WO2021080003A1 - Dispositif de détection de composants gazeux - Google Patents

Dispositif de détection de composants gazeux Download PDF

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Publication number
WO2021080003A1
WO2021080003A1 PCT/JP2020/039963 JP2020039963W WO2021080003A1 WO 2021080003 A1 WO2021080003 A1 WO 2021080003A1 JP 2020039963 W JP2020039963 W JP 2020039963W WO 2021080003 A1 WO2021080003 A1 WO 2021080003A1
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WO
WIPO (PCT)
Prior art keywords
sensor
gas
flow rate
heat flow
pressure
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PCT/JP2020/039963
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English (en)
Japanese (ja)
Inventor
芳彦 白石
長谷川　直樹
万織 柴田
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株式会社デンソー
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Publication of WO2021080003A1 publication Critical patent/WO2021080003A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G01K13/04—Thermometers specially adapted for specific purposes for measuring temperature of moving solid bodies
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00—Measuring quantity of heat
    • G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
    • G01K17/08—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
    • G01K17/20—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature across a radiating surface, combined with ascertainment of the heat transmission coefficient
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity

Definitions

  • This disclosure relates to a gas component detector.
  • Patent Document 1 proposes a method of calculating the concentration of one type of gas contained in a mixed gas based on the correlation between the amount of change in the heat flow rate of the mixed gas and the amount of change in pressure. The amount of change in the heat flow rate is calculated based on the detection result of the heat flow rate sensor, and the heat flow rate sensor is arranged in a state where the portion for detecting the heat flow rate is exposed to the mixed gas.
  • the heat flow sensor is arranged in a state of being exposed to the mixed gas as described above. Therefore, if there is a possibility that sparks or the like may occur when the heat flow sensor fails, safety is a concern.
  • An object of the present disclosure is to provide a gas component detection device capable of improving safety.
  • the gas component detection device outputs a heat flow sensor that outputs a detection signal according to the heat flow rate in the gas flow path and a detection signal according to the pressure in the gas flow path.
  • the amount of change in the heat flow rate when the heat flow rate of the pressure sensor and the mixed gas changes periodically in the gas flow path is calculated based on the detection signal of the heat flow rate sensor, and the pressure of the mixed gas is in the gas flow path.
  • the amount of change in pressure when it changes periodically in is calculated based on the detection signal of the pressure sensor, and based on the correlation between the calculated amount of change in heat flow and the amount of change in pressure, the specific gas of the mixed gas
  • the heat flow sensor includes a control unit for calculating the concentration, and the heat flow sensor has a sensor unit that outputs a detection signal according to the heat flow of the mixed gas in a state where the current is cut off.
  • the heat flow rate sensor is configured to output a detection signal according to the heat flow rate in a state where the current is cut off. Therefore, even if the heat flow rate sensor fails, it is possible to suppress the generation of sparks and the like. Therefore, the safety can be improved.
  • the first embodiment will be described with reference to the drawings.
  • the fuel cell system of the present embodiment is preferably applied to a fuel cell vehicle which is a kind of electric vehicle.
  • the fuel cell system of the present embodiment is a control system including the fuel cell 10.
  • the fuel cell 10 outputs electric energy by utilizing an electrochemical reaction between hydrogen gas and oxygen gas contained in air.
  • a polymer electrolyte fuel cell is used as the fuel cell 10.
  • the fuel cell 10 mainly supplies the DC power generated by the power generation to an electric load such as a vehicle traveling electric motor or a secondary battery via a DC-DC converter (not shown).
  • the fuel cell 10 of the present embodiment has a stack structure in which a plurality of fuel cell cells 10a, which are the smallest units, are stacked, and is configured as a series connection body in which a plurality of fuel cell cells 10a are electrically connected in series. ..
  • the plurality of fuel cell cells 10a are arranged on both sides of the membrane electrode assembly 100 and the membrane electrode assembly 100 formed by sandwiching both sides of the electrolyte membrane 101 between a pair of catalyst layers 102a and 102b. It is composed of a pair of diffusion layers 103a and 103b, and a separator 110 that sandwiches them.
  • the electrolyte membrane 101 is a proton-conducting ion exchange membrane formed of a water-containing polymer material such as a fluorine-based hydrocarbon or a hydrocarbon-based material.
  • the pair of catalyst layers 102a and 102b each constitute an electrode, and is composed of an anode-side catalyst layer 102a constituting an anode electrode and a cathode-side catalyst layer 102b constituting a cathode electrode.
  • each of the catalyst layers 102a and 102b includes a substance 102c such as platinum particles that exerts a catalytic action, a supported carbon 102d that supports the substance 102c, and an ionomer that coats the supported carbon 102d. It is composed of an electrolyte polymer) 102e.
  • the diffusion layers 103a and 103b diffuse the reaction gas into the catalyst layers 102a and 102b, and are composed of a porous member having gas permeability and electron conductivity.
  • a porous member having gas permeability and electron conductivity.
  • the porous member for example, carbon paper, carbon cloth, or the like is used.
  • the separator 110 is made of, for example, a conductive base material such as carbon or metal.
  • a hydrogen flow path 111 through which hydrogen gas flows is formed in a portion facing the anode side catalyst layer 102a, and an air flow path 112 through which air flows is formed in a portion facing the cathode side catalyst layer 102b. ing.
  • each fuel cell 10a hydrogen gas is supplied into the hydrogen flow path 111, and air is supplied to the air flow path 112.
  • each of the plurality of fuel cell 10a outputs electric energy by the electrochemical reaction of the hydrogen gas in the hydrogen flow path 111 and the oxygen gas in the air flow path 112, respectively, as shown below.
  • the fuel cell 10 is provided with an air inlet portion and an air outlet portion.
  • the air inlet portion constitutes a gas inlet portion that supplies air to the air flow paths 112 of the plurality of fuel cell 10a.
  • the air outlet portion constitutes a gas outlet portion that discharges generated water and impurities together with air from the air flow paths 112 of the plurality of fuel cell 10a.
  • An air supply pipe 20 for supplying air to the air inlet portion is connected to the fuel cell 10, and an air discharge pipe 21 for discharging generated water and impurities together with air from the air outlet portion is connected to the fuel cell 10. ing.
  • the air supply pipe 20 is provided with an air pump 22 at its most upstream portion for pumping air sucked from the atmosphere to the fuel cell 10.
  • the air pump 22 is an electric pump including a compression mechanism for pumping air and an electric motor for driving the compression mechanism.
  • An air pressure regulating valve 23 for adjusting the pressure of the air supplied to the fuel cell 10 is provided between the air pump 22 and the fuel cell 10 in the air supply pipe 20.
  • the air pressure regulating valve 23 includes a valve body that adjusts the opening degree of the air flow path through which air flows in the air supply pipe 20, and an electric actuator that drives the valve body.
  • the air discharge pipe 21 is provided with a solenoid valve 24 for discharging the generated water, impurities, etc. existing inside the fuel cell 10 to the outside together with the air.
  • the solenoid valve 24 includes a valve body that adjusts the opening degree of an air discharge path through which air is discharged from the air discharge pipe 21, and an electric actuator that drives the valve body.
  • the fuel cell 10 is provided with a hydrogen inlet portion 12a and a hydrogen outlet portion 12b.
  • the hydrogen inlet portion 12a constitutes a gas inlet portion that supplies hydrogen gas to the hydrogen flow paths 111 of the plurality of fuel cell 10a.
  • the hydrogen outlet portion 12b constitutes a gas outlet portion for discharging unreacted hydrogen gas or the like from the hydrogen flow paths 111 of the plurality of fuel cell 10a.
  • the unreacted hydrogen gas is the remaining hydrogen gas other than the hydrogen gas subjected to the electrochemical reaction among the hydrogen gases supplied to the fuel cell 10.
  • a hydrogen supply pipe 30 having a hydrogen supply flow path for supplying hydrogen to the hydrogen inlet portion 12a is connected to the fuel cell 10, and a small amount of unreacted hydrogen or the like is discharged to the outside from the hydrogen outlet portion 12b.
  • a hydrogen discharge pipe 31 including the hydrogen discharge flow path of the above is connected.
  • a high-pressure hydrogen tank (that is, a supply device) 32 filled with high-pressure hydrogen is provided at the uppermost stream of the hydrogen supply pipe 30.
  • the high-pressure hydrogen tank 32 stores hydrogen gas to be supplied to the fuel cell 10.
  • a hydrogen pressure regulating valve 33 for adjusting the pressure of hydrogen supplied to the fuel cell 10 is provided as a gas flow rate adjusting unit between the high pressure hydrogen tank 32 and the fuel cell 10 in the hydrogen supply pipe 30.
  • the hydrogen pressure regulating valve 33 is a solenoid valve composed of a valve body that adjusts the opening degree of the hydrogen supply flow path in the hydrogen supply pipe 30, and an electric actuator that drives the valve body.
  • the hydrogen discharge pipe 31 is provided with a solenoid valve 34 for discharging a small amount of unreacted hydrogen or the like to the outside.
  • the solenoid valve 34 includes a valve body that adjusts the opening degree of the hydrogen discharge flow path in the hydrogen discharge pipe 31, and an electric actuator that drives the valve body.
  • a gas-liquid separator 35 is provided between the solenoid valve 34 and the fuel cell 10 in the hydrogen discharge pipe 31.
  • the configuration of the gas-liquid separator 35 of the present embodiment will be described.
  • the gas-liquid separator 35 constitutes an exhaust gas flow path 35a for circulating exhaust gas between the hydrogen discharge pipes 31a and 31b.
  • the exhaust gas of this embodiment is a mixed gas containing at least hydrogen gas and nitrogen gas.
  • the upstream side of the hydrogen discharge pipe 31 in the flow direction of the exhaust gas with respect to the gas-liquid separator 35 is the hydrogen discharge pipe 31a, and the downstream side of the hydrogen discharge pipe 31 with respect to the gas-liquid separator 35 in the flow direction of the exhaust gas. Is a hydrogen discharge pipe 31b.
  • the inlet of the gas-liquid separator 35 connected to the hydrogen discharge pipe 31a is arranged on the lower side in the vertical direction with respect to the outlet of the gas-liquid separator 35 connected to the hydrogen discharge pipe 31b.
  • the bottom 35j of the gas-liquid separator 35 is provided with a discharge port 31c for discharging wastewater.
  • baffle plates 35b, 35c, 35d, 35e are provided inside the gas-liquid separator 35.
  • the baffle plates 35b, 35c, 35d, 35e are formed so as to meander the exhaust gas flow path 35a.
  • baffle plates 35b, 35c, 35d, and 35e are arranged offset in the vertical direction, respectively.
  • the baffle plates 35b and 35d are formed so as to project from the right side wall 35f, respectively.
  • the baffle plates 35c and 35e are formed so as to project from the left side wall 35g, respectively.
  • the gas-liquid separator 35 flows into the gas-liquid separator 35 from the hydrogen discharge pipe 31a in a state where the exhaust gas is mixed with the exhaust gas.
  • the baffle plates 35b, 35c, 35d, 35e are arranged in the gas-liquid separator 35, the drainage is discharged from the discharge port 31c provided on the floor side along the baffle plates 35b, 35c, 35d, 35e. It is discharged.
  • the exhaust gas passes through the exhaust gas flow path 35a and flows into the hydrogen discharge pipe 31b. That is, the exhaust gas and the drainage are separated by the baffle plates 35b, 35c, 35d, 35e, and the exhaust gas is discharged from the discharge port 31c while flowing to the hydrogen discharge pipe 31b.
  • a heat flow rate sensor 36, a pressure sensor 37, and a temperature sensor 38 are provided in the gas-liquid separator 35.
  • the heat flow rate sensor 36, the pressure sensor 37, and the temperature sensor 38 are arranged on the most downstream side of the gas-liquid separator 35 between the baffle plate 35b and the ceiling 35h in the flow direction of the exhaust gas. That is, the heat flow rate sensor 36, the pressure sensor 37, and the temperature sensor 38 are arranged on the right side wall 35f orthogonal to the flow direction of the exhaust gas in this embodiment.
  • the heat flow rate sensor 36 is a sensor that detects the heat flow rate in the exhaust gas flow path 35a.
  • the heat flow rate sensor 36 of the present embodiment is configured to include a mold member 300, a connector case 800, a housing 900, and the like.
  • the mold member 300 includes a sensor unit 310, a circuit unit 500, a lead frame 600, a mold resin 700 for sealing these, and the like.
  • the sensor unit 310 has a sensor substrate 320 having one side 320a and another side 320b, and is made of a rectangular plate-shaped semiconductor substrate such as silicon.
  • a recess 321 is formed in the sensor substrate 320 from the other surface 320b side. In the present embodiment, the recess 321 is formed so as to reach the base film 330, which will be described later.
  • the protective film 420 and the like, which will be described later, are omitted and are shown on one side 320a of the sensor substrate 320.
  • a base film 330 is formed on one surface 320a of the sensor substrate 320.
  • the base film 330 is configured by sequentially laminating a first insulating film 331 composed of an oxide film or the like and a second insulating film 332 composed of a nitride film or the like.
  • the sensor substrate 320 is formed with a recess 321 so as to reach the base film 330. Therefore, the portion of the base film 330 exposed from the recess 321 functions as the diaphragm portion 340.
  • thermocouples 350 formed by connecting two different types of metals and semiconductors are arranged on the base film 330.
  • a plurality of first wiring layers 360 composed of polysilicon or the like doped with p-type impurities are partitioned along a predetermined direction on the base film 330. More specifically, each first wiring layer 360 is located on the diaphragm portion 340 and on the diaphragm portion 340 in the normal direction with respect to one surface 320a of the sensor substrate 320 (hereinafter, also simply referred to as the normal direction). It is formed so as to have a located portion and a different portion. Each of the first wiring layers 360 is formed substantially radially around the diaphragm portion 340 in the normal direction.
  • each of the first wiring layers 360 is arranged in the circumferential direction with the diaphragm portion 340 as the center in the normal direction.
  • the normal direction of the sensor substrate 320 with respect to one surface 320a means that the sensor board 320 is viewed from the normal direction.
  • being located on the diaphragm portion 340 in the normal direction means, in other words, being located on the bottom surface of the recess 321 in the normal direction.
  • a first interlayer insulating film 370 composed of an oxide film or the like is formed so as to cover the first wiring layer 360.
  • a second wiring layer 380 is partitioned on the first interlayer insulating film 370.
  • the second wiring layer 380 is made of polysilicon doped with n-type impurities, and has a portion located on the diaphragm portion 340 and a portion different from the portion located on the diaphragm portion 340 in the normal direction. It is configured to have.
  • each of the second wiring layers 380 has a portion located on the first wiring layer 360.
  • the portion of the first wiring layer 360 located on the diaphragm portion 340 is defined as one end side of the first wiring layer 360, which is different from the portion of the first wiring layer 360 on the diaphragm portion 340.
  • the portion located in the portion will be described as the other end side of the first wiring layer 360.
  • the portion of the second wiring layer 380 located on the diaphragm portion 340 is on one end side of the second wiring layer 380, and the portion of the second wiring layer 380 located on the diaphragm portion 340 is different from the portion located on the diaphragm portion 340. Will be described as the other end side of the second wiring layer 380.
  • a second interlayer insulating film 390 composed of an oxide film or the like is formed so as to cover the second wiring layer 380.
  • the second interlayer insulating film 390 is formed with a contact hole 391 that exposes the other end side of each second wiring layer 380 and a contact hole 392 that exposes one end side.
  • the second interlayer insulating film 390 and the first interlayer insulating film 370 are formed with contact holes 393 that expose the other end side of each first wiring layer 360.
  • the second interlayer insulating film 390 and the first interlayer insulating film 370 are formed with contact holes in which one end side of each first wiring layer 360 is exposed in a cross section different from that of FIG. 7.
  • a first connection wiring layer 401, a second connection wiring layer 402, and a third connection wiring layer formed in a cross section different from that of FIG. 7 are formed on the second interlayer insulating film 390.
  • the first connection wiring layer 401, the second connection wiring layer 402, and the third connection wiring layer formed in a cross section different from that of FIG. 7 are contact holes 391 and 392 formed in the second interlayer insulating film.
  • 393 and FIG. 7 are formed so as to alternately connect the first wiring layer 360 and the second wiring layer 380 in series through a contact hole formed in a cross section different from that of FIG.
  • the first connection wiring layer 401 is formed so as to connect the other end side of the first wiring layer 360 and the other end side of the second wiring layer 380 through the contact hole 391 and the contact hole 393. ing.
  • the second connection wiring layer 402 is located in one direction in the circumferential direction with respect to one end side of the second wiring layer 380 and the first wiring layer 360 located below the second wiring layer 380 through the contact hole 392. It is formed so as to connect to the first wiring layer 360.
  • the third connection wiring layer includes one end of the first wiring layer 360 and the second wiring layer 380 located in the other direction in the circumferential direction with respect to the second wiring layer 380 located above the first wiring layer 360. Is formed to connect.
  • the sensor unit 310 is in a state in which a thermopile formed by connecting a plurality of thermocouples 350 in series is formed.
  • a stress relaxation film 410 composed of BPSG (abbreviation of Borophosphosilicate Glass) or the like is formed on the first connection wiring layer 401 and the second connection wiring layer 402.
  • a protective film 420 is formed on the second interlayer insulating film 390 so as to cover the first wiring layer 360 and the second wiring layer 380.
  • the protective film 420 is made of a nitride film or the like having low moisture permeability.
  • a part of the second connection wiring layer 402 extends to a portion of the sensor substrate 320 that is sealed with the mold resin 700 described later.
  • the protective film 420 is formed with an opening 421 that exposes a part of the second connection wiring layer 402.
  • the portion of the second wiring layer 380 exposed from the opening 421 functions as a pad portion 381 and is electrically connected to the circuit portion 500 via the bonding wire 611.
  • the above is the configuration of the sensor unit 310 in this embodiment.
  • a portion exposed from the mold resin 700 is exposed to exhaust gas (that is, a mixed gas).
  • exhaust gas that is, a mixed gas.
  • the heat capacity of the diaphragm portion 340 becomes small, and the heat capacity of the portion different from the diaphragm portion 340 becomes large. That is, the temperature of the diaphragm portion 340 is likely to change, and the temperature of the portion different from the diaphragm portion 340 is difficult to change.
  • thermocouple 350 the portion located on the diaphragm portion 340 in the normal direction becomes a hot contact, and the portion located on a portion different from the diaphragm portion 340 becomes a cold contact. Then, the sensor unit 310 outputs an electromotive voltage corresponding to the temperature difference (that is, heat flow rate) between the hot contact and the cold contact as a detection signal due to the Seebeck effect. In this case, the sensor unit 310 outputs a detection signal according to the temperature difference in a state where the current is cut off. In other words, the sensor unit 310 outputs a detection signal according to the temperature difference even if no current flows.
  • the temperature difference that is, heat flow rate
  • the circuit unit 500 is electrically connected to the sensor unit 310 and performs predetermined processing or the like on the detection signal output from the sensor unit 310.
  • the circuit unit 500 an IC chip or the like in which a semiconductor integrated circuit is formed on a silicon substrate or the like is used.
  • the lead frame 600 includes an island unit 601 on which a circuit unit 500 and a sensor unit 310 are mounted via an adhesive (not shown), and a terminal unit 602 that electrically connects to the outside.
  • the lead frame 600 is made of a metal having excellent conductivity such as general copper (Cu) or 42 alloy, and is processed into a predetermined shape by etching or pressing.
  • the island portion 601 has a planar rectangular shape, and the terminal portion 602 is arranged around the island portion 601.
  • the sensor unit 310 has a sensor substrate 320 having a flat rectangular shape as described above. Then, the sensor portion 310 is connected to the island portion 601 via a joining member 610 so that the portion where the recess 321 is formed protrudes from the island portion 601 and the other surface 320b of the sensor substrate 320 faces the island portion 601. Is prepared.
  • the circuit unit 500 and the pad unit 381 formed on the sensor unit 310 are electrically connected via a bonding wire 611. Further, the circuit unit 500 and one end of the terminal unit 602 are electrically connected via a bonding wire 612.
  • the bonding wires 611 and 612 are made of gold, aluminum, or the like.
  • the mold resin 700 is made of a general epoxy resin or the like, and is formed by a transfer molding method or the like using a mold. Specifically, the mold resin 700 is formed so that the sensor unit 310, the circuit unit 500, the lead frame 600, and the bonding wires 611 and 612 are sealed. The mold resin 700 is formed so that the peripheral portion of the sensor portion 310 including the diaphragm portion 340 is exposed. However, in the present embodiment, as shown in FIG. 6, the mold resin 700 is formed so as to seal the side surface between the one side 320a and the other side 320b of the sensor unit 310.
  • the connector case 800 is made by molding a resin such as PPS (polyphenylene sulfide) or PBT (polybutylene terephthalate), for example.
  • the connector case 800 has a columnar body portion 801 and a columnar connector portion 802 extending from the body portion 801 and having a diameter smaller than that of the body portion 801 at a connecting portion with the body portion 801. ing.
  • a recess 803 is formed on the outer peripheral side surface of the portion on the connecting side with the body portion 801 and an opening 804 is formed at the end on the side opposite to the body portion 801 side. Then, the body portion 801 is formed with a through hole 805 that communicates with the space in the recess 803 from the end portion on the side opposite to the connector portion 802 side.
  • the connector case 800 is provided with a plurality of metal rod-shaped terminals 810 for electrically connecting the sensor unit 310 and an external circuit or the like. Each of these terminals 810 is held in the connector case 800 by being integrally molded with the connector case 800 by insert molding.
  • each terminal 810 is held by the connector case 800 so that one end is exposed in the recess 803 of the connector case 800 and the other end is projected into the opening 804 of the connector case 800. There is. The other end of the terminal 810 protruding into the opening 804 is electrically connected to an external circuit or the like via an external wiring member such as a wire harness (not shown).
  • an external wiring member such as a wire harness (not shown).
  • the mold member 300 is press-fitted into the through hole 805.
  • the connector case so that the other end of the terminal portion 602 exposed from the mold resin 700 is exposed in the recess 803 and the sensor portion 310 protrudes from the connector case 800. It is press-fitted into the through hole 805 formed in 800.
  • one end of the terminal 810 and the other end of the terminal 602 are electrically connected by welding or the like.
  • the sensor unit 310 is electrically connected to the terminal 810 via the circuit unit 500 and the terminal unit 602, and the sensor unit 310 and the external circuit are connected to each other.
  • a potting material 820 that protects the welded portion between one end of the terminal 810 and the other end of the terminal 602 is arranged.
  • an annular groove portion 830 is formed so as to surround the through hole 805 at the end portion of the body portion 801 opposite to the connector portion 802 side, and the O-ring 831 is arranged in the groove portion 830. ing.
  • a potting material 840 is arranged between the mold member 300 and the connector case 800 so as to seal the gap between the mold member 300 and the connector case 800.
  • the housing 900 is formed by cutting or cold forging a metal material such as stainless steel, SUS, or aluminum, and has an extension portion 903 in which an accommodation recess 901 and an introduction hole 902 communicating with the accommodation recess 901 are formed. And have.
  • the body portion 801 of the connector case 800 is inserted into the accommodating recess 901 so that the sensor portion 310 is located in the introduction hole 902.
  • the housing 900 is assembled and integrated with the connector case 800 by crimping the open end portion 901a of the accommodating recess 901 to the body portion 801.
  • the O-ring 831 arranged in the groove 830 of the connector case 800 is crushed by the caulking pressure of the connector case 800 and the housing 900. As a result, the exhaust gas introduced into the introduction hole 902 is prevented from leaking from the gap between the connector case 800 and the housing 900.
  • the extension portion 903 has a bottomed cylindrical shape having a bottom portion at the tip portion in the protruding direction (that is, the tip portion on the side opposite to the connector case 800 side).
  • the extension portion 903 is formed with a screw portion 904 for fixing the housing 900 to the mounted member on the outer peripheral side surface, and an opening 905 is formed on the side opposite to the connector case 800 side of the screw portion 904. It is formed.
  • the gas-liquid separator 35 is the mounted member. As a result, the exhaust gas is introduced from the opening 905 into the introduction hole 902, and the exhaust gas flows along the surface direction of the sensor unit 310.
  • the heat flow rate sensor 36 outputs a detection signal according to the heat flow rate.
  • the pressure sensor 37 outputs pressure information indicating the pressure of the exhaust gas in the exhaust gas flow path 35a of the gas-liquid separator 35 as a detection signal.
  • the temperature sensor 38 outputs the temperature inside the gas-liquid separator 35 as a detection signal.
  • the fuel cell 10 controls the air pressure regulating valve 23, the hydrogen pressure regulating valve 33, the solenoid valves 24 and 34, and the air pump 22, and as a specific gas contained in the exhaust gas, 1
  • a control unit 40 for calculating the gas concentration of each type is provided.
  • the control unit 40 of the present embodiment calculates the concentration of hydrogen gas contained in the exhaust gas.
  • the control unit 40 is composed of a CPU (not shown), a microcomputer or the like including a storage unit composed of a non-transitional substantive storage medium such as a ROM, RAM, flash memory, or HDD.
  • CPU is an abbreviation for Central Processing Unit
  • ROM is an abbreviation for Read Only Memory
  • RAM is an abbreviation for Random Access Memory
  • HDD is an abbreviation for Hard Disk Drive.
  • Various data (for example, initial values, lookup tables, maps, etc.) used when executing the program are stored in advance in the ROM or the like, and in the present embodiment, the test lines Ka1 and Ka2 described later are stored. Is stored in advance. Further, the storage medium such as ROM is a non-transitional substantive storage medium.
  • control unit 40 calculates the concentration of hydrogen gas based on each input detection signal.
  • the control unit 40 of the present embodiment together with the pressure sensor 37 and the heat flow rate sensor 36, constitutes a gas component detection device 50 that calculates the concentration of hydrogen gas.
  • the hydrogen gas concentration calculation process of the present embodiment will be described.
  • the calculation process of the present embodiment is the same as that of JP-A-2017-90317, which has already been filed by the applicants, and thus will be briefly described.
  • the exhaust gas will be referred to as a mixed gas and will be described.
  • control unit 40 controls the hydrogen pressure regulating valve 33 to periodically supply hydrogen gas from the high-pressure hydrogen tank 32 to the fuel cell 10.
  • the high-pressure hydrogen tank 32 is controlled to alternately repeat opening and closing the valve of the high-pressure hydrogen tank 32.
  • the valve opening of the high-pressure hydrogen tank 32 is a state in which hydrogen gas is supplied from the high-pressure hydrogen tank 32 to the plurality of fuel cell cells 10a.
  • the valve closing of the high-pressure hydrogen tank 32 is a state in which the high-pressure hydrogen tank 32 and the plurality of fuel cell cells 10a are closed.
  • control unit 40 obtains the amount of change a of the heat flow rate in the hydrogen discharge pipe 31 based on the detected value of the heat flow rate sensor 36. Further, the control circuit obtains the amount of change b of the pressure in the hydrogen discharge pipe 31 based on the detected value of the pressure sensor 37.
  • the detected value of the heat flow sensor 36 at the time point T1 is R (t1)
  • the detected value of the pressure sensor 37 is A (t1).
  • the detected value of the heat flow sensor 36 at the time point T2 is R (t2)
  • the detected value of the pressure sensor 37 is A (t2).
  • the time point T2 is a time point after the time point T1.
  • the amount of change a and the amount of change b are calculated by the following formulas 1 and 2.
  • the heat flow rate sensor 36 and the pressure sensor 37 are arranged on the downstream side of the hydrogen flow path 111 of the plurality of fuel cell 10a in the gas flow direction. Therefore, the amount of change in the heat flow rate a is substantially the same as the amount of change in the heat flow rate in the hydrogen flow path 111, and the amount of change in pressure b is substantially the same as the amount of change in the pressure in the hydrogen flow path 111.
  • control unit 40 calculates the ratio of the change amount a to the change amount b (that is, "a / b"). That is, the heat flow rate change rate showing the correlation between the change amount a and the change amount b is calculated.
  • the thermal conductivity of hydrogen gas is higher than that of nitrogen gas. Therefore, as shown in FIG. 8, the rate of change in heat flow rate increases as the concentration of hydrogen gas increases. Moreover, the thermal conductivity of hydrogen gas and the thermal conductivity of nitrogen gas change depending on the temperature. Therefore, the rate of change in heat flow rate also changes depending on the temperature of the mixed gas.
  • the test line Ka1 and the test line Ka2 in FIG. 8 are derived by experiments in advance and are stored in a RAM or the like.
  • test lines Ka1 and Ka2 change the mixing ratio of hydrogen gas in the mixed gas and change the temperature, and the mixing ratio of each temperature is based on the detection results of the heat flow sensor 36, the pressure sensor 37, and the temperature sensor 38. It is derived by obtaining the rate of change in heat flow rate a / b for each time.
  • the test line Ka1 at 25 ° C. and the test line Ka2 at 60 ° C. are shown as examples, but in reality, further subdivided test lines for each temperature are derived and the ROM or the like is derived. Is remembered in.
  • control unit 40 selects the corresponding test line from the detection result of the temperature sensor 38, compares the calculated heat flow rate change rate with the test line, and calculates the hydrogen gas concentration.
  • the concentration of hydrogen gas is calculated based on the detection results of the heat flow rate sensor 36, the pressure sensor 37, and the temperature sensor 38. Therefore, the gas component detection device 50 having a simple structure can be configured.
  • the heat flow rate sensor 36 is configured to output a detection signal (that is, an electromotive voltage) according to the heat flow rate in a state where the current is cut off. Therefore, even if the heat flow rate sensor 36 fails, it is possible to suppress the generation of sparks and the like. Therefore, the safety can be improved.
  • a detection signal that is, an electromotive voltage
  • the sensor unit 310 in the heat flow sensor 36 has a diaphragm unit 340, and is composed of a portion where the heat capacity is increased and a portion where the heat capacity is decreased.
  • the sensor unit 310 has a thermocouple 350 having a portion located on the diaphragm portion 340 and a portion located on a portion different from the diaphragm portion 340 in the normal direction. Therefore, it becomes easy to form a temperature difference between the hot contact and the cold contact in the thermocouple 350, and the sensitivity can be improved.
  • the sensor unit 310 of the present embodiment is configured such that the protective member 430 is arranged on one side 320a side of the sensor substrate 320.
  • FIG. 9 omits the configuration of the thermocouple 350 and the like formed on one surface 320a of the sensor substrate 320.
  • the protective member 430 has a protective substrate 440 having one surface 440a and another surface 440b and made of a semiconductor substrate such as silicon, and the sensor so that the other surface 440b faces the one surface 32a of the sensor substrate 320. It is arranged on one side 320a side of the substrate 320.
  • the protective substrate 440 is formed with a recess 441 in a portion of the other surface 440b facing the diaphragm portion 340, and a through hole in the bottom surface of the recess 441 is used to communicate the space inside the recess 441 with the outside. 442 is formed. In the present embodiment, a plurality of through holes 442 are formed so that the bottom surface of the recess 441 has a mesh shape.
  • the protective member 430 is formed with a through hole that penetrates the protective member 430 and the sensor portion 310 in the stacking direction to expose the pad portion 381, and is electrically connected to the pad portion in the through hole.
  • the wiring portion to be formed is formed. Then, in the sensor unit 310, this wiring unit is connected to the circuit unit 500.
  • the sensor unit 310 since the sensor unit 310 has a configuration in which the protective member 430 is arranged on the sensor substrate 320, the overall strength is increased. Therefore, it is possible to prevent the sensor unit 310 from being destroyed.
  • the through hole 442 is formed in the protective member 430, and the portion located on the diaphragm portion 340 is exposed to the mixed gas that has passed through the through hole 442.
  • the flow direction of the mixed gas changes when passing through the through hole 442. Therefore, the portion located on the diaphragm portion 340 is exposed to the mixed gas having a weakened flow. Therefore, the influence of the flow velocity of the mixed gas can be reduced, and the detection accuracy can be improved.
  • FIG. 10 A modified example of the second embodiment will be described.
  • the recess 441 is not formed in the protective substrate 440, and the through hole 442 may be formed so as to open the portion located on the diaphragm portion 340 as a whole.
  • FIG. 10 omits the configuration of the thermocouple 350 and the like formed on one surface 320a of the sensor substrate 320.
  • the temperature sensor 38 is arranged on the sensor substrate 320. Specifically, the temperature sensor 38 is formed in a portion of the sensor substrate 320 that is sealed with the mold resin 700, and is formed on the base film 330 in the present embodiment.
  • the temperature sensor 38 is electrically connected to the circuit unit 500 via a bonding wire or the like in a cross section different from that of FIG.
  • the temperature sensor 38 of the present embodiment is composed of a temperature-sensitive resistor whose resistance value changes according to the temperature, and the voltage changes when the resistance value changes in the energized state. Then, the temperature sensor 38 outputs the temperature based on the change in voltage as a detection signal.
  • the temperature sensor 38 is formed on the sensor board 320, the number of parts can be reduced. That is, by integrating the heat flow rate sensor 36 and the temperature sensor 38, the number of parts can be reduced.
  • the temperature sensor 38 is configured to output a detection signal in a state of being energized, but is arranged in a portion sealed with the mold resin 700. Therefore, even if the temperature sensor 38 fails, sparks are suppressed from being generated in the mixed gas. Therefore, it is possible to further improve the safety while widening the configuration that can be adopted as the temperature sensor 38.
  • the temperature sensor 38 may be formed on, for example, the first interlayer insulating film 370. That is, the location of the temperature sensor 38 is appropriately changed as long as it is a portion sealed with the mold resin 700.
  • the sensor unit 310 has an insulating base material 450, a front surface protection member 451 and a back surface protection member 452 integrated, and inside the integrated body, the first and second interlayer connection members 461,
  • the structure is such that 462s are alternately connected in series.
  • the insulating base material 450, the front surface protection member 451 and the back surface protection member 452 are in the form of a film and are made of a flexible resin material such as a thermoplastic resin.
  • a via hole penetrating in the thickness direction is formed in the insulating base material 450, and the first and second interlayer connection members 461 and 462 made of different thermoelectric materials such as metal and semiconductor are formed in the via hole. It is embedded. Further, a surface conductor pattern 471 is formed on the surface of the insulating base material 450 on the surface protection member 451 side. A back surface conductor pattern 472 is formed on the surface of the insulating base material 450 on the back surface protection member 452 side. The first and second interlayer connection members 461 and 462 are connected in series by the front surface conductor pattern 471 and the back surface conductor pattern 472, so that a plurality of thermocouples 350 are connected in series. .. As the first and second interlayer connection members 461 and 462, for example, a combination of a solid-phase sintered Bi-Sb-Te alloy and Bi-Te, a combination of Cu and Constantan, and the like are adopted. ..
  • Such a sensor unit 310 outputs an electromotive voltage based on the temperature difference between the front surface 310a and the back surface 310b of the sensor unit 310 due to the heat flow rate. That is, even in such a sensor unit 310, a detection signal corresponding to the temperature difference is output without being energized.
  • the above is the configuration of the sensor unit 310 in this embodiment. Then, as shown in FIG. 13, the sensor unit 310 is arranged on the island unit 601 so that the back surface 310b faces the island unit 601. However, in the present embodiment, the entire sensor unit 310 is arranged on the island unit 601.
  • a heat sink 480 made of a material having high thermal conductivity is arranged on the opposite side of the island portion 601 from the sensor portion 310 via a joining member (not shown) such as silver paste.
  • the heat sink 480 is composed of heat-dissipating ceramics and porous ceramics mainly made of copper, molybdenum, tungsten, and alumina, ceramics mainly made of silicon carbide, and the like.
  • the heat insulating material 490 is arranged so as to cover the heat sink 480.
  • the mold resin 700 is formed so as to seal the sensor portion 310 and the heat sink 480, and a through hole 701 that exposes the surface 310a of the sensor portion 310 is formed.
  • a protective film 710 is formed in the portion of the through hole 701 and the sensor unit 310 that is exposed from the through hole 701.
  • the protective film 710 is made of a water-repellent material, for example, a fluorine surfactant or the like.
  • the sensor unit 310 may be configured to generate an electromotive voltage according to the temperature difference between the front surface 310a and the back surface 310b.
  • the heat sink 480 is arranged on the opposite side of the island portion 601 from the sensor portion 310, it is possible to suppress the temperature of the back surface 310b of the sensor portion 310 from fluctuating due to the mixed gas. Therefore, the temperature difference between the front surface 310a and the back surface 310b in the sensor unit 310 can be easily increased, and the sensitivity can be improved.
  • the heat insulating material 490 is arranged so as to cover the heat sink 480. Therefore, the heat insulating material 490 can prevent the temperature of the heat sink 480 from fluctuating due to the mixed gas. Therefore, it is possible to further prevent the temperature of the back surface 310b of the sensor unit 310 from fluctuating due to the mixed gas.
  • the island portion 601 of the lead frame 600 has a thick portion 601a in which the thickness of the portion where the sensor portion 310 is arranged is sufficiently thicker than the thickness of the other portion. It is configured.
  • the heat sink 480 according to the third embodiment is not arranged on the side opposite to the sensor unit 310 with the lead frame 600 in between. That is, in the present embodiment, the thick portion 601a of the lead frame 600 functions as a heat sink.
  • the thick portion 601a of the lead frame 600 functions as a heat sink, it is not necessary to provide a separate heat sink 480. Therefore, the number of parts can be reduced.
  • the heat flow rate sensor 36 is used to detect the heat flow rate in the mixed gas.
  • the portion of the mold member 300 protruding from the connector case 800 that is, the portion located in the extending portion 903 of the housing 900 is exposed to the mixed gas. Therefore, in the mold member 300, there is a concern that hydrogen gas contained in the mixed gas permeates the mold resin 700 and reaches the lead frame 600, the bonding wires 611, 612, etc., resulting in hydrogen embrittlement and the like.
  • a plating film 720 having a lower hydrogen gas permeability than the mold resin 700 is arranged on the portion of the mold member 300 exposed from the connector case 800.
  • the plating film 720 is composed of, for example, a copper plating film, a nickel plating film, or the like.
  • the plating film 720 is arranged in the portion of the mold member 300 exposed from the connector case 800, it is possible to prevent hydrogen gas from entering the inside of the mold member 300 by the plating film 720. Therefore, it is possible to suppress the occurrence of hydrogen embrittlement and the like.
  • the gas component detection device 50 may be applied to various devices other than the fuel cell 10.
  • the mixed gas is not limited to the one containing hydrogen gas and nitrogen gas, and may be configured to contain at least two kinds of gases having different thermal conductivity.
  • the heat flow rate sensor 36, the pressure sensor 37, and the temperature sensor 38 are not arranged in the gas-liquid separator 35, for example, between the gas-liquid separator 35 and the solenoid valve 34. It may be provided in the hydrogen discharge pipe 31. In this case, the hydrogen discharge pipe 31 constitutes the gas flow path. That is, the arrangement locations of the heat flow rate sensor 36, the pressure sensor 37, and the temperature sensor 38 can be changed as appropriate. Further, the fuel cell system may be configured not to include the gas-liquid separator 35.
  • a humidity sensor for detecting the humidity of the mixed gas may be provided, and the control unit 40 may calculate the concentration of the hydrogen gas in consideration of the detection result of the humidity sensor.
  • the detection accuracy can be improved by calculating the concentration of the hydrogen gas excluding the water vapor.
  • the diaphragm portion 340 is not limited to the one formed by forming the recess 321 from the other surface 320b of the sensor substrate 320.
  • the diaphragm portion 340 may be composed of a portion that substantially closes the recess by forming a recess so as to form a cavity inside from the one side 320a side of the sensor substrate 320.
  • the heat insulating material 490 does not have to be arranged. Even with such a configuration, the sensitivity can be improved by arranging the heat sink 480. Similarly, in the fifth and sixth embodiments, the heat insulating material 490 may not be arranged.
  • each of the above embodiments can be combined as appropriate.
  • the second embodiment may be combined with the third to sixth embodiments, and the protective member 430 may be arranged.
  • the third embodiment may be combined with the fourth to sixth embodiments so that the temperature sensor 38 and the heat flow rate sensor 36 are integrated.
  • the fifth embodiment may be combined with the sixth embodiment so that the island portion 601 is provided with the thick portion 601a. Then, the combination of the above embodiments may be further combined.
  • the controls and methods thereof described in the present disclosure are realized by a dedicated computer provided by configuring a processor and memory programmed to perform one or more functions embodied by a computer program. May be done.
  • the controls and methods thereof described in the present disclosure may be implemented by a dedicated computer provided by configuring the processor with one or more dedicated hardware logic circuits.
  • the control unit and method thereof described in the present disclosure may be a combination of a processor and memory programmed to perform one or more functions and a processor composed of one or more hardware logic circuits. It may be realized by one or more dedicated computers configured.
  • the computer program may be stored in a computer-readable non-transitional tangible recording medium as an instruction executed by the computer.

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Fuel Cell (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

La présente invention comprend : un capteur de flux thermique (36) qui émet un signal de détection correspondant au flux thermique dans un trajet d'écoulement de gaz ; un capteur de pression qui émet un signal de détection correspondant à la pression à l'intérieur du trajet d'écoulement de gaz ; une unité de commande qui calcule, en fonction du signal de détection provenant du capteur de flux thermique (36), l'amplitude du changement du flux thermique lorsque le flux thermique d'un gaz mélangé change périodiquement dans le trajet d'écoulement de gaz, qui calcule également, en fonction du signal de détection provenant du capteur de pression, l'amplitude du changement de pression lorsque la pression du gaz mélangé est périodiquement changée dans le trajet d'écoulement de gaz, et qui calcule en outre la concentration d'un gaz spécifique dans le gaz mélangé en fonction de la relation entre l'amplitude du changement dans le flux thermique calculée et l'amplitude du changement dans la pression calculée. Le capteur de flux thermique (36) est configuré de sorte à posséder une unité de capteur (310) qui émet le signal de détection correspondant au flux thermique du gaz mélangé dans un état dans lequel un courant électrique est coupé.
PCT/JP2020/039963 2019-10-24 2020-10-23 Dispositif de détection de composants gazeux WO2021080003A1 (fr)

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JP2019193606A JP2022180669A (ja) 2019-10-24 2019-10-24 ガス成分検出装置
JP2019-193606 2019-10-24

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017090317A (ja) * 2015-11-12 2017-05-25 株式会社デンソー ガス成分検出装置、および制御システム
JP2019128182A (ja) * 2018-01-22 2019-08-01 株式会社Ｓｏｋｅｎ ガス特性検出装置、燃料電池システム
JP2019129014A (ja) * 2018-01-23 2019-08-01 株式会社Ｓｏｋｅｎ 燃料電池システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017090317A (ja) * 2015-11-12 2017-05-25 株式会社デンソー ガス成分検出装置、および制御システム
JP2019128182A (ja) * 2018-01-22 2019-08-01 株式会社Ｓｏｋｅｎ ガス特性検出装置、燃料電池システム
JP2019129014A (ja) * 2018-01-23 2019-08-01 株式会社Ｓｏｋｅｎ 燃料電池システム

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