JP7367845B2 - グリッパ装置、搬送車、及び搬送方法 - Google Patents
グリッパ装置、搬送車、及び搬送方法 Download PDFInfo
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- JP7367845B2 JP7367845B2 JP2022505822A JP2022505822A JP7367845B2 JP 7367845 B2 JP7367845 B2 JP 7367845B2 JP 2022505822 A JP2022505822 A JP 2022505822A JP 2022505822 A JP2022505822 A JP 2022505822A JP 7367845 B2 JP7367845 B2 JP 7367845B2
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- 238000000034 method Methods 0.000 title claims description 18
- 230000002265 prevention Effects 0.000 claims description 32
- 230000003028 elevating effect Effects 0.000 claims description 31
- 230000007246 mechanism Effects 0.000 claims description 20
- 230000032258 transport Effects 0.000 description 31
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B61—RAILWAYS
- B61B—RAILWAY SYSTEMS; EQUIPMENT THEREFOR NOT OTHERWISE PROVIDED FOR
- B61B3/00—Elevated railway systems with suspended vehicles
- B61B3/02—Elevated railway systems with suspended vehicles with self-propelled vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C21/00—Cable cranes, i.e. comprising hoisting devices running on aerial cable-ways
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0297—Wafer cassette
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2811/00—Indexing codes relating to common features for more than one conveyor kind or type
- B65G2811/09—Driving means for the conveyors
Description
Claims (6)
- 物品の上面に設けられて前記上面に沿った方向に離間する一対の被保持部を備えた前記物品を保持するグリッパ装置であって、
前記物品の上方において昇降可能な昇降部に取り付けられ、前記一対の被保持部にそれぞれ係合する一対の係合部と、
前記一対の係合部間の距離が前記一対の被保持部間の間隔よりも短い待機位置から前記一対の係合部が前記一対の被保持部に係合可能な係合位置へと、前記一対の係合部が互いに離れるように前記一対の係合部を前記方向に沿って移動させる駆動部と、
前記昇降部に固定されると共に、前記間隔よりも長い間隔をもって前記方向に離間するように配置された一対の落下防止部と、を備え、
前記一対の落下防止部と前記待機位置に位置する前記一対の係合部との間には、それぞれ、前記一対の被保持部のそれぞれが鉛直方向に通過可能な第1隙間が形成され、
前記一対の落下防止部と前記係合位置に位置する前記一対の係合部との間には、それぞれ、前記一対の被保持部のそれぞれが鉛直方向に通過不能な第2隙間が形成される、グリッパ装置。 - 物品の上面に設けられて前記上面に沿った方向に離間する一対の被保持部を備えた前記物品を保持するグリッパ装置であって、
前記物品の上方において昇降可能な昇降部に取り付けられ、前記一対の被保持部にそれぞれ係合する一対の係合部と、
前記一対の係合部間の距離が前記一対の被保持部間の間隔よりも短い待機位置から前記一対の係合部が前記一対の被保持部に係合可能な係合位置へと、前記一対の係合部が互いに離れるように前記一対の係合部を前記方向に沿って移動させる駆動部と、を備え、
前記物品には、前記上面に立設された少なくとも一対の支柱と、前記支柱に固定された前記一対の被保持部とが設けられ、
前記一対の係合部のそれぞれは、前記一対の係合部が前記係合位置に位置するときに前記支柱を受け入れる切欠き部を有する、グリッパ装置。 - 前記駆動部は、前記一対の係合部を移動させるための1つのリンク機構を有する、請求項1又は2に記載のグリッパ装置。
- 請求項1~3のいずれか一項に記載のグリッパ装置を備え、天井に設けられた軌道に沿って走行する、搬送車。
- 物品の上面に設けられて前記上面に沿った方向に離間する一対の被保持部を備えた前記物品をグリッパ装置で保持して搬送する搬送方法であって、
前記グリッパ装置は、前記物品の上方において昇降可能な昇降部に取り付けられ、前記一対の被保持部にそれぞれ係合する一対の係合部と、前記昇降部に固定されると共に、前記一対の被保持部間の間隔よりも長い間隔をもって前記方向に離間するように配置された一対の落下防止部とを備え、
前記昇降部を降下させる降下工程と、
前記一対の係合部間の距離が前記一対の被保持部間の間隔よりも短い待機位置から、前記一対の係合部が前記一対の被保持部に係合可能な係合位置へと前記一対の係合部を前記方向に沿って移動させる移動工程と、
前記昇降部を上昇させると共に、前記係合位置にある前記一対の係合部を前記一対の被保持部に係合させることで前記物品を保持する保持工程と、を含み、
前記降下工程では、前記一対の落下防止部と前記待機位置に位置する前記一対の係合部との間にそれぞれ形成された第1隙間を、前記一対の被保持部のそれぞれが鉛直方向に通過し、
前記保持工程の後、前記一対の落下防止部と前記係合位置に位置する前記一対の係合部との間にそれぞれ形成された第2隙間から、前記一対の被保持部のそれぞれが鉛直方向に通過できない、搬送方法。 - 物品の上面に設けられて前記上面に沿った方向に離間する一対の被保持部を備えた前記物品をグリッパ装置で保持して搬送する搬送方法であって、
前記グリッパ装置は、前記物品の上方において昇降可能な昇降部に取り付けられ、前記一対の被保持部にそれぞれ係合する一対の係合部を備え、前記物品には、前記上面に立設された少なくとも一対の支柱と、前記支柱に固定された前記一対の被保持部とが設けられ、
前記昇降部を降下させる降下工程と、
前記一対の係合部間の距離が前記一対の被保持部間の間隔よりも短い待機位置から、前記一対の係合部が前記一対の被保持部に係合可能な係合位置へと前記一対の係合部を前記方向に沿って移動させる移動工程と、
前記昇降部を上昇させると共に、前記係合位置にある前記一対の係合部を前記一対の被保持部に係合させることで前記物品を保持する保持工程と、を含み、
前記移動工程により前記一対の係合部が前記係合位置に移動させられると、前記一対の係合部のそれぞれに設けられた切欠き部に前記支柱が入る、搬送方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020044629 | 2020-03-13 | ||
JP2020044629 | 2020-03-13 | ||
PCT/JP2021/002788 WO2021181923A1 (ja) | 2020-03-13 | 2021-01-27 | グリッパ装置、搬送車、及び搬送方法 |
Publications (3)
Publication Number | Publication Date |
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JPWO2021181923A1 JPWO2021181923A1 (ja) | 2021-09-16 |
JPWO2021181923A5 JPWO2021181923A5 (ja) | 2022-09-29 |
JP7367845B2 true JP7367845B2 (ja) | 2023-10-24 |
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JP2022505822A Active JP7367845B2 (ja) | 2020-03-13 | 2021-01-27 | グリッパ装置、搬送車、及び搬送方法 |
Country Status (7)
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---|---|
US (1) | US20230134312A1 (ja) |
EP (1) | EP4109502A4 (ja) |
JP (1) | JP7367845B2 (ja) |
KR (1) | KR20220150967A (ja) |
CN (1) | CN115280482A (ja) |
IL (1) | IL296295A (ja) |
WO (1) | WO2021181923A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005026596A (ja) | 2003-06-30 | 2005-01-27 | Oriental Kogyo Kk | シリコンウェハー用洗浄装置 |
WO2011065146A1 (ja) | 2009-11-27 | 2011-06-03 | 株式会社ダイフク | 天井搬送車 |
JP2013045964A (ja) | 2011-08-25 | 2013-03-04 | Sharp Corp | 被処理基板の浸漬処理方法及び浸漬処理装置 |
JP2018039659A (ja) | 2016-09-09 | 2018-03-15 | 株式会社ダイフク | 物品搬送装置 |
JP2018125411A (ja) | 2017-02-01 | 2018-08-09 | 村田機械株式会社 | 天井搬送車 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6481558B1 (en) * | 1998-12-18 | 2002-11-19 | Asyst Technologies, Inc. | Integrated load port-conveyor transfer system |
JP2011035022A (ja) | 2009-07-30 | 2011-02-17 | Murata Machinery Ltd | 天井搬送車 |
JP6136775B2 (ja) * | 2013-08-30 | 2017-05-31 | 株式会社ダイフク | 搬送装置 |
JP6064940B2 (ja) * | 2014-04-07 | 2017-01-25 | 株式会社ダイフク | 物品搬送車 |
JP6414134B2 (ja) * | 2016-05-09 | 2018-10-31 | 村田機械株式会社 | 搬送装置 |
JP6607175B2 (ja) * | 2016-12-07 | 2019-11-20 | 株式会社ダイフク | 移載機 |
-
2021
- 2021-01-27 EP EP21768710.2A patent/EP4109502A4/en active Pending
- 2021-01-27 KR KR1020227035075A patent/KR20220150967A/ko not_active Application Discontinuation
- 2021-01-27 US US17/910,384 patent/US20230134312A1/en active Pending
- 2021-01-27 WO PCT/JP2021/002788 patent/WO2021181923A1/ja unknown
- 2021-01-27 JP JP2022505822A patent/JP7367845B2/ja active Active
- 2021-01-27 CN CN202180019863.1A patent/CN115280482A/zh active Pending
-
2022
- 2022-09-07 IL IL296295A patent/IL296295A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005026596A (ja) | 2003-06-30 | 2005-01-27 | Oriental Kogyo Kk | シリコンウェハー用洗浄装置 |
WO2011065146A1 (ja) | 2009-11-27 | 2011-06-03 | 株式会社ダイフク | 天井搬送車 |
JP2013045964A (ja) | 2011-08-25 | 2013-03-04 | Sharp Corp | 被処理基板の浸漬処理方法及び浸漬処理装置 |
JP2018039659A (ja) | 2016-09-09 | 2018-03-15 | 株式会社ダイフク | 物品搬送装置 |
JP2018125411A (ja) | 2017-02-01 | 2018-08-09 | 村田機械株式会社 | 天井搬送車 |
Also Published As
Publication number | Publication date |
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KR20220150967A (ko) | 2022-11-11 |
TW202139338A (zh) | 2021-10-16 |
US20230134312A1 (en) | 2023-05-04 |
EP4109502A1 (en) | 2022-12-28 |
JPWO2021181923A1 (ja) | 2021-09-16 |
EP4109502A4 (en) | 2024-05-01 |
CN115280482A (zh) | 2022-11-01 |
WO2021181923A1 (ja) | 2021-09-16 |
IL296295A (en) | 2022-11-01 |
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