WO2021084853A1 - Matériau métallique pour contact coulissant, procédé de fabrication dudit matériau, élément balai pour moteur et moteur à vibration - Google Patents

Matériau métallique pour contact coulissant, procédé de fabrication dudit matériau, élément balai pour moteur et moteur à vibration Download PDF

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WO2021084853A1
WO2021084853A1 PCT/JP2020/031278 JP2020031278W WO2021084853A1 WO 2021084853 A1 WO2021084853 A1 WO 2021084853A1 JP 2020031278 W JP2020031278 W JP 2020031278W WO 2021084853 A1 WO2021084853 A1 WO 2021084853A1
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Prior art keywords
layer
plane
metal material
containing layer
copper
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PCT/JP2020/031278
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English (en)
Japanese (ja)
Inventor
颯己 葛原
秀一 北河
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古河電気工業株式会社
古河精密金属工業株式会社
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Priority to KR1020227003717A priority Critical patent/KR102544423B1/ko
Priority to JP2020564272A priority patent/JP6932860B1/ja
Priority to CN202080053235.0A priority patent/CN114175420B/zh
Publication of WO2021084853A1 publication Critical patent/WO2021084853A1/fr

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/10Bearings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R39/00Rotary current collectors, distributors or interrupters
    • H01R39/02Details for dynamo electric machines
    • H01R39/18Contacts for co-operation with commutator or slip-ring, e.g. contact brush
    • H01R39/20Contacts for co-operation with commutator or slip-ring, e.g. contact brush characterised by the material thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K13/00Structural associations of current collectors with motors or generators, e.g. brush mounting plates or connections to windings; Disposition of current collectors in motors or generators; Arrangements for improving commutation

Definitions

  • the present invention relates to a metal material for sliding contacts, a method for manufacturing the same, a brush material for a motor, and a vibration motor.
  • Micromotors are widely used in many applications such as audio equipment, home appliances, mobile phones, cameras, and automobiles.
  • the life of the motor is determined by the durability of the commutator and brush, which are members for energizing the motor coil.
  • a material having excellent performance such as wear resistance, arc resistance, electrical connectivity, conductivity, and strength is required, and in general, a Cu alloy strip coated with an Ag-Pd alloy is required. It is used.
  • Patent Document 1 regarding Pd plating on a metal substrate, the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is 45 to 60%, and the crystal orientation rate of the (200) plane is (200). 220) It is disclosed that a plated structure having a total crystal orientation ratio of 40 to 55% of the planes exhibits extremely high conductivity.
  • the brush material used so far is a clad material in which a base material (for example, a Cu base material) is coated with an Ag-Pd alloy, and is manufactured by repeating annealing and rolling, so that the manufacturing cost is high.
  • a processed alteration layer (a layer having a changed metal structure) formed by processing is formed on the Ag alloy, there are problems that the arc resistance is inferior, the wear is fast, and the motor life is short.
  • the present invention has been made in view of the above circumstances, and is a metal material for sliding contacts having sufficient conductivity for energizing a motor coil and excellent wear resistance, a method for manufacturing the same, and a method for manufacturing the same. It is an object of the present invention to provide a brush material for a motor and a vibration motor used.
  • the metal material for sliding contacts has a base material made of copper or a copper alloy, and a Pd-containing layer formed as the outermost layer on at least a part of the base material and containing 95% by mass or more of Pd.
  • the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%
  • the total of the crystal orientation rate of the (200) plane and the crystal orientation rate of the (220) plane is It has been found that when the content is less than 40%, the motor coil has sufficient conductivity for energizing the motor coil and is excellent in abrasion resistance, and the present invention has been completed.
  • the gist structure of the present invention is as follows.
  • the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the total of the crystal orientation rate of the (200) plane and the crystal orientation ratio of the (220) plane is 40%.
  • a metal material for sliding contacts characterized in that it is less than.
  • the Pd-containing layer is formed by using a metal material for sliding contacts having a Pd-containing layer containing Pd, and the Pd-containing layer has a (111) plane crystal orientation rate of more than 60% as measured by an X-ray diffraction method.
  • the vibration motor is made of a metal material in which the total of the crystal orientation ratio of the (200) plane and the crystal orientation ratio of the (220) plane is less than 40%.
  • the conductive substrate is formed as a surface layer on a resin plate, a copper layer made of copper or a copper alloy formed on the resin plate, and the copper layer.
  • the vibration motor according to (5) above which has an Au layer, an Au—Cu layer, an Au—Ni layer, or an Au—Co layer.
  • Pd plating is performed in a plating bath with a Pd concentration of 3 to 20 g / L and a bath temperature of 46 to 60 ° C. under the condition of a current density of 20 to 100 A / dm 2 , and the Pd-containing layer is used as the outermost layer.
  • a method for producing a metal material for sliding contacts which comprises forming.
  • a metal material for a sliding contact having sufficient conductivity for energizing a motor coil and excellent wear resistance, and a brush material for a motor and a vibration motor using the same. it can.
  • the vertical cross section of the metal material for a sliding contact of one embodiment is schematically shown.
  • the metal material for sliding contacts of the present invention is a base material made of copper or a copper alloy, and Pd formed as the outermost layer on at least a part of the base material and containing 95% by mass or more of Pd.
  • a metal material having a containing layer, the Pd-containing layer has a (111) plane crystal orientation rate of more than 60% and a (200) plane crystal orientation rate measured by an X-ray diffractometry. 220) The total crystal orientation of the planes is less than 40%.
  • the "crystal orientation ratio of the (111) plane measured by the X-ray diffraction method” is the total intensity of diffraction peaks from each crystal plane when Cu—K ⁇ rays are used in the X-ray diffraction method. It is a value showing the ratio of the intensity of the diffraction peak of the (111) plane as a percentage. Further, “the total of the crystal orientation rate of the (200) plane and the crystal orientation rate of the (220) plane measured by the X-ray diffraction method” is each of the cases where Cu—K ⁇ rays are used in the X-ray diffraction method.
  • FIG. 1 schematically shows a vertical cross section of a metal material for a sliding contact according to an embodiment.
  • the metal material 10 for sliding contacts shown in FIG. 1 is a Pd-containing layer formed as a surface layer on a base material 1 made of copper or a copper alloy and at least a part of the base material 1 and containing 95% by mass or more of Pd.
  • the Pd-containing layer 2 is a metal material having 2 and the crystal orientation ratio of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the crystal orientation ratio of the (200) plane and (200) plane are (2). 220) The total crystal orientation of the planes is less than 40%.
  • the illustrated metal material 10 for sliding contacts shows a case in which a base layer 3 made of Ni or a Ni alloy is provided between the base material 1 and the Pd-containing layer 2.
  • the base material 1 is made of copper or a copper alloy.
  • the copper alloy is not particularly limited, but for example, Cu—Zn-based alloy, Cu—Zn—Ni based alloy, Cu—Ni—Si based alloy, Cu—Sn based alloy, Cu—Ni—Sn based alloy, Cu—Cr. -Mg-based alloys, Cu-Ni-Si-Zn-Sn-Mg-based alloys and the like can be mentioned.
  • the thickness of the base material 1 is not particularly limited, but is preferably 0.02 to 0.15 mm.
  • the shape of the base material 1 is not particularly limited and may be appropriately selected depending on the intended use, and may be, for example, a strip material, a plate material, a bar material, a wire material, or the like.
  • the Pd-containing layer 2 is formed as the outermost layer on at least a part of the base material 1, and contains 95% by mass or more of Pd with respect to 100% by mass of the Pd-containing layer. As described above, when the Pd content in the Pd-containing layer 2 is 95% by weight or more, excellent conductivity and corrosion resistance can be ensured.
  • the Pd content in the Pd-containing layer 2 is not particularly limited as long as it is 95% by mass or more as described above, but it is preferably 98% by mass or more.
  • the Pd-containing layer 2 may be a Pd alloy as long as it contains 95% by mass or more of Pd.
  • the Pd alloy is not particularly limited, and examples thereof include Pd—Ni based alloys and Pd—Ag based alloys. Further, the Pd-containing layer 2 may be formed in a state where the Pd alloy phase is present in the Pd metal (matrix phase).
  • the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%.
  • the (111) plane of a Pd crystal tends to have a relatively higher hardness than other crystal planes, for example, the (200) plane and the (220) plane. Therefore, when the crystal orientation ratio is larger than 60%, the surface Since the hardness of the entire layer is increased, wear due to arc discharge is less likely to occur, and arc resistance is improved, the life of the brush material formed by using the layer is extended.
  • the crystal orientation rate of the (111) plane in the Pd-containing layer 2 may be larger than 60%, more preferably 65% or more.
  • the total of the crystal orientation rate of the (200) plane and the crystal orientation rate of the (220) plane measured by the X-ray diffraction method in the Pd-containing layer 2 is not particularly limited as long as it is less than 40%, but is preferably 35. Less than%. Since the (200) plane and the (220) plane of the Pd crystal have lower hardness than the (111) plane, if the crystal orientation ratio of the (200) plane and the (220) plane is high, the surface of the Pd-containing layer 2 However, wear is likely to occur due to arc discharge, and the arc resistance is inferior, which may shorten the life of the brush material.
  • the thickness of the Pd-containing layer 2 is not particularly limited, but is preferably 0.1 to 5 ⁇ m, more preferably 0.1 to 2 ⁇ m, and further preferably 0.2 to 0.5 ⁇ m. preferable. By setting the thickness of the Pd-containing layer 2 to 5 ⁇ m or less, it is possible to achieve both excellent workability and low cost in a well-balanced manner.
  • the Pd-containing layer is formed by electroplating.
  • the orientation rate of the (111) plane of the Pd crystal can be increased by forming the Pd crystal by electroplating.
  • the metal material 10 for sliding contacts may have a base layer 3 made of Ni or a Ni alloy between the base material 1 and the Pd-containing layer 2 described above.
  • the Ni alloy is not particularly limited, and examples thereof include Ni-P type, Ni-Fe type, and Ni-B type.
  • the thickness of the base layer 3 is not particularly limited, but is preferably 0.1 to 3.0 ⁇ m, more preferably 0.2 to 1.0 ⁇ m, for example.
  • Brush material for motor and vibration motor The metal material 10 for sliding contacts configured as described above can be used, for example, as a brush material for a motor used in a vibration motor.
  • the vibration motor includes a conductive substrate and a brush.
  • a metal material having the same configuration as the above-mentioned metal material for sliding contacts can be used as the brush.
  • this brush is a sliding contact having a base material made of copper or a copper alloy and a Pd-containing layer formed as the outermost layer on at least a part of the base material and containing 95% by mass or more of Pd.
  • the Pd-containing layer is formed by using a metal material for use, and the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the crystal orientation rate of the (200) plane and (220). It is composed of a metal material having a total surface crystal orientation ratio of less than 40%.
  • the conductive substrate that comes into contact with (sliding) the brush material is not particularly limited, but for example, a copper layer made of copper or a copper alloy is attached onto a resin plate.
  • a composite material is used in which a layer having excellent conductivity such as Au, Ni, Rh and an alloy thereof is formed as a surface layer on the copper layer by the method of Is preferable. Further, among these, by forming the surface layer as a plating layer of Au layer, Au—Cu layer, Au—Ni layer or Au—Co layer, it is formed on the outermost surface layer of at least a part of the base material constituting the brush. Abrasion resistance is more excellent with the Pd-containing layer.
  • the method for manufacturing the metal material for sliding contact of the present invention is the method for manufacturing the above-mentioned metal material for sliding contact. Specifically, in this method for producing a metal material for sliding contacts, dichlorotetraamminepalladium is used as a Pd source in at least a part of a base material made of copper or a copper alloy, and the Pd concentration (metal Pd conversion) is 3 to 20 g / L. In a plating bath having a bath temperature of 46 to 60 ° C. , Pd plating treatment is performed under the condition of a current density of 20 to 100 A / dm 2 , and a Pd-containing layer is formed as the outermost layer.
  • a base layer made of Ni or a Ni alloy is optionally laminated on a base material made of copper or a copper alloy.
  • Dichlorotetraammine-palladium is used as the outermost layer on the base material when the base layer is not formed, and on the base layer when the base layer is formed, the Pd concentration is 3 to 20 g / L, and the bath temperature is 46 to 46.
  • a Pd plating treatment is performed under the condition of a current density of 20 to 100 A / dm 2 to form a Pd-containing layer.
  • the (111) plane is in a precipitated state in which the plane (111) grows preferentially.
  • the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the sum of the crystal orientation rate of the (200) plane and the crystal orientation ratio of the (220) plane.
  • a Pd-containing layer having a value of less than 40% is obtained.
  • the electroplating method is used as the plating method for forming the Pd-containing layer.
  • the plating method for forming the base layer is not particularly limited, and for example, wet plating such as electroplating and electroless plating, and dry plating such as vapor deposition and sputtering can be used. Among these, wet plating is preferably used, and electroplating is more preferable.
  • the Pd plating conditions metal concentration in the plating solution, treatment time, bath temperature and current density when forming the base layer, etc.
  • the bath temperature and current density when forming the Pd-containing layer are determined by the plating method. It may be appropriately adjusted according to the chemical type of the plating layer, the thickness of the plating layer, and the like.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd—Ni plating was applied to at least the surface in rotational contact with the conductive substrate.
  • the conditions for Pd-Ni plating were dichlorotetraammine-palladium as a Pd source, a Pd concentration of 3 g / L, a bath temperature of 46 ° C., and a current density of 20 A / dm 2 .
  • the crystal orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 70%, and the total orientation ratio of the (200) plane and the (220) plane was 23%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd plating was applied to at least the surface in rotational contact with the conductive substrate.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 6 g / L, a bath temperature of 46 ° C., and a current density of 30 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 65%, and the total orientation ratio of the (200) plane and the (220) plane was 34%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd plating was applied to at least the surface in rotational contact with the conductive substrate.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 20 g / L, a bath temperature of 60 ° C., and a current density of 100 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 61%, and the total orientation ratio of the (200) plane and the (220) plane was 39%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd plating was applied to at least the surface in rotational contact with the conductive substrate.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 6 g / L, a bath temperature of 55 ° C., and a current density of 30 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 80%, and the total orientation ratio of the (200) plane and the (220) plane was 15%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 10 g / L, a bath temperature of 55 ° C., and a current density of 60 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 63%, and the total orientation ratio of the (200) plane and the (220) plane was 35%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 10 g / L, a bath temperature of 55 ° C., and a current density of 30 A / dm 2 .
  • the orientation ratio of the (111) plane of the obtained metal material in the Pd-containing tank was 71%, and the total orientation ratio of the (200) plane and the (220) plane was 25%.
  • Nickel silver for springs (C7701) was electrolytically degreased and pickled, and then Ni-plated as the outermost layer to obtain a metal material.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating.
  • the conditions for Pd plating were dinitrotetraamminepalladium as a Pd source, a Pd concentration of 6 g / L, a bath temperature of 40 ° C., and a current density of 30 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 60%, and the total orientation ratio of the (200) plane and the (220) plane was 40%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 15 g / L, a bath temperature of 46 ° C., and a current density of 110 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 42%, and the total orientation ratio of the (200) plane and the (220) plane was 54%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Next, Pd plating was applied to at least the surface in rotational contact with the conductive substrate.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 3 g / L, a bath temperature of 70 ° C., and a current density of 20 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 51%, and the total orientation ratio of the (200) plane and the (220) plane was 49%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 3 g / L, a bath temperature of 55 ° C., and a current density of 10 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 49%, and the total orientation ratio of the (200) plane and the (220) plane was 47%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd plating was applied to at least the surface in rotational contact with the conductive substrate.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 10 g / L, a bath temperature of 70 ° C., and a current density of 40 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 55%, and the total orientation ratio of the (200) plane and the (220) plane was 40%.
  • the conductive substrate of the motor has a copper layer made of a copper alloy attached on a resin plate, and an Au layer, an Au-Cu layer, an Au-Ni layer or an Au-Ni layer as a surface plating layer (surface layer) on the copper layer.
  • the one having the Au—Co layer formed was used.
  • a motor test was conducted under the conditions of an applied voltage of 2.5 V, a load current of 0.1 A, and a load rotation speed of 2000 rpm, and the time until the motor stopped (motor stop time) was measured and evaluated according to the following criteria. .. ⁇ : 7200 hours or more ⁇ : 5000 hours or more and less than 7200 hours ⁇ : 5000 hours or less
  • Heat resistance test Each sample was subjected to a heat resistance test by heating at 350 ° C. for 5 minutes in an air atmosphere. Then, according to the above-mentioned method for measuring the contact resistance value, the contact resistance value after the heat resistance test was determined. The evaluation criteria were the same.

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  • Organic Chemistry (AREA)
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  • Materials Engineering (AREA)
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Abstract

Le matériau métallique pour contact coulissant selon la présente invention comporte un substrat en cuivre ou en alliage de cuivre, et une couche contenant du Pd qui est formée en tant que couche la plus à l'extérieur sur au moins une partie du substrat et qui contient 95 % en masse ou plus de Pd, le matériau métallique étant caractérisé en ce que, dans la couche contenant du Pd, le taux d'orientation cristalline suivant un plan (111) tel que mesuré par diffraction des rayons X est supérieur à 60 %, et le total du taux d'orientation cristalline selon un plan (200) et du taux d'orientation cristalline suivant un plan (220) est inférieur à 40 %. Le matériau métallique pour contact coulissant est exceptionnel en termes de résistance à l'usure tout en ayant également une électroconductivité suffisante pour conduire de l'électricité vers un bobinage de moteur. L'invention concerne également un élément balai d'un moteur, et un moteur à vibration, utilisant le matériau métallique pour contact coulissant.
PCT/JP2020/031278 2019-10-30 2020-08-19 Matériau métallique pour contact coulissant, procédé de fabrication dudit matériau, élément balai pour moteur et moteur à vibration WO2021084853A1 (fr)

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KR1020227003717A KR102544423B1 (ko) 2019-10-30 2020-08-19 접동 접점용 금속 재료 및 그 제조 방법과 모터용 브러시재 및 진동 모터
JP2020564272A JP6932860B1 (ja) 2019-10-30 2020-08-19 摺動接点用金属材料およびその製造方法ならびにモータ用ブラシ材および振動モータ
CN202080053235.0A CN114175420B (zh) 2019-10-30 2020-08-19 滑动触点用金属材料及其制造方法、以及马达用刷材及振动马达

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115589667A (zh) * 2021-07-06 2023-01-10 长春石油化学股份有限公司 表面处理铜箔及铜箔基板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4406755A (en) * 1982-03-08 1983-09-27 Technic Inc. Bright palladium electrodeposition
JP2006314191A (ja) * 2005-05-02 2006-11-16 Samsung Electro-Mechanics Co Ltd 金−銅層を含む導電性基板、モータ、振動モータ及び電気接点用金属端子
JP2013127114A (ja) * 2011-11-17 2013-06-27 Tdk Corp 被覆体及び電子部品
JP2015175049A (ja) * 2014-03-17 2015-10-05 松田産業株式会社 パラジウムめっき液、パラジウムめっき方法、パラジウムめっき製品、摺動接点材料及び摺動接点

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4351736B2 (ja) 2008-02-04 2009-10-28 積水化学工業株式会社 メッキ構造体
JP2009228103A (ja) * 2008-03-25 2009-10-08 Sekisui Chem Co Ltd メッキ構造体及びメッキ構造体の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4406755A (en) * 1982-03-08 1983-09-27 Technic Inc. Bright palladium electrodeposition
JP2006314191A (ja) * 2005-05-02 2006-11-16 Samsung Electro-Mechanics Co Ltd 金−銅層を含む導電性基板、モータ、振動モータ及び電気接点用金属端子
JP2013127114A (ja) * 2011-11-17 2013-06-27 Tdk Corp 被覆体及び電子部品
JP2015175049A (ja) * 2014-03-17 2015-10-05 松田産業株式会社 パラジウムめっき液、パラジウムめっき方法、パラジウムめっき製品、摺動接点材料及び摺動接点

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115589667A (zh) * 2021-07-06 2023-01-10 长春石油化学股份有限公司 表面处理铜箔及铜箔基板
CN115589667B (zh) * 2021-07-06 2023-09-08 长春石油化学股份有限公司 表面处理铜箔及铜箔基板

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