WO2021107654A3 - 인쇄회로기판 - Google Patents

인쇄회로기판 Download PDF

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Publication number
WO2021107654A3
WO2021107654A3 PCT/KR2020/017003 KR2020017003W WO2021107654A3 WO 2021107654 A3 WO2021107654 A3 WO 2021107654A3 KR 2020017003 W KR2020017003 W KR 2020017003W WO 2021107654 A3 WO2021107654 A3 WO 2021107654A3
Authority
WO
WIPO (PCT)
Prior art keywords
connection part
insulation layer
pad
circuit board
printed circuit
Prior art date
Application number
PCT/KR2020/017003
Other languages
English (en)
French (fr)
Other versions
WO2021107654A2 (ko
Inventor
구교헌
이진학
정인호
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to JP2022531540A priority Critical patent/JP2023504416A/ja
Priority to US17/756,541 priority patent/US20220418107A1/en
Priority to CN202080089995.7A priority patent/CN114902816A/zh
Publication of WO2021107654A2 publication Critical patent/WO2021107654A2/ko
Publication of WO2021107654A3 publication Critical patent/WO2021107654A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

실시 예에 따른 인쇄히로기판은 비아 홀을 포함하는 절연층; 상기 절연층의 비아 홀에 배치된 비아를 포함하고, 상기 비아는, 상기 절연층의 상기 비아 홀 내에 배치되는 연결부; 상기 절연층의 상면 및 상기 연결부의 상면 위에 배치된 제1 패드; 및 상기 절연층의 하면 및 상기 연결부의 하면 아래에 배치된 제2 패드를 포함하고, 상기 연결부의 상면은 하측 방향으로 오목한 형상을 가지고, 상기 연결부의 하면은 상측 방향으로 오목한 형상을 가지며, 상기 제1 패드의 하면은 상기 연결부의 상면에 대응하는 볼록한 형상을 가지고, 상기 제2 패드의 상면은 상기 연결부의 하면에 대응하는 볼록한 형상을 가진다.
PCT/KR2020/017003 2019-11-27 2020-11-26 인쇄회로기판 WO2021107654A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022531540A JP2023504416A (ja) 2019-11-27 2020-11-26 回路基板
US17/756,541 US20220418107A1 (en) 2019-11-27 2020-11-26 Printed circuit board
CN202080089995.7A CN114902816A (zh) 2019-11-27 2020-11-26 印刷电路板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190153968A KR20210065347A (ko) 2019-11-27 2019-11-27 인쇄회로기판 및 이의 제조 방법
KR10-2019-0153968 2019-11-27

Publications (2)

Publication Number Publication Date
WO2021107654A2 WO2021107654A2 (ko) 2021-06-03
WO2021107654A3 true WO2021107654A3 (ko) 2021-07-22

Family

ID=76129569

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2020/017003 WO2021107654A2 (ko) 2019-11-27 2020-11-26 인쇄회로기판

Country Status (6)

Country Link
US (1) US20220418107A1 (ko)
JP (1) JP2023504416A (ko)
KR (1) KR20210065347A (ko)
CN (1) CN114902816A (ko)
TW (1) TW202135611A (ko)
WO (1) WO2021107654A2 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100965341B1 (ko) * 2007-12-20 2010-06-22 삼성전기주식회사 인쇄회로기판의 제조방법
JP2012049423A (ja) * 2010-08-30 2012-03-08 Sumitomo Bakelite Co Ltd 回路基板、半導体装置、回路基板の製造方法および半導体装置の製造方法
US20150146393A1 (en) * 2011-11-10 2015-05-28 Invensas Corporation High strength through-substrate vias
KR101875943B1 (ko) * 2011-10-24 2018-07-06 엘지이노텍 주식회사 인쇄회로기판 및 그 제조방법
KR101956563B1 (ko) * 2012-10-05 2019-03-11 신꼬오덴기 고교 가부시키가이샤 배선 기판 및 그 제조 방법

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Publication number Priority date Publication date Assignee Title
EP0916237B1 (de) * 1996-07-31 2001-01-17 Dyconex Patente Verfahren zur herstellung von verbindungsleitern
EP0948247B1 (en) * 1998-04-01 2005-08-31 Mitsui Mining & Smelting Co., Ltd. Method For Making A Multi-Layer Printed Wiring Board
US6972382B2 (en) * 2003-07-24 2005-12-06 Motorola, Inc. Inverted microvia structure and method of manufacture
US7205483B2 (en) * 2004-03-19 2007-04-17 Matsushita Electric Industrial Co., Ltd. Flexible substrate having interlaminar junctions, and process for producing the same
US8431833B2 (en) * 2008-12-29 2013-04-30 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP5360494B2 (ja) * 2009-12-24 2013-12-04 新光電気工業株式会社 多層配線基板、多層配線基板の製造方法、及びヴィアフィル方法
JP2014127623A (ja) * 2012-12-27 2014-07-07 Shinko Electric Ind Co Ltd 配線基板及び配線基板の製造方法
JP6870608B2 (ja) * 2015-02-23 2021-05-12 凸版印刷株式会社 印刷配線板及びその製造方法
JP2016213296A (ja) * 2015-05-07 2016-12-15 イビデン株式会社 プリント配線板
US10440835B1 (en) * 2019-01-31 2019-10-08 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Forming through holes through exposed dielectric material of component carrier
US10531577B1 (en) * 2019-01-31 2020-01-07 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Forming through holes through exposed dielectric material of component carrier
CN111511105A (zh) * 2019-01-31 2020-08-07 奥特斯奥地利科技与系统技术有限公司 具有用额外镀覆结构和桥结构填充的通孔的部件承载件
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100965341B1 (ko) * 2007-12-20 2010-06-22 삼성전기주식회사 인쇄회로기판의 제조방법
JP2012049423A (ja) * 2010-08-30 2012-03-08 Sumitomo Bakelite Co Ltd 回路基板、半導体装置、回路基板の製造方法および半導体装置の製造方法
KR101875943B1 (ko) * 2011-10-24 2018-07-06 엘지이노텍 주식회사 인쇄회로기판 및 그 제조방법
US20150146393A1 (en) * 2011-11-10 2015-05-28 Invensas Corporation High strength through-substrate vias
KR101956563B1 (ko) * 2012-10-05 2019-03-11 신꼬오덴기 고교 가부시키가이샤 배선 기판 및 그 제조 방법

Also Published As

Publication number Publication date
TW202135611A (zh) 2021-09-16
WO2021107654A2 (ko) 2021-06-03
JP2023504416A (ja) 2023-02-03
US20220418107A1 (en) 2022-12-29
CN114902816A (zh) 2022-08-12
KR20210065347A (ko) 2021-06-04

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