WO2021134741A1 - 一种改善显示屏拼接缝亮线的方法 - Google Patents

一种改善显示屏拼接缝亮线的方法 Download PDF

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Publication number
WO2021134741A1
WO2021134741A1 PCT/CN2020/070003 CN2020070003W WO2021134741A1 WO 2021134741 A1 WO2021134741 A1 WO 2021134741A1 CN 2020070003 W CN2020070003 W CN 2020070003W WO 2021134741 A1 WO2021134741 A1 WO 2021134741A1
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Prior art keywords
splicing
pixel module
display screen
optical material
bright line
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PCT/CN2020/070003
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English (en)
French (fr)
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钟文馗
林伟瀚
杨梅慧
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康佳集团股份有限公司
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Priority to CN202080000011.3A priority Critical patent/CN111183473B/zh
Priority to PCT/CN2020/070003 priority patent/WO2021134741A1/zh
Publication of WO2021134741A1 publication Critical patent/WO2021134741A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Definitions

  • the invention relates to the technical field of semiconductor optoelectronic displays, in particular to a method for improving the bright line of the splicing seam of a display screen.
  • Micro LED and Mini-LED are new display technologies that have the same high color gamut and high contrast ratio as OLED, but they have higher brightness, reliability and lifespan than OLED.
  • each pixel is composed of three RGB chips, which are individually driven by RGB three primary color sub-pixels.
  • Micro LED or Mini-LED display screens are produced in modular assembly, as shown in Figure 1, which can improve production efficiency; at the same time, it can improve the detection and maintenance efficiency of Micro LED and Mini-LED defective pixels.
  • the light-emitting chip in the existing Micro-LED or Mini-LED display uses an epoxy resin or silicone protective layer. Since the refractive index of optical epoxy resin or optical silica gel is about 1.4-1.6, its total reflection angle to air is about 38-45 degrees. As shown in Figure 2, when the LED display achieves Micro-LED or Mini-LED level, the light-emitting chip is very close to the edge of the substrate, and the thickness of the molded epoxy resin protective layer is about several times the thickness of the light-emitting chip.
  • the incident angle can easily exceed the total reflection angle, and obvious bright lines of reflection are produced at the edge of the splicing seam, which affects the display viewing effect.
  • the purpose of the present invention is to provide a method for improving the bright line of the splicing seam of the display screen, aiming to improve the problem of the bright line of the splicing seam on the existing Micro-LED or Mini-LED display screen.
  • a method for improving the bright line of the splicing seam of a display screen includes:
  • An optical material is arranged on the side surface of any one of the pixel module units, and the pixel module units provided with the optical material are spliced, so that the splicing seams formed after splicing are filled with the optical material.
  • the refractive index of the optical material is greater than or equal to the refractive index of the protective layer of the pixel module unit.
  • the refractive index of the optical material is 1.4-1.7.
  • the optical material is arranged on the side surface of the pixel module unit by spraying.
  • the optical material is arranged on the side surface of the pixel module unit by pasting.
  • the method for improving the bright line of a splicing seam of a display screen wherein after splicing the pixel module units provided with an optical material, the optical material is sprayed on the light-emitting surface of the pixel module unit.
  • the thickness of the optical material arranged on the side surface of the pixel module unit is 20-100 ⁇ m.
  • the method for improving the bright line of a splicing seam of a display screen wherein after the pixel module unit provided with an optical material is spliced, a glue film composed of the optical material is pasted on the light-emitting surface of the pixel module unit .
  • the optical material is an acrylic resin system material.
  • the pixel module unit is composed of three RGB chips, which are individually driven by the sub-pixels of the three primary colors of RGB.
  • the method for improving the bright line of the splicing seam of the display screen provided by the present invention is to fill in the splicing seams on the display screen by arranging a filling material on the side of the pixel module unit used for splicing to form the display screen. Filler. Since the splicing seams are filled with materials instead of the air in the prior art after splicing, total reflection cannot easily occur at the edges of the pixel module unit, so that the problem of bright lines in the splicing seams on the display screen is improved.
  • Fig. 1 is a schematic diagram of the structure of an existing modularly assembled Micro LED display device.
  • FIG. 2 is a schematic diagram of light propagation at the edge of a pixel module unit in the prior art.
  • FIG. 3 is a flowchart of a preferred embodiment of the method for improving the bright line of the splicing seam of the display screen provided by the present invention.
  • FIG. 4 is a schematic diagram of the splicing structure of any two adjacent pixel module units provided by the present invention.
  • FIG. 5 is a schematic diagram of the process of attaching an adhesive film on the backlight surface after the pixel module units provided by the present invention are spliced.
  • the present invention provides a method for improving the bright line of the splicing seam of a display screen.
  • connection and “connection” in the present invention include direct and indirect connection (connection) unless otherwise specified.
  • connection In the description of the present invention, it needs to be understood that the terms “upper”, “lower”, “front”, “rear”, “left”, right”, “vertical”, “horizontal”, “top”, “ The orientation or positional relationship indicated by “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise”, etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. It does not indicate or imply that the pointed device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.
  • the “on” or “under” of the first feature on the second feature may be in direct contact with the first and second features, or the first and second features may be indirectly through an intermediary. contact.
  • the “above”, “above” and “above” of the first feature on the second feature may mean that the first feature is directly above or diagonally above the second feature, or it simply means that the level of the first feature is higher than that of the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the level of the first feature is smaller than the second feature.
  • this embodiment provides a method for improving the bright lines of the splicing seam of a display screen.
  • the method includes the following steps:
  • S10 Provide a plurality of pixel module units for splicing to form a display screen.
  • a plurality of pixel module units 10 are provided to be combined to form a display screen.
  • the pixel module unit can be the smallest component unit for modular assembly of Micro-LED or Mini-LED display devices.
  • the pixel module unit includes a substrate 101, a Micro-LED/Mini-LED chip 102 arranged on the substrate 101, and a protective layer 103 encapsulated on the Micro-LED/Mini-LED chip 102.
  • the material can be epoxy resin, silica gel, etc.
  • the Micro-LED/Mini-LED chip 102 includes three RGB chips, which are individually driven by RGB three primary color sub-pixels.
  • the shape of the pixel module unit 10 may be a cube or other shapes.
  • the shape of the pixel module unit 10 is a rectangular parallelepiped, and from bottom to top are the substrate 101, the Micro-LED/Mini-LED chip 102, and the epoxy protective layer 103.
  • the front surface of the cuboid is the light-emitting surface
  • the bottom surface of the cuboid is the backlight surface
  • the side surface of the cuboid is the non-light-emitting surface.
  • the optical material 104 used for filling may be an organic material such as acrylic resin, a modified acrylic resin, or an acrylic resin system material doped with black pigments such as carbon black.
  • the optical material 104 provided on the non-light emitting surface of the pixel module unit 10 has a certain viscosity and elasticity. Among them, when it has a certain viscosity, the pixel module unit 10 can be spliced more firmly. When it has a certain elasticity, the pixel module unit 10 can be squeezed during the splicing process to reduce the air in the splicing seam 105. Squeeze it all out. The optical material 104 fills the splicing seam 105 during splicing.
  • a number of pixel module units 10 with optical materials 104 are spliced according to a predetermined splicing rule (for example, N rows and M columns, N pixel module units are arranged in each row, and M pixel module units are arranged in each column). After finishing, you can get the display screen.
  • a predetermined splicing rule for example, N rows and M columns, N pixel module units are arranged in each row, and M pixel module units are arranged in each column.
  • the refractive index of the optical material 104 is set to be greater than or equal to the refractive index of the protective layer 103 of the pixel module unit. Because the incident angle is greater than the critical angle when the light enters the optically thin medium from the optically dense medium, total reflection occurs. In order to avoid total reflection, it can be achieved by changing the refractive index of two adjacent materials. When the refractive index of the optical material 104 disposed on the pixel module unit 10 is greater than or equal to the refractive index of the protective layer 103, the light can be prevented from being totally reflected at the edge of the pixel module unit 10, and bright lines can be avoided at the joint 105 .
  • the refractive index of the optical material 104 is 1.4-1.7.
  • the external molded protective layer 103 mostly uses optical epoxy resin or optical silica gel, wherein the refractive index of the optical epoxy resin or optical silica gel is 1.4- Around 1.6.
  • the refractive index of the optical epoxy resin or optical silica gel is 1.4- Around 1.6.
  • the optical material 104 is arranged on the side surface of the pixel module unit 10 by spraying.
  • acrylic resin is selected as the optical material 104, and the viscosity of the acrylic resin is adjusted to make it suitable for painting and spraying. Brush the acrylic resin with a good viscosity on the side of the pixel module unit 10 under normal temperature conditions, so that the edge of the pixel module unit 10 is provided with a light shielding layer with a refractive index similar to that of the protective layer above. The chip in the pixel module unit The light emitted by 102 is not prone to total reflection at the edge. It should be noted that the diluent used for the adjustment of the viscosity of the acrylic resin, the viscosity range, the operation process during spraying or brushing, etc., are all commonly used techniques in the prior art, and will not be repeated here.
  • the optical material 104 on the side of the pixel module unit 10 can also be set by pasting, that is, the optical material 104 is prepared into an adhesive film in advance, and the adhesive film is applied to the pixel module unit during splicing. side.
  • the optical material is arranged on the side of the pixel module unit by sticking, which can make the setting operation of the optical material more convenient.
  • the optical material 104 is sprayed on the light-emitting surface of the pixel module unit 10.
  • the pixel module unit 10 after splicing can also be sealed and protected.
  • the optical material used here may be the same as or different from the optical material on the side of the pixel module unit, and the same optical material is usually selected for the convenience of operation.
  • the thickness of the optical material layer formed on the light exit surface is from 5 ⁇ m to 10 ⁇ m, from 10 ⁇ m to 15 ⁇ m, from 15 ⁇ m to 20 ⁇ m, and from 20 ⁇ m to 25 ⁇ m.
  • a layer of adhesive film 106 can be adhered to the light-emitting surface.
  • the material of the adhesive film 106 is consistent with the side surface of the pixel module unit 10.
  • the optical material 104 may be the same or different.
  • the refractive index of the adhesive film 106 is required to be greater than or equal to the refractive index of the protective layer of the pixel module unit as much as possible.
  • the thickness of the adhesive film 106 may be 10 ⁇ m to 15 ⁇ m, from 15 ⁇ m to 20 ⁇ m, from 20 ⁇ m to 25 ⁇ m, from 25 ⁇ m to 30 ⁇ m, from 30 ⁇ m to 35 ⁇ m, from 35 ⁇ m to 40 ⁇ m.
  • the adhesive film 106 can be adhered to the light-emitting surface of the pixel module unit 10 after splicing by rolling or molding. Utilizing the elasticity and good fluidity of the glue film 106, it is filled in the gap 105 after rolling or molding. On the one hand, the splicing seam 105 can be filled again to prevent the occurrence of improper filling of the splicing seam. On the other hand, it plays a role of sealing and protecting the pixel module unit 10 after splicing.
  • the thickness of the optical material 104 disposed on the side surface of the pixel module unit 10 is 20-100 ⁇ m.
  • the thickness of the optical material 104 disposed on the side surface of the pixel module unit 10 may be 20 ⁇ m to 30 ⁇ m, from 30 ⁇ m to 40 ⁇ m, from 40 ⁇ m to 50 ⁇ m, from 50 ⁇ m to 60 ⁇ m, from 60 ⁇ m to 70 ⁇ m, from 70 ⁇ m to 80 ⁇ m. , From 80 ⁇ m to 90 ⁇ m, from 90 to 100 ⁇ m.
  • the present invention provides a method for improving the bright line of the splicing seam of a display screen.
  • the method includes providing at least two pixel module units for splicing to form a display screen; An optical material is arranged on the upper surface, and the pixel module unit provided with the optical material is spliced, so that the splicing seam formed after splicing is filled with the optical material.
  • Filling materials are arranged on the side surfaces of the pixel module units used for splicing to form the display screen, and the filling materials are filled in the splicing seams on the display screen after splicing. Since the splicing seams are filled with materials instead of the air in the prior art after splicing, total reflection cannot easily occur at the edges of the pixel module unit, so that the problem of bright lines of splicing seams on the display screen is improved.

Abstract

一种改善显示屏拼接缝亮线的方法，方法包括：提供多个用于拼接形成显示屏的像素模块单元（10）（S10）；在任一像素模块单元（10）的侧面上设置光学材料（104），对设置有光学材料（104）的像素模块单元（10）进行拼接，使拼接后形成的拼接缝（105）内填充有光学材料（104）（S20）。通过在用于拼接形成显示屏的像素模块单元（10）的侧面上设置光学材料（104），拼接后在显示屏上的拼接缝（105）中填充光学材料（104）。由于拼接后拼接缝（104）之间为光学材料（104）而非现有技术中的空气，使得像素模块单元（10）边缘不容易发生全反射，使得显示屏上拼接缝（105）的亮线问题得到改善。

Description

一种改善显示屏拼接缝亮线的方法 技术领域
本发明涉及半导体光电显示器技术领域，特别涉及一种改善显示屏拼接缝亮线的方法。
背景技术
Micro LED、Mini-LED是新型显示技术，具有OLED相同的高色域高对比度，但其比OLED亮度更高，可靠性和寿命更好。现有的Micro LED、Mini-LED显示屏，其每个像素点由RGB三个芯片组成，通过RGB三基色子像素点单独驱动。Micro LED或者Mini-LED显示屏都是模块化装配生产，如图1所示，这样能提高生产效率；同时能提升Micro LED、Mini-LED坏点的检测和维修效率。
现有的Micro-LED或者Mini-LED显示屏中的发光芯片采用环氧树脂或者硅胶保护层。由于光学环氧树脂或者光学硅胶的折射率在1.4-1.6左右，使得其对空气的全反射角在38-45度角左右。如图2所示，当LED显示做到Micro-LED或者Mini-LED级别时发光芯片离基板边很近，而模压的环氧树脂保护层的厚度大概是发光芯片厚度的数倍以上，这就导致了发光芯片发出的光到基板边环氧树脂的边界的时候很入射角很容易超过全反射角，在拼接缝边缘产生明显的反射亮线，影响显示观看效果。
因而，现有技术还有待改进和提高。
发明内容
鉴于上述现有技术的不足，本发明的目的在于提供一种改善显示屏拼接缝亮线的方法，旨在改善现有Micro-LED或者Mini-LED显示屏上拼接缝亮线的问题。
本发明的技术方案如下：
一种改善显示屏拼接缝亮线的方法，其中，方法包括：
提供多个用于拼接形成显示屏的像素模块单元；
在任一所述像素模块单元的侧面上设置光学材料，对设置有光学材料的所述像素模块单元进行拼接，使拼接后形成的拼接缝内填充有所述光学材料。
所述改善显示屏拼接缝亮线的方法，其中，所述光学材料的折射率，大于等于所述像素模块单元的保护层的折射率。
所述改善显示屏拼接缝亮线的方法，其中，所述光学材料的折射率为1.4-1.7。
所述改善显示屏拼接缝亮线的方法，其中，所述光学材料是采用喷刷的方式设置在所述像素模块单元的侧面上。
所述改善显示屏拼接缝亮线的方法，其中，所述光学材料是通过黏贴的方式设置在所述像素模块单元的侧面上。
所述改善显示屏拼接缝亮线的方法，其中，将设置有光学材料的所述像素模块单元进行拼接后，在所述像素模块单元的出光面上喷刷所述光学材料。
所述改善显示屏拼接缝亮线的方法，其中，设置在所述像素模块单元侧面上的光学材料的厚度为20-100μm。
所述改善显示屏拼接缝亮线的方法，其中，设置有光学材料的所述像素模块单元进行拼接后，在所述像素模块单元的出光面上贴敷由所述光学材料构成的胶膜。
所述改善显示屏拼接缝亮线的方法，其中，所述光学材料为丙烯酸树脂体系材料。
所述改善显示屏拼接缝亮线的方法，其中，所述像素模块单元由RGB三个芯片组成，通过RGB三基色子像素点单独驱动。
有益效果：本发明所提供的改善显示屏拼接缝亮线的方法，通过在用于拼接形成显示屏的像素模块单元的侧面上设置填充材料，拼接后在显示屏上的拼接缝中填充填充材料。由于拼接后拼接缝之间为填充材料而非现有技术中的空气，使得像素模块单元边缘不能容易地发生全反射，使得显示屏上的拼接缝的亮线问题得到改善。
附图说明
图1为现有模块化装配的Micro LED显示装置结构示意图。
图2为现有技术中像素模块单元边缘处光线传播示意图。
图3为本发明所提供的改善显示屏拼接缝亮线的方法较佳实施例流程图。
图4本发明所提供的任一两相邻像素模块单元拼接结构示意图。
图5为本发明所提供的像素模块单元拼接后，在背光面贴敷胶膜工艺示意图。
具体实施方式
本发明提供一种改善显示屏拼接缝亮线的方法，为使本发明的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施方式对本发明作进一步详细说明。应当理解，此处所描述的具体实施方式仅用以解释本发明，并不用于限定本发明。
本文中为部件所编序号本身，例如“第一”、“第二”等，仅用于区分所描述的对象，不具有任何顺序或技术含义。而本发明所说“连接”、“联接”，如无特别说明，均包括直接和间接连接(联接)。在本发明的描述中，需要理解的是，术语“上”、“下”、“前”、“后”、“左”、右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
本技术领域技术人员可以理解，除非另外定义，这里使用的所有术语(包括技术术语和科学术语)，具有与本发明所属领域中的普通技术人员的一般理解相同的意义。还应该理解的是，诸如通用字典中定义的那些术语，应该被理解为具有与现有技术的上下文中的意义一致的意义，并且除非像这里一样被特定定义，否则不会用理想化或过于正式的含义来解释。
下面结合附图，通过对实施例的描述，对发明内容作进一步说明。
请参考图3-4，如图3所示，本实施例提供了一种改善显示屏拼接缝亮线的方法，方法包括步骤：
S10、提供多个用于拼接形成显示屏的像素模块单元。
具体地，提供多个像素模块单元10，用于拼合形成显示屏。像素模块单元可以是模块化装配Micro-LED或Mini-LED显示装置的最小构成单元。如图4所示，像素模块单元包括基板101、设置在基板101上的Micro-LED/Mini-LED芯片102以及封装在Micro-LED/Mini-LED芯片102上的保护层103，保护层103的材质可以是环氧树脂、硅胶等。Micro-LED/Mini-LED芯片102包括RGB三个芯片，通过RGB三基色子像素点单独驱动。
S20、在任一所述像素模块单元10的侧面上设置光学材料104，对设置有光学材料的像素模块单元10进行拼接，使拼接后形成的拼接缝105内填充有光学材料104。
具体地，像素模块单元10的形状可以是立方体或其他形状，例如像素模块单元10的形状为长方体，从下至上依次是基板101、Micro-LED/Mini-LED芯片102以及环氧树脂保护层103。其中，长方体的正面为出光面，长方体的底面为背光面，长方体的侧面为非出光面。用于填充的光学材料104可以是有机材料如丙烯酸树脂，通过改性的丙烯酸树脂，或掺杂黑色颜料如炭黑的丙烯酸树脂体系类材料。为了更好的完成拼接，设置在像素模组单元10非出光面的光学材料104具有一定的粘性和弹性。其中，当具有一定的粘性时，可以使像素模块单元10拼接的更加牢固，当其具有一定的弹性时，在拼接过程中对像素模块单元10进行挤压，可以将拼接缝105中的空气全部挤出。光学材料104在拼接时对拼接缝105起到填充作用。
进一步，将若干个带有光学材料104的像素模块单元10，按照预定的拼接规则进行拼接(如N行M列，每行设置N个像素模块单元、每列设置M个像素模块单元)，拼接完成后即可得到显示屏。需要说明的是，拼接时的电路连接以及其他功能部件的连接均为现有技术，在此不再赘述。
在一种实施方式中，将光学材料104的折射率设置为大于等于所述像素模块单元的保护层103的折射率。因为光从光密介质进入光疏介质时入射角度大于临界角就产生全反射。为了避免发生全反射，可通过改变相邻两种材料的折射率来实现。当设置在像素模块单元10上的光学材料104的折射率大于等于保护层103的折射率时，便可避免光线在像素模块单元10的边缘发生全反射，避免在拼接缝105处出现亮线。
在一种实施方式中，所述光学材料104的折射率为1.4-1.7。
具体地，现有技术中Micro-LED或者Mini-LED级别的发光芯片，其外部模压的保护层103多采用光学环氧树脂或者光学硅胶，其中光学环氧树脂或者光学硅胶的折射率在1.4-1.6左右。选择折射率为1.4-1.7的光学材料设置在像素模块单元的侧面(非出光面)，可以破坏掉发生全反射的条件(光密介质进入光疏介质)，使像素模块单元发出的光在边缘不易出现全反射，从而可以改善显示屏拼接缝隙亮线问题。
在一种实施方式中，所述光学材料104是采用喷刷的方式设置在所述像素模块单元10的侧面上。
具体地，作为举例，选择丙烯酸树脂作为光学材料104，调整丙烯酸树脂的粘度，使其适于涂刷和喷涂。在常温条件下将调配好粘度的丙烯酸树脂涂刷在像素模块单元10的侧面上，使得像素模块单元10的边缘设置一层与其上的保护层折射率相近的遮光层，像素模块单元中的芯片102发出的光在边缘不容易发生全反射。需要说明的是，丙烯酸树脂的粘度调整所用的稀释剂以及粘度的范围、喷涂或涂刷时的操作工艺等，均为现有技术中常用技术，在此不做赘述。
在本实施方式中，像素模块单元10侧面的光学材料104，也可以是通过黏贴的方式进行设置，即事先将光学材料104制备成胶膜，拼接时将胶膜贴敷在像素模块单元的侧面。采用黏贴的方式将光学材料设置在像素模块单元的侧面，可以使光学材料的设置操作更加方便。
在一种或多种实施方式中，将设置有光学材料104的像素模块单元10进行拼接后，在与像素模块单元10的出光面上喷刷光学材料104。
具体地，当将像素模块单元10拼接完成后，可在拼接后的像素模块单元10出光面上再喷刷一层光学材料104。一方面，可以对拼接缝105再次进行填充，防止出现拼接缝隙填充不到位的问题。另一方面，还可以对拼接后的像素模块单元10起到密封保护的作用。此处所用的光学材料可以与像素模块单元侧面的光学材料相同也可以不同，为了操作的方便通常选择相同的光学材料。
可选地，在本实施方式中，在出光面上形成的光学材料层的厚度为从5μm到10μm，从10μm到15μm，从15μm到20μm，从20μm到25μm。
如图5所示，在一种实施方式中，当像素模块单元10拼接完成后，还可以 在其出光面上粘附一层胶膜106，胶膜106的材质与像素模块单元10侧面上的光学材料104相同也可以不同，当胶膜106与像素模块单元10侧面上的光学材料104不相同时，要求其折射率也尽可能的要大于等于像素模块单元的保护层的折射率。
可选地，胶膜106的厚度可选的为10μm到15μm，从15μm到20μm，从20μm-25μm，从25μm-30μm，从30μm到35μm，从35μm-40μm。
在本实施方式中，胶膜106可以通过滚压或模压形式将其粘附在拼接后的像素模块单元10的出光面上。利用胶膜106的弹性好流动性，滚压或模压后填平在缝隙105中。一方面，可以对拼接缝105再次进行填充，防止出现拼接缝填充不到位的地方。另一方面，对拼接后的像素模块单元10起到密封保护的作用。
在一种实施方式中，设置在所述像素模块单元10侧面上的光学材料104的厚度为20-100μm。
可选地，设置在所述像素模块单元10侧面上的光学材料104的厚度可以为20μm到30μm，从30μm到40μm，从40μm-50μm，从50μm-60μm，从60μm到70μm，从70μm-80μm，从80μm到90μm，从90到100μm。
综上所述，本发明所提供的一种改善显示屏拼接缝亮线的方法，方法包括，提供至少两个用于拼接形成显示屏的像素模块单元；在任一所述像素模块单元的侧面上设置光学材料，对设置有光学材料的所述像素模块单元进行拼接，使拼接后形成的拼接缝内填充有所述光学材料。通过在用于拼接形成显示屏的像素模块单元的侧面上设置填充材料，拼接后在显示屏上的拼接缝中填充填充材料。由于拼接后拼接缝之间为填充材料而非现有技术中的空气，使得像素模块单元边缘不能容易地发生全反射，使得显示屏上的拼接缝的亮线问题得到改善。
应当理解的是，本发明的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本本发明所附权利要求的保护范围。

Claims (10)

  1. 一种改善显示屏拼接缝亮线的方法，其特征在于，方法包括：
    提供多个用于拼接形成显示屏的像素模块单元；
    在任一所述像素模块单元的侧面上设置光学材料，对设置有光学材料的所述像素模块单元进行拼接，使拼接后形成的拼接缝内填充有所述光学材料。
  2. 根据权利要求1所述改善显示屏拼接缝亮线的方法，其特征在于，所述光学材料的折射率，大于等于所述像素模块单元的保护层的折射率。
  3. 根据权利要求2所述改善显示屏拼接缝亮线的方法，其特征在于，所述光学材料的折射率为1.4-1.7。
  4. 根据权利要求1所述改善显示屏拼接缝亮线的方法，其特征在于，所述光学材料是采用喷刷的方式设置在所述像素模块单元的侧面上。
  5. 根据权利要求1所述改善显示屏拼接缝亮线的方法，其特征在于，所述光学材料是通过黏贴的方式设置在所述像素模块单元的侧面上。
  6. 根据权利要求1所述改善显示屏拼接缝亮线的方法，其特征在于，将设置有光学材料的所述像素模块单元进行拼接后，在所述像素模块单元的出光面上喷刷所述光学材料。
  7. 根据权利要求1所述改善显示屏拼接缝亮线的方法，其特征在于，设置在所述像素模块单元侧面上的光学材料的厚度为20-100μm。
  8. 根据权利要求1所述改善显示屏拼接缝亮线的方法，其特征在于，设置有光学材料的所述像素模块单元进行拼接后，在所述像素模块单元的出光面上贴敷由所述光学材料构成的胶膜。
  9. 根据权利要求1所述改善显示屏拼接缝亮线的方法，其特征在于，所述光学材料为丙烯酸树脂体系材料。
  10. 根据权利要求1所述改善显示屏拼接缝亮线的方法，其特征在于，所述像素模块单元由RGB三个芯片组成，通过RGB三基色子像素点单独驱动。
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