WO2021022749A1

WO2021022749A1 - Optical module

Info

Publication number: WO2021022749A1
Application number: PCT/CN2019/125117
Authority: WO
Inventors: 梅晓鹤; 胡强; 薛振峰; 周芸; 全本庆
Original assignee: 武汉光迅科技股份有限公司
Priority date: 2019-08-06
Filing date: 2019-12-13
Publication date: 2021-02-11
Also published as: CN110488431A

Abstract

Disclosed is an optical module (100), comprising: a photoelectric assembly (200) and a tube shell assembly (300), wherein the photoelectric assembly (200) is arranged inside the tube shell assembly (300); the photoelectric assembly (200) comprises a transmitter optical subassembly (TOSA) assembly (210) and a receiver optical subassembly (ROSA) assembly (220); the TOSA assembly (210) comprises a TOSA protective cover (211) having at least an electromagnetic wave shielding function; the ROSA assembly (220) comprises a ROSA protective cover (221) having at least an electromagnetic wave shielding function; the photoelectric assembly (200) further comprises a PCB (230); the tube shell assembly (300) comprises a base (320); and a certain movable margin is reserved between a U-shaped boss on the base (320) and a U-shaped through hole (231) on the PCB (230).

Description

An optical module

Cross references to related applications

This application is based on a Chinese patent application with an application number of 201910722007.7 and an application date of August 6, 2019, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby incorporated by reference into this application.

Technical field

This application relates to the field of optical communication technology, in particular to an optical module.

Background technique

With the rapid development of optical communications and Internet networks in recent years, market demand for networks has also increased dramatically, resulting in a rapid increase in the traffic of telecommunications backbone networks. In order to meet the market demand for high-rate data transmission, the transmission speed of optical modules is also rapidly increasing. At present, optical modules are gradually evolving from 100G to 400G. However, compared with 100G optical modules, 400G optical modules require digital signal processing ( DSP, Digital Signal Processing) and various complicated auxiliary circuits. Therefore, how to deal with the heat dissipation, miniaturization and electromagnetic interference caused by the increase in the transmission speed of the optical module has become an urgent problem to be solved.

Summary of the invention

In order to achieve the foregoing objectives, the technical solutions of the embodiments of the present application are implemented as follows:

In a first aspect, an embodiment of the present application provides an optical module, including: an optoelectronic component and a tube housing component, the optoelectronic component is disposed inside the tube housing component; wherein,

The optoelectronic component includes: a Transmitter Optical Subassembly (TOSA) component and a Receiver Optical Subassembly (ROSA) component; the TOSA component includes a TOSA protective cover with at least a function of shielding electromagnetic waves; the ROSA component Including ROSA protective cover with at least electromagnetic wave shielding function;

The optoelectronic component further includes: a PCB board;

The tube shell assembly includes: a base;

A certain amount of activity is reserved between the U-shaped boss on the base and the U-shaped through hole on the PCB board.

In an optional embodiment, the range of the activity margin is ±0.15mm to ±0.18mm.

In an optional embodiment, the TOSA assembly further includes a TOSA optoelectronic element, wherein the TOSA protective cover covers the TOSA optoelectronic element for protecting the TOSA optoelectronic element and shielding the TOSA optoelectronic element Of electromagnetic waves.

In an optional embodiment, the ROSA component further includes a ROSA optoelectronic element, wherein the ROSA protective cover covers the ROSA optoelectronic element for protecting the ROSA optoelectronic element and shielding the ROSA optoelectronic element Of electromagnetic waves.

In an optional embodiment, the TOSA assembly and the ROSA assembly are pigtailed devices, the TOSA assembly further includes a first pigtail ferrule, and the ROSA assembly further includes a second pigtail card Set; where,

The TOSA protective cover is used to constrain the coiling path corresponding to the first pigtail ferrule, and the ROSA protective cover is used to constrain the coiling path corresponding to the second pigtail ferrule.

In an optional embodiment, the optoelectronic component further includes: a heat sink copper plate; wherein,

The heat sink copper plate serves as the heat dissipation substrate of the TOSA assembly and is arranged on the lower surface of the PCB board.

In an optional embodiment, the tube housing assembly further includes: an upper cover, the upper cover is arranged on the upper part of the optoelectronic component; the base is arranged on the lower part of the optoelectronic component; wherein,

The upper cover and the base are fixed together by a connecting piece to form an accommodating space, and the accommodating space is used for arranging the optoelectronic component.

In an optional embodiment, a first groove is provided on the bottom surface of the base, and the first groove is used to avoid electronic devices on the lower surface of the PCB board.

In an optional embodiment, a second groove is provided on the bottom surface of the base, and the second groove is used to avoid the heat sink copper plate on the lower surface of the PCB board.

In an optional embodiment, an optical interface is provided on one side surface of the containing space formed by the upper cover and the base, and the horizontal central axis of the optical interface is higher than the upper surface of the PCB board.

In an optional embodiment, the upper cover includes: an electromagnetic shielding ring for shielding electromagnetic waves;

Wherein, the electromagnetic shielding ring is arranged at the connection between the upper cover and the base.

In an optional implementation, the electromagnetic shielding ring includes:

Ring wall stop for blocking electromagnetic wave transmission channel;

A shielding glue groove for tightly fitting the upper cover and the base.

In an optional embodiment, the ROSA protective cover is provided with a vent hole, and the ROSA component dissipates heat through the vent hole.

An optical module provided by an embodiment of the present application includes: an optoelectronic component and a tube case component, the optoelectronic component is disposed inside the tube case component; wherein, the optoelectronic component includes: a light emitting sub-module TOSA component and a light receiving component Sub-module ROSA component; the TOSA component includes a TOSA protective cover with at least a function of shielding electromagnetic waves; the ROSA component includes a ROSA protective cover with at least a function of shielding electromagnetic waves; the optoelectronic component also includes: a PCB board; the tube shell assembly It includes: a base; a certain amount of activity is reserved between the U-shaped boss on the base and the U-shaped through hole on the PCB board. The embodiments of the application realize the protection, electromagnetic shielding and heat dissipation of TOSA components and ROSA components, and at the same time reserve a certain amount of activity margin inside the optical module, so that the optical margin can be adjusted to consume the coupling deviation of the optical module .

Description of the drawings

Figure 1 is a perspective view of an optical module provided by an embodiment of the application;

2 is a perspective view of an optoelectronic component in an optical module provided by an embodiment of the application;

3 is an exploded view of the structure of the optoelectronic component in the optical module provided by the embodiment of the application;

FIG. 4 is an exploded view of the structure of the tube shell assembly in the optical module provided by an embodiment of the application;

Figure 5 is a perspective view of a base in an optical module provided by an embodiment of the application;

6 is a perspective view of the upper cover of the optical module provided by an embodiment of the application;

FIG. 7 is a side cross-sectional view of an optical module provided by an embodiment of the application;

8 is a perspective view of the pull ring in the optical module provided by an embodiment of the application;

Description of reference signs:

100-optical module; 200-optical component; 210-TOSA component; 211-TOSA protective cover; 212-TOSA photoelectric component; 213-first pigtail ferrule; 220-ROSA component; 221-ROSA protective cover; 222-ROSA Optoelectronic components; 223-second pigtail ferrule; 230-PCB board; 231-U-shaped through hole; 240-IC chip; 250-heat sink copper plate; 300-shell assembly; 310-top cover; 311-electromagnetic shielding Ring; 3111-ring wall stop; 3112-shielding glue groove; 312-first boss; 313-second boss; 314-third boss; 315-third arc groove; 316-fourth circle Arc groove; 320-base; 321-first groove; 322-second groove; 323-optical interface; 324-PCB board support column; 325-through hole; 326-screw hole; 327-first arc Groove; 328-second arc groove; 329-fourth boss; 330-pull ring; 331-brake pad; 332-pull ring handle; 341-first screw; 342-second screw; 343- The third screw; 344-the fourth screw.

detailed description

In order to have a more detailed understanding of the features and technical content of the embodiments of the present application, the implementation of the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference and explanation purposes only and are not used to limit the embodiments of the present application.

With the rapid development of optical communications and Internet networks in recent years, the market's demand for networks has also increased dramatically, resulting in a rapid increase in the traffic of the telecom backbone network. In order to meet the market demand for high-rate data transmission, the transmission speed of optical modules is also rapidly increasing. At present, optical modules are gradually evolving from 100G to 400G. However, compared with 100G optical modules, 400G optical modules require DSP and various Complex auxiliary circuit. Therefore, how to deal with the heat dissipation, miniaturization and electromagnetic interference caused by the increase in the transmission speed of the optical module has become an urgent problem to be solved.

Existing high-speed optical modules have considerations of heat dissipation and electromagnetic compatibility from the aspects of optics, hardware, process, and structure. However, after the overall plan and device selection are determined, it is difficult to modify the optics, hardware, and process. In terms of structural design, how to ensure the miniaturization of the package size of high-speed optical modules as much as possible, and how to lay out more optical components in the optical module housing while taking into account heat dissipation and electromagnetic compatibility issues has become the industry’s A big challenge.

To this end, the following technical solutions of the embodiments of the present application are proposed.

An optical module provided by an embodiment of the present application includes: an optoelectronic component and a tube housing component, the optoelectronic component is disposed inside the tube housing component; wherein, the optoelectronic component includes: a light emitting sub-module TOSA component and a light receiving sub-module Module ROSA component; the TOSA component includes a TOSA protective cover with at least a function of shielding electromagnetic waves; the ROSA component includes a ROSA protective cover with at least a function of shielding electromagnetic waves; the optoelectronic component also includes: a PCB board; the tube housing assembly includes : Base; a certain amount of movement is reserved between the U-shaped boss on the base and the U-shaped through hole on the PCB board.

Fig. 1 is a perspective view of an optical module provided by an embodiment of the application. As shown in Fig. 1, the optical module provided by an embodiment of the present application includes an optoelectronic assembly 200 and a tube housing assembly 300. The optoelectronic assembly 200 is disposed on the tube. Inside the housing assembly 300; wherein the optoelectronic assembly 200 (shown in Figure 2) includes: a TOSA assembly 210 and a ROSA assembly 220; the TOSA assembly 210 (shown in Figure 3) includes at least a TOSA protection with a function of shielding electromagnetic waves Cover 211; the ROSA component 220 includes a ROSA protective cover 221 with at least a function of shielding electromagnetic waves; the optoelectronic component 200 further includes: a PCB board 230; the package assembly 300 includes: a base 320; on the base 320 A certain amount of movement is reserved between the U-shaped boss and the U-shaped through hole on the PCB board 230 (as shown in FIG. 2).

It should be noted that the base 320 is provided with two U-shaped bosses, the two U-shaped bosses are provided with two through holes 325, and the base 320 is also provided with two screw holes 326; Correspondingly, the PCB board 230 is provided with two U-shaped through holes 231 at positions corresponding to the two through holes 325 on the U-shaped boss (as shown in FIG. 2). The U-shaped boss is used to limit the PCB board 230 laterally (a direction parallel to the PCB board 230). In specific implementation, within the allowable range of the MSA protocol, a space of ±0.15mm to ±0.18mm can be left between the U-shaped boss on the base 320 and the U-shaped through hole 321 on the PCB board 230 Movement margin, so that the staff can perform optical adjustment of the optical module to consume the coupling deviation of the optical module. After the optical module is adjusted, the gap of the movement margin can be filled with glue to ensure that the PCB board 230 is firmly fixed Inside the shell assembly 300.

FIG. 2 is a perspective view of an optoelectronic component in an optical module provided by an embodiment of the application, and FIG. 3 is an exploded view of a structure of an optoelectronic component in an optical module provided by an embodiment of the application, as shown in FIGS. 2 and 3, provided by the embodiment of the application The optoelectronic component 200 in the optical module includes: TOSA component 210, ROSA component 220, PCB board 230 and IC chip 240. The TOSA assembly 210 includes a TOSA protective cover 211, a TOSA photoelectric element 212 and a first pigtail ferrule 213. The ROSA component 220 includes a ROSA protective cover 221, a ROSA photoelectric element 222 and a second pigtail ferrule 223.

Here, the TOSA protective cover 211 covers the TOSA optoelectronic element 212 for protecting the TOSA optoelectronic element 212 and shielding the electromagnetic wave of the TOSA optoelectronic element 212.

Here, the TOSA assembly 210 is a pigtailed device, and the TOSA assembly 210 includes a first pigtail ferrule 213, wherein the TOSA protective cover 211 is used to constrain the corresponding to the first pigtail ferrule 213 Coil fiber path.

Here, the optoelectronic component 200 further includes a heat sink copper plate 250; wherein, the heat sink copper plate 250 serves as a heat dissipation substrate of the TOSA component 210 and is arranged on the lower surface of the PCB board 230.

In specific implementation, the heat sink copper plate 250 can be used as the heat dissipation support substrate of the TOSA optoelectronic element 212, and the heat sink copper plate 250 can be fixed on the surface by means of glue bonding or surface mount technology (SMT). On the lower surface of the PCB board 230, where the PCB board 230 and the heat sink copper plate 250 are pasted with through holes (not shown in FIG. 3) of a certain shape, the TOSA photoelectric element 212 passes through the The through holes are used for heat dissipation. During specific implementation, the TOSA optoelectronic element 212 (such as a laser, a ceramic backing plate, a lens, a filter, etc.) can pass through the through hole and be mounted on the heat sink copper plate 250, and the TOSA optoelectronic element 212 passes The gold wire bonding establishes an electrical connection with the PCB board 230.

In specific implementation, the TOSA protective cover 211 may be fixed on the upper surface of the PCB board 230 by means of glue bonding. The TOSA protective cover 211 is provided with pins and raised features (not shown in FIG. 3), the PCB board 230 is correspondingly provided with hole and groove features (not shown in FIG. 3), and the TOSA protective cover 211 When the pins and protrusions on the upper part are bonded to the corresponding hole and groove characteristics on the PCB board 230, the accurate positioning of the TOSA protective cover 211 on the PCB board 230 is ensured.

Here, the ROSA protective cover 221 covers the ROSA optoelectronic element 222 for protecting the ROSA optoelectronic element 222 and shielding the electromagnetic wave of the ROSA optoelectronic element 222.

Here, the ROSA assembly 220 is a pigtailed device, and the ROSA assembly 220 includes a second pigtail ferrule 223; wherein, the ROSA protective cover 221 is used to constrain the corresponding second pigtail ferrule 223 Coil fiber path.

Here, the ROSA protective cover 221 is also provided with a vent hole, and the ROSA component 220 performs heat dissipation through the vent hole.

In specific implementation, the ROSA protective cover 221 adopts a special structural design. The ROSA protective cover 221 is provided with vents, which are also used to prevent photo-diodes (PD) and trans-impedance amplifiers (TIA) chips. The condensation of water vapor generated during operation affects the optical performance indicators of the optical module.

FIG. 4 is an exploded view of the structure of the tube shell assembly of the optical module provided by the embodiment of the application. As shown in FIG. 4, the tube shell assembly 300 of the optical module provided by the embodiment of the present application includes: an upper cover 310, a base 320, and With a pull ring 330, the upper cover 310 is arranged on the upper part of the optoelectronic component 200; the base 320 is arranged on the lower part of the optoelectronic component 200; wherein,

The upper cover 310 and the base 320 are fixed together by a connecting piece to form a receiving space, and the receiving space is used for arranging the optoelectronic component 200.

FIG. 5 is a perspective view of a base in an optical module provided by an embodiment of the application. As shown in FIG. 5, a first groove 321 is provided on the bottom surface of the base 320, and the first groove 321 is used to avoid the PCB board. 230 electronic devices on the bottom surface.

Here, a second groove 322 is provided on the bottom surface of the base 320, and the second groove 322 is used to avoid the heat sink copper plate 250 on the lower surface of the PCB board 230.

Here, an optical interface 323 is provided on one side surface of the containing space formed by the upper cover 310 and the base 320. As shown in FIG. 5, an optical interface 323 is located at the right end of the base 320. The horizontal central axis of the optical interface 323 is higher than the upper surface of the PCB board 230; wherein the height difference between the horizontal central axis of the optical interface and the upper surface of the PCB board is a fixed height, and the fixed height can be Set to 2mm, but not limited to 2mm. Such an arrangement can provide a larger layout area for the PCB board 230 (the contour end surface of the PCB board 230 is close to the optical interface 323 as much as possible), and it is also convenient for the fiber optics inside the optical module.

As shown in FIGS. 3 and 5, the optoelectronic component 200 is used to convert the optical signal received by the optical module into an electric signal or convert the electric signal into an optical signal. The optoelectronic component 200 includes a first pigtail ferrule 213 and a second pigtail ferrule 223; the base 320 includes an optical interface 323; wherein, the first pigtail ferrule 213 and the second pigtail ferrule 223 One end of the optical fiber is connected to the TOSA assembly 210 and the ROSA assembly 220 respectively, and the other ends of the first pigtail ferrule 213 and the second pigtail ferrule 223 are connected to the optical interface 323. It should be noted that the optical interface 323 is provided with two interfaces corresponding to the first pigtail ferrule 213 and the second pigtail ferrule 223 to connect with the first pigtail ferrule 213 and The second pigtail ferrule 223 is connected. During specific implementation, the optical interface 323 is used for plug-in adaptation with an optical connector.

As shown in FIG. 5, the base 320 is provided with six PCB support columns 324, and the six PCB support columns 324 are symmetrically distributed along both sides of the base 320, and are used to support the PCB 230 Limit. The base 320 is provided with two U-shaped bosses, the two U-shaped bosses are provided with two through holes 325, and the base 320 is also provided with two screw holes 326; accordingly, the Two U-shaped through holes 231 are provided on the PCB board 230 at positions corresponding to the two through holes 325 on the U-shaped boss (as shown in FIG. 2). The screws include a first screw 341, a second screw 342, a third screw 343, and a fourth screw 344 (as shown in FIG. 4). The PCB board 230 is fixed on the six PCB board support columns 324 by a first screw 341, a second screw 342, a third screw 343, and a fourth screw 344. Correspondingly, the upper cover 310 is provided with two through holes at positions corresponding to the third screw 343 and the fourth screw 344 (also corresponding to the two screw holes 326 on the base 320) (as shown in FIG. 4). At the same time, the upper cover 310 is also fixedly connected to the base 320 by a first screw 341, a second screw 342, a third screw 343, and a fourth screw 344. The U-shaped boss is used to limit the PCB board 230 laterally (a direction parallel to the PCB board 230). During specific implementation, within the allowable range of the MSA protocol, a movement margin of ±0.18mm can be left between the U-shaped boss on the base 320 and the U-shaped through hole 321 on the PCB board 230. In order for the staff to perform the optical adjustment of the optical module, after the adjustment of the optical module is completed, the gap of the movable margin can be filled with glue to ensure that the PCB board 230 is firmly fixed inside the package assembly 300.

As shown in Figure 5, the base 320 is also provided with two arc grooves, namely a first arc groove 327 and a second arc groove 328; correspondingly, the upper cover 310 is on the first A third circular arc groove 315 and a fourth circular arc groove 316 are provided at positions corresponding to a circular arc groove 327 and the second circular arc groove 328 (as shown in FIG. 6). The first pigtail ferrule 213 is fixed to the upper cover 310 and the base 320 through the first circular arc groove 327 on the base 320 and the third circular arc groove 315 on the upper cover 310 In the accommodating space formed, that is, inside the tube shell assembly 300; the second pigtail ferrule 223 passes through the second arc groove 328 on the base 320 and the fourth groove on the upper cover 310 The arc groove 316 is fixed in the receiving space formed by the upper cover 310 and the base 320, that is, inside the tube shell assembly 300. The first circular arc groove 327, the second circular arc groove 328, the third circular arc groove 315, and the fourth circular arc groove 316 are used to connect the first pigtail ferrule 213 and the second The pigtail ferrule 223 is restricted to ensure the normal connection of the first pigtail ferrule 213 and the second pigtail ferrule 223 to the optical connector.

6 is a perspective view of the upper cover in the optical module provided by the embodiment of the application. As shown in FIG. 6, the upper cover 310 includes: an electromagnetic shielding ring 311 for shielding electromagnetic waves; wherein, the electromagnetic shielding ring 311 is arranged at The connection between the upper cover 310 and the base 320. The electromagnetic shielding ring 311 includes: a ring wall stop 3111 for blocking the transmission channel of electromagnetic waves; and a shielding glue groove 3112 for making the upper cover 310 and the base 320 closely fit.

During specific implementation, the annular wall stop 3111 on both sides of the upper cover 310 (the two sides in the direction parallel to the center line of the optical interface 323) is set higher and higher than the side walls on both sides of the base 320. (The side wall in the direction parallel to the center line of the optical interface 323) The closer the fit, the better the electromagnetic shielding effect.

As shown in FIG. 6, the upper cover 310 is provided with a first boss 312, and the first boss 312 is used to limit the PCB board 230 longitudinally (a direction perpendicular to the PCB board 230) . In specific implementation, the surface of the first boss 312 is in non-rigid contact with the upper surface of the PCB board 230, that is, there is a gap between the surface of the first boss 312 and the upper surface of the PCB board 230. A certain distance of the gap, the distance can be 0.1mm (the distance meets the MSA protocol, the embodiment of this application does not limit it), the maximum floating distance of the PCB board 230 in the longitudinal direction is 0.1mm, thereby realizing alignment The PCB board 230 is limited in the longitudinal direction.

Here, the upper cover 310 is provided with a second boss 313, a thermally conductive gasket (not shown in FIG. 6) is pasted on the second boss 313, and the second boss 313 is disposed on the The upper cover 310 is at a position corresponding to the IC chip 240, so that the IC chip 240 can dissipate heat through the thermally conductive pad mounted on the second boss 313.

FIG. 7 is a side cross-sectional view of an optical module provided by an embodiment of the application. As shown in FIG. 7, the optical module 100 provided by an embodiment of the present application includes: the upper cover 310, the optoelectronic component 200, and the base 320; Wherein, the upper cover 310 is arranged on the upper part of the optoelectronic component 200; the base 320 is arranged on the lower part of the optoelectronic component 200; the upper cover 310 and the base 320 are fixed together by connecting pieces to form a An accommodating space, where the optoelectronic component 200 is arranged.

As shown in FIGS. 6 and 7, the upper cover 310 is further provided with a third boss 314, and the third boss 314 is used to cooperate with the fourth boss 329 at the corresponding position of the base 320. In order to ensure that the electronic devices inside the package assembly 300 are isolated from the outside in the direction of the external electrical port (the direction toward the golden finger).

As shown in FIG. 7, the upper cover 310 is connected to the base 320 to cover the optoelectronic component 200; the arc grooves (first arc groove 327 and second arc groove 327) on the base 320 The arc groove 328) and the arc groove (the third arc groove 315 and the fourth arc groove 316) on the upper cover 310 cooperate with each other, and the pigtail ferrule (the first pigtail The clamping sleeve 213 and the second pigtail clamping sleeve 223) are completely restricted; the first boss 312 on the upper cover 310 and the base 320 cooperate with each other to restrict the PCB board 230 longitudinally.

FIG. 8 is a perspective view of the pull ring in the optical module provided by the embodiment of the application. As shown in FIG. 8, the pull ring 330 includes a brake pad 331 and a pull ring handle 332. The end of the brake pad 331 is wrapped Glue is inside the pull ring handle 332; the pull ring 330 is used to unlock and lock the optical module.

Here, in actual application, the material of the pull ring handle 332 may be a plastic material.

An optical module provided by an embodiment of the present application includes: an optoelectronic component and a tube case component, the optoelectronic component is disposed inside the tube case component; wherein, the optoelectronic component includes: a light emitting sub-module TOSA component and a light receiving component Sub-module ROSA assembly; the TOSA assembly includes a TOSA protective cover with at least a function of shielding electromagnetic waves; the ROSA assembly includes a ROSA protective cover with at least a function of shielding electromagnetic waves. The embodiments of the present application realize component protection, electromagnetic shielding, and heat dissipation of TOSA components and ROSA components, and at the same time realize the restriction and protection of the internal fiber of the optical module.

The above are only specific implementations of this application, but the protection scope of this application is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application. Should be covered within the scope of protection of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

It should be understood that “one embodiment” or “an embodiment” mentioned throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present application. Therefore, the appearance of "in one embodiment" or "in an embodiment" in various places throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that, in the various embodiments of the present application, the size of the sequence number of the above-mentioned processes does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic, rather than corresponding to the embodiments of the present application. The implementation process constitutes any limitation. The serial numbers of the foregoing embodiments of the present application are for description only, and do not represent the superiority of the embodiments.

It should be noted that in this article, the terms "include", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, It also includes other elements not explicitly listed, or elements inherent to the process, method, article, or device. If there are no more restrictions, the element defined by the sentence "including a..." does not exclude the existence of other identical elements in the process, method, article or device that includes the element.

In the several embodiments provided in this application, it should be understood that the disclosed device may be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, such as: multiple units or components can be combined, or It can be integrated into another system, or some features can be ignored or not implemented. In addition, the coupling, or direct coupling, or communication connection between the components shown or discussed may be indirect coupling or communication connection through some interfaces, devices or units, and may be electrical, mechanical or other forms of.

The units described above as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units; Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

The features disclosed in the several device embodiments provided in this application can be combined arbitrarily without conflict to obtain new device embodiments.

Claims

An optical module, comprising: a photoelectric component and a tube housing component, the photoelectric component being arranged inside the tube housing component; wherein,

The optoelectronic component includes: a light emitting sub-module TOSA component and a light receiving sub-module ROSA component; the TOSA component includes a TOSA protective cover with at least a function of shielding electromagnetic waves; the ROSA component includes a ROSA protective cover with at least a function of shielding electromagnetic waves;

The optoelectronic component further includes: a PCB board;

The tube shell assembly includes: a base;

A certain amount of movement margin is reserved between the U-shaped boss on the base and the U-shaped through hole on the PCB board.
The optical module according to claim 1, wherein:

The range of the activity margin is ±0.15mm to ±0.18mm.
The optical module according to claim 1, wherein the TOSA assembly further comprises a TOSA optoelectronic element, wherein the TOSA protective cover covers the TOSA optoelectronic element for protecting the TOSA optoelectronic element and shielding the TOSA Electromagnetic waves from optoelectronic components.
The optical module according to claim 1, wherein the ROSA component further comprises a ROSA optoelectronic element, wherein the ROSA protective cover covers the ROSA optoelectronic element for protecting the ROSA optoelectronic element and shielding the ROSA Electromagnetic waves from optoelectronic components.
The optical module according to claim 3 or 4, wherein the TOSA assembly and the ROSA assembly are pigtailed devices, the TOSA assembly further includes a first pigtail ferrule, and the ROSA assembly further includes a first Two pigtail ferrules; among them,

The TOSA protective cover is used to constrain the coiling path corresponding to the first pigtail ferrule, and the ROSA protective cover is used to constrain the coiling path corresponding to the second pigtail ferrule.
The optical module according to claim 1, wherein the optoelectronic component further comprises: a heat sink copper plate; wherein,

The heat sink copper plate serves as the heat dissipation substrate of the TOSA assembly and is arranged on the lower surface of the PCB board.
The optical module according to claim 6, wherein the tube housing assembly further comprises: an upper cover, the upper cover is arranged on the upper part of the optoelectronic component; the base is arranged on the lower part of the optoelectronic component; wherein,

The upper cover and the base are fixed together by a connecting piece to form an accommodating space, and the accommodating space is used for arranging the optoelectronic component.
8. The optical module according to claim 7, wherein a first groove is provided on the bottom surface of the base, and the first groove is used to avoid electronic devices on the lower surface of the PCB board.
The optical module according to claim 7 or 8, wherein a second groove is provided on the bottom surface of the base, and the second groove is used to avoid the heat sink copper plate on the lower surface of the PCB board.
The optical module according to claim 7, wherein an optical interface is provided on one side surface of the accommodating space formed by the upper cover and the base, and the horizontal central axis of the optical interface is higher than the upper surface of the PCB board. surface.
The optical module according to claim 7, wherein the upper cover comprises: an electromagnetic shielding ring for shielding electromagnetic waves;

Wherein, the electromagnetic shielding ring is arranged at the connection between the upper cover and the base.
The optical module according to claim 11, wherein the electromagnetic shielding ring comprises:

Ring wall stop for blocking electromagnetic wave transmission channel;

A shielding glue groove for tightly fitting the upper cover and the base.
The optical module according to claim 1, wherein the ROSA protective cover is provided with a vent hole, and the ROSA component dissipates heat through the vent hole.