WO2021149727A1 - Composition de résine d'étanchéité, dispositif à composants électroniques et procédé de fabrication de dispositif à composants électroniques - Google Patents

Composition de résine d'étanchéité, dispositif à composants électroniques et procédé de fabrication de dispositif à composants électroniques Download PDF

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Publication number
WO2021149727A1
WO2021149727A1 PCT/JP2021/001867 JP2021001867W WO2021149727A1 WO 2021149727 A1 WO2021149727 A1 WO 2021149727A1 JP 2021001867 W JP2021001867 W JP 2021001867W WO 2021149727 A1 WO2021149727 A1 WO 2021149727A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
sealing resin
cured product
mass
compound
Prior art date
Application number
PCT/JP2021/001867
Other languages
English (en)
Japanese (ja)
Inventor
格 山浦
貴大 齋藤
圭一 春日
智博 池田
Original Assignee
昭和電工マテリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昭和電工マテリアルズ株式会社 filed Critical 昭和電工マテリアルズ株式会社
Priority to KR1020227024757A priority Critical patent/KR20220131239A/ko
Priority to JP2021572768A priority patent/JPWO2021149727A1/ja
Priority to CN202180010375.4A priority patent/CN115004357A/zh
Publication of WO2021149727A1 publication Critical patent/WO2021149727A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention concerne une composition de résine d'étanchéité destinée à être utilisée dans un boîtier de niveau de tranche, la composition de résine d'étanchéité contenant une résine époxy, un agent de durcissement et une charge inorganique, et étant telle que le module d'élasticité à 25 °C d'un produit durci de la composition de résine d'étanchéité est de 18 GPa ou moins.
PCT/JP2021/001867 2020-01-23 2021-01-20 Composition de résine d'étanchéité, dispositif à composants électroniques et procédé de fabrication de dispositif à composants électroniques WO2021149727A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020227024757A KR20220131239A (ko) 2020-01-23 2021-01-20 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
JP2021572768A JPWO2021149727A1 (fr) 2020-01-23 2021-01-20
CN202180010375.4A CN115004357A (zh) 2020-01-23 2021-01-20 密封用树脂组合物、电子零件装置及电子零件装置的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020009046 2020-01-23
JP2020-009046 2020-01-23

Publications (1)

Publication Number Publication Date
WO2021149727A1 true WO2021149727A1 (fr) 2021-07-29

Family

ID=76991775

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/001867 WO2021149727A1 (fr) 2020-01-23 2021-01-20 Composition de résine d'étanchéité, dispositif à composants électroniques et procédé de fabrication de dispositif à composants électroniques

Country Status (5)

Country Link
JP (1) JPWO2021149727A1 (fr)
KR (1) KR20220131239A (fr)
CN (1) CN115004357A (fr)
TW (1) TW202136467A (fr)
WO (1) WO2021149727A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017179279A (ja) * 2016-03-31 2017-10-05 味の素株式会社 樹脂組成物
JP2018002887A (ja) * 2016-07-01 2018-01-11 味の素株式会社 樹脂組成物
JP2018053092A (ja) * 2016-09-28 2018-04-05 味の素株式会社 樹脂組成物
JP2018133535A (ja) * 2017-02-17 2018-08-23 日立化成株式会社 Ｗｌｐ構造光半導体素子用封止材、ｗｌｐ、ｗｌｐ構造光半導体装置、光半導体装置の製造方法
JP2019029530A (ja) * 2017-07-31 2019-02-21 日立化成株式会社 光半導体装置及び携帯液晶バックライト

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5309415B2 (ja) 2005-03-03 2013-10-09 日立化成株式会社 封止用エポキシ樹脂成形材料及び電子部品装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017179279A (ja) * 2016-03-31 2017-10-05 味の素株式会社 樹脂組成物
JP2018002887A (ja) * 2016-07-01 2018-01-11 味の素株式会社 樹脂組成物
JP2018053092A (ja) * 2016-09-28 2018-04-05 味の素株式会社 樹脂組成物
JP2018133535A (ja) * 2017-02-17 2018-08-23 日立化成株式会社 Ｗｌｐ構造光半導体素子用封止材、ｗｌｐ、ｗｌｐ構造光半導体装置、光半導体装置の製造方法
JP2019029530A (ja) * 2017-07-31 2019-02-21 日立化成株式会社 光半導体装置及び携帯液晶バックライト

Also Published As

Publication number Publication date
KR20220131239A (ko) 2022-09-27
JPWO2021149727A1 (fr) 2021-07-29
TW202136467A (zh) 2021-10-01
CN115004357A (zh) 2022-09-02

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