WO2021084853A1 - Metal material for sliding contact, method for manufacturing said material, brush member for motor, and vibration motor - Google Patents

Metal material for sliding contact, method for manufacturing said material, brush member for motor, and vibration motor Download PDF

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Publication number
WO2021084853A1
WO2021084853A1 PCT/JP2020/031278 JP2020031278W WO2021084853A1 WO 2021084853 A1 WO2021084853 A1 WO 2021084853A1 JP 2020031278 W JP2020031278 W JP 2020031278W WO 2021084853 A1 WO2021084853 A1 WO 2021084853A1
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Prior art keywords
layer
plane
metal material
containing layer
copper
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PCT/JP2020/031278
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French (fr)
Japanese (ja)
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颯己 葛原
秀一 北河
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古河電気工業株式会社
古河精密金属工業株式会社
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Priority to KR1020227003717A priority Critical patent/KR102544423B1/en
Priority to JP2020564272A priority patent/JP6932860B1/en
Priority to CN202080053235.0A priority patent/CN114175420B/en
Publication of WO2021084853A1 publication Critical patent/WO2021084853A1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/10—Bearings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R39/00—Rotary current collectors, distributors or interrupters
    • H01R39/02—Details for dynamo electric machines
    • H01R39/18—Contacts for co-operation with commutator or slip-ring, e.g. contact brush
    • H01R39/20—Contacts for co-operation with commutator or slip-ring, e.g. contact brush characterised by the material thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K13/00—Structural associations of current collectors with motors or generators, e.g. brush mounting plates or connections to windings; Disposition of current collectors in motors or generators; Arrangements for improving commutation

Definitions

  • the present invention relates to a metal material for sliding contacts, a method for manufacturing the same, a brush material for a motor, and a vibration motor.
  • Micromotors are widely used in many applications such as audio equipment, home appliances, mobile phones, cameras, and automobiles.
  • the life of the motor is determined by the durability of the commutator and brush, which are members for energizing the motor coil.
  • a material having excellent performance such as wear resistance, arc resistance, electrical connectivity, conductivity, and strength is required, and in general, a Cu alloy strip coated with an Ag-Pd alloy is required. It is used.
  • Patent Document 1 regarding Pd plating on a metal substrate, the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is 45 to 60%, and the crystal orientation rate of the (200) plane is (200). 220) It is disclosed that a plated structure having a total crystal orientation ratio of 40 to 55% of the planes exhibits extremely high conductivity.
  • the brush material used so far is a clad material in which a base material (for example, a Cu base material) is coated with an Ag-Pd alloy, and is manufactured by repeating annealing and rolling, so that the manufacturing cost is high.
  • a processed alteration layer (a layer having a changed metal structure) formed by processing is formed on the Ag alloy, there are problems that the arc resistance is inferior, the wear is fast, and the motor life is short.
  • the present invention has been made in view of the above circumstances, and is a metal material for sliding contacts having sufficient conductivity for energizing a motor coil and excellent wear resistance, a method for manufacturing the same, and a method for manufacturing the same. It is an object of the present invention to provide a brush material for a motor and a vibration motor used.
  • the metal material for sliding contacts has a base material made of copper or a copper alloy, and a Pd-containing layer formed as the outermost layer on at least a part of the base material and containing 95% by mass or more of Pd.
  • the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%
  • the total of the crystal orientation rate of the (200) plane and the crystal orientation rate of the (220) plane is It has been found that when the content is less than 40%, the motor coil has sufficient conductivity for energizing the motor coil and is excellent in abrasion resistance, and the present invention has been completed.
  • the gist structure of the present invention is as follows.
  • the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the total of the crystal orientation rate of the (200) plane and the crystal orientation ratio of the (220) plane is 40%.
  • a metal material for sliding contacts characterized in that it is less than.
  • the Pd-containing layer is formed by using a metal material for sliding contacts having a Pd-containing layer containing Pd, and the Pd-containing layer has a (111) plane crystal orientation rate of more than 60% as measured by an X-ray diffraction method.
  • the vibration motor is made of a metal material in which the total of the crystal orientation ratio of the (200) plane and the crystal orientation ratio of the (220) plane is less than 40%.
  • the conductive substrate is formed as a surface layer on a resin plate, a copper layer made of copper or a copper alloy formed on the resin plate, and the copper layer.
  • the vibration motor according to (5) above which has an Au layer, an Au—Cu layer, an Au—Ni layer, or an Au—Co layer.
  • Pd plating is performed in a plating bath with a Pd concentration of 3 to 20 g / L and a bath temperature of 46 to 60 ° C. under the condition of a current density of 20 to 100 A / dm 2 , and the Pd-containing layer is used as the outermost layer.
  • a method for producing a metal material for sliding contacts which comprises forming.
  • a metal material for a sliding contact having sufficient conductivity for energizing a motor coil and excellent wear resistance, and a brush material for a motor and a vibration motor using the same. it can.
  • the vertical cross section of the metal material for a sliding contact of one embodiment is schematically shown.
  • the metal material for sliding contacts of the present invention is a base material made of copper or a copper alloy, and Pd formed as the outermost layer on at least a part of the base material and containing 95% by mass or more of Pd.
  • a metal material having a containing layer, the Pd-containing layer has a (111) plane crystal orientation rate of more than 60% and a (200) plane crystal orientation rate measured by an X-ray diffractometry. 220) The total crystal orientation of the planes is less than 40%.
  • the "crystal orientation ratio of the (111) plane measured by the X-ray diffraction method” is the total intensity of diffraction peaks from each crystal plane when Cu—K ⁇ rays are used in the X-ray diffraction method. It is a value showing the ratio of the intensity of the diffraction peak of the (111) plane as a percentage. Further, “the total of the crystal orientation rate of the (200) plane and the crystal orientation rate of the (220) plane measured by the X-ray diffraction method” is each of the cases where Cu—K ⁇ rays are used in the X-ray diffraction method.
  • FIG. 1 schematically shows a vertical cross section of a metal material for a sliding contact according to an embodiment.
  • the metal material 10 for sliding contacts shown in FIG. 1 is a Pd-containing layer formed as a surface layer on a base material 1 made of copper or a copper alloy and at least a part of the base material 1 and containing 95% by mass or more of Pd.
  • the Pd-containing layer 2 is a metal material having 2 and the crystal orientation ratio of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the crystal orientation ratio of the (200) plane and (200) plane are (2). 220) The total crystal orientation of the planes is less than 40%.
  • the illustrated metal material 10 for sliding contacts shows a case in which a base layer 3 made of Ni or a Ni alloy is provided between the base material 1 and the Pd-containing layer 2.
  • the base material 1 is made of copper or a copper alloy.
  • the copper alloy is not particularly limited, but for example, Cu—Zn-based alloy, Cu—Zn—Ni based alloy, Cu—Ni—Si based alloy, Cu—Sn based alloy, Cu—Ni—Sn based alloy, Cu—Cr. -Mg-based alloys, Cu-Ni-Si-Zn-Sn-Mg-based alloys and the like can be mentioned.
  • the thickness of the base material 1 is not particularly limited, but is preferably 0.02 to 0.15 mm.
  • the shape of the base material 1 is not particularly limited and may be appropriately selected depending on the intended use, and may be, for example, a strip material, a plate material, a bar material, a wire material, or the like.
  • the Pd-containing layer 2 is formed as the outermost layer on at least a part of the base material 1, and contains 95% by mass or more of Pd with respect to 100% by mass of the Pd-containing layer. As described above, when the Pd content in the Pd-containing layer 2 is 95% by weight or more, excellent conductivity and corrosion resistance can be ensured.
  • the Pd content in the Pd-containing layer 2 is not particularly limited as long as it is 95% by mass or more as described above, but it is preferably 98% by mass or more.
  • the Pd-containing layer 2 may be a Pd alloy as long as it contains 95% by mass or more of Pd.
  • the Pd alloy is not particularly limited, and examples thereof include Pd—Ni based alloys and Pd—Ag based alloys. Further, the Pd-containing layer 2 may be formed in a state where the Pd alloy phase is present in the Pd metal (matrix phase).
  • the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%.
  • the (111) plane of a Pd crystal tends to have a relatively higher hardness than other crystal planes, for example, the (200) plane and the (220) plane. Therefore, when the crystal orientation ratio is larger than 60%, the surface Since the hardness of the entire layer is increased, wear due to arc discharge is less likely to occur, and arc resistance is improved, the life of the brush material formed by using the layer is extended.
  • the crystal orientation rate of the (111) plane in the Pd-containing layer 2 may be larger than 60%, more preferably 65% or more.
  • the total of the crystal orientation rate of the (200) plane and the crystal orientation rate of the (220) plane measured by the X-ray diffraction method in the Pd-containing layer 2 is not particularly limited as long as it is less than 40%, but is preferably 35. Less than%. Since the (200) plane and the (220) plane of the Pd crystal have lower hardness than the (111) plane, if the crystal orientation ratio of the (200) plane and the (220) plane is high, the surface of the Pd-containing layer 2 However, wear is likely to occur due to arc discharge, and the arc resistance is inferior, which may shorten the life of the brush material.
  • the thickness of the Pd-containing layer 2 is not particularly limited, but is preferably 0.1 to 5 ⁇ m, more preferably 0.1 to 2 ⁇ m, and further preferably 0.2 to 0.5 ⁇ m. preferable. By setting the thickness of the Pd-containing layer 2 to 5 ⁇ m or less, it is possible to achieve both excellent workability and low cost in a well-balanced manner.
  • the Pd-containing layer is formed by electroplating.
  • the orientation rate of the (111) plane of the Pd crystal can be increased by forming the Pd crystal by electroplating.
  • the metal material 10 for sliding contacts may have a base layer 3 made of Ni or a Ni alloy between the base material 1 and the Pd-containing layer 2 described above.
  • the Ni alloy is not particularly limited, and examples thereof include Ni-P type, Ni-Fe type, and Ni-B type.
  • the thickness of the base layer 3 is not particularly limited, but is preferably 0.1 to 3.0 ⁇ m, more preferably 0.2 to 1.0 ⁇ m, for example.
  • Brush material for motor and vibration motor The metal material 10 for sliding contacts configured as described above can be used, for example, as a brush material for a motor used in a vibration motor.
  • the vibration motor includes a conductive substrate and a brush.
  • a metal material having the same configuration as the above-mentioned metal material for sliding contacts can be used as the brush.
  • this brush is a sliding contact having a base material made of copper or a copper alloy and a Pd-containing layer formed as the outermost layer on at least a part of the base material and containing 95% by mass or more of Pd.
  • the Pd-containing layer is formed by using a metal material for use, and the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the crystal orientation rate of the (200) plane and (220). It is composed of a metal material having a total surface crystal orientation ratio of less than 40%.
  • the conductive substrate that comes into contact with (sliding) the brush material is not particularly limited, but for example, a copper layer made of copper or a copper alloy is attached onto a resin plate.
  • a composite material is used in which a layer having excellent conductivity such as Au, Ni, Rh and an alloy thereof is formed as a surface layer on the copper layer by the method of Is preferable. Further, among these, by forming the surface layer as a plating layer of Au layer, Au—Cu layer, Au—Ni layer or Au—Co layer, it is formed on the outermost surface layer of at least a part of the base material constituting the brush. Abrasion resistance is more excellent with the Pd-containing layer.
  • the method for manufacturing the metal material for sliding contact of the present invention is the method for manufacturing the above-mentioned metal material for sliding contact. Specifically, in this method for producing a metal material for sliding contacts, dichlorotetraamminepalladium is used as a Pd source in at least a part of a base material made of copper or a copper alloy, and the Pd concentration (metal Pd conversion) is 3 to 20 g / L. In a plating bath having a bath temperature of 46 to 60 ° C. , Pd plating treatment is performed under the condition of a current density of 20 to 100 A / dm 2 , and a Pd-containing layer is formed as the outermost layer.
  • a base layer made of Ni or a Ni alloy is optionally laminated on a base material made of copper or a copper alloy.
  • Dichlorotetraammine-palladium is used as the outermost layer on the base material when the base layer is not formed, and on the base layer when the base layer is formed, the Pd concentration is 3 to 20 g / L, and the bath temperature is 46 to 46.
  • a Pd plating treatment is performed under the condition of a current density of 20 to 100 A / dm 2 to form a Pd-containing layer.
  • the (111) plane is in a precipitated state in which the plane (111) grows preferentially.
  • the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the sum of the crystal orientation rate of the (200) plane and the crystal orientation ratio of the (220) plane.
  • a Pd-containing layer having a value of less than 40% is obtained.
  • the electroplating method is used as the plating method for forming the Pd-containing layer.
  • the plating method for forming the base layer is not particularly limited, and for example, wet plating such as electroplating and electroless plating, and dry plating such as vapor deposition and sputtering can be used. Among these, wet plating is preferably used, and electroplating is more preferable.
  • the Pd plating conditions metal concentration in the plating solution, treatment time, bath temperature and current density when forming the base layer, etc.
  • the bath temperature and current density when forming the Pd-containing layer are determined by the plating method. It may be appropriately adjusted according to the chemical type of the plating layer, the thickness of the plating layer, and the like.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd—Ni plating was applied to at least the surface in rotational contact with the conductive substrate.
  • the conditions for Pd-Ni plating were dichlorotetraammine-palladium as a Pd source, a Pd concentration of 3 g / L, a bath temperature of 46 ° C., and a current density of 20 A / dm 2 .
  • the crystal orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 70%, and the total orientation ratio of the (200) plane and the (220) plane was 23%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd plating was applied to at least the surface in rotational contact with the conductive substrate.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 6 g / L, a bath temperature of 46 ° C., and a current density of 30 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 65%, and the total orientation ratio of the (200) plane and the (220) plane was 34%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd plating was applied to at least the surface in rotational contact with the conductive substrate.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 20 g / L, a bath temperature of 60 ° C., and a current density of 100 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 61%, and the total orientation ratio of the (200) plane and the (220) plane was 39%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd plating was applied to at least the surface in rotational contact with the conductive substrate.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 6 g / L, a bath temperature of 55 ° C., and a current density of 30 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 80%, and the total orientation ratio of the (200) plane and the (220) plane was 15%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 10 g / L, a bath temperature of 55 ° C., and a current density of 60 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 63%, and the total orientation ratio of the (200) plane and the (220) plane was 35%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 10 g / L, a bath temperature of 55 ° C., and a current density of 30 A / dm 2 .
  • the orientation ratio of the (111) plane of the obtained metal material in the Pd-containing tank was 71%, and the total orientation ratio of the (200) plane and the (220) plane was 25%.
  • Nickel silver for springs (C7701) was electrolytically degreased and pickled, and then Ni-plated as the outermost layer to obtain a metal material.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating.
  • the conditions for Pd plating were dinitrotetraamminepalladium as a Pd source, a Pd concentration of 6 g / L, a bath temperature of 40 ° C., and a current density of 30 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 60%, and the total orientation ratio of the (200) plane and the (220) plane was 40%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 15 g / L, a bath temperature of 46 ° C., and a current density of 110 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 42%, and the total orientation ratio of the (200) plane and the (220) plane was 54%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Next, Pd plating was applied to at least the surface in rotational contact with the conductive substrate.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 3 g / L, a bath temperature of 70 ° C., and a current density of 20 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 51%, and the total orientation ratio of the (200) plane and the (220) plane was 49%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 3 g / L, a bath temperature of 55 ° C., and a current density of 10 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 49%, and the total orientation ratio of the (200) plane and the (220) plane was 47%.
  • Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd plating was applied to at least the surface in rotational contact with the conductive substrate.
  • the conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 10 g / L, a bath temperature of 70 ° C., and a current density of 40 A / dm 2 .
  • the orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 55%, and the total orientation ratio of the (200) plane and the (220) plane was 40%.
  • the conductive substrate of the motor has a copper layer made of a copper alloy attached on a resin plate, and an Au layer, an Au-Cu layer, an Au-Ni layer or an Au-Ni layer as a surface plating layer (surface layer) on the copper layer.
  • the one having the Au—Co layer formed was used.
  • a motor test was conducted under the conditions of an applied voltage of 2.5 V, a load current of 0.1 A, and a load rotation speed of 2000 rpm, and the time until the motor stopped (motor stop time) was measured and evaluated according to the following criteria. .. ⁇ : 7200 hours or more ⁇ : 5000 hours or more and less than 7200 hours ⁇ : 5000 hours or less
  • Heat resistance test Each sample was subjected to a heat resistance test by heating at 350 ° C. for 5 minutes in an air atmosphere. Then, according to the above-mentioned method for measuring the contact resistance value, the contact resistance value after the heat resistance test was determined. The evaluation criteria were the same.

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Abstract

This metal material for a sliding contact has a substrate formed from copper or a copper alloy, and a Pd-containing layer that is formed as an outermost layer on at least one part of the substrate and that contains 95 mass% or more of Pd, the metal material being characterized in that, in the Pd-containing layer, the crystal orientation rate of a (111) plane as measured by X-ray diffraction is greater than 60%, and the total of the crystal orientation rate of a (200) plane and the crystal orientation rate of a (220) plane is less than 40%, the metal material for a sliding contact being exceptional in terms of wear resistance while also having sufficient electroconductivity to conduct electricity to a motor coil. Also provided are a brush member for a motor, and a vibration motor, in which the metal material for a sliding contact is used.

Description

摺動接点用金属材料およびその製造方法ならびにモータ用ブラシ材および振動モータMetal materials for sliding contacts and their manufacturing methods, brush materials for motors and vibration motors
　本発明は、摺動接点用金属材料およびその製造方法ならびにモータ用ブラシ材および振動モータに関する。 The present invention relates to a metal material for sliding contacts, a method for manufacturing the same, a brush material for a motor, and a vibration motor.
　マイクロモータは、音響機器、家電、携帯電話、カメラ、自動車など、多くの用途で幅広く使用されている。モータの寿命は、モータコイルに通電するための部材である整流子とブラシの耐久性により決まる。このような部材としては、耐摩耗性、耐アーク性、電気接続性、導電性、強度等の性能に優れた材料が必要とされており、一般に、Ａｇ－Ｐｄ合金を被覆したＣｕ合金条が使用されている。 Micromotors are widely used in many applications such as audio equipment, home appliances, mobile phones, cameras, and automobiles. The life of the motor is determined by the durability of the commutator and brush, which are members for energizing the motor coil. As such a member, a material having excellent performance such as wear resistance, arc resistance, electrical connectivity, conductivity, and strength is required, and in general, a Cu alloy strip coated with an Ag-Pd alloy is required. It is used.
　一方で、めっき材料については、そのめっき材料が用いられる用途に要求される性能を充足するために、様々な改良がなされている。例えば、特許文献１には、金属基体上のＰｄめっきについて、Ｘ線回折法によって測定した（１１１）面の結晶配向率が４５～６０％であり、かつ（２００）面の結晶配向率と（２２０）面の結晶配向率の合計が４０～５５％であるめっき構造体が、極めて高い導電性を示すことが開示されている。 On the other hand, various improvements have been made to the plating material in order to satisfy the performance required for the application in which the plating material is used. For example, in Patent Document 1, regarding Pd plating on a metal substrate, the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is 45 to 60%, and the crystal orientation rate of the (200) plane is (200). 220) It is disclosed that a plated structure having a total crystal orientation ratio of 40 to 55% of the planes exhibits extremely high conductivity.
特許第４３５１７３６号公報Japanese Patent No. 4351736
　上述したとおり、これまで使用されてきたブラシ材は、基材（例えばＣｕ基材）にＡｇ－Ｐｄ合金で被覆したクラッド材であり、焼鈍と圧延を繰り返して製造するため、製造コストが高い上に、加工による加工変質層（金属組織が変化した層）がＡｇ合金上に形成するため、耐アーク性に劣り、摩耗が早くモータ寿命が短いといった課題があった。 As described above, the brush material used so far is a clad material in which a base material (for example, a Cu base material) is coated with an Ag-Pd alloy, and is manufactured by repeating annealing and rolling, so that the manufacturing cost is high. In addition, since a processed alteration layer (a layer having a changed metal structure) formed by processing is formed on the Ag alloy, there are problems that the arc resistance is inferior, the wear is fast, and the motor life is short.
　本発明は、以上の実情に鑑みてなされたものであり、モータコイルに通電するために十分な導電性を有しながら、耐摩耗性に優れる摺動接点用金属材料およびその製造方法ならびにそれを用いたモータ用ブラシ材および振動モータを提供することを目的とする。 The present invention has been made in view of the above circumstances, and is a metal material for sliding contacts having sufficient conductivity for energizing a motor coil and excellent wear resistance, a method for manufacturing the same, and a method for manufacturing the same. It is an object of the present invention to provide a brush material for a motor and a vibration motor used.
　本発明者らは、上述した目的を達成するため、鋭意検討を重ねた。その結果、摺動接点用金属材料が、銅または銅合金からなる基材と、基材の少なくとも一部に最表層として形成され、９５質量％以上のＰｄを含有するＰｄ含有層とを有し、Ｐｄ含有層は、Ｘ線回折法によって測定される（１１１）面の結晶配向率が６０％より大きく、かつ、（２００）面の結晶配向率と（２２０）面の結晶配向率の合計が４０％未満であることにより、モータコイルに通電するために十分な導電性を有しながら、耐摩耗性に優れることを見出し、本発明を完成するに至った。 The present inventors have conducted diligent studies in order to achieve the above-mentioned object. As a result, the metal material for sliding contacts has a base material made of copper or a copper alloy, and a Pd-containing layer formed as the outermost layer on at least a part of the base material and containing 95% by mass or more of Pd. In the Pd-containing layer, the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the total of the crystal orientation rate of the (200) plane and the crystal orientation rate of the (220) plane is It has been found that when the content is less than 40%, the motor coil has sufficient conductivity for energizing the motor coil and is excellent in abrasion resistance, and the present invention has been completed.
　すなわち、本発明の要旨構成は以下のとおりである。
　（１）銅または銅合金からなる基材と、前記基材の少なくとも一部に最表層として形成され、９５質量％以上のＰｄを含有するＰｄ含有層とを有する金属材料であって、前記Ｐｄ含有層は、Ｘ線回折法によって測定される（１１１）面の結晶配向率が６０％より大きく、かつ、（２００）面の結晶配向率と（２２０）面の結晶配向率の合計が４０％未満であることを特徴とする、摺動接点用金属材料。
　（２）前記基材と前記Ｐｄ含有層の間に、ＮｉまたはＮｉ合金からなる下地層を有することを特徴とする上記（１）に記載の摺動接点用金属材料。
　（３）前記Ｐｄ含有層が電気めっきにより形成されていることを特徴とする、上記（１）または（２）に記載の摺動接点用金属材料。
　（４）上記（１）、（２）または（３）に記載の摺動接点用金属材料を用いたモータ用ブラシ材。
　（５）導電性の基板とブラシとを含む振動モータであって、前記ブラシは、銅または銅合金からなる基材と、前記基材の少なくとも一部に最表層として形成され、９５質量％以上のＰｄを含有するＰｄ含有層とを有する摺動接点用金属材料を用いて形成され、前記Ｐｄ含有層は、Ｘ線回折法によって測定される（１１１）面の結晶配向率が６０％より大きく、かつ、（２００）面の結晶配向率と（２２０）面の結晶配向率の合計が４０％未満である金属材料から構成されることを特徴とする振動モータ。
　（６）前記導電性の基板は、樹脂製の板と、前記樹脂製の板の上に形成される、銅または銅合金からなる銅層と、前記銅層の上に表面層として形成される、Ａｕ層、Ａｕ－Ｃｕ層、Ａｕ－Ｎｉ層またはＡｕ－Ｃｏ層とを有する上記（５）に記載の振動モータ。
　（７）上記（１）、（２）または（３）に記載の摺動接点用金属材料を製造する方法であって、銅または銅合金からなる基材の少なくとも一部に、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度３～２０ｇ／Ｌ、浴温４６～６０℃のめっき浴中で、電流密度２０～１００Ａ／ｄｍ２の条件で、Ｐｄめっき処理を施して、Ｐｄ含有層を最表層として形成することを特徴とする、摺動接点用金属材料の製造方法。 That is, the gist structure of the present invention is as follows.
(1) A metal material having a base material made of copper or a copper alloy and a Pd-containing layer formed as the outermost layer on at least a part of the base material and containing 95% by mass or more of Pd. In the containing layer, the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the total of the crystal orientation rate of the (200) plane and the crystal orientation ratio of the (220) plane is 40%. A metal material for sliding contacts, characterized in that it is less than.
(2) The metal material for sliding contacts according to (1) above, wherein a base layer made of Ni or a Ni alloy is provided between the base material and the Pd-containing layer.
(3) The metal material for sliding contacts according to (1) or (2) above, wherein the Pd-containing layer is formed by electroplating.
(4) A brush material for a motor using the metal material for sliding contacts according to (1), (2) or (3) above.
(5) A vibration motor including a conductive substrate and a brush, wherein the brush is formed as a surface layer on a base material made of copper or a copper alloy and at least a part of the base material, and is 95% by mass or more. The Pd-containing layer is formed by using a metal material for sliding contacts having a Pd-containing layer containing Pd, and the Pd-containing layer has a (111) plane crystal orientation rate of more than 60% as measured by an X-ray diffraction method. Moreover, the vibration motor is made of a metal material in which the total of the crystal orientation ratio of the (200) plane and the crystal orientation ratio of the (220) plane is less than 40%.
(6) The conductive substrate is formed as a surface layer on a resin plate, a copper layer made of copper or a copper alloy formed on the resin plate, and the copper layer. The vibration motor according to (5) above, which has an Au layer, an Au—Cu layer, an Au—Ni layer, or an Au—Co layer.
(7) The method for producing a metal material for sliding contacts according to (1), (2) or (3) above, wherein dichlorotetraamminepalladium is added to at least a part of a base material made of copper or a copper alloy. Using a Pd source, Pd plating is performed in a plating bath with a Pd concentration of 3 to 20 g / L and a bath temperature of 46 to 60 ° C. under the condition of a current density of 20 to 100 A / dm 2 , and the Pd-containing layer is used as the outermost layer. A method for producing a metal material for sliding contacts, which comprises forming.
　本発明によれば、モータコイルに通電するための十分な導電性と、優れた耐摩耗性を有する摺動接点用金属材料、ならびにそれを用いたモータ用ブラシ材および振動モータを提供することができる。 According to the present invention, it is possible to provide a metal material for a sliding contact having sufficient conductivity for energizing a motor coil and excellent wear resistance, and a brush material for a motor and a vibration motor using the same. it can.
一の実施形態の摺動接点用金属材料の縦断面を模式的に示したものである。The vertical cross section of the metal material for a sliding contact of one embodiment is schematically shown.
　以下、本発明の好ましい実施形態について詳細に説明するが、本発明は以下の実施形態に限定されない。 Hereinafter, preferred embodiments of the present invention will be described in detail, but the present invention is not limited to the following embodiments.
１．摺動接点用金属材料
　本発明の摺動接点用金属材料は、銅または銅合金からなる基材と、基材の少なくとも一部に最表層として形成され、９５質量％以上のＰｄを含有するＰｄ含有層とを有する金属材料であって、Ｐｄ含有層は、Ｘ線回折法によって測定される（１１１）面の結晶配向率が６０％より大きく、かつ、（２００）面の結晶配向率と（２２０）面の結晶配向率の合計が４０％未満であることを特徴とするものである。 1. 1. Metallic material for sliding contacts The metal material for sliding contacts of the present invention is a base material made of copper or a copper alloy, and Pd formed as the outermost layer on at least a part of the base material and containing 95% by mass or more of Pd. A metal material having a containing layer, the Pd-containing layer has a (111) plane crystal orientation rate of more than 60% and a (200) plane crystal orientation rate measured by an X-ray diffractometry. 220) The total crystal orientation of the planes is less than 40%.
　なお、「Ｘ線回折法によって測定される（１１１）面の結晶配向率」とは、Ｘ線回折法において、Ｃｕ－Ｋα線を用いたときの各結晶面からの回折ピークの強度の合計に対する（１１１）面の回折ピークの強度の比率を百分率で示した値である。また、「Ｘ線回折法によって測定される（２００）面の結晶配向率と（２２０）面の結晶配向率の合計」とは、Ｘ線回折法において、Ｃｕ－Ｋα線を用いたときの各結晶面からの回折ピークの強度の合計に対する（２００）面の回折ピークの強度の比率を百分率で示した値と、各結晶面からの回折ピークの強度の総和に対する（２２０）面の回折ピークの強度の比率を百分率で示した値とを合計したものである。 The "crystal orientation ratio of the (111) plane measured by the X-ray diffraction method" is the total intensity of diffraction peaks from each crystal plane when Cu—Kα rays are used in the X-ray diffraction method. It is a value showing the ratio of the intensity of the diffraction peak of the (111) plane as a percentage. Further, "the total of the crystal orientation rate of the (200) plane and the crystal orientation rate of the (220) plane measured by the X-ray diffraction method" is each of the cases where Cu—Kα rays are used in the X-ray diffraction method. The ratio of the intensity of the diffraction peak on the (200) plane to the total intensity of the diffraction peaks from the crystal plane as a percentage, and the value of the diffraction peak on the (220) plane with respect to the total intensity of the diffraction peaks from each crystal plane. It is the sum of the strength ratio and the value shown as a percentage.
　図１は、一の実施形態の摺動接点用金属材料の縦断面を模式的に示したものである。図１に示す摺動接点用金属材料１０は、銅または銅合金からなる基材１と、基材１の少なくとも一部に最表層として形成され、９５質量％以上のＰｄを含有するＰｄ含有層２とを有する金属材料であって、Ｐｄ含有層２は、Ｘ線回折法によって測定される（１１１）面の結晶配向率が６０％より大きく、かつ、（２００）面の結晶配向率と（２２０）面の結晶配向率の合計が４０％未満である。また、図示の摺動接点用金属材料１０は、基材１とＰｄ含有層２の間に、ＮｉまたはＮｉ合金からなる下地層３を有する構成の場合を示している。 FIG. 1 schematically shows a vertical cross section of a metal material for a sliding contact according to an embodiment. The metal material 10 for sliding contacts shown in FIG. 1 is a Pd-containing layer formed as a surface layer on a base material 1 made of copper or a copper alloy and at least a part of the base material 1 and containing 95% by mass or more of Pd. The Pd-containing layer 2 is a metal material having 2 and the crystal orientation ratio of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the crystal orientation ratio of the (200) plane and (200) plane are (2). 220) The total crystal orientation of the planes is less than 40%. Further, the illustrated metal material 10 for sliding contacts shows a case in which a base layer 3 made of Ni or a Ni alloy is provided between the base material 1 and the Pd-containing layer 2.
　以下、本発明の摺動接点用金属材料の各部について詳細に説明する。 Hereinafter, each part of the metal material for sliding contacts of the present invention will be described in detail.
　（基材）
　基材１は、銅または銅合金からなるものである。 (Base material)
The base material 1 is made of copper or a copper alloy.
　銅合金としては、特に限定されないが、例えばＣｕ－Ｚｎ系合金、Ｃｕ－Ｚｎ－Ｎｉ系合金、Ｃｕ－Ｎｉ－Ｓｉ系合金、Ｃｕ－Ｓｎ系合金、Ｃｕ－Ｎｉ－Ｓｎ系合金、Ｃｕ－Ｃｒ－Ｍｇ系合金、Ｃｕ－Ｎｉ－Ｓｉ－Ｚｎ－Ｓｎ－Ｍｇ系合金などが挙げられる。 The copper alloy is not particularly limited, but for example, Cu—Zn-based alloy, Cu—Zn—Ni based alloy, Cu—Ni—Si based alloy, Cu—Sn based alloy, Cu—Ni—Sn based alloy, Cu—Cr. -Mg-based alloys, Cu-Ni-Si-Zn-Sn-Mg-based alloys and the like can be mentioned.
　基材１の厚さとしては、特に限定されないが、０．０２～０．１５ｍｍであることが好ましい。 The thickness of the base material 1 is not particularly limited, but is preferably 0.02 to 0.15 mm.
　基材１の形状としては、特に限定されず、用途に応じて適宜選択することができ、例えば条材、板材、棒材、線材などであってよい。 The shape of the base material 1 is not particularly limited and may be appropriately selected depending on the intended use, and may be, for example, a strip material, a plate material, a bar material, a wire material, or the like.
　（Ｐｄ含有層）
　Ｐｄ含有層２は、基材１の少なくとも一部に最表層として形成されるものであり、Ｐｄ含有層１００質量％に対して、９５質量％以上のＰｄを含有する。このように、Ｐｄ含有層２中のＰｄ含有量が９５重量％以上にすることで、優れた導電性や耐食性を確保することができる。 (Pd-containing layer)
The Pd-containing layer 2 is formed as the outermost layer on at least a part of the base material 1, and contains 95% by mass or more of Pd with respect to 100% by mass of the Pd-containing layer. As described above, when the Pd content in the Pd-containing layer 2 is 95% by weight or more, excellent conductivity and corrosion resistance can be ensured.
　Ｐｄ含有層２中のＰｄ含有量としては、上述したとおり９５質量％以上であれば特に限定されないが、９８質量％以上であることが好ましい。 The Pd content in the Pd-containing layer 2 is not particularly limited as long as it is 95% by mass or more as described above, but it is preferably 98% by mass or more.
　Ｐｄ含有層２としては、９５質量％以上のＰｄを含有する限りにおいて、Ｐｄ合金であってもよい。Ｐｄ合金としては、特に限定されないが、Ｐｄ－Ｎｉ系合金、Ｐｄ－Ａｇ系合金などが挙げられる。また、Ｐｄ含有層２は、Ｐｄ金属（母相）中にＰｄ合金相が存在する状態で形成されていてもよい。 The Pd-containing layer 2 may be a Pd alloy as long as it contains 95% by mass or more of Pd. The Pd alloy is not particularly limited, and examples thereof include Pd—Ni based alloys and Pd—Ag based alloys. Further, the Pd-containing layer 2 may be formed in a state where the Pd alloy phase is present in the Pd metal (matrix phase).
　Ｐｄ含有層２においては、Ｘ線回折法によって測定される（１１１）面の結晶配向率が６０％より大きい。Ｐｄ結晶の（１１１）面は、他の結晶面、例えば（２００）面や（２２０）面に比べて相対的に硬度が高い傾向があるため、その結晶配向率が６０％より大きいと、表面層全体の硬度が高くなり、アーク放電による摩耗が生じにくくなり耐アーク性が向上するため、これを用いて構成されるブラシ材としての寿命が長くなる。 In the Pd-containing layer 2, the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%. The (111) plane of a Pd crystal tends to have a relatively higher hardness than other crystal planes, for example, the (200) plane and the (220) plane. Therefore, when the crystal orientation ratio is larger than 60%, the surface Since the hardness of the entire layer is increased, wear due to arc discharge is less likely to occur, and arc resistance is improved, the life of the brush material formed by using the layer is extended.
　Ｐｄ含有層２における（１１１）面の結晶配向率としては、６０％より大きければよく、より好ましくは、６５％以上である。 The crystal orientation rate of the (111) plane in the Pd-containing layer 2 may be larger than 60%, more preferably 65% or more.
　Ｐｄ含有層２における、Ｘ線回折法によって測定される（２００）面の結晶配向率と（２２０）面の結晶配向率の合計としては、４０％未満であれば特に限定されないが、好ましくは３５％未満である。Ｐｄ結晶の（２００）面および（２２０）面は、（１１１）面と比較して硬度が低いため、（２００）面および（２２０）面の結晶配向率が高いと、Ｐｄ含有層２の表面がアーク放電によって摩耗が生じやすくなって耐アーク性が劣るため、ブラシ材としての寿命が短くなるおそれがある。 The total of the crystal orientation rate of the (200) plane and the crystal orientation rate of the (220) plane measured by the X-ray diffraction method in the Pd-containing layer 2 is not particularly limited as long as it is less than 40%, but is preferably 35. Less than%. Since the (200) plane and the (220) plane of the Pd crystal have lower hardness than the (111) plane, if the crystal orientation ratio of the (200) plane and the (220) plane is high, the surface of the Pd-containing layer 2 However, wear is likely to occur due to arc discharge, and the arc resistance is inferior, which may shorten the life of the brush material.
　Ｐｄ含有層２の厚さとしては、特に限定されないが、０．１～５μｍであることが好ましく、０．１～２μｍであることがより好ましく、０．２～０．５μｍであることがさらに好ましい。Ｐｄ含有層２の厚さを５μｍ以下とすることにより、優れた加工性と低コストをバランスよく両立させることができる。 The thickness of the Pd-containing layer 2 is not particularly limited, but is preferably 0.1 to 5 μm, more preferably 0.1 to 2 μm, and further preferably 0.2 to 0.5 μm. preferable. By setting the thickness of the Pd-containing layer 2 to 5 μm or less, it is possible to achieve both excellent workability and low cost in a well-balanced manner.
　Ｐｄ含有層が電気めっきにより形成されていることが好ましい。これにより、電気めっきで形成することでＰｄ結晶の（１１１）面の配向率を高くすることができる。 It is preferable that the Pd-containing layer is formed by electroplating. As a result, the orientation rate of the (111) plane of the Pd crystal can be increased by forming the Pd crystal by electroplating.
　（下地層）
　必須の構成要素ではないが、摺動接点用金属材料１０においては、上述した基材１とＰｄ含有層２の間に、ＮｉまたはＮｉ合金からなる下地層３を有していてもよい。 (Underground layer)
Although not an essential component, the metal material 10 for sliding contacts may have a base layer 3 made of Ni or a Ni alloy between the base material 1 and the Pd-containing layer 2 described above.
　基材１とＰｄ含有層２が直接接触していると、高温下や硫化水素雰囲気下などにおいて、基材１に含まれるＣｕ原子がＰｄ含有層２中を拡散し、Ｐｄ含有層２の表面に現れて酸化銅を形成し、接触抵抗が上昇することがある。したがって、これらのような環境下での使用が想定される場合には、下地層３を設けてＣｕの拡散を防止し、接触抵抗の上昇を抑えることが好ましい。 When the base material 1 and the Pd-containing layer 2 are in direct contact with each other, Cu atoms contained in the base material 1 diffuse in the Pd-containing layer 2 under high temperature or hydrogen sulfide atmosphere, and the surface of the Pd-containing layer 2 is exposed. May appear in and form copper oxide, increasing contact resistance. Therefore, when it is expected to be used in such an environment, it is preferable to provide the base layer 3 to prevent the diffusion of Cu and suppress the increase in contact resistance.
　Ｎｉ合金としては、特に限定されないが、例えばＮｉ－Ｐ系、Ｎｉ－Ｆｅ系、Ｎｉ－Ｂ系などが挙げられる。 The Ni alloy is not particularly limited, and examples thereof include Ni-P type, Ni-Fe type, and Ni-B type.
　下地層３の厚さとしては、特に限定されないが、例えば０．１～３．０μｍであることが好ましく、０．２～１．０μｍであることがより好ましい。 The thickness of the base layer 3 is not particularly limited, but is preferably 0.1 to 3.0 μm, more preferably 0.2 to 1.0 μm, for example.
　なお、下地層３には、ニッケル系材料で構成されたＮｉ含有層の代わりに、コバルトまたはコバルト合金層からなるコバルト（Ｃｏ）含有層を用いても、Ｎｉ含有層と同様の効果が得られる。 Even if a cobalt (Co) -containing layer made of cobalt or a cobalt alloy layer is used as the base layer 3 instead of the Ni-containing layer made of a nickel-based material, the same effect as that of the Ni-containing layer can be obtained. ..
２．モータ用ブラシ材および振動モータ
　以上のようにして構成される摺動接点用金属材料１０は、例えば振動モータに使用されるモータ用ブラシ材として用いることができる。 2. Brush material for motor and vibration motor The metal material 10 for sliding contacts configured as described above can be used, for example, as a brush material for a motor used in a vibration motor.
　具体的に、振動モータは、導電性の基板とブラシとを含むものである。そして、このような振動モータにおいて、ブラシとして、上述した摺動接点用金属材料と同様の構成の金属材料を用いることができる。より具体的に、このブラシは、銅または銅合金からなる基材と、基材の少なくとも一部に最表層として形成され、９５質量％以上のＰｄを含有するＰｄ含有層とを有する摺動接点用金属材料を用いて形成され、Ｐｄ含有層は、Ｘ線回折法によって測定される（１１１）面の結晶配向率が６０％より大きく、かつ、（２００）面の結晶配向率と（２２０）面の結晶配向率の合計が４０％未満である金属材料から構成されるものである。 Specifically, the vibration motor includes a conductive substrate and a brush. Then, in such a vibration motor, a metal material having the same configuration as the above-mentioned metal material for sliding contacts can be used as the brush. More specifically, this brush is a sliding contact having a base material made of copper or a copper alloy and a Pd-containing layer formed as the outermost layer on at least a part of the base material and containing 95% by mass or more of Pd. The Pd-containing layer is formed by using a metal material for use, and the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the crystal orientation rate of the (200) plane and (220). It is composed of a metal material having a total surface crystal orientation ratio of less than 40%.
　このような振動モータにおいて、ブラシ材と接する（摺動する）導電性の基板としては、特に限定されないが、例えば、樹脂製の板の上に銅または銅合金からなる銅層を、張り付ける等の方法を用いて形成し、さらに、この銅層の上に、表面層としてＡｕ、Ｎｉ、Ｒｈおよびそれらの合金のような導電性に優れる層を、めっきなどを用いて形成した複合材料を用いることが好ましい。また、このうち、特に表面層を、Ａｕ層、Ａｕ－Ｃｕ層、Ａｕ－Ｎｉ層またはＡｕ－Ｃｏ層のめっき層とすることで、ブラシを構成する基材の少なくとも一部の最表層に形成されるＰｄ含有層との間で耐摩耗性がより優れる。 In such a vibration motor, the conductive substrate that comes into contact with (sliding) the brush material is not particularly limited, but for example, a copper layer made of copper or a copper alloy is attached onto a resin plate. A composite material is used in which a layer having excellent conductivity such as Au, Ni, Rh and an alloy thereof is formed as a surface layer on the copper layer by the method of Is preferable. Further, among these, by forming the surface layer as a plating layer of Au layer, Au—Cu layer, Au—Ni layer or Au—Co layer, it is formed on the outermost surface layer of at least a part of the base material constituting the brush. Abrasion resistance is more excellent with the Pd-containing layer.
３．摺動接点用金属材料の製造方法
　本発明の摺動接点用金属材料の製造方法は、上述した摺動接点用金属材料を製造する方法である。具体的に、この摺動接点用金属材料の製造方法は、銅または銅合金からなる基材の少なくとも一部に、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度（金属Ｐｄ換算）３～２０ｇ／Ｌ、浴温４６～６０℃のめっき浴中で、電流密度２０～１００Ａ／ｄｍ２の条件で、Ｐｄめっき処理を施して、Ｐｄ含有層を最表層として形成する。 3. 3. Method for Manufacturing Metal Material for Sliding Contact The method for manufacturing the metal material for sliding contact of the present invention is the method for manufacturing the above-mentioned metal material for sliding contact. Specifically, in this method for producing a metal material for sliding contacts, dichlorotetraamminepalladium is used as a Pd source in at least a part of a base material made of copper or a copper alloy, and the Pd concentration (metal Pd conversion) is 3 to 20 g / L. In a plating bath having a bath temperature of 46 to 60 ° C. , Pd plating treatment is performed under the condition of a current density of 20 to 100 A / dm 2 , and a Pd-containing layer is formed as the outermost layer.
　より具体的に摺動接点用材料の製造方法について説明する。まず、銅または銅合金からなる基材上に、任意で、ＮｉまたはＮｉ合金からなる下地層を積層形成する。下地層を形成しない場合には基材上に、下地層を形成する場合には下地層上に、最表層として、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度３～２０ｇ／Ｌ、浴温４６～６０℃のめっき浴中で、電流密度２０～１００Ａ／ｄｍ２の条件で、Ｐｄめっき処理を施してＰｄ含有層を形成する。 More specifically, a method for manufacturing a material for sliding contacts will be described. First, a base layer made of Ni or a Ni alloy is optionally laminated on a base material made of copper or a copper alloy. Dichlorotetraammine-palladium is used as the outermost layer on the base material when the base layer is not formed, and on the base layer when the base layer is formed, the Pd concentration is 3 to 20 g / L, and the bath temperature is 46 to 46. In a plating bath at 60 ° C., a Pd plating treatment is performed under the condition of a current density of 20 to 100 A / dm 2 to form a Pd-containing layer.
　電流密度を２０～１００Ａ／ｄｍ２とすることにより、（１１１）面が優先的に成長する析出状態となる。その結果、最表層として、Ｘ線回折法によって測定される（１１１）面の結晶配向率が６０％より大きく、かつ、（２００）面の結晶配向率と（２２０）面の結晶配向率の合計が４０％未満であるＰｄ含有層が得られる。 By setting the current density to 20 to 100 A / dm 2 , the (111) plane is in a precipitated state in which the plane (111) grows preferentially. As a result, as the outermost layer, the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the sum of the crystal orientation rate of the (200) plane and the crystal orientation ratio of the (220) plane. A Pd-containing layer having a value of less than 40% is obtained.
　なお、Ｐｄ含有層を形成するためのめっき法としては、電気めっき法を用いる。一方、下地層を形成するためのめっき法としては、特に限定されないが、例えば電気めっきや無電解めっきのような湿式めっき、蒸着やスパッタのような乾式めっき等を用いることができる。これらの中でも、湿式めっきを用いることが好ましく、電気めっきを用いることがより好ましい。この際、Ｐｄ含有層を形成する際の浴温と電流密度以外のＰｄめっき条件（めっき液中の金属濃度、処理時間、下地層を形成する際の浴温および電流密度など）は、めっき方法や、めっき層の化学種、めっき層の厚さなどに応じて適宜調整すればよい。 The electroplating method is used as the plating method for forming the Pd-containing layer. On the other hand, the plating method for forming the base layer is not particularly limited, and for example, wet plating such as electroplating and electroless plating, and dry plating such as vapor deposition and sputtering can be used. Among these, wet plating is preferably used, and electroplating is more preferable. At this time, the Pd plating conditions (metal concentration in the plating solution, treatment time, bath temperature and current density when forming the base layer, etc.) other than the bath temperature and current density when forming the Pd-containing layer are determined by the plating method. It may be appropriately adjusted according to the chemical type of the plating layer, the thickness of the plating layer, and the like.
　次に、本発明の効果をさらに明確にするために、実施例および比較例について説明するが、本発明はこれらの実施例に限定されるものではない。 Next, in order to further clarify the effect of the present invention, Examples and Comparative Examples will be described, but the present invention is not limited to these Examples.
　以下に示す製造方法により、実施例１～７および比較例１～７の試料を作製した。 Samples of Examples 1 to 7 and Comparative Examples 1 to 7 were prepared by the production method shown below.
　［実施例１］
　ばね用洋白（Ｃ７７０１）を電解脱脂、酸洗浄を施した後、導電性の基板と回転接触する少なくとも表面にＰｄ－Ｎｉめっきを施した。Ｐｄ－Ｎｉめっきの条件は、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度３ｇ／Ｌ、浴温４６℃、電流密度２０Ａ／ｄｍ２とした。得られた金属材料のＰｄ含有層の（１１１）面の結晶配向率は７０％であり、（２００）面と（２２０）面の配向率の合計は２３％であった。 [Example 1]
Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd—Ni plating was applied to at least the surface in rotational contact with the conductive substrate. The conditions for Pd-Ni plating were dichlorotetraammine-palladium as a Pd source, a Pd concentration of 3 g / L, a bath temperature of 46 ° C., and a current density of 20 A / dm 2 . The crystal orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 70%, and the total orientation ratio of the (200) plane and the (220) plane was 23%.
　［実施例２］
　ばね用洋白（Ｃ７７０１）を電解脱脂、酸洗浄を施した後、導電性の基板と回転接触する少なくとも表面にＰｄめっきを施した。Ｐｄめっきの条件は、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度６ｇ／Ｌ、浴温４６℃、電流密度３０Ａ／ｄｍ２とした。得られた金属材料のＰｄ含有層の（１１１）面の配向率は６５％であり、（２００）面と（２２０）面の配向率の合計は３４％であった。 [Example 2]
Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd plating was applied to at least the surface in rotational contact with the conductive substrate. The conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 6 g / L, a bath temperature of 46 ° C., and a current density of 30 A / dm 2 . The orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 65%, and the total orientation ratio of the (200) plane and the (220) plane was 34%.
　［実施例３］
　ばね用洋白（Ｃ７７０１）を電解脱脂、酸洗浄を施した後、導電性の基板と回転接触する少なくとも表面にＰｄめっきを施した。Ｐｄめっきの条件は、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度２０ｇ／Ｌ、浴温６０℃、電流密度１００Ａ／ｄｍ２とした。得られた金属材料のＰｄ含有層の（１１１）面の配向率は６１％であり、（２００）面と（２２０）面の配向率の合計は３９％であった。 [Example 3]
Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd plating was applied to at least the surface in rotational contact with the conductive substrate. The conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 20 g / L, a bath temperature of 60 ° C., and a current density of 100 A / dm 2 . The orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 61%, and the total orientation ratio of the (200) plane and the (220) plane was 39%.
　［実施例４］
　ばね用洋白（Ｃ７７０１）を電解脱脂、酸洗浄を施した後、導電性の基板と回転接触する少なくとも表面にＰｄめっきを施した。Ｐｄめっきの条件は、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度６ｇ／Ｌ、浴温５５℃、電流密度３０Ａ／ｄｍ２とした。得られた金属材料のＰｄ含有層の（１１１）面の配向率は８０％であり、（２００）面と（２２０）面の配向率の合計は１５％であった。 [Example 4]
Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd plating was applied to at least the surface in rotational contact with the conductive substrate. The conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 6 g / L, a bath temperature of 55 ° C., and a current density of 30 A / dm 2 . The orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 80%, and the total orientation ratio of the (200) plane and the (220) plane was 15%.
　［実施例５］
　ばね用洋白（Ｃ７７０１）を電解脱脂、酸洗浄を施した後、Ｎｉの下地めっきを施した。次いで、その導電性の基板と回転接触する少なくとも表面にＰｄめっきを施した。Ｐｄめっきの条件は、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度１０ｇ／Ｌ、浴温５５℃、電流密度６０Ａ／ｄｍ２とした。得られた金属材料のＰｄ含有層の（１１１）面の配向率は６３％であり、（２００）面と（２２０）面の配向率の合計は３５％であった。 [Example 5]
Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating. The conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 10 g / L, a bath temperature of 55 ° C., and a current density of 60 A / dm 2 . The orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 63%, and the total orientation ratio of the (200) plane and the (220) plane was 35%.
　［実施例６、７］
　ばね用洋白（Ｃ７７０１）を電解脱脂、酸洗浄を施した後、Ｎｉの下地めっきを施した。次いで、その導電性の基板と回転接触する少なくとも表面にＰｄめっきを施した。Ｐｄめっきの条件は、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度１０ｇ／Ｌ、浴温５５℃、電流密度３０Ａ／ｄｍ２とした。得られた金属材料のＰｄ含有槽の（１１１）面の配向率は７１％であり、（２００）面と（２２０）面の配向率の合計は２５％の金属材料であった。 [Examples 6 and 7]
Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating. The conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 10 g / L, a bath temperature of 55 ° C., and a current density of 30 A / dm 2 . The orientation ratio of the (111) plane of the obtained metal material in the Pd-containing tank was 71%, and the total orientation ratio of the (200) plane and the (220) plane was 25%.
　［比較例１］
　ばね用洋白（Ｃ７７０１）を電解脱脂、酸洗いした後、Ｎｉめっきを最表層として施し金属材料を得た。 [Comparative Example 1]
Nickel silver for springs (C7701) was electrolytically degreased and pickled, and then Ni-plated as the outermost layer to obtain a metal material.
　［比較例２］
　ばね用銅基合金（Ｃ７２９５０）に、厚さ１０μｍのＡｇ－Ｐｄ合金フィルムをクラッドして金属材料を得た。 [Comparative Example 2]
A copper-based alloy for springs (C72950) was clad with an Ag—Pd alloy film having a thickness of 10 μm to obtain a metal material.
　［比較例３］
　ばね用洋白（Ｃ７７０１）を電解脱脂、酸洗浄を施した後、Ｎｉの下地めっきを施した。次いで、その導電性の基板と回転接触する少なくとも表面にＰｄめっきを施した。Ｐｄめっきの条件は、ジニトロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度６ｇ／Ｌ、浴温４０℃、電流密度３０Ａ／ｄｍ２とした。得られた金属材料のＰｄ含有層の（１１１）面の配向率は６０％であり、（２００）面と（２２０）面の配向率の合計は４０％であった。 [Comparative Example 3]
Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating. The conditions for Pd plating were dinitrotetraamminepalladium as a Pd source, a Pd concentration of 6 g / L, a bath temperature of 40 ° C., and a current density of 30 A / dm 2 . The orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 60%, and the total orientation ratio of the (200) plane and the (220) plane was 40%.
　［比較例４］
　ばね用洋白（Ｃ７７０１）を電解脱脂、酸洗浄を施した後、Ｎｉの下地めっきを施した。次いで、その導電性の基板と回転接触する少なくとも表面にＰｄめっきを施した。Ｐｄめっきの条件は、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度１５ｇ／Ｌ、浴温４６℃、電流密度１１０Ａ／ｄｍ２とした。得られた金属材料のＰｄ含有層の（１１１）面の配向率は４２％であり、（２００）面と（２２０）面の配向率の合計は５４％であった。 [Comparative Example 4]
Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating. The conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 15 g / L, a bath temperature of 46 ° C., and a current density of 110 A / dm 2 . The orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 42%, and the total orientation ratio of the (200) plane and the (220) plane was 54%.
　［比較例５］
　ばね用洋白（Ｃ７７０１）を電解脱脂、酸洗浄を施した後、Ｎｉの下地めっきを施した。次いでその導電性の基板と回転接触する少なくとも表面にＰｄめっきを施した。Ｐｄめっきの条件は、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度３ｇ／Ｌ、浴温７０℃、電流密度２０Ａ／ｄｍ２とした。得られた金属材料のＰｄ含有層の（１１１）面の配向率は５１％であり、（２００）面と（２２０）面の配向率の合計は４９％であった。 [Comparative Example 5]
Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Next, Pd plating was applied to at least the surface in rotational contact with the conductive substrate. The conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 3 g / L, a bath temperature of 70 ° C., and a current density of 20 A / dm 2 . The orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 51%, and the total orientation ratio of the (200) plane and the (220) plane was 49%.
　［比較例６］
　ばね用洋白（Ｃ７７０１）を電解脱脂、酸洗浄を施した後、Ｎｉの下地めっきを施した。次いで、その導電性の基板と回転接触する少なくとも表面にＰｄめっきを施した。Ｐｄめっきの条件は、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度３ｇ／Ｌ、浴温５５℃、電流密度１０Ａ／ｄｍ２とした。得られた金属材料のＰｄ含有層の（１１１）面の配向率は４９％であり、（２００）面と（２２０）面の配向率の合計は４７％であった。 [Comparative Example 6]
Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then subjected to Ni base plating. Then, at least the surface in rotational contact with the conductive substrate was subjected to Pd plating. The conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 3 g / L, a bath temperature of 55 ° C., and a current density of 10 A / dm 2 . The orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 49%, and the total orientation ratio of the (200) plane and the (220) plane was 47%.
　［比較例７］
　ばね用洋白（Ｃ７７０１）を電解脱脂、酸洗浄を施した後、導電性の基板と回転接触する少なくとも表面にＰｄめっきを施した。Ｐｄめっきの条件は、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度１０ｇ／Ｌ、浴温７０℃、電流密度４０Ａ／ｄｍ２とした。得られた金属材料のＰｄ含有層の（１１１）面の配向率は５５％であり、（２００）面と（２２０）面の配向率の合計は４０％であった。 [Comparative Example 7]
Nickel silver for springs (C7701) was electrolytically degreased and acid-cleaned, and then Pd plating was applied to at least the surface in rotational contact with the conductive substrate. The conditions for Pd plating were dichlorotetraamminepalladium as a Pd source, a Pd concentration of 10 g / L, a bath temperature of 70 ° C., and a current density of 40 A / dm 2 . The orientation ratio of the (111) plane of the Pd-containing layer of the obtained metal material was 55%, and the total orientation ratio of the (200) plane and the (220) plane was 40%.
　以上のようにして作製した試料について、その構造および特性について評価し、その製造条件とともに表１に示した。 The structure and characteristics of the sample prepared as described above were evaluated and shown in Table 1 together with the manufacturing conditions.
　（Ｐｄ含有層の厚さの測定）
　ＪＩＳ　Ｈ８５０１：１９９９の蛍光Ｘ線式試験方法にしたがい、作製した各試料の表面から蛍光Ｘ線分析を行い測定した。また、各層の厚さの確認のため、断面について画像解析法によっても厚さの測定を行った。画像解析法はＪＩＳ　Ｈ８５０１：１９９９の走査型電子顕微鏡試験方法にしたがい行った。 (Measurement of thickness of Pd-containing layer)
According to the fluorescent X-ray test method of JIS H8501: 1999, fluorescent X-ray analysis was performed from the surface of each prepared sample for measurement. In addition, in order to confirm the thickness of each layer, the thickness of the cross section was also measured by an image analysis method. The image analysis method was performed according to the scanning electron microscope test method of JIS H8501: 1999.
　（ピークのＸ線強度面積の比率の測定方法）
　各試料の表層の表面を、Ｘ線回折法を用いて分析し、各ピークの強度を算出した後、その合計量に対する（１１１）面の比率、ならびに（２００）面の比率および（２２０）面の比率の合計を算出した。Ｘ線回折測定は、以下の条件で行った。
　試料の大きさ：１５ｍｍ×１５ｍｍ
　測定装置：リガク株式会社　Ｇｅｉｇｅｒｆｌｅｘ　ＲＡＤ－Ａ
　Ｎ数：ｎ＝１０ (Measurement method of the ratio of peak X-ray intensity area)
After analyzing the surface of the surface layer of each sample using the X-ray diffraction method and calculating the intensity of each peak, the ratio of the (111) plane to the total amount, and the ratio of the (200) plane and the (220) plane. The total of the ratios of The X-ray diffraction measurement was performed under the following conditions.
Sample size: 15 mm x 15 mm
Measuring device: Rigaku Co., Ltd. Geigerflex RAD-A
Number of N: n = 10
　（耐摩耗性の評価）
　各試料を整流子片およびブラシ材形状にプレス加工し、小型モータに組み込んで評価を行った。モータの導電性の基板は、樹脂製の板の上に銅合金からなる銅層を張り付け、その上に表面のめっき層（表面層）として、Ａｕ層、Ａｕ－Ｃｕ層、Ａｕ－Ｎｉ層またはＡｕ－Ｃｏ層を形成したものを用いた。印加電圧２．５Ｖ、負荷電流０．１Ａ、負荷時回転数２０００回転／分の条件でモータ試験を行い、モータが停止するまでの時間（モータ停止時間）を測定し、以下の基準で評価した。
　　◎：７２００時間以上
　　○：５０００時間以上７２００時間未満
　　×：５０００時間未満 (Evaluation of wear resistance)
Each sample was press-processed into a commutator piece and a brush material shape, and incorporated into a small motor for evaluation. The conductive substrate of the motor has a copper layer made of a copper alloy attached on a resin plate, and an Au layer, an Au-Cu layer, an Au-Ni layer or an Au-Ni layer as a surface plating layer (surface layer) on the copper layer. The one having the Au—Co layer formed was used. A motor test was conducted under the conditions of an applied voltage of 2.5 V, a load current of 0.1 A, and a load rotation speed of 2000 rpm, and the time until the motor stopped (motor stop time) was measured and evaluated according to the following criteria. ..
⊚: 7200 hours or more ○: 5000 hours or more and less than 7200 hours ×: 5000 hours or less
　（接触抵抗値の測定）
　導電材（各試料）と、Ａｇ表面被覆張り出し加工材（表層に膜厚３μｍのＡｇ層を有する無酸素銅Ｃ１０２０、張り出し加工部の曲率半径が５ｍｍ）との間の接触抵抗を、四端子法により測定して求めた。ＤＣ電流源として株式会社ＴＦＦ　ケースレーインスツルメンツ社製　６２２０型ＤＣ電流ソースを用い、電気抵抗の測定には電流測定器（同社製　２１８２Ａ型ナノボルトメータ）を用いた。任意の５箇所における接触抵抗値を測定し、各々平均値（ｎ＝５）を算出し、以下の基準で評価した。
　　◎：５ｍΩ未満
　　○：５ｍΩ以上１０ｍΩ未満
　　×：１０ｍΩ以上 (Measurement of contact resistance value)
The contact resistance between the conductive material (each sample) and the Ag surface coating overhanging material (oxygen-free copper C1020 having an Ag layer with a film thickness of 3 μm on the surface layer, the radius of curvature of the overhanging portion is 5 mm) is controlled by the four-terminal method. It was obtained by measuring with. A 6220 type DC current source manufactured by TFF Caseley Instruments Co., Ltd. was used as the DC current source, and a current measuring device (2182A type nanovolt meter manufactured by the same company) was used to measure the electrical resistance. The contact resistance values at any five points were measured, the average value (n = 5) was calculated for each, and the evaluation was performed according to the following criteria.
⊚: less than 5 mΩ ○: 5 mΩ or more and less than 10 mΩ ×: 10 mΩ or more
　（耐硫化試験）
　各試料を、ＪＩＳ　Ｈ　８５０２：１９９９に準拠して、４０℃、３ｐｐｍの硫化水素（Ｈ２Ｓ）と残部が空気からなる雰囲気下に４８時間に置き、硫化水素に接触させる耐硫化試験を行った。その後、上記接触抵抗値の測定の方法にしたがい、耐硫化試験後の接触抵抗値を求めた。評価基準も同様とした。 (Sulfurization resistance test)
Each sample is placed in an atmosphere of 40 ° C., 3 ppm of hydrogen sulfide (H 2 S) and the balance of air for 48 hours in accordance with JIS H8502: 1999, and subjected to a sulfurization resistance test in which the sample is brought into contact with hydrogen sulfide. It was. Then, according to the above-mentioned method for measuring the contact resistance value, the contact resistance value after the sulfurization resistance test was determined. The evaluation criteria were the same.
　（耐熱試験）
　各試料を、大気雰囲気下において３５０℃で５分間加熱する耐熱試験を行った。その後、上記接触抵抗値の測定の方法にしたがい、耐熱試験後の接触抵抗値を求めた。評価基準も同様とした。 (Heat resistance test)
Each sample was subjected to a heat resistance test by heating at 350 ° C. for 5 minutes in an air atmosphere. Then, according to the above-mentioned method for measuring the contact resistance value, the contact resistance value after the heat resistance test was determined. The evaluation criteria were the same.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　上記表１から分かるように、実施例１～７の試料は、いずれも耐摩耗性が優れていた。加えて、実施例１～７の試料は、接触抵抗が低く、耐硫化試験や耐熱試験を行った後であっても接触抵抗が低い値を維持していた。 As can be seen from Table 1 above, all of the samples of Examples 1 to 7 had excellent wear resistance. In addition, the samples of Examples 1 to 7 had a low contact resistance, and maintained a low value of the contact resistance even after the sulfurization resistance test and the heat resistance test were performed.
　これに対し、Ｐｄ含有層を備えない比較例１の試料および（１１１）面の結晶配向率が本発明の適正範囲より低い比較例２～７の試料はいずれも、耐摩耗性が劣っていた。 On the other hand, the sample of Comparative Example 1 having no Pd-containing layer and the samples of Comparative Examples 2 to 7 in which the crystal orientation ratio of the (111) plane was lower than the appropriate range of the present invention were inferior in abrasion resistance. ..
　加えて、最表層がＮｉである比較例１の試料では、Ｎｉが容易に硫化されるため、耐硫化試験後の接触抵抗が高くなった。また、Ｐｄの含有量が本発明の適正範囲よりも少ない比較例２の試料は、Ｐｄ純度が低いため、耐硫化試験や耐熱試験を行った後の接触抵抗が高かった。なお、比較例２の試料は、クラッド加工により、Ｐｄ含有層に加工変質層が形成したことや、Ｐｄの含有量が少ないことによって、（１１１）面の結晶配向率が低いと考えられる。さらに、Ｐｄの含有量が本発明の適正範囲よりも少ない比較例４の試料は、Ｐｄ純度が低いため、耐硫化試験後の接触抵抗が低かった。さらにまた、Ｐｄ含有層の厚さが薄い比較例５の試料は、耐熱試験後の接触抵抗が高かった。加えて、下地層を有しない比較例７の試料は、耐熱試験後の接触抵抗が高かった。 In addition, in the sample of Comparative Example 1 in which the outermost layer is Ni, Ni is easily sulfurized, so that the contact resistance after the sulfurization resistance test is high. Further, since the sample of Comparative Example 2 in which the Pd content was smaller than the appropriate range of the present invention had a low Pd purity, the contact resistance after the sulfurization resistance test and the heat resistance test was high. In the sample of Comparative Example 2, it is considered that the crystal orientation rate of the (111) plane is low because the processed alteration layer is formed in the Pd-containing layer by the clad processing and the Pd content is low. Further, the sample of Comparative Example 4 in which the Pd content was less than the appropriate range of the present invention had a low Pd purity, so that the contact resistance after the sulfurization resistance test was low. Furthermore, the sample of Comparative Example 5 in which the thickness of the Pd-containing layer was thin had a high contact resistance after the heat resistance test. In addition, the sample of Comparative Example 7 having no base layer had a high contact resistance after the heat resistance test.
　１　　基材
　２　　Ｐｄ含有層
　３　　下地層
　１０　　摺動接点用金属材料 1 Base material 2 Pd-containing layer 3 Base layer 10 Metal material for sliding contacts

Claims (7)

  1. 　銅または銅合金からなる基材と、
    　前記基材の少なくとも一部に最表層として形成され、９５質量％以上のＰｄを含有するＰｄ含有層と
    を有する金属材料であって、
    　前記Ｐｄ含有層は、Ｘ線回折法によって測定される（１１１）面の結晶配向率が６０％より大きく、かつ、（２００）面の結晶配向率と（２２０）面の結晶配向率の合計が４０％未満であることを特徴とする摺動接点用金属材料。     With a base material made of copper or a copper alloy,
    A metal material having a Pd-containing layer formed as the outermost layer on at least a part of the base material and containing 95% by mass or more of Pd.
    In the Pd-containing layer, the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the total of the crystal orientation rate of the (200) plane and the crystal orientation ratio of the (220) plane is A metal material for sliding contacts, characterized in that it is less than 40%.
  2. 　前記基材と前記Ｐｄ含有層の間に、ＮｉまたはＮｉ合金からなる下地層を有することを特徴とする請求項１に記載の摺動接点用金属材料。 The metal material for sliding contacts according to claim 1, wherein a base layer made of Ni or a Ni alloy is provided between the base material and the Pd-containing layer.
  3. 　前記Ｐｄ含有層が電気めっきにより形成されていることを特徴とする、請求項１または２に記載の摺動接点用金属材料。 The metal material for sliding contacts according to claim 1 or 2, wherein the Pd-containing layer is formed by electroplating.
  4. 　請求項１、２または３に記載の摺動接点用金属材料を用いたモータ用ブラシ材。 A brush material for a motor using the metal material for sliding contacts according to claim 1, 2 or 3.
  5. 　導電性の基板とブラシとを含む振動モータであって、
    　前記ブラシは、
    　銅または銅合金からなる基材と、
    　前記基材の少なくとも一部に最表層として形成され、９５質量％以上のＰｄを含有するＰｄ含有層と
    を有する摺動接点用金属材料を用いて形成され、
    　前記Ｐｄ含有層は、Ｘ線回折法によって測定される（１１１）面の結晶配向率が６０％より大きく、かつ、（２００）面の結晶配向率と（２２０）面の結晶配向率の合計が４０％未満である金属材料から構成されることを特徴とする振動モータ。     A vibration motor that includes a conductive substrate and a brush.
    The brush
    With a base material made of copper or a copper alloy,
    It is formed by using a metal material for sliding contacts which is formed as the outermost layer on at least a part of the base material and has a Pd-containing layer containing 95% by mass or more of Pd.
    In the Pd-containing layer, the crystal orientation rate of the (111) plane measured by the X-ray diffraction method is larger than 60%, and the sum of the crystal orientation rate of the (200) plane and the crystal orientation ratio of the (220) plane is A vibration motor characterized by being composed of a metal material of less than 40%.
  6. 前記導電性の基板は、
    　樹脂製の板と、
    　前記樹脂製の板の上に形成される、銅または銅合金からなる銅層と、
    　前記銅層の上に表面層として形成される、Ａｕ層、Ａｕ－Ｃｕ層、Ａｕ－Ｎｉ層またはＡｕ－Ｃｏ層と
    を有する請求項５に記載の振動モータ。     The conductive substrate is
    With a resin plate
    A copper layer made of copper or a copper alloy formed on the resin plate,
    The vibration motor according to claim 5, which has an Au layer, an Au—Cu layer, an Au—Ni layer, or an Au—Co layer formed as a surface layer on the copper layer.
  7. 　請求項１、２または３に記載の摺動接点用金属材料を製造する方法であって、
    　銅または銅合金からなる基材の少なくとも一部に、ジクロロテトラアンミンパラジウムをＰｄ源とし、Ｐｄ濃度３～２０ｇ／Ｌ、浴温４６～６０℃のめっき浴中で、電流密度２０～１００Ａ／ｄｍ２の条件で、Ｐｄめっき処理を施して、Ｐｄ含有層を最表層として形成することを特徴とする、摺動接点用金属材料の製造方法。     The method for producing a metal material for sliding contacts according to claim 1, 2 or 3.
    A current density of 20 to 100 A / dm 2 in a plating bath having a Pd concentration of 3 to 20 g / L and a bath temperature of 46 to 60 ° C. using dichlorotetraamminepalladium as a Pd source for at least a part of a base material made of copper or a copper alloy. A method for producing a metal material for sliding contacts, which comprises performing Pd plating treatment under the above conditions to form a Pd-containing layer as the outermost layer.
PCT/JP2020/031278 2019-10-30 2020-08-19 Metal material for sliding contact, method for manufacturing said material, brush member for motor, and vibration motor WO2021084853A1 (en)

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JP2013127114A (en) * 2011-11-17 2013-06-27 Tdk Corp Coating body and electronic component
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CN115589667A (en) * 2021-07-06 2023-01-10 长春石油化学股份有限公司 Surface-treated copper foil and copper foil substrate
CN115589667B (en) * 2021-07-06 2023-09-08 长春石油化学股份有限公司 Surface-treated copper foil and copper foil substrate

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