WO2021176554A1 - 発光ユニットの製造方法 - Google Patents

発光ユニットの製造方法 Download PDF

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Publication number
WO2021176554A1
WO2021176554A1 PCT/JP2020/008893 JP2020008893W WO2021176554A1 WO 2021176554 A1 WO2021176554 A1 WO 2021176554A1 JP 2020008893 W JP2020008893 W JP 2020008893W WO 2021176554 A1 WO2021176554 A1 WO 2021176554A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
substrate
emitting unit
manufacturing
color
Prior art date
Application number
PCT/JP2020/008893
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
由治 谷澤
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to EP20923393.1A priority Critical patent/EP4117046A4/de
Priority to JP2022504809A priority patent/JPWO2021176554A1/ja
Priority to PCT/JP2020/008893 priority patent/WO2021176554A1/ja
Priority to CN202080095765.1A priority patent/CN115053357A/zh
Publication of WO2021176554A1 publication Critical patent/WO2021176554A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Definitions

  • This specification discloses a method for manufacturing a light emitting unit.
  • each of a large number of supplied LEDs is set as a plurality of chromaticity populations within a chromaticity range.
  • Each of these LEDs is finely ranked according to the numerical value of the light source, and then further ranked according to the numerical value of the forward voltage, and then each rank of the LED. It is disclosed that the LEDs belonging to the above are appropriately combined to specify the arrangement position of the light source unit on the bar.
  • an LED element having as uniform brightness and color as possible is selected. Is desirable. However, if the brightness and color of the LED elements that can be mounted on the same unit substrate are strictly controlled, the more characteristics to be managed, the fewer LED elements can be used, and the more in-process products are used.
  • the present disclosure can suppress variations in the light emitting state among a plurality of LED elements mounted on the same unit substrate, and is a mounting target as compared with a device in which the brightness and color of the LED elements are strictly controlled. It is a main object of the present invention to provide a method for manufacturing a light emitting unit capable of suppressing the generation of in-process products by increasing the number of LED elements.
  • the method for manufacturing the light emitting unit of the present disclosure is as follows. It is a method of manufacturing a light emitting unit for manufacturing a light emitting unit by mounting a plurality of LED elements on the same unit substrate. A plurality of combinations of brightness and color of the LED element that can be mounted on the same unit substrate are created as management data. The light emitting unit is manufactured by mounting a plurality of LED elements having the same brightness and color as any combination of the plurality of combinations included in the management data on the same unit substrate.
  • the gist is that.
  • a plurality of combinations of brightness and color of LED elements that can be mounted on the same unit substrate are created as management data, and the plurality of combinations included in the management data are combined.
  • a plurality of LED elements having the same brightness and color as any combination of the two are mounted on the same unit substrate.
  • FIG. 1 is a schematic configuration diagram of a multi-chamfered substrate.
  • the multi-chamfered substrate 10 is a collective substrate including a plurality of unit substrates 12 (child substrates).
  • a large number of a pair of unit substrates 12 having the same shape (substantially L-shaped) inverted 180 degrees are arranged vertically and horizontally on the multi-chamfered substrate 10.
  • Each unit substrate 12 is separated from each other by a dividing groove.
  • the multi-chamfered substrate 10 can easily separate each unit substrate 12 along the dividing groove by pressing each unit substrate 12.
  • each unit substrate 12 is also referred to as a board, and the number written at the end thereof represents an identification number.
  • FIG. 2 is a schematic configuration diagram of the component mounting machine 20.
  • the component mounting machine 20 includes a feeder 21 (for example, a tape feeder or a tray feeder) that supplies an LED 14 as an electronic component, a substrate transfer device 22 that conveys a multi-chamfered substrate 10 as a substrate S, and a feeder 21.
  • a feeder 21 for example, a tape feeder or a tray feeder
  • a mounting head 23 having a nozzle for sucking the LED 14 supplied from the mounting head 23 and a head moving device 24 for moving the mounting head 23 are provided.
  • the component mounting machine 20 takes out the LED 14 from the feeder 21 by the mounting head 23 according to a predetermined mounting order, and sequentially mounts the LED 14 on each unit board 12 included in the multi-chamfer board 10.
  • the LED 14 has variations in brightness, color, etc. due to individual differences in manufacturing. Therefore, when a plurality of LEDs 14 are mounted on the unit substrate 12 to manufacture a light emitting unit, the same unit substrate 12 is used so that the brightness and color of each LED 14 are as uniform as possible in the unit substrate 12. Each LED 14 to be mounted is selected. However, if the brightness and color of each LED 14 mounted on the same unit board 12 are strictly controlled, the number of LEDs 14 to be mounted decreases and the number of in-process products increases. Therefore, in the method for manufacturing the light emitting unit of the present embodiment, a plurality of combinations of the brightness, color, and forward voltage (voltage) of the LED 14 that can be mounted on the same unit substrate 12 are registered as management data and registered. The LED 14 whose brightness, color, and voltage match any of the combinations can be mounted on the same unit board 12.
  • FIG. 3 is an explanatory diagram showing an example of the light emitting unit manufacturing process.
  • management data for managing the LED 14 that can be mounted on the same unit substrate 12 is created (S100).
  • FIG. 4 is an explanatory diagram showing an example of management data.
  • FIG. 5 shows an example of the LED characteristic class.
  • the characteristic class is a grouping of combinations of brightness, color, and forward voltage of the LED 14 that can be mounted on the same unit substrate 12 for each combination.
  • the LEDs 14 included in the same combination can be regarded as having a uniform light emission state among the LEDs 14, and can be mounted on the same unit substrate 12.
  • the number of combinations is not limited to a plurality of combinations, and may be only one.
  • a plurality of LEDs 14 to be mounted on the same unit board 12 are selected from the same combination of management data (S110).
  • S110 combination of management data
  • FIG. 4 for example, when a plurality of LEDs 14 mounted on the same unit substrate 12 are selected from the combination 1, the plurality of LEDs 14 have a brightness of 792, a voltage of 674, and a color. It is selected from a combination of 00-11 and 19-23.
  • the plurality of LEDs 14 to be mounted on the same unit substrate 12 are selected from the combination 2
  • the plurality of LEDs 14 have a brightness of 792, a voltage of 674, and a color of 12 to 18. Selected from.
  • the plurality of LEDs 14 to be mounted on the same unit substrate 12 are selected from the combination 3 the plurality of LEDs 14 have a brightness of 793, a voltage of 015, and a color of 00 to 11. Selected from.
  • FIG. 6 is an explanatory diagram showing an example of an LED mounted on each unit substrate of the multi-chamfered substrate.
  • the LED 14 selected from the same combination is mounted on the multi-chamfered substrate 10 for each unit substrate 12 (Board).
  • the light emitting state (luminance, color, forward voltage) of each LED 14 can be made as uniform as possible in the unit substrate 12.
  • the LED 14 by giving a range to the characteristic classes (luminance, voltage and color) of the LED 14 that can be mounted on the same unit board 12 (which can be regarded as the same light emitting state) according to the management data, it can be mounted.
  • the number of LEDs 14 can be increased to suppress the generation of in-process products.
  • the LED 14 of the present embodiment corresponds to the LED element of the present disclosure
  • the unit substrate 12 child substrate
  • the multi-chamfered substrate 10 corresponds to a collective substrate.
  • the brightness, color, and forward voltage of the LED 14 are included in the management data, but the forward voltage may not be included in the management data. Even in this case, the brightness and color of the plurality of LEDs 14 mounted on the same unit substrate 12 can be made uniform.
  • the method for manufacturing the light emitting unit of the above-described embodiment is that in the multi-chamfered substrate 10 having a plurality of unit substrates 12, the brightness of the LED 14 that can be mounted on the same unit substrate 12 for each unit substrate 12 (child substrate) is increased.
  • the color combination is managed as management data.
  • the method for manufacturing the light emitting unit is not limited to the multi-chamfered substrate 10, and in a substrate having only one unit substrate, the brightness and color combinations of LEDs that can be mounted on the unit substrate are managed as management data. You may.
  • the method for manufacturing a light emitting unit of the present disclosure is a method for manufacturing a light emitting unit for manufacturing a light emitting unit by mounting a plurality of LED elements on the same unit substrate, and the same unit.
  • a plurality of combinations of brightness and color of the LED element that can be mounted on the substrate are created as management data, and any combination of the plurality of combinations included in the management data matches the brightness and color.
  • the gist is that the light emitting unit is manufactured by mounting a plurality of LED elements to be mounted on the same unit substrate.
  • a plurality of combinations of brightness and color of LED elements that can be mounted on the same unit substrate are created as management data, and the plurality of combinations included in the management data are combined.
  • a plurality of LED elements having the same brightness and color as any combination of the two are mounted on the same unit substrate.
  • a plurality of combinations of the brightness, color, and forward voltage of the LED element that can be mounted on the same unit substrate are created as management data and included in the management data.
  • the light emitting unit may be manufactured by mounting any combination of the plurality of combinations and a plurality of LED elements having the same brightness, color, and forward voltage on the same unit substrate. By doing so, it is possible to further suppress the variation in the light emitting state among the plurality of LED elements mounted on the same unit substrate. Further, by having a plurality of combinations of brightness, color, and forward voltage that can be mounted on the same unit board, it is possible to increase the number of LED elements to be mounted and suppress the generation of in-process products. ..
  • the unit substrate may be a child substrate formed by dividing the collective substrate, and the management data may be managed for each child substrate.
  • the management data has a plurality of sets of the plurality of combinations, and in the same set, with any combination of the plurality of combinations included in the management data.
  • a plurality of LED elements whose brightness and color match may be mounted on the same unit substrate to manufacture the light emitting unit.
  • This disclosure can be used in the light emitting unit manufacturing industry and the like.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PCT/JP2020/008893 2020-03-03 2020-03-03 発光ユニットの製造方法 WO2021176554A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP20923393.1A EP4117046A4 (de) 2020-03-03 2020-03-03 Verfahren zum herstellen einer lichtemittierenden einheit
JP2022504809A JPWO2021176554A1 (de) 2020-03-03 2020-03-03
PCT/JP2020/008893 WO2021176554A1 (ja) 2020-03-03 2020-03-03 発光ユニットの製造方法
CN202080095765.1A CN115053357A (zh) 2020-03-03 2020-03-03 发光单元的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/008893 WO2021176554A1 (ja) 2020-03-03 2020-03-03 発光ユニットの製造方法

Publications (1)

Publication Number Publication Date
WO2021176554A1 true WO2021176554A1 (ja) 2021-09-10

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PCT/JP2020/008893 WO2021176554A1 (ja) 2020-03-03 2020-03-03 発光ユニットの製造方法

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EP (1) EP4117046A4 (de)
JP (1) JPWO2021176554A1 (de)
CN (1) CN115053357A (de)
WO (1) WO2021176554A1 (de)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021221A (ja) * 2007-06-13 2009-01-29 Sharp Corp 線状光源装置、面発光装置、面状光源装置、および、液晶表示装置
JP2011254064A (ja) 2010-05-06 2011-12-15 Funai Electric Co Ltd 面発光装置
JP2013041730A (ja) * 2011-08-12 2013-02-28 Sharp Corp 光源モジュール
US20130075769A1 (en) * 2011-09-22 2013-03-28 Ledengin, Inc. Selection of phosphors and leds in a multi-chip emitter for a single white color bin
JP2013065644A (ja) * 2011-09-16 2013-04-11 Panasonic Corp 発光素子の製造システムおよび製造方法ならびに発光素子パッケージの製造システムおよび製造方法
JP2014096401A (ja) * 2012-11-07 2014-05-22 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置、演算装置および実装方法
JP2017108092A (ja) * 2015-11-30 2017-06-15 日亜化学工業株式会社 発光装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019130398A1 (ja) * 2017-12-25 2019-07-04 株式会社Ｆｕｊｉ 生産管理装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021221A (ja) * 2007-06-13 2009-01-29 Sharp Corp 線状光源装置、面発光装置、面状光源装置、および、液晶表示装置
JP2011254064A (ja) 2010-05-06 2011-12-15 Funai Electric Co Ltd 面発光装置
JP2013041730A (ja) * 2011-08-12 2013-02-28 Sharp Corp 光源モジュール
JP2013065644A (ja) * 2011-09-16 2013-04-11 Panasonic Corp 発光素子の製造システムおよび製造方法ならびに発光素子パッケージの製造システムおよび製造方法
US20130075769A1 (en) * 2011-09-22 2013-03-28 Ledengin, Inc. Selection of phosphors and leds in a multi-chip emitter for a single white color bin
JP2014096401A (ja) * 2012-11-07 2014-05-22 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置、演算装置および実装方法
JP2017108092A (ja) * 2015-11-30 2017-06-15 日亜化学工業株式会社 発光装置の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4117046A4

Also Published As

Publication number Publication date
EP4117046A4 (de) 2023-04-12
JPWO2021176554A1 (de) 2021-09-10
CN115053357A (zh) 2022-09-13
EP4117046A1 (de) 2023-01-11

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