WO2021169882A1 - 显示装置及其制备方法 - Google Patents

显示装置及其制备方法 Download PDF

Info

Publication number
WO2021169882A1
WO2021169882A1 PCT/CN2021/077122 CN2021077122W WO2021169882A1 WO 2021169882 A1 WO2021169882 A1 WO 2021169882A1 CN 2021077122 W CN2021077122 W CN 2021077122W WO 2021169882 A1 WO2021169882 A1 WO 2021169882A1
Authority
WO
WIPO (PCT)
Prior art keywords
touch
circuit board
flexible circuit
area
pads
Prior art date
Application number
PCT/CN2021/077122
Other languages
English (en)
French (fr)
Chinese (zh)
Inventor
熊韧
朱元章
汤强
宋慧强
蒋宜辰
闵航
尚飞
邱海军
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to KR1020227003545A priority Critical patent/KR20220146406A/ko
Priority to JP2022521456A priority patent/JP2023513863A/ja
Priority to US17/626,902 priority patent/US11991828B2/en
Priority to EP21760201.0A priority patent/EP4114147A4/en
Publication of WO2021169882A1 publication Critical patent/WO2021169882A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/134309—Electrodes characterised by their geometrical arrangement
    • G02F1/134372—Electrodes characterised by their geometrical arrangement for fringe field switching [FFS] where the common electrode is not patterned
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a display device and a manufacturing method thereof.
  • FMLOC display devices include a display panel, a touch layer disposed on the display panel, and a flexible circuit board (Flexible Printed Circuit, FPC for short), through the electrical connection of the flexible circuit board and the display panel, the display signal is transmitted to the display panel and the touch signal is transmitted to the touch layer, thereby achieving image display and touch point positioning.
  • FPC Flexible Printed Circuit
  • a display device in one aspect, includes a display panel, a touch layer disposed on the light-emitting side of the display panel, and a flexible circuit board bound with the display panel.
  • the touch layer includes a plurality of first touch leads and a plurality of second touch leads
  • the flexible circuit board includes a main flexible circuit board and a bridge flexible circuit board.
  • the main flexible circuit board includes a first substrate, a plurality of pads, a touch chip, a plurality of first touch connection wires, a plurality of second touch connection wires, and a plurality of third touch connection wires.
  • the first substrate has a first welding area, a second welding area, and a binding area.
  • the binding area is an area where the first substrate and the display panel are bound, and the plurality of pads are disposed on the The first welding area and the second welding area.
  • the touch chip is disposed on the first substrate, and the minimum distance between the touch chip and the first welding area is smaller than the minimum distance between the touch chip and the second welding area .
  • the plurality of first touch connection wires are disposed on the first substrate, and one end of each first touch connection wire is electrically connected to the touch chip, and the other end is connected to a first touch layer in the touch layer.
  • a touch lead is electrically connected;
  • the plurality of second touch connection wires are arranged on the first substrate, and one end of each second touch connection wire is electrically connected to a pad of the second welding area, The other end is electrically connected to a second touch lead in the touch layer;
  • the plurality of third touch connection lines are arranged on the first substrate, and one end of each third touch connection line is connected to the One of the pads of the first welding area is electrically connected, and the other end is electrically connected to the touch chip.
  • the bridging flexible circuit board includes a second substrate, a plurality of pads, and a plurality of touch switch wires.
  • the second substrate has a third welding area and a fourth welding area, the plurality of pads are disposed in the third welding area and the fourth welding area, and a pad of the third welding area is connected to the third welding area.
  • One pad of the first welding area is welded, and one pad of the fourth welding area is welded to one pad of the second welding area.
  • the multiple touch transfer wires are disposed on the second substrate, and one end of each touch transfer wire is electrically connected to a pad of the third welding area, and the other end is connected to the fourth welding area.
  • the disk is electrically connected; the maximum radial dimension of the pad is less than or equal to 1.0 mm.
  • the bridge flexible circuit board further includes at least one shielding transfer line, the at least one shielding transfer line is disposed on the second substrate, and one end of each shielding transfer line is connected to the third welding area One of the pads is electrically connected, and the other end is electrically connected to a pad of the fourth welding area.
  • the bridge flexible circuit board includes a plurality of the shielding transfer lines, and the plurality of shielding transfer lines includes at least two outermost edge shielding transfer lines, the two edge shielding transfer lines Adjacent ends are connected to each other to form a ring shape, and the multiple touch switch wires are all arranged on the inner side of the ring shape.
  • the third welding area and the fourth welding area include M rows of pads, where M ⁇ 2; in the two edge shielding patch cords, both ends of one edge shielding patch cord pass through the first One row of pads on the side away from the last row of pads is electrically connected to the two pads that are farthest from the first row of pads in the third welding area and the fourth welding area; the other edge is shielded
  • the two ends of the patch cord pass through the last row of pads away from the side of the first row of pads, and are electrically connected to the two pads farthest from the last row of pads in the third welding area and the fourth welding area. connect.
  • the third welding area and the fourth welding area are disposed at opposite ends of the second substrate, and the orthographic projection of the second substrate on the main flexible circuit board is not Center symmetrical figure.
  • the third soldering area or the fourth soldering area includes M rows of pads, where M ⁇ 2; among the multiple patch cords on the second substrate, the two outermost patch cords There are at least 2M pads distributed between the wires.
  • the main flexible circuit board is configured to be bound to the display panel of the display device; the first welding area and the second welding area are arranged side by side in a first direction; The extending directions of the sides of the main flexible circuit board close to the display panel are substantially parallel.
  • the pads of the third welding area and the pads of the fourth welding area are both arranged in multiple rows, and at least one row of the pads includes a plurality of pads arranged along the first direction; At least one of the plurality of patch cords on the second substrate passes through the area outside the first row of pads and the last row of pads in the third soldering area and the fourth soldering area, and the corresponding The pads are electrically connected.
  • two adjacent rows of pads are staggered to each other; the second direction is substantially perpendicular to the first direction.
  • the second substrate has a transition wiring area and connection sectors located at opposite ends of the transition wiring area;
  • the transition line includes a transition section, and a transition section located at the transition section.
  • the connecting sections at opposite ends, the transition section extends along the first direction and is arranged in the transition wiring area, and the connecting section is arranged in the connecting sector.
  • the minimum width of the connecting sector in the second direction is greater than or equal to the width of the transition wiring area in the second direction; the second direction is substantially perpendicular to the first direction.
  • the width of the transition wiring area in the second direction is smaller than the maximum width of the third welding area in the second direction; and/or, the transition wiring area is The width in the second direction is smaller than the maximum width of the fourth welding area in the second direction.
  • the connection sector close to the third welding area has a maximum width in the second direction greater than the maximum width of the third welding area in the second direction; and/or, close to the fourth welding The maximum width of the connecting sector of the area in the second direction is greater than the maximum width of the fourth welding area in the second direction.
  • the outer contour of the pad is approximately circular.
  • the diameter of the pad ranges from 0.25 mm to 0.35 mm.
  • the pad on the second substrate is a via pad; the second substrate has a plurality of via holes, and each via hole corresponds to a via pad.
  • the via pad includes two solder pads and a conductive connection layer.
  • the two solder tabs are respectively disposed on the surface of the second substrate close to and far from the main flexible circuit board, and the via hole corresponding to the via pad penetrates one of the two solder tabs of the via pad.
  • the second substrate in between, and the two soldering pads; the conductive connection layer covers the sidewall of the via hole, and both ends are electrically connected to the two soldering pads.
  • the outer contour of the orthographic projection of the via pad on the second substrate is approximately circular.
  • the diameter of the outer contour of the via pad ranges from 0.25 mm to 0.35 mm.
  • the inner contour of the orthographic projection of the via pad on the second substrate is approximately circular or X-shaped.
  • the diameter of the inner contour ranges from 0.05 mm to 0.15 mm.
  • the diameter of the circumscribed circle corresponding to the inner contour ranges from 0.05 mm to 0.2 mm.
  • the main flexible circuit board further includes a first metal pattern that covers the pad on the first substrate, and the first metal pattern is configured to prevent the first The pad on the substrate is oxidized; and/or, the bridge flexible circuit board further includes a second metal pattern that covers the pad on the second substrate, and the second metal pattern is configured To prevent the pads on the second substrate from being oxidized.
  • the material of the first metal pattern when the main flexible circuit board includes a first metal pattern, includes one or a combination of gold and nickel; When the second metal pattern is included, the material of the second metal pattern includes one or a combination of gold and nickel.
  • the main flexible circuit board further includes a first green oil layer and a first resin layer, the first green oil layer covering at least a first area of the first substrate, and the first area is The area outside the pad in the first welding area and the second welding area; the first resin layer covers the area outside the first welding area and the second welding area of the first substrate.
  • the bridge flexible circuit board further includes a second green oil layer and a second resin layer, the second green oil layer covering at least a second area of the second substrate, the second area being the third soldering area And the area outside the pad in the fourth welding area; the second resin layer covers the third welding area and the area outside the fourth welding area of the second substrate.
  • the first substrate has a component area.
  • the main flexible circuit board further includes at least one component and a third green oil layer.
  • the at least one component is disposed on the side of the first substrate close to the bridge flexible circuit board and is located on the first substrate.
  • the at least one component includes the touch chip; the third green oil layer covers an area outside the at least one component in the component area.
  • the main flexible circuit board further includes a support, the support is disposed on a side of the first substrate away from the bridging flexible circuit board, and the component area is located on the support Within the range of the orthographic projection on the first substrate.
  • the main flexible circuit board further includes a plurality of first bonding pins and a plurality of second bonding pins, and the plurality of first bonding pins are arranged in the bonding area , At least one first binding pin is configured to electrically connect the first touch connection wire with a corresponding first touch lead in the touch layer of the display device; the plurality of second binding pins The fixed pin is arranged in the binding area, and at least one second binding pin is configured to electrically connect the second touch connection wire with the corresponding second touch lead in the touch layer.
  • the range of the maximum size of the main flexible circuit board is 55.25mm ⁇ L1 ⁇ 55.55mm; the first direction and the main flexible circuit board close to the display panel
  • the extension directions of the sides are substantially parallel;
  • the binding area is strip-shaped and extends along the first direction;
  • the plurality of first binding pins and the plurality of second binding pins are along the Arranged side by side in the first direction;
  • the range of the maximum distance between the first binding pin and the second binding pin of the main flexible circuit board with the furthest distance is 53.55mm ⁇ L2 ⁇ 53.85mm.
  • the range of the maximum size of the binding area is 1.2mm ⁇ L3 ⁇ 1.6mm;
  • the second direction is substantially perpendicular to the first direction.
  • the number of first touch leads included in the touch layer is the same as the number of first touch wires included in the main flexible circuit board; the number of first touch wires included in the touch layer is the same The number of the two touch leads is the same as the number of the second touch connection wires and the number of the third touch connection wires included in the main flexible circuit board.
  • the main flexible circuit board further includes a plurality of data signal control lines, and the plurality of data signal control lines are disposed on the first substrate.
  • the display panel has a display area and a peripheral area located on at least one side of the display area; the display panel includes a plurality of data lines, and a driving chip, and the driving chip is disposed in the peripheral area and is connected to the peripheral area.
  • the multiple data signal control lines and the multiple data lines are electrically connected; the driving chip is configured to process the signals on the multiple data signal control lines and output them to the multiple data lines.
  • the number of data signal control lines included in the main flexible circuit board is less than the number of data lines included in the display panel, and the line width of the data signal control lines is greater than that of the data lines. Line width.
  • the main flexible circuit board further includes a first binding pin and a second binding pin;
  • the display panel further includes a plurality of first binding pads and a plurality of second binding pins.
  • a fixed pad, a first binding pad is electrically connected to the first binding pin and a first touch lead; a plurality of second binding pads, a second binding pad and a The second binding pin is electrically connected to a second touch lead.
  • the thicknesses of the first binding pad and the second binding pad are both smaller than the surface of the touch layer close to the display panel and the surface of the display panel far away from the display panel. The spacing between the surfaces on one side of the touch layer.
  • a display device in another aspect, includes a display panel, a touch layer disposed on the light emitting side of the display panel, and a flexible circuit board bound to the display panel.
  • the display panel has a display area and a peripheral area located on at least one side of the display area, the peripheral area is provided with a binding part, and the binding part includes a plurality of first binding pads and a plurality of second binding pads.
  • Fixed pad; the touch layer includes a plurality of first touch leads and a plurality of second touch leads, a first touch lead is electrically connected with a first binding pad, a second touch lead and A second binding pad is electrically connected.
  • the main flexible circuit board includes a first substrate, a plurality of pads, a touch chip, a plurality of first touch connection wires, a plurality of second touch connection wires, and a plurality of third touch connection wires.
  • the first substrate has a first welding area, a second welding area, and a binding area.
  • the binding area is provided with a plurality of first binding pins and a plurality of second binding pins.
  • the pin is electrically connected with a first binding pad, and a second binding pin is electrically connected with a second binding pad.
  • the plurality of pads are provided in the first welding area and the second welding area.
  • the touch chip is disposed on the first substrate, and the minimum distance between the touch chip and the first welding area is smaller than the minimum distance between the touch chip and the second welding area .
  • the plurality of first touch connection wires are arranged on the first substrate, one end of each first touch connection wire is electrically connected to the touch chip, and the other end is through the first binding pin, The first binding pad is electrically connected to the first touch wire; the plurality of second touch connection wires are disposed on the first substrate, and one end of each second touch connection wire is connected to the One of the pads of the second welding area is electrically connected, and the other end is electrically connected to the second touch lead through the second binding pin and the second binding pad; the plurality of third contacts
  • the control connection line is arranged on the first substrate, and one end of each third touch control connection line is electrically connected to a pad of the first welding area, and the other end is electrically connected to the touch chip.
  • the bridging flexible circuit board includes a second substrate, a plurality of pads, and a plurality of touch switch wires.
  • the second substrate has a third welding area and a fourth welding area, the plurality of pads are disposed in the third welding area and the fourth welding area, and a pad of the third welding area is connected to the third welding area.
  • One pad of the first welding area is welded, and one pad of the fourth welding area is welded to one pad of the second welding area.
  • the multiple touch transfer wires are disposed on the second substrate, and one end of each touch transfer wire is electrically connected to a pad of the third welding area, and the other end is connected to the fourth welding area. Disk electrical connection.
  • the maximum radial dimension of the pad is less than or equal to 1.0 mm.
  • the third soldering area or the fourth soldering area includes M rows of pads, where M ⁇ 2; among the multiple touch patch cords, at least 2M are distributed between the two outermost touch patch cords A pad.
  • the pads of the first welding area, the second welding area, the third welding area, and the fourth welding area are all arranged in multiple rows, and at least one row of pads includes a plurality of pads; along the column direction, Two adjacent rows of pads are staggered.
  • the pads on the bridging flexible circuit board are via pads; the via pads include two solder pads and a conductive connection layer, and the two solder pads are respectively arranged on the second substrate near and far away from the pads.
  • the via hole corresponding to the via pad penetrates the second substrate between the two pads of the via pad and the two pads; the conductive connection The layer covers the sidewall of the via hole, and the two ends are respectively electrically connected with the two soldering tabs.
  • the flexible circuit board includes a plurality of data signal control lines;
  • the display panel includes a plurality of data lines and a driving chip, and the driving chip is arranged in the peripheral area and is connected to the plurality of data The signal control line and the plurality of data lines are electrically connected;
  • the driving chip is configured to process the signals on the plurality of data signal control lines and output to the plurality of data lines; wherein, the data The number of signal control lines is smaller than the number of data lines, and the line width of the data signal control lines is greater than the line width of the data lines.
  • the number of first touch leads included in the touch layer is the same as the number of first touch wires included in the main flexible circuit board; the number of first touch wires included in the touch layer is the same The number of the two touch leads is the same as the number of the second touch connection wires and the number of the third touch connection wires included in the main flexible circuit board.
  • the first direction the flexible range of the main circuit board of the maximum dimension of 55.25mm ⁇ L 1 ⁇ 55.55mm; direction proximate the first flexible circuit board and the main display panel
  • the extending directions of the side edges of the are approximately parallel;
  • the binding area is strip-shaped and extends along the first direction;
  • the plurality of first binding pins and the plurality of second binding pins are along the The first direction is arranged side by side; and along the first direction, the range of the maximum distance between the first binding pin and the second binding pin of the main flexible circuit board with the furthest distance is 53.55mm ⁇ L 2 ⁇ 53.85mm;
  • the range of the maximum size of the binding area is 1.2mm ⁇ L 3 ⁇ 1.6mm;
  • the second direction is substantially perpendicular to the first direction.
  • a method for manufacturing a display device includes: forming a main flexible circuit board; the main flexible circuit board includes: a first substrate, a plurality of pads arranged in a first welding area and a second welding area of the first substrate, And a touch chip provided on the first substrate, a plurality of first touch connection wires, a plurality of second touch connection wires, a plurality of third touch connection wires, a plurality of first binding pins, and a plurality of The second binding pin.
  • each first touch connection wire is electrically connected to the touch chip, and the other end is electrically connected to a first binding pin; one end of each second touch connection wire is connected to the second welding area One pad is electrically connected, and the other end is electrically connected to one of the second binding pins; one end of each third touch connection wire is electrically connected to a pad of the first welding area, and the other end is electrically connected to the The touch chip is electrically connected.
  • a bridge flexible circuit board is formed; the bridge flexible circuit board includes: a second substrate, a plurality of pads arranged in the third welding area and the fourth welding area of the second substrate, and a plurality of touch patch cords; each One end of the touch switch wire is electrically connected to a pad of the third welding area, and the other end is electrically connected to a pad of the fourth welding area.
  • the plurality of pads in the first welding area are welded correspondingly to the plurality of pads in the third welding area, and the plurality of pads in the second welding area are welded to the plurality of pads in the fourth welding area.
  • the disk corresponds to welding to obtain a flexible circuit board.
  • a display panel and a touch layer are formed; the touch layer is located on one side of the light emitting side of the display panel; the display panel includes a plurality of first binding pads and a plurality of second binding pads, the touch
  • the control layer includes a plurality of first touch leads and a plurality of second touch leads; each first touch lead is electrically connected to a first binding pad of the display panel, and each second touch lead is electrically connected to a first binding pad of the display panel.
  • a second binding pad of the display panel is electrically connected.
  • the display panel provided with the touch control layer is bound to the flexible circuit board, so that the plurality of first binding pads are electrically connected to the plurality of first binding pins, and the plurality of A second binding pad is electrically connected to the plurality of second binding pins correspondingly.
  • the forming of the main flexible circuit board includes: forming a first conductive layer on the surface of the first substrate, and patterning the first conductive layer to be formed on the first soldering area and the Multiple pads in the second soldering area.
  • a first metal pattern is formed on the surface of the plurality of pads, and the first metal pattern is configured to prevent the plurality of pads from being oxidized.
  • the forming of the bridge flexible circuit board includes: forming a second conductive layer on the surfaces on opposite sides of the second substrate, and patterning the second conductive layer to form a conductive layer on the third soldering area and the fourth soldering area. Multiple solder tabs.
  • a second metal pattern is formed on the surfaces of the plurality of solder fins on the surfaces on opposite sides of the second substrate, and the second metal pattern is configured to prevent the plurality of solder fins from being oxidized.
  • a via hole is formed at the position of the two solder fins opposite in the thickness direction of the second substrate, and the via hole penetrates the two solder fins and the second substrate between the two solder fins.
  • a conductive connection layer is formed on the wall of the via, and both ends of the conductive connection layer are electrically connected to the two solder tabs; the conductive connection layer includes a conductive layer and a metal layer stacked in sequence, so The metal layer is configured to prevent the conductive layer from being oxidized.
  • the method further includes: coating green oil on the first welding area, the second welding area, the third welding area, the fourth welding area, and the component area. Removing the green oil in the areas where the multiple pads of the first welding area, the second welding area, the third welding area and the fourth welding area are located, so as to expose the multiple pads; and Remove the green oil in the area where the components of the component area are located to expose each component.
  • a resin material is applied to the first welding area, the second welding area, the third welding area, the fourth welding area, and the area outside the component area.
  • the plurality of pads of the first welding area are correspondingly welded to the plurality of pads of the third welding area, and the plurality of pads of the second welding area are connected to the The multiple soldering pads of the fourth soldering area are correspondingly soldered to obtain the flexible circuit board, including: coating tin paste on the multiple soldering pads of the first soldering area and the second soldering area.
  • the main flexible circuit board and the bridge flexible circuit board are aligned and attached together; the plurality of pads in the first welding area and the plurality of pads in the third welding area are attached correspondingly, the The plurality of pads in the second welding area and the plurality of pads in the fourth welding area are attached correspondingly.
  • the attached main flexible circuit board and the bridge flexible circuit board are heated to make the solder paste in a molten state.
  • the positioning and attaching the main flexible circuit board and the bridge flexible circuit board together includes: collecting a first image including the alignment mark of the main flexible circuit board, and including The second image of the alignment mark of the bridge flexible circuit board.
  • the first image and the second image are processed to obtain the first alignment mark coordinates of the main flexible circuit board and the second alignment mark coordinates of the bridged flexible circuit board.
  • the robot arm is controlled to move the bridge flexible circuit board and/or the main flexible circuit board to align the main flexible circuit board and the bridge flexible circuit board. Bit.
  • the third image including the alignment mark of the main flexible circuit board after the alignment and the fourth image including the alignment mark of the bridged flexible circuit board after the alignment are acquired.
  • FIG. 1 is a structural diagram of a display device according to some embodiments.
  • FIG. 2 is an exploded view of a touch display module of a display device according to some embodiments.
  • FIG. 3A is a cross-sectional view of I-I' when the display panel shown in FIG. 2 is an electroluminescent display panel;
  • 3B is another cross-sectional view of I-I' when the display panel shown in FIG. 2 is an electroluminescent display panel;
  • 3C is a cross-sectional view of I-I' when the display panel shown in FIG. 2 is a liquid crystal display panel;
  • 3D is another cross-sectional view of I-I' when the display panel shown in FIG. 2 is a liquid crystal display panel;
  • FIG. 4 is a structural diagram of the binding of a flexible circuit board and a display panel according to some embodiments
  • FIG. 5 is a structural diagram of a main flexible circuit board according to some embodiments.
  • Fig. 6 is a structural diagram of a bridged flexible circuit board according to some embodiments.
  • FIG. 7 is an enlarged view of a part where the display panel and the main flexible circuit board are bound according to some embodiments.
  • FIG. 8 is a structural diagram of a side of a main flexible circuit board away from the bridging flexible circuit board according to some embodiments.
  • Figure 9 is a structural diagram of a support according to some embodiments.
  • Figure 10 is a cross-sectional view at H-H' in Figure 9;
  • FIG. 11 is a structural diagram of another bridged flexible circuit board according to some embodiments.
  • FIG. 12 is a structural diagram of yet another bridged flexible circuit board according to some embodiments.
  • FIG. 13 is a diagram of a film structure of a main flexible circuit board or a bridge flexible circuit board according to some embodiments.
  • FIG. 14 is a diagram of another film layer structure of a main flexible circuit board or a bridge flexible circuit board according to some embodiments.
  • FIG. 15 is a diagram of another film structure of a main flexible circuit board or a bridge flexible circuit board according to some embodiments.
  • FIG. 16 is a diagram of another film structure of a main flexible circuit board or a bridge flexible circuit board according to some embodiments.
  • FIG. 17 is a diagram of a film structure of a bridge flexible circuit board according to some embodiments.
  • FIG. 18 is a diagram of another film layer structure for bridging flexible circuit boards according to some embodiments.
  • 19 is a structural diagram of a main flexible circuit board close to a side of the bridge flexible circuit board according to some embodiments.
  • 20 is a structural diagram of another main flexible circuit board away from the bridging flexible circuit board according to some embodiments.
  • FIG. 21 is an enlarged view of the binding area in FIG. 20 in some embodiments of the present disclosure.
  • FIG. 22 is a structural diagram of a shape of a pad according to some embodiments.
  • FIG. 23 is a structural diagram of another shape of a pad according to some embodiments.
  • FIG. 24 is a structural diagram of still another pad shape according to some embodiments.
  • FIG. 25 is an enlarged view of a welding area (which may be any one of the first welding area, the second welding area, the third welding area, or the fourth welding area) according to some embodiments;
  • FIG. 26A is a structural diagram of a circular shape of the inner contour of the via pad on the bridge flexible circuit board according to some embodiments.
  • FIG. 26B is an enlarged view of the shape of the inner contour of the via pad being X-shaped according to some embodiments.
  • Figure 27 is a cross-sectional view at A-A' in Figure 26A;
  • FIG. 28 is a structural diagram of the area outside the pads in the third welding area and the fourth welding area of the bridge flexible circuit board coated with green oil according to some embodiments;
  • FIG. 29A is an enlarged view of the third welding area in FIG. 28;
  • FIG. 29B is an enlarged view of the fourth welding area in FIG. 28;
  • Figure 30A is the X-ray diagram of Figure 29A
  • Figure 30B is the X-ray diagram of Figure 29B
  • FIG. 31 is a flowchart of a manufacturing method of a display device according to some embodiments.
  • FIG. 32 is still another flowchart of a manufacturing method of a display device according to some embodiments.
  • FIG. 33 is still another flowchart of a manufacturing method of a display device according to some embodiments.
  • FIG. 34 is another flowchart of a method of manufacturing a display device according to some embodiments.
  • FIG. 35 is still another flowchart of a manufacturing method of a display device according to some embodiments.
  • 36 is a structural diagram of the first soldering area and the second soldering area of the main flexible circuit board after coating solder paste on the pads of the main flexible circuit board according to some embodiments;
  • FIG. 37 is a cross-sectional view of a part of the pads after coating solder paste on the pads of the first soldering area and the second soldering area of the main flexible circuit board according to some embodiments;
  • FIG. 39 is another flowchart of a method of manufacturing a display device according to some embodiments.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, “plurality” means two or more.
  • connection and its extensions may be used.
  • the term “connected” may be used when describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.
  • the embodiments disclosed herein are not necessarily limited to the content of this document.
  • At least one of A, B, and C has the same meaning as “at least one of A, B, or C", and both include the following combinations of A, B, and C: only A, only B, only C, A and B The combination of A and C, the combination of B and C, and the combination of A, B and C.
  • a and/or B includes the following three combinations: A only, B only, and the combination of A and B.
  • exemplary embodiments are described herein with reference to cross-sectional views and/or plan views as idealized exemplary drawings.
  • the thickness of layers and regions are exaggerated for clarity. Therefore, variations in the shape with respect to the drawings due to, for example, manufacturing technology and/or tolerances can be envisaged. Therefore, the exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing.
  • an etched area shown as a rectangle will generally have curved features. Therefore, the areas shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shape of the area of the device, and are not intended to limit the scope of the exemplary embodiments.
  • the display device 100 is a device or device for visually displaying electronic information.
  • the display device 100 is a display device 100 that can be operated and controlled by tapping the screen with a finger (or a stylus or other tools). It includes at least one touch display panel 3 (also called : Touch screen, touch panel, touch screen, etc.).
  • the display device 100 may be any product or component with a display function, such as a smart phone, a tablet computer, a television, a monitor, a notebook computer, and other wearable electronic devices (such as a watch).
  • the type of the display device 100 is not limited, and it may be a liquid crystal display (Liquid Crystal Display, LCD for short) or an electroluminescent display device.
  • the electroluminescent display device may be an organic light-emitting diode (OLED) or a quantum dot electroluminescent display device (Quantum Dot Light Emitting). Diodes, QLED for short).
  • the display device 100 mainly includes a frame 1, a cover plate 2, a touch display panel 3, and a flexible circuit board 4 bonded and connected to the touch display panel 3.
  • the flexible circuit board 4 can be bent along the dashed line L toward the back of the touch display panel 3 (that is, the side away from the display surface of the touch display panel 3), so that the flexible circuit board 4 is located Touch the back of the display panel 3.
  • the display device 100 further includes a backlight assembly.
  • the touch display panel 3 may be a flexible touch display panel or a rigid touch display panel.
  • the display device 100 is a flexible display device.
  • the longitudinal section of the frame 1 is U-shaped, the touch display panel 3, the flexible circuit board 4 and other accessories are all arranged in the frame 1, and the flexible circuit board 4 is placed under the touch display panel 3 (away from the touch display panel). 3), the cover 2 is arranged on the side of the touch display panel 3 away from the flexible circuit board 4.
  • the display device 100 is a liquid crystal display device, the display device 100 includes a backlight assembly, and the backlight assembly is disposed between the touch display panel 3 and the flexible circuit board 4.
  • the touch display panel 3 includes a display panel 31 and a touch layer 32, and the touch layer 32 may be arranged on the light emitting side of the display panel 31.
  • the touch layer 32 can obtain coordinate information from external input (for example, the user's finger touch), that is, the touch layer 32 can be a touch panel that senses the user's touch; it can also be a fingerprint sensor panel that obtains fingerprint information of the user's finger.
  • the touch layer 32 can sense external input in a capacitive manner.
  • the sensing method of the touch layer 32 includes but is not limited to the above-mentioned embodiments, and other suitable sensing methods should be within the protection scope of the present disclosure.
  • the display device 100 further includes a polarizer 5 located between the cover plate 2 and the touch layer 32.
  • the polarizer 5 is used to reduce the reflected light after the external light is reflected by the metal structure in the display panel 3. Wherein, the polarizer 5 and the cover plate 2 are attached together by optical glue 6.
  • the display panel 31 is an organic electroluminescence display panel.
  • the display panel 31 includes a substrate 311 for display and an encapsulation layer 312 for encapsulating the substrate 311 for display.
  • the packaging layer 312 may be a packaging film or a packaging substrate.
  • each sub-pixel of the display substrate 311 includes a light-emitting device and a pixel driving circuit disposed on the first substrate Sub1, and the pixel driving circuit includes a plurality of thin film transistors 3111.
  • the thin film transistor 3111 includes an active layer, a source electrode, a drain electrode, a gate electrode, and a gate insulating layer, and the source electrode and the drain electrode are respectively in contact with the active layer.
  • the light-emitting device includes an anode 3112, a light-emitting functional layer 3113, and a cathode 3114.
  • the anode 3112 is electrically connected to the source or drain of the thin film transistor 3111 as the driving transistor among the plurality of thin film transistors 3111.
  • the anode 3112 and the thin film The drain of the transistor 3111 is electrically connected for illustration.
  • the display substrate 311 further includes a pixel defining layer 3115.
  • the pixel defining layer 3115 includes a plurality of opening regions, and one light emitting device is disposed in one opening region.
  • the light-emitting functional layer 3113 includes only the light-emitting layer. In other embodiments, in addition to the light-emitting layer, the light-emitting functional layer 3113 also includes an electron transport layer (election transporting layer, ETL), an electron injection layer (election injection layer, EIL), and a hole transporting layer (hole transporting layer). At least one of layer, HTL for short) and hole injection layer (HIL for short).
  • ETL electron transport layer
  • EIL electron injection layer
  • hole transporting layer hole transporting layer
  • the display substrate 311 further includes a flat layer 3116 provided between the thin film transistor 3111 and the anode 3112.
  • the touch layer 32 may be directly disposed on the encapsulation layer 312, that is, no other film layer is disposed between the touch layer 32 and the encapsulation layer 312.
  • the touch layer 32 may be formed on the encapsulation layer 312 of the display panel 31 through a continuous process, that is, the touch layer 32 may be directly formed on the encapsulation layer 312 of the display panel 31 after the encapsulation layer 312 of the display panel 31 is formed.
  • the thickness of the touch display panel 3 is small, which is beneficial to achieve lightness and thinness.
  • the touch layer 32 may be formed as a separate element, and the touch layer 32 is pasted on the encapsulation layer 312 of the display panel 31 by using the adhesive layer 7.
  • the touch layer 32 may further include a carrier film 33 for carrying the touch electrodes.
  • the material of the carrier film 33 is not limited.
  • the carrier film 33 may be at least one of a resin film, a glass substrate, and a composite film.
  • the material of the adhesive layer 7 is not limited.
  • the adhesive layer 7 may be a pressure sensitive adhesive (PSA), an optical clear adhesive (OCA), and an optical clear resin (OCR). At least one of them.
  • PSA pressure sensitive adhesive
  • OCA optical clear adhesive
  • OCR optical clear resin
  • the display panel 31 is a liquid crystal display panel.
  • the liquid crystal display panel includes an array substrate 313 and an aligning substrate 314 disposed oppositely, and a liquid crystal layer 315 disposed between the array substrate 313 and the aligning substrate 314. .
  • Each sub-pixel of the array substrate 313 includes a thin film transistor 3111 and a pixel electrode 3131 on a first substrate Sub1.
  • the pixel electrode 3131 is electrically connected to the source or drain of the thin film transistor 3111.
  • the pixel electrode 3131 and the drain of the thin film transistor 3111 are electrically connected for illustration.
  • the array substrate 313 further includes a common electrode 3132 disposed on the first substrate Sub1.
  • the pixel electrode 3131 and the common electrode 3132 may be arranged on the same layer.
  • the pixel electrode 3131 and the common electrode 3132 are both comb-tooth structures including a plurality of strip-shaped sub-electrodes.
  • the pixel electrode 3131 and the common electrode 3132 may also be provided in different layers.
  • a first insulating layer 3133 is provided between the pixel electrode 3131 and the common electrode 3132.
  • a second insulating layer 3134 is provided between the common electrode 3132 and the thin film transistor 3111.
  • the common electrode 3132 is provided on the box substrate 314.
  • the box substrate 314 includes a second substrate Sub2.
  • the liquid crystal display panel further includes a color filter layer CF and a black matrix pattern BM.
  • the color filter layer CF includes at least a red photoresist unit arranged in the red sub-pixel, a green photoresist unit arranged in the green sub-pixel, and a blue photoresist unit arranged in the blue sub-pixel.
  • the black matrix pattern BM is used to separate the light emitted from different sub-pixels, and has the function of reducing the reflected light generated after the external ambient light enters the interior of the display panel 31.
  • the color filter layer CF and the black matrix pattern BM may be disposed on the second substrate Sub2 of the matching box substrate 314, that is, the matching box substrate 314 includes the color filter layer CF and the black matrix pattern BM.
  • the thin film transistor 3111 and the black matrix pattern BM are disposed on different substrates, that is, on the first substrate Sub1 and the second substrate Sub2, respectively.
  • the color filter layer CF and the black matrix pattern BM can also be provided on the array substrate 313, that is, the array substrate 313 includes the color filter layer CF and the black matrix pattern BM.
  • the liquid crystal display panel adopts COA (Color filter on array, color filter layer on the array substrate) technology.
  • the liquid crystal display panel further includes an upper polarizer 316 disposed on the side of the cell substrate 314 away from the liquid crystal layer 315, and a lower polarizer 317 disposed on the side of the array substrate 313 away from the liquid crystal layer 315.
  • the touch layer 32 may be disposed between the color filter substrate CF and the upper polarizer 316 (ie On cell); as shown in FIG. 3D, the touch layer 32 may also be embedded in the liquid crystal layer 315 (ie In cell).
  • the position of the touch layer 32 is not limited to this.
  • the touch layer 32 may also be disposed on the side of the cover plate 2 close to the display panel 31.
  • the display panel 31 has a display area A1 and a peripheral area A2 located on at least one side of the display area A1.
  • FIG. 2 uses the peripheral area A2 surrounding the display area A1 as an example.
  • the display area A1 is an image display area, and the display area A1 is configured to set sub-pixels; the peripheral area A2 is an area where no image is displayed, and the peripheral area A2 is configured to set pixel circuits.
  • the gate drive circuit may be set in Surrounding area A2.
  • the cover plate 2 may include a light-transmitting area C1 and a light-shielding area C2.
  • the light-transmitting area C1 may at least partially overlap the display area A1 of the display panel 31, and the light emitted from the display panel 31 may pass through the light-transmitting area C1 of the cover plate 2 and be emitted to the outside to be seen by human eyes.
  • the light-shielding area C2 may be disposed at the periphery of the light-transmitting area C1, and may at least partially overlap the peripheral area A2 of the display panel 31.
  • the touch layer 32 includes a touch area B1 and a peripheral area B2 provided on at least one side of the touch area B1.
  • FIG. 2 takes the peripheral area B2 surrounding the touch area B1 as an example Give a gesture.
  • the touch area B1 is configured to arrange multiple touch electrodes
  • the peripheral area B2 is configured to arrange wiring.
  • the peripheral area B2 of the touch layer 32 surrounds the touch area B1.
  • the touch layer 32 includes a plurality of touch electrodes arranged in the touch area B1, a plurality of first touch leads 321 arranged in the peripheral area B2, a plurality of second touch leads 322, and a plurality of first contacts.
  • the plurality of first through holes 21 and the plurality of second through holes 22 are respectively centrally arranged at both ends of the touch layer 32 close to the peripheral area B2 of the flexible circuit board 4.
  • the peripheral area A2 of the display panel 31 surrounds the display area A1.
  • the peripheral area A2 of the display panel 31 is provided with a binding portion.
  • the binding portion includes a plurality of first binding pads 36 (see FIG. 7) and a plurality of second binding pads 37 (see FIG. 7).
  • a binding pad 36 and a plurality of second binding pads 37 are respectively concentrated and distributed on the two ends of the display panel 31 close to the peripheral area A2 of the flexible circuit board 4.
  • each first touch lead 321 is electrically connected to a touch electrode, and the other end is electrically connected to the first binding pad 36 in the display panel 31 through the first through hole 21;
  • One end of the control lead 322 is electrically connected to a touch electrode, and the other end is electrically connected to the second binding pad 37 in the display panel 31 through the second through hole 22.
  • the touch electrodes include touch transmitting electrodes Tx and touch receiving electrodes Rx.
  • the first touch lead 321 may be the lead of the touch transmitting electrode Tx and/or the lead of the touch receiving electrode Rx
  • the second touch lead 322 may be the lead of the touch transmitting electrode Tx and/or the touch receiving electrode.
  • the lead of Rx is not limited in the present disclosure.
  • the touch layer 32 is also It includes at least one first shielding wire 323 arranged on the side of the first touch wire 321 away from the second touch wire 322, and at least one shielding wire 323 arranged on the side of the second touch wire 322 away from the first touch wire 321.
  • One second shielding trace 324 is electrically connected to the first binding pad 36 in the display panel 31 through the first through hole 21, and each second shielding wire 324 is electrically connected to the first bonding pad 36 in the display panel 31 through the second through hole 22.
  • the second binding pad 37 is electrically connected.
  • the first touch lead 321 includes the lead of the touch transmitting electrode Tx and the lead of the touch receiving electrode Rx.
  • the second touch lead 322 includes the lead of the touch transmitting electrode Tx and the lead of the touch receiving electrode Rx, referring to FIG. 2, FIG. 4, and FIG.
  • the second shielding wiring 324 between the lead and the lead of the touch receiving electrode Rx.
  • Each first shielding wire 323 is electrically connected to the first binding pad 36 in the display panel 31 through the first through hole 21, and each second shielding wire 324 is electrically connected to the first bonding pad 36 in the display panel 31 through the second through hole 22.
  • the second binding pad 37 is electrically connected.
  • the first touch lead 321, the second touch lead 322, the first shielding wiring 323, and the second shielding wiring 324 are all in contact with each other.
  • the control chip 4100 is electrically connected.
  • the first touch lead 321 and the second touch lead 322 are electrically connected to the touch terminal of the touch chip 4100 to realize the touch function;
  • the first shielded wiring 323 and the second shielded wiring 324 are connected to the touch chip 4100
  • the ground terminal of the 4100 is electrically connected to reduce the interference of external signals to the signal of the touch lead, and to reduce the signal interference between the lead of the touch transmitting electrode Tx and the lead of the touch receiving electrode Rx.
  • the flexible circuit board 4 includes a main flexible circuit board 43 and a bridge flexible circuit board.
  • the circuit board 44, the main flexible circuit board 43 and the bridging flexible circuit board 44 are connected together by a connector. Due to the large structure of the connector, it occupies a large area of the main flexible circuit board 43 and the bridging flexible circuit board 44, and the connection of the connector requires manual insertion, which is inefficient, which will increase the labor cost of manufacturing the flexible circuit board 4. The cost of the connector.
  • FIG. 5 and FIG. 6 some embodiments of the present disclosure provide a display device, including a display panel 31, a touch layer 32 disposed on the light-emitting side of the display panel 31, and bound to the display panel 31
  • a predetermined flexible circuit board 4 the flexible circuit board 4 includes a main flexible circuit board 43 and a bridge flexible circuit board 44.
  • the shape of the display panel 31 in a plan view may be approximately rectangular.
  • the "rectangular” here includes not only a substantially rectangular shape, but also a shape similar to a rectangle in consideration of process conditions.
  • the display panel 31 has a long side and a short side.
  • the long side and the short side of the display panel 31 are right angles at each intersection position (ie, corner), so that the shape of the display panel 31 in a plan view is a rectangle.
  • the corners of the display panel 31 are curved, that is, the corners are smooth, so that the shape of the display panel 31 in a plan view is a rectangle with rounded corners.
  • the touch layer 32 may overlap the display panel 31.
  • the size of the touch layer 32 is approximately the same as the size of the display panel 31.
  • the sides of the touch layer 32 may be aligned with the sides of the display panel 31, but the present disclosure is not limited thereto.
  • the touch layer 32 may only partially overlap with the display panel 31, for example, the touch layer 32 overlaps with the display area A1 of the display panel 31 at least partially.
  • the touch area B1 corresponds to the display area A1
  • the peripheral area B2 corresponds to the peripheral area A2.
  • the main flexible circuit board 43 includes a first substrate 410, a plurality of pads P, a touch chip 4100, a plurality of first touch connection wires 41A, a plurality of second touch connection wires 42A, and a plurality of third touch wires.
  • Control connection line 30A is a first substrate 410, a plurality of pads P, a touch chip 4100, a plurality of first touch connection wires 41A, a plurality of second touch connection wires 42A, and a plurality of third touch wires.
  • the first substrate 410 has a first welding area 410A and a second welding area 410B, and a plurality of pads P are provided in the first welding area 410A and the second welding area 410B.
  • the touch chip 4100 is disposed on the first substrate 410, and the minimum distance between the touch chip 4100 and the first welding area 410A is smaller than the minimum distance between the touch chip 4100 and the second welding area 410B.
  • a plurality of first touch connection wires 41A are disposed on the first substrate 410, one end of each first touch connection wire 41A is electrically connected to the touch chip 4100, and the other end is connected to one of the touch layers 32 of the display device 100
  • the first touch wire 321 is electrically connected.
  • a plurality of second touch connection wires 42A are disposed on the first substrate 410. One end of each second touch connection wire 42A is electrically connected to a pad P of the second soldering area 410B, and the other end is connected to the touch pad of the display device 100.
  • a second touch lead 322 in the control layer 32 is electrically connected.
  • a plurality of third touch connection wires 30A are disposed on the first substrate 410, and one end of each third touch connection wire 30A is electrically connected to a pad P of the first welding area 410A, and the other end is electrically connected to the touch chip 4100. connect.
  • the bridge flexible circuit board 44 includes a second substrate 420, a plurality of pads P, and a plurality of touch switch wires 420C.
  • the second substrate 420 has a third welding area 420A and a fourth welding area 420B.
  • a plurality of pads P are provided in the third welding area 420A and the fourth welding area 420B.
  • One pad P of the third welding area 420A is connected to the first welding area.
  • One pad P of the area 410A is welded, and one pad P of the fourth welding area 420B is welded to one pad P of the second welding area 410B.
  • a plurality of touch transfer wires 420C are disposed on the second substrate 420, one end of each touch transfer wire 420C is electrically connected to a pad P of the third welding area 420A, and the other end is connected to a pad P of the fourth welding area 420B Electric connection.
  • both the first substrate 410 and the second substrate 420 are flexible substrates, and the flexible substrate may be polyethylene terephthalate, ethylene terephthalate, polyether ether ketone, poly One or more combinations of styrene, polycarbonate, polyarylate, polyarylate, polyimide, polyvinyl chloride, polyethylene, and textile fiber, and the embodiments of the present disclosure are not limited thereto.
  • the first touch wire 321 in the touch layer 32 can be directly electrically connected to the touch chip 4100 through the first touch connection wire 41A; the second touch wire 322 in the touch layer 32 can be electrically connected to the touch chip 4100 through the second The touch connecting wire 42A, the touch adapter cable 420C, and the third touch connecting wire 30A are electrically connected to the touch chip 4100, so that the touch signal of the touch layer 32 can be transmitted to the touch chip 4100 to realize the touch of the display panel 31 Control function.
  • the manufacturing efficiency of the flexible circuit board 4 can be improved and the cost can be reduced.
  • the bridge flexible circuit board 44 further includes at least one shielding transfer line 420D, at least one shielding transfer line 420D is disposed on the second substrate 420, and each shielding transfer line 420D One end is electrically connected to a pad P of the third welding area 420A, and the other end is electrically connected to a pad P of the fourth welding area 420B.
  • at least one shielding transfer line 420D is configured to be grounded.
  • the main flexible circuit board 4 when the touch layer 32 includes a first shielding trace 323 and a second shielding trace 324, the main flexible circuit board 4 also includes at least one first shielding trace.
  • At least one first shield connection wire 41B is disposed on the first substrate 410, one end of each first shield connection wire 41B is electrically connected to the touch chip 4100, and the other end is configured to be connected to the touch layer 32 of the display device 100 A first shielding wire 323 is electrically connected.
  • At least one second shield connection line 42B is provided on the first substrate 410, one end of each second shield connection line 42B is electrically connected to a pad P of the second welding area 410B, and the other end is configured to be connected to the display device 100 A second shielding wire 324 in the touch layer 32 is electrically connected.
  • At least one third shield connection line 30B is disposed on the first substrate 410. One end of each third shield connection line 30B is electrically connected to a pad P of the first welding area 410A, and the other end is electrically connected to the touch chip 4100.
  • touch adapter cable 420C is connected to the pad P corresponding to the second touch cable 42A and the third touch cable 30A
  • the shield adapter cable 420D is connected to the second shield cable 42B and the third shield.
  • the pad P connected by the line 30B is connected correspondingly.
  • the first shielding wire 323 in the touch layer 32 can be directly electrically connected to the touch chip 4100 through the first shielding connection wire 41B; the second shielding wire 324 in the touch layer 32 can be electrically connected through the second shielding wire 41B.
  • the connecting wire 42B, the shielding transfer wire 420D, and the third shielding connecting wire 30B are electrically connected to the touch chip 4100.
  • both the first shielding wire 323 and the second shielding wire 324 in the touch layer 32 can be connected to the ground signal, so as to reduce the interference of the touch signal.
  • the first shielding wire 323 is arranged on the side of the first touch wire 321 away from the second touch wire 322, and the second shielding wire 324 is arranged on the second touch wire 322 away from the first touch wire 321.
  • the interference of external signals on the signals of the touch leads can be reduced.
  • the first shielding trace 323 is provided between the lead of the adjacent touch transmitting electrode Tx and the lead of the touch receiving electrode Rx in the first touch lead 321, and the second shielding trace is provided on the second touch lead 322 When the leads of adjacent touch emitting electrodes Tx and the leads of touch receiving electrodes Rx are located between each other, the signal interference generated between the leads of touch emitting electrodes Tx and the leads of touch receiving electrodes Rx can be reduced.
  • the bridging flexible circuit board 44 includes a plurality of shielding patch cords 420D, and the plurality of shielding patch cords 420D includes at least two edge shielding patch cords located on the outermost side, and two edge shielding patch cords Adjacent ends are connected to each other to form a ring shape, and the multiple touch patch cords 420C are all arranged on the inner side of the ring shape. In this way, the interference of other signals (such as the signal of the high-frequency signal line on the main flexible circuit board 43) on the signal of the touch patch cord 420C located on the inner side of the loop can be reduced.
  • other signals such as the signal of the high-frequency signal line on the main flexible circuit board 43
  • the size of the welding area (including the first welding area 410A, the second welding area 410B, the third welding area 420A, and the fourth welding area 420B) is not limited.
  • the size of each welding area is 3.84 ⁇ 0.05 mm ⁇ 3.84 ⁇ 0.05 mm, for example, 3.84 mm ⁇ 3.84 mm.
  • the distance between the center of the leftmost pad P and the center of the rightmost pad P is 2.49mm to 2.84mm, and is exemplarily 2.49mm, 2.54mm, 2.59mm, 2.64mm, 2.69mm, 2.74mm, 2.79mm, 2.84mm, for example 2.66mm.
  • the number of pads P on each bonding area is not limited.
  • the number of pads P on each welding area may range from 20 to 50.
  • the number of pads P on each welding area may range from 20, 25, 30, 35, 40, 45, 50, for example 25.
  • the number of pads P of the first welding area 410A, the number of pads P of the second welding area 410B, the number of pads P of the third welding area 420A, and the number of pads P of the fourth welding area 420B The number can be equal or unequal. Exemplarily, referring to FIGS. 4 and 25, the number of pads P of the first welding area 410A, the second welding area 410B, the third welding area 420A, and the fourth welding area 420B are equal, and the number is 25.
  • the pad P of the third welding area 420A and the pad P of the fourth welding area 420B are connected through a patch cord (which may only include touch patch cords).
  • 420C may also include the touch adapter cable 420C and the shield adapter cable 420D) when connected, no short circuit will occur.
  • the distance B between two adjacent pads P may be 0.1 mm, 0.3 mm, 0.8 mm, or 1.0 mm.
  • the distance B between two adjacent pads P is the shortest distance between the edges of two adjacent pads P.
  • the maximum radial dimension of the aforementioned pad P is less than or equal to 1.0 mm.
  • the maximum radial dimension of the pad P may be 0.1 mm, 0.3 mm, 0.8 mm, or 1.0 mm.
  • the size of the pad P is small, and the area occupied by the main flexible circuit board 43 and the bridging flexible circuit board 44 in the flexible circuit board 4 is smaller, so that the flexible circuit board 4 can be made lighter and thinner, and the structure can be simplified. .
  • the shape of the outer contour of the pad P is not limited.
  • the shape of the outer contour of the pad P may be a circle, a square, a rectangle, or an irregular pattern.
  • the shape of the outer contour of the pad P includes but is not limited to the above, and any shape should fall within the protection scope of the embodiments of the present disclosure, and will not be listed here.
  • the size A of the diagonal of the square is the maximum radial size of the pad P.
  • the size A of the diagonal of the rectangle is the maximum radial size of the pad P.
  • the maximum value A of the distance between any two points on the edge of the pad P is that of the pad P Maximum radial size.
  • the diameter of the circle is the largest radial dimension of the pad P. At this time, the diameter of the pad P ranges from 0.25 mm to 0.35 mm.
  • the diameter of the circular pad P may be 0.25 mm, 0.3 mm, or 0.35 mm.
  • the third soldering area 420A and the fourth soldering area 420B are disposed at opposite ends of the second substrate 420, and the orthographic projection of the second substrate 420 on the main flexible circuit board 43 may be a centrally symmetrical figure. It may not be a centrally symmetrical figure.
  • the third welding area 420A and the fourth welding area 420B are disposed at opposite ends of the second substrate 420, and the orthographic projection of the second substrate 420 on the main flexible circuit board 43 is the center Symmetrical graphics.
  • the third welding area 420A and the fourth welding area 420B are arranged at opposite ends of the second substrate 420, and the orthographic projection of the second substrate 420 on the main flexible circuit board 43 is not the center Symmetrical graphics.
  • the middle of the side of the second substrate 420 corresponding to one end of the third welding area 420A has bumps extending toward the side away from the fourth welding area 420B, that is, the second substrate 420 is on the main flexible circuit board 43.
  • the side of the projection corresponding to one end of the third welding area 420A is formed by a plurality of straight lines connected in sequence, and the side of the orthographic projection of the second substrate 420 on the main flexible circuit board 43 corresponding to one end of the fourth welding area 420B is a straight line.
  • the orthographic projection of the second substrate 420 on the main flexible circuit board 43 is not a centrally symmetrical figure, the third welding can be prevented when the bridging flexible circuit board 44 and the main flexible circuit board 43 are attached and soldered in alignment.
  • the area 420A and the fourth welding area 420B are opposite to the positions of the first welding area 410A and the second welding area 410B.
  • the third soldering area 420A or the fourth soldering area 420B includes M rows of pads P, where M ⁇ 2; a plurality of transfer lines on the second substrate 420 (may only include touch transfer
  • the wire 420C may also include a touch switch wire 420C and a shielded switch wire 420D), at least 2M pads P are distributed between the two outermost switch wires.
  • each row of pads P in the third welding area 420A or the fourth welding area 420B includes one pad P; at this time, only the two transition lines located on the outermost side are distributed There are 2M pads P.
  • M the number of rows of pads P in the third welding area 420A or the fourth welding area 420B includes one pad P, at this time, there are 4 pads distributed between the two outermost transition wires. Pad P.
  • each row of pads P in the third welding area 420A or the fourth welding area 420B includes two pads P; at this time, the two outermost transition lines are distributed
  • the number of pads P is greater than 2M.
  • M the number of pads P in the third welding area 420A or the fourth welding area 420B includes two pads P, at this time, 8 are distributed between the two outermost transition wires.
  • a pad P the number of pads P.
  • the main flexible circuit board 43 is configured to be bound to the display panel 31 of the display device 100; the first welding area 410A and the second welding area 410B are arranged side by side along the first direction X ;
  • the first direction X is substantially parallel to the extending direction of the side of the main flexible circuit board 43 close to the display panel 31.
  • the pads P of the third bonding area 420A and the pads P of the fourth bonding area 420B are all arranged in multiple rows, and at least one row of the pads P includes the pads along the first direction X A plurality of pads P are arranged; along the second direction Y, two adjacent rows of pads P are staggered to each other; the second direction Y is substantially perpendicular to the first direction X.
  • the pads P of the third soldering area 420A and the fourth soldering area 420B are connected together by a transfer wire, it is possible to avoid the problem of a short circuit between the pad P located in the middle and its adjacent pad P.
  • the second substrate 420 has a transition wiring area T and connecting sectors S located at opposite ends of the transition wiring area T;
  • the transition line includes a transition section M and a transition section
  • the connecting section N at the opposite ends of the connecting section M extends in the first direction X and is arranged in the transition wiring area T, and the connecting section N is arranged in the connecting sector S; wherein the connecting sector S is in the second direction Y
  • the upper minimum width is greater than or equal to the width of the transition wiring area T in the second direction Y.
  • the width of the transition wiring area T is approximately equal to the distance between the transition sections M of the two outermost transition wires among the multiple transition wires; along the second direction Y, the connecting fan The width of the zone is approximately equal to the distance between the connecting sections N of the two outermost patch cords among the plurality of patch cords.
  • the width of the transition wiring area in the second direction Y is smaller than the maximum width of the third welding area 420A in the second direction Y; and/or, the width of the transition wiring area in the second direction Y It is smaller than the maximum width of the fourth welding area 420B in the second direction Y.
  • connection sector close to the third welding area 420A has a maximum width in the second direction Y greater than the maximum width of the third welding area 420A in the second direction Y; and/or, close to the fourth welding
  • the maximum width of the connecting sectors of the area 420B in the second direction Y is greater than the maximum width of the fourth welding area 420B in the second direction Y.
  • the patch cord can enter the soldering area from multiple sides of the soldering area, and be electrically connected to the corresponding pad P.
  • the patch cord can enter the soldering area from the area outside the first row of pads P and the second row of pads P in the soldering area, and be electrically connected to the corresponding pads P to facilitate wiring and avoid crosstalk of touch signals.
  • the pads P of the third bonding area 420A and the pads P of the fourth bonding area 420B are both arranged in multiple rows, and at least one row of the pads P includes a plurality of pads arranged along the first direction X; At least one of the multiple patch cords on the second substrate 420 passes through the area outside the first row of pads P and the last row of pads P in the third welding area 420A and the fourth welding area 420B, and is connected to the corresponding welding area. Disk P is electrically connected.
  • the third welding area 420A and the fourth welding area 420B on the second substrate 420 are each provided with two rows of pads P, and the first row of pads P of the third welding area 420A and the fourth welding area 420B includes One pad P, and the second row of pads P includes two pads P.
  • the number of patch cords on the second substrate 420 is three; optionally, one patch cord of the three patch cords passes through an area other than the second row in the pad P.
  • the third welding area 420A and the fourth welding area 420B on the second substrate 420 are each provided with two rows of pads P, and the first row of pads P of the third welding area 420A and the fourth welding area 420B includes two Pad P, the second row of pads P includes one pad P.
  • the number of patch cords on the second substrate 420 is three; optionally, one patch cord of the three patch cords passes through an area other than the first row in the pad P.
  • the third welding area 420A and the fourth welding area 420B on the second substrate 420 are each provided with two rows of pads P, and each row of pads P in the third welding area 420A or the fourth welding area 420B includes Two pads P.
  • the number of patch cords on the second substrate 420 is 4; optionally, two patch cords of the four patch cords, one patch cord passes through the area other than the first row in the pad P, and the other patch cord The patch cord passes through an area other than the second row in the pad P.
  • the third welding area 420A and the fourth welding area 420B on the second substrate 420 are each provided with three rows of pads P, and each row of pads P in the third welding area 420A or the fourth welding area 420B includes Three pads P.
  • the number of patch cords on the second substrate 420 is 9; optionally, the first row of pads P in the third welding area 420A and the first row of pads P in the fourth welding area 420B pass through three Patch cord connection; two patch cords pass through the area outside the first row in the pad P.
  • the third row of pads P in the third welding area 420A and the third row of pads P in the fourth welding area 420b are connected by three patch cords, and the two patch cords pass through areas other than the third row of the pads P.
  • both ends of one patch cord pass through the pads P in the first row and are far from the pads P in the last row.
  • One side of the third welding area 420A and the fourth welding area 420B are electrically connected to the two pads P with the farthest distance in the first row of pads P; the two ends of the other transfer wire pass through the last row of pads P.
  • the side away from the pads P in the first row is electrically connected to the two pads P with the farthest distance in the last row of pads P in the third welding area 420A and the fourth welding area 420B, respectively.
  • the third welding area 420A and the fourth welding area 420B include M rows of pads, where M ⁇ 2.
  • the bridging flexible circuit board 44 includes a plurality of shielding transfer lines 420D, and the plurality of shielding transfer lines 420D includes at least two edge shielding transfer lines located on the outermost side.
  • both ends of an edge shielding patch cord pass through the pad P of the first row away from the pad P of the last row, and respectively connect with the first row of the third welding area 420A and the fourth welding area 420B.
  • the two pads P with the farthest distance among the pads P are electrically connected; the two ends of the other edge shielding patch cord pass through the pads P in the last row and are away from the pads P in the first row, respectively, to the third welding area 420A and The two pads P with the farthest distance among the pads P in the last row of the fourth bonding area 420B are electrically connected.
  • the third welding area 420A and the fourth welding area 420B on the second substrate 420 are each provided with two rows of pads P, and each row of pads P in the third welding area 420A or the fourth welding area 420B includes Two pads P.
  • the number of patch cords on the second substrate 420 is 4; optionally, two patch cords out of the four patch cords, one patch cord passes through the area other than the first row in the pad P, and is connected to the first
  • the two pads P in the first row of pads P in the third welding area 420A and the fourth welding area 420B are electrically connected;
  • the two pads P with the farthest distance among the pads P in the second row of the third welding area 420A and the fourth welding area 420B are electrically connected.
  • a plurality of patch cords may include only the touch patch cord 420C, or may include the touch patch cord 420C and the shield patch cord 420D) may be located on the same side of the second substrate 420; or may be located opposite to the second substrate 420 On both sides.
  • the pad P on the second substrate 420 is a via pad; the second substrate 420 has a plurality of vias 421, and each via 421 corresponds to One via pad.
  • the via pad includes two solder pads 422 and a conductive connection layer 423.
  • the two solder pads 422 are respectively disposed on the surface of the second substrate 420 close to and far from the main flexible circuit board 43.
  • the via pads correspond to the vias. 421 penetrates the second substrate 420 between the two solder tabs 422 of the via pad, and two solder tabs 422; the conductive connection layer 423 covers the sidewall of the via hole 421, and both ends are connected to the two solder tabs respectively 422 electrical connection.
  • the conductive connection layer 423 may include a conductive film 11 and an anti-oxidation metal layer (also referred to as the second metal pattern 15) disposed on the side of the conductive film 11 away from the second substrate 420.
  • the patch cords bridging the flexible circuit board 44 may be provided on the surface of the second substrate 420 close to and/or away from the first substrate 410.
  • the surface of the second substrate 420 close to and away from the first substrate 410 can be connected to the pad P of the third soldering area 420A and the pad P of the fourth soldering area 420B through a patch cord, which can make the bridge flexible
  • the wiring of the circuit board 44 and the main flexible circuit board 43 is more convenient.
  • the shape of the outer contour of the orthographic projection of the via pad on the second substrate 420 is not limited.
  • the shape of the outer contour of the orthographic projection of the via pad on the second substrate 420 may be a circle, a square, a rectangle, or an irregular pattern.
  • the shape of the outer contour of the orthographic projection of the via pad on the second substrate 420 includes but is not limited to the above, and any shape should fall within the protection scope of the embodiments of the present disclosure. I will not list them one by one again.
  • the outer contour of the orthographic projection of the via pad on the second substrate 420 is approximately circular.
  • the diameter range D 1 of the outer contour of the via pad is 0.25 mm to 0.35 mm.
  • the diameter D 1 of the outer contour of the via pad may be 0.25 mm, 0.3 mm, or 0.35 mm.
  • the shape of the inner contour of the orthographic projection of the via pad on the second substrate 420 is not limited.
  • the shape of the inner contour of the orthographic projection of the via pad on the second substrate 420 may be a circle or an X shape.
  • the shape of the inner contour of the orthographic projection of the via pad on the second substrate 420 includes but is not limited to the above, and any shape should fall within the protection scope of the embodiments of the present disclosure. I will not list them one by one again.
  • the solder will not completely fill the via 421, and the via pad that bridges the flexible circuit board 44 and the main flexible circuit board 43 will have poor soldering. If the diameter range of the via 421 on the via pad is small, it will cause the via 421 to be unable to exhaust air during soldering, and the via 421 cannot be filled with tin, resulting in a problem of tin leakage.
  • the inner contour of the orthographic projection of the via pad on the second substrate 420 is approximately circular, and the diameter of the inner contour of the via pad ranges from 0.05 mm to 0.15. mm.
  • the diameter of the circular pad may be 0.05mm, 0.1mm, 0.15mm.
  • the inner contour of the orthographic projection of the via pad on the second substrate 420 is approximately X-shaped.
  • the diameter range D2 of the circumscribed circle corresponding to the X-shaped inner contour is 0.05 mm to 0.2 mm.
  • the diameter D2 of the circumscribed circle corresponding to the X-shaped inner contour may be 0.05 mm, 0.1 mm, or 0.2 mm.
  • both the main flexible circuit board 43 and the bridge flexible circuit board 44 have two conductive layers.
  • a conductive film 11 is provided on both sides of the first substrate 410 close to and away from the second substrate 420, and the conductive film 11 is connected to the first substrate 410 through an adhesive layer 12.
  • a conductive film 11 is provided on both sides of the second substrate 420 close to and away from the first substrate 410, and the conductive film 11 is connected to the second substrate 420 through an adhesive layer 12.
  • a conductive film 11 is provided on the side of the second substrate 420 close to and away from the first substrate 410, and the conductive film 11 is connected to the second substrate 420 through the adhesive layer 12.
  • a conductive film 11 is provided on both sides of the first substrate 410 close to and far from the second substrate 420, and the conductive film 11 is connected to the first substrate 410 through an adhesive layer 12.
  • the conductive film 11 can also be directly formed on the first substrate 410 and directly formed on the second substrate 420.
  • the conductive film 11 close to the bridging flexible circuit board 44 may form a plurality of pads P and various traces of the first welding area 410A and the second welding area 410B.
  • each trace may include a first touch connection line 41A, a second touch connection line 42A, a third touch connection line 30A, a first shield connection 41B, and a second touch connection line.
  • the conductive film 11 away from the bridging flexible circuit board 44 may form binding pins bound to the display panel 31.
  • the conductive film 11 away from the main flexible circuit board 43 can form multiple welding of the first welding area 410A and the second welding area 410B.
  • the conductive film 11 close to the main flexible circuit board 44 can form a plurality of solder tabs 422 and an electromagnetic interference layer 14 in the first welding area 410a and the second welding area 410b.
  • the main flexible circuit board 43 and the bridge flexible circuit board 44 are single-layer boards, that is, the main flexible circuit board 43 and the bridge flexible circuit board 44 have only one conductive layer.
  • a conductive film 11 is provided on a side of the first substrate 410 close to or far from the second substrate 420, and the conductive film 11 is connected to the first substrate 410 through an adhesive layer 12.
  • a conductive film 11 is provided on the side of the second substrate 420 close to or away from the first substrate 410, and the conductive film 11 is connected to the second substrate 420 through the adhesive layer 12.
  • the conductive film 11 can also be directly formed on the first substrate 410 and directly formed on the second substrate 420.
  • the conductive film 11 in the main flexible circuit board 43 may form a plurality of pads P of the first soldering area 410A and the second soldering area 410B, various wires, and bindings bound to the display panel 31 Pin.
  • each trace may include a first touch connection line 41A, a second touch connection line 42A, a third touch connection line 30A, a first shield connection 41B, and a first touch connection line 41A.
  • At least one of the second shield connection line 42B, the third shield connection line 30B, ELVDD, ELVSS, DVDD, and the high-frequency signal line 48 (referred to as the MIPI line).
  • the conductive film 11 in the bridging flexible circuit board 44 can form a plurality of pads P of the first soldering area 410A and the second soldering area 410B, the touch transfer wire 420C, and the shield Adapter cable 420D.
  • the material of the conductive film 11 is not limited.
  • the material of the conductive film 11 may be metal, for example, the material of the conductive film 11 may be copper.
  • the material of the adhesive layer 12 is not limited.
  • the adhesive layer 12 may be at least one of PSA (pressure sensitive adhesive), epoxy adhesive, and acrylic adhesive.
  • the orthographic projection of the adhesive layer 12 on the first substrate 410 or the second substrate 420 completely overlaps the orthographic projection of the first substrate 410 or the second substrate 420 to ensure that the adhesive layer 12 can remove the conductive film 11 Paste it completely.
  • the bridge flexible circuit board 44 further includes a protective layer 13 and an electromagnetic interference layer 14.
  • the protective layer 13 and the electromagnetic interference layer 14 are arranged on the second substrate 420 close to the main flexible circuit board. 43 side, and the protective layer 13 and the electromagnetic interference layer 14 are arranged away from the second substrate 420 in turn.
  • the electromagnetic interference layer 14 can shield the interference of the high-frequency signal line 48 on the main flexible circuit board 43 to the touch switch wire 420C on the bridging flexible circuit board 44.
  • the electromagnetic interference layer 14 is provided on the second substrate 420 other than the third pad area 420A and the fourth pad area 420B to avoid welding between the main flexible circuit board 43 and the bridging flexible circuit board 44 Make an impact.
  • the material of the protective layer 13 is not limited.
  • the material of the protective layer 13 may be a polyimide film (Polyimide Film, PI for short).
  • the material of the electromagnetic interference layer 14 is not limited. Exemplarily, the material of the electromagnetic interference layer 14 may be metal, for example, the material of the electromagnetic interference layer 14 may be copper.
  • the bridge flexible circuit board 44 includes a second substrate 420, a first adhesive layer 121, a second adhesive layer 122, a first conductive film 111, a second conductive film 112, and a protective layer 13. And the electromagnetic interference layer 14.
  • the first adhesive layer 121 and the second adhesive layer 122 are respectively disposed on opposite sides of the second substrate 420, and the first conductive film 111 is disposed on the side of the first adhesive layer 121 away from the second substrate 420.
  • the two conductive films 112 are arranged on the side of the second adhesive layer 122 away from the second substrate 420; the protective layer 13 is arranged on the side of the second conductive film 112 away from the second substrate 420, and the electromagnetic interference layer 14 is arranged on the protective layer 13 away from One side of the second substrate 420. It should be understood that the second adhesive layer 122, the second conductive film 112, the protective layer 13 and the electromagnetic interference layer 14 are located on the side of the second substrate 420 close to the first substrate 410.
  • the thickness of the first substrate 410 and the second substrate 420 may be 25.4 ⁇ m
  • the thickness of the first conductive film 111 and the second conductive film 112 may be 14 ⁇ m
  • the thickness of the first adhesive layer 121 and the second adhesive layer 122 The thickness may be 15 ⁇ m
  • the thickness of the protective layer 13 may be 12.7 ⁇ m
  • the thickness of the electromagnetic interference layer 14 may be 12 ⁇ m.
  • thermosetting glue may be 5 ⁇ m.
  • the main flexible circuit board 43 further includes a first metal pattern that covers the pad P on the first substrate 410, and the first metal pattern is configured to prevent the pad on the first substrate 410 P is oxidized.
  • the bridge flexible circuit board 44 further includes a second metal pattern 15 that covers the pad P on the second substrate 420, and the second metal pattern 15 is configured to prevent The pad P on the second substrate 420 is oxidized.
  • the shapes of the first metal pattern and the second metal pattern 15 are approximately the same as the shape of the pad P, so that the first metal pattern and the second metal pattern 15 can completely cover the pad P, thereby preventing the pad P The effect of P being oxidized.
  • the second metal pattern 15 also covers the wall of the via 421 to prevent the conductive layer (the conductive film 11) in the via 421 from being oxidized.
  • the materials of the first metal pattern and the second metal pattern 15 are not limited, as long as the pad can be prevented from being oxidized and corroded.
  • the materials of the first metal pattern and the second metal pattern include one or a combination of gold and nickel.
  • the thickness of the first metal pattern and the second metal pattern 15 ranges from 2 ⁇ m to 4 ⁇ m;
  • the thickness of the first metal pattern and the second metal pattern 15 is 0.05 ⁇ m.
  • the main flexible circuit board 43 further includes a first green oil layer and a first resin layer.
  • the first green oil layer covers at least the first area of the first substrate 410, the first area being the area outside the pad P in the first soldering area 410A and the second soldering area 410B; the first resin layer covers the first substrate 410 A welding area 410A and an area outside the second welding area 410B.
  • the bridge flexible circuit board 44 further includes a second green oil layer and a second resin layer.
  • the second green oil layer covers at least the second area of the second substrate 420, and the second area is the area outside the pad P in the third welding area 420A and the fourth welding area 420B
  • the second resin layer covers the area outside the third soldering area 420A and the fourth soldering area 420B of the second substrate 420.
  • the boundary of the pad P may also be coated with green oil to prevent the solder material from overflowing the range of the pad P. It should be understood that when green oil is applied to the boundary of the pad P, the green oil may be partially on the pad P, but it will not completely cover the pad P.
  • Figure 28 is a schematic diagram of the third welding part 420A and the fourth welding part 420B other than the pad P area (second area) coated with green oil
  • Figure 29A is Figure 28
  • Fig. 29B is an enlarged schematic view of the fourth welding part 420B in Fig. 28. It can be clearly seen from Figs. 29A and 29B that the green oil layer avoids the third welding part 420A and the fourth welding part. The area of each pad P in the portion 420B.
  • the first substrate 410 further has a component area 45.
  • the main flexible circuit board 43 also includes at least one component and a third green oil layer.
  • the at least one component is disposed on the side of the first substrate 410 close to the bridging flexible circuit board 44, and is located in the component area 45 of the first substrate 410;
  • the three green oil layers cover the area outside at least one component in the component area 45.
  • the at least one component may be that the main flexible circuit board 43 includes only one component; it may also be that the main flexible circuit board 43 includes two or more components.
  • the component may be at least one of a resistor, a capacitor, and a transistor.
  • the component may be a first component 4300 composed of multiple resistors, multiple capacitors, and multiple transistors.
  • the first component 4300 is bound by the main flexible circuit board 43
  • the pins and the binding pads on the display panel 3 are electrically connected to the driving chip 4200 in the display panel 3.
  • the component may be a touch chip 4100 with touch function composed of multiple resistors, multiple capacitors, and multiple transistors.
  • green oil is a liquid photoresist, which is an acrylic oligomer. It can be used as a protective layer.
  • the first green oil layer covers the first area and the second green oil layer covers the second area. The purpose is to prevent short circuits between two adjacent pads P; the third green oil layer covers the component area The area outside of at least one component in 45 is to prevent a short circuit between two adjacent components.
  • the "resin” may be one or a combination of polyimide film (Polyimide Film, PI for short) and Polyethylene terephthalate (PET for short).
  • first welding area 410A, the second welding area 410B, the third welding area 420A, the fourth welding area 420B, and the component area 45 are small, it is not conducive to coating a resin material to form a protective layer.
  • price of green oil is relatively expensive, if it covers the area outside the first welding area 410A and the second welding area 410B on the first substrate 410 and the third welding area 420A and the fourth welding area on the second substrate 420 The area outside the area 420B will result in higher production costs for the manufactured main flexible circuit board 43 and the bridge flexible circuit board 44.
  • the green oil covers the first area of the first substrate 410, the resin covers the areas outside the first welding area 410A and the second welding area 410B of the first substrate 410; and the green oil covers the second area of the second substrate 420 Area and the area outside the components in the component area 45, the resin covers the third soldering area 420A, the fourth soldering area 420B of the second substrate 420, and the area outside the component area 45; it can not only ensure the first substrate 410 and the second substrate 410 Both the surfaces of the two substrates 420 can form a good coating effect, and the production cost of the main flexible circuit board 43 and the bridge flexible circuit board 44 can also be reduced.
  • the main flexible circuit board 43 further includes a support 46.
  • the support 46 is disposed on the side of the first substrate 410 away from the bridging flexible circuit board 44, and the component area 45 is located The support 46 is within the range of the orthographic projection on the first substrate 410.
  • the support 46 can support all the components in the component area 45 on the first substrate 410, so that the component area 45 on the first substrate 410 will not be affected by the weight of the components. Deformation occurs, so that the components in the component area 45 can be protected.
  • the support 46 can support all the components in the component area 45 on the first substrate 410, and occupy the main flexible circuit board 43 in the flexible circuit board 4 away from the bridge flexible circuit board.
  • the area on one side of 44 is small, the flexible circuit board 4 is lighter and thinner, and the structure is simpler.
  • the supporting member 46 includes a metal sheet 460, and a first adhesive layer 461 and a first film 462 located on two opposite sides of the metal sheet 460.
  • the first adhesive layer 461 is located on the side of the metal sheet 460 close to the first substrate 410.
  • the first adhesive layer 461 is in contact with the surface of the first substrate 410 away from the second substrate 420. 2 and 4, in the case that the flexible circuit board 4 can be bent along the dotted line L toward the back of the display panel 31, so that the flexible circuit board 4 is located on the back of the display panel 31, the first film 462 and the display panel 31 Contact with the back.
  • the orthographic projection of the first adhesive layer 461 on the first substrate 410 overlaps the orthographic projection of the metal sheet 460 on the first substrate 410, that is, the first adhesive layer 461 is on the first substrate 410.
  • the area of the orthographic projection above is equal to the area of the orthographic projection of the metal sheet 460 on the first substrate 410, and the boundary of the first adhesive layer 461 is aligned with the boundary of the metal sheet 460. In this case, the metal sheet 460 is completely bonded to the first substrate 410, and the connection reliability is high.
  • the orthographic projection of the first thin film 462 on the first substrate 410 is within the orthographic projection of the metal sheet 460 on the first substrate 410, and the first thin film 462 is on the first substrate 410.
  • the area of the orthographic projection on the 410 is smaller than the area of the orthographic projection of the metal sheet 460 on the first substrate 410.
  • the material of the metal sheet 460 is not limited.
  • the material of the metal sheet 460 is at least one of steel, silicon and iron; for example, the material of the metal sheet 460 is an alloy of silicon and steel; for another example, the material of the metal sheet 460 is an alloy of silicon and iron; and
  • the material of the metal sheet 460 is steel.
  • the material of the first adhesive layer 461 is not limited. Exemplarily, the material of the first adhesive layer 461 may be thermosetting adhesive.
  • the material of the first film 462 is not limited, as long as it can achieve a good heat dissipation effect.
  • the first thin film 462 is a heat-dissipating graphite film.
  • the first substrate 410 further has a binding area, and the binding area is an area configured to be bound with the display panel 31 of the display device 100.
  • the main flexible circuit board 43 also includes a plurality of first bonding pins 4101 and a plurality of second bonding pins 4102, the plurality of first bonding pins 4101 are arranged in the bonding area, and at least one first bonding pin 4101 is configured to electrically connect the first touch connection wire 41A with the corresponding first touch wire 321 in the touch layer 32 of the display device 100; a plurality of second binding pins 4102 are arranged in the binding area, The at least one second binding pin 4102 is configured to electrically connect the second touch connection wire 42A with the corresponding second touch wire 322 in the touch layer 32.
  • the signals that are sequentially connected to the binding area from left to right include touch emitter electrode Rx signal, ELVDD+ELVSS signal, GOA signal (CLK, VGL, VGH), data signal control Line signal (Data signal), ELVSS+ELVDD signal, touch receiving electrode Tx signal.
  • the at least one first binding pin 4101 is configured to connect the first shield connection line 41B with It is electrically connected to the corresponding first shielding wire 323 in the touch layer 32; at least one second binding pin 4102 is configured to connect the second shielding wire 42B to the corresponding second shielding wire in the touch layer 32 324 electrical connection.
  • the range of the maximum dimension L 1 of the main flexible circuit board 43 is 55.25mm ⁇ L 1 ⁇ 55.55mm; the first direction X and the main flexible circuit board The extending directions of the sides of 43 close to the display panel 31 are substantially parallel.
  • the bonding area is a bar shape and extends along the first direction X; a plurality of first bonding pins 4101 and a plurality of second bonding pins 4102 Are arranged side by side along the first direction X; and along the first direction X, the range of the maximum distance L 2 between the first binding pin 4101 and the second binding pin 4102 of the main flexible circuit board 43 furthest is 53.55mm ⁇ L 2 ⁇ 53.85mm; along the second direction Y, the range of the maximum dimension L 3 of the binding area is 1.2mm ⁇ L 3 ⁇ 1.6mm.
  • the main flexible circuit board 43 is further provided with a connecting portion 47, and the connecting portion 47 is configured to be electrically connected to the main board of the display device 100.
  • the main flexible circuit board 43 has a copper leakage area A on the side away from the bridging flexible circuit board 44, and the copper leakage area A is configured to be grounded.
  • the number of first touch wires 321 included in the touch layer 32 and the number of first touch connection wires 41A included in the main flexible circuit board 43 may be the same or different; the number of first touch wires 321 included in the touch layer 32
  • the number of the two touch leads 322 and the number of the second touch connection wires 42A and the number of the third touch connection wires 30A included in the main flexible circuit board 43 may be the same or different.
  • the number of first touch leads 321 included in the touch layer 32 is the same as the number of first touch connection wires 41A included in the main flexible circuit board 43;
  • the number of the touch leads 322 is the same as the number of the second touch connection wires 42A and the number of the third touch connection wires 30A included in the main flexible circuit board 43.
  • the same touch electrode and multiple touch leads (first touch leads 321) arranged in different layers of the peripheral area A2 of the display panel 31 Or the second touch wire 322) is electrically connected, and multiple touch wires electrically connected to the same touch electrode can be connected to the same touch wire (first touch wire 41A or second touch wire 42A) Electric connection.
  • the size of the peripheral area A2 of the display panel 31 can be set to be narrower, and at the same time, it can be ensured that the touch chip 4100 can receive multiple different touches on the first touch lead 321 and the second touch lead 322. Signal, and prevent crosstalk of touch signals on two adjacent first touch leads 321 or second touch leads 322 from occurring.
  • the main flexible circuit board 43 correspondingly includes a first shielded connection line 41B, a second shielded connection line 42B, and a third shielded connection line 30B
  • the bridging flexible circuit board 44 correspondingly includes a shielding patch cord.
  • the number of first shield wires 323 included in the touch layer 32 and the number of first shield wires 41B included in the main flexible circuit board 43 may be the same or different;
  • the number of the second shielding wires 324 and the number of the second shielding connecting wires 42B and the number of the third shielding connecting wires 30B included in the main flexible circuit board 43 may be the same or different.
  • the number of first shield wires 323 included in the touch layer 32 is the same as the number of first shield wires 41B included in the main flexible circuit board 43; the second shield wires included in the touch layer 32
  • the number of the wires 324 is the same as the number of the second shield connection wires 42B and the number of the third shield connection wires 30B included in the main flexible circuit board 43.
  • the number of the first shielding wires 323 included in the touch layer 32 is less than the number of the first shielding connecting wires 41B included in the main flexible circuit board 43;
  • the number of shielding wires 324 is smaller than the number of second shielding connecting wires 42B and the number of third shielding connecting wires 30B included in the main flexible circuit board 43, so as to reduce the number of first shielding connecting wires 41B and second shielding connecting wires 42B
  • the third shielded connection line 30B occupies the area of the main flexible circuit board 43, which makes the structure of the flexible circuit board more streamlined and lower in cost.
  • the main flexible circuit board 43 further includes a plurality of data signal control lines, and the plurality of data signal control lines are disposed on the first substrate 410.
  • the display panel 31 includes a plurality of data lines Data and a driving chip 4200.
  • the driving chip 4200 is arranged in the peripheral area A2 and is electrically connected to the plurality of data signal control lines and the plurality of data lines Data; the driving chip 4200 is configured to The signals on the data signal control line are processed and output to multiple data lines Data.
  • the flexible circuit board 4 is connected to the driver chip 4200.
  • the lines (data signal control lines) only need to provide driving signals to the driving chip 4200, so that the driving chip 4200 outputs the data signals required by each column of sub-pixels.
  • the number of data signal control lines included in the main flexible circuit board 43 is less than the number of data lines Data included in the display panel 31, so that the use of one data line Data can be achieved by gating the data line Data.
  • the data signal control line transmits data signals to a plurality of data lines Data, thereby reducing the number of channels used for transmitting data signals in the driving chip 4200, that is, reducing the number of data signal control lines.
  • the line width of the data signal control line can be made larger than the line width of the data line, which is beneficial to improve the transmission efficiency of data signal transmission from one data signal control line to multiple data lines Data.
  • the main flexible circuit board 43 further includes a first binding pin 4101 and a second binding pin 4102;
  • the display panel 31 also includes a plurality of first binding pins 4102.
  • a pad 36 and a plurality of second binding pads 37, each of the first binding pads 36 is electrically connected to a first binding pin 4101 and a first touch lead 321;
  • a plurality of second binding pads Pads 37, each of the second binding pads 37 is electrically connected to a second binding pin 4102 and a second touch lead 322.
  • the flexible circuit board 4 can be connected to the display panel 31 through the first binding pins 4101 and the second binding pins 4102 (also called golden fingers) on the main flexible circuit board 43.
  • the first binding pad 36 and the second binding pad 37 on the peripheral area A2 are bound.
  • the thickness of the first binding pad 36 and the second binding pad 37 are both smaller than the surface of the touch layer 31 on the side close to the display panel 31 and the surface of the display panel 31 away from the touch layer 32.
  • the first bonding pad 36 and the second bonding pad 37 may be simultaneously etched. That is, the first binding pad 36 and the second binding pad 37 include a multi-layer superimposed metal layer, and the thickness of the multi-layer superimposed metal layer is smaller than the surface of the touch layer 32 on the side close to the display panel 31 and the display panel 31.
  • the touch layer 32 may be directly arranged on the light-emitting side of the display unit 31, that is, the touch layer 32 and the display unit 31 are an integrated structure.
  • the display device 100 includes a display panel 31, a touch layer 32 disposed on the light-emitting side of the display panel 31, and a display panel 31 bound flexible circuit board 4.
  • the display panel 31 has a display area A1 and a peripheral area A2 located on at least one side of the display area.
  • the peripheral area A2 is provided with a binding portion.
  • the binding portion includes a plurality of first binding pads 36 (see FIG. 7) and a plurality of second Two binding pads 37 (see FIG. 7);
  • the touch layer 32 includes a plurality of first touch leads 321 and a plurality of second touch leads 322, one first touch lead 321 and one first binding pad 36 is electrically connected, and a second touch lead 322 and a second binding pad 37 are electrically connected.
  • the main flexible circuit board 43 includes a first substrate 410, a plurality of pads P, a touch chip 4100, a plurality of first touch connection wires 41A, a plurality of second touch connection wires 42A, and a plurality of third touch wires.
  • the first substrate 410 has a first welding area 410A, a second welding area 410B, and a bonding area.
  • the bonding area is provided with a plurality of first bonding pins 4101 (see FIG. 5) and a plurality of second bonding pins 4102. (Refer to FIG. 5).
  • One first binding pin 4101 is electrically connected to one first binding pad 36
  • one second binding pin 4102 is electrically connected to one second binding pad 37.
  • a plurality of pads P are provided in the first welding area 410A and the second welding area 410B.
  • the touch chip 4100 is disposed on the first substrate 410, and the minimum distance between the touch chip 4100 and the first welding area 410A is smaller than the minimum distance between the touch chip 4100 and the second welding area 410B.
  • a plurality of first touch connection wires 41A are disposed on the first substrate 410. One end of each first touch connection wire 41A is electrically connected to the touch chip 4100, and the other end is connected through the first binding pin 4101 and the first binding pin 4101.
  • the fixed pad 36 is electrically connected to the first touch wire 321; a plurality of second touch connection wires 42A are disposed on the first substrate 410, and one end of each second touch connection wire 42A is connected to one of the second welding areas 410B
  • the pad P is electrically connected, and the other end is electrically connected to the second touch lead 322 through the second bonding pin 4102, the second bonding pad 37; a plurality of third touch connection wires 30A are disposed on the first substrate 410
  • One end of each third touch connection wire 30A is electrically connected to a pad P of the first welding area 410A, and the other end is electrically connected to the touch chip 4100.
  • the bridge flexible circuit board 44 includes a second substrate 420, a plurality of pads P, and a plurality of touch switch wires 420C.
  • the second substrate 420 has a third welding area 420A and a fourth welding area 420B.
  • a plurality of pads P are provided in the third welding area 420A and the fourth welding area 420B.
  • One pad P of the third welding area 420A is connected to the first welding area.
  • One pad P of the area 410A is welded, and one pad P of the fourth welding area 420B is welded to one pad P of the second welding area 410B.
  • a plurality of touch transfer wires 420C are disposed on the second substrate 420, one end of each touch transfer wire 420C is electrically connected to a pad P of the third welding area 420A, and the other end is connected to a pad P of the fourth welding area 420B Electric connection.
  • the maximum radial dimension of the pad P is less than or equal to 1.0 mm.
  • the third soldering area 420A or the fourth soldering area 420B includes M rows of pads P, where M ⁇ 2; among the multiple touch patch cords 420C, at least 2M are distributed between the two outermost touch patch cords 420C Pad P.
  • the pads P of the first welding area 410A, the second welding area 410B, the third welding area 420A, and the fourth welding area 420B are all arranged in multiple rows. At least one row of the pads P includes a plurality of pads P; The pads P in two adjacent rows are staggered.
  • the pad on the bridge flexible circuit board 44 is a via pad;
  • the via pad includes two solder tabs 422 and a conductive connection layer 423, and the two solder tabs 422 are respectively disposed on the second substrate 420 Close to and away from the surface of the main flexible circuit board 43, the via 421 corresponding to the via pad penetrates the second substrate 420 and the two pads 422 between the two pads 422 of the via pad; the conductive connection layer 423 covers the sidewall of the via 421, and both ends are electrically connected to two soldering tabs 422, respectively.
  • the display device provided in the embodiment of the present disclosure has the same technical features and beneficial effects as the display device provided in the above-mentioned embodiment, and reference may be made to the above-mentioned embodiment, which will not be repeated here.
  • the flexible circuit board 4 includes a plurality of data signal control lines; the display panel 31 includes a plurality of data lines Data and a driving chip 4200.
  • the driving chip 4200 is disposed in the peripheral area A2 and is connected to a plurality of data lines.
  • the signal control line and the multiple data lines Data are electrically connected; the driving chip 4200 is configured to process the signals on the multiple data signal control lines and output them to the multiple data lines Data; wherein, the number of data signal control lines is smaller than the number of data lines The number of Data, and the line width of the data signal control line is greater than the line width of the data line Data.
  • the number of first touch leads 321 included in the touch layer 32 is the same as the number of first touch connection wires 41A included in the main flexible circuit board 43;
  • the number of the touch leads 322 is the same as the number of the second touch connection wires 42A and the number of the third touch connection wires 30A included in the main flexible circuit board 43.
  • the range of the maximum dimension L 1 of the main flexible circuit board 43 is 55.25mm ⁇ L 1 ⁇ 55.55mm; the first direction X and the main flexible circuit board
  • the extension directions of the sides of 43 close to the display panel 31 are approximately parallel; in conjunction with FIG.
  • the binding area is strip-shaped and extends along the first direction X; a plurality of first binding pins 4101 and a plurality of second binding pins 4101
  • the fixed pins 4102 are arranged side by side along the first direction X; and along the first direction X, the maximum distance L between the first binding pin 4101 and the second binding pin 4102 of the main flexible circuit board 43 with the furthest distance 2 ranging 53.55mm ⁇ L 2 ⁇ 53.85mm; Y along a second direction, the maximum size of the binding region of the range L 3 is 1.2mm ⁇ L 3 ⁇ 1.6mm; Y X a second direction substantially perpendicular to the first direction .
  • Some embodiments of the present disclosure also provide a method for preparing the display device 100, which is used to prepare the display device 100 described in any of the above embodiments.
  • the preparation method includes S10 to S14.
  • the main flexible circuit board 43 includes: a first substrate 410, a plurality of pads P provided on the first soldering area 410A and the second soldering area 410B of the first substrate 410, and a touch chip 4100 provided on the first substrate 410, A plurality of first touch connection wires 41A, a plurality of second touch connection wires 42A, a plurality of third touch connection wires 30A, a plurality of first binding pins 4101, and a plurality of second binding pins 4102.
  • each first touch connection wire 41A is electrically connected to the touch chip 4100, and the other end is electrically connected to a first binding pin 4101; one end of each second touch connection wire 42A is electrically connected to the second welding area 410B One of the pads P is electrically connected, and the other end is electrically connected to a second binding pin 4102; one end of each third touch connection line 30A is electrically connected to a pad P of the first welding area 410A, and the other end is electrically connected to The touch control chip 4100 is electrically connected.
  • the bridge flexible circuit board 44 includes: a second substrate 420, a plurality of pads P arranged on the third soldering area 420A and the fourth soldering area 420B of the second substrate 420, and multiple touch transfer wires 420C; One end of the transfer wire 420C is electrically connected to a pad P of the third welding area 420A, and the other end is electrically connected to a pad P of the fourth welding area 420B.
  • the touch layer 32 is located on the side of the light emitting side of the display panel 31; the display panel 31 includes a plurality of first binding pads 36 and a plurality of second binding pads 37, and the touch layer 32 includes a plurality of first touch leads 321 and a plurality of second touch leads 322; each first touch lead 321 is electrically connected to a first binding pad 36 of the display panel 31, and each second touch lead 322 is electrically connected to a first binding pad 36 of the display panel 31 The two binding pads 37 are electrically connected.
  • the touch layer 32 may be formed on the display panel 31 through a continuous process. That is, the touch layer 32 may be formed directly above the display panel 31 after the display panel 31 is formed, and the thickness of the touch display panel 3 is small, which is beneficial to achieve lightness and thinness.
  • the above S10 includes S100 and S101.
  • a first conductive layer is formed on the surface of the first substrate 410 by coating or chemical deposition, and the first conductive layer is masked, developed, and etched to form the first welding area 410A and the second welding area 410A.
  • the first conductive layer may be copper foil.
  • the patterned first conductive layer may also form multiple traces, and the multiple traces may include a first touch connection line 41A, a second touch connection line 42A, a third touch connection line 30A, and a first shield connection. 41B, at least one of the second shield connection line 42B, the third shield connection line 30B, ELVDD, ELVSS, DVDD, and the high-frequency signal line 48.
  • the first substrate 410 includes two surfaces.
  • the first conductive layer is formed on the surface of the first substrate 410.
  • the first conductive layer may be formed on only one surface of the first substrate 410; or the first conductive layer may be formed on the first substrate 410.
  • the first conductive layer is formed on the surfaces on opposite sides of the substrate 410.
  • the main flexible circuit board 4 is a two-layer board, the first conductive layer is formed on both surfaces of the first substrate 410; when the main flexible circuit board 4 is a single-layer board, on the first substrate 410 A first conductive layer is formed on one surface.
  • nickel plating includes electrolytic and chemical methods, namely, it is divided into electroplating nickel and electroless nickel plating.
  • Nickel electroplating is in an electrolyte composed of nickel salt (called main salt), conductive salt, pH buffer, and wetting agent.
  • main salt nickel salt
  • conductive salt conductive salt
  • pH buffer pH buffer
  • wetting agent wetting agent
  • the anode uses metallic nickel
  • the cathode is a plated part. Direct current is applied to the cathode (plated part).
  • a uniform and dense nickel plating layer is deposited. Bright nickel is obtained from the bath with brightener, and dark nickel is obtained from the electrolyte without brightener.
  • Electroless plating is also called electroless plating, and it can also be called autocatalytic plating.
  • the specific process refers to: under certain conditions, the metal ions in the aqueous solution are reduced by the reducing agent and precipitated on the surface of the solid substrate.
  • Chemical gold refers to electroless gold plating. Electroless gold does not require an external power source. It only relies on the chemical reduction reaction of the plating solution to continuously reduce the gold ions on the surface of the first substrate 410 to form a gold plating layer.
  • the above S11 includes S102 to S105.
  • a second conductive layer is formed on the surface of the second substrate 420 by coating or chemical deposition, and the second conductive layer is masked, developed, and etched to be formed in the third welding area 420A and the fourth welding area 420A.
  • the second conductive layer may be copper foil.
  • the patterned second conductive layer may also form a plurality of wires, and the plurality of wires may include one or a combination of the touch switch wire 420C and the shielded switch wire 420D.
  • the second substrate 420 includes two surfaces.
  • the second conductive layer is formed on the surface of the second substrate 420.
  • the second conductive layer may be formed on only one surface of the second substrate 420;
  • a second conductive layer is formed on the surfaces on opposite sides of the substrate 420.
  • the method of forming the second metal pattern 15 is the same as the method of forming the first metal pattern, and the method of forming the first metal pattern can be referred to, which will not be repeated here.
  • the via hole can be formed by laser drilling, punch drilling, or the like.
  • a conductive connection layer 423 on the wall of the via 421.
  • Two ends of the conductive connection layer 423 are respectively electrically connected to two solder tabs 422;
  • the conductive connection layer 423 includes a conductive layer and a metal layer stacked in sequence, and the metal layer is configured to prevent the conductive layer from being oxidized.
  • step S102 to step S105 is not limited.
  • a via 421 may be formed on the second substrate 420, and then a second conductive layer is formed on the opposite sides of the second substrate 420, and a conductive connection layer 423 is formed on the wall of the via 421.
  • Both the third soldering area 420A and the fourth soldering area 420B include a plurality of pads P; then a second metal pattern 15 is formed on the surface of the pad P and a metal layer is formed on the wall of the via 421.
  • the order of step S102 to step S105 in some embodiments of the present disclosure includes but is not limited to the above-mentioned embodiments, and any other different order should fall within the protection scope of some embodiments of the present disclosure, and will not be repeated here.
  • the method of forming the conductive connection layer 423 may be, for example, depositing a layer of copper foil on the hole wall of the via 421; the method of forming the metal layer may be, for example, plating nickel or gold on the conductive connection layer 423 of the hole wall.
  • the manufacturing method of the display device 100 further includes S106 and S107.
  • S106 Apply green oil to the first welding area 410A, the second welding area 410B, the third welding area 420A, the fourth welding area 420B, and the component area 45, and remove the first welding area 410A, the second welding area 410B, and the first welding area 410B.
  • the "resin material” may be one or a combination of polyimide film and polyester resin.
  • step S106 and step S107 is not limited. Step S106 may be performed first, and then step S107; or step S107 may be performed first, and then step S106 may be performed.
  • the above S12 includes S110 to S112.
  • FIG. 36 is a schematic view of the structure of coating solder paste on the pad P of the first soldering area 410A.
  • "alignment” may be shape alignment.
  • the shape alignment is the one-to-one correspondence between the pads P of the first welding area 410A and the pads P of the third welding area 420A; the pads P of the second welding area 410B and the pads P of the fourth welding area 420B One-to-one correspondence.
  • "alignment” may be mark alignment.
  • the mark alignment is to set a mark at the position of the first welding area 410A and the third welding area 420A, and to set a mark at the position of the second welding area 410b and the fourth welding area 420B, such as "X-shape", it will be required Corresponding marks can be matched together.
  • the main flexible circuit board 43 and the flexible circuit board 42 attached together can be placed in a boiler for heating.
  • the heating temperature can be the melting point of the solder paste (183°C). In some embodiments, the heating temperature is greater than Or equal to 200°C.
  • solder paste can completely fill the via 421, so that the via pad is full of tin, that is, 100% tin is eaten.
  • FIG. 37 shows an enlarged schematic diagram of six welding points after the main flexible circuit board 43 and the bridge flexible circuit board 44 are soldered.
  • the above six welding points can be the first welding point, the second welding point, the third welding point, the fourth welding point, the fifth welding point, and the sixth welding point in order from left to right. Welding points.
  • the upper ends of the first welding point, the second welding point, the fourth welding point, and the fifth welding point all have a certain height of tin exposure, and the first welding point .
  • the height of the upper end of the second solder joint, the fourth solder joint, and the fifth solder joint is not exactly the same.
  • the upper end of the third solder joint and the sixth solder joint have very small tin exposure, almost the same as the height of the conductive film (copper foil).
  • the height of the upper end of the first welding point, the second welding point, the third welding point, the fourth welding point, the fifth welding point, and the sixth welding point are all less than or equal to 0.05 mm.
  • the upper end of the first welding point, the second welding point, the third welding point, the fourth welding point, the fifth welding point, and the sixth welding point are exposed to tin
  • the shapes are different.
  • the shape of the upper end of the first welding point, the second welding point, the fourth welding point, and the fifth welding point is arc-shaped, while the upper ends of the third welding point and the sixth welding point
  • the shape of the exposed tin is straight.
  • solder joint for example, refer to the third solder joint, the fourth solder joint, and the fifth solder joint.
  • soldering point the distance between the two pads P that are soldered together is different.
  • the height of the solder on the left is greater than the height of the solder on the right.
  • the width of the solder in the middle of the pad P has a wide, narrow, and wide variation from top to bottom.
  • the left and right sides of the solder in the middle appear similar to ">" and " ⁇ " shapes.
  • FIG. 38 shows that there are some other structures or wirings around a welding point.
  • the solder height A 2 in the via pad is 123.4 ⁇ m; the distance a between the surface) 3 is 19.9 ⁇ m; the distance a between the lower surface (the side away from the main surface of the flexible circuit board 43) and the left side of the solder bridge is a flexible circuit board 44 is 34.3 ⁇ m; right The distance A 4 between the solder and the upper surface of the bridging flexible circuit board 44 (the surface on the side close to the main flexible circuit board 43) is 53.3 ⁇ m.
  • the above S111 includes S1110 to S1115.
  • S1111 The first image and the second image are processed to obtain the first alignment mark coordinates of the main flexible circuit board 43 and the second alignment mark coordinates of the bridge flexible circuit board 44.
  • the coordinates of the alignment mark of the main flexible circuit board 43 and the coordinates of the alignment mark of the bridge flexible circuit board 44 are three-dimensional space coordinates, that is, the coordinates are (X, Y, Z).
  • S1112 According to the coordinates of the first alignment mark and the coordinates of the second alignment mark, control the robot arm to move the bridge flexible circuit board 44 and/or the main flexible circuit board 43 to align the main flexible circuit board 43 and the bridge flexible circuit board 44 Bit.
  • Controlling the robot arm to move the bridge flexible circuit board 44 and/or the main flexible circuit board 43 can be to control the robot arm to move the bridge flexible circuit board 44 and the main flexible circuit board 43; or it can be to control the robot arm to move only the main flexible circuit board 43; or , The control robot arm only moves the bridge flexible circuit board 44.
  • S1113 Collect a third image including the alignment mark of the main flexible circuit board 43 after the alignment, and a fourth image including the alignment mark of the bridged flexible circuit board 44 after the alignment.
  • step S1115 is executed; if the relative positions of the main flexible circuit board 43 and the bridge flexible circuit board 44 are not within the preset error range Within the range, the above steps S1110 to S1114 are repeated, and finally the main flexible circuit board 43 and the bridge flexible circuit board 44 after the detection and alignment are within the preset error range, that is, they completely correspond.
  • the glue layer may be a solid glue or a liquid glue.
  • the solid glue may be, for example, at least one of PSA (pressure sensitive adhesive), epoxy glue, and acrylic glue.
  • PSA pressure sensitive adhesive
  • epoxy glue epoxy glue
  • acrylic glue acrylic glue
  • main flexible circuit board 43 and the bridge flexible circuit board 44 in order to prevent the main flexible circuit board 43 and the bridge flexible circuit board 44 from moving when the main flexible circuit board 43 and the bridge flexible circuit board 44 are placed in a boiler for heating after being aligned and attached.
  • the main flexible circuit board 43 and the bridge flexible circuit board 44 were pasted together through an adhesive layer to prevent the alignment of the main flexible circuit board 43 and the bridge flexible circuit board 44 from being misaligned.
  • the camera can be used to collect the first image, the second image, the third image, and the fourth image
  • the processor can be used to process the first image and the second image (for example, it can be a computer simulation to obtain the first alignment mark coordinates and the second Alignment mark coordinates); and use the processor to process the third image and the fourth image, and detect whether the aligned main flexible circuit board 43 and the bridge flexible circuit board 44 are within a preset error range.
  • the main flexible circuit board 43 and the bridging flexible circuit board 44 are welded together by welding, and the process of preparing the flexible circuit board 4 is fully automated. In this way, the production efficiency can be greatly improved, and the structure of the formed flexible circuit board 4 is lighter, thinner, and more streamlined.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Combinations Of Printed Boards (AREA)
PCT/CN2021/077122 2020-02-24 2021-02-20 显示装置及其制备方法 WO2021169882A1 (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020227003545A KR20220146406A (ko) 2020-02-24 2021-02-20 디스플레이 디바이스 및 그 제조 방법
JP2022521456A JP2023513863A (ja) 2020-02-24 2021-02-20 表示装置及びその製造方法
US17/626,902 US11991828B2 (en) 2020-02-24 2021-02-20 Display apparatus and method for manufacturing the same
EP21760201.0A EP4114147A4 (en) 2020-02-24 2021-02-20 DISPLAY DEVICE AND PRODUCTION METHOD THEREOF

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN202010113081.1 2020-02-24
CN202010113081 2020-02-24
CN202010508043.6 2020-06-05
CN202010508043.6A CN113301710B (zh) 2020-02-24 2020-06-05 显示装置及其制备方法

Publications (1)

Publication Number Publication Date
WO2021169882A1 true WO2021169882A1 (zh) 2021-09-02

Family

ID=71628516

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/077122 WO2021169882A1 (zh) 2020-02-24 2021-02-20 显示装置及其制备方法

Country Status (6)

Country Link
US (1) US11991828B2 (ja)
EP (1) EP4114147A4 (ja)
JP (1) JP2023513863A (ja)
KR (1) KR20220146406A (ja)
CN (2) CN113301710B (ja)
WO (1) WO2021169882A1 (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020112986A1 (en) * 2018-11-27 2020-06-04 Facebook Technologies, Inc. Methods and apparatus for autocalibration of a wearable electrode sensor system
US20190121306A1 (en) 2017-10-19 2019-04-25 Ctrl-Labs Corporation Systems and methods for identifying biological structures associated with neuromuscular source signals
US11493993B2 (en) 2019-09-04 2022-11-08 Meta Platforms Technologies, Llc Systems, methods, and interfaces for performing inputs based on neuromuscular control
US11907423B2 (en) 2019-11-25 2024-02-20 Meta Platforms Technologies, Llc Systems and methods for contextualized interactions with an environment
US11961494B1 (en) 2019-03-29 2024-04-16 Meta Platforms Technologies, Llc Electromagnetic interference reduction in extended reality environments
US11150730B1 (en) 2019-04-30 2021-10-19 Facebook Technologies, Llc Devices, systems, and methods for controlling computing devices via neuromuscular signals of users
US11481030B2 (en) 2019-03-29 2022-10-25 Meta Platforms Technologies, Llc Methods and apparatus for gesture detection and classification
WO2020061451A1 (en) 2018-09-20 2020-03-26 Ctrl-Labs Corporation Neuromuscular text entry, writing and drawing in augmented reality systems
CN113301710B (zh) * 2020-02-24 2022-09-09 京东方科技集团股份有限公司 显示装置及其制备方法
CN114982386A (zh) * 2020-12-25 2022-08-30 京东方科技集团股份有限公司 柔性电路板及显示装置
WO2022134116A1 (zh) * 2020-12-26 2022-06-30 京东方科技集团股份有限公司 柔性电路板、触控显示模组及触控显示装置
CN215679319U (zh) * 2020-12-30 2022-01-28 京东方科技集团股份有限公司 一种触控显示装置
US11803265B2 (en) 2021-01-04 2023-10-31 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch display device
CN113597091A (zh) * 2021-08-03 2021-11-02 京东方科技集团股份有限公司 一种柔性电路板、显示装置及其制备方法
KR20240067247A (ko) * 2021-09-17 2024-05-16 보에 테크놀로지 그룹 컴퍼니 리미티드 회로기판 어셈블리, 디스플레이 모듈 및 그 제조 방법, 디스플레이 디바이스
CN113905117A (zh) * 2021-11-10 2022-01-07 信利（惠州）智能显示有限公司 显示屏模组
CN113993272A (zh) * 2021-11-30 2022-01-28 京东方科技集团股份有限公司 柔性电路板及显示装置
CN114286512A (zh) * 2021-12-30 2022-04-05 京东方科技集团股份有限公司 电路板组件及其制造方法、显示装置
CN114423149A (zh) * 2022-01-27 2022-04-29 京东方科技集团股份有限公司 电路板、显示模组和电子设备
CN116567923A (zh) * 2022-01-29 2023-08-08 京东方科技集团股份有限公司 电路板、显示装置以及电路板的制造方法
CN116567922A (zh) * 2022-01-29 2023-08-08 京东方科技集团股份有限公司 柔性印刷电路板和显示触控装置
CN114423182A (zh) * 2022-02-25 2022-04-29 京东方科技集团股份有限公司 柔性电路板及其制造方法
CN114661185B (zh) * 2022-03-22 2023-08-15 业成科技（成都）有限公司 触控模组和智能装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103338581A (zh) * 2012-03-16 2013-10-02 乐金显示有限公司 连接触摸屏的柔性印刷电路和使用其的液晶显示装置
US20160128194A1 (en) * 2014-10-29 2016-05-05 Samsung Display Co., Ltd. Display device
US20170090650A1 (en) * 2015-09-30 2017-03-30 Samsung Display Co., Ltd. Display device
CN107025014A (zh) * 2015-09-30 2017-08-08 乐金显示有限公司 触摸屏面板以及包括该触摸屏面板的显示装置
CN107039467A (zh) * 2017-05-15 2017-08-11 厦门天马微电子有限公司 一种阵列基板、显示面板及显示装置
CN211090137U (zh) * 2020-02-24 2020-07-24 京东方科技集团股份有限公司 显示装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1085788A3 (en) * 1999-09-14 2003-01-02 Seiko Epson Corporation Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment
JP2002258766A (ja) * 2001-02-28 2002-09-11 Seiko Epson Corp フレキシブル基板、電気光学装置および電子機器
US6921869B2 (en) * 2001-09-26 2005-07-26 Fujikura Ltd. Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof
JP5033078B2 (ja) 2008-08-06 2012-09-26 株式会社ジャパンディスプレイイースト 表示装置
KR101309862B1 (ko) 2009-12-10 2013-09-16 엘지디스플레이 주식회사 터치 패널 일체형 액정 표시 장치
KR101244318B1 (ko) * 2011-12-06 2013-03-15 삼성디스플레이 주식회사 표시장치용 회로기판 및 이를 포함하는 표시장치
CN103294238A (zh) * 2012-03-01 2013-09-11 瀚宇彩晶股份有限公司 触控显示装置
CN104205249B (zh) * 2012-06-19 2017-03-01 株式会社村田制作所 层叠型多芯电缆
KR20140074740A (ko) * 2012-12-10 2014-06-18 삼성디스플레이 주식회사 디스플레이 장치 및 그의 제조방법
KR102367317B1 (ko) * 2015-03-23 2022-02-25 삼성디스플레이 주식회사 인쇄회로기판 어셈블리
KR102424443B1 (ko) * 2015-09-14 2022-07-22 삼성디스플레이 주식회사 표시 장치
KR102637015B1 (ko) * 2016-06-08 2024-02-16 삼성디스플레이 주식회사 표시 장치 및 그것의 제조 방법
CN107229374B (zh) 2017-07-20 2020-01-03 武汉华星光电技术有限公司 一种触控显示面板
JP6916521B2 (ja) * 2017-10-24 2021-08-11 株式会社Ｊｏｌｅｄ プリント基板、表示装置及び表示装置の製造方法
CN107728848A (zh) 2017-10-31 2018-02-23 武汉华星光电技术有限公司 内嵌式触控显示面板
KR102608434B1 (ko) * 2018-07-09 2023-12-04 삼성디스플레이 주식회사 표시 장치
CN115052421A (zh) * 2019-11-19 2022-09-13 京东方科技集团股份有限公司 显示面板、显示装置
CN113391715B (zh) * 2020-03-13 2023-07-21 京东方科技集团股份有限公司 显示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103338581A (zh) * 2012-03-16 2013-10-02 乐金显示有限公司 连接触摸屏的柔性印刷电路和使用其的液晶显示装置
US20160128194A1 (en) * 2014-10-29 2016-05-05 Samsung Display Co., Ltd. Display device
US20170090650A1 (en) * 2015-09-30 2017-03-30 Samsung Display Co., Ltd. Display device
CN107025014A (zh) * 2015-09-30 2017-08-08 乐金显示有限公司 触摸屏面板以及包括该触摸屏面板的显示装置
CN107039467A (zh) * 2017-05-15 2017-08-11 厦门天马微电子有限公司 一种阵列基板、显示面板及显示装置
CN211090137U (zh) * 2020-02-24 2020-07-24 京东方科技集团股份有限公司 显示装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4114147A4

Also Published As

Publication number Publication date
US11991828B2 (en) 2024-05-21
EP4114147A4 (en) 2024-03-20
EP4114147A1 (en) 2023-01-04
KR20220146406A (ko) 2022-11-01
CN113301710B (zh) 2022-09-09
CN113301710A (zh) 2021-08-24
CN211090137U (zh) 2020-07-24
JP2023513863A (ja) 2023-04-04
US20220256706A1 (en) 2022-08-11

Similar Documents

Publication Publication Date Title
WO2021169882A1 (zh) 显示装置及其制备方法
US20200348788A1 (en) Display device with integrated touch screen
JPWO2021169882A5 (ja)
EP2687963A2 (en) Display device having touch sensing function
WO2020029371A1 (zh) 一种触摸屏及oled显示面板
WO2019047580A1 (zh) 触控基板及其制备方法、显示面板
US11276674B2 (en) Driving substrate and manufacturing method thereof, and display device
US20210212207A1 (en) Flexible printed circuit and manufacture method thereof, electronic device module and electronic device
US11589461B2 (en) Flexible printed circuit and manufacturing method thereof, electronic device module and electronic device
US11934606B2 (en) Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof
CN112882598B (zh) 一种自容式触控面板及触控式显示面板
US11275474B2 (en) Electronic panel and display device including the same
US11893179B2 (en) Touch display device
US11355447B2 (en) Electronic panel and method of manufacturing the same
US11861119B2 (en) Display panel and method for manufacturing the same, and display apparatus
CN112837623B (zh) 显示模组及电子设备
KR20190118438A (ko) 지문 인식 모듈 및 이를 포함하는 전자 디바이스
US11360623B2 (en) Touch sensor and electronic device
US20230397464A1 (en) Display apparatus
US20240155761A1 (en) Flexible Printed Circuit Board and Touch-Control Display Apparatus
US11917875B2 (en) Display device
US20240204155A1 (en) Display module and an electronic device including the same
US11861100B2 (en) Display device
KR20220106892A (ko) 표시 장치
KR20230100236A (ko) 표시 장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21760201

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022521456

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2021760201

Country of ref document: EP

Effective date: 20220926