CN114207852B - 热电转换元件 - Google Patents

热电转换元件

Info

Publication number
CN114207852B
CN114207852B CN202080056123.0A CN202080056123A CN114207852B CN 114207852 B CN114207852 B CN 114207852B CN 202080056123 A CN202080056123 A CN 202080056123A CN 114207852 B CN114207852 B CN 114207852B
Authority
CN
China
Prior art keywords
thermoelectric conversion
heat conduction
electrode
conduction portion
high heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080056123.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN114207852A (zh
Inventor
浅见健志
后藤庆次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN114207852A publication Critical patent/CN114207852A/zh
Application granted granted Critical
Publication of CN114207852B publication Critical patent/CN114207852B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202080056123.0A 2019-08-08 2020-08-05 热电转换元件 Active CN114207852B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-146670 2019-08-08
JP2019146670 2019-08-08
PCT/JP2020/029997 WO2021025059A1 (ja) 2019-08-08 2020-08-05 熱電変換素子

Publications (2)

Publication Number Publication Date
CN114207852A CN114207852A (zh) 2022-03-18
CN114207852B true CN114207852B (zh) 2025-07-22

Family

ID=74502967

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080056123.0A Active CN114207852B (zh) 2019-08-08 2020-08-05 热电转换元件

Country Status (5)

Country Link
US (1) US20220302365A1 (https=)
EP (1) EP4012788B1 (https=)
JP (1) JP7662521B2 (https=)
CN (1) CN114207852B (https=)
WO (1) WO2021025059A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4482281A4 (en) * 2022-03-08 2025-05-21 Denka Company Limited THERMOELECTRIC CONVERSION MODULE AND MANUFACTURING METHOD THEREFOR
EP4577027A1 (en) * 2022-09-09 2025-06-25 Denka Company Limited Thermoelectric conversion module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004104041A (ja) * 2002-09-13 2004-04-02 Sony Corp 熱電変換装置及びその製造方法
CN105531837A (zh) * 2013-09-25 2016-04-27 琳得科株式会社 导热性粘接片、其制造方法以及使用该导热性粘接片的电子器件

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Publication number Priority date Publication date Assignee Title
US8455751B2 (en) * 2003-12-02 2013-06-04 Battelle Memorial Institute Thermoelectric devices and applications for the same
KR101157216B1 (ko) 2003-12-02 2012-07-03 바텔리 메모리얼 인스티튜트 열전 디바이스 및 그 응용 장치
JP3981738B2 (ja) 2004-12-28 2007-09-26 国立大学法人長岡技術科学大学 熱電変換素子
JP4895293B2 (ja) 2007-01-26 2012-03-14 新日鐵化学株式会社 フレキシブル熱電変換素子及びその製造方法
JP5087757B2 (ja) * 2007-06-08 2012-12-05 住友金属鉱山株式会社 熱電変換モジュールとこれを用いた発電装置
JP5104875B2 (ja) * 2007-11-14 2012-12-19 株式会社村田製作所 熱電変換モジュール片、熱電変換モジュールおよびこれらの製造方法
JP5298532B2 (ja) 2007-12-27 2013-09-25 ダイキン工業株式会社 熱電素子
JP5067352B2 (ja) 2008-12-05 2012-11-07 住友金属鉱山株式会社 熱電変換モジュールとこれを用いた発電装置
CN102263197B (zh) 2011-07-22 2013-02-27 江苏物联网研究发展中心 新型微型热电发生器及其制造方法
WO2013121486A1 (ja) 2012-02-16 2013-08-22 日本電気株式会社 熱電変換モジュール装置、及び電子機器
CN105190921B (zh) 2013-03-21 2018-04-17 国立大学法人长冈技术科学大学 热电转换元件
EP3035396A4 (en) 2013-09-25 2017-04-19 Lintec Corporation Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same
KR102389426B1 (ko) 2014-12-26 2022-04-21 린텍 가부시키가이샤 열 전도성 접착 시트, 그의 제조 방법, 및 그것을 사용한 전자 디바이스
CN105099275B (zh) 2015-07-29 2017-08-25 浙江大学 具有微凸台阵列热端的平面型温差发电结构
JP6672562B2 (ja) 2015-08-20 2020-03-25 リンテック株式会社 ペルチェ冷却素子及びその製造方法
WO2017051699A1 (ja) 2015-09-24 2017-03-30 富士フイルム株式会社 熱電変換素子
US20190267531A1 (en) 2016-09-28 2019-08-29 Tdk Corporation Thermoelectric conversion device
WO2018139475A1 (ja) * 2017-01-27 2018-08-02 リンテック株式会社 フレキシブル熱電変換素子及びその製造方法
JP7183794B2 (ja) * 2017-01-31 2022-12-06 日本ゼオン株式会社 熱電変換モジュール
JPWO2018143185A1 (ja) 2017-01-31 2019-11-21 日本ゼオン株式会社 熱電変換モジュール
CN110494997A (zh) 2017-03-30 2019-11-22 琳得科株式会社 热电转换模块及其制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004104041A (ja) * 2002-09-13 2004-04-02 Sony Corp 熱電変換装置及びその製造方法
CN105531837A (zh) * 2013-09-25 2016-04-27 琳得科株式会社 导热性粘接片、其制造方法以及使用该导热性粘接片的电子器件

Also Published As

Publication number Publication date
EP4012788A1 (en) 2022-06-15
EP4012788B1 (en) 2024-01-03
EP4012788A4 (en) 2022-10-05
WO2021025059A1 (ja) 2021-02-11
US20220302365A1 (en) 2022-09-22
JP7662521B2 (ja) 2025-04-15
CN114207852A (zh) 2022-03-18
JPWO2021025059A1 (https=) 2021-02-11

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