WO2021143062A1 - 一种铜片内嵌式软磁粉芯电感及其制备方法和用途 - Google Patents

一种铜片内嵌式软磁粉芯电感及其制备方法和用途 Download PDF

Info

Publication number
WO2021143062A1
WO2021143062A1 PCT/CN2020/099228 CN2020099228W WO2021143062A1 WO 2021143062 A1 WO2021143062 A1 WO 2021143062A1 CN 2020099228 W CN2020099228 W CN 2020099228W WO 2021143062 A1 WO2021143062 A1 WO 2021143062A1
Authority
WO
WIPO (PCT)
Prior art keywords
soft magnetic
magnetic powder
copper sheet
core inductor
powder core
Prior art date
Application number
PCT/CN2020/099228
Other languages
English (en)
French (fr)
Inventor
张云帆
郭雄志
肖强
王国华
李懿轩
何恺
陈学敏
阮佳林
曹允开
李正平
Original Assignee
深圳市铂科新材料股份有限公司
惠州铂科磁材有限公司
惠州铂科实业有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市铂科新材料股份有限公司, 惠州铂科磁材有限公司, 惠州铂科实业有限公司 filed Critical 深圳市铂科新材料股份有限公司
Priority to US17/631,341 priority Critical patent/US20220293315A1/en
Priority to DE112020003316.3T priority patent/DE112020003316T5/de
Priority to JP2021507056A priority patent/JP2022520294A/ja
Publication of WO2021143062A1 publication Critical patent/WO2021143062A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147—Alloys characterised by their composition
    • H01F1/14708—Fe-Ni based alloys
    • H01F1/14733—Fe-Ni based alloys in the form of particles
    • H01F1/14741—Fe-Ni based alloys in the form of particles pressed, sintered or bonded together
    • H01F1/1475—Fe-Ni based alloys in the form of particles pressed, sintered or bonded together the particles being insulated
    • H01F1/14758—Fe-Ni based alloys in the form of particles pressed, sintered or bonded together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147—Alloys characterised by their composition
    • H01F1/14766—Fe-Si based alloys
    • H01F1/14791—Fe-Si-Al based alloys, e.g. Sendust
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/245—Magnetic cores made from sheets, e.g. grain-oriented
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/255—Magnetic cores made from particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H01F41/125—Other insulating structures; Insulating between coil and core, between different winding sections, around the coil

Definitions

  • the application belongs to the field of electronic technology, and relates to a copper chip embedded soft magnetic powder core inductor, and a preparation method and application thereof.
  • inductors In recent years, with the rapid development of semiconductor devices, the demand for inductors has evolved toward high efficiency, low inductance, miniaturization, and high current. Subsequently, the requirements for soft magnetic materials are low loss, high permeability and high saturation magnetic flux density. At present, common inductors include one-piece inductors and ferrite inductors.
  • the one-piece inductor is made by mixing metal magnetic powder and resin, and then integrally molded with the metal coil to make the inductor. It has the advantages of being able to cope with large currents and achieving miniaturization. However, due to its small pressing pressure, the metal powder occupies the The disadvantages such as small volume ratio make it difficult to obtain high magnetic permeability compared with ferrite inductors, which makes it difficult to achieve the required inductance. It is necessary to increase the inductance by increasing the coil, resulting in a larger inductance DCR , The copper loss is relatively large.
  • CN107768069A discloses an inductor and a manufacturing method thereof.
  • the manufacturing method of the inductor includes the following steps: S1, manufacturing a magnetic core, using granulated magnetic powder to press into a high-density block, and then cutting into a magnetic core structure, and sintering densely;
  • the magnetic core includes a center column and two leaf pendulums;
  • S3, compression molding fill a layer of the granulated magnetic powder at the bottom of the mold for pre-compacting, and then plant the magnetic core with the coil in step S2 Into the mold; after implantation, the granulated magnetic powder is filled in the mold for compression molding; S4, semi-finished product heat treatment; S5, terminal electrode production; the inductor obtained by this
  • CN107275045A discloses a method for manufacturing an inductor and a method for preparing a plastic packaging material, wherein the method for preparing the plastic packaging material includes mixing powder with a weight percentage of 60% to 90% and epoxy resin with a weight percentage of 10% to 40%. The resin is uniformly mixed, and then the mixed materials are pressed into a lump-shaped material, and placed in a refrigerated environment at -5 ⁇ 0°C, which is the plastic packaging material of the inductor.
  • the powder material is nickel-zinc ferrite powder and manganese-zinc ferrite.
  • the manufacturing method of the inductor includes welding and connecting the magnetic core of the enameled copper wire to the lead frame, and then using the aforementioned plastic packaging material
  • the inductor is manufactured by injection molding and packaging.
  • the inductor obtained by this solution has the problems of low magnetic flux density and large loss caused by the small specific gravity of soft magnetic powder and small molding pressure.
  • the purpose of this application is to provide a copper sheet embedded soft magnetic powder core inductor and a preparation method and application thereof.
  • the copper sheet embedded soft magnetic powder core inductor includes a copper sheet, and the surface of the copper sheet is covered with a soft magnetic material.
  • the interface between the soft magnetic material and the copper sheet contains an insulating resin material;
  • the copper sheet embedded soft magnetic powder core inductor has high density, high magnetic core permeability, high inductance, and high saturation magnetic flux density , Small size and less magnetic leakage, it can be used in low-voltage DC/DC converter circuits instead of ferrite inductors of the same inductance, which can achieve consistent or higher efficiency, and the inductor volume can be reduced by up to half.
  • the withstand voltage of the copper chip embedded soft magnetic powder core inductor described in this application can reach 15V or more, and the preparation method of the copper chip embedded soft magnetic powder core inductor described in this application is simple, has high generation efficiency, and is suitable for large-scale Automated manufacturing.
  • the present application provides a copper sheet embedded soft magnetic powder core inductor.
  • the copper sheet embedded soft magnetic powder core inductor includes a copper sheet, and the surface of the copper sheet is covered with a soft magnetic material.
  • the interface between the magnetic material and the copper sheet contains an insulating resin material.
  • the copper-chip embedded soft magnetic powder core inductor described in the present application has a high saturation magnetic flux density, can correspond to a large current (30A-100A), greatly reduces the volume of the inductor, and does not cause magnetic leakage problems caused by an open air gap.
  • the copper chip embedded soft magnetic powder core inductor described in the present application has the characteristics of high inductance. Compared with the traditional integrated inductor, it can reduce the number of windings, reduce the volume of the inductor, and reduce the inductance loss. Only one layer of copper can achieve the same level of inductance as ferrite inductance.
  • the two ends of the copper sheet are not covered by the soft magnetic material, and the two ends are any opposite ends.
  • the aspect ratio of the copper sheet is 8:1-10:1, such as 8.5:1, 9:1, or 9.5:1.
  • the insulating resin material includes a silicone resin material.
  • the silicone resin material mentioned here is a high temperature resistant silicone resin material, and the "high temperature resistant” refers to thermal stability at a temperature higher than 550°C, such as 560°C, 580°C, 600°C, or 650°C.
  • the high temperature resistant silicone resin material includes silicone resin REN 60.
  • the soft magnetic material is obtained by pressing metal soft magnetic powder.
  • the pressure of the compression molding is 12-18 T/cm 2 , for example, 13 T/cm 2 , 14 T/cm 2, 15 T/cm 2 , 16 T/cm 2 or 17 T/cm 2, etc.
  • the density of the soft magnetic material in the copper sheet embedded soft magnetic powder core inductor is 5.5-6.5 g/cm 3 , for example, 5.6 g/cm 3 , 5.7 g/cm 3 , 5.8 g/cm 3 , 5.9 g /cm 3 , 6.1g/cm 3 or 6.3g/cm 3 etc.
  • the copper-chip embedded soft magnetic powder core inductors described in this application have a higher density and saturation magnetic flux density, so that the copper-chip embedded soft magnetic powder core inductors can handle larger Electric current, and reduce the volume by more than 50%.
  • the covering areas of the soft magnetic material on both sides of the copper sheet are symmetrical to each other.
  • the soft magnetic material is symmetrically distributed on both sides of the copper sheet.
  • the symmetrical distribution here means that the length, width, and thickness of the soft magnetic material on both sides of the copper sheet are exactly the same, and the coverage area is also symmetrical with each other with the copper sheet as the symmetry plane.
  • the metallic soft magnetic powder includes any one or a combination of at least two of iron powder, iron silicon powder, sendust powder, iron nickel powder or iron nickel molybdenum powder, and the combination exemplarily includes The combination of iron powder and iron-silicon powder or the combination of iron-silicon-aluminum powder, iron-nickel powder and iron-nickel-molybdenum powder, etc.
  • the present application provides a method for preparing the copper-chip embedded soft magnetic powder core inductor as described in the first aspect, and the method includes the following steps:
  • step (2) The copper sheet coated with insulating resin material obtained in step (1) is placed in soft metal magnetic powder, pressed and molded, and annealed in an inert atmosphere to obtain the copper sheet embedded soft magnetic powder core inductor.
  • the preparation process of the copper sheet embedded soft magnetic powder core inductor described in this application firstly coats the surface of the copper sheet with an insulating resin material, and then presses it into metal soft magnetic powder, and then anneals; the copper sheet embedded soft magnetic powder core is obtained Inductors, in which the compression molding method can effectively increase the density of the prepared inductors and the volume ratio of magnetic materials, thereby increasing the permeability and inductance of the prepared copper embedded soft magnetic powder core inductors, and reducing winding coils Count, save copper loss.
  • the copper sheet has a built-in metal soft magnetic powder for compression, which helps reduce the volume of the inductor and reduce the leakage of magnetic flux.
  • the method described in the present application embeds the copper sheet in the metal soft magnetic powder body, and then presses it into a shape.
  • the preparation process is simple, which is beneficial to improve production efficiency and is suitable for large-scale automated production.
  • the insulating resin material in step (1) includes a silicone resin material.
  • the metallic soft magnetic powder in step (2) includes any one or a combination of at least two of iron powder, iron-silicon powder, iron-silicon-aluminum powder, iron-nickel powder or iron-nickel-molybdenum powder; the combination Exemplarily include a combination of iron powder and iron-silicon powder, or a combination of iron-silicon-aluminum powder, iron-nickel powder and iron-nickel-molybdenum powder.
  • the average particle size of the metallic soft magnetic powder in step (2) is 2-25 ⁇ m, for example, 5 ⁇ m, 8 ⁇ m, 10 ⁇ m, 15 ⁇ m, 20 ⁇ m, or 25 ⁇ m.
  • the pressure in step (2) of the press molding is 12-18T / cm 2, for example, 13T / cm 2, 14T / cm 2, 15T / cm 2, 16T / cm 2 or 17T / cm 2 and the like.
  • the annealing temperature in step (2) is 550-700°C, such as 580°C, 600°C, 620°C, 650°C, or 680°C.
  • the annealing time in step (2) is 1-3h, for example 1.5h, 2h or 2.5h.
  • the inert atmosphere is nitrogen.
  • the preparation method of the copper chip embedded soft magnetic powder core inductor includes the following steps:
  • step (2) The copper sheet coated with silicone resin material obtained in step (1) is placed in a soft metal magnetic powder with an average particle size of 10 ⁇ m, and molded under the condition of a pressure of 12 to 18 T/cm 2, The molded body is obtained, which is then placed in an annealing furnace and annealed at 550-700° C. under an inert atmosphere for 1-3 hours to obtain the copper sheet embedded soft magnetic powder core inductor.
  • the present application provides the use of the copper chip embedded soft magnetic powder core inductor as described in the first aspect, and the copper chip embedded soft magnetic powder core inductor is used in a low-voltage DC/DC converter circuit.
  • the copper sheet embedded soft magnetic powder core inductor of the present application includes a copper sheet, the surface of the copper sheet is covered with a soft magnetic material, and the interface between the soft magnetic material and the copper sheet contains an insulating resin material, Compared with traditional ferrite inductors, it has the advantages of high magnetic flux density, small size, and no magnetic leakage due to open air gaps;
  • the copper chip embedded soft magnetic powder core inductor described in this application is used in low-voltage DC/DC converter circuits. Compared with traditional ferrite inductors, it can achieve consistent or higher efficiency and reduce the volume It can reach more than half, and its withstand voltage can reach more than 15V;
  • the preparation method of the copper chip embedded soft magnetic powder core inductor described in the present application is simple, can significantly improve production efficiency, and is suitable for large-scale automated production.
  • FIG. 1 is a schematic diagram of the structure of the copper chip embedded soft magnetic powder core inductor of the present application.
  • the copper chip embedded soft magnetic powder core inductor includes a copper sheet.
  • the surface of the copper sheet is covered with a soft magnetic material, and the interface between the soft magnetic material and the copper sheet contains an insulating resin material; the soft material material is symmetrically distributed on both sides of the copper sheet, and both ends of the copper sheet are not The soft magnetic material is covered.
  • the area on the copper sheet that is not covered by the soft magnetic material is bent as shown in the figure.
  • the silicone resin REN 60 is evenly coated on the surface of a copper sheet with a thickness of 0.3mm and a width of 2.5mm, and is baked until it is cured;
  • step (2) Embed the copper sheet processed in step (1) in sendust magnetic powder with an average particle size of 15 ⁇ m and press molding at a pressure of 16 T/cm 2 to obtain a molded body.
  • the molded body is 14 mm long. The width is 5mm and the height is 2mm; after that, the formed body is placed in an annealing furnace and annealed at 680°C for 120 minutes in a nitrogen atmosphere to obtain a copper embedded soft magnetic powder core inductor.
  • the size of the molded body includes the size of the soft magnetic material and the size of the copper sheet located inside the soft magnetic material.
  • the silicone resin REN 60 is evenly coated on the surface of a copper sheet with a thickness of 0.25mm and a width of 2.5mm, and is baked until it is cured;
  • step (2) Embed the copper sheet processed in step (1) in sendust magnetic powder with an average particle size of 15 ⁇ m and press molding at a pressure of 12 T/cm 2 to obtain a molded body.
  • the molded body is 14 mm long. The width is 5mm and the height is 2mm; after that, the formed body is placed in an annealing furnace and annealed at 680°C for 120 minutes in a nitrogen atmosphere to obtain a copper embedded soft magnetic powder core inductor.
  • the silicone resin REN 60 is evenly coated on the surface of a copper sheet with a thickness of 0.3mm and a width of 2.7mm, and is baked until it is cured;
  • step (2) Embed the copper sheet processed in step (1) in sendust magnetic powder with an average particle size of 10 ⁇ m and press molding at a pressure of 18 T/cm 2 to obtain a molded body.
  • the molded body is 14 mm long. The width is 5mm and the height is 2mm; after that, the formed body is placed in an annealing furnace and annealed at 680°C for 120 minutes in a nitrogen atmosphere to obtain a copper embedded soft magnetic powder core inductor.
  • Embodiment 1 The difference between this embodiment and Embodiment 1 is that the annealing temperature is replaced from 680° C. to 550° C., and other conditions are completely the same as those of Embodiment 1.
  • Embodiment 1 The difference between this embodiment and Embodiment 1 is that the annealing temperature is replaced from 680° C. to 450° C., and other conditions are completely the same as those of Embodiment 1.
  • Embodiment 1 The difference between this embodiment and Embodiment 1 is that the annealing temperature is replaced from 680° C. to 800° C., and other conditions are completely the same as those of Embodiment 1.
  • Embodiment 1 The difference between this embodiment and Embodiment 1 is that the average particle size of the sendust magnetic powder in step (2) is replaced from 10 ⁇ m to 2 ⁇ m, and other conditions are completely the same as those of Embodiment 1.
  • Embodiment 1 The difference between this embodiment and Embodiment 1 is that the average particle size of the sendust magnetic powder in step (2) is replaced from 10 ⁇ m to 20 ⁇ m, and other conditions are completely the same as those of Embodiment 1.
  • This comparative example uses the same inductance ferrite inductor as in Example 1.
  • the size of the ferrite inductor is 14mm in length, 5mm in width, and 8mm in height; its preparation method is as follows: make groove 14mm ⁇ 5mm ⁇ 4mm Two pieces of ferrite, the groove depth is 1.7mm, the two pieces of ferrite are buckled up and down, and the copper piece is passed through the groove and bent to become the required ferrite inductor.
  • test conditions applied in the low-voltage DC/DC converter circuit are: frequency 700kHz, current 40A, voltage 1V;
  • the density of the copper chip embedded soft magnetic powder core inductor described in this application is between 5.5-6.5 g/cm 3 , and its density is significantly higher than that of the ferrite inductor in Comparative Example 1; and comparison It can be seen from Example 1 and Comparative Example 1 that under the same inductance condition, the volume of the copper embedded soft magnetic powder core inductor in Example 1 is about one-fourth of the volume of the ferrite inductor in Comparative Example 1. Moreover, the efficiency of the copper-chip embedded soft magnetic powder core inductor used in the low-voltage DC/DC converter circuit in Example 1 is slightly higher than that of the ferrite inductor in Comparative Example 1.

Abstract

本申请涉及一种铜片内嵌式软磁粉芯电感及其制备方法和用途，所述铜片内嵌式软磁粉芯电感包括铜片，所述铜片的表面覆盖有软磁材料，所述软磁材料与所述铜片的界面处含有绝缘树脂材料；所述铜片内嵌式软磁粉芯电感具有密度高、磁芯磁导率高、电感量高、饱和磁通密度高、体积小及漏磁少的特点，将其替代同样感量的铁氧体电感应用于低压DC/DC转化器电路中，其能获得一致或者更高的效率，同时电感体积减小可达一半以上，本申请所述铜片内嵌式软磁粉芯电感的耐压可达15V以上，且本申请所述铜片内嵌式软磁粉芯电感的制备方法简单，生产效率高，适于大规模自动化生产。

Description

一种铜片内嵌式软磁粉芯电感及其制备方法和用途 技术领域
本申请属于电子技术领域，涉及一种铜片内嵌式软磁粉芯电感及其制备方法和用途。
背景技术
近年来，随着半导体器件的高速化发展，电感器的需求朝着高效率、低感量、小型化、大电流化演变。随之而来，对软磁材料的要求是，低损耗、高磁导率以及高饱和磁通密度。目前，常见的电感包括一体成型电感和铁氧体电感。
其中，一体成型电感将金属磁性粉末和树脂混合炼制，然后与金属线圈一体成型制得电感器，其具有可应对大电流，同时实现小型化的优点，但由于其压制压力小、金属粉末占有体积比小等劣势，使得其与铁氧体电感器相比，很难获得高磁导率，从而难以达到所需的电感量，必须采用增加线圈的方式来提高感量，导致电感DCR较大，铜损较大。而铁氧体电感虽磁导率高，但饱和磁通密度小，需要开气隙防止饱和，从而导致漏磁等相关问题的出现，在使用过程中容易出现局部温升高、回路效率低的不良现象；此外，铁氧体电感的体积较大也成为限制其应用的关键因素之一。
CN107768069A公开了一种电感器及其制作方法，电感器的制作方法包括以下步骤：S1，制作磁芯，采用造粒磁粉压制成高密度块体，然后切削成磁芯结构，并且烧结致密；所述磁芯包括中柱和两个叶摆；S2，线圈绕制：将线圈绕制在所述中柱上，绕制后使得线圈的截面平行于所述电感器的长高平面，且线圈的两个引出端位于中柱的两侧，且处于同一平面上；S3，模压成型：在模具底部填一层所述造粒磁粉进行预压致密，然后将步骤S2中绕有线圈的磁芯植入 模具中；植入后在模具内填满所述造粒磁粉进行模压成型；S4，半成品热处理；S5，端电极制作；此方案所得电感存在压制压力小、热处理温度低导致的产品电感量低、磁通密度小、损耗大的问题。
CN107275045A公开了一种电感的制作方法、及其塑封材料的制备方法，其中其塑封材料的制备方法包括将重量百分比为60％～90％的粉料与重量百分比为10％～40％的环氧树脂均匀混合，再将混合的物料压制成团状物料，置于-5～0℃环境下冷藏，即为电感的塑封材料，其中粉料为镍锌铁氧体粉料、锰锌铁氧体粉料、铁硅铬粉料、铁硅铝粉料中的一种或几种；电感的制作方法，包括将绕好漆包铜线的磁芯焊接连接在引线框上，再采用前述塑封材料进行注塑封装，制作得到电感，此方案所得电感存在软磁粉末比重小、成型压力小导致的电感磁通密度小、损耗大的问题。
因此，开发一种饱和磁通密度高、电感量高、体积小，且适用于低压DC/DC转换器电路中具有高效率的电感仍具有重要意义。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请的目的在于提供一种铜片内嵌式软磁粉芯电感及其制备方法和用途，所述铜片内嵌式软磁粉芯电感包括铜片，所述铜片的表面覆盖有软磁材料，所述软磁材料与所述铜片的界面处含有绝缘树脂材料；所述铜片内嵌式软磁粉芯电感具有密度高、磁芯磁导率高、电感量高、饱和磁通密度高、体积小及漏磁少的特点，将其替代同样感量的铁氧体电感应用于低压DC/DC转化器电路中，其能获得一致或更高的效率，同时电感体积减小可达一半以上，本申请所述铜 片内嵌式软磁粉芯电感的耐压可达15V以上，且本申请所述铜片内嵌式软磁粉芯电感的制备方法简单，生成效率高，适于大规模自动化生产。
为达到此申请目的，本申请采用以下技术方案：
第一方面，本申请提供了一种铜片内嵌式软磁粉芯电感，所述铜片内嵌式软磁粉芯电感包括铜片，所述铜片的表面覆盖有软磁材料，所述软磁材料与所述铜片的界面处含有绝缘树脂材料。
本申请所述铜片内嵌式软磁粉芯电感具有高的饱和磁通密度，可对应大电流(30A-100A)，大幅缩小电感体积，同时不会出现因开气隙导致的漏磁问题。
本申请所述铜片内嵌式软磁粉芯电感具有电感量高的特点，与传统一体电感相比，可减少绕线圈数，缩小电感体积并降低电感损耗。仅使用一层铜片就可以达到铁氧体电感相同水平的电感量。
可选地，所述铜片的两端未被软磁材料覆盖，所述两端为任意相对的两端。
可选地，所述铜片的长宽比为8:1～10:1，例如8.5:1、9:1或9.5:1等。
可选地，所述绝缘树脂材料包括有机硅树脂材料。
此处所述有机硅树脂材料为耐高温有机硅树脂材料，所述“耐高温”指的是在高于550℃的温度下热稳定，例如560℃、580℃、600℃或650℃等。例如，所述耐高温有机硅树脂材料包括有机硅树脂
Figure PCTCN2020099228-appb-000001
REN 60。
可选地，所述软磁材料由金属软磁粉末压制成型得到。
可选地，所述压制成型的压力为12-18T/cm 2，例如13T/cm 2、14T/cm 2、15T/cm 2、16T/cm 2或17T/cm 2等。
可选地，所述铜片内嵌式软磁粉芯电感中软磁材料的密度为5.5～6.5g/cm 3，例如5.6g/cm 3、5.7g/cm 3、5.8g/cm 3、5.9g/cm 3、6.1g/cm 3或6.3g/cm 3等。
相较于传统铁氧体电感，本申请所述铜片内嵌式软磁粉芯电感具有更高的密度及饱和磁通密度，从而使得所述铜片内嵌式软磁粉芯电感可以应对更大电流，并缩小体积50％以上。
可选地，所述软磁材料在铜片两侧表面的覆盖区域相互对称。
可选地，所述软磁材料在铜片的两侧表面上对称分布。
此处所述对称分布指的是位于铜片两侧表面的软磁材料的长度、宽度和厚度完全相同，且覆盖区域也以铜片为对称平面相互对称。
可选地，所述金属软磁粉末包括铁粉、铁硅粉、铁硅铝粉、铁镍粉或铁镍钼粉中的任意一种或至少两种的组合，所述组合示例性地包括铁粉和铁硅粉的组合或铁硅铝粉、铁镍粉和铁镍钼粉的组合等。
第二方面，本申请提供了如第一方面所述的铜片内嵌式软磁粉芯电感的制备方法，所述方法包括以下步骤：
(1)在铜片表面涂覆绝缘树脂材料，烘烤，固化；
(2)将步骤(1)中得到的涂覆有绝缘树脂材料的铜片置于金属软磁粉末中，压制成型，惰性气氛下退火，得到所述铜片内嵌式软磁粉芯电感。
本申请所述铜片内嵌式软磁粉芯电感的制备过程首先在铜片表面涂覆绝缘树脂材料，之后在金属软磁粉末中压制成型，退火；得到所述铜片内嵌式软磁粉芯电感，其中，采用压制成型的方法能有效提高制备得到的电感的密度及磁性材料的体积比，进而提高制备得到的铜片内嵌式软磁粉芯电感的磁导率及电感量，减少绕线圈数，节省铜损。且铜片内置金属软磁粉体内进行压制，有助于减小电感体积、减少漏磁。
本申请所述方法将铜片内置在金属软磁粉体内，之后压制成型，其制备过 程简单，有利于提高生产效率，适于大规模自动化生产。
可选地，步骤(1)所述绝缘树脂材料包括有机硅树脂材料。
可选地，步骤(2)所述金属软磁粉末包括铁粉、铁硅粉、铁硅铝粉、铁镍粉或铁镍钼粉中的任意一种或至少两种的组合；所述组合示例性地包括铁粉和铁硅粉的组合或铁硅铝粉、铁镍粉和铁镍钼粉的组合等。
可选地，步骤(2)所述金属软磁粉末的平均粒径为2-25μm，例如5μm、8μm、10μm、15μm、20μm或25μm等。
可选地，步骤(2)所述压制成型的压力为12-18T/cm 2，例如13T/cm 2、14T/cm 2、15T/cm 2、16T/cm 2或17T/cm 2等。
可选地，步骤(2)所述退火的温度为550-700℃，例如580℃、600℃、620℃、650℃或680℃等。
可选地，步骤(2)所述退火的时间为1-3h，例如1.5h、2h或2.5h等。
可选地，所述惰性气氛为氮气。
作为本申请可选的技术方案，所述铜片内嵌式软磁粉芯电感的制备方法包括以下步骤：
(1)在铜片表面涂覆有机硅树脂材料，烘烤，固化；
(2)将步骤(1)中得到的涂覆有有机硅树脂材料的铜片置于平均粒径为10μm的金属软磁粉末中，在压力为12～18T/cm 2的条件下压制成型，得到成型体，之后将其置于退火炉中，惰性气氛下550-700℃退火1-3h，得到所述铜片内嵌式软磁粉芯电感。
第三方面，本申请提供了如第一方面所述的铜片内嵌式软磁粉芯电感的用途，所述铜片内嵌式软磁粉芯电感用于低压DC/DC转换器电路。
相对于现有技术，本申请具有以下有益效果：
(1)本申请所述铜片内嵌式软磁粉芯电感包括铜片，所述铜片的表面覆盖有软磁材料，所述软磁材料与所述铜片的界面处含有绝缘树脂材料，其与传统铁氧体电感相比，其具有磁通密度高、体积小、且不会因开气隙导致漏磁的优势；
(2)本申请所述铜片内嵌式软磁粉芯电感应用于低压DC/DC转换器电路中，与传统铁氧体电感相比，其可以获得一致或更高的效率，且体积减小可达一半以上，且其耐压可达15V以上；
(3)本申请所述铜片内嵌式软磁粉芯电感的制备方法简单，可明显提高生产效率，适于大规模自动化生产。
在阅读并理解了详细描述和附图后，可以明白其他方面。
附图说明
图1是本申请所述铜片内嵌式软磁粉芯电感的结构示意图。
具体实施方式
下面通过具体实施方式来进一步说明本申请的技术方案。本领域技术人员应该明了，所述实施例仅仅是帮助理解本申请，不应视为对本申请的具体限制。
具体实施方式部分所述铜片内嵌式软磁粉芯电感的结构示意图如图1所示，由图1可以看出，所述铜片内嵌式软磁粉芯电感包括铜片，所述铜片的表面覆盖有软磁材料，所述软磁材料与所述铜片的界面处含有绝缘树脂材料；所述软材材料在铜片的两侧表面对称分布，所述铜片的两端未被软磁材料覆盖，如图1所示，铜片上未被软磁材料覆盖的区域进行如图所示的弯曲。
实施例1
铜片内嵌式软磁粉芯电感的制备方法：
(1)将有机硅树脂
Figure PCTCN2020099228-appb-000002
REN 60均匀地涂覆于厚0.3mm、宽2.5mm铜片表面，并烘烤至其固化；
(2)将经步骤(1)处理后的铜片埋置于铁硅铝磁性粉末内，粉末平均粒径15μm，以16T/cm 2压力压制成型，得到成形体，所述成形体长14mm，宽5mm，高2mm；之后，将成形体置于退火炉中，在氮气气氛下，经过680℃退火120分钟，得到铜片内嵌式软磁粉芯电感。
所述成形体的尺寸包含软磁材料的尺寸及位于软磁材料内部的铜片的尺寸。
实施例2
铜片内嵌式软磁粉芯电感的制备方法：
(1)将有机硅树脂
Figure PCTCN2020099228-appb-000003
REN 60均匀地涂覆于厚0.25mm、宽2.5mm铜片表面，并烘烤至其固化；
(2)将经步骤(1)处理后的铜片埋置于铁硅铝磁性粉末内，粉末平均粒径15μm，以12T/cm 2压力压制成型，得到成形体，所述成形体长14mm，宽5mm，高2mm；之后，将成形体置于退火炉中，在氮气气氛下，经过680℃退火120分钟，得到铜片内嵌式软磁粉芯电感。
实施例3
铜片内嵌式软磁粉芯电感的制备方法：
(1)将有机硅树脂
Figure PCTCN2020099228-appb-000004
REN 60均匀地涂覆于厚0.3mm、宽2.7mm铜片表面，并烘烤至其固化；
(2)将经步骤(1)处理后的铜片埋置于铁硅铝磁性粉末内，粉末平均粒径10μm，以18T/cm 2压力压制成型，得到成形体，所述成形体长14mm，宽5mm，高2mm；之后，将成形体置于退火炉中，在氮气气氛下，经过680℃退火120分钟，得到铜片内嵌式软磁粉芯电感。
实施例4
本实施例与实施例1的区别在于，将退火温度由680℃替换为550℃，其他条件与实施例1相比完全相同。
实施例5
本实施例与实施例1的区别在于，将退火温度由680℃替换为450℃，其他条件与实施例1相比完全相同。
实施例6
本实施例与实施例1的区别在于，将退火温度由680℃替换为800℃，其他条件与实施例1相比完全相同。
实施例7
本实施例与实施例1的区别在于，将步骤(2)中的铁硅铝磁性粉末的平均粒径由10μm替换为2μm，其他条件与实施例1相比完全相同。
实施例8
本实施例与实施例1的区别在于，将步骤(2)中的铁硅铝磁性粉末的平均粒径由10μm替换为20μm，其他条件与实施例1相比完全相同。
实施例9
本实施例与实施例1的区别在于，将步骤(2)中的铁硅铝磁性粉末替换为 等平均粒径的铁镍粉，其他条件与实施例1相比完全相同。
实施例10
本实施例与实施例1的区别在于，将步骤(2)中的铁硅铝磁性粉末替换为等平均粒径的铁镍钼粉，其他条件与实施例1相比完全相同。
对比例1
本对比例采用与实施例1中同样感量的铁氧体电感，所述铁氧体电感的尺寸为长14mm，宽5mm，高8mm；其制备方法如下：制作带凹槽14mm×5mm×4mm铁氧体两片，凹槽深1.7mm，将两片铁氧体上下对扣，铜片从凹槽穿过并折弯，成为所需铁氧体电感。
性能测试：
测试实施例1-10制备得到的铜片内嵌式软磁粉芯电感和对比例1所述铁氧体电感的密度、体积和感量，并将其应用于低压DC/DC转换器电路中，测试其效率值；其测试结果如表1所示；此处铜片内嵌式软磁粉芯电感的体积指的是成形体的体积和未被软磁材料覆盖的铜片的体积之和。
其中，应用于低压DC/DC转换器电路中的测试条件为：频率700kHz，电流40A，电压1V；
测试实施例1-10制备得到的铜片内嵌式软磁粉芯电感和对比例1所述铁氧体电感的绝缘耐压，其测试结果如表1所示。
表1
Figure PCTCN2020099228-appb-000005
Figure PCTCN2020099228-appb-000006
由上表可以看出，本申请所述铜片内嵌式软磁粉芯电感的密度在5.5-6.5g/cm 3之间，其密度明显高于对比例1中的铁氧体电感；且对比实施例1和对比例1可以看出，在感量相同的条件下实施例1中的铜片内嵌式软磁粉芯电感的体积为对比例1中铁氧体电感体积的约四分之一，且实施例1中的铜片内嵌式软磁粉芯电感应用于低压DC/DC转换器电路中的效率略高于对比例1中所述铁氧体电感。
由实施例1、4-6对比可以看出，退火温度为550-680℃时，所得铜片内嵌式软磁粉芯电感应用于低压DC/DC转换器电路中的效率更高。
申请人声明，以上所述仅为本申请的具体实施方式，但本申请的保护范围并不局限于此。

Claims (11)

  1. 一种铜片内嵌式软磁粉芯电感，其中，所述铜片内嵌式软磁粉芯电感包括铜片，所述铜片的表面覆盖有软磁材料，所述软磁材料与所述铜片的界面处含有绝缘树脂材料。
  2. 如权利要求1所述的铜片内嵌式软磁粉芯电感，其中，所述铜片内嵌式软磁粉芯电感中软磁材料的密度为5.5～6.5g/cm 3。
  3. 如权利要求1或2所述的铜片内嵌式软磁粉芯电感，其中，所述软磁材料由金属软磁粉末压制成型得到；
    可选地，所述金属软磁粉末包括铁粉、铁硅粉、铁硅铝粉、铁镍粉或铁镍钼粉中的任意一种或至少两种的组合；
    可选地，所述绝缘树脂材料包括有机硅树脂材料。
  4. 如权利要求1-3任一项所述的铜片内嵌式软磁粉芯电感的制备方法，其中，所述方法包括以下步骤：
    (1)在铜片表面涂覆绝缘树脂材料，烘烤，固化；
    (2)将步骤(1)中得到的涂覆有绝缘树脂材料的铜片置于金属软磁粉末中，压制成型，惰性气氛下退火，得到所述铜片内嵌式软磁粉芯电感。
  5. 如权利要求4所述的方法，其中，步骤(2)所述金属软磁粉末的平均粒径为2-25μm。
  6. 如权利要求4或5所述的方法，其中，步骤(2)所述退火的温度为550-700℃；
    可选地，步骤(2)所述退火的时间为1-3h。
  7. 如权利要求4-6任一项所述的方法，其中，步骤(1)所述绝缘树脂材料包括有机硅树脂材料；
    可选地，步骤(2)所述金属软磁粉末包括铁粉、铁硅粉、铁硅铝粉、铁镍粉或铁镍钼粉中的任意一种或至少两种的组合。
  8. 如权利要求4-7任一项所述的方法，其中，步骤(2)所述压制成型的压力为12-18T/cm 2。
  9. 如权利要求4-8任一项所述的方法，其中，所述惰性气氛为氮气。
  10. 如权利要求4-9任一项所述的方法，其中，所述方法包括以下步骤：
    (1)在铜片表面涂覆有机硅树脂材料，烘烤，固化；
    (2)将步骤(1)中得到的涂覆有有机硅树脂材料的铜片置于平均粒径为10μm的金属软磁粉末中，在压力为12～18T/cm 2的条件下压制成型，得到成型体，之后将其置于退火炉中，惰性气氛下550-700℃退火1-3h，得到所述铜片内嵌式软磁粉芯电感。
  11. 如权利要求1-3任一项所述的铜片内嵌式软磁粉芯电感的用途，其中，所述铜片内嵌式软磁粉芯电感用于低压DC/DC转换器电路。
PCT/CN2020/099228 2020-01-17 2020-06-30 一种铜片内嵌式软磁粉芯电感及其制备方法和用途 WO2021143062A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US17/631,341 US20220293315A1 (en) 2020-01-17 2020-06-30 Internally Embedded Copper Plate-Type Soft Magnetic Powder Core Inductor, Preparation Method Therefor, and Use Thereof
DE112020003316.3T DE112020003316T5 (de) 2020-01-17 2020-06-30 Innen-eingebetteter-kupferplattentyp-weichmagnetischer-pulverkern-induktor, herstellungsverfahren hierfür und verwendung davon
JP2021507056A JP2022520294A (ja) 2020-01-17 2020-06-30 銅板埋め込み式軟磁性粉末コアインダクタ、その製造方法及び用途

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010052363.5A CN111243814A (zh) 2020-01-17 2020-01-17 一种铜片内嵌式软磁粉芯电感及其制备方法和用途
CN202010052363.5 2020-01-17

Publications (1)

Publication Number Publication Date
WO2021143062A1 true WO2021143062A1 (zh) 2021-07-22

Family

ID=70876204

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/099228 WO2021143062A1 (zh) 2020-01-17 2020-06-30 一种铜片内嵌式软磁粉芯电感及其制备方法和用途

Country Status (5)

Country Link
US (1) US20220293315A1 (zh)
JP (1) JP2022520294A (zh)
CN (1) CN111243814A (zh)
DE (1) DE112020003316T5 (zh)
WO (1) WO2021143062A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111243814A (zh) * 2020-01-17 2020-06-05 深圳市铂科新材料股份有限公司 一种铜片内嵌式软磁粉芯电感及其制备方法和用途
CN112509783B (zh) * 2020-08-09 2022-04-12 华为数字能源技术有限公司 一种功率电感及其制备方法、系统级封装模组
DE112021006318T5 (de) * 2020-12-04 2023-09-14 Hengdian Group Dmegc Magnetics Co., Ltd Integrierter mitgebrannter induktor und herstellungsverfahren dafür
CN112735797B (zh) * 2020-12-24 2022-06-14 横店集团东磁股份有限公司 一种一体式共烧电感及其制备方法与应用
CN112735752A (zh) * 2020-12-24 2021-04-30 横店集团东磁股份有限公司 一种一体成型共烧电感及其制备方法与应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1838349A (zh) * 2005-03-23 2006-09-27 胜美达集团株式会社 电感器
CN103280298A (zh) * 2013-05-29 2013-09-04 深圳顺络电子股份有限公司 一种电感线圈及其激光切割制造方法
CN111243814A (zh) * 2020-01-17 2020-06-05 深圳市铂科新材料股份有限公司 一种铜片内嵌式软磁粉芯电感及其制备方法和用途

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0620230A (ja) * 1992-07-03 1994-01-28 Mitsubishi Electric Corp 薄膜磁気ヘッドおよびその製法
JPH0974011A (ja) * 1995-09-07 1997-03-18 Tdk Corp 圧粉コアおよびその製造方法
JP2002324714A (ja) * 2001-02-21 2002-11-08 Tdk Corp コイル封入圧粉磁芯およびその製造方法
JP2003282333A (ja) * 2002-03-27 2003-10-03 Tdk Corp コイル封入圧粉磁芯
CN1260745C (zh) * 2003-04-01 2006-06-21 乾坤科技股份有限公司 抗流线圈的制造方法
JP2004363466A (ja) * 2003-06-06 2004-12-24 Toko Inc 複合磁性材料とそれを用いたインダクタの製造方法
JP2005268685A (ja) * 2004-03-22 2005-09-29 Tdk Corp 圧粉磁芯及びその製造方法
CA2588094A1 (en) * 2004-12-27 2006-07-06 Sumida Corporation Magnetic device
JP4769033B2 (ja) * 2005-03-23 2011-09-07 スミダコーポレーション株式会社 インダクタ
JP2006319020A (ja) * 2005-05-11 2006-11-24 Nec Tokin Corp インダクタンス部品
CN201007943Y (zh) * 2007-01-23 2008-01-16 恒忻电子(苏州)有限公司 一种新型一体成型电感
US8339227B2 (en) * 2007-12-12 2012-12-25 Panasonic Corporation Inductance part and method for manufacturing the same
CN101625926B (zh) * 2008-07-10 2011-12-07 潘学仁 一体式电感的制造方法
CN201402721Y (zh) * 2009-04-28 2010-02-10 田先平 一种平面变压器
CN201829300U (zh) * 2010-10-21 2011-05-11 普莱默电子(无锡)有限公司 小体积平面共模电感
TWM491930U (zh) * 2014-07-25 2014-12-11 Chicony Power Tech Co Ltd 變壓器結構
CN206921607U (zh) * 2017-05-18 2018-01-23 珠海群创新材料技术有限公司 表面金属化一体成型smd电感
CN107275045B (zh) 2017-05-24 2019-03-08 深圳顺络电子股份有限公司 一种电感的制作方法、及其塑封材料的制备方法
CN107768069A (zh) 2017-11-22 2018-03-06 深圳顺络电子股份有限公司 一种电感器及其制作方法
JP7038275B2 (ja) * 2017-12-26 2022-03-18 パナソニックＩｐマネジメント株式会社 インダクタおよびその製造方法
CN208570313U (zh) * 2018-04-13 2019-03-01 深圳市海光电子有限公司 一种卧式薄型化屏蔽大电流电感器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1838349A (zh) * 2005-03-23 2006-09-27 胜美达集团株式会社 电感器
CN103280298A (zh) * 2013-05-29 2013-09-04 深圳顺络电子股份有限公司 一种电感线圈及其激光切割制造方法
CN111243814A (zh) * 2020-01-17 2020-06-05 深圳市铂科新材料股份有限公司 一种铜片内嵌式软磁粉芯电感及其制备方法和用途

Also Published As

Publication number Publication date
CN111243814A (zh) 2020-06-05
US20220293315A1 (en) 2022-09-15
JP2022520294A (ja) 2022-03-30
DE112020003316T5 (de) 2022-03-24

Similar Documents

Publication Publication Date Title
WO2021143062A1 (zh) 一种铜片内嵌式软磁粉芯电感及其制备方法和用途
US7219416B2 (en) Method of manufacturing a magnetic element
US7675396B2 (en) Inductor and manufacture method thereof
US20040113744A1 (en) Complex magnetic material, and core and magnetic element using the complex magnetic material
CN112435845A (zh) 一种一体共烧电感及其制备方法
JP2002313632A (ja) 磁性素子およびその製造方法
JP2019201155A (ja) 圧粉磁芯およびインダクタ素子
JP2004363466A (ja) 複合磁性材料とそれを用いたインダクタの製造方法
TW202113883A (zh) 電感元件及其製造方法
US20030150523A1 (en) Powder core and high-frequency reactor using the same
EP3306629B1 (en) Method for manufacturing high-density integrally-molded inductor
JP2003068550A (ja) 軟磁性ポットコア、その製造方法、およびこれを用いるリアクトル
KR20220079872A (ko) 일체형 동시소성 인덕터 및 그 제조방법
TWI652700B (zh) 壓粉芯、該壓粉芯之製造方法、具備該壓粉芯之電氣電子零件及安裝有該電氣電子零件之電氣電子機器
WO2023133994A1 (zh) 一种一体成型电感器的制造方法及应用其制备的电感器
KR101872601B1 (ko) 자성 분말, 및 이를 포함하는 인덕터
US20240029952A1 (en) Integrated co-fired inductor and preparation method therefor
WO2018149422A2 (zh) 一体成型电感元件及其制造方法
US6788185B2 (en) Powder core and high-frequency reactor using the same
JPH07106141A (ja) 小形インダクタ及びその製造方法
WO2022032606A1 (zh) 模压组合电感的制造方法及模压组合电感
KR102469985B1 (ko) 트랜스포머
CN113889322A (zh) 一种高散热一体成型电感及其制备方法
CN116168942A (zh) 一种功率电感制备方法
KR101592351B1 (ko) 파워 인덕터 및 그 제조방법

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2021507056

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20913091

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 20913091

Country of ref document: EP

Kind code of ref document: A1