WO2021027063A1 - 一种电子设备用天线结构 - Google Patents

一种电子设备用天线结构 Download PDF

Info

Publication number
WO2021027063A1
WO2021027063A1 PCT/CN2019/112965 CN2019112965W WO2021027063A1 WO 2021027063 A1 WO2021027063 A1 WO 2021027063A1 CN 2019112965 W CN2019112965 W CN 2019112965W WO 2021027063 A1 WO2021027063 A1 WO 2021027063A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
conductive layer
antenna structure
housing
electronic equipment
Prior art date
Application number
PCT/CN2019/112965
Other languages
English (en)
French (fr)
Inventor
杨孟
刘飞
游志聪
Original Assignee
东莞美景科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 东莞美景科技有限公司 filed Critical 东莞美景科技有限公司
Publication of WO2021027063A1 publication Critical patent/WO2021027063A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors

Definitions

  • the utility model belongs to the field of electronic equipment, and particularly relates to an antenna structure for electronic equipment.
  • the casings used in various electronic products can be divided into plastic casings, alloy casings and composite material casings according to the different materials used.
  • the use of an alloy casing not only increases the production cost of the electronic product itself, but also greatly increases the quality of the electronic product itself, which is not conducive to carrying it out.
  • the use of alloy chassis metal itself has a better shielding effect on electromagnetic interference and metal materials have a higher thermal conductivity coefficient, which will affect the performance of the electronic product itself, so more and more electronic products use non-metal chassis.
  • the antenna structure cannot be formed to communicate with the internal structure of the electronic product.
  • the antenna structure in electronic products generally uses LDS/LAP/FPC antenna technology.
  • the antenna structure produced is generally suitable for the internal installation of electronic equipment and is not suitable for use as an exterior part.
  • part of the antenna structure needs to be installed on the appearance of the electronic device, which places higher requirements on the antenna structure.
  • One purpose of the present invention is to provide an antenna structure for electronic equipment in view of the deficiencies in the prior art.
  • An antenna structure for electronic equipment which includes a housing, the housing includes an outer wall surface and an inner wall surface; the housing is provided with a communication structure penetrating the housing, the outer end surface of the communication structure and the A first roughening treatment layer is provided on the outer wall surface around the outer end surface, and a first conductive layer is provided on the first roughening treatment layer; the inner end surface of the connecting structure and the inner end surface surrounding the inner end surface A contact structure is provided on the inner wall surface.
  • the connecting structure is a pre-embedded bracket made of metal; both ends of the pre-embedded bracket are respectively connected to the first conductive layer and the contact structure.
  • the communication structure is a reserved hole.
  • a connecting piece that penetrates the reserved hole and is fixedly connected to the first conductive layer is provided in the reserved hole; the connecting piece is formed in the reserved hole through a heterogeneous metal welding process, Or the connecting member is formed in the reserved hole by injecting a conductive curable liquid, or the connecting member is formed in the reserved hole by filling a metal conductor.
  • the contact structure includes a second roughening treatment layer and a second conductive layer; the first conductive layer and the second conductive layer are respectively composed of one or more layers of metal particles or powder coating.
  • first conductive layer and the second conductive layer are respectively zinc coating, zinc alloy coating, tin coating, tin alloy coating, aluminum coating, aluminum alloy coating, copper coating or copper coating.
  • alloy coatings constitute one or more layers.
  • the casing is a single-layer structure, and the casing is a non-conductive layer; or the casing is a multi-layer structure, and the casing is formed by stacking multiple non-conductive layers.
  • the first conductive layer is formed by metal spraying on the first roughening treatment layer.
  • the shell is provided with the first roughening treatment layer, the first conductive layer, the sanding layer, and the spray paint layer in sequence from the inside to the outside; the first conductive layer and the surrounding shell Body polishing forms the polishing layer, and the polishing layer is provided with the spray paint layer.
  • the present invention has the beneficial effects: the first conductive layer communicates with the contact structure through the communication structure, and the contact structure is used to communicate with the inside of the housing, thereby realizing the antenna structure on the electronic device The conduction. Not only the structure is simple, but also the problem of arranging the antenna structure on the non-conductive shell is effectively solved.
  • Another object of the present invention is to provide an electronic device, which is provided with an antenna structure, and the antenna structure is the above-mentioned antenna structure for the electronic device.
  • Figure 1 is a schematic structural diagram of an embodiment of the utility model
  • Figure 2 is a schematic diagram of the utility model connecting with embedded supports
  • Figure 3 is a schematic diagram of the utility model using a contact structure connected with a reserved hole on the side wall;
  • Figure 4 is a schematic diagram of the utility model using a contact structure connected with a reserved hole on the bottom wall;
  • Fig. 5 is a schematic diagram of a first example structure of an antenna pattern
  • FIG. 6 is a schematic diagram of a second example structure of an antenna pattern
  • FIG. 7 is a schematic diagram of a third example structure of an antenna pattern
  • Figure 8 is a schematic view of the utility model for spraying conductive material on the outer surface of the housing
  • Figure 9 is a schematic diagram of the utility model using a pre-embedded support and wire structure connection
  • housing 1 housing 1; connecting structure 2, reserved hole 201, connecting piece 202, embedded support 203, wire 204; first roughening treatment layer 301, second roughening treatment layer 302; first conductive layer 401, Second conductive layer 402; sanding layer 5; spray paint layer 6;
  • An antenna structure for electronic equipment (as shown in FIG. 1) includes a housing 1 composed of one or more non-conductive layers, and the housing 1 includes an outer wall surface and an inner wall surface.
  • the housing 1 is provided with a communicating structure 2 penetrating through the housing 1, and the outer end surface of the communicating structure 2 and the outer wall surface around the outer end surface are provided with a first rough surface formed by a surface treatment process.
  • the first roughening treatment layer 301 is provided with a corresponding pattern structure; this pattern structure has a certain depth, which is usually 0.01 to 0.1 mm lower than the outer wall surface.
  • a first conductive layer 401 is provided on the first roughening treatment layer 301; the first conductive layer 401 fills the recesses of the pattern structure to ensure that the height of the first conductive layer 401 is higher than the height of the pattern grooves;
  • the first conductive layer 401 can form a connecting line structure such as a connecting line and an antenna on the housing 1; the present invention does not specifically limit the connecting line structure formed by the first conductive layer 401, and all belong to the protection scope of the present invention.
  • Corresponding contact structures are provided on the inner end surface of the communication structure 2 and the inner wall surface around the inner end surface.
  • the contact structure includes a second roughening treatment layer 302 formed on the inner end surface of the connecting structure 2 and the inner wall surface around the inner end surface and formed by a surface treatment process, and a second roughening treatment layer 302 disposed on the second roughening treatment layer 302.
  • the upper second conductive layer 402 forms a corresponding contact structure.
  • the first conductive layer 401 communicates with the second conductive layer 402 through the connecting structure 2, and the contact structure is used to communicate with the inside of the casing 1, thereby realizing the conduction of the antenna structure on the electronic device. Not only the structure is simple, but also the problem of arranging the antenna structure on the non-conductive shell is effectively solved.
  • the communication structure 2 includes a metal embedded support 203 and a wire 204 connected to the embedded support 203, as shown in FIGS. 2 and 9.
  • the embedded support 203 is provided in the housing 1. One side of the embedded support 203 is fixedly connected to the conductive layer on the outer wall of the housing 1; the other side of the embedded support 203 is directly connected to the inner wall of the housing 1
  • the contact structure on the upper side is fixedly connected, or the other side of the embedded bracket 203 is fixedly connected to the contact structure on the inner wall surface of the housing 1 through a wire 204.
  • the embedded support 203 is set in the housing 1 by an injection molding process, and the embedded support 203 is located within the range of the antenna pattern.
  • the antenna pattern groove can be made by laser engraving, or reserved during injection molding, or The grooves of the antenna pattern are processed by CNC, and the first roughening treatment layer 301 is formed on the grooves.
  • the corresponding second conductive layer 402 is provided on the roughening treatment layer on the inner wall surface of the housing 1 to form a corresponding contact structure.
  • the contact structure can be formed by spraying a corresponding metal structure layer, or can be formed by welding copper sheets.
  • the utility model does not limit the specific forming method of the contact structure, and all are within the protection scope of the utility model.
  • the communication structure 2 is a reserved hole 201
  • the housing 1 is provided with at least one reserved hole 201 for communicating with the inside of the housing 1, as shown in FIG. 3.
  • the reserved hole 201 is a reserved hole 201 in any shape of a circle, a rectangle, a triangle, an ellipse, and an irregular polygon; the reserved hole 201 may also be a three-through hole.
  • the specific structure of the reserved hole 201 is not limited, and all belong to the protection scope of the present invention.
  • the reserved hole 201 is provided with a connecting member 202 that penetrates the reserved hole 201 and is fixedly connected to the conductive layer at both ends of the housing 1; the connecting member 202 is formed on the reserved hole by a heterogeneous metal welding process.
  • the connecting member 202 is formed in the reserved hole 201 by injecting a conductive curable liquid, or the connecting member 202 is formed in the reserved hole 201 by filling a conductive conductor.
  • the heterogeneous metal welding process defined in the present invention specifically refers to the metal spraying process, that is, the metal spraying process is used to spray zinc or phosphor bronze material into the reserved holes to form the connecting piece 202.
  • the shape of the connecting piece 202 is adapted to the shape of the reserved hole 201, and the shape of the connecting piece 202 is any one of a circle, a rectangle, a triangle, an ellipse, and an irregular polygon.
  • the connecting piece 202 is not limited to the specific structure of the connecting piece 202 in the present invention, and all belong to the protection scope of the present invention.
  • the connecting piece 202 can be connected to the side wall of the housing 1 (as shown in FIG. 3), and can also be connected to the bottom wall of the housing 1 (as shown in FIG. 4), so that the arrangement position of the connecting piece 202 can be ensured
  • the diversification of the antenna facilitates the connection of other components with the connector 202 and improves the antenna signal receiving capability.
  • the communication structure 2 can also be replaced with corresponding conductive lines; the first conductive layer 401 and the contact structure on the inner wall of the housing 1 can be connected through conductive lines; at the same time, conductive lines can be sprayed along the outer surface of the overall structure of the housing 1. Material to realize the conduction between the first conductive layer 401 and the contact structure on the inner wall of the housing 1, as shown in FIG. 8.
  • first conductive layer 401 and the second conductive layer 402 are respectively composed of one or more layers of metal particles or powder coating, and form corresponding antenna patterns, as shown in FIG. 5, FIG. 6, and FIG. 7;
  • the specific structure of the antenna pattern is not limited in the new model, and all are within the protection scope of the present utility model.
  • the antenna structure of a mobile phone it is used for line connection.
  • first conductive layer 401 and the second conductive layer 402 are respectively zinc coating, zinc alloy coating, tin coating, tin alloy coating, aluminum coating, aluminum alloy coating, copper coating or copper alloy coating.
  • One or more combinations of the layers constitute one or more layers.
  • the casing 1 has a single-layer structure, and the casing is a non-conductive layer.
  • the housing 1 has a multi-layer structure, and the housing 1 is formed by stacking multiple non-conductive layers. For example, one or more of the plastic structure layer and the ceramic structure layer may be combined to form one or more layers.
  • the housing 1 can also be a single-layer or multi-layer metal structure, and partition bars are arranged on the metal structure; the partition bars divide the metal structure into multiple components, and effectively avoid multiple components of the metal structure Partial conduction.
  • first conductive layer 401 and the second conductive layer 402 are formed on the first roughening treatment layer 301 and the second roughening treatment layer 302 by spraying, printing, coating, adsorption or adhesion.
  • first conductive layer 401 is formed on the first roughening treatment layer 301 by a metal spraying technology, and the thickness of the first conductive layer 401 formed by the metal spraying process is 0.02-0.5 mm, which is relatively high compared to other processes.
  • the thickness of the conductive layer is relatively large, which facilitates the polishing process when the antenna structure is used as an appearance part.
  • Metal spraying technology including thermal spraying and cold spraying.
  • Thermal spraying refers to the use of a certain heat source (such as electric arc, plasma spraying or combustion flame, etc.) to heat powdered or filamentary metal or non-metallic materials to a molten or semi-molten state , And then with the help of high-speed gas jet at a certain speed to the surface of the pretreated substrate, deposition to form a surface coating with various functions.
  • Cold spraying means that the metal particles are not melted during the entire spraying process. The compressed air is used to accelerate the metal particles, and the metal particles are crushed on the surface of the substrate and adhere firmly.
  • conductive materials are selected for the coating material, and sprayed to form a conductive layer; in addition, the coating material can also include different mixed materials, so that it can achieve conductivity while also having wear resistance, corrosion resistance, and One or several properties such as oxidation and heat conduction.
  • the first conductive layer 401 is formed by metal spraying technology
  • the conductive layer 3 formed by processes other than metal spraying requires five-coat five-bake or six-coat six-bake process or even more painting and baking times; relatively speaking, the conductive layer 3 formed by metal spraying is processed in the later stage At the same time, only three coatings and three baking or five coatings and five baking are needed, which reduces the production cost and improves the yield rate.
  • the polishing layer 5 is polished manually or automatically, for example, manual polishing is performed manually, or a professional machine is used for polishing, and the polishing quality and polishing efficiency are both good.
  • the entire paint spraying process is completed by an automated production line; preferably, the spray paint layer 6 adopts a "three-coating and three-baking" method, from the inside to the outside: a primer layer, a middle paint layer and a top paint layer.
  • the polishing layer 5 after the polishing layer 5 is formed, first remove dust from the polishing layer-preheat-spray primer layer-bake-spray middle paint layer-bake-spray top coat layer-bake, complete the entire spraying Process, increase the color sense of the appearance of electronic products, and at the same time strengthen the performance of the appearance of electronic products, to effectively protect the electronic products and ensure that they pass various reliability tests.
  • the spray paint layer 6 adopts a "five coating and five baking" method, from the inside to the outside: the first primer layer, the second primer layer, the third primer layer, the middle paint layer and the surface Lacquer layer.
  • the sanding layer 5 After the sanding layer 5 is formed, first remove dust from the sanding layer-baking-the first primer layer-the second primer layer-baking-baking-the third primer layer-the middle paint layer ——Top coat—baking—baking, and select the paint layer material, baking temperature, baking time, etc. according to the actual spraying needs, and then complete the entire spraying process. Through the spraying process, the performance of the appearance of the electronic product is strengthened to effectively protect the electronic product and ensure that it passes various reliability tests.
  • the present invention also provides an electronic device, the electronic device is provided with an antenna structure, and the antenna structure is the above-mentioned antenna structure for the electronic device.
  • the electronic device has all the advantages of the antenna structure for the electronic device described above.
  • the electronic devices in the present invention include smart phones, tablet computers, smart home appliances and smart wearable devices, etc.
  • the present invention does not limit specific electronic devices, and all fall within the protection scope of the present invention.

Landscapes

  • Telephone Set Structure (AREA)
  • Support Of Aerials (AREA)

Abstract

本实用新型属于电子设备领域，尤其涉及一种电子设备用天线结构。其包括壳体，所述壳体包括外壁面和内壁面；所述壳体上设有贯穿所述壳体的连通结构，所述连通结构的外端面以及所述外端面周围的所述外壁面上设有第一粗化处理层，所述第一粗化处理层上设有第一导电层；所述连通结构的内端面以及所述内端面周围的所述内壁面上设有触点结构。与现有技术相比，通过连通结构实现电子设备上天线结构的导通。不仅结构简单，而且有效解决了非导电壳体上设置天线结构的问题。

Description

一种电子设备用天线结构 技术领域
本实用新型属于电子设备领域，尤其涉及一种电子设备用天线结构。
背景技术
目前各种电子产品所使用的机壳，依据使用材料的不同可分为塑料机壳、合金机壳以及复合材料机壳等。采用合金机壳不仅提高了电子产品本身的生产成本，且极大的增加了电子产品本身的质量，不利于外出携带。此外，采用合金机壳金属本身对电磁波干扰有较好的屏蔽作用以及金属材料具有较高的热传导系数，这些都会影响电子产品本身的性能，故越来越多的电子产品使用非金属机壳。而当使用非金属机壳时，由于非金属机壳本身不包含任何导电层，无法形成天线结构与电子产品内部结构连通。
此外，现在电子产品中的天线结构，一般采用LDS/LAP/FPC天线技术，但由于制作工艺的缺陷，生产出来的天线结构普遍适用于电子设备内部设置，不宜作为外观件使用。同时，随着5G时代的到来，部分天线结构需要设置在电子设备的外观面上，这对天线结构提出了更高的要求。
实用新型内容
本实用新型的一个目的在于针对现有技术中的不足，提供一种电子设备用天线结构。
本实用新型采用如下的技术方案：
一种电子设备用天线结构，其包括壳体，所述壳体包括外壁面和内壁面；所述壳体上设有贯穿所述壳体的连通结构，所述连通结构的外端面以及所述外端面周围的所述外壁面上设有第一粗化处理层，所述第一粗化处理层上设有第一导电层；所述连通结构的内端面以及所述内端面周围的所述内壁面上设有触点结构。
进一步的，所述连通结构为金属材质的预埋支架；所述预埋支架的两端分别与所述第一导电层以及所述触点结构连接。
进一步的，所述连通结构为预留孔。
进一步的，所述预留孔内设有贯穿所述预留孔的并与所述第一导电层固定 连接的连接件；所述连接件通过异性金属焊接工艺形成于所述预留孔内，或所述连接件通过注入导电的可固化液体形成于所述预留孔内，或所述连接件通过填充金属类导体形成于所述预留孔内。
进一步的，所述触点结构包括第二粗化处理层和第二导电层；所述第一导电层与所述第二导电层分别由一层或多层金属颗粒或粉末涂层构成。
进一步的，所述第一导电层与所述第二导电层分别是锌涂层、锌合金涂层、锡涂层、锡合金涂层、铝涂层、铝合金涂层、铜涂层或者铜合金涂层中的一种或多种组合构成一层或多层。
进一步的，所述壳体为单层结构，所述壳体为非导电层；或所述壳体为多层结构，所述壳体由多层非导电层叠加形成。
进一步的，所述第一粗化处理层上金属喷涂形成所述第一导电层。
进一步的，所述壳体上，由内至外依次设有所述第一粗化处理层、所述第一导电层、打磨层以及喷漆层；所述第一导电层与其周边的所述壳体打磨形成所述打磨层，所述打磨层上设有所述喷漆层。
与现有技术相比，本实用新型获得的有益效果：第一导电层通过连通结构与触点结构连通，且触点结构用于与所述壳体的内部连通，进而实现电子设备上天线结构的导通。不仅结构简单，而且有效解决了非导电壳体上设置天线结构的问题。
本实用新型的另一个目的在于提供一种电子设备，所述电子设备上设有天线结构，所述天线结构为上述的电子设备用天线结构。
附图说明
为了更清楚的说明本实用新型实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单的介绍，显而易见的，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它附图。
图1为本实用新型实施例的结构示意图；
图2为本实用新型采用预埋支架连通的结构示意图；
图3为本实用新型采用预留孔连通的触点结构在侧壁的结构示意图；
图4为本实用新型采用预留孔连通的触点结构在底壁的结构示意图；
图5为天线图案的第一示例结构示意图；
图6为天线图案的第二示例结构示意图；
图7为天线图案的第三示例结构示意图；
图8为本实用新型为在壳体外表面喷涂导电材料的结构示意图；
图9为本实用新型在采用预埋支架加导线结构连通的示意图；
图中：壳体1；连通结构2、预留孔201、连接件202、预埋支架203、导线204；第一粗化处理层301、第二粗化处理层302；第一导电层401、第二导电层402；打磨层5；喷漆层6；
具体实施方式
下面将结合本实用新型中的附图，对本实用新型实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通的技术人员在没有做出创造性劳动的前提下所获得的所有其它实施例，都属于本实用新型的保护范围。
下面结合附图1和附图9以及本实施例详细论述本实用新型：
一种电子设备用天线结构，(如图1所示)其包括壳体1，所述壳体1由一层或多层非导电层构成，且所述壳体1包括外壁面和内壁面。所述壳体1上设有贯穿所述壳体1的连通结构2，所述连通结构2的外端面以及所述外端面周围的所述外壁面上设有经表面处理工艺形成的第一粗化处理层301，第一粗化处理层301上设置相应的图案结构；此图案结构具有一定的深度，通常是比外壁面低0.01至0.1mm。所述第一粗化处理层301上设有第一导电层401；第一导电层401将图案结构的凹位填满，保证第一导电层401的高度高于图案凹槽位的高度；同时，第一导电层401在壳体1上可以形成连接线、天线等连接线路结构；本实用新型对第一导电层401形成的连接线路结构不做具体限定，都属于本实用新型的保护范围。所述连通结构2的内端面以及所述内端面周围的所述内壁面上设有相应的触点结构。具体的，触点结构包括在连通结构2的内端面以及内端面周围的内壁面上设置的，并经表面处理工艺形成的第二粗化处理层302，以及设置在第二粗化处理层302上的第二导电层402，形成相应的触点结构。第一导电层401通过连通结构2与第二导电层402连通，且触点结构用于 与所述壳体1的内部连通，进而实现电子设备上天线结构的导通。不仅结构简单，而且有效解决了非导电壳体上设置天线结构的问题。
进一步的，所述连通结构2包括金属材质的预埋支架203以及与所述预埋支架203连接的导线204，如图2和图9所示。在所述壳体1内设有所述预埋支架203，预埋支架203一侧与壳体1外壁面上的导电层固定连接；预埋支架203的另一侧直接与壳体1内壁面上的触点结构固定连接，或预埋支架203的另一侧通过导线204与壳体1内壁面上的触点结构固定连接。具体的，预埋支架203采用注塑工艺设置在壳体1内，且预埋支架203处于位于天线图案范围内，天线图案凹槽位可以是用激光雕刻制成，或在注塑时预留，或利用CNC加工出天线图案凹槽位，并在凹槽位形成第一粗化处理层301。壳体1内壁面上的粗化处理层上设置相应第二导电层402，形成相应的触点结构，该触点结构可以通过喷涂相应的金属结构层形成，还可以通过焊接铜片形成，本实用新型对该触点结构的具体形成方式不做限定，都在本实用新型的保护范围。
另一优选实施方案，所述连通结构2为预留孔201，在所述壳体1上设有至少一个用于与所述壳体1内部连通的预留孔201，如图3所示。具体的，所述预留孔201为圆形、长方形、三角形、椭圆形、不规则多边形中的任意一种形状的预留孔201；预留孔201还可以是三通孔，本实用新型对预留孔201的具体结构不限定，都属于本实用新型的保护范围。所述预留孔201内设有贯穿所述预留孔201的并分别与壳体1两端的导电层固定连接的连接件202；所述连接件202通过异性金属焊接工艺形成于所述预留孔201内，或所述连接件202通过注入导电的可固化液体形成于所述预留孔201内，或所述连接件202通过填充导电导体形成于所述预留孔201内。本实用新型定义的异性金属焊接工艺具体指的是金属喷涂工艺，即采用金属喷涂工艺将锌或者磷青铜材料喷涂至预留孔内，以形成连接件202。具体的，所述连接件202的形状与所述预留孔201形状相适配，所述连接件202的形状为圆形、长方形、三角形、椭圆形、不规则多边形中的任意一种形状的连接件202，本实用新型对连接件202的具体结构不限定，都属于本实用新型的保护范围。此外，连接件202既可以与壳体1的侧壁连接(如图3所示)，又可以与壳体1的底壁连接(如图4所示)，这样可以保证连接件202的布置位置的多样化，便于其他部件与连接件202连接，提高天线信 号接收能力。
此外，连通结构2还可以替换为相应的导电线路；将第一导电层401与壳体1内壁上触点结构通过导电线路进行连接；同时，还可以沿壳体1整体结构的外表面喷涂导电材料，实现第一导电层401与壳体1内壁上触点结构的导通，如图8所示。
进一步的，第一导电层401与第二导电层402分别由一层或多层金属颗粒或粉末涂层构成，并形成相应的天线图案，如图5、图6、图7所示；本实用新型中对天线图案的具体结构不做限定，都在本实用新型的保护范围内。如作为手机的天线结构，用于线路连接。
进一步的，第一导电层401与第二导电层402分别是锌涂层、锌合金涂层、锡涂层、锡合金涂层、铝涂层、铝合金涂层、铜涂层或者铜合金涂层中的一种或多种组合构成一层或多层。
进一步的，所述壳体1为单层结构，所述壳体为非导电层。所述壳体1为多层结构，所述壳体1由多层非导电层叠加形成。比如，可以为塑料结构层、以及陶瓷结构层中的一种或多种组合构成一层或多层。此外，所述壳体1还可以是单层或多层金属结构，且在金属结构上设有隔断条；隔断条将金属结构分为多个组成部分，且有效避免了金属结构的多个组成部分间导通。
进一步的，所述第一粗化处理层301与所述第二粗化处理层302上通过喷涂、印刷、涂覆、吸附或者粘覆形成相应的第一导电层401以及第二导电层402。优选的，所述第一粗化处理层301上通过金属喷涂技术形成所述第一导电层401，采用金属喷涂工艺形成的第一导电层401的厚度为0.02-0.5mm，相对其它工艺形成的导电层厚度值较大，有利于天线结构作为外观件时的打磨处理。金属喷涂技术，包括热喷涂和冷喷涂，其中热喷涂是指利用某种热源(如电弧、等离子喷涂或燃烧火焰等)将粉末状或丝状的金属或非金属材料加热到熔融或半熔融状态，然后借助高速气体以一定速度喷射到预处理过的基体表面，沉积而形成具有各种功能的表面涂层的一种技术。冷喷涂是指整个喷涂过程金属粒子没有被融化，利用压缩空气加速金属粒子，金属粒子撞扁在基体表面并牢固附着。本实施例中，覆层的材料选择导电材料，喷涂形成导电层；此外，覆层的材料中还可以包括不同的混合材料，使其获得导电性能的同时还具有耐磨损、耐腐 蚀、抗氧化、导热等方面的一种或数种性能。
进一步的，通过金属喷涂技术形成第一导电层401后，在壳体1上，由内至外依次设有所述第一粗化处理层301、所述第一导电层401、打磨层5以及喷漆层6；所述第一导电层401与其周边的所述壳体1共同打磨形成所述打磨层5，使得形成的打磨层5在同一面上，无凹凸感(即：使得导电层的外表面与导电层周边壳体1的外表面间无高度差)，并在所述打磨层5上设有所述喷漆层6。采用除金属喷涂以外的其他工艺形成的导电层3，需要五涂五烤或六涂六烤工艺甚至更多的喷漆与烘烤次数；相对而言，采用金属喷涂形成的导电层3在后期处理时，仅需三涂三烤或是五涂五烤即可，降低了生成成本，同时也提高了良品率。
具体的，打磨层5通过手动或自动打磨，比如：利用人工手动打磨，或利用专业机器进行打磨，打磨质量与打磨效率均较好。整个喷漆的过程是由一条自动化生产线完成；优选的，所述喷漆层6采用“三涂三烤”的方式，由内至外分别为：底漆层、中漆层以及面漆层。即形成打磨层5后，首先对打磨层除尘——预热——喷涂底漆层——烘烤——喷涂中漆层——烘烤——喷涂面漆层——烘烤，完成整个喷涂过程，增加电子产品外观面的色彩感，同时强化电子产品外观面的性能，来有效保护电子产品，确保其通过各种可靠性测试。另一优选的方式为，喷漆层6采用“五涂五烤”的方式，由内至外分别为：第一底漆层、第二底漆层、第三底漆层、中漆层以及面漆层。即形成打磨层5后，首先对打磨层除尘——烘烤——第一底漆层——第二底漆层——烘烤——烘烤——第三底漆层——中漆层——面漆层——烘烤——烘烤，并依据实际喷涂的需要选择漆层材料以及烘烤温度、烘烤时间等，进而完成整个喷涂过程。通过喷涂过程，强化电子产品外观面的性能，来有效保护电子产品，确保其通过各种可靠性测试。
本实用新型还提供一种电子设备，所述电子设备上设有天线结构，所述天线结构为上述的电子设备用天线结构。所述电子设备具有上述电子设备用天线结构的全部优点。本实用新型中的电子设备包括智能手机、平板电脑和智能家电及智能穿戴设备等，但本实用新型不限定具体的电子设备，都属于本实用新型的保护范围。
以上借助具体实施例对本实用新型做了进一步描述，但是应该理解的是，这里具体的描述，不应理解为对本实用新型的实质和范围的限定，本领域内的普通技术人员在阅读本说明书后对上述实施例做出的各种修改，都属于本实用新型所保护的范围。

Claims (10)

  1. 一种电子设备用天线结构，其特征在于：其包括壳体，所述壳体包括外壁面和内壁面；所述壳体上设有贯穿所述壳体的连通结构，所述连通结构的外端面以及所述外端面周围的所述外壁面上设有第一粗化处理层，所述第一粗化处理层上设有第一导电层；所述连通结构的内端面以及所述内端面周围的所述内壁面上设有触点结构。
  2. 根据权利要求1所述的电子设备用天线结构，其特征在于：所述连通结构为金属材质的预埋支架；所述预埋支架的两端分别与所述第一导电层以及所述触点结构连接。
  3. 根据权利要求1所述的电子设备用天线结构，其特征在于：所述连通结构为预留孔。
  4. 根据权利要求3所述的电子设备用天线结构，其特征在于：所述预留孔内设有贯穿所述预留孔的并与所述第一导电层固定连接的连接件；所述连接件通过异性金属焊接工艺形成于所述预留孔内，或所述连接件通过注入导电的可固化液体形成于所述预留孔内，或所述连接件通过填充金属类导体形成于所述预留孔内。
  5. 根据权利要求1所述的电子设备用天线结构，其特征在于：所述触点结构包括第二粗化处理层和第二导电层；所述第一导电层与所述第二导电层分别由一层或多层金属颗粒或粉末涂层构成。
  6. 根据权利要求5所述的电子设备用天线结构，其特征在于：所述第一导电层与所述第二导电层分别是锌涂层、锌合金涂层、锡涂层、锡合金涂层、铝涂层、铝合金涂层、铜涂层或者铜合金涂层中的一种或多种组合构成一层或多层。
  7. 根据权利要求1所述的电子设备用天线结构，其特征在于：所述壳体为单层结构，所述壳体为非导电层；或所述壳体为多层结构，所述壳体由多层非导电层叠加形成。
  8. 根据权利要求1至7任一项所述的电子设备用天线结构，其特征在于：所述第一粗化处理层上金属喷涂形成所述第一导电层。
  9. 根据权利要求8所述的电子设备用天线结构，其特征在于：所述壳体上， 由内至外依次设有所述第一粗化处理层、所述第一导电层、打磨层以及喷漆层；所述第一导电层与其周边的所述壳体打磨形成所述打磨层，所述打磨层上设有所述喷漆层。
  10. 一种电子设备，所述电子设备上设有天线结构，其特征在于：所述天线结构为权利要求1-9任意一项所述的电子设备用天线结构。
PCT/CN2019/112965 2019-08-13 2019-10-24 一种电子设备用天线结构 WO2021027063A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201921313414.4 2019-08-13
CN201921313414.4U CN210224271U (zh) 2019-08-13 2019-08-13 一种电子设备用天线结构及电子设备

Publications (1)

Publication Number Publication Date
WO2021027063A1 true WO2021027063A1 (zh) 2021-02-18

Family

ID=69918489

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/112965 WO2021027063A1 (zh) 2019-08-13 2019-10-24 一种电子设备用天线结构

Country Status (2)

Country Link
CN (1) CN210224271U (zh)
WO (1) WO2021027063A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113725593A (zh) * 2020-05-26 2021-11-30 中兴通讯股份有限公司 终端设备和终端设备的天线制作方法
CN111954409B (zh) * 2020-08-13 2021-09-14 东莞美景科技有限公司 一种内置天线的壳体的制备方法
CN112468638A (zh) * 2020-11-24 2021-03-09 东莞美景科技有限公司 一种内置天线的玻璃纤维壳体及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104979630A (zh) * 2014-04-04 2015-10-14 三星电子株式会社 天线模块及包括该天线模块的电子装置
CN205752507U (zh) * 2016-05-12 2016-11-30 苏州同拓光电科技有限公司 一种手机壳体
CN107146946A (zh) * 2017-05-04 2017-09-08 深圳市金立通信设备有限公司 一种终端的天线制作方法、天线以及终端
WO2018116599A1 (ja) * 2016-12-22 2018-06-28 ソニー株式会社 電子機器
CN208045688U (zh) * 2018-04-23 2018-11-02 深圳市泽华永盛技术有限公司 一种电子设备用天线结构
CN110034375A (zh) * 2019-04-19 2019-07-19 Oppo广东移动通信有限公司 天线模组及电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104979630A (zh) * 2014-04-04 2015-10-14 三星电子株式会社 天线模块及包括该天线模块的电子装置
CN205752507U (zh) * 2016-05-12 2016-11-30 苏州同拓光电科技有限公司 一种手机壳体
WO2018116599A1 (ja) * 2016-12-22 2018-06-28 ソニー株式会社 電子機器
CN107146946A (zh) * 2017-05-04 2017-09-08 深圳市金立通信设备有限公司 一种终端的天线制作方法、天线以及终端
CN208045688U (zh) * 2018-04-23 2018-11-02 深圳市泽华永盛技术有限公司 一种电子设备用天线结构
CN110034375A (zh) * 2019-04-19 2019-07-19 Oppo广东移动通信有限公司 天线模组及电子设备

Also Published As

Publication number Publication date
CN210224271U (zh) 2020-03-31

Similar Documents

Publication Publication Date Title
WO2021027063A1 (zh) 一种电子设备用天线结构
WO2021027065A1 (zh) 金属喷涂的天线结构及其制备方法
WO2022032924A1 (zh) 一种内置天线的壳体及其制备方法
CN104053320A (zh) 壳体、制造壳体的方法和电子设备
TWI435954B (zh) Heat resistant copper foil and its manufacturing method, circuit board, copper clad laminate substrate and manufacturing method thereof
CN104838634B (zh) 电子设备的主体和便携式电子设备
CN103781296B (zh) 电子装置外壳制造方法
CN105307429B (zh) 一种电子产品外壳及其表面处理工艺
CN104582362A (zh) 实现双色双光泽的方法、塑胶外壳及终端
CN101754611A (zh) 电子装置外壳及其制造方法
WO2016101874A1 (zh) 通讯设备金属外壳及其制备方法
US20140295115A1 (en) Housing and electronic device using the same
WO2022007306A1 (zh) 一种新型天线结构及制备方法
JP2010141311A (ja) 電子装置ハウジング及びその製造方法
CN101410001B (zh) 兼具有表面装饰及电磁波遮蔽的非金属基材
CN112376093A (zh) 进油接管嘴化学镀镍电镀保护工装
CN205428622U (zh) 一种金属化铁粉芯磁芯和贴片电感
CN213522524U (zh) 一种新颖接地螺钉孔焊盘
CN207321690U (zh) 一种电子产品外壳的电镀仿金属表面结构及外壳
CN204632639U (zh) 一种双色注塑真空电镀的拉丝按键
WO2021027064A1 (zh) 一种非导电壳体的天线结构
CN203301551U (zh) 一种具有电磁屏蔽结构的手机后壳
CN214300403U (zh) 一种进油接管嘴电镀保护工装
CN209218444U (zh) 一种基板上的连接线路结构及其电子设备
CN206561661U (zh) 一种具有esd防护层的塑胶结构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19941720

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19941720

Country of ref document: EP

Kind code of ref document: A1