WO2021025059A1 - 熱電変換素子 - Google Patents

熱電変換素子 Download PDF

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Publication number
WO2021025059A1
WO2021025059A1 PCT/JP2020/029997 JP2020029997W WO2021025059A1 WO 2021025059 A1 WO2021025059 A1 WO 2021025059A1 JP 2020029997 W JP2020029997 W JP 2020029997W WO 2021025059 A1 WO2021025059 A1 WO 2021025059A1
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WIPO (PCT)
Prior art keywords
thermoelectric conversion
electrode
conductive portion
thermal conductive
thickness direction
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Ceased
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PCT/JP2020/029997
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English (en)
French (fr)
Japanese (ja)
Inventor
健志 浅見
慶次 後藤
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Denka Co Ltd
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Denka Co Ltd
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Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Priority to EP20850286.4A priority Critical patent/EP4012788B1/en
Priority to US17/633,039 priority patent/US20220302365A1/en
Priority to JP2021537344A priority patent/JP7662521B2/ja
Priority to CN202080056123.0A priority patent/CN114207852B/zh
Publication of WO2021025059A1 publication Critical patent/WO2021025059A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details

Definitions

  • thermoelectric conversion elements This disclosure relates to thermoelectric conversion elements.
  • thermoelectric conversion element may be used to generate electricity using geothermal heat or waste heat from a factory.
  • Patent Document 1 discloses an embodiment in which a flexible substrate having a pattern layer composed of a resin layer and a metal layer is provided on both sides of a thermoelectric conversion module having a P-type thermoelectric element material and an N-type thermoelectric element material. ing.
  • the metal layer contained in one flexible substrate overlaps one electrode included in the thermoelectric conversion module, and the metal layer contained in the other flexible substrate is the other included in the thermoelectric conversion module. It overlaps the electrode.
  • a temperature difference occurs in the surface direction of the thermoelectric conversion module. As a result, an electromotive force is generated in the thermoelectric conversion module.
  • thermoelectric conversion element as described above, further improvement in thermoelectric conversion efficiency is required. Therefore, an object of one aspect of the present disclosure is to provide a thermoelectric conversion element capable of improving thermoelectric conversion efficiency.
  • thermoelectric conversion element including a first thermoelectric conversion module and a pair of sheet members sandwiching the first thermoelectric conversion module, wherein the first thermoelectric conversion module has a first main surface and a first main surface.
  • a first substrate having a second main surface located on the opposite side, a first electrode provided on the first main surface, a first n-type thermoelectric conversion layer electrically connected to the first electrode, and a first n-type thermoelectric conversion.
  • a first electrode type thermoelectric conversion layer in contact with the layer, a second electrode electrically connected to the first p type thermoelectric conversion layer, and a first electrode provided on the first main surface, a first n type thermoelectric conversion layer, A first p-type thermoelectric conversion layer and a sealing layer covering the second electrode are provided, and each of the pair of sheet members includes a first high heat conductive portion, a second high heat conductive portion, and a low heat conductive portion.
  • the electrodes, the first n-type thermoelectric conversion layer, the first p-type thermoelectric conversion layer, and the second electrode are arranged in order along the arrangement direction orthogonal to the thickness direction of the first substrate, and the first electrode has a thickness.
  • the second electrode overlaps the first high heat conductive part of each of the pair of sheet members in the direction, and the second electrode overlaps the second high heat conductive part of each of the pair of sheet members in the thickness direction, and the first n-type thermoelectric conversion.
  • the first contact portion between the layer and the first p-type thermoelectric conversion layer is a thermoelectric conversion element that overlaps each low heat conductive portion of the pair of sheet members in the thickness direction.
  • thermoelectric conversion element On the second substrate having the third main surface located on the thermoelectric conversion module side and the fourth main surface located on the opposite side of the third main surface, and the third electrode and the third electrode provided on the fourth main surface.
  • the second n-type thermoelectric conversion layer electrically connected, the second p-type thermoelectric conversion layer in contact with the second n-type thermoelectric conversion layer, the fourth electrode electrically connected to the second p-type thermoelectric conversion layer, and the fourth electrode.
  • the thermoelectric conversion element according to [1] which is provided on a main surface and includes a third electrode, a second n-type thermoelectric conversion layer, a second p-type thermoelectric conversion layer, and a second sealing layer covering the fourth electrode. ..
  • the third electrode overlaps the first high thermal conductive portion and the first electrode of each of the pair of sheet members in the thickness direction, and the fourth electrode is the pair of sheet members in the thickness direction.
  • the second high thermal conductive portion and the second electrode are overlapped with each other, and the second contact portion between the second n-type thermoelectric conversion layer and the second p-type thermoelectric conversion layer is a pair of sheet members in the thickness direction, respectively.
  • the third electrode overlaps the second high thermal conductive portion of each of the pair of sheet members and the second electrode in the thickness direction, and the fourth electrode is the pair of sheet members in the thickness direction.
  • thermoelectric conversion element according to [2] which overlaps the low thermal conductivity portion of the above.
  • thermoelectric conversion element according to any one of [2] to [4] wherein the second thermoelectric conversion module is electrically connected to the first thermoelectric conversion module.
  • thermoelectric conversion element different from the pair of seat members is further provided, and the other seat member is located on the opposite side of the first thermoelectric conversion module with the second thermoelectric conversion module sandwiched in the thickness direction.
  • the thermoelectric conversion element according to any one of [5].
  • the thermoelectric conversion element according to [8], wherein the thermal conductivity of the low thermal conductivity portion is 0.08 W / mK or less.
  • thermoelectric conversion element according to any one of [1] to [9], wherein the thermal conductivity of the first high thermal conductive portion and the second high thermal conductive portion is 5 W / mK or more.
  • the distance from the first high heat conductive portion along the alignment direction to the first contact portion is five times or more the length of the first high heat conductive portion along the thickness direction, and the first along the alignment direction. 2.
  • thermoelectric conversion element capable of improving thermoelectric conversion efficiency.
  • FIG. 1 is a schematic cross-sectional view showing a thermoelectric conversion element according to the present embodiment.
  • FIG. 2 is a diagram obtained by extracting a part of FIG. 1.
  • FIG. 3 is a schematic cross-sectional view showing a thermoelectric conversion element according to the first modification.
  • FIG. 4 is a schematic cross-sectional view showing a thermoelectric conversion element according to the second modification.
  • FIG. 5 is a schematic cross-sectional view showing the first simulation condition. 6 (a) and 6 (b) are graphs showing the results of the first simulation.
  • FIG. 7 is a schematic cross-sectional view showing the second simulation condition.
  • FIG. 8 is a graph showing the result of the second simulation.
  • FIG. 9 is a schematic cross-sectional view showing a third simulation condition.
  • FIG. 1 is a schematic cross-sectional view showing a thermoelectric conversion element according to the present embodiment.
  • FIG. 2 is a diagram obtained by extracting a part of FIG. 1.
  • FIG. 3 is a schematic cross
  • FIG. 10 is a graph showing the result of the third simulation.
  • FIG. 11A is a schematic cross-sectional view of the thermoelectric conversion element according to the first reference example
  • FIG. 11B is a schematic cross-sectional view of the thermoelectric conversion element according to the second reference example.
  • FIG. 1 is a schematic cross-sectional view showing a thermoelectric conversion element according to the present embodiment.
  • FIG. 2 is a diagram obtained by extracting a part of FIG. 1.
  • the thermoelectric conversion element 1 shown in FIG. 1 is an element capable of generating electric power by supplying heat from the outside.
  • the thermoelectric conversion element 1 is, for example, an element that converts heat into electricity by utilizing the temperature difference inside the thermoelectric conversion element 1.
  • the thermoelectric conversion element 1 is a so-called in-plane type element. Therefore, the thermoelectric conversion element 1 tends to be more excellent in workability and flexibility than, for example, a ⁇ -type element (crossplane type element).
  • thermoelectric conversion element 1 can be provided along the side surface of, for example, a cylindrical pipe used for recovering factory exhaust heat. That is, the thermoelectric conversion element 1 can be easily arranged at various locations. Therefore, the thermoelectric conversion element 1 is used, for example, as a power source for a plant sensor that utilizes exhaust heat. In addition, the contact resistance between the thermoelectric conversion material contained in the thermoelectric conversion element 1 and the electrode also tends to be lower than that of the ⁇ -type module. In the following, it is assumed that the temperature of each component of the thermoelectric conversion element 1 is measured under the natural convection condition of air.
  • the thermoelectric conversion element 1 includes thermoelectric conversion modules 2A and 2B and sheet members 3A and 3B.
  • the thermoelectric conversion modules 2A and 2B and the sheet members 3A and 3B are alternately laminated.
  • the seat member 3A, the thermoelectric conversion module 2A (first thermoelectric conversion module), the seat member 3B, and the thermoelectric conversion module 2B (second thermoelectric conversion module) are arranged in this order.
  • the thermoelectric conversion modules 2A and 2B show the same shape as each other, and the sheet members 3A and 3B show the same shape as each other. That is, the thermoelectric conversion modules 2A and 2B have the same constituent requirements as each other, and the seat members 3A and 3B have the same constituent requirements as each other.
  • thermoelectric conversion modules 2A and 2B and the sheet members 3A and 3B are laminated corresponds to the direction along the thickness of the thermoelectric conversion modules 2A and 2B and the sheet members 3A and 3B.
  • the direction along the thickness of the thermoelectric conversion modules 2A and 2B and the sheet members 3A and 3B will be simply referred to as the thickness direction D1.
  • Viewing from the thickness direction D1 corresponds to a plan view.
  • FIG. 2 shows a thermoelectric conversion module 2A and a pair of seat members 3A and 3B sandwiching the thermoelectric conversion module 2A.
  • the thermoelectric conversion element according to one aspect of the present disclosure may have the structure shown in FIG.
  • the thermoelectric conversion module 2A is a thermoelectric conversion unit in the thermoelectric conversion element 1, and is a substrate 11 (first substrate), electrodes 12, 13 (first and second electrodes), an element portion 14, and a sealing layer 15 ( It has a first sealing layer).
  • the substrate 11 is, for example, a resin sheet member exhibiting heat resistance and flexibility, and exhibits a substantially flat plate shape.
  • the resins constituting the substrate 11 include, for example, (meth) acrylic resin, (meth) acrylonitrile resin, polyamide resin, polycarbonate resin, polyether resin, polyester resin, epoxy resin, organosiloxane resin, and polyimide. It is a based resin, a polysulfone based resin, etc.
  • the thickness of the substrate 11 is, for example, 5 ⁇ m or more and 50 ⁇ m or less.
  • the thermal conductivity of the substrate 11 is, for example, 0.1 W / mK (corresponding to 0.1 watt per meter per kelvin and 0.1 W ⁇ m -1 ⁇ K -1 ) or more and 0.3 W / mK or less.
  • a temperature difference may occur inside the element unit 14.
  • the substrate 11 has a main surface 11a (first main surface) and a main surface 11b (second main surface) located on the opposite side of the main surface 11a.
  • the main surfaces 11a and 11b are surfaces that intersect with respect to the direction along the thickness of the substrate 11.
  • the shapes of the main surfaces 11a and 11b are not particularly limited, but are, for example, a polygonal shape, a circular shape, an elliptical shape, and the like.
  • the electrode 12 is a member that constitutes a terminal included in the thermoelectric conversion element 1, and is a conductor provided on the main surface 11a of the substrate 11.
  • the electrode 12 is, for example, a conductor made of metal, alloy, or conductive resin.
  • the electrode 12 is formed on the substrate 11 by, for example, various dry methods.
  • the dry method is, for example, a physical vapor deposition method (PVD method), a patterning of a metal foil or an alloy foil, and the like.
  • the electrode 12 may be formed by using a nanopaste or the like in which metal particles are dispersed.
  • the shape of the electrode 12 in a plan view is not particularly limited, and is, for example, a polygonal shape, a circular shape, an elliptical shape, or the like.
  • the thickness of the electrode 12 is, for example, 6 ⁇ m or more and 70 ⁇ m or less.
  • the thermal conductivity of the electrode 12 is, for example, 5 W / mK or more. In this case, the electrode 12 tends to be easily heated from the outside.
  • the thermal conductivity of the electrode 12 may be, for example, 30 W / mK or more.
  • the electrode 13 is a member that constitutes a terminal included in the thermoelectric conversion element 1, and is a conductor provided on the main surface 11a of the substrate 11.
  • the electrode 13 is separated from the electrode 12.
  • the electrode 13 is formed at the same time as the electrode 12. Therefore, the electrode 13 is made of the same material as the electrode 12.
  • the shape of the electrode 13 in a plan view is not particularly limited, and is, for example, a polygonal shape, a circular shape, an elliptical shape, or the like.
  • the thermal conductivity of the electrode 13 is, for example, 5 W / mK or more, similarly to the electrode 12.
  • the thermal conductivity of the electrode 13 may be, for example, 30 W / mK or more.
  • the element unit 14 is a member on which thermoelectric conversion is performed in the thermoelectric conversion element 1.
  • the shape of the element portion 14 in a plan view is not particularly limited, and is, for example, a polygonal shape, a circular shape, an elliptical shape, or the like.
  • the element unit 14 has an n-type thermoelectric conversion layer 14a and a p-type thermoelectric conversion layer 14b.
  • the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b have the same shape as each other, but the present invention is not limited to this.
  • the n-type thermoelectric conversion layer 14a is provided on the main surface 11a of the substrate 11 and is electrically connected to the electrode 12. In the present embodiment, the n-type thermoelectric conversion layer 14a is located between the electrodes 12 and 13 and is in contact with the electrodes 12. The n-type thermoelectric conversion layer 14a covers a part of the electrode 12.
  • the n-type thermoelectric conversion layer 14a is, for example, an n-type semiconductor layer.
  • the n-type thermoelectric conversion layer 14a contains, for example, a composite of an inorganic substance and an organic substance, or a composite of a plurality of organic substances.
  • the inorganic substance examples include titanium sulfide (TiS 2 ), bismuth tellurium (Bi 2 Te 3 ), scutterdite, nickel (Ni) and the like.
  • Organic substances include, for example, n-type single-walled carbon nanotubes (SWCNTs), tetrathiafulvalene-tetracyanoquinodimethane (TTF-TCNQ), and the like.
  • the n-type thermoelectric conversion layer 14a is formed by, for example, various dry methods or wet methods.
  • the wet method is, for example, a doctor blade method, a dip coating method, a spray coating method, a spin coating method, an inkjet method, or the like.
  • the thickness of the n-type thermoelectric conversion layer 14a is, for example, 9 ⁇ m or more and 200 ⁇ m or less.
  • the thermal conductivity of the n-type thermoelectric conversion layer 14a is, for example, 0.01 W / mK or more and 0.5 W / mK or less. In this case, a temperature gradient can be easily formed inside the n-type thermoelectric conversion layer 14a.
  • the thickness of the n-type thermoelectric conversion layer 14a corresponds to the thickness of the portion that does not overlap with the electrode 12 in the thickness direction D1.
  • the p-type thermoelectric conversion layer 14b is provided on the main surface 11a of the substrate 11 and is in contact with the n-type thermoelectric conversion layer 14a.
  • the p-type thermoelectric conversion layer 14b is located between the electrodes 12 and 13, and is located on the opposite side of the electrode 12 with the n-type thermoelectric conversion layer 14a interposed therebetween.
  • the p-type thermoelectric conversion layer 14b covers a part of the electrode 13 and is in contact with the part.
  • the p-type thermoelectric conversion layer 14b is, for example, a p-type semiconductor layer.
  • the p-type thermoelectric conversion layer 14b contains, for example, carbon nanotubes and a conductive polymer different from carbon nanotubes.
  • the carbon nanotubes are, for example, p-type SWCNTs and the like.
  • the conductive polymer is, for example, poly (3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonic acid (PSS), or the like.
  • PEDOT poly (3,4-ethylenedioxythiophene)
  • PSS polystyrene sulfonic acid
  • the carbon nanotubes and the conductive polymer may be aggregated.
  • the p-type thermoelectric conversion layer 14b may include a porous structure in which carbon nanotubes are bonded to each other by a conductive polymer.
  • the p-type thermoelectric conversion layer 14b is formed by, for example, various dry methods or wet methods, similarly to the n-type thermoelectric conversion layer 14a.
  • the thickness of the p-type thermoelectric conversion layer 14b is, for example, 9 ⁇ m or more and 200 ⁇ m or less.
  • the thermal conductivity of the p-type thermoelectric conversion layer 14b is, for example, 0.01 W / mK or more and 0.5 W / mK or less. In this case, a temperature gradient can be easily formed inside the p-type thermoelectric conversion layer 14b.
  • the thickness of the p-type thermoelectric conversion layer 14b corresponds to the thickness of the portion that does not overlap with the electrode 13 in the thickness direction D1.
  • the sealing layer 15 is a resin layer that protects the electrodes 12 and 13, the n-type thermoelectric conversion layer 14a, and the p-type thermoelectric conversion layer 14b.
  • the sealing layer 15 is provided on the main surface 11a and covers the electrodes 12 and 13, the n-type thermoelectric conversion layer 14a, and the p-type thermoelectric conversion layer 14b.
  • the resin constituting the sealing layer 15 is, for example, a (meth) acrylic resin, a (meth) acrylonitrile resin, a polyamide resin, a polycarbonate resin, a polyether resin, a polyester resin, an epoxy resin, or an organosiloxane resin. , Polygon-based resin, polysulfone-based resin, etc.
  • the thickness of the sealing layer 15 is, for example, 50 ⁇ m or more and 200 ⁇ m or less, which is smaller than the intervals S1 and S2 described later.
  • the thermal conductivity of the sealing layer 15 is, for example, 0.1 W / mK or more and 0.5 W / mK or less.
  • the electrodes 12, the n-type thermoelectric conversion layer 14a, the p-type thermoelectric conversion layer 14b, and the electrodes 13 are arranged in order along the alignment direction D2 orthogonal to the thickness direction D1. Therefore, the electrode 12 is located on one end side of the thermoelectric conversion element 1 in the alignment direction D2, and the electrode 13 is located on the other end side of the thermoelectric conversion element 1 in the alignment direction D2.
  • thermoelectric conversion element 1 when the thermoelectric conversion element 1 is heated from the substrate 11 side, the portion of the n-type thermoelectric conversion layer 14a that contacts the electrode 12 The temperature tends to be the highest, and in the p-type thermoelectric conversion layer 14b, the temperature of the portion in contact with the electrode 13 tends to be the highest.
  • the temperature of the contact portion CP between the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b tends to be the lowest. Therefore, in each of the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b, a temperature gradient can be generated along the alignment direction D2.
  • the contact portion CP extends along a direction intersecting both the thickness direction D1 and the alignment direction D2, for example.
  • the contact portion CP may have a linear shape, a wavy line shape, or an arc shape.
  • the length of the n-type thermoelectric conversion layer 14a along the alignment direction D2 is longer than the length of the sealing layer 15 along the thickness direction D1.
  • the length of the n-type thermoelectric conversion layer 14a along the alignment direction D2 is, for example, 5 times or more, or 10 times or more, the length of the sealing layer 15 along the thickness direction D1.
  • the thermal conductivity of the sealing layer 15 is, for example, 0.1 W / mK or more and 0.5 W / mK or less. Therefore, for example, the heat conducted from the electrode 12 to the sealing layer 15 is more likely to reach the upper surface 15a of the sealing layer 15 than the contact portion CP. In other words, the contact portion CP is less likely to transfer heat via the sealing layer 15. Rather, the heat of the contact portion CP tends to be released to the outside through the sealing layer 15.
  • the thermoelectric conversion module 2B is a thermoelectric conversion unit in the thermoelectric conversion element 1 like the thermoelectric conversion module 2A. As described above, since the thermoelectric conversion modules 2A and 2B have the same constituent requirements as each other, the thermoelectric conversion module 2B also has the substrate 11 (second substrate), the electrode 12 (third electrode), and the electrode 13 ( It has a fourth electrode), an element portion 14, and a sealing layer 15 (second sealing layer).
  • the sealing layer 15 constitutes the outermost surface located on the main surface 11a (on the fourth main surface) of the substrate 11. In the present embodiment, the outermost layer is composed of only the sealing layer 15.
  • thermoelectric conversion modules 2A and 2B the electrodes 12 overlap each other in the thickness direction D1, the electrodes 13 overlap each other in the thickness direction D1, and the n-type thermoelectric conversion layers 14a overlap each other in the thickness direction D1.
  • the p-type thermoelectric conversion layers 14b are overlapped with each other in the thickness direction D1.
  • the thermoelectric conversion module 2A is electrically connected to the thermoelectric conversion module 2B, but the present invention is not limited to this.
  • the thermoelectric conversion modules 2A and 2B may be connected in series or in parallel.
  • the sheet member 3A is a member arranged between the thermoelectric conversion module 2A and the heat source, and is provided on the main surface 11b of the substrate 11. Therefore, the heat generated from the heat source is conducted to the thermoelectric conversion module 2A via the sheet member 3A.
  • the sheet member 3A has a first high thermal conductive portion 21, a second high thermal conductive portion 22, and a low thermal conductive portion 23.
  • the first high thermal conductive portion 21 and the second high thermal conductive portion 22 are portions that exhibit higher thermal conductivity than the low thermal conductive portion 23, and are separated from each other.
  • the first high thermal conductive portion 21 overlaps the electrode 12 in the thickness direction D1
  • the second high thermal conductive portion 22 overlaps the electrode 13 in the thickness direction D1.
  • the shapes of the first high thermal conductive portion 21 and the second high thermal conductive portion 22 in a plan view are not particularly limited, and are, for example, a polygonal shape, a circular shape, an elliptical shape, and the like. In a plan view, the shape of the first high thermal conductive portion 21 and the shape of the electrode 12 may be the same as each other or may be different from each other.
  • the shape of the second high thermal conductive portion 22 and the shape of the electrode 13 may be the same as each other or may be different from each other.
  • Each of the first high thermal conductive portion 21 and the second high thermal conductive portion 22 contains, for example, metal (silver, copper, aluminum, etc.), carbon, and the like.
  • Each of the first high thermal conductive portion 21 and the second high thermal conductive portion 22 may contain ceramics such as boron nitride and aluminum nitride that exhibit high thermal conductivity.
  • the thermal conductivity of each of the first high thermal conductive portion 21 and the second high thermal conductive portion 22 is, for example, 5 W / mK or more and 400 W / mK or less.
  • the electrode 12 may be located inside the edge of the first high thermal conductive portion 21 in a plan view, or the edge of the electrode 12. And the edge of the first high thermal conductive portion 21 may completely overlap.
  • the electrode 13 may be located inside the edge of the second high thermal conductive portion 22, or the edge of the electrode 13 and the edge of the second high thermal conductive portion 22 completely overlap each other. May be good.
  • the first high thermal conductive portion 21 may be located on one end side in the alignment direction D2 with respect to the electrode 12.
  • the edge on the one end side of the first high thermal conductive portion 21 may be located outside the edge on the one end side of the electrode 12.
  • the second high thermal conductive portion 22 may be located on the other end side in the alignment direction D2 with respect to the electrode 13.
  • the length T1 of the first high thermal conductive portion 21 along the thickness direction D1 is, for example, 50 ⁇ m or more and 500 ⁇ m or less.
  • the distance S1 from the first high thermal conductive portion 21 (contact portion between the first high thermal conductive portion 21 and the low thermal conductive portion 23) to the contact portion CP along the alignment direction D2 is, for example, the first high thermal conductive portion.
  • the length of 21 is 5 times or more or 10 times or more of T1. In this case, the temperature gradient inside the n-type thermoelectric conversion layer 14a along the alignment direction D2 can be satisfactorily generated.
  • the length T2 of the second high thermal conductive portion 22 along the thickness direction D1 is, for example, 50 ⁇ m or more and 500 ⁇ m or less.
  • the distance S2 from the second high thermal conductive portion 22 (the contact portion between the second high thermal conductive portion 22 and the low thermal conductive portion 23) along the alignment direction D2 to the contact portion CP is, for example, the second high thermal conductive portion. It is 5 times or more or 10 times or more the length T2 of 22. In this case, the temperature gradient inside the p-type thermoelectric conversion layer 14b along the alignment direction D2 can be satisfactorily generated.
  • the interval S1 may be 5 times or more, 10 times or more, or 20 times or less the length T1.
  • the interval S2 may be 5 times or more, 10 times or more, or 20 times or less the length T2.
  • the interval S1 is preferably 5 times or more, more preferably 10 times or more the length T1.
  • the low thermal conductive portion 23 is a portion that exhibits a lower thermal conductivity than the first high thermal conductive portion 21 and the second high thermal conductive portion 22, and is the main portion of the sheet member 3.
  • the low thermal conductive portion 23 overlaps at least the contact portion CP in the thickness direction D1 and covers most of the main surface 11b.
  • the low thermal conductive portion 23 overlaps most of the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b in addition to the contact portion CP in the thickness direction D1.
  • the low thermal conductive portion 23 fills the gap between the first high thermal conductive portion 21 and the second high thermal conductive portion 22 in the arrangement direction D2.
  • the low thermal conductive portion 23 includes, for example, cellulose nanofiber (CNF), silica airgel, and the like.
  • the low thermal conductive portion 23 may be a foam.
  • the thermal conductivity of the low thermal conductivity section 23 is significantly lower than the thermal conductivity of the first high thermal conductivity section 21 and the second high thermal conductivity section 22, for example, 0.01 W / mK or more and 0.2 W / mK or less.
  • the thermal conductivity of the low thermal conductivity portion 23 may be 0.08 W / mK or less.
  • the sheet member 3A is formed directly on, for example, the main surface 11b.
  • each of the first high thermal conductive portion 21, the second high thermal conductive portion 22, and the low thermal conductive portion 23 is formed by various dry methods or wet methods.
  • the sheet member 3A may be attached to the main surface 11b with an adhesive (not shown).
  • Adhesives include, for example, (meth) acrylic resin, (meth) acrylonitrile resin, polyamide resin, polycarbonate resin, polyether resin, polyester resin, epoxy resin, organosiloxane resin, polyimide resin, polysulfone. It is a based resin or the like.
  • the thermal conductivity of the adhesive is, for example, about the same as the thermal conductivity of the substrate 11.
  • the sheet member 3B is a member arranged between the thermoelectric conversion modules 2A and 2B in the thickness direction D1.
  • the sheet member 3B is provided on the sealing layer 15 of the thermoelectric conversion module 2A and on the main surface 11b (on the third main surface) of the substrate 11 of the thermoelectric conversion module 2B.
  • the sheet member 3B is formed directly on, for example, the main surface 11b of the substrate 11 of the thermoelectric conversion module 2B.
  • the sheet member 3B is attached to the sealing layer 15 of the thermoelectric conversion module 2A with an adhesive (not shown).
  • the sheet member 3B is attached to both the thermoelectric conversion modules 2A and 2B by an adhesive (not shown).
  • the sheet member 3B also has a first high thermal conductive portion 21, a second high thermal conductive portion 22, and a low thermal conductive portion 23.
  • the first high thermal conductive portion 21 of the sheet member 3B is located between the electrodes 12 of the thermoelectric conversion modules 2A and 2B in the thickness direction D1
  • the second high thermal conductive portion 22 of the sheet member 3B is thermoelectric in the thickness direction D1. It is located between the electrodes 13 of the conversion modules 2A and 2B.
  • the low thermal conductive portion 23 of the sheet member 3B is located at least between the contact portions CP of the element portions 14 of the thermoelectric conversion modules 2A and 2B in the thickness direction D1. Therefore, when the sheet member 3A is heated, heat transfer from the element portion 14 of the thermoelectric conversion module 2A to the element portion 14 of the thermoelectric conversion module 2B is satisfactorily suppressed by the low thermal conductive portion 23 of the sheet member 3B.
  • thermoelectric conversion element 1 the electrodes 12 of the thermoelectric conversion modules 2A and 2B overlap with the first high thermal conductive portions 21 of the sheet members 3A and 3B in the thickness direction D1.
  • the electrodes 13 of 2A and 2B overlap with the second high heat conductive portion 22 of the sheet members 3A and 3B in the thickness direction D1.
  • Contact portion CP first contact portion between the n-type thermoelectric conversion layer 14a (first n-type thermoelectric conversion layer) and p-type thermoelectric conversion layer 14b (first p-type thermoelectric conversion layer) in the thermoelectric conversion module 2A, and thermoelectric conversion.
  • the contact portion CP (second contact portion) between the n-type thermoelectric conversion layer 14a (second n-type thermoelectric conversion layer) and the p-type thermoelectric conversion layer 14b (second p-type thermoelectric conversion layer) in the module 2B is in the thickness direction D1. It overlaps the low heat conductive portion 23 of the sheet members 3A and 3B.
  • thermoelectric conversion element 1 may further include a configuration other than the above.
  • the thermoelectric conversion element 1 includes wiring for electrically connecting the thermoelectric conversion modules 2A and 2B, wiring for electrically connecting other thermoelectric conversion elements, wiring for extracting electric power to an external circuit, and the like. You may prepare.
  • the electrode 12 overlaps the first high heat conductive portion 21 in the thickness direction D1, and the electrode 13 has the second high heat in the thickness direction D1. It overlaps the conductive portion 22, and the contact portion CP between the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b overlaps the low thermal conductive portion 23 in the thickness direction D1.
  • the temperature of the contact portion CP tends to be the lowest in the n-type thermoelectric conversion layer 14a, and the temperature of the portion closest to the electrode 12 becomes the highest. There is a tendency.
  • the temperature of the contact portion CP tends to be the lowest, and the temperature of the portion closest to the electrode 13 tends to be the highest.
  • the temperature gradient of the n-type thermoelectric conversion layer 14a in the alignment direction D2 and the alignment direction D2 Both with the temperature gradient of the p-type thermoelectric conversion layer 14b in the above tend to be large.
  • thermoelectric conversion element 1 rather than keeping one electrode side in a high temperature state and the other electrode side in a low temperature state in the alignment direction D2, the temperature difference between both ends of the n-type thermoelectric conversion layer 14a in the alignment direction D2 and p in the alignment direction. Both the temperature difference between both ends of the type thermoelectric conversion layer 14b tends to widen. Therefore, according to the thermoelectric conversion element 1 according to the present embodiment, it is possible to improve the thermoelectric conversion efficiency.
  • the electrode 12 overlaps the first high heat conductive portion 21 of the sheet members 3A and 3B in the thickness direction D1, and the electrode 13 is the thickness direction D1.
  • the contact portion CP overlaps the second high heat conductive portion 22 of the sheet members 3A and 3B, and the contact portion CP overlaps the low heat conductive portion 23 of the sheet members 3A and 3B in the thickness direction D1.
  • the temperature of the contact portion CP tends to be the lowest, and the temperature of the portion closest to the electrode 12 tends to be the highest.
  • thermoelectric conversion element 1 In the p-type thermoelectric conversion layer 14b, the temperature of the contact portion CP tends to be the lowest, and the temperature of the portion closest to the electrode 13 tends to be the highest. As a result, the temperature gradient in the element portion 14 tends to widen in each of the thermoelectric conversion modules 2A and 2B stacked along the thickness direction D1. Therefore, according to the thermoelectric conversion element 1 according to the present embodiment, it is possible to further improve the thermoelectric conversion efficiency of the thermoelectric conversion element 1 and to reduce the size in a plan view.
  • thermoelectric conversion module 2A may be electrically connected to the thermoelectric conversion module 2B. In this case, the electromotive force or current capacity of the thermoelectric conversion element 1 can be increased.
  • the sealing layer 15 of the thermoelectric conversion module 2B constitutes the outermost surface located on the main surface 11a. In this case, the temperature gradient of the element unit 14 in the thermoelectric conversion module 2B tends to be maintained.
  • the thermal conductivity of the low thermal conductivity portion 23 may be 0.2 W / mK or less. In this case, the temperature difference between both ends of the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b in the arrangement direction D2 can be satisfactorily widened. When the thermal conductivity of the low thermal conductivity portion 23 is 0.08 W / mK or less, the temperature difference can be expanded more satisfactorily.
  • the thermal conductivity of the first high thermal conductive portion 21 and the second high thermal conductive portion 22 may be 5 W / mK or more. In this case, the temperature difference between both ends of the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b in the arrangement direction D2 can be satisfactorily widened.
  • the thermal conductivity of the electrodes 12 and 13 may be 5 W / mK or more. In this case, the temperature difference between both ends of the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b in the arrangement direction D2 can be satisfactorily widened.
  • the substrate 11 exhibits flexibility. Therefore, the thermoelectric conversion element 1 can exhibit flexibility. Therefore, for example, the thermoelectric conversion element 1 can be easily provided along the surface of the cylindrical pipe. That is, the restriction on the mounting location of the thermoelectric conversion element 1 can be relaxed.
  • the distance S1 from the first high heat conductive portion 21 along the alignment direction D2 to the contact portion CP is 5 times or more or 10 times the length T1 of the first high heat conductive portion 21 along the thickness direction D1.
  • the distance S2 from the second high heat conductive portion 22 along the alignment direction D2 to the contact portion CP is 5 times or more or 10 times the length T2 of the second high heat conductive portion 22 along the thickness direction D1. More than double. Therefore, the temperature difference between both ends of the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b in the arrangement direction D2 can be satisfactorily widened.
  • FIG. 3 is a schematic cross-sectional view of the thermoelectric conversion element according to the first modification.
  • the thermoelectric conversion element 1A according to the first modification includes a sheet member 3C different from the sheet members 3A and 3B in addition to the configuration of the thermoelectric conversion element 1.
  • the sheet member 3C is located on the opposite side of the thermoelectric conversion module 2A with the thermoelectric conversion module 2B interposed therebetween in the thickness direction D1. Therefore, the thermoelectric conversion module 2B is sandwiched between the sheet members 3B and 3C in the thickness direction D1.
  • the sheet member 3C is configured as a part of the outermost layer in the thermoelectric conversion element 1A.
  • the seat member 3C has the same configuration requirements as the seat members 3A and 3B. That is, the sheet member 3C includes a first high thermal conductive portion 21, a second high thermal conductive portion 22, and a low thermal conductive portion 23.
  • the first high thermal conductive portion 21 of the sheet member 3C overlaps the electrodes 12 of the thermoelectric conversion modules 2A and 2B and the first high thermal conductive portion 21 of the sheet members 3A and 3B in the thickness direction D1.
  • the second high thermal conductive portion 22 of the sheet member 3C overlaps the electrodes 13 of the thermoelectric conversion modules 2A and 2B and the second high thermal conductive portion 22 of the sheet members 3A and 3B in the thickness direction D1.
  • FIG. 4 is a schematic cross-sectional view of the thermoelectric conversion element according to the second modification.
  • the thermoelectric conversion element 1B according to the second modification includes thermoelectric conversion modules 2C to 2E and sheet members 3D to 3F.
  • the thermoelectric conversion modules 2C to 2E are electrically connected to each other, but the present invention is not limited to this.
  • thermoelectric conversion modules 2C to 2E has a substrate 11, a plurality of element portions 14, a sealing layer 15, and a plurality of electrodes 16.
  • the element portions 14 and the electrodes 16 provided on the substrate 11 and covered with the sealing layer 15 are alternately arranged in the alignment direction D2. Therefore, a part of the plurality of electrodes 16 is in contact with both the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b.
  • the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b are alternately laminated along the thickness direction D1.
  • the electrodes 16 that come into contact with only the n-type thermoelectric conversion layer 14a and the electrodes 16 that come into contact with only the p-type thermoelectric conversion layer 14b are alternately laminated along the thickness direction D1.
  • the electrode 16 is a conductor corresponding to the electrode 12 or the electrode 13 in the above embodiment.
  • the seat member 3D is located on one side of the thermoelectric conversion module 2C in the thickness direction D1.
  • the sheet member 3E is located on the other side of the thermoelectric conversion module 2C (and one side of the thermoelectric conversion module 2D) in the thickness direction D1 and is located between the thermoelectric conversion modules 2C and 2D.
  • the sheet member 3F is located on the other side of the thermoelectric conversion module 2D (and one side of the thermoelectric conversion module 2E) in the thickness direction D1 and is located between the thermoelectric conversion modules 2D and 2E.
  • the sheet members 3D to 3F include a low thermal conductive portion 23 and a high thermal conductive portion 24.
  • the high thermal conductive portion 24 is a portion that overlaps the electrode 16 in the thickness direction D1.
  • the high thermal conductive portion 24 corresponds to the first high thermal conductive portion 21 or the second high thermal conductive portion 22 in the above embodiment.
  • the electrode 16 may be located inside the edge of the high heat conductive portion 24 in a plan view, or the edge of the electrode 16 and the high heat conductive portion. The edges of the 24 may completely overlap. From the viewpoint of widening the temperature gradient along the arrangement direction D2 inside each element portion 14, the high thermal conductive portion 24 comes into contact with both the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b in a plan view. It may be located inside the edge of the electrode 16.
  • thermoelectric conversion element results of simulating the temperature change inside the element when the position or characteristics of the constituent requirements included in the thermoelectric conversion element are changed.
  • a two-dimensional model is set.
  • an EXCEL model in which the basic differential equation of two-dimensional heat conduction was applied to the difference was used.
  • the finite volume method was applied as a method of differentiation.
  • FIG. 5 is a schematic cross-sectional view showing the first simulation condition.
  • the model 30 in the first simulation includes high heat conductive parts 31 and 32 and low heat conductive parts 33, similarly to the sheet member 3 of the above embodiment.
  • the high thermal conductive portion 31 is exposed on one side in the thickness direction D1 and is located at one end of the model 30 in the alignment direction D2.
  • the high thermal conductive portion 32 is exposed on the other side in the thickness direction D1 and is located on the other end of the model 30 in the alignment direction D2.
  • the dimensions of the high thermal conductive portions 31 and 32 along the thickness direction D1 are set to be the same.
  • the low thermal conductive portion 33 has a sheet shape with a thickness of 1 mm, and is set to be integrated with the high thermal conductive portions 31 and 32.
  • the thermal conductivity of the high thermal conductive portions 31 and 32 was set to 398 W / mK, and the thermal conductivity of the low thermal conductive portion 33 was set to 0.3 W / mK.
  • the distance between the high thermal conductive portions 31 and 32 along the alignment direction D2 is defined as the interval X (mm), and the interval between the high thermal conductive portions 31 and 32 along the thickness direction D1 is defined as the interval Y (mm). Interval Y is less than 1).
  • the interval X is 0 mm
  • the central edge 31a of the high thermal conductive portion 31 in the alignment direction D2 overlaps the central edge 32a of the high thermal conductive portion 32 in the alignment direction D2 in the thickness direction D1.
  • the central edge 31b of the high thermal conductive portion 31 in the thickness direction D1 overlaps the central edge 32b of the high thermal conductive portion 32 in the thickness direction D1 in the alignment direction D2.
  • the temperature evaluation point 34 is located on the central edge 31a of the high thermal conductive portion 31 in the thickness direction D1 and is located at the center of the interval Y. Therefore, when the interval Y is 0 mm, the temperature evaluation point 34 overlaps the intersection of the edges 31a and 31b.
  • the temperature evaluation point 35 is located on the central edge 32a of the high thermal conductive portion 32 in the thickness direction D1 and is located at the center of the interval Y. Therefore, when the interval Y is 0 mm, the temperature evaluation point 35 overlaps the intersection of the edges 32a and 32b.
  • one side of the model 30 is set as the heat source side, and the other side of the model 30 is set as the air side.
  • the temperature on the heat source side is set to 70 ° C
  • the temperature on the air side is set to room temperature (23 ° C).
  • the surface 30b of the model 30 located on the heat source side in the thickness direction D1 is heated by natural convection
  • the surface 30a of the model 30 located on the air side in the thickness direction D1 is natural convection. It shall be cooled by.
  • FIG. 6A is a graph showing the change in the temperature difference between the temperature evaluation points 34 and 35 when the interval X is changed.
  • the horizontal axis represents the interval X
  • the vertical axis represents the temperature difference between the temperature evaluation points 34 and 35.
  • Plot 41 shows the simulation result when the interval Y is 0 mm
  • plot 42 shows the simulation result when the interval Y is 0.1 mm
  • plot 43 shows the simulation result when the interval Y is 0.2 mm.
  • plot 44 shows the simulation result when the interval Y is 0.3 mm
  • plot 45 shows the simulation result when the interval Y is 0.4 mm
  • plot 46 shows the simulation result when the interval Y is 0.5 mm.
  • the simulation result of is shown.
  • the temperature difference between the temperature evaluation points 34 and 35 increases as the interval X increases, regardless of the numerical value of the interval Y.
  • the temperature difference is unlikely to be large even if the interval X is widened.
  • the temperature difference hardly changes even if the interval X is widened, regardless of the numerical value of the interval Y. From this, for example, in the sheet member 3 of the above embodiment, when the distance between the first high thermal conductive portion 21 and the second high thermal conductive portion 22 in the alignment direction D2 is 2 mm or more, the first high thermal conduction in the thickness direction D1 It was suggested that it is not necessary to consider the distance between the portion 21 and the second high heat conductive portion 22.
  • FIG. 6B is a graph showing the change in the temperature difference between the temperature evaluation points 34 and 35 when the interval Y is changed.
  • the horizontal axis represents the interval Y
  • the vertical axis represents the temperature difference between the temperature evaluation points 34 and 35.
  • Plot 47 shows the simulation result when the interval X is 0 mm
  • plot 48 shows the simulation result when the interval X is 10 mm.
  • the shorter the interval Y the larger the temperature difference between the temperature evaluation points 34 and 35, regardless of the numerical value of the interval X. From this, it was suggested that, for example, in the model 30, the shorter the interval Y between the high thermal conductive portions 31 and 32 in the thickness direction D1, the larger the temperature difference.
  • FIG. 7 is a schematic cross-sectional view showing the second simulation condition.
  • the model 50 in the second simulation includes high thermal conductive portions 51 and 52 and low thermal conductive portions 53, similarly to the model 30.
  • the positions where the high thermal conductive portions 51 and 52 and the low thermal conductive portions 53 are provided, and their thermal conductivity are the same as those in the model 30.
  • the distance between the high thermal conductive portions 51 and 52 along the alignment direction D2 was set to 2 mm.
  • the length of the high thermal conductive portion 51 along the thickness direction D1 was set to Z mm, and the length of the high thermal conductive portion 52 along the thickness direction D1 was set to 1-Z mm.
  • the ambient temperature conditions of the model 50 are the same as in the first simulation.
  • the temperature evaluation point 54 is located at the intersection of the central edge 51a of the high thermal conductive portion 51 along the alignment direction D2 and the central edge 51b of the high thermal conductive portion 51 along the thickness direction D1.
  • the temperature evaluation point 55 is located at the intersection of the central edge 52a of the high thermal conductive portion 52 along the alignment direction D2 and the central edge 52b of the high thermal conductive portion 52 along the thickness direction D1.
  • FIG. 8 is a graph showing the second simulation result, and shows the change in the temperature difference between the temperature evaluation points 54 and 55 when the length of the high thermal conductive portion 51 along the thickness direction D1 is changed.
  • the horizontal axis represents the length Z
  • the vertical axis represents the temperature difference between the temperature evaluation points 54 and 55.
  • the larger the length of the high heat conductive portion 51 located on the heat source side in the thickness direction D1 along the thickness direction D1 the larger the temperature difference. From this result, it is suggested that it is effective to increase the thickness of the high heat conductive portion located on the heat source side as much as possible in order to widen the temperature difference of the temperature evaluation points 54 and 55 along the alignment direction D2 in the model 50. It was.
  • FIG. 9 is a schematic cross-sectional view showing a third simulation condition.
  • the model used in the third simulation has a structure in which the temperature difference is estimated to occur most in the alignment direction D2 based on the results of the first and second simulations.
  • the model 60 in the third simulation includes a high thermal conductive portion 61 and a low thermal conductive portion 62.
  • the high thermal conductive portion 61 and the low thermal conductive portion 62 are arranged in order along the alignment direction D2 and are integrated with each other.
  • the dimension of the high thermal conductive portion 61 and the low thermal conductive portion 62 along the thickness direction D1 is 1 mm.
  • the thermal conductivity of the high thermal conductivity section 61 is set to 398 W / mK.
  • one side of the model 60 is set as the heat source side, and the other side of the model 60 is set as the air side.
  • the temperature on the heat source side is set to 100 ° C.
  • the air side has the same conditions as the first simulation.
  • a temperature evaluation point 63 located on the surface 60a of the model 60 is set in the model 60.
  • the temperature evaluation point 63 is located on the low thermal conductive portion 62, which is 2 mm away from the contact portion 64 between the high thermal conductive portion 61 and the low thermal conductive portion 62 along the alignment direction D2. Therefore, the temperature of the temperature evaluation point 63 indicates the temperature of the surface 60a when the model 60 is heated (more specifically, the temperature of the surface 60a composed of the low thermal conductive portion 62).
  • FIG. 10 is a graph showing the third simulation result, and shows the temperature change of the temperature evaluation point 63 when the thermal conductivity of the low thermal conductivity portion 62 is changed.
  • the horizontal axis represents the thermal conductivity of the low thermal conductivity portion 62
  • the vertical axis represents the temperature of the temperature evaluation point 63.
  • the thermal conductivity of the low thermal conductivity portion 62 was 0.2 W / mK
  • the temperature difference between the heat source and the temperature evaluation point 63 was about 8 ° C.
  • the thermal conductivity of the low thermal conductivity portion 62 was 0.08 W / mK
  • the temperature difference between the heat source and the temperature evaluation point 63 was about 15 ° C.
  • the thermal conductivity of the low thermal conductivity portion 62 is 30 W / mK or more
  • the temperature difference between the heat source and the temperature evaluation point 63 is almost zero. From this, for example, when the thermal conductivity of the low thermal conductive portion 23 included in the sheet member 3 is 0.2 W / mK or less, the low thermal conductive portion 23 tends to show good heat insulating properties, and low heat. It was suggested that when the thermal conductivity of the conductive portion 23 is 0.08 W / mK or less, the low thermal conductive portion 23 tends to show better heat insulating properties.
  • FIG. 11A is a schematic cross-sectional view of the thermoelectric conversion element according to the first reference example
  • FIG. 11B is a schematic cross-sectional view of the thermoelectric conversion element according to the second reference example.
  • the thermoelectric conversion element 101 shown in FIG. 11A includes a thermoelectric conversion module 2A and sheet members 3A-1, 103-1.
  • the sheet member 3A-1 is a member having the same shape as the sheet member 3, and includes a first high thermal conductive portion 21-1, a second high thermal conductive portion 22-1, and a low thermal conductive portion 23-1.
  • the thicknesses (lengths along the thickness direction D1) of the sheet members 3A and 3A-1 may be different from each other.
  • the sheet member 103-1 includes a high thermal conductive portion 110-1 and a low thermal conductive portion 120-1 provided on the sealing layer 15 of the thermoelectric conversion module 2A.
  • the high thermal conductive portion 110-1 is provided for improving the heat dissipation of the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b, and overlaps the contact portion CP in the thickness direction D1.
  • the center of the high thermal conductive portion 110-1 in the alignment direction D2 overlaps the contact portion CP in the thickness direction D1.
  • the low thermal conductive portion 120-1 is a sheet member provided with electrodes 12 and 13 and their surroundings in order to reduce heat dissipation.
  • the low thermal conductive portion 120-1 surrounds the high thermal conductive portion 110-1 in the direction orthogonal to the thickness direction D1, and the electrodes 12, 13, the first high thermal conductive portion 21-1, and the second in the thickness direction D1. It overlaps the high thermal conductivity section 22-1.
  • the lengths of the high thermal conductive portion 110-1 and the low thermal conductive portion 120-1 along the thickness direction D1 are the same.
  • the thermoelectric conversion element 201 shown in FIG. 11B includes thermoelectric conversion modules 2A and 202 and sheet members 3A-2, 3B-2 and 103-2.
  • the sheet member 3A-2, the thermoelectric conversion module 2A, the sheet member 103-2, the thermoelectric conversion module 202, and the sheet member 3B-2 are laminated in this order.
  • the sheet members 3A-2 and 3B-2 are members having the same shape as the sheet members 3A and 3A-1, and are the first high thermal conductive portion 21-2, the second high thermal conductive portion 22-2, and the low thermal conductive portion. It is equipped with 23-2. That is, the sheet members 3A-2 and 3B-2 have the same shape or substantially the same shape as each other.
  • the thickness of the sheet members 3A-2 and 3B-2 (the length along the thickness direction D1) and the thickness of the sheet members 3A and 3A-1 (the length along the thickness direction D1) are mutually exclusive. It may be different.
  • the sheet member 103-2 is a member having the same shape as the sheet member 103-1 and includes a high thermal conductive portion 110-2 and a low thermal conductive portion 120-2.
  • the thicknesses (lengths along the thickness direction D1) of the sheet members 103-1 and 103-2 may be different from each other.
  • the thermoelectric conversion module 202 includes a substrate 11, an electrode 212, an n-type thermoelectric conversion layer 14a, a p-type thermoelectric conversion layer 14b, and a sealing layer 15.
  • the electrode 212 overlaps the contact portion CP of the thermoelectric conversion module 2A and the high thermal conductive portion 110-2 of the sheet member 103-2 in the thickness direction D1. Therefore, when the thermoelectric conversion element 201 is heated from the sheet member 3A-2 side in the thickness direction D1, the electrode 212 mainly passes through the element portion 14 of the thermoelectric conversion module 2A and the high thermal conduction portion 110-2. It is heated by the heat transmitted through it.
  • an n-type thermoelectric conversion layer 14a is provided on one end side of the electrode 212, and a p-type thermoelectric conversion layer 14b is provided on the other end side of the electrode 212.
  • the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b are separated from each other.
  • the length of the substrate 11 along the thickness direction D1 is set to 50 ⁇ m, and the lengths of the sheet members 3A and 3B along the thickness direction D1 are set to 300 ⁇ m.
  • the length of the sheet members 3A-1, 103-1 along the thickness direction D1 is set to 400 ⁇ m, and the lengths of the sheet members 3A-2, 3B-2, 103-2 along the thickness direction D1 are set.
  • the size was set to 200 ⁇ m.
  • the lengths of the electrodes 12, 13, 212 along the thickness direction D1 are set to 25 ⁇ m, and the lengths of the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b along the thickness direction D1 are set to 100 ⁇ m.
  • the maximum length of the sealing layer 15 along the thickness direction D1 is set to 150 ⁇ m, and the lengths of the first high heat conductive portion 21, the second high heat conductive portion 22, and the low heat conductive portion 23 along the thickness direction D1. Is set to 300 ⁇ m, and the lengths of the first high heat conductive portion 21-1, the second high thermal conductive portion 22-1 and the low thermal conductive portion 23-1 along the thickness direction D1 are set to 400 ⁇ m, and the length is set to 400 ⁇ m.
  • the lengths of the first high heat conductive portion 21-2, the second high heat conductive portion 22-2, and the low heat conductive portion 23-2 were set to 200 ⁇ m. Further, the lengths of the high thermal conductive portion 110-1 and the low thermal conductive portion 120-1 along the thickness direction D1 are set to 400 ⁇ m, and the high thermal conductive portion 110-2 and the low thermal conductive portion 120 along the thickness direction D1 are set. The length of -2 was set to 300 ⁇ m.
  • the length of the thermoelectric conversion modules 2A, 2B, 202 along the alignment direction D2 and the seat members 3A, 3A-1, 3A-2, 3B, 3B-2, 103-1, 103-2 is 15 mm.
  • the lengths of the electrodes 12, 13 and 212 along the alignment direction D2 are set to 3 mm, and the lengths of the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b along the alignment direction D2 are set to 2.
  • the length was set to 5 mm, and the lengths of the first high heat conductive portions 21,21-1,21-2 and the second high heat conductive portions 22,22-1,22-2 along the alignment direction D2 were set to 3 mm. Further, the lengths of the high thermal conductive portions 110-1 and 110-2 along the alignment direction D2 are set to 3 mm.
  • thermoelectric conversion elements 1, 101, 201 the thermal conductivity of the substrate 11 and the sealing layer 15 is set to 0.3 W / mK, and the thermal conductivity of the electrodes 12, 13, 212 is set to 398 W / mK.
  • the thermal conductivity of the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b is set to 0.5 W / mK, and the first high thermal conductivity section 21,21-1,21-2 and the second high thermal conductivity section are set.
  • the thermal conductivity of 22, 22-1, 22-2 was set to 5 W / mK, and the thermal conductivity of the low thermal conductivity portions 23, 23-1, 23-2 was set to 0.05 W / mK.
  • the thermal conductivity of the high thermal conductivity sections 110-1 and 110-2 was set to 5 W / mK, and the thermal conductivity of the low thermal conductive sections 120-1 and 120-2 was set to 0.05 W / mK.
  • thermoelectric conversion elements 1, 101, 201 the temperature on the heat source side is set to 100 ° C., and the temperature on the air side is set to room temperature (23 ° C.), as in the third simulation described above.
  • the temperature of the exposed surface of the sheet members 3A, 3A-1, 3A-2 intersecting the thickness direction D1 was also set to 100 ° C.
  • thermoelectric conversion elements 1, 101, 201 set under the above-mentioned conditions, the maximum temperature difference of the element unit 14 was simulated.
  • thermoelectric conversion element 201 the maximum temperature difference of one of the n-type thermoelectric conversion layer 14a and the p-type thermoelectric conversion layer 14b was simulated.
  • the maximum temperature difference of the element portion 14 of the thermoelectric conversion module 2A was 3.193 ° C.
  • the maximum temperature difference of the element portion 14 of the thermoelectric conversion module 2B was 6.628 ° C.
  • the maximum temperature difference of the element portion 14 of the thermoelectric conversion element 101 was 4.909 ° C.
  • thermoelectric conversion element 201 the maximum temperature difference of the element portion 14 of the thermoelectric conversion module 2A was 2.793 ° C., and the maximum temperature difference of the thermoelectric conversion module 202 was 1.168 ° C. From this, the total temperature difference of the thermoelectric conversion element 1 was 9.821 ° C, and the total temperature difference of the thermoelectric conversion element 201 was 3.961 ° C.
  • thermoelectric conversion efficiency tended to be low.
  • the power generation capacity per unit area of the configuration including the configuration of the thermoelectric conversion element 101 and in which a plurality of thermoelectric conversion modules are stacked along the thickness direction is the thermoelectric conversion element. It was suggested that the tendency was lower than that of the configuration of 1.
  • thermoelectric conversion element according to the present disclosure is not limited to the above-described embodiment and the above-mentioned modification, and various other modifications are possible.
  • a plurality of element portions along the arrangement direction may be provided on the substrate.
  • the first modification and the second modification may be combined as appropriate.
  • the outermost layer is composed of only a sealing layer, but is not limited to this.
  • the outermost layer may be composed of the sealing layer and a member different from the sealing layer.
  • the outermost layer may be composed of another sheet member composed of a low thermal conductive portion.
  • each electrode is formed at the same time, but the present invention is not limited to this.
  • high heat conductive part 110-1, 110-2 ... High heat conduction part, 120-1, 120-2 ... Low heat conduction part, CP ... Contact part, S1, S2 ... Interval, T1 ... Length of first high heat conduction part, T2 ... First 2 Length of high heat conduction part.

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EP20850286.4A EP4012788B1 (en) 2019-08-08 2020-08-05 Thermoelectric conversion element
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JP2021537344A JP7662521B2 (ja) 2019-08-08 2020-08-05 熱電変換素子
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