WO2021027905A1 - 底座、摄像模组及电子设备 - Google Patents

底座、摄像模组及电子设备 Download PDF

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Publication number
WO2021027905A1
WO2021027905A1 PCT/CN2020/109055 CN2020109055W WO2021027905A1 WO 2021027905 A1 WO2021027905 A1 WO 2021027905A1 CN 2020109055 W CN2020109055 W CN 2020109055W WO 2021027905 A1 WO2021027905 A1 WO 2021027905A1
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WO
WIPO (PCT)
Prior art keywords
substrate
photosensitive chip
base
mounting hole
lens
Prior art date
Application number
PCT/CN2020/109055
Other languages
English (en)
French (fr)
Inventor
马忠科
陈小凤
申成哲
Original Assignee
欧菲光集团股份有限公司
南昌欧菲光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 欧菲光集团股份有限公司, 南昌欧菲光电技术有限公司 filed Critical 欧菲光集团股份有限公司
Priority to US17/634,984 priority Critical patent/US20220294941A1/en
Priority to EP20852137.7A priority patent/EP4016982A1/en
Publication of WO2021027905A1 publication Critical patent/WO2021027905A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1686—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • This application relates to the field of camera technology, in particular to a base, camera module and electronic equipment.
  • Camera modules are currently one of the hot spots in the consumer electronics field and are widely used in terminal electronic devices such as smart phones and tablet computers.
  • terminal electronic devices such as smart phones and tablet computers are developing in the direction of thinning, which in turn requires the development of camera modules in the direction of thinning.
  • this application provides a base, a camera module, and an electronic device.
  • a base for carrying a lens comprising: a substrate for connecting with the lens, the substrate is provided with a mounting hole; a photosensitive chip is arranged in the mounting hole, opposite to the lens, the photosensitive chip There is a gap between the side wall of the chip and the inner wall of the mounting hole; and a connection structure is provided in the gap and is connected to the photosensitive chip and the substrate respectively to fix the photosensitive chip on the On the substrate.
  • the photosensitive chip is arranged in the mounting hole of the substrate, which can reduce the total thickness of the substrate and the photosensitive chip, thereby reducing the thickness of the entire camera module.
  • the sidewall of the photosensitive chip is connected to the substrate through the connection structure, and there is no need to provide a reinforcing steel plate at the bottom of the substrate, which can further reduce the thickness of the camera module.
  • the substrate includes a first surface and a second surface disposed opposite to each other, the second surface is used to connect with the lens, and the mounting hole is opened by the second surface and faces the The first surface extends.
  • the photosensitive chip includes an upper surface and a lower surface disposed opposite to each other, the upper surface is opposite to the lens, and the distance between the lower surface and the second surface is less than or equal to the For the depth of the mounting hole, the distance between the lower surface and the second surface is greater than or equal to the distance between the upper surface and the lower surface.
  • the distance between the inner wall of the mounting hole and the side wall of the photosensitive chip gradually decreases.
  • the thickness of the substrate is greater than or equal to the thickness of the photosensitive chip.
  • the substrate includes a first surface and a second surface disposed opposite to each other, and the mounting hole penetrates from the second surface to the first surface.
  • the inner wall of the mounting hole is provided with a first limiting structure
  • the side wall of the photosensitive chip is provided with a second limiting structure
  • the first limiting structure and the second limiting structure Cooperate to define the relative position between the photosensitive chip and the substrate in the circumferential direction of the mounting hole.
  • the shape of the mounting hole matches the shape of the photosensitive chip.
  • the connecting structure is a cured rubber block filling the gap.
  • the photosensitive chip and the mounting hole are arranged coaxially.
  • the substrate is a PCB board
  • a first electrode pin is provided on the PCB board
  • a second electrode pin is provided on the photosensitive chip
  • the first electrode pin is connected to the first electrode pin.
  • the two electrode pins are electrically connected by metal wires.
  • the base further includes a filter, and the filter is attached to the photosensitive chip.
  • the base further includes a bracket, which is arranged on the substrate and used to connect the lens and the substrate.
  • a first positioning structure is provided on the support, a second positioning structure is provided on the base plate, and the first positioning structure cooperates with the second positioning structure to define the support The installation position on the substrate.
  • the bracket is a hollow structure with open ends, a groove is provided on the substrate, and the bracket is installed in the groove; wherein the bracket is inserted into one end of the groove Is the first positioning structure, and the groove is the second positioning structure.
  • the base further includes a package body formed on the substrate for connecting the lens and the substrate.
  • the package body covers the edge of the photosensitive chip.
  • the packaging body and the connecting structure are integrally formed.
  • a camera module includes: a lens; and the base as described in any one of the above, and the base is connected with the lens.
  • An electronic device includes the above-mentioned camera module.
  • FIG. 1 is a cross-sectional view of a conventional camera module according to an embodiment.
  • FIG. 2 is a schematic cross-sectional view of the camera module provided by the first embodiment.
  • FIG 3 is a schematic cross-sectional view of a matching method of the substrate of the camera module and the photosensitive chip provided by the first embodiment.
  • FIG 4 is a top view of the mating of the substrate and the photosensitive chip of the camera module provided by the first embodiment.
  • Fig. 5 is a cross-sectional view in the direction of C-C in Fig. 4.
  • FIG. 6 is a cross-sectional view of the cooperation between the bracket of the camera module and the substrate provided by the second embodiment.
  • FIG. 7 is a schematic cross-sectional view of the camera module provided by the third embodiment.
  • Fig. 8 is a schematic diagram of an electronic device provided by an embodiment.
  • the camera module 100A generally includes two parts of a base 10A and a lens 20A.
  • the base 10A includes a substrate 1A, a photosensitive chip 2A, and a reinforcing steel plate 3A.
  • a hollow structure 11A is provided on the substrate 1A, a reinforcing steel plate 3A is attached to the substrate 1A and opposite to the hollow structure 11A, and the photosensitive chip 2A is disposed in the hollow structure 11A and bonded by glue On the reinforcing steel plate 3A.
  • the dimensions in the thickness direction include the thickness of the reinforcing steel plate 3A in addition to the dimensions of the lens 20A and the substrate 1A, which still cannot satisfy people. Requirements for thinner camera modules.
  • the camera module 100 provided in this embodiment mainly includes a base 10 and a lens 20.
  • the base 10 is used to carry the lens 20.
  • the base 10 includes a substrate 1, a photosensitive chip 2, a connecting structure 3, a filter 4, and a bracket 5.
  • the photosensitive chip 2 is connected to the substrate 1 through the connecting structure 3, and the substrate 1 is connected to the lens through the bracket 5. 20 is connected.
  • the substrate 1 is a PCB board, and the substrate 1 includes a first surface 11 and a second surface 12 arranged opposite to each other, and a mounting hole 13, wherein the second surface 12 is used to connect with the lens 20
  • the mounting hole 13 is opened by the second surface 12 of the substrate 1 and extends to the first surface 11.
  • the mounting hole 13 may be a blind hole or a through hole.
  • the mounting hole 13 penetrates from the second surface 12 to the first surface 11.
  • the photosensitive chip 2 is disposed in the mounting hole 13 and opposite to the lens 20.
  • the connecting structure 3 is arranged in the gap 6 between the two to fix the photosensitive chip 2 on the substrate 1.
  • the shape of the mounting hole 13 matches the shape of the photosensitive chip 2, for example, the photosensitive chip 2 has a rectangular structure, and the mounting hole 13 is a rectangular hole.
  • the substrate 1 is placed horizontally.
  • the second surface 12 is parallel to the horizontal plane, and the optical axis of the lens 20 is perpendicular to the horizontal plane.
  • the photosensitive chip 2 is arranged in the mounting hole 13, so that the space occupied by the substrate 1 in the vertical direction (that is, in the direction of the optical axis) is effectively used, and the assembly of the photosensitive chip 2 and the substrate 1 is reduced.
  • the vertical size of the entire camera module 100 can be reduced, that is, the thickness of the camera module 100 can be reduced.
  • connection structure 3 is arranged in the gap 6 between the side wall of the photosensitive chip 2 and the side wall of the mounting hole 13, which can effectively use the space occupied by the substrate 1 in the horizontal direction, and avoid the problem of the photosensitive chip 2
  • the connection with the substrate 1 increases the size of the camera module 100 in the vertical direction.
  • the reinforcing steel plate can be omitted in this embodiment, so as to further reduce the thickness of the camera module 100.
  • the connecting structure 3 is a solidified glue block filled in the gap 6, that is, the connecting structure 3 is formed by curing the glue filled in the gap 6.
  • the connecting structure 3 can also be arranged in other ways.
  • the connecting structure 3 can be a double-sided tape arranged in the gap 6.
  • the photosensitive chip 2 has an upper surface 22 and a lower surface 23 opposite to each other, wherein the upper surface 22 is opposite to the lens 20 to receive the light transmitted from the lens 20.
  • the thickness of the substrate 1 is greater than or equal to the thickness of the photosensitive chip 2, that is, the distance between the first surface 11 and the second surface 12 is greater than or equal to the distance between the upper surface 22 and the lower surface 23.
  • the photosensitive chip 2 does not protrude from the mounting hole 13, that is, the depth of the mounting hole 13 is greater than or equal to the thickness of the photosensitive chip 2, and the distance between the lower surface 23 and the second surface 12 is less than or equal to The depth of the mounting hole 13 and the distance between the lower surface 23 and the second surface 12 are greater than or equal to the thickness of the photosensitive chip 2. That is, in this embodiment, the photosensitive chip 2 is completely placed in the mounting hole 13, which can increase the area of the sidewall 21 of the photosensitive chip 2 and the inner wall 131 of the mounting hole 13, thereby increasing the size of the photosensitive chip 2. The contact area of the side wall 21 and the connection structure 3 improves the connection strength between the photosensitive chip 2 and the substrate 1.
  • the side wall 21 of the photosensitive chip 2 is not in contact with the inner wall 131 of the mounting hole 13, that is, there is a gap 6 between the periphery of the side wall 21 of the photosensitive chip 2 and the inner wall 131 of the mounting hole 13. In this way, the contact area between the connection structure 3 and the photosensitive chip 2 can also be increased, and the connection strength between the photosensitive chip 2 and the substrate 1 can be improved.
  • the photosensitive chip 2 and the mounting hole 13 are arranged coaxially, so that the gap 6 between the side wall 21 of the photosensitive chip 2 and the inner wall 131 of the mounting hole 13 is the same everywhere, so that the connection around the photosensitive chip 2
  • the thickness of the structure 3 is the same, so that after the base 10 is assembled, the connection strength between the photosensitive chip 2 and the substrate 1 is the same everywhere, which enhances the anti-destructive ability of the base 10 and improves the service life of the base 10.
  • the mounting hole 13 in the direction from the second surface 12 to the first surface 11, between the inner wall 131 of the mounting hole 13 and the side wall 21 of the photosensitive chip 2 The distance between the mounting holes 13 is gradually reduced, that is, the mounting hole 13 has a funnel-shaped structure, which not only facilitates the placement of the photosensitive chip 2 in the mounting hole 13, but also prevents the glue from overflowing and contaminating the photosensitive chip 2 when glue is applied to the gap 6.
  • the mounting hole 13 adopts this arrangement, and the connecting structure 3 formed after the glue is solidified has a tapered or trapezoidal structure. When matched with the mounting hole 13, it can act as a wedge, so that the photosensitive chip 2 can be better carried. .
  • a first electrode pin 14 is provided on the substrate 1 (ie, a PCB board), a second electrode pin 24 is provided on the photosensitive chip 2, and a first electrode pin 14 is provided. It is electrically connected to the second electrode pin 24 through a metal wire 7 (such as a gold wire, etc.), so as to realize power supply and data transmission between the substrate 1 and the photosensitive chip 2.
  • a metal wire 7 such as a gold wire, etc.
  • the inner wall 131 of the mounting hole 13 is provided with a first limiting structure 132
  • the side wall 21 of the photosensitive chip 2 is provided with a second limiting structure 25, which passes through the first limiting structure.
  • the positioning structure 132 cooperates with the second limiting structure 25 to limit the position of the photosensitive chip 2 relative to the substrate 1 in the circumferential direction of the mounting hole 13, so that the photosensitive chip 2 can be mounted more accurately, so that the first electrode pin 14 and the corresponding second
  • the electrode pins 24 correspond more accurately, and it is more convenient to electrically connect the first electrode pins 14 and the second electrode pins 24 through the metal wire 7.
  • the first limiting structure 132 is an installation groove provided on the inner wall of the installation hole 13.
  • the installation groove is opened by the second surface 12 and extends toward the first surface 11.
  • the installation groove Extending to the first surface 11; the second limiting structure 25 is a raised structure arranged on the side wall of the photosensitive chip 2, wherein the width of the raised structure matches the width of the mounting groove to prevent the photosensitive chip 2 from being installed in the mounting hole 13 After shaking in the horizontal direction.
  • first limiting structure 132 and the second limiting structure 25 may also be arranged in other ways, for example, the first limiting structure 132 is a protrusion provided on the inner wall 131 of the mounting hole 13 Structure, the second limiting structure 25 is a mounting groove provided on the side wall 21 of the photosensitive chip 2.
  • the filter 4 is attached to the photosensitive chip 2, so that the distance between the filter 4 and the photosensitive chip 2 can be reduced, thereby reducing the light between the filter 4 and the photosensitive chip 2.
  • the number of reflections between the photosensitive chips 2 avoids the phenomenon of light spots.
  • the bracket 5 includes a bottom surface 51 and a top surface 52 disposed opposite to each other, wherein the bottom surface 51 is connected to the substrate 1, and the top surface 52 is connected to the lens 20.
  • the bracket 5 is provided with a first positioning structure 53 and the base plate 1 is provided with a second positioning structure 14.
  • the bracket 5 is a hollow structure with open ends, that is, the bracket 5 further has a receiving cavity 54 penetrating from the bottom surface 51 to the top surface 52.
  • the substrate 1 is provided with a groove 140, and the bracket 5 is installed in the groove 140.
  • the thickness of the side wall of the end 540 of the bracket 5 into the groove 140 is the same as the width of the groove 140. At this time, the bracket 5 is inserted into the groove 140.
  • the side wall of one end 540 of the groove is the first positioning structure 53, and the groove 140 is the second positioning structure 14. This arrangement can also reduce the thickness of the entire camera module 100 to a certain extent.
  • the bracket 5 is matched with the substrate 1, the photosensitive chip 2 and the filter 4 are opposed to the receiving cavity 54 of the bracket 5, and the external light passes through the lens 20 and is transmitted from the receiving cavity 54 to the filter. 4 and 2 photosensitive chips.
  • the electronic components, the first electrode 14, the second electrode 24, and the metal wire 7 on the substrate 1 are also located in the accommodating cavity 54. These components can be protected by the bracket 5 to improve The service life and safety performance of the camera module 100.
  • the outer side wall of the groove 140 can also be omitted.
  • the thickness of the middle part of the substrate 1 is greater than the thickness of the outer peripheral part of the substrate 1, that is, the substrate 1 is similar to a trapezoidal structure.
  • the side wall 15 of the substrate 1 may be flush with the side wall 55 of the support 5.
  • the base 10 is not provided with a bracket 5, but is provided with a package body 8, wherein the package body 8 is provided between the substrate 1 and the lens 20 to connect the lens 20 and the substrate 1, that is, in this embodiment, the package body 8 is used to replace the bracket 5 of the above embodiment.
  • the package body 8 is molded on the substrate 1 and is a hollow structure with open ends formed by applying glue on the substrate 1 and curing.
  • the package body 8 covers the electronic components, the first electrode 14, the second electrode 24 and the substrate 1 on the substrate 1.
  • Metal wire 7 to protect these components.
  • the package body 8 also covers the edge of the photosensitive chip 2 to improve the connection strength between the photosensitive chip 2 and the substrate 1.
  • the photosensitive chip 2 includes a photosensitive area 210 and an edge area 220 located around the photosensitive area 210.
  • the photosensitive area 210 is opposite to the lens 20 so as to receive light transmitted from the lens 20.
  • the package body 8 covers the photosensitive chip 2 The edge area 220.
  • the package body 8 and the connection structure 3 may be an integrally formed structure, that is, in the production process, the package body 8 and the connection structure 3 can be formed at the same time by applying glue once.
  • the present application also provides an electronic device 1000 that uses the camera module 100 described in any of the above embodiments, wherein the electronic device 1000 may be a terminal such as a smart phone or a tablet computer. product.

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Abstract

本申请涉及一种底座(10)、摄像模组(100)及电子设备(1000)。该底座(10)，用于承载镜头(20)，包括：基板(1)，与镜头(20)相接，基板(1)设有安装孔(13)；感光芯片(2)，设置在安装孔(13)内，与镜头(20)相对，感光芯片(2)的侧壁(21)与安装孔(13)的内壁(131)之间具有间隙(6)；连接结构(3)，设置在间隙(6)内，分别与感光芯片(2)以及基板(1)相接，以将感光芯片(2)固定在基板(1)上。

Description

底座、摄像模组及电子设备
相关申请的交叉引用
本申请要求于2019年08月14日提交中国专利局、申请号为201921320024.X、名称为“底座、摄像模组及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及摄像头技术领域，特别是涉及一种底座、摄像模组及电子设备。
背景技术
摄像模组是目前在消费电子领域中的热点之一，广泛应用于智能手机、平板电脑等终端电子设备上。为了满足消费者的需求，智能手机、平板电脑等终端电子设备朝着薄型化方向发展，进而要求摄像模组也朝着薄型化方向发展。
当前仍然存在降低摄像模组的厚度的需求。
发明内容
基于此，本申请提供一种底座、摄像模组及电子设备。
一种底座，用于承载镜头，包括：基板，用于与所述镜头相连接，所述基板设有安装孔；感光芯片，设置在所述安装孔内，与所述镜头相对，所述感光芯片的侧壁与所述安装孔的内壁之间具有间隙；以及连接结构，设置在所述间隙内，与所述感光芯片以及所述基板分别相接，以将所述感光芯片固定在所述基板上。
在本申请的实施例提供的底座中，感光芯片设置在基板的安装孔内，可以降低基板与感光芯片的总厚度，进而降低整个摄像模组的厚度。同时，感光芯片的侧壁通过连接结构与基板连接，无需在基板的底部设置补强钢板，可以进一步降低摄像模组的厚度。
在一个实施例中，所述基板包括相背设置的第一表面和第二表面，所述第二表面用于与所述镜头相接，所述安装孔由所述第二表面开设并向所述第一表面延伸。
在一个实施例中，所述感光芯片包括相背设置的上表面和下表面，所述上表面与所述镜头相对，所述下表面与所述第二表面之间的间距小于或等于所述安装孔的深度，所述下表面与所述第二表面之间的间距大于或等于所述上表面与所述下表面之间的间距。
在一个实施例中，在由所述第二表面至所述第一表面的方向上，所述安装孔的内壁与所述感光芯片的侧壁之间的间距逐渐减小。
在一个实施例中，所述基板的厚度大于或等于所述感光芯片的厚度。
在一个实施例中，所述基板包括相背设置的第一表面和第二表面，所述安装孔由所述第二表面贯穿至所述第一表面。
在一个实施例中，所述安装孔的内壁设有第一限位结构，所述感光芯片的侧壁设有第二限位结构，所述第一限位结构与所述第二限位结构配合，以在所述安装孔周向上限定所述感光芯片与所述基板之间的相对位置。
在一个实施例中，所述安装孔的形状与所述感光芯片的形状匹配。
在一个实施例中，所述连接结构为填充所述间隙内的固化胶块。
在一个实施例中，所述感光芯片与所述安装孔同轴设置。
在一个实施例中，所述基板为PCB板，所述PCB板上设有第一电极引脚，所述感光芯片上设有第二电极引脚，所述第一电极引脚与所述第二电极引脚之间通过金属线电性连接。
在一个实施例中，所述底座还包括滤光片，所述滤光片贴设在所述感光芯片上。
在一个实施例中，所述底座还包括支架，设置在所述基板上，用于连接所述镜头和所述基板。
在一个实施例中，所述支架上设有第一定位结构，所述基板上设有第二定位结构，所述第一定位结构与所述第二定位结构配合，以限定所述支架在所述基板上的安装位置。
在一个实施例中，所述支架为两端开口的中空结构，所述基板上设有凹槽，所述支架安装在所述凹槽内；其中，所述支架置入所述凹槽的一端为所述第一定位结构，所述凹槽为所述第二定位结构。
在一个实施例中，所述底座还包括封装体，成型在所述基板上，用于连接所述镜头和所述基板。
在一个实施例中，所述封装体覆盖所述感光芯片的边缘。
在一个实施例中，所述封装体与所述连接结构为一体成型结构。
一种摄像模组，包括：镜头；以及如上任一项所述的底座，所述底座与所述镜头相接。
一种电子设备，包括如上所述的摄像模组。
附图说明
图1为一个实施例的传统摄像模组的剖面视图。
图2为第一实施例提供的摄像模组的剖面示意图。
图3为第一实施例提供的摄像模组的基板与感光芯片一种配合方式的剖面示意图。
图4为第一实施例提供的摄像模组的基板与感光芯片配合的俯视图。
图5为图4中C-C向的剖面视图。
图6为第二实施例提供的摄像模组的支架与基板配合的剖面视图。
图7为第三实施例提供的摄像模组的剖面示意图。
图8为一个实施例提供的电子设备的示意图。
具体实施方式
为使本申请的上述目的、特征和优点能够更加明显易懂，下面结合附图对本申请的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本申请。但是本申请能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本申请内涵的情况下做类似改进，因此本申请不受下面公开的具体实施的限制。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。
如图1所示，摄像模组100A通常包括底座10A和镜头20A两部分，其中底座10A包括基板1A、感光芯片2A以及补强钢板3A。为了使摄像模组100A更薄，基板1A上设有镂空结构11A，补强钢板3A贴设在基板1A上并与镂空结构11A相对，感光芯片2A设置在镂空结构11A内，并通过胶水粘接在补强钢板3A上。
这种设置方式虽然可以在一定程度上降低摄像模组100A的厚度，但是其厚度方向的尺寸除了镜头20A、基板1A等部件的尺寸之外，还包括补强钢板3A的厚度，依旧无法满足人们对摄像模组的薄型化要求。
如图2所示，本实施例提供的摄像模组100主要包括底座10和镜头20，其中，底座10用于承载镜头20。在本实施例中，底座10包括基板1、感光芯片2、连接结构3、滤光片4以及支架5，其中，感光芯片2通过连接结构3与基板1相接，基板1通过支架5与镜头20相接。
具体的，在本实施例中，基板1为PCB板，基板1包括相背设置的第一表 面11和第二表面12，以及安装孔13，其中，第二表面12用于与镜头20相接，安装孔13由基板1的第二表面12开设，并向第一表面11延伸。安装孔13可以是盲孔也可以是通孔，其中，为了方便基板1的生产加工，在本实施例中，安装孔13由第二表面12贯穿至第一表面11。感光芯片2设置在安装孔13内，并与镜头20相对。感光芯片2的侧壁21与安装孔13的内壁131之间具有间隙6，连接结构3设置在二者之间的间隙6内，以便将感光芯片2固定在基板1上。另外，在本实施例中，安装孔13的形状与感光芯片2的形状匹配，比如，感光芯片2为矩形结构，安装孔13为矩形孔。
在本实施例中，假设基板1水平放置，此时，第二表面12与水平面平行，镜头20的光轴与水平面垂直。在本实施例中，感光芯片2设置在安装孔13内，使得基板1在竖直方向上(即在光轴方向上)所占据的空间得到有效利用，降低感光芯片2与基板1组装后的厚度，从而可以降低整个摄像模组100的在竖直方向上的尺寸，即降低摄像模组100的厚度。同时，在本实施例中，连接结构3设置在感光芯片2的侧壁与安装孔13的侧壁之间的间隙6内，可以有效利用基板1在水平方向所占据的空间，避免因感光芯片2与基板1的连接而增大摄像模组100在竖直方向上的尺寸。相比于传统设计而言(如图1所述)，本实施例中可以省去补强钢板，以便进一步降低摄像模组100的厚度。
在本实施例中，连接结构3为填充在间隙6内的固化胶块，即连接结构3是由填充在间隙6内的胶水固化后形成的。在其他实施例中，连接结构3也可以采用其他设置方式，比如连接结构3可以为设置在间隙6内的双面胶等。
如图2所示，在本实施例中，感光芯片2具有相背设置的上表面22与下表面23，其中上表面22与镜头20相对，以接收从镜头20内传出的光线。另外，基板1的厚度大于或等于感光芯片2的厚度，即第一表面11与第二表面12之间的间距大于或等于上表面22与下表面23之间的间距。此外，在本实施例中，感光芯片2不凸出安装孔13，即，安装孔13的深度大于或等于感光芯片2的厚度，且下表面23与第二表面12之间的间距小于或等于安装孔13的深度，下表面23与第二表面12之间的间距大于或等于感光芯片2的厚度。也即，在本实 施例中，感光芯片2完全置于安装孔13内，这样可以增大感光芯片2的侧壁21与安装孔13的内壁131相对区域的面积，进而增大感光芯片2的侧壁21与连接结构3接触的面积，提高感光芯片2与基板1之间的连接强度。
进一步的，在本实施例中，感光芯片2的侧壁21不与安装孔13的内壁131相接触，即感光芯片2的侧壁21的四周与安装孔13的内壁131之间都有间隙6，这样也可以增大连接结构3与感光芯片2的接触面积，提高感光芯片2与基板1之间的连接强度。同时，在本实施例中，感光芯片2与安装孔13同轴设置，这样感光芯片2的侧壁21与安装孔13内壁131之间的间隙6处处相同，从而可以使感光芯片2周围的连接结构3的厚度相同，这样底座10组装完成后，感光芯片2与基板1连接处的连接强度处处相同，增强底座10的抗破坏能力，提高底座10的使用寿命。
如图3所示，在本实施例的一种优选的实施方式中，在由第二表面12至第一表面11的方向上，安装孔13的内壁131与感光芯片2的侧壁21之间的间距逐渐减小，即安装孔13呈漏斗状结构，这样不仅方便将感光芯片2放置在安装孔13内，而且在向间隙6内涂胶时还可以避免胶液外溢污染感光芯片2。同时，安装孔13采用这种设置方式，胶液固化后形成的连接结构3呈锥形或梯形结构，与安装孔13配合时可以起到楔子的作用，使感光芯片2可以得到更好的承载。
另外，如图4所示，在本实施例中，基板1(即PCB板)上设有第一电极引脚14，感光芯片2上设有第二电极引脚24，第一电极引脚14与第二电极引脚24之间通过金属线7(比如金线等)电性连接，以便实现基板1与感光芯片2之间的供电以及数据传输。
如图4和图5所示，在本实施例中，安装孔13的内壁131设有第一限位结构132，感光芯片2的侧壁21设有第二限位结构25，通过第一限位结构132与第二限位结构25配合，可以限定感光芯片2在安装孔13周向上相对基板1的位置，使得感光芯片2安装的更精准，使得第一电极引脚14与相应的第二电极引脚24对应的更精准，更方便通过金属线7将第一电极引脚14与第二电极引脚24电性连接。
具体的，在本实施例中，第一限位结构132为设置在安装孔13内壁上的安装槽，安装槽由第二表面12开设，并朝向第一表面11延伸，为了生产方便，安装槽延伸至第一表面11；第二限位结构25为设置在感光芯片2侧壁的凸起结构，其中，凸起结构的宽度与安装槽的宽度匹配，避免感光芯片2安装在安装孔13内以后在水平方向上晃动。可以理解的，在其他实施例中，第一限位结构132和第二限位结构25也可以是其他设置方式，比如第一限位结构132为设置在安装孔13的内壁131上的凸起结构，第二限位结构25为设置在感光芯片2侧壁21的安装槽。
如图2所示，在本实施例中，滤光片4贴设在感光芯片2上，这样可以减小滤光片4与感光芯片2之间的距离，进而减少光线在滤光片4和感光芯片2之间的反射次数，避免光斑现象的产生。
如图2所示，在本实施例中，支架5包括相背设置的底面51和顶面52，其中，底面51与基板1相接，顶面52与镜头20相接。其中，支架5上设有第一定位结构53，基板1上设有第二定位结构14，通过第一定位结构53与第二定位结构14配合，可以限定支架5在基板1上的安装位置。具体的，在本实施例中，支架5为两端开口的中空结构，即支架5还具有一从底面51贯穿至顶面52的容纳腔54。基板1上设有凹槽140，支架5安装在凹槽140内，其中，支架5置入凹槽140的一端540的侧壁的厚度与凹槽140的宽度相同，此时，支架5置入凹槽的一端540的侧壁便为第一定位结构53，凹槽140便为第二定位结构14，这样设置也可以在一定程度上降低整个摄像模组100的厚度。
另外，在本实施例中，支架5与基板1配合后，感光芯片2、滤光片4与支架5的容纳腔54相对，外部光线穿过镜头20后从容纳腔54内传递至滤光片4和感光芯片2处。同时，支架5与基板1配合后，基板1上的电子元件、第一电极14、第二电极24以及金属线7等也位于容纳腔54内，通过支架5可以对这些元器件进行保护，提高摄像模组100的使用寿命和安全性能。
如图6所示，在另一实施例中，凹槽140的外侧壁也可以省去，此时基板1的中间部位的厚度大于基板1的外周部位的厚度，即基板1类似一梯形结构， 进一步的，基板1的侧壁15可以是与支架5的侧壁55平齐。
如图7所示，在本申请提供的另一实施例中，底座10未设置支架5，而是设置了封装体8，其中，封装体8设置在基板1与镜头20之间，以连接镜头20和基板1，即在本实施例中，利用封装体8来替代上述实施例的支架5。封装体8成型在基板1上，是通过在基板1上涂胶并固化所形成的两端开口的中空结构，封装体8覆盖基板1上的电子元件、第一电极14、第二电极24以及金属线7，以便对这些元器件进行保护。同时，封装体8还覆盖感光芯片2的边缘，以提高感光芯片2与基板1之间的连接强度。具体的，感光芯片2包括感光区210以及位于感光区210四周的边缘区220，其中，感光区210与镜头20相对，以便接收从镜头20传入的光线，封装体8覆盖在感光芯片2的边缘区220。
另外，在本实施例中，封装体8和连接结构3可以是一体成型结构，即生产过程中，可以通过一次涂胶同时形成封装体8和连接结构3。
如图8所示，本申请还提供了一种电子设备1000，该电子设备1000使用了上述任一实施例所述的摄像模组100，其中，电子设备1000可以是智能手机、平板电脑等终端产品。
上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (20)

  1. 一种底座，用于承载镜头，包括：
    基板，用于与所述镜头相连接，所述基板设有安装孔；
    感光芯片，设置在所述安装孔内，与所述镜头相对，所述感光芯片的侧壁与所述安装孔的内壁之间具有间隙；以及
    连接结构，设置在所述间隙内，与所述感光芯片以及所述基板分别相接，以将所述感光芯片固定在所述基板上。
  2. 根据权利要求1所述的底座，其中，所述基板包括相背设置的第一表面和第二表面，所述第二表面用于与所述镜头相接，所述安装孔由所述第二表面开设并向所述第一表面延伸。
  3. 根据权利要求2所述的底座，其中，所述感光芯片包括相背设置的上表面和下表面，所述上表面与所述镜头相对，所述下表面与所述第二表面之间的间距小于或等于所述安装孔的深度，所述下表面与所述第二表面之间的间距大于或等于所述上表面与所述下表面之间的间距。
  4. 根据权利要求2所述的底座，其中，在由所述第二表面至所述第一表面的方向上，所述安装孔的内壁与所述感光芯片的侧壁之间的间距逐渐减小。
  5. 根据权利要求2所述的底座，其中，所述基板的厚度大于或等于所述感光芯片的厚度。
  6. 根据权利要求1所述的底座，其中，所述基板包括相背设置的第一表面和第二表面，所述安装孔由所述第二表面贯穿至所述第一表面。
  7. 根据权利要求1所述的底座，其中，所述安装孔的内壁设有第一限位结构，所述感光芯片的侧壁设有第二限位结构，所述第一限位结构与所述第二限位结构配合，以在所述安装孔周向上限定所述感光芯片与所述基板之间的相对位置。
  8. 根据权利要求1所述的底座，其中，所述安装孔的形状与所述感光芯片的形状匹配。
  9. 根据权利要求1所述的底座，其中，所述连接结构为填充所述间隙内的 固化胶块。
  10. 根据权利要求1所述的底座，其中，所述感光芯片与所述安装孔同轴设置。
  11. 根据权利要求1所述的底座，其中，所述基板为PCB板，所述PCB板上设有第一电极引脚，所述感光芯片上设有第二电极引脚，所述第一电极引脚与所述第二电极引脚之间通过金属线电性连接。
  12. 根据权利要求1所述的底座，其中，所述底座还包括滤光片，所述滤光片贴设在所述感光芯片上。
  13. 根据权利要求1所述的底座，其中，所述底座还包括支架，设置在所述基板上，用于连接所述镜头和所述基板。
  14. 根据权利要求13所述的底座，其中，所述支架上设有第一定位结构，所述基板上设有第二定位结构，所述第一定位结构与所述第二定位结构配合，以限定所述支架在所述基板上的安装位置。
  15. 根据权利要求14所述的底座，其中，所述支架为两端开口的中空结构，所述基板上设有凹槽，所述支架安装在所述凹槽内；其中，所述支架置入所述凹槽的一端为所述第一定位结构，所述凹槽为所述第二定位结构。
  16. 根据权利要求1所述的底座，其中，所述底座还包括封装体，成型在所述基板上，用于连接所述镜头和所述基板。
  17. 根据权利要求16所述的底座，其中，所述封装体覆盖所述感光芯片的边缘。
  18. 根据权利要求16所述的底座，其中，所述封装体与所述连接结构为一体成型结构。
  19. 一种摄像模组，包括：
    镜头；以及
    底座，与所述镜头相接，所述底座包括：
    基板，用于与所述镜头相连接，所述基板设有安装孔；
    感光芯片，设置在所述安装孔内，与所述镜头相对，所述感光芯片的 侧壁与所述安装孔的内壁之间具有间隙；以及
    连接结构，设置在所述间隙内，与所述感光芯片以及所述基板分别相接，以将所述感光芯片固定在所述基板上。
  20. 一种电子设备，包括摄像模组；
    其中，所述摄像模组包括：
    镜头；以及
    底座，与所述镜头相接，所述底座包括：
    基板，用于与所述镜头相连接，所述基板设有安装孔；
    感光芯片，设置在所述安装孔内，与所述镜头相对，所述感光芯片的侧壁与所述安装孔的内壁之间具有间隙；以及
    连接结构，设置在所述间隙内，与所述感光芯片以及所述基板分别相接，以将所述感光芯片固定在所述基板上。
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CN210724992U (zh) * 2019-08-14 2020-06-09 南昌欧菲光电技术有限公司 底座、摄像模组及电子设备

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