WO2021027074A1 - 一种阵列基板及其制备方法、显示装置 - Google Patents

一种阵列基板及其制备方法、显示装置 Download PDF

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Publication number
WO2021027074A1
WO2021027074A1 PCT/CN2019/113962 CN2019113962W WO2021027074A1 WO 2021027074 A1 WO2021027074 A1 WO 2021027074A1 CN 2019113962 W CN2019113962 W CN 2019113962W WO 2021027074 A1 WO2021027074 A1 WO 2021027074A1
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Prior art keywords
retaining wall
array substrate
opening
pixel
light
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English (en)
French (fr)
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闫莹
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TCL China Star Optoelectronics Technology Co Ltd
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TCL China Star Optoelectronics Technology Co Ltd
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Priority to US16/615,475 priority Critical patent/US20210288121A1/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the invention relates to the field of display, in particular to an array substrate, a preparation method thereof, and a display device.
  • AMOLED (English: Active-matrix organic light-emitting diode, Chinese translation: active matrix organic light-emitting diode or active matrix organic light-emitting diode) is a display technology.
  • OLED organic light emitting diode
  • AM active matrix or active matrix
  • AMOLED technology is mainly used in smart phones, and continues to develop in the direction of low power consumption, low cost, and large size.
  • inkjet printing technology has a good application prospect in the preparation of organic functional layers of AMOLED display devices.
  • Inkjet printing technology is to directly drop the ink with OLED material into the pre-made pixel definition layer, and form the required pattern after the solvent evaporates.
  • the pixel definition layer includes a dam and a plurality of grooves arranged in an array surrounded by the dam. The grooves are used to limit the ink. After drying and baking, the ink shrinks within the range of the grooves. To form a thin film.
  • the pixel design becomes smaller and smaller, which corresponds to the higher and higher accuracy requirements of inkjet printing, and the accuracy of printing and the amount of ink droplets are becoming more and more difficult to control.
  • the accuracy of printing requires accurate optimization of position, droplet size, and number of droplets to print the required substrates. If these are not adjusted well, bridges may occur. The inks of adjacent pixels overflow from the grooves of the pixel definition layer and overlap each other, resulting in poor display.
  • the present invention provides an array substrate, a preparation method thereof, and a display device to solve the "bridging" phenomenon caused by the poor ink drop position in the inkjet printing technology in the prior art.
  • the present invention provides an array substrate, including a light-emitting area and a non-light-emitting area surrounding the light-emitting area, and further comprising a substrate; a pixel definition layer is provided on the substrate, and the pixel defines The layer includes an opening and a retaining wall surrounding the opening, wherein the retaining wall corresponds to a non-light-emitting area, and the opening corresponds to a light-emitting area; the retaining wall between two adjacent openings is away from the substrate There is a groove on one side.
  • the side of the retaining wall away from the substrate is one of a convex arc shape, a convex cone shape, and an convex prism shape, and the groove is provided on the retaining wall away from the substrate. In the middle of one side.
  • the opening width of the groove is between 20-50 microns, and the opening depth of the groove is 0.5-1 microns.
  • any one of the openings is provided with a pixel layer, and the pixel layer includes a red pixel layer, a green pixel layer and a blue pixel layer.
  • the material of the pixel definition layer is a hydrophobic and oleophobic material.
  • the present invention also provides a method for preparing an array substrate.
  • the array substrate includes a light-emitting area and a non-light-emitting area surrounding the light-emitting area, including providing a substrate; a pixel definition layer preparation step: forming a pixel definition on the substrate Layer, opening holes are formed in the pixel definition layer corresponding to the light-emitting area, and the holes penetrate the pixel definition layer; the step of notching: the pixel definition layer between adjacent openings forms a retaining wall, A groove is opened on the side of the retaining wall away from the substrate.
  • a convex arc surface is formed on the side of the retaining wall away from the substrate.
  • a slit mask is used to prepare the convex arc surface.
  • a halftone mask is used to open the groove on the retaining wall.
  • the present invention also provides a display device including the array substrate.
  • the array substrate, the preparation method thereof, and the display device of the present invention effectively reduce the display defects caused by ink mixing by opening grooves on the barrier wall between the openings of the pixel definition layer, and at the same time, the barrier wall is set to be convex arc shape Structure:
  • the ink When the ink is dropped from the offset opening and falls onto the retaining wall, due to the convex arc structure of the retaining wall itself, the ink will slide down into the opening under the action of gravity to avoid color mixing.
  • the pixel definition layer itself adopts a hydrophobic and oleophobic structure.
  • the preparation method of the array substrate uses a halftone mask to open grooves on the retaining wall, and prepares the convex arc-shaped structure surface through a slit mask with dense edges and sparse middle. The method is simple and convenient for mass production. .
  • Fig. 1 is a schematic diagram of a pixel definition layer in the background art.
  • Fig. 2 is a schematic diagram of a pixel definition layer in the prior art.
  • FIG. 3 is a schematic diagram of the array substrate in Embodiment 1.
  • FIG. 3 is a schematic diagram of the array substrate in Embodiment 1.
  • FIG. 4 is a partial schematic diagram of the array substrate in the first embodiment.
  • FIG. 5 is a schematic diagram of the array substrate in the second embodiment.
  • FIG. 6 is a schematic diagram of the display device in Embodiment 2.
  • FIG. 6 is a schematic diagram of the display device in Embodiment 2.
  • the array substrate 10 of the present invention includes a substrate 110 and a pixel definition layer 120.
  • the array substrate 10 includes a light-emitting area 101 and a non-light-emitting area 102 surrounding the light-emitting area 101, and the light-emitting area 101 is used to provide a display image.
  • the pixel definition layer 120 is disposed on the substrate 110, and its material is a hydrophobic and oleophobic material, such as a fluorine-containing material.
  • the pixel definition layer 120 is provided with a number of openings 121 corresponding to the light-emitting area 101, wherein the pixel definition layer 120 between adjacent openings 121 is a barrier 122
  • inkjet printing is generally used to drop ink into the opening 121, but due to the increase in resolution and the reduction in pixel size, the size of the opening 121 is also reduced accordingly, which leads to When the ink is dripped, because the accuracy of the ink dripping position is not accurate, the phenomenon of “bridging” is likely to occur.
  • the ink in the adjacent opening 121 overflows the opening 121, and the overflow part spreads to the entire opening. Color mixing occurs on the retaining wall 122.
  • the ink includes red ink, green ink, and blue ink.
  • the ink drops into the opening 121 to form a pixel layer 1201, wherein the red ink Corresponding to the red pixel layer 12011, the green ink corresponds to the green pixel layer 12012, and the blue ink corresponds to the blue pixel layer 12013.
  • the retaining wall 122 is configured as a structure with a convex surface. As shown in FIG. 3, in this embodiment, the side of the retaining wall 122 away from the substrate 110 is The convex arc structure is beneficial for the ink to deviate from the opening 121 and fall onto the retaining wall 122 when dripping. Due to the convex structure of the retaining wall 122, the edge of the pixel definition layer is hydrophobic and sparse. Due to the characteristics of oil, the ink will slide down into the opening 121 under the action of gravity to avoid color mixing.
  • the array substrate 10 of the present invention includes a substrate 110 and a pixel definition layer 120.
  • the array substrate 10 includes a light-emitting area 101 and a non-light-emitting area 102 surrounding the light-emitting area 101, and the light-emitting area 101 is used to provide a display image.
  • the pixel definition layer 120 is disposed on the substrate 110, and its material is a hydrophobic and oleophobic material, such as a fluorine-containing material. As shown in FIG. 4, in order to receive ink for light emission, the pixel defining layer 120 is provided with a plurality of openings 121 corresponding to the light emitting area 101, wherein the pixel definition between adjacent openings 121 The layer 120 is the retaining wall 122. In the prior art, inkjet printing is generally used to drop ink into the opening 121.
  • the size of the opening 121 is also Corresponding reduction, which leads to the inaccuracy of the ink drop position when the ink is dripped, and the phenomenon of “bridging” is likely to occur, that is, the ink in the adjacent opening 121 overflows the opening 121, and the overflow part spreads to the entire opening. Color mixing occurs on the retaining wall 122.
  • the ink includes red ink, green ink, and blue ink.
  • the ink drops into the opening 121 to form a pixel layer 1201, wherein the red ink Corresponding to the red pixel layer 12011, the green ink corresponds to the green pixel layer 12012, and the blue ink corresponds to the blue pixel layer 12013. Since the red ink shifts to the edge of the opening 121 during the dripping process and overflows onto the retaining wall, The green ink shifts to the edge of the opening 121 during the dripping process and overflows onto the retaining wall adjacent to the red ink. The two inks are "bridged" to form a new color, causing color mixing.
  • the retaining wall 122 is configured as a structure with a convex surface.
  • the retaining wall 122 has a convex arc shape on the side away from the substrate 110.
  • the structure is conducive for the ink to deviate from the opening 121 and fall onto the retaining wall 122 when dripping. Due to the convex structure of the retaining wall 122, the ink will slide down to the opening due to gravity.
  • a groove 1221 is opened on the retaining wall 122, and the groove 1221 surrounds the opening 121.
  • the length of the groove 1221 is the same as the length of the opening 121, between 40 and 120 microns.
  • the opening width is 20-50 microns, and the depth is 0.5-1 microns. If the ink drop position shifts too much, it will fall to the groove 1221 in the middle of the retaining wall, so as not to cause bridging phenomenon, and there is no light source in the groove 1221, and the ink falling into the groove 1221 does not emit light , To avoid color mixing.
  • the steps of the method for preparing the array substrate in this embodiment include
  • the pixel defining layer preparation step forming a pixel defining layer on the substrate, and opening an opening in the pixel defining layer corresponding to the light-emitting area, and the opening passing through the pixel defining layer.
  • the pixel definition layer between adjacent openings forms a retaining wall, and a convex arc surface is formed on the side of the retaining wall away from the substrate, and a halftone mask is used on the retaining wall. There are grooves in the wall.
  • the display device 1 of the present invention includes the array substrate 10, wherein all the technical features and technical effects of the display device 1 are collectively embodied on the array substrate 10. The other components of the display device 1 will not be repeated one by one.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

一种阵列基板（10）及其制备方法、显示装置（1），阵列基板（10）包括基板（110）；像素定义层（120），设于所述基板（110）上，所述像素定义层（120）中包括开孔（121）和围绕所述开孔（121）的挡墙（122），其中所述挡墙（122）对应非发光区（102），所述开孔（121）对应发光区（101）；相邻两个开孔（121）之间的所述挡墙（122）远离所述基板（110）的一侧设有的凹槽（1221）。阵列基板（10）及其制备方法、显示装置（1）通过在像素定义层（120）的开孔（121）之间的挡墙（122）上开设凹槽（1221）来有效减少墨水混色带来的显示不良。

Description

一种阵列基板及其制备方法、显示装置 技术领域
本发明涉及显示领域，特别涉及一种阵列基板及其制备方法、显示装置。
背景技术
AMOLED(英语：Active-matrix organic light-emitting diode，中译：有源矩阵有机发光二极体或主动矩阵有机发光二极体)是一种显示屏技术。其中OLED(有机发光二极体)是描述薄膜显示技术的具体类型：有机电激发光显示；AM(有源矩阵体或称主动式矩阵体)是指背后的像素寻址技术。目前AMOLED技术主要用于智能手机，并继续朝低功耗、低成本、大尺寸方向发展。
如图1所示，喷墨打印技术在AMOLED显示器件有机功能层的制备中，应用前景较好。喷墨打印技术是将溶有OLED材料的墨水直接滴涂到预先制作好的像素定义层中，待溶剂挥发后形成所需图案。所述像素定义层包括堤坝、以及由堤坝围拢成的多个阵列排布的凹槽，所述凹槽由用来限制住墨水，通过干燥烘烤后，墨水收缩在该凹槽限制的范围内形成薄膜。
随着显示面板的分辨率提高，像素设计也越来越小，这就对应喷墨打印的精度要求越来越高，打印的精度及墨滴量越来越难控制。而目前打印的精度需要位置，液滴大小及液滴的数量的准确优化，才可打出需要的基板，而这些如果调整不佳，则有可能产生桥接(bridge)的现象发生。相邻的像素的墨水从像素定义层的凹槽中溢出(overflow)而搭接在一起，造成显示不良现象发生。
发明概述
技术问题
问题的解决方案
技术解决方案
为了解决上述问题，本发明提供了一种阵列基板及其制备方法、显示装置用以解决现有技术中由于喷墨打印技术中墨水滴落位置不佳而产生的“桥接”现象。
解决上述问题的技术方案是：本发明提供了一种阵列基板，包括发光区和围绕 所述发光区的非发光区，还包括基板；像素定义层，设于所述基板上，所述像素定义层中包括开孔和围绕所述开孔的挡墙，其中所述挡墙对应非发光区，所述开孔对应发光区；相邻两个开孔之间的所述挡墙远离所述基板的一侧设有的凹槽。
进一步的，所述挡墙远离所述基板的一侧为外凸的弧形、外凸的锥形、外凸棱形中的一种，所述凹槽设于所述挡墙远离所述基板的一侧的中间位置。
进一步的，所述凹槽的开口宽度在20～50微米之间，所述凹槽的开口深度为0.5～1微米。
进一步的，任一所述开孔内均设有像素层，所述像素层包括红色像素层、绿色像素层和蓝色像素层。
进一步的，所述像素定义层的材料为疏水疏油材料。
本发明还提供了一种阵列基板的制备方法，所述阵列基板包括发光区和围绕所述发光区的非发光区，包括提供一基板；像素定义层制备步骤：在所述基板上形成像素定义层，在所述像素定义层对应所述发光区开设开孔，所述开孔贯穿所述像素定义层；开槽步骤：相邻所述开孔之间的所述像素定义层形成挡墙，在所述挡墙远离所述基板一侧开设凹槽。
进一步的，所述挡墙远离所述基板一侧形成有外凸圆弧表面。
进一步的，在所述像素定义层制备步骤中，采用狭缝掩膜板制备所述外凸圆弧表面。
进一步的，在所述开槽步骤中，采用半色调掩膜板在所述挡墙上开设所述凹槽。
本发明还提供了一种显示装置，包括所述阵列基板。
发明的有益效果
有益效果
本发明的阵列基板及其制备方法、显示装置通过在像素定义层的开孔之间的挡墙上开设凹槽来有效减少墨水混色带来的显示不良，同时将挡墙设为外凸弧形结构，当墨水在滴落时偏移开孔落至挡墙上时，由于挡墙本身的外凸弧形结构，墨水会在重力作用下滑落至开孔内，避免混色现象。像素定义层本身采用疏 水疏油结构，当墨水滴落的位置稍偏移落至外凸弧形结构边缘处时，由于像素定义层边缘疏水疏油的特性，墨水会流回像素定义层开孔内，阵列基板的制备方法通过半色调掩膜板在挡墙上开设凹槽，通过边缘密集，中间稀疏的狭缝掩膜板制备所述外凸弧形结构表面，方法简单，便于大批量生产。
对附图的简要说明
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是背景技术中的像素定义层示意图。
图2是现有技术中的像素定义层示意图。
图3是实施例1中的阵列基板示意图。
图4是实施例1中的阵列基板局部示意图。
图5是实施例2中的阵列基板示意图。
图6是实施例2中的显示装置示意图。
图中
1显示装置；
10阵列基板；                 110基板；
120像素定义层；              101发光区；
102非发光区；                121开孔；
122挡墙；                    1201像素层；
12011红色像素层；            12012绿色像素层；
12013蓝色像素层；            1221凹槽；
发明实施例
本发明的实施方式
以下实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左 」、「右」、「顶」、「底」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
实施例1
如图3所示，本实施例中，本发明的阵列基板10包括基板110和像素定义层120。
所述阵列基板10包括发光区101和围绕所述发光区101的非发光区102，所述发光区101用于提供显示画面。
如图4所示，所述像素定义层120设于所述基板110上，其材料采用疏水疏油材料，如含氟类材料。为了承接用于发光的墨水，所述像素定义层120对应所述发光区101处设有若干开孔121，其中，相邻所述开孔121之间的所述像素定义层120为挡墙122，现有技术中一般采用喷墨打印的方式将墨水滴入所述开孔121内，但由于分辨率的提高和像素尺寸的减小，所述开孔121的尺寸也相应减少，这就导致在滴入墨水时，由于墨水滴入位置的精度不准，容易产生“桥接”现象，如图2所示，即相邻开孔121内的墨水溢出所述开孔121，溢出部分蔓延至所述挡墙122上从而出现混色现象，本实施例中，所述墨水包括红色墨水、绿色墨水和蓝色墨水，所述墨水滴入所述开孔121内形成像素层1201，其中所述红色墨水对应红色像素层12011，绿色墨水对应绿色像素层12012，蓝色墨水对应蓝色像素层12013，由于红色墨水在滴入过程中偏移至开孔121边缘处并溢出至所述挡墙上，所述绿色墨水在滴入过程中偏移至开孔121边缘处并溢出至与所述红色墨水相邻的所述挡墙上，两种墨水“桥接”形成了新的颜色，造成了混色现象，为了解决这一现象，本实施例中，所述挡墙122设为带有外凸表面的结构，如图3所示，本实施例中，所述挡墙122远离所述基板110一侧为外凸的弧形结构，有利于墨水在滴落时偏移所述开孔121落至所述挡墙122上时，由于所述挡墙122本身的外凸结构，同时像素定义层边缘疏水疏油的特性，墨水会在重力作用下滑落至所述开孔121内，避免混色现象。
实施例2
本实施例中，本发明的阵列基板10包括基板110和像素定义层120。
所述阵列基板10包括发光区101和围绕所述发光区101的非发光区102，所述发 光区101用于提供显示画面。
所述像素定义层120设于所述基板110上，其材料采用疏水疏油材料，如含氟类材料。如图4所示，为了承接用于发光的墨水，所述像素定义层120对应所述发光区101处设有若干开孔121，其中，相邻所述开孔121之间的所述像素定义层120为挡墙122，现有技术中一般采用喷墨打印的方式将墨水滴入所述开孔121内，但由于分辨率的提高和像素尺寸的减小，所述开孔121的尺寸也相应减少，这就导致在滴入墨水时，由于墨水滴入位置的精度不准，容易产生“桥接”现象，即相邻开孔121内的墨水溢出所述开孔121，溢出部分蔓延至所述挡墙122上从而出现混色现象，本实施例中，所述墨水包括红色墨水、绿色墨水和蓝色墨水，所述墨水滴入所述开孔121内形成像素层1201，其中所述红色墨水对应红色像素层12011，绿色墨水对应绿色像素层12012，蓝色墨水对应蓝色像素层12013，由于红色墨水在滴入过程中偏移至开孔121边缘处并溢出至所述挡墙上，所述绿色墨水在滴入过程中偏移至开孔121边缘处并溢出至与所述红色墨水相邻的所述挡墙上，两种墨水“桥接”形成了新的颜色，造成了混色现象。
为了解决这一现象，如图5所示，所述挡墙122设为带有外凸表面的结构，本实施例中，所述挡墙122远离所述基板110一侧为外凸的弧形结构，有利于墨水在滴落时偏移所述开孔121落至所述挡墙122上时，由于所述挡墙122本身的外凸结构，墨水会在重力作用下滑落至所述开孔121内，避免混色现象，同时在所述挡墙122上开设凹槽1221，所述凹槽1221围绕所述开孔121，其长度与所述开孔121长度相同，在40～120微米之间，其开口宽度为20～50微米，深度为0.5～1微米。若墨水滴落的位置偏移较多则落至挡墙中间的凹槽1221，从而不会引起桥联现象，同时凹槽1221内无发光源，落入所述凹槽1221内的墨水不发光，避免混色现象。
为了更好的解释本发明，本实施例中的阵列基板的制备方法步骤包括
提供一基板；
像素定义层制备步骤：在所述基板上形成像素定义层，在所述像素定义层对应所述发光区开设开孔，所述开孔贯穿所述像素定义层。
开槽步骤：相邻所述开孔之间的所述像素定义层形成挡墙，所述挡墙远离所述 基板一侧形成有外凸圆弧表面，采用半色调掩膜板在所述挡墙上开设凹槽。
本实施例中，如图6所示，本发明的显示装置1包括所述阵列基板10，其中，所述显示装置1的所有技术特征和技术效果均集中体现在所述阵列基板10上，对于显示装置1的其它部件，就不再一一赘述。
以上仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种阵列基板，包括发光区和围绕所述发光区的非发光区，其中，还包括
    基板；
    像素定义层，设于所述基板上，所述像素定义层中包括开孔和围绕所述开孔的挡墙，其中所述挡墙对应非发光区，所述开孔对应发光区；
    相邻两个开孔之间的所述挡墙远离所述基板的一侧设有的凹槽。
  2. 根据权利要求1所述的阵列基板，其中，所述挡墙远离所述基板的一侧为外凸的弧形、外凸的锥形、外凸棱形中的一种，所述凹槽设于所述挡墙远离所述基板的一侧的中间位置。
  3. 根据权利要求1所述的阵列基板，其中，
    所述凹槽的开口宽度在20～50微米之间，所述凹槽的开口深度为0.5～1微米。
  4. 根据权利要求1所述的阵列基板，其中，
    任一所述开孔内均设有像素层，所述像素层包括红色像素层、绿色像素层和蓝色像素层。
  5. 根据权利要求1所述的阵列基板，其中，
    所述像素定义层的材料为疏水疏油材料。
  6. 一种阵列基板的制备方法，所述阵列基板包括发光区和围绕所述发光区的非发光区，其中，包括
    提供一基板；
    像素定义层制备步骤：在所述基板上形成像素定义层，在所述像素定义层对应所述发光区开设开孔，所述开孔贯穿所述像素定义层；
    开槽步骤：相邻所述开孔之间的所述像素定义层形成挡墙，在所述挡墙远离所述基板一侧开设凹槽。
  7. 根据权利要求6所述的阵列基板的制备方法，其中，
    所述挡墙远离所述基板一侧形成有外凸圆弧表面。
  8. 根据权利要求7所述的阵列基板的制备方法，其中，
    在所述像素定义层制备步骤中，采用狭缝掩膜板制备所述外凸圆弧表面。
  9. 根据权利要求6所述的阵列基板的制备方法，其中，
    在所述开槽步骤中，采用半色调掩膜板在所述挡墙上开设所述凹槽。
  10. 一种显示装置，其中，包括权利要求1所述的阵列基板。
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