WO2021120954A1 - 光学组件、感光组件、摄像模组、光学组件和感光组件的制备方法 - Google Patents

光学组件、感光组件、摄像模组、光学组件和感光组件的制备方法 Download PDF

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Publication number
WO2021120954A1
WO2021120954A1 PCT/CN2020/129329 CN2020129329W WO2021120954A1 WO 2021120954 A1 WO2021120954 A1 WO 2021120954A1 CN 2020129329 W CN2020129329 W CN 2020129329W WO 2021120954 A1 WO2021120954 A1 WO 2021120954A1
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WO
WIPO (PCT)
Prior art keywords
dielectric layer
photosensitive
filter element
circuit board
support
Prior art date
Application number
PCT/CN2020/129329
Other languages
English (en)
French (fr)
Inventor
陈烈烽
梅哲文
叶林敏
孟楠
方银丽
王天一
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to CN202080085309.9A priority Critical patent/CN114982215A/zh
Publication of WO2021120954A1 publication Critical patent/WO2021120954A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
    • G02B13/0065—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element having a beam-folding prism or mirror
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/02—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices involving prisms or mirrors
    • G02B23/08—Periscopes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/1805—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/17—Bodies with reflectors arranged in beam forming the photographic image, e.g. for reducing dimensions of camera
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present application relates to the field of camera modules, and more specifically, to a method for preparing optical components, photosensitive components, camera modules, optical components, and photosensitive components.
  • the size of the matching filter element As the size of the photosensitive chip gradually increases, the size of the matching filter element also needs to increase accordingly.
  • the filter element is a sensitive and fragile element, and as the size increases, its sensitivity and fragility will further increase.
  • the main purpose of this application is to provide an optical component, a photosensitive component, a camera module, an optical component, and a method for preparing the photosensitive component, which is achieved by arranging a medium layer between the filter element in the camera module and its supporting part. Avoiding that the stress generated by the deformation of the support part of the filter element is concentrated on the filter element, causing the deformation of the filter element to exceed a predetermined threshold, resulting in damage to the filter element and the camera module The image quality is reduced.
  • Another object of the present application is to provide an optical component, a photosensitive component, a camera module, an optical component, and a method for preparing the photosensitive component, which is achieved by arranging a medium layer between the photosensitive chip in the camera module and its supporting part. Avoid the deterioration of image quality caused by the deformation of the photosensitive chip.
  • an optical assembly including:
  • the dielectric layer is arranged between the support and the filter element, and has a predetermined flexibility for preventing the amount of deformation of the filter element from exceeding a predetermined threshold.
  • the filter element is mounted on the holder through the dielectric layer.
  • the optical assembly further includes a support, the support is disposed on the support, the support and the surface of the support form a receiving cavity, wherein the dielectric layer is passed through The adhesive applied in the receiving cavity is cured and formed.
  • the optical assembly further includes an adhesive member, and the medium layer is respectively connected to the support and the filter element through the adhesive member.
  • the optical assembly further includes an adhesive member, wherein the dielectric layer is integrally formed on the bracket, and the dielectric layer is connected to the filter element through the adhesive member.
  • the optical assembly further includes an adhesive member, wherein the dielectric layer is integrally formed on the lower surface of the filter element, and the dielectric layer is connected to the adhesive member through the adhesive member. Bracket connection.
  • the medium layer is made of a flexible material, and the Shore hardness of the flexible material is 10HSA-70HSA.
  • the material of the dielectric layer is selected from any one of foam, a combination of plastic and foam, soft glue and silica gel.
  • the thickness of the dielectric layer is 80 um-130 um.
  • the thickness of the medium layer is 20um-100um.
  • the thickness of the medium layer is 50 um-100 um.
  • the amount of deformation that can occur on the dielectric layer is 5%-50% of its own thickness.
  • the amount of deformation that can occur on the dielectric layer is 5%-50% of its own thickness.
  • the bracket includes a support part and a suspension part extending inward from the support part, and the filter element is attached to the suspension part.
  • the upper surface of the suspension portion is lower than the upper surface of the support portion, and the upper surface of the filter element is lower than the upper surface of the support portion.
  • a photosensitive component which includes:
  • a photosensitive chip electrically connected to the circuit board
  • optical component as described above, wherein the optical component is disposed on the circuit board, and the filter element is located in the photosensitive path of the photosensitive chip.
  • the photosensitive assembly further includes a base provided on the circuit board, wherein the optical assembly is mounted on the base.
  • a camera module which includes:
  • the photosensitive component, the optical lens is held in the photosensitive path of the photosensitive component, wherein the photosensitive component includes the optical component as described above.
  • an optical component which includes:
  • a dielectric layer is formed between the support and the filter element.
  • forming a dielectric layer between the support and the filter element includes: forming the dielectric layer on the support; and installing the filter on the dielectric layer Light components.
  • forming a dielectric layer between the support and the filter element includes: forming the dielectric layer on the lower surface of the filter element; and The filter element of the dielectric layer is attached to the bracket.
  • forming the dielectric layer on the bracket includes: applying an adhesive member on the bracket; and attaching the dielectric layer to the adhesive member so as to The dielectric layer is formed on the support.
  • forming the dielectric layer on the support includes: integrally forming the dielectric layer on the support.
  • installing the filter element on the dielectric layer includes:
  • forming a dielectric layer between the support and the filter element includes: arranging a support on the support, and the support and the surface of the support form a receiving cavity; Applying an adhesive in the receiving cavity; attaching the filter element to the adhesive; and curing the adhesive to form a dielectric layer between the support and the filter element.
  • the method further includes: removing the support.
  • a photosensitive assembly including:
  • a photosensitive chip electrically connected to the circuit board
  • the medium layer is arranged between the circuit board and the photosensitive chip, and has a predetermined flexibility for preventing deformation of the photosensitive chip.
  • the photosensitive chip is mounted on the circuit board through the dielectric layer.
  • the photosensitive component further comprising a support member provided on the circuit board, the support member and the surface of the circuit board form a receiving cavity, wherein the dielectric layer is applied to The adhesive in the receiving cavity is cured and formed.
  • the photosensitive component further includes an adhesive member, and the medium layer is respectively connected to the circuit board and the photosensitive chip through the adhesive member.
  • an adhesive member is further included, wherein the dielectric layer is integrally formed on the circuit board, and the dielectric layer is connected to the photosensitive chip through the adhesive member.
  • the photosensitive component further comprising an adhesive member, wherein the medium layer is integrally formed on the lower surface of the photosensitive chip, and the medium layer is connected to the circuit board through the adhesive member.
  • the medium layer is made of a flexible material, and the Shore hardness of the flexible material is 10HSA-70HSA.
  • the material of the dielectric layer is selected from any one of foam, a combination of plastic and foam, soft glue and silica gel.
  • the thickness of the dielectric layer is 80 um-130 um.
  • the thickness of the medium layer is 20um-100um.
  • the medium layer is made of a flexible material with adhesiveness.
  • the thickness of the medium layer is 50 um-100 um.
  • the amount of deformation that can occur on the dielectric layer is 5%-50% of its own thickness.
  • the amount of deformation that can occur on the dielectric layer is 5%-50% of its own thickness.
  • a camera module which includes:
  • the optical lens is held on the photosensitive path of the photosensitive component.
  • an electronic device which includes:
  • the main body of the electronic equipment The main body of the electronic equipment.
  • the camera module assembled in the main body of the electronic device, wherein the camera module includes the photosensitive component as described above.
  • a method for manufacturing a photosensitive component which includes:
  • a dielectric layer is formed between the circuit board and the photosensitive chip.
  • forming a dielectric layer between the circuit board and the photosensitive chip includes:
  • the photosensitive chip is mounted on the medium layer.
  • forming a dielectric layer between the circuit board and the photosensitive chip includes:
  • the photosensitive chip with the dielectric layer is mounted on the circuit board.
  • forming the dielectric layer on the circuit board includes:
  • forming the dielectric layer on the circuit board includes:
  • the dielectric layer is integrally formed on the circuit board.
  • mounting the photosensitive chip on the medium layer includes:
  • forming a dielectric layer between the circuit board and the photosensitive chip includes:
  • a supporting member is arranged on the circuit board, and the supporting member and the surface of the circuit board form a receiving cavity;
  • the method further includes: removing the support.
  • FIG. 1 illustrates a schematic diagram of an inclination of a filter element relative to a photosensitive chip in a conventional camera module.
  • Fig. 2 illustrates a schematic diagram of an optical assembly according to an embodiment of the present application.
  • Fig. 3 illustrates a schematic diagram of deformation of the optical component according to an embodiment of the present application.
  • Fig. 4 illustrates a schematic diagram of an optical assembly according to another embodiment of the present application.
  • Fig. 5 illustrates a schematic diagram of a modified embodiment of the optical assembly according to another embodiment of the present application.
  • Fig. 6 illustrates a schematic diagram of another modified embodiment of the optical assembly according to another embodiment of the present application.
  • Fig. 7 illustrates a schematic diagram of a camera module according to an embodiment of the present application.
  • FIG. 8 illustrates a schematic diagram of a modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 9 illustrates a schematic diagram of the deformation of the photosensitive chip in the conventional camera module.
  • Fig. 10 illustrates a schematic diagram of a photosensitive assembly according to an embodiment of the present application.
  • Fig. 11 illustrates a curved schematic diagram of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 12 illustrates a schematic diagram of a photosensitive assembly according to another embodiment of the present application.
  • FIG. 13 illustrates a schematic diagram of a modified embodiment of the photosensitive assembly according to another embodiment of the present application.
  • FIG. 14 illustrates a schematic diagram of another modified embodiment of the photosensitive assembly according to another embodiment of the present application.
  • FIG. 15 illustrates a schematic diagram of a camera module according to an embodiment of the present application.
  • FIG. 16 illustrates a schematic diagram of a modified implementation of the camera module according to an embodiment of the present application.
  • Fig. 17 illustrates a schematic diagram of an electronic device according to an embodiment of the present application.
  • the filter element is a sensitive and fragile component. As its size increases, its sensitivity and fragility will further increase. In practical industrial applications, there have been a number of problems brought about after the size of the filter element is increased, for example, the filter element is more likely to be damaged or even cracked, and the filter element is tilted relative to the photosensitive chip.
  • the filter element 71P has an important function of filtering and preventing stray light.
  • the increase in area size and the demand for miniaturization of the camera module also limit its thickness. That is, the area of the filter element 71P gradually increases, and at the same time, its thickness has a tendency to become smaller. Therefore, the filter element The ratio of area to thickness of 71P will increase. In terms of physical performance, the filter element 71P with an increased ratio of area to thickness is more susceptible to deformation and more fragile.
  • the filter element 71P Since the coefficient of thermal expansion (CTE) between the support 72P for carrying the filter element 71P and the filter element 71P is too large, when the ambient temperature changes, the stress generated by the deformation of the support 72P will act on The filter element 71P, when the stress of the filter element 71P exceeds the predetermined threshold and the deformation of the filter element 71P exceeds the predetermined threshold, the filter element 71P will be damaged or even cracked. After the test, the deformation of the filter element 71P will be damaged or even broken.
  • the preset threshold value is 4000 ⁇ e, that is, when the amount of deformation that occurs exceeds 4000 ⁇ e, the filter element 71P will be damaged or even broken.
  • the filter element 71P has micro-cracks in itself, and these micro-cracks will cause stress concentration and increase the probability of damage or cracking.
  • FIG. 1 illustrates a schematic diagram of an inclination of the filter element 71P relative to the photosensitive chip in the conventional camera module. The obliquely installed filter element 71P will cause the focal length of the imaging system to change and cause image shift.
  • the inclination of the filter will also cause the incident angle of the external light to the filter element 71P to be different from the ideal situation, which will easily lead to an increase in stray light.
  • the uneven surface of the bracket 72P causes the support area of the filter element 71P to decrease, which increases the risk of damage to the filter element 71P.
  • the basic idea of this application is to prevent the filter element from being damaged due to its own deformation and imaging of the camera module by disposing a dielectric layer between the filter element in the camera module and its supporting part. Decrease in quality.
  • the present application proposes a photosensitive component, which includes: a filter element, a support for carrying the filter element, and a dielectric layer, wherein the dielectric layer is disposed on the circuit board and the Between the photosensitive chips, there is a predetermined flexibility for preventing the amount of deformation of the filter element from exceeding a predetermined threshold.
  • a dielectric layer between the filter element and its supporting part in the camera module, the stress generated by the filter element due to the deformation of the supporting part is prevented from being concentrated on the filter element and causing the filter element.
  • the amount of deformation generated by the light element exceeds a predetermined threshold, which results in damage to the filter element and degradation of the imaging quality of the camera module.
  • Fig. 2 illustrates a schematic diagram of an optical assembly according to an embodiment of the present application.
  • the optical assembly 710 includes a filter element 711, a dielectric layer 712, and a bracket 713.
  • the filter element 711 is mounted on the bracket through the dielectric layer 712. 713.
  • the dielectric layer 712 can effectively absorb the stress on the filter element 711 caused by the deformation of the bracket 713, thereby avoiding the stress of the filter element 711 due to the deformation of its supporting part from being concentrated on
  • the filter element 711 causes the amount of deformation generated by the filter element 711 to exceed a predetermined threshold, which in turn causes the filter element 711 to be damaged.
  • the preset threshold is 4000 ⁇ e. In other words, even if the bracket 713 of the optical component 710 is deformed during the heating or cooling process, or external stress acts on the bracket to cause it to deform, the dielectric layer 712 will ensure the filter element 711 The stability.
  • the dielectric layer 712 is preferably implemented as a flexible material, which has a predetermined flexibility for preventing the deformation of the filter element 711 from exceeding a predetermined threshold, that is,
  • the predetermined flexibility of the filter element 711 is not a specific value, and it only needs to be able to prevent the deformation of the filter element due to stress from being lower than 4000 ⁇ e.
  • the Shore hardness of the flexible material can be selected to be 10HSA-70HSA, for example, 20HSA, 30HSA, which can compress 5%-50% (preferably, 30%-50%) of its thickness under external force.
  • the upper surface of the dielectric layer 712 corresponds to the filter element 711, and the lower surface corresponds to the bracket 713.
  • the support 713 is deformed, and the force of the deformation of the support 713 will cause the lower surface of the dielectric layer 712 to deform.
  • the dielectric layer 712 can compress 5%-50% of its own thickness (preferably, 30%-50%), or stretch 5%-50% (preferably, 30%-50%) of its own thickness, Then its upper surface will not be bent, it is still close to a plane, and the deformation force of the bracket 713 will not act on the filter element 711, as shown in FIG. 3, therefore, the photosensitive surface of the filter element 711 can remain Better flatness can reduce light divergence.
  • the flatness of the photosensitive surface of the filter element 711 can be 0.701 ⁇ -0.72 ⁇ ( ⁇ is the light wavelength symbol), or in other words, the light-sensitive surface of the filter element 711 The flatness of the photosensitive surface is below 0.716um. It can also be understood that the hardness of the filter element 711 is greater than that of the dielectric layer 712, so the deformation (bending) of the filter element 711 can be suppressed by the deformation of the dielectric layer 712.
  • the material of the dielectric layer 712 can be implemented as foam, PET (polyethylene terephthalate, a kind of plastic material) + PU (PU is foam Cotton), soft rubber, silica gel, etc., among them, PET+PU can be understood as foaming on the PET material to form a PU layer.
  • PET can also be implemented as other plastic materials, and even PET can be replaced with metal, that is, on metal The upper foaming forms a PU layer.
  • the optical assembly 710 further includes at least one adhesive member 714, and the dielectric layer 712 is connected to the bracket 713 and the filter through the adhesive member 714, respectively.
  • the components 711 are connected, and the adhesive 714 can be implemented as a glue, double-sided tape, or other adhesive tools with adhesive properties. That is to say, in the embodiment of the present application, the adhesive 714 is first provided on the dielectric layer 712, the filter element 711 or the bracket 713, and then the adhesive 714 is used to connect the The dielectric layer 712, the bracket 713, and the filter element 711 are fixed to form the optical assembly 710.
  • the thickness of the foam is 80-130um, preferably 100um.
  • the thickness of the filter element 711 is 0.715-2.75mm, preferably 1 ⁇ 2mm; the thickness of the adhesive 714 is 20um-40um.
  • the thickness of the soft glue is 20-100 um, preferably 50 um.
  • the thickness of the filter element 711 is 0.715-2.75 mm, preferably 1 mm-2 mm.
  • the dielectric layer 712 may be integrally formed with the bracket 713, that is, the dielectric layer 712 and the bracket 713 are an integral structure.
  • the dielectric layer 712 may be formed on the support 713 through processes such as coating, spraying, printing, foaming, and the like.
  • the medium layer 712 is a foam layer
  • the medium layer 712 can be formed by pre-setting materials on the bracket 713 through foaming.
  • the foam layer ie, the dielectric layer 712
  • the parameters and performance of the dielectric layer 712 are the same as or similar to those in the foregoing embodiment.
  • the preparation process of the optical assembly 710 may be: first forming the dielectric layer 712 on the bracket 713, and then using the adhesive 714 to connect the filter element 711 is fixed to the dielectric layer 712 to form the optical component 710.
  • the dielectric layer 712 and the filter element 711 are integrally formed, that is, the dielectric layer 712 and the filter element 711 have an integral structure, for example, the medium
  • the layer 712 may be formed on the filter element 711 through processes such as coating, spraying, printing, foaming, and the like.
  • the bracket 713 includes a support portion 7131 and a suspension portion 7132 extending inward from the support portion 7131, and the filter element 711 is mounted on the support portion 7131. ⁇ suspended part 7132.
  • the upper surface of the support portion 7131 is higher than the height of the upper surface of the suspension portion 7132, that is, there is a gap between the suspension portion 7132 and the support portion 7131 to form a protective cavity for accommodating the filter element 711. More preferably, when the filter element 711 is mounted in the protective cavity, the upper surface of the filter element 711 is lower than the upper surface of the support portion 7131.
  • the filter element 711 can be implemented as various types of filter elements, including but not limited to infrared cut filters, full transmission spectral filters, and other filters.
  • Light sheet or a combination of multiple filters when the filter element 711 is implemented as a combination of an infrared cut filter and a full transmission spectrum filter, that is, the infrared cut filter and the full transmission spectrum filter can be Switch to be selectively located on the light-sensing path of the filter element 711, so that when used in an environment with sufficient light such as daytime, the infrared cut filter can be switched to the light-sensing path of the filter element 711 Path, to filter the infrared rays in the light reflected by the object entering the filter element 711 through the infrared cut filter, and when used in a dark environment such as night, the fully transparent
  • the spectral filter is switched to the light-sensing path of the filter element 711 to allow part of the in
  • the optical assembly 710 is composed of the filter element 711, the bonding member 714 and the bracket 713, wherein the thickness of the bonding member 714 is 50um. -100um (including equal to 50um and equal to 100um). That is, in this implementation, the function of the adhesive member 714 is equivalent to the combination of the dielectric layer 712 and the adhesive member 714 in Embodiment 71, or in other words, the function of the adhesive member 714 in Embodiment 71
  • the dielectric layer 712 is implemented to be formed by curing an adhesive with a thickness of 50um-100um.
  • the supporting member 715 is disposed on the bracket 713, the supporting member 715 and the upper surface of the bracket 713 form a receiving cavity 7150, and the bonding member 714 (glue) is disposed in the receiving cavity 7150.
  • the filter element 711 is attached to the adhesive 714, and then the adhesive 714 is cured by a process such as baking to form the optical component 710. As shown in FIG.
  • the support 715 includes an inner support unit 7151 and an outer support unit 7152, the receiving cavity 7150 is formed on the support surface, and the inner side surface of the inner support unit 7151 and Between the inner side surfaces of the outer support unit 7152, and both the inner support unit 7151 and the outer support unit 7152 have a ring structure.
  • the height of the outer support unit 7152 is higher than the height of the inner support unit 7151.
  • the heights of the inner support unit 7151 and the outer support unit 7152 can also be Equal, this is not limited by this application.
  • the adhesive 714 is preferably glue, which has a certain flexibility.
  • the adhesive 714 still has a certain flexibility after being cured into the adhesive 714.
  • the upper surface of the bonding member 714 faces the filter element 711, and the lower surface faces the bracket 713.
  • the bracket 713 is deformed, and the deformation force of the bracket 713 drives the bracket 713.
  • the lower surface of the bonding member 714 is deformed. Since the bonding member 714 is flexible and has a thickness of 50um-100um, the upper surface of the bonding member 714 will not be affected and bend, and it is still close to a flat surface.
  • the bracket 713 is deformed The force of ⁇ will not act on the filter element 711, therefore, the filter element 711 can maintain a good flatness.
  • the adhesive member 714 has a relatively large deformability. Specifically, the adhesive member 714 can compress its thickness by 5%-50% (preferably, 30%- 50%), or stretch 5%-50% of its own thickness (preferably, 30%-50%). Correspondingly, when the environmental temperature changes and the bracket 713 is deformed, the deformation force of the bracket 713 will drive the deformation of the lower surface of the adhesive member 714, because the dielectric layer 712 can compress 5%-50% of its thickness. (Preferably, 30%-50%), or stretch 5%-50% of its own thickness (preferably, 30%-50%), then the upper surface will not be bent, and it is still close to a flat surface. The deformation force of 713 will not act on the filter element 711. Therefore, the reflective surface of the filter element 711 can maintain a good flatness, which can reduce light divergence.
  • the thickness of the bonding member 714 is lower than the height of the supporting member 715. That is to say, during the preparation process, the thickness of the glue is smaller than the height of the supporting member 715, so that the glue is completely contained in the receiving cavity 7150, and at the same time, the filter element 711 is also contained in the receiving cavity 7150. Inside the cavity 7150.
  • the thickness of the glue may also be greater than or equal to the height of the support 715.
  • the thickness of the adhesive 714 is greater than the height of the support 715. It should be understood that since the glue has a certain viscosity, the However, even if the difference between the thickness of the glue and the height of the support 715 is within a certain range, the glue will not overflow from the receiving cavity 7150.
  • the supporting member 715 may also be optionally removed after the glue is cured to form the adhesive member 714, that is, the optical component 710 does not include The support 715, as shown in Figure 6
  • Fig. 7 illustrates a schematic diagram of a camera module according to an embodiment of the present application.
  • the camera module includes: a photosensitive component 720 and an optical lens 730 held on the photosensitive path of the optical component 720, wherein the photosensitive component 720 includes embodiments 71 and 72 disclosed ⁇ optical assembly 710.
  • the photosensitive component further includes a circuit board 721, a photosensitive chip 722 electrically connected to the circuit board 721, and at least one electronic component 723 disposed on the circuit board 721 ,
  • the optical component 710 is disposed on the circuit board 721. More specifically, the bracket 713 of the optical component 710 is mounted on the circuit board 721, and the filter element 711 is located in the photosensitive path of the photosensitive chip 722.
  • FIG. 8 illustrates a schematic diagram of a modified embodiment of the camera module according to an embodiment of the present application.
  • the camera module is further disposed on the base 724 of the circuit board, and the optical component 710 is installed on the base 724. That is, in this modified embodiment, the installation method of the optical assembly 710 is changed.
  • the base 724 is a molded base integrally formed on the circuit board 721 through a molding process.
  • the base 724 may also be implemented as other Type of base, and the position of the base 724 integrally formed on the circuit board can be adjusted.
  • the camera module can be further applied to electronic devices, such as smart phones, tablet computers, etc., as a front camera module or a rear camera module of the electronic device.
  • a method for manufacturing the optical component 710 is also provided.
  • the method for preparing the optical component 710 includes: providing a support 713 and a filter element 711; A dielectric layer 712 is formed between the optical elements 711.
  • forming a dielectric layer 712 between the support 713 and the filter element 711 includes: forming the dielectric layer 712 on the support 713; And, the filter element 711 is mounted on the dielectric layer 712.
  • forming a dielectric layer 712 between the support 713 and the filter element 711 includes: forming a dielectric layer 712 on the lower surface of the filter element 711 The dielectric layer 712; and, the filter element 711 with the dielectric layer 712 is mounted on the bracket 713.
  • forming the dielectric layer 712 on the support 713 includes: applying an adhesive 714 on the support 713; and attaching the dielectric layer 712 On the bonding member 714 to form the dielectric layer 712 on the bracket 713.
  • forming the dielectric layer 712 on the support 713 includes: integrally forming the dielectric layer 712 on the support 713.
  • mounting the filter element 711 on the dielectric layer 712 includes: applying an adhesive 714 on the dielectric layer 712; and mounting The filter element 711 is attached to the adhesive 714 to mount the filter element 711 on the dielectric layer 712.
  • forming the dielectric layer 712 between the support 713 and the filter element 711 includes: forming a support 715 on the support 713, wherein the support 715 and the surface of the bracket 713 form a receiving cavity 7150; applying an adhesive in the receiving cavity 7150; attaching the filter element 711 to the adhesive; and curing the adhesive so as to The dielectric layer 712 is formed between the support 713 and the filter element 711.
  • the method further includes removing the support 715.
  • the dielectric layer 712 is made of a flexible material, and the Shore hardness of the flexible material is 10HSA-70HSA.
  • the material of the dielectric layer 712 is selected from any one of foam, a combination of plastic and foam, soft glue and silica gel.
  • the thickness of the dielectric layer 712 is 80 um-130 um.
  • the thickness of the dielectric layer 712 is 20 um-100 um. The amount of deformation that the dielectric layer 712 can occur is 5%-50% of its thickness.
  • the photosensitive chip 81P is often attached to the upper surface of the circuit board 82P through a COB (Chip on Board) process, that is, the photosensitive chip 81P is attached to the photosensitive chip 81P through an adhesive.
  • COB Chip on Board
  • the upper surface Generally, the coefficient of thermal expansion (CTE) between the photosensitive chip 81P and the circuit board 82P is too different. Therefore, during the working process, affected by the environmental temperature change, the circuit board 82P will deform and cause the photosensitive chip The 81P is deformed, and the specific deformation form is: the photosensitive chip 81P is bent toward the optical lens side to form a shape similar to a "crying face", as shown in FIG. 9.
  • FIG. 9 illustrates a schematic diagram of the bending of the photosensitive chip 81P in the conventional camera module.
  • the actual focal plane forms an arc convex toward the side of the circuit board 82P, that is, the actual focal plane is an arc surface. It should be seen that the "crying face"-like deformation is exactly the opposite of the actual focal plane deformation, causing distortion, corner loss of light, and sharp angle drop, and other undesirable phenomena are aggravated, which more seriously affects the imaging of the camera module. quality.
  • the basic idea of the present application is to avoid the degradation of imaging quality caused by the deformation of the photosensitive chip by disposing a medium layer between the photosensitive chip and its supporting part in the camera module.
  • the present application proposes a photosensitive component, which includes: a circuit board; a photosensitive chip electrically connected to the circuit board; and, a dielectric layer, which is disposed on the circuit board and the photosensitive chip In between, there is a predetermined flexibility for preventing deformation of the photosensitive chip.
  • a photosensitive component which includes: a circuit board; a photosensitive chip electrically connected to the circuit board; and, a dielectric layer, which is disposed on the circuit board and the photosensitive chip In between, there is a predetermined flexibility for preventing deformation of the photosensitive chip.
  • Fig. 10 illustrates a schematic diagram of a photosensitive assembly according to an embodiment of the present application.
  • the photosensitive assembly 810 includes a photosensitive chip 811, a dielectric layer 812, and a circuit board 813.
  • the photosensitive chip 811 is mounted on the circuit board through the dielectric layer 812. 813.
  • the photosensitive chip 811 is conductively connected to the circuit board through an electrical connection medium such as a wire, wherein the dielectric layer 812 can effectively prevent the photosensitive chip 811 from bending.
  • the dielectric layer 812 will ensure the stability of the photosensitive chip 811.
  • the dielectric layer 812 is preferably implemented as a flexible material
  • the shore hardness of the flexible material is 10HSA-70HSA, for example, 20HSA, 30HSA, which can compress 5 of its own thickness under external force. %-50% (preferably, 30%-50%), or 5%-50% (preferably, 30%-50%) of the thickness of the stretch itself, where 10HSA means measured by A-type Shore hardness tester
  • the Shore hardness value of 10, 70HSA, 20HSA, 30HSA can be known in the same way.
  • the upper surface of the dielectric layer 812 corresponds to the photosensitive chip 811, and the lower surface corresponds to the circuit board 813.
  • the circuit board 813 When the environmental temperature changes, the circuit board 813 is deformed. The force of the deformation of the circuit board 813 will drive the deformation of the lower surface of the dielectric layer 812. Since the dielectric layer 812 can compress 5%-50% of its own thickness (preferably, 30%-50%), or stretch 5%-50% of its own thickness (preferably, 30%-50%), Then its upper surface will not be bent, it is still close to a plane, and the force of the deformation of the circuit board 813 will not act on the photosensitive chip 811, as shown in FIG. 11, therefore, the photosensitive surface of the photosensitive chip 811 can remain relatively flat. Good flatness can reduce light divergence.
  • the flatness of the photosensitive surface of the photosensitive chip 811 can be 0.801 ⁇ -0.82 ⁇ ( ⁇ is the light wavelength symbol), or in other words, the photosensitive surface of the photosensitive chip 811 The flatness is below 0.816um. It can also be understood that the hardness of the photosensitive chip 811 is greater than that of the dielectric layer 812, so the deformation (bending) of the photosensitive chip 811 can be suppressed by the deformation of the dielectric layer 812.
  • the material of the dielectric layer 812 can be implemented as foam, polyethylene terephthalate (English name: Polyethylene terephthalate, PET for short) + polyurethane (English name : Polyuretha, PU for short), soft rubber, silica gel, etc., among them, PET+PU can be understood as foaming on the PET material to form a PU layer.
  • PET can also be implemented as other plastic materials, and even PET can be replaced with metal , That is, foaming on the metal to form a PU layer.
  • the photosensitive component 810 further includes at least one adhesive member 814, and the dielectric layer 812 is connected to the circuit board 813 and the photosensitive member through the adhesive member 814, respectively.
  • the chip 811 is connected, and the adhesive member 814 can be implemented as an adhesive tool with adhesive properties such as glue or double-sided tape. That is to say, in the embodiment of the present application, the adhesive 814 is first provided on the dielectric layer 812, the photosensitive chip 811 or the circuit board 813, and then the adhesive 814 is used to connect the The dielectric layer 812, the circuit board 813, and the photosensitive chip 811 are fixed to form the photosensitive component 810.
  • the thickness of the foam is 80-130um, preferably 100um.
  • the thickness of the photosensitive chip 811 is 0.815-2.85 mm, preferably 1- 2mm; the thickness of the adhesive 814 is 20um-40um.
  • the thickness of the soft glue is 20-100 um, preferably 50 um.
  • the thickness of the photosensitive chip 811 is 0.815-2.85 mm, preferably 1 mm-2 mm.
  • the dielectric layer 812 may be integrally formed with the circuit board 813, that is, the dielectric layer 812 and the circuit board 813 are an integral structure.
  • the dielectric layer 812 may be formed on the circuit board 813 through processes such as coating, spraying, printing, and foaming.
  • the dielectric layer 812 when the dielectric layer 812 is a foam layer, the dielectric layer 812 can be formed by pre-setting materials on the circuit board 813 through foaming. In this way, the foam layer (ie, the dielectric layer 812) does not need to be fixed to the circuit board 813 by the adhesive 814, which can further effectively control the error caused by the adhesive 814, which is beneficial for improvement.
  • the parameters and performance of the dielectric layer 812 are the same as or similar to those in the foregoing embodiment.
  • the preparation process of the photosensitive component 810 may be: first forming the dielectric layer 812 on the circuit board 813, and then bonding the photosensitive chip through the adhesive 814 811 is fixed to the dielectric layer 812 to form the photosensitive component 810.
  • the dielectric layer 812 and the photosensitive chip 811 are integrally formed, that is, the dielectric layer 812 and the photosensitive chip 811 have an integral structure, for example, the dielectric layer 812
  • the photosensitive chip 811 can be formed on the photosensitive chip 811 through processes such as coating, spraying, printing, and foaming.
  • the photosensitive component 810 is composed of the photosensitive chip 811, the adhesive 814 and the circuit board 813, wherein the thickness of the adhesive 814 is 50um. -100um (including equal to 50um and equal to 100um). That is, in this implementation, the function of the adhesive member 814 is equivalent to the combination of the dielectric layer 812 and the adhesive member 814 in Embodiment 81, or in other words, the function of the adhesive member 814 in Embodiment 81
  • the dielectric layer 812 is implemented to be formed by curing an adhesive with a thickness of 50um-100um.
  • the supporting member 815 is configured as the circuit board 813, the inner side of the supporting member 815 and the upper surface of the circuit board 813 form a receiving cavity 8150, and the adhesive 814 (glue) is covered by The photosensitive chip 811 is attached to the bonding member 814, and then the bonding member 814 is cured by a process such as baking to form the photosensitive member 810.
  • the cross section of the support 815 may be implemented as a ring or a ring-like shape.
  • the adhesive 814 is preferably glue, which has a certain flexibility.
  • the adhesive 814 still has a certain flexibility after being cured into the adhesive 814.
  • the upper surface of the bonding member 814 faces the photosensitive chip 811, and the lower surface faces the circuit board 813.
  • the force of the deformation of the circuit board 813 drives The lower surface of the bonding member 814 is deformed. Since the bonding member 814 is flexible and has a thickness of 50um-100um, the upper surface of the bonding member 814 will not be affected and bend, and it is still close to a plane. The deformation force of the plate 813 will not act on the photosensitive chip 811, so the photosensitive chip 811 can maintain a good flatness.
  • the adhesive member 814 has a relatively large deformability. Specifically, the adhesive member 814 can compress its thickness by 5%-50% (preferably, 30%--30%) under an external force. 50%), or stretch 5%-50% of its own thickness (preferably, 30%-50%). Correspondingly, when the environmental temperature changes and the circuit board 813 is deformed, the force of the deformation of the circuit board 813 will drive the deformation of the lower surface of the bonding member 814, because the dielectric layer 812 can compress 5% to 5% of its thickness.
  • the reflective surface of the photosensitive chip 811 can maintain a good flatness, which can reduce light divergence.
  • the thickness of the bonding member 814 is lower than the height of the supporting member 815. That is, during the preparation process, the thickness of the glue is smaller than the height of the support 815, so that the glue is completely contained in the receiving cavity 8150, and at the same time, the photosensitive chip 811 is also contained in the receiving cavity Within 8150.
  • the thickness of the glue may also be greater than or equal to the height of the support 815.
  • the thickness of the bonding member 814 is greater than the height of the supporting member 815. It should be understood that since the glue has a certain viscosity, the However, even if the difference between the thickness of the glue and the height of the support 815 is within a certain range, the glue will not overflow from the receiving cavity 8150.
  • the supporting member 815 can also be optionally removed after the glue is cured to form the adhesive member 814, that is, the photosensitive component 810 does not include
  • the supporting member 815 is as shown in FIG. 14.
  • FIG. 15 illustrates a schematic diagram of a camera module according to an embodiment of the present application.
  • the camera module includes: the above-mentioned photosensitive component 810 and an optical lens 820 held on the photosensitive path of the photosensitive component 810.
  • the photosensitive component 810 further includes at least one electronic component 816 arranged on the circuit board 813, a bracket 817 arranged on the circuit board 813, and installed on the circuit board 813.
  • the at least one electronic component includes, but is not limited to, a capacitor, a resistor, and an inductor.
  • the bracket 817 may be implemented as a traditional plastic bracket 817, which is prefabricated and attached to the upper surface of the circuit board 811, or the bracket 817 may be implemented as a molded bracket It is integrally formed on the upper surface of the circuit board through a molding process, which is not limited by this application.
  • the filter element 818 can be implemented in different types, including, but not limited to, the filter element 818 can be implemented as an infrared cut filter, a full transmission spectrum filter, and other filters or multiple filters. Combination of light sheets. Specifically, for example, when the filter element 818 is implemented as a combination of an infrared cut filter and a full transmission spectrum filter, that is, the infrared cut filter and the full transmission spectrum filter can be Switch to be selectively located on the photosensitive path of the photosensitive chip 811, so that the infrared cut filter can be switched to the photosensitive path of the photosensitive chip 811 when used in an environment with sufficient light such as daytime.
  • the full transmission spectrum can be filtered
  • the film is switched to the light-sensing path of the light-sensing chip 811 to allow part of the infrared rays of the light reflected by the object entering the light-sensing chip 811 to pass through.
  • FIG. 16 illustrates a schematic diagram of a modified embodiment of the camera module according to an embodiment of the present application.
  • the camera module further includes a filter element holder 819 arranged on the holder 817 or the circuit board 813, and the filter element 818 is mounted on the filter element
  • the bracket 819 that is, in this modified embodiment, the installation method of the filter element 818 is changed.
  • Fig. 17 illustrates a schematic diagram of an electronic device according to an embodiment of the present application.
  • the electronic device 8100 includes an electronic device main body 8110 and a camera module 8120 assembled in the electronic device main body, wherein, in particular, the camera module 8120 includes the above-mentioned embodiments and their modifications.
  • the camera module 8120 can be implemented as a common camera module as described above as shown in FIGS. 15 and 16, or other types of camera modules, such as , TOF depth information camera module.
  • the location where the camera module 810 is installed on the electronic device main body 8110 is not limited by this application. For example, it can be installed on the front of the electronic device main body 8110 as the front of the electronic device 8100. Camera module; or, it can be installed on the back of the electronic device body 8110 as a rear camera module of the electronic device 8100.
  • the type of the electronic device is not limited by this application, and it can be implemented as a smart phone, a tablet computer, a laptop computer, etc.
  • a method for manufacturing the photosensitive component 810 is also provided.
  • the method for preparing the photosensitive component 810 includes: providing a circuit board 813 and a photosensitive chip 811; A dielectric layer 812 is formed between the photosensitive chips 811.
  • forming a dielectric layer 812 between the circuit board 813 and the photosensitive chip 811 includes: forming the dielectric layer 812 on the circuit board 813 And, mounted on the photosensitive chip 811 on the dielectric layer 812.
  • forming a dielectric layer 812 between the circuit board 813 and the photosensitive chip 811 includes: forming the dielectric layer 812 on the lower surface of the photosensitive chip 811 The dielectric layer 812; and, the photosensitive chip 811 with the dielectric layer 812 is mounted on the circuit board 813.
  • forming the dielectric layer 812 on the circuit board 813 includes: applying an adhesive 814 on the circuit board 813; and attaching the dielectric A layer 812 is formed on the bonding member 814 to form the dielectric layer 812 on the circuit board 813.
  • forming the dielectric layer 812 on the circuit board 813 includes: integrally forming the dielectric layer 812 on the circuit board 813.
  • mounting the photosensitive chip 811 on the dielectric layer 812 includes: applying an adhesive 814 on the dielectric layer 812; The photosensitive chip 811 is mounted on the adhesive 814 to mount the photosensitive chip 811 on the dielectric layer 812.
  • forming a dielectric layer 812 between the circuit board 813 and the photosensitive chip 811 includes: forming a support 815 on the circuit board 813, wherein the support The surface of the member 815 and the circuit board 813 form a receiving cavity 8150; applying an adhesive in the receiving cavity 8150; attaching the photosensitive chip 811 to the adhesive; The dielectric layer 812 is formed between the circuit board 813 and the photosensitive chip 811.
  • the method further includes removing the support 815.
  • the dielectric layer 812 is made of a flexible material, and the Shore hardness of the flexible material is 10°-70°.
  • the material of the dielectric layer 812 is selected from any one of foam, a combination of plastic and foam, soft glue and silica gel.
  • the thickness of the dielectric layer 812 is 80 um-130 um.
  • the thickness of the dielectric layer 812 is 20 um-100 um.
  • the amount of deformation that can occur in the dielectric layer 812 is 5%-50% of its thickness.

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Abstract

本申请公开了一种光学组件、感光组件、摄像模组、光学组件和感光组件的制备方法。该光学组件包括：滤光元件，用于承载所述滤光元件的支架，以及，介质层，所述介质层被设置于所述线路板和所述感光芯片之间，具有用于防止所述滤光元件所受应力值超过预定阈值的预定柔性。这样，通过在摄像模组中的滤光元件及其支撑部分之间设置介质层，来避免所述滤光元件因其支撑部分的形变产生的应力集中于所述滤光元件而导致所述滤光元件所产生的形变量超过预定阈值，而导致所述滤光元件破损以及摄像模组成像质量的降低。

Description

光学组件、感光组件、摄像模组、光学组件和感光组件的制备方法 技术领域
本申请涉及摄像模组领域，且更为具体地，涉及一种光学组件、感光组件、摄像模组、光学组件和感光组件的制备方法。
背景技术
随着移动电子设备的普及，被应用于移动电子设备用于帮助使用者获取影像(例如视频或者图像)的摄像模组的相关技术得到了迅猛的发展和进步，并且，在近年来，摄像模组在诸如医疗、安防、工业生产等诸多的领域都得到了广泛的应用。
为了满足越来越广泛的市场需求，高像素、大芯片、小尺寸、大光圈是现有摄像模组不可逆转的发展趋势。芯片尺寸的增大带来了诸多问题，例如，芯片更易变形等。
随着感光芯片的尺寸逐步提升，与其匹配的滤光元件尺寸也相应地需增加。本领域普通技术人员应知晓，滤光元件为敏感且脆弱的元器件，随着尺寸的增加，其敏感性和脆弱度将进一步增大。在实际产业应用中，已出现多个在滤光元件尺寸增大之后带来的问题，例如，滤光元件更易破损甚至破裂、滤光元件相对感光芯片发生倾斜等。
因此，需要一种有效的方案来确保滤光元件的稳定性。
发明内容
本申请的主要目的在于提供一种光学组件、感光组件、摄像模组、光学组件和感光组件的制备方法，其通过在摄像模组中的滤光元件及其支撑部分之间设置介质层，来避免所述滤光元件因其支撑部分的形变产生的应力集中于所述滤光元件而导致所述滤光元件所产生的形变量超过预定阈值，而导致所述滤光元件破损以及摄像模组成像质量的降低。
本申请的另一目的在于提供一种光学组件、感光组件、摄像模组、光学组件和感光组件的制备方法，其通过在摄像模组中的感光芯片及其支撑部分 之间设置介质层，来避免因感光芯片形变而导致的成像质量的降低。
根据本申请的一方面，提供了一种光学组件，其包括：
滤光元件；
支架，用于承载所述滤光元件；以及
介质层，设置于所述支架和所述滤光元件之间，具有用于防止所述滤光元件所发生的形变量超过预定阈值的预定柔性。
在根据本申请的光学组件中，所述滤光元件通过所述介质层被安装于所述支架。
在根据本申请的光学组件中，所述光学组件进一步包括支撑件，所述支撑件被设置于所述支架，所述支撑件与所述支架表面形成收容腔，其中，所述介质层通过被施加于所述收容腔内的黏着剂固化形成。
在根据本申请的光学组件中，所述光学组件进一步包括粘接件，所述介质层通过所述粘接件分别与所述支架和所述滤光元件连接。
在根据本申请的光学组件中，所述光学组件进一步包括粘接件，其中，所述介质层一体形成于所述支架，所述介质层通过所述粘接件与所述滤光元件连接。
在根据本申请的光学组件中，所述光学组件进一步包括粘接件，其中，所述介质层一体形成于所述滤光元件的下表面，所述介质层通过所述粘接件与所述支架连接。
在根据本申请的光学组件中，所述介质层由柔性材料制成，该柔性材料的邵氏硬度为10HSA-70HSA。
在根据本申请的光学组件中，所述介质层的制成材料，选自泡棉、塑料和泡棉的组合物、软胶和硅胶中任意一种。
在根据本申请的光学组件中，当所述介质层由泡棉制成时，所述介质层的厚度为80um-130um。
在根据本申请的光学组件中，当所述介质层由软胶制成时，所述介质层的厚度为20um-100um。
在根据本申请的光学组件中，所述介质层的厚度为50um-100um。
在根据本申请的光学组件中，所述介质层能够发生的形变量为自身厚度的5％-50％。
在根据本申请的光学组件中，所述介质层能够发生的形变量为自身厚度 的5％-50％。
在根据本申请的光学组件中，所述支架包括支撑部和自所述支撑部向内延伸的悬持部，所述滤光元件被贴装于所述悬持部。
在根据本申请的光学组件中，所述悬持部的上表面低于所述支撑部的上表面，所述滤光元件的上表面低于所述支撑部的上表面。
根据本申请又一方面，还提供一种感光组件，其包括：
线路板；
电连接于所述线路板的感光芯片；以及
如上所述的光学组件，其中，所述光学组件被设置于所述线路板，所述滤光元件位于所述感光芯片的感光路径。
在根据本申请的感光组件中，所述感光组件进一步包括设置于所述线路板的底座，其中，所述光学组件安装于所述底座。
根据本申请的又一方面，还提供一种摄像模组，其包括：
光学镜头；以及
感光组件，所述光学镜头被保持于所述感光组件的感光路径，其中，所述感光组件包括如上所述的光学组件。
根据本申请的又一方面，还提供一种光学组件的制备方法，其包括：
提供滤光元件和支架；以及
在所述支架和所述滤光元件之间形成介质层。
在根据本申请的制备方法中，在所述支架和所述滤光元件之间形成介质层，包括：在所述支架上形成所述介质层；以及，在所述介质层上安装所述滤光元件。
在根据本申请的制备方法中，在所述支架和所述滤光元件之间形成介质层，包括：在所述滤光元件的下表面上形成所述介质层；以及，将带有所述介质层的所述滤光元件贴装于所述支架。
在根据本申请的制备方法中，在所述支架上形成所述介质层，包括：在所述支架上施加粘接件；以及，贴装所述介质层于所述粘接件，以在所述支架上形成所述介质层。
在根据本申请的制备方法中，在所述支架上形成所述介质层，包括：在所述支架上一体形成所述介质层。
在根据本申请的制备方法中，在所述介质层上安装所述滤光元件，包括：
在所述介质层上施加粘接件；以及，贴装所述滤光元件于所述粘接件，以将所述滤光元件安装于所述介质层。
在根据本申请的制备方法中，在所述支架和所述滤光元件之间形成介质层，包括：在所述支架上设置支撑件，所述支撑件和所述支架表面形成收容腔；在所述收容腔内施加黏着剂；将所述滤光元件贴装于所述黏着剂；以及，固化所述黏着剂，以在所述支架和所述滤光元件之间形成介质层。
在根据本申请的制备方法中，所述方法进一步包括：去除所述支撑件。
根据本申请的一方面，提供了一种感光组件，其包括：
线路板；
电连接于所述线路板的感光芯片；以及
介质层，设置于所述线路板和所述感光芯片之间，具有用于防止所述感光芯片形变的预定柔性。
在根据本申请的感光组件中，所述感光芯片通过所述介质层被安装于所述线路板。
在根据本申请的感光组件中，进一步包括支撑件，所述支撑件被设置于所述线路板，所述支撑件与所述线路板表面形成收容腔，其中，所述介质层通过被施加于所述收容腔内的黏着剂固化形成。
在根据本申请的感光组件中，进一步包括粘接件，所述介质层通过所述粘接件分别与所述线路板和所述感光芯片连接。
在根据本申请的感光组件中，进一步包括粘接件，其中，所述介质层一体形成于所述线路板，所述介质层通过所述粘接件与所述感光芯片连接。
在根据本申请的感光组件中，进一步包括粘接件，其中，所述介质层一体形成于所述感光芯片的下表面，所述介质层通过所述粘接件与所述线路板连接。
在根据本申请的感光组件中，所述介质层由柔性材料制成，该柔性材料的邵氏硬度为10HSA-70HSA。
在根据本申请的感光组件中，所述介质层的制成材料，选自泡棉、塑料和泡棉的组合物、软胶和硅胶中任意一种。
在根据本申请的感光组件中，当所述介质层由泡棉制成时，所述介质层的厚度为80um-130um。
在根据本申请的感光组件中，当所述介质层由软胶制成时，所述介质层 的厚度为20um-100um。
在根据本申请的感光组件中，所述介质层由具有粘性的柔性材料制成。
在根据本申请的感光组件中，所述介质层的厚度为50um-100um。
在根据本申请的感光组件中，所述介质层能够发生的形变量为自身厚度的5％-50％。
在根据本申请的感光组件中，所述介质层能够发生的形变量为自身厚度的5％-50％。
根据本申请的另一方面，还提供一种摄像模组，其包括：
光学镜头；以及
如上所述的感光组件，所述光学镜头被保持于所述感光组件的感光路径上。
根据本申请又一方面，还提供一种电子设备，其包括：
电子设备主体；以及
组装于所述电子设备主体的摄像模组，其中，所述摄像模组包括如上所述的感光组件。
根据本申请又一方面，还提供一种感光组件的制备方法，其包括：
提供线路板和感光芯片；以及
在所述线路板和所述感光芯片之间形成介质层。
在根据本申请的制备方法中，在所述线路板和所述感光芯片之间形成介质层，包括：
在所述线路板上形成所述介质层；以及
在所述介质层上安装所述感光芯片。
在根据本申请的制备方法中，在所述线路板和所述感光芯片之间形成介质层，包括：
在所述感光芯片的下表面上形成所述介质层；以及
将带有所述介质层的所述感光芯片贴装于所述线路板。
在根据本申请的制备方法中，在所述线路板上形成所述介质层，包括：
在所述线路板上施加粘接件；以及
贴装所述介质层于所述粘接件，以在所述线路板上形成所述介质层。
在根据本申请的制备方法中，在所述线路板上形成所述介质层，包括：
在所述线路板上一体形成所述介质层。
在根据本申请的制备方法中，在所述介质层上安装所述感光芯片，包括：
在所述介质层上施加粘接件；以及
贴装所述感光芯片于所述粘接件，以将所述感光芯片安装于所述介质层。
在根据本申请的制备方法中，在所述线路板和所述感光芯片之间形成介质层，包括：
在所述线路板上设置支撑件，所述支撑件和所述线路板表面形成收容腔；
在所述收容腔内施加黏着剂；
将所述感光芯片贴装于所述黏着剂；以及
固化所述黏着剂，以在所述线路板和所述感光芯片之间形成所述介质层。
在根据本申请的制备方法中，所述方法进一步包括：去除所述支撑件。
通过对随后的描述和附图的理解，本申请进一步的目的和优势将得以充分体现。
本申请的这些和其它目的、特点和优势，通过下述的详细说明，附图和权利要求得以充分体现。
附图说明
通过结合附图对本申请实施例进行更详细的描述，本申请的上述以及其他目的、特征和优势将变得更加明显。附图用来提供对本申请实施例的进一步理解，并且构成说明书的一部分，与本申请实施例一起用于解释本申请，并不构成对本申请的限制。在附图中，相同的参考标号通常代表相同部件或步骤。
通过结合附图对本申请实施例进行更详细的描述，本申请的上述以及其他目的、特征和优势将变得更加明显。附图用来提供对本申请实施例的进一步理解，并且构成说明书的一部分，与本申请实施例一起用于解释本申请，并不构成对本申请的限制。在附图中，相同的参考标号通常代表相同部件或步骤。
图1图示了现有的摄像模组中滤光元件相对感光芯片发生倾斜的示意图。
图2图示了根据本申请实施例的光学组件的示意图。
图3图示了根据本申请实施例的所述光学组件的形变示意图。
图4图示了根据本申请另一实施例的光学组件的示意图。
图5图示了根据本申请另一实施例的所述光学组件的一个变形实施例的 示意图。
图6图示了根据本申请另一实施例的所述光学组件的另一变形实施例的示意图。
图7图示了根据本申请实施例的摄像模组的示意图。
图8图示了根据本申请实施例的摄像模组的变形实施的示意图。
图9图示了现有的摄像模组中感光芯片变形的示意图。
图10图示了根据本申请实施例的感光组件的示意图。
图11图示了根据本申请实施例的所述感光组件的弯曲示意图。
图12图示了根据本申请另一实施例的感光组件的示意图。
图13图示了根据本申请另一实施例的所述感光组件的一个变形实施例的示意图。
图14图示了根据本申请另一实施例的所述感光组件的另一变形实施例的示意图。
图15图示了根据本申请实施例的摄像模组的示意图。
图16图示了根据本申请实施例的摄像模组的变形实施的示意图。
图17图示了根据本申请实施例的电子设备的示意图。
具体实施方式
下面，将参考附图详细地描述根据本申请的示例实施例。显然，所描述的实施例仅仅是本申请的一部分实施例，而不是本申请的全部实施例，应理解，本申请不受这里描述的示例实施例的限制。
申请概述
如上所述，为了满足越来越广泛的市场需求，高像素、大芯片、小尺寸、大光圈是现有摄像模组不可逆转的发展趋势，随着感光芯片的尺寸逐步提升，与其匹配的滤光元件尺寸也需增加。滤光元件为敏感且脆弱的元器件，随着其尺寸的增大，其敏感性和脆弱度将进一步增加。在实际产业应用中，已出现多个在滤光元件尺寸增大之后带来的问题，例如，滤光元件更易破损甚至破裂、滤光元件相对感光芯片发生倾斜等。
在摄像模组(例如，常规摄像模组、潜望式摄像模组、指纹模组、TOF深度信息摄像模组)中，滤光元件71P具有重要的滤光、防杂散光的作用， 随着其面积尺寸的增加，并且摄像模组小型化的需求也限制着其厚度尺寸，也就是，滤光元件71P的面积逐渐增大，同时，其厚度尺寸有变小的趋势，因此，滤光元件71P的面积与厚度的比值将增大。在物理表现上，面积与厚度的比值增大的滤光元件71P更易发生形变，也更加脆弱。
由于用于承载滤光元件71P的支架72P与滤光元件71P之间的热膨胀系数(Coefficient of thermal expansion,CTE)相差过大，在环境温度发生变化时，因支架72P形变产生的应力将作用于滤光元件71P，当滤光元件71P所受应力超过预定阈值而导致其发生的形变量超过预定阈值时，滤光元件71P将发生破损甚至破裂，经试验测试，发生破损甚至破裂的形变量的预设阈值为4000μe，即，当发生的形变量超过4000μe时，滤光元件71P将发生破损甚至破裂。并且，本领域普通技术人员应知晓，在生产过程中，滤光元件71P自身存在微裂纹，这些微裂纹会使得应力集中，增大破损或破裂的几率。
并且，由于支架72P的热膨胀系数较大，在环境温度变化较大的情况下，支架72P自身产生的形变往往是不均匀的，导致支架72P上表面用于支撑滤光元件71P的部分的形变高低不平，也就是，支架72P中用于安装滤光元件71P部分的平面因不均匀的形变会产生高度差，而导致滤光元件71P相对于感光芯片发生倾斜，如图1所示。图1图示了现有的摄像模组中滤光元件71P相对感光芯片发生倾斜的示意图。倾斜安装的滤光元件71P会引起成像系统焦距的变化而产生像移。并且，滤光倾斜，还会导致外界光线入射到滤光元件71P时的入射角度相较于理想情况存在差距，容易导致杂散光的增加。并且，支架72P表面高低不平导致滤光元件71P的支撑面积减小，增大了滤光元件71P发生破损的风险。
针对上述技术问题，本申请的基本构思是通过在摄像模组中的滤光元件及其支撑部分之间设置介质层，来避免所述滤光元件因自身的形变而导致破损和摄像模组成像质量的降低。
基于此，本申请提出了一种感光组件，其包括：滤光元件、用于承载所述滤光元件的支架，以及，介质层，其中，所述介质层被设置于所述线路板和所述感光芯片之间，具有用于防止所述滤光元件所发生的形变量超过预定阈值的预定柔性。这样，通过在摄像模组中的滤光元件及其支撑部分之间设置介质层，来避免所述滤光元件因其支撑部分的形变产生的应力集中于所述滤光元件而导致所述滤光元件所产生的形变量超过预定阈值，而导致所述滤 光元件破损以及摄像模组成像质量的降低。
在介绍本申请的基本原理之后，下面将参考附图来具体介绍本申请的各种非限制性实施例。
实施例一
图2图示了根据本申请实施例的光学组件的示意图。在如图2所示意的光学组件中，所述光学组件710，包括一滤光元件711、介质层712和一支架713，所述滤光元件711通过所述介质层712被安装于所述支架713，所述介质层712可以有效地吸收因所述支架713形变而产生的作用于所述滤光元件711的应力，从而避免所述滤光元件711因其支撑部分的形变产生的应力集中于所述滤光元件711而导致所述滤光元件711所产生的形变量超过预定阈值，进而导致所述滤光元件711发生破损。如上所述，该预设阈值为4000μe。也就是说，即使该光学组件710的所述支架713在升温或降温过程中发生形变或者外部应力作用于所述支架而导致其发生变形，所述介质层712也会确保所述滤光元件711的稳定性。
进一步地，在本申请实施例中，所述介质层712优选地被实施为柔性材料，其具有用于防止所述滤光元件711所发生的形变量超过预定阈值的预定柔性，也就是，所述滤光元件711的预定柔性并非某个特定值，其仅需能够防止所述滤光元件因受应力所产生的形变量低于4000μe即可。特别地，在本申请实施中，该柔性材料的邵氏硬度可选择为10HSA-70HSA，例如，20HSA、30HSA，其受到外力可以压缩自身厚度的5％～50％(优选地，30％～50％)，或者，拉伸自身厚度的5％～50％(优选地，30％～50％)，其中，10HSA表示用A型邵氏硬度计测定的邵氏硬度值为10，70HSA，20HSA，30HSA同理可知。并且，在本申请实施例中，所述介质层712的上表面对应于所述滤光元件711，其下表面对应于所述支架713，当环境温度发生变化或者外部应力作用于所述支架导致所述支架713发生形变，支架713形变的力会带动所述介质层712的下表面形变。由于所述介质层712可以压缩自身厚度的5％～50％(优选地，30％～50％)，或者，拉伸自身厚度的5％～50％(优选地，30％～50％)，那么其上表面则不会发生弯曲，依旧是接近平面，支架713形变的力也不会作用至所述滤光元件711，如图3所示，因此，所述滤光元件711的感光面可以保持较好的平面度，可以减少光线发散，这里，所 述滤光元件711的感光面的平面度可以是0.701λ-0.72λ(λ为光波长符号)，或者说，所述滤光元件711的感光面的平面度在0.716um以下。也可以理解为，所述滤光元件711的硬度比所述介质层712的大，故可以通过所述介质层712的形变来抑制所述滤光元件711的形变(弯曲)。
进一步地，在本申请实施例中，所述介质层712的制成材料可被实施为泡棉、PET(聚对苯二甲酸乙二醇酯，塑料材料的一种)+PU(PU为泡棉)、软胶、硅胶等，其中，PET+PU可以理解为在PET材料上发泡形成PU层，其中，PET也可以被实施为其他塑料材料，甚至，PET可以用金属取代，即在金属上发泡形成PU层。
如图2所示，在本申请实施例中，所述光学组件710进一步包括至少一粘接件714，所述介质层712通过所述粘接件714分别与所述支架713和所述滤光元件711连接，所述粘接件714可以被实施为胶水、双面胶等具有粘性的粘接工具。也就是说，在本申请实施例中，先在所述介质层712、所述滤光元件711或所述支架713上设置所述粘接件714，再通过所述粘接件714将所述介质层712、所述支架713和所述滤光元件711固定以形成所述光学组件710。
特别地，当所述介质层712为泡棉时，所述泡棉厚度为80～130um，优选地为100um，此时，所述滤光元件711的厚度为0.715～2.75mm，优选地为1～2mm；所述粘接件714的厚度为20um～40um。当所述介质层712被实施为软胶时，所述软胶厚度为20～100um，优选为50um，此时，所述滤光元件711的厚度为0.715～2.75mm，优选为1mm～2mm。
在上述实施例的一个变形实施例中，所述介质层712可以与所述支架713一体形成，即，所述介质层712和所述支架713为一体结构。例如，所述介质层712可以通过镀膜、喷涂、印刷、发泡等工艺形成于所述支架713。比如，当所述介质层712为泡棉层时，可以通过在所述支架713上预设材料，经发泡形成所述介质层712。这样，所述泡棉层(即，所述介质层712)无需通过所述粘接件714与所述支架713固定，可进一步有效控制所述粘接件714带来的误差，有利于提升所述光学组件710的精度。值得一提的是，在该变形实施例中，所述介质层712参数、性能与上述实施例相同或相近。
也就是说，在该变形实施例中，所述光学组件710的制备过程可以是：先在所述支架713上形成所述介质层712，再通过所述粘接件714将所述滤 光元件711与所述介质层712固定，以形成所述光学组件710。
在上述实施例的另一个变形实施例中，所述介质层712与所述滤光元件711一体形成，即，所述介质层712与所述滤光元件711具有一体结构，例如，所述介质层712可以通过镀膜、喷涂、印刷、发泡等工艺形成于所述滤光元件711。
进一步地，如图2所示，在本申请实施例中，所述支架713包括支撑部7131和自所述支撑部7131向内延伸的悬持部7132，所述滤光元件711被安装于所述悬持部7132。为了保护所述滤光元件，优选地，所述支撑部7131的上表面高于所述悬持部7132的上表面高度，也就是，所述悬持部7132和所述支撑部7131之间具有落差，以形成用于收容所述滤光元件711的保护腔。更优选地，当所述滤光元件711被贴装于所述保护腔内时，所述滤光元件711的上表面低于所述支撑部7131的上表面。
值得一提的是，在本申请实施例中，所述滤光元件711可以被实施为各种类型滤光元件，包括但不限于红外截止滤光片、全透光谱滤光片以及其他的滤光片或者多个滤光片的组合。具体来说，例如，当所述滤光元件711被实施为红外截止滤光片和全透光谱滤光片的组合，即，所述红外截止滤光片和所述全透光谱滤片能够被切换以选择性地位于所述滤光元件711的感光路径上，这样，在白天等光线较为充足的环境下使用时，可以将所述红外截止滤光片切换至所述滤光元件711的感光路径，以藉由所述红外截止滤光片过滤进入所述滤光元件711的被物体反射的光线中的红外线，并且，当夜晚等光线较暗的环境中使用时，可以将所述全透光谱滤光片切换至所述滤光元件711的感光路径，以允许进入所述滤光元件711的被物体反射的光线中的红外线部分透光。
实施例二
如图4所示，在该实施例中，所述光学组件710由所述滤光元件711、所述粘接件714和所述支架713构成，其中，所述粘接件714的厚度为50um-100um(包括等于50um和等于100um)。也就是，在该实施中，所述粘接件714的作用相当于实施例71中的所述介质层712和所述粘接件714的二合一，或者说，实施例71中的所述介质层712被实施为由厚度为50um-100um的黏着剂固化形成。值得一提的是，现有粘接件例如胶水由于 具有流动性，其无法在所述滤光元件711或支架713上施加厚度为50um-100um的胶水，故在该实施例中，进一步提供支撑件715，所述支撑件715被设置于所述支架713，所述支撑件715与所述支架713的上表面形成一收容腔7150，所述粘接件714(胶水)被设置于所述收容腔7150内，再将所述滤光元件711贴附于所述粘接件714，然后，通过烘烤等工艺使得所述粘接件714固化，以形成所述光学组件710。如图4所示，在该实施例中，所述支撑件715包括内支撑单元7151和外支撑单元7152，所述收容腔7150形成于所述支撑表面，所述内支撑单元7151的内侧面和所述外支撑单元7152的内侧面之间，并且，所述内支撑单元7151和所述外支撑单元7152都具有环形结构。值得一提的是，在该实施例中，所述外支撑单元7152的高度高于所述内支撑单元7151的高度，当然，所述内支撑单元7151和所述外支撑单元7152的高度也可以相等，对此，并不为本申请所局限。
在该实施例中，所述粘接件714优选为胶水，该胶水具有一定柔性，这里，在固化成所述粘接件714后依旧具有一定的柔性。所述粘接件714的上表面对向所述滤光元件711，其下表面对向所述支架713，当环境温度变化导致所述支架713发生形变，所述支架713形变的力带动所述粘接件714的下表面形变，由于所述粘接件714具有一定柔性且具有50um-100um的厚度，那么其上表面则不会受到影响而发生弯曲，依旧是接近平面，所述支架713形变的力也不会作用至所述滤光元件711，因此，所述滤光元件711可以保持较好的平面度。
进一步地，在该实施例中，所述粘接件714具有较大的形变能力，具体地，所述粘接件714受到外力可以压缩自身厚度的5％～50％(优选地，30％～50％)，或者，拉伸自身厚度的5％～50％(优选地，30％～50％)。相应地，当环境温度发生变化导致所述支架713发生形变，支架713形变的力会带动所述粘接件714的下表面形变，由于所述介质层712可以压缩自身厚度的5％～50％(优选地，30％～50％)，或者，拉伸自身厚度的5％～50％(优选地，30％～50％)，那么其上表面则不会发生弯曲，依旧是接近平面，支架713形变的力也不会作用至所述滤光元件711，因此，所述滤光元件711的反射面可以保持较好的平面度，可以减少光线发散。
值得一提的是，在本申请实施例中，所述粘接件714的厚度低于所述支撑件715的高度。也就是说，在制备过程中，胶水的厚度小于所述支撑件715 的高度，以使得胶水被完全收容于所述收容腔7150内，同时，所述滤光元件711也被收容于所述收容腔7150内。
在上述实施例的变形实施例中，所述胶水的厚度也可以大于或者等于所述支撑件715的高度。如图5所示，在该变形实施例中，所述粘接件714(胶水)的厚度大于所述支撑件715的高度，应可以理解，由于胶水具有一定粘稠度，因此，在制备过程中，即使胶水厚度与所述支撑件715的高度差在一定范围内，胶水也不会自所述收容腔7150内溢出。
还值得一提的是，在上述实施例的其他变形实施例中，所述支撑件715在所述胶水固化形成所述粘接件714后也可以选择去除，即，所述光学组件710不包括所述支撑件715，如图6所示
实施例三
上述实施例一和实施例二公开的光学组件可以应用于摄像模组，例如，常规的摄像模组、潜望式摄像模组、TOF深度信息摄像模组等。图7图示了根据本申请实施例的摄像模组的示意图。如图7所示，所述摄像模组，包括：感光组件720和保持于所述光学组件720的感光路径上的光学镜头730，其中，所述感光组件720包括实施例71和实施例72公开的光学组件710。
如图7所示，在本申请实施例中，所述感光组件进一步包括线路板721、电连接于所述线路板721的感光芯片722和设置于所述线路板721的至少一电子元器件723，其中，所述光学组件710设置于所述线路板721。更具体地，所述光学组件710的所述支架713被贴装于所述线路板721上，所述滤光元件711位于所述感光芯片722的感光路径。
图8图示了根据本申请实施例的所述摄像模组的一个变形实施例的示意图。如图8所示，在该变形实施例中，所述摄像模组进一步设置于所述线路板的底座724，所述光学组件710被安装于所述底座724。也就是，在该变形实施例中，所述光学组件710的安装方式发生改变。特别地，在变形实施例中，所述底座724为通过模塑工艺一体成型于所述线路板721的模塑底座，当然，在本申请其他示例中，所述底座724还可以被实施为其他类型的底座，以及，所述底座724一体成型于所述线路板的位置可发生调整。
值得一提的是，所述摄像模组进一步可被应用于电子设备，例如，智能手机、平板电脑等，以作为所述电子设备的前置摄像模组或者后置摄像模组。
实施例四
根据本申请另一方面，还提供一种光学组件710的制备方法。
根据实施例一和实施例二中的相关描述，根据本申请实施例的所述光学组件710的制备方法，包括：提供支架713和滤光元件711；以及，在所述支架713和所述滤光元件711之间形成介质层712。
在根据本申请实施例的制备方法中，在一个示例中，在所述支架713和所述滤光元件711之间形成介质层712，包括：在所述支架713上形成所述介质层712；以及，在所述介质层712上安装所述滤光元件711。
在根据本申请实施例的制备方法中，在一个示例中，在所述支架713和所述滤光元件711之间形成介质层712，包括：在所述滤光元件711的下表面上形成所述介质层712；以及，将带有所述介质层712的所述滤光元件711贴装于所述支架713。
在根据本申请实施例的制备方法中，在一个示例中，在支架713上形成所述介质层712，包括：在所述支架713上施加粘接件714；以及，贴装所述介质层712于所述粘接件714，以在所述支架713上形成所述介质层712。
在根据本申请实施例的制备方法中，在一个示例中，在支架713上形成所述介质层712，包括：在所述支架713上一体形成所述介质层712。
在根据本申请实施例的制备方法中，在一个示例中，在所述介质层712上安装所述滤光元件711，包括：在所述介质层712上施加粘接件714；以及，贴装所述滤光元件711于所述粘接件714，以将所述滤光元件711安装于所述介质层712。
在根据本申请实施例的制备方法中，在一个示例中，在支架713和滤光元件711之间形成介质层712，包括：在所述支架713上形成支撑件715，其中，所述支撑件715和所述支架713表面形成收容腔7150；在所述收容腔7150内施加黏着剂；将所述滤光元件711贴装于所述黏着剂；以及，固化所述黏着剂，以在所述支架713和所述滤光元件711之间形成所述介质层712。
在根据本申请实施例的制备方法中，在一个示例中，所述方法进一步包括去除所述支撑件715。
值得一提的是，在本申请实施例中，所述介质层712由柔性材料制成，该柔性材料的邵氏硬度为10HSA-70HSA。所述介质层712的制成材料，选 自泡棉、塑料和泡棉的组合物、软胶和硅胶中任意一种。当所述介质层712由泡棉制成时，所述介质层712的厚度为80um-130um。当所述介质层712由软胶制成时，所述介质层712的厚度为20um-100um。所述介质层712能够发生的形变量为自身厚度的5％-50％。
申请概述
如上所述，随着消费者对终端设备的成像质量要求越来越高，摄像模组所采集的感光芯片尺寸也逐渐增大，这引发了一系列技术问题。并且，这些技术问题在现有的摄像模组结构中得不到妥善解决。因此，需要改进的摄像模组结构及其制造方案以生产满足性能要求的感光组件、摄像模组、电子设备和感光组件的制备方法。
具体来说，在现有的摄像模组中，感光芯片81P常通过COB(Chip on Board)工艺贴附于线路板82P的上表面，即，通过粘着剂将感光芯片81P贴附于感光芯片81P的上表面。通常，感光芯片81P与线路板82P之间的热膨胀系数(Coefficient of thermal expansion,CTE)相差过大，因此，在工作过程中，受环境温度变化的影响，线路板82P会发生形变而导致感光芯片81P发生形变，具体的形变形态为：感光芯片81P朝向光学镜头侧弯曲，以形成类似于“哭脸”的形状，如图9所示。图9图示了现有的摄像模组中感光芯片81P的弯曲示意图。
本领域技术人员应知晓，即便感光芯片81P没有发生“哭脸”状形变，由于感光芯片81P的边缘区域和中心区域相对于光学镜头的光程差不同，导致光心在抵达感光芯片81P的边缘部分时，容易出现畸变、边角失光以及锐角下降等不良现象，导致成像效果变差。在发生“哭脸”状形变之后，不良的成像现象会进一步地加剧，更为严重地影响了成像质量。具体来说，如图9所示，在摄像模组的成像过程中，实际焦点平面形成朝向线路板82P侧凸起的弧形，也就是，实际焦点平面为弧形面。应可以看出，“哭脸”状的形变恰好与实际焦点平面的形变方式相反，导致畸变、边角失光以及锐角下降等不良现象的程度被加剧，更为严重地影响摄像模组的成像质量。
针对上述技术问题，本申请的基本构思是通过在摄像模组中的感光芯片及其支撑部分之间设置介质层，来避免因感光芯片形变而导致的成像质量的降低。
基于此，本申请提出了一种感光组件，其包括：线路板；电连接于所述线路板的感光芯片；以及，介质层，所述介质层被设置于所述线路板和所述感光芯片之间，具有用于防止所述感光芯片形变的预定柔性。这样，通过在摄像模组中的感光芯片和线路板之间设置介质层，来避免因感光芯片形变而导致的成像质量的降低。在介绍本申请的基本原理之后，下面将参考附图来具体介绍本申请的各种非限制性实施例。
实施例一
图10图示了根据本申请实施例的感光组件的示意图。在如图10所示意的感光组件中，所述感光组件810，包括一感光芯片811、介质层812和一线路板813，所述感光芯片811通过所述介质层812被安装于所述线路板813，所述感光芯片811通过诸如引线之类的电连接介质被可导通地连接于所述线路板，其中，所述介质层812可以有效地防止所述感光芯片811弯曲。也就是说，即使该感光组件810的所述线路板813在升温或降温过程中发生形变，所述介质层812也会确保所述感光芯片811的稳定性。
进一步地，在本申请实施例中，所述介质层812优选地被实施为柔性材料，该柔性材料的邵氏硬度为10HSA-70HSA，例如，20HSA、30HSA，其受到外力可以压缩自身厚度的5％～50％(优选地，30％～50％)，或者，拉伸自身厚度的5％～50％(优选地，30％～50％)，其中，10HSA表示用A型邵氏硬度计测定的邵氏硬度值为10，70HSA，20HSA，30HSA同理可知。并且，在本申请实施例中，所述介质层812的上表面对应于所述感光芯片811，其下表面对应于所述线路板813，当环境温度发生变化导致所述线路板813发生形变，线路板813形变的力会带动所述介质层812的下表面形变。由于所述介质层812可以压缩自身厚度的5％～50％(优选地，30％～50％)，或者，拉伸自身厚度的5％～50％(优选地，30％～50％)，那么其上表面则不会发生弯曲，依旧是接近平面，线路板813形变的力也不会作用至所述感光芯片811，如图11所示，因此，所述感光芯片811的感光面可以保持较好的平面度，可以减少光线发散，这里，所述感光芯片811的感光面的平面度可以是0.801λ-0.82λ(λ为光波长符号)，或者说，所述感光芯片811的感光面的平面度在0.816um以下。也可以理解为，所述感光芯片811的硬度比所述介质层812的大，故可以通过所述介质层812的形变来抑制所述感光芯片811的形 变(弯曲)。
进一步地，在本申请实施例中，所述介质层812的制成材料可被实施为泡棉、聚对苯二甲酸乙二醇酯(英文名：Polyethylene terephthalate，简称PET)+聚氨酯(英文名：Polyuretha，简称PU)、软胶、硅胶等，其中，PET+PU可以理解为在PET材料上发泡形成PU层，其中，PET也可以被实施为其他塑料材料，甚至，PET可以用金属取代，即在金属上发泡形成PU层。
如图10所示，在本申请实施例中，所述感光组件810进一步包括至少一粘接件814，所述介质层812通过所述粘接件814分别与所述线路板813和所述感光芯片811连接，所述粘接件814可以被实施为胶水、双面胶等具有粘性的粘接工具。也就是说，在本申请实施例中，先在所述介质层812、所述感光芯片811或所述线路板813上设置所述粘接件814，再通过所述粘接件814将所述介质层812、所述线路板813和所述感光芯片811固定以形成所述感光组件810。
特别地，当所述介质层812为泡棉时，所述泡棉厚度为80～130um，优选地为100um，此时，所述感光芯片811的厚度为0.815～2.85mm，优选地为1～2mm；所述粘接件814的厚度为20um～40um。当所述介质层812被实施为软胶时，所述软胶厚度厚度为20～100um，优选为50um，此时，所述感光芯片811的厚度为0.815～2.85mm，优选为1mm～2mm。
在上述实施例的一个变形实施例中，所述介质层812可以与所述线路板813一体形成，即，所述介质层812和所述线路板813为一体结构。例如，所述介质层812可以通过镀膜、喷涂、印刷、发泡等工艺形成于所述线路板813。比如，当所述介质层812为泡棉层时，可以通过在所述线路板813上预设材料，经发泡形成所述介质层812。这样，所述泡棉层(即，所述介质层812)无需通过所述粘接件814与所述线路板813固定，可进一步有效控制所述粘接件814带来的误差，有利于提升所述感光组件810的精度。值得一提的是，在该变形实施例中，所述介质层812参数、性能与上述实施例相同或相近。
也就是说，在该变形实施例中，所述感光组件810的制备过程可以是：先在所述线路板813上形成所述介质层812，再通过所述粘接件814将所述感光芯片811与所述介质层812固定，以形成所述感光组件810。
在上述实施例的另一个变形实施例中，所述介质层812与所述感光芯片 811一体形成，即，所述介质层812与所述感光芯片811具有一体结构，例如，所述介质层812可以通过镀膜、喷涂、印刷、发泡等工艺形成于所述感光芯片811。
实施例二
如图12所示，在该实施例中，所述感光组件810由所述感光芯片811、所述粘接件814和所述线路板813构成，其中，所述粘接件814的厚度为50um-100um(包括等于50um和等于100um)。也就是，在该实施中，所述粘接件814的作用相当于实施例81中的所述介质层812和所述粘接件814的二合一，或者说，实施例81中的所述介质层812被实施为由厚度为50um-100um的黏着剂固化形成。值得一提的是，现有粘接物例如胶水由于具有流动性，其无法在所述感光芯片811或线路板813上施加厚度为50um-100um的胶水，故在该实施例中，进一步提供支撑件815，所述支撑件815被设置为所述线路板813，所述支撑件815的内侧面与所述线路板813的上表面形成一收容腔8150，所述粘接件814(胶水)被设置于所述收容腔8150内，再将所述感光芯片811贴附于所述粘接件814，然后，通过烘烤等工艺使得所述粘接件814固化，以形成所述感光组件810。值得一提的是，在该实施例中，所述支撑件815的截面可被实施为环状或者类环状。
在该实施例中，所述粘接件814优选为胶水，该胶水具有一定柔性，这里，在固化成所述粘接件814后依旧具有一定的柔性。所述粘接件814的上表面对向所述感光芯片811，其下表面对向所述线路板813，当环境温度变化导致所述线路板813发生形变，所述线路板813形变的力带动所述粘接件814的下表面形变，由于所述粘接件814具有一定柔性且具有50um-100um的厚度，那么其上表面则不会受到影响而发生弯曲，依旧是接近平面，所述线路板813形变的力也不会作用至所述感光芯片811，因此，所述感光芯片811可以保持较好的平面度。
进一步地，在该实施例中，所述粘接件814具有较大的形变能力，具体地，所述粘接件814受到外力可以压缩自身厚度的5％～50％(优选地，30％～50％)，或者，拉伸自身厚度的5％～50％(优选地，30％～50％)。相应地，当环境温度发生变化导致所述线路板813发生形变，线路板813形变的力会带动所述粘接件814的下表面形变，由于所述介质层812可以压缩自 身厚度的5％～50％(优选地，30％～50％)，或者，拉伸自身厚度的5％～50％(优选地，30％～50％)，那么其上表面则不会发生弯曲，依旧是接近平面，线路板813形变的力也不会作用至所述感光芯片811，因此，所述感光芯片811的反射面可以保持较好的平面度，可以减少光线发散。
值得一提的是，在本申请实施例中，所述粘接件814的厚度低于所述支撑件815的高度。也就是说，在制备过程中，胶水的厚度小于所述支撑件815的高度，以使得胶水被完全收容于所述收容腔8150内，同时，所述感光芯片811也被收容于所述收容腔8150内。
在上述实施例的变形实施例中，所述胶水的厚度也可以大于或者等于所述支撑件815的高度。如图13所示，在该变形实施例中，所述粘接件814(胶水)的厚度大于所述支撑件815的高度，应可以理解，由于胶水具有一定粘稠度，因此，在制备过程中，即使胶水厚度与所述支撑件815的高度差在一定范围内，胶水也不会自所述收容腔8150内溢出。
还值得一提的是，在上述实施例的其他变形实施例中，所述支撑件815在所述胶水固化形成所述粘接件814后也可以选择去除，即，所述感光组件810不包括所述支撑件815，如图14所示。
实施例三
上述实施例一和实施例二公开的感光组件可以应用于摄像模组，例如，常规的摄像模组、潜望式摄像模组、TOF深度信息摄像模组等。图15图示了根据本申请实施例的摄像模组的示意图。如图15所示，所述摄像模组，包括：如上所述的感光组件810和保持于所述感光组件810的感光路径上的光学镜头820。
应注意到，在本申请实施例中，所述感光组件810进一步包括设置于所述线路板813的至少一电子元器件816、设置于所述线路板813上的支架817,以及，安装于所述支架上的滤光元件818，所述至少一电子元器件，包括但不限于电容，电阻，电感。在本申请实施例中，所述支架817可被实施为传统的塑料支架817，其预制成型并贴附于所述线路板811的上表面，或者，所述支架817可被实施为模塑支架，其通过模塑工艺一体成型于所述线路板的上表面，对此，并不为本申请所局限。所述滤光元件818能够被实施为不同的类型，包括但不限于所述滤光元件818能够被实施为红外截止滤光片、 全透光谱滤光片以及其他的滤光片或者多个滤光片的组合。具体来说，例如，当所述滤光元件818被实施为红外截止滤光片和全透光谱滤光片的组合，即，所述红外截止滤光片和所述全透光谱滤片能够被切换以选择性地位于所述感光芯片811的感光路径上，这样，在白天等光线较为充足的环境下使用时，可以将所述红外截止滤光片切换至所述感光芯片811的感光路径，以藉由所述红外截止滤光片过滤进入所述感光芯片811的被物体反射的光线中的红外线，并且，当夜晚等光线较暗的环境中使用时，可以将所述全透光谱滤光片切换至所述感光芯片811的感光路径，以允许进入所述感光芯片811的被物体反射的光线中的红外线部分透光。
图16图示了根据本申请实施例的所述摄像模组的一个变形实施例的示意图。如图16所示，在该变形实施例中，所述摄像模组进一步包括设置于支架817或线路板813上的滤光元件支架819，所述滤光元件818被安装于所述滤光元件支架819，也就是，在该变形实施例中，所述滤光元件818的安装方式发生改变。
实施例四
图17图示了根据本申请实施例的电子设备的示意图。如图17所示，所述电子设备8100，包括电子设备主体8110和组装于所述电子设备主体的摄像模组8120，其中，特别地，所述摄像模组8120包括上述实施例及其变形实施例中所公开的所述感光组件810。
值得一提的是，在该实施例中，所述摄像模组8120可被实施为如上所述的普通型的摄像模组如图15和图16所示，或者其他类型的摄像模组，例如，TOF深度信息摄像模组。所述摄像模组810安装于所述电子设备主体8110的位置也并不为本申请所局限，例如，其可安装于所述电子设备主体8110的正面，以作为所述电子设备8100的前置摄像模组；或者，其可安装于所述电子设备主体8110的背面，以作为所述电子设备8100的后置摄像模组。
当然，所述电子设备的类型也并不为本申请所局限，其可被实施为智能手机、平板电脑、膝上型电脑等。
实施例五
根据本申请另一方面，还提供一种感光组件810的制备方法。
根据实施例81和实施例82中的相关描述，根据本申请实施例的所述感光组件810的制备方法，包括：提供线路板813和感光芯片811；以及，在所述线路板813和所述感光芯片811之间形成介质层812。
在根据本申请实施例的制备方法中，在一个示例中，在所述线路板813和所述感光芯片811之间形成介质层812，包括：在所述线路板813上形成所述介质层812；以及，在所述介质层812上安装于所述感光芯片811。
在根据本申请实施例的制备方法中，在一个示例中，在所述线路板813和所述感光芯片811之间形成介质层812，包括：在所述感光芯片811的下表面上形成所述介质层812；以及，将带有所述介质层812的所述感光芯片811贴装于所述线路板813。
在根据本申请实施例的制备方法中，在一个示例中，在线路板813上形成所述介质层812，包括：在所述线路板813上施加粘接件814；以及，贴装所述介质层812于所述粘接件814，以在所述线路板813上形成所述介质层812。
在根据本申请实施例的制备方法中，在一个示例中，在线路板813上形成所述介质层812，包括：在所述线路板813上一体形成所述介质层812。
在根据本申请实施例的制备方法中，在一个示例中，在所述介质层812上安装所述感光芯片811，包括：在所述介质层812上施加粘接件814；以及，贴装所述感光芯片811于所述粘接件814，以将所述感光芯片811安装于所述介质层812。
在根据本申请实施例的制备方法中，在一个示例中，在线路板813和感光芯片811之间形成介质层812，包括：在所述线路板813上形成支撑件815，其中，所述支撑件815和所述线路板813表面形成收容腔8150；在所述收容腔8150内施加黏着剂；将所述感光芯片811贴装于所述黏着剂；以及，固化所述黏着剂，以在所述线路板813和所述感光芯片811之间形成所述介质层812。
在根据本申请实施例的制备方法中，在一个示例中，所述方法进一步包括去除所述支撑件815。
值得一提的是，在本申请实施例中，所述介质层812由柔性材料制成，该柔性材料的邵氏硬度为10度-70度。所述介质层812的制成材料，选自泡 棉、塑料和泡棉的组合物、软胶和硅胶中任意一种。当所述介质层812由泡棉制成时，所述介质层812的厚度为80um-130um。当所述介质层812由软胶制成时，所述介质层812的厚度为20um-100um。所述介质层812能够发生的形变量为自身厚度的5％-50％。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (49)

  1. 一种光学组件，其特征在于，包括：
    滤光元件；
    支架，用于承载所述滤光元件；以及
    介质层，设置于所述支架和所述滤光元件之间，具有用于防止所述滤光元件所发生的形变量超过预定阈值的预定柔性。
  2. 根据权利要求1所述的光学组件，其中，所述滤光元件通过所述介质层被安装于所述支架。
  3. 根据权利要求2所述的光学组件，进一步包括支撑件，所述支撑件被设置于所述支架，所述支撑件与所述支架表面形成收容腔，其中，所述介质层通过被施加于所述收容腔内的黏着剂固化形成。
  4. 根据权利要求1所述的光学组件，进一步包括粘接件，所述介质层通过所述粘接件分别与所述支架和所述滤光元件连接。
  5. 根据权利要求1所述的光学组件，进一步包括粘接件，其中，所述介质层一体形成于所述支架，所述介质层通过所述粘接件与所述滤光元件连接。
  6. 根据权利要求1所述的光学组件，进一步包括粘接件，其中，所述介质层一体形成于所述滤光元件的下表面，所述介质层通过所述粘接件与所述支架连接。
  7. 根据权利要求4-6任一所述的光学组件，其中，所述介质层由柔性材料制成，该柔性材料的邵氏硬度为10HSA-70HSA。
  8. 根据权利要求7所述的光学组件，其中，所述介质层的制成材料，选自泡棉、塑料和泡棉的组合物、软胶和硅胶中任意一种。
  9. 根据权利要求8所述的光学组件，其中，当所述介质层由泡棉制成时，所述介质层的厚度为80um-130um。
  10. 根据权利要求9所述的光学组件，其中，当所述介质层由软胶制成时，所述介质层的厚度为20um-100um。
  11. 根据权利要求3所述的光学组件，其中，所述介质层的厚度为50um-100um。
  12. 根据权利要求10所述的光学组件，其中，所述介质层能够发生的形变量为自身厚度的5％-50％。
  13. 根据权利要求11所述的光学组件，其中，所述介质层能够发生的形变量为自身厚度的5％-50％。
  14. 根据权利要求1所述的光学组件，其中，所述支架包括支撑部和自所述支撑部向内延伸的悬持部，所述滤光元件被贴装于所述悬持部。
  15. 根据权利要求14所述的光学组件，其中，所述悬持部的上表面低于所述支撑部的上表面，所述滤光元件的上表面低于所述支撑部的上表面。
  16. 一种感光组件，其特征在于，包括：
    线路板；
    电连接于所述线路板的感光芯片；以及
    根据权利要求1-15任一所述的光学组件，其中，所述光学组件被设置于所述线路板，所述滤光元件位于所述感光芯片的感光路径。
  17. 根据权利要求16所述的感光组件，进一步包括设置于所述线路板的底座，其中，所述光学组件安装于所述底座。
  18. 一种摄像模组，其特征在于，包括：
    光学镜头；以及
    感光组件，所述光学镜头被保持于所述感光组件的感光路径，其中，所述感光组件包括根据权利要求1-15任一所述的光学组件。
  19. 一种光学组件的制备方法，其特征在于，包括：
    提供滤光元件和支架；以及
    在所述支架和所述滤光元件之间形成介质层。
  20. 根据权利要求19所述的制备方法，其中，在所述支架和所述滤光元件之间形成介质层，包括：
    在所述支架上形成所述介质层；以及
    在所述介质层上安装所述滤光元件。
  21. 根据权利要求19所述的制备方法，其中，在所述支架和所述滤光元件之间形成介质层，包括：
    在所述滤光元件的下表面上形成所述介质层；以及
    将带有所述介质层的所述滤光元件贴装于所述支架。
  22. 根据权利要求20所述的制备方法，其中，在所述支架上形成所述介质层，包括：
    在所述支架上施加粘接件；以及
    贴装所述介质层于所述粘接件，以在所述支架上形成所述介质层。
  23. 根据权利要求20所述的制备方法，其中，在所述支架上形成所述介质层，包括：
    在所述支架上一体形成所述介质层。
  24. 根据权利要求22或23所述的制备方法，其中，在所述介质层上安装所述滤光元件，包括：
    在所述介质层上施加粘接件；以及
    贴装所述滤光元件于所述粘接件，以将所述滤光元件安装于所述介质层。
  25. 根据权利要求19所述的制备方法，其中，在所述支架和所述滤光元件之间形成介质层，包括：
    在所述支架上设置支撑件，所述支撑件和所述支架表面形成收容腔；
    在所述收容腔内施加黏着剂；
    将所述滤光元件贴装于所述黏着剂；以及
    固化所述黏着剂，以在所述支架和所述滤光元件之间形成介质层。
  26. 根据权利要求25所述的制备方法，进一步包括：去除所述支撑件。
  27. 一种感光组件，其特征在于，包括：
    线路板；
    电连接于所述线路板的感光芯片；以及
    介质层，设置于所述线路板和所述感光芯片之间，具有用于防止所述感光芯片形变的预定柔性。
  28. 根据权利要求27所述的感光组件，其中，所述感光芯片通过所述介质层被安装于所述线路板。
  29. 根据权利要求28所述的感光组件，进一步包括支撑件，所述支撑件被设置于所述线路板，所述支撑件与所述线路板表面形成收容腔，其中，所述介质层通过被施加于所述收容腔内的黏着剂固化形成。
  30. 根据权利要求27所述的感光组件，进一步包括粘接件，所述介质层通过所述粘接件分别与所述线路板和所述感光芯片连接。
  31. 根据权利要求27所述的感光组件，进一步包括粘接件，其中，所述介质层一体形成于所述线路板，所述介质层通过所述粘接件与所述感光芯片连接。
  32. 根据权利要求27所述的感光组件，进一步包括粘接件，其中，所述介质层一体形成于所述感光芯片的下表面，所述介质层通过所述粘接件与所述线路板连接。
  33. 根据权利要求30-32任意一项所述的感光组件，其中，所述介质层由柔性材料制成，该柔性材料的邵氏硬度为10HSA-70HSA。
  34. 根据权利要求33所述的感光组件，其中，所述介质层的制成材料，选自泡棉、塑料和泡棉的组合物、软胶和硅胶中任意一种。
  35. 根据权利要求34所述的感光组件，其中，当所述介质层由泡棉制成时，所述介质层的厚度为80um-130um。
  36. 根据权利要求35所述的感光组件，其中，当所述介质层由软胶制成时，所述介质层的厚度为20um-100um。
  37. 根据权利要求29所述的感光组件，其中，所述介质层的厚度为50um-100um。
  38. 根据权利要求26所述的感光组件，其中，所述介质层能够发生的形变量为自身厚度的5％-50％。
  39. 根据权利要求27所述的感光组件，其中，所述介质层能够发生的形变量为自身厚度的5％-50％。
  40. 一种摄像模组，其特征在于，包括：
    光学镜头；以及
    根据权利要求27-39任意一项所述的感光组件，其中，所述光学镜头被保持于所述感光组件的感光路径。
  41. 一种电子设备，其特征在于，包括：
    电子设备主体；以及
    组装于所述电子设备主体的摄像模组，其中，所述摄像模组包括根据权利要求27-29任意一项所述的感光组件。
  42. 一种感光组件的制备方法，其特征在于，包括：
    提供线路板和感光芯片；以及
    在所述线路板和所述感光芯片之间形成介质层。
  43. 根据权利要求42所述的制备方法，其中，在所述线路板和所述感光芯片之间形成介质层，包括：
    在所述线路板上形成所述介质层；以及
    在所述介质层上安装所述感光芯片。
  44. 根据权利要求42所述的制备方法，其中，在所述线路板和所述感光芯片之间形成介质层，包括：
    在所述感光芯片的下表面上形成所述介质层；以及
    将带有所述介质层的所述感光芯片贴装于所述线路板。
  45. 根据权利要求43所述的制备方法，其中，在所述线路板上形成所述介质层，包括：
    在所述线路板上施加粘接件；以及
    贴装所述介质层于所述粘接件，以在所述线路板上形成所述介质层。
  46. 根据权利要求43所述的制备方法，其中，在所述线路板上形成所述介质层，包括：
    在所述线路板上一体形成所述介质层。
  47. 根据权利要求45或46所述的制备方法，其中，在所述介质层上安装所述感光芯片，包括：
    在所述介质层上施加粘接件；以及
    贴装所述感光芯片于所述粘接件，以将所述感光芯片安装于所述介质层。
  48. 根据权利要求42所述的制备方法，其中，在所述线路板和所述感光芯片之间形成介质层，包括：
    在所述线路板上设置支撑件，所述支撑件和所述线路板表面形成收容腔；
    在所述收容腔内施加黏着剂；
    将所述感光芯片贴装于所述黏着剂；以及
    固化所述黏着剂，以在所述线路板和所述感光芯片之间形成所述介质层。
  49. 根据权利要求28所述的制备方法，进一步包括：去除所述支撑件。
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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115314625A (zh) * 2022-08-22 2022-11-08 维沃移动通信有限公司 摄像头模组及电子设备
CN116497310B (zh) * 2023-04-04 2023-12-05 北京创思镀膜有限公司 一种光学薄膜元件及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100799876B1 (ko) * 2006-11-27 2008-01-30 삼성전기주식회사 카메라 모듈 패키지
CN108810332A (zh) * 2017-04-28 2018-11-13 南昌欧菲光电技术有限公司 摄像模组及其组装方法、感光组件
CN108810333A (zh) * 2017-04-28 2018-11-13 南昌欧菲光电技术有限公司 摄像模组及其组装方法、下沉式感光组件
CN110412709A (zh) * 2018-04-28 2019-11-05 三赢科技（深圳）有限公司 镜头模组及该镜头模组的组装方法
CN110557536A (zh) * 2019-09-12 2019-12-10 Oppo广东移动通信有限公司 摄像头组件以及电子设备
CN110602361A (zh) * 2019-09-12 2019-12-20 Oppo广东移动通信有限公司 摄像头组件以及电子设备

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4118523A1 (de) * 1991-02-19 1992-08-20 Leica Industrieverwaltung Axialsymmetrische fuegeverbindung hoher thermischer belastbarkeit
CN1161462A (zh) * 1995-03-31 1997-10-08 大宇电子株式会社 带有温度补偿层的薄膜致动的反射镜阵列
US20020145762A1 (en) * 2001-04-05 2002-10-10 Chuan-Yu Hsu Optical chassis pasted with plating film reflection thin plates
JP2003004922A (ja) * 2001-06-26 2003-01-08 Canon Inc 反射光学素子およびその製造方法、光学系、光学機器
US20040170109A1 (en) * 2003-02-28 2004-09-02 Matsushita Electric Industrial Co., Ltd. Optical pickup
US8425060B2 (en) * 2007-11-09 2013-04-23 Nikon Corporation Self-correcting optical elements for high-thermal-load optical systems
CN102981242B (zh) * 2012-12-12 2014-10-15 中国科学院长春光学精密机械与物理研究所 一种空间光学遥感器反射镜柔性支撑机构
CN103116211B (zh) * 2013-01-25 2015-01-28 北京航空航天大学 一种曲面棱镜的装夹方法
DE102014103157B3 (de) * 2014-03-10 2015-06-18 Jenoptik Optical Systems Gmbh Justierbarer deformierbarer Spiegel zum Ausgleich von Aberrationen eines Strahlenbündels
EP3179176B1 (en) * 2015-12-07 2019-03-13 Ricardo Lozano Peña Thermally balanced sandwich-type solar face
CN111193852B (zh) * 2016-03-28 2021-10-15 宁波舜宇光电信息有限公司 摄像模组及其制造方法
CN105785547A (zh) * 2016-04-27 2016-07-20 河南省皓泽电子有限公司 一种双摄像头用的闭环单组控制中心导向自动对焦装置
CN206282067U (zh) * 2016-11-29 2017-06-27 河南省皓泽电子有限公司 一种潜望式自动对焦装置
CN106405991A (zh) * 2016-11-29 2017-02-15 深圳市世尊科技有限公司 潜望式摄像模组及用于该潜望式摄像模组的反射镜装置
CN108227113A (zh) * 2016-12-10 2018-06-29 中国科学院长春光学精密机械与物理研究所 用于反射镜光学元件角度调整及像差补偿的装置以及方法
CN109698894B (zh) * 2017-10-20 2023-06-30 宁波舜宇光电信息有限公司 基于金属支架的感光组件和摄像模组
CN108761593A (zh) * 2017-12-27 2018-11-06 宁波长阳科技股份有限公司 反射结构及其应用
JP6951687B2 (ja) * 2018-03-19 2021-10-20 株式会社リコー 画像投写装置及び移動体
CN208141027U (zh) * 2018-05-11 2018-11-23 南阳英锐光电科技股份有限公司 一种棱镜的胶合夹持装置
CN208351111U (zh) * 2018-05-22 2019-01-08 宁波舜宇光电信息有限公司 潜望式摄像模组、潜望式阵列模组以及电子设备
CN208902945U (zh) * 2018-09-19 2019-05-24 长春奥普光电技术股份有限公司 一种光学镜头的俯仰机构
CN109348097A (zh) * 2018-09-29 2019-02-15 上海与德科技有限公司 潜望式摄像装置及终端设备
CN109348096A (zh) * 2018-09-29 2019-02-15 上海与德科技有限公司 潜望式摄像装置及终端设备
CN208874051U (zh) * 2018-09-30 2019-05-17 清华大学 一种紧凑型激光器结构
CN209148958U (zh) * 2018-10-22 2019-07-23 中国科学院上海技术物理研究所 极端温度环境下反射式望远镜的支撑装置
CN209387995U (zh) * 2018-12-30 2019-09-13 瑞声科技(新加坡)有限公司 镜头模组
CN209593574U (zh) * 2019-02-25 2019-11-05 德淮半导体有限公司 一种潜望式变焦镜头、成像模组及电子装置
CN209805924U (zh) * 2019-03-22 2019-12-17 华为技术有限公司 潜望式摄像头模组和电子设备
CN110568583A (zh) * 2019-07-23 2019-12-13 珠海格力电器股份有限公司 一种潜望式摄像头及移动设备
CN213637945U (zh) * 2020-12-08 2021-07-06 蓝图智创(天津)科技有限公司 一种具有缓冲功能的摄像机用防护罩

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100799876B1 (ko) * 2006-11-27 2008-01-30 삼성전기주식회사 카메라 모듈 패키지
CN108810332A (zh) * 2017-04-28 2018-11-13 南昌欧菲光电技术有限公司 摄像模组及其组装方法、感光组件
CN108810333A (zh) * 2017-04-28 2018-11-13 南昌欧菲光电技术有限公司 摄像模组及其组装方法、下沉式感光组件
CN110412709A (zh) * 2018-04-28 2019-11-05 三赢科技（深圳）有限公司 镜头模组及该镜头模组的组装方法
CN110557536A (zh) * 2019-09-12 2019-12-10 Oppo广东移动通信有限公司 摄像头组件以及电子设备
CN110602361A (zh) * 2019-09-12 2019-12-20 Oppo广东移动通信有限公司 摄像头组件以及电子设备

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