WO2021068722A1 - 陶瓷结构件的制备方法、陶瓷结构件及电子设备 - Google Patents

陶瓷结构件的制备方法、陶瓷结构件及电子设备 Download PDF

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Publication number
WO2021068722A1
WO2021068722A1 PCT/CN2020/115742 CN2020115742W WO2021068722A1 WO 2021068722 A1 WO2021068722 A1 WO 2021068722A1 CN 2020115742 W CN2020115742 W CN 2020115742W WO 2021068722 A1 WO2021068722 A1 WO 2021068722A1
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WIPO (PCT)
Prior art keywords
ceramic
ceramic body
preparing
shaping
structure according
Prior art date
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PCT/CN2020/115742
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English (en)
French (fr)
Inventor
赵岩峰
邹攀
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Oppo广东移动通信有限公司
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Publication of WO2021068722A1 publication Critical patent/WO2021068722A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/003—Apparatus or processes for treating or working the shaped or preshaped articles the shaping of preshaped articles, e.g. by bending
    • B28B11/005—Using heat to allow reshaping, e.g. to soften ceramic articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/12—Apparatus or processes for treating or working the shaped or preshaped articles for removing parts of the articles by cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/24—Apparatus or processes for treating or working the shaped or preshaped articles for curing, setting or hardening
    • B28B11/243—Setting, e.g. drying, dehydrating or firing ceramic articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H04M1/185—Improving the rigidity of the casing or resistance to shocks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • C04B2235/3225—Yttrium oxide or oxide-forming salts thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3244—Zirconium oxides, zirconates, hafnium oxides, hafnates, or oxide-forming salts thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9646—Optical properties
    • C04B2235/9661—Colour

Definitions

  • the invention relates to the technical field of electronic equipment, in particular to a method for preparing ceramic structural parts, ceramic structural parts and electronic equipment.
  • Ceramic structural parts have high strength, high gloss, high fracture toughness and excellent thermal insulation properties, and are widely used in middle frames and back covers of electronic devices.
  • the mixed ceramic slurry is usually cast, dry pressed, and injection molded to obtain a ceramic blank, and then the ceramic blank is debinding, degreased, and sintered to obtain a ceramic sintered blank.
  • CNC machining to obtain curved ceramic structural parts with suitable shapes and curvatures, the obtained ceramic sintered blanks need to be reserved for more machining allowances, and more machining allowances will lead to higher processing costs and lower production efficiency.
  • a method for preparing ceramic structural parts includes the following steps:
  • the shaping mold having a shaping surface, and the shaping surface includes a curved surface;
  • the softened ceramic body is bent and adsorbed to the curved surface under the action of the air pressure difference.
  • a method for preparing ceramic structural parts includes the following steps:
  • the shaping mold having an inner cavity and a shaping surface
  • the inner cavity is evacuated to make the softened ceramic body bend and adhere to the shaping surface.
  • a ceramic structure is characterized in that it is produced by the method for preparing the ceramic structure as described above.
  • An electronic device characterized in that it comprises the ceramic structure as described above.
  • FIG. 1 is a schematic flow diagram of the steps of a method for preparing a ceramic structure provided by an embodiment
  • FIG. 2 is a schematic flow chart of the steps of a method for preparing a ceramic structure provided by an embodiment
  • Fig. 3 is a schematic flow chart of the steps of a method for preparing a ceramic body provided by an embodiment
  • Fig. 4 is a schematic structural diagram of a ceramic body placed in a shaping mold and a limiting mold according to an embodiment
  • Fig. 5 is a schematic diagram of the structure of the ceramic body in Fig. 4;
  • Fig. 6 is a schematic structural view of vacuuming the inner cavity of the shaping mold in Fig. 4 and bending the ceramic body;
  • FIG. 7 is a schematic structural diagram of an electronic device provided by an embodiment.
  • terminal equipment refers to, but is not limited to, devices that can receive and/or send communication signals connected via any one or several of the following connection methods:
  • connection methods via wired lines such as public switched telephone networks (PSTN), digital subscriber lines (Digital Subscriber Line, DSL), digital cables, and direct cable connections;
  • PSTN public switched telephone networks
  • DSL Digital Subscriber Line
  • DSL Digital Subscriber Line
  • DSL Digital Subscriber Line
  • wireless interface methods such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, AM-FM broadcast transmitters.
  • WLAN wireless local area networks
  • DVB-H digital television networks
  • satellite networks AM-FM broadcast transmitters.
  • a terminal device that is set to communicate through a wireless interface may be referred to as a "mobile terminal.”
  • mobile terminals include but are not limited to the following electronic devices:
  • Satellite phone or cellular phone (1) Satellite phone or cellular phone
  • PCS Personal Communications System
  • a method for preparing a ceramic structural member 100 is provided. Please refer to FIG. 1 to FIG. 3, which includes the following steps:
  • the shaping mold 200 is obtained.
  • the shaping mold 200 has a shaping surface 210.
  • the shaping surface 210 includes a flat surface 211 and a curved surface 212, and the curved surface 212 is smoothly connected to the edge of the flat surface 211. It can be understood that, in other embodiments, the shaping surface 210 may be a complete curved surface.
  • the shaping mold 200 has an inner cavity 201
  • the shaping surface 210 is provided with a plurality of air holes 2101 communicating with the inner cavity 201
  • the air holes 2101 are evenly distributed on the curved surface 212 of the shaping surface 210.
  • the air holes 2101 may also be evenly distributed on the plane 211 of the shaping surface 210.
  • the inner cavity 201 may communicate with an external vacuuming device (for example, a vacuum pump) through an air pumping channel 202.
  • the plastic mold 200 can be made of a material with a thermal expansion coefficient similar to that of the ceramic body 300.
  • the plastic mold 200 can be made of graphite with high temperature resistance.
  • the plastic mold 200 has a thermal expansion coefficient similar to that of the ceramic body 300.
  • the material may also include at least one of aluminum oxide, silicon nitride, boron nitride, and boron carbide.
  • the porosity of the shaping surface 210 of the shaping mold 200 may be 12%-18%.
  • Step S22 Obtain a ceramic blank 300.
  • the ceramic blank 300 may be a flat panel, and the ceramic blank 300 may also be a curved panel that needs further processing, which is not limited herein.
  • the ceramic body 300 is placed on the shaping surface 210.
  • the ceramic body 300 is attached to the plane 211 of the shaping surface 210, and the edge of the ceramic body 300 is opposite to the curved surface 212 of the shaping surface 210.
  • the ceramic body 300 is fixed to the curved surface 210.
  • the step of obtaining the ceramic body 100 may include the following steps:
  • step S221 the ceramic raw material powder is mixed with the dispersant and the binder to obtain a ceramic slurry.
  • the mixing process can be carried out in a ball mill, the temperature of the ball mill is controlled below 30°C, and the time of the ball mill is controlled between 45h-58h.
  • the ceramic raw material powder is a white ceramic raw material powder
  • the white ceramic raw material powder is mixed with a dispersant and a binder to obtain a white ceramic slurry.
  • the white ceramic raw material powder includes the following components by mass percentage: 0-0.25% alumina, 1-5% yttrium oxide, and the balance of zirconium oxide containing hafnium oxide and other trace impurities.
  • the dispersant includes at least one of polyacrylic acid, polyethylene glycol, and glycerin.
  • the binder includes at least one of polyvinyl butyral (PVB), dioctyl phthalate (DOP), and dibutyl phthalate (DBP).
  • the particle size of the white ceramic raw material powder may be 0.0001 mm to 0.02 mm, and the mass ratio of the white ceramic raw material powder to the dispersant and the binder is 50:3:1.
  • the ceramic raw material powder is a colored ceramic raw material powder
  • the colored ceramic raw material powder is mixed with a dispersant and a binder to obtain a colored ceramic slurry.
  • the color ceramic raw material powder includes the following components in mass percentages: 90-99% zirconia, 1-5% yttria, 0.1-3% alumina, and 0.8-8% colorant.
  • the coloring agent is used to color white zirconium oxide.
  • the coloring agent can include erbium trioxide, neodymium trioxide, praseodymium trioxide, cerium oxide, iron trioxide, chromium trioxide, manganese trioxide, zinc oxide A combination of one or more of, magnesium, silicon, calcium, cobalt, nickel, copper, vanadium, cadmium and tin.
  • the dispersant includes at least one of polyacrylic acid, polyethylene glycol, and glycerin.
  • the binder includes at least one of polyvinyl butyral (PVB), dioctyl phthalate (DOP), and dibutyl phthalate (DBP).
  • the particle size of the colored ceramic raw material powder may be 0.0001 mm to 0.02 mm, and the mass ratio of the colored ceramic raw material powder to the dispersant and the binder is 50:3:1.
  • step S222 the mixed ceramic slurry is cast and stamped to obtain a ceramic green body.
  • the ceramic slurry obtained by mixing needs to be vacuum defoamed before casting.
  • the vacuum defoaming process can be carried out in a vacuum sealed stirring tank.
  • the following operating parameters can be selected for the vacuum defoaming process of the ceramic slurry: the vacuum degree is negative 0.1Mpa-minus 0.9Mpa, the stirring speed is 80r/min-120r/min, and the stirring time is 15min-30min.
  • the ceramic slurry that has been defoamed is placed in a casting machine for casting. Adjusting the casting process parameters can produce 0.2mm-1.2mm casting blanks.
  • the produced cast body can be placed in a stamping die for stamping. It is also called cutting in the stamping industry.
  • the purpose of stamping/cutting is to prepare ceramic green bodies of appropriate size to match the laminate. And the use of isostatic pressure.
  • the cutting machine used in the process is a device that cuts the dried cast green sheet, and the size of the cut sheet can be determined according to the size of the ceramic structure 100 to be prepared and the sintering shrinkage rate during the subsequent sintering of the ceramic green body. determine.
  • Step S223 debinding and degreasing the ceramic green body to remove organic components.
  • the debinding and degreasing temperature is controlled at 300° C.-900° C., and the time is controlled within 0.5-4 h. After debinding and degreasing, the sample has no problems such as distortion, cracking, and discoloration.
  • Step S224 sintering the debinding and debinding ceramic green body at a sintering temperature of 1300° C.-1550° C. to obtain a ceramic sintered body.
  • the ceramic green body can be placed in a reducing or oxidizing or inert atmosphere for sintering.
  • step S225 CNC machining is performed on the ceramic sintered body to obtain the ceramic body 300.
  • the thickness of the ceramic sintered body that needs to be controlled to be 0.4 mm, and the excess 0.1 mm can be smoothed and removed by CNC machining.
  • the corners of the ceramic sintered compact are CNC processed at the same time to form the notch 301 to obtain the ceramic body 300 with the notch 301.
  • the shape and size of the notch 301 are not limited here.
  • the depth of the notch 301 can be controlled to be 0.1 mm-1.5 mm, and the depth can be understood as the distance from the edge of the ceramic body 300 toward the inner side of the ceramic body 300. In this way, the arrangement of the notch 301 can avoid the risk of wrinkles and warping in the corners of the ceramic body 300 during the subsequent hot bending process, and improve the hot bending yield of the ceramic body 300.
  • a limit mold 400 is obtained.
  • the limiting mold 400 is provided with a receiving groove 410, and the groove surface 411 of the receiving groove 410 has the same shape as the shaping surface 210.
  • the groove surface 411 of the accommodating groove 410 is opposite to the shaping surface 210, and the ceramic body 300 is accommodated in the accommodating groove 410.
  • one of the limiting mold 400 and the shaping mold 200 is provided with a protrusion 203, and the other is provided with a positioning groove 403, and the groove surface 411 of the accommodating groove 410 is opposite to the shaping surface 210.
  • the protrusion 203 is embedded in the positioning groove 410.
  • the limit mold 400 does not actually contact the ceramic body 300, and the limit mold 400 only serves as a limit for the ceramic body 300 during the hot bending process, so as to avoid The ceramic body 300 is separated from the shaping surface 210.
  • the plastic mold 200 can be made of a material with a thermal expansion coefficient close to that of the ceramic body 300.
  • the plastic mold 200 can be made of graphite with high temperature resistance.
  • the plastic mold 200 can also be made of graphite. It can be selected to include at least one of aluminum oxide, silicon nitride, boron nitride, and boron carbide. It can be understood that in other embodiments, step S23 may be omitted.
  • step S24 the ceramic body 300 is heated to soften the ceramic body 300.
  • the shaping mold 200, the limiting mold 400, and the ceramic body 300 are placed in an inert atmosphere for heating.
  • the heating time can be controlled to increase to 1450°C for 6 hours, and the temperature can be maintained for 10 hours, and then the temperature can be cooled down for 14 hours.
  • Step S25 referring to FIG. 6, the softened ceramic body 300 is bent under the action of the air pressure difference and adsorbed on the curved surface 212 of the shaping surface 210, so that the ceramic structure 100 with the required curved surface shape can be prepared.
  • the shape of the shaping surface 210 is adapted to the curved shape of the ceramic structure 100 to be prepared.
  • the edge of the softened ceramic body 300 is bent and absorbed on the curved surface 212 of the shaping surface 210 under the action of the air pressure difference.
  • the inner cavity 201 of the shaping mold 200 can be evacuated, so that the softened ceramic body 300 bends and is adsorbed on the curved surface 212 under the adsorption action of the pores 2101.
  • the airflow direction during the vacuuming process can refer to the direction indicated by the dashed arrow in Figure 6, and the following parameters need to be controlled for vacuuming: the vacuuming time is 60s-90s, and the vacuum degree is 0.01Mpa-0.1Mpa.
  • the air pressure on the side of the ceramic body 300 away from the shaping mold 200 can also be increased to make the edge of the ceramic body 300 bend and adsorb to the curved surface 212 of the shaping surface 210.
  • step S25 since the pressure difference between the upper and lower surfaces of the ceramic body 300 is formed, the ceramic body 300 in a high temperature state can conform to the shaping surface 210 of the shaping mold 200 and be molded into the required shape, and the limit mold 400 It mainly plays a limiting role. Since the limiting mold 400 is not subjected to external pressure during the molding process, the mold print produced by the limiting mold 400 restricting the shape of the ceramic body 300 during the molding process is relatively light, which solves the problem of the adoption of related technologies. Hot press molding is used to produce a mold print on the surface of the ceramic body 300, which is difficult to be polished and removed.
  • CNC cutting is performed on the margin of the curved edge of the ceramic body 300 to eliminate the gap 301 (for example, a full circle of the edge of the ceramic body 300 including the notch 301 can be cut off, and the other part of the edge of the ceramic body 300 after being bent is retained), so as to obtain the ceramic structure 100 with the required curved surface shape.
  • the ceramic structural part 100 produced after the gap 301 is eliminated can continue to undergo subsequent processing processes, such as polishing, PVD electroplating Log logo, etc., to meet the needs of appearance use.
  • the ceramic body 300 softened by heating can be directly bent and formed into the required curved shape under the action of the air pressure difference, that is, the curved ceramic structure 100 of the required shape is obtained.
  • the ceramic body 300 of the present invention does not need to reserve too much machining allowance before the hot bending forming, which can greatly reduce the processing cost and improve the production efficiency.
  • the related technology uses the ceramic body after the mold is hot-pressed and heated and softened. However, the ceramic body will produce a mold mark when it is pressed by the mold. When the mold mark is severe, it is difficult to remove by polishing.
  • the present invention uses a pressure difference method. Bending the ceramic body 300 after being softened by heating can avoid or reduce the risk of mold marks on the surface of the ceramic body 300.
  • a ceramic structural member 10 prepared by the foregoing method for preparing the ceramic structural member 10 is provided. Therefore, the ceramic structural member 10 has all the features and advantages of the ceramic structural member 10 prepared by the method for preparing the ceramic structural member 10, and will not be repeated here.
  • an electronic device 10 is provided. As shown in FIG. 7, the electronic device 10 includes the above-mentioned ceramic structure 100, and the ceramic structure 100 is the middle frame of the electronic device 10. In other embodiments, the ceramic structure 100 may also include one of a back cover and a button. The ceramic structure 100 may also be an integrally formed structure of a ceramic middle frame and a ceramic back cover. Of course, the ceramic structure 100 may also be other components of the electronic device 10, and the structure of the ceramic structure 100 will not be repeated here.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Signal Processing (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Inorganic Chemistry (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

一种陶瓷结构件(100)的制备方法，包括如下步骤：获取塑形模具(200)，塑形模具(200)具有塑形面(210)，塑形面(210)包括曲面(212)；获取陶瓷坯体(300)，将陶瓷坯体(300)放置于塑形面(210)；加热陶瓷坯体(300)，以软化陶瓷坯体(300)；使软化后的陶瓷坯体(300)在气压差的作用下弯曲并吸附于曲面(212)。

Description

陶瓷结构件的制备方法、陶瓷结构件及电子设备 技术领域
本发明涉及电子设备技术领域，特别是涉及一种陶瓷结构件的制备方法、陶瓷结构件及电子设备。
背景技术
陶瓷结构件具有高强度、高光泽、高断裂韧性以及优异的隔热性能而被广泛应用于电子设备的中框和后盖。为了制备陶瓷结构件，通常将混合后的陶瓷浆料经流延、干压、注塑而获得陶瓷毛坯，再将陶瓷毛坯进行排胶、脱脂、烧结而获得陶瓷烧结坯，其中，为了后续能够通过CNC加工得到合适形状和曲率的曲面陶瓷结构件，所获得的陶瓷烧结坯需要预留较多的加工余量，较多的加工余量将导致较高的加工成本以及较低的生产效率。
发明内容
基于此，有必要提供一种陶瓷结构件的制备方法、陶瓷结构件及电子设备。
一种陶瓷结构件的制备方法，包括如下步骤：
获取塑形模具，所述塑形模具具有塑形面，所述塑形面包括曲面；
获取陶瓷坯体，将所述陶瓷坯体放置于所述塑形面；
加热所述陶瓷坯体，以软化所述陶瓷坯体；以及
使软化后的所述陶瓷坯体在气压差的作用下弯曲并吸附于所述曲面。
一种陶瓷结构件的制备方法，包括如下步骤：
提供塑形模具，所述塑形模具具有内腔及塑形面；
提供陶瓷坯体，将所述陶瓷坯体放置于所述内腔；
加热所述陶瓷坯体，以软化所述陶瓷坯体；以及
对所述内腔抽真空，以使软化后的所述陶瓷坯体弯曲并贴合于所述塑形面。
一种陶瓷结构件，其特征在于，采用如上所述的陶瓷结构件的制备方法制得。
一种电子设备，其特征在于，包括如上所述的陶瓷结构件。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他实施例的附图。
图1为一实施例提供的陶瓷结构件的制备方法的步骤流程示意图；
图2为一实施例提供的陶瓷结构件的制备方法的步骤流程示意图；
图3为一实施例提供的陶瓷坯体的制备方法的步骤流程示意图；
图4为一实施例提供的陶瓷坯体放置于塑形模具和限位模具的结构示意图；
图5为图4中陶瓷坯体的结构示意图；
图6为对图4中塑形模具的内腔抽真空并使陶瓷坯体弯曲的结构示意图；
图7为一实施例提供的电子设备的结构示意图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
作为在此使用的“终端设备”指包括但不限于经由以下任意一种或者数种连接方式连接的能够接收和/或发送通信信号的装置：
(1)经由有线线路连接方式，如经由公共交换电话网络(Public Switched Telephone Networks，PSTN)、数字用户线路(Digital Subscriber Line，DSL)、数字电缆、直接电缆连接；
(2)经由无线接口方式，如蜂窝网络、无线局域网(Wireless Local Area Network，WLAN)、诸如DVB-H网络的数字电视网络、卫星网络、AM-FM广播发送器。
被设置成通过无线接口通信的终端设备可以被称为“移动终端”。移动终端的示例包括但不限于以下电子装置：
(1)卫星电话或蜂窝电话；
(2)可以组合蜂窝无线电电话与数据处理、传真以及数据通信能力的个人通信系统(Personal Communications System,PCS)终端；
(3)无线电电话、寻呼机、因特网/内联网接入、Web浏览器、记事簿、日历、配备有全球定位系统(Global Positioning System，GPS)接收器的个人数字助理(Personal Digital Assistant，PDA)；
(4)常规膝上型和/或掌上型接收器；
(5)常规膝上型和/或掌上型无线电电话收发器等。
本发明的一方面，提供一种陶瓷结构件100的制备方法，请参考图1至图3所示，包括如下步骤：
步骤S21，获取塑形模具200。参考图4所示，塑形模具200具有塑形面210。在一实施例中，塑形面210包括平面211和曲面212，曲面212与平面211的边缘平滑连接。可以理解，在其它实施例中，塑形面210可以为一完整的曲面。
在一实施例中，塑形模具200具有内腔201，塑形面210开设有与内腔201连通的多个气孔2101，气孔2101均匀分布在塑形面210的曲面212。可以理解，在其它实施例中，气孔2101还可以均匀分布在塑形面210的平面211。其中，内腔201可以通过抽气通道202与外界抽真空装置(例如真空泵)连通。
在一实施例中，塑形模具200可以选择热膨胀系数与陶瓷坯体300的热膨胀系数相接近的材质，例如塑形模具200的材质可以选择具有耐高温性质的石墨，当然，塑形模具200的材质也可以包括氧化铝、氮化硅、氮化硼、碳化硼中的至少一种。另外，塑形模具200的塑形面210的气孔率可以为12％-18％。
步骤S22，获取陶瓷坯体300，陶瓷坯体300可以为平板状的面板，陶瓷坯体300也可以为需要进一步加工的弯曲的面板，在此不作限定。将陶瓷坯体300放置于塑形面210。在一实施例中，使得陶瓷坯体300贴设于塑形面210的平面211，并使得陶瓷坯体300的边缘与塑形面210的曲面212相对。在一实施例中，当塑形面210为一完整的曲面时，使得陶瓷坯体300固定于该曲面210。
在一实施例中，获取陶瓷坯体100的步骤可以包括如下步骤：
步骤S221，将陶瓷原料粉末与分散剂和粘结剂混合，得到陶瓷浆料。混合过程可以在球磨机中进行，球磨温度控制在30℃以下，球磨时间控制在45h-58h。
在一实施例中，陶瓷原料粉末为白色陶瓷原料粉末，将白色陶瓷原料粉末与分散剂和粘结剂混合，以得到白色陶瓷浆料。其中，白色陶瓷原料粉末包括以下质量百分数的成分：0-0.25％氧化铝、1-5％氧化钇以及余量含有氧化铪的氧化锆和其它微量杂质。分散剂包括聚丙烯酸、聚乙二醇和甘油中的至少一种。粘结剂包括聚乙烯醇缩丁醛(PVB)、邻苯二甲酸二辛酯(DOP)、邻苯二甲酸二丁酯(DBP)中的至少一种。在一实施例中，白色陶瓷原料粉末的粒度可为0.0001mm-0.02mm，白色陶瓷原料粉末与分散剂和粘结剂的质量比值为50:3:1。
在一实施例中，陶瓷原料粉末为彩色陶瓷原料粉末，将彩色陶瓷原料粉末与分散剂和粘结剂混合，以得到彩色陶瓷浆料。其中，彩色陶瓷原料粉末包括以下质量百分数的成分：90～99％氧化锆、1～5％氧化钇、0.1～3％氧化铝、0.8～8％着色剂。着色剂用于对白色氧化锆进行着色，着色剂可以包 括三氧化二铒、三氧化二钕、三氧化二镨、氧化铈、三氧化二铁、三氧化二铬、三氧化二锰、氧化锌、镁、硅、钙、钴、镍、铜、钒、镉和锡等中的一种或多种的组合。分散剂包括聚丙烯酸、聚乙二醇和甘油中的至少一种。粘结剂包括聚乙烯醇缩丁醛(PVB)、邻苯二甲酸二辛酯(DOP)、邻苯二甲酸二丁酯(DBP)中的至少一种。在一实施例中，彩色陶瓷原料粉末的粒度可为0.0001mm-0.02mm，彩色陶瓷原料粉末与分散剂和粘结剂的质量比值为50:3:1。
步骤S222，混合得到的陶瓷浆料经过流延、冲压成型，得到陶瓷生坯。
混合得到的陶瓷浆料在流延成型之前需要进行真空除泡处理，真空除泡过程可以在真空密封搅拌罐中进行，陶瓷浆料进行真空除泡的过程可以选择如下操作参数：真空度为负0.1Mpa-负0.9Mpa，搅拌速度为80r/min-120r/min，搅拌时间为15min-30min。待真空除泡完成后，将除泡完成的陶瓷浆料放置在流延机中进行流延成型。调节流延工艺参数，可以制得0.2mm-1.2mm的流延坯体。
为了得到陶瓷生坯，可以将制得的流延坯体放置于冲压模具中进行冲压成型，冲压成型行业内也叫做裁剪，冲压成型/裁剪的目的是制备合适尺寸的陶瓷生坯以匹配叠层和等静压的使用。其中，该工艺所使用的裁片机是将干燥后的流延生片裁切的设备，裁片尺寸可以根据所需要制备的陶瓷结构件100的尺寸及后续陶瓷生坯烧结时的烧结收缩率进行确定。
步骤S223，对陶瓷生坯进行排胶脱脂，以去除有机成分。在一实施例中，排胶脱脂温度控制在300℃-900℃，时间控制在0.5-4h，排胶脱脂后，样品无扭曲变形、无开裂、无异色等问题。
步骤S224，烧结排胶脱脂后的陶瓷生坯，烧结温度为1300℃-1550℃，得到陶瓷烧结坯。其中，陶瓷生坯可以被置于还原性或氧化或惰性气氛中进行烧结。
步骤S225，对陶瓷烧结坯进行CNC加工，以得到陶瓷坯体300。在一实施例中，以制备均匀厚度为0.3mm的陶瓷坯体为例，需控制制得的陶瓷烧结 坯的厚度为0.4mm，多余的0.1mm余量可以通过CNC加工进行磨平切除。
在一实施例中，在对陶瓷烧结坯进行CNC加工的过程中，参考图5所示，同时对陶瓷烧结坯的边角进行CNC加工并形成缺口301，得到具有缺口301的陶瓷坯体300，缺口301的形状和尺寸在此不作任何限定。在一实施例中，可以控制缺口301的深度为0.1mm-1.5mm，深度可以理解为陶瓷坯体300的边缘朝向陶瓷坯体300内侧的距离。如此，缺口301的设置可以避免后续陶瓷坯体300在进行热弯过程中边角产生褶皱和翘曲的风险，提升陶瓷坯体300热弯良品率。
步骤S23，获取限位模具400。参考图4所示，限位模具400开设有容置槽410，容置槽410的槽面411与塑形面210的形状相同。使容置槽410的槽面411与塑形面210相对，并使得陶瓷坯体300容置于容置槽410内。在一实施例中，限位模具400和塑形模具200中的一者设置有凸起203，另一者设置有定位槽403，在使容置槽410的槽面411与塑形面210相对的步骤中，使凸起203内嵌于定位槽410内。需要说明的是，在后续陶瓷坯体300热弯过程中，限位模具400不与陶瓷坯体300实际接触，限位模具400仅对热弯过程的陶瓷坯体300起到限位作用，避免陶瓷坯体300脱离于塑形面210。
在一实施例中，塑形模具200可以选择热膨胀系数与陶瓷坯体300的热膨胀系数相接近的材质，例如塑形模具200的材质可以选择具有耐高温性质的石墨，塑形模具200的材质也可以选择包括氧化铝、氮化硅、氮化硼、碳化硼中的至少一种。可以理解，在其它实施例中，步骤S23可以省略。
步骤S24，加热陶瓷坯体300，以软化陶瓷坯体300。在一实施例中，将塑形模具200、限位模具400以及陶瓷坯体300置于惰性气氛中进行加热。例如，可以控制加热时间6h升温至1450℃，并维持该温度10h，然后经14h降温冷却。
步骤S25，参考图6所示，使软化后的陶瓷坯体300在气压差的作用下弯曲并吸附于塑形面210的曲面212上，从而能够制备得到所需要曲面形状的陶瓷结构件100，塑形面210的形状与所需要制备的陶瓷结构件100的弯 曲形状相适应。在一实施例中，使软化后的陶瓷坯体300的边缘在气压差的作用下弯曲并吸附于塑形面210的曲面212。例如，可以对塑形模具200的内腔201抽真空，以使软化后的陶瓷坯体300在气孔2101的吸附作用下产生弯曲并吸附于曲面212。其中，抽真空过程中的气流方向可以参考图6中虚线箭头所指示的方向，抽真空需要控制如下参数：抽真空时间为60s-90s，真空度为0.01Mpa-0.1Mpa。在其它实施例中，也可以通过增加陶瓷坯体300远离塑形模具200一侧的气压来使陶瓷坯体300的边缘弯曲并吸附于塑形面210的曲面212。
在步骤S25中，由于陶瓷坯体300上下表面形成压强差，所以在高温状态下的陶瓷坯体300能够顺应塑形模具200的塑形面210，成型为所需要的形状，而限位模具400主要起到限位作用，由于成型过程中限位模具400没有受到外界的压力，因此成型过程中由于限位模具400限制陶瓷坯体300的外形而产生的模具印比较轻，解决了相关技术通过采用热压成型而在陶瓷坯体300的表面产生模具印而难以抛光去除的问题。
在一实施例中，在使软化后的陶瓷坯体300在气压差的作用下弯曲并吸附于曲面212的步骤之后，对陶瓷坯体300弯曲后的边缘余量进行CNC切削加工，以消除缺口301(例如可以切除陶瓷坯体300的边缘包括缺口301的一整圈，而保留陶瓷坯体300的边缘弯曲后的另一部分)，从而得到所需要曲面形状的陶瓷结构件100。消除缺口301后制得的陶瓷结构件100可以继续进行后续处理工艺，例如抛光、PVD电镀Log标识等，以满足外观使用需求。
在本发明的陶瓷结构件100的制备方法中，受热软化后的陶瓷坯体300在气压差的作用下能够直接热弯成型为所需要的曲面形状，即获得所需要形状的曲面陶瓷结构件100，相对比通过CNC加工陶瓷坯体而获得曲面陶瓷结构件而言，本发明陶瓷坯体300在热弯成型前不需要预留过多的加工余量，能够极大减少加工成本并提高生产效率。另外，相关技术采用模具热压受热软化后的陶瓷坯体，然而陶瓷坯体在受到模具的挤压时会产生模具印，模具印严重时通过抛光也难以去除，而本发明采用气压差的方式使受热软化后的 陶瓷坯体300产生弯曲可以避免或者减轻陶瓷坯体300的表面生成模具印的风险。
本发明的再一方面，提供一种利用前面的陶瓷结构件10的制备方法制备得到的陶瓷结构件10。因此，该陶瓷结构件10具有前面的陶瓷结构件10的制备方法制备的陶瓷结构件10所具有的全部特征及优点，在此不再赘述。
本发明的又一方面，提供一种电子设备10，如图7所示，该电子设备10包括上述的陶瓷结构件100，该陶瓷结构件100为电子设备10的中框。在其它实施例中，陶瓷结构件100还可以包括后盖、按键中的一种。陶瓷结构件100还可以是陶瓷中框和陶瓷后盖一体成型结构。当然，陶瓷结构件100还可以是电子设备10的其他部件，对于陶瓷结构件100的结构形式，在此不再赘述。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (20)

  1. 一种陶瓷结构件的制备方法，包括如下步骤：
    获取塑形模具，所述塑形模具具有塑形面，所述塑形面包括曲面；
    获取陶瓷坯体，将所述陶瓷坯体放置于所述塑形面；
    加热所述陶瓷坯体，以软化所述陶瓷坯体；以及
    使软化后的所述陶瓷坯体在气压差的作用下弯曲并吸附于所述曲面。
  2. 根据权利要求1所述的陶瓷结构件的制备方法，其特征在于，所述塑形面包括平面，所述曲面与所述平面的边缘连接；在将所述陶瓷坯体放置于所述塑形面的步骤中，使所述陶瓷坯体贴设于所述平面，并使所述陶瓷坯体的边缘与所述曲面相对；在使软化后的所述陶瓷坯体在气压差的作用下弯曲并吸附于所述曲面的步骤中，使软化后的所述陶瓷坯体的边缘在气压差的作用下弯曲并吸附于所述曲面。
  3. 根据权利要求1所述的陶瓷结构件的制备方法，其特征在于，所述塑形模具具有内腔，所述塑形面开设有与所述内腔连通的气孔，所述使软化后的所述陶瓷坯体在气压差的作用下弯曲并吸附于所述曲面的步骤包括：
    对所述内腔抽真空，以使软化后的所述陶瓷坯体在所述气孔的吸附作用下产生弯曲并吸附于所述曲面。
  4. 根据权利要求1所述的陶瓷结构件的制备方法，其特征在于，所述获取陶瓷坯体，包括如下步骤：
    将陶瓷原料粉末与分散剂和粘结剂混合，得到陶瓷浆料；
    所述陶瓷浆料经过流延、冲压成型，得到陶瓷生坯；
    对所述陶瓷生坯进行排胶脱脂，以去除有机成分；
    烧结排胶脱脂后的陶瓷生坯，烧结温度为1300℃-1550℃，得到陶瓷烧结坯；
    对所述陶瓷烧结坯进行CNC加工，以得到所述陶瓷坯体。
  5. 根据权利要求4所述的陶瓷结构件的制备方法，其特征在于，所述将陶瓷原料粉末与分散剂和粘结剂进行混合，得到陶瓷浆料的步骤包括：
    将白色陶瓷原料粉末与分散剂和粘结剂混合，以得到白色陶瓷浆料，其中，所述白色陶瓷原料粉末包括以下质量百分数的成分：0-0.25％氧化铝、1-5％氧化钇以及余量含有氧化铪的氧化锆。
  6. 根据权利要求4所述的陶瓷结构件的制备方法，其特征在于，所述将陶瓷原料粉末与分散剂和粘结剂进行混合，得到陶瓷浆料的步骤包括：
    将彩色陶瓷原料粉末与分散剂和粘结剂混合，以得到彩色陶瓷浆料，其中，所述彩色陶瓷原料粉末包括以下质量百分数的成分：90～99％氧化锆、1～5％氧化钇、0.1～3％氧化铝、0.8～8％着色剂。
  7. 根据权利要求4所述的陶瓷结构件的制备方法，其特征在于，在对所述陶瓷烧结坯进行CNC加工，以得到所述陶瓷坯体的步骤中，对所述陶瓷烧结坯的边角进行CNC加工并形成缺口；在使软化后的所述陶瓷坯体在气压差的作用下弯曲并吸附于所述曲面的步骤中，使软化后的所述陶瓷坯体的边缘在气压差的作用下弯曲并吸附于所述曲面。
  8. 根据权利要求7所述的陶瓷结构件的制备方法，其特征在于，在使软化后的所述陶瓷坯体在气压差的作用下弯曲并吸附于所述曲面的步骤之后，对所述陶瓷烧结坯弯曲后的边缘余量进行CNC切削加工，以消除所述缺口。
  9. 根据权利要求1所述的陶瓷结构件的制备方法，其特征在于，在将所述陶瓷坯体放置于所述塑形面的步骤之后，且在加热所述陶瓷坯体的步骤之前，所述陶瓷结构件的制备方法还包括如下步骤：
    获取限位模具，所述限位模具开设有容置槽，所述容置槽的槽面与所述塑形面的形状相同，使所述容置槽的槽面与所述塑形面相对，并使所述陶瓷坯体容置于所述容置槽内。
  10. 根据权利要求9所述的陶瓷结构件的制备方法，其特征在于，所述限位模具和所述塑形模具中的一者设置有凸起，另一者设置有定位槽，在使所述容置槽的槽面与所述塑形面相对的步骤中，使所述凸起内嵌于所述定位槽内。
  11. 根据权利要求9所述的陶瓷结构件的制备方法，其特征在于，所述 塑形模具和所述限位模具的材质皆包括石墨、或者氧化铝、氮化硅、氮化硼、碳化硼中的至少一种；在加热所述陶瓷坯体，以软化所述陶瓷坯体的步骤中，将所述塑形模具、所述限位模具以及所述陶瓷坯体置于惰性气氛中进行加热。
  12. 一种陶瓷结构件的制备方法，包括如下步骤：
    提供塑形模具，所述塑形模具具有内腔及塑形面；
    提供陶瓷坯体，将所述陶瓷坯体放置于所述内腔；
    加热所述陶瓷坯体，以软化所述陶瓷坯体；以及
    对所述内腔抽真空，以使软化后的所述陶瓷坯体弯曲并贴合于所述塑形面。
  13. 根据权利要求12所述的陶瓷结构件的制备方法，其特征在于，所述塑形面开设有多个间隔设置的气孔，所述气孔用于连通抽真空装置。
  14. 根据权利要求13所述的陶瓷结构件的制备方法，其特征在于，多个所述气孔均匀分布于所述塑形面。
  15. 根据权利要求12所述的陶瓷结构件的制备方法，其特征在于，所述提供陶瓷坯体的步骤包括：
    将陶瓷原料粉末、分散剂和粘结剂混合，得到陶瓷浆料；
    所述陶瓷浆料经过流延、冲压成型，得到陶瓷生坯；
    对所述陶瓷生坯进行排胶脱脂后，烧结排胶脱脂后的所述陶瓷生坯，得到陶瓷烧结坯；
    CNC加工所述陶瓷烧结坯，以获得所述陶瓷坯体。
  16. 根据权利要求15所述的陶瓷结构件的制备方法，其特征在于，所述陶瓷坯体的边缘形成有缺口。
  17. 根据权利要求16所述的陶瓷结构件的制备方法，其特征在于，在对所述内腔抽真空，以使软化后的所述陶瓷坯体弯曲并贴合于所述塑形面的步骤之后，还包括：
    对弯曲后所述陶瓷坯体的边缘进行CNC切削加工，以消除所述缺口。
  18. 一种陶瓷结构件，其特征在于，采用如权利要求1至17中任意一项 所述的陶瓷结构件的制备方法制得。
  19. 一种电子设备，其特征在于，包括如权利要求18所述的陶瓷结构件。
  20. 根据权利要求19所述的电子设备，其特征在于，所述陶瓷结构件包括中框、后盖、按键中的一种，或者，所述陶瓷结构件为陶瓷中框和陶瓷后盖一体成型结构。
PCT/CN2020/115742 2019-10-11 2020-09-17 陶瓷结构件的制备方法、陶瓷结构件及电子设备 WO2021068722A1 (zh)

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