CN108121040A - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
- Publication number
- CN108121040A CN108121040A CN201711364366.7A CN201711364366A CN108121040A CN 108121040 A CN108121040 A CN 108121040A CN 201711364366 A CN201711364366 A CN 201711364366A CN 108121040 A CN108121040 A CN 108121040A
- Authority
- CN
- China
- Prior art keywords
- multiplexing
- interfaces
- lock pins
- light emission
- optical module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention is a kind of optical module, including housing, positioned at the in vivo LC lock pins multiplexing LC interfaces of the shell, light emission component, fiber array demultiplexing LC interfaces, reception optical assembly and printed circuit board (PCB), the LC lock pins multiplexing LC interfaces include multiplexing LC interfaces, AWG chips and the multiplexing LC lock pins of parallel connection, the both ends of the AWG chips are connected respectively with the multiplexing LC interfaces and multiple multiplexing LC lock pins, the quantity of the light emission component is multiple, and each light emission component is corresponding with each multiplexing LC lock pins to be assembled.The present invention is encapsulated by the combination of multiple light emission components and multiple multiplexing LC lock pins and AWG chip wire jumpers instead of box, reduces producting process difficulty, improves yield rate, is reduced and is generated the difficulty that defective products is reprocessed.In addition, AWG chips are external in the shell, heat radiation energy accesses fine solution, so as to which AWG chips reduce the influence of temperature drift.
Description
Technical field
The present invention relates to domain of communication equipment, more particularly to optical module.
Background technology
Growing with communication field transmission capacity, traditional transmission technology has been difficult to meet transmission capacity and transmission
The requirement of speed, in data-center applications field and internet core node, educational institution, search engine, large-scale website, height
The fields such as performance calculating, to prevent that it is new to planning that deficiency, common carrier and service suppliers from occurring in the bandwidth resources of core network
Generation express network agreement is disposed.Institute of Electrical and Electronics Engineers to the 40Gbps under P802.3ba engineering task forces and
100Gbps Ethernets have formulated unified standard.
As the demand of data center and data exchange increasingly increases, existing communication systems face with a large bandwidth and at a high rate, it is high
Capacity and the requirement of low energy consumption.It needs to provide higher and faster bandwidth and rate under smaller space, lower energy consumption, because
This, parallel optical optical communication module research is the mainstream studied at present.Parallel optical module mainly by multiple lasers and connects
Device is received to exist concurrently and receive data.Such parallel optical module is generally multimode and is suitable for short distance communication, typically less than
The high bandwidth of 300m calculates and calculates application.And for over long distances（More than 2km）Communication, usually using have wavelength-division multiplex and
The single-mode optical module of demultiplexing.
At present have the function of wavelength-division multiplex/demultiplexing optical module have two schemes, TFF glass blocks optical plan with
The PLC schemes of AWG blocks are used by multiple individual laser packages inside a kovar alloy box, form an entirety hair
Receiving device is penetrated, then assembling and optical module are combined with PCBA board, as shown in Figure 1.Laser overall package is in box, technology difficulty
Greatly, and after making difficulty is reprocessed, and single laser damage or routing are problematic, and entire device is caused, which to scrap, causes production cost
Rise.Therefore, it is necessary to a kind of technology difficulty is low, high yield rate is readily produced, and is easy to the optical module structure reprocessed.
The content of the invention
The object of the present invention is to provide a kind of simple for process, high yield rate, optical modules easy to maintenance.
The present invention is achieved through the following technical solutions above-mentioned purpose：A kind of optical module, including housing, in the housing
LC lock pins multiplexing LC interfaces, light emission component, fiber array demultiplexing LC interfaces, receive optical assembly and printed circuit board (PCB), institute
Stating LC lock pins multiplexing LC interfaces includes multiplexing LC interfaces, AWG chips and the multiplexing LC lock pins of multiple parallel connections, the AWG chips
Both ends be connecteds respectively with the multiplexing LC interfaces and multiple multiplexing LC lock pins, the quantity of the light emission component be it is multiple,
Each light emission component is corresponding with each multiplexing LC lock pins to be assembled.
Further, the light emission component and printed circuit board (PCB) are whole by being welded to connect composition.
Further, the reception optical assembly, fiber array demultiplexing LC interfaces and the assembling of printed circuit board (PCB) direct-coupling
It is integral.
Further, the fiber array demultiplexing LC interfaces include demultiplexing LC interfaces and demultiplexing LC lock pins, described
Demultiplexing LC lock pins are connected with the reception optical assembly.
Further, the LC interfaces groove cooperation assembling of the multiplexing LC interfaces, multiplexing LC interfaces and housing.
Further, the light emission component passes through Heat Conduction Material and cage connection.
Further, the printed circuit board (PCB) passes through Heat Conduction Material and cage connection
Compared with prior art, the advantageous effect of optical module of the present invention is：It is inserted by multiple light emission components and multiple multiplexing LC
The combination of core and AWG chip wire jumpers is encapsulated instead of box, reduces producting process difficulty, improves yield rate, is reduced and is generated defective products
The difficulty reprocessed.In addition, AWG chips have temperature drift characteristic, cause channel narrows, box packagings are led since space is small
It causes temperature difference bigger, influences the width of passband, and AWG chips are external in the shell in the present invention, heat radiation energy accesses very
It is good to solve, so as to which AWG chips reduce the influence of temperature drift.
Description of the drawings
Fig. 1 is the assembly structure diagram of traditional optical module.
Fig. 2 is the assembly structure diagram of the present invention.
Fig. 3 is the decomposition texture schematic diagram of the present invention.
Fig. 4 is the structure diagram of LC lock pins multiplexing LC interfaces.
Fig. 5 is the structure diagram of fiber array demultiplexing LC interfaces.
Specific embodiment
Refer to Fig. 2 to Fig. 5, a kind of optical module, LC lock pins multiplexing LC interfaces 2, light including housing 1, in housing 1
Emitting module 3, fiber array demultiplexing LC interfaces 4 receive optical assembly 5 and printed circuit board (PCB) 6, and LC lock pins multiplexing LC interfaces 2 wrap
Include the LC lock pins 23 of LC interfaces 21, AWG chips 22 and multiple parallel connections, the both ends of AWG chips 22 respectively with LC interfaces 21 and multiple
LC lock pins 23 connect, and AWG chips and housing are engaged, and ensure AWG chips and skin temperature balance.The number of light emission component 3
It measures to be multiple, each light emission component 3 is corresponding with each LC lock pins 23 to be fitted together.
Light emission component 3 and printed circuit board (PCB) 6 are whole by being welded to connect composition.Receive optical assembly 5, fiber array demultiplexes
Integral with LC interfaces 4 and the assembling of 6 direct-coupling of printed circuit board (PCB), fiber array demultiplexing LC interfaces 4 include demultiplexing LC and connect
Mouth 41 and demultiplexing LC lock pins 42, demultiplexing LC lock pins 42 are connected with receiving optical assembly 5.
It is multiplexed the LC interface grooves of LC interfaces 21, demultiplexing LC interfaces 41 and housing（Figure is not marked）Cooperation assembling, printing electricity
Road plate and the cooperation assembling of housing correspondence position.Emit optical assembly and receive optical assembly institute band optical fiber free distribution group inside housings
Dress.Housing includes upper shell, lower housing and draw ring, and wherein light emission component is formed heat and handed over by Heat Conduction Material and cage connection
The system of changing planes, printed circuit board (PCB) form heat exchange mechanism by Heat Conduction Material and cage connection.
The present invention is by the combination of multiple light emission components and multiple multiplexing LC lock pins and AWG chip wire jumpers instead of box
Encapsulation reduces producting process difficulty, improves yield rate, reduces and generates the difficulty that defective products is reprocessed.In addition, AWG chips have temperature
Drift characteristic is spent, causes channel narrows, box packagings cause temperature difference bigger since space is small, influence the width of passband
Degree, and AWG chips are external in the shell in the present invention, heat radiation energy accesses fine solution, so as to which AWG chips reduce temperature drift
Influence.
Above-described is only some embodiments of the present invention.For those of ordinary skill in the art, not
On the premise of departing from the invention design, various modifications and improvements can be made, these belong to the protection model of the present invention
It encloses.
Claims (7)
1. a kind of optical module, it is characterised in that：Including housing, positioned at the in vivo LC lock pins multiplexing LC interfaces of the shell, light emitting
Component, fiber array demultiplexing LC interfaces receive optical assembly and printed circuit board (PCB), and the LC lock pins multiplexing LC interfaces include multiplexing
The multiplexing LC lock pins of LC interfaces, AWG chips and multiple parallel connections, the both ends of the AWG chips respectively with the multiplexing LC interfaces and
Multiple multiplexing LC lock pins connections, the quantity of the light emission component is multiple, each light emission component and each institute
It states multiplexing LC lock pins and corresponds to assembling.
2. optical module according to claim 1, it is characterised in that：The light emission component and printed circuit board (PCB) pass through welding
Connection composition is whole.
3. optical module according to claim 1, it is characterised in that：The reception optical assembly, fiber array demultiplexing LC connect
Mouth and the assembling of printed circuit board (PCB) direct-coupling are integral.
4. optical module according to claim 1, it is characterised in that：The fiber array demultiplexing LC interfaces include demultiplexing
LC interfaces and demultiplexing LC lock pins, the demultiplexing LC lock pins are connected with the reception optical assembly.
5. optical module according to claim 4, it is characterised in that：The multiplexing LC interfaces, multiplexing LC interfaces and housing
The cooperation assembling of LC interfaces groove.
6. optical module according to claim 1, it is characterised in that：The light emission component is connected by Heat Conduction Material and shell
It connects.
7. optical module according to claim 1, it is characterised in that：The printed circuit board (PCB) is connected by Heat Conduction Material and shell
It connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711364366.7A CN108121040A (en) | 2017-12-18 | 2017-12-18 | A kind of optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711364366.7A CN108121040A (en) | 2017-12-18 | 2017-12-18 | A kind of optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108121040A true CN108121040A (en) | 2018-06-05 |
Family
ID=62229298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711364366.7A Pending CN108121040A (en) | 2017-12-18 | 2017-12-18 | A kind of optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108121040A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110488431A (en) * | 2019-08-06 | 2019-11-22 | 武汉光迅科技股份有限公司 | A kind of optical module |
| WO2020038231A1 (en) * | 2018-08-21 | 2020-02-27 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112946838A (en) * | 2021-02-04 | 2021-06-11 | 光彩芯辰(浙江)科技有限公司 | Light emission assembly and optical module using same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106405755A (en) * | 2016-11-30 | 2017-02-15 | 武汉光迅科技股份有限公司 | High-speed multi-channel transmitting and receiving device |
| CN106646784A (en) * | 2017-02-20 | 2017-05-10 | 众瑞速联（武汉）科技有限公司 | Wavelength division multiplexing light emission device based on array waveguide grating |
| CN107065083A (en) * | 2017-03-31 | 2017-08-18 | 武汉博昇光电股份有限公司 | A kind of multichannel integrated module of optical transceiver |
| CN206649186U (en) * | 2017-03-31 | 2017-11-17 | 武汉博昇光电股份有限公司 | A kind of multichannel light receiving element and receiving module |
| CN107479150A (en) * | 2017-09-15 | 2017-12-15 | 武汉联特科技有限公司 | A kind of four-way CWDM QSFP optical modules |
-
2017
- 2017-12-18 CN CN201711364366.7A patent/CN108121040A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106405755A (en) * | 2016-11-30 | 2017-02-15 | 武汉光迅科技股份有限公司 | High-speed multi-channel transmitting and receiving device |
| CN106646784A (en) * | 2017-02-20 | 2017-05-10 | 众瑞速联（武汉）科技有限公司 | Wavelength division multiplexing light emission device based on array waveguide grating |
| CN107065083A (en) * | 2017-03-31 | 2017-08-18 | 武汉博昇光电股份有限公司 | A kind of multichannel integrated module of optical transceiver |
| CN206649186U (en) * | 2017-03-31 | 2017-11-17 | 武汉博昇光电股份有限公司 | A kind of multichannel light receiving element and receiving module |
| CN107479150A (en) * | 2017-09-15 | 2017-12-15 | 武汉联特科技有限公司 | A kind of four-way CWDM QSFP optical modules |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020038231A1 (en) * | 2018-08-21 | 2020-02-27 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN110488431A (en) * | 2019-08-06 | 2019-11-22 | 武汉光迅科技股份有限公司 | A kind of optical module |
| CN112946838A (en) * | 2021-02-04 | 2021-06-11 | 光彩芯辰(浙江)科技有限公司 | Light emission assembly and optical module using same |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180605 |
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| RJ01 | Rejection of invention patent application after publication |