WO2021027906A1 - 底座、摄像模组及电子设备 - Google Patents

底座、摄像模组及电子设备 Download PDF

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Publication number
WO2021027906A1
WO2021027906A1 PCT/CN2020/109063 CN2020109063W WO2021027906A1 WO 2021027906 A1 WO2021027906 A1 WO 2021027906A1 CN 2020109063 W CN2020109063 W CN 2020109063W WO 2021027906 A1 WO2021027906 A1 WO 2021027906A1
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WO
WIPO (PCT)
Prior art keywords
mounting hole
photosensitive chip
lens
substrate
base
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PCT/CN2020/109063
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English (en)
French (fr)
Inventor
马忠科
陈小凤
申成哲
Original Assignee
欧菲光集团股份有限公司
南昌欧菲光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 欧菲光集团股份有限公司, 南昌欧菲光电技术有限公司 filed Critical 欧菲光集团股份有限公司
Priority to US17/634,978 priority Critical patent/US20220291570A1/en
Priority to EP20851425.7A priority patent/EP3993387A1/en
Publication of WO2021027906A1 publication Critical patent/WO2021027906A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • This application relates to the field of camera technology, in particular to a base, camera module and electronic equipment.
  • Camera modules are currently one of the hot spots in the consumer electronics field and are widely used in terminal electronic devices such as smart phones and tablet computers.
  • terminal electronic devices such as smart phones and tablet computers are developing in the direction of thinning, which in turn requires the development of camera modules in the direction of thinning.
  • the camera module usually includes a base and a lens.
  • the base includes a substrate and a photosensitive chip.
  • a mounting hole may be provided on the substrate, the photosensitive chip is arranged in the mounting hole, and the side wall of the photosensitive chip is connected to the inner wall of the mounting hole by glue or the like.
  • this application provides a base, a camera module, and an electronic device.
  • a base for carrying a lens comprising: a substrate connected with the lens, the substrate is provided with a mounting hole; a photosensitive chip is arranged in the mounting hole, opposite to the lens; and a supporting structure, provided Inside the mounting hole, it is connected with the inner wall of the mounting hole and connected with the surface of the photosensitive chip away from the lens to support the photosensitive chip.
  • the photosensitive chip is arranged in the mounting hole of the substrate, which can reduce the total thickness of the substrate and the photosensitive chip, thereby reducing the thickness of the entire camera module.
  • the support of the photosensitive chip can be realized through the arrangement of the supporting structure, thereby improving the connection strength between the photosensitive chip and the substrate, thereby enhancing the strength and reliability of the entire camera module.
  • the supporting structure includes a cured rubber block arranged on the surface of the photosensitive chip away from the lens; the cured rubber block is located in the mounting hole and is opposite to the inner wall of the mounting hole Pick up.
  • the supporting structure includes a supporting plate disposed on the photosensitive chip away from the lens, and the supporting plate is located in the mounting hole and connected with the inner wall of the mounting hole.
  • the mounting hole is a stepped hole
  • the supporting structure is a stepped surface of the stepped hole
  • the substrate includes a first surface and a second surface disposed opposite to each other, the second surface is used to connect with the lens, and the mounting hole penetrates from the second surface to the The first surface; the distance between the surface of the support structure away from the photosensitive chip and the second surface is less than or equal to the distance between the first surface and the second surface.
  • the substrate includes a first surface and a second surface disposed opposite to each other, the second surface is used to connect with the lens, and the mounting hole is opened by the second surface and faces the The first surface extends;
  • the photosensitive chip includes an upper surface and a lower surface opposite to each other, the upper surface is opposite to the lens, and the distance between the lower surface and the second surface is smaller than the mounting hole The distance between the lower surface and the second surface is greater than or equal to the distance between the upper surface and the lower surface.
  • the inner wall of the mounting hole is provided with a first limiting structure
  • the side wall of the photosensitive chip is provided with a second limiting structure
  • the first limiting structure and the second limiting structure Cooperate to define the relative position between the photosensitive chip and the substrate in the circumferential direction of the mounting hole.
  • the substrate is a PCB board
  • a first electrode pin is provided on the PCB board
  • a second electrode pin is provided on the photosensitive chip
  • the first electrode pin is connected to the first electrode pin.
  • the two electrode pins are electrically connected by metal wires.
  • the base further includes a filter, and the filter is attached to the photosensitive chip.
  • the base further includes a connecting structure, and the connecting structure is disposed in the gap and is connected to the photosensitive chip respectively.
  • the substrate is connected to fix the photosensitive chip on the substrate.
  • the connecting structure is a cured rubber block filling the gap.
  • the substrate includes a first surface and a second surface disposed opposite to each other, the second surface is used to connect with the lens, and the mounting hole is opened by the second surface and faces the The first surface extends; wherein, in the direction from the second surface to the first surface, the distance between the inner wall of the mounting hole and the side wall of the photosensitive chip gradually decreases.
  • the photosensitive chip and the mounting hole are arranged coaxially.
  • the base further includes a bracket, which is arranged between the substrate and the lens to connect the lens and the substrate; wherein a first positioning structure is provided on the bracket, and the A second positioning structure is provided on the substrate, and the first positioning structure cooperates with the second positioning structure to define the mounting position of the bracket on the substrate.
  • the bracket is a hollow structure with open ends, a groove is provided on the substrate, and the bracket is installed in the groove; wherein the bracket is inserted into one end of the groove Is the first positioning structure, and the groove is the second positioning structure.
  • the base further includes a package body formed on the substrate for connecting the lens and the substrate.
  • the package body covers the edge of the photosensitive chip.
  • the packaging body and the connecting structure are integrally formed.
  • a camera module includes: a lens; and the base as described in any one of the above, and the base is connected with the lens.
  • An electronic device includes the above-mentioned camera module.
  • FIG. 1 is a schematic cross-sectional view of a camera module provided by an embodiment.
  • FIG. 2 is a schematic cross-sectional view of a matching position between a substrate and a photosensitive chip provided by another embodiment.
  • FIG 3 is a schematic cross-sectional view of a mating method of the substrate of the camera module and the photosensitive chip provided by an embodiment.
  • FIG. 4 is a top view of the mating of the substrate and the photosensitive chip of the camera module provided by an embodiment.
  • Fig. 5 is a cross-sectional view in the direction of C-C in Fig. 4.
  • FIG. 6 is a cross-sectional view of the mating of the bracket of the camera module and the substrate provided by another embodiment.
  • FIG. 7 is a schematic cross-sectional view of a camera module provided by another embodiment.
  • Fig. 8 is a schematic diagram of an electronic device provided by an embodiment.
  • the camera module 100 mainly includes a base 10 and a lens 20, wherein the base 10 is used to carry the lens 20.
  • the base 10 includes a substrate 1, a photosensitive chip 2, a connecting structure 3, a filter 4, a bracket 5, and a supporting structure 6.
  • the photosensitive chip 2 is connected to the substrate 1 through the connecting structure 3, and the substrate 1 passes through
  • the bracket 5 is connected to the lens 20.
  • the substrate 1 is a PCB board, and the substrate 1 includes a first surface 11 and a second surface 12 arranged opposite to each other, and a mounting hole 13, wherein the second surface 12 is used to connect with the lens 20
  • the mounting hole 13 is opened by the second surface 12 of the substrate 1 and extends to the first surface 11.
  • the mounting hole 13 may be a blind hole or a through hole. Among them, in order to facilitate production and processing, in this embodiment, the mounting hole 13 penetrates from the second surface 12 to the first surface 11.
  • the photosensitive chip 2 is disposed in the mounting hole 13 and opposite to the lens 20.
  • the supporting structure 6 is connected to the inner wall 131 of the mounting hole 13 and is connected to the lower surface 23 of the photosensitive chip 2 to support the photosensitive chip 2.
  • the upper surface 22 of the photosensitive chip 2 is connected to the lens 20.
  • the lower surface 23 and the upper surface 22 of the photosensitive chip 2 are arranged opposite to each other.
  • the substrate 1 is placed horizontally.
  • the second surface 12 is parallel to the horizontal plane, and the optical axis of the lens 20 is perpendicular to the horizontal plane.
  • the photosensitive chip 2 is arranged in the mounting hole 13, so that the space occupied by the substrate 1 in the vertical direction (that is, in the direction of the optical axis) is effectively used, and the assembly of the photosensitive chip 2 and the substrate 1 is reduced.
  • the vertical size of the entire camera module 100 can be reduced, that is, the thickness of the camera module 100 can be reduced.
  • the connecting structure 3 is arranged in the gap 7 between the side wall 21 of the photosensitive chip 2 and the inner wall 131 of the mounting hole 13, which can effectively use the space occupied by the substrate 1 in the horizontal direction, and avoid the exposure
  • the connection of the chip 2 and the substrate 1 increases the size of the camera module 100 in the vertical direction.
  • the supporting structure 6 is arranged in the mounting hole 13 and supports the photosensitive chip 2, which can improve the connection strength between the photosensitive chip 2 and the substrate 1, and reduce the loss of the photosensitive chip 2 from the substrate 1. risk. It is understandable that in other embodiments, only the supporting structure 6 may be provided and the connecting structure 3 is omitted, that is, the connection between the photosensitive chip 2 and the substrate 1 is realized only through the supporting structure 6, and the gap 7 may also be Omit.
  • the lower surface 23 of the photosensitive chip 2 is located in the mounting hole 13, and a certain distance from the first surface 11 of the substrate 1.
  • the lower surface 23 of the photosensitive chip 2 and the inner wall of the mounting hole 13 A accommodating space is formed between 131 and the connecting structure 3, and the supporting structure 6 may be formed by curing the glue filled in the accommodating space.
  • the distance between the surface of the supporting structure 6 away from the photosensitive chip 2 and the lens 20 is less than or equal to the distance between the first surface 11 of the substrate 1 and the lens 20, which can not only increase the distance between the photosensitive chip 2 and the substrate 1
  • the connection strength can also effectively avoid increasing the thickness of the base 10, which is beneficial to the miniaturized design of the camera module 100.
  • the supporting structure 6 can also be arranged in other ways.
  • the supporting structure 6 can be a supporting plate arranged in the containing space, and the supporting plate is connected to the inner wall of the mounting hole by glue or the like.
  • the lower surface 23 of the photosensitive chip 2 may be adhered by glue, or it may only abut the lower surface 23 of the photosensitive chip 2.
  • the support plate can be a steel plate, aluminum plate or copper plate with high heat dissipation function.
  • the thickness of the support plate is set appropriately so that the distance between the surface of the support plate (ie, the support structure 6) away from the photosensitive chip 2 and the lens 20 after assembly is less than or equal to the substrate The distance between the first surface 11 of 1 and the lens 20.
  • the mounting hole 13 is a stepped hole, and the diameter (or width) of the end of the stepped hole close to the second surface 12 is larger than the diameter (or width) of the end close to the first surface 11.
  • the step surface of the stepped hole can directly serve as the supporting structure 6.
  • the connecting structure 3 is a cured glue block filled in the gap 7, that is, the connecting structure 3 is formed by curing the glue filled in the gap 7.
  • the connecting structure 3 can also be arranged in other ways, for example, the connecting structure 3 can be provided with double-sided tape in the gap 7 and the like.
  • the thickness of the substrate 1 is greater than the thickness of the photosensitive chip 2, that is, the distance between the first surface 11 and the second surface 12 is greater than or equal to the distance between the upper surface 22 and the lower surface 23. spacing.
  • the photosensitive chip 2 does not protrude from the mounting hole 13, that is, the depth of the mounting hole 13 is greater than or equal to the thickness of the photosensitive chip 2, and the distance between the lower surface 23 and the second surface 12 is smaller than the depth of the mounting hole 13, namely
  • the surface 23 is located in the mounting hole 13 and is spaced a certain distance from the first surface 11 for the support structure 6 to be provided.
  • the distance between the lower surface 23 and the second surface 12 is greater than or equal to the thickness of the photosensitive chip 2.
  • the photosensitive chip 2 is completely placed in the mounting hole 13, which can increase the area of the sidewall 21 of the photosensitive chip 2 and the inner wall 131 of the mounting hole 13, thereby increasing the size of the photosensitive chip 2.
  • the contact area of the side wall 21 and the connection structure 3 improves the connection strength between the photosensitive chip 2 and the substrate 1.
  • the side wall 21 of the photosensitive chip 2 is not in contact with the inner wall 131 of the mounting hole 13, that is, there is a gap 7 between the periphery of the side wall 21 of the photosensitive chip 2 and the inner wall 131 of the mounting hole 13. In this way, the contact area between the connection structure 3 and the photosensitive chip 2 can also be increased, and the connection strength between the photosensitive chip 2 and the substrate 1 can be improved.
  • the photosensitive chip 2 is coaxially arranged with the mounting hole 13, so that the gap 7 between the side wall 21 of the photosensitive chip 2 and the inner wall 131 of the mounting hole 13 is the same everywhere, so that the connection around the photosensitive chip 2
  • the thickness of the structure 3 is the same, so that after the base 10 is assembled, the connection strength between the photosensitive chip 2 and the substrate 1 is the same everywhere, which enhances the anti-destructive ability of the base 10 and improves the service life of the base 10.
  • the mounting hole 13 in the direction from the second surface 12 to the first surface 11, between the inner wall 131 of the mounting hole 13 and the side wall 21 of the photosensitive chip 2 The distance between the mounting holes 13 is gradually reduced, that is, the mounting hole 13 has a funnel-shaped structure, which not only facilitates the placement of the photosensitive chip 2 in the mounting hole 13, but also prevents the glue overflow from contaminating the photosensitive chip 2 when glue is applied to the gap 7.
  • the mounting hole 13 adopts this arrangement, and the connecting structure 3 formed after the glue is solidified has a tapered or trapezoidal structure. When matched with the mounting hole 13, it can act as a wedge, so that the photosensitive chip 2 can be better carried. .
  • a first electrode pin 14 is provided on the substrate 1 (ie, a PCB board), a second electrode pin 24 is provided on the photosensitive chip 2, and the first electrode pin 14 and the first electrode pin 14 are The two electrode pins 24 are electrically connected by a metal wire 8 (such as a gold wire, etc.) to realize power supply and data transmission between the substrate 1 and the photosensitive chip 2.
  • a metal wire 8 such as a gold wire, etc.
  • the inner wall 131 of the mounting hole 13 is provided with a first limiting structure 132
  • the side wall 21 of the photosensitive chip 2 is provided with a second limiting structure 25, which passes through the first limiting structure.
  • the positioning structure 132 cooperates with the second limiting structure 25 to limit the position of the photosensitive chip 2 relative to the substrate 1 in the circumferential direction of the mounting hole 13, so that the photosensitive chip 2 can be mounted more accurately, so that the first electrode pin 14 and the corresponding second
  • the electrode pins 24 correspond more accurately, and it is more convenient to electrically connect the first electrode pins 14 and the second electrode pins 24 through the metal wire 8.
  • the first limiting structure 132 is an installation groove provided on the inner wall of the installation hole 13.
  • the installation groove is opened by the second surface 12 and extends toward the first surface 11.
  • the installation groove Extending to the first surface 11; the second limiting structure 25 is a raised structure arranged on the side wall of the photosensitive chip 2, wherein the width of the raised structure matches the width of the mounting groove to prevent the photosensitive chip 2 from being installed in the mounting hole 13 Later shake in the horizontal direction.
  • first limiting structure 132 and the second limiting structure 25 may also be arranged in other ways, for example, the first limiting structure 132 is a protrusion provided on the inner wall 131 of the mounting hole 13 Structure, the second limiting structure 25 is a mounting groove provided on the side wall 21 of the photosensitive chip 2.
  • the filter 4 is attached to the photosensitive chip 2, so that the distance between the filter 4 and the photosensitive chip 2 can be reduced, thereby reducing the light in the filter 4 and The number of reflections between the photosensitive chips 2 avoids the phenomenon of light spots.
  • the bracket 5 includes a bottom surface 51 and a top surface 52 opposite to each other, wherein the bottom surface 51 is connected to the substrate 1, and the top surface 52 is connected to the lens 20.
  • the bracket 5 is provided with a first positioning structure 53 and the base plate 1 is provided with a second positioning structure 14.
  • the bracket 5 is a hollow structure with open ends, that is, the bracket 5 further has a receiving cavity 54 penetrating from the bottom surface 51 to the top surface 52.
  • the substrate 1 is provided with a groove 140, and the bracket 5 is installed in the groove 140.
  • the thickness of the side wall of the end 540 of the bracket 5 into the groove 140 is the same as the width of the groove 140. At this time, the bracket 5 is inserted into the groove 140.
  • the side wall of one end 540 of the groove is the first positioning structure 53, and the groove 140 is the second positioning structure 14. This arrangement can also reduce the thickness of the entire camera module 100 to a certain extent.
  • the bracket 5 is matched with the substrate 1, the photosensitive chip 2 and the filter 4 are opposed to the receiving cavity 54 of the bracket 5, and the external light passes through the lens 20 and is transmitted from the receiving cavity 54 to the filter. 4 and 2 photosensitive chips.
  • the electronic components, the first electrode 14, the second electrode 24, and the metal wire 8 on the substrate 1 are also located in the accommodating cavity 54. These components can be protected by the bracket 5 to improve imaging The service life and safety performance of the module 100.
  • the outer side wall of the groove 140 can also be omitted.
  • the thickness of the middle part of the substrate 1 is greater than the thickness of the outer peripheral part of the substrate 1, that is, the substrate 1 is similar to a trapezoidal structure.
  • the side wall 15 of the substrate 1 may be flush with the side wall 55 of the support 5.
  • the base 10 is not provided with a bracket 5, but is provided with a package body 9, wherein the package body 9 is provided between the substrate 1 and the lens 20 to connect the lens 20 and the substrate 1, that is, in this embodiment, the package body 9 is used to replace the bracket 5 of the above embodiment.
  • the package body 9 is molded on the substrate 1 and is a hollow structure with open ends formed by applying glue on the substrate 1 and curing.
  • the package body 9 covers the electronic components, the first electrode 14, the second electrode 24 and the substrate 1 on the substrate 1. Metal wires 8, etc., to protect these components.
  • the package body 9 also covers the edge of the photosensitive chip 2 to improve the connection strength between the photosensitive chip 2 and the substrate 1.
  • the photosensitive chip 2 includes a photosensitive area 210 and an edge area 220 located around the photosensitive area 210.
  • the photosensitive area 210 is opposite to the lens 20 so as to receive light from the lens 20.
  • the package 9 covers the photosensitive chip 2 The edge area 220.
  • the package body 9 and the connection structure 3 may be an integrally formed structure, that is, in the production process, the package body 9 and the connection structure 3 can be formed at the same time by applying glue once.
  • the present application also provides an electronic device 1000 that uses the camera module 100 described in any of the above embodiments, wherein the electronic device 1000 may be a terminal such as a smart phone or a tablet computer. product.

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Abstract

本申请涉及一种底座(10)、摄像模组(100)及电子设备(1000)。该底座(10)，用于承载镜头(20)，包括：基板(1)，与镜头(20)相接，基板(1)设有安装孔(13)；感光芯片(2)，设置在安装孔(13)内，与镜头(20)相对；以及支撑结构(6)，设置在安装孔(13)内，与安装孔(13)的内壁(131)连接，并与感光芯片(2)远离镜头(20)的表面相接，以支撑感光芯片(2)。

Description

底座、摄像模组及电子设备
相关申请的交叉引用
本申请要求于2019年08月14日提交中国专利局、申请号为201921312330.9、名称为“底座、摄像模组及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及摄像头技术领域，特别是涉及一种底座、摄像模组及电子设备。
背景技术
摄像模组是目前在消费电子领域中的热点之一，广泛应用于智能手机、平板电脑等终端电子设备上。为了满足消费者的需求，智能手机、平板电脑等终端电子设备朝着薄型化方向发展，进而要求摄像模组也朝着薄型化方向发展。
摄像模组通常包括底座和镜头两部分，其中，底座包括基板、感光芯片。为了使摄像模组更薄，可以在基板上设有安装孔，感光芯片设置在安装孔内，且感光芯片的侧壁通过胶水等与安装孔的内壁连接。这种设置方式虽然可以在一定程度上降低摄像模组的厚度，但是感光芯片与基板之间的连接强度较低，易脱落损坏。
发明内容
基于此，本申请提供一种底座、摄像模组及电子设备。
一种底座，用于承载镜头，包括：基板，与所述镜头相接，所述基板设有 安装孔；感光芯片，设置在所述安装孔内，与所述镜头相对；以及支撑结构，设置在所述安装孔内，与所述安装孔的内壁连接，并与所述感光芯片远离所述镜头的表面相接，以支撑所述感光芯片。
在本申请的实施例提供的底座中，感光芯片设置在基板的安装孔内，可以降低基板与感光芯片的总厚度，进而降低整个摄像模组的厚度。同时，通过支撑结构的设置可以实现对感光芯片的支撑，从而提高感光芯片与基板之间的连接强度，进而增强整个摄像模组的强度和可靠性。
在一个实施例中，所述支撑结构包括设置在所述感光芯片远离所述镜头的表面上的固化胶块；所述固化胶块位于所述安装孔内，并与所述安装孔的内壁相接。
在一个实施例中，所述支撑结构包括设置在所述感光芯片远离所述镜头上的支撑板，所述支撑板位于所述安装孔内，并与所述安装孔的内壁相接。
在一个实施例中，所述安装孔为阶梯孔，所述支撑结构为所述阶梯孔的台阶面。
在一个实施例中，所述基板包括相背设置的第一表面和第二表面，所述第二表面用于与所述镜头相接，所述安装孔由所述第二表面贯穿至所述第一表面；所述支撑结构远离所述感光芯片的表面与所述第二表面之间的间距小于或等于所述第一表面与所述第二表面之间的间距。
在一个实施例中，所述基板包括相背设置的第一表面和第二表面，所述第二表面用于与所述镜头相接，所述安装孔由所述第二表面开设并向所述第一表面延伸；所述感光芯片包括相背设置的上表面和下表面，所述上表面与所述镜头相对，所述下表面与所述第二表面之间的间距小于所述安装孔的深度，所述下表面与所述第二表面之间的间距大于或等于所述上表面与所述下表面之间的间距。
在一个实施例中，所述安装孔的内壁设有第一限位结构，所述感光芯片的侧壁设有第二限位结构，所述第一限位结构与所述第二限位结构配合，以在所述安装孔周向上限定所述感光芯片与所述基板之间的相对位置。
在一个实施例中，所述基板为PCB板，所述PCB板上设有第一电极引脚，所述感光芯片上设有第二电极引脚，所述第一电极引脚与所述第二电极引脚之间通过金属线电性连接。
在一个实施例中，所述底座还包括滤光片，所述滤光片贴设在所述感光芯片上。
在一个实施例中，所述感光芯片的侧壁与所述安装孔的内壁之间具有间隙；所述底座还包括连接结构，所述连接结构设置在所述间隙内，分别与所述感光芯片以及所述基板相接，以将所述感光芯片固定在所述基板上。
在一个实施例中，所述连接结构为填充所述间隙内的固化胶块。
在一个实施例中，所述基板包括相背设置的第一表面和第二表面，所述第二表面用于与所述镜头相接，所述安装孔由所述第二表面开设并向所述第一表面延伸；其中，在由所述第二表面至所述第一表面的方向上，所述安装孔的内壁与所述感光芯片的侧壁之间的间距逐渐减小。
在一个实施例中，所述感光芯片与所述安装孔同轴设置。
在一个实施例中，所述底座还包括支架，设置在所述基板与所述镜头之间，以连接所述镜头和所述基板；其中，所述支架上设有第一定位结构，所述基板上设有第二定位结构，所述第一定位结构与所述第二定位结构配合，以限定所述支架在所述基板上的安装位置。
在一个实施例中，所述支架为两端开口的中空结构，所述基板上设有凹槽，所述支架安装在所述凹槽内；其中，所述支架置入所述凹槽的一端为所述第一定位结构，所述凹槽为所述第二定位结构。
在一个实施例中，所述底座还包括封装体，成型在所述基板上，用于连接所述镜头和所述基板。
在一个实施例中，所述封装体覆盖所述感光芯片的边缘。
在一个实施例中，所述封装体与所述连接结构为一体成型结构。
一种摄像模组，包括：镜头；以及如上任一项所述的底座，所述底座与所述镜头相接。
一种电子设备，包括如上所述的摄像模组。
附图说明
图1为一实施例提供的摄像模组的剖面示意图。
图2为另一实施例提供的基板与感光芯片配合处的剖面示意图。
图3为一实施例提供的摄像模组的基板与感光芯片一种配合方式的剖面示意图。
图4为一实施例提供的摄像模组的基板与感光芯片配合的俯视图。
图5为图4中C-C向的剖面视图。
图6为另一实施例提供的摄像模组的支架与基板配合的剖面视图。
图7为另一实施例提供的摄像模组的剖面示意图。
图8为一实施例提供的电子设备的示意图。
具体实施方式
为使本申请的上述目的、特征和优点能够更加明显易懂，下面结合附图对本申请的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本申请。但是本申请能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本申请内涵的情况下做类似改进，因此本申请不受下面公开的具体实施的限制。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。
如图1所示，本实施例提供的摄像模组100主要包括底座10和镜头20，其 中，底座10用于承载镜头20。在本实施例中，底座10包括基板1、感光芯片2、连接结构3、滤光片4、支架5以及支撑结构6，其中，感光芯片2通过连接结构3与基板1相接，基板1通过支架5与镜头20相接。
具体的，在本实施例中，基板1为PCB板，基板1包括相背设置的第一表面11和第二表面12，以及安装孔13，其中，第二表面12用于与镜头20相接，安装孔13由基板1的第二表面12开设，并向第一表面11延伸。安装孔13可以是盲孔也可以是通孔。其中，为了方便生产加工，在本实施例中，安装孔13由第二表面12贯穿至第一表面11。感光芯片2设置在安装孔13内，并与镜头20相对。感光芯片2的侧壁21与安装孔13的内壁131之间具有间隙7，连接结构3设置在间隙7内，以便将感光芯片2固定在基板1上。支撑结构6与安装孔13的内壁131相接，并与感光芯片2的下表面23相接，以便对感光芯片2进行支撑，其中，在本实施例中，感光芯片2上表面22与镜头20相对，以接收从镜头20内传出的光线，感光芯片2的下表面23与上表面22相背设置。
在本实施例中，假设基板1水平放置，此时，第二表面12与水平面平行，镜头20的光轴与水平面垂直。在本实施例中，感光芯片2设置在安装孔13内，使得基板1在竖直方向上(即在光轴方向上)所占据的空间得到有效利用，降低感光芯片2与基板1组装后的厚度，从而可以降低整个摄像模组100的在竖直方向上的尺寸，即降低摄像模组100的厚度。同时，在本实施例中，连接结构3设置在感光芯片2的侧壁21与安装孔13的内壁131之间的间隙7内，可以有效利用基板1在水平方向所占据的空间，避免因感光芯片2与基板1的连接而增大摄像模组100在竖直方向上的尺寸。
同时，在本实施例中，支撑结构6设置在安装孔13内，并对感光芯片2进行支撑，可以提高感光芯片2与基板1之间的连接强度，降低感光芯片2从基板1上脱落的风险。可以理解的，在其他实施例中，也可以是只设有支撑结构6而省去连接结构3，即只通过支撑结构6实现感光芯片2与基板1之间的连接，此时间隙7也可以省去。
在本实施例中，感光芯片2的下表面23位于安装孔13内，并与基板1的 第一表面11之间相距一定距离，此时，感光芯片2的下表面23、安装孔13的内壁131以及连接结构3之间围绕形成一个容纳空间，支撑结构6可以是由填充在该容纳空间内的胶水固化后所形成。此时，支撑结构6远离感光芯片2的表面与镜头20之间的间距小于或等于基板1的第一表面11与镜头20之间的间距，这样不仅可以提高感光芯片2与基板1之间的连接强度，还可以有效避免增大底座10的厚度，有利于摄像模组100的小型化设计。
当然，在其他实施例中，支撑结构6也可以是其他设置方式，比如支撑结构6可以是设置在容纳空间内的支撑板，支撑板板通过胶水等与安装孔的内壁连接，此时支撑板可以通过胶水与感光芯片2的下表面23粘接，也可以是仅与感光芯片2的下表面23抵接。同时，支撑板可以是钢板、铝板或者铜板等具有高散热功能的板材。此外，为了利于摄像模组100的小型化设计，支撑板的厚度设置合适，以便在组装后使得支撑板(即支撑结构6)远离感光芯片2的表面与镜头20之间的间距小于或等于基板1的第一表面11与镜头20之间的间距。
如图2所示，在另一实施例中，安装孔13为阶梯孔，且阶梯孔靠近第二表面12的一端的直径(或宽度)大于靠近第一表面11一端的直径(或宽度)，此时，阶梯孔的台阶面可以直接作为支撑结构6。
在本实施例中，连接结构3为填充在间隙7内的固化胶块，即连接结构3是由填充在间隙7内的胶水固化后形成的。当然，在其他实施例中，连接结构3也可以采用其他设置方式，比如连接结构3可以的设置在间隙7内的双面胶等。
如图1所示，在本实施例中，基板1的厚度大于感光芯片2的厚度，即第一表面11与第二表面12之间的间距大于或等于上表面22与下表面23之间的间距。另外，感光芯片2不凸出安装孔13，即，安装孔13的深度大于或等于感光芯片2的厚度，且下表面23与第二表面12之间的间距小于安装孔13的深度，即下表面23位于安装孔13内，并与第一表面11之间间隔一定距离，以便设置支撑结构6。同时，下表面23与第二表面12之间的间距大于或等于感光芯片2的厚度。也即，在本实施例中，感光芯片2完全置于安装孔13内，这样可以增大感光芯片2的侧壁21与安装孔13的内壁131相对区域的面积，进而增大感 光芯片2的侧壁21与连接结构3接触的面积，提高感光芯片2与基板1之间的连接强度。
进一步的，在本实施例中，感光芯片2的侧壁21不与安装孔13的内壁131相接触，即感光芯片2的侧壁21的四周与安装孔13的内壁131之间都有间隙7，这样也可以增大连接结构3与感光芯片2的接触面积，提高感光芯片2与基板1之间的连接强度。同时，在本实施例中，感光芯片2与安装孔13同轴设置，这样感光芯片2的侧壁21与安装孔13内壁131之间的间隙7处处相同，从而可以使感光芯片2周围的连接结构3的厚度相同，这样底座10组装完成后，感光芯片2与基板1连接处的连接强度处处相同，增强底座10的抗破坏能力，提高底座10的使用寿命。
如图3所示，在本实施例的一种优选的实施方式中，在由第二表面12至第一表面11的方向上，安装孔13的内壁131与感光芯片2的侧壁21之间的间距逐渐减小，即安装孔13呈漏斗状结构，这样不仅方便将感光芯片2放置在安装孔13内，而且在向间隙7内涂胶时还可以避免胶液外溢污染感光芯片2。同时，安装孔13采用这种设置方式，胶液固化后形成的连接结构3呈锥形或梯形结构，与安装孔13配合时可以起到楔子的作用，使感光芯片2可以得到更好的承载。
如图4所示，在本实施例中，基板1(即PCB板)上设有第一电极引脚14，感光芯片2上设有第二电极引脚24，第一电极引脚14与第二电极引脚24之间通过金属线8(比如金线等)电性连接，以便实现基板1与感光芯片2之间的供电以及数据传输。
如图4和图5所示，在本实施例中，安装孔13的内壁131设有第一限位结构132，感光芯片2的侧壁21设有第二限位结构25，通过第一限位结构132与第二限位结构25配合，可以限定感光芯片2在安装孔13周向上相对基板1的位置，使得感光芯片2安装的更精准，使得第一电极引脚14与相应的第二电极引脚24对应的更精准，更方便通过金属线8将第一电极引脚14与第二电极引脚24电性连接。
具体的，在本实施例中，第一限位结构132为设置在安装孔13内壁上的安 装槽，安装槽由第二表面12开设，并朝向第一表面11延伸，为了生产方便，安装槽延伸至第一表面11；第二限位结构25为设置在感光芯片2侧壁的凸起结构，其中，凸起结构的宽度与安装槽的宽度匹配，避免感光芯片2安装在安装孔13内以后在水平方向上晃动。可以理解的，在其他实施例中，第一限位结构132和第二限位结构25也可以是其他设置方式，比如第一限位结构132为设置在安装孔13的内壁131上的凸起结构，第二限位结构25为设置在感光芯片2的侧壁21上的安装槽。
如图1所示，在本实施例中，滤光片4贴设在感光芯片2上，这样可以减小滤光片4与感光芯片2之间的距离，进而减少光线在滤光片4和感光芯片2之间的反射次数，避免光斑现象的产生。
如图1所示，在本实施例中，支架5包括相背设置的底面51和顶面52，其中，底面51与基板1相接，顶面52与镜头20相接。其中，支架5上设有第一定位结构53，基板1上设有第二定位结构14，通过第一定位结构53与第二定位结构14配合，可以限定支架5在基板1上的安装位置。具体的，在本实施例中，支架5为两端开口的中空结构，即支架5还具有一从底面51贯穿至顶面52的容纳腔54。基板1上设有凹槽140，支架5安装在凹槽140内，其中，支架5置入凹槽140的一端540的侧壁的厚度与凹槽140的宽度相同，此时，支架5置入凹槽的一端540的侧壁便为第一定位结构53，凹槽140便为第二定位结构14，这样设置也可以在一定程度上降低整个摄像模组100的厚度。
另外，在本实施例中，支架5与基板1配合后，感光芯片2、滤光片4与支架5的容纳腔54相对，外部光线穿过镜头20后从容纳腔54内传递至滤光片4和感光芯片2处。同时，支架5与基板1配合后，基板1上的电子元件、第一电极14、第二电极24以及金属线8等也位于容纳腔54内，通过支架5可以对这些元件进行保护，提高摄像模组100的使用寿命和安全性能。
如图6所示，在另一实施例中，凹槽140的外侧壁也可以省去，此时基板1的中间部位的厚度大于基板1的外周部位的厚度，即基板1类似一梯形结构，进一步的，基板1的侧壁15可以是与支架5的侧壁55平齐。
如图7所示，在本申请提供的另一实施例中，底座10未设置支架5，而是设置了封装体9，其中，封装体9设置在基板1与镜头20之间，以连接镜头20和基板1，即在本实施例中，利用封装体9来替代上述实施例的支架5。封装体9成型在基板1上，是通过在基板1上涂胶并固化所形成的两端开口的中空结构，封装体9覆盖基板1上的电子元件、第一电极14、第二电极24以及金属线8等，以便对这些元件进行保护。同时，封装体9还覆盖感光芯片2的边缘，以提高感光芯片2与基板1之间的连接强度。具体的，感光芯片2包括感光区210以及位于感光区210四周的边缘区220，其中，感光区210与镜头20相对，以便接收从镜头20传入的光线，封装体9覆盖在感光芯片2的边缘区220。
另外，在本实施例中，封装体9和连接结构3可以是一体成型结构，即生产过程中，可以通过一次涂胶同时形成封装体9和连接结构3。
如图8所示，本申请还提供了一种电子设备1000，该电子设备1000使用了上述任一实施例所述的摄像模组100，其中，电子设备1000可以是智能手机、平板电脑等终端产品。
上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (20)

  1. 一种底座，用于承载镜头，包括：
    基板，用于与所述镜头相连接，所述基板设有安装孔；
    感光芯片，设置在所述安装孔内，与所述镜头相对；以及
    支撑结构，设置在所述安装孔内，与所述安装孔的内壁连接，并与所述感光芯片远离所述镜头的表面相接，以支撑所述感光芯片。
  2. 根据权利要求1所述的底座，其中，所述支撑结构包括设置在所述感光芯片远离所述镜头的表面上的固化胶块；所述固化胶块位于所述安装孔内，并与所述安装孔的内壁相接。
  3. 根据权利要求1所述的底座，其中，所述支撑结构包括设置在所述感光芯片远离所述镜头上的支撑板，所述支撑板位于所述安装孔内，并与所述安装孔的内壁相接。
  4. 根据权利要求1所述的底座，其中，所述安装孔为阶梯孔，所述支撑结构为所述阶梯孔的台阶面。
  5. 根据权利要求1所述的底座，其中，所述基板包括相背设置的第一表面和第二表面，所述第二表面用于与所述镜头相接，所述安装孔由所述第二表面贯穿至所述第一表面；所述支撑结构远离所述感光芯片的表面与所述第二表面之间的间距小于或等于所述第一表面与所述第二表面之间的间距。
  6. 根据权利要求1所述的底座，其中，所述基板包括相背设置的第一表面和第二表面，所述第二表面用于与所述镜头相接，所述安装孔由所述第二表面开设并向所述第一表面延伸；所述感光芯片包括相背设置的上表面和下表面，所述上表面与所述镜头相对，所述下表面与所述第二表面之间的间距小于所述安装孔的深度，所述下表面与所述第二表面之间的间距大于或等于所述上表面与所述下表面之间的间距。
  7. 根据权利要求1所述的底座，其中，所述安装孔的内壁设有第一限位结构，所述感光芯片的侧壁设有第二限位结构，所述第一限位结构与所述第二限位结构配合，以在所述安装孔周向上限定所述感光芯片与所述基板之间的相对 位置。
  8. 根据权利要求1所述的底座，其中，所述基板为PCB板，所述PCB板上设有第一电极引脚，所述感光芯片上设有第二电极引脚，所述第一电极引脚与所述第二电极引脚之间通过金属线电性连接。
  9. 根据权利要求1所述的底座，其中，所述底座还包括滤光片，所述滤光片贴设在所述感光芯片上。
  10. 根据权利要求1所述的底座，其中，所述感光芯片的侧壁与所述安装孔的内壁之间具有间隙；所述底座还包括连接结构，所述连接结构设置在所述间隙内，分别与所述感光芯片以及所述基板相接，以将所述感光芯片固定在所述基板上。
  11. 根据权利要求10所述的底座，其中，所述连接结构为填充所述间隙内的固化胶块。
  12. 根据权利要求1所述的底座，其中，所述基板包括相背设置的第一表面和第二表面，所述第二表面用于与所述镜头相接，所述安装孔由所述第二表面开设并向所述第一表面延伸；其中，在由所述第二表面至所述第一表面的方向上，所述安装孔的内壁与所述感光芯片的侧壁之间的间距逐渐减小。
  13. 根据权利要求1所述的底座，其中，所述感光芯片与所述安装孔同轴设置。
  14. 根据权利要求1所述的底座，其中，所述底座还包括支架，设置在所述基板上，用于连接所述镜头和所述基板；其中，所述支架上设有第一定位结构，所述基板上设有第二定位结构，所述第一定位结构与所述第二定位结构配合，以限定所述支架在所述基板上的安装位置。
  15. 根据权利要求14所述的底座，其中，所述支架为两端开口的中空结构，所述基板上设有凹槽，所述支架安装在所述凹槽内；其中，所述支架置入所述凹槽的一端为所述第一定位结构，所述凹槽为所述第二定位结构。
  16. 根据权利要求1所述的底座，其中，所述底座还包括封装体，成型在所述基板上，用于连接所述镜头和所述基板。
  17. 根据权利要求16所述的底座，其中，所述封装体覆盖所述感光芯片的边缘。
  18. 根据权利要求16所述的底座，其中，所述封装体与所述连接结构为一体成型结构。
  19. 一种摄像模组，包括：
    镜头；以及
    底座，与所述镜头相接，所述底座包括：
    基板，用于与所述镜头相连接，所述基板设有安装孔；
    感光芯片，设置在所述安装孔内，与所述镜头相对；以及
    支撑结构，设置在所述安装孔内，与所述安装孔的内壁连接，并与所述感光芯片远离所述镜头的表面相接，以支撑所述感光芯片。
  20. 一种电子设备，包括摄像模组；
    其中，所述摄像模组包括：
    镜头；以及
    底座，与所述镜头相接，所述底座包括：
    基板，用于与所述镜头相连接，所述基板设有安装孔；
    感光芯片，设置在所述安装孔内，与所述镜头相对；以及
    支撑结构，设置在所述安装孔内，与所述安装孔的内壁连接，并与所述感光芯片远离所述镜头的表面相接，以支撑所述感光芯片。
PCT/CN2020/109063 2019-08-14 2020-08-14 底座、摄像模组及电子设备 WO2021027906A1 (zh)

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