WO2021058545A1 - Assemblage d'un appareil d'ablation laser et appareil d'ablation laser d'un tel ensemble - Google Patents

Assemblage d'un appareil d'ablation laser et appareil d'ablation laser d'un tel ensemble Download PDF

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Publication number
WO2021058545A1
WO2021058545A1 PCT/EP2020/076538 EP2020076538W WO2021058545A1 WO 2021058545 A1 WO2021058545 A1 WO 2021058545A1 EP 2020076538 W EP2020076538 W EP 2020076538W WO 2021058545 A1 WO2021058545 A1 WO 2021058545A1
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WIPO (PCT)
Prior art keywords
vacuum chamber
ablation
purge gas
gas
gas inlet
Prior art date
Application number
PCT/EP2020/076538
Other languages
English (en)
Inventor
Marcus KÄSTNER
Stephan Hiller
Sascha Christian MÜLLER
Camille Stebler
Bernd Stenke
Regula PFEFFER
Original Assignee
Carl Zeiss Smt Gmbh
Carl Zeiss Microscopy Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Carl Zeiss Smt Gmbh, Carl Zeiss Microscopy Gmbh filed Critical Carl Zeiss Smt Gmbh
Publication of WO2021058545A1 publication Critical patent/WO2021058545A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material

Definitions

  • the invention relates to an assembly of a laser ablation apparatus.
  • the in vention furthermore relates to a laser ablation apparatus having such an as sembly.
  • a laser ablation apparatus of the type set forth in the introductory part is known from EP 2 629079 A2.
  • a further laser-based workpiece machining apparatus is known from US 2006/0249480 Al.
  • Particle beam devices are known from DE 102008 001 812 A1/B4, from DE 102008 045 336 Al, from DE 102012 020519 Al, from DE 102012010 708 Al and from DE 102012012 275 A1/B4/B9.
  • US 2013/0087547 Al discloses particle con trol in laser processing systems.
  • JP 2000260730 A discloses a laser-anneal ing device.
  • JP 62204518 A discloses a preventing method for contamina tion of an optical window.
  • JP 2016.159346 A discloses a laser processing device.
  • DE 102011 056 811 Al discloses a method to protect the surface of an optical component and a device to machine workpieces.
  • US 6,339,205 B1 discloses a grid support welding apparatus.
  • DE 102014210 838 Al discloses a laser welding head and a laser welding device including a vacuum chamber. It is an object of the present invention to develop an assembly of a laser ab lation apparatus in such a manner that undesired contamination of compo nents of the assembly and/or of a workpiece to be machined caused by ab lation particles is avoided.
  • the arrangement of a duct passage for a vacuum pump of the assembly such that ablation particles are discharged thereby from a chamber section directly adjacent to the optical surface effectively prevents contamination of the optical surface that is a constituent part of an optics component that is arranged last before the ab lation region in the beam path of the machining light.
  • the arrangement of the chamber section directly adjacent to the optical surface of the optics component that is arranged last before the ablation region in the beam path ensures the reliable discharge of ablation particles before they are depos ited undesirably on the optical surface.
  • the vacuum pump may be embodied as a suction pump to enable an outlet of the purging gas from the vacuum chamber.
  • a further vacuum pump to evacuate the vacuum chamber may be present in the assembly.
  • the duct passage for the connectible vacuum pump and/or at least one gas inlet of the purging gas opens into the vacuum chamber, in particular opens into the chamber section of the vacuum chamber, with respect to the beam path of the machining light at the height of the optical surface or at a distance from the optical surface that is not greater than 50% of a distance between the optical surface and the ablation region.
  • This distance ratio can be at most 45%, at most 40%, at most 35%, at most 30%, at most 25%, at most 20%, at most 15% or at most 10%. This distance ratio is regularly more than 0.5%.
  • Such distance ratio may be less than 0.5%, i.e. may be in the range between 0% and 0.5%. Such distance ratios can ensure that the abla tion particles are sucked away from the chamber section of the vacuum chamber that is directly adjacent to the optical surface via the duct passage.
  • the outlay related to sucking away ablation particles near the workpiece can be avoided. Damage to fragile samples caused by such suction taking place near the sample is thus prevented. Undesirable, purge-gas-induced re deposition of ablation particles on the workpiece can also be avoided in this way.
  • the sample volume to be ablated can be subsequently removed along the fixed laser machining path by way of laser machining.
  • a volume of greater than 100 pm 3 can be ablated using light pulses.
  • the ablated volume is here transformed into a material cloud that can be removed by being pumped out of the machining or vacuum cham ber.
  • a pulsed laser for example a pulsed solid-state laser, can be used for laser machining.
  • Solid-state lasers typically consist of crystals or glasses that are doped with optically active ions, such as YAG (yttrium alu minium garnet) lasers or Nd: YLF (neodymium: yttrium lithium fluoride) lasers, and differ in the wavelength of the emitted, monochromatic laser light.
  • optically active ions such as YAG (yttrium alu minium garnet) lasers or Nd: YLF (neodymium: yttrium lithium fluoride) lasers, and differ in the wavelength of the emitted, monochromatic laser light.
  • lasers of a different con struction type for laser machining for example gas lasers, excimer lasers or other types of laser suitable for material machining. Since laser light is co herent and directional, the laser beam can be guided over long distances and strongly focused. It is thus possible to generate very high power densi ties (power per unit area) on the surface of the object to be machined.
  • a specific embodiment of the present invention relates to a femtosecond la ser, preferably with the wavelength 515 nm and a pulse duration (sech 2 fit) of typically less than 1 ps, less than 500 fs or less than 250 fs. It can fur thermore also be possible, however, that other types of laser (e.g. nanosec ond lasers with a corresponding pulse duration in the nanosecond range) are used. Lasers with different wavelengths and different pulse durations can be used, that is to say lasers with a wavelength in the range of the visi ble light but also lasers with a wavelength in the infrared range or in the higher-energy ultraviolet (UV) spectral range, depending on the type of material that is to be ablated.
  • a pulse duration e.g. nanosec ond lasers with a corresponding pulse duration in the nanosecond range
  • At least one gas inlet allows the support of the dis charge of the ablation particles from the chamber section directly adjacent to the optical surface by means of a purge gas. Collisions of the ablation particles with the purge gas particles reduce a kinetic energy of the ablation particles. In addition, they imprint on the ablation particles a preferential direction that can be directed away from the workpiece or from the at least one optical surface and can support the discharge of the ablation particles to the vacuum pump.
  • the at least one gas inlet can open into the vacuum chamber with respect to the beam path of the machining light at the height of the optical surface or at a distance from the optical surface that is not greater than 50% of the distance between the optical surface and the abla tion region.
  • At least one section of the gas inlet can be in the form of a ring channel.
  • a ring plane can here be arranged parallel to the optical surface and/or parallel to a holding plane of the workpiece holder.
  • Inflow of the purge gas with a preferential direction according to Claim 3 ensures particularly reliable discharge of the ablation particles from the chamber section directly adjacent to the optical surface.
  • the preferential di rection can be specified for example via settable purge gas nozzles.
  • Such settable purge gas nozzles can have for example a pivotable design.
  • the purge gas flow into the chamber section of the vacuum chamber and/or through the chamber section of the vacuum chamber may be with respect to the beam path of the machining light at a distance from the optical sur face of the last optics component that is not greater than 50% of the dis tance between the optical surface and the ablation region.
  • the distance ratios what was said above relating to the distance of the opening of the vacuum duct passage applies here.
  • Purging can be located in the immediate vicinity of the last optical compo nent or in the intermediate region between the workpiece and the last opti cal component. To reduce re-deposition on the sample, it has proven ad- vantageous not to locate gas purging in the immediate environment of the ablation region. As a consequence, an average free path length of the abla tion particles in the environment of the workpiece remains advantageously large, which makes re-deposition of the ablation particles on the workpiece less likely.
  • a plurality of gas inlets according to Claim 4 has proven useful for produc ing a defined purge gas flow.
  • Such purge gas flow may be realized directly adjacent to the optical surface from the entrance into the chamber section through the chamber section to exit of the chamber section. Such exit may be defined via gas outlet ducts from the chamber section.
  • a purge gas duct system can have a ring channel or a ring part channel for the distribution to a plurality of gas inlets.
  • Inlet distributors and/or outlet distributors of the gas inlet and outlet system which is part of the assembly may have a shape of a part of a ring. Such ring part may be part of a circumference of the chamber section.
  • Inlet channels and/or outlet channels of such distribution channel may have respective lengths and/or cross section areas which do not deviate from each other along the path of the purge gas by more than 10%.
  • these inlet channels and/or outlet channels may have equal lengths.
  • such inlet and/or outlet channels may be equally dis- tributed around at least a part of a circumference of the chamber section.
  • a number of gas inlet channels and/or of corresponding gas outlet channels may be in a range between 3 and 30, in particular between 10 and 20, more particular between 13 and 17.
  • Such plurality of gas inlets may provide a homogeneous flow of the purging gas, in particular a homogeneous mass flow rate which ensures good decontamination properties of the assembly over the whole interesting area of the component which should be pre vented from contamination.
  • a machining light entrance window represents an ex ample of an optics component that is arranged last before the ablation re gion in the beam path of the machining light and for which prevention of the deposition of ablation particles is particularly advantageous.
  • a last optics component can also be embodied in the form of a lens element or a mirror or as a further optical functional component with at least one optical surface.
  • Further alternatives to a machining light en trance window are a filter or a protection window or a protection pellicle.
  • Gas channels having lengths and/or cross sections which fulfil the condi tion of Claim 8 have proven to provide a homogeneous inlet and/or outlet gas flow and in particular a homogeneous purging gas mass flow rate across the chamber section.
  • All of the inlet channels may have equal lengths and/or cross sections.
  • All of the outlet channels may have equal lengths and/or cross sections.
  • a homogeneous gas flow, in particular a ho mogeneous flow without generating turbulence in particular at the optical surface of the last optics component and without generating turbulence at the workpiece, is advantageous to maintain the workpiece and in particular the optical surface of the last optics component contamination-free or with low contamination.
  • a number of inlet channels and a number of outlet channels of the assembly may not differ by more than 10%.
  • the inlet chan nels and/or the outlet channels may have a circular and/or elliptical and/or rectangular or multiangular cross section.
  • An outlet/inlet width ratio according to Claim 9 has proven to provide a very homogeneous purge gas flow throughout the chamber section.
  • Such outlet/inlet width ratio may be between 1.1 and 20.
  • width ratio may in a range between 1.1 and 2, in particular between 1.2 and 1.5.
  • main purge gas outlet/ inlet ducts such ratio may be in the range between 2 and 20, in particular be tween 5 and 10.
  • a machining laser known in the prior art for example a CO2 laser or an Nd: YAG laser can be used as the laser light source for the machining light.
  • the laser light source can be a ps laser or an fs laser.
  • An fs laser having a pulse duration of at most 500 fs, at most 300 fs or at most 250 fs can be used with preference.
  • the machining light can have a wavelength in the green wavelength range.
  • the laser light source can in particular be a fibre solid-state laser with the laser medium YB:YAG.
  • a fundamental of the laser light source can have a wavelength of 1030 nm and can be frequency-doubled or frequency-tripled to generate the machining light.
  • the laser light source can thus be an ultra- short pulse laser, in particular with machining light in the green wavelength range.
  • a laser wavelength can preferably be 515 nm.
  • Other machining light wavelengths for example in the IR and UV wavelength ranges, can also be used, depending on the workpiece material that is to be machined and de pending on the ablation application chosen.
  • the arrangement of the gas inlet system near the last optical unit is advan tageous to reduce contamination on the surface of the last optics compo nent and/or on the workpiece surface.
  • Ablation in a vacuum is furthermore advantageous to reduce contamination on the workpiece surface and to guide the particles in a direction away from the workpiece surface. Further more, a method is possible in which ablation processes can be combined under atmospheric and vacuum conditions.
  • Figure 1 schematically shows a section through an assembly of a laser ablation apparatus
  • Figure 2 shows again schematically main components of a laser abla tion apparatus having such an assembly
  • Figure 3 shows, in a sectional illustration similar to Figure 1, compo nents of a variant of the assembly of the laser ablation appa- ratus with a further embodiment of a gas inlet and outlet sys tem as a constituent part of a purge device of the laser abla tion apparatus;
  • Figure 4 shows, in an illustration similar to Figure 3, a further embodi ment of the gas inlet and outlet system of the purge device;
  • Figure 5 shows a view of the gas inlet system according to Figure 4, as seen from the viewing direction V in Figure 4;
  • Figure 6 shows, in an illustration similar to Figure 3, a further embodi ment of a gas inlet and outlet system of the purge device;
  • Figure 7 shows a section along the line VII- VII in Figure 6;
  • Figure 8 shows, in an illustration similar to Figure 3, a further embodi ment of a gas inlet and outlet system of the purge device
  • Figure 9 shows, in an illustration similar to Figure 3, a further embodi ment of a gas inlet and outlet system of the purge device
  • Figure 10 shows a section along the line X-X in Figure 9;
  • Figure 11 shows, in an illustration similar to Figure 3, a further embodi ment of a gas inlet and outlet system of the purge device
  • Figure 12 a view of the gas inlet and outlet system according to Figure 11, as seen from the viewing direction XII in Figure 11;
  • Figure 13 in a perspective view another embodiment of a gas inlet and outlet system of the purge device;
  • Figure 14 shows, in an illustration similar to Figure 3, a further embodi ment of a gas inlet and outlet system of the purge device
  • Figure 15 a view of the gas inlet and outlet system according to Figure 11, as seen from the viewing direction XV in Figure 14;
  • Figure 16 in a perspective view another embodiment of a gas inlet and outlet system of the purge device.
  • a laser ablation apparatus 1 serves for structuring or preparing objects, for example microscopic samples.
  • An assembly 2 of the laser ablation appa ratus is shown in more detail in Figure 1.
  • the assembly 2 has a vacuum chamber that is connected to a vacuum pump 5 via a duct passage 4.
  • An interior 6 of the vacuum chamber 3 can be evac uated via the duct passage.
  • a workpiece holder 7 is arranged in the vacuum chamber 3.
  • the former is carried by an adjustment stage 8, via which the workpiece holder 7 is dis placeable in a driven manner in at least two translational degrees of free dom. It is also possible to move it in three translational degrees of freedom and/or in additional rotational degrees of freedom.
  • the workpiece holder 7 serves for supporting a workpiece 9 that is to be machined by laser ablation. This machining takes place using machining light 10 in an ablation region 11 of the workpiece 9.
  • the workpiece 9 can have a dimension of, for example, up to 50 mm x 50 mm in a machining plane.
  • An optics component 12 arranged last before the ablation region 11 in the beam path of the machining light 10 is part of the assembly 2. This is em bodied in the form of an entrance window or input coupling window for the machining light.
  • the optics component 12 has an optical entrance surface 13 and an optical exit surface 14, on which the machining light 10 im pinges and which transmit the machining light 10 coming from a laser light source 15 (cf Figure 2) to the ablation region 11.
  • the duct passage 4 via which the vacuum pump 5 is connected to the vac uum chamber 3 is designed such that ablation particles 16 that are coming from the ablation region 11 and enter a chamber section 17 directly adja cent to the optical exit surface of the optics component 12 are discharged from the vacuum chamber 3 via the duct passage 4.
  • the ablation particles 16 leave the ablation region 11 within an emission cone 18 into the interior of the vacuum chamber 3 in the direction of the optics component 12, thus reaching the chamber section 17 adjacent to the optics component 12.
  • Two gas inlets 20, 21 of a gas inlet system 22 of the assembly 2 open into the chamber section 17 of the interior 6 of the vacuum chamber 3.
  • the gas inlet system 22 is part of a purge device 22a of the laser ablation apparatus 1.
  • the gas inlets 20, 21 are arranged directly adjacent to the optics compo nent 12, specifically open into the vacuum chamber 3 at the height of the optical exit surface 14 with respect to the beam path of the machining light 10.
  • Alternative or additional gas inlets of the gas inlet system 22 can open into the vacuum chamber 3, similar to the duct passage 4, at a distance from the optical exit surface 14 that is not greater than 50% of the distance B between the optical exit surface 14 and the ablation region 11.
  • the gas inlets 20, 21 are designed such that purge gas 23 flows into the chamber section 17 of the vacuum chamber 3 that is directly adjacent to the optical exit surface 14 with a preferential direction.
  • a purge gas source 24 (cf. Figure 2) is part of the gas inlet system 22.
  • the vacuum chamber 3 is connected via an isolation valve 25 to a main chamber (not illustrated) of the laser ablation apparatus 1 which makes possible the introduction and removal of the workpiece 9 from the main chamber into the vacuum chamber 3 and from the vacuum chamber 3 into the main chamber.
  • the vacuum chamber 3 and/or the main chamber can adjoin a particle beam system.
  • the particle beam system can be a scanning electron microscope or an ion beam system, or a combination of electron and ion beam system (SEM/FIB), also referred to as crossbeam.
  • SEM/FIB electron and ion beam system
  • a cross beam arrangement of this type is known for example from DE 10 2012 020 478 A1 and DE 102008 045 336 Al.
  • the vacuum or sample chamber 3 in which the machining takes place can also be part of a particle beam cham ber of the particle beam system.
  • the vacuum chamber 3 can be automated, and the machined workpieces can be transferred from the machining site into the chamber of the particle beam device.
  • Either one container with a plurality of samples/holders which are automatically introduced can be mounted to the vacuum or ma chining chamber, or the vacuum or machining chamber can connect two particle beam systems and thereby move samples into or out of the machin ing chamber or in between the different chambers.
  • the ablation particles 16 transported from the ablation region 11 in the direction of the optics com ponent 12 do not deposit on the optical exit surface 14 but rather are dis charged from the vacuum chamber 3 via the duct passage 4 along a transport outlet path 26 when they enter the chamber section 17 adjacent to the optical exit surface 14.
  • the ablation particles 16 entering the chamber section 17 are here entrained as a supporting action by the purge gas 23 of the gas inlet system 22. Undesirable contamination of the optical exit sur face 14 is hereby effectively prevented.
  • the ablation particles 16 being discharged at a distance from the ablation region 11 additionally ensures that the ablation particles 16 do not deposit undesirably in the environment of the ablation region 11 on the workpiece 9. This simplifies in particular a preparation of the workpiece because there is no need to expend effort to remove a deposit of ablation particles from the workpiece 9. This is advantageous in particular if the workpiece is sub- sequently analysed, for example by way of microscopy and/or other analy sis methods. Preventing a deposit of the ablation particles on the workpiece 9 is particularly advantageous if a side wall, also referred to as a cross sec tion of the ablation volume, of a depression in the workpiece 9 produced by the ablation is analysed.
  • the assembly 2 includes no removal by suction near the workpiece via a vacuum duct passage, and also a purge gas flow near the workpiece.
  • Figures 3 to 10 are used to describe further embodiments of gas in let systems for a purge device of the laser ablation apparatus 1 which can be used instead of the gas inlet system 22 according to Figures 1 and 2.
  • Components and functions corresponding to those which have been ex plained with reference to the above figures bear the same reference signs and will not be discussed again in detail.
  • a gas inlet system 27 comprises a main purge gas duct 28, which is in fluid-connection with a U-shaped, partially cylindrical or fully cylindrical purge gas distributor 29.
  • the purge gas distributor 29 Independently of the three dif ferent possible embodiments “U-shaped”, “partially cylindrical” and “fully cylindrical”, the purge gas distributor 29 has the inverted U-shape shown in section in Figure 3.
  • Side legs or side cylinder wall sections 30, 31 of the purge gas distributor 29 each have a plurality of purge gas nozzles 32 that are directed obliquely upwardly towards the chamber section 17 and from which the purge gas 23 flows upwardly, as indicated in Figure 3.
  • the purge gas that flows out in this way entrains the ablation particles 16 towards the chamber section 17 and from there, via the transport outlet path 26, to the duct passage 4, which is not illustrated further in Figure 3.
  • the two side legs/side cylinder wall sections 30, 31 are connected to one another and to the main purge gas duct 28 via a horizontally extending ring channel section 3 la of the gas inlet system 27.
  • the ring channel section 31a extends adjacent to or in the chamber section 17.
  • the optics component 12 includes in the embodiment according to Figures 3 ff a laser input-coupling window 12a and, arranged opposite it with an offset towards the interior 6, a protective window 12b.
  • the protective win dow 12b in this embodiment according to Figures 3 ff. represents the optics component that is arranged last before the ablation region 11 in the beam path of the machining light 10.
  • the protective window 12b is held by a protective-window holder 12c indicated in Figures 3 ff
  • the side legs/side cylinder wall sections 30 cover a large portion of a verti cal distance between the optics component 12 and the workpiece 9.
  • the re sult is the gas inlet system 27 that extends along the vertical direction.
  • Figures 4 and 5 show components of a further variant of a gas inlet system 33, which can be used instead of the gas inlet system 22 according to Fig ures 1 and 2 or instead of the gas inlet system 27 according to Figure 3.
  • a semi-circular ring channel section 34 in which a plurality of purge gas nozzles 32 are implemented, is in fluid-connection with the main purge gas duct 28.
  • a semi-circular ring channel section 34 in a not depicted embodiment such ring channel section also may have a partly elliptical or even an angular shape.
  • the purge gas noz zles 32 are oriented such that the purge gas 23 in each case flows radially inwards with respect to the semicircle shape of the ring channel section 34.
  • the result in turn is an effective transport of the ablation particles 16 with the purge gas 23 to the transport outlet path 26.
  • the ring channel section 34 is in turn arranged directly adjacent to the optics component 12. What was stated above in relation to the distance of the gas inlets of the gas inlet sys tem 22 applies to this adjacency relationship.
  • Figures 6 and 7 show components of a further variant of a gas inlet system 35, which can be used instead of the gas inlet system 22 according to Fig ures 1 and 2, instead of the gas inlet system 27 according to Figure 3, or in stead of the gas inlet system 33 according to Figures 4 and 5.
  • a ring chan nel 36 that is in fluid connection with the main purge gas duct 28 is part of the gas inlet system 35.
  • the purge gas nozzles 32 of the ring channel 36 are implemented so as to be adjustable by a pivot ac tion, as indicated in Figure 6 by double-headed arrows 37. This produces a settability of the respective purge gas preferential direction of the purge gas 23 exiting the purge gas nozzles.
  • Figure 8 shows components of a further variant of a gas inlet system 38, which can be used instead of the gas inlet system 22 according to Figures 1 and 2, instead of the gas inlet system 27 according to Figure 3, instead of the gas inlet system 33 according to Figures 4 and 5, or instead of the gas inlet system 35 according to Figures 6 and 7.
  • the gas inlet system 38 has a plurality of purge gas distributor ducts 39 that are distributed in the manner of a fan and are in each case in fluid connection with the main purge gas duct.
  • a purge gas flow can be produced in the manner of a purge gas cur tain 40 between the optics component 12 and the workpiece 9 via purge gas outlets in the purge gas distributor ducts 39 and again leads to effective en trainment of the ablation particles 16 towards the transport outlet path 26.
  • the result is in particular a wide, fan-type purge gas effect on the ablation particles 16 in the intermediate space between the optics component 12 and the workpiece 9.
  • Figures 9 and 10 show components of a further variant of a gas inlet sys tem 41, which can be used instead of the gas inlet system 22 according to Figures 1 and 2, instead of the gas inlet system 27 according to Figure 3, instead of the gas inlet system 33 according to Figures 4 and 5, instead of the gas inlet system 35 according to Figures 6 and 7, or instead of the gas inlet system 38 according to Figure 8.
  • the gas inlet system 41 can be un derstood to be a combination of the gas inlet components of the gas inlet systems 35 according to Figures 6 and 7 and of 38 according to Figure 8.
  • the gas inlet system 41 has, in addition to the ring channel 36, which can also be implemented as a ring channel section in the manner of the ring channel section 34 of the gas inlet system 33, purge gas distributor ducts 42 arranged in the manner of strips, that is to say in particular in rows and/or columns.
  • Purge gas distributor ducts 42 arranged in the manner of strips, that is to say in particular in rows and/or columns.
  • Horizontally arranged purge gas distributor ducts of said purge gas distributor ducts 42 are denoted 42h in Figures 9 and 10 and vertically arranged purge gas distributor ducts are denoted 42v.
  • Both the ring channel 36 and the purge gas distributor duct 42 are in fluid connection with the main purge gas duct 28, which is not shown in detail with respect to the purge gas distributor ducts 42 in Figures 9 and 10.
  • a highly flexible purge gas inflow can be implemented via the differ ent components 36, 42 of the gas inlet system 41.
  • the purge gas nozzles 32 on the one hand and, on the other hand, the purge gas distributor ducts 42h, 42v overall are adjustable, which is indicated in Fig ure 9 for one of the purge gas distributor ducts 42h by a double-headed ar row 43, which in turn is intended to indicate a pivoting degree of freedom.
  • This distribution in turn produces between the optics component 12 and the workpiece 9 an effective entrainment of the ablation particles 16 towards the transport outlet path 26.
  • FIGs 11 and 12 show components of a further variant or embodiment of a gas inlet and outlet system 45, which can be used instead of the gas inlet systems and/or the duct passages 4 which were described above with re spect to Figures 1 to 10.
  • the gas inlet system 45 comprises a main purge gas duct 28 which is in fluid connection with a U-shaped or ring part shaped purge gas distributor 46 (compare Figure 12).
  • the inlet part of such purge gas distributor 46 is in fluid connection with a plurality of purge gas inlet channels 47 which open towards the chamber section 17.
  • the purge gas distributor 46 is divided into an inlet distributor also denoted as 46i in Figure 12 and an outlet dis tributor 46o.
  • Those inlet/outlet distributors 46i, 46o may be configured as components without physical connection, i.e. as completely separated com ponents.
  • the inlet channels 47 are distributed around approximately half of a whole circumference of the inlet distributor 46i around the chamber section 17.
  • Each of the inlet channels 47 has, between an entry portion towards the in let distributor 46i and an exit portion towards the chamber section 17, at least approximately the same length along the direction of the flow of the purge gas 23 which is depicted in Figure 12 via individual arrows. Lengths and/or cross section diameters of different of these inlet channels 47 devi ate from each other by no more than 10%.
  • the outlet distributor 46o has a duct shape which is at least approximately mirror symmetric with respect to a vertical mirror plane 48 in Figure 12.
  • the function of such outlet distributor 46o corresponds to that of the duct passage 4 described above with respect to the embodiments of Figures 1 to 10.
  • the outlet distributor 46o of the purge gas distributor 46 of the gas inlet system 45 has outlet channels 49 which are arranged accordingly mirror symmetrical to the inlet channels 47 and the outlet channels 49 open into the main channel part of the outlet distributor 46o which is in fluid connec tion with a main purge gas outlet duct 50 of the gas inlet and outlet system 45.
  • Such main purge gas outlet duct 50 is arranged mirror symmetrical to the main purge gas inlet duct 28 again with respect to mirror plane 48.
  • the main purge gas outlet duct 50 has the function of the transport outlet path 26 described above with respect to the embodiments according to Figures 1 to 10.
  • the length of the outlet channels 49 are at least approximately equal to each other as discussed above with respect to the inlet channels 47.
  • the number of inlet channels 47 and/or of the outlet channels 49 may vary between 3 and 30 and may be in the region between 10 and 15. In the em bodiment shown in Figure 13, thirteen of such inlet channels 47 and outlet channels 49 are present.
  • the distance A between a plane defined by a duct passage 51 between the inlet channel 47 and the outlet channel 49 on the one hand and the optical exit surface 14 is approximately 25% of the distance B between the optical exit surface 14 and the ablation region 11 defined by the workpiece holder 7 or the workpiece 9 respectively.
  • the distance A may be smaller than 25% of the distance B, depending on the respective embodiment.
  • An absolute distance A may be in region between 5 mm and 10 mm, in particular in the region of 7 mm.
  • Figure 13 shows components of a further embodiment of a gas inlet and outlet system 52 which can be used instead of the systems discussed above with respect to Figures 1 to 12.
  • Components and functions which were de scribed above with respect to the previous embodiments carry, if applica ble, the same reference numerals and are not described again in detail.
  • the gas inlet and outlet system 52 includes an L-shaped inlet distributor 53i and a mirror symmetrically L-shaped outlet distributor 53 o.
  • a main carrying body 54 of the system 52 in which the distributors 53i, 53o of the purge gas distributor 53 are embodied as duct passages, has a circular opening 55 defining the chamber section 17.
  • the inlet channels 47 of the inlet distributor 53i and the outlet channels 49 of the outlet distribu tor 53o of the system 52 are not of equal length along the path of the purge gas 23.
  • the inlet distributor 53i is in fluid connection with a main purge gas duct 28 and the outlet distributor 53o is fluid connection with a main purge gas outlet duct 50.
  • An arrangement position of the system 52 with respect to the optics com ponent 12 and with respect to the workpiece 9 and the workpiece holder 7 corresponds to the position of the system 45 described above with respect to Figures 11 and 12. Accordingly, the distance ratio A/B of the system 52 corresponds to that of the system 45.
  • the main purge gas inlet duct 28 and the main purge gas outlet duct 50 open to the same side facilitating an arrangement of further purge gas duct portions.
  • a main purge gas flow which is depicted by a big arrow in Figure 13, is approximately perpendicular to a flow path direction of the purge gas into the main purge gas duct 28 and out of the main purge gas outlet duct 50 of the system 52.
  • This is different e.g. to the relation between the main purge gas flow within the duct pas sage 51 in the embodiment of Figures 11 and 12 which is approximately parallel to the flow direction in those parts of the main purge gas ducts 28, 50 which are closely adjacent to inlet/outlet distributors 46i/46o.
  • Lengths as well as cross section diameters of the individual inlet/outlet channels 47, 49 which may be embodied as nozzles vary in dependence of the distance of the individual nozzles to the gas inlet duct 28 and to the gas outlet duct 50. Also the inlet distributor 53i as well as the outlet distributor 53 o have different cross section diameters to adjust for a homogeneous mass flow of the purge gas 23 in the duct passage 51 avoiding turbulences.
  • Figures 14 and 15 show components of a further variant of a gas inlet sys tem 56, which can be used instead of the systems which were described above with respect to Figures 1 to 13.
  • Components and functions which were described above with respect to the previous embodiments carry, if applicable, the same reference numerals and are not described again in de tail.
  • the distance ratio A/B is approximately 1/3.
  • a main difference between the systems 56 according to Figures 14 and 15 and 45 according to Figures 11 and 12 is the channel width of the outlet duct portions of the system 56, i.e. of outlet channels 57 which are used in stead of the outlet channels 49 of the system 45, of the outlet distributor 58o which is used instead of the outlet distributor 46o of the system 45 and of a main purge gas outlet duct 59 which is used instead of the main purge gas outlet duct 50 of the system 45.
  • These components 57, 58o and 59 have in the system 56 a much larger cross section as compared to the respective components of the system 45.
  • a ratio between a channel width of the main purge gas outlet duct 59 can be between 2/1 and 20/1 as com pared to the channel width of the main purge gas inlet duct 28.
  • Such chan nel width ratio may be in the region of 10/1.
  • An inner width diameter of the main purge gas inlet duct 28 may be 3.5 mm.
  • An inner width diameter of the main purge gas outlet duct 59 may be 11 mm.
  • a channel width ratio between the outlet channels 57 of the system 56 and the channel width of the inlet channels 47 of the system 56 (or the channel width of the outlet channels 47 of the system 45) may be in the region be tween 1.1/1 to 2/1.
  • Such channel ratio may be in particular between 1.3 and 1.4.
  • a ration between the channel widths of outlet distributor 58o and the inlet distributor 46i (or the outlet distributor 46o) of the em bodiment of Figures 11 and 12 may be in the range between 1.1/1 and 2/1.
  • Figure 16 shows components of a further embodiment of a gas inlet and outlet system 60 which can be used instead of the gas inlet systems dis cussed above with respect to Figures 1 to 15, in particular with reference to the embodiment according to figures 14 and 15.
  • Components and functions which were described above with respect to the previous embodiments carry, if applicable, the same reference numerals and are not described again in detail.
  • the distance ratio A/B is approximately 1/3.
  • the system 60 may be understood as a combination of features of the sys tems 56 with respect to the different channel widths of the inlet and outlet duct portions and 52 with respect to the opening of the main purge gas inlet and outlet ducts to the same side.
  • system 60 resembles to the system 52 of Fig. 13 regarding the feature of a perpendicular main flow direction of the purging gas 23 through the duct passage 51 as compared to the direction of the main purge gas inlet/outlet ducts 28 and 59 adjacent to the inlet distributor 46i and the outlet distributor 58o of Fig. 15.
  • the main body 54 has a tilted body section 61 carrying and/or forming duct passages of the main purge gas inlet/outlet ducts 28 and 59.
  • the inlet and/or outlet channels may be embodied as nozzles with varying nozzle diameter or with varying nozzle cross sectional areas to adapt a mass flow rate of the purging gas passing through the respective nozzle.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un appareil d'ablation laser comprenant un assemblage (2) comportant une chambre à vide (3). Cette chambre comprend un porte-pièce (7) destiné à supporter une pièce de travail (9) à usiner par ablation laser avec une lumière d'usinage (10) dans une zone d'ablation (11). Un composant optique (12) qui est disposé en dernier avant la zone d'ablation (11) dans le trajet de faisceau de la lumière d'usinage (10) présente au moins une surface optique (14) à travers laquelle la lumière d'usinage (10) se propage. La chambre à vide (3) présente un passage de conduit (4) d'une pompe à vide pouvant être raccordée, de telle sorte que des particules d'ablation (16) entrant dans une section de chambre (17) de la chambre à vide (3), qui est directement adjacente à la surface optique (14), sont évacuées de la chambre à vide (3) par l'intermédiaire du passage de conduit (4). Le résultat est un appareil d'ablation laser comprenant un assemblage dans lequel est évitée une contamination non souhaitée de composants de l'ensemble provoquée par les particules d'ablation.
PCT/EP2020/076538 2019-09-26 2020-09-23 Assemblage d'un appareil d'ablation laser et appareil d'ablation laser d'un tel ensemble WO2021058545A1 (fr)

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DE102019214742.9A DE102019214742A1 (de) 2019-09-26 2019-09-26 Baugruppe einer Laser-Ablationsvorrichtung sowie Laser-Ablationsvorrichtung einer derartigen Baugruppe
DE102019214742.9 2019-09-26

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Publication number Priority date Publication date Assignee Title
WO2023032037A1 (fr) * 2021-08-31 2023-03-09 信越エンジニアリング株式会社 Dispositif de séparation de pièce et procédé de séparation de pièce
DE102022102292A1 (de) 2022-02-01 2023-05-04 Asml Netherlands B.V. Verfahren zum betrieb einer vakuumkammer und vakuumkammer hierfür

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JPS62204518A (ja) 1986-03-04 1987-09-09 Sanei Riken:Kk 光学窓汚れ防止法
US6339205B1 (en) 1999-01-27 2002-01-15 Mitsubishi Nuclear Fuel Co., Ltd. Grid support welding apparatus
JP2000260730A (ja) 1999-03-08 2000-09-22 Matsushita Electric Ind Co Ltd レーザアニール装置
US20060249480A1 (en) 2003-03-04 2006-11-09 Adrian Boyle Laser machining using an active assist gas
DE102008001812A1 (de) 2008-05-15 2009-12-03 Carl Zeiss Nts Gmbh Positioniereinrichtung für ein Teilchenstrahlgerät
DE102008045336A1 (de) 2008-09-01 2010-03-11 Carl Zeiss Nts Gmbh System zur Bearbeitung einer Probe mit einem Laserstrahl und einem Elektronenstrahl oder einem Ionenstrahl
US20130087547A1 (en) 2011-10-05 2013-04-11 Applied Materials, Inc. Particle control in laser processing systems
DE102011056811A1 (de) 2011-12-21 2013-06-27 Forschungszentrum Jülich GmbH Verfahren zum Schutz der Oberfläche eines optischen Bauteils sowie Vorrichtung zur Bearbeitung von Werkstücken
EP2629079A2 (fr) 2012-02-17 2013-08-21 Carl Zeiss Microscopy GmbH Procédé et dispositifs de préparation d'échantillons microscopiques à l'aide de lumière pulsée
DE102012010708A1 (de) 2012-05-30 2013-12-05 Carl Zeiss Microscopy Gmbh Kombiniertes bearbeitungssystem zur bearbeitung mittels laser und fokussierten ionenstrahlen
DE102012012275A1 (de) 2012-06-21 2013-12-24 Carl Zeiss Microscopy Gmbh Laserstrahleinkopplung für ein bearbeitungssystem zur mikro-materialbearbeitung
DE102012020478A1 (de) 2012-10-18 2014-05-08 Carl Zeiss Microscopy Gmbh Teilchenstrahlsystem und Verfahren zum Bearbeiten einer TEM-Probe
DE102012020519A1 (de) 2012-10-19 2014-04-24 Eve Ernst Vetter Gmbh Vorrichtung zum Halten eines Zahnersatzteils
DE102014210838A1 (de) 2014-06-06 2015-12-17 Trumpf Laser Gmbh Einkoppeloptik, Laserschweißkopf und Laserschweißvorrichtung mit Vakuumkammer
JP2016159346A (ja) 2015-03-04 2016-09-05 住友重機械工業株式会社 レーザ加工装置

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