CN107433672A - 移动通信设备外壳的制备方法 - Google Patents
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Abstract
本发明提供一种移动通信设备外壳的制备方法,采用的是烧结和热弯一体化的方式,减少了工序,这样对应地避免单独烧结造成变形的风险,大大提高产品的良率,从而降低生产成本;同时由于在烧结过程中加了一定的压力,最终做出的产品致密度、断裂韧性、抗弯强度等性能较好。
Description
技术领域
本发明涉及陶瓷产品领域,尤其涉及一种移动通信设备外壳的制备方法。
背景技术
随着手机移动网络的不断发展,现有的4g技术已经不能满足高速信息传输的需求,而5g技术对于手机天线的设计以及外壳的材质提出了更严格的要求。目前成熟应用的金属机壳加纳米注塑的工艺已经无法满足5g信号要求,玻璃虽然有良好的信号穿透能力,但玻璃强度偏低,跌落容易碎裂。因此陶瓷成为了目前最具应用前景的下一代机壳材料。
目前针对陶瓷手机壳的制备,普遍采用的是CNC(数控机床)直接加工和干压预成型后再CNC加工两种方案,CNC直接加工方法是将一陶瓷厚板通过CNC加工的方式直接加工成手机壳;而对于先干压预成型后再CNC加工的方案,是将生坯或者预烧结体通过CNC的方式加工成带有一定余量的手机壳,然后进行烧结,最终对烧结体进行CNC精加工。对于CNC直接加工的方案,由于是直接用一块厚板去加工成手机壳,其材料成本、加工成本较高,且加工效率低,市场采用此方案的较少;对于先干压预成型后再CNC加工的方案,由于其烧结过程中变形较大,良率较低,产品一致性较低,同时仍需CNC再次加工,其加工效率仍然普遍较低,成本也较高。同时这两种方法都涉及到烧结,这样就会增加烧结过程中产品变形的风险,从而良率较低。
因此,有必要提供一种新的移动通信设备外壳的制备方法以解决上述问题。
发明内容
本发明需要解决的技术问题是提供一种通信设备外壳制备方法,以解决现有方法加工效率低,良率低,容易变形的问题。
为解决上述技术问题,本发明提供了一种移动通信设备外壳的制备方法,包括如下步骤:
步骤S1:将氧化锆陶瓷粉料与溶剂、粘接剂混合形成混合浆料;
步骤S2:所述混合浆料通过流延成型的方式得到单层的基础膜带,通过叠层和等静压的方式在所述基础膜带上制备至少一层叠加膜带;
步骤S3:通过脱脂和预烧结得到预成型坯体;
步骤S4:将所述预成型坯体放置到预设的移动通信设备外壳模具中,在升降温过程中采用加压方式进行热弯和烧结,以使得所述预成型坯体得到与移动通信设备外壳模具形状一致的致密陶瓷结构的移动通信设备外壳。
优选的,所述预设的移动通信设备外壳模具采用石墨、碳化硅或复合材料制备。
优选的,所述热弯和烧结在烧结炉中进行,热弯温度为1300-1500℃,升温速率0-5℃/min,保温时间0-5h,压力为0-1000N。
优选的,所述烧结炉为真空烧结炉、气氛烧结炉或空气炉中的任意一种。
优选的,所述步骤S1中的氧化锆陶瓷粉料中添加有氧化钇、氧化钛、氧化硅中任意一种或多种粉料。
优选的,所述步骤S1中的溶剂为酒精或甲苯。
优选的,所述步骤S1中的粘接剂为PVB1或PVB2。
优选的,所述步骤S2中获得的基础膜带的厚度为0-1mm。
优选的,所述步骤S3中的脱脂方法为在300-600℃下脱脂20-50h。
优选的,所述步骤S3中的预烧结的温度为1000-1300℃,升温速率为0-5℃/min,并保温0-5h。
相较于现有技术,本发明的移动通信设备外壳的制备方法采用的是烧结和热弯一体化的方式,减少了工序,这样对应地避免单独烧结造成变形的风险,大大提高产品的良率,从而降低生产成本;同时由于在烧结过程中加了一定的压力,最终做出的产品致密度、断裂韧性、抗弯强度等性能较好。
附图说明
图1为本发明通信设备外壳的制备方法的示意图。
具体实施方式
下面将结合附图和实施方式对本发明作进一步说明。
参照图1所示,本发明提供一种通信设备外壳的制备方法,其具有高产品的良率,从而降低生产成本,产品致密度、断裂韧性、抗弯强度等性能较好的有益效果。
具体包括如下步骤:
步骤S1,浆料混合:将氧化锆陶瓷粉料与溶剂、粘接剂混合形成混合浆料;
其中氧化锆陶瓷粉料中添加有氧化钇、氧化钛、氧化硅中任意一种或多种粉料;溶剂为酒精或甲苯;粘接剂为PVB1或PVB2中的任意一种。
步骤S2,成型:混合浆料通过流延成型的方式得到厚度在0-1mm的单层的基础膜带,通过叠层和等静压的方式在基础膜带上制备不同厚度的叠加膜带,然后将多层膜带裁切一定尺寸的产品;
步骤S3:通过脱脂和预烧结得到预成型坯体,包括:
步骤S31,脱脂:在温度300-600℃下脱脂20-50h。
步骤S32,预烧结:预烧结温度为1000-1300℃,保温时间为0-5h,升温速率为0-5℃/min。
步骤S4,热弯和烧结:将预成型坯体放置到预先设计好的移动通信设备外壳模具中,在升降温过程中采用加压方式进行热弯和烧结,使氧化锆陶瓷材料在温度和压力的综合作用下得到与移动通信设备外壳模具形状相一致的产品,并且完成陶瓷的致密化过程,得到与移动通信设备外壳模具形状一致的致密陶瓷结构的移动通信设备外壳。
其中,预设的移动通信设备外壳模具采用石墨、碳化硅或复合材料制备。热弯和烧结的设备为烧结炉,具体可以为真空烧结炉、气氛烧结炉或空气炉等。其中热弯温度为1300-1500℃,保温时间为0-5h,升温速率为0-5℃/min,优选的,在0-1000N的压力下进行,这样,可以获得更致密的陶瓷结构。
相较于现有技术,本发明的移动通信设备外壳的制备方法采用的是烧结和热弯一体化的方式,减少了工序,这样对应地避免单独烧结造成变形的风险,大大提高产品的良率,从而降低生产成本;同时由于在烧结过程中加了一定的压力,最终做出的产品致密度、断裂韧性、抗弯强度等性能较好。
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其它相关的技术领域,均同理包括在本发明的专利保护范围内。
Claims (10)
1.一种移动通信设备外壳的制备方法,其特征在于,包括如下步骤:
步骤S1:将氧化锆陶瓷粉料与溶剂、粘接剂混合形成混合浆料;
步骤S2:所述混合浆料通过流延成型的方式得到单层的基础膜带,通过叠层和等静压的方式在所述基础膜带上制备至少一层叠加膜带;
步骤S3:通过脱脂和预烧结得到预成型坯体;
步骤S4:将所述预成型坯体放置到预设的移动通信设备外壳移动通信设备外壳模具中,在升降温过程中采用加压方式进行热弯和烧结,以使得所述预成型坯体得到与移动通信设备外壳模具形状一致的致密陶瓷结构的移动通信设备外壳。
2.根据权利要求1所述的移动通信设备外壳的制备方法,其特征在于,所述预设的移动通信设备外壳模具采用石墨、碳化硅或复合材料制备。
3.根据权利要求1所述的移动通信设备外壳的制备方法,其特征在于,所述热弯和烧结在烧结炉中进行,热弯温度为1300-1500℃,升温速率0-5℃/min,保温时间0-5h,压力为0-1000N。
4.根据权利要求3所述的移动通信设备外壳的制备方法,其特征在于,所述烧结炉为真空烧结炉、气氛烧结炉或空气炉中的任意一种。
5.根据权利要求1所述的移动通信设备外壳的制备方法,其特征在于,所述步骤S1中的氧化锆陶瓷粉料中添加有氧化钇、氧化钛、氧化硅中任意一种或多种粉料。
6.根据权利要求1所述的移动通信设备外壳的制备方法,其特征在于,所述步骤S1中的溶剂为酒精或甲苯。
7.根据权利要求1所述的移动通信设备外壳的制备方法,其特征在于,所述步骤S1中的粘接剂为PVB1或PVB2。
8.根据权利要求1所述的移动通信设备外壳的制备方法,其特征在于,所述步骤S2中获得的基础膜带的厚度为0-1mm。
9.根据权利要求1所述的移动通信设备外壳的制备方法,其特征在于,所述步骤S3中的脱脂方法为在300-600℃下脱脂20-50h。
10.根据权利要求1所述的移动通信设备外壳的制备方法,其特征在于,所述步骤S3中的预烧结的温度为1000-1300℃,升温速率为0-5℃/min,并保温0-5h。
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