WO2021142690A1 - 自动测值机 - Google Patents
自动测值机 Download PDFInfo
- Publication number
- WO2021142690A1 WO2021142690A1 PCT/CN2020/072374 CN2020072374W WO2021142690A1 WO 2021142690 A1 WO2021142690 A1 WO 2021142690A1 CN 2020072374 W CN2020072374 W CN 2020072374W WO 2021142690 A1 WO2021142690 A1 WO 2021142690A1
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- WIPO (PCT)
- Prior art keywords
- measuring
- conveying
- needle
- positioning
- conveying line
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
Definitions
- This application relates to the field of surface mount technology, specifically, to an automatic measuring machine.
- SMT Surface Mounting Technology, surface mount technology
- the purpose of this application includes, for example, to provide an automatic measuring machine, which can automatically measure the electronic components on the tape, and then realize the automation of the electronic component detection, and can be achieved by passing the measuring needle through the packaging film The purpose of avoiding manual tearing off the packaging film, thereby improving production efficiency.
- the embodiment of the present application provides an automatic measuring machine for automatic measuring of electronic components on a tape in the SMT process.
- the tape is provided with a packaging film for encapsulating the electronic components and along the A plurality of through holes arranged in the extending direction of the material belt, the automatic measuring machine includes: a feeder, a conveying platform, and a detection mechanism;
- the conveying platform is provided with a conveying line for conveying the material belt;
- the feeder is connected to the conveying platform, and the feeder is used to convey the material belt along the conveying line;
- the detection mechanism can be movably arranged on the conveying platform and located above the conveying line, and a measuring needle is arranged on the side of the detection mechanism close to the conveying line, and the measuring needle is used to penetrate the conveying line.
- the detection mechanism can drive the measuring needle to selectively move closer to the conveying line, or drive the measuring needle to move away from the conveying line.
- the automatic measuring function provided by this application can move relative to the conveying platform through the detection mechanism, and at the same time drive the measuring needle to approach or move away from the conveying line, and then can control the electronic components on the material belt conveyed by the conveying line when the measuring needle is close to the conveying line Measure the value, and then can automatically measure the value of the electronic components on the tape, avoid the error of manual detection, and improve the efficiency of the measurement.
- the electronic components are measured by the measuring needle passing through the packaging film, which can avoid the waste of time and cost caused by manually tearing off the packaging film, and further improve the production efficiency.
- Fig. 1 is a schematic diagram of the structure of an automatic measuring machine provided in an embodiment of the application;
- Figure 2 is a schematic diagram of the structure of the material belt
- Fig. 3 is a schematic diagram of an enlarged structure at III in Fig. 1;
- FIG. 4 is a schematic diagram of a partial structure of an automatic measuring machine provided in an embodiment of this application.
- FIG. 5 is a schematic structural diagram from a first perspective of the first pressing provided in an embodiment of the application.
- FIG. 6 is a schematic view of a second view of the structure of the first tablet provided in an embodiment of the application.
- Fig. 7 is a schematic structural diagram of a conveying platform provided in an embodiment of the application.
- FIG. 8 is a schematic diagram of an enlarged structure of VIII in FIG. 7;
- FIG. 9 is a schematic diagram of a partial structure of an automatic measuring machine provided in an embodiment of the application.
- Fig. 10 is a schematic diagram of an enlarged structure at X in Fig. 1.
- Icon 10-automatic measuring machine; 11- material belt; 12- electronic components; 13- through hole; 100- conveying platform; 110- conveying line; 120- conveying trough; 121- conveying space; 122- second pressing 123-installation slot; 200-detection mechanism; 210-needle lowering mechanism; 220-replacement structure; 230-first measured value structure; 240-second measured value structure; 250-measured needle; 251-first measured value Needle; 252-second measuring needle; 260-positioning structure; 261-mounting frame; 262-connecting frame; 263-first pressing plate; 264-first positioning tooth; 265-second positioning tooth; 266-avoidance groove ; 300-feeder; 310-conveying gear; 311- gear teeth; 400-cutting device.
- an automatic measuring machine 10 is provided.
- the automatic measuring machine 10 is used for electronic devices on the material belt 11 conveyed in the process flow of SMT (Surface Mounting Technology).
- the component 12 is measured, and then whether the electronic component 12 is qualified.
- the automatic measuring machine 10 can automatically measure the electronic component 12 on the material strip 11, thereby realizing the automation of the electronic component 12 detection, and can avoid the manual tearing of the packaging film through the measuring needle 250 through the packaging film, and then The purpose of improving production efficiency.
- a packaging film (not shown) for packaging the electronic component 12 is provided on the material strip 11, and the electronic component 12 is packaged by the packaging film, which can avoid The electronic component 12 is damaged by touch and oxidation.
- the strip 11 is provided with a plurality of through holes 13 arranged along the extending direction of the strip 11, and at the same time, the arrangement direction of the plurality of electronic components 12 on the strip 11 is also arranged along the extending direction of the strip 11.
- the automatic value measuring machine 10 includes a feeder 300, a conveying platform 100, and a detection mechanism 200.
- the feeder 300 is connected to the conveying platform 100, and the feeder 300 is used to convey the material belt 11 equipped with the electronic components 12 to the conveying platform 100.
- the conveying platform 100 is used to convey the material belt 11, so that the material belt 11 can move on a designated path, so as to facilitate the detection of the electronic components 12 on the material belt 11, and at the same time, it is also convenient for the electronic components 12 to be taken and installed in the printing press. ⁇ circuit board.
- the conveying platform 100 is provided with a conveying line 110 for conveying the material belt 11, and the conveying platform 100 can convey the material belt 11 along a conveying path restricted by the conveying line 110.
- the detection mechanism 200 is movably arranged on the conveying platform 100, and the detection mechanism 200 is located above the conveying line 110, so that the detection mechanism 200 can move relative to the conveying platform 100 and selectively approach or move away from the conveying line 110, and then pass the detection
- the mechanism 200 measures the material tape 11 when it is close to the material tape 11, so as to realize the automatic measurement of the electronic components 12 on the material tape 11.
- the detection mechanism 200 is provided with a measuring needle 250 on the side close to the conveying line 110, and the measuring needle 250 can pass through the packaging film for the packaging tape 11 and directly penetrate into the packaging.
- the inside of the film contacts the electronic component 12, and the measurement value of the electronic component 12 is realized.
- the detection mechanism 200 includes a first measurement structure 230, a second measurement structure 240 and a positioning structure 260.
- the first measurement structure 230 and the second measurement structure 240 can both be movably installed on the conveying platform 100 and located above the conveying line 110. At the same time, the first measurement structure 230 and the second measurement structure 240 are arranged at intervals. Both the measuring structure 230 and the second measuring structure 240 are provided with measuring needles 250 on the side close to the conveying line 110, so that the first measuring structure 230 and the second measuring structure 240 can measure the electronic component 12 respectively. .
- the measuring needle 250 may include a first measuring needle 251 and a second measuring needle 252.
- the first measuring needle 251 is used to detect the electronic component 12 of the first specification
- the second measuring needle 252 is used to detect The second specification of electronic components 12.
- the first measuring needle 251 is installed on the first measuring structure 230
- the second measuring needle 252 is installed on the second measuring structure 240, so that the first measuring structure 230 and the second measuring structure 240 can be passed. Test the measuring needles 250 of different specifications respectively.
- the electronic components 12 of different specifications need to be placed in the corresponding first measuring value structure 230 or the second measuring value structure respectively.
- Below 240 it is convenient to perform corresponding measurement through the first measurement structure 230 or the second measurement structure 240 to ensure the accuracy and efficiency of the measurement of the electronic component 12.
- both the first measurement structure 230 and the second measurement structure 240 can be set to multiple, and each first measurement structure 230 and each second measurement structure 240 are
- the set measuring needle 250 can be used to measure electronic components 12 of different specifications.
- the measuring needle 250 may also include a third measuring needle for detecting the electronic component 12 of the third specification, a fourth measuring needle for detecting the electronic component 12 of the fourth specification, and a measuring needle for detecting the electronic component 12 of the fifth specification.
- the third, fourth, and fifth measuring needles are respectively installed on a plurality of first measuring structures 230 or second measuring structures 240, so that each The first measurement structure 230 and each second measurement structure 240 can perform measurement corresponding to the electronic components 12 of different specifications, thereby realizing efficient and accurate measurement for the electronic components 12 of various specifications, and greatly improving the measurement efficiency.
- the number of the first measurement structure 230 is set to one, the number of the second measurement structure 240 is set to two, and the first measurement structure 230 is set to two second measurement structures.
- the value structure is between 240.
- the measuring pins 250 mounted on the first measuring value structure 230 and the two second measuring value structures 240 can both measure values for the electronic components 12 of different specifications. It should be understood that in other embodiments, the measuring pins 250 on the first measuring structure 230 and the two second measuring structures 240 can also be set to target the electronic components 12 of the same specification, that is, it can be carried out according to actual needs.
- the measuring needle 250 For the setting of the measuring needle 250, when only one specification of the electronic component 12 needs to be measured, only the first measuring structure 230 and the two second measuring structures 240 need to be provided with the electronic component 12 for that specification.
- the measuring needle 250 is sufficient.
- a variety of corresponding measuring needles 250 are set to be installed in the first measuring structure 230 or the two second measuring structures respectively. 240 is enough.
- the end of the measuring needle 250 close to the conveying line 110 is set as a wedge-shaped part, so that the measuring needle 250 can penetrate the packaging film and extend into the packaging film to the electronic components 12 inside the packaging film. Performing the measurement can avoid the time and cost increase caused by manually tearing off the packaging film, thereby reducing the cost and improving the efficiency of the measurement. It should be understood that, in other embodiments, the end of the measuring needle 250 may also be set in other sharp shapes, such as a cone shape or a knife-point shape.
- the positioning structure 260 is installed in the first measuring structure 230, and the first measuring structure 230 can drive the positioning structure 260 to move while moving relative to the conveying platform 100, and then pass when the first measuring structure 230 is close to the conveying line 110
- the positioning structure 260 provides a positioning function for the strip 11, so that the electronic component 12 on the strip 11 can maintain a stable position while measuring, thereby making the measurement of the electronic component 12 efficient and stable.
- the positioning structure 260 can be inserted into the through hole 13 on the material belt 11 under the action of the first measurement structure 230 to provide a stable positioning function to the material belt 11.
- the positioning structure 260 can also provide positioning for the material strip 11 in other ways. For example, the positioning structure 260 can be pressed on the part of the material strip 11 where the electronic component 12 is not installed, thereby ensuring that the material strip 11 stability and so on.
- the positioning structure 260 includes a mounting frame 261, a first positioning tooth 264 and a second positioning tooth 265.
- the mounting frame 261 is mounted on the first measuring structure 230, and the mounting frame 261 extends below the second measuring structure 240.
- the first positioning tooth 264 and the second positioning tooth 265 are both protrudingly provided on the side of the mounting frame 261 close to the conveying line 110, and the first positioning tooth 264 is located below the first measurement structure 230, and the second positioning tooth 265 is located in the second measurement structure.
- the first positioning teeth 264 can provide positioning for the strip 11 located below the first measurement structure 230, thereby ensuring that the first measurement structure 230 is positioned to match the electronic components 12 on the strip 11 below the first measurement structure 230.
- the second positioning teeth 265 can provide positioning for the strip 11 located below the second measurement structure 240, thereby ensuring that the second measurement structure 240 is positioned on the strip 11 below the second measurement structure 240.
- the stability of the electronic component 12 can be ensured when the electronic component 12 is inspected. It should be noted that when the material belt 11 is transported on the conveyor line 110, when one end of the material belt 11 is located below the first measurement structure 230 and the other end is located below the second measurement structure 240, it can pass at the same time.
- the first positioning teeth 264 and the second positioning teeth 265 provide a positioning function to the material belt 11, thereby ensuring the stability of the material belt 11.
- the number of the first positioning tooth 264 and the second positioning tooth 265 may both be multiple, and the number of the first positioning tooth 264 and the second positioning tooth 265 may also be one.
- the mounting frame 261 can extend in two directions and extend to two second measurement structures respectively.
- the teeth 265 provide a stable positioning function to the material belt 11.
- the first measuring structure when the material belt 11 is conveyed below the first measuring structure 230 and the electronic component 12 needs to be detected by the measuring needle 250 on the first measuring structure 230, the first measuring structure is controlled at this time 230 moves toward the conveying line 110, and can position the material belt 11 through the first positioning teeth 264 to ensure the stability of the material belt 11, and then measure the electronic component 12 through the measuring needle 250 on the first measuring structure 230 At this time, the second measured value structure 240 may not produce any action.
- the first measuring structure 230 is first controlled to move toward the conveying line 110 and pass The second positioning teeth 265 provide positioning for the material belt 11 to ensure the stability of the material belt 11, and then control the second measuring structure 240 to move toward the conveying line 110 and measure the electronic component 12. It should be understood that at this time, the first The measured value structure 230 and the second measured value structure 240 can also operate at the same time.
- the setting of the measuring needle 250 on the first measuring value structure 230 may also be eliminated, that is, the first measuring value structure 230 only provides a positioning function for the material belt 11.
- the measuring needle 250 when the measuring needle 250 is installed on the first measuring structure 230 and the second measuring structure 240, it can pass through the mounting frame 261 and protrude from the side of the mounting frame 261 close to the conveying line 110, thereby making The measuring needle 250 can pass through the mounting frame 261 and measure the electronic component 12 when the first measuring structure 230 or the second measuring structure 240 moves close to the conveying line 110.
- the mounting frame 261 includes a connecting frame 262 and a first pressing piece 263.
- the connecting frame 262 is installed on the first measuring structure 230
- the first pressing piece 263 is installed on the side of the connecting frame 262 close to the conveying line 110
- the first pressing piece 263 extends below the second measuring structure 240.
- the connecting frame 262 is installed on both sides of the first measuring structure 230, and the first pressing piece 263 is installed on the connecting frame 262 located on both sides of the first measuring structure 230, and then The installation stability of the first pressing piece 263 can be ensured, and at the same time, the installation of the measuring needle 250 on the first measuring structure 230 can be facilitated, that is, the measuring needle 250 is installed between the connecting frames 262 on both sides.
- the first positioning teeth 264 and the second positioning teeth 265 are both installed on the side of the first pressing piece 263 close to the conveying line 110, that is, the first positioning teeth 264 are installed on the first pressing piece 263 under the first measuring structure 230 ,
- the second positioning tooth 265 is installed on the first pressing piece 263 located under the second measuring structure 240.
- the measuring needle 250 passes through the first pressing piece 263 and enables the measuring needle 250 to measure the electronic component 12 so as to prevent the first pressing piece 263 from affecting the detection of the electronic component 12.
- a plurality of avoiding grooves 266 are provided on the first pressing piece 263, and the plurality of avoiding grooves 266 are respectively arranged corresponding to the plurality of measuring needles 250, wherein at least two avoiding grooves 266 respectively correspond to the first measuring structure 230 and the second measurement structure 240, so that the measurement needle 250 on the first measurement structure 230 can pass through the corresponding avoiding groove 266 to achieve the purpose of passing through the first pressing piece 263, and at the same time, the second measurement structure 240 The upper measuring needle 250 can pass through the corresponding avoiding groove 266 to achieve the purpose of passing through the first pressing piece 263.
- the way in which the escape groove 266 is arranged can be directly penetrated on the first pressing piece 263, and at the same time, the first pressing piece 263 may be set in a fold line shape or a curved shape, etc., at this time, the first pressing piece 263 is recessed. The part forms an escape slot 266.
- the length of the measuring needle 250 protruding from the first pressing piece 263 through the avoiding groove 266 is less than the length of the first positioning tooth 264 protruding from the first pressing piece 263, and is smaller than the length of the second positioning tooth 264 protruding from the first pressing piece 263.
- the teeth 265 protrude from the first pressing piece 263 by the length of the first pressing piece 263.
- the detection mechanism 200 further includes at least two lower needle mechanisms 210 and at least two replacement structures 220.
- Both lower needle mechanisms 210 can be movably installed on the conveying platform 100, and the two lower needle mechanisms 210 are arranged at intervals, and both lower needle mechanisms 210 can move relative to the conveying platform 100 to be selectively close to or away from the conveying line 110 Conveyor line 110.
- the two replacement structures 220 are respectively detachably installed on the two lower needle mechanisms 210, and the first measured value structure 230 and the second measured value structure 240 are respectively installed on the two replacement structures 220, and the replacement structure 220 and the lower needle can be further installed.
- the detachable connection of the mechanism 210 realizes the disassembly and replacement of the first measurement structure 230 and the second measurement structure 240.
- the replacement structure 220 may be a clamping block that is clamped to the lower needle mechanism 210.
- the lower needle mechanism 210 is provided with a card slot suitable for the card block, and the card block can extend into the card slot to realize the needle lowering mechanism.
- the detachable connection between 210 and the replacement structure 220, or the replacement structure 220 may be a part made of a magnetic member, which can be detachably installed on the needle lowering mechanism 210 by means of magnetic attraction.
- the conveying line 110 includes a conveying trough 120 extending along a straight line, the conveying trough 120 is opened on the conveying platform 100, and the conveying trough 120 is used to convey the material belt 11 .
- the extension path of the conveying trough 120 may also be a curve or a broken line.
- the first measured value structure 230 and the second measured value structure 240 in the detection mechanism 200 need to follow the conveying trough
- the arrangement of the conveying paths 120 allows the detection mechanism 200 to measure the electronic components 12 on the tape 11 on the conveying trough 120 when it moves relative to the conveying line 110.
- the feeder 300 is arranged at one end of the conveying trough 120 so that the feeder 300 can convey the material belt 11 along the conveying trough 120.
- the feeder 300 includes a conveying gear 310, which is rotatably connected to the conveying platform 100, and the conveying gear 310 is provided with a plurality of gear teeth 311 that are adapted to the through holes 13, and when the material belt 11 is placed on When the conveying groove 120 is inside, at least one gear tooth 311 extends into the through hole 13, and the material belt 11 is conveyed along the conveying groove 120 during the rotation of the conveying gear 310.
- a material cutting device 400 is provided at the other end of the conveying trough 120, and the material cutting device 400 is used to cut off the material tape 11 corresponding to the electronic component 12 that has completed the measurement, thereby ensuring the continuation of subsequent production. It should be understood that in other embodiments, the setting of the material cutting device 400 may also be eliminated.
- a second pressing piece 122 is further provided inside the conveying groove 120, and a conveying space 121 for conveying the material belt 11 is formed between the second pressing piece 122 and the bottom wall of the conveying groove 120. That is, in this embodiment, the second pressing piece 122 is substantially parallel to the bottom wall of the conveying groove 120, so that the second pressing piece 122 and the bottom wall of the conveying groove 120 can define a conveying space suitable for the material belt 11 121. It can ensure that the material belt 11 is stably conveyed inside the conveying space 121, avoid the warping or deviation of the material belt 11, and thereby ensure that the electronic components 12 on the material belt 11 can be provided with stable and efficient measurement values.
- the second pressing piece 122 is also provided with a positioning opening adapted to the positioning structure 260, so that when the positioning structure 260 moves close to the material belt 11, it can pass through the positioning opening and penetrate into the through hole on the material belt 11.
- the hole 13 realizes the positioning function for the material belt 11.
- the side wall of the conveying groove 120 is provided with a mounting groove 123 adapted to the second pressing plate 122, and the second pressing plate 122 is installed in the conveying groove 120 through the mounting groove 123.
- the second pressing sheet 122 can provide a stable pressing effect to the material belt 11, thereby ensuring that the material belt 11 can be stably conveyed.
- the automatic measuring machine 10 may also include a control system (not shown), a driving device (not shown), and a measuring instrument (not shown).
- detection devices can be set at both ends of the conveying trough 120 to detect the input and output of the material belt 11, that is, when the material belt 11 is put into the conveying trough 120 near the end of the feeder 300, detecting The device detects the insertion of the material belt 11, and at this time, the control system controls the driving device connected to the feeder 300 to convey the material belt 11 at a fixed distance to transport the material belt 11 to a designated position.
- the control system controls the driving device connected to the detection mechanism 200 to drive the first measuring structure 230 to move close to the conveying line 110, and the material belt 11 can be realized by the cooperation of the positioning structure 260 and the through hole 13
- the position calibration can improve the position accuracy of the strip 11, and then the measuring pin 250 on the first measuring structure 230 can contact the electronic component 12 for measuring, or by controlling the driving device to drive the second measuring structure 240 to approach
- the conveying line 110 moves and contacts the electronic component 12 through the measuring needle 250 for measuring.
- the measuring instrument can be electrically connected with the measuring needle 250, so that the measuring instrument can measure the value of the electronic component 12 through the contact of the measuring needle 250 with the electronic component 12, and can read the data on the measuring instrument.
- the measuring pin 250 is provided with a detection chip, which is used to detect whether the communication is smooth.
- the detection chip can transmit the information that cannot be communicated to the control system.
- the detection chip is also used to record the number of needle lowerings, that is, the number of times the measuring needle 250 drops the measured value, so as to monitor the service life of the measuring needle 250.
- the detection chip will feed back the measurement result to the control system, and the control system will control the corresponding image acquisition structure to shoot The picture of the tested material and save it.
- the control system can be a PLC control unit.
- the detection device may be a photosensitive sensor such as infrared or laser.
- the measuring pin 250 can send control commands to the upper computer (not shown) through wired cables such as usb, serial port, network cable, Bluetooth, wifi, etc., or wirelessly connected to the upper computer (not shown).
- the upper computer can send control commands through USB, serial port, GPIB, network cable, wifi, etc. Cable or wirelessly connected LCR meters, multimeters, impedance analyzers, oscilloscopes, network analyzers, comprehensive testers and other measuring instruments to obtain the measured values.
- the automatic measuring machine 10 provided in this embodiment can move relative to the conveying platform 100 through the detection mechanism 200, and at the same time drive the measuring needle 250 to approach or move away from the conveying line 110, and then to approach the measuring needle 250
- the conveyor line 110 is used, the electronic components 12 on the material belt 11 conveyed by the conveyor line 110 are measured, and then the electronic components 12 on the material belt 11 can be automatically measured, which avoids the error of manual detection and improves For the efficiency of the measured value.
- measuring the value of the electronic component 12 through the measuring needle 250 through the packaging film can avoid the waste of time and cost caused by manually tearing off the packaging film, and further improve the production efficiency.
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Abstract
本申请的实施例提供了一种自动测值机，涉及表面贴装技术领域。该自动测值机（10）包括：送料机（300）、输送平台（100）、检测机构（200）。输送平台（100）上设置有用于输送料带（11）的输送线（110）。送料机（300）连接于输送平台（100），并且送料机（300）用于沿输送线（110）输送料带（11）。检测机构（200）可活动地设置于输送平台（100），并位于输送线（110）上方，检测机构（200）靠近输送线（110）的一侧设置有测值针（250），测值针（250）用于穿透封装膜并对电子元件（12）测值，检测机构（200）能带动测值针（250）选择性地靠近输送线（110）移动，或者带动测值针（250）远离输送线（110）移动。
Description
本申请涉及表面贴装技术领域，具体而言，涉及一种自动测值机。
SMT (Surface
Mounting Technology，表面贴装技术)行业这几年可以说是飞速的发展。而在发展的过程中人们对产品的品质、结构框架要求不断地提高，表面贴装技术正在向无源元件的前进，表面贴装元件越来越小。
现阶段在SMT行业最为头痛的问题就是，电子元器件越来越多、尺寸越来越小，而品质越来越高，这就要求工厂在来料环节要严格把控质量。目前就大部分SMT工厂而言，需要人工对来料进行检测，具体流程：拿到待测物料盘，撕开封装塑胶膜，在放大镜下取出待测物料放到特定检测位置，再通过放大镜找准极性测值点，手持电桥测量表笔测值并记录。
本申请的目的包括，例如，提供了一种自动测值机，其能够自动对料带上的电子元件进行测值，进而实现电子元件检测的自动化，并且能通过测值针穿过封装膜实现避免手动撕去封装膜，进而提高生产效率的目的。
本申请的实施例可以这样实现：
本申请的实施例提供了一种自动测值机，用于SMT工艺中的料带上电子元件的自动测值，所述料带上设置有用于封装所述电子元件的封装膜以及沿所述料带延伸方向排列的多个通孔，所述自动测值机包括：送料机、输送平台、检测机构；
所述输送平台上设置有用于输送所述料带的输送线；
所述送料机连接于所述输送平台，并且所述送料机用于沿所述输送线输送所述料带；
所述检测机构可活动地设置于所述输送平台，并位于所述输送线上方，所述检测机构靠近所述输送线的一侧设置有测值针，所述测值针用于穿透所述封装膜并对所述电子元件测值，所述检测机构能带动所述测值针选择性地靠近所述输送线移动，或者带动所述测值针远离所述输送线移动。
本申请实施例的自动测值机相对于现有技术的有益效果包括，例如：
本申请提供的自动测值机能通过检测机构相对于输送平台活动，并同时带动测值针靠近或者远离输送线，进而能在测值针靠近输送线时对输送线输送的料带上的电子元件进行测值，进而能自动对料带上的电子元件进行测值检测，避免了人工检测出现的误差，同时提高了对于测值的效率。另外，通过测值针穿过封装膜对电子元件进行测值，能避免手工撕掉封装膜造成的时间成本的浪费，进一步地提高了生产效率。
为了更清楚地说明本申请实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，应当理解，以下附图仅示出了本申请的某些实施例，因此不应被看作是对范围的限定，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他相关的附图。
图1为本申请实施例中提供的自动测值机的结构示意图；
图2为料带的结构示意图；
图3为图1中III处的放大结构示意图；
图4为本申请实施例中提供的自动测值机局部的结构示意图；
图5为本申请实施例中提供的第一压片第一视角的结构示意图；
图6为本申请实施例中提供的第一压片第二视角的结构示意图；
图7为本申请实施例中提供的输送平台的结构示意图；
图8为图7中VIII的放大结构示意图；
图9为本申请实施例中提供的自动测值机局部的结构示意图；
图10为图1中X处的放大结构示意图。
图标：10-自动测值机；11-料带；12-电子元件；13-通孔；100-输送平台；110-输送线；120-输送槽；121-输送空间；122-第二压片；123-安装槽；200-检测机构；210-下针机构；220-更换结构；230-第一测值结构；240-第二测值结构；250-测值针；251-第一测值针；252-第二测值针；260-定位结构；261-安装架；262-连接架；263-第一压片；264-第一定位齿；265-第二定位齿；266-避让槽；300-送料机；310-输送齿轮；311-轮齿；400-剪料装置。
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。通常在此处附图中描述和示出的本申请实施例的组件可以以各种不同的配置来布置和设计。
因此，以下对在附图中提供的本申请的实施例的详细描述并非旨在限制要求保护的本申请的范围，而是仅仅表示本申请的选定实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。
在本申请的描述中，需要说明的是，若出现术语“上”、“下”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，或者是该申请产品使用时惯常摆放的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，若出现术语“第一”、“第二”等仅用于区分描述，而不能理解为指示或暗示相对重要性。
需要说明的是，在不冲突的情况下，本申请的实施例中的特征可以相互结合。
请参阅图1，本实施例中提供了一种自动测值机10，该自动测值机10用于SMT（Surface Mounting Technology，表面贴装技术）的工艺流程中输送的料带11上的电子元件12进行测值，进而检测电子元件12是否合格。该自动测值机10能够自动对料带11上的电子元件12进行测值，进而实现电子元件12检测的自动化，并且能通过测值针250穿过封装膜实现避免手动撕去封装膜，进而提高生产效率的目的。
需要说明的是，请结合参阅图1和图2，在本实施例中，料带11上设置有用于封装电子元件12的封装膜（图未示），通过封装膜封装电子元件12，能避免电子元件12受到触碰损坏以及氧化损坏。另外，料带11上设置有沿料带11的延伸方向排列的多个通孔13，同时，料带11上的多个电子元件12的排列方向同样沿料带11的延伸方向设置。
其中，请结合参阅图1-图3，自动测值机10包括送料机300、输送平台100和检测机构200。送料机300连接于输送平台100，并且送料机300用于将装有电子元件12的料带11输送至输送平台100上。输送平台100用于输送料带11，进而使得料带11能在指定的路径上移动，以便于料带11上的电子元件12的检测，同时还可以便于电子元件12的拿取并安装于印制电路板。可选地，在本实施例中，输送平台100上设置有用于输送料带11的输送线110，输送平台100能将料带11沿输送线110限制的输送路径进行输送。检测机构200可活动地设置于输送平台100，并且检测机构200位于输送线110的上方，以使得检测机构200能相对于输送平台100移动并选择性地靠近或者远离输送线110，便能通过检测机构200在靠近料带11时对料带11进行测值，进而实现对于料带11上电子元件12的自动测值。需要说明的是，在本实施例中，检测机构200靠近输送线110的一侧设置有测值针250，该测值针250能穿过用于封装料带11的封装膜并直接深入至封装膜内部接触电子元件12，并实现对于电子元件12的测值。
进一步地，请结合参阅图1和图4，检测机构200包括第一测值结构230、第二测值结构240和定位结构260。
其中，第一测值结构230和第二测值结构240均可活动地安装于输送平台100并位于输送线110上方，同时第一测值结构230和第二测值结构240间隔设置，第一测值结构230和第二测值结构240靠近输送线110的一侧均设置有测值针250，进而使得第一测值结构230和第二测值结构240能分别对电子元件12进行测值。
可选地，测值针250可以包括第一测值针251和第二测值针252，第一测值针251用于检测第一规格的电子元件12，第二测值针252用于检测第二规格的电子元件12。并且第一测值针251安装于第一测值结构230上，第二测值针252安装于第二测值结构240上，便能实现通过第一测值结构230和第二测值结构240分别检测不同规格的测值针250，换言之，在对不同规格的电子元件12进行检测时，需要将不同规格的电子元件12分别对应放置于相应的第一测值结构230或者第二测值结构240下方，以便于通过第一测值结构230或者第二测值结构240进行相应的测值，保证对于电子元件12测值的准确性和高效性。
需要说明的是，在本实施例中，第一测值结构230和第二测值结构240均可以设置为多个，并且每个第一测值结构230和每个第二测值结构240上设置的测值针250能分别用于测量不同规格的电子元件12。换言之，测值针250还可以包括用于检测第三规格电子元件12的第三测值针、用于检测第四规格电子元件12的第四测值针以及用于检测第五规格电子元件12的第五测值针等，并且第三测值针、第四测值针以及第五测值针分别安装于多个第一测值结构230或者第二测值结构240上，进而使得每个第一测值结构230和每个第二测值结构240能对应不同规格的电子元件12进行测值，进而实现针对多种规格电子元件12高效精准的测值，大幅度提升测量效率。
可选地，在本实施例中，第一测值结构230的数量设置为一个，第二测值结构240的数量设置为两个，并且，第一测值结构230设置于两个第二测值结构240之间。其中，第一测值结构230和两个第二测值结构240上安装的测值针250均能针对不同规格的电子元件12进行测值。应当理解，在其他实施例中，也可以将第一测值结构230和两个第二测值结构240上的测值针250设置为针对同种规格的电子元件12，即能按照实际需求进行测值针250的设置，当仅需要对一种规格的电子元件12进行测值时，只需在第一测值结构230和两个第二测值结构240上设置针对该规格的电子元件12的测值针250即可，当需要对多种规格的电子元件12进行测值时，便设置多种对应的测值针250分别安装于第一测值结构230或者两个第二测值结构240上即可。
进一步地，在本实施例中，测值针250靠近输送线110的一端设置为楔形部，进而使得测值针250能穿透封装膜并伸入至封装膜内部对封装膜内部的电子元件12进行测值，能避免手工撕掉封装膜造成的时间即成本的增加，进而降低成本并提高测值效率。应当理解，在其他实施例中，测值针250的端部也可以设置为尖锐的其他形状，例如锥形或者刀尖形等。
另外，定位结构260安装于第一测值结构230，并且第一测值结构230能在相对输送平台100移动的同时带动定位结构260移动，进而在第一测值结构230靠近输送线110时通过定位结构260对料带11提供定位作用，使得料带11上的电子元件12在进行测量的同时能保持一个位置稳定的状态，进而使得对于电子元件12的测量高效且稳定。可选地，在本实施例中，定位结构260能在第一测值结构230的带动作用下卡入至料带11上的通孔13内部，进而向料带11提供稳定的定位作用，应当理解，在其他实施例中，定位结构260也可以通过其他的方式对料带11提供定位作用，例如，定位结构260可以压持在料带11上未安装电子元件12的部分，进而保证料带11的稳定性等。
进一步地，定位结构260包括安装架261、第一定位齿264和第二定位齿265。安装架261安装于第一测值结构230，并且安装架261延伸至第二测值结构240下方。第一定位齿264和第二定位齿265均凸设于安装架261靠近输送线110的一侧，并且第一定位齿264位于第一测值结构230下方，第二定位齿265位于第二测值结构240下方。能通过第一定位齿264对位于第一测值结构230下方的料带11提供定位作用，进而保证第一测值结构230在对第一测值结构230下方的料带11上的电子元件12进行检测时，能保证电子元件12的稳定。同理，能通过第二定位齿265对位于第二测值结构240下方的料带11提供定位作用，进而保证第二测值结构240在对为第二测值结构240下方的料带11上的电子元件12进行检测时，能保证电子元件12的稳定。需要说明的是，当料带11在输送线110的输送过程中，出现料带11的一端位于第一测值结构230下方，另一端位于第二测值结构240下方时，此时能同时通过第一定位齿264和第二定位齿265向料带11提供定位作用，进而保证料带11的稳定。其中，第一定位齿264和第二定位齿265的数量均可以是多个，同理第一定位齿264和第二定位齿265的数量也可以是一个。
可选地，在本实施例中，由于第一测值结构230的两侧均设置有第二测值结构240，即，安装架261能沿两个方向延伸，并分别延伸至两个第二测值结构240下方，并且分别在两个第二测值结构240的下方设置有第二定位齿265，进而保证料带11在位于第二测值结构240下方时，能通过对应的第二定位齿265向料带11提供稳定的定位作用。
在本实施例中，当料带11输送至第一测值结构230下方并需要通过第一测值结构230上的测值针250对电子元件12进行检测时，此时控制第一测值结构230朝向输送线110移动，并能通过第一定位齿264对料带11的定位保证料带11的稳定性，进而通过第一测值结构230上的测值针250对电子元件12进行测值，此时第二测值结构240可以不产生动作。同理，当料带11输送至第二测值结构240下方并需要通过第二测值结构240对电子元件12进行测值时，先控制第一测值结构230朝向输送线110移动，并通过第二定位齿265对料带11提供定位作用保证料带11的稳定性，然后通过控制第二测值结构240朝向输送线110移动并对电子元件12进行测值，应当理解，此时第一测值结构230和第二测值结构240也可以同时动作。
另外，在其他实施例中，第一测值结构230上也可以取消测值针250的设置，即第一测值结构230仅对料带11提供定位作用。
需要说明的是，测值针250在安装于第一测值结构230和第二测值结构240上时，能穿过安装架261并凸出于安装架261靠近输送线110的侧面，进而使得测值针250至随着第一测值结构230或者第二测值结构240靠近输送线110移动时，能穿过安装架261并对电子元件12进行测值。
进一步地，请结合参阅图1、图4、图5和图6，在本实施例中，安装架261包括连接架262和第一压片263。连接架262安装于第一测值结构230，第一压片263安装于连接架262靠近输送线110的一侧，并且第一压片263延伸至第二测值结构240下方。需要说明的是，在本实施例中，连接架262安装于第一测值结构230的两侧，第一压片263则安装于位于第一测值结构230两侧的连接架262上，进而能保证第一压片263的安装稳定性，同时，能便于第一测值结构230上测值针250的安装，即将测值针250安装于两侧的连接架262之间。第一定位齿264和第二定位齿265均安装于第一压片263靠近输送线110的一侧，即第一定位齿264安装于位于第一测值结构230下方的第一压片263上，第二定位齿265安装于位于第二测值结构240下方的第一压片263上。
在本实施例中，测值针250穿过第一压片263并使得测值针250能对电子元件12进行测值，避免第一压片263对电子元件12的检测造成影响。可选地，第一压片263上设置有多个避让槽266，多个避让槽266分别对应于多个测值针250设置，其中，至少两个避让槽266分别对应于第一测值结构230和第二测值结构240，进而使得第一测值结构230上的测值针250能穿过对应的避让槽266实现穿过第一压片263的目的，同时使得第二测值结构240上的测值针250能穿过对应的避让槽266实现穿过第一压片263的目的。需要说明的是，避让槽266的设置方式可以直接在第一压片263上贯穿开设，同时也可以将第一压片263设置为折线形或者和曲线形等，此时第一压片263凹陷的部分形成避让槽266。
进一步地，在本实施例中，测值针250穿过避让槽266凸出于第一压片263的长度小于第一定位齿264凸出于第一压片263的长度，并且小于第二定位齿265凸出于第一压片263凸出于第一压片263的长度。能使得在第一定位齿264和第二定位齿265穿过通孔13并对料带11提供定位作用时，能便于测值针250对料带11上的电子元件12进行测值。
另外，检测机构200还包括至少两个下针机构210和至少两个更换结构220。两个下针机构210均可活动的安装于输送平台100，并且两个下针机构210间隔设置，两个下针机构210均能相对于输送平台100活动以选择性地靠近输送线110或者远离输送线110。两个更换结构220分别可拆卸地安装于两个下针机构210，第一测值结构230和第二测值结构240分别安装于两个更换结构220上，进而能通过更换结构220和下针机构210的可拆卸连接实现第一测值结构230和第二测值结构240的拆卸更换。
需要说明的是，更换结构220可以是卡接于下针机构210的卡块，同时下针机构210上设置有相适应于卡块的卡槽，卡块能伸入卡槽内部实现下针机构210和更换结构220的可拆卸连接，或者更换结构220可以是采用磁性件制成的零件，能通过磁力吸附的方式可拆卸的安装于下针机构210上等。
请结合参阅图1、图7、图8和图9，输送线110包括沿直线延伸的输送槽120，该输送槽120开设于输送平台100上，并且输送槽120用于对料带11进行输送。应当理解，在其他实施例中，输送槽120的延伸路径也可以是曲线或者折线，此时相对应的，检测机构200中的第一测值结构230和第二测值结构240需按照输送槽120的输送路径排列，进而使得检测机构200能在相对输送线110移动时对输送槽120上的料带11上的电子元件12进行测值。
其中，请结合参阅图1和图10，送料机300设置于输送槽120的其中一端，以使得送料机300能将料带11沿输送槽120输送。需要说明的是，送料机300包括输送齿轮310，输送齿轮310转动连接于输送平台100，并且输送齿轮310上设置有多个与通孔13相适配的轮齿311，当料带11放置于输送槽120内部时，至少一个轮齿311伸入至通孔13内部，并在输送齿轮310的转动过程中将料带11沿输送槽120输送。
另外，输送槽120的另一端设置有剪料装置400，剪料装置400用于将完成测值的电子元件12对应的料带11剪掉，进而保证后续的生产继续。应当理解，在其他实施例中，也可以取消剪料装置400的设置。
进一步地，在本实施例中，输送槽120内部还设置有第二压片122，第二压片122与输送槽120的底壁之间形成用于输送料带11的输送空间121。即在本实施例中，第二压片122大致平行于输送槽120的底壁，进而使得第二压片122能与输送槽120的底壁之间限定一个适配于料带11的输送空间121，能保证料带11在输送空间121内部稳定的输送，避免料带11发生起翘或者跑偏的情况，进而保证能对料带11上的电子元件12提供稳定高效的测值。另外，第二压片122上还设置有适配于定位结构260的定位开孔，以使得定位结构260在靠近料带11移动时，能穿过定位开孔并穿入料带11上的通孔13，实现对于料带11的定位作用。
需要说明的是，在本实施例中，输送槽120的侧壁上设置有适配于第二压片122的安装槽123，通过安装槽123实现第二压片122在输送槽120的安装，能使得第二压片122向料带11提供稳定的压持作用，进而保证料带11能稳定的进行输送。
另外，在本实施例中，自动测值机10还可以包括控制系统（图未示）、驱动装置（图未示）和测值仪（图未示）。其中，在输送槽120的两端可以设置检测装置（图未示），用于检测料带11的输入和输出，即在料带11放入至输送槽120靠近送料机300的一端时，检测装置检测到料带11的放入，此时控制系统控制连接于送料机300的驱动装置对料带11进行定距离输送，以将料带11输送至指定的位置。当料带11输送至指定的位置时，控制系统控制连接于检测机构200的驱动装置驱动第一测值结构230靠近输送线110移动，能通过定位结构260与通孔13的配合实现料带11的位置校准，能提高料带11的位置精确性，然后能通过第一测值结构230上的测值针250接触电子元件12进行测值，或者通过控制驱动装置驱动第二测值结构240靠近输送线110移动并通过测值针250接触电子元件12进行测值。测值仪能与测值针250电连接，进而使得测值仪能通过测值针250与电子元件12的接触进行电子元件12的测值，并能在测值仪上进行数据的读取。
在本实施例中，测值针250内设有检测芯片，检测芯片用于检测通讯是否通畅，当测值针250外壳上的触点与测值针250接触不良，或是测值针250的型号错误时，都无法顺利通讯，测值针250也就不能顺利测值，此时，检测芯片便能将无法通讯的信息传递给控制系统。检测芯片还用于记录下针次数，也即测值针250下降测值的次数，以监控测值针250的使用寿命。当测值针250下降后却测值失败或是检测到的结果与预先设定的标准值不匹配时，检测芯片会将测值结果反馈给控制系统，控制系统会控制相应的图像获取结构拍摄被测物料的图片并进行保存。
其中，控制系统可以是PLC控制单元。检测装置可以是红外、激光等光敏传感器等。另外，测值针250能通过向usb、串口、网线、蓝牙、wifi等有线电缆或者无线方式连接上位机（图未示）发送控制指令，上位机通过usb、串口、GPIB、网线、wifi等有线电缆或者无线方式连接的LCR表、万用表、阻抗分析仪、示波器、网络分析仪、综合测试仪等测值仪获取所测值。
综上所述，本实施例中提供的自动测值机10能通过检测机构200相对于输送平台100活动，并同时带动测值针250靠近或者远离输送线110，进而能在测值针250靠近输送线110时对输送线110输送的料带11上的电子元件12进行测值，进而能自动对料带11上的电子元件12进行测值检测，避免了人工检测出现的误差，同时提高了对于测值的效率。另外，通过测值针250穿过封装膜对电子元件12进行测值，能避免手工撕掉封装膜造成的时间成本的浪费，进一步地提高了生产效率。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。
Claims (13)
- 一种自动测值机，其特征在于，用于SMT工艺中的料带上电子元件的自动测值，所述料带上设置有用于封装所述电子元件的封装膜以及沿所述料带延伸方向排列的多个通孔，所述自动测值机包括：送料机、输送平台、检测机构；所述输送平台上设置有用于输送所述料带的输送线；所述送料机连接于所述输送平台，并且所述送料机用于沿所述输送线输送所述料带；所述检测机构可活动地设置于所述输送平台，并位于所述输送线上方，所述检测机构靠近所述输送线的一侧设置有测值针，所述测值针用于穿透所述封装膜并对所述电子元件测值，所述检测机构能带动所述测值针选择性地靠近所述输送线移动，或者带动所述测值针远离所述输送线移动。
- 根据权利要求1所述的自动测值机，其特征在于，所述检测机构包括第一测值结构、第二测值结构和定位结构；所述第一测值结构和所述第二测值结构均可活动地设置于所述输送平台并位于所述输送线上方，所述第一测值结构和所述第二测值结构间隔设置，所述第一测值结构和所述第二测值结构靠近所述输送线的一侧均设置有所述测值针；所述定位结构安装于所述第一测值结构，所述第一测值结构能带动所述定位结构朝向所述输送线移动并使所述定位结构卡入所述通孔。
- 根据权利要求2所述的自动测值机，其特征在于，所述定位结构包括安装架、第一定位齿和第二定位齿，所述安装架安装于所述第一测值结构，并且所述安装架延伸至所述第二测值结构下方；所述第一定位齿和所述第二定位齿均凸设于所述安装架靠近所述输送线的一侧，并且所述第一定位齿位于所述第一测值结构下方，所述第二定位齿位于所述第二测值结构下方。
- 根据权利要求3所述的自动测值机，其特征在于，所述安装架包括连接架和第一压片，所述连接架安装于所述第一测值结构，所述第一压片安装于所述连接架靠近所述输送线的一侧，并且所述第一压片延伸至所述第二测值结构下方；所述第一定位齿和所述第二定位齿均安装于所述第一压片靠近所述输送线的一侧。
- 根据权利要求4所述的自动测值机，其特征在于，所述第一压片上设置有多个避让槽，至少其中两个所述避让槽分别对应设置于所述第一测值结构下方和所述第二测值结构下方，所述测值针穿过所述避让槽并凸出于所述第一压片靠近所述输送线的侧面。
- 根据权利要求2所述的自动测值机，其特征在于，所述检测机构还包括至少两个下针机构和至少两个更换结构，两个所述下针机构均可活动的安装于所述输送平台，并且两个所述下针机构间隔设置，两个所述更换结构分别可拆卸地安装于两个所述下针机构，所述第一测值结构和所述第二测值结构分别安装于两个所述更换结构。
- 根据权利要求2所述的自动测值机，其特征在于，所述测值针包括第一测值针和第二测值针，所述第一测值针用于第一规格的所述电子元件的测值，所述第二测值针用于第二规格的所述电子元件的测值，所述第一测值针安装于所述第一测值结构，所述第二测值针安装于所述第二测值结构。
- 根据权利要求2-7中任意一项所述的自动测值机，其特征在于，所述输送线包括输送槽，所述输送槽用于输送所述料带，所述送料机设置于所述输送槽的其中一端，所述输送槽位于所述定位结构下方，所述定位结构能伸入所述输送槽并卡入所述通孔。
- 根据权利要求8所述的自动测值机，其特征在于，所述输送槽的内部还设置有第二压片，所述第二压片与所述输送槽的底壁之间形成用于输送所述料带的输送空间，所述第二压片上开设有适配于所述定位结构的定位开孔，所述定位结构能穿过所述定位开孔并伸入所述输送空间。
- 根据权利要求8所述的自动测值机，其特征在于，所述输送槽的两端设置有检测装置，所述检测装置用于检测所述料带的输入和输出。
- 根据权利要求8所述的自动测值机，其特征在于，还包括剪料装置，所述剪料装置设于所述输送槽远离所述送料机的一端，所述剪料装置用于将完成测值的电子元件对应的料带剪掉。
- 根据权利要求1-7中任意一项所述的自动测值机，其特征在于，所述测值针靠近所述输送线的一端呈楔形。
- 根据权利要求1所述的自动测值机，其特征在于，所述测值针内设有检测芯片。
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