WO2021117339A1 - Feuille de cuivre traitée en surface, carte stratifiée cuivrée, et carte de circuit imprimé - Google Patents

Feuille de cuivre traitée en surface, carte stratifiée cuivrée, et carte de circuit imprimé Download PDF

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Publication number
WO2021117339A1
WO2021117339A1 PCT/JP2020/038989 JP2020038989W WO2021117339A1 WO 2021117339 A1 WO2021117339 A1 WO 2021117339A1 JP 2020038989 W JP2020038989 W JP 2020038989W WO 2021117339 A1 WO2021117339 A1 WO 2021117339A1
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Prior art keywords
copper foil
treated
layer
treatment layer
base material
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PCT/JP2020/038989
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English (en)
Japanese (ja)
Inventor
郁浩 五刀
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Ｊｘ金属株式会社
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Priority to KR1020227017427A priority Critical patent/KR20220087525A/ko
Priority to CN202080082012.7A priority patent/CN114761622B/zh
Publication of WO2021117339A1 publication Critical patent/WO2021117339A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Definitions

  • This disclosure relates to surface-treated copper foil, copper-clad laminates, and printed wiring boards.
  • Copper-clad laminates are widely used in various applications such as flexible printed wiring boards.
  • This flexible printed wiring board is mounted by etching the copper foil of a copper-clad laminate to form a conductor pattern (also called a "wiring pattern") and connecting electronic components on the conductor pattern with solder. Manufactured.
  • the loss of signal power (transmission loss) in an electronic circuit can be roughly divided into two.
  • the first is the conductor loss, that is, the loss due to the copper foil
  • the second is the dielectric loss, that is, the loss due to the resin base material.
  • the conductor loss has a skin effect in the high frequency region and has the characteristic that the current flows on the surface of the conductor. Therefore, if the surface of the copper foil is rough, the current will flow along a complicated path. Therefore, in order to reduce the conductor loss of the high frequency signal, it is desirable to reduce the surface roughness of the copper foil.
  • transmission loss and “conductor loss” are simply used in the present specification, they mainly mean “transmission loss of high frequency signal” and "conductor loss of high frequency signal”.
  • Patent Document 1 proposes a method of providing a roughening treatment layer formed of roughened particles on a copper foil and forming a silane coupling treatment layer on the outermost surface layer.
  • the roughened layer can enhance the adhesiveness between the copper foil and the resin base material by the anchor effect of the roughened particles, but it may increase the conductor loss due to the skin effect, so that it can be applied to the copper foil surface. It is desirable to reduce the amount of coarsened particles to be electrodeposited. On the other hand, if the number of roughened particles electrodeposited on the surface of the copper foil is reduced, the anchoring effect of the roughened particles is reduced, and sufficient adhesiveness between the copper foil and the resin base material cannot be obtained.
  • a resin base material formed of a low-dielectric material such as a liquid crystal polymer or a low-dielectric polyimide is more difficult to adhere to a copper foil than a conventional resin base material, so that the adhesiveness between the copper foil and the resin base material is improved.
  • the development of a method to enhance it is desired.
  • the silane coupling treatment layer has an effect of improving the adhesiveness between the copper foil and the resin base material, the effect of improving the adhesiveness may not be sufficient depending on the type.
  • An embodiment of the present invention has been made to solve the above problems, and is a surface-treated copper foil capable of enhancing adhesiveness to a resin base material, particularly a resin base material suitable for high-frequency applications.
  • the purpose is to provide.
  • Another object of the present invention is to provide a copper-clad laminate having excellent adhesiveness between a resin base material, particularly a resin base material suitable for high-frequency applications and a surface-treated copper foil.
  • an embodiment of the present invention aims to provide a printed wiring board having excellent adhesion between a resin base material, particularly a resin base material suitable for high frequency applications, and a circuit pattern.
  • the present inventors have conducted a load area ratio that separates the protruding valley portion and the core portion among various indexes of the surface roughness of the surface-treated layer. Based on the finding that SMr2 is closely related to the adhesiveness between the surface-treated copper foil and the resin base material, by controlling SMr2 to a specific range, the surface-treated copper foil and the resin base material can be combined. They have found that the adhesiveness between them can be enhanced, and have completed the embodiment of the present invention.
  • the embodiment of the present invention has a copper foil and a surface-treated layer formed on at least one surface of the copper foil, and has a load area ratio that separates the protruding valley portion and the core portion of the surface-treated layer.
  • the present invention relates to a surface-treated copper foil having an SMr2 of 91 to 96%. Further, an embodiment of the present invention relates to a copper-clad laminate comprising the surface-treated copper foil and a resin base material adhered to the surface-treated layer of the surface-treated copper foil. Further, an embodiment of the present invention relates to a printed wiring board including a circuit pattern formed by etching the surface-treated copper foil of the copper-clad laminate.
  • a surface-treated copper foil capable of enhancing the adhesiveness with a resin base material, particularly a resin base material suitable for high frequency applications.
  • a copper-clad laminate having excellent adhesiveness between a resin base material, particularly a resin base material suitable for high-frequency applications and a surface-treated copper foil.
  • a printed wiring board having excellent adhesiveness between a resin base material, particularly a resin base material suitable for high frequency applications, and a circuit pattern.
  • the surface-treated copper foil according to the embodiment of the present invention has a copper foil and a surface-treated layer formed on at least one surface of the copper foil. That is, the surface treatment layer may be formed on only one surface of the copper foil, or may be formed on both surfaces of the copper foil. Further, when the surface treatment layers are formed on both surfaces of the copper foil, the types of the surface treatment layers may be the same or different.
  • the surface treatment layer has a load area ratio SMr2 that separates the protruding valley portion and the core portion from 91 to 96%.
  • the load area ratio SMr2 that separates the protruding valley portion and the core portion represents the ratio of the protruding valley portion below the core portion, and the smaller the ratio of the protruding valley portion, the larger the value of SMr2.
  • SMr2 is measured according to ISO 25178.
  • the anchor effect can be enhanced by setting SMr2 of the surface treatment layer to 91% or more (reducing the proportion of protruding valleys). As a result, the adhesive force between the surface-treated copper foil and the resin base material is increased. On the other hand, by setting SMr2 of the surface treatment layer to 96% or less, it is possible to suppress an increase in transmission loss due to the skin effect.
  • the surface treatment layer has a load area ratio SMr1 that separates the protruding peak portion and the core portion, preferably 16 to 28%.
  • the load area ratio SMr1 that separates the protruding mountain portion and the core portion represents the ratio of the protruding peak portion above the core portion, and the larger the ratio of the protruding peak portion, the larger the value of SMr1.
  • SMr1 is measured according to ISO 25178.
  • SMr1 of the surface treatment layer 16% or more (increasing the ratio of the protruding peaks), it is possible to easily disperse the peeling force in the height direction of the protruding peaks due to the presence of the protruding peaks. it can. As a result, the adhesive force between the surface-treated copper foil and the resin base material is increased. On the other hand, by setting SMr1 of the surface treatment layer to 28% or less, it is possible to suppress an increase in transmission loss due to the skin effect.
  • the surface-treated layer has a protruding peak height Spk of preferably 1.2 to 2.5 ⁇ m.
  • the protruding peak height Spk is measured in accordance with ISO 25178.
  • the resin base material is adhered to the surface-treated layer of the surface-treated copper foil, if the protruding peak portion of the surface-treated layer is low, the peeling force is concentrated on the surface of the core portion. Therefore, by setting the Spk of the surface treatment layer to 1.2 ⁇ m or more (increasing the protruding ridge), it is possible to easily disperse the peeling force in the height direction of the protruding ridge due to the presence of the protruding ridge. .. As a result, the adhesive force between the surface-treated copper foil and the resin base material is increased. On the other hand, by setting the Spk of the surface treatment layer to 2.5 ⁇ m or less, it is possible to suppress an increase in transmission loss due to the skin effect.
  • the level difference Sk of the core portion of the surface treatment layer is preferably 1.0 to 2.0 ⁇ m.
  • the level difference Sk of the core portion of the surface treatment layer represents the degree of variation in the height of the portion (core portion) excluding the protruding peak portion and the protruding valley portion, and is measured in accordance with ISO 25178.
  • the Sk of the surface treatment layer is set to 1.0 ⁇ m or more (increasing the variation in the height of the core portion), the upper surface of the core portion is made uneven and the peeling force is increased in the height direction of the core portion. It can be easily dispersed. As a result, the adhesive force between the surface-treated copper foil and the resin base material is increased.
  • the Sk of the surface treatment layer is set to 2.0 ⁇ m or less, it is possible to suppress an increase in transmission loss due to the skin effect.
  • the type of the surface treatment layer is not particularly limited, and various surface treatment layers known in the art can be used.
  • the surface treatment layer include a roughening treatment layer, a heat resistance treatment layer, a rust prevention treatment layer, a chromate treatment layer, a silane coupling treatment layer and the like. These layers may be used alone or in combination of two or more.
  • the surface treatment layer preferably has a roughening treatment layer from the viewpoint of adhesiveness to the resin base material.
  • the surface treatment layer has one or more layers selected from the group consisting of a heat resistant treatment layer, a rust prevention treatment layer, a chromate treatment layer and a silane coupling treatment layer, these layers are on the roughening treatment layer. It is preferable that it is provided in.
  • FIG. 1 shows a schematic cross-sectional view of a surface-treated copper foil having a roughening-treated layer on one surface of the copper foil.
  • the roughening treatment layer formed on one surface of the copper foil 10 includes a primary roughening particle 20, a cover plating layer 30 covering the primary roughening particle 20, and a cover plating layer 30.
  • the primary roughened particles 20 coated with the cover plating layer 30 are substantially spherical, and the secondary roughened particles 40 are formed so as to spread in a dendritic shape. With such a structure, it becomes easy to control SMr2, SMr1, Spk and Sk of the surface treatment layer within the above range.
  • the primary roughened particles 20 are not particularly limited, but are formed from an element selected from the group consisting of copper, nickel, cobalt, phosphorus, tungsten, arsenic, molybdenum, chromium and zinc, or an alloy containing two or more kinds of elements. be able to. Among them, the primary roughened particles 20 are preferably formed from copper or a copper alloy, particularly copper.
  • the cover plating layer 30 is not particularly limited, but can be formed of copper, silver, gold, nickel, cobalt, zinc, or the like.
  • the secondary roughened particles 40 are not particularly limited, but can be formed from a metal selected from the group consisting of nickel, cobalt, copper, and zinc, or an alloy containing two or more kinds of metals. Among them, the secondary roughened particles 40 are preferably formed from a copper alloy, particularly a Cu—Co—Ni alloy.
  • the roughened layer can be formed by electroplating.
  • the conditions may be adjusted according to the electroplating apparatus used and are not particularly limited, but typical conditions are as follows. (Formation condition R1 of primary roughened particles 20)
  • Plating solution composition 5 to 15 g / L Cu, 40 to 100 g / L sulfuric acid
  • Plating solution temperature 20 to 50 ° C.
  • Electroplating Conditions current density 30 ⁇ 60A / dm 2, coulombs 40 ⁇ 100As / dm 2
  • the formation condition R1 of the primary roughened particles 20 As the amount of coulomb decreases, the growth of the primary roughened particles 20 in the Z direction (direction perpendicular to the copper foil 10) is suppressed. Further, under the formation condition R2 of the cover plating layer 30, as the amount of coulomb increases, the layer grows uniformly and thickly in the XYZ direction. Therefore, by controlling the amount of coulomb (R1) / amount of coulomb (R2) to 6.0 or less, preferably 4.0 or less, the shape of the primary roughened particles 20 coated with the cover plating layer 30 is substantially spherical. It can be controlled to have a substantially hemispherical shape.
  • the secondary coarse particles 20 are formed on the cover plating layer 30.
  • the chemical particles 40 are likely to be formed so as to spread in a dendritic shape.
  • the amount of coulomb (R1) / amount of coulomb (R2) exceeds 6.0, the growth of the primary roughened particles 20 in the Z direction becomes large, so that the primary roughened particles 20 coated with the cover plating layer 30
  • the shape is approximately ellipsoidal to semi-ellipsoidal. Therefore, the secondary roughened particles 40 formed on the cover plating layer 30 are less likely to spread like dendritic particles.
  • the heat-resistant treatment layer and the rust-prevention treatment layer are not particularly limited, and can be formed from materials known in the art. Since the heat-resistant treatment layer may also function as a rust-preventive treatment layer, one layer having both the functions of the heat-resistant treatment layer and the rust-preventive treatment layer is formed as the heat-resistant treatment layer and the rust-preventive treatment layer. May be good.
  • the heat-resistant layer and / or rust-preventive layer includes nickel, zinc, tin, cobalt, molybdenum, copper, tungsten, phosphorus, arsenic, chromium, vanadium, titanium, aluminum, gold, silver, platinum group elements, iron, and tantalum.
  • the heat-resistant treatment layer and / or the rust-prevention treatment layer is preferably a Ni—Zn layer or a Zn layer.
  • the Ni—Zn layer has a lower Ni content than the Zn content or the Zn layer does not contain Ni, the conductor loss can be reduced without significantly reducing the heat resistance effect and the rust preventive effect. It is preferable because it becomes.
  • the heat-resistant treatment layer and the rust-prevention treatment layer can be formed by electroplating.
  • the conditions may be adjusted according to the electroplating apparatus to be used and are not particularly limited, but the conditions for forming the heat resistant treatment layer (Ni—Zn layer) using a general electroplating apparatus are as follows. is there. Plating solution composition: 1 to 30 g / L Ni, 1 to 30 g / L Zn Plating solution pH: 2-5 Plating liquid temperature: 30 to 50 ° C Electroplating conditions: current density 1-10 A / dm 2 , time 0.1-5 seconds
  • the chromate-treated layer is not particularly limited and can be formed from a material known in the art.
  • the term "chromate-treated layer" as used herein means a layer formed of a solution containing chromic anhydride, chromic acid, dichromic acid, chromate or dichromate.
  • the chromate-treated layer can be any element (metal, alloy, oxide, nitride, sulfide, etc.) such as cobalt, iron, nickel, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium. It can be a layer containing (may be in the form).
  • Examples of the chromate-treated layer include a chromate-treated layer treated with an aqueous solution of chromic anhydride or potassium dichromate, and a chromate-treated layer treated with a treatment solution containing chromic anhydride or potassium dichromate and zinc.
  • the chromate-treated layer can be formed by a known method such as immersion chromate treatment and electrolytic chromate treatment. These conditions are not particularly limited, but for example, the conditions for forming a general immersion chromate-treated layer are as follows. Chromate solution composition: 1 to 10 g / L K 2 Cr 2 O 7 , 0.01 to 10 g / L Zn Chromate solution pH: 2-5 Chromate liquid temperature: 30-55 ° C
  • the silane coupling treatment layer is not particularly limited, and can be formed from a material known in the art.
  • the term "silane coupling-treated layer" as used herein means a layer formed of a silane coupling agent.
  • the silane coupling agent is not particularly limited, and those known in the art can be used.
  • Examples of silane coupling agents include amino-based silane coupling agents, epoxy-based silane coupling agents, mercapto-based silane coupling agents, metharoxy-based silane coupling agents, vinyl-based silane coupling agents, and imidazole-based silane coupling agents. , Triazine-based silane coupling agent and the like. Among these, amino-based silane coupling agents and epoxy-based silane coupling agents are preferable.
  • silane coupling agent can be used alone or in combination of two or more.
  • a typical method for forming a silane coupling treatment layer a 1.2% by volume aqueous solution (pH: 10) of N-2- (aminoethyl) -3-aminopropyltrimethoxysilane (KBM603 manufactured by Shin-Etsu Chemical Co., Ltd.) ) Is applied and dried to form a silane coupling treatment layer.
  • the copper foil is not particularly limited, and may be either an electrolytic copper foil or a rolled copper foil.
  • Electrolytic copper foil is generally produced by electrolytically depositing copper on a titanium or stainless steel drum from a copper sulfate plating bath, but a flat S-plane (shine surface) formed on the drum side and an S-plane. It has an M surface (matte surface) formed on the opposite side.
  • the surface treatment layer and the resin are formed by forming a surface treatment layer on the M surface of the electrolytic copper foil and adhering the surface treatment layer to the resin base material. Adhesion with the base material can be improved.
  • the material of the copper foil is not particularly limited, but when the copper foil is a rolled copper foil, tough pitch copper (JIS H3100 alloy number C1100) and oxygen-free copper (JIS H3100 alloy number) usually used as a circuit pattern of a printed wiring board are used.
  • High-purity copper such as C1020 or JIS H3510 alloy number C1011) can be used.
  • copper alloys such as Sn-containing copper, Ag-containing copper, copper alloys to which Cr, Zr, Mg and the like are added, and Corson-based copper alloys to which Ni and Si and the like are added can also be used.
  • copper foil is a concept including copper alloy foil.
  • the thickness of the copper foil is not particularly limited, but may be, for example, 1 to 1000 ⁇ m, 1 to 500 ⁇ m, 1 to 300 ⁇ m, 3 to 100 ⁇ m, 5 to 70 ⁇ m, 6 to 35 ⁇ m, or 9 to 18 ⁇ m. ..
  • the surface-treated copper foil having the above-mentioned structure can be produced according to a method known in the art.
  • SMr2, SMr1, Spk and Sk of the surface treatment layer can be controlled by adjusting the formation conditions of the surface treatment layer, particularly the formation conditions of the roughening treatment layer described above.
  • the load area ratio SMr2 that separates the protruding valley portion and the core portion of the surface-treated layer is controlled to 91 to 96%, so that the surface-treated copper foil is a surface-treated copper foil.
  • the anchor effect can be enhanced when a resin base material is adhered to the surface. Therefore, this surface-treated copper foil can enhance the adhesiveness to a resin base material, particularly a resin base material suitable for high-frequency applications.
  • the copper-clad laminate according to the embodiment of the present invention includes the above-mentioned surface-treated copper foil and a resin base material adhered to the surface-treated layer of the above-mentioned surface-treated copper foil.
  • This copper-clad laminate can be manufactured by adhering a resin base material to the surface-treated layer of the above-mentioned surface-treated copper foil.
  • the resin base material is not particularly limited, and those known in the art can be used. Examples of resin base materials include paper base material phenol resin, paper base material epoxy resin, synthetic fiber cloth base material epoxy resin, glass cloth / paper composite base material epoxy resin, glass cloth / glass non-woven fabric base material epoxy resin, and glass. Examples thereof include cloth-based epoxy resins, polyester films, polyimide films, liquid crystal polymers, and fluororesins.
  • the method for adhering the surface-treated copper foil to the resin base material is not particularly limited, and can be performed according to a method known in the art.
  • the surface-treated copper foil and the resin base material may be laminated and thermocompression bonded.
  • the copper-clad laminate manufactured as described above can be used for manufacturing a printed wiring board.
  • the copper-clad laminate according to the embodiment of the present invention uses the above-mentioned surface-treated copper foil, it is possible to improve the adhesiveness to a resin base material, particularly a resin base material suitable for high-frequency applications.
  • the printed wiring board according to the embodiment of the present invention includes a circuit pattern formed by etching the surface-treated copper foil of the copper-clad laminate.
  • This printed wiring board can be manufactured by etching the surface-treated copper foil of the copper-clad laminate to form a circuit pattern.
  • the method for forming the circuit pattern is not particularly limited, and a known method such as a subtractive method or a semi-additive method can be used. Among them, the subtractive method is preferable as the method for forming the circuit pattern.
  • a predetermined resist pattern is formed by applying, exposing and developing a resist on the surface of the surface-treated copper foil of the copper-clad laminate.
  • the surface-treated copper foil of the portion (unnecessary portion) where the resist pattern is not formed is removed by etching to form a circuit pattern.
  • the resist pattern on the surface-treated copper foil is removed.
  • the various conditions in this subtractive method are not particularly limited, and can be performed according to the conditions known in the art.
  • the printed wiring board according to the embodiment of the present invention uses the above-mentioned copper-clad laminate, it is excellent in adhesiveness between a resin base material, particularly a resin base material suitable for high-frequency applications, and a circuit pattern. ..
  • Example 1 A rolled copper foil A (young rate after recrystallization of 120 GPa, thickness of 12 ⁇ m) is prepared, one surface is degreased and pickled, and then a roughened treated layer is formed as a surface treated layer to form a surface treated copper. I got the foil.
  • the conditions for forming the roughened layer were as follows. ⁇ Conditions for forming primary roughened particles R1> Plating solution composition: 11 g / L Cu, 50 g / L sulfuric acid Plating solution temperature: 25 ° C. Electroplating conditions: current density 35.6 A / dm 2 , coulomb amount 72.7 As / dm 2
  • Plating solution composition 20 g / L Cu, 100 g / L sulfuric acid Plating solution temperature: 50 ° C.
  • Electroplating conditions current density 9.9 A / dm 2 , coulomb amount 30.3 As / dm 2
  • Example 1 A surface-treated copper foil was obtained in the same manner as in Example 1 except that at least one of the type of rolled copper foil, the current density and the amount of coulomb in R1, R2 and Y was changed as shown in Table 1.
  • the rolled copper foil B is a rolled copper foil having a Young's modulus of 85 GPa and a thickness of 12 ⁇ m after recrystallization.
  • FIG. 2 shows SEM photographs (20,000 times, inclination of 40 °) of the surface-treated layer (roughened layer) in the surface-treated copper foils of Example 1 and Comparative Example 1.
  • ⁇ SMr2, SMr1, Spk, Sk of the surface treatment layer> Images were taken using a laser microscope (LEXT OLS4000) manufactured by Olympus Corporation. The captured image was analyzed using the analysis software of a laser microscope (LEXT OLS4100) manufactured by Olympus Corporation. Measurements of SMr2, SMr1, Spk and Sk were performed in accordance with ISO 25178, respectively. In addition, as these measurement results, the average value of the values measured at any three places was used as the measurement result. The temperature at the time of measurement was 23 to 25 ° C.
  • the main setting conditions for the laser microscope and analysis software are as follows.
  • Objective lens MPLAPON50XLEXT (magnification: 50x, numerical aperture: 0.95, immersion type: air, mechanical lens barrel length: ⁇ , cover glass thickness: 0, field of view: FN18)
  • Optical zoom magnification 1x
  • Scanning mode XYZ High accuracy (height resolution: 10 nm, number of pixels of captured data: 1024 x 1024)
  • Captured image size [number of pixels]: 257 ⁇ m in width ⁇ 258 ⁇ m in length [1024 ⁇ 1024] (Since it is measured in the lateral direction, the evaluation length is equivalent to 257 ⁇ m)
  • Filter Gaussian filter Noise removal: Measurement pretreatment Surface (
  • the strength (TD180 ° peel strength) when the circuit (surface-treated copper foil) is peeled off from the surface of the resin base material at a speed of 50 mm / min in the TD180 ° direction is based on JIS C6471: 1995. Was measured. The measurement was performed three times, and the average value was used as the result of peel strength. If the peel strength is 0.50 kgf / cm or more, it can be said that the adhesiveness between the circuit (surface-treated copper foil) and the resin base material is good.
  • the circuit width was adjusted by a normal subtractive etching method using a copper chloride etching solution.
  • Table 2 shows the results of the above characteristic evaluation.
  • the surface-treated copper foils of Examples 1 to 14 in which SMr2 of the surface-treated layer was within a predetermined range had high peel strength.
  • the surface-treated copper foil of Comparative Example 1 in which SMr2 of the surface-treated layer was out of the predetermined range had low peel strength.
  • a surface-treated copper foil capable of enhancing the adhesiveness with a resin base material, particularly a resin base material suitable for high frequency applications. ..
  • a copper-clad laminate having excellent adhesiveness between a resin base material, particularly a resin base material suitable for high-frequency applications and a surface-treated copper foil.
  • a printed wiring board having excellent adhesiveness between a resin base material, particularly a resin base material suitable for high frequency applications, and a circuit pattern.

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  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une feuille de cuivre traitée en surface qui possède une feuille de cuivre, et une couche traitée en surface formée sur au moins une face de cette feuille de cuivre. La feuille de cuivre traitée en surface de l'invention présente un rapport de surface de charge (ＳＭｒ２) séparant une partie âme et une partie vallée de saillie de la couche traitée en surface, compris entre ９１ et ９６％.
PCT/JP2020/038989 2019-12-13 2020-10-15 Feuille de cuivre traitée en surface, carte stratifiée cuivrée, et carte de circuit imprimé WO2021117339A1 (fr)

Priority Applications (2)

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KR1020227017427A KR20220087525A (ko) 2019-12-13 2020-10-15 표면 처리 구리박, 동장 적층판 및 프린트 배선판
CN202080082012.7A CN114761622B (zh) 2019-12-13 2020-10-15 表面处理铜箔、覆铜积层板及印刷配线板

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JP2019-225894 2019-12-13
JP2019225894A JP2021095596A (ja) 2019-12-13 2019-12-13 表面処理銅箔、銅張積層板及びプリント配線板

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WO2021117339A1 true WO2021117339A1 (fr) 2021-06-17

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JP (1) JP2021095596A (fr)
KR (1) KR20220087525A (fr)
CN (1) CN114761622B (fr)
TW (1) TW202122642A (fr)
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WO2023281776A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, plaque stratifiée plaquée de cuivre et carte de circuit imprimé
WO2023281775A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé
WO2023281774A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé
WO2023281778A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, carte stratifiée plaquée de cuivre et carte de circuit imprimé
WO2023281777A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, plaque stratifiée plaquée de cuivre et carte de circuit imprimé

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KR20240030268A (ko) * 2022-08-30 2024-03-07 롯데에너지머티리얼즈 주식회사 기둥형 노듈 구조를 갖는 표면처리동박，이를 포함하는 동박적층판 및 프린트 배선판

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JP2017036495A (ja) * 2015-08-06 2017-02-16 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
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WO2023281776A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, plaque stratifiée plaquée de cuivre et carte de circuit imprimé
WO2023281775A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé
WO2023281774A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé
WO2023281778A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, carte stratifiée plaquée de cuivre et carte de circuit imprimé
WO2023281777A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, plaque stratifiée plaquée de cuivre et carte de circuit imprimé

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CN114761622B (zh) 2024-01-12
TW202122642A (zh) 2021-06-16
CN114761622A (zh) 2022-07-15
KR20220087525A (ko) 2022-06-24
JP2021095596A (ja) 2021-06-24

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