WO2021181827A1 - 空気流量測定装置 - Google Patents

空気流量測定装置 Download PDF

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Publication number
WO2021181827A1
WO2021181827A1 PCT/JP2020/048699 JP2020048699W WO2021181827A1 WO 2021181827 A1 WO2021181827 A1 WO 2021181827A1 JP 2020048699 W JP2020048699 W JP 2020048699W WO 2021181827 A1 WO2021181827 A1 WO 2021181827A1
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WIPO (PCT)
Prior art keywords
air flow
thin film
lead frame
flow rate
resin member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/048699
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English (en)
French (fr)
Japanese (ja)
Inventor
ファハナー ビンティ ハリダン ファティン
阿部　博幸
余語　孝之
望 八文字
瑞紀 伊集院
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Astemo Ltd filed Critical Hitachi Astemo Ltd
Priority to DE112020006397.6T priority Critical patent/DE112020006397T5/de
Priority to CN202080097550.3A priority patent/CN115176130A/zh
Priority to JP2022505781A priority patent/JP7164282B2/ja
Priority to US17/801,620 priority patent/US12169137B2/en
Publication of WO2021181827A1 publication Critical patent/WO2021181827A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F5/00—Measuring a proportion of the volume flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements

Definitions

  • the present invention relates to, for example, an air flow rate measuring device for measuring the flow rate of air sucked into an internal combustion engine of an automobile.
  • the air flow measuring element and the lead frame on which the air flow measuring element is mounted are different, the air flow measuring element and the lead frame are made of synthetic resin.
  • stress due to heat shrinkage of the synthetic resin acts on the thin film portion, which is a thin film portion, and the thin film portion may warp in the direction of protruding from the cavity portion. There was a problem.
  • the thin film portion is warped, there is a problem that it is difficult to accurately measure the flow rate of air.
  • the present invention has been made to solve such a problem, and when the air flow measuring element is mounted on a lead frame to form a resin sealing package for sealing the air flow measuring element and the lead frame, the present invention is made. It is an object of the present invention to provide an air flow rate measuring device capable of accurately measuring an air flow rate by suppressing the occurrence of warpage in a thin film portion.
  • the air flow rate measuring device includes a lead frame, an air flow rate measuring element mounted on the lead frame and having a detection unit, and the lead frame and the air flow rate measuring element so that at least the detection unit is exposed.
  • the radius of curvature ⁇ of the exposed portion of the air flow rate measuring element exposed from the sealing resin member is 2.13 or less. It is characterized by being.
  • the air flow measuring element when the air flow measuring element is mounted on a lead frame to form a resin-sealed package for sealing the air flow measuring element and the lead frame, warpage of the thin film portion is suppressed and air is suppressed. It is possible to provide an air flow rate measuring device capable of accurately measuring the flow rate of the air flow rate.
  • FIG. 2 (a) is a top view
  • FIGS. 2 (b) and 2 (c) are side views
  • FIG. 2 (c) is a front view.
  • Front view of the housing It is a figure explaining the structure of the resin-sealed package
  • FIG. 4A is a perspective view
  • FIG. 4B is a cross-sectional view showing a cross section taken along the line AA of FIG. 4A.
  • FIG. 6A shows the cross-sectional view of the element in which the thin film part is convex
  • FIG. 6B is the cross-sectional view of the element in which the thin film part is concave
  • FIG. 6 (c) is a table showing each symbol of the calculation formula for explaining the mechanism. The figure explaining the force acting on an element and a lead frame by heat shrinkage of a mold resin.
  • 8A is a diagram schematically showing a cross section of a resin-sealed package
  • FIG. 8B is a perspective view of the resin-sealed package
  • FIG. 8B is a diagram illustrating the amount of warpage of the thin film portion.
  • c) is a diagram schematically showing a cross section of the thin film portion
  • FIG. 8 (d) is an explanatory diagram illustrating measurement in the vertical direction and the horizontal direction of the element.
  • the graph which shows the warp amount of the thin film part in the vertical direction and the horizontal direction of an element the graph which shows the relationship between the warp amount and a distance in a horizontal direction, and the graph which shows the relationship between the warp amount and a distance in a vertical direction, respectively.
  • It is a graph which shows the relationship between the curing shrinkage rate of a resin, and the amount of warpage
  • FIG. The figure which shows the relationship between the curing shrinkage rate of a resin, the amount of warpage of a package, and the amount of warpage of a thin film part.
  • FIG. 11A is a figure which shows the case where the curing shrinkage rate is 0.09%
  • the embodiment for carrying out the invention solves various problems requested as an actual product, and is particularly used as an air flow rate measuring device for measuring an air flow rate. It solves various desirable problems and produces various effects.
  • One of the various problems solved by the following embodiments is the content described in the column of the problems to be solved by the above-mentioned invention, and one of the various effects exerted by the following embodiments is. It is the effect described in the column of effect of the invention.
  • the various problems solved by the following embodiments and the various effects produced by the following embodiments will be described in the description of the following embodiments. Therefore, the problems and effects described in the following embodiments are also described in the contents other than the contents of the problem column to be solved by the invention and the effect column of the invention.
  • the internal combustion engine control system 1 includes an intake body 22 in which intake air 2 is sucked from an air cleaner 21 and has a main passage 22a based on the operation of an internal combustion engine 10 including an engine cylinder 11 and an engine piston 12. , Is guided to the combustion chamber of the engine cylinder 11 via the throttle body 23 and the intake manifold 24.
  • the flow rate of the intake air 2 guided to the combustion chamber is detected by the air flow rate measuring device 20 according to the present invention, fuel is supplied from the fuel injection valve 14 based on the detected flow rate, and the air-fuel mixture together with the intake air 2 It is guided to the combustion chamber in the state.
  • the fuel injection valve 14 is provided in the intake port of the internal combustion engine, and the fuel injected into the intake port forms an air-fuel mixture together with the intake air 2 and is guided to the combustion chamber via the intake valve 15. , Combusts to generate mechanical energy.
  • the fuel and intake air 2 guided to the combustion chamber are in a mixed state of the fuel and the intake air 2, and are explosively burned by the spark ignition of the spark plug 13 to generate mechanical energy.
  • the gas after combustion is guided from the exhaust valve 16 to the exhaust pipe, and is discharged to the outside of the vehicle from the exhaust pipe as exhaust gas 3.
  • the flow rate of the intake air 2 guided to the combustion chamber is controlled by the throttle valve 25 whose opening degree changes based on the operation of the accelerator pedal.
  • the fuel supply amount is controlled based on the flow rate of the intake air guided to the combustion chamber, and the driver controls the opening degree of the throttle valve 25 to control the flow rate of the intake air guided to the combustion chamber, thereby causing the internal combustion engine to operate.
  • the generated mechanical energy can be controlled.
  • the flow rate, temperature, humidity, and pressure of the intake air 2 taken in from the air cleaner 21 and flowing through the main passage 22a are detected by the air flow rate measuring device 20, and a signal indicating the flow rate of the intake air 2 is sent from the air flow rate measuring device 20 to the control device 4. Will be sent. Further, a signal of the throttle angle sensor 26 for detecting the opening degree of the throttle valve 25 is transmitted to the control device 4, and further, the position and state of the engine piston 12, the intake valve 15 and the exhaust valve 16 of the internal combustion engine, and the rotation of the internal combustion engine. In order to measure the speed, the signal of the rotation angle sensor 17 is transmitted to the control device 4. A signal from the oxygen sensor 28 is transmitted to the control device 4 in order to measure the state of the mixing ratio of the fuel amount and the air amount from the state of the exhaust gas 3.
  • the control device 4 calculates the fuel injection amount and the ignition timing based on the flow rate of the intake air 2 which is the output of the air flow rate measuring device 20, the output of the rotation angle sensor 17, and the detected rotation speed of the internal combustion engine. .. Based on these calculation results, the amount of fuel supplied from the fuel injection valve 14 and the ignition timing ignited by the spark plug 13 are controlled. The fuel supply amount and ignition timing are actually based on the state of change in temperature and throttle angle detected by the air flow rate measuring device 20, the state of change in engine rotation speed, and the state of air-fuel ratio detected by the oxygen sensor 28. , Finely controlled. Further, the control device 4 controls the amount of air bypassing the throttle valve 25 by the idle air control valve 27 in the idle operation state of the internal combustion engine, and controls the rotation speed of the internal combustion engine in the idle operation state.
  • the fuel supply amount and ignition timing which are the main control amounts of the internal combustion engine, are both calculated using the output of the air flow rate measuring device 20 as the main parameter. Therefore, it is important to improve the detection accuracy of the air flow rate measuring device 20, suppress the change with time, and improve the reliability in order to improve the control accuracy and reliability of the vehicle.
  • the vehicle equipped with the air flow rate measuring device 20 is used in an environment where changes in temperature and humidity are large. It is desirable that the air flow rate measuring device 20 also considers the response to changes in temperature and humidity in the usage environment and the response to dust, pollutants, and the like.
  • the air flow rate measuring device 20 is mounted on the intake pipe which is affected by the heat generated from the internal combustion engine. Therefore, the heat generated by the internal combustion engine is transmitted to the air flow rate measuring device 20 via the intake pipe. Since the air flow rate measuring device 20 measures the flow rate of the intake air 2 by transferring heat to the intake air 2, it is important to suppress the influence of heat from the outside as much as possible.
  • the air flow rate measuring device 20 mounted on the vehicle solves the problems described in the column of the problems to be solved by the invention, and exerts the effects described in the column of the effects of the invention.
  • the various problems described above are fully considered, the various problems required for the product are solved, and various effects are achieved.
  • Specific problems to be solved by the air flow rate measuring device 20 and specific effects to be achieved will be described in the description of the following embodiments.
  • the air flow rate measuring device 20 has a housing 100 and a housing 100.
  • the cover 200 and the chip package 300 are provided.
  • the air flow rate measuring device 20 is used in a state of being inserted into the main passage 22a through a mounting hole provided in the passage wall of the intake body 22 and fixed to the intake body 22.
  • the housing 100 is configured by, for example, injection molding a synthetic resin material, and has a flange 111 for fixing the air flow measuring device 20 to the intake body 22 and a flange 111 protruding from the flange 111. It has a connector 112 exposed to the outside from the intake body 22 for electrical connection with an external device, and a measuring unit 113 extending from the flange 111 toward the center of the main passage 22a.
  • the measuring unit 113 has a thin and long shape extending straight from the flange 111, and has a wide front surface 121 and a back surface 122, and a width. It has a pair of narrow sides 123, 124.
  • the measuring unit 113 projects from the inner wall of the intake body 22 toward the center of the main passage 22a with the air flow rate measuring device 20 attached to the intake body 22.
  • the front surface 121 and the back surface 122 are arranged in parallel along the central axis of the main passage 22a, and of the narrow side surfaces 123 and 124 of the measuring unit 113, the side surface 123 on one side in the longitudinal direction of the measuring unit 113 is the main passage 22a.
  • the side surface 124 on the other side of the measuring unit 113 in the lateral direction is arranged to face the downstream side of the main passage 22a. With the air flow rate measuring device 20 attached to the intake body 22, the tip of the measuring unit 113 is the lower surface 125.
  • the measurement unit 113 is provided with a sub-passage inlet 131 on the side surface 123, and a first outlet 132 and a second outlet 133 on the side surface 124.
  • the sub-passage inlet 131, the first outlet 132, and the second outlet 133 are provided at the tip of the measuring unit 113 extending from the flange 111 toward the center of the main passage 22a. Therefore, the gas in the portion near the central portion away from the inner wall surface of the intake body 22 can be taken into the sub-passage. Therefore, the air flow rate measuring device 20 can measure the flow rate of the gas in the portion away from the inner wall surface of the intake body 22, and can suppress a decrease in measurement accuracy due to the influence of heat or the like.
  • the air flow rate measuring device 20 has a shape in which the measuring unit 113 extends long along the axis from the outer wall of the intake body 22 toward the center, and the widths of the side surfaces 123 and 124 are as shown in FIG. 2 (d). In addition, it has a relatively narrow shape. As a result, the air flow rate measuring device 20 can suppress the fluid resistance to the intake air 2 to a small value.
  • the measuring unit 113 is inserted inside through a mounting hole provided in the intake body 22, the flange 111 is brought into contact with the intake body 22, and is fixed to the intake body 22 with a screw.
  • the flange 111 has a substantially rectangular shape in a plan view having a predetermined plate thickness, and as shown in FIG. 2A, fixing holes 141 are provided in pairs at the diagonal corners. ..
  • the fixing hole portion 141 has a through hole 142 penetrating the flange 111.
  • the flange 111 is fixed to the intake body 22 by inserting a fixing screw (not shown) into the through hole 142 of the fixing hole portion 141 and screwing it into the screw hole of the intake body 22.
  • the connector 112 is provided with four external terminals 147 and correction terminals 148 inside.
  • the external terminal 147 is a terminal for outputting a physical quantity such as a flow rate and a temperature, which is a measurement result of the air flow rate measuring device 20, and a power supply terminal for supplying DC power for operating the air flow rate measuring device 20.
  • the correction terminal 148 is used to measure the produced air flow rate measuring device 20, obtain a correction value for each air flow rate measuring device 20, and store the correction value in the memory inside the air flow rate measuring device 20. In the subsequent measurement operation of the air flow rate measuring device 20, the correction data representing the correction value stored in the above-mentioned memory is used, and the correction terminal 148 is not used.
  • the correction terminal 148 has a different shape from the external terminal 147 so that the correction terminal 148 does not get in the way when connecting the external terminal 147 to another external device.
  • the correction terminal 148 has a shorter shape than the external terminal 147, and is configured so that even if the connection terminal of an external device connected to the external terminal 147 is inserted into the connector 112, it does not interfere with the connection. ing.
  • the longitudinal direction of the measuring unit 113 which is the direction in which the measuring unit 113 extends from the flange 111, is the Z axis, and the sub-passage inlet 131 of the measuring unit 113 is directed toward the first exit 132.
  • the lateral direction of the measuring unit 113 which is the extending direction, may be referred to as the X-axis
  • the thickness direction of the measuring unit 113 which is the direction from the front surface 121 to the back surface 122 of the measuring unit 113, may be referred to as the Y-axis.
  • the housing 100 is provided with a sub-passage groove 150 for forming the sub-passage 134 and a circuit chamber 135 for accommodating the circuit board 311.
  • the circuit chamber 135 and the sub-passage groove 150 are formed in front of the measuring unit 113.
  • the circuit chamber 135 is provided in a region on one side (side surface 123 side) in the X-axis direction, which is a position on the upstream side in the flow direction of the intake air 2.
  • the sub-passage groove 150 is located on the Z-axis direction tip side (lower surface 125 side) of the measuring unit 113 with respect to the circuit chamber 135 and the X-axis located on the downstream side in the flow direction of the intake air 2 with respect to the circuit chamber 135. It is provided over the area on the other side of the direction (side surface 124 side).
  • the sub-passage groove 150 forms the sub-passage 134 by being covered with the cover 200.
  • the sub-passage groove 150 has a first sub-passage groove 151 and a second sub-passage groove 152 that branches in the middle of the first sub-passage groove 151.
  • the first sub-passage groove 151 measures the sub-passage inlet 131 that opens to the side surface 123 on one side of the measuring unit 113 and the first outlet 132 that opens to the side surface 124 on the other side of the measuring unit 113.
  • the portion 113 is formed so as to extend along the X-axis direction.
  • the first sub-passage groove 151 forms a first sub-passage A in which the intake air 2 is taken in from the sub-passage inlet 131 and the taken-in intake air 2 is returned from the first outlet 132 to the main passage 22a in cooperation with the cover 200. do.
  • the first sub-passage A has a flow path extending from the sub-passage inlet 131 along the flow direction of the intake air 2 in the main passage 22a and connecting to the first outlet 132.
  • the second sub-passage groove 152 branches at an intermediate position of the first sub-passage groove 151, is bent toward the base end side (flange side) of the measuring unit 113, and extends along the Z-axis direction of the measuring unit 113. Exists. Then, the base end portion of the measuring unit 113 bends toward the other side (side surface 124 side) of the measuring unit 113 in the X-axis direction, makes a U-turn toward the tip end portion of the measuring unit 113, and again in the Z-axis direction of the measuring unit 113. It extends along.
  • the second outlet 133 is arranged to face the downstream side in the flow direction of the intake air 2 in the main passage 22a.
  • the second outlet 133 has an opening area substantially equal to or slightly larger than that of the first outlet 132, and is formed at a position adjacent to the first outlet 132 on the longitudinal proximal end side of the measuring unit 113.
  • the second sub-passage groove 152 forms a second sub-passage B in cooperation with the cover 200, which allows the intake air 2 branched from the first sub-passage A to pass through and returns to the main passage 22a from the second outlet 133. do.
  • the second sub-passage B has a flow path that reciprocates along the Z-axis direction of the measuring unit 113. That is, the second sub-passage B branches with the outbound passage portion B1 that branches in the middle of the first sub-passage A and extends toward the base end portion side (direction away from the first sub-passage A) of the measurement unit 113.
  • the return passage portion B2 is connected to a second outlet 133 that opens toward the downstream side in the flow direction of the intake air 2 at a position downstream of the auxiliary passage inlet 131 in the main passage 22a in the flow direction of the intake air 2.
  • a chip package 300 which will be described later, is arranged at an intermediate position of the out-passage portion B1. Since the second sub-passage B is formed so as to extend and reciprocate along the longitudinal direction of the measuring unit 113, a longer passage length can be secured and pulsation in the main passage 22a. When this occurs, the influence on the chip package 300 can be reduced.
  • the cover 200 is formed of an injection-molded product made of a synthetic resin material, and is attached to the side surface of the housing 100 so as to cover the housing 100.
  • the cover 200 may be made of a metal material such as an aluminum alloy and may be formed by precision casting such as lost wax or die casting.
  • the chip package 300 includes an air flow rate measuring element (hereinafter, simply referred to as an element) 301, a lead frame 302, and a sealing resin member 303. , Polyimide tape 304 and a die attach film (hereinafter referred to as DAF) 305.
  • the chip package 300 is manufactured by setting the element 301 and the lead frame 302 on which the element 301 is mounted in a mold, pouring the mold resin into the mold, and heat-curing the mold resin.
  • the chip package 300 has a sealing resin member 303 having a flat plate shape having a substantially rectangular shape in a plan view.
  • the sealing resin member 303 has a base end portion on one side in the longitudinal direction arranged in the circuit chamber 135 of the housing 100 and a tip end portion on the other side in the longitudinal direction arranged in the second sub-passage B of the housing 100. ing.
  • a plurality of terminal portions T are arranged at the base end portion of the sealing resin member 303 so as to project in a direction away from each other along the lateral direction.
  • a concave groove is recessed in the tip of the sealing resin member 303 so as to extend along the lateral direction.
  • the concave groove is provided on the surface of the tip portion of the sealing resin member 303, and forms a passage Kt through which the intake air 2 flows.
  • the tip portion of the sealing resin member 303 is arranged in the outward passage portion B1 of the outward passage portion B1 and the return passage portion B2 forming the second sub-passage B of the housing 100 shown in FIG.
  • the chip package 300 measures the flow rate of the intake air 2 flowing in the second sub-passage B, and transmits a signal of the measurement result to the control device 4.
  • the element 301 has an element main body 401 as a substrate.
  • the element main body 401 is composed of a flat plate-shaped member, and is joined to the lead frame 302 by a DAF 305 provided between the element main body 401 and the back surface.
  • the surface of the element body 401 is exposed from the sealing resin member 303 as a detection portion.
  • the element main body 401 has an opening Kd formed so as to open on the back surface, and a thin film portion 402 is formed so as to close the opening Kd on the front surface side of the element main body 401.
  • the thin film portion 402 includes a first temperature difference sensor 407, a first heater temperature sensor 405, a heater 404, a second heater temperature sensor 406, and a second temperature difference sensor 408 arranged in the main flow direction of the medium to be measured. It is a detection unit for detecting the flow rate of the measurement medium.
  • the arrangement direction is expressed as the horizontal direction (short direction), and the direction perpendicular to the arrangement direction is expressed as the vertical direction (longitudinal direction).
  • the element 301 has a thin film portion 402 which is a detection unit and a peripheral region portion 403 which continuously spreads around the thin film portion 402 on the surface of the element main body 401.
  • the thin film portion 402 is composed of, for example, a thin film having a thickness of less than several ⁇ m, and is exposed in the passage Kt of the sealing resin member 303. As shown in FIG. 8C, the thin film portion 402 includes a first temperature difference sensor 407, a first heater temperature sensor 405, a heater 404, a second heater temperature sensor 406, and a second temperature difference sensor 408. Is formed, and a PIQ layer 409 is formed around the upper side of the thin film portion 402.
  • the thin film portion 402 can measure the flow rate of the intake air 2 flowing on the surface of the thin film portion 402 based on the temperature distribution in the direction along the surface of the thin film portion 402.
  • the element main body 401 has a truncated cone-shaped opening Kd formed on the back surface side of the thin film portion 402 so that the opening diameter increases as the distance from the back surface of the thin film portion 402 increases.
  • the element 301 has a flat surface shape with no curvature on the front surface and the back surface of the element body 401 in a single state before being molded by the sealing resin member 303.
  • the sealing resin member 303 When the element 301 is molded together with the lead frame 302 by the sealing resin member 303, bending stress is generated due to shrinkage of the resin between the sealing resin member 303 and the lead frame 302.
  • changes in the crosslink density and volume shrinkage between the molecules of the sealing resin member 303 occur in the process of curing from the viscous fluid, so that the volume decreases after curing.
  • the molding shrinkage rate means that the volume shrinks after the sealing resin member injected into the mold is cooled, and the shrinkage ratio (hereinafter referred to as the shrinkage rate) is generally determined by the following formula (2). Defined.
  • the surface side of the element main body 401 is deformed so as to project from a flat shape to a convex shape and be curved.
  • the element 301 has a radius of curvature ⁇ of the exposed portion exposed from the sealing resin member 303 of the element 301 being 2.13 or less.
  • the radius of curvature ⁇ (mm) of the peripheral region portion 403, which is a region of the surface of the element main body 401 that does not include the thin film portion 402 is 0 or more, and as shown in FIG. 5, the chip package 300 It is formed so as to satisfy the relationship of ⁇ ⁇ 2.13 in the longitudinal direction.
  • the upper surface of the element 301 is specifically a boundary portion between the element 301 and the sealing resin member 303 that covers the upper surface of the element 301.
  • the radius of curvature ⁇ is represented by the following equation (1).
  • h1 (mm) is opposite to the surface side of the sealing resin member 303 on which the element 301 is provided with the element 301 interposed therebetween and the element 301.
  • the thickness of the sealing resin member 303 on the back surface side of the lead frame 302 (hereinafter referred to as the thickness of the back surface resin portion S) and h2 (mm) are the lead frame 302.
  • the thickness (mm) and h3 (mm) of the sealing resin member 303 are the thickness of the sealing resin member 303 on the surface side of the lead frame 302 (hereinafter, referred to as the thickness of the surface resin portion U), and h4 (mm) is the thickness of the element body 401.
  • H5 (mm) represents the thickness of the thin film portion 402
  • ⁇ (%) represents the curing shrinkage rate of the sealing resin member 303.
  • the radius of curvature ⁇ of the peripheral region portion 403 of the surface of the element main body 401 can be measured by the following method. That is, by cutting the chip package 300 at the position of the element 301, the radius of curvature ⁇ of the surface of the element body 401 appearing on the cut surface can be measured. Further, the radius of curvature ⁇ can be measured non-destructively by a non-contact displacement measuring method using light such as a laser beam. Further, the radius of curvature ⁇ can be measured non-destructively by scanning the peripheral region 403 on the surface of the element main body 401 with a three-dimensional measuring machine (also referred to as a 3D scanner).
  • a three-dimensional measuring machine also referred to as a 3D scanner
  • the radius of curvature ⁇ is calculated using the general formula of the bending stress of the sealing resin member 303.
  • FIG. 6C shows the items of the calculation formula and the symbols of the items.
  • E Young's modulus
  • moment of inertia of area I bending moment M
  • ⁇ the radius of curvature of the beam
  • the following equation (a) can be obtained.
  • FIG. 6A when the thin film portion 402 is deformed convexly, As shown in FIG. 6B, when the thin film portion 402 is deformed into a concave shape, Will be.
  • the laminated body to be the sealing resin member 303 of the embodiment it is the composite balance of h1, h2, and h3 shown in FIG. 6C that determines the amount of warpage of the thin film portion 402. Therefore, the apparent warp of h1 to h5 is obtained.
  • ⁇ has the relationship of the following formula (d).
  • equation (a) Will be.
  • the bending moment M is It is represented by.
  • E, ⁇ , and ⁇ T multiplied by M are dimensionless, the following equation (g) is obtained.
  • the warp of the thin film portion 402 is 0, or in the case of the structure of the present embodiment, the warp is ⁇ 3 ⁇ m, that is, the chip package 300 according to the present embodiment. It is obtained from the following composite thickness ⁇ .
  • the lead frame 302 is made of a thin metal material such as copper (Cu) having high conductivity, and has a pattern portion (not shown) and a terminal portion T shown in FIG. 4 (a).
  • the terminal portion T is connected to the terminal pad of the circuit board 311.
  • the lead frame 302 supports and fixes the element 301 via the DAF 305. That is, the lead frame 302 mounts the element 301.
  • the lead frame 302 is formed with a through hole Kh communicating with the opening Kd of the thin film portion 402, and further formed with a through hole Ku communicating with the opening K3 of the surface resin portion U described later.
  • the through hole Kh and the through hole Ku are connected by a communication passage R (see FIG. 4B).
  • the through hole Kh, the through hole Ku, and the communication passage R function so that the pressure in the opening Kd of the thin film portion 402 and the atmospheric pressure are substantially equal to each other.
  • the sealing resin member 303 has a back surface resin portion S having a thickness h1 and a surface resin portion U having a thickness h3 made of a synthetic resin, that is, a so-called mold resin material. ..
  • the thickness h3 of the front surface resin portion U has a thickness more than twice the thickness h1 of the back surface resin portion S.
  • each component is integrated by covering the element 301 and the lead frame 302 by the back surface resin portion S and the front surface resin portion U.
  • the mold resin a material having a curing shrinkage rate ⁇ of 0.18% or more is selected.
  • the material of the mold resin is not particularly limited as long as it is a synthetic resin having a curing shrinkage rate ⁇ of 0.18% or more.
  • the sealing resin member 303 is formed with a passage Kt that exposes the periphery of the thin film portion 402 and the thin film portion 402 and allows air flow to pass therethrough.
  • the back surface resin portion S of the sealing resin member 303 is formed with a truncated cone-shaped opening (opening) K1 whose opening diameter increases as the distance from the lead frame 302 increases.
  • the opening K1 is provided at a position opposite to the element 301 with the lead frame 302 in between.
  • the surface resin portion U of the sealing resin member 303 is formed with an opening K2 at an end opposite to the passage Kt in the longitudinal direction (longitudinal direction) of the sealing resin member 303.
  • An opening K3 is formed in the back surface resin portion S of the sealing resin member 303 at an end opposite to the opening K1 in the longitudinal direction of the sealing resin member 303.
  • the sealing resin member 303 has a groove-shaped passage Kt on its surface.
  • the passage Kt of the sealing resin member 303 has a pair of passage walls Th and a bottom wall on which the surface of the element main body 401 is exposed.
  • the pair of passage wall Th has a diaphragm shape in which the opening area (cross-sectional area) of the passage Kt gradually narrows as it approaches the thin film portion 402 which is the detection portion.
  • a pair of passage walls Th forming the passage Kt cover both edges of the element 301 in a direction orthogonal to the air flow passing through the passage Kt, and the thin film portion 402 is exposed to the passage Kt.
  • the surface resin portion U is formed so as to do so. Therefore, when the sealing resin member 303 is deformed due to heat shrinkage, the element 301 is also deformed together with the sealing resin member 303 by receiving stress from the surface resin portion U.
  • the polyimide tape 304 is made of a polymer compound containing an imide bond, and has high heat resistance, excellent mechanical properties, and resistance to chemicals.
  • the polyimide tape 304 is provided on the surface of the lead frame 302 opposite to the surface on which the element 301 is mounted, and closes the through hole Kh, the through hole Ku, and the communication passage R of the lead frame 302.
  • DAF305 is made of a film adhesive having high adhesive reliability, is sandwiched between the element 301 and the lead frame 302, and adheres the element 301 and the lead frame 302.
  • the DAF 305 is provided with an opening that communicates between the opening Kd of the thin film portion 402 and the through hole Kh of the lead frame 302.
  • the sealing resin member 303 is thermally shrunk due to curing when the sealing resin member 303 is formed, and the thin film portion 402 is warped. bottom. If the amount of warpage (mm) of the thin film portion 402 increases, the measurement accuracy of the flow rate of the intake air 2 decreases. Therefore, it is preferable that the amount of warpage of the thin film portion 402 is small.
  • specifications such as the amount of warpage of the thin film portion 402, the relationship between the thin film portion 402 and the curing shrinkage rate ⁇ , and the radius of curvature ⁇ will be specifically described with reference to the drawings.
  • the chip package 300 according to the present embodiment is sealed with reference to Examples 1 and 2, and Comparative Examples 1 and 2.
  • the action of heat shrinkage of the resin member 303 and the amount of warpage of the thin film portion 402 were specifically verified.
  • the amount of warpage (mm) of the thin film portion 402 is based on the flat surface of the thin film portion 402 before the warp occurs and the reference of the thin film portion 402 in which the thin film portion 402 is warped and has a convex shape.
  • the chip package according to Comparative Example 1 has a coefficient of linear expansion ⁇ (ppm / ° C.) of 17.7 in the lead frame 302, and an intermediate member 306 is located between the element 301 and the lead frame 302. Is sandwiched.
  • the linear expansion coefficient ⁇ of the element 301 is 3, the linear expansion coefficient ⁇ of the package is 7, and the curing shrinkage rate ⁇ (%) of the mold resin is 0.11 or 0.3.
  • the linear expansion coefficient ⁇ of the lead frame 302 is 17.7, there is no intermediate member between the element 301 and the lead frame 302, and the linear expansion coefficient ⁇ of the element 301 is 3.
  • the linear expansion coefficient ⁇ of the mold resin of the sealing resin member 303 is 7, and the curing shrinkage rate ⁇ of the mold resin of the package is 0.11.
  • the linear expansion coefficient ⁇ of the lead frame 302 is 17.7, there is no intermediate member between the element 301 and the lead frame 302, and the element 301
  • the linear expansion coefficient ⁇ is 3, the linear expansion coefficient ⁇ of the mold resin of the sealing resin member 303 is 7, and the curing shrinkage rate ⁇ of the mold resin of the sealing resin member 303 is 0.3.
  • the linear expansion coefficient ⁇ of the lead frame 302 is 17.7, which is intermediate between the element 301 and the lead frame 302, similarly to the air flow rate measuring device 20 according to the first embodiment.
  • the linear expansion coefficient ⁇ of the element 301 is 3
  • the linear expansion coefficient ⁇ of the mold resin of the sealing resin member 303 is 7
  • the curing shrinkage rate ⁇ of the mold resin of the sealing resin member 303 is 0.3.
  • the chip package 300 according to the second embodiment has a larger inner diameter of the through hole Kh of the lead frame 302 than the chip package 300 according to the first embodiment.
  • the mold resin when the mold resin heat-shrinks during curing, the mold resin has a compressive force (N) represented by (-) toward the center of the element 301 and the center of the element 301.
  • the compressive force generated by the contraction of the lead frame 302 can be received by the intermediate member 306, and the compressive force from the lead frame 302 can be prevented from accumulating in the element 301. ..
  • the sealing resin member 303 has a compressive force toward the center of the element 301.
  • a tensile force acts on the element 301 and the lead frame 302 toward the center of the element 301, and a compressive force acts on the element 301 and the lead frame 302 toward the center of the element 301.
  • the intermediate member is not provided in Comparative Example 2, the compressive force generated by the contraction of the lead frame 302 directly acts on the element 301 and accumulates. Therefore, a compressive force acts on the thin film portion 402, and the amount of warpage of the thin film portion 402 is large.
  • the sealing resin member 303 when the mold resin of the sealing resin member 303 is thermally shrunk during curing, the sealing resin member 303 is relatively directed toward the central portion of the element 301. A large compressive force acts on the element 301 and a relatively large tensile force acts on the element 301 and the lead frame 302 toward the center of the element 301. ..
  • the tensile force acting on the sealing resin member 303 becomes relatively large with respect to the compressive force acting on the element 301 and the lead frame 302, and the warp of the sealing resin member 303 becomes large.
  • a relatively small compressive force acts on the thin film portion 402, and the warp amount of the thin film portion 402 is reduced as compared with Comparative Example 2. Therefore, it can be seen that the warp of the thin film portion 402 is reduced by positively warping the element 301 in the tensile direction.
  • the chip package 300 according to the second embodiment is relatively directed toward the central portion of the element 301 toward the sealing resin member 303 when the mold resin of the sealing resin member 303 is thermally shrunk during curing.
  • a large compressive force acts on the element 301 and a relatively large tensile force acts on the element 301 and the lead frame 302 toward the center of the element 301. ..
  • Example 2 unlike Example 1, the through hole Kh of the lead frame 302 is formed larger than the through hole Kh of Example 1, so that the compressive force acting on the lead frame 302 is halved for comparison. Is getting smaller. As a result, the tensile force acting on the sealing resin member 303 becomes relatively large with respect to the compressive force acting on the element 301 and the lead frame 302, and the warp of the sealing resin member 303 becomes large. When the warp of the sealing resin member 303 becomes large, a relatively small compressive force acts on the thin film portion 402, and the warp amount of the thin film portion 402 is greatly reduced as compared with the first embodiment. Therefore, it can be seen that the warp of the thin film portion 402 is canceled by warping the element 301 more in the tensile direction.
  • the black circle mark represents the chip package 300 having no intermediate member
  • the black square mark represents the chip package having the intermediate member.
  • the graph on the left side shows the amount of warpage in the horizontal direction of the diaphragm
  • the graph on the right side shows the amount of warpage in the vertical direction of the diaphragm.
  • the horizontal and vertical directions of the thin film portion 402 are the longitudinal direction (x-axis direction) of the chip package 300 and are orthogonal to the flow direction of the intake air 2.
  • the direction is the vertical direction
  • the lateral direction of the chip package 300 z-axis direction
  • the flow direction of the intake air 2 is the horizontal direction.
  • FIG. 9 when the amount of warpage in the lateral direction of the thin film portion 402 is 10 ⁇ m to 11 ⁇ m, the amount of warp in the vertical direction x of the thin film portion 402 is also 12 ⁇ m to 14 ⁇ m, and both have a large amount of warp. There is.
  • the graph of the relationship between the amount of warp and the distance shows that the shape of the warp in the vertical direction is two peaks. Therefore, the thin film portion 402 protrudes and the temperature distribution becomes NG, so that the measurement accuracy of the thin film portion 402 cannot be obtained.
  • the amount of warp in the horizontal direction of the thin film portion 402 is 7 ⁇ m to 9 ⁇ m
  • the amount of warp in the vertical direction of the thin film portion 402 is also 8 ⁇ m to 12 ⁇ m, and both have a large amount of warp.
  • the graph of the relationship between the amount of warp and the distance shows that the shape of the warp in the vertical direction is two peaks. Therefore, also in this case, the thin film portion 402 protrudes and the temperature distribution becomes NG, so that the measurement accuracy of the thin film portion 402 cannot be obtained.
  • the vertical warp amount of the thin film portion 402 is also 6 ⁇ m to 8 ⁇ m, both of which are relatively large warpage amounts.
  • the graph of the relationship between the amount of warpage and the distance shows that the shape of the warp of the thin film portion 402 in the lateral direction is two peaks. The measurement accuracy of the thin film portion 402 cannot be obtained.
  • the amount of warpage in the horizontal direction of the thin film portion 402 is 0.5 ⁇ m to 1 ⁇ m
  • the amount of warp in the vertical direction of the thin film portion 402 is 3 ⁇ m to 4 ⁇ m, and both have relatively small warpage amounts.
  • the warp of the thin film portion 402 is reduced, and the graph has a flat shape without peaks. Therefore, the shapes of the thin film portions 402 in the horizontal direction and the vertical direction are flat, the temperature distribution is good in both cases, and the measurement accuracy can be obtained.
  • the vertical warp amount of the thin film portion 402 is 2 ⁇ m, and both of them.
  • the amount of warpage is relatively small.
  • the warp in the horizontal direction and the warp in the vertical direction in the graph of the relationship between the amount of warp and the distance, the warp of the thin film portion 402 is reduced, and the graph is flat with no peaks. Therefore, the shapes of the thin film portions 402 in the horizontal direction and the vertical direction are flat, the temperature distribution is good in both cases, and the measurement accuracy can be obtained.
  • the amount of warpage of the thin film portion 402 is small, and the graph of the relationship between the amount of warpage and the distance in both the horizontal and vertical directions shows that the shape of the warp is flat and does not have two peaks.
  • the warp of the thin film portion 402 is 3 ⁇ m or less, the same level of accuracy as that of a chip package having an intermediate member can be obtained.
  • the amount of warpage of the thin film portion 402 is 1.5 ⁇ m, and the curing shrinkage rate of the resin is about 0.14%.
  • the amount of warpage of the thin film portion 402 is about 3.2 ⁇ m and the curing shrinkage rate of the resin is about 0.12%
  • the amount of warpage of the thin film portion 402 is about 3.5 ⁇ m and the curing shrinkage rate of the resin is about 0.11.
  • the amount of warpage of the thin film portion 402 is about 3.9 ⁇ m, and when the curing shrinkage rate of the resin is about 0.09%, the amount of warpage of the thin film portion 402 is about 4.2 ⁇ m.
  • the warp of the thin film portion 402 is 3 ⁇ m or less, the same level of accuracy as a chip package having an intermediate member can be obtained, but a black circle mark having a resin curing shrinkage rate of about 0.14% or less.
  • the four points of are over 3 ⁇ m.
  • FIG. 10A when the points marked with black circles are connected by a straight broken line, it can be seen that the curing shrinkage rate of the resin is 0.18% and the amount of warpage of the thin film portion 402 is 3 ⁇ m. Therefore, the optimum value of the curing shrinkage rate of the resin is required to be 0.18% or more.
  • the warp of the sealing resin member 303 represents the warp on the lower surface of the back surface resin portion S of the sealing resin member 303.
  • sample 1 is configured in the same manner as in Example 1 described above
  • sample 2 is configured in the same manner as in Example 2 described above.
  • the amount of warpage of the sealing resin member 303 is shown by a bar graph
  • the amount of warpage of the thin film portion 402 is shown by a polygonal line.
  • the amount of warpage of the sealing resin member 303 of sample 1 is about 5.2 ⁇ m
  • the amount of warpage of the thin film portion 402 is also about 5.2 ⁇ m
  • the amount of warpage of the sealing resin member 303 of sample 2 is about 5.5 ⁇ m when the amount of warpage of the thin film portion 402 is about 4.2 ⁇ m and the curing shrinkage rate of the resin is 0.11%.
  • the amount of warpage of the thin film portion 402 is about 4.8 ⁇ m
  • the amount of warpage of the sealing resin member 303 of sample 2 is about 5.5 ⁇ m
  • the amount of warpage of the thin film portion 402 is about 4.8 ⁇ m
  • the curing shrinkage rate of the resin is 0.
  • the amount of warpage of the sealing resin member 303 of sample 2 is about 6.5 ⁇ m
  • the amount of warpage of the thin film portion 402 is about 3.5 ⁇ m
  • when the curing shrinkage rate of the resin is 0.14%, of sample 2.
  • the amount of warpage of the sealing resin member 303 is about 6.6 ⁇ m
  • the amount of warpage of the thin film portion 402 is about 3.2 ⁇ m
  • the curing shrinkage rate of the resin is 0.3%
  • the amount of warpage of the sealing resin member 303 of sample 1 Is about 7.5 ⁇ m
  • the amount of warpage of the thin film portion 402 is about 2.2 ⁇ m
  • the amount of warpage of the sealing resin member 303 of sample 2 is about 7.8 ⁇ m
  • the amount of warpage of the thin film portion 402 is about 1.5 ⁇ m. ..
  • the calculated curvature 1 / ⁇ and radius of curvature ⁇ are 0.461 for 1 / ⁇ when h5 is 0.0005, 2.168 for ⁇ , and 0.477 for 1 / ⁇ when h5 is 0.001.
  • ⁇ is 2.095
  • ⁇ is 2.037
  • h5 was 0.008, 1 / ⁇ was 0.509 and ⁇ was 1.983.
  • the optimum value of the ratio h3 / h1 of the thickness of the front surface resin portion U and the thickness of the back surface resin portion S is twice or more. It has been verified that the optimum value of the curing shrinkage rate ⁇ is 0.18%.
  • ⁇ Measurement of radius of curvature ⁇ > the radius of curvature ⁇ on the upper surface of the element 301 in the chip package 300 according to the present embodiment was actually measured, and it was verified whether it was consistent with the calculation result of the general formula.
  • a 3D scanner VR-3000 was used as the measuring device.
  • the measurement position was the oxide film area of the element 301, and the measurement method was to derive the radius of curvature ⁇ by aiming at the exposed dimension of the element 301 (the width of the passage of the intake air 2).
  • the chip package 300 according to the present embodiment is mounted on the lead frame 302 and the lead frame 302, and the lead frame 302 and the element 301 are mounted on the lead frame 302 so that the element 301 having the thin film portion 402 and at least the thin film portion 402 are exposed. It has a sealing resin member 303 that seals the above.
  • the radius of curvature ⁇ of the exposed portion exposed from the sealing resin member 303 of the element 301 is 2.13 or less.
  • the element 301 is formed so as to satisfy the condition that the radius of curvature ⁇ (mm) of the exposed portion exposed from the sealing resin member 303 of the element 301 is 2.13 or less. Therefore, when forming the sealing resin member 303 that seals the element 301 and the lead frame 302, it is possible to obtain an effect that warpage of the thin film portion 402 can be suppressed. That is, the condition that the radius of curvature ⁇ (mm) of the peripheral region portion of the surface of the element 301 after the mold resin forming the sealing resin member 303 is cured is 2.13 or less ( ⁇ ⁇ 2.13).
  • the amount of warpage of the thin film portion 402 is within 3 ⁇ m, which is the optimum value, the flatness of the surface of the thin film portion 402 is ensured, and the chip package 300 capable of accurately measuring the flow rate of the intake air 2 is provided. It has the effect of being obtained.
  • ⁇ satisfies the relationship of the following formula (1), h1 to h5 of the chip package 300 and the curing shrinkage rate ⁇ are appropriately selected to ensure ⁇ .
  • the effect that ⁇ 2.13 can be calculated can be obtained.
  • the curing shrinkage rate ⁇ of the mold resin forming the sealing resin member 303 is 0.18% or more, so that the sealing resin member 303 is molded at the molding temperature.
  • the sealing resin member 303 can be deformed in a direction in which the sealing resin member 303 is positively warped so that its surface becomes convex. Therefore, the compressive stress of the thin film portion 402 generated by the contraction of the lead frame 302 is relaxed by the tensile force acting on the mold resin, the stress is prevented from being concentrated on the thin film portion 402, and the thin film portion 402 is suppressed from being deformed. The effect of being able to do it is obtained.
  • the chip package 300 according to the present embodiment does not have an intermediate member, the effect that the production cost is reduced as compared with the conventional chip package having the intermediate member can be obtained.
  • the chip package 300 has a groove-shaped passage Kt in which the sealing resin member 303 has a pair of passage walls Th and a bottom wall on which the surface of the element main body 401 is exposed.
  • a pair of passage walls Th forming the passage Kt of the sealing resin member 303 cover both edges in the direction orthogonal to the air flow of the element 301, and the thin film portion 402 is exposed in the passage Kt.
  • the maximum thickness (mm) h3 of the surface resin portion U which is the thickness of the sealing resin member 303 on the surface side (element 301 side) of the lead frame 302, is set.
  • the sealing resin member 303 is formed to have a thickness that is at least twice the maximum thickness (mm) h1 of the back surface resin portion S, which is the thickness on the back surface side of the lead frame 302.
  • a through hole Kh is formed in a part of the lead frame 302 in a region where the thin film portion 402 is projected onto the lead frame 302 in a direction perpendicular to the surface of the element 301.
  • a polyimide tape 304 is attached to the back surface side of the lead frame 302 so as to cover the through hole Kh.
  • the sealing resin member 303 has an opening K1 so that a part of the tape 304 is exposed.
  • the opening K1 has a truncated cone shape in which the opening diameter increases as the distance from the lead frame 302 increases.
  • the passage wall Th has a diaphragm shape in which the opening area of the passage Kt gradually narrows as it approaches the thin film portion 402 (detection portion).
  • the resin-sealed package is manufactured by resin-sealing the sealing resin member 303 so that the curing shrinkage rate ⁇ is 0.18% or more.
  • the resin-sealed package is manufactured by resin-sealing the exposed portion of the element 301 exposed from the sealing resin member 303 so that the radius of curvature ⁇ is 2.13 or less.
  • the present invention is not limited to the above-described embodiments, and various designs are designed without departing from the spirit of the present invention described in the claims. You can make changes.
  • the above-described embodiment has been described in detail in order to explain the present invention in an easy-to-understand manner, and is not necessarily limited to the one including all the described configurations.

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  • Physics & Mathematics (AREA)
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  • General Physics & Mathematics (AREA)
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PCT/JP2020/048699 2020-03-10 2020-12-25 空気流量測定装置 Ceased WO2021181827A1 (ja)

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JP2022505781A JP7164282B2 (ja) 2020-03-10 2020-12-25 空気流量測定装置
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US8057882B2 (en) * 2006-03-28 2011-11-15 Kobe Steel, Ltd. Membrane structure element and method for manufacturing same
JP5456815B2 (ja) * 2010-10-13 2014-04-02 日立オートモティブシステムズ株式会社 流量センサおよびその製造方法
JP5676527B2 (ja) * 2012-06-15 2015-02-25 日立オートモティブシステムズ株式会社 熱式流量計
JP5755185B2 (ja) * 2012-06-15 2015-07-29 日立オートモティブシステムズ株式会社 熱式流量計
JP6096070B2 (ja) * 2013-06-20 2017-03-15 日立オートモティブシステムズ株式会社 熱式流量計の製造方法
JP6198697B2 (ja) * 2014-08-14 2017-09-20 日立オートモティブシステムズ株式会社 熱式流量計
JP5841211B2 (ja) * 2014-09-01 2016-01-13 日立オートモティブシステムズ株式会社 物理量計測装置及びその製造方法
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