JPWO2021176554A1 - - Google Patents

Info

Publication number
JPWO2021176554A1
JPWO2021176554A1 JP2022504809A JP2022504809A JPWO2021176554A1 JP WO2021176554 A1 JPWO2021176554 A1 JP WO2021176554A1 JP 2022504809 A JP2022504809 A JP 2022504809A JP 2022504809 A JP2022504809 A JP 2022504809A JP WO2021176554 A1 JPWO2021176554 A1 JP WO2021176554A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022504809A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021176554A1 publication Critical patent/JPWO2021176554A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022504809A 2020-03-03 2020-03-03 Pending JPWO2021176554A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/008893 WO2021176554A1 (ja) 2020-03-03 2020-03-03 発光ユニットの製造方法

Publications (1)

Publication Number Publication Date
JPWO2021176554A1 true JPWO2021176554A1 (ja) 2021-09-10

Family

ID=77613166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022504809A Pending JPWO2021176554A1 (ja) 2020-03-03 2020-03-03

Country Status (4)

Country Link
EP (1) EP4117046A4 (ja)
JP (1) JPWO2021176554A1 (ja)
CN (1) CN115053357A (ja)
WO (1) WO2021176554A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021221A (ja) * 2007-06-13 2009-01-29 Sharp Corp 線状光源装置、面発光装置、面状光源装置、および、液晶表示装置
JP2013041730A (ja) * 2011-08-12 2013-02-28 Sharp Corp 光源モジュール
US20130075769A1 (en) * 2011-09-22 2013-03-28 Ledengin, Inc. Selection of phosphors and leds in a multi-chip emitter for a single white color bin
JP2013065644A (ja) * 2011-09-16 2013-04-11 Panasonic Corp 発光素子の製造システムおよび製造方法ならびに発光素子パッケージの製造システムおよび製造方法
JP2014096401A (ja) * 2012-11-07 2014-05-22 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置、演算装置および実装方法
JP2017108092A (ja) * 2015-11-30 2017-06-15 日亜化学工業株式会社 発光装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011254064A (ja) * 2010-05-06 2011-12-15 Funai Electric Co Ltd 面発光装置
CN111386612B (zh) * 2017-12-25 2023-07-25 株式会社富士 生产管理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021221A (ja) * 2007-06-13 2009-01-29 Sharp Corp 線状光源装置、面発光装置、面状光源装置、および、液晶表示装置
JP2013041730A (ja) * 2011-08-12 2013-02-28 Sharp Corp 光源モジュール
JP2013065644A (ja) * 2011-09-16 2013-04-11 Panasonic Corp 発光素子の製造システムおよび製造方法ならびに発光素子パッケージの製造システムおよび製造方法
US20130075769A1 (en) * 2011-09-22 2013-03-28 Ledengin, Inc. Selection of phosphors and leds in a multi-chip emitter for a single white color bin
JP2014096401A (ja) * 2012-11-07 2014-05-22 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置、演算装置および実装方法
JP2017108092A (ja) * 2015-11-30 2017-06-15 日亜化学工業株式会社 発光装置の製造方法

Also Published As

Publication number Publication date
CN115053357A (zh) 2022-09-13
EP4117046A4 (en) 2023-04-12
WO2021176554A1 (ja) 2021-09-10
EP4117046A1 (en) 2023-01-11

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