the pair of engaging units. Since the pair of engaging portions are moved by only one link mechanism, the structure is simpler than when a plurality of link mechanisms are used. Further, since one common link mechanism is provided for the pair of engaging portions, it is easy to synchronize the operations of the pair of engaging portions.
- a transport vehicle may be provided that includes any of the gripper devices described above and travels along a track provided on the ceiling. According to this transport vehicle, since the gripper device has a compact configuration, the transport vehicle can be made compact and lighter than the size and weight of the article.
- Yet another aspect of the present disclosure is a transport method in which an article provided on the upper surface of the article and provided with a pair of held portions separated in a direction along the upper surface is held and conveyed by the gripper device, and the gripper device is used.
- the process includes a step of raising the elevating portion and a holding step of holding the article by engaging the pair of engaging portions at the engaging positions with the pair of held portions.
- the same actions and effects as described above can be achieved. That is, in the holding step, the article can be held in a compact structure. Since the gripper device has a compact structure, the advantages of the device being compact and lightweight can be utilized even when transporting the held article. For example, this transfer method is advantageous from the viewpoint of increasing the transfer speed and reducing the power consumption.
- the article can be held in a compact configuration.
- FIG. 1 is a diagram showing a schematic configuration of a transport vehicle provided with a gripper device according to an embodiment of the present disclosure.
- FIG. 2 is a plan view showing the gripper device in FIG.
- FIG. 3 is a perspective view showing an article transported by the transport vehicle system of FIG.
- FIG. 4 is a view showing the gripper device viewed from the side, and is a view showing a state in which a pair of engaging portions are located in a standby position.
- FIG. 5 is a view showing the gripper device viewed from the side, and is a view showing a state in which the pair of engaging portions are located at the engaging positions.
- FIG. 6 is a plan view showing a state in which the engaging portion is engaged with the held portion.
- FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG.
- FIG. 8 is a partially enlarged view of FIG.
- FIG. 9 is a diagram showing a state in which the other held portion is held when one held portion is damaged
- the ceiling transport vehicle (transport vehicle) 1 of one embodiment travels along a track 100 laid on the ceiling 110 of a clean room where a semiconductor device is manufactured.
- the ceiling carrier 1 of one embodiment transports a FOUP (Front Opening Unified Pod) (article) 200 in which a plurality of semiconductor wafers are housed, and a transfer unit provided in a processing device for performing various treatments on the semiconductor wafers.
- the FOUP200 is relocated to the load port 300 and the like.
- the track 100 is suspended from the ceiling 110 by a suspension column 108.
- the track 100 has a traveling rail 101 and a feeding rail 102 provided below the traveling rail 101.
- the ceiling carrier 1 includes a frame unit 2, a traveling unit 3a, a power receiving unit 3b, a lateral unit 4, a theta unit 5, an elevating drive unit 6, a gripper device 10, and a controller 8. ..
- the frame unit 2 includes a center frame 21, a front frame 22, and a rear frame 23.
- the front frame 22 extends downward from the end of the center frame 21 on the front side (front side in the traveling direction of the ceiling carrier 1).
- the rear frame 23 extends downward from the end of the center frame 21 on the rear side (rear side in the traveling direction of the ceiling carrier 1).
- the traveling unit 3a and the power receiving unit 3b are arranged above the center frame 21.
- the traveling unit 3a is attached to the traveling rail 101.
- the power receiving unit 3b receives power from, for example, a high-frequency current line laid along the power feeding rail 102 in a non-contact manner. By supplying electric power to the power receiving unit 3b, the traveling unit 3a travels along the track 100.
- the lateral unit 4 is arranged below the center frame 21.
- the lateral unit 4 moves the theta unit 5, the elevating drive unit 6, and the gripper device 10 in the lateral direction (sideways in the traveling direction of the ceiling carrier 1).
- Theta unit 5 is arranged below the lateral unit 4.
- Theta unit 5 rotates the elevating drive unit 6 and the gripper device 10 in a horizontal plane.
- the elevating drive unit 6 is arranged below the theta unit 5.
- the elevating drive unit 6 elevates and elevates the gripper device 10.
- the gripper device 10 is arranged below the elevating drive unit 6.
- the gripper device 10 holds the flange portion (held portion) 202 of the FOUP 200.
- the controller 8 is arranged on the front frame 22 and the rear frame 23.
- the controller 8 is an electronic control unit composed of a CPU, a ROM, a RAM, and the like. The controller 8 controls each part of the ceiling carrier 1.
- the front frame 22 and the rear frame 23 are provided with four downward fall prevention portions 26 and two lid fall prevention portions 27 that prevent the FOUP 200 from falling from the frame unit 2.
- the lower fall prevention portion 26 is attached to the lower end of the front frame 22 and the lower end of the rear frame 23 at the four corners of the frame unit 2, and faces the front end and the rear end of the bottom surface of the FOUP 200, respectively.
- the lid fall prevention portion 27 is attached to the lower portion of the front frame 22 and the lower portion of the rear frame 23, respectively, and faces the FOUP 200 from the lid 205 side (see FIG. 3).
- the lower fall prevention unit 26 and the lid fall prevention unit 27 are opened and closed at appropriate timings with the transfer of the FOUP 200.
- the ceiling carrier 1 configured as described above operates as follows, as an example.
- the ceiling carrier 1 that does not hold the FOUP 200 stops above the load port 300. If the horizontal position of the gripper device 10 deviates from the position directly above the load port 300, the lateral unit 4 and theta unit 5 are driven to reduce the horizontal position and angle of the holding unit together with the elevating drive unit 6. adjust. Subsequently, the elevating drive unit 6 lowers the gripper device 10, and the gripper device 10 holds the flange portion 202 of the FOUP 200 mounted on the load port 300.
- the elevating drive unit 6 raises the gripper device 10 to the ascending end, and arranges the FOUP 200 between the front frame 22 and the rear frame 23.
- the lower fall prevention part 26 and the lid fall prevention part 27 are closed.
- the ceiling carrier 1 holding the FOUP 200 starts traveling.
- the ceiling carrier 1 holding the FOUP 200 stops above the load port 300.
- the lower fall prevention part 26 and the lid fall prevention part 27 are opened.
- the elevating drive unit 6 lowers the gripper device 10 to mount the FOUP 200 on the load port 300, and the gripper device 10 releases the holding of the flange portion 202 of the FOUP 200.
- the elevating drive unit 6 raises the gripper device 10 to the ascending end. Subsequently, the ceiling carrier 1 that does not hold the FOUP 200 starts running.
- the gripper device 10 is connected to the motor 16 via an elevating portion 11 forming the main body of the gripper device 10, a motor 16 fixed to the elevating portion 11, and an output shaft 16a of the motor 16. It includes one link mechanism 20 and a pair of finger portions (engagement portions) 12 attached to the tip of the link mechanism 20.
- the motor 16, the link mechanism 20, and the pair of finger portions 12 are attached to the elevating portion 11.
- the motor 16 and the link mechanism 20 form a drive unit 7 for moving a pair of finger units 12.
- the elevating part 11 is suspended by, for example, four belts 6a constituting the elevating drive unit 6 described above.
- the elevating unit 11 can be elevated and lowered above the FOUP 200 (above the load port 300) by controlling the elevating drive unit 6 by the controller 8.
- the elevating drive unit 6 may have three belts 6a, and the elevating portion 11 may be suspended by the three belts 6a.
- the FOUP 200 held by the gripper device 10 of the present embodiment will be described with reference to FIG.
- the FOUP 200 has, for example, a rectangular parallelepiped main body 201.
- a lid 205 is attached to the side surface of the main body 201 (the side surface of the ceiling carrier 1 in the traveling direction) so as to be openable and closable.
- the FOUP 200 accommodates a plurality of semiconductor wafers in the main body 201.
- the FOUP 200 may accommodate a plurality of semiconductor panels, which are rectangular substrates, in the main body 201.
- a pair of flange portions 202 held by the gripper device 10 are provided on the rectangular upper surface 201a of the main body 201.
- the pair of flange portions 202 are separated from each other in a direction along the upper surface 201a and in a direction corresponding to the traveling direction of the ceiling carrier 1 (X direction shown in the drawing). In the following description, this direction is referred to as "first direction”.
- the pair of flange portions 202 are arranged at the ends 201b and 201b of the upper surface 201a in the X direction, and are in the direction along the upper surface 201a and orthogonal to the first direction (Y shown in the drawing). It extends long in the direction).
- the direction orthogonal to the first direction is referred to as a "second direction”.
- first and second directions can be used to describe the FOUP 200, but can also be used to describe the gripper device 10 that holds the FOUP 200.
- the first direction corresponds to the traveling direction of the ceiling carrier 1 in a state where the elevating drive unit 6 and the gripper device 10 are aligned with the frame unit 2.
- a plurality of pairs (three pairs in this embodiment) of columns 203 are erected at each of the ends 201b and 201b.
- the three columns 203 are arranged in the Y direction, for example, separated from each other in the Y direction.
- Each column 203 extends perpendicular to the upper surface 201a, and its lower end is fixed to the upper surface 201a.
- three columns 203 having the same length are erected at one end 201b of the upper surface 201a in the first direction, and one flange portion 202 is welded or bolted to the upper end of these columns 203. It is fixed by etc.
- Each flange portion 202 is, for example, a long plate-shaped member arranged parallel to the upper surface 201a and extending in the Y direction. For example, three columns 203 having the same length are erected at the other end 201b of the upper surface 201a in the first direction, and one flange portion 202 is welded or bolted to the upper end of these columns 203. It is fixed by etc.
- the pair of flange portions 202 extend, for example, parallel to the upper surface 201a of the FOUP 200.
- the FOUP 200 includes a pair of flange portions 202 provided on the upper surface 201a and separated in the first direction along the upper surface 201a.
- a predetermined space is formed between the upper surface 201a and the flange portion 202. Further, as shown in FIG. 1, the pair of flange portions 202 are within the range of the length of the main body 201 in the first direction (the total length of the FOUP 200).
- the finger portion 12 of the gripper device 10 is inserted into the space between the upper surface 201a and the flange portion 202 from the central portion to the end portion 201b of the upper surface 201a.
- the FOUP 200 is an article that is moved from the inside to the outside and is held (supported) from below by the finger portion 12 inserted into the space.
- the gripper device 10 will be described in detail with reference to FIGS. 2, 4 and 5.
- the pair of finger portions 12 of the gripper device 10 move along the first direction (X direction shown in the drawing).
- the pair of finger portions 12 are supported by the elevating portion 11 so that they can move (slide) horizontally in the gripper device 10.
- the gripper device 10 holds the FOUP 200
- the finger portion 12 advances so as to approach the flange portion 202.
- the gripper device 10 releases the holding of the FOUP 200
- the finger portion 12 retracts so as to move away from the flange portion 202.
- the link mechanism 20 is a mechanism for moving the finger portion 12.
- the link mechanism 20 has a first end on one central link 17 that is connected to the output shaft 16a of the motor 16 and rotates about the output shaft 16a, and a pair of shafts 17a provided at both ends of the central link 17. It includes a pair of rotatably connected first links 18 and a pair of second links 19 whose base ends are rotatably connected to a pair of shafts 18a provided at the second end of the first link 18.
- the central link 17 rotates with the rotation of the output shaft 16a, and one of the first link 18 and the second link 19 and the other first link 18 and the second link 19 And move in synchronization. Finger portions 12 are attached to the tips of the pair of second links 19.
- the finger portion 12 includes a rectangular engaging plate 13 in a plan view.
- the engaging plate 13 is inserted into the space between the upper surface 201a of the FOUP 200 and the flange portion 202 to support the flange portion 202 from below.
- the pair of finger portions 12 of the gripper device 10 engage with the pair of flange portions 202 of the FOUP 200.
- the engaging plate 13 includes a thick plate portion 13a attached to the tip of the second link 19 and a thin plate portion formed on the tip end side of the thick plate portion 13a. Includes 13b.
- the thin plate portion 13b is thinner than the thick plate portion 13a.
- the lower surface of the thin plate portion 13b is flush with the lower surface of the thick plate portion 13a, but the upper surface of the thin plate portion 13b is formed at a position lower than the upper surface of the thick plate portion 13a.
- One first cushioning member 14 and two second cushioning members 15 having the same thickness as above are attached.
- the first buffer member 14 and the second buffer member 15 are, for example, resin members.
- the rectangular second cushioning member 15 is attached to both ends of the thin plate portion 13b in the second direction, and the rectangular first cushioning member 14 is attached between the second cushioning members 15.
- the position where the second cushioning member 15 is attached corresponds to the position of the central support column 203 among the three support columns 203 erected on the FOUP 200.
- the thin plate portion 13b and the first buffer member 14 are formed with triangular notches having substantially the same size and shape.
- the finger portion 12 is formed with a notch portion 12a that receives the central support column 203.
- the notch portion 12a is, for example, a V-shaped recess including two hypotenuses, and is open at the tip 12b of the finger portion 12 in the X direction.
- the length of the engaging plate 13 in the Y direction is shorter than the distance between the columns 203 located at both ends.
- the finger portion 12 With the notch 12a of the finger portion 12 receiving the central support column 203 (that is, with the central support column 203 housed in the notch portion 12a), the finger portion 12 is placed between the support columns 203 located at both ends. Arranged (see FIG. 6).
- the standby position P1 in which the distance between the pair of finger portions 12 is shorter than the distance between the pair of flange portions 202 and the pair of finger portions 12 can be engaged with the pair of flange portions 202.
- a pair of finger portions 12 are moved along the first direction with and from the engaging position P2.
- the engaging position P2 is a position where the distance between the pair of finger portions 12 is longer than the distance between the pair of flange portions 202.
- the pair of finger portions 12 move linearly by the link mechanism 20.
- the “distance between the pair of finger portions 12” means the distance between the tips 12b of the finger portions 12 shown in FIG.
- the “distance between the pair of flange portions 202” means the distance between the inner end surfaces 202b of the pair of flange portions 202 in the first direction shown in FIG.
- the drive unit 7 moves the pair of finger portions 12 along the first direction from the standby position P1 to the engagement position P2 so that the pair of finger portions 12 are separated from each other.
- the drive unit 7 moves the pair of finger portions 12 from the inside of the elevating portion 11 (the position closer to the center of the elevating portion 11) to the outside (the position closer to the front frame 22 and the rear frame 23). In this way, the drive unit 7 extends and deploys the pair of finger units 12. Further, the drive unit 7 moves the pair of finger portions 12 along the first direction from the engagement position P2 to the standby position P1 so that the pair of finger portions 12 approach each other.
- the drive unit 7 moves the pair of finger portions 12 from the outside (positions closer to the front frame 22 and the rear frame 23) to the inside (positions closer to the center of the elevating portion 11) of the elevating portion 11. In this way, the drive unit 7 retracts and stores the pair of finger units 12.
- the gripper device 10 of the present embodiment includes a fall prevention unit 30 for preventing the FOUP 200 from falling in case the device (FOUP 200 or finger unit 12) is damaged or the like.
- a pair of fall prevention portions 30 are fixed to both ends of the elevating portion 11 in the first direction.
- the pair of fall prevention portions 30 are arranged so as to be separated in the first direction with a distance longer than the distance between the pair of flange portions 202. More specifically, the pair of fall prevention portions 30 are separated in the first direction with a distance longer than the distance between the outer end surfaces 202a (see FIG. 8) of the pair of flange portions 202 in the first direction.
- Each fall prevention portion 30 includes a hanging plate 31 that hangs down from the elevating portion 11.
- the lower end 31a of the hanging plate 31 is located at a height lower than the flange portion 202 in a state where the gripper device 10 is lowered to match the height of the gripper device 10 with respect to the FOUP 200. More specifically, in a state where the finger portion 12 is engaged with the flange portion 202 and the gripper device 10 holds the FOUP 200 (the state shown in FIGS. 5 and 8), the lower end 31a of the hanging plate 31 is the flange portion 202. Located at a lower height, the inner surface 31b of the hanging plate 31 faces the outer end surface 202a of the flange portion 202 with a predetermined gap.
- each of the pair of flange portions 202 can pass through the first pair in the vertical direction.
- a gap G1 is formed.
- each of the pair of flange portions 202 cannot pass vertically between the pair of fall prevention portions 30 and the pair of finger portions 12 located at the engagement position P2.
- Second gap G2 is formed.
- the first gap G1 and the second gap G2 can be defined as the distance between the tip 12b of the finger portion 12 and the inner surface 31b of the hanging plate 31.
- the first gap G1 is larger than the size of the flange portion 202 in the first direction.
- the second gap G2 is smaller than the size of the flange portion 202 in the first direction.
- a method of transporting the FOUP 200 by the ceiling transport vehicle 1 provided with the gripper device 10 of the present embodiment will be described. Each of the following operations is executed based on the control by the controller 8. First, the elevating portion 11 is lowered in a state where the horizontal position of the gripper device 10 is located directly above the load port 300 (lowering step). In this descent step, the gripper device 10 is positioned in the height direction and the horizontal direction with respect to the FOUP 200 by using a known positioning means or the like provided on the elevating unit 11.
- the drive unit 7 moves the pair of finger units 12 along the first direction (see the moving process, FIGS. 4 and 5).
- the central support column 203 is inserted into the notch portion 12a of the finger portion 12, and the finger portion 12 is inserted into the lower surface side of the flange portion 202.
- the elevating portion 11 is raised, the pair of finger portions 12 at the engaging position P2 are engaged with the pair of flange portions 202, and the FOUP 200 is held by the gripper device 10 (holding step).
- the pair of finger portions 12 attached to the elevating portion 11 are moved from the standby position P1 to the engaging position P2 by the motor 16.
- a pair of flange portions 202 that are separated from each other in the first direction are provided on the upper surface 201a of the FOUP 200.
- the pair of finger portions 12 are arranged (inside) between the pair of flange portions 202 when the gripper device 10 tries to hold the FOUP 200, and move from the inside to the outside of the FOUP 200 along the first direction. Be made to.
- the arrangement of the finger portions 12 and the movement and engagement in the first direction make the gripper device 10 compact as a whole. According to the gripper device 10, the article can be held in a compact configuration.
- the pair of finger portions 12 are moved by only one link mechanism 20, the structure is simpler than when a plurality of link mechanisms are used. Further, since one common link mechanism 20 is provided for the pair of finger portions 12, it is easy to synchronize the operations of the pair of finger portions 12.
- the first gap G1 between the finger part 12 and the fall prevention part 30 is formed in each of the both end regions in the first direction.
- the flange portion 202 passes through (see FIG. 4).
- the pair of finger portions 12 are moved to the engagement position P2 and engaged with the pair of flange portions 202, the second portion between the finger portion 12 and the fall prevention portion 30 is provided in each of the both end regions in the first direction.
- the flange portion 202 cannot pass through the gap G2 (see FIG. 5). For example, as shown in FIG.
- the second flange portion 202 is sandwiched and held between the second flange portion 12 and the second fall prevention portion 30. In this way, since the engaging structure of either one is maintained, the FOUP200 can be held, and the FOUP200 can be prevented from falling.
- the controller 8 may detect the absence of the flange portion 202 in response to a signal from the presence sensor or the like). When the controller 8 detects the absence of the flange portion 202, it may generate an alarm or notify the operator to that effect. By such a method, not only the absence of the flange portion 202 but also the damage of the finger portion 12 can be detected.
- the support column 203 By providing the support column 203 in the FOUP 200, it is possible to easily form a space in which the finger portion 12 is inserted between the upper surface 201a of the FOUP 200 and the flange portion 202.
- the support column 203 plays a role of a spacer, so to speak. Further, in the movement of the finger portion 12 in the first direction, for example, it is possible to control a part of the finger portion 12 to come into contact with the support column 203 from the inside. In that case, the finger portion 12 can be positioned reliably and easily.
- the ceiling carrier 1 of the present embodiment since the gripper device 10 has a compact configuration, the ceiling carrier 1 can be made more compact and lighter than the size and weight of the FOUP 200.
- the same operations and effects as those of the ceiling transport vehicle 1 and the gripper device 10 described above are exhibited. That is, in the holding step, the FOUP 200 can be held in a compact configuration. Since the gripper device 10 has a compact structure, the advantages of the device being compact and lightweight can be utilized even when the held FOUP 200 is conveyed. For example, the transport method of the present embodiment is advantageous from the viewpoint of increasing the transport speed and reducing the power consumption.
- the present invention is not limited to the above embodiments.
- one or both of the lower fall prevention unit 26 and the lid fall prevention unit 27 may be omitted.
- a pair of columns 203 may be erected on the upper surface 201a of the FOUP 200. That is, the columns 203 at both ends in the Y direction may be omitted.
- the support column 203 may be erected at a substantially central portion of the flange portion 202 in the extending direction.
- the pair of flange portions 202 may slightly protrude from the length of the main body 201 in the first direction (the total length of the FOUP 200).
- the first finger portion 12 and the second finger portion 12 may be driven separately. Each finger portion may be driven by, for example, a ball screw or a belt instead of the link mechanism.
- the pair of engaging portions may be moved along the upper surface 201a of the FOUP 200 in a direction that is linear and at an angle to the first direction.
- the pair of engaging portions may be moved along the upper surface 201a of the FOUP 200 in a zigzag shape, for example, not only when the pair of engaging portions are linearly moved by the driving portion.
- the pair of engaging portions may be moved, for example, in a curved line along the upper surface 201a of the FOUP 200.
- the article may be SMIF (Standard Mechanical Interface) Pod, FOSB (Front Opening Shipping Box), or the like.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Transportation (AREA)
- Robotics (AREA)
- Warehouses Or Storage Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Carriers, Traveling Bodies, And Overhead Traveling Cranes (AREA)
- Manipulator (AREA)
Abstract
Description
Claims (6)
- 物品の上面に設けられて前記上面に沿った方向に離間する一対の被保持部を備えた前記物品を保持するグリッパ装置であって、
前記物品の上方において昇降可能な昇降部に取り付けられ、前記一対の被保持部にそれぞれ係合する一対の係合部と、
前記一対の係合部間の距離が前記一対の被保持部間の間隔よりも短い待機位置から前記一対の係合部が前記一対の被保持部に係合可能な係合位置へと、前記一対の係合部が互いに離れるように前記一対の係合部を前記方向に沿って移動させる駆動部と、を備える、グリッパ装置。 - 前記昇降部に固定されると共に、前記間隔よりも長い間隔をもって前記方向に離間するように配置された一対の落下防止部を備え、
前記一対の落下防止部と前記待機位置に位置する前記一対の係合部との間には、それぞれ、前記一対の被保持部のそれぞれが鉛直方向に通過可能な第1隙間が形成され、
前記一対の落下防止部と前記係合位置に位置する前記一対の係合部との間には、それぞれ、前記一対の被保持部のそれぞれが鉛直方向に通過不能な第2隙間が形成される、請求項1に記載のグリッパ装置。 - 前記物品には、前記上面に立設された少なくとも一対の支柱と、前記支柱に固定された前記一対の被保持部とが設けられ、
前記一対の係合部のそれぞれは、前記一対の係合部が前記係合位置に位置するときに前記支柱を受け入れる切欠き部を有する、請求項1又は2に記載のグリッパ装置。 - 前記駆動部は、前記一対の係合部を移動させるための1つのリンク機構を有する、請求項1~3のいずれか一項に記載のグリッパ装置。
- 請求項1~4のいずれか一項に記載のグリッパ装置を備え、天井に設けられた軌道に沿って走行する、搬送車。
- 物品の上面に設けられて前記上面に沿った方向に離間する一対の被保持部を備えた前記物品をグリッパ装置で保持して搬送する搬送方法であって、
前記グリッパ装置は、前記物品の上方において昇降可能な昇降部に取り付けられ、前記一対の被保持部にそれぞれ係合する一対の係合部を備え、
前記昇降部を降下させる降下工程と、
前記一対の係合部間の距離が前記一対の被保持部間の間隔よりも短い待機位置から、前記一対の係合部が前記一対の被保持部に係合可能な係合位置へと前記一対の係合部を前記方向に沿って移動させる移動工程と、
前記昇降部を上昇させると共に、前記係合位置にある前記一対の係合部を前記一対の被保持部に係合させることで前記物品を保持する保持工程と、を含む、搬送方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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CN202180019863.1A CN115280482A (zh) | 2020-03-13 | 2021-01-27 | 夹持器装置、输送车以及输送方法 |
KR1020227035075A KR20220150967A (ko) | 2020-03-13 | 2021-01-27 | 그리퍼 장치, 반송차, 및 반송 방법 |
EP21768710.2A EP4109502A4 (en) | 2020-03-13 | 2021-01-27 | GRIPPER, TRANSPORT VEHICLE AND TRANSPORT METHOD |
US17/910,384 US20230134312A1 (en) | 2020-03-13 | 2021-01-27 | Gripper device, conveyance vehicle, and conveyance method |
JP2022505822A JP7367845B2 (ja) | 2020-03-13 | 2021-01-27 | グリッパ装置、搬送車、及び搬送方法 |
IL296295A IL296295A (en) | 2020-03-13 | 2022-09-07 | Holding device, transport vehicle and method of transport |
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JP2020044629 | 2020-03-13 | ||
JP2020-044629 | 2020-03-13 |
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PCT/JP2021/002788 WO2021181923A1 (ja) | 2020-03-13 | 2021-01-27 | グリッパ装置、搬送車、及び搬送方法 |
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US (1) | US20230134312A1 (ja) |
EP (1) | EP4109502A4 (ja) |
JP (1) | JP7367845B2 (ja) |
KR (1) | KR20220150967A (ja) |
CN (1) | CN115280482A (ja) |
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- 2021-01-27 KR KR1020227035075A patent/KR20220150967A/ko not_active Application Discontinuation
- 2021-01-27 EP EP21768710.2A patent/EP4109502A4/en active Pending
- 2021-01-27 CN CN202180019863.1A patent/CN115280482A/zh active Pending
- 2021-01-27 JP JP2022505822A patent/JP7367845B2/ja active Active
- 2021-01-27 WO PCT/JP2021/002788 patent/WO2021181923A1/ja unknown
- 2021-01-27 US US17/910,384 patent/US20230134312A1/en active Pending
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KR20220150967A (ko) | 2022-11-11 |
JP7367845B2 (ja) | 2023-10-24 |
CN115280482A (zh) | 2022-11-01 |
EP4109502A1 (en) | 2022-12-28 |
IL296295A (en) | 2022-11-01 |
US20230134312A1 (en) | 2023-05-04 |
EP4109502A4 (en) | 2024-05-01 |
TW202139338A (zh) | 2021-10-16 |
JPWO2021181923A1 (ja) | 2021-09-16 |
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