WO2021073182A1 - Module de caméra et dispositif électronique - Google Patents

Module de caméra et dispositif électronique Download PDF

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Publication number
WO2021073182A1
WO2021073182A1 PCT/CN2020/102487 CN2020102487W WO2021073182A1 WO 2021073182 A1 WO2021073182 A1 WO 2021073182A1 CN 2020102487 W CN2020102487 W CN 2020102487W WO 2021073182 A1 WO2021073182 A1 WO 2021073182A1
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WO
WIPO (PCT)
Prior art keywords
image sensor
circuit board
camera module
welding part
welding
Prior art date
Application number
PCT/CN2020/102487
Other languages
English (en)
Chinese (zh)
Inventor
缪伟亮
罗振东
冉坤
Original Assignee
华为技术有限公司
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Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021073182A1 publication Critical patent/WO2021073182A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • This application relates to the technical field of electronic equipment, and in particular to a camera module and electronic equipment.
  • electronic devices are generally equipped with camera modules to achieve image collection and other functions; for example, in mobile phones, in order to achieve the shooting function, they are generally equipped with at least one camera module; with the miniaturization and thinner design of mobile phones, the traditional Due to the large space occupied by the camera module, a significant restriction has been formed on the miniaturization and thinner design of the mobile phone.
  • the camera module will slightly protrude from the phone shell, which affects the overall beauty of the phone and the thickness of the body; in addition, because the camera module will slightly protrude from the phone shell, when the phone suffers It is easy to cause damage to the camera module when dropped or collided, which reduces the anti-drop performance and user experience of the mobile phone.
  • some manufacturers began to equip mobile phones with liftable camera modules, but due to the height of the camera modules, the size of the liftable camera modules was larger, which affected the thin and light design of the mobile phones.
  • the present application provides a camera module and electronic device with a compact structure, which is convenient to realize a miniaturization, light and thin design.
  • an embodiment of the present application provides a camera module, including a circuit board, an image sensor, and a lens assembly; a recessed portion is provided on the first board surface of the circuit board, and a first welding portion is provided at the edge of the recessed portion;
  • the image sensor is arranged in the recess, so as to reduce the vertical space occupation of the circuit board and the image sensor; the edge of the image sensor is provided with a second welding part for welding with the first welding part of the circuit board; the first welding part After welding with the second welding part (such as laser spray welding, electron beam welding, etc.), the fixed connection and electrical connection between the image sensor and the circuit board can be realized;
  • the lens assembly is set above the image sensor and fixed On the first surface of the circuit board, external light can be projected on the top surface of the image sensor after being processed by the lens assembly to convert the light signal into an electrical signal.
  • the vertical space occupation of the image sensor and the circuit board can be reduced, and the arrangement of the first welding part and the second welding part can be combined , So as to achieve the fixed connection and electrical connection between the image sensor and the circuit board, and at the same time, it can also reduce the occupation of the welding structure in the horizontal space and the vertical space, thereby facilitating the realization of the miniaturization and lightweight design of the camera module. It is also easy to realize modular production.
  • the recessed portion may be configured as a groove structure.
  • the contour of the groove structure can be the same or roughly the same as the contour of the image sensor, so that the image sensor can be well arranged in the cavity, and at the same time, the gap between the image sensor and the cavity can be reduced, so that the volume of the camera module can be reduced. More compact.
  • the height of the image sensor may be greater than, equal to, or less than the depth of the groove. Therefore, under different circumstances, the top surface of the image sensor may protrude from the groove, be located in the groove, or be in contact with the circuit board. The first board is flush.
  • the bottom surface of the image sensor is attached to the bottom surface in the groove, and the top surface of the image sensor is located in the groove.
  • the first welding part can be arranged on the side wall of the groove, and the second welding part can be arranged on the top surface of the image sensor, so as to reduce the first welding part and the first welding part as much as possible.
  • the distance between the two welding parts is to facilitate the realization of the welding connection between the first welding part and the second welding part, and at the same time, it can also save the amount of solder used, so as to realize the lightweight design of the camera module.
  • the first welding part may be arranged on the side wall of the groove, and the second welding part may also be arranged on the side of the image sensor; when the image sensor is placed in the groove, the second welding part is connected to the first welding part.
  • the welding parts are arranged oppositely, so as to realize the welding of the first welding part and the second welding part.
  • the setting positions of the first welding part and the second welding part can also be adjusted adaptively, so as to facilitate the realization of the first welding part and the second welding part. Good soldering.
  • the first welding part can be arranged on the first board surface of the circuit board, and the second welding part can be arranged on the top surface of the image sensor, so as to reduce the distance between the first welding part and the second welding part as much as possible.
  • the amount of solder used can be saved, so as to realize the lightweight design of the camera module.
  • the second welding part may also be provided on the side of the image sensor.
  • the second welding part may be provided on both the top surface and the side surface of the image sensor; correspondingly, the second welding part may be provided on both the side wall of the groove and the first board surface of the circuit board to lift the first welding part Flexibility and reliability when welding with the second welding part.
  • the recess can also be provided as a through-hole structure, that is, the recess on the first surface of the circuit board penetrates the second surface of the circuit board, wherein the second The board surface is the surface away from the first board surface.
  • the top surface of the image sensor may be located in the through hole or protrude from the through hole.
  • the bottom surface of the image sensor can be located in the through hole or protrude from the through hole.
  • a backing plate can be fixed on the second surface of the circuit board, and the bottom surface of the image sensor can be attached to the backing plate, so as to ensure the connection between the image sensor and the circuit board. The relative position between.
  • an infrared filter in order to prevent the red light in the light (the wavelength range can be between 605nm-700nm) from causing adverse effects such as image color distortion on the image sensor, an infrared filter can be set between the lens assembly and the image sensor, The infrared filter can be fixedly connected to the circuit board or fixedly connected to the image sensor.
  • the lens assembly in order to avoid the space occupation of the infrared filter, can also be fixed on the circuit board through a bracket.
  • the height of the bracket can be greater than or equal to the thickness of the infrared filter to prevent positional interference between the lens assembly and the infrared filter.
  • the embodiment of the present application also provides a manufacturing method for the above-mentioned camera module, which includes providing a recessed portion on the first surface of the circuit board, placing the image sensor in the recessed portion, and then using laser spraying
  • the first welding part of the circuit board and the second welding part of the image sensor are welded by welding, electron beam welding, etc., so as to realize the fixed connection and electrical connection between the circuit board and the image sensor.
  • the concave portion can be formed by milling or the like.
  • the image sensor can be directly placed in the groove, and then the first welding portion and the second welding portion are welded.
  • the recessed part is a through-hole structure, auxiliary tools can be used to assist in positioning the relative position between the image sensor and the circuit board, and then the first welding part and the second welding part are welded.
  • the image sensor and the circuit board can also be bonded by an adhesive; in specific implementation, the process of setting the adhesive can be It is performed after the welding of the first welding part and the second welding part is completed, or it may be performed before the welding of the first welding part and the second welding part.
  • the infrared filter can be fixed on the first surface of the circuit board by adhesive or other connecting parts, and then the lens assembly can be fixed on the circuit board;
  • the fixed connection between the lens assembly and the circuit board can be realized in the form of adhesive or other connecting parts.
  • an embodiment of the present application also provides an electronic device including a processor and any one of the above-mentioned camera modules, and the image sensor is signally connected to the processor.
  • the electronic device may be a mobile phone, a tablet computer, a notebook computer, and the like.
  • FIG. 1 is a schematic diagram of a cross-sectional structure of a camera module provided by an embodiment of the application
  • FIG. 2 is an exploded view of a cross-sectional structure of another camera module provided by an embodiment of the application;
  • FIG. 3 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • FIG. 4 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • FIG. 5 is a plan view of a camera module provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of a cross-sectional structure of a camera module provided by an embodiment of the application.
  • FIG. 7 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • FIG. 8 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • FIG. 9 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • FIG. 10 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • FIG. 11 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • FIG. 12 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • FIG. 13 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • FIG. 14 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • 15 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • 16 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • FIG. 17 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • FIG. 18 is a schematic cross-sectional structure diagram of another camera module provided by an embodiment of the application.
  • FIG. 19 is a schematic structural diagram of an electronic device provided by an embodiment of this application.
  • the camera module provided in the embodiments of the present application can be applied to electronic devices such as mobile phones, tablet computers, and notebook computers to implement functions such as image collection.
  • the camera module can be set in the mobile phone to realize functions such as photographing, video shooting, and Selfie.
  • the camera module 01 may include a circuit board 011 (such as a printed circuit board), an image sensor 012, a lens assembly 013, an infrared filter 014, a bracket 015 and other components; among them, the image
  • the sensor 012 is a device that converts an optical image into an electrical signal.
  • the image sensor 012 can include a charge-coupled device (CCD) or a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS), etc.; the image sensor 012 is fixed on The board surface of the circuit board 011 is electrically connected to the circuit board 011 through the conductive wire 016, so as to transmit the electrical signal through the circuit board 011 to the graphics processing unit (GPU) or central processing unit (central processing unit) in the mobile phone.
  • the processing unit (CPU) the functions of acquiring, converting, and processing optical images can be realized.
  • the lens assembly 013 is mounted on the circuit board 011 through the bracket 015. The light in the external environment is projected into the image sensor 012 after the lens assembly 013.
  • the lens assembly 013 can process the light that will be projected on the image sensor 012 (such as shaping, Adjust the focal length, etc.) so that light can be efficiently projected in the image sensor 012.
  • the infrared filter 014 is fixed on the bracket 015 and is arranged between the lens assembly 013 and the image sensor 012. After the light in the external environment is processed by the lens assembly 013 (such as shaping and adjusting the focus), the infrared filter 014 is used to treat the light The red light is filtered and then projected into the image sensor 012 to prevent the red light from adversely affecting the working performance of the image sensor 012.
  • the height of the camera module 01 is greatly affected by the thickness of the circuit board 011 and the height of the image sensor 012; at the same time, due to the image
  • the sensor 012 and the circuit board 011 are electrically connected by an additional conductive wire 016, so that the conductive wire 016 will also occupy a certain horizontal and vertical space.
  • the conductive wire 016 is relatively fragile, the infrared filter 014 and the lens The component 013 cannot be directly fixed on the circuit board 011 and interferes with the conductive wire 016.
  • the traditional camera module 01 generally has a relatively large volume, which is inconvenient to realize a miniaturized design.
  • the embodiments of the present application provide a camera module with a compact structure, a small footprint, and easy modular production, and an electronic device applied to the camera module.
  • references described in this specification to "one embodiment” or “some embodiments”, etc. mean that one or more embodiments of the present application include a specific feature, structure, or characteristic described in conjunction with the embodiment. Therefore, the sentences “in one embodiment”, “in some embodiments”, “in some other embodiments”, “in some other embodiments”, etc. appearing in different places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless it is specifically emphasized otherwise.
  • the terms “including”, “including”, “having” and their variations all mean “including but not limited to”, unless otherwise specifically emphasized.
  • the camera module 10 includes a circuit board 11, an image sensor 12, and a lens assembly 13;
  • the surface) is provided with a recessed portion 111, and the edge of the recessed portion 111 is provided with a first welding portion 112;
  • the image sensor 12 is arranged in the recessed portion 111, thereby reducing the vertical space occupation of the circuit board 11 and the image sensor 12
  • the edge of the image sensor 12 is provided with a second soldering portion 121 for soldering with the first soldering portion 112 on the circuit board 11; as shown in FIG.
  • the first soldering portion 112 and the second soldering portion 121 are soldered by solder 20 After that, the fixed connection and electrical connection between the image sensor 12 and the circuit board 11 can be realized; the lens assembly 13 is arranged above the image sensor 12 and fixed on the upper surface of the circuit board 11, and the external light passes through the lens assembly 13 After processing, it can be projected on the top surface of the image sensor 12 to convert the optical signal into an electrical signal, which is convenient for transmission and subsequent processing.
  • the vertical space occupation of the image sensor 12 and the circuit board 11 can be reduced, and the first welding portion 112 and The arrangement of the second welding part 121 can realize the fixed connection and electrical connection between the image sensor 12 and the circuit board 11, and can also reduce the occupation of the welding structure in the horizontal space and the vertical space, thereby facilitating the realization of the camera module 10's miniaturization, light weight design, but also easy to achieve modular production.
  • the circuit board 11 may be a printed circuit board (Printed Circuit Board, PCB) or a flexible printed circuit board (Flexible Printed Circuit, FPC), etc.
  • the circuit board 11 may be an independent component in an electronic device. It can also be a motherboard in an electronic device.
  • the processor and other components in the electronic device can be set on the motherboard; when the circuit board 11 is a component independent of the motherboard, the circuit board 11 and the motherboard can be electrically connected through connectors and other components. Connection;
  • the processor and other devices in the mobile phone can also be arranged on the circuit board 11, or it is understandable that the circuit board 11 can be used as the main board of the mobile phone.
  • the lens assembly 13 in order to process the light to be irradiated on the image sensor 12 (such as shaping and adjusting the focal length), the lens assembly 13 can be arranged on one side of the top surface of the image sensor 12.
  • the lens assembly 13 includes a lens assembly 131 and a voice coil motor 132.
  • the lens assembly 131 is fixed in the voice coil motor 132.
  • the focal length of the lens assembly 131 can be adjusted so that light can be effectively projected on the image sensor 12.
  • the voice coil motor 132 can be directly fixed on the upper surface of the circuit board 11; for example, an adhesive can be directly attached to the upper surface of the circuit board 11, or it can be directly attached to the upper surface of the circuit board 11 through other connectors (such as Screws etc.) fix the voice coil motor 132 on the circuit board 11.
  • the recessed portion 111 can have various forms.
  • the recessed portion 111 can be configured as a groove structure or a through-hole structure.
  • the recessed portion 111 is configured as a groove structure.
  • the contour of the groove structure can be the same or approximately the same as the contour of the image sensor 12, so that the image sensor 12 can be well arranged in the recess, and at the same time, the gap between the image sensor 12 and the recess can be reduced, so that the camera mold The volume of group 10 is more compact.
  • the height of the image sensor 12 may be greater than, equal to, or less than the thickness of the circuit board 11 (or the depth of the groove 111). Therefore, in different situations, the top surface of the image sensor 12 may protrude beyond the concave.
  • the groove 111 is flush with the groove 111 (or the upper surface of the circuit board 11) or is located in the groove 111.
  • the height of the image sensor 12 is less than the depth of the groove 111; after the image sensor 12 is disposed in the groove 111, the bottom surface of the image sensor 12 and the groove 111 The bottom surface inside 111 is attached, and the top surface of the image sensor 12 is located in the groove 111.
  • the first welding portion 112 may be disposed on the side wall of the groove 111, and the second welding portion 121 can be arranged on the top surface of the image sensor 12, so as to reduce the distance between the first welding part 112 and the second welding part 121 as much as possible, so as to realize the welding connection of the first welding part 112 and the second welding part 121, At the same time, the amount of solder 20 used can be saved, so that the lightweight design of the camera module 10 can be realized.
  • the solder 20 may be tin-lead solder, silver solder, copper solder, etc., and the first soldering portion 112 and the second soldering portion 121 can be welded by laser spray welding, electron beam welding, etc., to achieve the image Soldering between the sensor 12 and the circuit board 11.
  • first welding portion 112 and the second welding portion 121 may be a pad structure, a bump structure or other types of structures, and the first welding portion 112 and the second welding portion 121 may be provided correspondingly There are multiple, and the placement positions of the first welding portion 112 and the second welding portion 121 may also be various.
  • the first welding portion 112 is provided with multiple, and is arranged at intervals around the edge of the groove 111; the second welding portion 121 is also provided with multiple They are arranged at intervals around the edge of the image sensor 12.
  • the second welding part 121 may also be arranged on the side of the image sensor 12; as shown in FIG. 6, in an embodiment provided in the present application, the second welding part 121 is arranged on the side of the image sensor 12. After the image sensor 12 is placed in the groove 111, the second welding part 121 is disposed opposite to the first welding part 112, so as to realize the welding of the first welding part 112 and the second welding part 121.
  • the second welding portion 121 may be provided on both the top surface and the side surface of the image sensor 12; specifically, as shown in FIG. 7, in an embodiment provided in the present application, the second welding portion 121
  • the cross section of the welding part 121 is L-shaped, that is, a part of the second welding part 121 is located on the top surface of the image sensor 12, and the other part is located on the side of the image sensor 12; when the image sensor 12 and the circuit board 11 are welded, they can be located
  • the second welding part 121 on the top surface of the image sensor 12 is welded to the first welding part 112, or the second welding part 121 on the side of the image sensor 12 can be welded to the first welding part 112; or, the second welding part 121 on the side of the image sensor 12 can be welded to the first welding part 112;
  • the second welding parts 121 on the top and side surfaces of the sensor 12 are both welded to the first welding part 112.
  • the setting positions of the first welding portion 112 and the second welding portion 121 can also be adjusted adaptively, so as to facilitate the realization of the first welding portion 112 and the second welding portion 112. Good welding of the second welding part 121.
  • the height of the image sensor 12 is greater than the depth of the groove 111; after the image sensor 12 is disposed in the groove 111, the bottom surface of the image sensor 12 and the groove 111 The bottom surface inside 111 is attached, and the top surface of the image sensor 12 protrudes from the groove 111.
  • the first welding portion 112 may be provided on the circuit board.
  • the second welding part 121 can be arranged on the top surface of the image sensor 12, so as to reduce the distance between the first welding part 112 and the second welding part 121 as much as possible, so as to realize the first welding part
  • the welding connection between 112 and the second welding part 121 can also save the amount of solder 20 used, so as to realize the lightweight design of the camera module 10.
  • the second welding part 121 is arranged on the side of the image sensor 12 to facilitate the welding of the first welding part 112 and the second welding part 121.
  • the second welding portion 121 may be provided on both the top surface and the side surface of the image sensor 12; specifically, as shown in FIG. 10, in an embodiment provided in the present application, the second welding portion 121
  • the cross section of the welding part 121 is L-shaped, that is, a part of the second welding part 121 is located on the top surface of the image sensor 12, and the other part is located on the side of the image sensor 12; when the image sensor 12 and the circuit board 11 are welded, they can be located
  • the second welding part 121 on the top surface of the image sensor 12 is welded to the first welding part 112, or the second welding part 121 on the side of the image sensor 12 can be welded to the first welding part 112; or, the second welding part 121 on the side of the image sensor 12 can be welded to the first welding part 112;
  • the second welding part 121 on the top surface and the side surface of the sensor 12 is welded to the first welding part 112 to improve the flexibility and reliability of welding the first welding part 112 and the second welding
  • the first welding The setting positions of the first welding part 112 and the second welding part 121 can also be adjusted adaptively, so as to achieve good welding of the first welding part 112 and the second welding part 121.
  • the height of the image sensor 12 is approximately the same as the depth of the groove 111; after the image sensor 12 is disposed in the groove 111, the bottom surface of the image sensor 12 and The bottom surface of the groove 111 is attached, and the top surface of the image sensor 12 is substantially flush with the upper surface of the circuit board 11.
  • the second welding portion 121 may be provided On the top surface of the image sensor 12, the distance between the first welding part 112 and the second welding part 121 is reduced as much as possible, so as to realize the welding connection of the first welding part 112 and the second welding part 121, and at the same time The use amount of the solder 20 is saved, so that the lightweight design of the camera module 10 can be realized.
  • the second welding portion 121 when the first welding portion 112 is provided on the side wall of the groove 111, the second welding portion 121 may also be provided on the side of the image sensor 12; as shown in FIG. 12, the In one embodiment, the second welding part 121 is arranged on the side of the image sensor 12 to facilitate the welding of the first welding part 112 and the second welding part 121.
  • the second welding portion 121 may be provided on both the top surface and the side surface of the image sensor 12; specifically, the cross section of the second welding portion 121 may be L-shaped, that is, the second welding portion 121 One part is located on the top surface of the image sensor 12, and the other part is located on the side surface of the image sensor 12.
  • the corresponding first welding portion 112 may also be arranged on the side wall of the groove 111 and the upper surface of the circuit board 11; specifically, the cross section of the first welding portion 112 may be L-shaped, that is, a part of the first welding portion 112 It may be located on the side wall of the groove 111, and the other part may be located on the upper surface of the circuit board 11 to improve the flexibility and reliability of the welding of the first welding portion 112 and the second welding portion 121.
  • the image sensor 12 and the circuit board 11 can be fixedly connected by an adhesive (such as acrylate glue, epoxy glue, etc.) .
  • the bottom surface of the image sensor 12 and the bottom surface in the groove 111 are bonded through an adhesive layer 30a; the side surface of the image sensor 12 and the bottom surface of the groove 111 are bonded.
  • the side walls are adhered by the adhesive layer 30b.
  • the image sensor 12 and the groove 111 may be connected only by the solder 20, or only the adhesive layer 30a is provided between the bottom surface of the image sensor 12 and the bottom surface of the groove 111. Or, only the adhesive layer 30b is provided between the side surface of the image sensor 12 and the side wall of the groove 111.
  • the recess 111 may also be configured as a through hole structure.
  • the circuit board 11 is provided with a through-passing through the first board surface (the upper board surface in the figure) and the second board surface (the lower board surface in the figure).
  • Hole 111, the image sensor 12 is arranged in the through hole 111.
  • the positional relationship between the image sensor 12 and the through hole 111 can be various.
  • the bottom surface of the image sensor 12 is located in the through hole 111, that is, the bottom surface of the image sensor 12 does not protrude from the bottom surface of the circuit board 11.
  • the top surface of the image sensor 12 may protrude from the upper surface of the circuit board 11, may also be flush with the first surface, or may be located in the through hole 111.
  • the image sensor 12 may be assisted and fixed by an additional structural member.
  • the camera module 10 further includes a backing plate 14, and the backing plate 14 is fixed on the second board surface of the circuit board 11 (ie, the lower board in the figure).
  • the bottom surface of the image sensor 12 can be attached to the surface of the backing plate 14, so that the image sensor can be lifted 12's force stability.
  • the lining board 14 may be a board with a certain degree of rigidity to have good force-receiving performance and anti-deformation performance.
  • the liner 14 may be made of metal materials (such as iron, steel, copper and alloys thereof, etc.) or ceramic materials.
  • the backing plate 14 can be attached to the lower surface of the circuit board 11 by an adhesive, or can be fixed on the circuit board 11 by other connectors (such as screws).
  • the image sensor 12 and the backing board 14 may be bonded by an adhesive to improve the stability of the connection between the image sensor 12 and the backing board 14.
  • the positional relationship between the image sensor 12 and the through hole 111 can also be adjusted adaptively according to actual requirements.
  • the bottom surface of the image sensor 12 protrudes from the bottom surface of the circuit board 11, so that when the upper space is insufficient, the image sensor 12 can occupy part of the lower surface. Space (or prevent the top surface of the image sensor 12 from protruding from the top surface of the circuit board 11).
  • an infrared filter can be set between the lens assembly 13 and the image sensor 12 15.
  • the infrared filter 15 can be directly fixed on the upper surface of the circuit board 11 to make the structure of the camera module 10 more compact; at the same time, due to the image sensor 12 and the circuit board 11 are directly soldered by a relatively strong solder 20. Therefore, the infrared filter 15 can also directly contact the solder 20 without damaging the solder 20, and therefore, the image sensor 12 and the circuit board will not be damaged.
  • the infrared filter 15 can be directly adhered to the circuit board 11 by using an additional adhesive layer 30c; in some embodiments, solder is used between the image sensor 12 and the circuit board 11
  • the adhesive layer 30c can also be used for auxiliary fixing to improve the stability of the connection between the image sensor 12 and the circuit board 11.
  • the lens assembly 13 in order to avoid the space occupation of the infrared filter 15, the lens assembly 13 may also be fixed on the circuit board 11 through a bracket 40.
  • the height of the bracket 40 may be greater than or equal to the thickness of the infrared filter 15 to prevent positional interference between the lens assembly 13 and the infrared filter 15.
  • a recess 111 can be provided on the upper surface of the circuit board 11, and then the image sensor 12 can be placed in the recess 111, and the image sensor 12 and After the relative positions of the circuit boards 11, the first welding part 112 of the circuit board 11 and the second welding part 121 of the image sensor 12 can be welded by laser spray welding, electron beam welding, etc., so as to realize the circuit board 11 and The fixed connection and electrical connection between the image sensors 12.
  • the recessed portion 111 can be formed by milling or the like.
  • the image sensor 12 can be directly placed in the recessed portion, and then the first welding portion 112 and the second welding portion 112 can be placed directly in the recessed portion.
  • the welding part 121 is welded; when the recessed part 111 has a through-hole structure, an auxiliary tool can be used to assist in positioning the relative position between the image sensor 12 and the circuit board 11, and then the first welding part 112 and the second welding part 121 Perform welding.
  • the image sensor 12 and the circuit board 11 can also be connected by an adhesive (such as acrylate glue, epoxy glue, etc.).
  • an adhesive such as acrylate glue, epoxy glue, etc.
  • the process of setting the adhesive can be performed after the first welding portion 112 and the second welding portion 121 are welded, or it can be performed after the first welding portion 112 and the second welding portion 121 are welded.
  • the welding part 121 is performed before welding.
  • the infrared filter 15 can be fixed on the upper surface of the circuit board 11 by adhesive or other connecting parts, and set corresponding to the image sensor 12, and then the lens assembly 13 is fixed on the circuit board 11; when the lens assembly 13 is fixed on the circuit board 11, the fixed connection between the lens assembly 13 and the circuit board 11 can be achieved in the form of an adhesive or other connectors.
  • the camera module provided in the embodiments of the present application can be applied to various electronic devices such as mobile phones, tablet computers, and notebook computers.
  • the camera module 10 can be set in the mobile phone as a front camera or a rear camera of the mobile phone.
  • the circuit board 11 in the camera module 10 can be an independent component, and is connected to the main board in the mobile phone through connectors and other devices; that is, the circuit board 11 can only be provided with the above-mentioned image sensor 12 and lens assembly 13 and infrared filter 15.
  • some electronic components in the mobile phone such as a graphics processor, a central processing unit, etc. may also be arranged in the circuit board 11, or the circuit board 11 and the main board of the mobile phone are integrated.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

La présente invention concerne le domaine technique des dispositifs électroniques, et concerne un module de caméra et un dispositif électronique, destinés à être utilisés pour résoudre le problème technique de l'espace d'occupation important du module de caméra. Le module de caméra fourni par des modes de réalisation de la présente invention comprend une carte de circuit imprimé, un capteur d'image et un composant de lentille. Une première surface de carte de la carte de circuit imprimé est pourvue d'une partie évidée. Des premières parties de brasage sont disposées sur le bord de la partie évidée. Le capteur d'image est disposé dans la partie évidée de façon à réduire les occupations de la carte de circuit imprimé et du capteur d'image dans l'espace vertical. Des secondes parties de brasage brasées sur les premières parties de brasage de la carte de circuit imprimé sont disposées sur le bord du capteur d'image. Après brasage des premières parties de brasage et des secondes parties de brasage, une connexion fixe et une connexion électrique entre le capteur d'image et la carte de circuit imprimé peuvent être obtenues. Le composant de lentille est disposé au-dessus du capteur d'image, et est fixé sur la première surface de carte de la carte de circuit imprimé. Après avoir été traité par le composant de lentille, la lumière externe peut être projetée sur la surface supérieure du capteur d'image pour convertir un signal optique en un signal électrique.
PCT/CN2020/102487 2019-10-17 2020-07-16 Module de caméra et dispositif électronique WO2021073182A1 (fr)

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110913097B (zh) * 2019-10-17 2021-09-17 华为技术有限公司 一种摄像模组和电子设备
CN212211129U (zh) * 2020-04-30 2020-12-22 华为技术有限公司 摄像头模组及电子设备
CN113938581A (zh) * 2020-06-29 2022-01-14 宁波舜宇光电信息有限公司 光学组件及其组装方法
CN115066092B (zh) * 2021-10-09 2023-03-24 荣耀终端有限公司 电路板组件、制造方法及电子设备
CN115348369B (zh) * 2022-06-29 2023-09-05 荣耀终端有限公司 摄像模组及电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060028573A1 (en) * 2004-08-06 2006-02-09 Byoung-Rim Seo Image sensor camera module and method of fabricating the same
CN102331612A (zh) * 2010-07-13 2012-01-25 鸿富锦精密工业（深圳）有限公司 镜头模组及使用该镜头模组的便携式电子装置
CN102569324A (zh) * 2012-02-22 2012-07-11 苏州晶方半导体科技股份有限公司 图像传感器的封装结构及封装方法
CN206743369U (zh) * 2017-04-28 2017-12-12 南昌欧菲光电技术有限公司 摄像模组及其倒装式感光组件
CN108418999A (zh) * 2017-02-10 2018-08-17 谷歌有限责任公司 摄像头模块
CN109788167A (zh) * 2017-11-10 2019-05-21 格科微电子（上海）有限公司 降低摄像头模组高度的装配方法及摄像头模组
CN110913097A (zh) * 2019-10-17 2020-03-24 华为技术有限公司 一种摄像模组和电子设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201210005A (en) * 2010-08-23 2012-03-01 Shu-Zi Chen Thinning of the image capturing module and manufacturing method thereof
TWI429279B (zh) * 2011-08-09 2014-03-01 Hon Hai Prec Ind Co Ltd 鏡頭模組
CN203406942U (zh) * 2013-07-28 2014-01-22 宁波远大成立科技股份有限公司 一种影像传感元件
US9703176B2 (en) * 2014-01-20 2017-07-11 Lg Innotek Co., Ltd. Camera module for providing operational convenience
CN206212127U (zh) * 2015-11-26 2017-05-31 三星电机株式会社 相机模块
CN205336387U (zh) * 2015-12-21 2016-06-22 宁波舜宇光电信息有限公司 打线胶封的摄像模组及感光装置
CN108124082B (zh) * 2016-11-28 2022-08-23 宁波舜宇光电信息有限公司 下沉式摄像模组和下沉式感光组件及其制造方法
CN109712939A (zh) * 2017-10-26 2019-05-03 南昌欧菲光电技术有限公司 玻璃封装芯片结构及摄像模组
CN207558777U (zh) * 2017-10-26 2018-06-29 欧菲影像技术（广州）有限公司 玻璃封装芯片结构及摄像模组
CN208874638U (zh) * 2018-10-17 2019-05-17 盐城鸿石智能科技有限公司 一种手机摄像头模组
CN109451215A (zh) * 2018-11-15 2019-03-08 维沃移动通信（杭州）有限公司 一种摄像头模组及终端

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060028573A1 (en) * 2004-08-06 2006-02-09 Byoung-Rim Seo Image sensor camera module and method of fabricating the same
CN102331612A (zh) * 2010-07-13 2012-01-25 鸿富锦精密工业（深圳）有限公司 镜头模组及使用该镜头模组的便携式电子装置
CN102569324A (zh) * 2012-02-22 2012-07-11 苏州晶方半导体科技股份有限公司 图像传感器的封装结构及封装方法
CN108418999A (zh) * 2017-02-10 2018-08-17 谷歌有限责任公司 摄像头模块
CN206743369U (zh) * 2017-04-28 2017-12-12 南昌欧菲光电技术有限公司 摄像模组及其倒装式感光组件
CN109788167A (zh) * 2017-11-10 2019-05-21 格科微电子（上海）有限公司 降低摄像头模组高度的装配方法及摄像头模组
CN110913097A (zh) * 2019-10-17 2020-03-24 华为技术有限公司 一种摄像模组和电子设备

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