WO2021157555A1 - 積層構造体の製造方法、積層構造体、及びインクジェット用組成物セット - Google Patents

積層構造体の製造方法、積層構造体、及びインクジェット用組成物セット Download PDF

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Publication number
WO2021157555A1
WO2021157555A1 PCT/JP2021/003672 JP2021003672W WO2021157555A1 WO 2021157555 A1 WO2021157555 A1 WO 2021157555A1 JP 2021003672 W JP2021003672 W JP 2021003672W WO 2021157555 A1 WO2021157555 A1 WO 2021157555A1
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WIPO (PCT)
Prior art keywords
layer
composition
photocurable
light
thermosetting
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Application number
PCT/JP2021/003672
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English (en)
French (fr)
Japanese (ja)
Inventor
満 谷川
貴志 渡邉
佳史 杉沢
孝徳 井上
悠介 藤田
大地 濱田
Original Assignee
積水化学工業株式会社
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Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to JP2021575795A priority Critical patent/JPWO2021157555A1/ja
Priority to CN202180012951.9A priority patent/CN115052737A/zh
Priority to KR1020227020463A priority patent/KR20220138370A/ko
Publication of WO2021157555A1 publication Critical patent/WO2021157555A1/ja

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container

Definitions

  • the present invention relates to a method for manufacturing a laminated structure using an inkjet device.
  • the present invention also relates to a laminated structure.
  • the present invention also relates to an inkjet composition set that is applied and used by using an inkjet device.
  • a method of applying a composition using an inkjet device is known.
  • a method is used in which an inkjet composition is applied onto the surface of a base material using an inkjet device, and the composition is cured by light, heat, or the like.
  • Patent Document 1 describes a curable composition for inkjet printing containing (A) a multi-branched oligomer or polymer having an ethylenically unsaturated group, (B) a photopolymerization initiator, and (C) a thermosetting compound. The thing is disclosed.
  • a cured product layer in which the ink jet composition is cured may be arranged.
  • the cured product layer is often used as an adhesive layer for adhering two parts or the like.
  • a region surrounded by a cured product layer can be formed to form a metal layer inside the region, or a partition wall can be formed with the cured product layer to prevent the underfill material from getting wet and spreading. This leads to miniaturization and cost reduction of electronic parts.
  • the material for example, the material for forming the metal layer and the underfill material
  • An object of the present invention is to provide a method for producing a laminated structure, a laminated structure, and a composition set for inkjet, which can enhance the leakage prevention property of a material. It is also an object of the present invention to provide an apparatus used for manufacturing the above-mentioned laminated structure.
  • a first light obtained by irradiating a first composition coated on the surface of a first base material by an inkjet method with light and photocuring the first composition is applied to the first photocuring step of forming the cured product layer and the second composition coated by the inkjet method on the surface side of the first photocured product layer opposite to the first base material side.
  • the second composition comprises a second photocuring step of forming a photocured second photocured layer by irradiating the first composition with a monofunctional (meth) acrylate.
  • the second composition contains a compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the second composition comprises a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • a method for producing a laminated structure which comprises an agent and is a composition in which the first composition and the second composition are different.
  • the method for producing a laminated structure is on the surface side of the first photocured material layer opposite to the first base material side.
  • a second coating step of applying the composition of 2 by an inkjet method is provided, and in the second photocuring step, the second composition coated in the second coating step is irradiated with light.
  • a plurality of the second coating step and the second photocuring step are performed in the thickness direction of the first photocured product layer, respectively. It is done once.
  • the method for producing a laminated structure heats the first photocured material layer and the second photocured material layer to obtain the first photocured product layer.
  • the first and first photo-cured product layers are formed by the first photo-cured product layer in which the photo-cured product layer is heat-cured, and the second light and thermo-cured product layer in which the second photo-cured product layer is heat-cured. It is provided with the heating step for the photocurable material layer of 2.
  • the method for producing a laminated structure is such that the first photocurable layer and the second photocurable layer are heated to obtain the first photocurable layer.
  • the first and first photo-cured product layers are formed by the first photo- and heat-cured product layer in which the first photo-cured product layer is heat-cured, and the second photo- and heat-cured product layer in which the second photo-cured product layer is heat-cured.
  • the first and second heating steps for the photocurable material layer are provided with or without the heating step for the second photocurable material layer, the first of the second light and heat-curable material layer is provided.
  • a third composition coated by an inkjet method on the surface side opposite to the base material side of the above is irradiated with light to form a third photocurable material layer in which the third composition is photocured.
  • the photo-curing step of 3 is provided and the heating step for the first and second photo-cured product layers is not provided, the surface of the second photo-cured product layer opposite to that of the first substrate side.
  • a third photocuring step is provided in which a third composition coated on the side by an inkjet method is irradiated with light to form a third photocurable layer in which the third composition is photocured.
  • the third composition contains a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat-curing agent, and the second composition and the third composition are different from each other. It is a composition.
  • the first composition and the third composition are the same composition.
  • the method for producing a laminated structure is such that the first and second photocurable layer heating steps are provided. After the heating step for the second photocurable material layer, a flattening treatment step for flattening the surface of the second light and the heat-cured material layer opposite to the first base material side is provided. And when the heating step for the second photocurable material layer is not provided, after the second photocurable material layer, the surface of the second photocurable material layer opposite to the first base material side is flattened. A flattening treatment step for flattening treatment is provided, and the flattening treatment is a polishing treatment.
  • the method for producing a laminated structure is such that the method for producing a laminated structure is formed on a surface of the third photocured material layer opposite to the first base material side.
  • the arrangement step of arranging the second base material is provided.
  • the method for producing a laminated structure may be described in the case where the first and second heating steps for a photocurable material layer are provided.
  • the third photocurable material layer is heated to form a third light and a thermosetting material layer in which the third photocurable material layer is thermoset, and a third photocurable material layer heating step is provided.
  • the heating step for the second photocurable material layer is not provided, the first photocurable material layer, the second photocurable material layer and the third photocurable material layer are heated to obtain the first photocurable material layer.
  • the present invention includes a third light in which the material layer is thermoset and a heating step for the first, second and third photocurable material layers forming the thermosetting material layer.
  • a second light obtained by irradiating a second composition coated on the surface of a first base material by an inkjet method with light and photocuring the second composition.
  • the second photo-curing material layer is provided with a second photo-curing step of forming the cured product layer, and the second photo-cured product layer is heated to heat the second photo-cured product layer to heat-curing the second photo-cured product layer.
  • the heating step for the second photocurable material layer to be formed is provided or not provided, and the heating step for the second photocurable material layer is provided, the first of the second light and the heat-cured material layer is provided.
  • the first composition coated by an inkjet method on the surface side opposite to the base material side of the above is irradiated with light to form a first photocurable material layer in which the first composition is photocured.
  • inkjet is applied to the surface side of the second photo-curing material layer opposite to the first base material side.
  • the first composition comprises a first photocuring step of irradiating the first composition applied by the method with light to form a first photocurable layer in which the first composition is photocured.
  • the composition comprises a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a heat-curing agent
  • the second composition is a polyfunctional (meth) acrylate compound and an epoxy.
  • a method for producing a laminated structure which comprises a compound, a photopolymerization initiator, and a heat-curing agent, and the first composition and the second composition are different compositions.
  • the method for producing a laminated structure heats the second photocurable material layer, and the second photocurable material layer is thermoset.
  • the second photo-curing material layer for forming the second light and thermosetting material layer is provided, and in the first photo-curing step, the first light and thermosetting material layer is formed.
  • the first composition coated on the surface side opposite to the base material side by an inkjet method is irradiated with light to form a first photocurable product layer in which the first composition is photocured.
  • the second photocurable layer heating step when the second photocurable layer heating step is provided, the second photocurable layer heating step is followed by the second photocurable layer heating step.
  • a flattening treatment step for flattening the surface of the photo- and heat-cured product layer opposite to the first base material side is provided and the heating step for the second photo-cured product layer is not provided.
  • a flattening treatment step of flattening the surface of the second photocured material layer opposite to the first base material side is provided, and the flattening treatment is a polishing treatment. Is.
  • the method for producing a laminated structure is such that the first photocured product is provided with the heating step for the second photocured product layer.
  • the second photo-cured product is provided with a heating step for a first photo-cured product layer in which the layer is heated to form a first light and a thermosetting product layer in which the first photo-cured product layer is thermoset.
  • the layer heating step is not provided, the first photo-cured product layer and the second photo-cured product layer are heated so that the first photo-cured product layer is thermoset.
  • the present invention includes a heating step for a first and second photocurable material layer, which forms a thermosetting material layer and a second light and thermosetting material layer in which the second photocurable material layer is heat-cured.
  • the method for producing a laminated structure is such that the method for producing a laminated structure is formed on a surface of the first photocured material layer opposite to the first base material side.
  • the arrangement step of arranging the second base material is provided.
  • the surface roughness of the second base material is smaller than the surface roughness of the first base material.
  • the first base material, the first layer arranged on the surface of the first base material, and the first base material side of the first layer are A second layer arranged on the opposite surface is provided, and the combination of the first layer and the second layer is such that the first layer is a monofunctional (meth) acrylate compound.
  • the layer is a photocurable material layer or a light and thermosetting material layer of a second composition containing an acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, or the first.
  • the layer is a photocurable material layer or a light and thermosetting material layer of a second composition containing a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent
  • the second layer is a photocurable layer or a light and thermosetting layer of the first composition containing a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • a laminated structure in which the first composition and the second composition are different compositions.
  • the first layer comprises a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • the composition is a photocurable layer or a light and thermosetting layer
  • the second layer contains a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • the photocured material layer or the light and thermosetting material layer of the second composition is a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • the second layer has a polished surface.
  • the laminated structure comprises a second substrate disposed on a surface of the second layer opposite to the first layer side. ..
  • the first layer is the light and thermosetting layer of the first composition
  • the second layer is the second composition. Light and thermosetting layer.
  • the thickness of the second layer is thicker than the thickness of the first layer.
  • the thickness of the first layer is 0.1 ⁇ m or more and 10 ⁇ m or less
  • the thickness of the second layer is 1 ⁇ m or more and 1000 ⁇ m or less.
  • the laminated structure comprises a third layer disposed on a surface of the second layer opposite to the first layer side.
  • the third layer is a photocurable layer or a light and thermosetting layer of a third composition containing a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • the second composition and the third composition are different compositions.
  • the first composition and the third composition are the same composition.
  • the laminated structure comprises a second substrate disposed on a surface of the third layer opposite to the second layer side. ..
  • the surface roughness of the first base material is smaller than the surface roughness of the second base material.
  • the third layer is a light and thermosetting layer of the third composition.
  • the thickness of the second layer is thicker than the thickness of the third layer.
  • the thickness of the third layer is 0.1 ⁇ m or more and 10 ⁇ m or less.
  • the first layer contains a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • the composition is a photocurable layer or a light and thermosetting layer
  • the second layer contains a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • the photocured material layer or the light and thermosetting material layer of the first composition is a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • composition set for inkjet having a first composition and a second composition, wherein the first composition is a monofunctional (meth) acrylate compound and an epoxy.
  • the second composition comprises a compound, a photopolymerization initiator and a thermocuring agent, and the second composition comprises a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator and a thermocuring agent.
  • An epoxy composition set in which the first composition and the second composition are different compositions is provided.
  • the inkjet composition set has a first container and a second container, and the first container is filled with the first composition. Is contained, and the second composition is contained in the second container.
  • the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention have the above-mentioned configurations, it is possible to improve the material leakage prevention property.
  • FIG. 1A to 1C are cross-sectional views for explaining each step of the method for manufacturing a laminated structure according to the first embodiment of the present invention.
  • 2 (d) to 2 (f) are cross-sectional views for explaining each step of the method for manufacturing a laminated structure according to the first embodiment of the present invention.
  • 3 (g) and 3 (h) are cross-sectional views for explaining each step of the method for manufacturing a laminated structure according to the first embodiment of the present invention.
  • FIG. 4 is a flowchart for explaining each step of the method for manufacturing a laminated structure according to the first embodiment of the present invention.
  • FIG. 5 is a flowchart for explaining each step of the method for manufacturing a laminated structure according to a second embodiment of the present invention.
  • FIG. 6 is a flowchart for explaining each step of the method for manufacturing a laminated structure according to a second embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of the laminated structure manufactured by the method for manufacturing the laminated structure according to the second embodiment.
  • FIG. 8 is a flowchart for explaining each step of the method for manufacturing a laminated structure according to a third embodiment of the present invention.
  • FIG. 9 is a flowchart for explaining each step of the method for manufacturing a laminated structure according to a third embodiment of the present invention.
  • FIG. 10 is a cross-sectional view of the laminated structure manufactured by the method for manufacturing the laminated structure according to the third embodiment.
  • FIG. 11 is a schematic configuration diagram showing an example of a part of the apparatus used in the method for manufacturing the laminated structure shown in FIGS. 1 to 3.
  • FIG. 12 is a schematic configuration diagram showing another example of the apparatus used in the method for manufacturing the laminated structure shown in FIGS. 1 to 3.
  • FIG. 13 is a cross-sectional view schematically showing an inkjet composition set according to the first embodiment of the present invention.
  • FIG. 14 is a cross-sectional view showing an electronic component obtained by using the laminated structure according to the first embodiment of the present invention.
  • the first composition coated on the surface of the first base material by an inkjet method is irradiated with light, and the first composition is irradiated with light.
  • the present invention includes a first photocuring step (a first photocuring step for a composition) for forming a cured first photocurable material layer.
  • the method (1) for producing a laminated structure according to the present invention is applied to a second composition coated on the surface side of the first photocured material layer opposite to the first base material side by an inkjet method.
  • the present invention comprises a second photocuring step (a photocuring step for a second composition) of irradiating light to form a second photocurable material layer in which the second composition is photocured.
  • the second composition coated on the surface of the first base material by an inkjet method is irradiated with light, and the second composition is irradiated with light.
  • the present invention includes a second photocuring step (a second photocuring step for a composition) for forming a cured second photocurable material layer.
  • the second photo-cured product layer is heated to heat the second photo-cured product layer and the second photo-cured product layer is heat-cured.
  • a heating step for the second photocurable layer to be formed is provided or not provided.
  • the method (2) for producing a laminated structure according to the present invention when the heating step for the second photocurable material layer is provided, the second light and the first base material side of the thermosetting material layer are provided.
  • a first photocuring layer is formed by irradiating a first composition coated on the opposite surface side by an inkjet method with light to form a photocured first photocured product layer in which the first composition is photocured.
  • a step (a first photocuring step for a composition) is provided.
  • the method (2) for producing a laminated structure according to the present invention when the heating step for the second photocurable material layer is not provided, the method (2) is different from that of the first base material side of the second photocurable material layer.
  • the first composition comprises a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • the second composition comprises a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • the first composition and the second composition are different compositions.
  • the method (1) for manufacturing the laminated structure includes a first coating step (coating step for the first composition) of applying the first composition on the surface of the first base material by an inkjet method. Is preferable.
  • a first coating step coating step for the first composition
  • the first base material side of the first photocurable layer is formed between the first photocuring step and the second photocuring step.
  • a second coating step coating step for the second composition
  • the second photocurable material layer is preferably in contact with the first photocurable material layer.
  • the method (2) for manufacturing the laminated structure includes a second coating step (coating step for the second composition) in which the second composition is coated on the surface of the first base material by an inkjet method. Is preferable.
  • the first base material side of the second photocurable layer is formed between the second photocuring step and the first photocuring step. It is preferable to provide a first coating step (coating step for the first composition) for coating the first composition on the opposite surface side by an inkjet method.
  • the first photocurable material layer is preferably in contact with the second photocurable material layer.
  • first coating step and the first photocuring step are collectively referred to as a first photocuring material layer forming step (first photocuring material layer forming step for composition). .. Further, in the present specification, the second coating step and the second photocuring step are collectively referred to as a second photocuring material layer forming step (second composition photocuring material layer forming step). It is called.
  • the first composition is coated on the surface of the first base material by an inkjet method, and the coated first composition is irradiated with light. Therefore, it is preferable to include a first photocurable material layer forming step in which the first composition forms a photocurable first photocurable material layer.
  • the second composition is coated and applied by an inkjet method on the surface side of the first photocurable material layer opposite to the first base material side. It is preferable to include a second photocurable product layer forming step of irradiating the second composition with light to form a second photocurable material layer in which the second composition is photocured.
  • the second composition is coated on the surface of the first base material by an inkjet method, and the coated second composition is irradiated with light. Therefore, it is preferable to include a second photocurable product layer forming step in which the second composition forms a photocurable second photocurable material layer.
  • the first composition is coated and applied by an inkjet method on the surface side of the second photocurable material layer opposite to the first base material side. It is preferable that the first composition is irradiated with light to form a first photocurable layer in which the first composition is photocured.
  • the laminated structure according to the present invention comprises a first base material, a first layer arranged on the surface of the first base material, and a side opposite to the base material side of the first layer. It comprises a second layer arranged on the surface.
  • the combination of the first layer and the second layer is the following first combination A or the following combination B.
  • Combination A The first layer is a photocurable layer or a light and thermosetting layer of the first composition containing a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator and a thermosetting agent.
  • the second layer is a photocurable layer or a light and thermosetting layer of a second composition containing a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator and a thermosetting agent.
  • the first layer is a photocurable layer or a light and thermosetting layer of a second composition containing a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator and a thermosetting agent.
  • the second layer is a photocurable layer or a light and thermosetting product of the first composition containing a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator and a thermosetting agent. It is a layer.
  • the first composition and the second composition are different compositions.
  • the laminated structure according to the present invention has the above configuration, it is possible to improve the material leakage prevention property.
  • the inkjet composition set according to the present invention is an inkjet composition set having a first composition and a second composition.
  • the first composition contains a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the second composition.
  • the composition comprises a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • the first composition and the second composition are different compositions.
  • the inkjet composition set according to the present invention has the above-mentioned structure, it is possible to improve the material leakage prevention property.
  • the present inventors have found that the shape retention of the cured product layer may be low in the conventional inkjet composition, and the material leaks to the periphery of the cured product layer.
  • the composition for inkjet is a photocurable composition
  • the present inventors are likely to inhibit the photopolymerization reaction due to the influence of oxygen in the air on the surface of the composition applied by the inkjet device. I found the problem.
  • powder such as dust adheres to the surface of the inkjet composition light may not be sufficiently irradiated at the portion where the powder adheres, and the photopolymerization reaction may not proceed sufficiently.
  • the present inventors have found that in such a case, the composition for inkjet is not sufficiently cured, and the shape retention of the cured product layer tends to be deteriorated.
  • the surface of the base material is treated with a chemical solution or the surface of the base material is physically damaged to form irregularities on the surface of the base material.
  • Methods and methods for performing primer treatment are known. However, in these methods, the surface properties of the base material change even in the portion where the inkjet composition is not applied, so that problems such as a decrease in conductivity when parts are connected may occur. be.
  • the adhesive strength between the primer and the cured product layer may decrease.
  • the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention it is not necessary to perform surface treatment of the base material and to use an apparatus capable of nitrogen substitution.
  • the shape retention of the cured product layer obtained by curing the first composition and the second composition can be enhanced, and the adhesive strength with the substrate and the interlayer adhesive strength can be enhanced.
  • the first composition since a specific first composition and a specific second composition are used, the first composition. And the shape retention of the cured product layer in which the second composition is cured can be enhanced. Further, in the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention, since the specific first composition and the specific second composition are used, the base material and the base material are used. The adhesive strength of the first composition to the cured product layer can be enhanced, and the interlayer adhesive strength between the cured product layer of the first composition and the cured product layer of the second composition can be enhanced. ..
  • a material for example, a material for forming a metal layer and a material for forming a metal layer
  • a material may be formed from between a base material and a cured product layer.
  • Underfill material, etc. does not easily leak out.
  • the material is arranged inside the region surrounded by the cured product layer, the material is unlikely to leak from the inside to the outside of the region.
  • the material is arranged outside the region surrounded by the cured product layer, the material is unlikely to leak from the outside to the inside of the region.
  • the shapes of the photocurable material layer of the first composition and the second composition, and the light and thermosetting material layer are maintained. It can enhance the sex.
  • the strength of the cured product layer can be improved, so that damage to the cured product layer can be effectively suppressed.
  • FIGS. 1 (a) to (c), FIGS. 2 (d) to (f), and FIGS. 3 (g) and 3 (h) are steps of the method for manufacturing a laminated structure according to the first embodiment of the present invention. It is sectional drawing for demonstrating.
  • FIG. 4 is a flowchart for explaining each step of the method for manufacturing a laminated structure according to the first embodiment of the present invention.
  • the method for manufacturing the laminated structure according to the first embodiment in FIGS. 1 to 4 is the method for manufacturing the laminated structure (1).
  • the stage 11, the first discharge unit 12, the first light irradiation unit 13, the second discharge unit 14, and the second light irradiation unit are shown.
  • a device 10 including 15 is used.
  • the first ejection unit 12 is a member for ejecting the first composition and is an inkjet head.
  • the second ejection unit 14 is a member for ejecting the second composition and is an inkjet head. Therefore, the device 10 is an inkjet device.
  • a first light irradiation unit 13 is arranged between the first discharge unit 12 and the second discharge unit 14.
  • the second light irradiation unit 15 is arranged on the side of the second discharge unit 14 opposite to the first light irradiation unit 13 side.
  • the first light irradiation unit 13 and the second light irradiation unit 15 can irradiate ultraviolet rays.
  • First photocurable layer forming step (S1 and S2 in FIG. 4)> First, as shown in FIG. 1A, the first base material 3 is arranged on the surface of the stage 11. The first base material 3 is fixed on the surface of the stage 11. The first base material 3 is adsorbed on the stage 11. Next, the first composition 1 is applied onto the surface of the first base material 3 by an inkjet method (first coating step). The first composition 1 is applied from the first discharge portion 12. The first composition 1 is applied to a predetermined position of the first base material 3. The first composition 1 is partially coated on the surface of the first base material 3.
  • the stage 11 is moved until the applied first composition 1 is located below the first light irradiation unit 13.
  • the inkjet device may be moved instead of the stage 11.
  • the first composition 1 is irradiated with light (ultraviolet rays) from the first light irradiation unit 13 to form a first photocurable product layer 1A in which the first composition is photocured (first photocuring). Process).
  • the first photocuring step After the first photocuring step, it is determined whether or not to repeat the first photocuring layer forming step (S3 in FIG. 4). When the first photocurable layer forming step is repeated, the first composition is applied to the surface side of the formed first photocurable layer opposite to the first base material side. ..
  • the stage 11 is moved until the applied second composition 2 is located below the second light irradiation unit 15.
  • the inkjet device may be moved instead of the stage 11.
  • the second composition 2 is irradiated with light (ultraviolet rays) from the second light irradiation unit 15 to form a second photocurable product layer 2A in which the second composition is photocured (second photocuring). Process).
  • the second photocuring step After the second photocuring step, it is determined whether or not to repeat the second photocuring layer forming step (S6 in FIG. 4). When the second photocurable layer forming step is repeated, the second composition is applied to the surface side of the formed second photocurable layer opposite to the first base material side. ..
  • FIGS. 2 (e) and 2 (f) are diagrams showing the second second photocurable layer forming step.
  • the stage 11 is moved until the second photocurable material layer 2A is located below the second discharge portion 14.
  • the inkjet device may be moved instead of the stage 11.
  • the second composition 2 is applied on the surface of the second photocurable material layer 2A opposite to the first base material 3 side by an inkjet method. That is, the second composition 2 is applied to the surface side of the first photocurable material layer 1A opposite to the first base material 3 side (second coating step).
  • the second composition 2 is applied from the second discharge portion 14.
  • the stage 11 is moved until the applied second composition 2 is located below the second light irradiation unit 15.
  • the inkjet device may be moved instead of the stage 11.
  • the second composition 2 is irradiated with light (ultraviolet rays) from the second light irradiation unit 15 to form a second photocurable product layer 2A in which the second composition is photocured (second photocuring). Process).
  • FIGS. 1 (c) and 2 (d), and FIGS. 2 (e) and 2 (f). has been done twice.
  • the second photocurable layer forming step may be performed twice or more, or may be performed three or more times.
  • the first base material 3 and the first base material 3 By performing the second photocurable layer forming step a plurality of times in the thickness direction of the first photocurable layer, as shown in FIG. 3 (g), the first base material 3 and the first base material 3 A laminated structure including a first photo-cured product layer 1A and a second photo-cured product layer 2A, in which the thickness of the second photo-cured product layer 2A is larger than the thickness of the first photo-cured product layer 1A. 4A can be obtained.
  • a laminated structure 4B including the first base material 3, the first light and thermosetting layer 1B, and the second light and thermosetting layer 2B can be obtained.
  • FIG. 5 and 6 are flowcharts for explaining each step of the method for manufacturing a laminated structure according to the second embodiment of the present invention.
  • the method for manufacturing a laminated structure according to the second embodiment is the method for manufacturing a laminated structure (1).
  • FIG. 7 is a cross-sectional view of the laminated structure manufactured by the method for manufacturing the laminated structure according to the second embodiment.
  • the first photocuring step After the first photocuring step, it is determined whether or not to repeat the first photocuring layer forming step (S3 in FIG. 5). When the first photocurable layer forming step is repeated, the first composition is applied to the surface side of the formed first photocurable layer opposite to the first base material side. ..
  • the second photocuring step After the second photocuring step, it is determined whether or not to repeat the second photocuring layer forming step (S6 in FIG. 5). When the second photocurable layer forming step is repeated, the second composition is applied to the surface side of the formed second photocurable layer opposite to the first base material side. ..
  • a laminated structure including a first base material, a first light and thermosetting layer, and a second light and thermosetting layer by performing the heating steps for the first and second photocurable layers. You can get a body.
  • the first and second heating steps for the photocurable material layer are performed and the flattening treatment step is performed, the second light after the first and second heating steps for the photocurable material layer is performed. And the surface of the thermosetting layer opposite to the first base material side is flattened (flattening treatment step).
  • the heating step for the first and second photocurable material layers is not performed and the flattening treatment step is performed, the second photocurable material layer is opposite to the first base material side. The surface is flattened (flattening step).
  • a third photocurable layer forming step is performed using the third composition in the same manner as in the first photocurable layer forming step or the second photocured layer forming step.
  • the third composition is inkjetd on the surface of the second light and thermosetting material layer opposite to the first base material side. Apply by the method (third coating step (third coating step for composition)).
  • the third composition is inkjet-processed on the surface of the second photocurable material layer opposite to the first base material side. (Third coating step (third coating step for composition)).
  • the third composition is applied from a predetermined ejection portion provided in the inkjet device.
  • the first composition and the third composition are the same composition, in the third coating step, substantially, the second light and thermosetting layer or the second
  • the first composition is coated on the surface of the photocured material layer opposite to the first base material side by an inkjet method.
  • the third composition is irradiated with light (ultraviolet rays) from a predetermined light irradiation unit included in the inkjet device to form a third photocurable product layer in which the third composition is photocured (third).
  • light ultraviolet rays
  • the third photocuring step substantially light (ultraviolet rays) is emitted from a predetermined light irradiation portion included in the inkjet device. Will be irradiated to form a third photocurable layer in which the first composition is photocured.
  • the third photocuring step it is determined whether or not to repeat the third photocuring layer forming step (S13 in FIG. 6).
  • the third composition is applied to the surface side of the formed third photocurable layer opposite to the first base material side. ..
  • the third coating step and the third photocuring step are collectively referred to as a third photocuring material layer forming step (third composition photocuring material layer forming step).
  • ⁇ Third heating step for the photocurable material layer or the first, second and third heating steps for the photocurable material layer (S15 in FIG. 6)>
  • the third photocurable material layer is heated to form a third light and thermosetting material layer ().
  • Third heating step for the photocurable layer When the heating steps for the first and second photocurable material layers are not performed, the first photocurable material layer, the second photocurable material layer and the third photocurable product after the arrangement step are performed.
  • the layers are heated to form a first light and thermosetting layer, a second light and thermosetting layer, and a third light and thermosetting layer (first, second and third). Heating process for photocurable layer).
  • the first light and thermosetting layer is a layer obtained by thermosetting the first photocuring layer.
  • the second light and thermosetting layer is a layer obtained by thermosetting the second photocuring layer.
  • the third light and thermosetting layer is a layer obtained by thermosetting the third photocuring layer.
  • the first base material 3 the first light and thermosetting layer 1D, the second light and thermosetting layer 2D, and the third light and heat.
  • a laminated structure 4D including the cured product layer 6D and the second base material 7 in this order can be obtained.
  • FIG. 8 and 9 are flowcharts for explaining each step of the method for manufacturing a laminated structure according to a third embodiment of the present invention.
  • the method for manufacturing a laminated structure according to a third embodiment is the method for manufacturing a laminated structure (2).
  • FIG. 10 is a cross-sectional view of the laminated structure manufactured by the method for manufacturing the laminated structure according to the third embodiment.
  • the second composition is applied onto the surface of the first base material by an inkjet method (second coating step).
  • the second composition is applied in place on the first substrate.
  • the second composition is partially applied onto the surface of the first substrate.
  • the applied second composition is irradiated with light (ultraviolet rays) to form a second photocurable product layer in which the second composition is photocured (second photocuring step).
  • the second photocuring step After the second photocuring step, it is determined whether or not to repeat the second photocuring layer forming step (S3 in FIG. 8). When the second photocurable layer forming step is repeated, the second composition is applied to the surface side of the formed second photocurable layer opposite to the first base material side. ..
  • the second heating step for the photocurable material layer (S5 in FIG. 8)> After the second photocuring step, it is determined whether or not to perform the second heating step for the photocured material layer (S4 in FIG. 8).
  • the heating step for the second photocurable material layer is performed, the second photocurable material layer is heated to form a second light and thermosetting material layer in which the second photocurable material layer is heat-cured. (Second heating step for the photocurable material layer).
  • First photocurable layer forming step (S8 and S9 in FIG. 9)>
  • the heating step for the second photocurable material layer is performed, the first composition is applied to the surface side of the second light and the thermosetting material layer opposite to the first base material side by an inkjet method.
  • First coating step When the heating step for the second photocurable material layer is not performed, the first composition is applied to the surface side of the second photocurable material layer opposite to the first base material side by an inkjet method.
  • the heating step for the second photocurable material layer when the heating step for the second photocurable material layer was performed, the second light and the thermosetting material layer were coated on the surface side opposite to the first base material side by an inkjet method.
  • the first composition is irradiated with light to form a first photo-cured product layer in which the first composition is photo-cured (first photo-curing step).
  • the heating step for the second photocurable material layer is not performed, the first composition is applied by an inkjet method to the surface side of the second photocurable material layer opposite to the first base material side. By irradiating an object with light, the first composition forms a photo-cured first photo-cured product layer (first photo-curing step).
  • the first photocuring step After the first photocuring step, it is determined whether or not to repeat the first photocuring layer forming step (S10 in FIG. 9). When the first photocurable layer forming step is repeated, the first composition is applied to the surface side of the formed first photocurable layer opposite to the first base material side. ..
  • the first photocurable material layer is heated to form the first light and thermosetting material layer (first). Heating process for photocurable layer).
  • the heating step for the second photocurable material layer is not performed, the first photocurable material layer and the second photocurable material layer are heated after the arrangement step to obtain the first light and heat.
  • a cured product layer and a second light and thermosetting material layer are formed (heating steps for the first and second photocured product layers).
  • the first light and thermosetting layer is a layer obtained by thermosetting the first photocuring layer.
  • the second light and thermosetting layer is a layer obtained by thermosetting the second photocuring layer.
  • the first base material 3, the second light and thermosetting material layer 2E, the first light and thermosetting material layer 1E, and the second base material 7 It is possible to obtain a laminated structure 4E including the above in this order.
  • the method (1) for manufacturing the laminated structure may or may not include the first coating step.
  • the method (2) for manufacturing the laminated structure may or may not include the second coating step.
  • the laminated structure (1) preferably includes the first coating step, the first photocuring step, the second coating step, and the second photocuring step in this order. ..
  • the laminated structure (2) preferably includes the second coating step, the second photocuring step, the first coating step, and the first photocuring step in this order. ..
  • the method (1) for manufacturing the laminated structure may or may not include the third coating step.
  • the method (1) for manufacturing the laminated structure may or may not include the third photocuring step.
  • the method (1) for manufacturing the laminated structure may or may not include the third photocurable layer forming step.
  • the entire applied first composition is irradiated with light to obtain the first composition.
  • the photocurable material layer may be formed.
  • each time a plurality of drops of the first composition are applied the applied first composition is irradiated with light and the first photocuring is performed.
  • a material layer may be formed.
  • each time one drop of the first composition is applied the applied first composition is irradiated with light and the first photocuring is performed.
  • a material layer may be formed.
  • the first photocurable layer forming step is performed only once in the thickness direction of the first base material, as shown in FIG. You may be broken.
  • the first photocurable layer forming step may be performed a plurality of times in the thickness direction of the first base material. That is, in the methods (1) and (2) for manufacturing the laminated structure, the first coating step and the first photocuring step are performed only once in the thickness direction of the first base material, respectively. It may be performed, or it may be performed multiple times. By performing the first photocurable material layer forming step a plurality of times in the thickness direction of the first base material, the thickness of the first photocurable material layer can be increased.
  • the first photocurable layer forming step is performed before the second photocured layer forming step.
  • the second photocurable layer forming step is performed before the first photocured layer forming step.
  • the first photocurable material layer forming step and the second photocured material layer forming step are performed before the third photocured material layer forming step. It is said.
  • the entire applied second composition is irradiated with light to obtain a second composition.
  • the photocurable material layer may be formed.
  • every time a plurality of drops of the second composition are applied the applied second composition is irradiated with light and the second photocuring is performed.
  • a material layer may be formed.
  • each time one drop of the second composition is applied the applied second composition is irradiated with light to cure the second composition.
  • a material layer may be formed.
  • the second photocurable layer forming step may be performed only once in the thickness direction of the first photocurable layer.
  • the second photocurable layer forming step is performed a plurality of times in the thickness direction of the first photocurable layer, as shown in FIGS. 1 and 2. You may. That is, in the method (1) for manufacturing the laminated structure, the second coating step and the second photocuring step are performed only once in the thickness direction of the first photocured product layer, respectively. It may be performed a plurality of times.
  • the second photocurable layer forming step may be performed only once in the thickness direction of the first base material.
  • the second photocurable layer forming step may be performed a plurality of times in the thickness direction of the first base material.
  • the second coating step and the second photocuring step may be performed only once in the thickness direction of the first base material, respectively. It may be performed multiple times.
  • the thickness of the second photocurable material layer is formed by performing the second photocurable material layer forming step a plurality of times in the thickness direction of the first photocurable material layer or the thickness direction of the first base material. Can be increased.
  • the second photocurable material layer forming step is preferably performed a plurality of times in the thickness direction of the first photocurable material layer or the thickness direction of the first base material. The number of times the second photocurable layer forming step is repeated is appropriately changed according to the thickness of the target second photocurable layer.
  • the entire applied third composition is irradiated with light to form a third composition.
  • the photocurable material layer may be formed.
  • each time a plurality of drops of the third composition are applied the applied third composition is irradiated with light to be photocured.
  • a material layer may be formed.
  • each time one drop of the third composition is applied the applied third composition is irradiated with light to cure the third composition.
  • a material layer may be formed.
  • the third photo-cured product layer forming step may be performed only once in the thickness direction of the second photo-cured product layer.
  • the third photocurable layer forming step may be performed a plurality of times in the thickness direction of the second photocurable layer. That is, in the methods (1) and (2) for manufacturing the laminated structure, the third coating step and the third photocuring step are 1 in the thickness direction of the second photocured product layer, respectively. It may be performed only once, or it may be performed multiple times. By performing the third photocurable material layer forming step a plurality of times in the thickness direction of the second photocurable material layer, the thickness of the third photocurable material layer can be increased.
  • the light irradiation in the first photocuring step, the second photocuring step and the third photocuring step is preferably ultraviolet irradiation. ..
  • the illuminance and irradiation time of ultraviolet rays in the first photo-curing step, the second photo-curing step, and the third photo-curing step are the first composition, the second composition, and the third composition. It can be appropriately changed depending on the composition and the coating thickness of the composition.
  • the first light-curing process, the illuminance of ultraviolet rays in the second light-curing step and the third light-curing step may also be 1000 mW / cm 2 or more, even 5000 mW / cm 2 or more well, it may also be 10000 mW / cm 2 or less, may be 8000 MW / cm 2 or less.
  • the irradiation time of ultraviolet rays in the first photocuring step, the second photocuring step, and the third photocuring step may be, for example, 0.01 seconds or more, or 0.1 seconds or more. It may be 400 seconds or less, or 100 seconds or less.
  • the method (1) for manufacturing the laminated structure may or may not include the first and second heating steps for the photocurable material layer.
  • the method (1) for manufacturing the laminated structure may or may not include the third heating step for the photocurable material layer.
  • the method (1) for manufacturing the laminated structure may or may not include the first, second, and third heating steps for the photocurable material layer.
  • the method (2) for manufacturing the laminated structure may or may not include the second heating step for the photocurable material layer.
  • the method (2) for manufacturing the laminated structure may or may not include the first heating step for the photocurable material layer.
  • the method (2) for manufacturing the laminated structure may or may not include the first and second heating steps for the photocurable material layer.
  • the method (1) for producing the laminated structure may include the heating steps for the first and second photocured product layers. preferable. From the viewpoint of increasing the strength of the cured product layer of the third composition, it is preferable that the method (1) for producing the laminated structure includes the heating step for the third photocured product layer. From the viewpoint of increasing the strength of the cured product layers of the first, second and third compositions, the method (1) for producing the laminated structure is for the first, second and third photocured product layers. It is preferable to include a heating step. From the viewpoint of increasing the strength of the cured product layer of the second composition, it is preferable that the method (2) for producing the laminated structure includes the heating step for the second photocured product layer.
  • the method (2) for producing the laminated structure includes the heating step for the first photocured product layer. From the viewpoint of increasing the strength of the cured product layer of the first and second compositions, the method (2) for producing the laminated structure may include the heating steps for the first and second photocured product layers. preferable.
  • the first and second heating steps for the photocurable material layer are performed after the second photocurable material layer forming step.
  • the first and second heating steps for the photocurable material layer are preferably performed before the third photocurable material layer forming step, and the first and second photocurable material layer forming steps are preferably performed. It is preferable that the step is performed before the heating step for the photocurable material layer of 3.
  • the first and second heating steps for the photocurable material layer may be performed after the third photocurable material layer forming step.
  • the third heating step for the photocured material layer may be performed before the arrangement step or after the arrangement step.
  • the second heating step for the photocurable material layer is performed after the second photocurable material layer forming step.
  • the second heating step for the photocurable material layer is preferably performed before the first photocurable material layer forming step, and the first It is preferable that the step is performed before the heating step for the photocurable material layer of 1.
  • the first heating step for the photocurable product layer may be performed before the arrangement step or after the arrangement step.
  • the heating temperature and heating time in each of the heating steps can be appropriately changed depending on the composition of the first composition, the second composition and the third composition, and the coating thickness of the composition.
  • the heating temperature in the heating step may be, for example, 100 ° C. or higher, 120 ° C. or higher, 250 ° C. or lower, or 200 ° C. or lower.
  • the heating time in the heating step may be, for example, 5 minutes or more, 30 minutes or more, 600 minutes or less, or 300 minutes or less.
  • the method (1) for manufacturing the laminated structure may or may not include the flattening treatment step.
  • the method (2) for manufacturing the laminated structure may or may not include the flattening treatment step.
  • the methods (1) and (2) for manufacturing the laminated structure include the flattening treatment step. ..
  • the thickness of the cured product layer arranged between the second photocured material layer (or the second light and thermosetting material layer) and the second base material is reduced.
  • the adhesive force between the cured product layer and the second base material can be enhanced.
  • the flattening treatment step may be performed before or after the first and second heating steps for the photocurable product layer.
  • the method (1) for producing the laminated structure after the heating steps for the first and second photocurable material layers, the second light and the thermosetting material layer are opposite to those on the first base material side. It is preferable to flatten the surface.
  • the flattening treatment step may be performed before or after the second heating step for the photocurable product layer.
  • the method (2) for manufacturing the laminated structure after the heating step for the second photocurable material layer, the surface of the second light and the thermosetting material layer opposite to the first base material side is flattened. It is preferable to carry out the chemical treatment.
  • the adhesive strength between the base material and the cured product layer can be increased, and the strength of the cured product layer can be increased, so that the cured product layer can be removed from the first base material during the flattening treatment. It is possible to prevent peeling and destruction of the cured product layer.
  • Examples of the flattening treatment include polishing treatment and the like.
  • Examples of the polishing treatment include cutting polishing treatment by tool processing using diamond, chemical mechanical polishing treatment and the like.
  • the flattening treatment is preferably a polishing treatment. Since the flattening treatment is particularly easy, the polishing treatment is preferably a cutting polishing treatment by a cutting tool using diamond, and a cutting polishing treatment by a cutting tool using diamond and a chemical mechanical polishing treatment. It is more preferable that both treatments are performed.
  • Examples of the device that can be used for the flattening process include a "flattening device” manufactured by Keylink and a “DFS8910” manufactured by DISCO.
  • the absolute value of the difference between the maximum height and the minimum height of the surface of the second light and thermosetting layer (or the second photocured layer) after the flattening treatment is preferably 5 ⁇ m or less. It is more preferably 3 ⁇ m or less, and further preferably 1 ⁇ m or less.
  • the absolute value of the above difference may be 0.5 ⁇ m or more.
  • the methods (1) and (2) for manufacturing the laminated structure may or may not include the above-mentioned arrangement step.
  • the method (1) for manufacturing the laminated structure may include an arrangement step of arranging the second base material on the surface of the third photocurable material layer opposite to the first base material side. preferable.
  • the third heating step for the photocured material layer is performed before the placement step, the third light and the third light and the above-mentioned arrangement step are performed.
  • the second base material is placed on the surface of the thermosetting material layer opposite to the first base material side.
  • the method (2) for manufacturing the laminated structure may include an arrangement step of arranging the second base material on the surface of the first photocurable material layer opposite to the first base material side. preferable.
  • the first heating step for the photocured material layer is performed before the placement step, in the placement step, the first light and the above-mentioned first light and The second base material is placed on the surface of the thermosetting material layer opposite to the first base material side.
  • the method of arranging the second base material is not particularly limited.
  • the first base material and the second base material may be the same base material or different base materials.
  • the base material that comes into contact with the cured product layer of the second composition is preferably a base material having irregularities on the surface or a base material whose surface is primed.
  • the adhesiveness of the second composition to the cured product layer can be further enhanced, and the effects of the present invention can be further exerted.
  • long-term reliability can be improved.
  • the method of forming irregularities on the surface of the base material include a method using a brush and a method of blasting.
  • the surface roughness of the base material in contact with the cured product layer of the first composition is preferably smaller than the surface roughness of the base material in contact with the cured product layer of the second composition.
  • the base material that comes into contact with the cured product layer of the first composition is the second base material, and is in contact with the cured product layer of the second composition.
  • the base material to be used is the above-mentioned first base material. Therefore, in the method (2) for manufacturing the laminated structure, the surface roughness of the second base material is preferably smaller than the surface roughness of the first base material.
  • the surface roughness means the surface roughness in the region in contact with the cured product layer of the first composition, the second composition or the third composition.
  • the surface roughness means the arithmetic mean roughness Ra measured in accordance with JIS B0601: 1994.
  • the surface roughness of the base material in contact with the cured product layer of the second composition is preferably 100 nm or more, more preferably 200 nm or more, preferably 1000 nm or less, and more preferably 500 nm or less.
  • the absolute value of the difference between the surface roughness of the base material in contact with the cured product layer of the first composition and the surface roughness of the base material in contact with the cured product layer of the second composition is preferably 50 nm or more. , More preferably 100 nm or more, preferably 900 nm or less, and more preferably 800 nm or less.
  • the first base material is preferably a ceramic substrate or a silicon substrate, and more preferably a silicon substrate.
  • the second base material is preferably a glass substrate.
  • the first base material is preferably a ceramic substrate or a silicon substrate, and more preferably a ceramic substrate.
  • the second base material is preferably a glass substrate.
  • the present specification also discloses an apparatus used for manufacturing the laminated structure.
  • the apparatus includes a stage, a first discharge unit for discharging the first composition, a second discharge unit for discharging the second composition, and the first discharge unit. It includes a first light irradiation unit arranged between the second discharge unit and the second discharge unit.
  • the device includes a third discharge unit for discharging the third composition.
  • the first ejection unit is an inkjet head and the second ejection unit is an inkjet head.
  • the third ejection unit is preferably an inkjet head.
  • the device is preferably an inkjet device.
  • the third discharge unit can have the same configuration as the first discharge unit or the second discharge unit.
  • the device may include only one first discharge unit for discharging the first composition, or may include two or more of the first discharge portions.
  • the device may include only one second discharge portion for discharging the second composition, or may include two or more of the second discharge portions.
  • the apparatus is located on the opposite side of the first discharge portion from the first light irradiation portion, or the first light irradiation of the second discharge portion. It is preferable to provide a second light irradiation portion arranged on the side opposite to the portion.
  • the second light irradiation unit may be arranged on the side opposite to the first light irradiation unit of the first discharge unit, and the first light irradiation unit of the second discharge unit may be arranged. It may be arranged on the side opposite to the light irradiation part, the side opposite to the first light irradiation part of the first discharge part, and the first light irradiation part of the second discharge part. It may be arranged on both sides opposite to.
  • the device does not have to include the second light irradiation unit.
  • the apparatus does not include the second light irradiation unit, the first photocuring step and the second photocuring step are performed using the first light irradiation unit.
  • the first light irradiation unit and the second light irradiation unit can irradiate ultraviolet rays.
  • the first light irradiation unit is preferably a first ultraviolet irradiation unit
  • the second light irradiation unit is preferably a second ultraviolet irradiation unit.
  • Examples of the first ultraviolet irradiation unit and the second ultraviolet irradiation unit include a light emitting diode (UV-LED) that generates ultraviolet rays.
  • UV-LED light emitting diode
  • the apparatus may include a first ink tank 16 in which the first composition is stored and a first circulation flow path portion 17.
  • a second ink tank 18 in which the second composition is stored and a second circulation flow path portion 19 may be provided.
  • the first circulation flow path portion 17 connects the first ink tank 16 and the first ejection portion 12.
  • the first composition flows inside the first circulation flow path portion 17.
  • the second circulation flow path portion 19 connects the second ink tank 18 and the second ejection portion 14.
  • the second composition flows inside the second circulation flow path portion 19.
  • the first circulation flow path portion 17 has a buffer tank 17A and a pump 17B in the first circulation flow path portion 17. However, as shown in FIG. 12A, the first circulation flow path portion 17X does not have to have the buffer tank and the pump in the first circulation flow path portion 17X.
  • the first circulation flow path portion preferably has the buffer tank in the first circulation flow path portion, and preferably has the pump. Further, the first circulation flow path portion may have a current meter, a thermometer, a filter, a liquid level sensor, and the like in addition to the buffer tank and the pump in the first circulation flow path portion.
  • the second circulation flow path portion 19 has a buffer tank 19A and a pump 19B in the second circulation flow path portion 19. However, as shown in FIG. 12B, the second circulation flow path portion 19X does not have to have the buffer tank and the pump in the second circulation flow path portion 19X.
  • the second circulation flow path portion preferably has the buffer tank in the second circulation flow path portion, and preferably has the pump. Further, the second circulation flow path portion may have a current meter, a thermometer, a filter, a liquid level sensor, and the like in addition to the buffer tank and the pump in the second circulation flow path portion.
  • the buffer tanks 17A, 19A or the pumps 17B, 19B may be arranged between the ejection portions 12, 14 and the ink tanks 16, 18, respectively. preferable.
  • the buffer tanks 17A and 19A are arranged on the discharge portions 12 and 14 side of the pumps 17B and 19B.
  • the pumps 17B and 19B are arranged on the ink tanks 16 and 18 side of the buffer tanks 17A and 19A.
  • the first composition is temporarily stored in the buffer tank 17A.
  • the second composition is temporarily stored in the buffer tank 19A.
  • the circulation method of the first composition and the second composition it is possible to circulate the composition by using its own weight or by applying pressure, depressurization, etc. using a pump or the like. It is possible. A plurality of these may be used in combination.
  • the pump include a cylinder type pulsation-free pump, a propeller pump, a gear pump, a diaphragm pump and the like. From the viewpoint of increasing the circulation efficiency and further improving the formation accuracy of the cured product layer, the first and second circulation flow paths are placed in the first and second circulation flow paths in the first and second circulation flow paths. It is preferable to include a pump for transferring the composition of 2.
  • the first and second circulation flow paths are provided with the first and second circulation channels in the first and second circulation flow paths. It is preferable to include a buffer tank for temporary storage.
  • a heating heater may be introduced into the first and second ink tanks, or the first and second circulation flow paths may be heated. By using a heater or the like, it is possible to adjust the temperature of the first and second compositions.
  • the first circulation flow path portion is preferably a circulation flow path portion for circulating the first composition at 30 ° C. or higher, and is a circulation flow path portion for circulating at 40 ° C. or higher. Is more preferable, and it is preferable that it is a circulation flow path portion for circulating at 100 ° C. or lower, and it is preferable that it is a circulation flow path portion for circulating at 90 ° C. or lower. In this case, the viscosity of the first composition can be optimized, and the discharge property of the first composition can be improved.
  • the second circulation flow path portion is preferably a circulation flow path portion for circulating the second composition at 30 ° C. or higher, and is a circulation flow path portion for circulating at 40 ° C. or higher. Is more preferable, and it is preferable that it is a circulation flow path portion for circulating at 100 ° C. or lower, and it is preferable that it is a circulation flow path portion for circulating at 90 ° C. or lower. In this case, the viscosity of the second composition can be optimized, and the discharge property of the second composition can be improved.
  • the discharge nozzle of the discharge portion keeps an appropriate pressure and the pressure fluctuation (pulsation) is small within that range.
  • an attenuator between the pump and the discharge portion in order to suppress the pulsation of the pump.
  • Examples of such an attenuator include a buffer tank in which the first and second compositions are temporarily stored, a membrane type damper, and the like.
  • the first and second compositions are first.
  • the first and second compositions that have not been ejected from the first and second ejection portions are flowed into the first and second circulation flow path portions and moved to the first and second ink tanks.
  • the first and second compositions can be coated while being circulated.
  • the laminated structure according to the present invention comprises a first base material, a first layer (layer X) arranged on the surface of the first base material, and the first group of the first layer. It includes a second layer (layer Y) arranged on the surface opposite to the material side.
  • the combination of the first layer and the second layer is the following combination A or the following combination B.
  • Combination A The first layer is a photocurable layer or a light and thermosetting layer of the first composition containing a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator and a thermosetting agent.
  • the second layer is a photocurable layer or a light and thermosetting layer of a second composition containing a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator and a thermosetting agent.
  • the first layer is a photocurable layer or a light and thermosetting layer of a second composition containing a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator and a thermosetting agent.
  • the second layer is a photocurable layer or a light and thermosetting product of the first composition containing a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator and a thermosetting agent. It is a layer.
  • the first composition and the second composition are different compositions.
  • the laminated structure according to the present invention may satisfy the combination A or the combination B.
  • a first layer which is a cured product layer of the first composition
  • a second layer which is a cured product layer of the second composition
  • a first layer which is a photo-cured product layer of the first composition
  • a second layer which is a photo-cured product layer of the second composition
  • the first layer is preferably a light and thermosetting layer of the first composition
  • the second layer is the above. It is preferably a light and thermosetting layer of the second composition.
  • the first layer is preferably a light and thermosetting layer of the second composition
  • the second layer is the above-mentioned second layer. It is preferably a light and thermosetting layer of the first composition.
  • the second layer preferably has a polished surface.
  • the laminated structure may include a third layer (layer Z) arranged on the surface of the second layer opposite to the first layer side.
  • the third layer is a photocurable layer of a third composition containing a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • the second composition and the third composition are different compositions.
  • the laminated structure according to the present invention preferably includes the third layer.
  • the laminated structure preferably includes a second base material arranged on the surface of the second layer opposite to the first layer side.
  • the laminated structure has a second base material arranged on the surface of the third layer opposite to the second layer side. It is preferable to prepare.
  • the surface roughness of the base material in contact with the cured product layer of the first composition is smaller than the surface roughness of the base material in contact with the cured product layer of the second composition. Is preferable.
  • the surface roughness of the base material in contact with the cured product layer of the third composition is smaller than the surface roughness of the base material in contact with the cured product layer of the second composition. Is preferable. Therefore, in the case of the combination A, it is preferable that the surface roughness of the first base material is smaller than the surface roughness of the second base material in the laminated structure. In the case of the combination B, in the laminated structure, it is preferable that the surface roughness of the second base material is smaller than the surface roughness of the first base material.
  • the surface roughness means the surface roughness in the region in contact with the cured product layer of the first composition, the second composition or the third composition.
  • the surface roughness means the arithmetic mean roughness Ra measured in accordance with JIS B0601: 1994.
  • the surface roughness of the base material in contact with the cured product layer of the second composition is preferably 100 nm or more, more preferably 200 nm or more, preferably 1000 nm or less, and more preferably 500 nm or less. ..
  • Absolute value of the difference between the surface roughness of the base material in contact with the cured product layer of the first composition and the surface roughness of the base material in contact with the cured product layer of the second composition in the laminated structure is preferably 50 nm or more, more preferably 100 nm or more, preferably 900 nm or less, and more preferably 800 nm or less.
  • the thickness of the second layer is preferably thicker than the thickness of the first layer, and is 40 ⁇ m or more than the thickness of the first layer. It is more preferably thick, and further preferably 50 ⁇ m or more thicker than the thickness of the first layer.
  • the thickness of the second layer is preferably thicker than the thickness of the third layer, and is 40 ⁇ m or more than the thickness of the third layer. It is more preferably thick, and even more preferably 50 ⁇ m or more thicker than the thickness of the third layer.
  • the thickness of the first layer is preferably 0.1 ⁇ m or more, more preferably 0.3 ⁇ m or more, preferably 10 ⁇ m or less, more preferably 5 m or less. Is.
  • the thickness of the second layer is preferably 40 ⁇ m or more, more preferably 50 ⁇ m or more, preferably 1000 ⁇ m or less, and more preferably 800 m or less.
  • the thickness of the third layer is preferably 0.1 ⁇ m or more, more preferably 0.3 ⁇ m or more, preferably 10 ⁇ m or less, more preferably 5 m or less. Is.
  • the ratio (thickness / width) to the width of the thickness is preferably 0.01 or more, more preferably 0.1 or more, preferably 200 or less, and more. It is preferably 150 or less.
  • the ratio (thickness / width) is equal to or greater than the above lower limit and equal to or less than the above upper limit, the effect of the present invention can be exhibited even more effectively.
  • the ratio (thickness / width) to the width of the thickness is preferably 0.01 or more, more preferably 0.1 or more. It is preferably 200 or less, more preferably 150 or less.
  • the ratio (thickness / width) is equal to or greater than the above lower limit and equal to or less than the above upper limit, the effect of the present invention can be exhibited even more effectively.
  • the ratio (thickness / width) to the width of the thickness is preferably 0.01 or more, more preferably 0.1 or more, preferably 200 or less, and more preferably 150 or less.
  • the ratio (thickness / width) is equal to or greater than the above lower limit and equal to or less than the above upper limit, the effect of the present invention can be exhibited even more effectively.
  • the inkjet composition set includes the first composition and the second composition. In the inkjet composition set, the first composition and the second composition are not mixed. The first composition is preferably contained in a first container, and the second composition is preferably contained in a second container.
  • the inkjet composition set is a set of the first composition and the second composition. In the inkjet composition set, it is preferable that the first composition is applied and then the second composition is applied and used. In the inkjet composition set, it is preferable that the first composition is applied and photocured, and then the second composition is applied and photocured before use.
  • the inkjet composition set is preferably used for producing the above-mentioned laminated structure.
  • the inkjet composition set may have a third composition.
  • the first composition, the second composition, and the third composition are not mixed.
  • the third composition is preferably contained in a third container.
  • the inkjet composition set having the third composition is a set of the first composition, the second composition, and the third composition.
  • the first photocurable material layer (or the first light and thermosetting material layer) and the third photocurable material layer (or the third light and thermosetting material layer) are formed by the same composition.
  • the first composition in the set product of the first composition and the second composition is used as the third photocurable layer (or the third light and thermosetting layer). ) Can be used to form.
  • FIG. 13 is a cross-sectional view schematically showing an inkjet composition set according to the first embodiment of the present invention.
  • the inkjet composition set 5 has a first container 101, a first composition 1, a second container 102, and a second composition 2.
  • the first composition 1 is contained in the first container 101.
  • the second composition 2 is contained in the second container 102.
  • the second composition is consumed more than the first composition. Therefore, in the above inkjet composition set, the amount (volume) of the first composition contained in the first container is the first composition of the second composition contained in the second container. It is preferably larger than the amount (volume) of the object.
  • (meth) acrylate means one or both of "acrylate” and “methacrylate”.
  • the first composition and the second composition are different compositions, and the third composition and the second composition are different compositions. That is, the composition of the first composition and the composition of the second composition are different, and the composition of the third composition and the composition of the second composition are different.
  • the first composition and the third composition may be different compositions or the same composition. From the viewpoint of increasing the production efficiency of the laminated structure, it is preferable that the first composition and the third composition are the same composition. That is, it is preferable that the first composition and the third composition have the same composition.
  • the first composition and the third composition include a monofunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • the second composition contains a polyfunctional (meth) acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.
  • the first composition and the third composition may or may not contain a polyfunctional (meth) acrylate compound, respectively.
  • the second composition may or may not contain a monofunctional (meth) acrylate compound.
  • the polyfunctional (meth) acrylate compound contained in the first composition and the above It may be the same as or different from the polyfunctional (meth) acrylate compound contained in the second composition.
  • the third composition and the second composition contain a polyfunctional (meth) acrylate compound
  • the polyfunctional (meth) acrylate compound contained in the third composition and the above It may be the same as or different from the polyfunctional (meth) acrylate compound contained in the second composition.
  • both the first composition and the second composition contain a monofunctional (meth) acrylate compound
  • the monofunctional (meth) acrylate compound contained in the first composition and the above It may be the same as or different from the monofunctional (meth) acrylate compound contained in the second composition.
  • the third composition and the second composition contain a monofunctional (meth) acrylate compound
  • the monofunctional (meth) acrylate compound contained in the third composition and the above It may be the same as or different from the monofunctional (meth) acrylate compound contained in the second composition.
  • the first composition comprises a monofunctional (meth) acrylate compound.
  • the second composition comprises a polyfunctional (meth) acrylate compound.
  • the third composition comprises a monofunctional (meth) acrylate compound.
  • a (meth) acrylate compound having an epoxy group is regarded as a (meth) acrylate compound, not an epoxy compound. Only one kind of the monofunctional (meth) acrylate compound and the polyfunctional (meth) acrylate compound may be used, or two or more kinds thereof may be used in combination.
  • Examples of the monofunctional (meth) acrylate compound include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, i-propyl (meth) acrylate, n-butyl (meth) acrylate, and i-.
  • the polyfunctional (meth) acrylate compound may be a bifunctional (meth) acrylate compound, a trifunctional (meth) acrylate compound, or a tetrafunctional or higher functional (meth) acrylate compound. You may.
  • bifunctional (meth) acrylate compound examples include 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonandi (meth) acrylate, and 1, 10-decanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 2,4-dimethyl-1,5-pentanediol di (meth) acrylate, butylethylpropanediol (meth) acrylate, ethoxylated cyclohexanemethanol Di (meth) acrylate, polyethylene glycol di (meth) acrylate, oligoethylene glycol di (meth) acrylate, ethylene glycol di (meth) acrylate, 2-ethyl-2-butylbutanediol di (meth) acrylate, 2-ethyl- Examples thereof include 2-butyl
  • trifunctional (meth) acrylate compound examples include trimethylolpropane tri (meth) acrylate, trimethylolethane tri (meth) acrylate, alkylene oxide-modified tri (meth) acrylate of trimethylolpropane, and pentaerythritol tri (meth).
  • tetrafunctional (meth) acrylate compound examples include pentaerythritol tetra (meth) acrylate, sorbitol tetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, and dipentaerythritol tetra (meth) acrylate propionate. Can be mentioned.
  • pentafunctional (meth) acrylate compound examples include sorbitol penta (meth) acrylate and dipentaerythritol penta (meth) acrylate.
  • hexafunctional (meth) acrylate compound examples include dipentaerythritol hexa (meth) acrylate, sorbitol hexa (meth) acrylate, and phosphazene alkylene oxide-modified hexa (meth) acrylate.
  • Examples of the (meth) acrylate compound having an epoxy group include glycidyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate glycidyl ether.
  • the glass transition temperatures of the homopolymers of the monofunctional (meth) acrylate compounds contained in the first composition and the third composition are respectively. It is preferably ⁇ 100 ° C. or higher, more preferably ⁇ 90 ° C. or higher, preferably less than 0 ° C., and more preferably ⁇ 10 ° C. or lower.
  • the glass transition temperature of the homopolymer of the polyfunctional (meth) acrylate compound contained in the second composition is preferably 50 ° C. or higher. It is more preferably 80 ° C. or higher, preferably 200 ° C. or lower, and more preferably 180 ° C. or lower.
  • the polymerization method is not particularly limited.
  • the homopolymer can be obtained by homopolymerizing the monofunctional (meth) acrylate compound or the polyfunctional (meth) acrylate compound by a known method.
  • all the above monofunctional (meth) acrylate compounds or all the above polyfunctional (meth) acrylate compounds may be polymerized at one time, and the above monofunctional (meth) acrylate compound or the above polyfunctionality may be polymerized at once.
  • the (meth) acrylate compound of the above may be sequentially added and polymerized.
  • the glass transition temperature can be measured in accordance with JIS-K7121 under the condition of a heating rate of 10 ° C./min using a differential scanning calorimeter.
  • Examples of the differential scanning calorimeter include "DSC7020" manufactured by Hitachi High-Tech Science Corporation.
  • the monofunctional (meth) acrylate compounds contained in the first composition and the third composition each have an ester structure of an acrylic acid structure portion. It is preferable that the compound has a group having 4 or more carbon atoms bonded to the oxygen atom constituting the above.
  • the group having 4 or more carbon atoms may be a group having a branched structure or a group having no branched structure (a group having a linear structure).
  • the monofunctional (meth) acrylate compound contained in the first composition and the third composition may be isodecyl acrylate, isononyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, or dodecyl acrylate, respectively. preferable.
  • These monofunctional (meth) acrylate compounds are compounds in which a group having 4 or more carbon atoms is bonded to an oxygen atom constituting the ester structure of the acrylic acid structure portion.
  • the polyfunctional (meth) acrylate compound contained in the second composition is a bifunctional or trifunctional (meth) acrylate compound. Is preferable.
  • the polyfunctional (meth) acrylate compound contained in the second composition is trimethylolpropane triacrylate, 1,6-hexanediol di. It is preferably acrylate or dicyclopentenyl dimethanol diacrylate.
  • the content of the monofunctional (meth) acrylate compound in 100% by weight of the first composition or 100% by weight of the third composition is preferably 5% by weight or more, more preferably 10% by weight. % Or more, preferably 95% by weight or less, more preferably 90% by weight or less.
  • the content of the monofunctional (meth) acrylate compound is not less than the above lower limit and not more than the above upper limit, the effect of the present invention can be exhibited even more effectively.
  • the content of the polyfunctional (meth) acrylate compound in 100% by weight of the first composition is preferably 0. It is 1% by weight or more, more preferably 0.5% by weight or more, preferably 50% by weight or less, and more preferably 30% by weight or less.
  • the third composition contains the polyfunctional (meth) acrylate compound
  • the content of the polyfunctional (meth) acrylate compound in 100% by weight of the third composition is preferably 0. It is 1% by weight or more, more preferably 0.5% by weight or more, preferably 50% by weight or less, and more preferably 30% by weight or less.
  • the content of the polyfunctional (meth) acrylate compound in 100% by weight of the second composition is preferably 10% by weight or more, more preferably 20% by weight or more, preferably 99% by weight or less, more preferably 99% by weight or less. It is 90% by weight or less.
  • the content of the polyfunctional (meth) acrylate compound is not less than the above lower limit and not more than the above upper limit, the effect of the present invention can be exhibited even more effectively.
  • the content of the monofunctional (meth) acrylate compound in 100% by weight of the second composition is preferably 0. It is 1% by weight or more, more preferably 0.5% by weight or more, preferably 50% by weight or less, and more preferably 30% by weight or less.
  • the content of the monofunctional (meth) acrylate compound is not less than the above lower limit and not more than the above upper limit, the effect of the present invention can be exhibited even more effectively.
  • the content of the polyfunctional (meth) acrylate compound in 100% by weight of the first composition is the second composition. It is preferably less than the content of the polyfunctional (meth) acrylate compound in 100% by weight of the composition.
  • the third composition contains the polyfunctional (meth) acrylate compound
  • the content of the polyfunctional (meth) acrylate compound in 100% by weight of the third composition is the second composition. It is preferably less than the content of the polyfunctional (meth) acrylate compound in 100% by weight of the composition. In this case, the effect of the present invention can be exhibited even more effectively.
  • the content of the monofunctional (meth) acrylate compound in 100% by weight of the second composition is the above-mentioned first. It is preferably less than the content of the monofunctional (meth) acrylate compound in 100% by weight of the composition.
  • the content of the monofunctional (meth) acrylate compound in 100% by weight of the second composition is the third It is preferably less than the content of the monofunctional (meth) acrylate compound in 100% by weight of the composition. In this case, the effect of the present invention can be exhibited even more effectively.
  • the first composition contains an epoxy compound.
  • the second composition contains an epoxy compound.
  • the third composition contains an epoxy compound.
  • the epoxy compound contained in the first composition, the epoxy compound contained in the second composition, and the epoxy compound contained in the third composition may be the same or different from each other. May be good. Only one type of each of the above epoxy compounds may be used, or two or more types may be used in combination.
  • Examples of the epoxy compound include bisphenol A type epoxy compound, bisphenol F type epoxy compound, bisphenol S type epoxy compound, phenol novolac type epoxy compound, biphenyl type epoxy compound, biphenyl novolac type epoxy compound, biphenol type epoxy compound, and naphthalene type epoxy compound.
  • Examples thereof include epoxy compounds and epoxy compounds having a triazine nucleus as a skeleton.
  • the epoxy compounds contained in the first composition and the third composition are bisphenol A type epoxy compounds or dicyclopentadiene type epoxy compounds, respectively. Is preferable.
  • the epoxy compound contained in the second composition is preferably a bisphenol A type epoxy compound or a dicyclopentadiene type epoxy compound.
  • the content of the epoxy compound in 100% by weight of the first composition or 100% by weight of the third composition is preferably 0.1% by weight or more, more preferably 1% by weight or more, preferably 1% by weight or more. Is 90% by weight or less, more preferably 70% by weight or less.
  • the content of the epoxy compound is not less than the above lower limit and not more than the above upper limit, the effect of the present invention can be exhibited even more effectively.
  • the content of the epoxy compound in 100% by weight of the second composition is preferably 0.1% by weight or more, more preferably 1% by weight or more, preferably 90% by weight or less, and more preferably 70% by weight or less. Is. When the content of the epoxy compound is not less than the above lower limit and not more than the above upper limit, the effect of the present invention can be exhibited even more effectively.
  • the first composition contains a photopolymerization initiator.
  • the second composition contains a photopolymerization initiator.
  • the third composition contains a photopolymerization initiator.
  • the photopolymerization initiator contained in the first composition, the photopolymerization initiator contained in the second composition, and the photopolymerization initiator contained in the third composition are the same. May be different. Only one kind of the photopolymerization initiator may be used, or two or more kinds thereof may be used in combination.
  • the photopolymerization initiator examples include a photoradical polymerization initiator and a photocationic polymerization initiator.
  • the photopolymerization initiator is preferably a photoradical polymerization initiator. Only one kind of the photopolymerization initiator may be used, or two or more kinds thereof may be used in combination.
  • the photoradical polymerization initiator is a compound for initiating a radical polymerization reaction by generating radicals by irradiation with light.
  • the photoradical polymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; and alkylphenone compounds such as 2-hydroxy-2-methyl-1-phenyl-propan-1-one; Acetphenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone; 2-methyl-1- [4- (methylthio) phenyl]- 2-Molholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butane-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinopheny
  • Aminoacetophenone compounds such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butyl anthraquinone; 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropyl Thioxanthone compounds such as thioxanthone; Ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal; acylphos such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide.
  • a photopolymerization initiator may be used together with the photoradical polymerization initiator.
  • the photopolymerization initiator include N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, triethanolamine and the like.
  • Other photopolymerization initiators may be used.
  • the photopolymerization initiator only one kind may be used, or two or more kinds may be used in combination.
  • a titanocene compound such as CGI-784 (manufactured by Ciba Specialty Chemicals), which absorbs in the visible light region, may be used to promote the photoreaction.
  • photocationic polymerization initiator examples include sulfonium salts, iodonium salts, metallocene compounds, benzointosilates and the like. Only one kind of the photocationic polymerization initiator may be used, or two or more kinds thereof may be used in combination.
  • the content of the photopolymerization initiator in 100% by weight of the first composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 30% by weight or less, more preferably. It is 20% by weight or less.
  • the content of the photopolymerization initiator in 100% by weight of the second composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 30% by weight or less, more preferably. It is 20% by weight or less.
  • the content of the photopolymerization initiator in 100% by weight of the third composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 30% by weight or less, more preferably. It is 20% by weight or less.
  • the first composition contains a thermosetting agent.
  • the second composition contains a thermosetting agent.
  • the third composition contains a thermosetting agent.
  • the thermosetting agent contained in the first composition, the thermosetting agent contained in the second composition, and the thermosetting agent contained in the third composition may be the same. It may be different. Only one type of the thermosetting agent may be used, or two or more types may be used in combination.
  • heat-curing agent examples include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfid compounds, acid anhydrides and the like.
  • thermosetting agent a modified polyamine compound such as amine-epoxy adduct may be used. Thermosetting agents other than these may be used.
  • the amine compound means a compound having one or more primary to tertiary amino groups.
  • the amine compound include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, hydrazides, and guanidine derivatives.
  • an epoxy compound-added polyamine a reaction product of an epoxy compound and a polyamine
  • a Michael-added polyamine a reaction product of an ⁇ , ⁇ -unsaturated ketone and a polyamine
  • a Mannig-added polyamine a condensation of a polyamine and a formalin and a phenol.
  • thiourea-added polyamines reactants of thiourea and polyamines
  • ketone-blocking polyamines reactions of ketone compounds and polyamines [ketimine]
  • other adducts may be used.
  • aliphatic polyamine examples include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, diethylaminopropylamine and the like.
  • alicyclic polyamine examples include mensendiamine, isophoronediamine, N-aminoethylpiperazine, 3,9-bis (3-aminopropyl) -2,4,8,10-tetraoxaspiro (5,5) undecane.
  • Adduct, bis (4-amino-3-methylcyclohexyl) methane, bis (4-aminocyclohexyl) methane and the like can be mentioned.
  • aromatic polyamine examples include m-phenylenediamine, p-phenylenediamine, o-xylene diamine, m-xylene diamine, p-xylene diamine, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylpropane, and 4,4.
  • hydrazide examples include carbodihydrazide, adipic acid dihydrazide, sebacic acid dihydrazide, dodecane diacid dihydrazide, and isophthalic acid dihydrazide.
  • guanidine derivative examples include dicyandiamide, 1-o-tolyldiguanide, ⁇ -2,5-dimethylguanide, ⁇ , ⁇ -diphenyldiguanide, ⁇ , ⁇ -bisguanylguanidinodiphenyl ether, p-chlorophenyldiguanide, ⁇ , ⁇ . -Hexamethylenebis [ ⁇ - (p-chlorophenol)] diguanide, phenyldiguanidooxalate, acetylguanidine, diethylcyanoacetylguanidine and the like can be mentioned.
  • Examples of the phenol compound include a multivalent phenol compound and the like.
  • Examples of the polyhydric phenol compound include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabrom bisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, naphthalene skeleton-containing phenol novolac resin, and the like.
  • examples thereof include a xylylene skeleton-containing phenol novolac resin, a dicyclopentadiene skeleton-containing phenol novolac resin, and a fluorene skeleton-containing phenol novolac resin.
  • Examples of the acid anhydride include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecyl anhydride, chlorendic anhydride, and pyromellitic anhydride.
  • Examples thereof include benzophenone tetracarboxylic acid anhydride, methylcyclohexene tetracarboxylic acid anhydride, trimellitic anhydride, polyazelineic acid anhydride and the like.
  • the content of the thermosetting agent in 100% by weight of the first composition is preferably 0.1% by weight or more, more preferably 1% by weight or more, preferably 50% by weight or less, and more preferably 40% by weight. It is as follows.
  • the content of the thermosetting agent in 100% by weight of the second composition is preferably 0.1% by weight or more, more preferably 1% by weight or more, preferably 50% by weight or less, and more preferably 40% by weight. It is as follows.
  • the content of the thermosetting agent in 100% by weight of the third composition is preferably 0.1% by weight or more, more preferably 1% by weight or more, preferably 50% by weight or less, and more preferably 40% by weight. It is as follows.
  • the first composition may or may not contain a curing accelerator.
  • the second composition may or may not contain a curing accelerator.
  • the third composition may or may not contain a curing accelerator.
  • the curing accelerator contained in the first composition, the curing accelerator contained in the second composition, and the curing accelerator contained in the third composition may be the same. It may be different. Only one type of the curing accelerator may be used, or two or more types may be used in combination.
  • curing accelerator examples include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organic metal salts, phosphorus compounds, urea compounds and the like.
  • the content of the curing accelerator in 100% by weight of the first composition is preferably 0.01% by weight or more, more preferably 0. It is 1% by weight or more, preferably 10% by weight or less, and more preferably 8% by weight or less.
  • the content of the curing accelerator in 100% by weight of the second composition is preferably 0.01% by weight or more, more preferably 0. It is 1% by weight or more, preferably 10% by weight or less, and more preferably 8% by weight or less.
  • the content of the curing accelerator in 100% by weight of the third composition is preferably 0.01% by weight or more, more preferably 0. It is 1% by weight or more, preferably 10% by weight or less, and more preferably 8% by weight or less.
  • the first composition may or may not contain a solvent.
  • the second composition may or may not contain a solvent.
  • the third composition may or may not contain a solvent.
  • the solvent contained in the first composition, the solvent contained in the second composition, and the solvent contained in the third composition may be the same or different from each other. Only one type of the solvent may be used, or two or more types may be used in combination.
  • Examples of the solvent include water and organic solvents.
  • the solvent is preferably an organic solvent.
  • organic solvent examples include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone and cyclohexanone, aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene, cellosolve, methyl cellosolve, butyl cellosolve, carbitol and methylcarbitol.
  • alcohols such as ethanol
  • ketones such as acetone, methyl ethyl ketone and cyclohexanone
  • aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene
  • cellosolve methyl cellosolve
  • butyl cellosolve carbitol and methylcarbitol.
  • Butyl carbitol propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, tripropylene glycol monomethyl ether and other glycol ethers, ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol.
  • the content of the solvent in 100% by weight of the first composition is preferably 5% by weight or less, more preferably 1% by weight or less, still more preferably. It is 0.5% by weight or less. Most preferably, the first composition does not contain the solvent.
  • the content of the solvent in 100% by weight of the second composition is preferably 5% by weight or less, more preferably 1% by weight or less, still more preferably. It is 0.5% by weight or less. Most preferably, the second composition does not contain the solvent.
  • the content of the solvent in 100% by weight of the third composition is preferably 5% by weight or less, more preferably 1% by weight or less, still more preferably. It is 0.5% by weight or less. Most preferably, the third composition does not contain the solvent.
  • the first composition may or may not contain a filler.
  • the second composition may or may not contain a filler.
  • the third composition may or may not contain a filler.
  • the filler contained in the first composition, the filler contained in the second composition, and the filler contained in the third composition may be the same or different from each other. Only one type of the filler may be used, or two or more types may be used in combination.
  • the cured product layer (photo-cured product layer or light and thermosetting material layer) of the first composition From the viewpoint of further improving the thickness accuracy of the cured product layer (photo-cured product layer or light and thermosetting material layer) of the first composition, and further making it more difficult for voids to occur in the cured product layer of the first composition.
  • the smaller the content of the filler in the first composition the better. Further, the smaller the content of the filler in the first composition, the more the occurrence of ejection defects by the inkjet device can be suppressed.
  • the cured product layer (photo-cured product layer or light and thermosetting material layer) of the second composition From the viewpoint of further improving the thickness accuracy of the cured product layer (photo-cured product layer or light and thermosetting material layer) of the second composition, and further making it more difficult for voids to occur in the cured product layer of the second composition.
  • the smaller the content of the filler in the second composition the better. Further, the smaller the content of the filler in the second composition, the more the occurrence of ejection defects by the inkjet device can be suppressed.
  • the cured product layer (photo-cured product layer or light and thermosetting material layer) of the third composition From the viewpoint of further improving the thickness accuracy of the cured product layer (photo-cured product layer or light and thermosetting material layer) of the third composition, and further making it more difficult for voids to occur in the cured product layer of the third composition.
  • the smaller the content of the filler in the third composition the better. Further, the smaller the content of the filler in the third composition, the more the occurrence of ejection defects by the inkjet device can be suppressed.
  • filler examples include silica, talcite, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.
  • the content of the filler in 100% by weight of the first composition is preferably 30% by weight or less, more preferably 10% by weight or less, still more preferably. It is 1% by weight or less. Most preferably, the first composition does not contain the filler.
  • the content of the filler in 100% by weight of the second composition is preferably 30% by weight or less, more preferably 10% by weight or less, still more preferably. It is 1% by weight or less. Most preferably, the second composition does not contain the filler.
  • the content of the filler in 100% by weight of the third composition is preferably 30% by weight or less, more preferably 10% by weight or less, still more preferably. It is 1% by weight or less. Most preferably, the third composition does not contain the filler.
  • the first composition, the second composition, and the third composition may each contain other components.
  • the other components are not particularly limited, and examples thereof include adhesive aids such as coupling agents, pigments, dyes, leveling agents, antifoaming agents, and polymerization inhibitors.
  • the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention can enhance the leakage prevention property of the material, and are therefore suitable for forming a partition wall material and a dam material in electronic parts. Can be used for.
  • the method for producing a laminated structure, the laminated structure, and the composition set for inkjet according to the present invention can be used for other purposes.
  • the first layer and the second layer may be used to form a coating agent.
  • FIG. 14 is a cross-sectional view showing an electronic component obtained by using the laminated structure according to the first embodiment of the present invention.
  • 14 (a) is a plan view of the electronic component
  • FIG. 14 (b) is a cross-sectional view taken along the line II in FIG. 14 (a).
  • the electronic component 80 includes a laminated structure 4C.
  • the laminated structure 4C includes a first base material 3, a first light and thermosetting layer (first layer) 1B, a second light and thermosetting layer (second layer) 2B, and the like. It includes an underfill material 60, a solder ball 65, and a semiconductor chip 70.
  • the first light and thermosetting layer 1B is formed by photocuring and thermosetting the first composition.
  • the second light and thermosetting layer 2B is formed by photocuring and thermosetting the second composition.
  • the first light and thermosetting material layer 1B and the second light and thermosetting material layer 2B are arranged in a frame shape.
  • the underfill material 60, the solder balls 65, and the semiconductor chip 70 are arranged inside the frame-shaped region.
  • the electronic component 80 can be obtained by pouring the underfill material 60 into the inside of the frame-shaped region.
  • the underfill material 60 is poured into and after the underfill material 60 is poured into the frame-shaped region. 60 does not easily leak to the outside of the frame-shaped area.
  • TMPTA Trimethylolpropane triacrylate
  • HDDA 1,6-Hexanediol diacrylate
  • Aromatic amine compound (“EH-105L” manufactured by ADEKA Corporation)
  • Inkjet device A stage having a vacuum suction function, a first discharge unit, a second discharge unit, and a first ultraviolet irradiation unit (LED) arranged between the first discharge unit and the second discharge unit.
  • An inkjet device having the above was prepared.
  • Examples 1 to 8 and Comparative Examples 1 to 3 Preparation of the first composition: The components shown in Tables 1 to 3 were blended in the blending amounts shown in Tables 1 to 3 to obtain the first composition.
  • Preparation of the second composition The components shown in Tables 1 to 3 were blended in the blending amounts shown in Tables 1 to 3 to obtain a second composition.
  • the silicon wafer was adsorbed on the stage and fixed.
  • the first composition was discharged from the first discharge section.
  • the first composition was photocured by irradiating the first ultraviolet irradiation unit with ultraviolet rays having a wavelength of 365 nm for 0.2 seconds at an illuminance of 2000 mW / cm 2.
  • a first layer (photocured product layer) having a linear shape having a width of 150 ⁇ m, a length of 10 mm, and a thickness of 3 ⁇ m was formed.
  • the second composition was discharged from the second discharge portion on the surface of the first layer (photo-cured product layer).
  • the second composition was photocured by irradiating the first ultraviolet irradiation unit with ultraviolet rays having a wavelength of 365 nm for 0.2 seconds at an illuminance of 2000 mW / cm 2.
  • a second layer (photo-cured product layer) having a linear shape having a width of 150 ⁇ m, a length of 10 mm, and a thickness of 100 ⁇ m is placed on the surface of the first layer (photo-cured product layer).
  • a second layer (photo-cured product layer) having a linear shape having a width of 150 ⁇ m, a length of 10 mm, and a thickness of 100 ⁇ m is placed on the surface of the first layer (photo-cured product layer).
  • a laminated structure (X) including a base material (silicon wafer), a first layer (photo-cured product layer), and a second layer (photo-cured product layer) in this order was obtained.
  • Example 5 a first layer (photocured product layer) having a linear shape having a width of 300 ⁇ m, a length of 10 mm, and a thickness of 3 ⁇ m is formed, and a linear shape having a width of 300 ⁇ m, a length of 10 mm, and a thickness of 100 ⁇ m is formed. Two layers (photo-cured product layer) were formed.
  • Example 6 a first layer (photocured material layer) having a linear shape having a width of 150 ⁇ m, a length of 10 mm, and a thickness of 3 ⁇ m is formed, and a linear shape having a width of 150 ⁇ m, a length of 10 mm, and a thickness of 200 ⁇ m is formed. Two layers (photo-cured product layer) were formed.
  • Example 7 a first layer (photocured product layer) having a linear shape having a width of 150 ⁇ m, a length of 10 mm, and a thickness of 5 ⁇ m is formed, and a linear shape having a width of 150 ⁇ m, a length of 10 mm, and a thickness of 100 ⁇ m is formed. Two layers (photo-cured product layer) were formed.
  • Example 8 a first layer (photocured product layer) having a linear shape having a width of 150 ⁇ m, a length of 10 mm, and a thickness of 5 ⁇ m is formed, and a linear shape having a width of 150 ⁇ m, a length of 10 mm, and a thickness of 200 ⁇ m is formed. Two layers (photo-cured product layer) were formed.
  • the silicon wafer was adsorbed on the stage and fixed.
  • the first composition was discharged from the first discharge section.
  • the first composition was photocured by irradiating the first ultraviolet irradiation unit with ultraviolet rays having a wavelength of 365 nm for 0.2 seconds at an illuminance of 2000 mW / cm 2.
  • a first layer (photocured product layer) having a linear shape having a width of 150 ⁇ m, a length of 10 mm, and a thickness of 103 ⁇ m was formed. This was designated as a laminated structure (X) provided with a photocurable material layer.
  • the silicon wafer was adsorbed on the stage and fixed.
  • the second composition was discharged from the second discharge section. After 0.1 seconds from the discharge, the second composition was photocured by irradiating the first ultraviolet irradiation unit with ultraviolet rays having a wavelength of 365 nm for 0.2 seconds at an illuminance of 2000 mW / cm 2.
  • a second layer photocured product layer having a linear shape having a width of 150 ⁇ m, a length of 10 mm, and a thickness of 103 ⁇ m was formed. This was designated as a laminated structure (X) provided with a photocurable material layer.
  • the width and thickness of the first layer (photo-cured product layer) and the second layer (photo-cured product layer) in the laminated structure (X) are determined by a laser microscope (“OLS4100” manufactured by Olympus Corporation”. ) was used for measurement. In Examples 1 to 8, the shape of the photocurable product layer was retained.
  • laminated structure (X) including light and thermosetting material layer Fabrication of laminated structure (X) including light and thermosetting material layer: The first and second layers (photo-cured product layer) in the obtained laminated structure (X) including the photo-cured product layer are heat-cured by heating at 170 ° C. for 1 hour, and the light and thermosetting product layer are heat-cured. The first and second layers were obtained. In this way, a laminated structure (X) including a base material (silicon wafer), a first layer (light and thermosetting layer), and a second layer (light and thermosetting layer) is obtained. rice field.
  • the first layer (light and thermosetting layer) and the second layer (light and thermosetting layer) in the obtained laminated structure (X) are subjected to a cross-section polishing device (“Teglamin 25” manufactured by Struas). I cut it.
  • An optical microscope Keyence “Digital Microscope VH-Z100" shows the cross sections of the first layer (light and thermocured product layer) and the second layer (light and thermocured product layer) obtained by cutting. The thickness of the first layer and the thickness of the second layer were measured by observing with.
  • the second composition was discharged from the second discharge unit (in Comparative Example 4, the first composition was discharged from the first discharge unit). After 0.1 seconds from the discharge, the second composition was photocured by irradiating the first ultraviolet irradiation unit with ultraviolet rays having a wavelength of 365 nm for 0.2 seconds at an illuminance of 2000 mW / cm 2. By repeating the coating and the irradiation with ultraviolet rays, a second layer (photocurable material layer) having a shape having a width of 10 mm, a length of 10 mm, and a thickness of 20 ⁇ m was formed.
  • silica powder (“Sea Horster KE-P250” manufactured by Nippon Shokubai Co., Ltd.) was placed on the surface of the photocurable material layer, and nitrogen was sprayed on the surface of the photocurable material layer at 400 L / min for 10 seconds. The amount of silica powder remaining on the surface of the photocured material layer was measured.
  • a silicon wafer was adsorbed and fixed on the stage.
  • the first composition was discharged from the first discharge section. After 0.1 seconds from the discharge, the first composition was photocured by irradiating the first ultraviolet irradiation unit with ultraviolet rays having a wavelength of 365 nm for 0.2 seconds at an illuminance of 2000 mW / cm 2.
  • a first layer photocurable material layer having a square frame shape having a width of 150 ⁇ m, a side length of 10 mm, and a thickness of 3 ⁇ m was formed.
  • the second composition was discharged from the second discharge portion on the surface of the first layer (photo-cured product layer).
  • the second composition was photocured by irradiating the first ultraviolet irradiation unit with ultraviolet rays having a wavelength of 365 nm for 0.2 seconds at an illuminance of 2000 mW / cm 2.
  • a second layer having a square frame shape having a width of 150 ⁇ m, a side length of 10 mm, and a thickness of 100 ⁇ m is formed on the surface of the first layer (photocured product layer).
  • a photocured product layer) was formed.
  • first and second layers were heat-cured by heating at 170 ° C. for 1 hour to obtain first and second layers which are light and thermosetting product layers.
  • first and second layers which are light and thermosetting product layers.
  • a laminated structure including a base material (silicon wafer), a first layer (light and thermosetting layer), and a second layer (light and thermosetting layer) was obtained.
  • Preparation of material X The following components were mixed with a planetary stirrer, and the obtained mixture was dispersed and treated with three rolls to obtain Material X.
  • Bisphenol F type epoxy resin (“EPICLON830” manufactured by DIC) 70 parts by weight Reactive diluent (“ED-529” manufactured by ADEKA) 30 parts by weight Thermosetting agent (“EH105L” manufactured by ADEKA) 30 parts by weight Molten silica ( Admatex “SO-C5") 300 parts by weight Coupling agent (JNC “S510”) 3 parts by weight Carbon black (Mitsubishi Chemical "MA-600”) 0.5 parts by weight
  • the obtained material X is filled inside a light and thermosetting layer (a laminate of a first layer and a second layer) having a square frame shape so as to have a thickness of 50 ⁇ m, and 150 Material X was thermoset by heating at ° C. for 1 hour.
  • Comparative Example 4 after forming a first layer (photocured material layer) having a square frame shape having a width of 150 ⁇ m, a side length of 10 mm, and a thickness of 103 ⁇ m on a silicon wafer, the first layer was formed.
  • the evaluation was carried out in the same manner as above, except that the layer (photocurable material layer) was heat-cured by heating at 170 ° C. for 1 hour to obtain a first layer which is a light and thermosetting material layer. rice field.
  • Comparative Example 5 after forming a second layer (photocured product layer) having a square frame shape having a width of 150 ⁇ m, a side length of 10 mm, and a thickness of 103 ⁇ m on the silicon wafer, the second layer was formed.
  • the evaluation was carried out in the same manner as above, except that the layer (photo-cured product layer) was heat-cured by heating at 170 ° C. for 1 hour to obtain a second layer which is a light and thermosetting product layer. rice field.
  • Comparative Example 4 the shape of the light and the thermosetting layer (the laminate of the first layer and the second layer) changed during the thermosetting, and the thickness of the light and the thermosetting layer decreased to about 30 ⁇ m. Material X leaked to the outside of the light and thermosetting layer. Further, in Comparative Examples 1 to 3 and 5, since the adhesive force between the base material (silicon wafer) and the first layer or the adhesive force between the first layer and the second layer is low, the heat of the material X is low. Unable to withstand expansion, material X leaked to the outside of the light and thermosetting layer.
  • Example 9 to 14 Preparation of the first composition and the third composition: The components shown in Tables 4 and 5 were blended in the blending amounts shown in Tables 4 and 5 to obtain a first composition and a third composition.
  • Preparation of the second composition The components shown in Tables 4 and 5 were blended in the blending amounts shown in Tables 4 and 5 to obtain a second composition.
  • the silicon wafer was adsorbed on the stage and fixed.
  • the first composition was discharged from the first discharge section.
  • the first composition was photocured by irradiating the first ultraviolet irradiation unit with ultraviolet rays having a wavelength of 365 nm for 0.2 seconds at an illuminance of 2000 mW / cm 2.
  • a first layer photocurable material layer having a square frame shape having a width of 200 ⁇ m, a side length of 10 mm, and a thickness of 5 ⁇ m was formed.
  • the second composition was discharged from the second discharge portion on the surface of the first layer (photo-cured product layer).
  • the second composition was photocured by irradiating the first ultraviolet irradiation unit with ultraviolet rays having a wavelength of 365 nm for 0.2 seconds at an illuminance of 2000 mW / cm 2.
  • a second layer having a square frame shape having a width of 200 ⁇ m, a side length of 10 mm, and a thickness of 1000 ⁇ m is formed on the surface of the first layer (photocured product layer).
  • a photocured product layer) was formed.
  • the third composition (first composition) was discharged from the first discharge portion on the surface of the second layer (photocurable product layer). After 0.1 seconds from the discharge, the third composition was photocured by irradiating the first ultraviolet irradiation unit with ultraviolet rays having a wavelength of 365 nm for 0.2 seconds at an illuminance of 2000 mW / cm 2. By repeating the coating and irradiation with ultraviolet rays, a third layer (photocurable material layer) having a square frame shape having a width of 200 ⁇ m, a side length of 10 mm, and a thickness of 10 ⁇ m was formed.
  • a glass substrate was attached onto the surface of the third layer using a bonder (“FTD-7000P” manufactured by Shibaura Mechatronics Co., Ltd.), and heated at 170 ° C. for 1 hour to obtain the first layer (photocured product).
  • Layer), the second layer (photo-cured product layer) and the third layer (photo-cured product layer) were heat-cured.
  • the first base material silicon wafer
  • the first layer light and thermosetting layer
  • the second layer light and thermosetting layer
  • the third layer light
  • a thermosetting layer and a second base material (glass substrate) in this order to obtain a laminated structure (X).
  • Example 10 In Examples 10 and 11, the following operations were additionally performed, and a third layer (photocured product) having a square frame shape having a width of 200 ⁇ m, a side length of 10 mm, and a thickness of 5 ⁇ m was performed.
  • a laminated structure (X) was produced in the same manner as in Example 9 except that the layer) was formed.
  • the base material silicon wafer
  • the first layer photo-cured product layer
  • the second layer photo-cured product layer
  • the first layer (photo-cured product layer) and the second layer (photo-cured product layer) were thermally cured by heating the laminate with the layer) at 170 ° C. for 1 hour.
  • a flattening treatment was performed by cutting and polishing the surface of the second layer (light and thermosetting layer) by 100 ⁇ m using a flattening device (manufactured by Keylink).
  • the absolute value of the difference between the maximum height and the minimum height of the surface of the second layer after the flattening treatment was 3 ⁇ m or less.
  • the substrate silicon wafer
  • the first layer light and thermosetting layer
  • the second layer light and thermosetting layer
  • the third layer light and thermosetting.
  • Example 12 a laminated structure (X) was produced as follows.
  • the ceramic substrate was adsorbed on the stage and fixed.
  • the second composition was discharged from the second discharge section. After 0.1 seconds from the discharge, the second composition was photocured by irradiating the first ultraviolet irradiation unit with ultraviolet rays having a wavelength of 365 nm for 0.2 seconds at an illuminance of 2000 mW / cm 2.
  • a second layer photocurable layer having a square frame shape having a width of 200 ⁇ m, a side length of 10 mm, and a thickness of 1000 ⁇ m was formed on the surface of the base material.
  • the first composition was discharged from the first discharge portion on the surface of the second layer (photocurable product layer). After 0.1 seconds from the discharge, the first composition was photocured by irradiating the first ultraviolet irradiation unit with ultraviolet rays having a wavelength of 365 nm for 0.2 seconds at an illuminance of 2000 mW / cm 2. By repeating coating and irradiation with ultraviolet rays, a first layer having a square frame shape having a width of 200 ⁇ m, a side length of 10 mm, and a thickness of 10 ⁇ m on the surface of the second layer (photocured product layer) ( A photocured product layer) was formed.
  • a glass substrate was attached onto the surface of the first layer using a bonder (“FTD-7000P” manufactured by Shibaura Mechatronics Co., Ltd.), and heated at 170 ° C. for 1 hour to obtain the first layer (photocured product).
  • the layer) and the second layer (photocurable layer) were heat-cured.
  • Example 13 and 14 the following operations were additionally performed, and the first layer (photocured product) having a square frame shape having a width of 200 ⁇ m, a side length of 10 mm, and a thickness of 5 ⁇ m was performed.
  • a laminated structure (X) was produced in the same manner as in Example 12 except that the layer) was formed.
  • the laminate of the base material (ceramic substrate) and the second layer (photocurable material layer) is placed at 170 ° C.
  • the second layer (photocurable material layer) was thermoset by heating for 1 hour.
  • a flattening device manufactured by Keylink
  • the absolute value of the difference between the maximum height and the minimum height of the second layer after the flattening treatment was 3 ⁇ m or less.

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PCT/JP2021/003672 2020-02-04 2021-02-02 積層構造体の製造方法、積層構造体、及びインクジェット用組成物セット WO2021157555A1 (ja)

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JP2014055288A (ja) * 2012-08-13 2014-03-27 Sekisui Chem Co Ltd インクジェット用硬化性組成物及び電子部品の製造方法
JP2015110206A (ja) * 2013-11-06 2015-06-18 積水化学工業株式会社 硬化物膜の製造方法
JP2016204453A (ja) * 2015-04-17 2016-12-08 積水化学工業株式会社 インクジェット用組成物、半導体装置の製造方法、電子部品及び電子部品の製造方法

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TW201942144A (zh) 2018-03-30 2019-11-01 日商太陽油墨製造股份有限公司 噴墨印刷用硬化性組成物、其之硬化物、及具有該硬化物之電子零件

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2014055288A (ja) * 2012-08-13 2014-03-27 Sekisui Chem Co Ltd インクジェット用硬化性組成物及び電子部品の製造方法
JP2015110206A (ja) * 2013-11-06 2015-06-18 積水化学工業株式会社 硬化物膜の製造方法
JP2016204453A (ja) * 2015-04-17 2016-12-08 積水化学工業株式会社 インクジェット用組成物、半導体装置の製造方法、電子部品及び電子部品の製造方法

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