WO2021027065A1 - 金属喷涂的天线结构及其制备方法 - Google Patents

金属喷涂的天线结构及其制备方法 Download PDF

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WO2021027065A1
WO2021027065A1 PCT/CN2019/112970 CN2019112970W WO2021027065A1 WO 2021027065 A1 WO2021027065 A1 WO 2021027065A1 CN 2019112970 W CN2019112970 W CN 2019112970W WO 2021027065 A1 WO2021027065 A1 WO 2021027065A1
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layer
antenna structure
conductive layer
metal
conductive
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PCT/CN2019/112970
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English (en)
French (fr)
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杨孟
刘飞
游志聪
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东莞美景科技有限公司
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

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  • the invention belongs to the field of electronic equipment, and particularly relates to a metal sprayed antenna structure and a preparation method thereof.
  • the 5G signal era With the development of communication technology, the 5G signal era is about to enter commercialization.
  • the antenna structure in electronic products generally adopts LDS/LAP/FPC antenna technology. Due to the defects of the manufacturing process, the antenna structure produced is generally suitable for the internal installation of electronic equipment and is not suitable for use as an exterior part. At the same time, with the advent of the 5G era, part of the antenna structure needs to be installed on the appearance of the electronic device, which places higher requirements on the antenna structure.
  • An object of the present invention is to provide a metal sprayed antenna structure in view of the deficiencies in the prior art.
  • a metal sprayed antenna structure which comprises a shell.
  • the shell is provided with a roughening treatment layer, a conductive layer, a polishing layer and a spray paint layer in order from the inside to the outside; the outer wall of the shell is provided with a roughening treatment layer , Metal spraying on the roughening treatment layer forms a conductive layer, the conductive layer and the shell around the conductive layer are polished to form a polishing layer, and a spray paint layer is provided on the polishing layer.
  • the present invention has the beneficial effects: the appearance surface of the antenna structure is polished and painted, which can increase the color sense of the appearance surface of the electronic product, and at the same time strengthen the performance of the appearance surface of the electronic product, to effectively protect the electronics Products to ensure that they pass various reliability tests.
  • Another object of the present invention is to provide a method for preparing a metal sprayed antenna structure in view of the deficiencies in the prior art, including the following steps:
  • the present invention has the beneficial effect that the antenna structure adopting the above-mentioned preparation method not only has a simple preparation process, but also overcomes the defects of the prior art.
  • the antenna structure produced not only has a strong sense of color on the appearance surface, but also meets the appearance requirements of the antenna structure as an appearance part; at the same time, it increases the consistency and overall sense of the appearance of the electronic product, making the overall performance of the appearance surface good.
  • step 2) when the antenna pattern groove position is formed by laser engraving or injection molding, the corresponding groove position is reserved or the corresponding groove position is processed by CNC.
  • the depth of the groove position of the antenna pattern is 0.01-0.1 mm.
  • the diameter of the conductive metal particles in step 4) is 2-100 ⁇ m.
  • step 4 one or more layers of conductive metal particles or powder are sprayed, and the thickness of the conductive layer formed is 0.02-0.5 mm.
  • step 7 the spray paint layer is formed by three-coating and three-baking or five-coating and five-baking process.
  • the thickness of the spray paint layer is 8-100 ⁇ m.
  • Figure 1 is a schematic structural diagram of an embodiment of the present invention
  • Fig. 2 is a flow chart of the method for preparing the metal sprayed antenna structure of the present invention
  • shell 1 shell 1; roughening treatment layer 2; conductive layer 3; sanding layer 4; painting layer 5;
  • a metal sprayed antenna structure which comprises a shell 1; on the shell 1, a roughening treatment layer 2, a conductive layer 3, a polishing layer 4, and a spray paint layer 5 are sequentially arranged from the inside to the outside; the outer wall surface of the shell 1
  • a roughening treatment layer 2 is provided on the roughening treatment layer 2, and corresponding pattern grooves are arranged on the roughening treatment layer 2; the pattern grooves have a certain depth, which is usually 0.01 to 0.1 mm lower than the outer wall surface of the casing 1.
  • the pattern grooves are filled to form the corresponding conductive layer 4; the conductive layer can form a connecting line structure such as a connecting line and an antenna on the housing 1; the connecting line structure formed on the conductive layer 3 of the present invention Without specific limitation, all belong to the protection scope of the present invention.
  • the conductive layer 3 and the shell 1 around the conductive layer 3 are polished to form a polishing layer 4, and a spray paint layer 5 is provided on the polishing layer 4.
  • the appearance surface of the antenna structure is polished and painted, which can increase the color sense of the appearance surface of the electronic product, and at the same time strengthen the performance of the appearance surface of the electronic product, to effectively protect the electronic product and ensure that it passes various reliability tests.
  • the method for manufacturing an antenna structure based on the foregoing metal spraying includes the following steps:
  • the way of masking treatment can be: fixing the housing 1 to a masking jig, and the masking jig covers the area of the housing 2 that does not require metal spraying treatment, exposing the area that needs metal spraying;
  • the way of masking treatment can also be : Wrap the shell 1 with a thin layer of material, and remove the thin layer of material corresponding to the area that needs to be metal sprayed through equipment such as a laser laser engraving machine to expose the area that needs to be metal sprayed.
  • the present invention does not specifically limit the method of masking treatment, which all fall within the protection scope of the present invention.
  • the conductive metal particles or powder are sprayed on the roughening treatment layer 2 by a metal spraying technique to form a conductive layer 3, ensuring that the height of the conductive layer 3 is higher than the height of the groove position of the antenna pattern.
  • Metal spraying technology including thermal spraying and cold spraying.
  • Thermal spraying refers to the use of a certain heat source (such as electric arc, plasma spraying or combustion flame, etc.) to heat powdered or filamentary metal or non-metallic materials to a molten or semi-molten state , And then with the help of high-speed gas jet at a certain speed to the surface of the pretreated substrate, deposition to form a surface coating with various functions.
  • Cold spraying means that the metal particles are not melted during the entire spraying process.
  • conductive materials are selected for the coating material, and sprayed to form a conductive layer; in addition, the coating material can also include different mixed materials, so that it can achieve conductivity while also having wear resistance, corrosion resistance, and One or several properties such as oxidation and heat conduction.
  • the antenna structure adopting the above-mentioned preparation method overcomes the defects of the prior art.
  • the produced antenna structure not only has a strong sense of color on the appearance surface, but also meets the appearance requirements of the antenna structure as an appearance part; at the same time, the overall performance of the appearance surface is good .
  • step 2) when the antenna pattern groove is formed by laser engraving or injection molding, the corresponding groove is reserved or the corresponding groove is processed by CNC; the antenna pattern groove can be made in various forms , To facilitate the production of antenna pattern grooves.
  • the depth of the groove position of the antenna pattern is 0.01-0.1 mm.
  • the diameter of the conductive metal particles in step 4) is 2-100 ⁇ m.
  • the uniformity of the metal spraying is the best, resulting in the best performance of the conductive layer formed.
  • one or more layers of conductive metal particles or powder are sprayed to form the conductive layer 3; and the thickness of the conductive layer 3 is 0.02-0.5 mm; the thickness of the conductive layer 3 formed by other processes is larger.
  • one or more layers of conductive metal particles or powders are respectively zinc coating, zinc alloy coating, tin coating, tin alloy coating, aluminum coating, aluminum alloy coating, copper coating or copper alloy coating.
  • One or more combinations of the layers constitute one or more layers.
  • the thickness of the spray paint layer 5 in step 7) is 8-100 ⁇ m.
  • the spray paint effect of the spray paint layer 5 is the best, which can better protect the electronic products and ensure that it passes various reliability tests.
  • the spray paint layer 5 is formed by three-coating and three-bake or five-coating and five-bake process; the conductive layer 3 formed by processes other than metal spraying requires five-coating, five-bake or six-coating and six-bake process. More painting and baking times; relatively speaking, the conductive layer 3 formed by metal spraying only needs three coatings and three baking or five coatings and five baking in the post-processing, which reduces the production cost and also increases Yield rate. Specifically, the entire painting process is completed by an automated production line; the painting layer 5 adopts a "three-coating and three-baking" method, from the inside to the outside: the primer layer, the middle paint layer and the top paint layer.
  • the spray paint layer 5 adopts a "five coating and five baking" method, from the inside to the outside: the first primer layer, the second primer layer, the third primer layer, the middle paint layer and the surface Lacquer layer.
  • the sanding layer 4 After the sanding layer 4 is formed, first remove dust from the sanding layer-baking-the first primer layer-the second primer layer-baking-baking-the third primer layer-the middle paint layer ——Top coat—baking—baking, and select the paint layer material, baking temperature, baking time, etc. according to the actual spraying needs, and then complete the entire spraying process. Through the spraying process, the performance of the appearance of the electronic product is strengthened to effectively protect the electronic product and ensure that it passes various reliability tests.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

本发明属于电子设备领域，尤其涉及一种金属喷涂的天线结构及其制备方法。一种金属喷涂的天线结构，其包括壳体，壳体上，由内至外依次设有粗化处理层、导电层、打磨层以及喷漆层；壳体上设有粗化处理层，粗化处理层上金属喷涂形成导电层，导电层与其周边的壳体打磨形成打磨层，打磨层上设有喷漆层。与现有技术相比，对该天线结构的外观面进行了打磨与喷漆处理，可以增加电子产品外观面的色彩感，同时强化电子产品外观面的性能，来有效保护电子产品，确保其通过各种可靠性测试。

Description

金属喷涂的天线结构及其制备方法 技术领域
本发明属于电子设备领域，尤其涉及一种金属喷涂的天线结构及其制备方法。
背景技术
随着通讯技术的发展，5G信号时代即将步入商业化。而现在电子产品中的天线结构，一般采用LDS/LAP/FPC天线技术，由于制作工艺的缺陷，生产出来的天线结构普遍适用于电子设备内部设置，不宜作为外观件使用。同时，随着5G时代的到来，部分天线结构需要设置在电子设备的外观面上，这对天线结构提出了更高的要求。
发明内容
本发明的一个目的在于针对现有技术中的不足，提供一种金属喷涂的天线结构。
本发明采用如下的技术方案：
一种金属喷涂的天线结构，其包括壳体，壳体上，由内至外依次设有粗化处理层、导电层、打磨层以及喷漆层；壳体的外壁面上设有粗化处理层，粗化处理层上金属喷涂形成导电层，导电层与导电层周边的壳体打磨形成打磨层，打磨层上设有喷漆层。
与现有技术相比，本发明获得的有益效果：该天线结构的外观面进行了打磨与喷漆处理，可以增加电子产品外观面的色彩感，同时强化电子产品外观面的性能，来有效保护电子产品，确保其通过各种可靠性测试。
本发明的另一个目的在于针对现有技术中的不足，提供一种金属喷涂的天线结构的制备方法，包括以下几个步骤：
1)将壳体部分区域进行遮蔽处理，露出需要金属喷涂的区域；
2)在需要金属喷涂的区域加工相应的天线图案凹槽位；
3)将天线图案凹槽位进行表面处理形成粗化处理层；
4)将导电金属颗粒或粉末经金属喷涂技术喷涂在粗化处理层上，形成导电层；
5)除去步骤1)中的遮蔽处理；
6)利用打磨机器对导电层与导电层周边壳体进行打磨，打磨至导电层与导电层周边壳体在同一个面，形成相应的打磨层；
7)利用喷漆设备对打磨层进行喷漆处理，形成喷漆层。
与现有技术相比，本发明获得的有益效果：采用上述制备方法的天线结构，不仅制备工艺简单，且克服了现有技术的缺陷。生产的天线结构不仅外观面的色彩感强，满足了天线结构作为外观件的外观要求；同时，增加了电子产品外观的一致性以及整体感，使得外观面的整体性能好。
进一步的，步骤2)中天线图案凹槽位由激光雕刻成型或注塑成型时预留相应的凹槽位或利用CNC加工出相应的凹槽位。
进一步的，天线图案凹槽位的深度值为0.01-0.1mm。
进一步的，步骤4)中导电金属颗粒的直径为2-100μm。
进一步的，步骤4)中导电金属颗粒或粉末喷涂一层或多层，形成的所述导电层厚度为0.02-0.5mm。
进一步的，步骤7)中喷漆层通过三涂三烤或五涂五烤工艺喷涂形成。
进一步的，喷漆层的厚度值为8-100μm。
附图说明
为了更清楚的说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单的介绍，显而易见的，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它附图。
图1为本发明实施例的结构示意图；
图2为本发明金属喷涂的天线结构的制备方法的流程图；
图中：壳体1；粗化处理层2；导电层3；打磨层4；喷漆层5；
具体实施方式
下面将结合本发明中的附图，对本发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通的技术人员在没有做出创造性劳动的前提下所获得的所有其它实施例，都属于本发明的保护范围。
下面结合附图1至附图2以及本实施例详细论述本发明：
一种金属喷涂的天线结构，其包括壳体1；壳体1上，由内至外依次设有粗化处理层2、导电层3、打磨层4以及喷漆层5；壳体1的外壁面上设有粗化处理层2，粗化处理层2上设置相应的图案凹槽位；此图案凹槽位具有一定的深度，通常是比壳体1的外壁面低0.01至0.1mm。通过金属喷涂技术，将图案凹槽位填满，形成相应的导电层4；该导电层在壳体1上可以形成连接线、天线等连接线路结构；本发明对导电层3形成的连接线路结构不做具体限定，都属于本发明的保护范围。导电层3与导电层3周边的壳体1打磨形成打磨层4，打磨层4上设有喷漆层5。该天线结构的外观面进行了打磨与喷漆处理，可以增加电子产品外观面的色彩感，同时强化电子产品外观面的性能，来有效保护电子产品，确保其通过各种可靠性测试。
基于上述一种金属喷涂的天线结构的制备方法，其包括以下几个步骤：
1)将壳体1部分区域(即无需金属喷涂的区域)进行遮蔽处理，露出需要金属喷涂的区域。具体的，遮蔽处理的方式可以为：将壳体1固定于遮蔽治具上，遮蔽治具将壳体2无需金属喷涂处理的区域覆盖，露出需要金属喷涂的区域；遮蔽处理的方式还可以为：利用薄层材料包裹壳体1，并通过激光镭雕机等设备去除需要金属喷涂处理区域对应的薄层材料，露出需要金属喷涂的区域。本发明对遮蔽处理的方法不做具体限定，都属于本发明的保护范围。
2)在需要金属喷涂的区域加工相应的天线图案凹槽位。
3)将天线图案凹槽位进行表面处理形成粗化处理层2。
4)将导电金属颗粒或粉末经金属喷涂技术喷涂在粗化处理层2上，形成导电层3，保证导电层3的高度高于天线图案凹槽位的高度。金属喷涂技术，包括热喷涂和冷喷涂，其中热喷涂是指利用某种热源(如电弧、等离子喷涂或燃烧火焰等)将粉末状或丝状的金属或非金属材料加热到熔融或半熔融状态，然后借助高速气体以一定速度喷射到预处理过的基体表面，沉积而形成具有各种功能的表面涂层的一种技术。冷喷涂是指整个喷涂过程金属粒子没有被融化，利用压缩空气加速金属粒子，金属粒子撞扁在基体表面并牢固附着。本实施例中，覆层的材料选择导电材料，喷涂形成导电层；此外，覆层的材料中还可以包括不同的混合材料，使其获得导电性能的同时还具有耐磨损、耐腐蚀、抗氧化、 导热等方面的一种或数种性能。
5)除去步骤1)中的遮蔽处理。
6)利用人工或打磨机器对导电层3与导电层3周边的壳体1进行打磨，打磨至导电层3与导电层3周边壳体1在同一个面上，无凹凸感，形成相应的打磨层4；使得导电层3的外表面与导电层3周边壳体1的外表面间无高度差。
7)利用喷漆设备对打磨层4进行喷漆处理，形成喷漆层5。
有益效果：采用上述制备方法的天线结构，克服了现有技术的缺陷，生产的天线结构不仅外观面的色彩感强，满足了天线结构作为外观件的外观要求；同时，外观面的整体性能好。
进一步的，步骤2)中天线图案凹槽位由激光雕刻成型或注塑成型时预留相应的凹槽位或利用CNC加工出相应的凹槽位；该天线图案凹槽位可以通过多种形式制作，方便天线图案凹槽位的制作。
进一步的，天线图案凹槽位的深度值为0.01-0.1mm。天线图案凹槽位的深度值为0.01-0.1mm时，为凹槽位深度的最优值，便于在天线图案凹槽位上喷涂导电金属颗粒或粉末，且形成的天线结构的固定性更好。
进一步的，步骤4)中导电金属颗粒的直径为2-100μm。导电金属颗粒的直径为2-100μm时，金属喷涂均匀性最好，致使形成的导电层性能最优。
进一步的，步骤4)中喷涂一层或多层的导电金属颗粒或粉末，形成导电层3；且导电层3厚度值为0.02-0.5mm；相对其它工艺形成的导电层3厚度值较大，有利于天线结构作为外观件时的打磨处理。具体的，一层或多层的导电金属颗粒或粉末分别为锌涂层、锌合金涂层、锡涂层、锡合金涂层、铝涂层、铝合金涂层、铜涂层或者铜合金涂层中的一种或多种组合构成一层或多层。
进一步的，步骤7)中喷漆层5的厚度值为8-100μm。喷漆层5厚度范围为8-100μm时，喷漆层5的喷漆效果最佳，能更好的保护电子产品，确保其通过各种可靠性测试。
进一步的，步骤7)中喷漆层5通过三涂三烤或五涂五烤工艺喷涂形成；采用除金属喷涂以外的其他工艺形成的导电层3，需要五涂五烤或六涂六烤工艺甚至更多的喷漆与烘烤次数；相对而言，采用金属喷涂形成的导电层3在后期处理时，仅需三涂三烤或是五涂五烤即可，降低了生成成本，同时也提高了良品 率。具体的，整个喷漆的过程是由一条自动化生产线完成；喷漆层5采用“三涂三烤”的方式，由内至外分别为：底漆层、中漆层以及面漆层。即形成打磨层4后，首先对打磨层除尘——预热——喷涂底漆层——烘烤——喷涂中漆层——烘烤——喷涂面漆层——烘烤，完成整个喷涂过程，增加电子产品外观面的色彩感，同时强化电子产品外观面的性能，来有效保护电子产品，确保其通过各种可靠性测试。另一优选的方式为，喷漆层5采用“五涂五烤”的方式，由内至外分别为：第一底漆层、第二底漆层、第三底漆层、中漆层以及面漆层。即形成打磨层4后，首先对打磨层除尘——烘烤——第一底漆层——第二底漆层——烘烤——烘烤——第三底漆层——中漆层——面漆层——烘烤——烘烤，并依据实际喷涂的需要选择漆层材料以及烘烤温度、烘烤时间等，进而完成整个喷涂过程。通过喷涂过程，强化电子产品外观面的性能，来有效保护电子产品，确保其通过各种可靠性测试。
以上借助具体实施例对本发明做了进一步描述，但是应该理解的是，这里具体的描述，不应理解为对本发明的实质和范围的限定，本领域内的普通技术人员在阅读本说明书后对上述实施例做出的各种修改，都属于本发明所保护的范围。

Claims (8)

  1. 一种金属喷涂的天线结构，其特征在于：其包括壳体，所述壳体上，由内至外依次设有粗化处理层、导电层、打磨层以及喷漆层；所述壳体的外壁面上设有所述粗化处理层，所述粗化处理层上金属喷涂形成所述导电层，所述导电层与所述导电层周边的所述壳体打磨形成所述打磨层，所述打磨层上设有所述喷漆层。
  2. 一种如权利要求1所述的金属喷涂的天线结构的制备方法，其特征在于：包括以下几个步骤：
    1)将所述壳体部分区域进行遮蔽处理，露出需要金属喷涂的区域；
    2)在需要金属喷涂的区域加工相应的天线图案凹槽位；
    3)将所述天线图案凹槽位进行表面处理形成所述粗化处理层；
    4)将导电金属颗粒或粉末经金属喷涂技术喷涂在所述粗化处理层上，形成所述导电层；
    5)除去步骤1)中的遮蔽处理；
    6)利用打磨机器对所述导电层以及所述导电层周边壳体进行打磨，打磨至所述导电层与所述导电层周边壳体在同一个面，形成相应的所述打磨层；
    7)利用喷漆设备对所述打磨层进行喷漆处理，形成所述喷漆层。
  3. 根据权利要求2所述的金属喷涂的天线结构的制备方法，其特征在于：步骤2)中所述天线图案凹槽位由激光雕刻成型或注塑成型时预留相应的凹槽位或利用CNC加工出相应的凹槽位。
  4. 根据权利要求3所述的金属喷涂的天线结构的制备方法，其特征在于：所述天线图案凹槽位的深度值为0.01-0.1mm。
  5. 根据权利要求2所述的金属喷涂的天线结构的制备方法，其特征在于：步骤4)中所述导电金属颗粒的直径为2-100μm。
  6. 根据权利要求2所述的金属喷涂的天线结构的制备方法，其特征在于：步骤4)中所述导电金属颗粒或粉末喷涂一层或多层，形成的所述导电层厚度为0.02-0.5mm。
  7. 根据权利要求2所述的金属喷涂的天线结构的制备方法，其特征在于：步骤7)中所述喷漆层通过三涂三烤或五涂五烤工艺喷涂形成。
  8. 根据权利要求7所述的金属喷涂的天线结构的制备方法，其特征在于：所述喷漆层的厚度值为8-100μm。
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