CN114982386A - 柔性电路板及显示装置 - Google Patents

柔性电路板及显示装置 Download PDF

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Publication number
CN114982386A
CN114982386A CN202080003650.5A CN202080003650A CN114982386A CN 114982386 A CN114982386 A CN 114982386A CN 202080003650 A CN202080003650 A CN 202080003650A CN 114982386 A CN114982386 A CN 114982386A
Authority
CN
China
Prior art keywords
sub
circuit board
body region
layer
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080003650.5A
Other languages
English (en)
Inventor
李凡
牛文骁
王吉
肖云瀚
梁恒镇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of CN114982386A publication Critical patent/CN114982386A/zh
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09227Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10128Display
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10128Display
    • H05K2201/10136Liquid Crystal display [LCD]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/061Lamination of previously made multilayered subassemblies
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本公开提供了一种柔性电路板和显示装置。柔性电路板包括:主体区;绑定区,绑定区与主体区的第一侧结合,绑定区包括多个绑定引脚;和伸出区,伸出区与主体区的第二侧结合,第一侧和第二侧是主体区的两个相对侧。所述主体区包括第一子主体区和第二子主体区,所述第二子主体区位于所述第一子主体区靠近所述伸出区的一侧,所述多条走线至少包括第一走线、第二走线和第三走线,所述第一走线、所述第二走线和所述第三走线都在所述第一子主体区中延伸,所述第一走线和所述第二走线在所述第二子主体区中延伸。所述第一子主体区具有多层板结构,所述第二子主体区具有单层板或双层板结构,所述第二子主体区的厚度小于所述第一子主体区的厚度。

Description

PCT国内申请,说明书已公开。

Claims (24)

  1. PCT国内申请,权利要求书已公开。
CN202080003650.5A 2020-12-25 2020-12-25 柔性电路板及显示装置 Pending CN114982386A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/139459 WO2022134013A1 (zh) 2020-12-25 2020-12-25 柔性电路板及显示装置

Publications (1)

Publication Number Publication Date
CN114982386A true CN114982386A (zh) 2022-08-30

Family

ID=82157125

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080003650.5A Pending CN114982386A (zh) 2020-12-25 2020-12-25 柔性电路板及显示装置

Country Status (3)

Country Link
US (1) US20220240386A1 (zh)
CN (1) CN114982386A (zh)
WO (1) WO2022134013A1 (zh)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040112632A1 (en) * 2002-12-13 2004-06-17 Shigeru Michiwaki Printed wiring board having rigid portion and flexible portion, and method of fabricating the board
US20140369009A1 (en) * 2013-06-18 2014-12-18 Samsung Electronics Co., Ltd. Display device
CN104460119A (zh) * 2014-08-29 2015-03-25 友达光电股份有限公司 显示面板及其制造方法
CN105430889A (zh) * 2015-12-29 2016-03-23 广东欧珀移动通信有限公司 柔性电路板及终端
CN107180594A (zh) * 2017-06-30 2017-09-19 厦门天马微电子有限公司 一种显示面板和显示装置
CN108241240A (zh) * 2018-02-08 2018-07-03 上海天马微电子有限公司 一种显示面板以及显示装置
CN211090137U (zh) * 2020-02-24 2020-07-24 京东方科技集团股份有限公司 显示装置
WO2020156595A2 (zh) * 2019-01-30 2020-08-06 京东方科技集团股份有限公司 柔性电路板及制作方法、显示装置、电路板结构及其显示面板
CN111511098A (zh) * 2020-06-10 2020-08-07 京东方科技集团股份有限公司 一种柔性线路板fpc及显示装置
CN112002246A (zh) * 2020-09-28 2020-11-27 上海天马有机发光显示技术有限公司 显示面板及显示装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011043318A1 (ja) * 2009-10-05 2011-04-14 株式会社村田製作所 回路基板
US11129284B2 (en) * 2019-09-16 2021-09-21 Apple Inc. Display system and rigid flex PCB with flip chip bonded inside cavity

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040112632A1 (en) * 2002-12-13 2004-06-17 Shigeru Michiwaki Printed wiring board having rigid portion and flexible portion, and method of fabricating the board
US20140369009A1 (en) * 2013-06-18 2014-12-18 Samsung Electronics Co., Ltd. Display device
CN104460119A (zh) * 2014-08-29 2015-03-25 友达光电股份有限公司 显示面板及其制造方法
CN105430889A (zh) * 2015-12-29 2016-03-23 广东欧珀移动通信有限公司 柔性电路板及终端
CN107180594A (zh) * 2017-06-30 2017-09-19 厦门天马微电子有限公司 一种显示面板和显示装置
CN108241240A (zh) * 2018-02-08 2018-07-03 上海天马微电子有限公司 一种显示面板以及显示装置
WO2020156595A2 (zh) * 2019-01-30 2020-08-06 京东方科技集团股份有限公司 柔性电路板及制作方法、显示装置、电路板结构及其显示面板
CN211090137U (zh) * 2020-02-24 2020-07-24 京东方科技集团股份有限公司 显示装置
CN111511098A (zh) * 2020-06-10 2020-08-07 京东方科技集团股份有限公司 一种柔性线路板fpc及显示装置
CN112002246A (zh) * 2020-09-28 2020-11-27 上海天马有机发光显示技术有限公司 显示面板及显示装置

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Publication number Publication date
WO2022134013A1 (zh) 2022-06-30
US20220240386A1 (en) 2022-07-28

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